TW202531325A - Substrate processing device and substrate processing method - Google Patents

Abstract

The present invention relates to a substrate processing device and a substrate processing method for forming a filling layer on a laminated substrate having a plurality of substrates bonded thereto. The substrate processing device (1) comprises: a substrate holding device (2) for holding and rotating a laminated substrate (Ws) bonded thereto with a first substrate (W1) and a second substrate (W2); a spray nozzle (3) for accelerating filling material particles (Fp) constituting a filling layer (L) and spraying the filling material particles (Fp) onto a gap (G) between an edge portion (E1) of the first substrate (W1) and an edge portion (E2) of the second substrate (W2); and a filling material particle supply line (12) connected to the spray nozzle (3) for supplying the filling material particles (Fp) to the spray nozzle (3).

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing apparatus and a substrate processing method for forming a filling layer on a laminated substrate in which a plurality of substrates are bonded.

In recent years, to achieve further densification and enhanced functionality of semiconductor components, development has been underway of three-dimensional packaging technology, which involves three-dimensionally integrating multiple substrates. For example, this technology involves bonding the component surface of a first substrate, where integrated circuits and electrical wiring are formed, to the component surface of a second substrate, where integrated circuits and electrical wiring are also formed. Furthermore, after bonding the first substrate to the second substrate, the second substrate is thinned using a polishing or grinding device. This allows the integrated circuit to be layered perpendicular to the component surfaces of the first and second substrates.

Three-dimensional packaging technology can also be used to bond more than three substrates. For example, a second substrate bonded to a first substrate can be thinned, and then a third substrate bonded to the second substrate can be thinned. This specification refers to this configuration of multiple bonded substrates as a "laminated substrate."

Typically, the edges of substrates are pre-ground into a rounded or chamfered shape to prevent cracking or chipping. When a second substrate having such a shape is ground, a sharp end is formed on the second substrate. This sharp end (hereinafter referred to as the knife edge) is formed by grinding the back surface and outer peripheral surface of the second substrate. This knife edge is prone to chipping due to physical contact, and can damage the laminated substrate itself when transporting the laminated substrate. Furthermore, if the bonding between the first and second substrates is incomplete, the second substrate may also crack during grinding.

Therefore, to prevent cracking or chipping at the blade edge, a filler is applied to the laminate substrate before grinding the second substrate. The filler is applied to the gap between the edges of the first and second substrates. The filler supports the blade edge formed after grinding the second substrate, preventing cracking or chipping.

[Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Application Laid-Open No. 2022-38834

(Problem to be Solved by the Invention) Historically, fillers used to fill the gap between the edges of a first and second substrate consisted of materials and solvents that harden with heat. The process of applying such fillers to a laminate substrate involves applying the filler to the gap between the edges of the first and second substrates, followed by a curing process in which the filler is cured by heat and the solvent contained in the filler is volatilized. This curing process takes a long time, reducing overall process productivity.

Furthermore, if the solvent contained in the filler is not completely removed during the curing process and remains, the remaining solvent components may contaminate the substrate in subsequent steps, potentially adversely affecting the device. Therefore, after thinning the second substrate, a process is required to remove the filler from the laminated substrate.

Therefore, the present invention provides a substrate processing apparatus and a substrate processing method that can suppress cracks and chips in a laminated substrate formed by bonding a plurality of substrates and improve the productivity of a processing procedure.

(Solution) One aspect provides a substrate processing apparatus for forming a filling layer on a laminate substrate comprising a first substrate and a second substrate bonded thereto. The apparatus comprises: a substrate holding device for holding and rotating the laminate substrate; a spray nozzle for accelerating filling material particles constituting the filling layer and spraying the filling material particles onto a gap between an edge portion of the first substrate and an edge portion of the second substrate; and a filling material particle supply line connected to the spray nozzle for supplying the filling material particles to the spray nozzle. In one embodiment, the spray nozzle is a plasma spraying nozzle, in which the heat generated by the plasma accelerates the filler material particles and melts the filler material particles. In another embodiment, the spray nozzle is a flame spraying nozzle, in which the heat generated by a combustion flame accelerates the filler material particles and melts the filler material particles. In another embodiment, the spray nozzle is a de Laval nozzle, in which the filler material particles are accelerated to a speed exceeding the speed of sound.

In one embodiment, the substrate processing apparatus further comprises a heating gas supply line connected to the Laval nozzle for supplying heating gas to the Laval nozzle. The Laval nozzle is configured to heat the filler particles with the heating gas. In another embodiment, the substrate processing apparatus further comprises a vaporization chamber connected to the filler particle supply line for vaporizing a filler material, which is a material of the filler particles. The Laval nozzle is configured to accelerate the filler particles formed from the vaporized filler material and spray the filler particles onto the gap. In one embodiment, the substrate processing apparatus further comprises a suspension generating device connected to the filler particle supply line for dispersing the filler particles in a liquid to generate a suspension containing the filler particles. The spray nozzle is configured to accelerate the suspension and spray the suspension onto the gap. In another embodiment, the substrate processing apparatus further comprises an aerosol chamber connected to the filler particle supply line for aerosolizing the filler particles. The spray nozzle is configured to accelerate the aerosolized filler particles and spray the aerosolized filler particles onto the gap.

In one embodiment, the substrate processing apparatus further comprises a rocking mechanism for rocking the laminated substrate or the spray nozzle about a designated rocking center. In another embodiment, the substrate processing apparatus further comprises a moving mechanism for moving the laminated substrate or the spray nozzle in a thickness direction of the laminated substrate. In one embodiment, the substrate processing apparatus further comprises: an edge shape detector for detecting the shape of the edge of the laminated substrate; and a motion control unit for controlling the motion of the rocking mechanism; the motion control unit is configured to cause the rocking mechanism to rock the laminated substrate or the ejection nozzle about the rocking center based on the detected edge shape. In one embodiment, the substrate processing apparatus further comprises: an edge shape detector for detecting the shape of the edge of the laminated substrate; and a motion control unit for controlling the movement of the movement mechanism; the motion control unit is configured to cause the movement mechanism to move the laminated substrate or the spray nozzle in the thickness direction of the laminated substrate based on the detected edge shape. In another embodiment, the filler particles are composed of the same material as the material constituting the laminated substrate, or a compound thereof. In another embodiment, the filler particles are composed of ceramic.

One aspect provides a substrate processing method for forming a filling layer on a laminate substrate comprising a first substrate and a second substrate bonded thereto. Filler material particles constituting the filling layer are supplied to a spray nozzle. The laminate substrate is rotated while the spray nozzle accelerates the filler material particles and sprays the filler material particles onto a gap between an edge of the first substrate and an edge of the second substrate. In another aspect, the method of accelerating the filler material particles and spraying them onto the gap by the spray nozzle involves accelerating the filler material particles using heat generated by plasma using a plasma plating nozzle, melting the filler material particles using the heat generated by the plasma, and spraying the melted filler material particles onto the gap. One embodiment involves accelerating the filler material particles using the jet nozzle and spraying them onto the gap. A flame plating nozzle accelerates the filler material particles using the heat of a combustion flame, melts the filler material particles using the heat generated by the combustion flame, and sprays the melted filler material particles onto the gap. Another embodiment involves accelerating the filler material particles using the jet nozzle, accelerating the filler material particles to a speed exceeding the speed of sound using a de Laval nozzle.

In one embodiment, the substrate processing method further includes supplying a heated gas to the Laval nozzle, accelerating the filler material particles via the spray nozzle, and spraying the filler material particles onto the gap. The Laval nozzle accelerates the filler material particles to a speed exceeding the speed of sound, heats the filler material particles with the heated gas, and sprays the heated filler material particles onto the gap. In one embodiment, the filler particles are supplied to the injection nozzle by vaporizing a filler material serving as the material of the filler particles, and the filler particles formed from the vaporized filler material are supplied to the injection nozzle. Furthermore, the filler particles are accelerated by the injection nozzle and sprayed onto the gap, and the filler particles are accelerated to a speed exceeding the speed of sound by the Laval nozzle and sprayed onto the gap. In one embodiment, the filler particles are supplied to the spray nozzle by dispersing the filler particles in a liquid to form a suspension containing the filler particles, and the suspension is supplied to the spray nozzle. The filler particles are accelerated by the spray nozzle and sprayed onto the gap by the spray nozzle. One embodiment includes supplying the filler particles to the spray nozzle, aerosolizing the filler particles, and supplying the aerosolized filler particles to the spray nozzle; accelerating the filler particles via the spray nozzle and spraying the filler particles onto the gap; and accelerating the aerosolized filler particles via the spray nozzle and spraying the aerosolized filler particles onto the gap.

In one embodiment, the substrate processing method further includes oscillating the laminated substrate or the spray nozzle about a designated oscillation center. In another embodiment, the substrate processing method further includes moving the laminated substrate or the spray nozzle in the thickness direction of the laminated substrate. In another embodiment, the substrate processing method further includes detecting the shape of an edge of the laminated substrate and oscillating the laminated substrate or the spray nozzle about the oscillation center based on the detected edge shape. In one embodiment, the substrate processing method further includes detecting the shape of an edge of the laminate substrate and moving the laminate substrate or the spray nozzle in the thickness direction of the laminate substrate based on the detected edge shape. In another embodiment, the filler particles are composed of the same material as the material constituting the laminate substrate, or a compound thereof. In another embodiment, the filler particles are composed of ceramic.

