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TW202511698A - Interferometer configured to measure small structures - Google Patents

Interferometer configured to measure small structures Download PDF

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Publication number
TW202511698A
TW202511698A TW113133912A TW113133912A TW202511698A TW 202511698 A TW202511698 A TW 202511698A TW 113133912 A TW113133912 A TW 113133912A TW 113133912 A TW113133912 A TW 113133912A TW 202511698 A TW202511698 A TW 202511698A
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sample
light
interferometer
reflected
optical element
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TW113133912A
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喬安納 施密特
海瑟姆 Ab 穆斯塔法
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美商昂圖創新公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/0209Low-coherence interferometers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/22Measuring arrangements characterised by the use of optical techniques for measuring depth
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/70Using polarization in the interferometer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

An interferometer is configured to characterize a plurality of structures in a sample including High Aspect Ratio structures. The interferometer illuminates the sample with illumination optics having a numerical aperture that is smaller than the numerical aperture of the collection optics that collect the reflected light in order to increase the amount of light that penetrates the depth of the structures and improves the signal to noise ratio. During measurement, the focal position of the collection optics with respect to the sample is fixed, while an optical path difference between the sample light and the reference light is altered to scan the coherence fringes through the depth of the structures. Images of a region of the sample are collected at different optical path differences between the reference light and the sample light and are analyzed to characterize the structures in the sample.

Description

經組態以測量小型結構之干涉儀Interferometer configured to measure small structures

本文所述之標的係關於干涉測量法,且更具體地係關於用於測量深且窄之結構的方法及設備。The subject matter described herein relates to interferometry and, more particularly, to methods and apparatus for measuring deep and narrow structures.

干涉測量法係一種用於精確測量各種物理參數包括固體物體之表面形狀或輪廓的既定方法。擷取多個資料訊框,各資料訊框在參考光束與測試光束之間具有不同的相對相移,且由電腦處理資料以高精度地判定參考與測試之間的相對路徑差。Interferometry is an established method for accurately measuring a variety of physical parameters including the surface shape or profile of solid objects. Multiple data frames are acquired, each with a different relative phase shift between the reference and test beams, and the data is processed by a computer to determine the relative path difference between reference and test with high accuracy.

半導體及其他類似產業正在生產愈來愈小且愈來愈複雜之結構,所述結構需要在製造期間進行非接觸式評估。例如,矽通孔(Through Silicon Vias, TSV) 是一種被生產用於連接積體電路先進封裝中之裝置及晶片的結構。例如,TSV可包括溝槽及孔洞二者。諸如TSV之結構因為深度深且寬度窄,有時被稱為高縱橫比(High Aspect Ratio, HAR)。隨著諸如矽通孔之複雜結構的深度不斷增加,而寬度變窄,使用習知光學計量方法測量此等裝置之輪廓亦變得愈來愈困難,甚至不可能。例如,對於習知干涉儀,沒有足夠之光量能夠穿透結構之深度並返回至偵測器以提供充足之信號。The semiconductor and other similar industries are producing smaller and more complex structures that require non-contact evaluation during manufacturing. For example, Through Silicon Vias (TSV) are a type of structure produced to connect devices and chips in advanced packaging of integrated circuits. For example, TSVs can include both trenches and holes. Structures such as TSVs are sometimes referred to as High Aspect Ratio (HAR) because of their deep depth and narrow width. As complex structures such as TSVs continue to increase in depth and narrow in width, it becomes increasingly difficult or even impossible to measure the profile of these devices using conventional optical metrology methods. For example, with conventional interferometers, not enough light can penetrate deep into the structure and return to the detector to provide an adequate signal.

一種干涉儀經組態以特徵化包括具有高縱橫比之結構之一樣本中之複數個結構。該干涉儀利用照明光學元件照射該樣本,該照明光學元件具有一數值孔徑,該數值孔徑小於用於收集來自該樣本之經反射光之收集光學元件的數值孔徑,從而增加穿透所述結構之深度的光量,以改善信號對雜訊比。額外地,該收集光學元件聚焦於相對於該樣本不變之固定焦點位置處,同時該樣本光與該參考光之間之光學路徑差經改變,或者光之光譜的週期性經調變以在測量期間通過所述結構之該深度掃描相干條紋。以該參考光與該樣本光之間之不同光學路徑差收集該樣本之一區域之影像,並進行分析以特徵化該樣本中之所述結構。An interferometer is configured to characterize a plurality of structures in a sample including structures having a high aspect ratio. The interferometer illuminates the sample using an illumination optic having a numerical aperture that is smaller than the numerical aperture of a collection optic used to collect reflected light from the sample, thereby increasing the amount of light that penetrates deep into the structure to improve the signal-to-noise ratio. Additionally, the collection optic is focused at a fixed focal position that is constant relative to the sample, while the optical path difference between the sample light and the reference light is varied, or the periodicity of the spectrum of the light is modulated to scan coherence fringes through the depth of the structure during measurement. Images of a region of the sample are collected with different optical path differences between the reference light and the sample light and analyzed to characterize the structure in the sample.

在一個實施方案中,一種利用一干涉儀特徵化包括複數個結構之一樣本之一區域之方法包括:將照明光分裂成待入射於該樣本上並由該樣本反射的樣本光及待入射於一參考鏡上並由該參考鏡反射的參考光。該方法包括:利用具有一第一數值孔徑之照明光學元件用該樣本光照射該樣本之該區域;及將收集光學元件聚焦於相對於該樣本之一焦點位置處,該收集光學元件具有大於該第一數值孔徑之一第二數值孔徑。通過該樣本之深度掃描藉由來自該樣本之經反射樣本光與來自該參考鏡之經反射參考光產生干涉所產生之一或多個相干包絡(envelope),同時不改變該收集光學元件相對於該樣本之該焦點位置。該方法進一步包括:利用該收集光學元件對與來自該參考鏡之經反射參考光以該一或多個相干包絡之複數個深度產生干涉的來自該樣本之經反射樣本光進行成像,以產生多個影像。包括該複數個結構之該樣本之該區域的該多個影像經分析以特徵化該樣本之該區域。In one embodiment, a method of characterizing a region of a sample including a plurality of structures using an interferometer includes: splitting illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by a reference mirror. The method includes: illuminating the region of the sample with the sample light using an illumination optical element having a first numerical aperture; and focusing a collection optical element at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture. Scanning the sample through a depth of the sample by interference of reflected sample light from the sample with reflected reference light from the reference mirror to generate one or more coherent envelopes while not changing the focal position of the collection optics relative to the sample. The method further includes imaging, using the collection optics, reflected sample light from the sample that interferes with reflected reference light from the reference mirror at a plurality of depths of the one or more coherent envelopes to generate a plurality of images. The plurality of images of the region of the sample that includes the plurality of structures are analyzed to characterize the region of the sample.

在一個實施方案中,一種經組態用於特徵化包括複數個結構之一樣本之一區域之干涉儀包括用於將照明光分裂成待入射於該樣本上並由該樣本反射的樣本光及待入射於一參考鏡上並由該參考鏡反射的參考光之構件。該干涉儀進一步包括:用於利用具有一第一數值孔徑之照明光學元件用該樣本光照射該樣本之該區域之構件;及用於將收集光學元件聚焦於相對於該樣本之一焦點位置處之構件,該收集光學元件具有大於該第一數值孔徑之一第二數值孔徑。該干涉儀進一步包括:用於通過該樣本之深度掃描藉由來自該樣本之經反射樣本光與來自該參考鏡之經反射參考光產生干涉所產生之一或多個相干包絡,同時不改變該收集光學元件相對於該樣本之該焦點位置之構件。該干涉儀進一步包括:用於利用該收集光學元件對與來自該參考鏡之經反射參考光以該一或多個相干包絡之複數個深度產生干涉之來自該樣本之經反射樣本光進行成像,以產生多個影像之構件。該干涉儀進一步包括:用於分析包括該複數個結構之該樣本之該區域的該多個影像以特徵化該樣本之該區域之構件。In one embodiment, an interferometer configured for characterizing a region of a sample including a plurality of structures includes means for splitting illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by a reference mirror. The interferometer further includes means for illuminating the region of the sample with the sample light using illumination optics having a first numerical aperture; and means for focusing collection optics at a focal position relative to the sample, the collection optics having a second numerical aperture greater than the first numerical aperture. The interferometer further includes: means for generating one or more coherent envelopes by interference of reflected sample light from the sample with reflected reference light from the reference mirror through depth scanning of the sample, while not changing the focal position of the collection optical element relative to the sample. The interferometer further includes: means for imaging the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror at a plurality of depths of the one or more coherent envelopes using the collection optical element to generate a plurality of images. The interferometer further includes: means for analyzing the plurality of images of the region of the sample including the plurality of structures to characterize the region of the sample.

在一個實施方案中,一種經組態用於特徵化包括複數個結構之一樣本之一區域之干涉儀包括一分光器,該分光器經組態將照明光分裂成待入射於該樣本上並由該樣本反射的樣本光及待入射於一參考鏡上並由該參考鏡反射的參考光。該干涉儀進一步包括:具有一第一數值孔徑之照明光學元件,其經組態以用該樣本光照射該樣本之該區域;及收集光學元件,其經組態以聚焦於相對於該樣本之一焦點位置處,該收集光學元件具有大於該第一數值孔徑之一第二數值孔徑。一致動器經組態以通過該樣本之深度掃描藉由來自該樣本之經反射樣本光與來自該參考鏡之經反射參考光產生干涉所產生之一或多個相干包絡,同時不改變該收集光學元件相對於該樣本之該焦點位置。該干涉儀進一步包括:一偵測器,其經組態以利用該收集光學元件對與來自該參考鏡之經反射參考光以該一或多個相干包絡之複數個深度產生干涉之來自該樣本之經反射樣本光進行成像,以產生多個影像。該干涉儀進一步包括:至少一個處理器,其經組態以分析包括該複數個結構之該樣本之該區域的該多個影像以特徵化該樣本之該區域。In one embodiment, an interferometer configured for characterizing a region of a sample including a plurality of structures includes a beam splitter configured to split illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by a reference mirror. The interferometer further includes: an illumination optical element having a first numerical aperture, configured to illuminate the region of the sample with the sample light; and a collection optical element configured to focus at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture. An actuator is configured to generate one or more coherence envelopes by interference of reflected sample light from the sample with reflected reference light from the reference mirror through depth scanning of the sample, while not changing the focal position of the collection optical element relative to the sample. The interferometer further includes: a detector configured to image the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror at multiple depths of the one or more coherence envelopes using the collection optical element to generate multiple images. The interferometer further includes: at least one processor configured to analyze the multiple images of the region of the sample including the multiple structures to characterize the region of the sample.

在一個實施方案中,一種利用一干涉儀特徵化包括複數個結構之一樣本之一區域之方法包括:將照明光分裂成待入射於該樣本上並由該樣本反射的樣本光及待入射於一參考鏡上並由該參考鏡反射的參考光。該方法包括:利用具有一第一數值孔徑之照明光學元件用該樣本光照射該樣本之該區域;及將收集光學元件聚焦於相對於該樣本之一焦點位置處,該收集光學元件具有大於該第一數值孔徑之一第二數值孔徑。改變該樣本光與該參考光之間之一光學路徑差,同時不改變該收集光學元件相對於該樣本之該焦點位置。該方法進一步包括:利用該收集光學元件對與來自該參考鏡之經反射參考光以複數個光學路徑差產生干涉之來自該樣本之經反射樣本光進行成像,以產生多個影像。包括該複數個結構之該樣本之該區域的該多個影像經分析以特徵化該樣本之該區域。In one embodiment, a method of characterizing a region of a sample including a plurality of structures using an interferometer includes: splitting illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by a reference mirror. The method includes: illuminating the region of the sample with the sample light using an illumination optical element having a first numerical aperture; and focusing a collection optical element at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture. Changing an optical path difference between the sample light and the reference light while not changing the focal position of the collection optical element relative to the sample. The method further includes: using the collection optical element to image the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror by a plurality of optical path differences to generate a plurality of images. The plurality of images of the region of the sample including the plurality of structures are analyzed to characterize the region of the sample.

在一個實施方案中,一種利用一干涉儀特徵化包括複數個結構之一樣本之一區域之方法包括:將照明光分裂成待入射於該樣本上並由該樣本反射的樣本光及待入射於一參考鏡上並由該參考鏡反射的參考光。該方法包括:利用具有一第一數值孔徑之照明光學元件用該樣本光照射該樣本之該區域;及將收集光學元件聚焦於相對於該樣本之一焦點位置處,該收集光學元件具有大於該第一數值孔徑之一第二數值孔徑。該方法包括:調變該照明光或藉由來自該樣本之經反射樣本光與來自該參考鏡之經反射參考光產生干涉所產生之干涉光之光譜的週期性,同時不改變該收集光學元件相對於該樣本之該焦點位置。該方法進一步包括:利用該收集光學元件對與來自該參考鏡之該經反射參考光以該光之光譜的該週期性之調變的複數個變化產生干涉之來自該樣本之經反射樣本光進行成像,以產生多個影像。包括該複數個結構之該樣本之該區域的該多個影像經分析以特徵化該樣本之該區域。In one embodiment, a method of characterizing a region of a sample including a plurality of structures using an interferometer includes: splitting illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by a reference mirror. The method includes: illuminating the region of the sample with the sample light using an illumination optical element having a first numerical aperture; and focusing a collection optical element at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture. The method includes: modulating the periodicity of the spectrum of the illumination light or interference light generated by interference of reflected sample light from the sample with reflected reference light from the reference mirror, while not changing the focal position of the collection optical element relative to the sample. The method further includes: using the collection optical element to image the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror with a plurality of changes in the periodic modulation of the spectrum of the light to generate a plurality of images. The plurality of images of the region of the sample including the plurality of structures are analyzed to characterize the region of the sample.

干涉儀諸如低相干干涉儀(LCI)會產生從樣本反射的樣本光及從參考表面反射的參考光。經反射樣本光及參考光發生干涉,產生干涉圖案。當樣本光與參考光之間之光學路徑差小於相干長度時,波干涉之強度增加。藉由掃描樣本上之干涉物鏡之焦點位置,樣本光與參考光之間之光學路徑差被改變並可相對於改變焦點位置而被記錄。使用關於焦點位置之經記錄干涉資料,可特徵化樣本,例如可判定樣本之深度輪廓。Interferometers such as low coherence interferometers (LCI) generate sample light reflected from a sample and reference light reflected from a reference surface. The reflected sample and reference light interfere, generating an interference pattern. When the optical path difference between the sample and reference light is less than the coherence length, the intensity of the wave interference increases. By scanning the focal position of the interferometer objective on the sample, the optical path difference between the sample and reference light is changed and can be recorded relative to the changed focal position. Using the recorded interference data about the focal position, the sample can be characterized, for example, the depth profile of the sample can be determined.

干涉測量法已被用於精確測量樣本上之結構的輪廓。然而,樣本上之結構不斷縮小,給習知干涉測量法技術造成困難。例如,LCI光學輪廓儀可精確測量超過10 µm寬之通孔例如溝槽或孔洞之深度。然而,使用LCI技術測量具有較小之寬度之通孔變得愈來愈困難。例如,測量5 µm寬之通孔深度可能會遇到一些困難,但對於小於5 µm寬,且特別是3 µm寬或更小之通孔,深度測量係不可重複的,且可能無法測量,特別是對於更深之通孔,例如,30 µm或更大之深度。Interferometry has been used to accurately measure the profile of structures on a sample. However, the structures on a sample continue to shrink, creating challenges for conventional interferometry techniques. For example, LCI optical profilers can accurately measure the depth of vias such as trenches or holes that are over 10 µm wide. However, it is becoming increasingly difficult to measure vias with smaller widths using LCI techniques. For example, measuring the depth of a 5 µm wide via may present some difficulty, but for vias less than 5 µm wide, and especially 3 µm wide or less, depth measurements are not repeatable and may not be measurable, especially for deeper vias, e.g., 30 µm or greater depths.

如本文所討論,干涉儀經組態以使用數值孔徑(numerical aperture, NA)小於收集光學元件之NA之照明光學元件特徵化小型結構,諸如可具有5 µm或更小之寬度及30 µm或更大之深度的高縱橫比(HAR)通孔。在一些實施方案中,例如,照明光可被提供給物鏡下方之干涉物鏡,使得照明光學元件之NA不包括物鏡,而收集光學元件包括物鏡。在一些實施方案中,照明光可透過物鏡提供,但是照明光之NA會減小,使得照明光學元件(包括物鏡)具有比用作收集光學元件之物鏡之NA更小的NA。As discussed herein, interferometers are configured to characterize small structures using illumination optics having a numerical aperture (NA) less than the NA of collection optics, such as high aspect ratio (HAR) through holes that may have a width of 5 µm or less and a depth of 30 µm or more. In some embodiments, for example, illumination light may be provided to an interferometer objective below an objective such that the NA of the illumination optics does not include the objective and the collection optics includes the objective. In some embodiments, illumination light may be provided through the objective, but the NA of the illumination light is reduced such that the illumination optics (including the objective) has a smaller NA than the NA of the objective used as the collection optics.

