TW202542516A - Device, concentrating measuring apparatus including the same, and concentration measuring method using the same - Google Patents
Device, concentrating measuring apparatus including the same, and concentration measuring method using the sameInfo
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Description
本發明係關於切換是否讓電流在一對電極間流通之際的屬於閘極電極的電壓值之閾值電壓Vth會依據被檢流體中的被檢測對象的濃度而變化之器件,更具體地說,係關於根據如此的閾值電壓Vth的變化來測定被檢流體中的被檢測對象的濃度之濃度測定裝置及濃度測定方法。This invention relates to a device in which the threshold voltage Vth of the gate electrode, which controls whether current flows between a pair of electrodes, varies depending on the concentration of the test object in the tested fluid. More specifically, it relates to a concentration measuring apparatus and method for measuring the concentration of the test object in the tested fluid based on such a change in threshold voltage Vth .
在即將到來的超智慧社會Society 5.0中,以兼顧經濟發展及社會課題的解決為目標,支持著此目標之IoT(物聯網)中,必須要有用來取得資料之感測器。In the upcoming super-smart society, Society 5.0, which aims to balance economic development and the resolution of social issues, the Internet of Things (IoT) that supports this goal must have useful sensors to acquire data.
過去,檢測檢體液中有無被檢測對象及濃度之方法,已知的有使用半導體之電化學感測器。例如,專利文獻1、2中揭示了場效電晶體(FET:Field Effect Transistor)構造的感測器。In the past, known methods for detecting the presence and concentration of the analyte in a sample fluid included electrochemical sensors using semiconductors. For example, patents 1 and 2 disclose sensors constructed using field-effect transistors (FETs).
如此的FET構造的感測器100係如圖5所示,在基板101上形成有閘極電極102,並以覆蓋該閘極電極102的型態形成有絕緣膜103。另外,在絕緣膜103上形成有半導體層104,並且以與半導體層104接觸的型態形成有汲極電極105及源極電極106。As shown in FIG5, the sensor 100 with such a FET structure has a gate electrode 102 formed on a substrate 101, and an insulating film 103 formed to cover the gate electrode 102. In addition, a semiconductor layer 104 is formed on the insulating film 103, and a drain electrode 105 and a source electrode 106 are formed in contact with the semiconductor layer 104.
此外,可如圖5所示,單獨地以覆蓋閘極電極102的型態設置感應膜107,或者,可將絕緣膜103用作為感應膜。感應膜107可選擇性地檢測檢體液中的被檢測對象。而且,因為閘極電壓的閾值電壓Vth會依據吸附於感應膜107或滲入到感應膜107內部等之被檢測對象的量而變化,所以可藉由在使檢體液與感應膜107接觸的狀態下量測閘極電壓的閾值電壓Vth,來測出檢體液中的被檢測對象的濃度。Furthermore, as shown in Figure 5, the sensing membrane 107 can be provided separately in the form of covering the gate electrode 102, or the insulating membrane 103 can be used as the sensing membrane. The sensing membrane 107 can selectively detect the analyte in the sample fluid. Moreover, since the threshold voltage Vth of the gate voltage varies depending on the amount of the analyte adsorbed on or penetrating into the sensing membrane 107, the concentration of the analyte in the sample fluid can be measured by measuring the threshold voltage Vth of the gate voltage while the sample fluid is in contact with the sensing membrane 107.
如此使用半導體之感測器因為高靈敏度且小型,所以可做到微量檢測,並可做成可攜帶的檢測裝置。再者,由於使用的是半導體,所以檢測結果是以電氣訊號的型態輸出,因而與通訊機器的相容性高,也可用於在遠端的測定。[先前技術文獻][專利文獻]Because of their high sensitivity and small size, semiconductor sensors can perform micro-detection and can be made into portable detection devices. Furthermore, since semiconductors are used, the detection results are output as electrical signals, resulting in high compatibility with communication devices and enabling remote measurement. [Previous Art Documents][Patent Documents]
[專利文獻1] 日本特開2011-043420號公報[專利文獻2] 日本特開2012-122749號公報[Patent Document 1] Japanese Patent Application Publication No. 2011-043420 [Patent Document 2] Japanese Patent Application Publication No. 2012-122749
[發明所欲解決之課題]專利文獻1、2係採用使含有銦(In)及鋅(Zn)之氧化物中包含有鎵(Ga)、鋁(Al)、鐵(Fe)等而成的氧化物半導體,特別是含有In、Ga、Zn之氧化物半導體(以下稱為「InGaZnO」)來作為半導體層104。在以往係大多是採用結晶矽(silicon)來作為半導體層104。[Problem to be Solved by the Invention] Patents 1 and 2 use oxide semiconductors containing indium (In) and zinc (Zn) with gallium (Ga), aluminum (Al), and iron (Fe) as the semiconductor layer 104, especially oxide semiconductors containing In, Ga, and Zn (hereinafter referred to as "InGaZnO"). In the past, crystalline silicon was mostly used as the semiconductor layer 104.
然而,採用結晶矽之情況,對於可見光來說並不是透明的,而且不能彎折,因而有用途受到限制之問題。此外,OFF電流(閘極電壓低於閾值電壓Vth時從汲極電極流到源極電極之洩漏電流)為約1.0×10-12A/μm至1.0×10-7A/μm之較大的值,因而在測定時會成為雜訊(noise)而影響測定,會有難以做到微量檢測之缺點。However, when using crystalline silicon, it is not transparent to visible light and cannot be bent, thus limiting its applications. In addition, the OFF current (the leakage current from the drain to the source when the gate voltage is below the threshold voltage Vth ) is a relatively large value of about 1.0× 10⁻¹² A/μm to 1.0× 10⁻⁷ A/μm, which will become noise during measurement and affect the measurement, making it difficult to achieve micro-scale detection.
另一方面,InGaZnO對於可見光來說是透明的,且具有可撓性,因而沒有用途受到限制的情形。OFF電流也為約1.0×10-16A/μm至1.0×10-11A/μm之比結晶矽小的值,在測定時成為雜訊之影響也較小。On the other hand, InGaZnO is transparent to visible light and flexible, thus its applications are not limited. The OFF current is also much smaller than that of crystalline silicon, ranging from about 1.0 × 10⁻¹⁶ A/μm to 1.0 × 10⁻¹¹ A/μm, and its influence as noise during measurement is also smaller.
