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TW202526320A - An acoustic subsurface inspection device and method - Google Patents

An acoustic subsurface inspection device and method Download PDF

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Publication number
TW202526320A
TW202526320A TW113149984A TW113149984A TW202526320A TW 202526320 A TW202526320 A TW 202526320A TW 113149984 A TW113149984 A TW 113149984A TW 113149984 A TW113149984 A TW 113149984A TW 202526320 A TW202526320 A TW 202526320A
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acoustic
sample
subsurface
signal
afm
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哈美德 沙地海恩瑪納尼
尼蘭詹 賽庫馬爾
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荷蘭商近場儀器有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01QSCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/24AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
    • G01Q60/32AC mode
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • G01N29/06Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654Imaging
    • G01N29/0681Imaging by acoustic microscopy, e.g. scanning acoustic microscopy
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01QSCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q30/00Auxiliary means serving to assist or improve the scanning probe techniques or apparatus, e.g. display or data processing devices
    • G01Q30/04Display or data processing devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01QSCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q70/00General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
    • G01Q70/06Probe tip arrays

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  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

The present application discloses an acoustic subsurface inspection device (1) an a corresponding method. The disclosure comprises performing a measurement session including at least two acoustic measurements, each acoustic measurement comprising inputting an acoustic wave at an input location at a surface (114) of a sample (11) and generating a respective sense signal (S32a, S32b) that is indicative for a measured reflections of the acoustic wave at a measurement location. A measurement session comprises at least two acoustic measurements that are performed with a different input location and/or a different measurement location. Subsequently output data indicative for subsurface features in the sample is generated based on a computation using the respective sense signals generated with the at least two acoustic measurements in the measurement session.

Description

聲學次表面檢測裝置及方法Acoustic subsurface detection device and method

發明領域 本申請案係關於一種聲學次表面檢測裝置。 Field of the Invention This application relates to an acoustic subsurface detection device.

本申請案進一步係關於一種聲學次表面檢測方法。This application further relates to an acoustic subsurface detection method.

發明背景 聲學檢測裝置及方法可供用於微影行業中以使得能夠對成品及/或中間產品進行次表面檢測,以便適當地控制製程之對準及製程參數且視需要移除無效產品。根據莫耳定律(Moore's law),半導體裝置之關鍵尺寸變得愈來愈小,以便實現不斷增加之積體度。亦存在製造具有增加數目個層之裝置的趨勢。 Background of the Invention Acoustic inspection devices and methods can be used in the lithography industry to enable subsurface inspection of finished and/or intermediate products to properly control process alignment and process parameters and, if necessary, remove defective products. According to Moore's law, critical dimensions of semiconductor devices are becoming increasingly smaller to achieve ever-increasing integration. There is also a trend toward fabricating devices with an increasing number of layers.

現有聲學檢測方法根據第一基於低頻之方法及第二基於高頻之方法操作。在第一方法中,在相對低聲頻(例如,在約1 MHz至幾百MHz之範圍內)下量測樣本表面之剛度。隨即,可在高達約2微米深度之次奈米解析度下識別次表面特徵。在第二方法中,在例如超過1 GHz之相對高聲頻下量測彈性及波散射。此方法使得可以比第一方法可能之位準更深之位準檢測樣本,但到目前為止,與第一方法可實現之解析度相比,實際上可實現之解析度較差。Existing acoustic detection methods operate according to a first, low-frequency-based approach and a second, high-frequency-based approach. In the first approach, the stiffness of a sample's surface is measured at relatively low acoustic frequencies (e.g., in the range of approximately 1 MHz to several hundred MHz). Consequently, subsurface features can be identified with sub-nanometer resolution at depths up to approximately 2 microns. In the second approach, elasticity and wave scattering are measured at relatively high acoustic frequencies, e.g., exceeding 1 GHz. This approach allows for deeper detection of samples than is possible with the first approach, but to date, the resolution achievable has been poor compared to that achieved with the first approach.

發明概要 本揭露內容之一目標為提供一種改良之聲學次表面檢測裝置以解決上述缺點。 Summary of the Invention An object of the present disclosure is to provide an improved acoustic subsurface detection device to address the aforementioned shortcomings.

本揭露內容之進一步目標為提供一種改良之聲學次表面檢測方法以解決上述缺點。A further object of the present disclosure is to provide an improved acoustic subsurface detection method to address the above-mentioned shortcomings.

根據首先提及之目標,改良之聲學次表面檢測裝置包含用於固持待檢測之樣本之載體、信號產生器、至少一個AFM尖端、側向定位裝置、距離控制裝置及信號處理器。According to the first-mentioned object, an improved acoustic subsurface detection device includes a carrier for holding a sample to be detected, a signal generator, at least one AFM tip, a lateral positioning device, a distance control device and a signal processor.

如上文所指出,裝置尤其與微影行業中之應用相關,其中待檢測之樣本為半導體裝置,例如(半成品)積體電路,諸如NAND記憶體。在其他實例中,樣本為包含高度積體之光學電路系統之微光裝置。在又進一步示例中,樣本為MEMS裝置。在再進一步示例中,樣本包含選自電子、光學及機械元件中之二者或更多者之組合。As noted above, the device is particularly relevant for applications in the lithography industry, where the sample to be inspected is a semiconductor device, such as a (semi-finished) integrated circuit, such as a NAND memory. In other examples, the sample is a micro-optical device comprising a highly integrated optical circuit system. In yet another example, the sample is a MEMS device. In yet another example, the sample comprises a combination of two or more selected from electronic, optical, and mechanical components.

信號產生器經組配以提供驅動信號,運用該驅動信號驅動至少一個AFM尖端以便在樣本之表面上之輸入位置處將聲波感應至樣本中。隨即,電驅動信號可藉由致動器(諸如靜電或壓電致動器)被轉換為用於至少一個AFM尖端之聲學信號。根據另一方法,聲學信號由雷射產生,該雷射將調變雷射束引導至尖端或承載尖端之懸臂支架或隔膜。A signal generator is configured to provide a drive signal that drives at least one AFM tip to induce acoustic waves into the sample at an input location on the sample's surface. The electrical drive signal can then be converted into an acoustic signal for the at least one AFM tip by an actuator (such as an electrostatic or piezoelectric actuator). According to another approach, the acoustic signal is generated by a laser that directs a modulated laser beam toward the tip or a cantilever or diaphragm supporting the tip.

至少一個AFM尖端或另一至少一個AFM尖端(亦)經組配用於在樣本之表面上之接收位置處接收樣本中之聲波之反射。為此,其耦接至經組配以產生指示所接收之經反射聲波之感測信號的聲學感測器(例如,壓電元件)。在單個AFM尖端經組配以感應聲波及接收經反射聲波二者之情況下,用以將電信號轉換成聲學信號之致動器(例如,壓電元件)亦可充當用以將聲學信號轉換成電信號之感測器。在僅存在經組配以感應聲波及接收經反射聲波之單個AFM尖端之情況下,致動器、信號產生器較佳地經組配以產生脈衝信號。此簡化待對感測信號執行之信號處理操作。在一些示例中,信號處理器產生脈衝信號,該脈衝信號具有與反射到達單個AFM尖端所花費之時間相比短的脈衝持續時間,使得由反射產生之所感測信號可容易地與由聲學輸入信號產生之所感測信號區分開。在此等示例中之一些中,信號處理器產生脈衝列中之脈衝,其中後續脈衝之間的時間間隔超過回應持續時間。回應持續時間例如被定義為其中回應振幅已減小至實質上小於其最大值(例如小於最大值之10倍或小於最大值之100倍)之值的時間間隔。At least one AFM tip or at least one other AFM tip is (also) configured to receive reflections of acoustic waves in the sample at a receiving location on the surface of the sample. To this end, it is coupled to an acoustic sensor (e.g., a piezoelectric element) configured to generate a sensing signal indicative of the received reflected acoustic waves. In the case where a single AFM tip is configured to both sense and receive reflected acoustic waves, an actuator (e.g., a piezoelectric element) for converting electrical signals into acoustic signals can also serve as the sensor for converting acoustic signals into electrical signals. In the case where there is only a single AFM tip configured to sense and receive reflected acoustic waves, the actuator, the signal generator, is preferably configured to generate a pulse signal. This simplifies the signal processing operations to be performed on the sensing signal. In some examples, the signal processor generates a pulse signal having a pulse duration that is short compared to the time it takes for a reflection to reach a single AFM tip, so that a sensed signal resulting from the reflection can be easily distinguished from a sensed signal resulting from the acoustic input signal. In some of these examples, the signal processor generates pulses in a pulse train in which the time interval between subsequent pulses exceeds a response duration. The response duration is defined, for example, as the time interval in which the response amplitude has decreased to a value substantially less than its maximum value (e.g., less than 10 times the maximum value or less than 100 times the maximum value).

在個別AFM尖端用於感應聲波及接收經反射聲波之情況下,則更易於將由於反射而產生之所感測信號與由聲學輸入信號產生之所感測信號區分開。信號處理器可產生驅動信號作為連續高頻信號或產生針對其中使用單個AFM尖端之情況所描述的脈衝狀信號。In cases where a single AFM tip is used to sense acoustic waves and receive reflected acoustic waves, it is easier to distinguish the sensed signals due to reflections from those due to the acoustic input signal. The signal processor can generate the drive signal as a continuous high-frequency signal or as a pulsed signal as described for the case where a single AFM tip is used.

側向定位裝置用於控制至少一個AFM尖端相對於樣本之表面的側向位置。通常,側向定位裝置經組配以例如藉由定位樣本及/或至少一個AFM尖端而控制在樣本表面之二個正交方向上的側向位置。The lateral positioning device is used to control the lateral position of at least one AFM tip relative to the surface of the sample. Typically, the lateral positioning device is configured to control the lateral position of the sample surface in two orthogonal directions, for example, by positioning the sample and/or at least one AFM tip.

距離控制裝置控制AFM尖端中之至少一者相對於樣本之表面的距離。在示例中,距離控制裝置控制承載至少一個AFM尖端之裝置頭部在橫向於樣本表面之方向上的位置。替代地或另外,距離控制裝置控制配置於裝置頭部中之AFM尖端在橫向於樣本表面之方向上的位置。The distance control device controls the distance of at least one of the AFM tips relative to the surface of the sample. In one example, the distance control device controls the position of a device head carrying the at least one AFM tip in a direction transverse to the sample surface. Alternatively or additionally, the distance control device controls the position of the AFM tip disposed in the device head in a direction transverse to the sample surface.

