TWI246394B - Thermal conduction substrate device - Google Patents

Abstract

The present invention relates to a thermal conduction substrate device that is composed of a circuit layer, an insulation layer and a metal plate. A surface of the metal plate has notches with parallel arrangement that reduces the thermal resistance and increases the heat dissipation area. An insulation layer is disposed onto the bottom of the circuit layer. The heat generated from electronic components can be transmitted to the bottom of the metal layer to speedily conduct the heat. When the thermal conduction substrate is applied in cooperation with the conventional heat dissipation parts to increase the whole heat dissipation capability, the deformations caused by the assembly stresses can be efficiently decreased via notches of the metal plate, thereby reducing the whole thermal resistance and non-uniformity of the thermal contact resistance. The thermal conduction substrate device has advantages of various shapes, better heat dissipation capability and fast forming.

Description

1246394 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a "thermal conductive substrate device", especially a heat-dissipating effect applied to a power module. A heat-dispersing metal plate with grooves, and an insulating layer with thermal conductivity is provided to match the metal plate group to the bottom layer of the circuit layer. Through the groove design, the thermal resistance can be reduced, and the heat dissipation efficiency can be improved accordingly. In order to provide a multi-style shape and excellent heat dissipation substrate device, which has practical industrial practicality and creative set of effects. [Previous technology] According to the press, the application of modern technology products is very common, especially in computers, information and communication. Specialized industries are more widely used. Because technology products have many precision electronic components, when they are powered on, each component has thermal resistance. South temperature will be generated at the beginning of operation, and South temperature is likely to cause damage to the components, and even affect the overall structure in severe cases. Therefore, its operational stability is very important, especially the heat dissipation effect.

For example, as shown in Figure 8A, the heat dissipation device that can be installed on various power supply modules is commonly used. It is a partial cross-sectional view of the first conventional power supply module. It is a power supply module with a heat dissipation device 70, which is composed of a circuit layer. 71, insulation layer 7 2 and metal plate 7 3, the circuit layer 7 is provided with a number of electronic components 7 1 1 above, in order to achieve the effect of various electrical operation control, the circuit layer 7 1 at the bottom is provided with a An insulating layer 7 2 with a heat transfer effect, so that the insulating layer 7 2 can protect the circuit layer 71 from being disturbed by the current conduction, and then at the bottom of the tie edge layer 7 2.卩 ,, and ° has a metal plate 7 3 with 咼 thermal conductivity, because

1246394 Five 'invention description (2) After the electronic component 7 1 1 is operated by current conduction, the heat generated by it is conducted to the metal plate 7 3 through the insulating layer 7 2 to transfer the heat and achieve the effect of dissipating heat. As shown in FIG. 8B, it is a diagram of an application example of conventional one. In order to increase the heat dissipation effect, a conventional power module can be added with a heat sink 7 5, which is connected to the power module and heat dissipation. Pieces 7 and 5 are covered with a thermally conductive filler 74, which is generally made of silicone. By virtue of its softness and elasticity, it can fill the uneven surface between the power module and the radiator 7 and can reach the buffer. For the effector, the power module is fixed on the heat sink 7 5 by bolt locking or inlaying, and the lower thermal resistance of the heat sink 7 5 is used to transfer the heat of the power module. , Can increase heat dissipation. In addition, as shown in Figure 9A, it is a second conventional power module, which is a multilayer circuit layer 80 with copper conductors, and an insulating layer 8 is covered between the multilayer circuit layers 80. 1, which is attached to both sides of the circuit layer 80. Electronic components 8 2 can be assembled respectively, so that heat can be convected by air through its surface to achieve the effect of heat dissipation. It can also borrow a thermally conductive filler 8 3 at the bottom of the power module for overlapping with a metal plate 8 4. As shown in Figure 9B, through the high thermal conductivity of the metal plate 8 4, The heat generated by the electronic component 8 2 is transmitted to the bottom end of the metal plate 8 4 through the insulating layer 8 1 to achieve the effect of heat dissipation. [Content] (Technical problem to be solved) However, the inventor has found that in addition to the above-mentioned power module to dissipate heat through the underlying metal plate, or to increase its heat dissipation effect, an additional heat sink is provided for the gold.