然而,InGaZnO的場效遷移率(field effect mobility)為約10cm2/Vs之低值,因而沒有使汲極-源極間電壓VDS夠大的話,就難以精度良好地檢測閾值電壓Vth的變化。However, the field effect mobility of InGaZnO is a low value of about 10 cm² /Vs. Therefore, without a sufficiently large drain-source voltage VDS , it is difficult to accurately detect changes in the threshold voltage Vth .
本發明係有鑑於如此的現況,而以提供可用於即使被檢流體中的被檢測對象很微量也可高靈敏度地檢測閾值電壓Vth,且可迅速測定被檢流體中的被檢測對象的濃度之濃度測定裝置及濃度測定方法中之器件為目的。[解決課題之手段]In view of the current situation, this invention aims to provide a device and method for concentration measurement that can detect the threshold voltage V <sub>th </sub> with high sensitivity even when the amount of the analyte in the tested fluid is very small, and can quickly determine the concentration of the analyte in the tested fluid. [Means of Solving the Problem]
本發明係為了解決如上述的先前技術面臨的課題而發明者,本發明之器件及具備該器件之濃度測定裝置以及使用該器件之濃度測定方法係包含如以下所述構成者。This invention was made to solve the problems faced by the prior art as described above. The device of this invention, the concentration measuring apparatus having the device, and the concentration measuring method using the device are comprised as described below.
[1] 一種器件,係具有:絕緣基板;形成於該絕緣基板上之閘極電極;以與前述閘極電極絕緣的狀態形成於該閘極電極上之至少一個絕緣複合層;以及可保持被檢流體之儲存部,前述絕緣複合層係具有一對電極以及與該一對電極接觸之半導體層,前述半導體層係由含有銦(In)元素、鋅(Zn)元素及添加元素(X)之氧化物所構成,前述添加元素(X)係包含從鉭(Ta)、鍶(Sr)及鈮(Nb)選出的至少一種元素,在前述絕緣複合層與前述儲存部之間具備有感應膜,該感應膜係對於前述被檢流體中的被檢測對象有選擇性。[1] A device comprising: an insulating substrate; a gate electrode formed on the insulating substrate; at least one insulating composite layer formed on the gate electrode in a state of being insulated from the gate electrode; and a storage portion for holding a tested fluid, wherein the insulating composite layer has a pair of electrodes and a semiconductor layer in contact with the pair of electrodes, and the semiconductor layer is composed of an indium-containing... The composite material is composed of oxides of elements (In), zinc (Zn), and additive element (X), wherein the additive element (X) includes at least one element selected from tantalum (Ta), strontium (Sr), and niobium (Nb). A sensing film is provided between the insulating composite layer and the storage portion, and the sensing film is selective for the analyte in the tested fluid.
[2] 如[1]所述的器件,其中,前述感應膜為離子載體(ionophore)。[2] The device as described in [1], wherein the aforementioned sensing film is an ionophore.
[3] 如[1]所述的器件,其中,前述感應膜為脂質膜(lipid membrane)。[3] The device as described in [1], wherein the aforementioned sensing membrane is a lipid membrane.
[4] 如[1]所述的器件,其中,前述感應膜為核酸探針(nucleic acid probe)。[4] The device as described in [1], wherein the aforementioned sensing membrane is a nucleic acid probe.
[5] 如[1]至[4]中任一項所述的器件,其中,在前述絕緣基板與前述閘極電極之間更具備有絕緣膜。[5] The device as described in any of [1] to [4], wherein an insulating film is further provided between the aforementioned insulating substrate and the aforementioned gate electrode.
[6] 如[1]至[5]中任一項所述的器件,其中,前述半導體層的場效遷移率係在20cm2/Vs以上。[6] The device as described in any of [1] to [5], wherein the field-effect mobility of the aforementioned semiconductor layer is above 20 cm² /Vs.
[7] 如[1]至[6]中任一項所述的器件,其中,前述半導體層的前述一對電極間的OFF電流係在1×10-12A以下。[7] The device as described in any of [1] to [6], wherein the OFF current between the aforementioned pair of electrodes of the aforementioned semiconductor layer is less than 1 × 10⁻¹² A.
[8] 一種濃度測定裝置,係具備有:如[1]至[7]中任一項所述的器件,以及控制裝置,前述控制裝置係具有:電壓施加手段,係使施加於前述一對電極之中電流流入側的電極與前述閘極電極之間之電壓變動;電流測定手段,係測出在前述一對電極間流通的電流;閾值電壓檢測手段,係根據利用前述電壓施加手段而施加的電壓值及利用前述電流測定手段而測出的電流值,檢測出在切換是否讓電流在前述一對電極間流通之際的屬於前述閘極電極的電壓值之閾值電壓Vth;以及濃度算出手段,係根據利用前述閾值電壓檢測手段而檢測出的閾值電壓Vth,算出前述被檢流體中的被檢測對象的濃度。[8] A concentration measuring device comprising: a device as described in any one of [1] to [7], and a control device comprising: a voltage applying means for changing the voltage between the current-flow-side electrode of the pair of electrodes and the gate electrode; a current measuring means for measuring the current flowing between the pair of electrodes; and a threshold voltage detecting means for detecting, based on the voltage value applied by the voltage applying means and the current value measured by the current measuring means, a threshold voltage Vth belonging to the voltage value of the gate electrode at the time of switching whether to allow current to flow between the pair of electrodes. ; and the concentration calculation method is to calculate the concentration of the object to be tested in the fluid to be tested based on the threshold voltage V th detected by the aforementioned threshold voltage detection method.
