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TW346736B - Chemically grafted electrical devices - Google Patents

Chemically grafted electrical devices

Info

Publication number
TW346736B
TW346736B TW084112897A TW84112897A TW346736B TW 346736 B TW346736 B TW 346736B TW 084112897 A TW084112897 A TW 084112897A TW 84112897 A TW84112897 A TW 84112897A TW 346736 B TW346736 B TW 346736B
Authority
TW
Taiwan
Prior art keywords
electrical devices
chemically grafted
grafted electrical
conductive
particles
Prior art date
Application number
TW084112897A
Other languages
English (en)
Inventor
R Crotzer David
G Hanrahan Mark
S Pickles Charles
Original Assignee
Augat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Augat Inc filed Critical Augat Inc
Application granted granted Critical
Publication of TW346736B publication Critical patent/TW346736B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1168—Graft-polymerization

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacture Of Switches (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Multi-Conductor Connections (AREA)
TW084112897A 1994-12-02 1995-12-04 Chemically grafted electrical devices TW346736B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/348,574 US5600099A (en) 1994-12-02 1994-12-02 Chemically grafted electrical devices

Publications (1)

Publication Number Publication Date
TW346736B true TW346736B (en) 1998-12-01

Family

ID=23368606

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084112897A TW346736B (en) 1994-12-02 1995-12-04 Chemically grafted electrical devices

Country Status (8)

Country Link
US (1) US5600099A (zh)
EP (1) EP0795262B1 (zh)
JP (1) JP3691518B2 (zh)
CN (1) CN1085035C (zh)
CA (1) CA2206643C (zh)
DE (1) DE69527851T2 (zh)
TW (1) TW346736B (zh)
WO (1) WO1996017501A1 (zh)

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US5909012A (en) * 1996-10-21 1999-06-01 Ford Motor Company Method of making a three-dimensional part with buried conductors
CA2245413C (en) * 1997-09-16 2001-09-18 Thomas & Betts International, Inc. Conductive elastomer for grafting to an elastic substrate
DE19753082C1 (de) * 1997-11-29 1999-03-04 Preh Elektro Feinmechanik Drehschalter oder -widerstand
US6524115B1 (en) 1999-08-20 2003-02-25 3M Innovative Properties Company Compliant interconnect assembly
US7477120B2 (en) 2001-08-13 2009-01-13 Bose Corporation Transformer shielding
US6574114B1 (en) 2002-05-02 2003-06-03 3M Innovative Properties Company Low contact force, dual fraction particulate interconnect
US7367116B2 (en) * 2003-07-16 2008-05-06 Matsushita Electric Industrial Co., Ltd. Multi-layer printed circuit board, and method for fabricating the same
US7592796B2 (en) * 2004-05-18 2009-09-22 Circuit Check Plate with an indicator for discerning among pre-identified probe holes in the plate
US7887899B2 (en) 2005-08-25 2011-02-15 Sumitomo Electric Industries, Ltd. Anisotropic conductive sheet, production method thereof, connection method and inspection method
US7825512B2 (en) * 2005-09-12 2010-11-02 Hewlett-Packard Development Company, L.P. Electronic package with compliant electrically-conductive ball interconnect
US7624500B2 (en) * 2006-08-16 2009-12-01 Lexmark International, Inc. Printing of multi-layer circuits
EP1983623A1 (en) * 2007-04-18 2008-10-22 Eaton Electric B.V. Cooling arrangement for conductor in electrical installation
US8440012B2 (en) * 2010-10-13 2013-05-14 Rf Micro Devices, Inc. Atomic layer deposition encapsulation for acoustic wave devices
JP5781289B2 (ja) * 2010-10-15 2015-09-16 矢崎総業株式会社 ワイヤハーネス配索構造
TWI449136B (zh) * 2011-04-20 2014-08-11 乾坤科技股份有限公司 金屬芯印刷電路板及電子封裝結構
DE102011101805B4 (de) * 2011-05-17 2016-08-25 Fela Holding Gmbh Schaltungsträger
CN103457022A (zh) * 2012-06-05 2013-12-18 深圳富泰宏精密工业有限公司 天线及其制造方法
US9459285B2 (en) * 2013-07-10 2016-10-04 Globalfoundries Inc. Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assembly
DE102013224765A1 (de) * 2013-12-03 2015-06-03 Robert Bosch Gmbh Verfahren zur Via-Stift-Verfüllung
JP6447475B2 (ja) * 2015-11-30 2019-01-09 オムロン株式会社 接点部材、摺動接点、電気機器、および接点部材の製造方法
US11172717B2 (en) 2017-12-20 2021-11-16 Romed Fasteners, Inc. Magnetic fastener providing electrical connection and having female member with solid cover
US10609967B2 (en) * 2017-12-20 2020-04-07 Romed Fasteners, Inc. Magnetic fasteners providing an electrical connection
US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11128072B1 (en) 2020-07-22 2021-09-21 TE Connectivity Services Gmbh Electrical connector assembly having variable height contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes

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Also Published As

Publication number Publication date
JP3691518B2 (ja) 2005-09-07
CN1167563A (zh) 1997-12-10
CA2206643C (en) 2001-05-22
JPH10510094A (ja) 1998-09-29
EP0795262A4 (en) 1999-11-17
EP0795262A1 (en) 1997-09-17
DE69527851D1 (de) 2002-09-26
WO1996017501A1 (en) 1996-06-06
CA2206643A1 (en) 1996-06-06
DE69527851T2 (de) 2003-04-24
US5600099A (en) 1997-02-04
CN1085035C (zh) 2002-05-15
EP0795262B1 (en) 2002-08-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees