1266594 九、發明說明： 【發明所屬之技術領域】 ’尤指一種經模組化 本發明係關於一種電腦系統及其埶 設計之電腦系統及其散熱模組。 …、換農置 【先前技術】 ，著電子資訊《的快速發展，高科技電子產品 、運算快速的趙勢發展，不但使系統散熱負荷持續增力t，1266594 IX. Description of the invention: [Technical field to which the invention pertains] ‘In particular, a modularized computer system and a computer system thereof and a heat dissipation module thereof. ..., change the farmer [previous technology], the rapid development of electronic information, high-tech electronic products, rapid development of Zhao potential, not only make the system cooling load continue to increase t,
料速度销料下―熱《愈來愈 重威我子元件的運雜能及產品功㈣歡性 而燒毀該等昂貴的電子元件。因此，為確保電子猶的 二 須對件的本身及產品的整個系統進行有效且快速的散熱。 業界有採用散熱器加風扇的方式對電子元件進行散執，唯此種習 ===槪冷錢織料足高頻高賴子元 因為如果單以提高風扇轉速會造成噪音與振動的品質問 加散熱器之面積又違背輕薄小巧的市場產品需求。 科技電子產品卿應有的雜，設計出具有高鱗、質量輕、 =二=隨電子元件不同操作功率自動調節移熱能力、並能隨產 電子產品的重要挑賴機會。、衣i已成輕界發展τ—代先進 回流到蒸發部的吸埶區ri阮L社丄朴流魈順暢且及時地 之高、低神變化;^行11，以及⑶餘容量紐著發熱元件 性能的環路式熱交換散熱而；功！=高 尚須結合易於量產、方便安裝、可靠揮 本滿足以下三項條件/ ^'1、、、性能而言，環路式熱交換裝置應基 汽分離，互不‘且循ϋΐ，功能的整體需求：⑴環路中的液、 回流到祕.“早向傳熱’（2)使卫作流體順暢且及時地 6 594 既有元件的功能，並創造更多附加功能等重要 高產品的市職爭力。 則素的祕4，以提 本創作經由、纟示合考I上述堵多因素，提出一44-4kl fJ. Ah 交換散熱產品之模組化系統設計。挺出針對南性趣路式熱 【發明内容】 一種散熱模組裝設於一電路板上，該散埶# ^置、—風料錄鮮-敵風扇， 苐-風道及第二風道，該環路式熱交換裝置;^路形成有 路板上之複數電子元件至少其中之亡;ί;ς置^ 與第二風道之間並與風罩相卡扣，一 ，弟一風運 ，件轉動直到其自動調節到平 ㈣内生路式熱上 達到方便安裝的效果 將該風罩喊支螺絲即可 :實施方式】 路式熱交顧置扇％及—雜7〇。該環 70與風it門^^。、#底气70敎於風罩3〇之底端從而在底板 並與底交縣置1G容餘該風道内 並朝向環路式熱交鮮/1n風罩3G的吸風口端之上方及側方 得該風扇50之;量涵^产路六風罩30的内壁接觸，從而使 面積。風罩30父換褒置1〇的冷凝部16之全部散熱 裝置10的冷凝部°工作時’風扇50朝環路式熱交換 出，且能達拂;^氣$以便將電子元件產生的大部份熱量排 效率件之散熱 兩側延伸出^ ’風罩30包括一頂壁3〇a及從頂壁30a 折邊32上開設有複1 ’，側―壁―=底端分別向外延伸-折邊32， ^ 32 ^ ^ 34 ^ ^ ^ 1266594 請一併參閱第四圖，底把7 有複數固定孔74，該環路有一開孔72，靠近週緣地區設 於底板70的開孔72之蒸發和係鑲嵌並固接 由扣»構如卡銷76穿迅精由螺絲19鎖固於底板70上。藉 筒34之鎖孔Γ相·^^^反:固定孔％與風罩30底部之卡 交換裝置10裝設於風罩如：4圖），k而可將底板70及環路式熱 裕度的鬆結合，從而使^反70士與風罩30之間保有少許前後 小角度的轉動裕度，該預置^沿風罩30縱向保有一 邊32的突起36作為# y的1、角度轉動裕度是藉由以設於風罩30折 置ίο因支揮裝設於底板70上的環路式熱交換裝 36作為支 = 目^熱爾置1G與底板％可相對風罩30以突起 分擔if 例如銅、銘等金屬，以便 埶負荷出，達到降低冷凝部16與風扇50的散 反Λ亦可採用易於成形的低熱導性材料，例如塑 i二二出成?或賴方式成形，並與高導熱材料製成的 ,、、、毛#12膠百’猎以間化製程及降低成本。 由上df 第六圖，該環路式熱交換裝置ω之蒸發部12 細社媒彳％收二板24共同構成一密封的扁平腔體，由内設的毛 體ΐ間區隔為液相微流通道區與低流阻的蒸汽通道 以發的蒸汽通道區與 杯的冷减部16串接。蒸發部12的上、下蓋 底邻靠进道-ϋ良好材質製成的内凹狀蓋體，該下蓋板124的 3 = 14侧(即靠近蒸汽通道區侧)為-較厚的均熱段124a 俨二t侧（即靠近液相微流通道區側〕為一較薄的非均教 L二，二二二 12的下蓋板124的吸熱區125吸熱時，藉由下蓋板 ^對應於液相被流通道區部分的非均熱段mb的厚度相對小於 度’可极t制回流至液相微流通道區之卫作流體^到 m二γ區125沿下蓋板124截面的侧向熱傳導效應而升溫汽 化’故可將&體侧送至該吸熱區125，進—步有餘止乾化現象。 纽it，12的上、下蓋板122、124之對應於液相微流通道區部份 ^卜壁为別設置一散熱器20。當蒸發部12的下蓋板124吸熱時，藉由 對應1液相微流通道區的上、下蓋板122、124外壁所設置之散埶器％， 使回流至該區的工作流體不致受到鄰近高溫吸熱區125的蒸丨^對流 1266594 可紅作紐順概達該吸熱區125，減防止乾 可為—增加散熱面積_片，由於回流至液爐 !之液體存量少’且藉由毛細力在其中傳輸的流 二政”、、器20可為一不需風扇之散熱鰭片。可以理解地， 政…态20也可以只設置於上述上、下蓋板122、124其中之一。 邱献’該冷凝部16係由複數散熱韓片他及穿設於該等 tun複數冷凝管(圖未示）、一上連通管廳、一下連通管 導官14與回流導管18分別連接於該冷凝部的下連 ϋί卜熱交換裝置1G迴路_充有可隨電子元件 弗騰程度的卫作赫’環路中的卫作流體進入冷 ί卩16内的冷凝管璧面作直接細的減換。為防 熱’贿提早冷凝囤積於該管中，導致回流 二其廿12乾化，故本創作所採取的防制措施是採用低流阻 的蒸汽導管14設計，包括_導熱性差的材質， 次將蒸πv& 14的表面包覆絕熱材料。 區ιί 熱10,作時，蒸發部12的下蓋板124之吸熱 124a中，日Ult參第九®)吸熱，熱量先傳到較厚的均熱段 含於苴中由該均熱段丨旅所涵蓋的毛細結構126，將薇 體，;^於錢產生液、汽相變化，絲急速膨脹的沸騰流 較大的流動空間，且由於該沸騰流體在液 不t，該彿騰流體必然順利進人吸熱區125周邊 過言的的見通道區’使得腔體内不致因汽化膨脹而產生 導ί 自麟?、ΐ她雜蜂並施⑽熱處理的蒸汽 面積的一㈣减f 12之蒸汽快速輸送至具有大吸熱®積及大散熱 多的a ϋ:接认1克服習知技術因冷凝部16内的空間過大而造成過 ^Ϊίΐ^ 槽或燒結等的高毛細力吸液結構，使 互f循單—方向傳熱，並能隨著發熱元 -率殳化而自行5周變散熱能力，發揮全方位解熱功能。 在，該環路式熱交齡置1G之蒸汽導管14也可與設 在^部16上方的上連通管16b連通，形成另一實施例。 1266594 第八圖為本發明散熱模組組裝於電路板8〇並固設於 $體不意圖，第九圖為第八圖之側視圖。