(Effects of the Invention) This invention forms a filling layer between the edges of the first and second substrates, protecting the knife edge formed on the edge of the second substrate. As a result, cracks and gaps in the laminated substrate are suppressed. Furthermore, because the filling layer is formed by accelerating filler particles and spraying them onto the gap between the edges of the first and second substrates, a subsequent curing step is unnecessary, improving process productivity.

The following describes embodiments of the present invention with reference to the accompanying drawings. Figure 1A is a cross-sectional view showing an example of the edge of a laminate substrate Ws being processed. As shown in Figure 1A, the laminate substrate Ws has a structure in which a first substrate W1 and a second substrate W2 are bonded. In this embodiment, the first and second substrates W1 and W2 are circular.

The edge E1 of the first substrate W1 is the outermost surface inclined relative to the bonding surface (e.g., component surface) S1 of the first substrate W1. More specifically, the edge E1 of the first substrate W1 has a rounded or chamfered shape. Similarly, the edge E2 of the second substrate W2 is the outermost surface inclined relative to the bonding surface (e.g., component surface) S2 of the second substrate W2. More specifically, the edge E2 of the second substrate W2 has a rounded or chamfered shape. The edges E1 and E2 are also referred to as bevel portions. A gap G is formed between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. The edge of the laminate substrate Ws includes the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2.

Figure 1B shows a cross-sectional view of an example edge portion of a laminated substrate Ws with a filling layer L formed thereon. The filling layer L is formed in a gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. This gap G extends throughout the entire circumference of the laminated substrate Ws and has a roughly triangular cross-section. The filling layer L is formed to completely fill this gap G.

Figure 1C shows a cross-sectional view of an example of the edge of a laminated substrate Ws after thinning after forming a filler layer L. This thinning process forms a knife edge Ek on the edge E2 of the second substrate W2. Because the filler layer L supports the knife edge Ek, cracking or chipping of the knife edge Ek is prevented.

Figure 2 is a front view of one embodiment of a substrate processing apparatus 1, and Figure 3 is a side view of the substrate processing apparatus 1 shown in Figure 2. The substrate processing apparatus 1 is used to form a filling layer L on a laminated substrate Ws, which is formed by bonding a first substrate W1 and a second substrate W2. The substrate processing apparatus 1 includes a substrate holding device 2 that holds the laminated substrate Ws in a vertical position and rotates the held laminated substrate Ws, and a spray nozzle 3 that forms the filling layer L on the laminated substrate Ws.

The substrate holding device 2 includes a holding stage 5 for holding the back surface of the laminated substrate Ws; a rotation shaft 6 connected to the center of the holding stage 5; and a rotation mechanism 8 for rotating the holding stage 5 and the rotation shaft 6. The holding stage 5 is configured to hold the back surface of the laminated substrate Ws by vacuum suction. As shown in FIG3 , the holding stage 5 has a holding surface 5a perpendicular to the horizontal plane. The laminated substrate Ws is held by the holding stage 5 such that the flat portion of the laminated substrate Ws is perpendicular to the horizontal plane. Therefore, the laminated substrate Ws is held in a vertical position by the substrate holding device 2.

The rotating mechanism 8 includes a motor (not shown). The rotating mechanism 8 is configured to rotate the holding stage 5 and the laminated substrate Ws held thereon in unison about the rotation axis R of the substrate holding device 2 in the direction indicated by the arrow in FIG. 2 .

In one embodiment, the substrate holding device 2 may include, in place of the holding stage 5, a plurality (e.g., four) of rollers (not shown) capable of contacting the periphery of the laminate substrate Ws. These rollers can also hold the laminate substrate Ws with the flat portion of the laminate substrate Ws perpendicular to the horizontal plane. In this case, the substrate holding device 2 may include, in place of the rotation shaft 6 and the rotation mechanism 8, a roller rotation mechanism (not shown) that rotates each roller in the same direction and at the same speed about the axis of the roller. The roller rotation mechanism rotates the plurality of rollers, causing the laminate substrate Ws to rotate about the rotation center of the substrate holding device 2.

In another embodiment, the holding stage 5 of the substrate holding device 2 has a holding surface parallel to the horizontal plane, and the laminated substrate Ws can also be held by the holding stage 5 in such a manner that the flat portion of the laminated substrate Ws is parallel to the horizontal plane. In other words, the laminated substrate Ws can also be held in a horizontal position by the substrate holding device 2.

The substrate processing apparatus 1 includes a filler particle supply line 12 for supplying filler particles Fp constituting the filler layer L to the spray nozzle 3. The filler particle supply line 12 is connected to the spray nozzle 3. The spray nozzle 3 is connected to a filler particle supply source 13 via the filler particle supply line 12. The filler particles Fp are powders that do not contain volatile components such as solvents. In one embodiment, the particle size (diameter) of the filler particles Fp is in the range of 1 μm to 100 μm, more preferably in the range of 1 μm to 10 μm. An example of the filler particle supply source 13 is a disk-type powder feeder.

The filler particles Fp are composed of the same material as that constituting the laminate substrate Ws (e.g., silicon), or a compound thereof (e.g., silicon oxide, silicon nitride, silicon carbide, etc.). In one embodiment, the filler particles Fp may also be a material having mechanical properties (e.g., tensile strength) and thermal properties (e.g., heat resistance and linear expansion coefficient) similar to those of the laminate substrate Ws (e.g., ceramics such as aluminum oxide, zirconium oxide, silicon oxide, silicon nitride, silicon carbide), or other materials used in semiconductor manufacturing processes (e.g., metals such as tungsten, carbon, etc.). The filler layer L formed on the laminate substrate Ws using filler particles Fp composed of such materials does not contaminate the laminate substrate Ws during subsequent processes. Therefore, after thinning the second substrate W2, there is no need to remove the filling layer L from the laminate substrate Ws, so the productivity of the entire process can be improved.

The filler particle supply source 13 is connected to a carrier gas supply source 16 via a carrier gas supply line 15. When carrier gas is supplied from the carrier gas supply source 16 through the carrier gas supply line 15 to the filler particle supply source 13, the filler particles Fp in the filler particle supply source 13 flow into the filler particle supply line 12 along with the carrier gas. The filler particles Fp are then supplied to the injection nozzle 3 along with the carrier gas through the filler particle supply line 12. Examples of carrier gas include nitrogen, air, helium, argon, and other gases, or mixed gases thereof.

A flow regulating valve 17 and a flow meter 18 are installed in the carrier gas supply line 15. The flow regulating valve 17 is configured to regulate the flow of carrier gas flowing through the carrier gas supply line 15. The carrier gas supply line 15 is connected to the filler particle supply line 12 via the filler particle supply source 13. Therefore, the flow of carrier gas and filler particles Fp flowing through the filler particle supply line 12 can be regulated by the flow regulating valve 17. The flow meter 18 is configured to measure the flow of carrier gas flowing through the carrier gas supply line 15. In one embodiment, the flow regulating valve 17 and the flow meter 18 may also be installed in the filler particle supply line 12.

The spray nozzle 3 is located radially outward from the stacking substrate Ws held by the substrate holder 2, and is positioned above the stacking substrate Ws, facing the gap G between the stacking substrates Ws. The spray nozzle 3 is configured to accelerate filler particles Fp and spray them into the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2 of the stacking substrate Ws. The spray nozzle 3 is configured to cause the accelerated filler particles Fp to collide with the stacking substrate Ws, forming a filling layer L in the gap G between the stacking substrates Ws.

In one embodiment, the speed of the filler particles Fp ejected from the ejection nozzle 3 is 150 m/s or greater. As described later, the ejection nozzle 3 is configured to accelerate the filler particles Fp supplied through the filler particle supply line 12. In another embodiment, if the speed of the filler particles Fp supplied to the ejection nozzle 3 along with the carrier gas through the filler particle supply line 12 is sufficiently high, the ejection nozzle 3 may not be provided with a mechanism for accelerating the filler particles Fp. In other words, the ejection nozzle 3 may be configured to spray the filler particles Fp onto the gap G of the laminated substrate Ws at the speed supplied to the ejection nozzle 3 through the filler particle supply line 12.

The filling layer L is formed on the laminated substrate Ws by the spray nozzle 3 while the laminated substrate Ws is rotated by the substrate holding device 2. Thus, the filling layer L can be formed in the gap G formed around the entire circumference of the laminated substrate Ws.

The substrate processing apparatus 1 further includes a motion control unit 10 electrically connected to the substrate holding device 2, the spray nozzle 3, a flow regulating valve 17, and a flow meter 18. The motion control unit 10 controls the operation of the substrate holding device 2, the spray nozzle 3, and the flow regulating valve 17. The carrier gas flow rate flowing through the carrier gas supply line 15, measured by the flow meter 18, is transmitted to the motion control unit 10.

The motion control unit 10 is composed of at least one computer. It includes a memory device 10a that stores programs and a calculation device 10b that executes calculations according to the instructions contained in the programs. The memory device 10a includes a primary memory device such as a random access memory (RAM), and secondary memory devices such as a hard disk drive (HDD) and a solid-state drive (SSD). Examples of the calculation device 10b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the motion control unit 10 is not limited to these examples.

