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TWI262897B - Coated magnesium oxide powder with high filling property, and resin composition containing such powder - Google Patents

Coated magnesium oxide powder with high filling property, and resin composition containing such powder

Info

Publication number
TWI262897B
TWI262897B TW92136360A TW92136360A TWI262897B TW I262897 B TWI262897 B TW I262897B TW 92136360 A TW92136360 A TW 92136360A TW 92136360 A TW92136360 A TW 92136360A TW I262897 B TWI262897 B TW I262897B
Authority
TW
Taiwan
Prior art keywords
magnesium oxide
powder
oxide powder
resin composition
composition containing
Prior art date
Application number
TW92136360A
Other languages
Chinese (zh)
Other versions
TW200513437A (en
Inventor
Toshio Kiyokawa
Kaori Yamamoto
Masaaki Kunishige
Original Assignee
Tateho Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateho Kagaku Kogyo Kk filed Critical Tateho Kagaku Kogyo Kk
Publication of TW200513437A publication Critical patent/TW200513437A/en
Application granted granted Critical
Publication of TWI262897B publication Critical patent/TWI262897B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/02—Compounds of alkaline earth metals or magnesium
    • C09C1/028—Compounds containing only magnesium as metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
    • C01P2004/82—Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
    • C01P2004/82—Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases
    • C01P2004/84—Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases one phase coated with the other
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)

Abstract

The present invention provides coated magnesium oxide powder having excellent moisture resistance, as well as excellent filling and flowing properties when added to a resin as a filler, which is characterized in that the surface of magnesium oxide powder is coated with a complex oxide, and said coated magnesium oxide powder has an angle of repose <= 55 DEG and a tap density >= 1.65 g/ml. Further, the present invention provides a resin composition containing said coated magnesium oxide powder, and an electronic device using said resin composition.
TW92136360A 2003-10-03 2003-12-22 Coated magnesium oxide powder with high filling property, and resin composition containing such powder TWI262897B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003346085 2003-10-03

Publications (2)

Publication Number Publication Date
TW200513437A TW200513437A (en) 2005-04-16
TWI262897B true TWI262897B (en) 2006-10-01

Family

ID=34419492

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92136360A TWI262897B (en) 2003-10-03 2003-12-22 Coated magnesium oxide powder with high filling property, and resin composition containing such powder

Country Status (4)

Country Link
JP (1) JP4237182B2 (en)
AU (1) AU2003289060A1 (en)
TW (1) TWI262897B (en)
WO (1) WO2005033216A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4744911B2 (en) * 2005-03-31 2011-08-10 ポリプラスチックス株式会社 High thermal conductive resin composition
JP4747926B2 (en) * 2005-05-25 2011-08-17 東ソー株式会社 Polyarylene sulfide composition
JP4747731B2 (en) * 2005-08-12 2011-08-17 東ソー株式会社 Polyarylene sulfide composition
JP4747730B2 (en) * 2005-08-12 2011-08-17 東ソー株式会社 Polyarylene sulfide composition
JP4747918B2 (en) 2005-11-04 2011-08-17 東ソー株式会社 Polyarylene sulfide composition
JP4747931B2 (en) * 2006-04-25 2011-08-17 東ソー株式会社 Polyarylene sulfide composition
JP2007291300A (en) * 2006-04-27 2007-11-08 Tosoh Corp Polyarylene sulfide composition
WO2011010291A1 (en) * 2009-07-24 2011-01-27 Ticona Llc Thermally conductive polymer compositions and articles made therefrom
JP5803403B2 (en) * 2011-08-09 2015-11-04 東ソー株式会社 Polyarylene sulfide resin composition and composite comprising the same
JPWO2013161844A1 (en) * 2012-04-27 2015-12-24 ポリプラスチックス株式会社 High thermal conductive resin composition
JP6685068B2 (en) * 2016-03-03 2020-04-22 株式会社大豊化成 Heat conductive composite filler, method for manufacturing heat conductive composite filler, heat conductive resin, and method for manufacturing heat conductive resin
US11279830B2 (en) 2016-09-21 2022-03-22 Dic Corporation Surface-treated spinel particles, method for producing the same, resin composition, and molded article
CN108017073B (en) * 2017-12-27 2019-08-23 淮阴工学院 A kind of method that takes bischofite as raw material to prepare magnesium oxide airgel
KR102205178B1 (en) * 2018-12-13 2021-01-21 한국재료연구원 MgO AND METHOD FOR MANUFACTURING THE SAME, AND HIGH THERMAL CONDUCTIVE MgO COMPOSITION, AND MgO CERAMICS USING THE SAME
JP7478631B2 (en) * 2020-09-15 2024-05-07 デンカ株式会社 Magnesium oxide powder, filler composition, resin composition, and heat dissipation part

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345117A (en) * 1986-08-08 1988-02-26 Ube Ind Ltd Production of magnesia powder resistant to hydration
JP2786191B2 (en) * 1987-08-14 1998-08-13 旭硝子株式会社 Method for producing magnesium oxide powder
JP2731854B2 (en) * 1989-02-10 1998-03-25 協和化学工業株式会社 Method for producing high hydration resistant and high fluidity magnesium oxide
JP2538724B2 (en) * 1991-06-14 1996-10-02 日立電線株式会社 Filler for DC power cable insulation
JPH06171928A (en) * 1992-12-01 1994-06-21 Kyowa Chem Ind Co Ltd Production of magnesium oxide high in hydration resistance and high in fluidity
JP2001031887A (en) * 1999-07-21 2001-02-06 Toyota Motor Corp High thermal conductive powder and method for producing the same
AU6183900A (en) * 1999-08-06 2001-03-05 Kyowa Chemical Industry Co., Ltd. Highly acid-resistant, hydration-resistant magnesium oxide particles and resin compositions
JP2003034522A (en) * 2001-07-24 2003-02-07 Tateho Chem Ind Co Ltd Method for manufacturing coated magnesium oxide powder
JP4046491B2 (en) * 2001-07-24 2008-02-13 タテホ化学工業株式会社 Method for producing double oxide-coated magnesium oxide
JP4412879B2 (en) * 2002-03-11 2010-02-10 メルク株式会社 Extender pigment and method for producing the same

Also Published As

Publication number Publication date
WO2005033216A1 (en) 2005-04-14
JP4237182B2 (en) 2009-03-11
AU2003289060A1 (en) 2005-04-21
JPWO2005033216A1 (en) 2006-12-14
TW200513437A (en) 2005-04-16

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