1244776 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種發光裝置及一種發光模組定位電路板， 尤指一種可以增進發光二極體發光模組之散熱效率的發光裝置 5 及一種適用於大量生產場合之發光裝置及發光模組定位電路 板0 【先前技術】 發光二極體是目前照明產業的熱門產品，其應用領域並逐 10 漸地擴大。以往發光二極體僅應用於發光二極體跑馬燈或紅綠 燈，但目前已經應用於小型白光發光二極體手電筒等可攜式照 明設備領域，一般相信，發光二極體未來更具有取代目前液晶 顯示器之冷陰極螢光燈管（CCFL)光源的潛力。其原因在於發光 二極體具有較一般光源（如日光燈、鎢絲燈）體積小及所需電力 15 較少的優點，況且其所需之周圍裝置（如電源供應器）所佔據的 體積也遠較以往的光源小。 可是，目前市面上的瓦級（其功率約為1瓦或1瓦以上）發光 二極體發光裝置的安裝程序複雜，而且需要大量人力，使得其 成本無法更進一步降低。其原因在於安裝時，必須先用人力將 20 每一個發光二極體依序利用固定材質（如螺絲、膠等任何可協助 固定的物質）固定於一基板的特定位置上。接著，再用人力利用 焊接的方式，將每一個發光二極體的每一個接腳與相關的導線 連接，才能完成整個發光二極體發光裝置的安裝程序。因此， 此種安裝程序除了程序複雜及必須使用大量人力以外，每一個 1244776 發光二極體的安裝位置也無法標準化，而人為造成之導線焊接 過程的失敗率更無法降低，導致發光二極體發光裝置的產量無 法進一步提升。 此外，由於近來瓦級發光二極體的發光效率逐漸提升，導 5 致瓦級發光二極體所產生的熱能也大幅增加，間接造成瓦級發 光二極體發光裝置發光時的溫度驟增。而且，當整體發光二極 體發光裝置的溫度達到某一程度以後，便會造成其内部元件的 損壞，並影響其發光效率。而目前市面上的發光二極體發光裝 置並未有較具體完整的散熱相關裝置，僅依靠空氣傳導的方式 10 移除其内部的熱能，並無法克服此一散熱的難題。另一方面， 在目前市面上的瓦級發光二極體發光裝置中，各個瓦級發光二 極體之間，因目前單顆瓦級發光二極體模組本身設計的關係， 是以並聯電路的方式互相連接，所以驅動整體瓦級發光二極體 發光裝置所需的電流較大，造成供應其電流之電源供應器的負 15 擔增加。此種情況除了會使整體瓦級發光二極體模組的使用壽 命進一步縮短以外，同時也會使其溫度進一步升高，形成惡性 循環。 因此，產業界亟需一種除了可以利用大量且標準化的生產 方式生產、可以迅速移除熱能及利用低電流即可使用複數個發 20 光二極體模組，以降低其生產成本、增加其產量增加並延長其 使用壽命。 【發明内容】 1244776 n之發歧置，包括：複數個發光二極體模組、一定 早=熱單元。其中’每_發光二極體模組皆具有一發 先二極體基座、—金屬散熱板以及至少—發光二極體發光單 元 ， σ — 一 / π %— 视 11¾、无早 R早元包括—具有複數個貫孔及—電路圖樣的定位 入y寺發光二極體模組產生之熱能藉由其發光二極體基座及 至屬散熱板傳遞至此散熱單元，並由此散熱單元移除到外界。 2安裝本發明之發光裝置時，此等發光二極體模組被放置於此 定位板之複數個貝孔中，此等發光二極體模組並藉由位於其發 光-極體基絲面之複數個電氣接點與此定位板所具之電路圖 10 樣達成電氣連接。 本I明之舍光模組定位電路板，係配合複數個具有至少一 1光一極體舍光單元、一發光二極體基座及一與此發光二極體 基座相連接之金屬散熱板之發光二極體模組，而此發光模組定 位電路板係包括：一具有複數個貫孔之基板及一設於此基板表 15面的電路圖樣。其中，此等貫孔係貫穿此基板並容置此等發光 二極體模組，而當此等發光二極體模組容置於此等貫孔後，此 等發光二極體模組電氣連接於此電路圖樣。 因此，本發明之發光裝置及發光模組定位電路板可以簡化 整體發光二極體發光裝置的安裝程序，並可以利用標準化的生 20 產流程大量生產以減低生產所需的成本及時間，同時減少人為 安裝失誤造成的損失。除此之外，由於本發明之發光裝置包括 一金屬材質之散熱鰭片，並搭配至少一散熱風扇，所以本發明 之發光裝置的散熱效率較以往的發光裝置大幅增進，並使其使 用哥命大幅延長。 1244776 本發明之發光二極體模組所使用之發光二極體可為任何種 類之發光二極體，較佳為悬晶發光二極體。本發明之發光二極 體模組可具有任何數目之發光二極體，較佳為三個光二極 體。本發明之發光二極體所發出的光線可為任何波長範圍，較 5佳為為藍光範圍、紅光範圍、綠光範圍或白光。本發明之金屬 散熱板可為任何可傳導熱能之金屬材質，較佳為紹。本發明之 印刷電路板的可為任何種類之印刷電路板，較佳為單層印刷電 路板或雙層印刷電路板。本發明之印刷電路板所具有之貫孔可 為任何形狀之貫孔，較佳方孔或圓孔。本發明之散熱單元可為 10任何可以移除熱能之結構’較佳為散熱縛片或熱導管。本發明 之散熱單元可為任何可傳導熱能的金屬材質，較佳為銅植。 本發明之發光裝置可具有任何數目之散熱風扇，較佳為一個散 熱風扇。本發明之保護層可為有任何具有保護功能的材質，較 佳為透明高分子層，次佳為聚甲基丙稀酸甲醋（PMma)。本^ 15明之印刷電路板可為任何習用之印刷電路板，較佳為—具㈣ 電路之印刷電路板。本發明之固定板的材質可為任何易於加: 之材負，車父佳為金屬或聚曱基丙烯酸甲酯（pMMA)。 【實施方式】 2〇 如圖1及圖2所示，本發明之發光裝置係由發光二極體模級 10、印刷電路板20(基板）、散熱鰭片3〇及散熱風扇4〇所構成 其中，發光二極體模組10係由銘製的導熱板u、發光二極體基 座12、發光二極體裝置13構成；印刷電路板2〇(基板）則具有複 1244776 數们貝孔21及位於其表面之印刷電路22。此外，發光二極體模 、、且10亚可廷擇性設置配光片14(透鏡），以增加其發光的效率。 在安I本發明之發光裝置時，首先將各個發光二極體模組 10分別置入於相對應之位於印刷電路板20(基板）的貫孔21中， 5並以導·23(銲料）將位於發光二極體模組狀發光二極體基 座12的，接腳（圖中未示）分別與貫孔21周圍之印刷電仙相連 接。接著’將散熱風扇40置放於散熱鰭片3〇的下方並利用螺絲 (圖中未不）將兩者固定成一體。最後，將印刷電路板2〇(基板) 及容置於其貫孔21中的各個發光二極體模組1〇置放於已與散熱 1〇風扇40結合成-體之散熱鰭片3〇的上表_上，再利用導熱膠 貼或其他固定方式將兩者結合。此時，各個發光二極體模組1〇 之#呂製導熱板11皆與叙製的散熱_片3〇接觸，完成本發明之發 光裝置的安裝程序。 此外’如圖1及圖2所示，本發明之發光模組定位電路板即 為具有複數個貫孔21及印刷電路22之印刷電路板2〇(基板）。如 前所述’各個發光二極體模組1〇在安裝時係被容置於貫孔Μ 炎藉由導電膠23(銲料）將位於發光二極體模組1〇之發光二極體 基雇12的各接腳（圖中未示）分別與貫孔21周圍之印刷電路22相 連操^此’本發明之發光模組定位電路板可以大幅減低在製 造發光裝置時，固定各個發光二極體模於一基板所需要的時 間，立且可以提高各個發光二極體的定位精確度，同時減低人 為安裝，誤所造成的損失。除此之外，本發明之發光模組定位 電路板更可以應於於大量生產的場合，大幅減低生產的成本。 1244776 圖3係本發明之發光二極體模组之發光二極 ::光;光二極體構成其發= 15，發光二極體132對應連接於接腳 二極體"3對應連接於接腳155與接腳152，亦即每=光 極體皆具有兩個接聊。如前所述，經由利用導電膠（㈣-=妾腳=卩刷電路板所具有之印刷電路電氣連接嗜^ ::成二Γ:發光二極體133便可分別_ 極體的發光強度。此外，在本較佳實施例中，# 13卜發光：極體132及發光二極體133分別提供位於藍 制2先波長範_絲，使得本發明之發光裝置可以經由控 =電路適當地的觀各個發光二極體的發光強度，提供—彩色 的光源。 15 20 架構轉的示意圖。需注意的是，在此電路 (、同波長補光源的各個發光二極體係以串聯 ”路相連接。