1246394 V. Description of the invention (3) The metal plate is in the shape of a flat plate, so that the heat flow generated by the power module can only be led out by the four sides of the metal plate; The screws or inlays are used to assemble and fix. Among them, since the bottom metal plate of the power module is a flat plate, when the assembly and fixing is applied on both sides, the silicone layer is a soft material, which makes the power module in the assembly connection. The silicon rubber is strongly squeezed near the point, so that the silicon rubber is compressed and deformed, and the deformation amount of the silicone rubber at one end will move to the remaining space on both sides to form a deformed protruding end, which will generate an upward pushing force and support the power supply. The bottom layer of the module causes deformation, forming a squeeze lock on both sides of the bottom of the power module, and a gap is formed in the center, which causes poor thermal contact and reduces heat dissipation performance. As shown in Figure 8C, it is || The schematic diagram of the thermal group at each position of the device can be clearly shown in the figure. When the power module is powered on, the thermal resistance at the gap is higher than the two sides, so it will generate high temperature, and it will cause damage to electronic components. Even it can cause damage to the power supply module of serious, affecting the operation of the overall structure. ~ As in the second conventional heat sink, the circuit layer with electronic components on both sides can be convected by air on its surface to achieve cooling effect. However, when the power loss of the power module goes south, The temperature convection of warm light can not achieve the cooling effect; and the second practice uses another method of setting a metal plate at the bottom, which can improve the heat dissipation effect. Please refer to the ninth figure B for cooperation. Second, the schematic diagram of the thermal resistance of each position during the operation of the circuit layer. It can be seen from the figure that although the difference in thermal resistance between the bottom layer of the circuit layer does not change much, the higher the upper layer, the higher the thermal resistance, and the ungrouped The other end of the metal plate is provided, which has the highest thermal resistance. If an external heat sink is assembled at the bottom of the circuit layer to improve the heat dissipation efficiency, it will still be caused by assembly stress.

Page 7 1246394 V. Description of the invention (4) The circuit layer is deformed, and the disadvantage of increasing the thermal resistance makes the overall efficiency limited. (Technical means to solve the problem) For the shape of the thermally conductive substrate device and the purpose of transferring the gold to the metal plate, it is non-aligned because it is uniformly arranged on the bottom. It is uniform and can be researched. It is mainly arranged uniformly. The metal plate is good, and then passed to the layer of the present invention can be effectively lowered to improve the provision of a multi-pattern shape metal plate structure. 'This is indeed consistent with the present invention. The invention is based on the concept of long-term and thorough understanding. A guide system is used to make the metal plate at the bottom of the circuit layer into a preset geometric groove shape, which can reduce the thermal resistance to the air, and its thermal conductivity characteristics can quickly transfer heat from the heat source to the surrounding air, which can improve the cooling performance. The metal plate itself has a good heat dissipation function, and it can be added with a heat sink. By using the bottom grooves of the metal plate, the stress generated by the assembly is low, so that the thermal contact has better heat dissipation performance. With such a mechanism combination, it can be extremely effective. The best heat dissipation effect, and at the same time made the rapid usability and innovative effect. (Comparison with the effect of the prior art) It is known from the above description that the present invention can achieve the following effects compared with the prior art: 1. Improve heat dissipation performance: Because of the novel structure design of the metal plate with geometric grooves in the present invention, It can increase the air contact area and reduce the thermal resistance, which can quickly transfer heat from the heat source end to the other end and be radiated from the metal plate, thereby improving the overall heat dissipation efficiency.

