TW364161B - Semiconductor and method relating to semiconductors - Google Patents
Semiconductor and method relating to semiconductorsInfo
- Publication number
- TW364161B TW364161B TW086103707A TW86103707A TW364161B TW 364161 B TW364161 B TW 364161B TW 086103707 A TW086103707 A TW 086103707A TW 86103707 A TW86103707 A TW 86103707A TW 364161 B TW364161 B TW 364161B
- Authority
- TW
- Taiwan
- Prior art keywords
- area
- semiconductor
- semiconductors
- areas
- doped
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 2
- 229920005591 polysilicon Polymers 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/01—Manufacture or treatment
- H10D10/051—Manufacture or treatment of vertical BJTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0338—Process specially adapted to improve the resolution of the mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9700773A SE519628C2 (sv) | 1997-03-04 | 1997-03-04 | Tillverkningsförfarande för halvledarkomponent med deponering av selektivt utformat material,vilket är ogenomträngligt för dopjoner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW364161B true TW364161B (en) | 1999-07-11 |
Family
ID=20406016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW086103707A TW364161B (en) | 1997-03-04 | 1997-03-24 | Semiconductor and method relating to semiconductors |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US6140194A (zh) |
| EP (1) | EP0966757A1 (zh) |
| JP (1) | JP2001513945A (zh) |
| KR (1) | KR20000075706A (zh) |
| CN (1) | CN1249848A (zh) |
| AU (1) | AU6644398A (zh) |
| CA (1) | CA2283396A1 (zh) |
| SE (1) | SE519628C2 (zh) |
| TW (1) | TW364161B (zh) |
| WO (1) | WO1998039797A1 (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI554710B (zh) * | 2015-02-24 | 2016-10-21 | 蔡晉暉 | 手電筒改良結構 |
| TWI655772B (zh) * | 2017-05-05 | 2019-04-01 | 旺宏電子股份有限公司 | 半導體元件 |
| US10256307B2 (en) | 2017-05-08 | 2019-04-09 | Macronix International Co., Ltd. | Semiconductor device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127071A (ja) * | 1999-08-19 | 2001-05-11 | Hitachi Ltd | 半導体装置及びその製造方法 |
| US7432179B2 (en) * | 2004-12-15 | 2008-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Controlling gate formation by removing dummy gate structures |
| US7701034B2 (en) * | 2005-01-21 | 2010-04-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy patterns in integrated circuit fabrication |
| US7939384B2 (en) * | 2008-12-19 | 2011-05-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Eliminating poly uni-direction line-end shortening using second cut |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4110126A (en) * | 1977-08-31 | 1978-08-29 | International Business Machines Corporation | NPN/PNP Fabrication process with improved alignment |
| GB2088626A (en) * | 1980-02-22 | 1982-06-09 | Mostek Corp | Self-aligned buried contact and method of making |
| JPS5737870A (en) * | 1980-08-20 | 1982-03-02 | Toshiba Corp | Semiconductor device |
| EP0122004A3 (en) * | 1983-03-08 | 1986-12-17 | Trw Inc. | Improved bipolar transistor construction |
| US4573256A (en) * | 1983-08-26 | 1986-03-04 | International Business Machines Corporation | Method for making a high performance transistor integrated circuit |
| GB2172744B (en) * | 1985-03-23 | 1989-07-19 | Stc Plc | Semiconductor devices |
| US4962053A (en) * | 1987-01-30 | 1990-10-09 | Texas Instruments Incorporated | Bipolar transistor fabrication utilizing CMOS techniques |