組裝時，先將^二 衣置ίο的蒸發部^的吸熱區⑵的吸熱面與電子件二士、，、父換 =上熱介面材料(TIM)，將散熱模組置於電路n面之 底部的吸細準確轉冑職80上_子树82 2 發部12 藉由彈簧· 84將風罩3G固定於電路板^的置=位’再 與風罩30之間保有少許前後裕度的鬆、=，從路由^底板7〇 置⑴沿風罩3〇縱向保有-小角度的轉動裕度㈣^^式熱^裝 2 80及機殼9〇 —並鎖固時，可輕易地將環路式換二 之吸熱面定_電子元件82之發熱面位置、，並自動It 貼该政熱面肝以緊密熱接觸，從而達到方便安裝與可靠自定 在上述實施例中，藉由環路式熱交換裝 固設於底板70的模組化設計，在使用時，^將風$ 50上風罩30 板80及機殼9〇，達到方便安裝的優/僅而將風罩⑽固定於電路 在上述實施例中，風罩3〇與底板7〇 1側之用於卡扣風罩3G與底板7G 突起36 立空間’因而使得後續藉由彈簣螺絲84二罩= 向/雷有度的f 0-並鎖固時，可輕易地將環路式熱交換 的、f j及機殼 ❿ 以緊密熱接觸，達賴_與/#==丨賴贿熱面且予 在上述實施例中，風扇％固設於 方’風扇50之風量涵蓋冷凝部16的 ^^及風口= 之上方及側 =亦有部份分流職板7G下方 y風=的下 80 ；6 L,T，^ ff J° ^ 及數量。 又從而可減少糸統風扇的負荷 在上述實施例中，環路式熱交換裝置 元件溫度變麵產生不__度@·^ f 有可隨電子 以絕熱處理的蒸汽導#丨4設計，絲 ^ ^低祕空管並施 屬網填滿並可搭配管壁具微細溝槽或 元王被金屬絲或金 流導管18 ’使自該冷凝部’16 ==== .1266594 【圖式簡單說明】 第第趙组合示意圖 ^三圖為第二圖中風罩之另—角度立體示 ;^四圖為第二圖中環路式熱交換裝置與底；^立 f五圖為第四圖中的蒸發部沿線V-V之剖視j體刀解不意圖，Under the speed of the material, the heat is “more and more important.” The heavy-duty energy and the product function of the sub-components are used to reproduce the expensive electronic components. Therefore, in order to ensure the effective and rapid heat dissipation of the electronic device and the entire system of the product. In the industry, there are radiators and fans to disperse electronic components. This is the only way to learn the quality of noise and vibration if the fan speed is increased. The area of the radiator is contrary to the demand for thin and light market products. The science and technology electronics products should have the same high-scale, light-weight, = two = automatic adjustment of heat transfer capacity with different operating power of electronic components, and can be an important opportunity to follow the production of electronic products. , clothing i has become a light world development τ - generation of advanced return to the evaporation section of the suction section ri阮L society simple and smooth and timely high, low God changes; ^ line 11, and (3) the remaining capacity of the fever Loop-type heat exchange of component performance for heat dissipation; = high quality must be combined with easy mass production, easy installation, and reliable operation to meet the following three conditions / ^ '1,, performance, the loop heat exchange device should be separated by the base steam, not each other and cycle, functional Overall requirements: (1) the liquid in the loop, back to the secret. "Early heat transfer" (2) makes the fluid flow smoothly and timely 6 594 The function of the existing components, and create more additional functions such as important high-products The city's professional competitiveness. The secret of the 4, to mention the creation of the book through the use of multiple test factors, proposed a 44-4kl fJ. Ah exchange cooling system modular system design. Road type heat [Summary of the invention] A heat dissipation module is assembled on a circuit board, and the heat dissipation mode is placed on the circuit board. The heat dissipation mode is used to store the air, the enemy fan, the wind tunnel and the second air duct. The switching device is formed by at least one of the plurality of electronic components formed on the circuit board; ς; ς is placed between the second air duct and the hood, and one of the brothers is swayed, and the member rotates until it Automatic adjustment to the flat (four) endogenous road type heat to achieve the convenience of installation, the windshield shouting screws can be: implementation 】 Road type hot-selling fan set % and - miscellaneous 7 〇. The ring 70 and the wind it door ^ ^., # bottom gas 70 敎 at the bottom of the windshield 3 从而 so that the bottom plate and the bottom of the county set 1G tolerance The fan 50 is located above and to the side of the air inlet end of