[9] 一種濃度測定方法,係使用如[1]至[7]中任一項所述的器件來檢測被檢流體中的被檢測對象的濃度,該濃度測定方法係包括:檢測出在切換是否讓電流在前述一對電極間流通之際的屬於前述閘極電極的電壓值之閾值電壓Vth,根據該閾值電壓Vth來測定前述被檢流體中的被檢測對象的濃度。[發明的效果][9] A concentration measurement method, which uses a device as described in any one of [1] to [7] to detect the concentration of a test object in a test fluid, the concentration measurement method comprising: detecting a threshold voltage Vth of the voltage value belonging to the gate electrode when switching whether current flows between the aforementioned pair of electrodes, and measuring the concentration of the test object in the test fluid based on the threshold voltage Vth . [Effects of the Invention]
根據本發明,採用含有銦(In)元素、鋅(Zn)元素及添加元素(X)之氧化物來作為半導體層,其中添加元素(X)為從鉭(Ta)、鍶(Sr)及鈮(Nb)選出的至少一種元素,藉此可減小OFF電流,且可使場效遷移率比採用以往的氧化物半導體的情況大,因而可得到即使被檢流體中的被檢測對象很微量也可高靈敏度地檢測閾值電壓Vth之器件。According to the present invention, an oxide containing indium (In), zinc (Zn) and an additive element (X) is used as the semiconductor layer, wherein the additive element (X) is at least one element selected from tantalum (Ta), strontium (Sr) and niobium (Nb). This reduces the OFF current and increases the field-effect mobility compared to conventional oxide semiconductors. As a result, a device can be obtained that can detect the threshold voltage Vth with high sensitivity even when the amount of the analyte in the detected fluid is very small.
再者,使用如此的器件,而可得到即使被檢流體中的被檢測對象很微量也可迅速測定被檢流體中的被檢測對象的濃度之濃度測定裝置及濃度測定方法。Furthermore, by using such a device, a concentration measuring apparatus and concentration measuring method can be obtained to quickly measure the concentration of the test object in the test fluid, even if the amount of the test object in the test fluid is very small.
以下,根據圖式來更詳細地說明本發明的實施型態(實施例)。圖1係用來說明本實施型態的濃度測定裝置的構成之示意圖,圖2係用來說明圖1的濃度測定裝置中使用的器件的構成之正面示意圖,圖3係圖2的側面示意圖。The embodiments of the present invention will now be described in more detail with reference to the figures. Figure 1 is a schematic diagram illustrating the configuration of the concentration measuring device of the present embodiment, Figure 2 is a front view illustrating the configuration of the device used in the concentration measuring device of Figure 1, and Figure 3 is a side view of Figure 2.
如圖1所示,本實施型態的濃度測定裝置50係具備有器件10及控制裝置60,器件10係具有:絕緣基板12、閘極電極層13、至少一個絕緣複合層14及可保持作為被檢流體的檢體液L之儲液部16。As shown in Figure 1, the concentration measuring device 50 of this embodiment includes a device 10 and a control device 60. The device 10 includes an insulating substrate 12, a gate electrode layer 13, at least one insulating composite layer 14, and a storage section 16 for holding the test liquid L, which is the test fluid.
如圖2、3所示構成之器件10可為例如場效電晶體(FET)、金屬氧化物半導體場效電晶體(MOSFET)等之半導體元件。The device 10 configured as shown in Figures 2 and 3 can be a semiconductor device such as a field-effect transistor (FET) or a metal oxide semiconductor field-effect transistor (MOSFET).
閘極電極層13係具有形成於絕緣基板12上之閘極電極131以及絕緣膜132。在本實施型態中,在絕緣基板12與閘極電極131之間係設有防止各種氣體及水蒸氣等的侵入之絕緣膜12a,但亦可直接在絕緣基板12上形成閘極電極131。The gate electrode layer 13 has a gate electrode 131 and an insulating film 132 formed on the insulating substrate 12. In this embodiment, an insulating film 12a is provided between the insulating substrate 12 and the gate electrode 131 to prevent the intrusion of various gases and water vapors, but the gate electrode 131 can also be formed directly on the insulating substrate 12.
絕緣複合層14係具有一對電極(第一電極141及第二電極142)以及與一對電極141、142接觸之半導體層144。The insulating composite layer 14 has a pair of electrodes (first electrode 141 and second electrode 142) and a semiconductor layer 144 in contact with the pair of electrodes 141 and 142.
儲液部16只要是可保持檢體液L之構成即可,並沒有特別的限制,惟在本實施型態中,為了將檢體液L保持成檢體液L會與後述的感應膜18接觸,而以設成圍繞感應膜18的型態之隔間部16a來構成儲液部16。The liquid storage section 16 is only required to hold the sample liquid L and there are no particular restrictions. However, in this embodiment, in order to keep the sample liquid L in contact with the sensing membrane 18 described later, the liquid storage section 16 is configured as a partition section 16a surrounding the sensing membrane 18.
本實施型態雖然構成為以作為被檢流體之含有被檢測對象之檢體液L儲存於儲液部16的狀態進行測定,來測出檢體液L中含有的被檢測對象的濃度之構成,但亦可構成為例如設置可儲存氣體之儲存部來替代儲液部16,且以作為被檢流體之含有被檢測對象之氣體儲存於儲存部之狀態進行測定,來測出氣體中含有的被檢測對象的濃度之構成。Although this embodiment is configured to measure the concentration of the test object contained in the test liquid L by storing the test liquid L in the liquid storage unit 16 as the test fluid, it can also be configured to replace the liquid storage unit 16 by providing a gas storage unit, and measure the concentration of the test object contained in the gas by storing the gas containing the test object in the storage unit as the test fluid.
另外,在絕緣複合層14與儲液部16之間具備有感應膜18。感應膜18係對於檢體液L中的被檢測對象具有選擇性。具體而言,具有選擇性地讓被檢測對象的離子穿透,或選擇性地捕捉被檢測對象的構成成分(例如核酸)之性質。如此的感應膜18可採用例如鋰離子載體、鉀離子載體、鈉離子載體、鈣離子載體、銨(ammonium)離子載體、氯化物離子用離子載體、鎂離子載體等之離子載體,也可採用脂質膜或核酸探針。Furthermore, a sensing membrane 18 is provided between the insulating composite layer 14 and the liquid storage portion 16. The sensing membrane 18 is selective for the analyte in the sample solution L. Specifically, it has the property of selectively allowing ions of the analyte to penetrate or selectively capturing the constituent components of the analyte (e.g., nucleic acids). Such a sensing membrane 18 can be an ion carrier such as a lithium ion carrier, potassium ion carrier, sodium ion carrier, calcium ion carrier, ammonium ion carrier, chloride ion carrier, magnesium ion carrier, etc., or it can be a lipid membrane or a nucleic acid probe.