Page 8 1246394 V. Description of the invention (5) 2. It can be equipped with a heat sink to set the heat sink together to reduce the heat dissipation. 3. The heat sink can have a variety of gaps and more heat dissipation. 4. Production of metal processing machines with grooves can quickly add heat sinks: the shape of the metal plate is more diverse. If the fan or radiator or heat pipe of the present invention is added to the bottom of the metal plate, it can borrow the shape of the carbon groove at the bottom of the metal plate. The design is uniform, which can effectively reduce the assembly stress and increase the thermal resistance with the heat sink, thereby improving the heat dissipation efficiency. Increased area: Due to the geometrical design of the trough-shaped metal plate of the present invention, its shape can also have a small arrangement of hot metal plates at the same time, which expands the heat dissipation area, which can be improved easily and quickly. The invented geometric shape and sheet design are extremely easy to implement because they can be formed from metal aluminum or copper using the existing integrated processing. [Embodiment] Please refer to the first component 1 and a gold circuit layer 1 of the main package 3 0. 1 High-conductance circuit layer 1 of the transport device 1 and the board 3 1 0 will avoid the thermal radiation effect of the board. An A diagram includes a circuit layer power core group A on the circuit layer 10, and heat is generated through the current-free conduction. The heat dissipation of the metal plate 3 0 is shown in the first B diagram, which is a guide of the present invention. Insulating layer, the bottom of the circuit layer 100 is respectively set with the absolute interference condition with heat transfer effect, which causes it to penetrate the insulating layer 2 to transfer heat to B, and its main indication is the heating substrate device B, 2 0 and a metal plate are assembled with several electrons and an insulating layer 2 0 to protect the amount of electronic components transmitted to the edge layer 2. Since 0 will heat out, the improvement is provided in a bright metal; plate 3 0

1246394 V. Description of the invention (6) < Pf picture, the bottom of the metal plate 3 0 ## can be reduced, the number of grooves can be reduced, C into a number of troughs 3 1 parallel arrangement 1 the heat generated by the heat source through the surrounding appropriate There are sleeve holes 3 2, which can pass through to the metal plate 30 by itself and air products, and the edge layer 20, to achieve the effect of rapid cooling, and to quickly transfer heat to the outside, so that sexual performance; To mention, the power module A as a whole has a 50% electrical heat sink. At the beginning, the power supply group A is connected to a tube and other devices, which can: gas pair! Generally, it can be a radiator, a cabinet or a heat: plus 50 heat-conducting fillers Γ and using 2 heat irregularities to cushion the effect, plus 2 screw locks or inlays The circuit layer 3 is fixedly connected to the external layer 5 through the sleeve hole 32, and the arrangement is such that the gold soft f2 0 arranged with several grooves 3 丄 is formed on the silicon rubber 4 0. Since the silicon rubber 4 0 is a shaped shell material, which is pressed by the metal plate 3 0 to make the silicon rubber 4 0 change and be accommodated in the groove 3 1 to evenly disperse the stress generated by its assembly and fixation, such as As shown in Figure 1D, it is a schematic diagram of the distribution of thermal resistance at various positions of the heat sink b of the creative device. Since the grooves 3 i at the bottom of the metal sheet 30 are set to make it equidistant from the silicone rubber 40, it is effective. And the stress generated by the assembly is evenly distributed, so that the thermal resistance can be evenly distributed. The bottom surface of the metal plate 30 and the silicone rubber 40 and the groove 31 and the silicon rubber 40 are equal to each other. The difference in thermal resistance is minimized. , It can effectively improve its heat dissipation efficiency, and avoid the deformation of the metal plate due to assembly stress in the driving structure. 10 pages 1246394

V. Description of the invention (7) The disadvantages of the gap that causes great thermal resistance. As shown in the second A to II C diagrams, this is the first to third embodiment of this creation, which can be set so that the bottom of the metal plate 30 of this creation can form a number of grooves 3 1 vertical and horizontal intersection arrangement, or It can form a number of grooves 3 1 obliquely intersect in a cross arrangement, or it can form a number of cylinders 3 3 arrays, formed by the above geometrical arrangement, so that the metal plate 30 and the silicon rubber 40 form a carbon with a geometric shape. Groove 3 1, so that the assembly stress can be evenly dispersed by the combination of the metal plate 崁 groove 3 1 and the silicon rubber 40, so as to reduce the thermal stress between the metal plate 30 and the silicon rubber 40, due to the geometric shape 崁The groove 31 can allow the heat flow to flow out in multiple directions, which can increase the air convection space to minimize the turbulence and effectively improve the heat dissipation effect. Furthermore, the thickness of the seventh embodiment is increased to form the cylindrical array. However, because of this, there is a slightly higher heat space for air to produce a larger; and because the rubber glue 40 is connected, the module B between the lock or the stone glue rubber 40 is reduced, and the third is added as the third A ~, which is designed to be implemented with a deeper column forming plug, so that the resistance However, gas convection, or the depth of the space convection groove 31, can be used to accommodate the reduction of the amount of variation caused by carbon. The heat sink 50 is shown in the 3D diagram, which is the groove 31 of the geometrical metal plate of the previous invention. For example, the third D-shaped 3 4 array-shaped metal plate has deep grooves rather than shallow grooves. Because the deep grooves 31 are formed to provide the effect of adding heat sinks 50, they can be effectively increased significantly and can be increased. Metal plate silicone 40 has a larger deformation assembly stress, and because the depth of the metal and the groove 31 is increased, the torque of the assembly is reduced, so that 30, and the metal plate 3 has more space to reduce the thermal resistance 3 〇 and Shi Xi, and according to the board 3 〇 and can be connected to the power supply with