the loop type heat exchange/1n windshield 3G; the inner wall of the six windshield 30 is contacted to make the area. The condensing portion of all the heat dissipating devices 10 of the condensing portion 16 of the 父 褒 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The heat-dissipating efficiency member extends from both sides of the heat-dissipating portion. The 'wind hood 30 includes a top wall 3〇a and a plurality of folds 32 are formed from the top wall 30a. The side wall-= bottom end extends outward-folded Side 32, ^ 32 ^ ^ 34 ^ ^ ^ 1266594 Please refer to the fourth figure together. The bottom handle 7 has a plurality of fixing holes 74. The loop has an opening 72 which is evaporated near the peripheral opening of the bottom plate 70. The system is inlaid and fixed by the buckle»configuration such as the bayonet 76. The fastener is fastened to the bottom plate 70 by the screw 19. The locking hole of the cylinder 34 is opposite to the bottom surface. ^^^: the fixing hole % and the bottom of the windshield 30 Card exchange device 1 0 is installed in the hood such as: 4)), k can be combined with the bottom plate 70 and the loop type thermal margin, so that there is a slight front and rear small angle of rotation between the anti-70s and the hood 30. , the preset ^ along the longitudinal direction of the hood 30 holds a protrusion 36 of the side 32 as # y 1, the angular rotation margin is a loop which is disposed on the bottom plate 70 by being disposed on the hood 30 The heat exchange unit 36 is used as a support member. The heat source unit 1 and the bottom plate are provided with a protrusion, such as copper, metal, etc., with respect to the hood 30 so as to be loaded with load, so as to reduce the dispersion of the condensation portion 16 and the fan 50. It can also be made of low-heat-conducting materials that are easy to form, such as plastic i-two or two, or with high-heat-conducting materials, and can be used to reduce the cost and reduce costs. . From the sixth figure of the above df, the evaporation unit 12 of the loop type heat exchange device ω forms a sealed flat cavity, which is divided into a liquid phase by a built-in capillary body. The microfluidic channel region and the low flow resistance vapor channel are connected in series with the cold reduction portion 16 of the cup. The bottom of the upper and lower covers of the evaporation portion 12 are adjacent to the inner concave-shaped cover made of a good material, and the 3=14 side of the lower cover 124 (ie, near the side of the steam passage region) is thicker. The hot section 124a 俨2t side (ie, near the side of the liquid phase microfluidic channel area) is a thin non-uniform L2, and the heat absorbing area 125 of the lower cover 124 of the 2222 is absorbed by the lower cover. ^ The thickness of the non-heating section mb corresponding to the portion of the liquid phase channel portion is relatively less than 'degrees' can be returned to the liquid phase microfluidic channel region of the working fluid ^ to m two gamma region 125 along the lower cover 124 The lateral heat transfer effect of the cross section is heated and vaporized, so that the & body side can be sent to the heat absorbing zone 125, and the step of drying can be dried. The upper and lower covers 122, 124 of Newit, 12 correspond to the liquid. A portion of the microfluidic channel region is provided with a heat sink 20. When the lower cover 124 