TWI275765B - Wick structure, method of manufacturing the wick structure, and heat pipe - Google Patents
Wick structure, method of manufacturing the wick structure, and heat pipe Download PDFInfo
- Publication number
- TWI275765B TWI275765B TW094102627A TW94102627A TWI275765B TW I275765 B TWI275765 B TW I275765B TW 094102627 A TW094102627 A TW 094102627A TW 94102627 A TW94102627 A TW 94102627A TW I275765 B TWI275765 B TW I275765B
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- TW
- Taiwan
- Prior art keywords
- capillary structure
- screen
- wire
- singularity
- powder
- Prior art date
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Woven Fabrics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
I275765 九、發明說明·· 【發明所屬之技術領域】 本發明係關於一種不需增加編織密度即可增加毛細吸力之毛纟鲈 構及該毛細結構之製造方法,與採用該毛細結構之熱总。 /… 【先前技術】I275765 IX. INSTRUCTION DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a bristles structure capable of increasing capillary suction without increasing the weaving density, and a method of manufacturing the same, and a heat total using the capillary structure . /... [Prior technology]
現階段’對於發熱量較高之電子元件,人們普遍_鮮、散熱 韓片及散熱風扇相結合之方式進行散熱。利用熱管内部充填之低弗點 工作液體在發熱電子元件處(蒸發端)吸熱蒸發,向散熱鰭片移動 在散熱㈣處(冷凝端)將發熱電子元件產生之熱量傳遞至散熱籍片, 利用散熱風扇將產生之熱量帶走,完成對電子元件之散熱^汽化9後之 工作液體在冷凝端放熱,凝結成㈣,該㈣在熱管壁部的毛㈣社構 之作用下回流至蒸發端,進人下―卫作循環。該歸具有較高之^ 效率和傳熱雜,在電子播散_域發揮著线制。 ”、 ^細吸力為影響熱管性能之主要因素,毛細吸力之大小主要取決 於熱管之毛細結構,熱管毛細結構之孔轉小,其毛細吸力越大。^ =熱管根據其毛細結構之不同可分為溝槽型、燒結型、纖維型及絲 、·周m絲網型歸之毛細結構係由複數金屬絲編織形成。若要 細結構之毛細吸力,通常係增加其編織密度,使各金屬絲間 a隙,惟’在目前技術下,_編織減小毛細結構孔隙具有較 之毛!1纟4業界希望需求—種不需增加編織密度即可增加毛細吸力 【發明内容】 ϋ吉構:觀細結觀細複^線域之_,縣料表面設 丨結:i月Λ的:系巧供一種不需增加編織密度即可增加毛細吸力之 有複數凸起 結構時,先提供表^的係提供一種毛細結構之製造方法,加工該毛細 有凸起之毛細結、構广有凸起之絲網,然後在絲網上設置凸起,形成具 J275765 包括上社罐狀《,該熱管 =叹於&體内之上述毛細結構及填充於管體内之工作介質。 有效======r凸起可減小 能夠#恤从、、* 木σκ毛細結構之熱管内部的工作介質 製^毛熱管之吸熱端,提高熱管之散熱效率。利用該方法 需增加編織密度即可達到增加毛細吸力之功效。 下面參照附圖結合實施例對本發明作進一步說明。 。該絲線6之截面形狀為圓形或矩形 可制單—截面形狀之絲線6編織, 也了刼用不同截面形狀之絲線6編織。 ^ 。戈不6 '錄,末由_呂 .秀鋼專材枓衣成,該物冬之溶點小於或等於絲線6之溶點 燒、、,。過程中出現絲網已經融化而粉末尚未麥化之情況。.’免 如第四圖所示,採用上述毛細結構4之 官體2内壁之毛細結構4及填充於管體2内之卫作介^/體2叹於 其中,管體2由導熱性良好之金屬製成,本實施例中 ^為銅。該管體2内可設置支碰或_燒鲜 f 與管體2内壁之良好接觸。 Λ貝兄仏。構4 工作介質一般採用具有較低沸點並可與毛細結構4丘 如水、酒精等。 于心欣體, 如第五至第七圖所示,本發明毛細結構4之製作過程如下: 編織。將複數絲線6交叉編織,形成未具有凸起8之絲網; 喷灑。將絲網置入高溫爐或其他加熱裝置中加埶, 噴嘴9將細小粉末雙面喷至絲網之上、下表面,'該細小以鱼: 因受熱而彼此粘結,形成具有凸起8之絲網。該絲網上可 ^二鉍 料之粉末,也可喷灑不同材料粉末之混合物。 ^ 1275765 將絲網由加熱裝置中取出,降溫、冷卻,得到具有凸起6之絲網。 本發明也可在常溫下將粉末舖設於一平板上形成粉末床,並將絲 網置^加«置巾加熱,將已加熱之絲網快速地放置於粉末床上,將 粉末壓貼附著於絲網上,形成該毛細結構4。 本^中,毛細結構4設有複數凸起8,該等凸起8可減小毛細結 大小’提昇毛細吸力,使採用該毛細結構之熱管内 m 作介質能夠較快地回流至熱管之吸熱端 【圖式簡單說明】 '''s ^At this stage, for electronic components with high heat generation, it is common to use a combination of fresh heat and heat dissipation. The low-point working liquid filled in the heat pipe absorbs heat and evaporates at the heat-generating electronic component (evaporation end), and moves to the heat-dissipating fin at the heat-dissipating (four) (condensing end) to transfer the heat generated by the heat-generating electronic component to the heat-dissipating film, utilizing heat dissipation The fan takes away the heat generated by the fan, and completes the heat dissipation of the electronic component. The working liquid after the vaporization 9 releases heat at the condensation end and condenses into (4). The (4) is returned to the evaporation end under the action of the hair (4) structure of the heat pipe wall. Entering the people - the circulation of the