額外地,干涉儀改變光學路徑差而將焦點位置保持在相對於樣本之固定位置,而不是掃描干涉物鏡之焦點位置以改變參考光與樣本光之間之光學路徑差。例如,可藉由移動參考鏡或分光器或其組合來改變參考光學路徑之長度,而不改變物鏡焦點位置。在另一實施方案中,干涉儀可調變干涉儀所使用之光譜的週期性,同時將焦點位置固持在相對於樣本之固定位置處,而不是掃描干涉物鏡或參考鏡之焦點位置。Additionally, the interferometer varies the optical path difference while maintaining the focal position at a fixed position relative to the sample, rather than scanning the focal position of the interferometer objective to vary the optical path difference between the reference light and the sample light. For example, the length of the reference optical path may be varied by moving the reference mirror or the beam splitter or a combination thereof, without changing the objective focal position. In another embodiment, the interferometer may modulate the periodicity of the spectrum used by the interferometer while maintaining the focal position at a fixed position relative to the sample, rather than scanning the focal position of the interferometer objective or reference mirror.

在一些實施方案中,可使用多個參考光學路徑,各參考光學路徑之長度係基於樣本之表面之標稱位置來組態。可同時或依序掃描多個參考光學路徑中之各者以減少測量之通量時間。In some implementations, multiple reference optical paths may be used, with the length of each reference optical path configured based on a nominal position on the surface of the sample. Each of the multiple reference optical paths may be scanned simultaneously or sequentially to reduce the throughput time of the measurement.

圖1顯示使用干涉物鏡之干涉儀100的示意圖,該干涉物鏡相對於樣本垂直地掃描以改變與參考光束之光學路徑差。干涉儀100可係低相干干涉儀且包括寬頻光源110及將光引導向干涉物鏡120之分光器112。干涉物鏡120被繪示為米勞物鏡,其包括物鏡122、分光器124、及參考鏡126。物鏡122將光引導向樣本102,且分光器124將光分裂成入射於參考鏡126上且從該參考鏡反射的經反射參考光束123及入射於樣本102上且從該樣本反射的樣本光束125。經反射參考光束123及經反射樣本光束125r在物鏡122處重新組合。所得干涉光束由分光器112引導至透鏡142,該透鏡在耦接至處理系統150之偵測器140處提供干涉光束之影像。在測量期間,當光之差異小於相干長度時,經反射參考光束123與經反射樣本光束125r發生干涉。FIG1 shows a schematic diagram of an interferometer 100 using an interference objective that is scanned perpendicularly relative to a sample to vary the optical path difference with a reference beam. The interferometer 100 may be a low coherence interferometer and includes a broadband light source 110 and a beam splitter 112 that directs light toward an interference objective 120. The interference objective 120 is illustrated as a Milhausen objective that includes an objective 122, a beam splitter 124, and a reference lens 126. The objective 122 directs light toward the sample 102, and the beam splitter 124 splits the light into a reflected reference beam 123 that is incident on and reflected from the reference lens 126, and a sample beam 125 that is incident on and reflected from the sample 102. The reflected reference beam 123 and the reflected sample beam 125r are recombined at the objective lens 122. The resulting interference beam is directed by the beam splitter 112 to the lens 142, which provides an image of the interference beam at the detector 140 coupled to the processing system 150. During measurement, the reflected reference beam 123 and the reflected sample beam 125r interfere when the difference in light is less than the coherence length.

干涉物鏡120耦接至處理系統150控制之致動器128以調整干涉物鏡120之垂直位置。在操作中,干涉儀100如箭頭129所指示相對於樣本垂直掃描干涉物鏡120,以改變與參考光束123之光學路徑差。在一些實施方案中,樣本102可垂直移動(經由台座)以調整干涉物鏡120及樣本102之相對垂直位置。所得干涉圖案由偵測器140在不同垂直高度處接收並由處理系統150使用以判定樣本102之特性,諸如樣本102之表面輪廓。The interferometer 120 is coupled to an actuator 128 controlled by a processing system 150 to adjust the vertical position of the interferometer 120. In operation, the interferometer 100 scans the interferometer 120 vertically relative to the sample as indicated by arrow 129 to change the optical path difference with the reference beam 123. In some embodiments, the sample 102 can be moved vertically (via a stage) to adjust the relative vertical position of the interferometer 120 and the sample 102. The resulting interference pattern is received by the detector 140 at different vertical heights and used by the processing system 150 to determine characteristics of the sample 102, such as the surface profile of the sample 102.

圖2A舉例繪示掃描樣本上之焦點位置以改變光學路徑差的干涉物鏡210之操作。干涉物鏡210產生樣本光束212,該樣本光束被引導向樣本202並由該樣本反射。樣本光束212之焦點位置213被繪示為虛線。在樣本202之測量期間,藉由朝向及遠離樣本移動干涉物鏡210(或移動樣本202之相對位置),如箭頭218所繪示,在樣本202上垂直掃描(移動)樣本光束212之焦點位置213。FIG. 2A illustrates an example of the operation of an interferometer objective 210 that scans the focal position on a sample to change the optical path difference. The interferometer objective 210 generates a sample beam 212 that is directed toward and reflected by the sample 202. The focal position 213 of the sample beam 212 is depicted as a dashed line. During measurement of the sample 202, the focal position 213 of the sample beam 212 is vertically scanned (moved) on the sample 202 as indicated by arrow 218 by moving the interferometer objective 210 toward and away from the sample (or moving the relative position of the sample 202).

圖2B繪示具有疊加干涉信號220A、220B、及220C之樣本202,所述干涉信號藉由在不同掃描點處掃描樣本202上之干涉物鏡210的焦點位置而產生。當參考光束與樣本光束之間之光學路徑差小於相干長度時,波干涉之強度增加。藉由在多個水平掃描點處垂直掃描樣本202上之焦點位置213並記錄相對於焦點位置之所得干涉信號,可獲得樣本202之深度輪廓。2B shows a sample 202 with superimposed interference signals 220A, 220B, and 220C generated by scanning the focal position of the interferometer objective 210 on the sample 202 at different scan points. When the optical path difference between the reference beam and the sample beam is less than the coherence length, the intensity of the wave interference increases. By vertically scanning the focal position 213 on the sample 202 at multiple horizontal scan points and recording the resulting interference signal relative to the focal position, the depth profile of the sample 202 can be obtained.

圖3A及圖3B繪示米勞干涉物鏡310,如箭頭312所繪示,該米勞干涉物鏡在樣本302上掃描樣本束之焦點位置。例如,樣本302可包括複雜之結構並被繪示為具有可係孔洞或溝槽之結構304。例如,圖3A繪示干涉物鏡310,其中樣本光束之焦點位置位於樣本302之頂部表面處,即結構304之頂部。圖3B繪示在掃描至結構304之底部之後具有樣本光束之焦點位置的干涉物鏡310。3A and 3B illustrate a Mil-Laurence interferometer objective 310 that scans the focal position of a sample beam on a sample 302, as indicated by arrow 312. For example, sample 302 may include a complex structure and is illustrated as having a structure 304 that may be a hole or a groove. For example, FIG3A illustrates an interferometer objective 310 where the focal position of the sample beam is located at the top surface of sample 302, i.e., the top of structure 304. FIG3B illustrates the interferometer objective 310 with the focal position of the sample beam after scanning to the bottom of structure 304.

圖4A繪示樣本402之掃描電子顯微鏡(SEM)橫截面輪廓410、樣本402之對應低相干干涉儀(LCI)橫截面輪廓420、及繪示LCI條紋之對應相關圖430。LCI橫截面輪廓420及對應相關圖430例如可由圖1所示之干涉儀100藉由垂直地掃描樣本402上之樣本光束的焦點位置而產生。如所繪示,樣本402具有以虛線繪示之頂部表面406及具有以虛線繪示之底部表面408的複數個TSV 404。圖4A中之TSV 404係5 µm寬,且具有10 µm之深度。FIG4A shows a scanning electron microscope (SEM) cross-sectional profile 410 of a sample 402, a corresponding low coherence interferometer (LCI) cross-sectional profile 420 of the sample 402, and a corresponding correlation graph 430 showing LCI fringes. The LCI cross-sectional profile 420 and the corresponding correlation graph 430 can be generated, for example, by the interferometer 100 shown in FIG1 by vertically scanning the focal position of the sample beam on the sample 402. As shown, the sample 402 has a top surface 406 shown in dashed lines and a plurality of TSVs 404 having a bottom surface 408 shown in dashed lines. The TSVs 404 in FIG4A are 5 μm wide and have a depth of 10 μm.

LCI條紋顯示LCI橫截面輪廓420並在相關圖430中繪示干涉信號之強度在樣本402之頂部表面406處及底部表面408處增加。相關圖430中所繪示之LCI條紋在兩個不同位置處產生,亦即,位於TSV 404外部以測量樣本402之頂部表面406之第一位置及位於TSV 404內部以測量TSV 404之底部表面408之第二位置處。藉由垂直掃描干涉物鏡使得樣本光束之焦點位置掃描樣本402之頂部表面406及底部表面408二者,TSV之深度可基於頂部條紋與底部條紋(對應於頂部表面406及底部表面408處)之間之距離來判定。來自通孔之繞射可能會產生額外條紋,有時稱為重像條紋,此可能會使測量進一步複雜化。對於相對大的TSV,例如如圖4A所繪示之5 µm寬之TSV,如LCI橫截面輪廓420所繪示,重影條紋在通孔之開口或通孔底部外側之延伸中幾乎不可見。The LCI fringes show an LCI cross-sectional profile 420 and show in correlation graph 430 that the intensity of the interference signal increases at the top surface 406 and the bottom surface 408 of the sample 402. The LCI fringes shown in correlation graph 430 are generated at two different locations, namely, a first location located outside the TSV 404 to measure the top surface 406 of the sample 402 and a second location located inside the TSV 404 to measure the bottom surface 408 of the TSV 404. By scanning the interferometer objective perpendicularly so that the focal position of the sample beam scans both the top surface 406 and the bottom surface 408 of the sample 402, the depth of the TSV can be determined based on the distance between the top fringe and the bottom fringe (corresponding to the top surface 406 and the bottom surface 408). Diffraction from the via may produce additional fringes, sometimes referred to as ghost fringes, which may further complicate the measurement. For relatively large TSVs, such as the 5 µm wide TSV shown in FIG. 4A, the ghost fringes are barely visible in the opening of the via or extending outside the bottom of the via as shown in the LCI cross-sectional profile 420.

然而,隨著裝置不斷縮小,因為結構之變窄的寬度及大深度,使用習知LCI干涉儀測量TSV及其他高縱橫比結構正變得愈來愈困難,甚至不可能。例如,由於TSV之窄寬度,在TSV深度上掃描樣本光束之焦點位置的習知LCI干涉儀無法向TSV之底部提供充足光以產生充足之信號,且存在重影條紋可能會使測量進一步複雜化。However, as devices continue to shrink, measuring TSVs and other high aspect ratio structures using conventional LCI interferometry is becoming increasingly difficult or even impossible due to the narrowed width and large depth of the structures. For example, due to the narrow width of the TSV, conventional LCI interferometry, which scans the focal position of the sample beam across the depth of the TSV, cannot provide enough light to the bottom of the TSV to generate sufficient signal, and the presence of ghost fringes may further complicate the measurement.

圖4B及圖4C繪示由具有高縱橫比通孔之樣本產生的LCI條紋450及460。圖4B繪示來自具有通孔之樣本的LCI條紋450,該通孔具有5 µm之寬度及10 µm之深度。如圖4B中可見,來自頂部表面之條紋452如同來自通孔之底部之條紋454清晰可見,且因此,圖4B所繪示之結構中之通孔之深度可被精確地測量。然而,隨著通孔變窄及/或加深,來自通孔之底部之條紋之振幅顯著減少。例如,圖4C繪示來自具有通孔諸如溝槽之樣本的LCI條紋460,該通孔具有1.5 µm之寬度及8 µm之深度。如圖4C中可見,來自頂部表面之條紋462清晰可見,然而,來自通孔之底部之條紋464之振幅大幅減少且可能不足以用於準確特徵化通孔。具體地,應注意,圖4C所繪示之通孔相對淺,例如具有約1:5之深寬比(寬度:深度),且通孔之底部處之條紋464之振幅非常弱。測量高縱橫比(HAR)通孔係所欲的,其可具有小於1:20深寬比,例如1:50。對於通孔之習知LCI測量,直徑小於在5 µm至3 µm之間之通孔的典型深寬比限制為約1:12,而對於較窄結構,該限制更差,例如1:10或更小。此外,當結構變窄至低於例如4 µm時,來自通孔之額外繞射包括重影條紋466,所述重影條紋在頂部表面位凖處之通孔開口處係強的,此可能使測量進一步複雜化。4B and 4C show LCI stripes 450 and 460 generated from a sample having a high aspect ratio via. FIG. 4B shows LCI stripe 450 from a sample having a via having a width of 5 µm and a depth of 10 µm. As can be seen in FIG. 4B , stripes 452 from the top surface are clearly visible as are stripes 454 from the bottom of the via, and therefore, the depth of the via in the structure shown in FIG. 4B can be accurately measured. However, as the via narrows and/or deepens, the amplitude of the stripes from the bottom of the via decreases significantly. For example, FIG. 4C shows LCI stripe 460 from a sample having a via, such as a trench, having a width of 1.5 µm and a depth of 8 µm. As can be seen in FIG. 4C , the fringe 462 from the top surface is clearly visible, however, the amplitude of the fringe 464 from the bottom of the via is greatly reduced and may not be sufficient to accurately characterize the via. Specifically, it should be noted that the via depicted in FIG. 4C is relatively shallow, e.g., having an aspect ratio (width:depth) of about 1:5, and the amplitude of the fringe 464 at the bottom of the via is very weak. Measuring high aspect ratio (HAR) vias is desirable, which may have an aspect ratio of less than 1:20, e.g., 1:50. For known LCI measurements of vias, the typical aspect ratio limit for vias with diameters less than between 5 µm and 3 µm is about 1:12, and for narrower structures the limit is worse, e.g., 1:10 or less. Additionally, when the structure narrows to below, for example, 4 µm, additional diffraction from the via includes ghost fringes 466 that are strong at the via opening at the top surface location, which can further complicate the measurement.

為了充分特徵化結構,諸如HAR結構,已發現通孔之底部之條紋的強度取決於多種因素,包括照明光之數值孔徑、通孔係孔洞或溝槽、直徑/寬度、深度、及照明光之偏振、樣本相對於參考鏡之相對反射率、照明光之光譜頻寬(例如,較短波長將在窄結構中行進得更遠)、及參考鏡之位置。具體地,已發現,將物鏡之焦點位置維持在單一高度,同時改變參考光束與樣本光束之間之光學路徑差,會產生從結構之底部具有增加之條紋振幅的條紋。可改變光學路徑差,且通過物體深度掃描低相干條紋,同時維持物鏡之焦點位置(亦即,同時固持物鏡之焦點位置固定於一個位置處),例如,藉由掃描參考鏡、掃描產生參考光之分光器、或其組合。在另一實施方案中,可藉由調變光之光譜的週期性同時將物鏡之焦點位置維持於單一高度處來通過物體深度產生並掃描低相干條紋。在一些實施方案中,可改變光學路徑差且可調變光之光譜的週期性以產生相干條紋,所述相干條紋在不移動物鏡之焦點位置之情況下經通過物體深度掃描。藉由在不移動物鏡之焦點位置之情況下通過物體深度掃描相干條紋,例如藉由掃描參考鏡或藉由調變光之光譜的週期性,可避免使物鏡散焦之繞射影響成像,例如,以避免改變背景強度及/或影響條紋可見度。In order to fully characterize a structure, such as a HAR structure, it has been found that the intensity of the fringing at the bottom of the via depends on a variety of factors, including the numerical aperture of the illumination light, whether the via is a hole or a trench, the diameter/width, depth, and polarization of the illumination light, the relative reflectivity of the sample relative to the reference lens, the spectral bandwidth of the illumination light (e.g., shorter wavelengths will travel farther in a narrow structure), and the position of the reference lens. Specifically, it has been found that maintaining the focal position of the objective lens at a single height while varying the optical path difference between the reference beam and the sample beam produces fringing with increasing fringing amplitude from the bottom of the structure. The optical path difference may be varied and low coherence fringes may be scanned through the depth of the object while maintaining the focal position of the objective lens (i.e., while holding the focal position of the objective lens fixed at one position), for example, by scanning a reference lens, scanning a beam splitter that generates reference light, or a combination thereof. In another embodiment, low coherence fringes may be generated and scanned through the depth of the object by modulating the periodicity of the spectrum of the light while maintaining the focal position of the objective lens at a single height. In some embodiments, the optical path difference may be varied and the periodicity of the spectrum of the light may be modulated to generate coherence fringes that are scanned through the depth of the object without moving the focal position of the objective lens. By scanning the coherent fringes through the depth of the object without moving the focal position of the objective, for example by scanning a reference lens or by modulating the periodicity of the spectrum of the light, diffraction that defocuses the objective can be avoided from affecting the imaging, for example to avoid changing the background intensity and/or affecting the visibility of the fringes.