FIG4 is a schematic diagram showing one embodiment of the spray nozzle 3. The spray nozzle 3 of this embodiment is a plasma plating nozzle. A plasma plating nozzle is configured to generate plasma, accelerate filler particles Fp using the heat of the plasma, and melt the filler particles Fp. The plasma plating nozzle is connected to a plasma gas supply line 20 for supplying plasma gas used to generate the plasma to the plasma plating nozzle. The plasma gas supply line 20 is connected to a plasma gas supply source (not shown). Plasma gas is supplied from a plasma gas supply source to the plasma plating nozzle through a plasma gas supply line 20. Examples of plasma gas include argon and nitrogen.

The plasma plating nozzle comprises a roughly cylindrical nozzle body 22; a cathode 23 and an anode 24 housed within the nozzle body 22; and a plasma gas flow path 25 connected to the plasma gas supply line 20. The nozzle body 22 has a nozzle 22a at its front end for ejecting filler particles Fp. The plasma gas flow path 25 is formed by the inner surface of the nozzle body 22, the outer surface of the cathode 23, and the outer surface of the anode 24, and extends to the nozzle 22a. Plasma gas supplied to the plasma plating nozzle via the plasma gas supply line 20 flows through the plasma gas flow path 25 toward the nozzle 22a. A voltage is applied from a power source (not shown) to the cathode 23 and the anode 24. Plasma (arc plasma) P is generated by supplying plasma gas between the cathode 23 and the anode 24 to which the voltage is applied.

The plasma plating nozzle further includes a filler particle introduction line 27 connected to the filler particle supply line 12. In this embodiment, the filler particle introduction line 27 penetrates the nozzle body 22 at its lower portion and extends perpendicularly to the length of the nozzle body 22. The filler particle introduction line 27 is connected to the plasma gas flow path 25, and the outlet end of the filler particle introduction line 27 is adjacent to the injection port 22a.

The carrier gas and filler particles Fp are supplied to the plasma P generated between the cathode 23 and the anode 24 in the plasma gas flow path 25 via the filler particle supply line 12 and the filler particle introduction line 27. The configuration of the filler particle introduction line 27 is not limited to that of the present embodiment, as long as it can supply the filler particles Fp to the plasma P generated between the cathode 23 and the anode 24. For example, the plasma plating nozzle may include a plurality of filler particle introduction lines 27. Alternatively, the filler particle introduction line 27 may extend obliquely with respect to the longitudinal direction of the nozzle body 22, or the filler particle introduction line 27 may penetrate the cathode 23 and extend longitudinally of the nozzle body 22.

The carrier gas in the plasma P supplied to the plasma gas flow path 25 via the filler particle introduction line 27 rapidly expands due to the heat of the plasma P, generating a jet stream through the ejection port 22a. The filler particles Fp are accelerated by this jet stream and ejected from the plasma plating nozzle through the ejection port 22a. Furthermore, the heat of the plasma P melts the filler particles Fp, which are then ejected from the plasma plating nozzle.

The specific configuration of the plasma spray nozzle is not limited to this embodiment as long as it generates plasma and accelerates the filler particles Fp using the heat of the plasma to melt the filler particles Fp. In one embodiment, the plasma spray nozzle may also be configured to generate plasma using microwaves.

The plasma plating nozzle is positioned so that its nozzle 22a faces the gap G between the laminate substrates Ws. In one embodiment, the distance K between the nozzle 22a and the outermost edge of the laminate substrate Ws is within a range of 1 mm to 100 mm. Accelerated by the plasma P, melted filler material particles Fp are ejected from the nozzle 22a toward the gap G between the laminate substrates Ws, impacting the laminate substrates Ws (more specifically, the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2, which form the gap G). Filler particles Fp are deformed by colliding with the laminate substrate Ws and are cooled by the surface of the laminate substrate Ws, forming a film on the laminate substrate Ws. A plasma spray nozzle sprays filler particles Fp onto the gap G of the laminate substrate Ws, accumulating the film of filler particles Fp to form a filling layer L that fills the gap G.

In this embodiment, by accelerating the filler particles Fp and spraying them onto the gap G of the laminated substrate Ws, a filling layer L is formed in the gap G. This eliminates the need for a subsequent curing step. This improves overall process productivity. Furthermore, since no equipment is required for the curing step, installation and maintenance costs can be reduced.

Figure 5 is a schematic diagram showing another embodiment of the spray nozzle 3. The spray nozzle 3 of this embodiment is a flame plating nozzle. The flame plating nozzle is configured so that the heat of a combustion flame accelerates and melts filler material particles Fp. The flame plating nozzle is connected to a fuel supply line 30 for supplying fuel used to generate the combustion flame to the flame plating nozzle, and a combustion-supporting gas supply line 31 for supplying combustion-supporting gas to the flame plating nozzle.

The fuel supply line 30 is connected to a fuel supply source (not shown). Fuel (fuel gas) is supplied from the fuel supply source to the flame plating nozzle through the fuel supply line 30. Examples of the fuel include acetylene. The combustion-supporting gas supply line 31 is connected to a combustion-supporting gas supply source (not shown). Combustion-supporting gas is supplied from the combustion-supporting gas supply source to the flame plating nozzle through the combustion-supporting gas supply line 31. Examples of the combustion-supporting gas include oxygen.

The flame plating nozzle comprises a roughly cylindrical nozzle body 33; a fuel flow path 34 connected to the fuel supply line 30; a combustion-supporting gas flow path 35 connected to the combustion-supporting gas supply line 31; and a combustion chamber 36 connected to both the fuel flow path 34 and the combustion-supporting gas flow path 35. The nozzle body 33 has an injection port 33a at its front end for ejecting filler particles Fp. The fuel flow path 34, the combustion-supporting gas flow path 35, and the combustion chamber 36 are formed by the inner surface of the nozzle body 33. The combustion chamber 36 extends to the injection port 33a.

The fuel supplied to the flame plating nozzle via the fuel supply line 30 flows through the fuel flow path 34 and is supplied to the combustion chamber 36. The combustion-supporting gas supplied to the flame plating nozzle via the combustion-supporting gas supply line 31 flows through the combustion-supporting gas flow path 35 and is supplied to the combustion chamber 36. The fuel and the combustion-supporting gas are mixed in the combustion chamber 36, and the mixed gas is combusted to generate a combustion flame Q.

The flame plating nozzle further includes a filler particle introduction line 38 connected to the filler particle supply line 12. In this embodiment, the filler particle introduction line 38 penetrates the nozzle body 33 at its lower portion and extends perpendicularly to the length of the nozzle body 33. The filler particle introduction line 38 is connected to the combustion chamber 36, and the outlet end of the filler particle introduction line 38 is adjacent to the injection port 33a.

The carrier gas and filler particles Fp are supplied to the combustion flame Q in the combustion chamber 36 via the filler particle supply line 12 and the filler particle introduction line 38. The configuration of the filler particle introduction line 38 is not limited to that of this embodiment, as long as it can supply the filler particles Fp to the combustion flame Q in the combustion chamber 36. For example, a flame plating nozzle may include multiple filler particle introduction lines 38. Alternatively, the filler particle introduction line 38 may extend obliquely with respect to the longitudinal direction of the nozzle body 33, or the filler particle introduction line 38 may extend in the longitudinal direction of the nozzle body 33.

The carrier gas supplied to the combustion flame Q through the filler particle introduction line 38 rapidly expands due to the heat of the combustion flame Q, generating a blowout jet through the nozzle 33a. The filler particles Fp are accelerated by this jet and ejected from the flame plating nozzle through the nozzle 33a. Furthermore, the filler particles Fp are melted by the heat of the combustion flame Q, and the melted filler particles Fp are ejected from the flame plating nozzle.

The specific structure of the flame plating nozzle is not limited to that of the present embodiment as long as it can generate a combustion flame, accelerate the filler particles Fp with the heat of the combustion flame, and melt the filler particles Fp.

The flame plating nozzle is positioned so that its nozzle opening 33a faces the gap G between the laminated substrates Ws. In one embodiment, the distance K between the nozzle opening 33a and the outermost edge of the laminated substrate Ws is within a range of 1 mm to 100 mm. Filler material particles Fp, accelerated and melted by the combustion flame Q, are ejected from the nozzle opening 33a toward the gap G between the laminated substrates Ws, impacting the laminated substrates Ws (more specifically, the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2, which form the gap G). Filler particles Fp are deformed by colliding with the laminate substrate Ws and are cooled by the surface of the laminate substrate Ws, forming a film on the laminate substrate Ws. The flame spray nozzle sprays filler particles Fp onto the gap G of the laminate substrate Ws, causing the film of filler particles Fp to accumulate, thereby forming a filling layer L that fills the gap G.

FIG6 is a schematic diagram showing yet another embodiment of the injection nozzle 3. The injection nozzle 3 of this embodiment is a Laval nozzle. The Laval nozzle is constructed in such a way as to accelerate the filler material particles Fp to a speed above the speed of sound. The Laval nozzle has a nozzle body 40 having a constricted portion 40a that partially reduces its diameter, and a flow path 41 formed by the inner surface of the nozzle body 40. The flow path 41 is connected to the filler material particle supply pipeline 12. The flow path 41 is formed by the constricted portion 40a and has a throat 41a in which the horizontal cross-section of the nozzle body 40 is minimized. The nozzle body 40 has a nozzle 40b at its front end for ejecting the filler material particles Fp.

The carrier gas and filler particles Fp supplied to the Laval nozzle via the filler particle supply line 12 flow through the flow path 41. The carrier gas is compressed in the throat 41a of the flow path 41. Downstream of the throat 41a, the carrier gas expands, causing the flow velocity of the carrier gas and filler particles Fp to exceed the speed of sound (sonic or supersonic). Filler particles Fp, accelerated to above the speed of sound, pass through the ejection port 40b and are ejected from the Laval nozzle.

