1257699 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種微型攝影模組之組合構造。 【先前技術】 習知微型攝影模組（compaet camera module，CCM)在 使用時須組合連接至一已設積體電路晶片之基板，以驅動 並作動該微型攝影模組。並且習知微型攝影模組内部會組 藝配有許多被動元件，因此造成微型攝影模組之尺寸無法有 效縮小。 請參閱第1圖，一種習知微型攝影模組之組合構造1〇〇 主要包含有一設有一影像感測晶片111之微型攝影模組 110以及一印刷電路板120。在該微型攝影模組u〇中， 該影像感測晶片111與複數個被動元件115係黏設於一軟 性電路板112上，複數個銲線116係電性連接該影像感測 晶片111與該軟性電路板112，一鏡片模組113係罩蔽該 • 影像感測晶片U1與該些被動元件115，影像可透過一透 鏡鏡筒118之透鏡以及該鏡片模組113之一遽光片117， 而月b被該影像感測晶片1 1 1摘取。而該軟性電路板1 1 2之 一端係設置有複數個連接指i 14，以供電性導接至該印刷 電路板120。此外，通常一積體電路晶片122係設置於該 P刷電路板120上，以驅動或處理該影像感測晶片工丨丨之 影像資料。該印刷電路板120係具有複數個連接墊121， 可以焊料或是異方性導電膠固定連接該軟性電路板丨12之 只二連接4曰114與該印刷電路板120之該些連接塾121， 5 1257699 以使該影像感測晶片111能電性捸姐 b覺性連接至該積體電路晶片 122。然而在該微型攝影模 供、、且110與該印刷電路板120組 合後係不可分離，且盔法右对始,# “，、有效縮小該微型攝影模組之組合 構造1 00之尺寸，尤其針對採自 T耵抹自動對焦之微型攝影模組， 更需要加設鏡頭組的驅動元件 靭兀仵而在有限的尺寸下，極需 有增加微型攝影模組内元件設置的方法。 【發明内容】1257699 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a combined construction of a miniature photographic module. [Prior Art] A conventional picaet camera module (CCM) must be combined to be connected to a substrate on which an integrated circuit chip has been mounted to drive and operate the miniature camera module. Moreover, it is known that the miniature photography module has a plurality of passive components in its interior, so that the size of the miniature photography module cannot be effectively reduced. Referring to FIG. 1, a conventional miniature camera module assembly structure 1a mainly includes a miniature camera module 110 having an image sensing chip 111 and a printed circuit board 120. In the micro-camera module, the image sensing chip 111 and the plurality of passive components 115 are attached to a flexible circuit board 112, and the plurality of bonding wires 116 are electrically connected to the image sensing chip 111. The flexible circuit board 112, a lens module 113 covers the image sensing chip U1 and the passive components 115. The image is transmitted through a lens of a lens barrel 118 and a light sheet 117 of the lens module 113. The month b is extracted by the image sensing wafer 1 1 1 . One end of the flexible circuit board 112 is provided with a plurality of connection fingers 14 for power supply to the printed circuit board 120. In addition, an integrated circuit chip 122 is typically disposed on the P-brush circuit board 120 to drive or process image data of the image sensing wafer process. The printed circuit board 120 has a plurality of connection pads 121, and the two connections 4曰114 of the flexible circuit board 12 and the connection ports 121 of the printed circuit board 120 can be fixedly connected by solder or an anisotropic conductive adhesive. 5 1257699 to enable the image sensing wafer 111 to be electrically connected to the integrated circuit wafer 122. However, after the miniature photography module is supplied, and 110 is combined with the printed circuit board 120, it is inseparable, and the helmet method is right-handed, #", effectively reducing the size of the combination structure of the miniature camera module, especially For the miniature photographic module that adopts autofocus from T耵, it is more necessary to add the driving component of the lens group to the toughness. In a limited size, it is highly desirable to increase the component setting in the micro photographic module. 】