藉由調變光源之光譜的週期性來通過物體深度掃描低相干條紋,與改變光學路徑差同時將物鏡焦點位置維持於相對於物體相同之高度具有類似的效果。在維持物鏡之焦點位置的同時,可例如藉由將寬頻光譜修改為週期性且接著以時間週期性改變光譜來執行光之光譜的週期性之調變。例如,可使用調變干涉儀來調變光之光譜的週期性,該調變干涉儀以多種方式中之一者與主計量干涉儀組合,例如以串列干涉儀組態。Scanning low coherence fringes through the depth of an object by modulating the periodicity of the spectrum of a light source has a similar effect to varying the optical path difference while maintaining the objective lens focal position at the same height relative to the object. Modulation of the periodicity of the spectrum of light can be performed, for example, by modifying the broadband spectrum to be periodic and then varying the spectrum periodically in time while maintaining the focal position of the objective lens. For example, the periodicity of the spectrum of light can be modulated using a modulation interferometer that is combined with a main metrology interferometer in one of a number of ways, such as in a tandem interferometer configuration.

圖5A舉例繪示調變干涉儀500之示意圖,該調變干涉儀可用以調變光之光譜的週期性並可與計量干涉儀組合,例如以串聯干涉儀組態。例如,調變干涉儀500可接收來自光源之光並調變作為輸入光提供給計量干涉儀的光之光譜,或者調變干涉儀500可接收來自計量干涉儀之光並調變提供給計量干涉儀之偵測器的光之光譜。如所繪示,調變干涉儀500可具有邁克生(Michelson)組態,但是可使用其他組態。輸入光(例如,來自光源或來自計量干涉儀)經接收並提供給分光器504。分光器504將光之一部分引導至第一臂中之第一返回鏡506,並將光之另一部分引導至第二臂中之第二返回鏡508。從第一返回鏡506及第二返回鏡508反射的光在分光器504處重新組合並且經提供作為輸出光(例如,作為至計量干涉儀或至計量干涉儀之偵測器之輸入光)。如所繪示,第一返回鏡506耦接至致動器507,該致動器由處理系統控制以改變第一返回鏡506之位置,從而改變調變干涉儀500之參考臂之間的光學路徑差。若需要,第一返回鏡506及第二返回鏡508二者均可移動。FIG5A illustrates an example of a modulation interferometer 500 that can be used to modulate the periodicity of a spectrum of light and can be combined with a metrology interferometer, such as in a tandem interferometer configuration. For example, the modulation interferometer 500 can receive light from a light source and modulate the spectrum of light provided as input light to the metrology interferometer, or the modulation interferometer 500 can receive light from a metrology interferometer and modulate the spectrum of light provided to a detector of the metrology interferometer. As shown, the modulation interferometer 500 can have a Michelson configuration, but other configurations can be used. Input light (e.g., from a light source or from a metrology interferometer) is received and provided to a beam splitter 504. The beam splitter 504 directs a portion of the light to a first return mirror 506 in the first arm and another portion of the light to a second return mirror 508 in the second arm. The light reflected from the first return mirror 506 and the second return mirror 508 is recombined at the beam splitter 504 and provided as output light (e.g., as input light to a metrology interferometer or to a detector of the metrology interferometer). As shown, the first return mirror 506 is coupled to an actuator 507, which is controlled by a processing system to change the position of the first return mirror 506, thereby changing the optical path difference between the reference arms of the modulation interferometer 500. If necessary, both the first return mirror 506 and the second return mirror 508 can be moved.

在另一實施方案中,並非移動第一返回鏡506,而是可使用非平衡光纖干涉儀來調變光之光譜的週期性,例如,該光纖干涉儀相對於一個光纖拉伸另一個光纖,以改變干涉儀之平衡,從而改變內部參考平面之位置,且因此調變光之光譜的週期性。In another embodiment, instead of moving the first return mirror 506, an unbalanced fiber optic interferometer may be used to modulate the periodicity of the spectrum of light, for example, the fiber optic interferometer stretches one fiber relative to the other to change the balance of the interferometer, thereby changing the position of the internal reference plane and thereby modulating the periodicity of the spectrum of light.

可使用其他技術來調變光之光譜的週期性。例如,圖5B繪示光譜調變器520,該光譜調變器可用以調變光之光譜的週期性且可與計量干涉儀組合。例如,光譜調變器520可接收來自光源之光並調變作為輸入光提供給計量干涉儀的光之光譜,或者光譜調變器520可接收來自計量干涉儀之光並調變提供給計量干涉儀之偵測器的光之光譜。光譜調變器520接收輸入光並利用色散光學元件522諸如棱鏡或繞射光柵對光之光譜進行光譜分解。使用空間光調變器524調變光之光譜,從而產生光之光譜之變化週期性,使用重新組合光學元件526(可係棱鏡或繞射光柵)將其重新組合,以產生輸出光。Other techniques may be used to modulate the periodicity of the spectrum of light. For example, FIG. 5B illustrates a spectrum modulator 520 that may be used to modulate the periodicity of the spectrum of light and may be combined with a metrology interferometer. For example, the spectrum modulator 520 may receive light from a light source and modulate the spectrum of light provided as input light to a metrology interferometer, or the spectrum modulator 520 may receive light from a metrology interferometer and modulate the spectrum of light provided to a detector of the metrology interferometer. The spectrum modulator 520 receives input light and spectrally decomposes the spectrum of light using a dispersive optical element 522 such as a prism or a diffraction grating. The spectrum of the light is modulated using a spatial light modulator 524 to generate periodic changes in the spectrum of the light, and is recombined using a recombining optical element 526 (which may be a prism or a diffraction grating) to generate output light.

如上文所討論,圖5C繪示用於產生週期性光譜之低相干條紋550。圖5D舉例繪示調變前來自源之輸入光562的實例,且圖5E繪示輸出光564之實例,顯示了調變後之週期光譜。如圖5C所繪示,顯示了三組低相干條紋552、554、及556,各組皆由相干包絡約束。外側條紋554及556距中條紋552之距離為D,且距離D變化以改變光譜的週期性,例如,藉由改變調變干涉儀500中之參考臂之光學路徑差或藉由利用光譜調變器520中空間光調變器524調變光譜。如上文所討論,藉由調變光之光譜的週期性,或者使用其他方法,外側條紋554及/或556之相干包絡可通過物體例如通孔的深度移動,同時維持物鏡之焦點位置,此有利地避免了機械掃描。As discussed above, FIG5C illustrates low coherence fringes 550 used to generate a periodic spectrum. FIG5D illustrates an example of input light 562 from a source before modulation, and FIG5E illustrates an example of output light 564, showing a periodic spectrum after modulation. As shown in FIG5C, three sets of low coherence fringes 552, 554, and 556 are shown, each set being bounded by a coherent envelope. The outer stripes 554 and 556 are located at a distance D from the center stripe 552, and the distance D is varied to change the periodicity of the spectrum, for example, by changing the optical path difference of the reference arm in the modulation interferometer 500 or by modulating the spectrum using the spatial light modulator 524 in the spectrum modulator 520. As discussed above, by modulating the periodicity of the spectrum of light, or using other methods, the coherent envelope of the outer stripes 554 and/or 556 can be moved through the depth of an object, such as a through hole, while maintaining the focal position of the objective lens, which advantageously avoids mechanical scanning.

額外地,干涉儀可使用將照明及成像光學元件分離之設計。例如,光學元件設計可使用低數值孔徑(NA)光學元件來照射樣本,同時使用高NA成像光學元件。成像光學元件可設計用於解析度方面之最佳成像,例如高NA、畸變、色像差等。可係物鏡下方之分離光學元件的照明光學元件可經設計用於最佳波前品質、更好之準直,例如更低NA。準直光學元件之散焦可額外地控制波前形狀並塑形照明光束。波長頻寬濾波器及偏振元件亦可影響諸如HAR TSV之結構中之光傳播。照射光學元件與成像光學元件分離之設計允許控制或增強條紋調變包絡之形狀,從而允許特徵化更深之通孔。Additionally, interferometers can use designs that separate the illumination and imaging optics. For example, the optics design can use low numerical aperture (NA) optics to illuminate the sample while using high NA imaging optics. The imaging optics can be designed for best imaging in terms of resolution, such as high NA, distortion, chromatic aberrations, etc. The illumination optics, which can be a separate optic below the objective, can be designed for best wavefront quality, better collimation, such as lower NA. Defocusing of the collimating optics can additionally control the wavefront shape and shape the illumination beam. Wavelength bandwidth filters and polarization elements can also affect light propagation in structures such as HAR TSVs. The design of separate illumination and imaging optics allows the shape of the fringe modulation envelope to be controlled or enhanced, thereby allowing deeper vias to be characterized.

圖6舉例繪示具有不同源大小及透鏡焦距長度之系統中之光束準直發散的實例。圖6繪示包括光源602之三個系統610、620、及630,該光源由光源孔徑614(在系統610及630中)及光源孔徑624(在系統620中)之大小以及光學元件612(在系統610及620中具有焦距fl1)及632(在系統630中具有焦距fl2)之數值孔徑NA(以焦距繪示)來調節。如所繪示,光源孔徑624大於光源孔徑614,從而提供更大之光源602,且光學元件632之焦距fl2短於光學元件612之焦距fl1,例如,光學元件632之NA大於光學元件612之NA。Figure 6 illustrates an example of beam collimation divergence in systems with different source sizes and lens focal lengths. Figure 6 shows three systems 610, 620, and 630 including a light source 602 that is adjusted by the size of the source aperture 614 (in systems 610 and 630) and the source aperture 624 (in system 620) and the numerical aperture NA (shown in terms of focal length) of optical elements 612 (having focal length fl1 in systems 610 and 620) and 632 (having focal length fl2 in system 630). As shown, the light source aperture 624 is larger than the light source aperture 614, thereby providing a larger light source 602, and the focal length fl2 of the optical element 632 is shorter than the focal length fl1 of the optical element 612, eg, the NA of the optical element 632 is larger than the NA of the optical element 612.

如使用光源602及光學元件612之系統610及620所繪示,源602之光源孔徑之大小會影響光束準直發散。例如,系統610包括較系統620之光源孔徑624相對更小的光源孔徑614,此導致系統610中之準直光束系列(發散)的角度範圍(以角度α繪示)較系統620中之角度範圍(由β1繪示)相對更小,例如,β1> α。系統610中較小大小之光源孔徑614導致較具有較大大小光源孔徑624之系統620中發現之更小的準直光束發散。因此,系統610具有較系統620更好之光束準直,但是為等效大小之光學元件612提供較少之光。As shown in systems 610 and 620 using light source 602 and optical element 612, the size of the source aperture of source 602 affects the collimated beam divergence. For example, system 610 includes a relatively smaller source aperture 614 than a source aperture 624 of system 620, which results in the angular range (shown by angle α) of the collimated beam series (divergence) in system 610 being relatively smaller than the angular range (shown by β1) in system 620, e.g., β1>α. The smaller size of source aperture 614 in system 610 results in a smaller collimated beam divergence than that found in system 620 having a larger size source aperture 624. Thus, system 610 has better beam collimation than system 620, but provides less light for an optical element 612 of equivalent size.

額外地,如使用相同光源602及光源孔徑614之系統610及630所繪示,光學元件之NA(焦距)會影響光束準直發散。例如,系統610包括具有較系統630之光學元件632之焦距fl2(較高之NA)相對更長之焦距fl1(較小之NA)的光學元件612,此導致系統610中之準直光束系列(發散)的角度範圍(以角度α繪示)較系統630中之角度範圍(由β2繪示)相對更小,例如,β2> α。系統610中之光學元件612之較長焦距fl1(較小之NA)導致較具有較短焦距fl2(較大之NA)之系統630中發現之更小之準直光束發散。因此,系統610具有比系統630更好之光束準直,但是為等效大小之光源602及光源孔徑614提供較少之光。Additionally, as shown for systems 610 and 630 using the same light source 602 and light source aperture 614, the NA (focal length) of the optical element affects the beam collimation divergence. For example, system 610 includes optical element 612 having a relatively longer focal length fl1 (smaller NA) than focal length fl2 (higher NA) of optical element 632 of system 630, which results in the angular range (shown by angle α) of the collimated beam series (divergence) in system 610 being relatively smaller than the angular range (shown by β2) in system 630, e.g., β2>α. The longer focal length fl1 (smaller NA) of optical element 612 in system 610 results in a smaller collimated beam divergence than that found in system 630 having a shorter focal length fl2 (larger NA). Thus, system 610 has better beam collimation than system 630, but provides less light for an equivalent sized light source 602 and light source aperture 614.

因此,分離照明光學元件設計及成像光學元件設計允許控制至結構例如通孔之光傳播,而不影響成像光學元件。藉由將照明光學元件之NA減小至例如標稱準直之光,可向被測結構之底部提供更多的光,同時對成像光學元件使用高NA允許更好地對物體上之小橫向特徵進行成像。Therefore, separating the illumination optics design and the imaging optics design allows control of light propagation to structures such as vias without affecting the imaging optics. By reducing the NA of the illumination optics to, for example, nominally collimated light, more light can be provided to the bottom of the structure being measured, while using a high NA for the imaging optics allows better imaging of small lateral features on the object.

圖7A及圖7B分別舉例繪示干涉儀700及700'的示意圖,其藉由通過物體深度掃描相干條紋,同時將收集光學元件之焦點位置維持於單一高度,且如本文所討論,使用具有不同有效NA之照明光學元件及收集光學元件來特徵化樣本上之結構,使得照明光較經收集之樣本光更準直。干涉儀700'類似於干涉儀700,其中相似指定元件係相同的,且有時在本文中統稱為干涉儀700。7A and 7B illustrate schematic diagrams of interferometers 700 and 700', respectively, which characterize structures on a sample by scanning coherent fringes through the depth of an object while maintaining the focal position of the collection optical element at a single height, and using illumination optical elements and collection optical elements with different effective NAs as discussed herein to make the illumination light more collimated than the collected sample light. Interferometer 700' is similar to interferometer 700, where similarly designated elements are the same and are sometimes collectively referred to herein as interferometer 700.

圖7A所繪示之干涉儀700經組態以改變光學路徑差以在參考光與樣本光之間通過物體深度掃描相干條紋,同時維持收集光學元件之焦點位置,且圖7B所繪示之干涉儀700'經組態以調變光之光譜的週期性以通過物體深度掃描相干條紋,同時維持收集光學元件之焦點位置。在一些實施方案中,干涉儀700'之一或多個態樣可與干涉儀700組合。干涉儀700可使用低NA照明光學元件作為照明光學元件,並使用高NA收集光學元件以產生比經收集之樣本光更準直的照明光。在一些實施方案中,干涉儀700可係LCI干涉儀、相干掃描干涉儀等。The interferometer 700 illustrated in FIG7A is configured to vary the optical path difference between the reference light and the sample light to scan a coherence fringe through the depth of the object while maintaining the focal position of the collection optics, and the interferometer 700′ illustrated in FIG7B is configured to modulate the periodicity of the spectrum of the light to scan a coherence fringe through the depth of the object while maintaining the focal position of the collection optics. In some embodiments, one or more aspects of the interferometer 700′ can be combined with the interferometer 700. The interferometer 700 can use a low NA illumination optic as the illumination optic and a high NA collection optic to produce illumination light that is more collimated than the collected sample light. In some implementations, the interferometer 700 may be an LCI interferometer, a coherent scanning interferometer, or the like.

