1273747 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種溫控平台檢測系統，尤指一種可提 供多工檢測待測物件並且快速抽換待測物件之一種抽換式 溫控平台檢測系統。 【先前技術】 • 習知作為溫度控制的元件可分為壓縮機以及熱電致 冷晶片兩種，惟壓縮機因體積過於龐大，對於具有微型化 系統需求之實驗有諸多限制，尤其是分別獨立的冷卻加熱 系統，對於需要隨時調整溫度輸出與快速達到穩態要求之 應用更是一大挑戰。此外，也因必須添加冷煤，而造成環 保公害。 與傳統壓縮機相較之下，熱電致冷晶片之體積小且不 需使用冷煤故無環保公害問題，因此相當適合用於如血液 • 分析、胚體實驗以及生物晶片即時化驗等生命科學與醫學 生物化驗領域中。文件US6826916揭露了一種透過金屬基 座將欲降溫的光學元件直接固定於熱電致冷晶片上之發 明，惟其對於待降溫之元件之更換較為不便，且僅能於同 一時間内對單一元件執行降溫，無法達到多工之要求◦綜 - 合上述，因此亟需一個可提供多工檢測待測物件並且快速 抽換待測物件之系統，以解決習知技術缺失。 【發明内容】 6 1273747 本發明駐要目的是類—觀於 =靖測物之抽換式溫控平台檢測系、二 於^、基座上之至少一載具以承載待測物件， 才欢測以及便於抽換待測物。 運i夕工 為達到上述之目的，本發明係提供—種抽換 4測系統，包括：—導熱基座、至少—連: 溫度感測元件以及至少一埶電致 ™ ’y — 高導熱性材料組成如金屬二；：片鐵;系由 載:高機，合材料等’可以均勻溫度分佈::: 及頂針&= 待測物件；該連接器可選擇插槽式 ^頂針式其巾之-，並設置於料熱基座上，* ; = 崎測物件提供的訊號傳㈣議測 IC電;可選擇熱敏電阻、熱電偶 屯阻式，皿度计及其組合苴中一， 、 座上，以片、目丨丨兮番θ /、 、’置於该導熱基 …、电双~曰曰片，可為單層或多層， :導S個串聯、並聯、串並聯或多級疊層使用疋並且斑 工檢測待測物件並且快速抽換待測物件以提升工作效率。 較佳的是’該導熱基 1普壯 承載裝置可為導熱基座上 ^ /、 ^ 軌式插槽、+#iu_ 曰，且该插槽可選擇滑 恭目Γ 槽、及夾持式插槽其中之一，以利該 m其中該載具更設有—防 1273747 插槽之方向錯誤。此外，該載具可單獨由一基板構成或由 ~ 一基板與一訊號感測器所構成。其中該訊號感測器可選擇 • 表面聲波元件（SAW)、石英晶體微天平（QCM)、壓電晶體 (PZ)、光纖（FOS)以及場效電晶體（FET)、化學感測器等其 中之一，且該基板可選擇印刷電路板、玻璃及高分子材質 其中之一，或該載具係為一個已嵌入訊號感測器之矽晶圓 載具◦其中該載具係為一基板與一訊號感測器所構成時， 則該基板更包括有如導熱通孔、金屬薄膜之導熱裝置。 • 較佳的是，該熱電致冷晶片更連結至由一散熱鰭片及 一後端強制散熱單元構成之裝置，以加速散熱，其中該後 端強制散熱單元，可選擇氣冷散熱器、水冷散熱器及冷媒其中之 【實施方式】 為使貴審查委員對於本發明之特徵、目的及功能有更進一 步之認知與理解，兹配合圖示詳細說明如后： 請參閱圖一，其係為本發明抽換式溫控平台檢測系統 較佳實施例立體示意圖。在本實施例中，本發明提供一種 溫控平台檢測系統，其係包括一導熱基座10、至少一連接 器20、至少一溫度感測元件30以及一熱電致冷晶片40。 該導熱基座10係由高導熱性材料所構成，如金屬材料銅、 鋁、鐵等，或半導體材質如矽，或高機能複合材料，並且 該導熱基座10更提供至少一具有防笨裝置之載具70，以 承載一待測物件8 0。該導熱基座10更包括：至少一承載 裝置11，其係利用機械加工形成之插槽，以及至少一導熱 8 1273747 基座頂部開口 13。該？ 並且分別配置對應之载具二載，具1 件30於各承載裝置】】中。节 以及溫度感測το 觀測者檢測待測物件δ。。走、基座頂部開口 13可以讓 二遠連接器2G ’其係設置於該導熱基 、 吕亥載具70所残測的％味难 、…、土 α 上，可以將 称貝編唬傳遞至後端檢 該溫度感測元件3Q，得外罢认^…衍糸、、充 以感測該載具7〇之㈤声、:、;又士。亥導熱基座10上，可 令孰人日 1科_溫度訊號至控制器。 口乂…、电致々晶片4〇，係愈導埶其 據控制器供給的電壓值，爽、素、':土座10連接，並且根 基座10與熱電致冷晶片4〇 11^由於钕熱 短，故能即時響庫埶、、7^卜=，使其熱傳遞路徑縮 控時間。在本達成熱平衡，有效縮短溫 ，才間在本_例中，該熱電致冷晶片4 散熱鰭片50與一後端強制坳舶留—ΡΛ 又逆、、、口主J由一 以加速散熱。 政熱早706(1構成之散熱裝置， 圖二為圖-之剖面圖。載具70經由導熱基座μ 的開口順者承載裝置u置人溫控平台内，該承财置Η 内部更嵌入有用以固定該載具70之固定簧片12，當 具^送人該承載裝置u並與連接器2{)完成接合後田= 接器20會將訊號傳遞至後端檢測分析系統，以達成檢、、則 的。溫度感測元件3Q係、安裝於該導熱基座上，能即:將㈤ 度訊號回駐㈣H，並透過該控㈣，調整輸出至執= 致冷晶片40的電壓值來達成溫度調變功能。由於該導K 座1〇與該熱電致冷晶片4〇直接接觸，使其熱傳遞路^ς 短，故能即時響應熱溫度變化，達成熱平衡，有效縮 1273747 控時間◦該熱電致冷晶片40更設置有由一散熱鰭片50與 '一後端強制散熱單元60構成之散熱裝置以幫助散熱。其應 ~ 用為當工作溫度必須下降至低於室溫時，將會從該導熱基 座10帶走大量的熱，此時該熱電致冷晶片40的冷面持續 降溫，而該熱電致冷晶片40的熱面將會累積能量，如果此 時該熱電致冷晶片40的熱面溫度無法降低，那麼冷面溫度 自然無法跟著降低。所以必須透過該散熱鰭片50與該後端 強制散熱單元60將該熱電致冷晶片40熱面累積的熱量散 • 失，這樣便可迫使該熱電致冷晶片40冷面的溫度持續降 低，理論上該熱電致冷晶片40的工作溫度可達-150°C〜 + 125。。。 請參閱圖三，其係本發明之承載裝置11内部示意圖。 其中固定簧片12係置於承載裝置11内部，當載具70送入 承載裝置11時，會產生一作用力擠壓該固定簧片12，此 時該固定簧片12會產生一反作用力進而固定該載具70。 請參閱圖四，其係載具70的示意圖。該載具70係由 • 基板71與訊號感測器72所構成。其中該基板71可選擇印 刷電路板、玻璃、高分子材質其中之一。其中該訊號感測 器可選擇表面聲波元件（SAW)、石英晶體微天平（QCM)、壓 電晶體（PZ)、光纖（FOS)及場效電晶體（FE：T)、化學感測器 等其中之一。 . 請參閱圖五，其係載具70的示意圖。其中該載具70 . 係為一個已嵌入訊號感測器的矽晶圓載具73。 請參閱圖六，其係本發明之溫度控制電路之電路方塊 圖。當預設之溫度值輸入控制器後，該控制器會將該溫度 1273747 值轉換成電壓訊號並輸出至熱電致冷晶片，此時該熱電致 ~ 冷晶片會因輸入電壓值的不同而有溫度變化，更由於導熱 ' 基座係與該熱電致冷晶片連結，因此該導熱基座上之載具 溫度理論上會與該熱電致冷晶片一致，但由於外界雜訊的 . 影響，使得該待載具溫度與預設溫度值可能會有些許誤 差，當該載具所代表的輸出溫度與預設溫度值有溫差存 在，溫度感測元件會將該溫差訊號再傳回該控制器，重複 執行上述動作至預設溫度值與輸出溫度一致為止。 • 因此，利用本發明之抽換式溫控平台檢測系統執行檢 測工作更具有下列優點： 1. 大幅微型化溫控模組。 2. 便於快速更換待測物件。 3. 縮短溫控穩態響應時間。 4. 可擴充承載裝置，以實現同時多工之功能。 