TWD213820S - Memory heat sink - Google Patents
Memory heat sink Download PDFInfo
- Publication number
- TWD213820S TWD213820S TW110301421F TW110301421F TWD213820S TW D213820 S TWD213820 S TW D213820S TW 110301421 F TW110301421 F TW 110301421F TW 110301421 F TW110301421 F TW 110301421F TW D213820 S TWD213820 S TW D213820S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat sink
- memory
- dimensional
- design
- creation
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract 1
Images
Abstract
【物品用途】;本創作為有關一種「記憶體散熱片」之外形設計，尤指可運用於記憶體外部之長矩形片體，以提供記憶體散熱之功效，並利用多數斜面方式，呈現出錐狀之立體觀感之浮凸狀立體設計，呈現新奇、美觀、不凡之創設美感。;【設計說明】;本創作係提供一種「記憶體散熱片」之造型，該散熱片表面呈現有多數斜面組構出不規則延伸之複數立體錐狀，藉此襯托出散熱片整體的視覺觀感立體效果，且整體外觀大膽創新、獨樹新格、別具創意，必成為消費者寵愛、刺激購買慾，完全符合設計專利之申請要件，爰依法提出申請。[Purpose of the article]; This creation is about the shape design of a "memory heat sink", especially a long rectangular piece that can be applied to the outside of the memory to provide heat dissipation for the memory, and uses multiple slopes to present a The embossed three-dimensional design with a tapered three-dimensional look presents a novel, beautiful and extraordinary creative aesthetic. ;[Design Description];This creation is to provide a "memory heat sink" shape. The surface of the heat sink presents a plurality of inclined planes to form a plurality of irregularly extending three-dimensional cones, thereby setting off the overall visual appearance of the heat sink. The three-dimensional effect, and the overall appearance is bold, innovative, unique and creative, which will definitely become the favorite of consumers and stimulate the desire to buy. It fully meets the application requirements for a design patent, and the application must be filed in accordance with the law.
Description
本創作為有關一種「記憶體散熱片」之外形設計，尤指可運用於記憶體外部之長矩形片體，以提供記憶體散熱之功效，並利用多數斜面方式，呈現出錐狀之立體觀感之浮凸狀立體設計，呈現新奇、美觀、不凡之創設美感。 This creation is about a "memory heat sink" outer shape design, especially a long rectangular sheet that can be used on the outside of the memory to provide heat dissipation for the memory, and uses most inclined surfaces to present a cone-shaped three-dimensional look The embossed three-dimensional design presents a novel, beautiful, and extraordinary sense of creation.
本創作係提供一種「記憶體散熱片」之造型，該散熱片表面呈現有多數斜面組構出不規則延伸之複數立體錐狀，藉此襯托出散熱片整體的視覺觀感立體效果，且整體外觀大膽創新、獨樹新格、別具創意，必成為消費者寵愛、刺激購買慾，完全符合設計專利之申請要件，爰依法提出申請。 This creation provides a shape of a "memory heat sink". The surface of the heat sink presents a plurality of inclined planes forming an irregularly extending three-dimensional cone shape, thereby bringing out the overall visual appearance of the heat sink and the overall appearance. Bold innovation, unique new style, unique creativity, will become the favorite of consumers, stimulate the desire to buy, and fully meet the requirements of application for design patents, and apply for it in accordance with the law.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110301421F TWD213820S (en) | 2021-03-23 | 2021-03-23 | Memory heat sink |
| US29/787,465 USD1051080S1 (en) | 2021-03-23 | 2021-06-07 | Memory heat dissipation sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110301421F TWD213820S (en) | 2021-03-23 | 2021-03-23 | Memory heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD213820S true TWD213820S (en) | 2021-09-01 |
Family
ID=88971119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110301421F TWD213820S (en) | 2021-03-23 | 2021-03-23 | Memory heat sink |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1051080S1 (en) |
| TW (1) | TWD213820S (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1077283S1 (en) * | 2025-01-08 | 2025-05-27 | Fujin Xia | Wall panel |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD205998S (en) | 2020-01-06 | 2020-07-21 | 威剛科技股份有限公司 | Part of the memory module |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7360581B2 (en) * | 2005-11-07 | 2008-04-22 | 3M Innovative Properties Company | Structured thermal transfer article |
| USD608029S1 (en) * | 2009-04-02 | 2010-01-12 | 3Form, Inc | Architectural panel with uneven surface |
| USD613258S1 (en) * | 2009-05-15 | 2010-04-06 | Koninklije Philips Electronics N.V. | Heatsink |
| TW201101980A (en) * | 2009-06-19 | 2011-01-01 | shi-yao Huang | High heat dissipation single grain diamond layer carrier |
| USD676118S1 (en) * | 2011-06-24 | 2013-02-12 | Hiform As | Heat exchanger panel |
| USD713979S1 (en) * | 2013-03-25 | 2014-09-23 | 3Form, Llc | Tile with a curved face |
| USD757662S1 (en) * | 2014-02-06 | 2016-05-31 | Kobe Steel, Ltd. | Plate for heat exchanger |
| USD761447S1 (en) * | 2015-01-27 | 2016-07-12 | Building Materials Investment Corporation | Roofing panel |
| USD806396S1 (en) * | 2015-12-31 | 2018-01-02 | Matte-Veede, FZE | Suitcase |
| USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
| USD962880S1 (en) * | 2020-08-06 | 2022-09-06 | Essencore Limited | Heat sink for memory modules |
-
2021
- 2021-03-23 TW TW110301421F patent/TWD213820S/en unknown
- 2021-06-07 US US29/787,465 patent/USD1051080S1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD205998S (en) | 2020-01-06 | 2020-07-21 | 威剛科技股份有限公司 | Part of the memory module |
Also Published As
| Publication number | Publication date |
|---|---|
| USD1051080S1 (en) | 2024-11-12 |
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