如圖7A及圖7B所示,干涉儀700及干涉儀700'分別包括光學頭710及710'(有時統稱為光學頭710),其包括光源712及偵測器720,以及干涉物鏡713,該干涉物鏡包括分光器714、參考鏡716、及物鏡718。在一些實施方案中,干涉儀700可係LCI干涉儀,且光源712可具有足以產生低相干條紋之光譜頻寬及角頻寬。額外地,光源712可係可基於被測量樣本上之結構的類型來組態。例如,光源712可基於被測量結構之組態來調整光譜頻寬及角頻寬中之至少一者、柱面光學元件及空間線性源中之至少一者、及偏振控制、或其任何組合。例如,可基於通孔之形狀、寬度、及深度選擇光學元件之光譜及/或角頻寬及類型。例如,相較於較長波長,較短波長可用以更好地在窄通孔中傳播,而使用寬光譜頻寬可用以更好地判定相干包絡,例如,隨著光譜頻寬增加,相干包絡更窄。例如,如圖6所繪示,角頻寬可用以控制準直之光束之發散。此外,柱面光學元件及/或線性光源之使用可用以控制x及y方向上之準直發散,此可有利於控制溝槽測量。進一步言之,可回應於通孔之形狀、寬度、及深度來控制光之偏振。例如,圓偏振可用於各種通孔,包括具有各種定向之孔洞及溝槽。在具體實例中,諸如溝槽具有一個具體定向,可使用與溝槽具有相同定向之線性偏振來改善溝槽中之傳播。額外地,可例如藉由選擇不同反射率之鏡或藉由改變干涉儀之不同臂之分光比率來控制樣本相對於參考鏡之相對反射率。在一些實施方案中,光學頭710中可包括額外組件,諸如分光器、偏振器、透鏡等。額外地,如本文討論,光源712在光學頭710中之相對位置可改變。例如,如所繪示,來自光源712之照明光被提供給物鏡718下方之分光器714,但是在一些實施方案中,來自光源712之照明光可例如經由第二分光器被提供在物鏡718上方(如以虛線由物鏡718繪示)。分光器714分裂照明光並產生被引導至參考鏡716並從該參考鏡反射的參考光715及被引導至樣本702之樣本光717。As shown in FIG. 7A and FIG. 7B , interferometer 700 and interferometer 700′ respectively include optical heads 710 and 710′ (sometimes collectively referred to as optical heads 710), which include a light source 712 and a detector 720, and an interferometer objective 713, which includes a beam splitter 714, a reference lens 716, and an objective lens 718. In some embodiments, interferometer 700 can be an LCI interferometer, and light source 712 can have a spectral bandwidth and an angular bandwidth sufficient to generate low coherence fringes. In addition, light source 712 can be configurable based on the type of structure on the sample being measured. For example, the light source 712 can adjust at least one of the spectral bandwidth and the angular bandwidth, at least one of the cylindrical optical element and the spatial linear source, and polarization control, or any combination thereof based on the configuration of the measured structure. For example, the spectral and/or angular bandwidth and type of the optical element can be selected based on the shape, width, and depth of the through hole. For example, shorter wavelengths can be used to better propagate in narrow through holes than longer wavelengths, and using a wide spectral bandwidth can be used to better determine the coherence envelope, for example, as the spectral bandwidth increases, the coherence envelope is narrower. For example, as shown in Figure 6, the angular bandwidth can be used to control the divergence of a collimated beam. In addition, the use of cylindrical optical elements and/or linear light sources can be used to control the collimated divergence in the x and y directions, which can be beneficial for controlling trench measurements. Further, the polarization of light can be controlled in response to the shape, width, and depth of the through-hole. For example, circular polarization can be used for various through-holes, including holes and trenches with various orientations. In specific examples, if the trench has a specific orientation, linear polarization with the same orientation as the trench can be used to improve propagation in the trench. Additionally, the relative reflectivity of the sample relative to the reference mirror can be controlled, for example, by selecting mirrors of different reflectivities or by changing the splitting ratio of different arms of the interferometer. In some embodiments, the optical head 710 may include additional components, such as a beam splitter, a polarizer, a lens, etc. Additionally, as discussed herein, the relative position of the light source 712 in the optical head 710 can be varied. For example, as depicted, illumination light from the light source 712 is provided to the beam splitter 714 below the objective lens 718, but in some implementations, illumination light from the light source 712 can be provided above the objective lens 718 (as depicted by the objective lens 718 in dashed lines), for example, via a second beam splitter. The beam splitter 714 splits the illumination light and produces a reference light 715 that is directed to and reflected from a reference lens 716 and a sample light 717 that is directed to the sample 702.

在一些實施方案中,光學頭710可包括額外組件諸如孔徑719,以有效地減小照明光之NA。雖然圖7A及圖7B中繪示之干涉物鏡713具有邁克生組態,但是應理解,其他類型之干涉物鏡組態可用於光學頭710中,包括米勞物鏡組態及林尼克(Linnik)物鏡組態。In some embodiments, the optical head 710 may include additional components such as an aperture 719 to effectively reduce the NA of the illumination light. Although the interference lens 713 shown in Figures 7A and 7B has a Michaelson configuration, it should be understood that other types of interference lens configurations can be used in the optical head 710, including a Milhausen lens configuration and a Linnik lens configuration.

來自光源712之照明光被分光器714接收,該分光器分裂照明光並產生被引導至參考鏡716並從該參考鏡反射的參考光715及入射於樣本702上並從該樣本反射的樣本光717。來自參考鏡716及樣本702之經反射光重新組合並干涉,產生由偵測器720接收之干涉光722,從該干涉光可測量樣本702上之結構704的一或多個特性,諸如深度、寬度、或其他輪廓參數。樣本光717由光學頭710中之物鏡718聚焦於例如樣本702之頂部表面處或附近。Illumination light from light source 712 is received by beamsplitter 714, which splits the illumination light and produces reference light 715 that is directed to and reflected from reference mirror 716 and sample light 717 that is incident on and reflected from sample 702. The reflected light from reference mirror 716 and sample 702 is recombined and interferes to produce interference light 722 that is received by detector 720, from which one or more characteristics of structure 704 on sample 702 can be measured, such as depth, width, or other profile parameters. Sample light 717 is focused by objective lens 718 in optical head 710, for example, at or near the top surface of sample 702.

干涉儀700維持物鏡718相對於樣本702之焦點位置,亦即,焦點位置係固定的,同時在樣本702之測量期間通過物體深度掃描相干條紋。例如,如圖7A所繪示,參考光715與樣本光717之間之光學路徑差經改變以通過物體深度掃描相干條紋。參考光715與樣本光717之間之光學路徑差可藉由增加及/或減少參考光715之光學路徑長度來改變(如箭頭721所繪示)。例如,可藉由移動參考鏡716或藉由移動分光器714(例如,若干涉物鏡713具有米勞型物鏡組態)來增加或減少參考光715之光學路徑長度。The interferometer 700 maintains the focal position of the objective lens 718 relative to the sample 702, i.e., the focal position is fixed, while scanning the coherence fringe through the depth of the object during measurement of the sample 702. For example, as shown in FIG. 7A , the optical path difference between the reference light 715 and the sample light 717 is changed to scan the coherence fringe through the depth of the object. The optical path difference between the reference light 715 and the sample light 717 can be changed by increasing and/or decreasing the optical path length of the reference light 715 (as shown by arrow 721). For example, the optical path length of reference light 715 may be increased or decreased by moving reference mirror 716 or by moving beam splitter 714 (e.g., if interferometer objective 713 has a Michelaud-type objective configuration).

如圖7B所繪示,可例如使用調變光學元件772或782調變光之光譜的週期性以通過物體深度掃描相干條紋,此可類似於圖5A中所示之調變干涉儀500或圖5B中所示之光譜調變器520。例如,調變光學元件772可調變由提供給分光器714之光源712產生之光之光譜的週期性。在另一實例中,調變光學元件782可例如經由鏡784及786接收來自分光器714之光,且可調變例如經由鏡788提供給偵測器720之光之光譜的週期性。在一些實施方案中,可使用圖7A及圖7B所繪示之技術之組合,包括移動參考鏡716、移動分光器714、及調變光之光譜的週期性的任何組合。As shown in FIG7B , the periodicity of the spectrum of light can be modulated to scan coherent fringes through the depth of an object, for example using a modulation optical element 772 or 782, which can be similar to the modulation interferometer 500 shown in FIG5A or the spectrum modulator 520 shown in FIG5B . For example, the modulation optical element 772 can modulate the periodicity of the spectrum of light generated by the light source 712 provided to the beam splitter 714. In another example, the modulation optical element 782 can receive light from the beam splitter 714, for example via mirrors 784 and 786, and can modulate the periodicity of the spectrum of light provided to the detector 720, for example via mirror 788. In some implementations, a combination of the techniques depicted in Figures 7A and 7B may be used, including any combination of moving the reference mirror 716, moving the beam splitter 714, and modulating the periodicity of the spectrum of light.

額外地,干涉儀700可使用對於入射於樣本702上之照明光(例如,由陰影樣本光724繪示)具有有效NA之照明光學元件,該有效NA低於收集光學元件對於來自樣本702之經收集光有效之NA(例如由經收集光726所繪示)。用於照明光之照明光學元件例如,可具有小於0.05之相對低的有效NA,且可產生準直或接近準直之光,而用於經收集光之收集光學元件可具有至少0.2之相對高的有效NA。舉實例而言,在一些實施方案中,低NA照明光學元件可係一或多個透鏡(未顯示),其在光學路徑中之收集光學元件之後(亦即,在物鏡718與樣本702之間)向干涉物鏡713提供照明光。分光器714引導照明光之一部分以照射樣本702並將照明光之另一部分引導至參考鏡716。在另一實施方案中,照明光學元件之有效NA可藉由限制光源712之空間範圍(例如,利用孔徑719(例如,如圖6所討論))而減小,且因此例如低NA照明光學元件可包括物鏡718及孔徑719以減小光源712之空間範圍。有減小照明光學元件之NA之不同方法,諸如透過使用科勒照明、臨界照明以及可使用其他無焦或非聚焦或臨界照明來控制照明光學元件之NA。Additionally, the interferometer 700 can use an illumination optics element having an effective NA for illumination light incident on the sample 702 (e.g., as illustrated by the shadow sample light 724) that is lower than the NA effective for the collected light from the sample 702 (e.g., as illustrated by the collected light 726). The illumination optics element for the illumination light can, for example, have a relatively low effective NA of less than 0.05 and can produce collimated or nearly collimated light, while the collection optics element for the collected light can have a relatively high effective NA of at least 0.2. For example, in some embodiments, the low NA illumination optics element can be one or more lenses (not shown) that provide illumination light to the interferometer objective 713 after the collection optics element in the optical path (i.e., between the objective 718 and the sample 702). Beam splitter 714 directs a portion of the illumination light to illuminate sample 702 and another portion of the illumination light to reference lens 716. In another embodiment, the effective NA of the illumination optics may be reduced by limiting the spatial extent of light source 712, e.g., using aperture 719 (e.g., as discussed in FIG. 6 ), and thus, for example, the low NA illumination optics may include objective lens 718 and aperture 719 to reduce the spatial extent of light source 712. There are different methods of reducing the NA of illumination optics, such as by using Kohler illumination, critical illumination, and other afocal or non-focused or critical illumination may be used to control the NA of the illumination optics.

干涉儀700進一步經組態以對包括複數個結構704之樣本702之區域成像,使得可同時特徵化多個結構704。例如,偵測器720可包括成像管透鏡,該成像管透鏡對由偵測器720接收之樣本之區域成像,且當光學路徑差變化時可收集該區域之多個影像。Interferometer 700 is further configured to image a region of sample 702 including a plurality of structures 704 so that multiple structures 704 can be simultaneously characterized. For example, detector 720 can include an imaging tube lens that images a region of the sample received by detector 720 and can collect multiple images of the region as the optical path difference varies.

光學頭710中之偵測器720以及干涉儀700之其他組件,諸如光源712、台座730、夾盤732、移動參考鏡716及/或分光器714之致動器、調變光學元件772或782中之參考鏡等可耦接至處理系統750,諸如工作台、個人電腦、中央處理單元、或其他適當之電腦系統、或多個系統。應理解,可使用一個處理器、多個分離處理器、或多個經聯結處理器,其等之全部在本文中可互換地稱為處理系統750。處理系統750可包括在干涉儀700中、或連接至干涉儀、或以其他方法與干涉儀相關聯。例如,處理系統750可例如藉由控制在其上固持樣本702之台座730的移動來控制樣本702之定位。例如,台座730可能夠在笛卡爾(亦即,X及Y)座標或極(亦即,R及θ)座標的任一者或二者的某一組合中水平運動。台座730亦可能夠沿著Z座標垂直運動,例如用於將物鏡718聚焦於樣本702之表面上或附近。在一些實施方案中,台座730可固持為靜止,而光學頭710或光學頭710之部分相對於樣本702移動,或者台座730及光學頭710(或其部分)二者可相對於另一者移動。處理系統750可進一步控制用以固持或釋放樣本702之台座730上的夾盤732之操作。The detector 720 in the optical head 710 and other components of the interferometer 700, such as the light source 712, the stage 730, the chuck 732, the actuators for moving the reference mirror 716 and/or the beam splitter 714, the reference mirrors in the modulation optical elements 772 or 782, etc., can be coupled to a processing system 750, such as a workbench, a personal computer, a central processing unit, or other suitable computer system, or multiple systems. It should be understood that one processor, multiple separate processors, or multiple connected processors can be used, all of which are interchangeably referred to herein as the processing system 750. The processing system 750 can be included in the interferometer 700, connected to the interferometer, or otherwise associated with the interferometer. For example, the processing system 750 can control the positioning of the sample 702, such as by controlling the movement of the stage 730 on which the sample 702 is held. For example, the stage 730 may be capable of horizontal movement in either Cartesian (i.e., X and Y) coordinates or polar (i.e., R and θ) coordinates, or some combination of both. The stage 730 may also be capable of vertical movement along the Z coordinate, such as for focusing the objective 718 on or near the surface of the sample 702. In some embodiments, the stage 730 may be held stationary while the optical head 710 or a portion of the optical head 710 moves relative to the sample 702, or both the stage 730 and the optical head 710 (or a portion thereof) may move relative to the other. The processing system 750 can further control the operation of the chuck 732 on the stage 730 for holding or releasing the sample 702.

處理系統750亦可收集及分析獲取自光學頭710的資料。如本文所討論,處理系統750可分析干涉儀資料以判定樣本702上之結構704之特性,諸如深度、寬度、或其他輪廓參數。處理系統750包括具有記憶體754的至少一個處理器752以及包括例如顯示器756及輸入裝置758的使用者介面。體現電腦可讀取程式碼之非暫時性電腦可用儲存媒體759可由處理系統750使用,用於使該處理系統750控制光干涉儀700,及執行包括本文所述之分析之功能。用於自動實施本實施方式中所描述之一或多個動作的資料結構、軟體碼等可由所屬技術領域中具有通常知識者按照本揭露予以實作,且儲存在例如非暫時性電腦可用儲存媒體759上,該電腦可用儲存媒體可係可儲存碼及/或資料以供電腦系統(諸如至少一處理器752)使用的任何裝置或媒體。非暫時性電腦可用儲存媒體759可係但不限於快閃驅動器、磁性及光學儲存裝置,諸如磁碟、磁帶、光碟、及DVD(數位多功能光碟或數位視訊光碟)。通訊埠757亦可用以接收用以程式化處理系統750之指令,以執行本文所述之功能之任何一或多者,且可表示諸如至網際網路或任何其他電腦網路之任何類型的通訊連接。通訊埠757可進一步在前饋或反饋程序中匯出信號(例如具有測量或偵測結果及/或指令)至另一系統(諸如外部處理工具),以基於所述測量結果來調整與樣本之製造程序步驟相關聯的一程序參數。額外地,本文所述之功能可整體或部分地體現於特定應用積體電路(application specific integrated circuit, ASIC)或可程式化邏輯裝置(programmable logic device, PLD)之電路系統內,且所述功能可以電腦可理解之描述符語言予以體現,該電腦可理解之描述符語言可用來建立如本文所述般操作的ASIC或PLD。來自資料分析之結果可例如儲存在與樣本相關聯及/或提供給使用者(例如,經由顯示器756、警報器、或其他輸出裝置)的記憶體754中。此外,可將來自該分析之結果回饋至製程設備,以調整適當的圖案化步驟來補償在測量或檢測中之任何偵測到的錯誤。The processing system 750 can also collect and analyze data acquired from the optical head 710. As discussed herein, the processing system 750 can analyze the interferometer data to determine characteristics of the structures 704 on the sample 702, such as depth, width, or other profile parameters. The processing system 750 includes at least one processor 752 having a memory 754 and a user interface including, for example, a display 756 and an input device 758. A non-transitory computer usable storage medium 759 embodying computer readable program code can be used by the processing system 750 to enable the processing system 750 to control the optical interferometer 700 and perform functions including the analysis described herein. Data structures, software codes, etc. used to automatically implement one or more actions described in the present embodiment can be implemented by a person of ordinary skill in the art in accordance with the present disclosure and stored, for example, on a non-transitory computer-usable storage medium 759, which can be any device or medium that can store code and/or data for use by a computer system (such as at least one processor 752). The non-transitory computer-usable storage medium 759 can be, but is not limited to, a flash drive, magnetic and optical storage devices, such as a disk, a tape, an optical disk, and a DVD (digital versatile disk or digital video disk). Communication port 757 may also be used to receive instructions for programming processing system 750 to perform any one or more of the functions described herein, and may represent any type of communication connection, such as to the Internet or any other computer network. Communication port 757 may further export signals (e.g., having measurement or detection results and/or instructions) to another system (e.g., an external processing tool) in a feedforward or feedback process to adjust a process parameter associated with a sample manufacturing process step based on the measurement results. Additionally, the functionality described herein may be embodied in whole or in part in the circuitry of an application specific integrated circuit (ASIC) or a programmable logic device (PLD), and the functionality may be embodied in a computer-understandable descriptor language that may be used to create an ASIC or PLD that operates as described herein. Results from the data analysis may be stored, for example, in a memory 754 associated with the sample and/or provided to a user (e.g., via a display 756, an alarm, or other output device). Furthermore, results from the analysis may be fed back to the process equipment to adjust the appropriate patterning steps to compensate for any detected errors in the measurement or detection.