惟以上所述者，僅為本發明之較佳實施例，並非用以 限定本發明之實施範圍，舉凡依本發明申請專利範圍所作 * 之均等變化與修飾，仍將不失本發明之要義所在，亦不脫 離本發明之精神和範圍，均應視為本發明之進一步實施狀 況0 【圖式簡單說明】 圖一係為抽換式溫控平台檢測系統之較佳實施例立 體示意圖。 圖二係為圖一之剖面圖。 1273747 圖三係為承載裝置内部示意圖。 圖四係為載具之不意圖。 圖五係為另一種載具的示意圖。 圖六係為溫度控制電路之電路方塊圖。 【主要元件符號說明】 10- 導熱基座 11- 承載裝置 12- 固定簧片 13- 導熱基座頂部開口 20-連接器 3 0 -溫度感測元件 40-熱電致冷晶片 50-散熱鰭片 60-後端強制散熱單元 70-載具 71 -基板 7 2 -訊號感測器 73-矽晶圓載具 80-待測物件 121273747 IX. Description of the Invention: [Technical Field] The present invention relates to a temperature control platform detection system, and more particularly to a temperature-control platform capable of providing multiplex detection of an object to be tested and quickly extracting an object to be tested. Detection Systems. [Prior Art] • It is customary to use temperature control components as compressors and thermoelectric cooling chips. However, compressors are too bulky and have many limitations on experiments with miniaturized systems, especially independent. Cooling the heating system is a challenge for applications that require constant temperature output and fast steady-state requirements. In addition, because of the need to add cold coal, it causes environmental pollution. Compared with conventional compressors, thermoelectrically cooled wafers are small in size and do not require the use of cold coal, so they are not suitable for environmental protection, so they are suitable for life sciences such as blood analysis, embryo body experiments, and biochip real-time assays. In the field of medical bioassay. Document US Pat. No. 6,826,916 discloses an invention for directly attaching an optical element to be cooled to a thermoelectrically cooled wafer through a metal base, but it is inconvenient for the replacement of the component to be cooled, and can only cool the single component at the same time. Unable to meet the requirements of multiplexing - In view of the above, there is a need for a system that can provide multiplex inspection of the object to be tested and quickly exchange the object to be tested to solve the lack of prior art. SUMMARY OF THE INVENTION 6 1273747 The purpose of the present invention is to view the test system of the temperature-control platform of the measuring object, the at least one carrier on the base, and the at least one carrier on the pedestal to carry the object to be tested. Measure and facilitate the exchange of the object to be tested. In order to achieve the above objectives, the present invention provides a four-measurement system including: a thermally conductive base, at least one: a temperature sensing element and at least one electrically conductive TM 'y - high thermal conductivity Material composition such as metal two;: sheet iron; is carried by: high machine, composite material, etc. 'can be even temperature distribution::: and thimble &= the object to be tested; the connector can be selected slot type thimble type towel - and set on the material heat base, *; = signal transmission provided by the Kawasaki object (4) to measure the IC power; optional thermistor, thermocouple resistance type, the meter and its combination , on the seat, in the film, the eyepiece θ /, , ' placed in the thermal base ..., electric double ~ 曰曰 piece, can be single or multi-layer, : S lead series, parallel, series or parallel or more The level stack