The Laval nozzle of this embodiment is connected to a heating gas supply line 45 for supplying heating gas to the Laval nozzle. Heating gas supply line 45 is connected to a heater 46. Heater 46 is configured to heat carrier gas supplied from carrier gas supply source 16 via carrier gas supply line 47. In one embodiment, the temperature of the carrier gas (i.e., heating gas) heated by heater 46 is within a range of 100°C to 2000°C.

A flow regulating valve 48 and a flow meter 49 are installed in the carrier gas supply line 47. The flow regulating valve 48 is configured to regulate the flow of carrier gas flowing through the carrier gas supply line 47. The carrier gas supply line 47 is connected to the heated gas supply line 45 via the heater 46. Therefore, the flow of carrier gas and filler particles Fp flowing through the heated gas supply line 45 can be regulated by the flow regulating valve 48. The flow meter 49 is configured to measure the flow of carrier gas flowing through the carrier gas supply line 47. In one embodiment, the flow regulating valve 48 and the flow meter 49 may also be installed in the heated gas supply line 45.

The flow regulating valve 48 and the flow meter 49 are electrically connected to the motion control unit 10. The motion of the flow regulating valve 48 is controlled by the motion control unit 10. The carrier gas flow rate flowing through the carrier gas supply line 47 measured by the flow meter 49 is sent to the motion control unit 10.

The carrier gas (hereinafter referred to as heated gas) heated by a heater 46 is supplied to the Laval nozzle via a heated gas supply line 45. The Laval nozzle further includes a heated gas inlet line 43 connected to the heated gas supply line 45. In this embodiment, the heated gas inlet line 43 is connected to the nozzle body 40 upstream of the constricted portion 40a in the direction of flow of the carrier gas and filler particles Fp and communicates with the flow path 41. The heated gas supplied to the flow path 41 heats the filler particles Fp flowing through the flow path 41. The heated filler particles Fp are accelerated to a speed exceeding the speed of sound in the flow path 41 and ejected from the Laval nozzle through the ejection port 40b.

The Laval nozzle is positioned so that its nozzle 40b faces the gap G between the laminate substrate Ws. In one embodiment, the distance K between the Laval nozzle nozzle 40b and the outermost edge of the laminate substrate Ws is within a range of 1 mm to 100 mm. Filler particles Fp, accelerated and heated by the Laval nozzle, are ejected from the nozzle 40b toward the gap G between the laminate substrate Ws, impacting the laminate substrate Ws (more specifically, the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2, which form the gap G). Filler particles Fp are deformed by impacting the laminate substrate Ws and cooled by the surface of the laminate substrate Ws, forming a film on the laminate substrate Ws. A Laval nozzle sprays filler particles Fp onto the gap G of the laminate substrate Ws, accumulating the film of filler particles Fp to form a filling layer L that fills the gap G.

Because the filler particles Fp, heated and softened by the heated gas, are easily deformed when they collide with the laminate substrate Ws, the film of the filler particles Fp can be well deposited on the laminate substrate Ws. The filler particles Fp heated by the heated gas can be in a molten state or a semi-molten state.

In one embodiment, when the speed of the filler material particles Fp ejected from the Laval nozzle is sufficiently high (for example, when the speed of the filler material particles Fp is 500 m/s or higher), the Laval nozzle may not be equipped with a heating gas inlet line 43, and heating gas is not supplied to the Laval nozzle. Therefore, when the speed of the filler material particles Fp ejected from the Laval nozzle is sufficiently high, even if the filler material particles Fp are not heated or softened, they can still be deformed by impact with the laminate substrate Ws, thereby forming a film on the laminate substrate Ws.

FIG7 is a side view showing another embodiment of the substrate processing apparatus 1. Since the structure and operation of this embodiment, which are not specifically described, are the same as those of the substrate processing apparatus 1 described with reference to FIG2 and FIG3 , repeated descriptions thereof are omitted. The spray nozzle 3 of this embodiment is a Laval nozzle described with reference to FIG6 . In this embodiment, the filling material particle supply line 12 replaces the filling material particle supply source 13 and is connected to a vaporization chamber 51 for vaporizing the filling material Fm, which is the material of the filling material particles Fp. The vaporization chamber 51 is connected to the carrier gas supply source 16 via the carrier gas supply line 15. When carrier gas is supplied from carrier gas supply source 16 through carrier gas supply line 15 to vaporization chamber 51, the interior of vaporization chamber 51 is filled with carrier gas at a predetermined pressure. Examples of carrier gas include nitrogen, air, helium, argon, and other gases, or mixed gases thereof.

The vaporization chamber 51 of this embodiment includes a heater 53 as a heat source. Filler material Fm, which is the material of filler particles Fp, is loaded into the heater 53. The vaporization chamber 51 is configured so that the heat from the heater 53 vaporizes the filler material Fm in a carrier gas environment. The vaporized filler material Fm forms filler particles Fp with nanometer-sized diameters before reaching the laminated substrate Ws.

The specific structure of the vaporization chamber 51 is not limited to this embodiment, as long as it can vaporize the filling material Fm. In one embodiment, the vaporization chamber 51 can also be configured in such a way that the filling material Fm is vaporized by laser ablation.

In this embodiment, the substrate holding device 2 and the spray nozzle 3 holding the laminated substrate Ws are housed within a vacuum chamber 55. The vacuum chamber 55 is connected to a vacuum pump 58 via a vacuum line 56. The vacuum pump 58 is configured to evacuate the vacuum chamber 55 via the vacuum line 56, thereby creating a vacuum state within the vacuum chamber 55. The vacuum pump 58 is electrically connected to the operation control unit 10, and the operation of the vacuum pump 58 is controlled by the operation control unit 10.

Due to the pressure difference between the vaporization chamber 51 and the vacuum chamber 55, the vaporized filler material Fm or the filler material particles Fp formed from the vaporized filler material Fm flow from the vacuum chamber 55 into the filler material particle supply line 12 along with the carrier gas. The vaporized filler material Fm or the filler material particles Fp formed from the vaporized filler material Fm are supplied from the filler material particle supply line 12 along with the carrier gas to the injection nozzle 3 (a Laval nozzle in this embodiment). The injection nozzle 3 (a Laval nozzle in this embodiment) accelerates the vaporized filler material Fm or the filler material particles Fp formed from the vaporized filler material Fm to a speed exceeding the speed of sound.

Filler particles Fp, accelerated by the spray nozzle 3 (a Laval nozzle in this embodiment), are ejected from the Laval nozzle toward the gap G of the stacking substrate Ws, impacting the stacking substrate Ws (more specifically, the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2, which form the gap G). The nanometer-sized filler particles Fp collide with the stacking substrate Ws, forming a dense film on the stacking substrate Ws. The Laval nozzle sprays the filler particles Fp onto the gap G of the stacking substrate Ws, causing the film of filler particles Fp to accumulate, thereby filling the gap G and forming a filling layer L.

In this embodiment, the filling material layer L is formed on the gap G of the laminate substrate Ws using the spray nozzle 3 within a vacuum chamber 55, which is in a vacuum state. This reduces the generation of bubbles during the formation of the filling material layer L. Alternatively, the filling material layer L can be formed on the gap G of the laminate substrate Ws within the vacuum chamber 55 using the plasma plating nozzle described with reference to Figures 2 to 4 .

FIG8 is a side view showing yet another embodiment of the substrate processing apparatus 1. Since the structure and operation of this embodiment, which are not specifically described, are the same as those of the substrate processing apparatus 1 described with reference to FIG2 and FIG3 , repeated descriptions thereof are omitted. The spray nozzle 3 of this embodiment is the plasma plating nozzle described with reference to FIG4 . The filling material particle supply line 12 of this embodiment replaces the filling material particle supply source 13 and is connected to a suspension generating device 60 for generating a suspension Fs containing the filling material particles Fp. The suspension generating device 60 is configured so as to disperse the filling material particles Fp in a liquid (e.g., water, ethanol, etc.) to generate a suspension (slurry) Fs containing the filling material particles Fp.

A suspension pump 61 is installed in the filler particle supply line 12. The suspension pump 61 is configured to pressurize a suspension Fs containing filler particles Fp from the suspension generator 60 through the filler particle supply line 12 to the spray nozzle 3 (a plasma plating nozzle in this embodiment). The suspension pump 61 is electrically connected to the operation control unit 10, and its operation is controlled by the operation control unit 10.

The spray nozzle 3 (a plasma plating nozzle in this embodiment) uses the heat of the plasma to accelerate a suspension Fs containing filler particles Fp. The suspension Fs containing filler particles Fp, accelerated by the spray nozzle 3, is sprayed from the spray nozzle 3 toward the gap G of the build-up substrate Ws. The spray nozzle 3 sprays the suspension Fs containing filler particles Fp onto the gap G of the build-up substrate Ws (more specifically, onto the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2, which form the gap G). Before or after the suspension Fs containing filler particles Fp collides with the build-up substrate Ws, liquid components evaporate from the suspension Fs, forming a film of filler particles Fp. The spray nozzle 3 sprays the suspension Fs containing filler particles Fp onto the gap G of the build-up substrate Ws, depositing the film of filler particles Fp to fill the gap G and form a filling layer L.

