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TWD119911S1 - Wafer boat - Google Patents

Wafer boat

Info

Publication number
TWD119911S1
TWD119911S1 TW095305862F TW95305862F TWD119911S1 TW D119911 S1 TWD119911 S1 TW D119911S1 TW 095305862 F TW095305862 F TW 095305862F TW 95305862 F TW95305862 F TW 95305862F TW D119911 S1 TWD119911 S1 TW D119911S1
Authority
TW
Taiwan
Prior art keywords
wafer
comb
end plates
tooth structure
view
Prior art date
Application number
TW095305862F
Other languages
Chinese (zh)
Inventor
佐藤泉
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD119911S1 publication Critical patent/TWD119911S1/en

Links

Abstract

【物品用途】本創作的物品是一種晶舟，主要是為了載置整批晶圓，進行相關處理用的載具。【創作特點】該晶舟，乃如立體圖所示，大體上是由兩片位置互為平行的圓形端板，以及兩個圓形端板間設有三道軸向晶圓支架以及兩支連結桿所組成；如俯視圖或仰視圖所示，該兩端板的正上方設有一個半圓缺口；如前視圖所示，該晶圓支架具有密集的梳齒形構造，配合B-B剖面圖所示，該三道晶圓支架分別設置在端版的正下方以及兩側邊，且兩側的支架與正下方的支架之間，設有許多圓弧狀的連結桿使兩者相連結，其中正下方的晶圓支架，其梳齒形構造的開口朝向正上方；兩側的晶圓支架，其梳齒形構造的開口以向內傾斜的角度朝向內上方；使多數的片狀晶圓得以被放置在三道晶圓支架間，形成多數梳齒形構造；整體觀之，確為一新穎獨特之設計。[Purpose of the item] The item of this creation is a kind of wafer boat, which is mainly used as a carrier for carrying a whole batch of wafers for related processing. [Features of the creation] As shown in the three-dimensional diagram, the wafer boat is generally composed of two circular end plates that are parallel to each other, and three axial wafer supports and two connecting rods are arranged between the two circular end plates; as shown in the top view or bottom view, there is a semicircular notch directly above the two end plates; as shown in the front view, the wafer support has a dense comb-tooth structure, and as shown in the B-B cross-sectional view, the three wafer supports are respectively arranged directly below the end plates. The wafer holders on the sides are connected to the bottom bracket by many arc-shaped connecting rods. The comb-tooth structure of the wafer holders on the bottom brackets has its opening facing upward. The comb-tooth structure of the wafer holders on the sides has its opening facing upward at an inwardly inclined angle. This allows most sheet wafers to be placed between the three wafer holders to form a comb-tooth structure. Overall, it is a novel and unique design.

TW095305862F 2006-05-01 2006-10-26 Wafer boat TWD119911S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006011365 2006-05-01

Publications (1)

Publication Number Publication Date
TWD119911S1 true TWD119911S1 (en) 2007-11-11

Family

ID=40001144

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095305862F TWD119911S1 (en) 2006-05-01 2006-10-26 Wafer boat

Country Status (2)

Country Link
US (1) USD580894S1 (en)
TW (1) TWD119911S1 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616391S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
WO2011008753A1 (en) * 2009-07-13 2011-01-20 Greene, Tweed Of Delaware, Inc. Chimerized wafer boats for use in semiconductor chip processing and related methods
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD163542S (en) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 Wafer boat for substrate processing equipment
TWD166332S (en) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 Part of the wafer boat for substrate processing equipment
TWD167988S (en) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD165429S (en) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD168827S (en) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
JP1537630S (en) * 2014-11-20 2015-11-09
JP1537313S (en) * 2014-11-20 2015-11-09
JP1537312S (en) * 2014-11-20 2015-11-09
JP1537629S (en) * 2014-11-20 2015-11-09
JP1563649S (en) * 2016-02-12 2016-11-21
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
KR102552458B1 (en) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
JP1658652S (en) * 2019-08-07 2020-04-27
JP1700777S (en) * 2021-03-15 2021-11-29 Boat for substrate processing equipment
JP1706322S (en) * 2021-08-27 2022-01-31
JP1731670S (en) * 2022-03-04 2025-12-15 Substrate holder for substrate processing apparatus
JP1741512S (en) * 2022-09-14 2023-04-11
JP1741513S (en) * 2022-09-14 2023-04-11

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5458688A (en) * 1993-03-09 1995-10-17 Tokyo Electron Kabushiki Kaisha Heat treatment boat
TW325588B (en) * 1996-02-28 1998-01-21 Asahi Glass Co Ltd Vertical wafer boat
KR100284567B1 (en) * 1997-04-15 2001-04-02 후지이 아키히로 Vertical wafer boat
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
US6056123A (en) * 1997-12-10 2000-05-02 Novus Corporation Semiconductor wafer carrier having the same composition as the wafers
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier
US20020130061A1 (en) * 2000-11-02 2002-09-19 Hengst Richard R. Apparatus and method of making a slip free wafer boat
KR100410982B1 (en) * 2001-01-18 2003-12-18 삼성전자주식회사 Boat for Semiconductor Manufacturing Apparatus
JP2002324830A (en) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp Substrate heat treatment holder, substrate heat treatment apparatus, semiconductor device manufacturing method, substrate heat treatment holder manufacturing method, and substrate heat treatment holder structure determination method
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers

Also Published As

Publication number Publication date
USD580894S1 (en) 2008-11-18

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