guard. This has a higher efficiency and heat transfer, and plays a role in the electronic dissemination field. ", fine suction is the main factor affecting the performance of the heat pipe. The size of the capillary suction mainly depends on the capillary structure of the heat pipe. The pores of the capillary structure of the heat pipe are small, and the capillary suction force is larger. ^ = The heat pipe can be divided according to the capillary structure The mesh structure of the groove type, the sintered type, the fiber type and the wire type, and the mesh type is formed by weaving a plurality of wires. If the capillary suction of the fine structure is required, the weaving density is usually increased to make the wires Between the a gap, but 'in the current technology, _ woven to reduce the capillary structure of the pores have a smaller than the wool! 1 纟 4 industry hopes that the need to increase the woven density can increase the capillary suction [invention] ϋ吉构: View细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细Providing a method for manufacturing a capillary structure, processing the capillary having a convex capillary, and forming a convex mesh, and then providing a protrusion on the wire to form a J275765 comprising a canister shape, the heat pipe= Sigh & body The above-mentioned capillary structure and the working medium filled in the tube body. Effective ======r protrusion can reduce the heat absorption of the working medium made by the heat medium inside the heat pipe of the # 恤 从, , * wood σκ capillary structure At the end, the heat dissipation efficiency of the heat pipe is improved. The utility model can increase the weaving density to achieve the effect of increasing the capillary suction force. The present invention will be further described below with reference to the accompanying drawings. The cross-sectional shape of the wire 6 is circular or rectangular. The order--the cross-sectional shape of the thread 6 is woven, and it is also woven with the thread 6 of different cross-section shapes. ^.Ge not 6' recorded, the end is made by _Lu. Xiugang special material, the melting point of the winter is less than Or equal to the melting point of the wire 6, the process, the screen has melted and the powder has not been wheatized.. 'As shown in the fourth figure, the capillary structure of the inner wall of the body 2 of the above capillary structure 4 is used. 4 and the valve body 2 filled in the tube body 2 is sighed therein, the tube body 2 is made of a metal having good thermal conductivity, and in this embodiment, it is copper. The tube body 2 can be provided with a bump or _Steaming f is in good contact with the inner wall of the tube 2. 4 The working medium generally adopts a lower boiling point and can be combined with a capillary structure such as water, alcohol, etc. In the heart of the body, as shown in the fifth to seventh figures, the manufacturing process of the capillary structure 4 of the present invention is as follows: Weaving. The wire 6 is cross-woven to form a wire mesh having no protrusions 8; spraying. The wire mesh is placed in a high temperature furnace or other heating device to be twisted, and the nozzle 9 sprays the fine powder on both sides of the wire mesh and the lower surface. 