FIG9 is a side view showing yet another embodiment of the substrate processing apparatus 1. Since the structure and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to FIG7 , repeated descriptions thereof are omitted. The filling material particle supply line 12 of this embodiment replaces the vaporization chamber 51 and is connected to an aerosol chamber 65 for aerosolizing the filling material particles Fp. The aerosol chamber 65 is connected to the carrier gas supply source 16 via the carrier gas supply line 15. The aerosol chamber 65 is configured so that the carrier gas supplied from the carrier gas supply source 16 through the carrier gas supply line 15 into the aerosol chamber 65 is mixed with the filling material particles Fp to generate aerosolized filling material particles Fp.

In this embodiment, the substrate holder 2, which holds the laminated substrate Ws, and the spray nozzle 3 are housed within a vacuum chamber 55, which is maintained in a vacuum state. Due to the pressure difference between the aerosol chamber 65 and the vacuum chamber 55, aerosolized filler particles Fp flow from the aerosol chamber 65 into the filler particle supply line 12 along with a carrier gas. The aerosolized filler particles Fp, along with the carrier gas, are supplied through the filler particle supply line 12 to the spray nozzle 3 (a Laval nozzle in this embodiment). The spray nozzle 3 (a Laval nozzle in this embodiment) accelerates the aerosolized filler particles Fp to a speed exceeding the speed of sound.

Aerosolized filler particles Fp, accelerated by the spray nozzle 3 (a Laval nozzle in this embodiment), are sprayed from the spray nozzle 3 toward the gap G between the stacking substrates Ws, where they collide with the stacking substrates Ws (more specifically, the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2, which form the gap G). The collision of the aerosolized filler particles Fp with the stacking substrates Ws forms a dense coating on the stacking substrates Ws. The spray nozzle 3 sprays the filler particles Fp onto the gap G between the stacking substrates Ws, accumulating the coating of filler particles Fp and thereby filling the gap G to form a filling layer L.

In any of the embodiments described above with reference to Figures 5 to 9 , since the filler material particles Fp are accelerated and sprayed onto the gap G of the laminated substrate Ws, thereby forming the filler layer L in the gap G4, a subsequent curing step is unnecessary. This improves the productivity of the entire process. Furthermore, since no equipment is required for the curing step, installation and maintenance costs can be reduced.

FIG10 is a side view showing yet another embodiment of the substrate processing apparatus 1. Since the structure and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to FIG2 through FIG4 , a repeated description thereof will be omitted. The substrate processing apparatus 1 shown in FIG10 further includes a rocking mechanism (substrate rocking mechanism) 70 that rocked the laminated substrate Ws about a predetermined rocking center. The spray nozzle 3 of this embodiment is the plasma plating nozzle described with reference to FIG4 , but one embodiment may also be the flame plating nozzle described with reference to FIG5 , or the Laval nozzle described with reference to FIG6 . In addition, the substrate rocking mechanism 70 of this embodiment can also be applied to any substrate processing apparatus 1 described with reference to FIG. 7 to FIG. 9 .

The substrate oscillation mechanism 70 includes a oscillation arm 72 connected to the substrate holding device 2; a oscillation shaft 73 connected to the oscillation arm 72; and a motor 74 connected to the oscillation shaft 73. The motor 74 is configured to rotate the oscillation shaft 73 about its axis. The motor 74 rotates the oscillation shaft 73, oscillating the entire substrate holding device 2 via the oscillation arm 72. This causes the laminated substrate Ws held by the substrate holding device 2 to oscillate about the oscillation center O (i.e., the axis of the oscillation shaft 73).

The substrate oscillating mechanism 70 oscillates the stacking substrate Ws about the oscillation center O, tilting the stacking substrate Ws at a predetermined angle relative to the spray direction J of the filler particles Fp ejected by the ejection nozzle 3. In other words, the substrate oscillating mechanism 70 is configured to change the relative angle between the ejection direction J of the filler particles Fp ejected by the ejection nozzle 3 and the radial direction of the stacking substrate Ws. The substrate oscillating mechanism 70 is also configured to maintain the tilt angle of the stacking substrate Ws. The substrate oscillating mechanism 70 (more specifically, the motor 74 ) is electrically connected to the motion control unit 10 , and the motion of the substrate oscillating mechanism 70 (more specifically, the motor 74 ) is controlled by the motion control unit 10 .

FIG11 is a schematic diagram illustrating the deposition of filler particles Fp in the gap G of the stacking substrate Ws by the spray nozzle 3. As described above, the spray nozzle 3 sprays the filler particles Fp onto the gap G of the stacking substrate Ws, depositing a film of the filler particles Fp in the gap G of the stacking substrate Ws, thereby forming a filling layer L in the gap G. However, since the filler particles Fp that collide with the stacking substrate Ws are fixed at the point of collision, as shown in FIG11 , the filler particles Fp are deposited unevenly in a portion of the gap G of the stacking substrate Ws, preventing the formation of a filling layer L throughout the gap G. Therefore, in this embodiment, the substrate rocking mechanism 70 rocked the laminated substrate Ws, and the position of the laminated substrate Ws where the filler particles Fp ejected from the ejection nozzle 3 collided was changed, thereby forming the filling layer L in the gap G of the laminated substrate Ws.

In this embodiment, the position of the rocking center O coincides with the deepest portion of the gap G of the laminate substrate Ws. The position of the rocking center O and the tilt angle of the laminate substrate Ws are predetermined based on experimental results, etc., in order to appropriately form the filling layer L in the gap G of the laminate substrate Ws.

Figure 12 is a schematic diagram illustrating one embodiment of a method for forming a filler layer L in a gap G of a buildup substrate Ws by rocking the buildup substrate Ws using a substrate rocking mechanism 70. For illustrative purposes, Figure 12 omits the substrate rocking mechanism 70. As shown in step 1-1 of Figure 12 , the filler material particles Fp are sprayed onto the surface of the buildup substrate Ws by the spray nozzle 3, with the spray direction J of the filler material particles Fp aligned with the radial direction of the buildup substrate Ws. In other words, the buildup substrate Ws is not tilted. For example, while the laminated substrate Ws is rotated by one cycle by the substrate holding device 2, the filler particles Fp are sprayed onto the surface by the spray nozzle 3 without tilting the laminated substrate Ws.

Next, in step 1-2, the stacking substrate Ws is rocked in the first direction D1 about the rocking center O by the substrate rocking mechanism 70. The filler material particles Fp are sprayed by the spray nozzle 3 while the stacking substrate Ws is tilted at a first angle relative to the spraying direction J of the filler material particles Fp from the spray nozzle 3. For example, while the stacking substrate Ws is rotated once by the substrate holding device 2, the filler material particles Fp are sprayed onto the surface of the stacking substrate Ws while the substrate Ws is tilted at the first angle.

In step 1-3, the stacking substrate Ws is rocked about the rocking center O in a second direction D2, which is opposite to the first direction D1, by the substrate rocking mechanism 70. With the stacking substrate Ws tilted at a second angle relative to the spraying direction J of the spray nozzle 3, the filler material particles Fp are sprayed onto the surface. For example, while the stacking substrate Ws is rotated once by the substrate holding device 2, the filler material particles Fp are sprayed onto the surface by the spray nozzle 3 while the stacking substrate Ws is tilted at the second angle.

In step 1-4, the stacking substrate Ws is rocked in the first direction D1 about the rocking center O by the substrate rocking mechanism 70. Similar to step 1-1, the filler material particles Fp are sprayed onto the surface of the stacking substrate Ws by the spray nozzle 3, with the spray direction J of the filler material particles Fp aligned with the radial direction of the stacking substrate Ws, that is, without tilting the stacking substrate Ws. For example, the filler material particles Fp are sprayed onto the surface of the stacking substrate Ws by the spray nozzle 3 while the stacking substrate Ws is rotated once by the substrate holding device 2, without tilting the stacking substrate Ws. Steps 1-1 to 1-4 may be repeated until the filling layer L is formed by filling the gap G of the laminate substrate Ws.

In one embodiment, during each of steps 1-1 to 1-4, filler particles Fp may be sprayed onto the surface of the laminate substrate Ws using the spray nozzle 3 while the laminate substrate Ws is rotated multiple times by the substrate holding device 2. In another embodiment, after steps 1-1 to 1-4, filler particles composed of a different material than the filler particles used in the initial steps 1-1 to 1-4 may be used in the subsequent repetition of steps 1-1 to 1-4. In this way, multiple filler layers composed of different materials are deposited in the gaps G of the laminate substrate Ws.

Furthermore, in other embodiments, the substrate rocking mechanism 70 may rock the laminated substrate Ws around the rocking center O, while the spray nozzle 3 may spray the filler particles Fp onto the surface.

When this embodiment is adopted, the substrate rocking mechanism 70 is used to rock the stacking substrate Ws, and the filling material particles Fp are deposited in the gap G of the stacking substrate Ws. The filling material particles Fp are not deposited in a part of the gap G, but can form a filling layer L in the entire gap G.

In one embodiment, as shown in FIG13 , the substrate processing apparatus 1 may include a swing mechanism (nozzle swing mechanism) 75, which replaces the substrate swing mechanism 70 and swings the nozzle 3 about a designated swing center. The nozzle swing mechanism 75 includes a nozzle holder 77 that holds the nozzle 3; a swing shaft 78 connected to the nozzle holder 77; and a motor 79 connected to the swing shaft 78. The motor 79 is configured to rotate the swing shaft 78 about its axis. The motor 79 is configured to rotate the rocking shaft 78 and rock the injection nozzle 3 held by the nozzle holder 77 about the rocking center O (that is, the axis of the rocking shaft 78).