圖8顯示干涉儀800的示意圖,其可係低相干干涉儀,並可係圖7A所示之干涉儀700的實施方案。干涉儀800包括干涉物鏡,該干涉物鏡改變參考光學路徑長度以改變參考光與樣本光之間之光學路徑差,從而通過物體深度掃描相干條紋。額外地,干涉儀800提供標稱準直之照明光,以為入射於樣本上之照明光提供低NA,並為來自樣本802之經收集光提供高NA。若需要,除了改變參考光與樣本光之間之光學路徑差以通過物體深度掃描相干條紋之外,或替代地改變參考光與樣本光之間之光學路徑差以通過物體深度掃描相干條紋,干涉儀800可包括如圖7B及圖5A及圖5B所繪示之調變光學元件。FIG8 shows a schematic diagram of an interferometer 800, which may be a low coherence interferometer and may be an implementation of the interferometer 700 shown in FIG7A. The interferometer 800 includes an interferometer objective lens that changes the reference optical path length to change the optical path difference between the reference light and the sample light, thereby scanning the coherence fringes through the depth of the object. Additionally, the interferometer 800 provides nominally collimated illumination light to provide a low NA for the illumination light incident on the sample and a high NA for the collected light from the sample 802. If desired, in addition to or instead of changing the optical path difference between the reference light and the sample light to scan the coherence fringes through the depth of the object, the interferometer 800 may include a modulating optical element as shown in Figures 7B and 5A and 5B.

如所繪示,干涉儀800包括光源810及一或多個透鏡811以產生由干涉物鏡820接收之準直或接近準直之光。干涉物鏡820在圖8中繪示為邁克生物鏡,其包括物鏡822、分光器812、及參考鏡826,但是亦可使用其他類型之物鏡。準直之光被物鏡822下方(亦即物鏡822與樣本802之間)之干涉物鏡820接收。分光器812將準直之光分裂成入射於參考鏡826上並從該參考鏡反射的參考光823及入射於樣本802上並從該樣本反射的樣本光825。參考鏡826耦接至致動器828,該致動器由至少一個處理器850控制以調整參考鏡826之位置。在操作中,干涉儀800如箭頭827所指示移動參考鏡826,以改變參考光823與樣本光825之間之光學路徑差。在一些實施方案中,包括例如參考鏡826、分光器812、及具有一或多個透鏡811之光源810的總成830可耦接至致動器831,並如箭頭832所指示移動以改變參考光823與樣本光825之間的光學路徑差。物鏡822用作收集光學元件並聚焦於樣本802之頂部表面上或附近,如經收集光829所繪示。收集光學元件(亦即物鏡822)之焦點位置不改變,亦即焦點位置相對於樣本802係固定的,而光學路徑差則藉由移動參考鏡826而改變。利用在物鏡822下方提供之準直或接近準直之照明光,干涉儀800可對(例如,標稱準直之)樣本光825使用低NA照明光學元件(例如,(多個)透鏡811),同時對經收集光829使用高NA收集光學元件(例如,物鏡822)。As shown, the interferometer 800 includes a light source 810 and one or more lenses 811 to produce collimated or nearly collimated light received by an interference objective 820. The interference objective 820 is shown in FIG. 8 as a Michaelisoscope, which includes an objective lens 822, a beam splitter 812, and a reference lens 826, but other types of objectives may also be used. The collimated light is received by the interference objective 820 below the objective lens 822 (i.e., between the objective lens 822 and the sample 802). The beam splitter 812 splits the collimated light into a reference light 823 incident on and reflected from the reference lens 826 and a sample light 825 incident on and reflected from the sample 802. Reference mirror 826 is coupled to an actuator 828, which is controlled by at least one processor 850 to adjust the position of reference mirror 826. In operation, interferometer 800 moves reference mirror 826 as indicated by arrow 827 to change the optical path difference between reference light 823 and sample light 825. In some embodiments, an assembly 830 including, for example, reference mirror 826, beam splitter 812, and light source 810 having one or more lenses 811 can be coupled to actuator 831 and moved as indicated by arrow 832 to change the optical path difference between reference light 823 and sample light 825. Objective lens 822 serves as a collection optical element and focuses on or near the top surface of sample 802, as shown by collected light 829. The focal position of the collection optics (i.e., objective 822) does not change, i.e., the focal position is fixed relative to the sample 802, while the optical path difference is changed by moving the reference mirror 826. With collimated or nearly collimated illumination light provided below the objective 822, the interferometer 800 can use low NA illumination optics (e.g., lens(es) 811) for the (e.g., nominally collimated) sample light 825 while using high NA collection optics (e.g., objective 822) for the collected light 829.

從樣本802反射的參考光823及樣本光825在分光器812處重新組合。所得干涉光由分光器812、物鏡822、及透鏡842(例如成像管透鏡)引導至偵測器840,該偵測器耦接至至少一個處理器850,該處理器可係處理系統750之部分。所產生之干涉圖案由偵測器840在不同之光學路徑差處接收並且由至少一個處理器850使用以判定樣本802之特性,諸如樣本802之表面輪廓。Reference light 823 and sample light 825 reflected from sample 802 are recombined at beam splitter 812. The resulting interference light is directed by beam splitter 812, objective lens 822, and lens 842 (e.g., an imaging tube lens) to detector 840, which is coupled to at least one processor 850, which may be part of processing system 750. The resulting interference pattern is received by detector 840 at different optical path differences and used by at least one processor 850 to determine characteristics of sample 802, such as the surface profile of sample 802.

干涉儀800使用具有掃描參考鏡826之寬頻光源810來實現由通過物體之深度掃描之相干包絡之定位判定的深度解析度。相干包絡係在其上相干波(例如電磁波)維持指定相干度的傳播距離。當參考光823及樣本光825之間之光學路徑差相差小於相干長度時,波干涉較強。如圖5A及圖5B以及圖7B所討論,在一些實施方案中,除了掃描參考鏡826之外或代替該掃描參考鏡,例如由寬頻光源810提供之光或由分光器812提供之干涉光之光譜的週期性可經調變以通過物體之深度掃描的相干包絡。至少一個處理器850接收來自各單一掃描點之反射光學資料,該資料被解譯為沿著掃描之干涉圖案,並將其記錄為深度輪廓。若在光束中引入偏振態,則干涉儀800可例如藉由在偵測器陣列(例如CCD陣列或偏振像素化攝影機)上成像來同時收集大視場上之資料,包括待測量之數個結構之樣本802之區域。影像中之各像素對應於樣本802之區域中之位置,並且各影像可對應於不同之光學路徑差,其對應於深度。Interferometer 800 uses a broadband light source 810 with a scanning reference mirror 826 to achieve depth resolution determined by the location of the coherence envelope of a depth scan through the object. The coherence envelope is the propagation distance over which a coherent wave (e.g., an electromagnetic wave) maintains a specified degree of coherence. When the optical path difference between reference light 823 and sample light 825 differs by less than the coherence length, the waves interfere strongly. As discussed in Figures 5A and 5B and Figure 7B, in some embodiments, in addition to or in lieu of a scanning reference mirror 826, the periodicity of the spectrum of, for example, the light provided by the broadband light source 810 or the interfering light provided by the beam splitter 812 can be modulated to pass the coherent envelope of the depth scan of the object. At least one processor 850 receives the reflected optical data from each single scan point, which is interpreted as an interference pattern along the scan and recorded as a depth profile. If polarization states are introduced in the light beam, the interferometer 800 can simultaneously collect data over a large field of view, including a region of the sample 802 of several structures to be measured, for example by imaging on a detector array (e.g., a CCD array or a polarization pixelated camera). Each pixel in the image corresponds to a position in the region of the sample 802, and each image can correspond to a different optical path difference, which corresponds to depth.

圖9繪示干涉物鏡之實施方案,其可用作圖8所示之干涉儀800中之干涉物鏡820。圖9繪示干涉物鏡900(可係邁克生型干涉物鏡),其包括物鏡902、分光器904、及參考鏡906,該參考鏡如箭頭所示移動以改變光學路徑差。準直或接近準直之照明光由光源(未顯示)經由一或多個透鏡908提供,並由物鏡902下方(亦即物鏡902與樣本901之間)的干涉物鏡900接收。分光器904將照明光分裂成入射於參考鏡906上並從該參考鏡反射的參考光905及入射於樣本901上並從該樣本反射的樣本光907。如經收集光909所繪示,收集光學元件例如物鏡902聚焦於樣本901之頂部表面上或附近,並維持焦點位置,同時藉由移動參考鏡906改變光學路徑差。在一些實施方案中,參考鏡906、分光器904、及照明光之源可耦接至致動器,並如虛線箭頭所指示垂直移動以改變參考光905與樣本光907之間之光學路徑差。如所繪示,因為樣本光907具有低NA照明光學元件(透鏡908)(例如標稱準直),所以比經由物鏡902提供之光更多之光被提供至樣本901之結構之底部。FIG9 shows an embodiment of an interferometer objective that can be used as the interferometer objective 820 in the interferometer 800 shown in FIG8. FIG9 shows an interferometer objective 900 (which can be a Michaelson-type interferometer objective) that includes an objective lens 902, a beam splitter 904, and a reference lens 906 that moves as indicated by the arrows to change the optical path difference. Collimated or nearly collimated illumination light is provided by a light source (not shown) through one or more lenses 908 and received by the interferometer objective 900 below the objective lens 902 (i.e., between the objective lens 902 and the sample 901). Beam splitter 904 splits the illumination light into reference light 905 incident on and reflected from reference mirror 906 and sample light 907 incident on and reflected from sample 901. As shown by collection light 909, a collection optical element such as objective lens 902 focuses on or near the top surface of sample 901 and maintains the focal position while changing the optical path difference by moving reference mirror 906. In some embodiments, reference mirror 906, beam splitter 904, and the source of illumination light can be coupled to an actuator and moved vertically as indicated by the dashed arrow to change the optical path difference between reference light 905 and sample light 907. As depicted, because sample light 907 has low NA illumination optics (lens 908 ) (eg, nominally collimated), more light is provided to the bottom of the structure of sample 901 than light provided via objective 902 .

圖10顯示干涉儀1000的示意圖,其可係低相干干涉儀,且可係圖7A所顯示之干涉儀700的實施方案。干涉儀1000包括干涉物鏡,該干涉物鏡改變參考光學路徑長度以改變參考光與樣本光之間之光學路徑差,從而通過物體深度掃描相干條紋。額外地,干涉儀1000使用低NA照明光學元件以提供入射於樣本上之照明光,並使用高NA成像光學元件來提供來自樣本1002之經收集光。若需要,除了改變參考光與樣本光之間之光學路徑差以通過物體深度掃描相干條紋之外,或替代地改變參考光與樣本光之間之光學路徑差以通過物體深度掃描相干條紋,干涉儀1000可包括如圖7B及圖5A及圖5B所繪示之調變光學元件。FIG10 shows a schematic diagram of an interferometer 1000, which may be a low coherence interferometer and may be an implementation of the interferometer 700 shown in FIG7A. The interferometer 1000 includes an interferometer objective lens that changes the reference optical path length to change the optical path difference between the reference light and the sample light, thereby scanning the coherence fringes through the depth of the object. Additionally, the interferometer 1000 uses low NA illumination optics to provide illumination light incident on the sample and uses high NA imaging optics to provide collected light from the sample 1002. If desired, in addition to or instead of changing the optical path difference between the reference light and the sample light to scan the coherence fringes through the depth of the object, the interferometer 1000 may include a modulation optical element as shown in Figures 7B and 5A and 5B.

如所繪示,干涉儀1000包括光源1010(可係寬頻光源)以及一或多個透鏡1011及孔徑1012以減小光源1010之孔徑大小。干涉儀1000例如可使用科勒照明。照明光由分光器1014引導向干涉物鏡1020。干涉物鏡1020在圖10中繪示為米勞物鏡,其包括物鏡1022、分光器1024、及參考鏡1026,但是亦可使用其他類型之物鏡。如樣本光1025之錐體所繪示,照明光由物鏡1022接收並聚焦於樣本1002之頂部表面上或附近。因為光源1010之減小之孔徑大小,入射於樣本1002上之照明光由具有有效低NA之物鏡1022提供。然而,如經收集光1029所繪示,物鏡1022以較高NA收集來自樣本1002之經反射光(例如影像)。因此,如所繪示,干涉儀1000對樣本光1025使用低NA光學元件,但是對經收集光1029使用高NA光學元件。As shown, the interferometer 1000 includes a light source 1010 (which may be a broadband light source) and one or more lenses 1011 and apertures 1012 to reduce the aperture size of the light source 1010. The interferometer 1000 may use Kohler illumination, for example. The illumination light is directed by a beam splitter 1014 to an interferometer objective 1020. The interferometer objective 1020 is shown in FIG. 10 as a Milhausen objective, which includes an objective lens 1022, a beam splitter 1024, and a reference lens 1026, but other types of objectives may also be used. As shown by the cone of sample light 1025, the illumination light is received by the objective lens 1022 and focused on or near the top surface of the sample 1002. Because of the reduced aperture size of the light source 1010, the illumination light incident on the sample 1002 is provided by the objective 1022, which has an effective low NA. However, the objective 1022 collects reflected light (e.g., an image) from the sample 1002 at a higher NA, as shown by the collected light 1029. Thus, as shown, the interferometer 1000 uses low NA optics for the sample light 1025, but uses high NA optics for the collected light 1029.

分光器1024將照明光分裂成入射於參考鏡1026上並從該參考鏡反射的參考光1023及入射於樣本1002上並從該樣本反射的樣本光1025。可藉由移動參考鏡1026及/或分光器1024改變干涉物鏡1020中之參考光學路徑之長度。例如,參考鏡1026可耦接至致動器1028,該致動器由至少一個處理器1050控制以調整參考鏡1026之位置。額外地或替代地,分光器1024可耦接至由至少一個處理器1050控制之致動器1028以調整分光器1024之位置。在操作中,干涉儀1000維持(亦即相對於樣本1002固定)物鏡1022之焦點位置,同時藉由例如移動參考鏡1026及/或分光器1024改變光學路徑差。參考鏡1026(及/或分光器1024)可如箭頭所指示掃描,以改變參考光1023與樣本光1025之間之光學路徑差。The beam splitter 1024 splits the illumination light into a reference light 1023 incident on and reflected from a reference mirror 1026 and a sample light 1025 incident on and reflected from the sample 1002. The length of the reference optical path in the interference objective 1020 can be changed by moving the reference mirror 1026 and/or the beam splitter 1024. For example, the reference mirror 1026 can be coupled to an actuator 1028 controlled by at least one processor 1050 to adjust the position of the reference mirror 1026. Additionally or alternatively, the beam splitter 1024 can be coupled to an actuator 1028 controlled by at least one processor 1050 to adjust the position of the beam splitter 1024. In operation, the interferometer 1000 maintains (i.e., keeps fixed relative to the sample 1002) the focal position of the objective lens 1022 while varying the optical path difference by, for example, moving the reference lens 1026 and/or the beam splitter 1024. The reference lens 1026 (and/or the beam splitter 1024) may be scanned as indicated by the arrows to vary the optical path difference between the reference light 1023 and the sample light 1025.