of the evaporation portion 12 absorbs heat, the outer walls of the upper and lower covers 122, 124 corresponding to the liquid phase microfluidic channel region are corresponding. The diffuser % is set so that the working fluid returning to the zone is not subjected to the vaporization of the adjacent high-temperature heat-absorbing zone 125, and the convection can be made to the heat-absorbing zone 125. Preventing dryness - increasing the heat dissipation area _ piece, due to the flow back to the liquid furnace! The liquid storage is small 'and the flow is transmitted by the capillary force", the device 20 can be a heat sink fin without a fan. It can be understood that the political state 20 can also be disposed only on one of the upper and lower covers 122 and 124. Qiu Xian's the condensing portion 16 is composed of a plurality of heat-dissipating pieces and is disposed in the tun plurality of condenser tubes. (not shown), an upper communication pipe hall, a lower communication pipe guide 14 and a return pipe 18 are respectively connected to the lower portion of the condensation portion, the heat exchange device 1G circuit _ is filled with the degree of the electronic component The working fluid in the loop of the He's loop enters the condensing duct inside the cold 卩16 for direct fine reduction. In order to prevent heat, the early condensation of the bribes accumulates in the tube, causing the reflux to dry up. The control measures adopted in this creation are designed with a low flow resistance steam conduit 14, including a material with poor thermal conductivity, and the surface of the steamed πv & 14 is coated with a heat insulating material. Area ιί Heat 10, when the evaporation portion 12 In the heat absorption 124a of the lower cover 124, the Ult ninth®) absorbs heat, The amount first transmitted to the thicker soaking section is contained in the capillary structure 126 covered by the soaking section of the soaking section, which will be compared with the bodily fluid, the vapor phase change, and the rapid expansion of the boiling stream. The large flow space, and because the boiling fluid is not in the liquid, the Fo Teng fluid must smoothly enter the passage area of the end of the heat absorption zone 125, so that the cavity does not cause vaporization and expansion, resulting in a guideline, ΐ 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 ( 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ The high-capillary liquid absorbing structure caused by the groove or sintering of the Ϊ ΐ ΐ 烧结 , 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或Features. The steam duct 14 of the loop type thermal age setting 1G can also communicate with the upper communication tube 16b provided above the portion 16, forming another embodiment. 1266594 The eighth figure is a side view of the heat dissipation module of the present invention assembled on the circuit board 8 固 and fixed to the body, and the ninth figure is the eighth diagram. When assembling, first place the heat absorption surface of the heat absorbing area (2) of the evaporation part of the 衣 衣 与 与 与 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The bottom of the suction is accurately transferred to the job 80 on the _ subtree 82 2 the hair 12 by the spring 84 to fix the hood 3G to the circuit board ^ position = then maintain a little margin between the hood and the hood 30 Loose, =, from the routing ^ bottom plate 