1246394 $, description of the invention (8) The contact between the heat sinks 50 can be changed again _ its 枉 3 5 figure, this state '' its excellent existence, its system, its material and heat dissipation, such as through sheet 3, Or it is stamped, and the metal pillar is cheap. If the original circuit layer is used, gold can be used; or the original gold has different effects, which can be sheet-formed, and the effector can be stamped into a 7th shape. For example, if the fifth component is made into a shape, the sixth component is made to have a profit of 10%, such as the third metal plate, and the third metal plate is the hottest. As the fourth creative fund has the shape shown in Figure 0, the shape of all the grooves in Figure B can be increased according to the shape. The geometry shown in this figure can be fastened with E, 0, and F. The board can be set for convection. The number wear rigidity is shown by the system, and the heat dissipation with the horizontal. It is the stickiness of the shape to achieve consistency, so as to increase the heat dissipation effect. F No: This is the eighth embodiment of this creation. It is set as a tower with a number of ring protrusions 3 5 i. It is the ninth embodiment of this creation. The surface of the column with a number of fins 3 6 and the maximum thermal contact conduction area are shown in FIG. 10 of the tenth embodiment of this creation. Figure 3 0 is a copper plate or aluminum plate with a heat conducting plate 60 slot 61 The high thermal conductivity and heat transfer area of the sheet can be used to increase the thermal conductivity of the eleventh embodiment of this creation. It is a cost creation of a metal with a trough-like arrangement and is fixed at the bottom of the metal plate 30 as a whole. The twelfth embodiment is a diagram of a cross-section groove-shaped metal sheet 38, which can be shaped externally and can have the effect of multi-directional hollowing. 'It is not only easy to form, but also the price of the thirteenth embodiment. The slotted metal plate 30 and the insulation layer 20 are integrated into a single structure;

1246394 V. Description of the invention (9) As shown in Figure 6B, the 1 2 enables the ceramic ceramic substrate 12 to have several layers of geometry with this creation to achieve heat dissipation effects such as the seventh A and board applications. It is implemented in multiple layers as shown in Figure 7A. A metal layer is set below the layer 1 with a plate 3 0 its groove 3 plus an atmospheric heat sink to make a lower plate 3 0 solder joints 4 without a base material to form an insulating layer 4 0 0 Adhesive fixing. With the above structure, not only the formation of the gap is faster, the heat sink can be lowered, and the device can be effectively lifted. In summary, the preset geometrical thermal resistance makes the thermal circuit layer 1 0 at the bottom of the group. Pottery substrate 1 2-There are several electrons on the side, the earth material has the function of insulation and heat conduction, and the other side is fixed by the shape of the solder metal plate 3 〇 埤 junction, with the shape of ^ groove 31 metal plate 3 〇 The thermal conductivity effect is the fifteenth and sixteenth implementations of this creation with geometric shape 14 ^ The bottom circuit layer 14 can be used after this ^ 0 and the solder 14 and the creation are as shown in Figure 7B As shown, the multi-layer can be adhered with 41 under the multilayer circuit layer 14, and under the medium 41 The medium of Fu Yizhong 1 is the same as the metal created by this invention. Due to the geometric shape of the metal plate 3 of the present invention, the heat dissipation is increased, and there are more arrangements. The heat dissipation is increased, and it has multiple heat dissipation directions. The energy delivered to the environment makes it possible to provide a highly efficient and cost-effective heat sink. "Thermal conductive substrate device" is to provide a thermally conductive metal plate with a groove, which can be quickly and efficiently transferred to the metal plate, and it can be fixed by the insulating layer 4 with the circuit layer shown in Figure 7B; or layer, then After one of the mediums is borrowed and formed, the heat dissipation area of the speed and style has low thermal resistance, and the heat dissipation industry uses the shape of the present invention, and the formation amount is determined by the heat source.