從樣本1002反射的參考光1023及樣本光1025在分光器1024處重新組合。所得干涉光由物鏡1022、分光器1014、及透鏡1042引導至偵測器1040,該偵測器耦接至至少一個處理器1050。所得干涉圖案由偵測器1040在不同光學路徑差處接收並由至少一個處理1050使用以判定樣本1002之特性,諸如樣本1002之表面輪廓。例如,至少一個處理器1050可係圖7A及圖7B中所示之處理系統750之部分。Reference light 1023 and sample light 1025 reflected from sample 1002 are recombined at beam splitter 1024. The resulting interference light is directed by objective 1022, beam splitter 1014, and lens 1042 to detector 1040, which is coupled to at least one processor 1050. The resulting interference pattern is received by detector 1040 at different optical path differences and used by at least one processor 1050 to determine characteristics of sample 1002, such as a surface profile of sample 1002. For example, at least one processor 1050 can be part of processing system 750 shown in Figures 7A and 7B.

干涉儀1000使用具有參考鏡1026(可係掃描參考鏡)及/或分光器1024之光源1010來實現由通過物體之深度掃描相干包絡之定位判定的深度解析度。相干包絡係在其上相干波(例如電磁波)維持指定相干度的傳播距離。當參考光1023與樣本光1025之間之光學路徑差相差小於相干長度時,波干涉係強的。如圖5A及圖5B以及圖7B所討論,在一些實施方案中,除了掃描參考鏡1026之外或代替該掃描參考鏡,例如由寬頻光源1010提供之光或由分光器1024提供之干涉光之光譜的週期性可被改變以通過物體之深度掃描相干包絡。至少一個處理器1050接收來自各單一掃描點之經反射光學資料,該資料被解譯為干涉圖案,並將其記錄為深度輪廓。若在光束中引入正交偏振態,則干涉儀1000可例如藉由在偵測器陣列例如CCD陣列或偏振像素化攝影機上成像來同時收集大視場上之資料,包括待測量之數個結構之樣本1002之區域。影像中之各像素對應於樣本1002之區域中之位置,且各影像可對應於不同之光學路徑差,其對應於深度。Interferometer 1000 uses a light source 1010 with a reference mirror 1026 (which may be a scanning reference mirror) and/or a beam splitter 1024 to achieve depth resolution determined by the location of the coherence envelope of a depth scan through the object. The coherence envelope is the propagation distance over which a coherent wave (e.g., an electromagnetic wave) maintains a specified degree of coherence. When the optical path difference between reference light 1023 and sample light 1025 differs by less than the coherence length, the wave interference is strong. As discussed in Figures 5A and 5B and Figure 7B, in some embodiments, in addition to or in place of the scanning reference mirror 1026, the periodicity of the spectrum of the light provided by the broadband light source 1010 or the interfering light provided by the beam splitter 1024 can be varied to scan the coherent envelope through the depth of the object. At least one processor 1050 receives the reflected optical data from each single scan point, which is interpreted as an interference pattern and recorded as a depth profile. If orthogonal polarization states are introduced in the light beams, the interferometer 1000 can simultaneously collect data over a large field of view, including a region of the sample 1002 of several structures to be measured, for example by imaging on a detector array such as a CCD array or a polarization pixelated camera. Each pixel in the image corresponds to a position in the region of the sample 1002, and each image can correspond to a different optical path difference, which corresponds to depth.

圖11A至圖11C繪示干涉物鏡之各種實施方案,其可用作圖10所顯示之干涉儀1000中之干涉物鏡1020。11A to 11C illustrate various embodiments of interferometer objectives that may be used as the interferometer objective 1020 in the interferometer 1000 shown in FIG. 10 .

圖11A繪示干涉物鏡1100(可係米勞型干涉物鏡),其包括物鏡1102、分光器1104、及參考鏡1106,其中如箭頭所指示,參考鏡1106及/或分光器1104經移動以改變光學路徑差。照明光由具有減小之孔徑大小之光源(未顯示)提供,且如樣本光1107所繪示,由干涉物鏡1100接收並由物鏡1102聚焦。分光器1104將照明光分裂成入射於參考鏡1106上並從該參考鏡反射的參考光1105及入射於樣本1101上並從該樣本反射的樣本光1107。物鏡1102如經收集光1109所繪示聚焦於樣本1101之頂部表面上或附近,以利用相對高NA之光學元件對樣本1101進行成像,並維持焦點位置,同時藉由移動參考鏡1106、分光器1104、或參考鏡1106及分光器1104二者而改變光學路徑差。11A shows an interference objective 1100 (which may be a Michelaud-type interference objective) including an objective lens 1102, a beam splitter 1104, and a reference lens 1106, wherein the reference lens 1106 and/or the beam splitter 1104 are moved to change the optical path difference as indicated by the arrows. Illumination light is provided by a light source (not shown) having a reduced aperture size and is received by the interference objective 1100 and focused by the objective lens 1102 as shown by sample light 1107. The beam splitter 1104 splits the illumination light into reference light 1105 incident on and reflected from the reference lens 1106 and sample light 1107 incident on and reflected from the sample 1101. The objective lens 1102 is focused on or near the top surface of the sample 1101 as shown by the collected light 1109 to image the sample 1101 using relatively high NA optical elements and maintain the focal position while changing the optical path difference by moving the reference lens 1106, the beam splitter 1104, or both the reference lens 1106 and the beam splitter 1104.

圖11B繪示干涉物鏡1120(可係邁克生型干涉物鏡),其包括物鏡1122、分光器1124、及參考鏡1126,該參考鏡如相關聯箭頭所指示移動以改變光學路徑差。類似於圖11A所討論之干涉物鏡1100,照明光由具有減小之孔徑大小之光源(未顯示)提供,且如樣本光1127所示,由干涉物鏡1120接收並由物鏡1122聚焦。分光器1124將照明光分裂成入射於參考鏡1126上並從該參考鏡反射的參考光1125及入射於樣本1121上並從該樣本反射的樣本光1127。物鏡1122如經收集光1129所繪示聚焦於樣本1121之頂部表面上或附近,以利用相對高NA之光學元件對樣本1121進行成像,並維持焦點位置,同時藉由移動參考鏡1126,或者如虛線箭頭所繪示一起垂直地移動分光器1124及參考鏡1126而改變光學路徑差。FIG11B shows an interference objective 1120 (which may be a Michaelson-type interference objective) including an objective lens 1122, a beam splitter 1124, and a reference lens 1126 that moves as indicated by the associated arrows to change the optical path difference. Similar to the interference objective 1100 discussed in connection with FIG11A, illumination light is provided by a light source (not shown) having a reduced aperture size and is received by the interference objective 1120 and focused by the objective lens 1122 as indicated by sample light 1127. The beam splitter 1124 splits the illumination light into reference light 1125 incident on and reflected from the reference lens 1126 and sample light 1127 incident on and reflected from the sample 1121. The objective lens 1122 is focused on or near the top surface of the sample 1121 as shown by the collected light 1129 to image the sample 1121 using relatively high NA optical elements and maintain the focal position while changing the optical path difference by moving the reference mirror 1126, or by moving the beamsplitter 1124 and the reference mirror 1126 vertically together as shown by the dotted arrow.

圖11C繪示林尼克型干涉物鏡1150,其包括匹配物鏡1152及1153、分光器1154、及如箭頭所示移動以改變光學路徑差之參考鏡1156。照明光由具有減小孔徑大小之光源(未顯示)提供,並由分光器1154接收,該分光器將照明光分裂成參考光1155,該參考光利用物鏡1153聚焦於參考鏡1156上,且樣本光1157由物鏡1152聚焦於樣本1151上並從該樣本反射。物鏡1153及參考鏡1156可一起移動以改變光學路徑差,而在一些實施方案中,僅移動參考鏡1156。在一些實施方案中,如虛線箭頭所繪示,分光器1154、物鏡1153、及參考鏡1156均垂直移動。物鏡1152如經收集光1159所繪示聚焦於樣本1151之頂部表面上或附近,以利用相對高NA之光學元件對樣本1151進行成像,並維持焦點位置,同時藉由移動參考鏡1156及物鏡1153而改變光學路徑差。11C shows a Linnik-type interferometer objective 1150, which includes matching objective lenses 1152 and 1153, a beam splitter 1154, and a reference lens 1156 that moves as indicated by the arrows to change the optical path difference. Illumination light is provided by a light source (not shown) with a reduced aperture size and is received by beam splitter 1154, which splits the illumination light into reference light 1155, which is focused on reference lens 1156 using objective lens 1153, and sample light 1157, which is focused on sample 1151 by objective lens 1152 and reflected from the sample. Objective lens 1153 and reference lens 1156 can be moved together to change the optical path difference, while in some embodiments, only reference lens 1156 is moved. In some embodiments, as shown by the dashed arrows, the beam splitter 1154, the objective lens 1153, and the reference lens 1156 are all moved vertically. The objective lens 1152 is focused on or near the top surface of the sample 1151 as shown by the collected light 1159 to image the sample 1151 using relatively high NA optical elements and maintain the focus position while changing the optical path difference by moving the reference lens 1156 and the objective lens 1153.

在一些實施方案中,可使用多個參考路徑。例如,若單一參考路徑用於測量具有多個層級(例如,頂部表面及底部表面)之結構,則用以改變參考光學路徑以產生對應於各層級之條紋圖案的掃描可能係長的,此將減少通量。藉由使用多個參考路徑,且各參考路徑經組態用於不同層級,可大幅減小掃描長度。In some implementations, multiple reference paths may be used. For example, if a single reference path is used to measure a structure having multiple levels (e.g., a top surface and a bottom surface), the scan used to change the reference optical path to produce a fringe pattern corresponding to each level may be long, which will reduce throughput. By using multiple reference paths, with each reference path configured for a different level, the scan length can be greatly reduced.

圖12舉例繪示具有頂部表面1202及底部表面1204之結構1200,其中對應相關圖1210及1230由干涉儀產生,如本文所討論。相關圖1210、1230包括對應於結構1200之頂部表面1202之頂部條紋1212、1232及對應於結構1200之底部表面1204之底部條紋1214、1234。12 illustrates a structure 1200 having a top surface 1202 and a bottom surface 1204, with corresponding correlation maps 1210 and 1230 generated by interferometry, as discussed herein. The correlation maps 1210, 1230 include top stripes 1212, 1232 corresponding to the top surface 1202 of the structure 1200 and bottom stripes 1214, 1234 corresponding to the bottom surface 1204 of the structure 1200.

利用單一參考光學路徑,用以改變參考光學路徑之掃描將具有至少與結構1200之整個深度一樣大之長度。例如,單一參考鏡1220可掃描結構1200之整個深度之距離1222以產生相關圖1210,其中頂部條紋1212對應於頂部表面1202處之第一位置,且底部條紋1214對應於底部表面1204處之第二位置,但是沿著相同線繪示。結構1200之深度可基於對應於頂部表面1202之頂部條紋1212與底部條紋1214之間之距離來判定。若使用單一參考光學路徑,則調整參考鏡1220掃描之範圍(亦即距離1222)例如以對應於結構1200之深度可能係所欲的。With a single reference optical path, the scan used to change the reference optical path will have a length at least as great as the entire depth of structure 1200. For example, single reference mirror 1220 may scan distance 1222 throughout the depth of structure 1200 to produce correlation graph 1210, where top stripe 1212 corresponds to a first location at top surface 1202, and bottom stripe 1214 corresponds to a second location at bottom surface 1204, but is drawn along the same line. The depth of structure 1200 may be determined based on the distance between top stripe 1212 and bottom stripe 1214 corresponding to top surface 1202. If a single reference optical path is used, it may be desirable to adjust the range (ie, distance 1222) scanned by reference mirror 1220, for example, to correspond to the depth of structure 1200.

然而,藉由使用多個參考路徑,可在所關注之層級上使用分離之掃描,且沒有必要在結構1200之整個深度上進行掃描。例如,如所繪示,第一參考鏡1240掃描距離1242(其僅係整個距離1222之一部分),且第二參考鏡1244分離地掃描距離1246(其僅係整個距離1222之一部分),可產生相關圖1230,其中頂部條紋1232對應於頂部表面1202處之第一位置(由第一參考鏡1240之掃描產生),且底部條紋1234對應於底部表面1204處之第二位置(由第二參考鏡1244之掃描產生)。應理解,因為干涉儀對整個區域進行成像,所以可執行第一參考鏡1240及第二參考鏡1244之掃描,而無需光學元件與樣本之間之相對橫向移動,且可如圖13A至圖13C所討論同時(或依序)執行掃描。結構1200之深度可基於頂部條紋1232與底部條紋1234之間之距離來判定,該距離可基於參考光學路徑之長度之間的已知差來校準。可同時或依序掃描多個參考光學路徑。因為相較於使用單一參考光學路徑,各參考光學路徑在短得多的距離上掃描,所以可大幅減少擷取時間。額外地(或替代地),例如,如圖5A至圖5C、及圖7B所討論,可調變光之光譜的週期性,以進一步減小(或消除)參考鏡1240及1244被實體掃描之距離。However, by using multiple reference paths, separate scans can be used at the levels of interest, and it is not necessary to scan the entire depth of structure 1200. For example, as shown, first reference mirror 1240 scans distance 1242 (which is only a portion of full distance 1222), and second reference mirror 1244 separately scans distance 1246 (which is only a portion of full distance 1222), resulting in correlation graph 1230 in which top stripe 1232 corresponds to a first location at top surface 1202 (resulting from the scan by first reference mirror 1240), and bottom stripe 1234 corresponds to a second location at bottom surface 1204 (resulting from the scan by second reference mirror 1244). It will be appreciated that because the interferometer images the entire area, the scans of the first reference mirror 1240 and the second reference mirror 1244 can be performed without relative lateral movement between the optical elements and the sample, and can be performed simultaneously (or sequentially) as discussed in Figures 13A-13C. The depth of the structure 1200 can be determined based on the distance between the top stripe 1232 and the bottom stripe 1234, which can be calibrated based on the known difference between the lengths of the reference optical paths. Multiple reference optical paths can be scanned simultaneously or sequentially. Because each reference optical path scans a much shorter distance than when using a single reference optical path, the acquisition time can be significantly reduced. Additionally (or alternatively), for example, as discussed in connection with FIGS. 5A-5C , and 7B , the periodicity of the spectrum of light can be modulated to further reduce (or eliminate) the distance that reference mirrors 1240 and 1244 are physically scanned.

圖13A、圖13B、及圖13C繪示產生多個參考光學路徑的不同實施方案,其可使用如在本文討論之圖9、圖11B、及圖11C中繪示之邁克生或林尼克型干涉物鏡搭配本文討論之干涉儀700、800、100使用。13A, 13B, and 13C illustrate different implementations of generating multiple reference optical paths that may be used with a McArthur or Linnik type interferometer objective as shown in FIGS. 9, 11B, and 11C discussed herein in conjunction with the interferometers 700, 800, 100 discussed herein.

如圖13A所繪示,干涉物鏡1300包括具有多個參考鏡之多個參考光學路徑。干涉物鏡1300包括物鏡(未顯示)、第一分光器1304、第二分光器1306、及兩個參考鏡1308及1310,該兩個參考鏡如箭頭所指示分離地移動以改變各參考光學路徑中之光學路徑差。繪示為準直之照明光1303由光源(未顯示)提供並由干涉物鏡1300接收。第一分光器1304將照明光1303分裂成參考光1305及樣本光1307,該樣本光入射於樣本1301上並從該樣本反射。第二分光器1306將參考光1305之第一部分引導至第一參考鏡1308,並將參考光1305之第二部分引導至第二參考鏡1310。與第一參考鏡1308及第二參考鏡1310相關聯之參考光學路徑之長度可對應於接近結構中之不同層級之標稱位置,例如圖12中所顯示之頂部表面1202及底部表面1204。參考鏡1308及1310可獨立地移動以改變各參考光學路徑之光學路徑差。在一些實施方案中,第二分光器1306可係將參考光1305之不同光譜範圍引導至第一參考鏡1308及第二參考鏡1310的二色性分光器。偵測器,例如圖7A、圖7B、圖8、或圖10中之偵測器720、840、或1040,可包括另一二色性分光器及分離之感測器以同時偵測回應於各參考光學路徑而產生之條紋。替代地,第一參考鏡1308及第二參考鏡1310可依序掃描,使得可在收集由一個參考光學路徑產生之條紋之前收集由另一個參考光學路徑產生之條紋。在一些實施方案中,翻轉鏡可用以防止在掃描第一參考鏡1308時收集來自第二參考鏡1310之參考光,並防止在掃描第二參考鏡1310時收集來自第一參考鏡1308之參考光。As shown in FIG13A , an interference objective 1300 includes multiple reference optical paths with multiple reference lenses. The interference objective 1300 includes an objective lens (not shown), a first beam splitter 1304, a second beam splitter 1306, and two reference lenses 1308 and 1310 that move separately as indicated by arrows to change the optical path difference in each reference optical path. Illumination light 1303, shown as collimated, is provided by a light source (not shown) and received by the interference objective 1300. The first beam splitter 1304 splits the illumination light 1303 into reference light 1305 and sample light 1307, which is incident on and reflected from a sample 1301. Second beam splitter 1306 directs a first portion of reference light 1305 to first reference mirror 1308 and directs a second portion of reference light 1305 to second reference mirror 1310. The lengths of the reference optical paths associated with first reference mirror 1308 and second reference mirror 1310 may correspond to nominal positions at different levels in the proximity structure, such as top surface 1202 and bottom surface 1204 as shown in FIG12. Reference mirrors 1308 and 1310 may be independently movable to vary the optical path difference of each reference optical path. In some implementations, second beam splitter 1306 can be a dichroic beam splitter that directs different spectral ranges of reference light 1305 to first reference mirror 1308 and second reference mirror 1310. A detector, such as detector 720, 840, or 1040 in FIG. 7A, FIG. 7B, FIG. 8, or FIG. 10, can include another dichroic beam splitter and separate sensors to simultaneously detect fringes generated in response to each reference optical path. Alternatively, first reference mirror 1308 and second reference mirror 1310 can be scanned sequentially so that fringes generated by one reference optical path can be collected before fringes generated by another reference optical path. In some implementations, a flip mirror can be used to prevent collection of reference light from second reference mirror 1310 when scanning first reference mirror 1308, and to prevent collection of reference light from first reference mirror 1308 when scanning second reference mirror 1310.