信號處理器經組配用於產生關於樣本中之次表面特徵的輸出資料。輸出資料包含例如次表面特徵之位置、次表面特徵之形狀、次表面特徵之材料屬性及類似者。The signal processor is configured to generate output data related to subsurface features in the sample. The output data includes, for example, the location of the subsurface feature, the shape of the subsurface feature, the material properties of the subsurface feature, and the like.

聲學次表面檢測裝置經組配以執行具有運用相互不同之輸入位置及/或相互不同之接收位置進行之至少二個聲學量測的量測時期。信號處理器經組配以組合來自運用量測時期中之至少二個聲學量測產生之各別感測信號的資訊,以計算關於樣本中之次表面特徵的資訊。The acoustic subsurface detection device is configured to perform a measurement session comprising at least two acoustic measurements performed using different input positions and/or different receiving positions. The signal processor is configured to combine information from respective sensed signals generated from the at least two acoustic measurements during the measurement session to calculate information about subsurface features in the sample.

由於信號處理器組合來自運用量測時期中之至少二個聲學量測產生之各別感測信號的資訊的事實,因此其可獲得關於樣本中之次表面特徵的資訊,否則該資訊將不可用。Due to the fact that the signal processor combines information from the respective sensing signals resulting from at least two acoustic measurements applied during the measurement period, it can obtain information about sub-surface features in the sample that would otherwise not be available.

如上文所指出,在一些示例中,使用AFM尖端,該AFM尖端經組配用於感應聲波且經組配用於接收聲波之反射。在彼等示例中,在AFM尖端相對於樣本表面之相互不同之側向位置處以相互不同之時間間隔執行至少二個聲學量測。側向位置中之第一者為第一聲學量測中之輸入位置及接收位置。側向位置中之第二者為第二聲學量測中之輸入位置及接收位置。As noted above, in some examples, an AFM tip is used that is configured to sense acoustic waves and receive reflections of the acoustic waves. In these examples, at least two acoustic measurements are performed at different lateral positions of the AFM tip relative to the sample surface and at different time intervals. The first of the lateral positions serves as the input and receiving position in the first acoustic measurement. The second of the lateral positions serves as the input and receiving position in the second acoustic measurement.

在另一實施例中,聲學次表面檢測裝置包含經組配用於將聲波感應至樣本中之複數個傳輸AFM尖端及用於接收經反射聲波之至少一個單獨接收AFM尖端。在彼實施例中,信號處理器經組配以基於由源自複數個傳輸AFM尖端中之各者的聲波之反射產生的所產生感測信號之比較而產生輸出資料。In another embodiment, an acoustic subsurface detection apparatus includes a plurality of transmitting AFM tips configured to induce acoustic waves into a sample and at least one separate receiving AFM tip configured to receive reflected acoustic waves. In that embodiment, a signal processor is configured to generate output data based on a comparison of generated sensing signals resulting from reflections of acoustic waves from each of the plurality of transmitting AFM tips.

在另一實施例中,聲學次表面檢測裝置包含經組配用於接收經反射聲波之複數個接收AFM尖端以及至少一個傳輸AFM尖端,且信號處理器經組配以基於由複數個接收AFM尖端中之各者提供的所產生感測信號之比較而產生輸出資料。In another embodiment, the acoustic subsurface detection device includes a plurality of receiving AFM tips configured to receive reflected acoustic waves and at least one transmitting AFM tip, and the signal processor is configured to generate output data based on a comparison of generated sensing signals provided by each of the plurality of receiving AFM tips.

AFM尖端不必靜態地組配為傳輸AFM尖端、接收AFM尖端或同時組配為二者。在一些示例中,聲學次表面檢測裝置包含至少一個AFM尖端,該至少一個AFM尖端可動態組配為傳輸AFM尖端、接收AFM尖端或同時組配為二者。An AFM tip need not be statically configured as a transmitting AFM tip, a receiving AFM tip, or both. In some examples, an acoustic subsurface probing apparatus includes at least one AFM tip that is dynamically configured as a transmitting AFM tip, a receiving AFM tip, or both.

如上文所指出,驅動信號可提供為脈衝列。在聲學量測時期中之同一聲學量測期間,亦即,在不改變輸入位置及接收位置的同時,可針對脈衝列中之各脈衝獲得複數個感測信號。可對所獲得之複數個感測信號進行統計分析,例如以導出量測雜訊之估計及/或提供經去雜感測信號。此外,驅動信號可提供為脈衝列,以便執行鎖定偵測。As noted above, the drive signal can be provided as a pulse train. During the same acoustic measurement period during an acoustic measurement session, that is, while the input and receiving positions remain unchanged, multiple sensed signals can be obtained for each pulse in the pulse train. Statistical analysis can be performed on the multiple sensed signals obtained, for example, to derive an estimate of measurement noise and/or to provide a de-noised sensed signal. Furthermore, the drive signal can be provided as a pulse train to facilitate lock detection.

在一些實施例中,聲學次表面檢測裝置之信號處理器包含峰值偵測單元及計算單元,該峰值偵測單元用以判定在量測時期中之至少二個聲學量測中之各別者中獲得之各別感測信號中出現峰值的各別延遲,該計算單元用以根據各別延遲之間的差而計算次表面特徵之位置。各別延遲之間的差為次表面特徵之側向位置之單調函數。隨即,次表面特徵之側向位置可運用反函數根據經量測差來計算,或運用其近似,例如使用查找表或多項式近似來估計。In some embodiments, a signal processor of an acoustic subsurface detection device includes a peak detection unit and a calculation unit. The peak detection unit is configured to determine the respective delays at which peaks occur in respective sense signals obtained in respective ones of at least two acoustic measurements during a measurement period. The calculation unit is configured to calculate the position of a subsurface feature based on the difference between the respective delays. The difference between the respective delays is a monotonic function of the lateral position of the subsurface feature. The lateral position of the subsurface feature can then be calculated from the measured differences using an inverse function or an approximation thereof, such as an estimate using a lookup table or a polynomial approximation.

在存在更多次表面特徵之情況下,峰值偵測單元可經組配以偵測信號中之複數個峰值且使相互對應之峰值之間的延遲差相關。第一聲學量測之感測信號中出現的峰值可與第二聲學量測之感測信號中出現的峰值成對,其限制條件為第一量測中之輸入位置及接收位置充分靠近第二量測中之輸入位置及接收位置。In the presence of more subsurface features, the peak detection unit can be configured to detect multiple peaks in the signal and correlate the delay differences between corresponding peaks. A peak appearing in the sensed signal of a first acoustic measurement can be paired with a peak appearing in the sensed signal of a second acoustic measurement, provided that the input and receiving locations in the first measurement are sufficiently close to the input and receiving locations in the second measurement.

進一步可在相互不同之輸入位置及/或相互不同之接收位置處執行具有多於二個聲學量測之量測時期,例如以判定次表面特徵之多於一個座標。Furthermore, measurement sessions with more than two acoustic measurements can be performed at mutually different input positions and/or mutually different receiving positions, for example to determine more than one coordinate of a subsurface feature.

在替代實施例中,聲學次表面檢測裝置之信號處理器包含預測模組,該預測模組經組配以基於樣本之模型而產生所預測偵測信號且基於所預測偵測信號與實際偵測信號之比較而產生輸出資料。在此實施例中,所預測偵測信號與實際偵測信號之間的比較指示樣本之屬性是否偏離其應該之屬性。若為此情況,則可對樣本進行進一步量測以識別偏離之原因。In an alternative embodiment, the signal processor of the acoustic subsurface detection device includes a prediction module configured to generate a predicted detection signal based on a sample-based model and to generate output data based on a comparison of the predicted detection signal with the actual detection signal. In this embodiment, the comparison between the predicted detection signal and the actual detection signal indicates whether the properties of the sample deviate from their expected properties. If so, further measurements can be performed on the sample to identify the cause of the deviation.

在聲學次表面檢測裝置之再另一實施例中,信號處理器包含經訓練神經網路,該經訓練神經網路接收各別感測信號且經組配以將神經網路操作應用於所接收感測信號以估計次表面特徵之屬性。所獲得感測信號包含關於存在於樣本中之次表面特徵之卷積資訊。出於重建關於次表面特徵之資訊的目的,可訓練神經網路。由於感測信號由局部資訊支配之事實,可運用具有大量訓練區之訓練樣本來訓練神經網路,該等訓練區具有相互不同之次表面圖案。訓練樣本之在設計時間判定之屬性隨即充當地面實況。In yet another embodiment of an acoustic subsurface detection device, a signal processor includes a trained neural network that receives individual sensor signals and is configured to apply neural network operations to the received sensor signals to estimate properties of subsurface features. The acquired sensor signals include convolutional information about subsurface features present in a sample. The neural network can be trained to reconstruct information about the subsurface features. Due to the fact that the sensor signals are dominated by local information, the neural network can be trained using training samples with a large number of training areas having mutually different subsurface patterns. The properties of the training samples determined at design time then serve as ground truth.

在進一步實施例中,聲學次表面檢測裝置之信號處理器包含上文所描述之信號分析組件中之二者或更多者,以便以各種方式分析感測信號。 本申請案進一步係關於一種改良之聲學次表面檢測方法,其固持待檢測之樣本。 In a further embodiment, the signal processor of an acoustic subsurface detection device includes two or more of the signal analysis components described above to analyze the sensed signal in various ways. This application further relates to an improved acoustic subsurface detection method that holds a sample to be detected.

方法包含執行包括至少二個聲學量測之量測時期。各聲學量測包含在樣本表面之輸入位置處輸入聲波且產生在樣本表面之量測位置處量測聲波之反射的各別感測信號。至少二個聲學量測係運用不同輸入位置及/或不同量測位置執行的。The method includes performing a measurement session comprising at least two acoustic measurements. Each acoustic measurement includes inputting an acoustic wave at an input location on a sample surface and generating a respective sensing signal that measures a reflection of the acoustic wave at a measurement location on the sample surface. The at least two acoustic measurements are performed using different input locations and/or different measurement locations.