如此的感應膜18的製造方法並沒有特別的限制,在採用例如離子載體之情況,可按照如以下所述的步驟來製作。首先,在燒杯內秤量聚氯乙烯。此處,從處理(handling)的容易化及順利貼合到絕緣複合層14的觀點來說,聚氯乙烯以採用聚合度約1050者較佳。There are no particular limitations on the manufacturing method of such a sensing film 18. When using, for example, an ion carrier, it can be manufactured according to the steps described below. First, weigh polyvinyl chloride (PVC) in a beaker. Here, from the viewpoint of ease of handling and smooth bonding to the insulating composite layer 14, it is preferable to use PVC with a degree of polymerization of approximately 1050.
接著,添加四氫呋喃(tetrahydrofuran)到燒杯作為溶劑,並用攪拌器攪拌到聚氯乙烯溶解為止。Next, add tetrahydrofuran to the beaker as a solvent and stir with a stirrer until the polyvinyl chloride is dissolved.
聚氯乙烯溶解之後,添加塑化劑、離子載體,並且若被檢測對象為陽離子時添加陰離子排除劑,若被檢測對象為陰離子時添加陽離子排除劑,並再用攪拌棒攪拌。After the polyvinyl chloride is dissolved, plasticizer and ion carrier are added. If the object being tested is cationic, anion scavenger is added; if the object being tested is anionic, a cation scavenger is added. Then, stir with a stirring rod.
塑化劑可採用例如2-硝基苯辛醚(NPOE)、雙(2-乙基己基)癸二酸酯(bis(2-ethylhexyl) sebacate)等。陰離子排除劑可採用例如四(4-氯苯基)硼酸钾(tetrakis(4-chlorophenyl)boron potassium)等,陽離子排除劑可採用三(十二烷基)甲基氯化铵(TDDMACl)等。Plasticizers such as 2-nitrophenyl octyl ether (NPOE) and bis(2-ethylhexyl) sebacate can be used. Anion scavengers such as tetrakis(4-chlorophenyl)boron potassium can be used, and cation scavengers such as tris(dodecyl)methylammonium chloride (TDDMACl) can be used.
離子載體可依據被檢測對象的離子而適當地選擇,例如,在想要檢測鋰離子(Li+)的情況可採用二苄基-14-冠-4 (dibenzyl-14-crown-4)或TTD-14-冠-4,在想要檢測鉀離子(K+)的情況可採用雙(苯并-15-冠-5) (bis(benzo-15-crown-5)),在想要檢測鈉離子(Na+)的情況可採用雙(12-冠-4),在想要檢測鈣離子(Ca2+)的情況可採用HDOPP-Ca,在想要檢測銨離子(NH4 +)的情況可採用壬醇,在想要檢測氯化物離子(Cl-)的情況可採用Bisthiourea-1,在想要檢測鎂離子(Mg2+)的情況可採用C14-K22B5或K22B1B5、K22B9。The ion support can be appropriately selected according to the ions of the analyte. For example, dibenzyl-14-crown-4 or TTD-14-crown-4 can be used to detect lithium ions (Li + ), bis(benzo-15-crown-5) can be used to detect potassium ions (K + ), bis(12-crown-4) can be used to detect sodium ions (Na + ), HDOPP-Ca can be used to detect calcium ions (Ca2 + ), and ammonium ions (NH4+) can be used to detect ammonium ions ( NH4 +). For the detection of chloride ions ( Cl- ), nonanol can be used; for the detection of magnesium ions (Mg2+), Bisthiourea-1 can be used; and for the detection of magnesium ions (Mg2 + ), C14-K22B5, K22B1B5, or K22B9 can be used.
接著,將經此調製出的溶液攤平在玻璃培養皿上風乾,就可製作出感應膜18。從更加快響應速度(離子擴散平衡之成立)的觀點來說,感應膜18做得越薄效果越好,惟以旋轉塗覆法(spin coating)來製作感應膜18較佳。Next, the prepared solution is spread evenly on a glass petri dish and air-dried to produce the sensing membrane 18. From the perspective of accelerating the response speed (establishing ion diffusion equilibrium), the thinner the sensing membrane 18 is, the better. However, it is better to use the spin coating method to produce the sensing membrane 18.
將如此製作出的感應膜18切成適當的大小,並以不會夾雜空氣的方式貼在絕緣複合層14上,然後使用例如環氧樹脂將儲液部16接著在此貼好的感應膜18上,就可製作出器件10。The sensing film 18, which is thus made, is cut to an appropriate size and attached to the insulating composite layer 14 in a way that does not trap air. Then, the liquid storage part 16 is attached to the sensing film 18 using, for example, epoxy resin, to make the device 10.
絕緣複合層14至少在與感應膜18接觸的部位具備有絕緣膜146。絕緣膜146也具有作為保護半導體層144使之不會接觸到檢體液L之保護層的作用。藉由設置絕緣膜146,可防止半導體層144受到腐蝕等,提高半導體層144的耐久性及可靠性。絕緣膜146的材質只要是具有絕緣性者即可,可採用公知的材料,且以具有耐腐食性者較佳。具有絕緣性的材料有Ta2O5、Si3N4、SiO2等,其厚度以在0.01μm以上0.5μm以下較佳,在0.03μm以上0.2μm以下更佳。The insulating composite layer 14 has an insulating film 146 at least in the area that contacts the sensing membrane 18. The insulating film 146 also serves as a protective layer to prevent the semiconductor layer 144 from contacting the sample fluid L. By providing the insulating film 146, corrosion and other damage to the semiconductor layer 144 can be prevented, thereby improving the durability and reliability of the semiconductor layer 144. The insulating film 146 can be made of any insulating material, and known materials can be used, with those having corrosion resistance being preferred. Materials with insulating properties include Ta₂O₅ , Si₃N₄ , and SiO₂ , with a thickness preferably between 0.01μm and 0.5μm, and even better between 0.03μm and 0.2μm.