uses 疋 and the plaque detects the object to be tested and quickly exchanges the object to be tested to improve work efficiency. Preferably, the heat-conducting base 1 can be a heat-conducting base on the ^ /, ^ rail slot, +#iu_ 曰, and the slot can be selected as a sliding channel, and a clamping plug One of the slots, in order to benefit the m, the carrier is further equipped with - the wrong direction of the 1273747 slot. In addition, the carrier may be composed of a single substrate or a substrate and a signal sensor. Among them, the signal sensor can be selected: surface acoustic wave component (SAW), quartz crystal microbalance (QCM), piezoelectric crystal (PZ), fiber optic (FOS), field effect transistor (FET), chemical sensor, etc. And the substrate can be selected from one of a printed circuit board, a glass and a polymer material, or the carrier is a wafer carrier with a signal sensor embedded therein, wherein the carrier is a substrate and a carrier When the signal sensor is constructed, the substrate further includes a heat conducting device such as a heat conductive through hole and a metal film. Preferably, the thermoelectrically cooled chip is further connected to a device consisting of a heat dissipating fin and a rear end forced heat dissipating unit for accelerating heat dissipation, wherein the rear end of the forced heat dissipating unit can be selected from an air cooled radiator and water cooled. [Embodiment] In order for the reviewer to have a better understanding and understanding of the features, purposes and functions of the present invention, the detailed description is as follows: Please refer to Figure 1. A schematic perspective view of a preferred embodiment of the invention relates to a pumping type temperature control platform detection system. In the present embodiment, the present invention provides a temperature control platform detection system including a thermally conductive base 10, at least one connector 20, at least one temperature sensing element 30, and a thermoelectrically cooled wafer 40. The thermally conductive base 10 is made of a highly thermally conductive material, such as a metal material such as copper, aluminum, iron, or the like, or a semiconductor material such as tantalum, or a high-performance composite material, and the thermally conductive base 10 further provides at least one anti-stiction device. The carrier 70 carries an object to be tested 80. The thermally conductive base 10 further includes at least one carrier 11 that is machined into a slot and at least one thermally conductive 8 1273747 base top opening 13 . What? And respectively, the corresponding carrier is configured to carry two loads, and one piece 30 is in each carrying device]. Section and temperature sensing το The observer detects the object to be measured δ. . The pedestal top opening 13 allows the two-way connector 2G to be disposed on the heat-conducting base, the 5% of the refractory, and the soil α, which can be transmitted to the rear end. The temperature sensing element 3Q is inspected, and the external sensing device is used to sense the sound of the vehicle, and is filled with the sound of the vehicle. On the heat-conducting base 10 of the sea, it can be