接著,使用運用量測時期中之至少二個聲學量測產生之各別感測信號,基於計算而產生指示樣本中之次表面特徵的輸出資料。Then, output data indicative of subsurface features in the sample is generated based on calculations using respective sensing signals generated by at least two acoustic measurements during the measurement period.

聲學次表面檢測方法之實施例進一步包含在固持待檢測之樣本之步驟之前的額外步驟。Embodiments of the acoustic subsurface inspection method further include an additional step prior to the step of holding the sample to be inspected.

額外步驟包含: 提供神經網路; 提供至少一個測試樣本; 執行複數個聲學量測,複數個聲學量測中之各聲學量測包含: 在輸入位置處輸入聲學輸入信號且在感測位置處獲得指示聲學反射信號之感測信號,其中至少二個聲學量測之輸入位置及/或感測位置處於相對於樣本表面之相互不同之側向位置。 Additional steps include: Providing a neural network; Providing at least one test sample; Performing a plurality of acoustic measurements, each of the plurality of acoustic measurements comprising: Inputting an acoustic input signal at an input location and obtaining a sensing signal indicative of an acoustic reflection signal at a sensing location, wherein the input location and/or sensing location of at least two of the acoustic measurements are located at different lateral positions relative to the sample surface.

隨即,出於重建關於次表面特徵之資訊的目的而訓練神經網路。由於感測信號由局部資訊支配之事實,可運用具有大量訓練區之訓練樣本來執行訓練,該等訓練區具有相互不同之次表面圖案。訓練樣本之在設計時間判定之屬性隨即充當地面實況。The neural network is then trained to reconstruct information about subsurface features. Since sensory signals are dominated by local information, training can be performed using training samples from a large number of training regions with distinct subsurface patterns. The properties of the training samples, determined at design time, then serve as ground truth.

在聲學次表面檢測方法之實施例中,計算包含產生指示各別感測信號之間的差的差信號。此充當簡化用於產生輸出資料之進一步計算步驟的中間計算步驟。In an embodiment of the acoustic subsurface detection method, the calculation includes generating a difference signal indicating the difference between the respective sense signals. This serves as an intermediate calculation step that simplifies further calculation steps for generating output data.

在實施例中,聲學次表面檢測裝置包含預測模組,該預測模組經組配以基於樣本之模型而產生所預測偵測信號且基於所預測偵測信號與實際偵測信號之比較而產生輸出資料。在此情況下,不必根據偵測信號重建次表面特徵。實情為,基於該比較,可判定是否存在次表面缺陷。In one embodiment, an acoustic subsurface inspection device includes a prediction module configured to generate a predicted detection signal based on a sample model and to generate output data based on a comparison of the predicted detection signal with the actual detection signal. In this case, it is not necessary to reconstruct subsurface features from the detection signal. Instead, the presence of a subsurface defect can be determined based on the comparison.

在聲學次表面檢測裝置之實施例中,經組配以偵測反射之至少一個AFM尖端相對於經組配用於供應聲學輸入信號之至少一個AFM尖端處於固定距離。此實施例在以下意義上為有利的:其具有機械簡單之構造且可非常準確地校準相對位置。In an embodiment of an acoustic subsurface detection device, at least one AFM tip configured to detect reflections is located at a fixed distance from at least one AFM tip configured to provide an acoustic input signal. This embodiment is advantageous in that it has a mechanically simple construction and the relative position can be calibrated very accurately.

在聲學次表面檢測裝置之另一實施例中,經組配以偵測反射之至少一個AFM尖端相對於經組配用於供應聲學輸入信號之至少一個AFM尖端處於可組配距離。此使得可執行額外量測。In another embodiment of the acoustic subsurface detection device, at least one AFM tip configured to detect reflections is at a configurable distance relative to at least one AFM tip configured to provide an acoustic input signal. This allows for additional measurements to be performed.

在一些示例中,傳輸AFM尖端與接收AFM尖端之間的相對側向定位並非固定的,而是可經調整。此可調性允許例如接收AFM尖端相對於傳輸AFM尖端定位於複數個可選擇/可調整之側向偏移處。藉由選擇不同側向分離,量測條件可經改良以適合受檢測樣本之特定特性、其次表面結構以及所要量測解析度及準確度。In some examples, the relative lateral positioning between the transmitting and receiving AFM tips is not fixed but adjustable. This adjustability allows, for example, the receiving AFM tip to be positioned at a plurality of selectable/adjustable lateral offsets relative to the transmitting AFM tip. By selecting different lateral separations, measurement conditions can be optimized to suit the specific characteristics of the sample being inspected, its secondary surface structure, and the desired measurement resolution and accuracy.

任擇地,可組配距離係基於待成像之(例如預期)埋入式結構及/或自其導出之參數而調整。具有可組配距離允許取決於待成像之埋入式結構之性質及/或自其導出之參數而進行最佳化。Optionally, the configurable distance is adjusted based on the (e.g. expected) buried structure to be imaged and/or parameters derived therefrom. Having a configurable distance allows optimization to be performed depending on the properties of the buried structure to be imaged and/or parameters derived therefrom.

藉由調整傳輸器-接收器間距,可修改往返於次表面特徵之聲波之路徑長度,此進而影響延遲時間及偵測到之信號特性。此靈活性有利於微調量測以增加信號對比度、減小量測不確定度,且實現改良之信號雜訊比。舉例而言,藉由增加傳輸AFM尖端與接收AFM尖端之間的側向距離,可減輕所感測信號中之某些干擾圖案,或先前無法區分之某些次表面特徵現在可在經反射信號中產生可區分的峰值。相反地,藉由減小側向距離,可有可能增加特定局部次表面結構之量測敏感度。因此,具有可組配距離提供度量衡優點:操作者或自動化控制系統可選擇或調諧AFM尖端位置以最好地適合手頭樣本之材料及組配。By adjusting the transmitter-receiver spacing, the path length of the acoustic wave traveling to and from subsurface features can be modified, which in turn affects the delay time and the characteristics of the detected signal. This flexibility facilitates fine-tuning the measurement to increase signal contrast, reduce measurement uncertainty, and achieve an improved signal-to-noise ratio. For example, by increasing the lateral distance between the transmitting and receiving AFM tips, certain interference patterns in the sensed signal can be mitigated, or previously indistinguishable subsurface features can now produce distinguishable peaks in the reflected signal. Conversely, by reducing the lateral distance, it is possible to increase the measurement sensitivity of specific local subsurface structures. Therefore, having a configurable distance offers a metrological advantage: the operator or an automated control system can select or tune the AFM tip position to best suit the material and configuration of the sample at hand.

具有多於一個AFM尖端之聲學次表面檢測裝置之實施例可包含用於在朝向樣本之表面之方向上個別地定位各AFM尖端的各別致動器。Embodiments of an acoustic subsurface sensing device having more than one AFM tip may include a respective actuator for individually positioning each AFM tip in a direction toward the surface of the sample.

有利地,可確保有效控制之個別耦合位準。藉由為各AFM尖端提供個別致動器,可微調尖端相對於樣本表面之豎直定位,藉此允許精確控制接觸力及因此各尖端位置處之聲耦合。AFM尖端與樣本表面之間的受所施加力影響之聲耦合直接影響經量測反射信號之信號雜訊比(SNR)。Advantageously, effectively controlled individual coupling levels can be ensured. By providing each AFM tip with a separate actuator, the vertical positioning of the tip relative to the sample surface can be finely tuned, thereby allowing precise control of the contact force and, therefore, the acoustic coupling at each tip position. The acoustic coupling between the AFM tip and the sample surface, influenced by the applied force, directly impacts the signal-to-noise ratio (SNR) of the measured reflected signal.

在一些示例中,確保頭部與樣本基體之理想平行對準可為具有挑戰性的,且可能存在小的角度未對準(傾斜)。因此,頭部相對於樣本之固定豎直位置可導致尖端至基體之距離跨越多個AFM尖端變化,因為各尖端可以略微不同之角度或豎直偏移接合基體表面。此等變異可導致由個別AFM尖端施加至基體之接觸力的差異,從而導致可能不利地影響量測品質之不均勻的聲耦合條件。有利地,藉由針對各AFM尖端採用個別致動器,即使在基體表面中存在傾斜或其他空間變異之情況下,亦可個別地控制各尖端之豎直位移及接觸力。舉例而言,充當聲源之一個AFM尖端可在某一接觸力位準下定位以實現將改良之聲波傳輸至樣本中,而指定為接收器之AFM尖端可獨立地經調整以確保用於最佳偵測及耦合效率之合適的力位準。在一些示例中,此個別控制可進一步與其中AFM尖端中經組配用於接收反射之一者置放於距源AFM尖端一可組配側向距離處的實施例組合。藉由如此做,由感測尖端施加之力可經調諧以提供改良之聲耦合(各尖端之適當耦合),藉此增強經反射信號之SNR且改良次表面特徵偵測之保真度及可靠性。In some cases, ensuring perfect parallel alignment of the tip and sample substrate can be challenging, and small angular misalignments (tilts) may exist. Consequently, a fixed vertical position of the tip relative to the sample can cause the tip-to-substrate distance to vary across multiple AFM tips, as each tip can engage the substrate surface at a slightly different angle or vertical offset. These variations can lead to differences in the contact force applied to the substrate by individual AFM tips, resulting in uneven acoustic coupling conditions that can adversely affect measurement quality. Advantageously, by employing a separate actuator for each AFM tip, the vertical displacement and contact force of each tip can be individually controlled, even in the presence of tilt or other spatial variations in the substrate surface. For example, an AFM tip acting as an acoustic source can be positioned at a certain contact force level to achieve improved acoustic wave transmission into the sample, while the AFM tip designated as a receiver can be independently adjusted to ensure the appropriate force level for optimal detection and coupling efficiency. In some examples, this individual control can be further combined with an embodiment in which one of the AFM tips configured to receive reflections is placed at a configurable lateral distance from the source AFM tip. By doing so, the force applied by the sensing tips can be tuned to provide improved acoustic coupling (proper coupling of each tip), thereby enhancing the SNR of the reflected signal and improving the fidelity and reliability of subsurface feature detection.

在實施例中,聲學次表面檢測裝置之頭部具有可移除地安裝於其中之一或多個AFM尖端。In one embodiment, the head of the acoustic subsurface detection device has one or more AFM tips removably mounted therein.