本發明之主要目的係在於提供—種微賴影模組之 、、且口構梃’其包含有一微型攝影模組與一印刷電路板，該 微型攝影模組與該印刷電路板係分別包含有可相互插拔 連接之-第-連接器與_第二連接器，並且至少—嵌入式 被動元件係埋設於該第一連接器或/與第二連接器，以利該 微型攝影模組能微小化及模組化，並使該微型攝影模組具 有方便組合、重工容易與提高製程良率之功效。 依據本發明，一種微型攝影模組之組合構造主要包含 一微型攝影模組與一印刷電路板。該微型攝影模組係包含 有一影像感測晶片、一基板、一鏡片模組以及一第一連接 器，其中該影像感測晶片與該鏡片模組係設於該基板之一 上表面’該第一連接器係設於該基板之一下表面。該印刷 電路板係設置有一第二連接器，該第二連接器係可供該第 連接器之插接’以達模組化結合。其中，至少一喪入式 被動元件係埋設於該第一連接器或/與第二連接器内，以使 該微型攝影模組達到微小化、模組化與降低成本之功效。 【實施方式】 1257699 請參閱第2與3圖，在本發明之一具體實施例中，一 種微型攝景々模組之組合構造2〇〇主要包含有一微型攝影模 組2 1 0與一印刷電路板22〇。該微型攝影模組2丨〇與該印 刷電路板220之間係可相互插拔連接。 該微型攝影模組2 10係包含有一影像感測晶片2丨i、 一基板212、一鏡片模組213以及一第一連接器214。在 本實施例中，該微型攝影模組21〇另包含有至少一埋設於 該第一連接器214内之嵌入式被動元件215。其中，該基 板212係具有一上表面212A以及一下表面212B，該基板 212係可選自於一印刷電路板、一陶瓷基板、或是一預模 導線架，並可具有兩面電性導通之結構（圖未繪出）。該影 像感測晶片211與該鏡片模組213係設於該基板212之該 上表面212 ，該影像感測晶片211係可為 CMOS(Complementary Metal-Oxide Semiconductor，互補 性金屬氧化物半導體）影像感測晶片。該影像感測晶片2 j j 係黏貼至該基板2 12 ’並使其感測面朝上，利用複數個銲 線216電性連接該影像感測晶片2 11至該基板212。該鏡 片模組213則具有一濾光片21 7，並且該鏡片模組213係 可結合一透鏡鏡筒218。該鏡片模組213係結合於該基板 212，並且罩蔽該影像感測晶片2丨丨。該第一連接器2丨4係 設於該基板212之該下表面212B，並可為插頭連接器或是 插座連接器。而該嵌入式被動元件215係可模合密封於該 第一連接器214内並藉由該基板212電性連接至該影像感 測晶片2 11;或者，該第一連接器2 14係可具有一容置穴（圖 1257699 未繪出）’以埋設該嵌入式被動元件2 i 5。 該印刷電路板220係可為各式電氣產品内之電路板， 例如數位相機、PDA、無線手機等等。該印刷電路板22〇 係设置有一第二連接器221。在本實施例中，該印刷電路 板220另包含有至少一埋設於該第二連接器221内之嵌入 式被動凡件222。此外，一積體電路晶片223係可設置於 該印刷電路板220上。在本實施例中，該積體電路晶片223 係覆晶接合於該印刷電路板22()上。該第二連接器221係 為對應於該第一連接器214之插座連接器或是插頭連接 器，以使該第二連接器221與該第一連接器214係可相互 插拔連接。在本實施例中，該微型攝影模組21〇與該印刷 電路板220係藉由該第一連接器214與該第二連接器 之插接，以使得該影像感測晶片211能電性連接至該印刷 電路板220。此外’在該第—連接器2 i 4内之該喪入式被 動元件215亦可藉由該第一連接器214之插接端點電性連 接至該印刷電路板220 ;或者，在該第二連接器221内之 該嵌入式被動元件222可藉由該第二連接器221之插接端 點電性連接至該微型攝影模組21〇之該影像感測晶片 211°車又佳地’該第一連接器214或該第二連接器221之 間額外加裝有一扣環（圖未繪出），用以使兩連接器緊密接 合’不受外力震動影響。並可利用内置模封或是容置穴等 方式’使該嵌入式被動元件222埋設於該第二連接器22 r 内。 由於該微型攝影模組210與該印刷電路板220分別包 1257699 3有可相互插接該第一連接器214與該第二連接器221， W ’至少一嵌入式被動元件215、214係埋設於該第一 連接器214或/與第二連接器221内。因此，在對焦與測試 後可以更換不良之微型攝影模組2丨〇或印刷電路板22〇， 以達到可模組化重工之功效，進而方便作業性、提昇製程 良率並可減少表面黏著（SMT)之成本。此外，由於該嵌入 式被動元件215、214係埋設於該第一連接器214與第二 鲁 連接器221内，因此可使該微型攝影模組之組合構造200 尺寸具有微小化並且可減少基板製造成本之功效。 本發明之保護範圍當視後附之申請專利範圍所界定 2為準，任何熟知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本發明之保護範 圍。 【圖式簡單說明】 第1圖·· f知微型攝影模組之組合構造之截面示意圖。 _帛2圖·依據本發明之—具體實施例…種微型攝影模組 之組合構造之組合前截面示意圖。 第3圖：依據本發明之一具體實施例，該微型攝影模組之 組合構造之組合後截面示意圖。 【主要元件符號說明】 1 〇 〇微型攝影模組之組合構造 110 微型攝影模組 113 鏡片模組 116 銲線 111衫像感測晶片112 軟性電路板 114連接指 1丨5被動元件 9 濾光片 118 透鏡鏡筒 印刷電路板 121 連接墊 積體電路晶片 微型攝影模組之組合構造 微型攝影模組2 11 影像感測晶片 下表面 銲線The main purpose of the present invention is to provide a micro-shadow module, which includes a miniature camera module and a printed circuit board, and the miniature camera module and the printed circuit board system respectively include The first connector and the second connector can be plugged and unplugged, and at least the embedded passive component is embedded in the first connector or/and the second connector, so that the miniature camera module can be tiny The modularization and the mini-photographic module have the advantages of convenient combination, easy rework and improved process yield. According to the present invention, a composite structure of a miniature photographic module mainly comprises a miniature photographic module and a printed circuit