如圖13B所繪示,干涉物鏡1320包括具有多個參考表面之多個參考光學路徑。干涉物鏡1320包括物鏡(未顯示)、第一分光器1324、第一參考鏡1326,該第一參考鏡係可移動的並用作分光器,該分光器將入射光之一部分引導向第一分光器1324並將光之另一部分引導至能夠從第一參考鏡1326分離地移動的第二參考鏡1330。繪示為準直之照明光1323由光源(未顯示)提供並由干涉物鏡1320接收。第一分光器1324將照明光1323分裂成參考光1325及樣本光1327,該樣本光入射於樣本1321上並從該樣本反射。可係部分透明之薄膜的第一參考鏡1326將參考光1305之第一部分反射回第一分光器1324,並將參考光1305之第二部分透射至第二參考鏡1330,並經由第一參考鏡1326反射並返回。第一參考鏡1326可如相關聯箭頭所指示移動,且第二參考鏡1330可如相關聯箭頭所指示移動。與第一參考鏡1326及第二參考鏡1330相關聯之參考光學路徑之長度可對應於結構中之不同層級之標稱位置,例如圖12中所示之頂部表面1202及底部表面1204。參考鏡1326及1330可獨立地移動以改變各參考光學路徑之光學路徑差。在一些實施方案中,在掃描第一參考鏡1326的同時第二參考鏡1330可隨第一參考鏡1326移動,接著可分離地移動以掃描第二參考鏡1330。在一些實施方案中,第一參考鏡1326可係二色性分光器,其將參考光1325之一個光譜範圍反射回第一分光器1324並將參考光1325之不同光譜範圍透射至第二參考鏡1330。如圖13A所討論,偵測器,例如圖7A、圖7B、圖8、或圖10中之偵測器720、840、或1040,可包括一個二色性分光器及分離之感測器以同時偵測回應於各參考光學路徑而產生之條紋。替代地,第一參考鏡1326及第二參考鏡1330可依序掃描,使得可在收集由一個參考光學路徑產生之條紋之前收集由另一個參考光學路徑產生之條紋。As shown in FIG13B , the interference objective 1320 includes a plurality of reference optical paths having a plurality of reference surfaces. The interference objective 1320 includes an objective lens (not shown), a first beam splitter 1324, a first reference lens 1326, which is movable and acts as a beam splitter, which directs a portion of incident light to the first beam splitter 1324 and directs another portion of the light to a second reference lens 1330 that is movable separately from the first reference lens 1326. Illumination light 1323, shown as collimated, is provided by a light source (not shown) and received by the interference objective 1320. The first beam splitter 1324 splits the illumination light 1323 into reference light 1325 and sample light 1327, which is incident on and reflected from the sample 1321. A first reference mirror 1326, which may be a partially transparent film, reflects a first portion of the reference light 1305 back to the first beam splitter 1324, and transmits a second portion of the reference light 1305 to the second reference mirror 1330, and reflects and returns through the first reference mirror 1326. The first reference mirror 1326 may be movable as indicated by the associated arrows, and the second reference mirror 1330 may be movable as indicated by the associated arrows. The lengths of the reference optical paths associated with the first reference mirror 1326 and the second reference mirror 1330 may correspond to nominal positions at different levels in the structure, such as the top surface 1202 and the bottom surface 1204 shown in FIG. Reference mirrors 1326 and 1330 can be independently moved to change the optical path difference of each reference optical path. In some embodiments, second reference mirror 1330 can be moved with first reference mirror 1326 while scanning first reference mirror 1326, and then can be moved separately to scan second reference mirror 1330. In some embodiments, first reference mirror 1326 can be a dichroic beam splitter that reflects one spectral range of reference light 1325 back to first beam splitter 1324 and transmits a different spectral range of reference light 1325 to second reference mirror 1330. As discussed in Figure 13A, a detector, such as detector 720, 840, or 1040 in Figures 7A, 7B, 8, or 10, may include a dichroic beam splitter and separate sensors to simultaneously detect fringes generated in response to each reference optical path. Alternatively, the first reference mirror 1326 and the second reference mirror 1330 may be scanned sequentially so that fringes generated by one reference optical path are collected before fringes generated by another reference optical path.

如圖13C所繪示,干涉物鏡1350包括具有由單一光學元件產生之多個參考表面的多個參考光學路徑。干涉物鏡1350包括物鏡(未顯示)及玻璃板1356,該玻璃板具有用作第一參考鏡1358之部分反射前表面及用作第二參考鏡1360之反射後表面。繪示為準直之照明光1353由光源(未顯示)提供並由干涉物鏡1350接收。第一分光器1354將照明光1353分裂成參考光1355及樣本光1357,該樣本光入射於樣本1351上並從該樣本反射。玻璃板1356之前表面用作第一參考鏡1358並將參考光1305之第一部分反射回第一分光器1354,並將參考光1305之第二部分透射至玻璃板1356之後表面,該後表面用作第二參考鏡1360並反射參考光1305。玻璃板1356能夠如相關聯箭頭所指示移動,以移動第一參考鏡1358及第二參考鏡1360。與第一參考鏡1358及第二參考鏡1360相關聯之參考光學路徑之長度(亦即,玻璃板1356之前表面與後表面之間之距離)可對應於結構中之不同層級之標稱位置,例如圖12中所顯示之頂部表面1202及底部表面1204。在一些實施方案中,玻璃板1356可係二色性分光器,其將參考光1355之一個光譜範圍反射回第一分光器1354並將參考光1355之不同光譜範圍透射至第二參考鏡1360。如圖13A所討論,偵測器,例如圖7A、圖7B、圖8、或圖10中之偵測器720、840、或1040,可包括一個二色性分光器及分離之感測器以同時偵測回應於各參考光學路徑而產生之條紋。替代地,第一參考鏡1358及第二參考鏡1360可依序掃描,使得可在收集由一個參考光學路徑產生之條紋之前收集由另一個參考光學路徑產生之條紋。As shown in Figure 13C, the interference objective 1350 includes multiple reference optical paths with multiple reference surfaces produced by a single optical element. The interference objective 1350 includes an objective lens (not shown) and a glass plate 1356 having a partially reflective front surface used as a first reference mirror 1358 and a reflective rear surface used as a second reference mirror 1360. Illumination light 1353, shown as collimated, is provided by a light source (not shown) and received by the interference objective 1350. A first beam splitter 1354 splits the illumination light 1353 into reference light 1355 and sample light 1357, which is incident on and reflected from the sample 1351. The front surface of the glass plate 1356 serves as a first reference mirror 1358 and reflects a first portion of the reference light 1305 back to the first beam splitter 1354, and transmits a second portion of the reference light 1305 to the rear surface of the glass plate 1356, which serves as a second reference mirror 1360 and reflects the reference light 1305. The glass plate 1356 can be moved as indicated by the associated arrows to move the first reference mirror 1358 and the second reference mirror 1360. The length of the reference optical path associated with the first reference mirror 1358 and the second reference mirror 1360 (i.e., the distance between the front surface and the rear surface of the glass plate 1356) can correspond to the nominal positions of different levels in the structure, such as the top surface 1202 and the bottom surface 1204 shown in FIG. In some embodiments, glass plate 1356 can be a dichroic beam splitter that reflects one spectral range of reference light 1355 back to first beam splitter 1354 and transmits a different spectral range of reference light 1355 to second reference mirror 1360. As discussed in FIG13A, a detector, such as detector 720, 840, or 1040 of FIG7A, FIG7B, FIG8, or FIG10, can include a dichroic beam splitter and separate sensors to simultaneously detect fringes generated in response to each reference optical path. Alternatively, the first reference mirror 1358 and the second reference mirror 1360 may be scanned sequentially so that fringes produced by one reference optical path are collected before fringes produced by the other reference optical path.

圖14A、圖14B及圖14C繪示如單像素掃描所見之不同大小通孔之相關圖的實例。在圖14A至圖14C所繪示之相關圖中,頂部條紋係重影條紋,並可與底部條紋一起用於產生近似之通孔深度,但是將使用由樣本之頂部表面(亦即通孔外側)產生之條紋來進行精確的深度測量,且圖14A、圖14B、及圖14C所繪示之底部條紋及重影條紋(亦即,圖14A、圖14B、及圖14C所繪示之頂部條紋)將被忽略。Figures 14A, 14B, and 14C show examples of correlation graphs for vias of different sizes as seen with a single pixel scan. In the correlation graphs shown in Figures 14A to 14C, the top stripes are ghost stripes and can be used with the bottom stripes to generate an approximate via depth, but the stripes generated from the top surface of the sample (i.e., the outside of the via) will be used for accurate depth measurement, and the bottom stripes and ghost stripes (i.e., the top stripes shown in Figures 14A, 14B, and 14C) shown in Figures 14A, 14B, and 14C will be ignored.

圖14A繪示5 µm寬乘50 µm深通孔的相關圖。相關圖1402例如係來自具有習知掃描干涉物鏡之干涉儀所獲得的樣本掃描,亦即掃描物鏡之焦點位置,而相關圖1404係來自具有如本文討論之掃描參考鏡之干涉儀所獲得的樣本掃描。如可見,相關圖1402及1404二者分別具有對應於在樣本之頂部表面處產生之重影條紋的可見條紋1402t及1404t。然而,以習知掃描干涉物鏡產生之相關圖1402具有由向右傾斜所繪示之顯著背景強度變化,並具有對應於通孔之底部之底部條紋1402b的低對比度,此可能係結構內之繞射及多次反射的結果。背景強度係所偵測位置處之參考、物體、及任何其他光束的強度總和。另一方面,用掃描參考鏡產生之相關圖1404具有恆定之背景強度值並具有對應於通孔之底部之底部條紋1404b的良好對比度。FIG. 14A shows correlation graphs for a 5 μm wide by 50 μm deep through hole. Correlation graph 1402 is, for example, from a sample scan obtained by an interferometer with a known scanning interferometer objective, i.e., the focal position of the scanning objective, while correlation graph 1404 is from a sample scan obtained by an interferometer with a scanning reference lens as discussed herein. As can be seen, both correlation graphs 1402 and 1404 have visible fringes 1402t and 1404t, respectively, corresponding to ghost fringes generated at the top surface of the sample. However, the correlation graph 1402 produced with the conventional scanning interferometer has a significant background intensity variation as indicated by the tilt to the right, and has a low contrast of the bottom stripe 1402b corresponding to the bottom of the through hole, which may be the result of diffraction and multiple reflections within the structure. The background intensity is the sum of the intensities of the reference, object, and any other beams at the detected position. On the other hand, the correlation graph 1404 produced with the scanning reference lens has a constant background intensity value and has a good contrast of the bottom stripe 1404b corresponding to the bottom of the through hole.

圖14B繪示3 µm寬乘30 µm深通孔的相關圖。例如,相關圖1412係來自具有習知掃描干涉物鏡之干涉儀所獲得的樣本掃描,亦即掃描物鏡之焦點位置,而相關圖1414係來自具有如本文討論之掃描參考鏡之干涉儀所獲得的樣本掃描。如可見,相關圖1412及1414二者分別具有對應於在樣本之頂部表面處產生之重影條紋的可見條紋1412t及1414t。然而,以習知掃描干涉物鏡產生之相關圖1412具有由向右傾斜所繪示之顯著背景強度變化,且對應於通孔底部之底部條紋不可見,此可能係結構內之繞射及多次反射的結果。另一方面,利用掃描參考鏡產生之相關圖1414具有恆定之背景強度值並具有對應於通孔之底部之底部條紋1414b的良好對比度。FIG14B shows correlation graphs for a 3 µm wide by 30 µm deep via. For example, correlation graph 1412 is from a sample scan obtained with an interferometer having a known scanning interferometer objective, i.e., the focal position of the scanning objective, while correlation graph 1414 is from a sample scan obtained with an interferometer having a scanning reference lens as discussed herein. As can be seen, both correlation graphs 1412 and 1414 have visible fringes 1412t and 1414t, respectively, corresponding to ghost fringes generated at the top surface of the sample. However, the correlation graph 1412 produced by the conventional scanning interferometer has a significant background intensity variation as indicated by the tilt to the right, and the bottom stripe corresponding to the bottom of the via is not visible, which may be the result of diffraction and multiple reflections within the structure. On the other hand, the correlation graph 1414 produced by the scanning reference lens has a constant background intensity value and has good contrast of the bottom stripe 1414b corresponding to the bottom of the via.

圖14C繪示3 µm寬乘50 µm深通孔的相關圖。相關圖1424例如係來自由具有如本文所討論之掃描參考鏡之干涉儀所獲得的樣本掃描。未顯示由具有習知掃描干涉物鏡之干涉儀所獲得之對應相關圖,因為未產生對應於通孔之底部之有用條紋。然而,如可見,利用掃描參考鏡產生之相關圖1424顯示對應於在樣本之頂部表面處產生之重影條紋的可見條紋1424t,具有恆定之背景強度值,並具有對應於通孔之底部的底部條紋1424b之良好對比度。FIG. 14C shows a correlation graph for a 3 µm wide by 50 µm deep through-hole. The correlation graph 1424 is, for example, from a sample scan obtained by an interferometer with a scanning reference lens as discussed herein. The corresponding correlation graph obtained by an interferometer with a conventional scanning interferometer objective is not shown because no useful fringe corresponding to the bottom of the through-hole is produced. However, as can be seen, the correlation graph 1424 produced using the scanning reference lens shows a visible fringe 1424t corresponding to a ghost fringe produced at the top surface of the sample, with a constant background intensity value, and with good contrast of a bottom fringe 1424b corresponding to the bottom of the through-hole.

圖15舉例繪示如本文所討論之干涉儀諸如干涉儀700產生之多個影像的集合1500(繪示為影像1500A、1500B、及1500C)。集合1500中之各影像係資料訊框,其包括如在掃描期間收集之具有複數個結構1502例如通孔之樣本的全視場。例如,當參考鏡係處於在此給定掃描時刻/訊框處干涉條紋不可見之位置時,產生影像1500A。全視場例如可係0.45 mmx0.45 mm,且包括有包括複數個結構1502例如通孔的樣本之區域。在集合1500中產生樣本之區域之多個影像,各影像具有藉由掃描參考鏡、分光器、或改變由光源提供之光譜或其任何組合而產生的不同光學路徑差。應理解,雖然圖15繪示集合1500中之三個影像,但是來自掃描之影像之集合可包括顯著更多數量之影像。FIG. 15 illustrates, by way of example, a collection 1500 of multiple images (shown as images 1500A, 1500B, and 1500C) generated by an interferometer as discussed herein, such as interferometer 700. Each image in collection 1500 is a data frame that includes a full field of view of a sample having a plurality of structures 1502, such as vias, as collected during a scan. For example, image 1500A is generated when the reference mirror is in a position where interference fringes are not visible at this given scan time/frame. The full field of view may be, for example, 0.45 mm x 0.45 mm and includes an area of the sample including a plurality of structures 1502, such as vias. Multiple images of an area of the sample are generated in set 1500, each image having a different optical path difference produced by scanning a reference mirror, a beam splitter, or changing the spectrum provided by the light source, or any combination thereof. It should be understood that although Figure 15 shows three images in set 1500, a set of images from a scan may include a significantly larger number of images.