本揭露內容又進一步提供一種系統,其除改良之聲學次表面檢測裝置以外,亦包含校準樣本及校準單元。其中校準單元經組配以使得聲學次表面檢測裝置產生指示校準樣本中之次表面特徵的輸出資料且基於輸出資料與針對校準樣本預期的輸出資料之比較而校準聲學次表面檢測裝置。The present disclosure further provides a system that includes, in addition to the improved acoustic subsurface detection device, a calibration sample and a calibration unit. The calibration unit is configured to cause the acoustic subsurface detection device to generate output data indicative of subsurface features in the calibration sample and to calibrate the acoustic subsurface detection device based on a comparison of the output data with output data expected for the calibration sample.

較佳實施例之詳細說明 圖1示意性地展示改良之聲學次表面檢測裝置1之實施例。在圖1之實施例中,聲學次表面檢測裝置1包含:用於固持待檢測之樣本11之載體10;信號產生器20;經組配用於感應聲波W之至少一個AFM尖端31;經組配用於接收聲波之反射R ca、R da之至少一個AFM尖端32、32a、32b;側向定位裝置16;距離控制裝置;及信號處理器50。 Detailed Description of Preferred Embodiments FIG1 schematically illustrates an embodiment of an improved acoustic subsurface detection device 1. In the embodiment of FIG1 , the acoustic subsurface detection device 1 includes: a carrier 10 for holding a sample 11 to be detected; a signal generator 20; at least one AFM tip 31 configured to sense an acoustic wave W; at least one AFM tip 32, 32a, 32b configured to receive reflections Rca and Rda of the acoustic wave; a lateral positioning device 16; a distance control device; and a signal processor 50.

當由信號產生器20驅動時,至少一個AFM尖端31經組配用於在樣本之表面114上之輸入位置p a、p d、p e處將聲波W感應至樣本中。 When driven by the signal generator 20, at least one AFM tip 31 is configured to induce acoustic waves W into the sample at input positions pa , pd , pe on the surface 114 of the sample.

至少一個AFM尖端32、32a、32b經組配用於在樣本之表面(114)上之接收位置p b、p c、p f處接收樣本中之聲波之反射R ca、R da,且其耦接至經組配以產生指示所接收之經反射聲波之感測信號S 32a、S 32b的聲學感測器。 At least one AFM tip 32, 32a, 32b is configured to receive reflections Rca , Rda of acoustic waves in the sample at receiving positions pb , pc , pf on the surface (114) of the sample and is coupled to an acoustic sensor configured to generate sense signals S32a , S32b indicative of the received reflected acoustic waves.

側向定位裝置16經組配用於控制至少一個AFM尖端31、32相對於樣本11之表面的側向位置。The lateral positioning device 16 is configured to control the lateral position of at least one AFM tip 31 , 32 relative to the surface of the sample 11 .

距離控制裝置51經提供用於控制AFM尖端中之至少一者相對於樣本11之表面的距離。A distance control device 51 is provided for controlling the distance of at least one of the AFM tips relative to the surface of the sample 11 .

信號處理器50經組配用於產生關於樣本中之次表面特徵113c、113d的輸出資料S imThe signal processor 50 is configured to generate output data S im relating to the sub-surface features 113 c , 113 d in the sample.

聲學次表面檢測裝置經組配以執行具有運用相互不同之輸入位置及/或相互不同之接收位置進行之至少二個聲學量測的量測時期。The acoustic subsurface detection device is configured to perform a measurement session having at least two acoustic measurements performed using mutually different input positions and/or mutually different receiving positions.

信號處理器50經組配以組合來自運用量測時期中之至少二個聲學量測產生之各別感測信號的資訊,以計算關於樣本中之次表面特徵113c、113d的資訊。The signal processor 50 is configured to combine information from respective sense signals generated from at least two acoustic measurements taken during a measurement period to calculate information about sub-surface features 113c, 113d in the sample.

圖2示意性地展示樣本11之表面114,且說明聲學次表面檢測裝置之二個實施例之操作。圖2之上部說明第一實施例之操作,其中由信號產生器20驅動之AFM尖端31在樣本11之表面114上之輸入位置p a處將聲波W感應至樣本中。至少一個AFM尖端在樣本之表面114上之各別接收位置p b、p c處接收樣本中之聲波之反射R ab、R ac。在一個示例中,單個AFM尖端隨後被定位於接收位置p b、p c處。在另一示例中,各別AFM尖端被定位於接收位置P b、p c處以同時接收聲波之反射R ab、R acFIG2 schematically shows the surface 114 of a sample 11 and illustrates the operation of two embodiments of an acoustic subsurface detection apparatus. The upper portion of FIG2 illustrates the operation of the first embodiment, in which an AFM tip 31 driven by a signal generator 20 induces an acoustic wave W into the sample at an input position p a on the surface 114 of the sample 11. At least one AFM tip receives reflections Rab and Rac of the acoustic wave in the sample at respective receiving positions p b and pc on the surface 114 of the sample. In one example, a single AFM tip is then positioned at receiving positions p b and pc . In another example, separate AFM tips are positioned at receiving positions P b and pc to simultaneously receive reflections Rab and Rac of the acoustic wave.

圖2之下部展示第二實施例之操作,其中定位於接收位置p f處之單個AFM尖端接收樣本中在樣本11之表面114上之各別位置p d、p e處感應的聲波之反射R df、R ef。在一個示例中,單個AFM尖端隨後被定位於位置p d、p e處以用於感應聲波。在另一示例中,各別AFM尖端被定位於位置P d、p e處以同時在樣本11中感應聲波。 The lower portion of FIG. 2 illustrates the operation of a second embodiment, in which a single AFM tip positioned at a receiving position pf receives reflections Rdf and Ref of acoustic waves sensed in a sample at respective positions pd and pe on the surface 114 of the sample 11. In one example, the single AFM tip is then positioned at positions pd and pe to sense the acoustic waves. In another example, separate AFM tips are positioned at positions Pd and pe to simultaneously sense the acoustic waves in the sample 11.

在此等實施例中之此等示例中之各者中,獲得各別感測信號,該等各別感測信號係運用量測時期中之至少二個聲學量測產生的。在第一實施例之示例中,針對反射R ab、R ac獲得各別感測信號。在第二實施例之示例中,針對反射R df、R ef獲得各別感測信號。基於所產生感測信號之比較,信號處理器產生輸出資料。 In each of these examples of these embodiments, respective sensing signals are obtained, each generated using at least two acoustic measurements during a measurement period. In the first example of the embodiment, respective sensing signals are obtained for reflections Rab and Rac . In the second example of the embodiment, respective sensing signals are obtained for reflections Rdf and Ref . Based on a comparison of the generated sensing signals, a signal processor generates output data.

圖3A及圖3B更詳細地說明改良之聲學次表面檢測裝置之實施例之操作。圖3A展示例示性樣本11,其具有下部層111 (例如基體)、矩陣112及一系列特徵,該等特徵中最靠近傳輸尖端31之二者表示為113c及113d。3A and 3B illustrate the operation of an embodiment of the improved acoustic subsurface detection device in more detail. FIG3A shows an exemplary sample 11 having a lower layer 111 (e.g., a substrate), a matrix 112, and a series of features, the two closest to the transmission tip 31 of which are designated 113c and 113d.

在此實施例中,改良之聲學次表面檢測裝置包含具有AFM尖端31之感測頭部30,該AFM尖端經組配以在樣本11之表面114上之輸入位置處將聲波W感應至樣本11中。感測頭部30亦具有一對AFM尖端32 a、32 b,該對AFM尖端相對於AFM尖端31以彼此5 nm之距離對稱地配置,且經組配以在各別接收位置處接收聲波W之反射。在一個示例中,AFM尖端31、32 a、32 b靜態地經組配以執行此等功能。亦即,其功能為固線式的。舉例而言,AFM尖端31排他性地連接至信號產生器20以接收驅動信號S 31,且AFM尖端32 a、32 b排他性地連接至信號處理器50以提供其各別感測信號S 32a、S 32b。在彼情況下,一方面AFM尖端31及另一方面AFM尖端32 a、32 b可具有專用構造以最佳地執行其各別固線式功能。在另一示例中,AFM尖端31、32 a、32 b動態地經組配以執行此等功能。舉例而言,此等AFM尖端中之各者機械地耦接至各別壓電元件。在此情況下,AFM尖端31經組配以將聲波W感應至樣本11中,因為其壓電元件動態地經組配以自信號產生器20接收驅動信號S 31,且AFM尖端31、32 a、32 b之壓電元件動態地經組配以將其各別感測信號S 32a、S 32b提供至信號產生器20。 In this embodiment, the improved acoustic subsurface detection device includes a sensing head 30 having an AFM tip 31 configured to induce an acoustic wave W into the sample 11 at an input location on the surface 114 of the sample 11. The sensing head 30 also includes a pair of AFM tips 32 a and 32 b symmetrically arranged with respect to the AFM tip 31 at a distance of 5 nm from each other and configured to receive reflections of the acoustic wave W at respective receiving locations. In one example, the AFM tips 31, 32 a , and 32 b are statically configured to perform these functions, i.e., their functions are fixed-wired. For example, AFM tip 31 is exclusively connected to signal generator 20 to receive drive signal S31 , and AFM tips 32a and 32b are exclusively connected to signal processor 50 to provide their respective sense signals S32a and S32b . In this case, AFM tip 31, on the one hand, and AFM tips 32a and 32b, on the other hand, may have dedicated configurations to optimally perform their respective fixed-wire functions. In another example, AFM tips 31, 32a , and 32b are dynamically configured to perform these functions. For example, each of these AFM tips is mechanically coupled to a respective piezoelectric element. In this case, the AFM tip 31 is configured to induce the acoustic wave W into the sample 11 because its piezoelectric element is dynamically configured to receive the drive signal S 31 from the signal generator 20, and the piezoelectric elements of the AFM tips 31, 32a , 32b are dynamically configured to provide their respective sense signals S 32a , S 32b to the signal generator 20.

為簡單起見,由傳輸尖端31發射且由特徵113c、113d反射之聲波示意性地以箭頭形式展示。For simplicity, the acoustic waves emitted by the transmission tip 31 and reflected by the features 113c, 113d are schematically shown in the form of arrows.

驅動信號S 31及感測信號S 32a、S 32b通常為電信號,但替代地,可為此等信號中之一或多者為光學信號的情況。 The drive signal S31 and the sense signals S32a , S32b are typically electrical signals, but alternatively, one or more of these signals may be optical signals.