7 (1) along the hood 3 〇 longitudinally - a small angle of rotation margin (four) ^ ^ type hot ^ 2 and the chassis 9 〇 - and locked, can easily The loop type is replaced by the heat absorbing surface _ the position of the heat generating surface of the electronic component 82, and automatically it is attached to the hot face of the government to be in close thermal contact, thereby facilitating installation and reliable self-determination in the above embodiment, by the ring The road type heat exchange is fixed on the modular design of the bottom plate 70. When in use, the wind 50 50 windshield cover 30 plate 80 and the casing 9 are used to achieve the convenient installation/only the windshield (10) is fixed. In the above embodiment, the hood 3 〇 and the side of the bottom plate 7〇1 are used for the buckle hood 3G and the bottom plate 7G to protrude 36. Thus, the subsequent use of the magazine screws 84 two hoods = f / ft to the / Lei degree and can be locked, the loop heat exchange, fj and the casing ❿ can be easily intimate thermal contact, Dalai _ and /#== 贿 贿 bribe In the above embodiment, the fan % is fixed to the side of the fan 50. The air volume of the fan 50 covers the upper portion of the condensing portion 16 and the tuyere = side and the side = there is also a part of the diverting plate below the 7G y wind = 80 ;6 L,T,^ ff J° ^ and quantity. Therefore, the load of the fan can be reduced. In the above embodiment, the temperature change of the component of the loop heat exchange device is not generated by the steam guide #丨4 ^ ^Low secret pipe and the application network is filled and can be matched with the wall with a fine groove or the king is wire or gold flow conduit 18 'from the condensation section '16 ==== .1266594 [Simple diagram Explanation] The first Zhao combination diagram ^ three diagrams are the other perspectives of the windshield in the second diagram; ^ four diagrams are the loop heat exchange device and the bottom in the second diagram; The section of the evaporation section along the line VV is not intended to be solved.
，圖為第五圖中蒸發部除去上蓋板矛 —弟七圖為本發明散熱模組中環路式熱交換署 圖， 貫施例立體示意圖； 、展置與底板結合之另一 第八圖為本發明散熱模組組裝於電路板 意圖；及 兀口 5又於機殼之一立體示 第九圖為第八圖之侧視圖。 【主要元件符號說明】In the fifth figure, the evaporation part is removed from the upper cover spear. The seventh figure is the loop type heat exchange unit in the heat dissipation module of the present invention, and the three-dimensional schematic diagram of the embodiment is shown; The heat dissipation module of the present invention is assembled on a circuit board; and the mouthpiece 5 is shown in a perspective view of the eighth figure in a side view of the casing. [Main component symbol description]
環路式熱交換裝置 蒸發部 蒸汽導管 冷凝部 散熱鰭片 上連通管 下連通管 回流導管 散熱器 風罩 頂壁 側壁 折邊 卡筒 鎖孔 10 突起 12 風扇 14 底板 16 固定孔 16a 卡銷 16b 電路板 16c 電子元件 18 螺絲 20 機殼 30 上蓋板 30a 下蓋板 30b 吸熱區 32 均熱段 34 非均熱段 34a 毛細結構 36 50 70 74 76 80 82、86 19、84 90 122 124 125 124a 124b 126 11Circulating heat exchanger evaporating section steam duct condensing section fin on the connecting tube lower connecting tube return duct radiator hood top wall side flange folding cylinder lock hole 10 protrusion 12 fan 14 bottom plate 16 fixing hole 16a bayonet 16b circuit board 16c Electronic components 18 Screws 20 Chassis 30 Upper cover 30a Lower cover 30b Heat absorption zone 32 Soaking section 34 Non-heating section 34a Capillary structure 36 50 70 74 76 80 82, 86 19, 84 90 122 124 125 124a 124b 126 11