其中，電路51係為提供在本發明之發光裝置之每 —個發光三極顚組中，各個提供藍色波絲圍絲之發光二 δ體驅動電流，電路Μ係為提供在本發明之發光裝置之每一個 t光—極體核組中，各個提供綠色波長㈣光源之發光二極體 驅動電，·，電路53係為提供在本發明之發光裝置之每一個發光 μ和體模、、’且中各個提供紅色波長範圍光源之發光二極體驅動 電机所以’本發明之發光裝置僅需一電路架構，便可以控 J所有位於其中之發光二極體模組的發光強度。況且，由於本 10 1244776 =明之發光裝置的電路架構係為—串聯電路，因此所需之 電流極低並可減輕電源供應裝置的負擔，更使得整體發騎 的尺寸可以進纟小型化，便於應用於可攜式裝置中提供光 5 10 15 如圖5所示，本發明另—較佳實施例之發光裝置係由 二極體模組1G、蚊及導電結構50、散熱H片3G及散熱風^ 所構成。其中’發光二極體模組1〇包括銘製的導熱板U 二極體基座12、發光二極體裝心及配光片14(透鏡）；固= 導電結構5〇則由具有複數個貫孔$1之固定板Μ及具有印 53於其表面之印刷電路板54構成。相較於前叙具有複數個 咖及印刷電路22的印刷電路板2Q(基板），此較佳實施例之固 疋及導電娜0則由提供固定她㈣定攸及導電功能 刷電路板54兩種不同元件構成。另—方面，包括此種分離式之 固定及導電結構之發光裝置的錢程序與前—較佳實施例之發 光裝置的安裝程序相同，於此不再贅述。 、 上述實施例僅係為了方便說明而舉例而已，本發明所主張 =利範圍自應以申請專利範圍所述為準，而非僅限於上述實 20【圖式簡單說明】 圖1係本發明一較佳實施例之發光裝置的立體圖。 圖2係圖1中，沿著a_a，線段所得之剖面圖。 圖3係本發明-較佳實施例之發光二極體模組發光二極體基座 的平面圖。 1244776 圖4係本發明一較佳實施例之電路架構的示意圖。 圖5係本發明另一較佳實施例之發光裝置的立體圖。 【主要元件符號說明】 5 10發光二極體模組 11導熱板 12發光二極體基座 13發光二極體裝置131發光二極體 132發光二極體 14配光片 153接腳 156接腳 22印刷電路 40散熱風扇 52固定板 151接腳 154接腳 20印刷電路板 30散熱鰭片 50固定及導電結構 53印刷電路 133發光二極體 152接腳 155接腳 21貫孔 31上表面 5 1貫孔 54印刷電路板 121244776 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a light-emitting device and a light-emitting module positioning circuit board, particularly a light-emitting device 5 and a light-emitting device that can improve the heat dissipation efficiency of a light-emitting diode light-emitting module. Light-emitting device and light-emitting module positioning circuit board suitable for mass production 0 [Previous technology] Light-emitting diodes are currently popular products in the lighting industry, and their application fields have gradually expanded from 10 to 10. In the past, light-emitting diodes were only used in light-emitting diode marquees or traffic lights, but they have been used in portable lighting equipment such as small white light-emitting diode flashlights. It is generally believed that light-emitting diodes will replace current liquid crystals in the future. The potential of a cold cathode fluorescent lamp (CCFL) light source for a display. The reason is that the light emitting diode has the advantages of smaller volume and less power required than ordinary light sources (such as fluorescent lamps and tungsten filament lamps), and the required peripheral devices (such as power supply) occupy a lot of space. Smaller than conventional light sources. However, the current watt-level (the power of which is about 1 watt or more) light-emitting diode light-emitting devices on the market is complicated to install and requires a lot of manpower, making it impossible to further reduce its cost. The reason is that during installation, each of the light-emitting diodes must first be fixed to a specific position of a substrate by using a fixing material (such as screws, glue and any other material that can assist in fixing) in order. Then, the welding process is used to manually connect each pin of each light-emitting diode to the relevant wire, so as to complete the installation process of the entire light-emitting diode light-emitting device. Therefore, in addition to the complexity of this installation procedure and the need to use a lot of manpower, the installation position of each 1244776 light-emitting diode cannot be standardized, and the failure rate of the human-made wire bonding process cannot be reduced, resulting in light-emitting diode light The output of the device cannot be further increased. In addition, as the luminous efficiency of watt-level light-emitting diodes has gradually improved in recent years, the thermal energy generated by watt-level light-emitting diodes has also increased significantly, which indirectly