半導體層144的場效遷移率以在20cm2/Vs以上較佳,尤其以60cm2/Vs以上更佳。The field-effect mobility of semiconductor layer 144 is preferably above 20 cm² /Vs, especially above 60 cm² /Vs.
另外,半導體層144在如上述構成的器件10中,在施加於閘極電極131的電壓小於閾值電壓Vth時屬於從第一電極141流到第二電極142的電流或是從第二電極142流到第一電極141的電流之OFF電流以在1×10-12A以下較佳,在特別是1×10-14A以下更佳。如上述OFF電流小,因此在如後述地檢測閾值電壓Vth之際,即使施加於第一電極141與第二電極142之間的電壓小也可更高精度地檢測出閾值電壓Vth。Furthermore, in the device 10 configured as described above, the OFF current of semiconductor layer 144, which is the current flowing from the first electrode 141 to the second electrode 142 or from the second electrode 142 to the first electrode 141 when the voltage applied to the gate electrode 131 is less than the threshold voltage Vth , is preferably less than 1× 10⁻¹² A, and more preferably less than 1× 10⁻¹⁴ A. Because the OFF current is small, the threshold voltage Vth can be detected with higher accuracy even when the voltage applied between the first electrode 141 and the second electrode 142 is small, as described later .
如此的半導體層144係由含有銦(In)元素、鋅(Zn)元素及添加元素(X)之氧化物所構成,且添加元素(X)為從鉭(Ta)、鍶(Sr)及鈮(Nb)選出的至少一種元素。Such a semiconductor layer 144 is composed of an oxide containing indium (In), zinc (Zn) and an additive element (X), wherein the additive element (X) is at least one element selected from tantalum (Ta), strontium (Sr) and niobium (Nb).
具體而言,關於In及X,以滿足以下的式(1)所表示的原子比較佳(式中的X為前述添加元素的含有比的總和,此在以下的式(2)及(3)中也相同)。0.4≦(In+X)/(In+Zn+X)≦0.8 …(1)關於Zn,以滿足以下的式(2)所表示的原子比較佳。0.2≦Zn/(In+Zn+X)≦0.6 …(2)關於X,以滿足以下的式(3)所表示的原子比較佳。0.001≦X/(In+Zn+X)≦0.015 …(3)Specifically, for In and X, the atomic ratio expressed by the following formula (1) is preferred (where X is the sum of the contents of the aforementioned added elements, which is also the case in formulas (2) and (3) below). 0.4≦(In+X)/(In+Zn+X)≦0.8 …(1) For Zn, the atomic ratio expressed by the following formula (2) is preferred. 0.2≦Zn/(In+Zn+X)≦0.6 …(2) For X, the atomic ratio expressed by the following formula (3) is preferred. 0.001≦X/(In+Zn+X)≦0.015 …(3)
In、Zn及X的原子比滿足式(1)至式(3),半導體層144就會確實地表現出如上述的場效遷移率及OFF電流If the atomic ratios of In, Zn, and X satisfy equations (1) to (3), then semiconductor layer 144 will indeed exhibit the field-effect mobility and OFF current described above.
為了使半導體層144表現出更高的場效遷移率,更低的OFF電流,使In、Zn及X的原子比滿足式(1-2)、式(2-2)、式(3-2)為更佳。0.43≦(In+X)/(In+Zn+X)≦0.79 …(1-2)0.21≦Zn/(In+Zn+X)≦0.57 …(2-2)0.0015≦X/(In+Zn+X)≦0.013 …(3-2)To achieve higher field-effect mobility and lower OFF current in semiconductor layer 144, the atomic ratios of In, Zn, and X are optimized to satisfy equations (1-2), (2-2), and (3-2). 0.43≦(In+X)/(In+Zn+X)≦0.79 …(1-2) 0.21≦Zn/(In+Zn+X)≦0.57 …(2-2) 0.0015≦X/(In+Zn+X)≦0.013 …(3-2)
使In、Zn及X的原子比滿足式(1-3)、式(2-3)、式(3-3)為更佳。0.48≦(In+X)/(In+Zn+X)≦0.78 …(1-3)0.22≦Zn/(In+Zn+X)≦0.52 …(2-3)0.002<X/(In+Zn+X)≦0.012 …(3-3)The atomic ratios of In, Zn, and X should satisfy equations (1-3), (2-3), and (3-3) to be optimal. 0.48≦(In+X)/(In+Zn+X)≦0.78 …(1-3) 0.22≦Zn/(In+Zn+X)≦0.52 …(2-3) 0.002<X/(In+Zn+X)≦0.012 …(3-3)
使In、Zn及X的原子比滿足式(1-4)、式(2-4)、式(3-4)為更佳。0.53≦(In+X)/(In+Zn+X)≦0.75 …(1-4)0.25≦Zn/(In+Zn+X)≦0.47 …(2-4)0.0025≦X/(In+Zn+X)≦0.010 …(3-4)The atomic ratios of In, Zn, and X are preferred to satisfy equations (1-4), (2-4), and (3-4). 0.53≦(In+X)/(In+Zn+X)≦0.75 …(1-4) 0.25≦Zn/(In+Zn+X)≦0.47 …(2-4) 0.0025≦X/(In+Zn+X)≦0.010 …(3-4)
使In、Zn及X的原子比滿足式(1-5)、式(2-5)、式(3-5)為更佳。0.58≦(In+X)/(In+Zn+X)≦0.70 …(1-5)0.30≦Zn/(In+Zn+X)≦0.42 …(2-5)0.003≦X/(In+Zn+X)≦0.009 …(3-5)The atomic ratios of In, Zn, and X are preferred to satisfy equations (1-5), (2-5), and (3-5). 0.58≦(In+X)/(In+Zn+X)≦0.70 …(1-5) 0.30≦Zn/(In+Zn+X)≦0.42 …(2-5) 0.003≦X/(In+Zn+X)≦0.009 …(3-5)
添加元素(X)如上述採用從Ta、Sr及Nb選出的至少一種以上。可單獨採用此等元素的任一種,亦可組合兩種以上而使用。另外,添加元素(X)亦可包含Ta、Sr及Nb以外的元素,但較佳為只包含此等元素。The added element (X) uses at least one of the elements selected from Ta, Sr, and Nb as described above. Any one of these elements may be used alone, or in combination of two or more. Additionally, the added element (X) may also contain elements other than Ta, Sr, and Nb, but it is preferable to contain only these elements.