1246394 V. Description of the Invention (ίο) An external heat sink is used to reduce the thermal resistance and achieve the heat dissipation effect, so as to provide a heat-conducting device that can be formed quickly and can be formed in multiple styles, so that the overall industry is practical and cost-effective. Its structure has never been seen in books or public use, and it is in line with the requirements for new patent applications. Those who need to be aware of the above are the technical principles applied immediately by the specific implementation of the present invention. If changes are made according to the concept of the present invention, the functional effects still do not exceed the spirit covered by the description and illustrations. , Should be within the scope of the present invention, Chen Ming.

Page 14 1246394 Brief Description of the Drawings Figure A: This is a side view of the combination of the present invention. FIG. 1B is a bottom view of the metal plate of the present invention. The first figure C is a side view of a combination of the present invention and an external heat sink. Figure D: It is a schematic diagram of the thermal resistance distribution of the present invention. FIG. 2A is a diagram of a first application embodiment of the present invention. FIG. 2B is a diagram of a second application embodiment of the present invention. FIG. 2C is a diagram of a third application embodiment of the present invention. The third diagram A is a diagram of a fourth application embodiment of the present invention. FIG. 3B is a diagram of a fifth application embodiment of the present invention. The third diagram C is a diagram of a sixth application embodiment of the present invention. The third D diagram is a diagram of a seventh application embodiment of the present invention. FIG. 3E is a diagram of an eighth application embodiment of the present invention. The third F diagram is a diagram of a ninth application embodiment of the present invention. The fourth diagram is a diagram of a tenth application embodiment of the present invention. FIG. 5A is a diagram of the eleventh application embodiment of the present invention. FIG. 5B is a diagram of a twelfth application embodiment of the present invention. FIG. 6A is a diagram of a thirteenth application embodiment of the present invention. FIG. 6B is a diagram of a fourteenth application embodiment of the present invention. FIG. 7A is a diagram of a fifteenth application embodiment of the present invention. The seventh diagram A is a diagram of a sixteenth application embodiment of the present invention. The eighth figure A is a side view of a combination of the conventional one. The eighth figure B is a side view of a combination of a conventional one and an external heat sink. Figure 8C: It is a schematic diagram of the thermal resistance distribution of the conventional one. The ninth figure A is a side view of the combination of the conventional two.

1246394 on page 15 Brief description of the diagram Ninth diagram B: It is a schematic diagram of the thermal resistance distribution of the conventional 2 2 4 7 7 7 7 8 8 8 Figure number description) A 0 2 4 0 0 2 4 5 7 0 0 0 0 0 0 2 4 Power phase: Group circuit layer, ceramic substrate, multilayer circuit layer, insulation layer, metal plate, sleeve pin, ring round metal foil, silicon heat sink, heat sink, heat sink, electronic component metal layer, heat sink, multilayer circuit layer, electronic component metal layer

B 3 Solder for heat-conducting electronic components 3 1 • • • ^ Slot 3 3 • • • • Column 3 5 • • • • 4 Column 3 6 • • •, Reading Tower Column 3 8 • • • # Shape Metal foil 4 1 · · · · t medium 6 1 · · · · · f groove 7 1 · · · · t circuit layer 7 2 · · · ·, insulation layer 7 4 · ·… heat conductive filler 8 1 · · · · · i 邑 缘 层 8 3 · •… Conductive filler

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Claims (1)