如圖3A中所展示,AFM尖端32 a、32 b分別自樣本11中之二個最接近次表面特徵113c、113d接收反射R ca及R da且產生感測信號S 32a,如圖3B中所展示。在實踐中,可假定可忽略來自距此等二個次表面特徵113c、113d更遠之其他次表面特徵的反射。同樣,AFM尖端32 b分別自樣本11中之二個最接近次表面特徵113c、113d接收反射R cb及R db且產生感測信號S 32b,圖3B中所展示。 As shown in FIG3A , AFM tips 32 a and 32 b receive reflections R ca and R da, respectively, from the two closest subsurface features 113 c and 113 d in sample 11 and generate a sense signal S 32 a , as shown in FIG3B . In practice, it can be assumed that reflections from other subsurface features farther from these two subsurface features 113 c and 113 d are negligible. Similarly, AFM tip 32 b receives reflections R cb and R db, respectively, from the two closest subsurface features 113 c and 113 d in sample 11 and generates a sense signal S 32 b , as shown in FIG3B .

圖3B展示感測信號S 32a及S 32b各自在曲線圖之原點附近具有主峰值,該主峰值歸因於由於在樣本表面114上傳播之波引起的初始聲學激發(acoustic excitation)。感測信號S 32a具有分別在時間延遲t ca及t da之後的主峰值之後的第一峰值及第二峰值。此等時間延遲t ca及t da分別指示自AFM尖端31經由次表面特徵113c至AFM尖端32a之路徑長度,及自AFM尖端31經由次表面特徵113d至AFM尖端32a之路徑長度。同樣,感測信號S 32b具有分別在時間延遲t cb及t db之後的主峰值之後的第一峰值及第二峰值。此等時間延遲t cb及t db分別指示自AFM尖端31經由次表面特徵113c至AFM尖端32b之路徑長度,及自AFM尖端31經由次表面特徵113d至AFM尖端32b之路徑長度。 FIG3B shows that sense signals S32a and S32b each have a main peak near the origin of the graph, attributed to the initial acoustic excitation caused by the wave propagating on sample surface 114. Sense signal S32a has a first peak and a second peak following the main peak after time delays tca and tda , respectively. These time delays tca and tda indicate the path lengths from AFM tip 31 through subsurface feature 113c to AFM tip 32a, and from AFM tip 31 through subsurface feature 113d to AFM tip 32a, respectively. Similarly, sense signal S32b has a first peak and a second peak following the main peak after time delays tcb and tdb , respectively. These time delays tcb and tdb indicate the path lengths from the AFM tip 31 through the subsurface feature 113c to the AFM tip 32b, and from the AFM tip 31 through the subsurface feature 113d to the AFM tip 32b, respectively.

在此示例中,運用單個脈衝感應聲波W。如圖3B中所展示,脈衝具有與聲音行進至待偵測之次表面特徵之距離所花費的時間相比短的持續時間。隨即,作為回應,亦即在此情況下,初始峰值之後的峰值可容易地與初始峰值區分開。藉助於示例,基體中之音速為大約2000 m/s。當在1微米之範圍內量測時,行進時間為約0.5 ns,且脈衝寬度至多為行進時間的十分之一,亦即不大於0.05 ns。在實踐中,量測脈衝可感應為脈衝列之部分,其限制條件為後續脈衝之間的時間間隔超過量測聲波之反射的時間間隔。在回應於如驅動信號S 31之脈衝列提供聲波的同時,AFM尖端31、32a、32b可維持處於固定位置,使得執行具有相同條件之複數個量測時期,從而使得能夠執行統計操作。舉例而言,計算次表面特徵之較準確位置估計或計算位置估計中之不確定性的量度。 In this example, a single pulse, W, is used to induce an acoustic wave. As shown in Figure 3B, the pulse has a short duration compared to the time it takes the sound to travel the distance to the subsurface feature to be detected. Consequently, in response, in this case, subsequent peaks following the initial peak can be easily distinguished from the initial peak. By way of example, the speed of sound in the substrate is approximately 2000 m/s. When measured within a range of 1 micron, the travel time is approximately 0.5 ns, and the pulse width is at most one-tenth of the travel time, or no more than 0.05 ns. In practice, the measurement pulses can be sensed as part of a pulse train, with the constraint that the time interval between subsequent pulses exceeds the time interval for measuring the reflection of the acoustic wave. While providing the acoustic wave in response to a pulse train such as drive signal S 31 , the AFM tip 31, 32a, 32b can be maintained in a fixed position, allowing multiple measurement sessions with identical conditions to be performed, thereby enabling statistical operations to be performed, such as calculating a more accurate position estimate of a subsurface feature or calculating a measure of uncertainty in the position estimate.

在以下論述中,尖端32a、31及32b之座標(x, z)以及特徵113c、113d之座標相對於傳輸尖端31之座標來表示。因此,傳輸尖端之相對座標為(0, 0)。進一步假定,接收尖端32a、32b在相同位準z處與傳輸尖端31相距相等距離d。因此,接收尖端分別具有座標(-dx, 0)及(dx, 0)。進一步假定特徵具有z座標dz,及沿著x軸相對於傳輸尖端31之相對位置-xc、+xd。因此,特徵113c及113d之座標分別為(-xc, dz)及(xd, dz)。在所展示之示例中,第一接收尖端32a產生感測信號S 32a,該感測信號指示由樣本11中之特徵反射之聲波的疊加,尤其分別自最靠近特徵113c及113d所接收之反射R ca及R da。同樣地,第二接收尖端32b產生感測信號S 32b,該感測信號指示由樣本11中之特徵反射之聲波的疊加,尤其分別自最靠近特徵113c及113d所接收之反射R cb及R db。取決於特徵至尖端之相對位置,以不同延遲接收反射。 In the following discussion, the coordinates (x, z) of tips 32a, 31, and 32b, and the coordinates of features 113c and 113d, are expressed relative to the coordinates of transmitting tip 31. Thus, the relative coordinates of the transmitting tip are (0, 0). It is further assumed that receiving tips 32a, 32b are equidistant from transmitting tip 31 at the same level z. Thus, the receiving tips have coordinates (-dx, 0) and (dx, 0), respectively. It is further assumed that the feature has a z-coordinate dz and relative positions -xc and +xd along the x-axis relative to transmitting tip 31. Thus, the coordinates of features 113c and 113d are (-xc, dz) and (xd, dz), respectively. In the example shown, first receive tip 32a generates a sense signal S 32a , which indicates the superposition of acoustic waves reflected from features in sample 11, specifically reflections R ca and R da received from features 113c and 113d closest to the tip, respectively. Similarly, second receive tip 32b generates a sense signal S 32b , which indicates the superposition of acoustic waves reflected from features in sample 11, specifically reflections R cb and R db received from features 113c and 113d closest to the tip, respectively. The reflections are received with different delays depending on the relative position of the feature to the tip.

接收反射之延遲由矩陣112中之路徑長度及音速v s判定。峰值之相對時間位置t ca(亦即,傳輸尖端31發射聲學脈衝與所偵測信號S 32a中出現由特徵113c之反射引起之峰值之間的時間間隔)經近似為: (1a) The delay in receiving the reflection is determined by the path lengths and the speed of sound v in matrix 112. The relative time position of the peak, tca (i.e., the time interval between the emission of the acoustic pulse by the transmitting tip 31 and the appearance of the peak in the detected signal S32a caused by the reflection of feature 113c), is approximated by: (1a)

同樣地,對於所偵測信號S 32a中由來自特徵113d之反射R da引起之峰值,相對時間位置t da為: (1b) Similarly, for the peak in detected signal S 32a caused by reflection R da from feature 113d, the relative time position t da is: (1b)

所偵測信號S 32b中由來自特徵113c之反射R cb引起之峰值的時間位置t cb為: (2a) The time position tcb of the peak in the detected signal S32b caused by the reflection Rcb from the feature 113c is: (2a)

此外,來自特徵113d之反射R db在時間位置t db處引起所偵測信號S 32b中之峰值: (2b) Furthermore, the reflection R db from feature 113 d causes a peak in the detected signal S 32 b at time position t db : (2b)

所偵測信號S 32a中之峰值之間的距離為: The distance between the peaks in the detected signal S 32a is:

所偵測信號S 32b中之峰值之間的距離為: The distance between the peaks in the detected signal S 32b is:

因此,距離相差為: Therefore, the distance difference is:

在單個量測之情況下,可判定在頭部30之鄰域中存在二個特徵,但無法判定位置。In the case of a single measurement, it can be determined that two features exist in the vicinity of the head 30, but their positions cannot be determined.

由於各別感測信號係運用量測時期中之至少二個聲學量測而產生之事實,可根據經量測延遲時間t ca、t cb計算關於樣本11中之次表面特徵113c、113d的資訊,如以下所展示。 (3) Due to the fact that the respective sensing signal is generated using at least two acoustic measurements during the measurement period, information about the subsurface features 113c, 113d in the sample 11 can be calculated based on the measured delay times tca , tcb , as shown below. (3)

圖3C以任意單位展示特徵相對於傳輸器尖端之位置的位置x c與延遲中之所觀察差Δ c,ab之間的關係。如自其變得顯而易見,所觀察差為距離之單調遞增函數,此使得可判定特徵之位置。 Figure 3C shows the relationship between the position xc of the feature relative to the position of the transmitter tip and the observed difference in delay Δc ,ab in arbitrary units. As is apparent from this, the observed difference is a monotonically increasing function of the distance, which allows the position of the feature to be determined.

圖3D更詳細地展示用以執行上文所論述之計算的信號處理器50。圖3D之例示性信號處理器包含計算方程式1a中指定之延遲時間t ca的第一延遲時間計算模組55a。第二延遲時間計算模組55b計算方程式2a中指定之延遲時間t cb。減法元件56計算此等延遲時間之間的差Δ c,ab。特徵位置計算模組57根據方程式3計算特徵之位置x cFIG3D illustrates in greater detail the signal processor 50 used to perform the calculations discussed above. The exemplary signal processor of FIG3D includes a first delay time calculation module 55a that calculates the delay time tca specified in Equation 1a. A second delay time calculation module 55b calculates the delay time tcb specified in Equation 2a. A subtraction element 56 calculates the difference Δc ,ab between these delay times. A feature position calculation module 57 calculates the feature position xc according to Equation 3.