另外,半導體層144的厚度由於越薄表層的導電率的變化會越變大,因此如後述移動之電荷的變化會變大,測定精度會提高。如此的半導體層144的厚度以在0.5μm以下較佳,在0.1μm以下更佳,在0.05μm以下特佳。半導體層144的厚度的下限值並沒有特別的規定,但一般係在0.005μm以上。Furthermore, the thinner the semiconductor layer 144, the greater the change in surface conductivity, thus increasing the variation in moving charges as described later, and improving measurement accuracy. A thickness of less than 0.5 μm is preferred, less than 0.1 μm is even better, and less than 0.05 μm is ideal. There is no specific lower limit for the thickness of the semiconductor layer 144, but it is generally above 0.005 μm.
另外,半導體層144的感應膜18側的表面144a以儘可能地平滑較佳。半導體層144的表面144a若不平滑,就會發生例如在與絕緣膜146之間產生間隙,或絕緣膜146不連續地形成的情形,導致絕緣膜146與感應膜18的密著性降低,就無法正確地掌握來自感應膜18的電位變化。因此,測定精度會降低,或是動作會變得不穩定。Furthermore, the surface 144a of the sensing film 18 side of the semiconductor layer 144 should be as smooth as possible. If the surface 144a of the semiconductor layer 144 is not smooth, gaps may occur between it and the insulating film 146, or the insulating film 146 may be discontinuously formed, resulting in reduced adhesion between the insulating film 146 and the sensing film 18. Consequently, it will be impossible to accurately measure potential changes from the sensing film 18. Therefore, measurement accuracy will decrease, or the operation will become unstable.
具體而言,半導體層144的表面144a的最大高度Sz以在0.05μm以下較佳,在0.01μm以下更佳,在0.003μm以下最佳。此最大高度Sz的下限值並沒有特別的規定,但一般係在0.0005μm以上。另外,半導體層144的感應膜18側的表面144a的算術平均高度Sa以在0.03μm以下較佳,在0.005μm以下更佳,在0.002μm以下最佳。此算術平均高度Sa的下限值並沒有特別的規定,但一般係在0.0002μm以上。Specifically, the maximum height Sz of the surface 144a of the semiconductor layer 144 is preferably below 0.05 μm, more preferably below 0.01 μm, and best of all below 0.003 μm. There is no specific requirement for the lower limit of this maximum height Sz, but it is generally above 0.0005 μm. Furthermore, the arithmetic mean height Sa of the surfaces 144a on the 18 sides of the sensing film 18 of the semiconductor layer 144 is preferably below 0.03 μm, more preferably below 0.005 μm, and best of all below 0.002 μm. There is no specific requirement for the lower limit of this arithmetic mean height Sa, but it is generally above 0.0002 μm.
此處,最大高度Sz及算術平均高度Sa為ISO 25178所規定的表面粗糙度的參數,如此的參數可用例如3D表面粗糙度形狀測定機(Zygo公司製的NexView)等來測定。而且,此情況的測定條件以按照下述方式進行較佳。Here, the maximum height Sz and the arithmetic mean height Sa are surface roughness parameters specified in ISO 25178. Such parameters can be measured using, for example, a 3D surface roughness shape measuring machine (NexView manufactured by Zygo). Moreover, the measurement conditions in this case are preferably performed as follows.
遵循ISO 25178,以對物透鏡50倍,變焦透鏡20倍,測定範圍89μm×87μm之條件進行測定。從所得到的三維表面形狀抽出範圍3μm×3μm的粗糙度曲線,利用附屬於3D表面粗糙度形狀測定機之分析程式「Mx」,以下述的修正條件進行粗糙度曲線的修正,然後算出最大高度Sz及算術平均高度Sa。The measurement was performed according to ISO 25178, using a 50x objective lens, a 20x zoom lens, and a measurement range of 89μm × 87μm. A roughness curve of 3μm × 3μm was extracted from the obtained three-dimensional surface shape. Using the analysis program "Mx" attached to the 3D surface roughness shape measuring machine, the roughness curve was corrected under the following correction conditions. Then, the maximum height Sz and the arithmetic mean height Sa were calculated.
<修正條件>-Remove:Form Remove-Filter Type:Spline-Filter:Low Pass-Type:Gaussian Spline Auto<Correction conditions>-Remove:Form Remove-Filter Type:Spline-Filter:Low Pass-Type:Gaussian Spline Auto
在將如上述的器件10形成為FET構造之情況,可用與過去已知FET及MOSFET等同樣的方法來形成,例如,可使用濺鍍裝置在絕緣基板12上形成導電性金屬薄膜作為第一電極141及第二電極142,接著,使用濺鍍裝置形成如上述構成的氧化物薄膜作為半導體層144。在第一電極141及第二電極142的成膜以及半導體層144的成膜中的圖案化(patterning)中可使用陰影遮罩(shadow mask)。When the device 10 described above is formed as a FET structure, it can be formed using the same methods as known FETs and MOSFETs. For example, a conductive metal thin film can be formed on the insulating substrate 12 using a sputtering apparatus as the first electrode 141 and the second electrode 142. Then, an oxide thin film as described above can be formed using a sputtering apparatus as the semiconductor layer 144. A shadow mask can be used in the patterning of the first electrode 141 and the second electrode 142 and the semiconductor layer 144.
用作為第一電極141及第二電極142之導電性金屬並沒有特別的限制,可使用例如鉬(Mo)或鎢(W)等,亦可使用此等金屬與氧化鈰(CeO2)、銅(Cu)、銀(Ag)等的合金。There are no particular restrictions on the conductive metals used as the first electrode 141 and the second electrode 142. For example, molybdenum (Mo) or tungsten (W) can be used, as well as alloys of these metals with cerium oxide (CeO 2 ), copper (Cu), silver (Ag), etc.
