TWI251459B - Thermal pad - Google Patents

Abstract

A thermal pad, which is suitable for pasting between an electric product and a heat sink. This thermal pad characterized by a plurality of hole in it. Therefore, when pasting the thermal pad to the electric product, air could be released through the hole that distributes over the thermal pad. Accordingly, there are no air between electric product and thermal pad and no air gap will exist to decrease the efficiency of the heat sink. Especially, using this thermal pad in the back light module of liquid crystal display and the plasma display panel that have larger size, the efficiency of heat sink could improved more outstanding.

Description

1251459 V. INSTRUCTIONS (1) 别 9 关于 There is a heat-conducting patch (t h e r m a 1 p a d), and the special product; the weight can avoid the air gap (ai...) from the electronic heat-generating patch. In order to effectively exert the heat dissipation effect of the heat sink, the various electronic components and their products are in the absence of =11 in people's lives. One of the characteristics of these electronic components is that they use electricity for ^wt Ϊ, so it is inevitable that when the operation is accompanied by a large number of heat pipes, the 0 ^ e # effect will delay the dissipation of heat energy, which will eventually lead to the failure of electronic products. 'Even even permanent damage. The 13th drawing is not a schematic diagram of a conventional heat dissipation system. Please refer to the map, the eye arrow ugly sink 50) in the hair source, this method is configured with a heat sink (heat hot Korean film (1) η);;: into "5 ° system by the heat sink and many scattered The surface of the surface. The heat sink fins protrude from the door of the heat sink 80, to: 贴:, the patch 1〇0 is disposed in the heat sink 50 and the electronic product: 4ΓίΓ device 50 and electronic product 8 ° Get a better fit. Surface mount 1〇0 contacts the surface of the heat sink 50 of the electronic component 80 (including the dispersion: the wide heat can be transmitted to the thermal substrate through the heat sink, And these heat sink fins are outside:), the receiver is then passed through the heat sink 5. The attached heat energy is transferred to the outer jft仃 hot father, and the electronic component 80 is generated. The transfer piece is set to 5° with respect to the electronic production heat. The heat dissipation port is provided with a larger heat dissipation area, so it can be utilized.

11118twf.ptd * Page 5 1251459 V. Invention Description (2) The heat transfer 'and the hot parent's side', effectively reduce the electronic component itself, the Leizi ΓΛΓΛ is shown as a well-known heat dissipation system, which is in the thermal patch There is no intention between the mouth of the scorpion and the mouth of the scorpion. Please refer to Fig. 2, ΑΓΛΛ:0 is attached to the electronic product 80, there is often an air gap between the sheet 100 and the electronic product 8 ,, this air gap 11 0 0 ΐ is difficult to eliminate by subsequent processing. Electronic products 8 due to air gaps. The attached area of the produced film product 80 becomes smaller, and the conductive area conducts heat energy to conduct Li; the second day can only transmit a non-thermal good conductor through less effective heat. Because of the pressure, 'and the air gap 110 itself is also at the threshold _ 4 ¥ between the hot patch and the electronic product is easy to produce between the work space =, 2 to greatly reduce the efficiency of heat dissipation. The second production of the product I ^ : 1 疋 'Because only a small volume of air, it will create a large area of air gap between the electric 习 ^ ^ μ 片, so in the ^ method, to avoid this problem It is very difficult. In particular, in the heat dissipation system of the electronic product W, it is necessary to attach a heat-conductive patch to a large-area heat-dissipating area, and Jiang Zheng & and the vertical frame reduces heat dissipation efficiency. It is easy to generate a large area of air gap, and the main purpose of the present invention is to provide a heat-conducting patch, which is suitable for generating an air gap when the heat-conductive patch is attached to an electronic product, so as to improve the heat dissipation of the political heat system. effectiveness. ^ The above object, the present invention provides a thermally conductive patch suitable for attaching between "production σ" and a heat sink. The guide according to the present invention

1251459

The hot patch is characterized by having a plurality of through holes, so that when the heat conductive patch is attached to the electric product, the air can escape through the through holes of the thermal conductive patch without staying in the electronic product and the thermal conductive patch. Between the air gaps and the heat dissipation efficiency of the heat dissipation system. Wherein, the through holes are, for example, circular through holes [^ circular through holes, polygonal through holes or irregular through holes. And the through holes are arranged on the heat conducting patch, such as a random array or array. The above thermal conductive patch according to the present invention can achieve a greater improvement in heat dissipation efficiency in a plasma display panel of a liquid crystal display having a larger size and a plasma display panel of a plasma display.

The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims. #评图3 is a schematic illustration of a thermally conductive patch in accordance with a preferred embodiment of the present invention. Referring to Figure 3, the feature of the thermally conductive patch 2 〇 $ has a plurality of through holes 210. Among them, the shape of the through holes 21 is a member shape, an ellipse, a polygon or an irregular shape. And these through holes 2 are, for example, randomly arranged or arrayed on the heat-conductive patch 2 〇 。.