The nozzle oscillating mechanism 75 oscillates the ejection nozzle 3, held in the nozzle holder 77, about an oscillation center O, tilting the ejection nozzle 3 at a predetermined angle relative to the radial direction of the laminate substrate Ws. In other words, the nozzle oscillating mechanism 75 is configured to change the relative angle between the ejection direction J of the filler particles Fp ejected by the ejection nozzle 3 and the radial direction of the laminate substrate Ws. The nozzle oscillating mechanism 75 is configured to maintain the tilt angle of the ejection nozzle 3. The nozzle rocking mechanism 75 (more specifically, the motor 79 ) is electrically connected to the motion control unit 10 , and the motion of the nozzle rocking mechanism 75 (more specifically, the motor 79 ) is controlled by the motion control unit 10 .

The position of the rocking center O and the tilt angle of the ejection nozzle 3 are predetermined based on experimental results, etc., in order to appropriately form the filling layer L in the gap G of the laminated substrate Ws.

Even in this embodiment, the nozzle oscillating mechanism 75 is used to oscillate the spray nozzle 3 around the oscillation center O, and the spray nozzle 3 is used to deposit the filling material particles Fp in the gap G of the laminated substrate Ws, so that the filling material particles Fp can be deposited in such a manner as to fill the gap G.

FIG14 is a side view showing yet another embodiment of the substrate processing apparatus 1. Since the structure and operation of this embodiment, not specifically described, are identical to those of the embodiment described with reference to FIG10 , a repeated description thereof will be omitted. The substrate processing apparatus 1 of this embodiment further includes a movement mechanism (substrate movement mechanism) 80 for moving the laminated substrate Ws in its thickness direction. The spray nozzle 3 of this embodiment is the plasma plating nozzle described with reference to FIG4 , but may alternatively be the flame plating nozzle described with reference to FIG5 , or the Laval nozzle described with reference to FIG6 . In addition, the substrate moving mechanism 80 of this embodiment can also be applied to any substrate processing apparatus 1 described with reference to FIG. 7 to FIG. 9 .

The substrate moving mechanism 80 of this embodiment includes a connecting member 81 connected to the substrate holding device 2; a linear guide 82 that guides the movement of the connecting member 81 in the thickness direction of the laminated substrate Ws; a direct-acting mechanism 83 connected to the connecting member 81; and a motor 84 connected to the direct-acting mechanism 83. Examples of the direct-acting mechanism 83 include a ball screw mechanism and a cylinder mechanism. The motor 84 is configured to move the entire substrate holding device 2 in the thickness direction of the laminated substrate Ws via the direct-acting mechanism 83, the linear guide 82, and the connecting member 81, thereby moving the laminated substrate Ws held by the substrate holding device 2 in the thickness direction. In one embodiment, the substrate moving mechanism 80 may include a linear electric actuator (linear motor, etc.) instead of the linear guide 82, the linear mechanism 83, and the motor 84.

The substrate moving mechanism 80 moves the laminated substrate Ws in its thickness direction, displacing the center C of the gap G in the thickness direction of the laminated substrate Ws by a predetermined distance from the position of the nozzle 22a of the ejection nozzle 3 in the thickness direction of the laminated substrate Ws. In other words, the substrate moving mechanism 80 is configured to change the relative position of the center C of the gap G in the thickness direction of the laminated substrate Ws and the ejection nozzle 22a of the ejection nozzle 3. The substrate moving mechanism 80 (more specifically, the motor 84) is electrically connected to the motion control unit 10, and the motion of the substrate moving mechanism 80 (more specifically, the motor 84) is controlled by the motion control unit 10.

The moving distance in the thickness direction of the laminate substrate Ws is predetermined based on experimental results, etc., in order to appropriately form the filling layer L in the gap G of the laminate substrate Ws.

Figure 15 is a schematic diagram illustrating one embodiment of a method for forming a filler layer L in the gap G of the laminated substrate Ws by moving the laminated substrate Ws in its thickness direction using a substrate moving mechanism 80. For illustrative purposes, Figure 15 omits the substrate moving mechanism 80. As shown in step 2-1 of Figure 15 , with the center C of the gap G in the thickness direction of the laminated substrate Ws positioned directly below the nozzle opening 22a of the spray nozzle 3, filler particles Fp are sprayed onto the surface of the laminated substrate Ws using the spray nozzle 3. For example, while the laminated substrate Ws is rotated once by the substrate holding device 2, the filling material particles Fp are sprayed by the spray nozzle 3 with the center C of the gap G in the thickness direction of the laminated substrate Ws located directly below the spray port 22a of the spray nozzle 3.

Next, step 2-2 is to move the laminated substrate Ws in the third direction D3 by means of the substrate moving mechanism 80, so that the center C of the gap G is positioned in the thickness direction of the laminated substrate Ws and is shifted in the third direction D3 relative to the position of the nozzle 22a of the spray nozzle 3 in the thickness direction of the laminated substrate Ws, and the filling material particles Fp are sprayed onto the surface by means of the spray nozzle 3. For example, while the laminated substrate Ws is rotated by the substrate holding device 2 for one cycle, the center C of the gap G is shifted in the thickness direction of the laminated substrate Ws to a third direction D3 relative to the position of the nozzle 22a of the nozzle 3 in the thickness direction of the laminated substrate Ws, and the filling material particles Fp are sprayed onto the surface by the nozzle 3.

In step 2-3, the stacking substrate Ws is moved in a fourth direction D4, which is opposite to the third direction D3, by the substrate moving mechanism 80. With the gap G in the thickness direction of the stacking substrate Ws displaced in the fourth direction D4 relative to the position of the nozzle 22a of the nozzle 3 in the thickness direction of the stacking substrate Ws, the filler particles Fp are sprayed by the spray nozzle 3. For example, while the stacking substrate Ws is rotated once by the substrate holding device 2, the filler particles Fp are sprayed onto the surface of the stacking substrate Ws by the spray nozzle 3 while the gap G in the thickness direction of the stacking substrate Ws is displaced in the fourth direction D4 relative to the position of the nozzle 22a of the nozzle 3 in the thickness direction of the stacking substrate Ws.

In step 2-4, the stacking substrate Ws is moved in the third direction D3 by the substrate moving mechanism 80. Similar to step 2-1, filler particles Fp are sprayed through the spray nozzle 3 with the center C of the gap G in the thickness direction of the stacking substrate Ws positioned directly below the nozzle opening 22a of the spray nozzle 3. For example, while the stacking substrate Ws is rotated once by the substrate holding device 2, the filler particles Fp are sprayed through the spray nozzle 3 with the center C of the gap G in the thickness direction of the stacking substrate Ws positioned directly below the nozzle opening 22a of the spray nozzle 3. Steps 2-1 to 2-4 may be repeated until the filling layer L is formed by filling the gap G of the laminate substrate Ws.

In one embodiment, in each of steps 2-1 to 2-4, filler particles Fp may be sprayed by the spray nozzle 3 while the laminate substrate Ws is rotated multiple times by the substrate holding device 2. In another embodiment, after steps 2-1 to 2-4, filler particles composed of a different material than the filler particles used in the initial steps 2-1 to 2-4 may be used in the subsequent repetition of steps 2-1 to 2-4. In this way, multiple filler layers composed of different materials are deposited in the gap G of the laminate substrate Ws.

Furthermore, in other embodiments, the laminated substrate Ws may be moved in its thickness direction by the substrate moving mechanism 80 and the filling material particles Fp may be sprayed by the spray nozzle 3 .

When this embodiment is adopted, the substrate moving mechanism 80 moves the stacking substrate Ws in its thickness direction, and the filling material particles Fp are deposited in the gap G of the stacking substrate Ws. The filling material particles Fp are not deposited in a part of the gap G, so that the filling layer L can be formed in the entire gap G.

In one embodiment, as shown in FIG16 , the substrate processing apparatus 1 may include a movement mechanism (nozzle movement mechanism) 85 for moving the spray nozzle 3 in the thickness direction of the laminated substrate Ws, in place of the substrate movement mechanism 80. The nozzle movement mechanism 85 of this embodiment includes: a nozzle holder 86 for holding the spray nozzle 3; a linear guide 87 for guiding the movement of the nozzle holder 86 in the thickness direction of the laminated substrate Ws; a linear motion mechanism 88 connected to the nozzle holder 86; and a motor 89 connected to the linear motion mechanism 88. Examples of the linear motion mechanism 88 include a ball bearing mechanism, a cylinder mechanism, and the like.

The motor 89 is configured to move the spray nozzle 3 in the thickness direction of the laminated substrate Ws via the linear motion mechanism 88, linear guide 87, and nozzle holder 86. In one embodiment, the nozzle moving mechanism 85 may include a linear electric actuator (such as a linear motor) instead of the linear guide 87, linear motion mechanism 88, and motor 89.

The nozzle moving mechanism 85 moves the spray nozzle 3 in the thickness direction of the laminated substrate Ws, displacing the nozzle orifice 22a of the spray nozzle 3 by a predetermined distance from the center C of the gap G in the thickness direction of the laminated substrate Ws. In other words, the nozzle moving mechanism 85 is configured to change the relative position of the center C of the gap G in the thickness direction of the laminated substrate Ws and the nozzle orifice 22a of the spray nozzle 3. The nozzle moving mechanism 85 (more specifically, the motor 89) is electrically connected to the motion control unit 10, and the motion of the nozzle moving mechanism 85 (more specifically, the motor 89) is controlled by the motion control unit 10.