接著,在其上沉積形成陶瓷薄膜而可形成絕緣膜146。具體而言,可使用例如日本SAMCO公司製的PD-2202L等之電漿CVD裝置,以成膜氣體:SiH4/N2O/N2混合氣體,成膜壓力:110Pa,基板溫度250℃至400℃之條件沉積形成SiOx薄膜來形成絕緣膜146。Next, a ceramic thin film is deposited on it to form an insulating film 146. Specifically, a plasma CVD apparatus such as the PD-2202L manufactured by SAMCO Corporation of Japan can be used to deposit a SiOx thin film to form the insulating film 146 under the following conditions: film-forming gas: SiH4 / N2O / N2 mixed gas, film-forming pressure: 110Pa, and substrate temperature: 250°C to 400°C.
本實施型態的濃度測定裝置50的控制裝置60係具備有:用來在第一電極141與第二電極142之間施加電壓之可變電壓源32;用來在第一電極141與閘極電極131之間施加電壓之可變電壓源34(電壓施加手段);用來測定第一電極141與第二電極142之間的電流值之電流計36(電流測定手段);以及用來測定第一電極141與閘極電極131之間的電壓值之電壓計38(電壓測定手段)。The control device 60 of the concentration measuring device 50 in this embodiment includes: a variable voltage source 32 for applying a voltage between the first electrode 141 and the second electrode 142; a variable voltage source 34 (voltage application means) for applying a voltage between the first electrode 141 and the gate electrode 131; a current meter 36 (current measuring means) for measuring the current value between the first electrode 141 and the second electrode 142; and a voltmeter 38 (voltage measuring means) for measuring the voltage value between the first electrode 141 and the gate electrode 131.
控制裝置60係構成為:具有電腦,其具備演算手段及記憶手段、輸出入手段等,根據記憶手段所記憶的程式,進行可變電壓源32及可變電壓源34的施加電壓控制,或進行利用電流計36的電流值測定及利用電壓計38的電壓值測定。The control device 60 is configured to have a computer equipped with calculation means, memory means, input and output means, etc., and to control the applied voltage of the variable voltage source 32 and the variable voltage source 34 according to the program stored in the memory means, or to measure the current value using the ammeter 36 and the voltage value using the voltmeter 38.
控制裝置60更具備有閾值電壓檢測手段62。閾值電壓檢測手段62係構成為:控制可變電壓源32及可變電壓源34所施加的電壓,並且將電流計36及電壓計38所測出的電流值及電壓值作為電氣訊號而接收。如此的閾值電壓檢測手段62可藉由組進控制裝置60中的電腦等而實現。The control device 60 is further equipped with a threshold voltage detection means 62. The threshold voltage detection means 62 is configured to control the voltage applied by the variable voltage source 32 and the variable voltage source 34, and receive the current and voltage values measured by the ammeter 36 and the voltmeter 38 as electrical signals. Such a threshold voltage detection means 62 can be implemented by a computer or the like integrated into the control device 60.
閾值電壓檢測手段62係在利用可變電壓源32在第一電極141與第二電極142之間施加預定的電壓Vds之狀態下,使利用可變電壓源34而施加於第一電極141與閘極電極131之間的電壓Vg慢慢增大。然後,閾值電壓檢測手段62利用電流計36檢測在第一電極141與第二電極142之間流通的電流Id的變化,並且利用電壓計38檢測第一電極141與閘極電極131之間的電壓Vg的變化,藉此來測出閾值電壓Vth。The threshold voltage detection means 62, while applying a predetermined voltage Vds between the first electrode 141 and the second electrode 142 using a variable voltage source 32, gradually increases the voltage Vg applied between the first electrode 141 and the gate electrode 131 using a variable voltage source 34. Then, the threshold voltage detection means 62 uses a current meter 36 to detect the change in the current Id flowing between the first electrode 141 and the second electrode 142, and a voltmeter 38 to detect the change in the voltage Vg between the first electrode 141 and the gate electrode 131, thereby measuring the threshold voltage Vth .
在如上述構成的器件10中,已知閾值電壓Vth會依據存在於感應膜18表面或感應膜18內部之被檢測對象的量而變化。因此,可藉由檢測該閾值電壓Vth,而檢測檢體液L中含有的被檢測對象的濃度。In the device 10 configured as described above, it is known that the threshold voltage Vth varies depending on the amount of the analyte present on or inside the sensing membrane 18. Therefore, the concentration of the analyte in the sample fluid L can be detected by detecting the threshold voltage Vth .
閾值電壓Vth的測定方法並沒有特別的限制,可例如檢測電流Id開始在第一電極141與第二電極142之間流通之際的電壓Vg,亦可從電流Id正在流通的狀態使電壓Vg慢慢減小,然後檢測不再有電流Id流通之際的電壓Vg。雖然可採用使電壓Vg變化而以電流Id到達預定的值(例如1×10-9A)時的Vds的值作為閾值電壓Vth等習知的方法,但從更正確的測定之觀點來說,較佳的為將電壓Vds保持一定,在預定的範圍內施加電壓Vg,並且量測當下流通的電流Id,以最小平方法算出相對於預定的範圍的Vg之√Id的近似直線,然後以該近似直線的√Id=0之際的Vg作為閾值電壓Vth。There are no particular limitations on the method for measuring the threshold voltage Vth . For example, it can be used to detect the voltage Vg when the current Id begins to flow between the first electrode 141 and the second electrode 142, or it can be used to gradually decrease the voltage Vg while the current Id is flowing, and then detect the voltage Vg when the current Id no longer flows. While conventional methods such as varying the voltage Vg and using the value of Vds when the current Id reaches a predetermined value (e.g., 1 × 10⁻⁹ A) as the threshold voltage Vth can be employed, from a more accurate measurement perspective, it is preferable to keep the voltage Vds constant, apply the voltage Vg within a predetermined range, measure the current Id flowing at that time, calculate an approximate straight line of √Id relative to the predetermined range of Vg using the least squares method, and then use the Vg at the point where √Id = 0 of the approximate straight line as the threshold voltage Vth .