causes the temperature of watt-level light-emitting diode light-emitting devices to suddenly increase. Moreover, when the temperature of the overall light-emitting diode light-emitting device reaches a certain level, it will cause damage to its internal components and affect its light-emitting efficiency. At present, the light-emitting diode light-emitting devices on the market do not have a more specific and complete heat-releasing device, and only relying on the air conduction method 10 to remove the heat energy inside it cannot overcome this problem of heat dissipation. On the other hand, in the current watt-level light-emitting diode light-emitting devices on the market, due to the relationship between the design of a single watt-level light-emitting diode module itself and each watt-level light-emitting diode, a parallel circuit is used. The methods are connected to each other, so the current required to drive the entire watt-level light-emitting diode light-emitting device is relatively large, which causes an increase in the burden of the power supply that supplies its current. In this case, in addition to shortening the service life of the entire tile-level light-emitting diode module, it will also further increase its temperature and form a vicious cycle. Therefore, the industry urgently needs a 20-light diode module that can be used in addition to using a large number of standardized production methods, which can quickly remove thermal energy and use low current to reduce its production costs and increase its output. And extend its service life. [Summary of the invention] 1244776 n is divergent, including: a plurality of light-emitting diode modules, must be early = thermal unit. Among them, each light-emitting diode module has a first diode base, a metal heat sink, and at least a light-emitting diode light-emitting unit, σ — one / π% — depending on 11¾, no early R early element Including-having a plurality of through holes and-positioning of the circuit pattern, the thermal energy generated by the light emitting diode module of the temple is transferred to the heat dissipation unit through its light emitting diode base and the heat dissipation plate, and is removed by the heat dissipation unit. To the outside world. 2 When the light-emitting device of the present invention is installed, these light-emitting diode modules are placed in a plurality of bayonet holes of the positioning plate, and the light-emitting diode modules are located on the light-polar body wire surface of the light-emitting diode module. A plurality of electrical contacts are electrically connected to the circuit diagram of the positioning plate. The light-emitting module positioning circuit board of the present invention is matched with a plurality of light-emitting diode base units, a light-emitting diode base, and a metal heat-dissipating plate connected to the light-emitting diode base. The light-emitting diode module, and the light-emitting module positioning circuit board includes: a substrate having a plurality of through holes and a circuit pattern provided on the surface 15 of the substrate. Wherein, the through-holes penetrate the substrate and accommodate the light-emitting diode modules, and when the light-emitting diode modules are accommodated in the through-holes, the light-emitting diode modules are electrically Connect to this circuit pattern. Therefore, the light-emitting device and the light-emitting module positioning circuit