used to send a temperature signal to the controller. The 乂 乂 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The heat is short, so it can immediately ring the library, 7^b =, so that the heat transfer path is reduced. In this case, the heat balance is achieved, and the temperature is effectively shortened. In this example, the heat-dissipating fins 4 of the thermoelectric cooling fins 4 and the rear end of the heat-dissipating fins 50 are forced to be retracted, and the main J is used to accelerate the heat dissipation. . The political heat is early 706 (1 consists of a heat sink, and Figure 2 is a cross-sectional view of the figure. The carrier 70 is placed in the temperature control platform via the opening of the heat-conducting base μ, which is embedded in the interior of the temperature control platform. There is a fixed reed 12 for fixing the carrier 70. After the carrier u is delivered and the connector 2{) is engaged, the field connector 20 transmits the signal to the back end detection and analysis system to achieve inspection. , and then. The temperature sensing component 3Q is mounted on the thermally conductive base, and can return the (five) signal to the (four) H, and through the control (4), adjust the voltage value outputted to the crying wafer 40 to achieve the temperature modulation function. . Since the conductive K-seat 1〇 is in direct contact with the thermoelectrically cooled wafer 4〇, the heat transfer path is short, so that the thermal temperature change can be instantly responded to achieve thermal equilibrium, and the thermoelectrically cooled wafer 40 is effectively reduced by 1373747 control time. Further, a heat dissipating device composed of a heat dissipating fin 50 and a rear end forced heat dissipating unit 60 is provided to help dissipate heat. It should be used to take a large amount of heat from the thermally conductive susceptor 10 when the operating temperature must fall below room temperature, at which time the cold surface of the thermoelectrically cooled wafer 40 continues to cool, and the thermoelectric cooling The hot side of the wafer 40 will accumulate energy. If the hot surface temperature of the pyroelectric wafer 40 cannot be lowered at this time, the cold surface temperature naturally cannot be lowered. Therefore, it is necessary to dissipate the heat accumulated on the hot surface of the thermoelectrically cooled wafer 40 through the heat dissipation fins 50 and the rear end forced heat dissipation unit 60, thereby forcing the temperature of the cold surface of the thermoelectric cooling wafer 40 to continuously decrease. The thermoelectrically cooled wafer 40 can be operated at temperatures ranging from -150 ° C to + 125. . . Please refer to FIG. 3 , which is a schematic diagram of the internal structure of the carrying device 11 of the present invention. The fixing spring 12 is placed inside the carrying device 11. When the carrier 70 is fed into the carrying device 11, a force is generated to press the fixing spring 12, and the fixing spring 12 generates a reaction force. The carrier 70 is fixed. Please refer to FIG. 4 , which is a schematic diagram of the carrier 70 . The carrier 70 is composed of a substrate 71 and a signal sensor 