TW404562U - Semiconductor glue film application platform with positioning structure - Google Patents

Semiconductor glue film application platform with positioning structure

Info

Publication number: TW404562U
Authority: TW; Taiwan
Prior art keywords: positioning structure; application platform; glue film; film application; semiconductor glue
Prior art date: 1999-05-06

Application number

TW88207199U

Other languages

Chinese (zh)

Inventor

Jau-Yuan Su

Dau-You Chen

Su Tao

Original Assignee

Advanced Semiconductor Eng

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-05-06

Filing date

1999-05-06

Publication date

2000-09-01

1999-05-06 Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng

1999-05-06 Priority to TW88207199U priority Critical patent/TW404562U/en

2000-09-01 Publication of TW404562U publication Critical patent/TW404562U/en

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW88207199U TW404562U (en)	1999-05-06	1999-05-06	Semiconductor glue film application platform with positioning structure

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW88207199U TW404562U (en)	1999-05-06	1999-05-06	Semiconductor glue film application platform with positioning structure

Publications (1)

Publication Number	Publication Date
TW404562U true TW404562U (en)	2000-09-01

Family

ID=21647779

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW88207199U TW404562U (en)	1999-05-06	1999-05-06	Semiconductor glue film application platform with positioning structure

Country Status (1)

Country	Link
TW (1)	TW404562U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWD195587S (en)	2017-09-27	2019-01-21	日商濱松赫德尼古斯股份有限公司	Part for semiconductor device
TWD195586S (en)	2017-09-27	2019-01-21	日商濱松赫德尼古斯股份有限公司	Part for semiconductor device
TWD195624S (en)	2017-09-27	2019-01-21	日商濱松赫德尼古斯股份有限公司	Part for semiconductor device

1999
- 1999-05-06 TW TW88207199U patent/TW404562U/en not_active IP Right Cessation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWD195587S (en)	2017-09-27	2019-01-21	日商濱松赫德尼古斯股份有限公司	Part for semiconductor device
TWD195586S (en)	2017-09-27	2019-01-21	日商濱松赫德尼古斯股份有限公司	Part for semiconductor device
TWD195624S (en)	2017-09-27	2019-01-21	日商濱松赫德尼古斯股份有限公司	Part for semiconductor device
USD864883S1 (en)	2017-09-27	2019-10-29	Hamamatsu Photonics K.K.	Part for semiconductor device
USD864882S1 (en)	2017-09-27	2019-10-29	Hamamatsu Photonics K.K.	Part for semiconductor device
USD865690S1 (en)	2017-09-27	2019-11-05	Hamamatsu Photonics K.K.	Part for semiconductor device

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Legal Events

Date	Code	Title	Description
2001-01-29	GD4K	Issue of patent certificate for granted utility model filed before june 30, 2004
2011-07-01	MK4K	Expiration of patent term of a granted utility model