board. The miniature photographic module includes an image sensing chip, a substrate, a lens module, and a first connector, wherein the image sensing chip and the lens module are disposed on an upper surface of the substrate A connector is disposed on a lower surface of the substrate. The printed circuit board is provided with a second connector for the plug connector of the connector to be modularly coupled. At least one passive passive component is embedded in the first connector or/and the second connector to achieve miniaturization, modularization and cost reduction of the miniature camera module. [Embodiment] 1257699 Please refer to FIGS. 2 and 3, in a specific embodiment of the present invention, a miniature structure 之 module combination structure 2 〇〇 mainly includes a miniature photographic module 2 10 and a printed circuit Board 22〇. The miniature camera module 2A and the printed circuit board 220 are pluggable and connectable to each other. The miniature camera module 2 10 includes an image sensing chip 2丨i, a substrate 212, a lens module 213, and a first connector 214. In this embodiment, the miniature camera module 21 further includes at least one embedded passive component 215 embedded in the first connector 214. The substrate 212 has an upper surface 212A and a lower surface 212B. The substrate 212 can be selected from a printed circuit board, a ceramic substrate, or a pre-mode lead frame, and can have two sides electrically conductive. (Figure not shown). The image sensing chip 211 and the lens module 213 are disposed on the upper surface 212 of the substrate 212. The image sensing wafer 211 can be a CMOS (Complementary Metal-Oxide Semiconductor) image sense. Test the wafer. The image sensing wafer 2 j j is adhered to the substrate 2 12 ′ with its sensing surface facing up, and the image sensing wafer 2 11 is electrically connected to the substrate 212 by using a plurality of bonding wires 216 . The lens module 213 has a filter 21 7 and the lens module 213 can be combined with a lens barrel 218. The lens module 213 is coupled to the substrate 212 and covers the image sensing wafer 2A. The first connector 2丨4 is disposed on the lower surface 212B of the substrate 212 and may be a plug connector or a socket connector. The embedded passive component 215 is die-tightly sealed in the first connector 214 and electrically connected to the image sensing die 2 11 by the substrate 212; or the first connector 2 14 may have A pocket (not shown in Figure 1257699) is used to embed the embedded passive component 2 i 5 . The printed circuit board 220 can be a circuit board within various electrical products, such as a digital camera, a PDA, a wireless handset, and the like. The printed circuit board 22 is provided with a second connector 221. In this embodiment, the printed circuit board 220 further includes at least one embedded passive component 222 embedded in the second connector 221. Further, an integrated circuit wafer 223 can be disposed on the printed circuit board 220. In the present embodiment, the integrated circuit wafer 223 is bonded to the printed circuit board 22 (). The second connector 221 is a socket connector or a plug connector corresponding to the first connector 