TWD215851S - Substrate retaining ring - Google Patents
Substrate retaining ring Download PDFInfo
- Publication number
- TWD215851S TWD215851S TW110303146F TW110303146F TWD215851S TW D215851 S TWD215851 S TW D215851S TW 110303146 F TW110303146 F TW 110303146F TW 110303146 F TW110303146 F TW 110303146F TW D215851 S TWD215851 S TW D215851S
- Authority
- TW
- Taiwan
- Prior art keywords
- retaining ring
- view
- substrate
- substrate retaining
- article
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract description 9
- 238000007517 polishing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Abstract
【物品用途】;本設計的物品是基板保持環，例如：如「使用狀態參考圖」所示，應用於半導體等製程的基板研磨工序中，將晶圓等基板保持在環內，來研磨基板的其中一面。;【設計說明】;後視圖、左側視圖及右側視圖與前視圖相同，皆省略之。[Use of article]; The article of this design is a substrate retaining ring. For example: as shown in the "Usage Reference Picture", it is used in the substrate polishing process of semiconductor and other processes to hold substrates such as wafers in the ring for polishing. One side of the substrate. ;[Design Description];The rear view, left side view and right side view are the same as the front view and are omitted.
Description
本設計的物品是基板保持環，例如：如「使用狀態參考圖」所示，應用於半導體等製程的基板研磨工序中，將晶圓等基板保持在環內，來研磨基板的其中一面。The article of this design is a substrate holding ring. For example, as shown in the "use state reference drawing", it is used in the substrate polishing process of semiconductor and other manufacturing processes to hold wafers and other substrates in the ring to polish one side of the substrate.
後視圖、左側視圖及右側視圖與前視圖相同，皆省略之。The rear view, left side view, and right side view are the same as the front view, so they are omitted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-027291 | 2020-12-18 | ||
| JP2020027291F JP1717341S (en) | 2020-12-18 | 2020-12-18 | Board retaining ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD215851S true TWD215851S (en) | 2021-12-01 |
Family
ID=81988394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110303146F TWD215851S (en) | 2020-12-18 | 2021-06-17 | Substrate retaining ring |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1717341S (en) |
| TW (1) | TWD215851S (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD241121S (en) | 2024-06-13 | 2025-10-21 | 日商荏原製作所股份有限公司 (日本) | Part of the retaining ring used for semiconductor wafer polishing |
| TWD241122S (en) | 2024-06-13 | 2025-10-21 | 日商荏原製作所股份有限公司 (日本) | Part of the retaining ring used for semiconductor wafer polishing |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1086087S1 (en) * | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD202849S (en) | 2018-09-26 | 2020-02-21 | 日商富士紡控股股份有限公司 | Substrate retaining ring |
| TWD204496S (en) | 2018-12-10 | 2020-05-01 | 日商富士紡控股股份有限公司 | Substrate retaining ring |
-
2020
- 2020-12-18 JP JP2020027291F patent/JP1717341S/en active Active
-
2021
- 2021-06-17 TW TW110303146F patent/TWD215851S/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD202849S (en) | 2018-09-26 | 2020-02-21 | 日商富士紡控股股份有限公司 | Substrate retaining ring |
| TWD204496S (en) | 2018-12-10 | 2020-05-01 | 日商富士紡控股股份有限公司 | Substrate retaining ring |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD241121S (en) | 2024-06-13 | 2025-10-21 | 日商荏原製作所股份有限公司 (日本) | Part of the retaining ring used for semiconductor wafer polishing |
| TWD241122S (en) | 2024-06-13 | 2025-10-21 | 日商荏原製作所股份有限公司 (日本) | Part of the retaining ring used for semiconductor wafer polishing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1717341S (en) | 2022-06-14 |
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