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TW364161B - Semiconductor and method relating to semiconductors - Google Patents

Semiconductor and method relating to semiconductors

Info

Publication number
TW364161B
TW364161B TW086103707A TW86103707A TW364161B TW 364161 B TW364161 B TW 364161B TW 086103707 A TW086103707 A TW 086103707A TW 86103707 A TW86103707 A TW 86103707A TW 364161 B TW364161 B TW 364161B
Authority
TW
Taiwan
Prior art keywords
area
semiconductor
semiconductors
areas
doped
Prior art date
Application number
TW086103707A
Other languages
English (en)
Inventor
Haakan Sjoedin
Anders Soederbaerg
Nils Oegren
Ivar Hamberg
Dimitri Olofsson
Anderson Karin
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of TW364161B publication Critical patent/TW364161B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/01Manufacture or treatment
    • H10D10/051Manufacture or treatment of vertical BJTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0338Process specially adapted to improve the resolution of the mask
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0112Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Bipolar Transistors (AREA)
TW086103707A 1997-03-04 1997-03-24 Semiconductor and method relating to semiconductors TW364161B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9700773A SE519628C2 (sv) 1997-03-04 1997-03-04 Tillverkningsförfarande för halvledarkomponent med deponering av selektivt utformat material,vilket är ogenomträngligt för dopjoner

Publications (1)

Publication Number Publication Date
TW364161B true TW364161B (en) 1999-07-11

Family

ID=20406016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086103707A TW364161B (en) 1997-03-04 1997-03-24 Semiconductor and method relating to semiconductors

Country Status (10)

Country Link
US (2) US6140194A (zh)
EP (1) EP0966757A1 (zh)
JP (1) JP2001513945A (zh)
KR (1) KR20000075706A (zh)
CN (1) CN1249848A (zh)
AU (1) AU6644398A (zh)
CA (1) CA2283396A1 (zh)
SE (1) SE519628C2 (zh)
TW (1) TW364161B (zh)
WO (1) WO1998039797A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554710B (zh) * 2015-02-24 2016-10-21 蔡晉暉 手電筒改良結構
TWI655772B (zh) * 2017-05-05 2019-04-01 旺宏電子股份有限公司 半導體元件
US10256307B2 (en) 2017-05-08 2019-04-09 Macronix International Co., Ltd. Semiconductor device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127071A (ja) * 1999-08-19 2001-05-11 Hitachi Ltd 半導体装置及びその製造方法
US7432179B2 (en) * 2004-12-15 2008-10-07 Taiwan Semiconductor Manufacturing Company, Ltd. Controlling gate formation by removing dummy gate structures
US7701034B2 (en) * 2005-01-21 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy patterns in integrated circuit fabrication
US7939384B2 (en) * 2008-12-19 2011-05-10 Taiwan Semiconductor Manufacturing Company, Ltd. Eliminating poly uni-direction line-end shortening using second cut

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
US4110126A (en) * 1977-08-31 1978-08-29 International Business Machines Corporation NPN/PNP Fabrication process with improved alignment
GB2088626A (en) * 1980-02-22 1982-06-09 Mostek Corp Self-aligned buried contact and method of making
JPS5737870A (en) * 1980-08-20 1982-03-02 Toshiba Corp Semiconductor device
EP0122004A3 (en) * 1983-03-08 1986-12-17 Trw Inc. Improved bipolar transistor construction
US4573256A (en) * 1983-08-26 1986-03-04 International Business Machines Corporation Method for making a high performance transistor integrated circuit
GB2172744B (en) * 1985-03-23 1989-07-19 Stc Plc Semiconductor devices
US4962053A (en) * 1987-01-30 1990-10-09 Texas Instruments Incorporated Bipolar transistor fabrication utilizing CMOS techniques
US4866001A (en) * 1988-07-01 1989-09-12 Bipolar Integrated Technology, Inc. Very large scale bipolar integrated circuit process
EP0414013A3 (en) * 1989-08-23 1991-10-16 Texas Instruments Incorporated Method for forming bipolar transistor in conjunction with complementary metal oxide semiconductor transistors
US5212397A (en) * 1990-08-13 1993-05-18 Motorola, Inc. BiCMOS device having an SOI substrate and process for making the same
US5406113A (en) * 1991-01-09 1995-04-11 Fujitsu Limited Bipolar transistor having a buried collector layer
JP3798808B2 (ja) * 1991-09-27 2006-07-19 ハリス・コーポレーション 高いアーリー電壓,高周波性能及び高降伏電壓特性を具備した相補型バイポーラトランジスター及びその製造方法
US5389561A (en) * 1991-12-13 1995-02-14 Sony Corporation Method for making SOI type bipolar transistor
US5326710A (en) * 1992-09-10 1994-07-05 National Semiconductor Corporation Process for fabricating lateral PNP transistor structure and BICMOS IC
US5416031A (en) * 1992-09-30 1995-05-16 Sony Corporation Method of producing Bi-CMOS transistors
DE4308958A1 (de) * 1993-03-21 1994-09-22 Prema Paezisionselektronik Gmb Verfahren zur Herstellung von Bipolartransistoren
US5451532A (en) * 1994-03-15 1995-09-19 National Semiconductor Corp. Process for making self-aligned polysilicon base contact in a bipolar junction transistor
US5516708A (en) * 1994-11-17 1996-05-14 Northern Telecom Limited Method of making single polysilicon self-aligned bipolar transistor having reduced emitter-base junction
US5489541A (en) * 1995-04-14 1996-02-06 United Microelectronics Corporation Process of fabricating a bipolar junction transistor
US5708287A (en) * 1995-11-29 1998-01-13 Kabushiki Kaisha Toshiba Power semiconductor device having an active layer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI554710B (zh) * 2015-02-24 2016-10-21 蔡晉暉 手電筒改良結構
TWI655772B (zh) * 2017-05-05 2019-04-01 旺宏電子股份有限公司 半導體元件
US10256307B2 (en) 2017-05-08 2019-04-09 Macronix International Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
CA2283396A1 (en) 1998-09-11
EP0966757A1 (en) 1999-12-29
WO1998039797A1 (en) 1998-09-11
CN1249848A (zh) 2000-04-05
JP2001513945A (ja) 2001-09-04
US6153919A (en) 2000-11-28
US6140194A (en) 2000-10-31
SE9700773D0 (sv) 1997-03-04
KR20000075706A (ko) 2000-12-26
SE9700773L (sv) 1998-09-05
SE519628C2 (sv) 2003-03-18
AU6644398A (en) 1998-09-22

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