board of the present invention can simplify the installation process of the overall light-emitting diode light-emitting device, and can use the standardized production process to mass produce to reduce the cost and time required for production, while reducing Damage caused by human installation errors. In addition, since the light-emitting device of the present invention includes a metal heat-dissipating fin and is equipped with at least one heat-dissipating fan, the heat-dissipating efficiency of the light-emitting device of the present invention is greatly improved compared with the conventional light-emitting device, and the use of it Significantly longer. 1244776 The light-emitting diode used in the light-emitting diode module of the present invention may be any kind of light-emitting diode, preferably a suspended crystal light-emitting diode. The light emitting diode module of the present invention may have any number of light emitting diodes, preferably three light diodes. The light emitted by the light-emitting diode of the present invention may be in any wavelength range, and more preferably, it is blue light range, red light range, green light range, or white light. The metal heat-dissipating plate of the present invention may be any metal material that can conduct thermal energy, and is preferably Shao. The printed circuit board of the present invention may be any kind of printed circuit board, and is preferably a single-layer printed circuit board or a double-layer printed circuit board. The through-holes of the printed circuit board of the present invention may be through-holes of any shape, preferably square holes or round holes. The heat-dissipating unit of the present invention may be any structure capable of removing thermal energy ', preferably a heat-dissipating fin or a heat pipe. The heat dissipating unit of the present invention can be any metal material that can conduct thermal energy, and is preferably a copper plant. The light-emitting device of the present invention may have any number of heat-radiating fans, preferably a heat-radiating fan. The protective layer of the present invention may be any material having a protective function, preferably a transparent polymer layer, and secondly, polymethyl methacrylate (PMma). The printed circuit board of this document can be any conventional printed circuit board, preferably a printed circuit board with a circuit. The material of the fixing plate of the present invention can be any material that can be easily added. The car is preferably metal or polymethyl methacrylate (pMMA). [Embodiment] 20 As shown in FIG. 1 and FIG. 2, the light emitting device of the present invention is composed of a light emitting diode phantom stage 10, a printed circuit board 20 (substrate), a heat sink fin 30, and a heat sink fan 40. Among them, the light-emitting diode module 10 is composed of an inscribed heat-conducting plate u, a light-emitting diode base 12, and a light-emitting diode device 13. The printed circuit board 20 (substrate) has a complex 1244776 number of holes. 