1246394 VI. Application scope " '~~'-12: A type of thermally conductive substrate device, which is mainly composed of a circuit layer, an insulation layer and a metal plate, and a plurality of electronic components are arranged on the circuit layer, so that The electronic circuit can control the operation effect. An insulation layer with electrical insulation effect and a metal plate with high thermal conductivity are set under the circuit layer, so that the heat generated by the operation of electronic components can pass through the insulation layer and be transferred to the metal plate. Those who achieve thermal dispersion effect are mainly characterized by: making the bottom of the above metal plate into a preset geometry and having a trough, so that through the carbon trough to increase air convection, the surface area can be increased to reduce thermal resistance. Heat is transferred to the end of the metal plate; this can improve the heat dissipation performance, and the overall structure can be quickly formed and the heat dissipation area is large, making the overall structure extremely innovative. _ 2. According to the thermally conductive substrate device described in item 1 of the scope of patent application, wherein the metal plate can be formed of aluminum or copper or other materials with high thermal conductivity. 3. According to the thermal conductive substrate device described in item 1 of the scope of the patent application, wherein 'the substrate can be additionally connected to a heat sink, which is provided with a thermal conductive filler between the metal plate and the heat sink' and borrowed The metal plate with a plurality of carbon grooves arranged on the bottom layer can be evenly overlapped on the heat sink to achieve the effect of uniformly dispersing assembly stress and reducing thermal resistance. 4. According to the thermally conductive substrate device described in item 3 of the scope of the patent application, + The thermally conductive filler is made of silicone or other soft plastic materials. 5. According to the thermally conductive substrate device described in item 1 of the scope of the patent application, wherein the bottom layer of the metal plate can be arranged in a vertical and horizontal or vertical intersection or diagonally intersecting number slot arrangement, and the number of intersecting arrangement Slots can be inside Page 17 12463947 ~-VI. Patent application scope $ 成 有多 向 之 Circulation paths,,, V reduction, turbulence, and improve heat dissipation efficiency 6 Among them, can be placed in the internal efficiency 7 'its or circulation 8 where, the column, and the path, 9 where' is effective, & 1, where There are two more easy arrangements and 1, among which, according to the formation of the metal, 0, the path can be set, the array can be set to reduce, the maximum heat dissipation of the metal can be 0, and the metal hollow is The price is lower. 1. The bottom layer is for patent application. The bottom layer can be circulated for multiple applications. The thickness of the metal plate can increase the air. The bottom layer of the patent application can be 1J 4 non-lined, with less turbulence and application. The patent model can be set as a convective surface area. According to the patent application, the shape of the metal pillars can be reduced by stamping the sheet shape to achieve the heat conductive substrate device described in the geometric item according to the patent application, and the number of cylindrical arrays is arranged, and the system is routed to reduce interference. And increase the 5th degree of the cooling perimeter and increase the number of convective air perimeters. The first ridge of the rising radiating perimeter has the largest or 6 positions to form a space. The ring flange stack described in the item can be used at Shaper. The number of fin rows described in the above item is a thermally conductive substrate package with thermal contact, which has a deeper groove to improve heat dissipation. The thermal conductive substrate device is formed by stacking and forming the tower into a multi-directional thermal conductive substrate device. The columns are column-shaped and the conductive areas coexist. The grooves can be used to form a variety of shapes and shapes; it can increase the effect of heat dissipation, and its cost benefits. Metal plate, insulating layer, and circuit of the thermally conductive substrate device described in the first item of the scope Page 18 1246394 VI. The scope of patent application layer uses the heat conduction of the fastened sticky metal plate 1 2. Yi, where the heat conduction effect of the welding edge on the side of the electric ceramic substrate is fixed in the shape 1 3, Yi, where the electric The bottom layer is grouped to form a 1-4. Yi, wherein the electricity can be borrowed in the multilayer and then a medium to set up an effect to achieve the number of electrons connected to the circuit layer according to the patent application. The circuit layer is provided with heat dissipation. The circuit of the circuit layer is used to communicate with the other side and heat conduction. Please apply for an insulation device. If the patent is for a metal plate below the layer, the bottom layer has a groove to dissipate heat. Efficacy. The thermal conductive substrate device described in the first item of the scope is provided with a ceramic base material at the bottom group, so that the ceramic element can reach the metal plate welding plate device having a geometric shape through the ceramic base material. The thermally conductive substrate device described in the first item of the scope has a circuit layer and has a bottom layer, which can be fixed by using a solder and a metal plate after the layer. The thermally conductive substrate device described in the first item of the scope is a multilayer circuit layer and does not have The bottom layer is adhered with a medium and an insulating material, and then fixed to form a heat sink. Page 19