圖4係顯示使用本實施型態的濃度測定裝置50進行檢體液L中的被檢測對象的濃度測定之際的被檢測對象的濃度與閾值電壓Vth的關係之圖表。在此測定(實施例)中,係以氯化銨(NH4Cl)水溶液作為檢體液L,以銨離子(NH4 +)作為被檢測對象,以銨離子載體作為感應膜18,並使電壓Vds為1V,使電壓Vg在1.3V至1.5V之預定的範圍內變化而進行測定。Figure 4 is a graph showing the relationship between the concentration of the test subject and the threshold voltage Vth during the concentration measurement of the test subject in the sample solution L using the concentration measuring device 50 of this embodiment. In this measurement (example), an ammonium chloride ( NH4Cl ) aqueous solution is used as the sample solution L, ammonium ions ( NH4 + ) are used as the test subject, an ammonium ion carrier is used as the sensing membrane 18, and the voltage Vds is set to 1V, while the voltage Vg is varied within a predetermined range of 1.3V to 1.5V for measurement.
從圖4可知NH4 +濃度越變高,閾值電壓Vth會越變低。因此,可例如事先製作出表示被檢測對象的濃度與閾值電壓Vth的關係之檢量線,然後根據使用濃度測定裝置50而測出的閾值電壓Vth來求出被檢測對象的濃度。As shown in Figure 4, the higher the NH₄⁺ concentration, the lower the threshold voltage V₁th . Therefore, a calibration curve representing the relationship between the concentration of the tested object and the threshold voltage V₁th can be prepared in advance, and then the concentration of the tested object can be determined based on the threshold voltage V₁th measured using the concentration measuring device 50.
或者,可使被檢測對象的濃度與閾值電壓Vth相對應而作為訓練資料(training data)進行機器學習,然後利用人工智慧(AI)根據使用濃度測定裝置50而測出的閾值電壓Vth來求出被檢測對象的濃度。Alternatively, the concentration of the object being tested can be correlated with a threshold voltage V th and used as training data for machine learning. Then, artificial intelligence (AI) can be used to calculate the concentration of the object being tested based on the threshold voltage V th measured using the concentration measuring device 50.
本實施型態的控制裝置60更具備有濃度算出手段64,且濃度算出手段64係構成為根據閾值電壓檢測手段62所檢測出的閾值電壓Vth而如上述算出被檢測對象的濃度。如此的濃度算出手段64可藉由組進控制裝置60中的電腦等而實現。The control device 60 of this embodiment further includes a concentration calculation means 64, which is configured to calculate the concentration of the detected object as described above based on the threshold voltage Vth detected by the threshold voltage detection means 62. This concentration calculation means 64 can be implemented by a computer or the like integrated into the control device 60.
以上,針對本發明的較佳實施型態進行了說明,但本發明並不限定於此,而是可在未脫離本發明的目的之範圍內做各種變化。The above describes the preferred embodiment of the invention, but the invention is not limited thereto, and various changes can be made without departing from the purpose of the invention.
10:器件12:絕緣基板12a:絕緣膜13:閘極電極層14:絕緣複合層16:儲液部16a:隔間部18:感應膜32:可變電壓源34:可變電壓源36:電流計38:電壓計50:濃度測定裝置60:控制裝置62:閾值電壓檢測手段64:濃度算出手段100:感測器101:基板102:閘極電極103:絕緣膜104:半導體層105:汲極電極106:源極電極107:離子感應膜(感應膜)131:閘極電極132:絕緣膜141:第一電極142:第二電極144:半導體層144a:表面146:絕緣膜10: Device; 12: Insulating substrate; 12a: Insulating film; 13: Gate electrode layer; 14: Insulating composite layer; 16: Liquid storage section; 16a: Spacer section; 18: Sensing film; 32: Variable voltage source; 34: Variable voltage source; 36: Ammeter; 38: Voltmeter; 50: Concentration measuring device; 60: Control device; 62: Threshold voltage detection method; 64: Concentration calculation method 100: Sensor; 101: Substrate; 102: Gate electrode; 103: Insulating film; 104: Semiconductor layer; 105: Drain electrode; 106: Source electrode; 107: Ion sensing film (sensing film); 131: Gate electrode; 132: Insulating film; 141: First electrode; 142: Second electrode; 144: Semiconductor layer; 144a: Surface; 146: Insulating film.
圖1係用來說明本實施型態的濃度測定裝置的構成之示意圖。圖2係用來說明圖1的濃度測定裝置中使用的器件的構成之正面示意圖。圖3係圖2的側面示意圖。圖4係顯示使用圖1的濃度測定裝置進行檢體液L中的被檢測對象的濃度測定之際的被檢測對象的濃度與閾值電壓Vth的關係之圖表。圖5係用來說明以往的FET構造的感測器的構成之示意圖。Figure 1 is a schematic diagram illustrating the configuration of the concentration measuring device of this embodiment. Figure 2 is a front schematic diagram illustrating the configuration of the device used in the concentration measuring device of Figure 1. Figure 3 is a side schematic diagram of Figure 2. Figure 4 is a graph showing the relationship between the concentration of the test object and the threshold voltage Vth when measuring the concentration of the test object in the sample fluid L using the concentration measuring device of Figure 1. Figure 5 is a schematic diagram illustrating the configuration of a conventional FET sensor.
10:器件 10: Devices
12:絕緣基板 12: Insulating substrate
13:閘極電極層 13: Gate electrode layer
14:絕緣複合層 14: Insulating Composite Layer
16:儲液部 16: Liquid Storage Section
32:可變電壓源 32: Variable Voltage Power Supply
34:可變電壓源 34: Variable Voltage Power Supply
36:電流計 36: Ammeter
38:電壓計 38: Voltmeter
50:濃度測定裝置 50: Concentration measuring device
60:控制裝置 60: Control Device
62:閾值電壓檢測手段 62: Threshold Voltage Detection Methods
64:濃度算出手段 64: Concentration Calculation Method
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2023-223220 | 2023-12-28 |
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| TW202542516A true TW202542516A (en) | 2025-11-01 |
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