21 and a printed circuit 22 on its surface. In addition, the light emitting diode phantom and the light distribution sheet 14 (lens) can be selectively set to increase the light emitting efficiency. In the light-emitting device of the present invention, first, each light-emitting diode module 10 is respectively placed in a corresponding through-hole 21 located on a printed circuit board 20 (substrate), 5 and guided by 23 (solder). The pins (not shown) of the light-emitting diode module-shaped light-emitting diode base 12 are respectively connected to the printed electric fairy around the through-hole 21. Next ', the cooling fan 40 is placed below the cooling fins 30 and the two are integrated into one with screws (not shown). Finally, the printed circuit board 20 (substrate) and each light-emitting diode module 10 accommodated in its through hole 21 are placed on a heat-dissipating fin 3 which has been combined with a heat-dissipating fan 40 to form a body. On the table above, and then use thermal adhesive or other fixing methods to combine the two. At this time, the #Lu heat-conducting plate 11 of each light-emitting diode module 10 is in contact with the heat-dissipating sheet 30, which completes the installation procedure of the light-emitting device of the present invention. In addition, as shown in FIG. 1 and FIG. 2, the light-emitting module positioning circuit board of the present invention is a printed circuit board 20 (substrate) having a plurality of through holes 21 and a printed circuit 22. As described above, 'Each light-emitting diode module 10 is accommodated in the through-hole M during installation. The light-emitting diode base located at the light-emitting diode module 10 is conductively conductive 23 (solder). Each pin (not shown) of the employee 12 is connected to the printed circuit 22 around the through hole 21 respectively. The light-emitting module positioning circuit board of the present invention can greatly reduce the fixing of each light-emitting diode when manufacturing a light-emitting device. The time required for the phantom to be placed on a substrate can improve the positioning accuracy of each light-emitting diode, and reduce the loss caused by human installation and errors. In addition, the light-emitting module positioning circuit board of the present invention can be applied to mass production occasions, and the production cost is greatly reduced. 1244776 Fig. 3 is the light-emitting diode of the light-emitting diode module of the present invention :: light; the light-emitting diode constitutes its emission = 15, the light-emitting diode 132 is correspondingly connected to the pin diode " 3 is correspondingly connected to the terminal Feet 155 and pin 152, that is, each pole has two connections. As mentioned before, by using the conductive adhesive (㈣- = 妾 脚 = 卩) of the printed circuit electrical connection of the printed circuit board, the ^ :: into two Γ: light-emitting diode 133 can respectively separate the light-emitting intensity of the pole. In addition, in this preferred embodiment, # 13Bu emitting light: the polar body 132 and the light-emitting diode 133 respectively provide the first two wavelength ranges of the blue system, so that the light-emitting device of the present invention can be appropriately controlled by the control circuit. Observe the luminous intensity of each light-emitting diode and provide a colored light source. 