214, so that the second connector 221 and the first connector 214 are pluggable and detachable. In this embodiment, the micro-camera module 21 and the printed circuit board 220 are connected to the second connector by the first connector 214, so that the image sensing chip 211 can be electrically connected. To the printed circuit board 220. In addition, the pass-in passive component 215 in the first connector 2 i 4 can also be electrically connected to the printed circuit board 220 by the plug-in terminal of the first connector 214; or, in the The embedded passive component 222 in the second connector 221 can be electrically connected to the image sensing chip 211 of the micro camera module 21 by the plugging end of the second connector 221. An additional buckle (not shown) is additionally disposed between the first connector 214 or the second connector 221 for tightly engaging the two connectors 'without external force shocks. The embedded passive component 222 can be embedded in the second connector 22r by means of a built-in mold or a cavity. Since the miniature camera module 210 and the printed circuit board 220 respectively have 1257699 3, the first connector 214 and the second connector 221 can be mutually plugged, and at least one embedded passive component 215, 214 is embedded in the The first connector 214 or/and the second connector 221 are inside. Therefore, after the focus and test, the defective micro photography module 2 or the printed circuit board 22 can be replaced to achieve the effect of modularization, thereby facilitating workability, improving process yield and reducing surface adhesion ( The cost of SMT). In addition, since the embedded passive components 215 and 214 are embedded in the first connector 214 and the second solder connector 221, the combined configuration 200 of the miniature camera module can be miniaturized and the substrate manufacturing can be reduced. The cost of the effect. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. . [Simplified description of the drawings] Fig. 1 shows a schematic cross-sectional view of the combined structure of the miniature photography module. _帛2Fig. A combined front cross-sectional view of a combined construction of a miniature photographic module in accordance with the present invention. Figure 3 is a schematic cross-sectional view showing the combined construction of the miniature photographic module in accordance with an embodiment of the present invention. [Main component symbol description] 1 〇〇Miniature camera module combination structure 110 Mini camera module 113 Lens module 116 Bond wire 111 shirt image sensing chip 112 Flexible circuit board 114 connection finger 1丨5 Passive component 9 Filter 118 Lens barrel printed circuit board 121 Connection pad integrated circuit chip Micro photography module combination structure Micro photography module 2 11 Image sensing wafer lower surface bonding wire
基板 212A上表面 212B 鏡片模組 214 第一連接器 嵌入式被動元件 216 濾光片 218 透鏡鏡筒 印刷電路板 221 第二連接器 嵌入式被動元件 積體電路晶片 10Substrate 212A Upper Surface 212B Lens Module 214 First Connector Embedded Passive Element 216 Filter 218 Lens Tube Printed Circuit Board 221 Second Connector Embedded Passive Element Integrated Circuit Wafer 10