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TW333739B - The method for plating independent conductor circuit - Google Patents

The method for plating independent conductor circuit

Info

Publication number
TW333739B
TW333739B TW086111370A TW86111370A TW333739B TW 333739 B TW333739 B TW 333739B TW 086111370 A TW086111370 A TW 086111370A TW 86111370 A TW86111370 A TW 86111370A TW 333739 B TW333739 B TW 333739B
Authority
TW
Taiwan
Prior art keywords
plating
conductor circuit
independent conductor
layer
protective layer
Prior art date
Application number
TW086111370A
Other languages
English (en)
Inventor
Izuru Yoshizawa
Hiroaki Takahashi
Tomoyuki Kawahara
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21170196A external-priority patent/JP3405640B2/ja
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of TW333739B publication Critical patent/TW333739B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW086111370A 1996-08-09 1997-08-08 The method for plating independent conductor circuit TW333739B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21170196A JP3405640B2 (ja) 1996-08-09 1996-08-09 独立回路へのメッキ方法
JP27910996 1996-10-22

Publications (1)

Publication Number Publication Date
TW333739B true TW333739B (en) 1998-06-11

Family

ID=26518792

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086111370A TW333739B (en) 1996-08-09 1997-08-08 The method for plating independent conductor circuit

Country Status (5)

Country Link
US (1) US6132588A (zh)
CN (1) CN1104832C (zh)
GB (1) GB2321908B (zh)
TW (1) TW333739B (zh)
WO (1) WO1998007302A1 (zh)

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US6479887B1 (en) * 1998-08-31 2002-11-12 Amkor Technology, Inc. Circuit pattern tape for wafer-scale production of chip size semiconductor packages
US6428641B1 (en) 1998-08-31 2002-08-06 Amkor Technology, Inc. Method for laminating circuit pattern tape on semiconductor wafer
US6885868B1 (en) 1999-09-30 2005-04-26 Nortel Networks Limited Fair packet scheduler and scheduling method for packet data radio
US20040007386A1 (en) * 2002-07-11 2004-01-15 S & S Technology Corporation Structure of printed circuit board (PCB)
EP1381260A1 (en) * 2002-07-11 2004-01-14 Ultratera Corporation Method of plating connecting layers on a conductor pattern of a printed circuit board (PCB)
KR20040024381A (ko) * 2002-09-14 2004-03-20 엘지전자 주식회사 인쇄회로기판의 도금방법
JP4195619B2 (ja) * 2003-01-20 2008-12-10 株式会社フジクラ 多層配線板およびその製造方法
DE10329143B4 (de) * 2003-06-27 2005-09-01 Infineon Technologies Ag Elektronisches Modul und Verfahren zur Herstellung desselben
JP4168984B2 (ja) * 2004-06-28 2008-10-22 セイコーエプソン株式会社 配線基板の形成方法
KR100992187B1 (ko) * 2008-08-28 2010-11-04 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
WO2015002483A1 (ko) * 2013-07-03 2015-01-08 주식회사 아모센스 터치 스크린 패널용 터치 센서, 그 제조방법 및 이를 포함하는 터치 스크린 패널
JP6624298B2 (ja) * 2016-09-09 2019-12-25 富士電機株式会社 半導体装置製造方法
CN108174521A (zh) * 2017-12-26 2018-06-15 上海安费诺永亿通讯电子有限公司 一种用于天线和传输线的电子线路板制作工艺
JP7235379B2 (ja) * 2019-06-19 2023-03-08 住友電工デバイス・イノベーション株式会社 電子デバイスの製造方法
CN111356296A (zh) * 2020-02-19 2020-06-30 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） 电路板精密线路的制备方法、电路板精密线路及电路板
CN114390783A (zh) * 2020-10-20 2022-04-22 深南电路股份有限公司 线路板的制作方法及线路板
CN115483329B (zh) * 2022-09-30 2025-10-21 芜湖长信科技股份有限公司 一种Mini LED COG线路结构及其制作方法

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JPS59143149A (ja) * 1983-02-07 1984-08-16 Nippon Telegr & Teleph Corp <Ntt> 感光性導電ペ−スト
JPS60187090A (ja) * 1984-03-07 1985-09-24 株式会社日立製作所 セラミツク基板への部分厚付け金被覆方法
JPS6163088A (ja) * 1984-09-03 1986-04-01 松下電器産業株式会社 スル−ホ−ル配線板の製造方法
US4666818A (en) * 1985-06-10 1987-05-19 The Foxboro Company Method of patterning resist for printed wiring board
JPS62226688A (ja) * 1986-03-27 1987-10-05 神東塗料株式会社 ブリツジ用導電性ペ−スト組成物
JPS62253795A (ja) * 1986-04-25 1987-11-05 Hitachi Ltd 基板上に設けた導体部にめつき層を形成する方法
JPS62296595A (ja) * 1986-06-17 1987-12-23 松下電器産業株式会社 印刷配線回路板の選択めつき方法
US4921777A (en) * 1987-08-03 1990-05-01 Allied-Signal Inc. Method for manufacture of multilayer printed circuit boards
US4897338A (en) * 1987-08-03 1990-01-30 Allied-Signal Inc. Method for the manufacture of multilayer printed circuit boards
US4988412A (en) * 1988-12-27 1991-01-29 General Electric Company Selective electrolytic desposition on conductive and non-conductive substrates
US5106461A (en) * 1989-04-04 1992-04-21 Massachusetts Institute Of Technology High-density, multi-level interconnects, flex circuits, and tape for tab
US5183552A (en) * 1989-09-14 1993-02-02 Schering Aktiengesellschaft Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces
US5252195A (en) * 1990-08-20 1993-10-12 Mitsubishi Rayon Company Ltd. Process for producing a printed wiring board
US5137618A (en) * 1991-06-07 1992-08-11 Foster Miller, Inc. Methods for manufacture of multilayer circuit boards
US5209817A (en) * 1991-08-22 1993-05-11 International Business Machines Corporation Selective plating method for forming integral via and wiring layers
JPH0575273A (ja) * 1991-09-18 1993-03-26 Toshiba Corp 回路基板
JP2680234B2 (ja) * 1992-11-12 1997-11-19 株式会社日立製作所 配線パターン形成方法
US5725807A (en) * 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
JPH0756336A (ja) * 1993-06-07 1995-03-03 Ajinomoto Co Inc 樹脂組成物
JPH077264A (ja) * 1993-06-15 1995-01-10 Nec Toyama Ltd 印刷配線板の製造方法
US5863405A (en) * 1994-05-18 1999-01-26 Polyplastics Co., Ltd. Process for forming conductive circuit on the surface of molded article
JPH08330710A (ja) * 1995-06-05 1996-12-13 Nippon Paint Co Ltd プリント配線板電極部の金属めっき加工方法
EP0762813A1 (en) * 1995-08-25 1997-03-12 Macdermid Incorporated Method for the manufacture of printed circuit boards

Also Published As

Publication number Publication date
GB9807238D0 (en) 1998-06-03
US6132588A (en) 2000-10-17
WO1998007302A1 (en) 1998-02-19
GB2321908B (en) 2000-08-30
GB2321908A (en) 1998-08-12
CN1104832C (zh) 2003-04-02
CN1198873A (zh) 1998-11-11

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