| US4866001A (en) * | 1988-07-01 | 1989-09-12 | Bipolar Integrated Technology, Inc. | Very large scale bipolar integrated circuit process |
| EP0414013A3 (en) * | 1989-08-23 | 1991-10-16 | Texas Instruments Incorporated | Method for forming bipolar transistor in conjunction with complementary metal oxide semiconductor transistors |
| US5212397A (en) * | 1990-08-13 | 1993-05-18 | Motorola, Inc. | BiCMOS device having an SOI substrate and process for making the same |
| US5406113A (en) * | 1991-01-09 | 1995-04-11 | Fujitsu Limited | Bipolar transistor having a buried collector layer |
| JP3798808B2 (ja) * | 1991-09-27 | 2006-07-19 | ハリス・コーポレーション | 高いアーリー電壓,高周波性能及び高降伏電壓特性を具備した相補型バイポーラトランジスター及びその製造方法 |
| US5389561A (en) * | 1991-12-13 | 1995-02-14 | Sony Corporation | Method for making SOI type bipolar transistor |
| US5326710A (en) * | 1992-09-10 | 1994-07-05 | National Semiconductor Corporation | Process for fabricating lateral PNP transistor structure and BICMOS IC |
| US5416031A (en) * | 1992-09-30 | 1995-05-16 | Sony Corporation | Method of producing Bi-CMOS transistors |
| DE4308958A1 (de) * | 1993-03-21 | 1994-09-22 | Prema Paezisionselektronik Gmb | Verfahren zur Herstellung von Bipolartransistoren |
| US5451532A (en) * | 1994-03-15 | 1995-09-19 | National Semiconductor Corp. | Process for making self-aligned polysilicon base contact in a bipolar junction transistor |
| US5516708A (en) * | 1994-11-17 | 1996-05-14 | Northern Telecom Limited | Method of making single polysilicon self-aligned bipolar transistor having reduced emitter-base junction |
| US5489541A (en) * | 1995-04-14 | 1996-02-06 | United Microelectronics Corporation | Process of fabricating a bipolar junction transistor |
| US5708287A (en) * | 1995-11-29 | 1998-01-13 | Kabushiki Kaisha Toshiba | Power semiconductor device having an active layer |
-
1997
- 1997-03-04 SE SE9700773A patent/SE519628C2/sv not_active IP Right Cessation
- 1997-03-24 TW TW086103707A patent/TW364161B/zh active
-
1998
- 1998-03-03 US US09/033,714 patent/US6140194A/en not_active Expired - Fee Related
- 1998-03-04 CA CA002283396A patent/CA2283396A1/en not_active Abandoned
- 1998-03-04 JP JP53844898A patent/JP2001513945A/ja active Pending
- 1998-03-04 AU AU66443/98A patent/AU6644398A/en not_active Abandoned
- 1998-03-04 CN CN98802982A patent/CN1249848A/zh active Pending
- 1998-03-04 WO PCT/SE1998/000388 patent/WO1998039797A1/en not_active Ceased
- 1998-03-04 EP EP98908408A patent/EP0966757A1/en not_active Withdrawn
- 1998-03-04 KR KR1019997007774A patent/KR20000075706A/ko not_active Ceased
-
1999
- 1999-01-26 US US09/236,619 patent/US6153919A/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI554710B (zh) * | 2015-02-24 | 2016-10-21 | 蔡晉暉 | 手電筒改良結構 |
| TWI655772B (zh) * | 2017-05-05 | 2019-04-01 | 旺宏電子股份有限公司 | 半導體元件 |
| US10256307B2 (en) | 2017-05-08 | 2019-04-09 | Macronix International Co., Ltd. | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2283396A1 (en) | 1998-09-11 |
| EP0966757A1 (en) | 1999-12-29 |
| WO1998039797A1 (en) | 1998-09-11 |
| CN1249848A (zh) | 2000-04-05 |
| JP2001513945A (ja) | 2001-09-04 |
| US6153919A (en) | 2000-11-28 |
| US6140194A (en) | 2000-10-31 |
| SE9700773D0 (sv) | 1997-03-04 |
| KR20000075706A (ko) | 2000-12-26 |
| SE9700773L (sv) | 1998-09-05 |
| SE519628C2 (sv) | 2003-03-18 |
| AU6644398A (en) | 1998-09-22 |
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