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TWI263323B - Method for reworking semiconductor packages - Google Patents

Method for reworking semiconductor packages

Info

Publication number
TWI263323B
TWI263323B TW092108431A TW92108431A TWI263323B TW I263323 B TWI263323 B TW I263323B TW 092108431 A TW092108431 A TW 092108431A TW 92108431 A TW92108431 A TW 92108431A TW I263323 B TWI263323 B TW I263323B
Authority
TW
Taiwan
Prior art keywords
semiconductor packages
solder balls
reworking
turntable
heating
Prior art date
Application number
TW092108431A
Other languages
Chinese (zh)
Other versions
TW200421580A (en
Inventor
Ching-Chung Wei
Yen-Chun Chen
Yao-Nan Chen
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW092108431A priority Critical patent/TWI263323B/en
Publication of TW200421580A publication Critical patent/TW200421580A/en
Application granted granted Critical
Publication of TWI263323B publication Critical patent/TWI263323B/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method for reworking semiconductor packages is provided, which includes placing semiconductor packages on a peripheral area of a turntable within a heating vessel, in a manner that the surface of the semiconductor packages with solder balls implanted thereon are facing-up disposed, followed by heating the interior of the heating vessel until the temperature exceeds the melting point of the solder balls, and then rotating the turntable to generate a centrifugal force in order to utilize a heated-air blade to flush and remove the melted solder balls from the surface of the semiconductor packages. By virtue of these steps, the melted solder balls on the semiconductor packages can be completely removed.
TW092108431A 2003-04-11 2003-04-11 Method for reworking semiconductor packages TWI263323B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092108431A TWI263323B (en) 2003-04-11 2003-04-11 Method for reworking semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092108431A TWI263323B (en) 2003-04-11 2003-04-11 Method for reworking semiconductor packages

Publications (2)

Publication Number Publication Date
TW200421580A TW200421580A (en) 2004-10-16
TWI263323B true TWI263323B (en) 2006-10-01

Family

ID=37966336

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092108431A TWI263323B (en) 2003-04-11 2003-04-11 Method for reworking semiconductor packages

Country Status (1)

Country Link
TW (1) TWI263323B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455244B (en) * 2012-03-19 2014-10-01 Wistron Corp Clamping tool and equipment for rework process
CN109107810B (en) * 2018-09-13 2024-04-26 韶关市中都工业新技术开发有限公司 How to use the vegetable oil rust-proof production line for cast iron kitchenware
CN111058006B (en) * 2019-12-11 2021-07-27 江苏长电科技股份有限公司 A magnetron sputtering method for BGA electromagnetic shielding products

Also Published As

Publication number Publication date
TW200421580A (en) 2004-10-16

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