Figure 4 is a schematic view showing the application of the thermally conductive patch of the present invention to an electronic product. Referring to FIG. 4, a heat conductive patch 200 of the preferred embodiment is provided according to the present invention, and has a circular through hole 2 1 〇. These circular = hole 2 1 〇 in the diameter of the design is based on the thickness of the thermal patch 2 〇 、, the components matched or other factors, the design is based on the principle of not affecting the overall heat dissipation efficiency. Before the heat sink 24〇 is attached to the electronic product 23〇,

Illl8twf.ptd. Page 7 1251459 V. INSTRUCTIONS (4) When the thermal conductive patch is first calibrated, the air can be easily; the surface of the electronic product 230. In this hole 210, the hole 210 escapes, and does not stay in the gap between the two::|: film, avoiding the generation of air gap/contact with the hot patch 20 0 ^ It is worth noting that Phase broadcast ^ such as the heat dissipation efficiency of the hotline. A large area of thermal paste posted ‘Japanese,? Ming: The proposed thermal patch is quite helpful. In other words, some of the through holes are attached to the hole having a larger size for the convenience of attachment, and the hot patch can be easily attached to the display of the display. #=Daylight module Or, the guide of the invention of the invention' = 2 will be combined with the 1 2 3 4 5 diagram and the 6th diagram. ~SMD is applied to the actual display in the plasma display and backlight module=图参:第!:;thermal conduction 1 ^ ΐ ^ ^ ^ .,ν ,Λ', ^ ; 1 2 八复固贝孔2 1 〇. By attaching the thermal conductive patch 200 to the plasma, the page is not between the panel 31G and the backing plate 32G, and due to the action of the through-hole, the electro-convex display panel 310 can generate the generated thermal energy. The maximum effective conduction of 4 areas of heat is transferred to the plate 320, so that the plasma display panel 31 〇 obtains the best heat dissipation efficiency, and the performance is stable and the quality is good. 5 Figure 6 is a schematic view showing the application of the thermally conductive patch of the present invention to a backlight module. Referring to FIG. 6 , the backlight module 35 includes an outer frame 352 and a plurality of cold cathode lamps disposed in the outer frame 352 354 1251459. 5. Description of the invention (5) at least one of the outer frames The optical film 356 in the body 352, a heat sink 36 0 and a heat conductive patch 200. The material of the outer frame 352 is, for example, a reflective material, or the inner surface of the outer frame 35 is attached with a reflection sheet 358 to reinforce the overall brightness of the backlight module 3^50. Thermally conductive patch 2 导热 导热 is a thermally conductive patch according to a preferred embodiment of the present invention having a plurality of through holes 21 〇. By attaching the heat-conductive patch 20 to the outer frame 352 and the heat sink 36〇, and due to the action of the through-hole 21〇, the backlight module 35 can generate the maximum energy, f is most effective. The conduction area is thermally conducted to the heat sink 3 60, so that the backlight is stable and the quality is good, and the effect is "represented in the liquid crystal display to limit the present:: Month has been disclosed as a preferred embodiment." It is not intended to be used by those skilled in the art, and may be modified and modified without departing from the spirit of the invention. The invention is not limited by the scope of the patent application.

1251459 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional heat dissipation system; FIG. 2 is a schematic diagram of a conventional heat dissipation system having an air gap between a heat conductive patch and an electronic product; The figure shows the heat conduction patch according to the preferred embodiment of the present invention. FIG. 4 is a schematic view showing the application of the heat conductive patch of the present invention to an electronic product; It is shown that the heat conductive patch of the present invention is not intended to be applied to a plasma, and FIG. 6 is a schematic view showing the application of the heat conductive patch of the present invention to a backlight module. [Illustration description] 5 0 : Heat sink 8 0 : Electronic product 1 0 0 : Thermal patch 1 1 0 : Air gap 2 0 0 : Thermal patch 2 1 0 : Through hole 2 3 0 : Electronic product 4 240 360: heat sink 3 0 0 : plasma display 3 1 0 plasma display panel 3 2 0 : back plate 3 5 0 : light module

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Claims (1)

1251459 VI. Scope of Application for Patention 1 · Between one kind of guide, the heat-conductive patch is attached to 2. If the application is made of a round hole, it is circular. 3 · If you want to use the hole system to randomly row 4 · If you apply for hot patch, the hot patch of the electronic product patent range through hole, ellipses 2 attached to an electronic product and - heat sink mouth = for a plurality of through holes In order to facilitate the conduction between the guide and the heat sink. The heat-conductive patch of the first aspect, wherein the circular through-hole, the polygonal through-hole or the irregular-shaped patent are listed in the scope of the patent, and the outer cover is A plurality of lamps, a heat dissipating device, and a heat-dissipating patch are disposed on the heat-dissipating heat patch of the first embodiment of the plurality of through-hole arrays. The thermal conductive patch described in item 1 is on the thermal patch. The method includes: wherein the heat conductive patch 6 of the plurality of materials is 7. The material of the application frame is 7. If the application lamp tube comprises cold cathode 8 · If applying for a reflective sheet, 9 · if applying for an optical film, The outer frame body; on one outer surface of the outer frame; and between the outer frame body and the heat dissipating device, the through hole. The backlight module of claim 5, wherein the outer reflective material. The backlight module of claim 5, wherein the pole lamps are. The backlight module of claim 5, further comprising a reflective sheet disposed on an inner surface of the outer frame. The backlight module of claim 5, further comprising: wherein the optical die is disposed above the lamps. 11118 twf.ptd 12th tribute 1251459 VIII. Patent application scope. The backlight module of claim 5, wherein the through holes are circular through holes, elliptical through holes, polygonal through holes or Irregularly shaped through holes. 1. The backlight module of claim 5, wherein the plurality of through holes are randomly arranged on the heat conductive patch. The backlight module of claim 5, wherein the array of holes is arranged on the heat conductive patch. 13. A plasma display comprising: a plasma display panel; a backing plate disposed on a back side of the plasma display panel; and a thermal conductive patch disposed on the plasma display panel and the backing plate The thermal conductive patch has a plurality of through holes. The plasma display of claim 13, wherein the through holes are circular through holes, elliptical through holes, polygonal through holes or irregular shaped holes. The plasma display of claim 13, wherein the through holes are randomly arranged on the heat conductive patch. The plasma display of claim 13, wherein the array of through holes is arranged on the thermally conductive patch. 11118twf.ptd - Page 13