在另一方法中,在圖4A、圖4B中所說明,裝置包含具有單個傳輸尖端31及單個接收尖端32a之檢測頭部30,且量測時期包含在二個或更多個不同位置處量測。舉例而言,在參考位置處執行第一量測,且在與參考位置相差x軸方向上之漂移的位置處執行第二量測。作為非限制性示例,假定漂移為dx。In another approach, illustrated in Figures 4A and 4B , the apparatus includes a detection head 30 having a single transmitting tip 31 and a single receiving tip 32a, and a measurement session includes measurements at two or more different locations. For example, a first measurement is performed at a reference location, and a second measurement is performed at a location that is offset from the reference location by an amount in the x-axis direction. As a non-limiting example, assume the offset is dx.

如上所述,對於第一量測,假定傳輸尖端之位置在原點處,且接收尖端32a之位置相對於傳輸尖端31之位置在位置-dx處。在彼情況下,表示為t da1之所觀察延遲為: As described above, for the first measurement, it is assumed that the position of the transmitting tip is at the origin and the position of the receiving tip 32a is at position -dx relative to the position of the transmitting tip 31. In that case, the observed delay, denoted as t da1 , is:

對於第二量測,在傳輸尖端之位置在dx處的情況下,表示為t da2之所觀察延遲為: 因此,延遲時間之差Δ c,12可計算為 For the second measurement, with the transmission tip at position dx, the observed delay, denoted as t da2 , is: Therefore, the delay time difference Δ c,12 can be calculated as

隨即,特徵之位置可運用圖3A、圖3B、圖3C之示例中所描述之相同計算來判定。The location of the feature can then be determined using the same calculations described in the examples of Figures 3A, 3B, and 3C.

在進一步實施例中,在圖5A、圖5B中所說明,聲學次表面檢測裝置包含可動態組配以充當用於感應聲波之AFM尖端及充當用於接收反射之AFM尖端的AFM尖端31。在操作中,信號產生器20運用驅動信號S 31_i1驅動AFM尖端31,該驅動信號使得AFM尖端31在樣本11之表面114上之第一輸入位置處將聲波W1感應至樣本中,且信號處理器50處理由AFM尖端回應於經感應聲波之所接收反射而產生的感測信號S 31_o1。在不損失一般性之情況下,假定位置具有座標(x1 = 0, z1 = 0)。AFM尖端31亦經組配用於在彼位置處接收樣本中之聲波之反射R c1、R d1,且產生指示所接收之經反射聲波且將由信號處理器50處理之感測信號S 31_o1In a further embodiment, as illustrated in Figures 5A and 5B , an acoustic subsurface detection device includes an AFM tip 31 that can be dynamically configured to function as an AFM tip for sensing acoustic waves and as an AFM tip for receiving reflections. In operation, a signal generator 20 drives the AFM tip 31 using a drive signal S 31_i1 , which causes the AFM tip 31 to sense an acoustic wave W1 into the sample at a first input position on the surface 114 of the sample 11. The signal processor 50 processes a sense signal S 31_o1 generated by the AFM tip in response to the received reflection of the sensed acoustic wave. Without loss of generality, the position is assumed to have coordinates (x1 = 0, z1 = 0). The AFM tip 31 is also configured to receive reflections R c1 , R d1 of the acoustic wave in the sample at that location and generate a sense signal S 31 — o1 indicative of the received reflected acoustic wave to be processed by the signal processor 50 .

聲學信號W1在特徵113c處之反射在驅動信號中之峰值之後的時間間隔t c1處引起感測信號S 31_o1中之峰值,其中時間間隔由下式指定: The reflection of the acoustic signal W1 at the feature 113c causes a peak in the sense signal S31_o1 at a time interval tc1 after the peak in the drive signal, where the time interval is specified by:

類似地,可計算由其他特徵(例如,特徵113d)之反射引起之峰值的時間位置。Similarly, the time positions of peaks caused by reflections from other features (e.g., feature 113d) can be calculated.

如圖5B中所展示,頭部30在x軸之正方向上移位距離dx,且重複上文所描述之量測,從而產生第二感測信號S 31_o2。現在量測時間間隔tc2,其由下式判定: As shown in FIG5B , the head 30 is shifted by a distance dx in the positive direction of the x-axis and the measurement described above is repeated, thereby generating a second sensing signal S 31_o2 . Now the time interval tc2 is measured, which is determined by the following formula:

此等時間間隔之長度的差Δ c,12為: The difference in the length of these time intervals, Δ c,12 , is:

此再次為特徵113c之位置x c的單調相關函數,使得可計算位置x cThis is again a monotonically related function of the position xc of feature 113c, allowing the position xc to be calculated.

綜上所述,聲學次表面檢測裝置經組配以執行聲學次表面檢測方法。在執行該方法時,待檢測之樣本11固持於例如xy台上,可運用該xy台動態地控制該樣本之側向位置。方法包含執行包括至少二個聲學量測之量測時期。在各聲學量測中,在輸入位置處輸入聲波,且產生指示聲波在量測位置處之經量測反射的各別感測信號。量測時期中之至少二個聲學量測係運用不同輸入位置及/或運用不同量測位置執行的。方法亦包含使用運用量測時期中之至少二個聲學量測產生之各別感測信號,基於計算而產生指示樣本中之次表面特徵的輸出資料。In summary, the acoustic subsurface detection device is configured to perform an acoustic subsurface detection method. When performing the method, the sample 11 to be detected is fixed on, for example, an xy stage, and the lateral position of the sample can be dynamically controlled using the xy stage. The method includes performing a measurement period including at least two acoustic measurements. In each acoustic measurement, an acoustic wave is input at an input position, and a respective sensing signal is generated indicating the measured reflection of the acoustic wave at the measurement position. At least two acoustic measurements in the measurement period are performed using different input positions and/or using different measurement positions. The method also includes using the respective sensing signals generated using at least two acoustic measurements in the measurement period to generate output data indicating subsurface features in the sample based on calculations.

如上文所論述,可以各種方式執行量測時期中之至少二個聲學量測。舉例而言,如參考圖2所論述,可運用單個傳輸尖端及複數個接收尖端或運用複數個傳輸尖端及單個接收尖端來執行量測時期。此外,可運用複數個傳輸尖端及複數個接收尖端,或如圖4A、圖4B中所展示運用單個傳輸尖端及單個接收尖端,或如圖5A、圖5B中所展示運用經組配以感應聲波及接收其反射之單個尖端來執行量測時期。As discussed above, the at least two acoustic measurements during a measurement session can be performed in various ways. For example, as discussed with reference to FIG2 , a measurement session can be performed using a single transmitting tip and multiple receiving tips, or using multiple transmitting tips and a single receiving tip. Furthermore, a measurement session can be performed using multiple transmitting tips and multiple receiving tips, or using a single transmitting tip and a single receiving tip as shown in FIG4A and FIG4B , or using a single tip configured to sense acoustic waves and receive their reflections as shown in FIG5A and FIG5B .

如進一步所論述,尖端之功能可為固線式的或為可動態組配的。As discussed further, the functionality of the tip can be hard-wired or dynamically configurable.

圖6A至圖6D說明出於疊對偵測之目的改良之聲學次表面檢測方法之實施例。其中圖6A展示來自樣本表面下方2.5微米之深度處且相互分離5 nm之二個次表面次表面特徵的二個偵測信號。在此曲線圖中,豎軸指示信號強度,且水平軸指示根據接收到對經感應聲波之回應之時間延遲計算的自次表面特徵至偵測器之距離。圖6B展示放大部分。圖6C展示根據二個偵測信號之間的差計算之差信號。圖6D展示針對次表面特徵之各種側向偏移獲得之差信號。如自圖6D變得顯而易見,差信號清楚地指示次表面特徵之間的偏移。Figures 6A to 6D illustrate an embodiment of an acoustic subsurface detection method improved for the purpose of overlay detection. Figure 6A shows two detection signals from two subsurface features at a depth of 2.5 microns below the sample surface and separated by 5 nm from each other. In this graph, the vertical axis indicates the signal intensity, and the horizontal axis indicates the distance from the subsurface feature to the detector calculated based on the time delay of the response to the sensed acoustic wave. Figure 6B shows an enlarged portion. Figure 6C shows a difference signal calculated based on the difference between the two detection signals. Figure 6D shows the difference signal obtained for various lateral offsets of the subsurface features. As is apparent from Figure 6D, the difference signal clearly indicates the offset between the subsurface features.

在實施例中,經組配以計算關於樣本中之次表面特徵之資訊的信號處理器50包含經訓練神經網路50 NN。出於此目的,經訓練神經網路50 NN可藉由應用於待訓練之網路之以下程序來獲得。 In an embodiment, the signal processor 50 configured to calculate information about subsurface features in a sample comprises a trained neural network 50 NN . For this purpose, the trained neural network 50 NN can be obtained by applying the following procedure to the network to be trained.

提供至少一個訓練樣本11T,該至少一個訓練樣本包含側向地分佈於樣本中之各種相互不同之次表面結構。使用至少一個訓練樣本11T,重複執行以下訓練步驟序列。At least one training sample 11T is provided, wherein the at least one training sample comprises a variety of mutually different subsurface structures distributed laterally within the sample. The following sequence of training steps is repeatedly performed using the at least one training sample 11T.

在量測時期中獲得各別感測資料,其中輸入位置及量測位置在位置x周圍之空間範圍中。量測時期包括至少二個聲學量測,各聲學量測包含在輸入位置處輸入聲波且產生指示聲波在量測位置處之經量測反射的各別感測信號,其中至少二個聲學量測係運用空間範圍內之不同輸入位置及/或不同量測位置執行的。Respective sensing data is obtained during a measurement period, wherein an input position and a measurement position are within a spatial range around position x. The measurement period includes at least two acoustic measurements, each acoustic measurement comprising inputting an acoustic wave at the input position and generating a respective sensing signal indicative of a measured reflection of the acoustic wave at the measurement position, wherein the at least two acoustic measurements are performed using different input positions and/or different measurement positions within the spatial range.

在待訓練之神經網路50 NN之輸入處提供例如藉由頭部30運用量測時期中之至少二個聲學量測而產生的各別感測信號ST(x)。 At the input of the neural network 50 NN to be trained, a respective sensor signal ST(x) is provided, for example generated by the head 30 using at least two acoustic measurements during a measurement period.