72. The substrate 71 can be selected from one of a printed circuit board, a glass, and a polymer material. The signal sensor can select surface acoustic wave element (SAW), quartz crystal microbalance (QCM), piezoelectric crystal (PZ), optical fiber (FOS) and field effect transistor (FE: T), chemical sensor, etc. one of them. Please refer to FIG. 5 , which is a schematic diagram of the carrier 70 . The carrier 70 is a silicon wafer carrier 73 that has been embedded with a signal sensor. Please refer to FIG. 6, which is a circuit block diagram of the temperature control circuit of the present invention. When the preset temperature value is input to the controller, the controller converts the temperature of 1273747 into a voltage signal and outputs it to the thermoelectrically cooled wafer. At this time, the thermoelectrically-cooled wafer has a temperature due to the difference of the input voltage value. The change, and more because the heat conduction 'base is connected to the thermoelectric cooling chip, so the temperature of the carrier on the thermally conductive base is theoretically consistent with the thermoelectrically cooled wafer, but due to the influence of external noise, the waiting There may be some error between the temperature of the vehicle and the preset temperature. When the temperature difference between the output temperature represented by the vehicle and the preset temperature value exists, the temperature sensing component will transmit the temperature difference signal back to the controller and repeat the execution. The above operation until the preset temperature value coincides with the output temperature. • Therefore, the use of the pumping type temperature control platform detection system of the present invention to perform the inspection work has the following advantages: 1. The miniaturization of the temperature control module. 2. It is convenient to quickly change the object to be tested. 3. Shorten the temperature-controlled steady-state response time. 4. The load carrying device can be expanded to realize the function of simultaneous multiplexing. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalent changes and modifications of the invention according to the scope of the present invention will remain the essence of the present invention. Without departing from the spirit and scope of the present invention, it should be considered as a further implementation of the present invention. [FIG. 1] FIG. 1 is a perspective view of a preferred embodiment of a temperature-controlled platform detection system. Figure 2 is a cross-sectional view of Figure 1. 1273747 Figure 3 is a schematic diagram of the internal structure of the carrying device. Figure 4 is a schematic representation of the vehicle. Figure 5 is a schematic diagram of another vehicle. Figure 6 is a block diagram of the temperature control circuit. [Main component symbol description] 10- Thermal base 11 - Carrier 12 - Fixed reed 13 - Thermal base top opening 20 - Connector 3 0 - Temperature sensing element 40 - Thermoelectric cooled wafer 50 - Heat sink fin 60 - Rear end forced heat dissipation unit 70 - Carrier 71 - Substrate 7 2 - Signal sensor 73 - 矽 Wafer carrier 80 - Object to be tested 12