'The fish are small: they are bonded to each other by heat to form a wire mesh with protrusions 8. The wire can be sprayed with a mixture of powders of different materials. ^ 1275765 The heating device is taken out, cooled, and cooled to obtain a wire mesh having the protrusions 6. The present invention can also lay the powder on a flat plate at a normal temperature to form a powder bed, and the wire is placed and heated. The heated screen is quickly placed on the powder bed and the powder is pressed against the screen to form the capillary structure 4. In the present invention, the capillary structure 4 is provided with a plurality of protrusions 8, which can reduce the size of the capillary knot to increase the capillary suction force, so that the medium in the heat pipe using the capillary structure can be quickly returned to the heat absorption of the heat pipe. End [Simple description of the schema] '''s ^
第一圖為本發明毛細結構之展開圖; 第二圖為本發明毛細結構展開之俯視圖; 第三圖為第二圖之部分放大圖; 第四圖為本發明熱管之截面圖; 第五圖為本發明毛細結構製造方法之工作流程圖。 【主毛緒财麵拉料狀態掘。 管體 絲線 凸起 2毛細結辑 6 孔隙’ 8 噴嘴 479The first figure is a development view of the capillary structure of the present invention; the second figure is a top view of the expansion of the capillary structure of the present invention; the third figure is a partial enlarged view of the second figure; the fourth figure is a sectional view of the heat pipe of the present invention; It is a working flow chart of the manufacturing method of the capillary structure of the present invention. [The main Mao Xu Cai face pulling state. Tube body wire protrusion 2 capillary knot 6 pore ' 8 nozzle 479
Claims (1)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094102627A TWI275765B (en) | 2005-01-28 | 2005-01-28 | Wick structure, method of manufacturing the wick structure, and heat pipe |
| US11/164,457 US20060196641A1 (en) | 2005-01-28 | 2005-11-23 | Screen mesh wick and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094102627A TWI275765B (en) | 2005-01-28 | 2005-01-28 | Wick structure, method of manufacturing the wick structure, and heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200626863A TW200626863A (en) | 2006-08-01 |
| TWI275765B true TWI275765B (en) | 2007-03-11 |
Family
ID=36943017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094102627A TWI275765B (en) | 2005-01-28 | 2005-01-28 | Wick structure, method of manufacturing the wick structure, and heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20060196641A1 (en) |
| TW (1) | TWI275765B (en) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI259895B (en) * | 2005-03-18 | 2006-08-11 | Foxconn Tech Co Ltd | Heat pipe |
| US20060260786A1 (en) * | 2005-05-23 | 2006-11-23 | Faffe Limited | Composite wick structure of heat pipe |
| KR100795753B1 (en) * | 2006-06-26 | 2008-01-21 | (주)셀시아테크놀러지스한국 | Plate heat transfer device and its manufacturing method |
| ITMI20071332A1 (en) * | 2007-07-04 | 2009-01-05 | Fic S P A | RADIATOR, PARTICULARLY FOR HEATING OR SIMILAR SYSTEMS, AT HIGH THERMAL PERFORMANCES AND AT HIGH OPERATING SILENCE. |
| WO2009049397A1 (en) * | 2007-10-19 | 2009-04-23 | Metafoam Technologies Inc. | Heat management device using inorganic foam |
| US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| TW201036527A (en) * | 2009-03-19 | 2010-10-01 | Acbel Polytech Inc | Large-area liquid-cooled heat-dissipation device |