作為對其之回應,待訓練之神經網路50 NN將神經網路操作應用於各別感測信號且提供輸出資料F(x)。輸出資料f(x)例如指示區x中之訓練樣本11T中之次表面特徵的所估計偏移。 In response thereto, the neural network 50 NN to be trained applies a neural network operation to the respective sensor signal and provides output data F(x). The output data f(x) indicates, for example, the estimated offset of the subsurface feature in the training sample 11T in the region x.

此外,在空間範圍x中自至少一個訓練樣本之次表面規格獲得地面實況資料GT(x)。In addition, the ground truth data GT(x) is obtained from the subsurface specifications of at least one training sample in the spatial range x.

此處藉由損失計算模組70基於輸出資料F(x)與地面實況資料GT(x)之比較而計算損失L(x)。Here, the loss L(x) is calculated by the loss calculation module 70 based on the comparison between the output data F(x) and the ground truth data GT(x).

隨後藉由所計算損失L(x)之反向傳播而更新待訓練之神經網路50 NN之神經網路參數。 The neural network parameters of the neural network 50 NN to be trained are then updated by back propagating the calculated loss L(x).

在更新之後,選擇不同於先前空間範圍之新空間範圍,且執行下一訓練步驟序列。After the update, a new spatial range is selected that is different from the previous spatial range and the next sequence of training steps is executed.

應注意,在聲學次表面檢測裝置之又進一步實施例中,信號處理器包含預測模組,該預測模組經組配以基於樣本之模型而產生所預測偵測信號且基於所預測偵測信號與實際偵測信號之比較而產生輸出資料。在此實施例中,不必根據偵測信號重建次表面屬性。實情為,將所獲得偵測信號與所預期偵測信號進行比較,且偏差指示樣本之缺陷。It should be noted that in yet another embodiment of the acoustic subsurface detection device, the signal processor includes a prediction module configured to generate a predicted detection signal based on a sample-based model and to generate output data based on a comparison of the predicted detection signal with the actual detection signal. In this embodiment, subsurface properties need not be reconstructed from the detection signal. Instead, the obtained detection signal is compared to the expected detection signal, and deviations indicate sample defects.

在技術方案中,詞語「包含」不排除其他元件或步驟,且不定冠詞「一(a)」或「一(an)」不排除複數個。單個組件或其他單元可滿足技術方案中所敍述之數個項目之功能。在相互不同之技術方案中敍述某些措施的純粹事實並不指示不能有利地使用此等措施之組合。技術方案中之任何參考符號均不應被視為限制範疇。In a technical solution, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single component or other unit may fulfill the functions of several items described in the technical solution. The mere fact that certain measures are described in different technical solutions does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the technical solution should not be construed as limiting the scope.

1:聲學次表面檢測裝置 10:載體 11:樣本 11T:訓練樣本 16:側向定位裝置 20:信號產生器 30:頭部 31,32,32a,32b:尖端 50:信號處理器 50 NN:經訓練神經網路 51:距離控制裝置 55a:第一延遲時間計算模組 55b:第二延遲時間計算模組 56:減法元件 57:特徵位置計算模組 70:損失計算模組 111:下部層 112:矩陣 113c,113d:次表面特徵 114:表面 F(x):輸出資料 GT(x):地面實況資料 L(x):損失 p a,p d,p e:輸入位置 p b,p c,p f:接收位置 R ab,R ac,R c1,R ca,R cb,R d1,R da,R db,R df,R ef:反射 S 31,S 31_i1:驅動信號 S 31_o1,S 32a,S 32b,ST(x):感測信號 S 31_o2:第二感測信號 S im:輸出資料 t ca,t cb,t da,t db:時間延遲 W,W1:聲波 x c:位置 Δ c,ab:差 1: Acoustic subsurface detection device 10: Carrier 11: Sample 11T: Training sample 16: Lateral positioning device 20: Signal generator 30: Head 31, 32, 32a, 32b: Tip 50: Signal processor 50NN : Trained neural network 51: Distance control device 55a: First delay time calculation module 55b: Second delay time calculation module 56: Subtraction element 57: Feature position calculation module 70: Loss calculation module 111: Lower layer 112: Matrix 113c, 113d: Subsurface feature 114: Surface F(x): Output data GT(x): Ground truth data L(x): Losses p a , p d , p e : Input positions p b , p c ,p f : Received position Rab ,R ac ,R c1 , R ca ,R cb ,R d1 ,R da ,R db ,R df ,R ef : Reflection S 31 ,S 31_i1 : Drive signal S 31_o1 ,S 32a ,S 32b ,ST(x): Sense signal S 31_o2 : Second sense signal Sim : Output data t ca ,t cb ,t da ,t db : Time delay W,W1 : Sound wave x c : Position Δ c,ab : Difference

參考圖式更詳細地展示本揭露內容之此等及其他態樣。其中: 圖1示意性地展示改良之聲學次表面檢測裝置之實施例; 圖2說明各種量測選項; 圖3A至圖3D更詳細地說明改良之聲學次表面檢測裝置1之實施例之操作; 圖4A、圖4B說明改良之聲學次表面檢測裝置之另一實施例; 圖5A、圖5B說明改良之聲學次表面檢測裝置之再另一實施例; 圖6A至圖6D說明對疊對偵測之應用; 圖7說明訓練神經網路以供在改良之聲學次表面檢測裝置之實施例中或在對應方法之實施例中使用的方法。 These and other aspects of the present disclosure are illustrated in greater detail in the accompanying drawings. Among them: FIG. 1 schematically illustrates an embodiment of an improved acoustic subsurface detection device; FIG. 2 illustrates various measurement options; FIG. 3A through FIG. 3D illustrate the operation of an embodiment of the improved acoustic subsurface detection device 1 in greater detail; FIG. 4A and FIG. 4B illustrate another embodiment of the improved acoustic subsurface detection device; FIG. 5A and FIG. 5B illustrate yet another embodiment of the improved acoustic subsurface detection device; FIG. 6A through FIG. 6D illustrate an application for stacked pair detection; FIG. 7 illustrates a method for training a neural network for use in an embodiment of the improved acoustic subsurface detection device or in corresponding embodiments of the method.

11:樣本 11: Sample

30:頭部 30: Head

31,32a,32b:尖端 31, 32a, 32b: Tip

111:下部層 111: Lower layer

112:矩陣 112: Matrix

113c,113d:次表面特徵 113c, 113d: Subsurface features

114:表面 114: Surface

Rca,Rcb,Rda,Rdb:反射 R ca ,R cb ,R da ,R db : reflection

S31:驅動信號 S 31 : Drive signal

S32a,S32b:感測信號 S 32a , S 32b : Sensing signal

W:聲波 W: Sound waves

x,z:元件 x,z:component

Claims (17)