The moving distance of the spray nozzle 3 in the thickness direction of the laminated substrate Ws is predetermined based on experimental results and the like so as to appropriately form the filling layer L in the gap G of the laminated substrate Ws.

Even in this embodiment, the nozzle moving mechanism 85 is used to move the spray nozzle 3 in the thickness direction of the laminate substrate Ws, and the spray nozzle 3 is used to deposit the filling material particles Fp in the gap G of the laminate substrate Ws, thereby filling the gap G.

FIG17 is a front view showing yet another embodiment of the substrate processing apparatus 1. Since the structure and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to FIG10 , a repeated description thereof will be omitted. The substrate processing apparatus 1 of this embodiment further includes an edge shape detector 90 for detecting the shape of the edge of the laminated substrate Ws. The spray nozzle 3 of this embodiment is the plasma plating nozzle described with reference to FIG4 , but one embodiment may also be the flame plating nozzle described with reference to FIG5 , or the Laval nozzle described with reference to FIG6 . The edge shape detector 90 of this embodiment can also be applied to any substrate processing apparatus 1 described with reference to FIG. 7 to FIG. 9 .

The edge shape detector 90 of this embodiment is configured to generate an image of the edge of the laminated substrate Ws to detect the shape of the edge of the laminated substrate Ws. As shown in Figure 2, the edge shape detector 90 is located radially outward of the laminated substrate Ws held by the substrate holder 2, and is positioned toward the edge of the laminated substrate Ws, including the gap G between the laminated substrate Ws and the edge of the laminated substrate Ws. The edge shape detector 90 is positioned upstream of the spray nozzle 3 in the rotational direction of the laminated substrate Ws and to the side of the laminated substrate Ws. The edge shape detector 90 includes an image detector (not shown) (e.g., a CMOS detector or a CCD detector). In one embodiment, the edge shape detector 90 may be a two-dimensional profile measuring device (line detector) that is a non-contact laser displacement detector.

FIG18 shows an example of an edge image of a laminated substrate Ws generated by the edge shape detector 90. The edge shape detector 90 is configured to detect the shape of the edge of the laminated substrate Ws based on the image of the edge of the laminated substrate Ws. The detected shape of the edge of the laminated substrate Ws includes the shape of the valley of the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. As shown in FIG17 , the edge shape detector 90 is electrically connected to the motion control unit 10. The edge shape of the laminated substrate Ws detected by the edge shape detector 90 is transmitted to the motion control unit 10.

The motion control unit 10 is configured to control the motion of the substrate rocking mechanism 70 based on the edge shape of the buildup substrate Ws detected by the edge shape detector 90. More specifically, the motion control unit 10 determines the tilt angle of the buildup substrate Ws when forming the filling layer L in the gap G of the buildup substrate Ws based on the edge shape of the buildup substrate Ws detected by the edge shape detector 90. For example, the motion control unit 10 determines the first angle of the spray direction J for spraying the filling material particles Fp from the spray nozzle 3 in step 1-2 of FIG. 12 , and the second angle of the spray direction J for spraying the filling material particles Fp from the spray nozzle 3 in step 1-3. The operation control unit 10 issues a command to the substrate rocking mechanism 70 to rock the buildup substrate Ws at a predetermined tilt angle, and forms a filling layer L in the gap G of the buildup substrate Ws using the spray nozzle 3.

In this embodiment, the tilt angle of the build-up substrate Ws is determined based on the edge shape of the build-up substrate Ws detected by the edge shape detector 90. As a result, the filling layer L can be appropriately formed to fill the gap G of the build-up substrate Ws.

The edge shape detector 90 described with reference to Figures 17 and 18 can also be applied to the substrate processing apparatus 1 equipped with the nozzle oscillating mechanism 75 described with reference to Figure 13. In this case, the motion control unit 10 is configured to control the motion of the nozzle oscillating mechanism 75 based on the edge shape of the build-up substrate Ws detected by the edge shape detector 90. More specifically, the motion control unit 10 determines the tilt angle of the ejection nozzle 3 when forming the filling layer L in the gap G of the build-up substrate Ws based on the edge shape of the build-up substrate Ws detected by the edge shape detector 90. The operation control unit 10 issues a command to the nozzle swing mechanism 75 to swing the ejection nozzle 3 at a predetermined angle, thereby forming a filling layer L in the gap G of the laminated substrate Ws using the ejection nozzle 3.

The edge shape detector 90 described with reference to Figures 17 and 18 can also be applied to the substrate processing apparatus 1 equipped with the substrate moving mechanism 80 described with reference to Figure 14. In this case, the motion control unit 10 is configured to control the motion of the substrate moving mechanism 80 based on the edge shape of the laminated substrate Ws detected by the edge shape detector 90. More specifically, the motion control unit 10 determines the movement distance in the thickness direction of the laminated substrate Ws when forming the filling layer L in the gap G of the laminated substrate Ws based on the edge shape of the laminated substrate Ws detected by the edge shape detector 90. The motion control unit 10 issues a command to the substrate moving mechanism 80 to move the laminated substrate Ws by a predetermined distance in its thickness direction, and forms a filling layer L in the gap G of the laminated substrate Ws by the spray nozzle 3.

The edge shape detector 90 described with reference to Figures 17 and 18 can also be applied to the substrate processing apparatus 1 equipped with the nozzle moving mechanism 85 described with reference to Figure 16. In this case, the motion control unit 10 is configured to control the motion of the nozzle moving mechanism 85 based on the edge shape of the laminated substrate Ws detected by the edge shape detector 90. More specifically, the motion control unit 10 determines the movement distance of the ejection nozzle 3 in the thickness direction of the laminated substrate Ws when forming the filling layer L in the gap G of the laminated substrate Ws based on the edge shape of the laminated substrate Ws detected by the edge shape detector 90. The operation control unit 10 issues a command to the nozzle moving mechanism 85 to move the spray nozzle 3 by a predetermined distance in the thickness direction of the laminate substrate Ws, thereby forming a filling layer L in the gap G of the laminate substrate Ws through the spray nozzle 3 .

In one embodiment, the edge shape detector 90 may be installed in a separate device from the substrate processing apparatus 1. In this case, the edge shape detector 90 pre-detects the edge shape of the laminated substrate Ws before it is transported to the substrate processing apparatus 1. The edge shape of the laminated substrate Ws detected by the edge shape detector 90 is sent to the motion control unit 10. The motion control unit 10 controls the operation of the substrate oscillating mechanism 70, the nozzle oscillating mechanism 75, the substrate moving mechanism 80, or the nozzle moving mechanism 85 based on the edge shape of the laminated substrate Ws, and forms the filling layer L in the gap G of the laminated substrate Ws using the spray nozzle 3.

The above embodiments are described with the intention that those skilled in the art can implement the present invention. Those skilled in the art will naturally be able to implement various variations of the above embodiments, and the technical concepts of the present invention are also applicable to other embodiments. Therefore, the present invention is not limited to the described embodiments but is to be interpreted within the broadest scope of the technical concepts defined by the scope of the patent application.

[Industrial Applicability] The present invention can be used in a substrate processing apparatus and method for forming a filling layer on a laminated substrate comprising a plurality of substrates bonded together.

1: Substrate processing device 2: Substrate holding device 3: Spray nozzle 5: Holding stage 5a: Holding surface 6: Rotation axis 8: Rotation mechanism 10: Motion control unit 10a: Memory device 10b: Calculation device 12: Filler particle supply line 13: Filler particle supply source 15: Carrier gas supply line 16: Carrier gas supply source 17: Flow control valve 18: Flow meter 20: Plasma gas supply line 22: Nozzle body 22a: Spray port 23: Cathode 24: Anode 25: Plasma gas flow path 27: Filler particle introduction line 30: Fuel supply line 31: Combustion-supporting gas supply line 33: Nozzle body 33a: Injection port 34: Fuel flow path 35: Combustion-supporting gas flow path 36: Combustion chamber 38: Filler particle inlet line 40: Nozzle body 40a: Reduction section 40b: Injection port 41: Flow path 41a: Throat section 43: Heating gas inlet line 45: Heating gas supply line 46: Heater 47: Carrier gas supply line 48: Flow control valve 49: Flow meter 51: Vaporization chamber 53: Heater 55: Vacuum chamber 56: Vacuum line 58: Vacuum pump 60: Suspension generating device 61: Suspension pump 65: Aerosol chamber 70: Rocking mechanism (substrate rocking mechanism) 72: Rocking arm 73: Rocking shaft 74: Motor 75: Rocking mechanism (nozzle rocking mechanism) 77: Nozzle holder 78: Rocking shaft 79: Motor 80: Substrate moving mechanism 81: Connecting member 82: Linear guide rail 83: Direct-acting mechanism 84: Motor 85: Nozzle moving mechanism 86: Nozzle holder 87: Linear guide rail 88: Direct-acting mechanism 89: Motor 90: Edge shape detector D1: First direction D2: Second direction D3: Third direction D4: Fourth direction E1, E2: Edge Ek: Knife edge Fm: Filler Fp: Filler particles Fs: Suspended liquid G: Gap J: Spray direction K: Distance from the nozzle of the plasma, flame, or Laval nozzle to the outermost edge of the laminate substrate L: Filler layer O: Oscillation center P: Plasma R: Rotation axis S1, S2: Component surface W1: First substrate W2: Second substrate Ws: Laminated substrate

