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TWD231825S - Housing of power module - Google Patents

Housing of power module Download PDF

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Publication number
TWD231825S
TWD231825S TW112303274F TW112303274F TWD231825S TW D231825 S TWD231825 S TW D231825S TW 112303274 F TW112303274 F TW 112303274F TW 112303274 F TW112303274 F TW 112303274F TW D231825 S TWD231825 S TW D231825S
Authority
TW
Taiwan
Prior art keywords
power module
housing
design
item
diagram
Prior art date
Application number
TW112303274F
Other languages
Chinese (zh)
Inventor
黃元呈
許繼元
邱柏凱
高國書
Original Assignee
財團法人工業技術研究院 新竹縣竹東鎮中興路四段195號 (中華民國)
財團法人工業技術研究院
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 財團法人工業技術研究院 新竹縣竹東鎮中興路四段195號 (中華民國), 財團法人工業技術研究院 filed Critical 財團法人工業技術研究院 新竹縣竹東鎮中興路四段195號 (中華民國)
Priority to TW112303274F priority Critical patent/TWD231825S/en
Priority to US29/897,856 priority patent/USD1094288S1/en
Publication of TWD231825S publication Critical patent/TWD231825S/en

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Abstract

【物品用途】;本設計物品是一種功率模組的外殼。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。[Item Purpose];This design item is a power module housing. ;[Design Description];The dotted line part disclosed in the diagram is the part that this case does not claim to design.

Description

功率模組的外殼Power module housing

本設計物品是一種功率模組的外殼。This design item is a housing for a power module.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line part in the diagram is not the design advocated by this case.

TW112303274F 2023-06-29 2023-06-29 Housing of power module TWD231825S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW112303274F TWD231825S (en) 2023-06-29 2023-06-29 Housing of power module
US29/897,856 USD1094288S1 (en) 2023-06-29 2023-07-19 Power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW112303274F TWD231825S (en) 2023-06-29 2023-06-29 Housing of power module

Publications (1)

Publication Number Publication Date
TWD231825S true TWD231825S (en) 2024-06-21

Family

ID=92457319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112303274F TWD231825S (en) 2023-06-29 2023-06-29 Housing of power module

Country Status (2)

Country Link
US (1) USD1094288S1 (en)
TW (1) TWD231825S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD169201S (en) 2014-12-26 2015-07-21 台達電子工業股份有限公司 Portion of power module

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US9967986B2 (en) * 2014-01-02 2018-05-08 Semiconductor Components Industries, Llc Semiconductor package and method therefor
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
US9431311B1 (en) * 2015-02-19 2016-08-30 Semiconductor Components Industries, Llc Semiconductor package with elastic coupler and related methods
SG10201504274SA (en) 2015-05-29 2016-12-29 Delta Electronics Int’L Singapore Pte Ltd Package assembly
JP1551316S (en) * 2015-09-30 2016-06-13
US11342237B2 (en) 2015-12-15 2022-05-24 Semiconductor Components Industries, Llc Semiconductor package system and related methods
USD853978S1 (en) * 2017-02-28 2019-07-16 Infineon Technologies Ag High-performance semiconductor module
JP7046742B2 (en) 2018-07-05 2022-04-04 日立Astemo株式会社 Power module
CN113078127B (en) * 2020-01-05 2024-12-13 财团法人工业技术研究院 Power Module
TWI735249B (en) 2020-01-05 2021-08-01 財團法人工業技術研究院 Power module
CN113380730B (en) * 2020-02-25 2024-06-14 力特半导体（无锡）有限公司 Semiconductor package with improved clip
TWM636532U (en) 2022-09-22 2023-01-11 財團法人工業技術研究院 Module device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD169201S (en) 2014-12-26 2015-07-21 台達電子工業股份有限公司 Portion of power module

Also Published As

Publication number Publication date
USD1094288S1 (en) 2025-09-23

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