一種聲學次表面檢測裝置(1),其包含: 一載體(10),其用於固持一待檢測之樣本(11); 一信號產生器(20); 至少一個AFM尖端(31),其經組配以由該信號產生器驅動,經組配用於在該樣本之一表面(114)上之一輸入位置(p a、p d、p e)處將一聲波(W)感應至該樣本中; 至少一個AFM尖端(32、32a、32b),其經組配用於在該樣本之該表面(114)上之一接收位置(p b、p c、p f)處接收該樣本中之該聲波之一反射(R ca、R da)且耦接至經組配以產生指示所接收之經反射聲波之一感測信號(S 32a、S 32b)的一聲學感測器; 一側向定位裝置(16),其用於控制至少一個AFM尖端(31、32)相對於該樣本之該表面的一側向位置; 一距離控制裝置(51),其用於控制該等AFM尖端中之至少一者相對於該樣本之該表面的一距離; 一信號處理器(50),其用於產生關於該樣本中之次表面特徵(113c、113d)的輸出資料(S im); 其中該聲學次表面檢測裝置經組配以執行具有運用相互不同之輸入位置及/或相互不同之接收位置進行之至少二個聲學量測的一量測時期(measurement session); 且其中該信號處理器(50)經組配以組合來自運用該量測時期中之該等至少二個聲學量測產生之該等各別感測信號的資訊,以計算關於該樣本中之該次表面特徵(113c、113d)的資訊。 An acoustic subsurface detection device (1) comprises: a carrier (10) for holding a sample (11) to be detected; a signal generator (20); at least one AFM tip (31) configured to be driven by the signal generator and configured to induce an acoustic wave (W) into the sample at an input position ( pa , pd , pe ) on a surface (114) of the sample; at least one AFM tip (32, 32a, 32b) configured to receive a reflection ( Rca , Rda) of the acoustic wave in the sample at a receiving position ( pb , pc , pf ) on the surface (114) of the sample and coupled to a sensing signal ( S32a , S32b ) configured to generate a sensing signal indicative of the received reflected acoustic wave. 32b ); a lateral positioning device (16) for controlling a lateral position of at least one AFM tip (31, 32) relative to the surface of the sample; a distance control device (51) for controlling a distance of at least one of the AFM tips relative to the surface of the sample; a signal processor (50) for generating output data ( Sim ) related to subsurface features (113c, 113d) in the sample; wherein the acoustic subsurface detection device is configured to perform a measurement session having at least two acoustic measurements performed using different input positions and/or different receiving positions; And wherein the signal processor (50) is configured to combine information from the respective sense signals generated using the at least two acoustic measurements during the measurement period to calculate information about the sub-surface feature (113c, 113d) in the sample. 如請求項1之聲學次表面檢測裝置,其包含經組配用於將一聲波感應至該樣本中之複數個傳輸AFM尖端及經組配用於接收一經反射聲波之至少一個AFM尖端,其中該信號處理器經組配以基於由源自該等複數個傳輸AFM尖端中之各者的該等聲波之反射產生的所產生感測信號之一比較而產生輸出資料。An acoustic subsurface detection device as claimed in claim 1, comprising a plurality of transmitting AFM tips configured to sense an acoustic wave into the sample and at least one AFM tip configured to receive a reflected acoustic wave, wherein the signal processor is configured to generate output data based on a comparison of one of the generated sensing signals generated by reflections of the acoustic waves from each of the plurality of transmitting AFM tips. 如請求項1或2之聲學次表面檢測裝置,其包含經組配用於接收一經反射聲波之複數個接收AFM尖端及經組配用於將一聲波感應至該樣本中之至少一個傳輸AFM尖端,其中該信號處理器經組配以基於由該等複數個接收AFM尖端中之各者提供的所產生感測信號之一比較而產生輸出資料。An acoustic subsurface detection device as claimed in claim 1 or 2, comprising a plurality of receiving AFM tips configured to receive a reflected acoustic wave and at least one transmitting AFM tip configured to sense an acoustic wave into the sample, wherein the signal processor is configured to generate output data based on a comparison of one of the generated sensing signals provided by each of the plurality of receiving AFM tips. 如請求項1或2之聲學次表面檢測裝置,其經組配以按相互不同之時間間隔執行該等至少二個聲學量測,其中在執行該等至少二個聲學量測中之一第一者之後及在執行該等至少二個聲學量測中之一第二者之前,改變一輸入位置及/或一接收位置中之至少一者。An acoustic subsurface detection device as claimed in claim 1 or 2, which is configured to perform the at least two acoustic measurements at different time intervals, wherein at least one of an input position and/or a receiving position is changed after performing a first one of the at least two acoustic measurements and before performing a second one of the at least two acoustic measurements. 如前述請求項中任一項之聲學次表面檢測裝置,其中該信號處理器包含一峰值偵測單元(55a、55b)及一計算單元(57),該峰值偵測單元用以判定在該量測時期中之該等至少二個聲學量測中之各別者中獲得之各別感測信號(S 32a、S 32b)中出現一峰值的一各別延遲(t ca、t cb),該計算單元用以根據該等各別延遲之間的一差而計算該次表面特徵(113c、113d)之一位置(x c)。 An acoustic subsurface detection device as claimed in any of the preceding claims, wherein the signal processor comprises a peak detection unit (55a, 55b) and a calculation unit (57), the peak detection unit being used to determine a respective delay ( tca , tcb ) at which a peak appears in respective sensing signals ( S32a , S32b ) obtained in respective ones of the at least two acoustic measurements during the measurement period, and the calculation unit being used to calculate a position ( xc ) of the subsurface feature (113c, 113d) based on a difference between the respective delays. 如請求項1至4中任一項之聲學次表面檢測裝置,該信號處理器包含一預測模組,該預測模組經組配以基於該樣本之一模型而產生所預測偵測信號且基於該等所預測偵測信號與實際偵測信號之一比較而產生輸出資料。In the acoustic subsurface detection device of any one of claims 1 to 4, the signal processor includes a prediction module configured to generate predicted detection signals based on a model of the sample and to generate output data based on a comparison of the predicted detection signals with one of the actual detection signals. 如請求項1至4中任一項之聲學次表面檢測裝置,其中該信號處理器(50)包含一經訓練神經網路(50 NN),該經訓練神經網路接收該等各別感測信號且經組配以將神經網路操作應用於所接收感測信號以估計該次表面特徵之屬性。 An acoustic subsurface detection device as claimed in any one of claims 1 to 4, wherein the signal processor (50) comprises a trained neural network ( 50NN ) which receives the respective sensing signals and is configured to apply neural network operations to the received sensing signals to estimate properties of the subsurface feature. 如請求項1之聲學次表面檢測裝置,其中經組配以偵測一反射之該至少一個AFM尖端相對於經組配用於供應一聲學輸入信號之該至少一個AFM尖端處於一可組配距離。The acoustic subsurface detection device of claim 1, wherein the at least one AFM tip configured to detect a reflection is at a configurable distance relative to the at least one AFM tip configured to provide an acoustic input signal. 如請求項1之聲學次表面檢測裝置,其包含一頭部,該頭部承載經組配用於供應一聲學輸入信號之該至少一個AFM尖端及經組配以偵測一反射之至少二個AFM尖端,該頭部包含用於在朝向該樣本之一表面之一方向上個別地定位該等AFM尖端的一各別致動器。An acoustic subsurface detection device as claimed in claim 1, comprising a head carrying at least one AFM tip configured to supply an acoustic input signal and at least two AFM tips configured to detect a reflection, the head comprising a respective actuator for individually positioning the AFM tips in a direction toward a surface of the sample. 如請求項1之聲學次表面檢測裝置,其包含至少三個AFM尖端,該等至少三個AFM尖端可動態組配以充當用於供應一聲學輸入信號之一AFM尖端或用以偵測一反射之一AFM尖端。The acoustic subsurface detection device of claim 1 comprises at least three AFM tips, wherein the at least three AFM tips can be dynamically configured to serve as an AFM tip for supplying an acoustic input signal or an AFM tip for detecting a reflection. 如請求項1之聲學次表面檢測裝置,其具有可移除地安裝於其中之該等AFM尖端中之一或多者。An acoustic subsurface detection device as claimed in claim 1, having one or more of said AFM tips removably mounted therein. 如請求項1之聲學次表面檢測裝置,其經組配以與至少二個AFM尖端一起操作,以在將用於供應一聲學輸入信號之該至少一個AFM尖端定位於相對於該樣本之相互不同之側向位置的同時,偵測相對於該樣本之一固定側向位置處之一反射,該信號處理器經組配以基於針對該等相互不同之位置獲得之該等偵測信號而產生該輸出資料。An acoustic subsurface detection device as claimed in claim 1, which is configured to operate with at least two AFM tips to detect a reflection at a fixed lateral position relative to the sample while the at least one AFM tip for supplying an acoustic input signal is positioned at mutually different lateral positions relative to the sample, and the signal processor is configured to generate the output data based on the detection signals obtained for the mutually different positions. 一種系統,其除如前述請求項中任一項之聲學次表面檢測裝置以外,亦包含一校準樣本及一校準單元,其中該校準單元經組配以使得該聲學次表面檢測裝置產生指示該樣本中之次表面特徵的輸出資料且基於該輸出資料與針對該校準樣本預期的輸出資料之一比較而校準該聲學次表面檢測裝置。A system comprising, in addition to an acoustic subsurface detection device as claimed in any of the preceding claims, a calibration sample and a calibration unit, wherein the calibration unit is configured to cause the acoustic subsurface detection device to generate output data indicative of subsurface features in the sample and to calibrate the acoustic subsurface detection device based on a comparison of the output data with one of the output data expected for the calibration sample. 一種聲學次表面檢測方法,其包含: 固持一待檢測之樣本(11),該樣本具有一樣本表面; 執行包括至少二個聲學量測之一量測時期,各聲學量測包含在一輸入位置(p a、p d、p e)處輸入一聲波且產生指示該聲波在一量測位置(p b、p c、p f)處量測之反射的一各別感測信號,其中該等至少二個聲學量測係運用一不同輸入位置(p a、p d、p e)及/或一不同量測位置執行的; 使用運用該量測時期中之該等至少二個聲學量測產生之該等各別感測信號,基於一計算而產生指示該樣本中之次表面特徵的輸出資料。 An acoustic subsurface detection method comprises: holding a sample (11) to be detected, the sample having a sample surface; performing a measurement period including at least two acoustic measurements, each acoustic measurement comprising inputting an acoustic wave at an input position ( pa , pd , pe ) and generating a respective sensing signal indicating reflection of the acoustic wave measured at a measurement position ( pb , pc , pf ), wherein the at least two acoustic measurements are performed using a different input position ( pa , pd , pe ) and/or a different measurement position; and generating output data indicating subsurface features in the sample based on a calculation using the respective sensing signals generated using the at least two acoustic measurements in the measurement period. 如請求項14之聲學次表面檢測方法,其中該計算包含產生指示該等各別感測信號之間的一差的一差信號,作為用於該輸出資料之該計算之一中間計算步驟。The acoustic subsurface detection method of claim 14, wherein the calculation includes generating a difference signal indicating a difference between the respective sensing signals as an intermediate calculation step for the calculation of the output data. 如請求項14之聲學次表面檢測方法,其中該計算包含: 在一經訓練神經網路之一輸入處提供運用該量測時期中之該等至少二個聲學量測產生之該等各別感測信號; 其中該神經網路將神經網路操作應用於該等各別感測信號; 在該經訓練神經網路之一輸出處獲得指示該樣本中之次表面特徵的該輸出資料。 The acoustic subsurface detection method of claim 14, wherein the calculating comprises: providing, at an input of a trained neural network, the respective sensing signals generated using the at least two acoustic measurements during the measurement period; wherein the neural network applies a neural network operation to the respective sensing signals; and obtaining, at an output of the trained neural network, output data indicative of a subsurface feature in the sample. 如請求項16之聲學次表面檢測方法,其包含: 提供一待訓練之神經網路; 製備至少一個訓練樣本,該至少一個訓練樣本包含側向地分佈於該樣本中之各種相互不同之次表面結構; 重複以下訓練步驟: 應用如請求項10之步驟以在一量測時期中獲得各別感測資料,其中該等輸入位置及該等量測位置在一空間範圍內; 在一待訓練之神經網路之一輸入處提供運用該量測時期中之該等至少二個聲學量測產生之該等各別感測信號; 其中該神經網路將神經網路操作應用於該等各別感測信號; 在該待訓練之神經網路之一輸出處獲得輸出資料; 獲得地面實況資料,該地面實況資料係在該空間範圍內自該至少一個訓練樣本之一次表面規格獲得的; 基於該輸出資料與該地面實況資料之一比較而計算一損失; 藉由所計算之該損失之反向傳播而更新該待訓練之神經網路之神經網路參數; 選擇不同於先前空間範圍之一新空間範圍。 The acoustic subsurface detection method of claim 16, comprising: providing a neural network to be trained; preparing at least one training sample, wherein the at least one training sample comprises a variety of mutually different subsurface structures distributed laterally in the sample; repeating the following training steps: applying the steps of claim 10 to obtain respective sensing data during a measurement period, wherein the input positions and the measurement positions are within a spatial range; providing the respective sensing signals generated by the at least two acoustic measurements during the measurement period at an input of the neural network to be trained; wherein the neural network applies neural network operations to the respective sensing signals; Obtaining output data at an output of the neural network to be trained; Obtaining ground truth data, the ground truth data obtained from a surface specification of the at least one training example within the spatial range; Calculating a loss based on a comparison between the output data and the ground truth data; Updating neural network parameters of the neural network to be trained by backpropagating the calculated loss; Selecting a new spatial range that is different from the previous spatial range.
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