Figure 1A is a cross-sectional view showing an example of the edge of a laminated substrate being processed. Figure 1B is a cross-sectional view showing an example of the edge of a laminated substrate having a filler layer formed thereon. Figure 1C is a cross-sectional view showing an example of the edge of a laminated substrate thinned after the filler layer is formed. Figure 2 is a front view showing an embodiment of a substrate processing apparatus. Figure 3 is a side view of the substrate processing apparatus shown in Figure 2. Figure 4 is a schematic view showing an embodiment of a spray nozzle. Figure 5 is a schematic view showing another embodiment of a spray nozzle. Figure 6 is a schematic view showing yet another embodiment of a spray nozzle. Figure 7 is a side view showing another embodiment of a substrate processing apparatus. Figure 8 is a side view showing yet another embodiment of a substrate processing apparatus. Figure 9 is a side view showing yet another embodiment of a substrate processing apparatus. Figure 10 is a side view showing yet another embodiment of a substrate processing apparatus. Figure 11 is a schematic diagram showing how filler material particles are deposited in gaps between stacked substrates using a spray nozzle. Figure 12 is a schematic diagram showing one embodiment of a method for forming a filler layer in gaps between stacked substrates by rocking a stacked substrate using a substrate rocking mechanism. Figure 13 is a side view showing yet another embodiment of a rocking mechanism. Figure 14 is a side view showing yet another embodiment of a substrate processing apparatus. Figure 15 is a schematic diagram showing one embodiment of a method for moving a laminate substrate in its thickness direction using a substrate moving mechanism to form a filler layer in gaps between the laminate substrates. Figure 16 is a side view showing yet another embodiment of the moving mechanism. Figure 17 is a front view showing yet another embodiment of a substrate processing apparatus. Figure 18 is an example of an edge image of a laminate substrate generated by an edge shape detector.

1: Substrate processing equipment

2: Substrate holding device

3: Spray nozzle

5: Maintain the stage

5a: Maintaining the face

6: Rotation axis

8: Rotating mechanism

10: Motion Control Unit

10a: Memory device

10b: Calculation device

12: Filling material particle supply pipeline

13: Filling material particle supply source

15: Carrier gas supply line

16: Carrier gas supply source

17: Flow Control Valve

18: Flow meter

E1, E2: Edges

Fp: Filler particles

G: Gap

R: Rotation axis

W1: First substrate

W2: Second substrate

Ws: built-up substrate

Claims (28)

A substrate processing apparatus for forming a filling layer on a laminate substrate comprising a first substrate and a second substrate bonded thereto, comprising: a substrate holding device for holding and rotating the laminate substrate; a spray nozzle for accelerating filling material particles constituting the filling layer and spraying the filling material particles onto a gap between an edge portion of the first substrate and an edge portion of the second substrate; and a filling material particle supply line connected to the spray nozzle for supplying the filling material particles to the spray nozzle. The substrate processing apparatus as described in claim 1, wherein the spray nozzle is a plasma spraying nozzle, which accelerates the filling material particles by heat generated by plasma and melts the filling material particles by heat generated by the plasma. The substrate processing apparatus as described in claim 1, wherein the spray nozzle is a flame spraying nozzle, which accelerates the filler material particles by heat generated by a burning flame and melts the filler material particles by heat generated by the burning flame. The substrate processing apparatus as described in claim 1, wherein the spray nozzle is a de Laval nozzle, which accelerates the filling material particles to a speed exceeding the speed of sound. The substrate processing apparatus of claim 4 further comprises a heating gas supply line connected to the Laval nozzle for supplying heating gas to the Laval nozzle. The Laval nozzle is configured such that the heating gas heats the filler particles. The substrate processing apparatus as described in claim 4 further comprises a vaporization chamber connected to the filler particle supply line for vaporizing a filler material, which is a material of the filler particles. The Laval nozzle is configured to accelerate the filler particles formed from the vaporized filler material and spray the filler particles onto the gap. The substrate processing apparatus of claim 1 further comprises a suspension liquid generating device connected to the filler material particle supply line for dispersing the filler material particles in a liquid to generate a suspension liquid containing the filler material particles. The spray nozzle is configured to accelerate the suspension liquid and spray it onto the gap. The substrate processing apparatus of claim 1 further comprises an aerosol chamber connected to the filler particle supply line for aerosolizing the filler particles. The spray nozzle is configured to accelerate the aerosolized filler particles and spray them onto the gap. The substrate processing apparatus as claimed in claim 1 further comprises a rocking mechanism that rocks the laminated substrate or the spray nozzle around a designated rocking center. The substrate processing apparatus as claimed in claim 1 further comprises a moving mechanism for moving the laminated substrate or the spray nozzle in a thickness direction of the laminated substrate. The substrate processing apparatus of claim 9 further comprises: an edge shape detector for detecting the shape of the edge of the laminated substrate; and an operation control unit for controlling the operation of the rocking mechanism; the operation control unit is configured to cause the rocking mechanism to rock the laminated substrate or the spray nozzle about the rocking center based on the detected edge shape. The substrate processing apparatus of claim 10 further comprises: an edge shape detector for detecting the shape of the edge of the laminated substrate; and a motion control unit for controlling the movement of the moving mechanism; the motion control unit is configured to cause the moving mechanism to move the laminated substrate or the spray nozzle in the thickness direction of the laminated substrate based on the detected edge shape. The substrate processing apparatus as described in claim 1, wherein the filler particles are composed of the same material as the material constituting the laminate substrate or a compound thereof. The substrate processing apparatus as described in claim 1, wherein the aforementioned filling material particles are composed of ceramics. A substrate processing method forms a filling layer on a laminate substrate comprising a first substrate and a second substrate bonded together. Filling material particles constituting the filling layer are supplied to a spray nozzle. While the laminate substrate is rotated, the spray nozzle accelerates the filling material particles and sprays the filling material particles onto a gap between an edge of the first substrate and an edge of the second substrate. The substrate processing method as described in claim 15, wherein the filling material particles are accelerated by the spray nozzle and sprayed onto the gap, wherein the filling material particles are accelerated by a plasma plating nozzle using heat generated by plasma, the filling material particles are melted by the heat generated by the plasma, and the melted filling material particles are sprayed onto the gap. The substrate processing method as described in claim 15, wherein the filling material particles are accelerated by the spray nozzle and sprayed onto the gap, wherein the filling material particles are accelerated by the heat generated by a burning flame by a flame plating nozzle, and the filling material particles are melted by the heat generated by the burning flame, and the melted filling material particles are sprayed onto the gap. The substrate processing method as described in claim 15, wherein the filling material particles are accelerated by the spray nozzle, and the filling material particles are accelerated to a speed exceeding the speed of sound by a de Laval nozzle. The substrate processing method of claim 18 further comprises supplying a heated gas to the Laval nozzle, accelerating the filler material particles via the spray nozzle, and spraying the filler material particles onto the gap, wherein the filler material particles are accelerated to a speed exceeding the speed of sound via the Laval nozzle, heated with the heated gas, and then sprayed onto the gap. The substrate processing method of claim 18, wherein the filling material particles are supplied to the spray nozzle by vaporizing a filling material serving as the material of the filling material particles and supplying the filling material particles formed from the vaporized filling material to the spray nozzle; and wherein the filling material particles are accelerated by the spray nozzle and sprayed onto the gap by accelerating the filling material particles to a speed exceeding the speed of sound by the Laval nozzle and spraying the filling material particles onto the gap. The substrate processing method of claim 15, wherein the filling material particles are supplied to the spray nozzle by dispersing the filling material particles in a liquid to form a suspension containing the filling material particles, and the suspension is supplied to the spray nozzle; The filling material particles are accelerated by the spray nozzle and sprayed onto the gap by the spray nozzle, wherein the suspension is accelerated by the spray nozzle and sprayed onto the gap. The substrate processing method of claim 15, wherein the supplying of the filler material particles into the spray nozzle comprises aerosolizing the filler material particles and supplying the aerosolized filler material particles into the spray nozzle; and wherein the accelerating of the filler material particles by the spray nozzle and spraying the filler material particles onto the gap comprises accelerating the aerosolized filler material particles by the spray nozzle and spraying the aerosolized filler material particles onto the gap. The substrate processing method as described in claim 15 further includes shaking the aforementioned laminated substrate or the aforementioned spray nozzle around a designated shaking center. The substrate processing method as described in claim 15 further includes moving the aforementioned laminated substrate or the aforementioned spray nozzle in the thickness direction of the aforementioned laminated substrate. The substrate processing method of claim 23 further comprises detecting a shape of an edge of the laminated substrate, and oscillating the laminated substrate or the spray nozzle with the oscillation center as the center based on the detected edge shape. The substrate processing method of claim 24 further comprises detecting the shape of an edge of the laminate substrate, and moving the laminate substrate or the spray nozzle in the thickness direction of the laminate substrate based on the detected edge shape. The substrate processing method as described in claim 15, wherein the aforementioned filling material particles are composed of the same material as the material constituting the aforementioned laminated substrate or a compound thereof. The substrate processing method as described in claim 15, wherein the aforementioned filling material particles are composed of ceramics.