| CN101900507B (en) * | 2010-01-15 | 2011-12-21 | 富瑞精密组件(昆山)有限公司 | Flat and thin type heat pipe |
| US20120048517A1 (en) * | 2010-08-31 | 2012-03-01 | Kunshan Jue-Chung Electronics Co., | Heat pipe with composite wick structure |
| TWI428554B (en) | 2011-09-30 | 2014-03-01 | Foxconn Tech Co Ltd | Heat pipe |
| TW201525398A (en) * | 2013-12-25 | 2015-07-01 | Hao Pai | Wick structure having braided flat fiber and ultrathin heat pipe having the same |
| JP6477254B2 (en) | 2014-05-30 | 2019-03-06 | 三菱マテリアル株式会社 | Porous aluminum composite and method for producing porous aluminum composite |
| JP6237500B2 (en) * | 2014-07-02 | 2017-11-29 | 三菱マテリアル株式会社 | Porous aluminum heat exchange member |
| US12385697B2 (en) | 2014-09-17 | 2025-08-12 | Kelvin Thermal Technologies, Inc. | Micropillar-enabled thermal ground plane |
| US11988453B2 (en) | 2014-09-17 | 2024-05-21 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| CN109773434A (en) * | 2014-09-17 | 2019-05-21 | 科罗拉多州立大学董事会法人团体 | Enable the hot ground plane of microtrabeculae |
| CN105588464A (en) * | 2014-11-14 | 2016-05-18 | 富瑞精密组件(昆山)有限公司 | Capillary wire, capillary structure and heat pipe |
| US12104856B2 (en) | 2016-10-19 | 2024-10-01 | Kelvin Thermal Technologies, Inc. | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems |
| CN116936500A (en) | 2016-11-08 | 2023-10-24 | 开尔文热技术股份有限公司 | Method and apparatus for spreading high heat flux in a thermal ground plane |
| CN113720185B (en) | 2017-05-08 | 2024-11-15 | 开文热工科技公司 | Thermal Management Plane |
| CN110763057A (en) * | 2019-10-16 | 2020-02-07 | 东莞领杰金属精密制造科技有限公司 | Ultrathin heat pipe and manufacturing method thereof |
| EP3812684B1 (en) * | 2019-10-24 | 2023-06-07 | Albakri, Sami Abdulrahman A. | Planar heat transfer device, use thereof and method for its manufacture |
| KR102168097B1 (en) * | 2020-01-21 | 2020-10-20 | 에이블메탈 주식회사 | Sintering hybrid wick based screen mesh and method for manufacturing thereof |
| US11930621B2 (en) | 2020-06-19 | 2024-03-12 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
| KR102568890B1 (en) * | 2020-10-12 | 2023-08-21 | 한국항공대학교산학협력단 | Manufacturing method for low temperature sintering hybrid wick, hybrid wick and heat pipe including the same |
| CN116294733A (en) * | 2023-03-08 | 2023-06-23 | 华南理工大学 | A composite liquid-absorbing core soaking plate and its preparation method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4565243A (en) * | 1982-11-24 | 1986-01-21 | Thermacore, Inc. | Hybrid heat pipe |
| US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
| US4964457A (en) * | 1988-10-24 | 1990-10-23 | The United States Of America As Represented By The Secretary Of The Air Force | Unidirectional heat pipe and wick |
| US6460612B1 (en) * | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
| US20050247435A1 (en) * | 2004-04-21 | 2005-11-10 | Hul-Chun Hsu | Wick structure of heat pipe |
| US6997243B2 (en) * | 2004-04-23 | 2006-02-14 | Hul-Chun Hsu | Wick structure of heat pipe |
| CA2574200A1 (en) * | 2004-07-21 | 2006-01-26 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
-
2005
- 2005-01-28 TW TW094102627A patent/TWI275765B/en active
- 2005-11-23 US US11/164,457 patent/US20060196641A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TW200626863A (en) | 2006-08-01 |
| US20060196641A1 (en) | 2006-09-07 |
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