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TWI266561B - Method of manufacturing organic electroluminescent panel, manufacturing apparatus of organic electroluminescent panel, and organic electroluminescent panel - Google Patents

Method of manufacturing organic electroluminescent panel, manufacturing apparatus of organic electroluminescent panel, and organic electroluminescent panel

Info

Publication number
TWI266561B
TWI266561B TW093135876A TW93135876A TWI266561B TW I266561 B TWI266561 B TW I266561B TW 093135876 A TW093135876 A TW 093135876A TW 93135876 A TW93135876 A TW 93135876A TW I266561 B TWI266561 B TW I266561B
Authority
TW
Taiwan
Prior art keywords
vapor
organic electroluminescent
manufacturing
electroluminescent panel
panel
Prior art date
Application number
TW093135876A
Other languages
English (en)
Other versions
TW200529697A (en
Inventor
Shinichi Yotsuya
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200529697A publication Critical patent/TW200529697A/zh
Application granted granted Critical
Publication of TWI266561B publication Critical patent/TWI266561B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW093135876A 2003-11-27 2004-11-22 Method of manufacturing organic electroluminescent panel, manufacturing apparatus of organic electroluminescent panel, and organic electroluminescent panel TWI266561B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003397125A JP2005158571A (ja) 2003-11-27 2003-11-27 有機エレクトロルミネッセンスパネルの製造方法、有機エレクトロルミネッセンスパネルの製造装置及び有機エレクトロルミネッセンスパネル

Publications (2)

Publication Number Publication Date
TW200529697A TW200529697A (en) 2005-09-01
TWI266561B true TWI266561B (en) 2006-11-11

Family

ID=34463826

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093135876A TWI266561B (en) 2003-11-27 2004-11-22 Method of manufacturing organic electroluminescent panel, manufacturing apparatus of organic electroluminescent panel, and organic electroluminescent panel

Country Status (6)

Country Link
US (1) US20050130356A1 (zh)
EP (1) EP1536497A2 (zh)
JP (1) JP2005158571A (zh)
KR (1) KR100662832B1 (zh)
CN (1) CN1622707A (zh)
TW (1) TWI266561B (zh)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4329738B2 (ja) * 2005-07-14 2009-09-09 セイコーエプソン株式会社 液晶装置の製造装置、液晶装置の製造方法
JP2007025119A (ja) * 2005-07-14 2007-02-01 Seiko Epson Corp 配向膜の製造装置、配向膜の製造方法、液晶装置、及び電子機器
JP2007025117A (ja) * 2005-07-14 2007-02-01 Seiko Epson Corp 配向膜の製造装置、液晶装置、及び電子機器
JP4782548B2 (ja) * 2005-11-18 2011-09-28 九州日立マクセル株式会社 蒸着方法
JP4773834B2 (ja) * 2006-02-03 2011-09-14 キヤノン株式会社 マスク成膜方法およびマスク成膜装置
KR101281909B1 (ko) * 2006-06-30 2013-07-03 엘지디스플레이 주식회사 박막 증착 장치
JP4971723B2 (ja) 2006-08-29 2012-07-11 キヤノン株式会社 有機発光表示装置の製造方法
JP4872784B2 (ja) * 2007-05-01 2012-02-08 株式会社Ｉｈｉ 基板搬送装置
KR101517020B1 (ko) 2008-05-15 2015-05-04 삼성디스플레이 주식회사 유기전계발광표시장치의 제조장치 및 제조방법
JP5238393B2 (ja) * 2008-07-31 2013-07-17 キヤノン株式会社 成膜装置及びそれを用いた成膜方法
DE102008037387A1 (de) * 2008-09-24 2010-03-25 Aixtron Ag Verfahren sowie Vorrichtung zum Abscheiden lateral strukturierter Schichten mittels einer magnetisch auf einem Substrathalter gehaltenen Schattenmaske
JP2010159454A (ja) * 2009-01-08 2010-07-22 Ulvac Japan Ltd 成膜装置、成膜方法
DE102009019146B4 (de) * 2009-04-29 2014-07-24 THEVA DüNNSCHICHTTECHNIK GMBH Verfahren und Vorrichtung zur Hochratenbeschichtung durch Hochdruckverdampfen
CN103205696A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 蒸镀掩膜板
CN103572245A (zh) * 2012-08-07 2014-02-12 联胜（中国）科技有限公司 掩模块件及使用其的有机气相沉积装置与热蒸镀装置
CN103000819A (zh) * 2013-01-04 2013-03-27 四川虹视显示技术有限公司 Oled玻璃基板
CN103915571A (zh) * 2014-01-27 2014-07-09 上海天马有机发光显示技术有限公司 一种amoled显示面板及膜层制作方法、显示装置
US10947616B2 (en) * 2015-04-17 2021-03-16 Dai Nippon Printing Co., Ltd. Method for forming vapor deposition pattern, pressing-plate-integrated type pressing member, vapor deposition apparatus, and method for producing organic semiconductor element
JP6876520B2 (ja) * 2016-06-24 2021-05-26 キヤノントッキ株式会社 基板の挟持方法、基板の挟持装置、成膜方法、成膜装置、及び電子デバイスの製造方法、基板載置方法、アライメント方法、基板載置装置
CN106328831B (zh) * 2016-10-14 2018-11-30 京东方科技集团股份有限公司 一种贴合板、显示面板、其制作方法及显示装置
CN106435473A (zh) * 2016-11-11 2017-02-22 京东方科技集团股份有限公司 掩模板及其制作方法、有机发光二极管显示器的制作方法
KR102065825B1 (ko) * 2017-09-26 2020-02-11 주식회사 야스 포켓을 구비한 기판 이송 장치
JP6799147B2 (ja) * 2017-10-24 2020-12-09 株式会社アルバック 基板処理装置
KR102618039B1 (ko) 2018-08-29 2023-12-27 삼성디스플레이 주식회사 마스크 조립체, 이를 포함한 표시 장치의 제조장치 및 표시 장치의 제조방법
JP7129888B2 (ja) * 2018-11-07 2022-09-02 東京エレクトロン株式会社 成膜方法及び半導体製造装置
CN111850464B (zh) 2020-06-30 2023-01-03 昆山国显光电有限公司 一种背板
CN114015986A (zh) * 2020-07-17 2022-02-08 神华（北京）光伏科技研发有限公司 电流收集系统及其制备装置和制备方法
CN112853273B (zh) * 2020-12-31 2022-12-16 南京深光科技有限公司 一种柔性amoled掩模版表面镀膜设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4092914B2 (ja) * 2001-01-26 2008-05-28 セイコーエプソン株式会社 マスクの製造方法、有機エレクトロルミネッセンス装置の製造方法
TW589919B (en) * 2002-03-29 2004-06-01 Sanyo Electric Co Method for vapor deposition and method for making display device
JP2004055401A (ja) * 2002-07-22 2004-02-19 Sony Corp 有機膜形成装置

Also Published As

Publication number Publication date
KR100662832B1 (ko) 2006-12-28
EP1536497A2 (en) 2005-06-01
JP2005158571A (ja) 2005-06-16
US20050130356A1 (en) 2005-06-16
TW200529697A (en) 2005-09-01
CN1622707A (zh) 2005-06-01
KR20050051551A (ko) 2005-06-01

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