15 20 Schematic diagram of the structure conversion. It should be noted that in this circuit, the light-emitting diode systems of the same wavelength complementary light source are connected in series. Among them, the circuit 51 is provided in each of the light-emitting triodes of the light-emitting device of the present invention, and each provides a light-emitting two delta body driving current of a blue wave wire. The circuit M is provided to provide light in the present invention. In each of the t-light-pole core groups of the device, each of the light-emitting diodes driving the light source with a green wavelength Er is provided, and the circuit 53 is provided for each light-emitting μ and phantom of the light-emitting device of the present invention, 'And each of them provides a red wave The light-emitting diode driving motor of the range light source therefore requires that the light-emitting device of the present invention only needs a circuit structure to control the light-emitting intensity of all the light-emitting diode modules located therein. Moreover, since this 10 1244776 = Ming's light-emitting The circuit structure of the device is a series circuit, so the current required is extremely low and the burden on the power supply device can be reduced, and the size of the overall hair riding can be miniaturized, which is convenient for the application of light in portable devices. 5 10 15 As shown in FIG. 5, the light-emitting device according to another preferred embodiment of the present invention is composed of a diode module 1G, a mosquito and conductive structure 50, a heat-dissipating H sheet 3G, and a heat-dissipating wind ^. Among them, a light-emitting diode The body module 10 includes a thermally conductive plate U diode base 12, a light emitting diode core and a light distribution sheet 14 (lens); solid = conductive structure 50 is fixed by a plurality of through holes $ 1 The board M and the printed circuit board 54 having the printed circuit board 53 on its surface. Compared with the printed circuit board 2Q (substrate) with a plurality of coffee cups and the printed circuit 22 described above, the solid and conductive structure of this preferred embodiment She is fixed and conductive by providing fixation The functional brush circuit board 54 is composed of two different components. In addition, the money procedure of the light-emitting device including such a separate fixed and conductive structure is the same as the previous-preferred embodiment of the light-emitting device installation procedure, and is not repeated here. The above-mentioned embodiments are merely examples for the convenience of description. The claimed scope of the present invention should be based on the scope of the patent application, not limited to the above. [Schematic description of the diagram] Figure 1 is a copy of this A perspective view of a light-emitting device according to a preferred embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line a_a in Fig. 1. Fig. 3 is a light-emitting diode module light-emitting diode of the preferred embodiment of the present invention. Plan view of the base. 1244776 Figure 4 is a schematic diagram of a circuit architecture of a preferred embodiment of the present invention. Figure 5 is a perspective view of a light emitting device according to another preferred embodiment of the present invention. [Description of main component symbols] 5 10 Light-emitting diode module 11 Thermally conductive plate 12 Light-emitting diode base 13 Light-emitting diode device 131 Light-emitting diode 132 Light-emitting diode 14 Light-emitting sheet 153 Pin 156 Pin 22 printed circuit 40 cooling fan 52 fixing plate 151 pin 154 pin 20 printed circuit board 30 cooling fin 50 fixed and conductive structure 53 printed circuit 133 light emitting diode 152 pin 155 pin 21 through hole 31 upper surface 5 1 Through-hole 54 printed circuit board 12