圖16係繪示利用干涉儀特徵化包括複數個結構之樣本之區域之方法的流程圖,該方法可例如使用關於圖9及圖11A至圖11C討論之干涉物鏡及/或關於圖5A至圖5E討論之週期光譜之調變中之任一者,分別由圖7A、圖7B、圖8、及圖10中繪示之干涉儀700、800、及1000中之任一者執行。在一些實施方案中,複數個結構可係溝槽、孔洞、及高縱橫比(HAR)結構中之至少一者。例如,HAR結構可具有5 µm或更小之寬度及30 µm或更大之深度。FIG16 is a flow chart illustrating a method for characterizing a region of a sample including a plurality of structures using interferometry, which method may be performed by any of the interferometers 700, 800, and 1000 illustrated in FIGS. 7A, 7B, 8, and 10, respectively, using any of the interferometric objectives discussed with respect to FIGS. 9 and 11A-11C and/or the modulation of the periodic spectrum discussed with respect to FIGS. 5A-5E, for example. In some embodiments, the plurality of structures may be at least one of trenches, holes, and high aspect ratio (HAR) structures. For example, the HAR structures may have a width of 5 μm or less and a depth of 30 μm or more.

如方塊1602所繪示,該方法包括將照明光分裂成待入射於樣本上並由該樣本反射的樣本光及待入射於參考鏡上並由該參考鏡反射的參考光,例如,如圖7A及圖7B中之分光器714所繪示。舉實例而言,用於將照明光分裂成待入射於樣本上並由該樣本反射的樣本光及待入射至參考鏡上並由該參考鏡反射的參考光之構件可包括定位於物鏡下方之分光器(亦即,分光器係定位於物鏡與樣本之間),諸如圖8、圖9、圖10、圖11A、及圖11B中之分光器812、904、1024、1104、及1124,或者定位於物鏡上方之分光器(亦即,物鏡係定位於分光器與樣本之間),諸如圖11C中之分光器1154。As shown in block 1602, the method includes splitting the illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by the reference mirror, for example, as shown by the beam splitter 714 in Figures 7A and 7B. For example, the components for splitting the illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by the reference mirror may include a beam splitter positioned below the objective lens (i.e., the beam splitter is positioned between the objective lens and the sample), such as the beam splitters 812, 904, 1024, 1104, and 1124 in Figures 8, 9, 10, 11A, and 11B, or a beam splitter positioned above the objective lens (i.e., the objective lens is positioned between the beam splitter and the sample), such as the beam splitter 1154 in Figure 11C.

如方塊1604所繪示,該方法包括利用具有第一數值孔徑之照明光學元件用樣本光照射樣本之區域,例如,如圖7A及圖7B中之樣本光724所繪示。用於利用具有第一數值孔徑之照明光學元件用樣本光照射樣本之區域之構件可包括例如經定位以在收集透鏡下方提供照明光之光學元件,諸如分別在圖8及圖9中顯示之(多個)透鏡/分光器/樣本光811/812/825及908/904/907所繪示,或可包括例如經定位以在收集透鏡之前提供照明光之光學元件,諸如圖10中顯示之孔徑/物鏡/樣本光1012/1022/1023及在圖11A、圖11B、及圖11C中顯示之物鏡/樣本光1102/1107、1152/1157所繪示。As indicated at block 1604, the method includes illuminating a region of the sample with sample light using an illumination optical element having a first numerical aperture, such as illustrated by sample light 724 in FIGS. 7A and 7B. Components for illuminating an area of a sample with sample light using an illumination optical element having an aperture of a first numerical value may include, for example, an optical element positioned to provide illumination light below a collection lens, such as (multiple) lens/beamsplitter/sample light 811/812/825 and 908/904/907 shown in Figures 8 and 9, respectively, or may include, for example, an optical element positioned to provide illumination light before a collection lens, such as aperture/objective lens/sample light 1012/1022/1023 shown in Figure 10 and objective lens/sample light 1102/1107, 1152/1157 shown in Figures 11A, 11B, and 11C.

在方塊1606處,該方法包括將收集光學元件聚焦於相對於樣本之焦點位置處,該收集光學元件具有大於第一數值孔徑之第二數值孔徑,例如,如圖7A及圖7B中之經收集光726所繪示。在一些實施方案中,收集光學元件可係邁克生物鏡、米勞物鏡、或林尼克物鏡中之一者。用於將收集光學元件聚焦於相對於樣本之焦點位置處,該收集光學元件具有大於第一數值孔徑之第二數值孔徑之構件可包括例如分別在圖8、圖9、圖10、圖11A、圖11B、及圖11C中顯示之物鏡/經收集光822/829、902/909、1022/1029、1102/1109、1122/1129、及1152/1159。At block 1606, the method includes focusing a collection optical element at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture, for example, as depicted by collected light 726 in Figures 7A and 7B. In some embodiments, the collection optical element can be one of a Michael bioscope, a Millau objective, or a Linnik objective. Components for focusing the collecting optical element at a focal position relative to the sample, the collecting optical element having a second numerical aperture greater than the first numerical aperture may include, for example, objective lenses/collected light 822/829, 902/909, 1022/1029, 1102/1109, 1122/1129, and 1152/1159 shown in Figures 8, 9, 10, 11A, 11B, and 11C, respectively.

在方塊1608處,該方法包括通過樣本之深度掃描藉由來自樣本之經反射樣本光與來自參考鏡之經反射參考光產生干涉所產生之一或多個相干包絡,同時不改變收集光學元件相對於樣本之焦點位置,例如,如圖7A及圖7B中之箭頭721所繪示。用於通過樣本之深度掃描藉由來自樣本之經反射樣本光與來自參考鏡之經反射參考光產生干涉所產生之一或多個相干包絡,同時不改變收集光學元件相對於樣本之焦點位置之構件可包括例如用於改變樣本光與參考光之間之光學路徑差的構件,諸如圖8、圖9、圖10、圖11A、圖11B、及圖11C中顯示之一或多個移動參考鏡716、826、906、1026、1106、1126、及1156,及/或圖10及圖11A中顯示之移動分光器1024及1104,及/或圖8及圖10中改變照明光之光譜的光源810或1010,或用於調變照明光或藉由來自樣本之經反射樣本光與經反射參考光產生干涉所產生之干涉光之光譜的週期性的構件,諸如,如參考圖5A至圖5E所討論之調變干涉儀500或非平衡光纖干涉儀。At block 1608, the method includes generating one or more coherence envelopes by depth scanning the sample by interference of reflected sample light from the sample with reflected reference light from a reference mirror while not changing the focal position of the collection optical element relative to the sample, for example, as shown by arrow 721 in Figures 7A and 7B. One or more coherent envelopes generated by interference of reflected sample light from the sample and reflected reference light from the reference mirror for depth scanning through the sample, while not changing the focal position of the collection optical element relative to the sample, may include, for example, components for changing the optical path difference between the sample light and the reference light, such as one or more moving reference mirrors 716, 826, 906, 1026 shown in FIGS. 8, 9, 10, 11A, 11B, and 11C. , 1106, 1126, and 1156, and/or the moving beam splitters 1024 and 1104 shown in Figures 10 and 11A, and/or the light source 810 or 1010 in Figures 8 and 10 for changing the spectrum of the illumination light, or a periodic component for modulating the spectrum of the illumination light or the interference light generated by interference between the reflected sample light from the sample and the reflected reference light, such as the modulation interferometer 500 or the unbalanced fiber optic interferometer discussed with reference to Figures 5A to 5E.

如方塊1610所繪示,該方法包括:利用收集光學元件對與來自參考鏡之經反射參考光以一或多個相干包絡之複數個深度產生干涉之來自樣本之經反射樣本光進行成像,以產生多個影像,例如,如圖7A及圖7B及圖15中所顯示之干涉光722及偵測器720所繪示。用於利用收集光學元件對與來自參考鏡之經反射參考光以一或多個相干包絡之複數個深度產生干涉之來自樣本之經反射樣本光進行成像以產生多個影像之構件,可包括例如如圖8之物鏡822、透鏡842、及偵測器840,或圖10中之物鏡1022、透鏡1042、及偵測器1040。As shown in block 1610, the method includes imaging reflected sample light from a sample that interferes with reflected reference light from a reference mirror at multiple depths of one or more coherent envelopes using a collecting optical element to produce multiple images, such as illustrated by the interference light 722 and detector 720 shown in FIGS. 7A and 7B and 15 . Components for imaging reflected sample light from a sample that interferes with reflected reference light from a reference mirror at multiple depths of one or more coherent envelopes using collecting optical elements to produce multiple images may include, for example, objective lens 822, lens 842, and detector 840 as shown in Figure 8, or objective lens 1022, lens 1042, and detector 1040 in Figure 10.

如方塊1612所繪示,該方法包括分析包括複數個結構之樣本之區域的多個影像以特徵化樣本之區域,例如,如參考圖7A及圖7B所顯示之處理系統750所討論。用於分析包括複數個結構之樣本之區域的多個影像以特徵化樣本之區域之構件,可包括例如圖7A、圖7B、圖8、及圖10中可用如本文所討論之電腦可讀程式碼組態的至少一個處理器752、850、及1050。As indicated at block 1612, the method includes analyzing a plurality of images of a region of a sample including a plurality of structures to characterize the region of the sample, for example, as discussed with reference to the processing system 750 shown in Figures 7A and 7B. The means for analyzing a plurality of images of a region of a sample including a plurality of structures to characterize the region of the sample may include, for example, at least one processor 752, 850, and 1050 of Figures 7A, 7B, 8, and 10 that may be configured with computer readable code as discussed herein.

在一些實施方案中,該方法可藉由例如使用圖8、圖9、圖10、圖11A、圖11B、及圖11C中顯示之一或多個移動參考鏡716、826、906、1026、1106、1126、及1156,及/或圖10及圖11A中顯示之移動分光器1024及1104,及/或圖8及圖10中改變照明光之光譜的光源810或1010改變樣本光與參考光之間之光學路徑差,來通過樣本之深度掃描藉由來自樣本之經反射樣本光與來自參考鏡之經反射參考光產生干涉所產生之一或多個相干包絡。In some embodiments, the method may generate one or more coherent envelopes by causing interference between reflected sample light from the sample and reflected reference light from a reference mirror through depth scanning of the sample by, for example, changing the optical path difference between the sample light and the reference light using one or more moving reference mirrors 716, 826, 906, 1026, 1106, 1126, and 1156 shown in FIGS. 8 , 9 , 10 , 11A , 11B, and 11C and/or the moving beam splitters 1024 and 1104 shown in FIGS. 10 and 11A and/or the light source 810 or 1010 that changes the spectrum of the illumination light in FIGS. 8 and 10 .

在一些實施方案中,該方法可進一步包括將照明光提供至干涉儀在收集光學元件與樣本之間的光學路徑中,例如,如參考圖8及圖9所討論。例如,用於將照明光提供至干涉儀在收集光學元件與樣本之間的光學路徑中之構件可包括例如圖8中顯示之光源810、透鏡811、及分光器812,或圖9中顯示之透鏡/分光器908/904。在一個實例實施方案中,可藉由移動照明光學元件及參考鏡來改變樣本光與參考光之間之光學路徑差,同時不改變收集光學元件相對於樣本之焦點位置,例如,如參考圖8中之總成830所討論。用於移動照明光學元件及參考鏡之構件可包括例如圖8所顯示之致動器831。在一個實施方案中,照明光學元件可包括準直光學元件及將照明光分裂成樣本光及參考光之分光器,例如,如分別由圖8及圖9所顯示之透鏡/分光器811/812及908/904所繪示。In some implementations, the method can further include providing illumination light to the interferometer in an optical path between the collection optics and the sample, e.g., as discussed with reference to FIGS. 8 and 9. For example, components for providing illumination light to the interferometer in an optical path between the collection optics and the sample can include, for example, light source 810, lens 811, and beam splitter 812 shown in FIG. 8, or lens/beam splitter 908/904 shown in FIG. 9. In one example implementation, the optical path difference between the sample light and the reference light can be changed by moving the illumination optics and the reference lens while not changing the focal position of the collection optics relative to the sample, e.g., as discussed with reference to assembly 830 in FIG. 8. The means for moving the illumination optics and the reference lens may include, for example, actuator 831 as shown in Fig. 8. In one embodiment, the illumination optics may include collimating optics and a beamsplitter that splits the illumination light into sample light and reference light, for example, as illustrated by lenses/beamsplitters 811/812 and 908/904 shown in Figs. 8 and 9, respectively.

在一些實施方案中,該方法可藉由移動參考鏡、移動將照明光分裂成樣本光及參考光之分光器、及調變照明光之光譜中之至少一者改變樣本光與參考光之間之光學路徑差,同時不改變收集光學元件相對於樣本之焦點位置,例如,如參考圖7A、圖7B、圖8、及圖10所討論。In some implementations, the method can change the optical path difference between the sample light and the reference light by moving a reference mirror, moving a beamsplitter that splits the illumination light into sample light and reference light, and modulating at least one of the spectrum of the illumination light, while not changing the focal position of the collection optical element relative to the sample, for example, as discussed with reference to Figures 7A, 7B, 8, and 10.

在一些實施方案中,該方法可進一步包括將參考光分裂以產生待入射於第二參考鏡上並由該第二參考鏡反射的第二參考光;改變樣本光與第二參考光之間之第二光學路徑差,同時不改變收集光學元件相對於樣本之焦點位置,其中第二光學路徑差不同於光學路徑差;利用收集光學元件對與來自該第二參考鏡之經反射第二參考光以複數個第二光學路徑差產生干涉之來自該樣本之經反射樣本光進行成像,以產生第二組多個影像;及分析包括複數個結構之樣本之區域的第二組多個影像以特徵化樣本之區域,例如,如參考圖12及圖13A至圖13C所討論。例如,用於將參考光分裂以產生待入射於第二參考鏡上並由該第二參考鏡反射的第二參考光之構件可包括例如分別在圖13A、圖13B、及圖13C中顯示之第二分光器1306、第一參考鏡1326、及玻璃板1356。用於改變樣本光與第二參考光之間之第二光學路徑差,同時不改變收集光學元件相對於樣本之焦點位置,其中第二光學路徑差不同於該光學路徑差之構件,可分別包括例如圖13A、圖13B、及圖13C所示之第二參考鏡1310、1330、1360。用於利用收集光學元件對與來自該第二參考鏡之經反射第二參考光以複數個第二光學路徑差產生干涉之來自該樣本之經反射樣本光進行成像以產生第二組多個影像之構件可包括例如如圖8中之物鏡822、透鏡842、及偵測器840,或圖10中之物鏡1022、透鏡1042、及偵測器1040。用於分析包括複數個結構之樣本之區域的第二組多個影像以特徵化樣本之區域之構件可包括例如圖7A、圖7B、圖8、及圖10中可用如本文所討論之電腦可讀程式碼組態的至少一個處理器752、850、及1050。In some embodiments, the method may further include splitting the reference light to generate a second reference light to be incident on and reflected by a second reference mirror; changing a second optical path difference between the sample light and the second reference light while not changing a focal position of the collecting optical element relative to the sample, wherein the second optical path difference is different from the optical path difference; imaging the reflected sample light from the sample that interferes with the reflected second reference light from the second reference mirror by a plurality of second optical path differences using the collecting optical element to generate a second set of multiple images; and analyzing the second set of multiple images of a region of the sample including a plurality of structures to characterize the region of the sample, for example, as discussed with reference to FIG. 12 and FIGS. 13A to 13C. For example, components for splitting the reference light to generate the second reference light to be incident on and reflected by the second reference mirror may include, for example, the second beam splitter 1306, the first reference mirror 1326, and the glass plate 1356 shown in FIG. 13A, FIG. 13B, and FIG. 13C, respectively. Components for changing the second optical path difference between the sample light and the second reference light while not changing the focal position of the collection optical element relative to the sample, wherein the second optical path difference is different from the optical path difference, may include, for example, the second reference mirrors 1310, 1330, 1360 shown in FIG. 13A, FIG. 13B, and FIG. 13C, respectively. The means for imaging the reflected sample light from the sample that interferes with the reflected second reference light from the second reference lens by a plurality of second optical path differences using a collection optical element to generate a second set of multiple images may include, for example, the objective lens 822, lens 842, and detector 840 in FIG8, or the objective lens 1022, lens 1042, and detector 1040 in FIG10. The means for analyzing the second set of multiple images of a region of the sample including a plurality of structures to characterize the region of the sample may include, for example, at least one processor 752, 850, and 1050 in FIG7A, FIG7B, FIG8, and FIG10 that may be configured with computer readable code as discussed herein.

舉實例而言,在多個影像中以光學路徑差產生干涉的來自樣本之經反射樣本光與來自參考鏡之經反射參考光產生對應於樣本之頂部表面的頂部干涉條紋,例如,如圖12中之相關圖1230中之頂部條紋1232所繪示,且在第二組多個影像中以第二光學路徑差產生干涉的來自樣本之經反射樣本光與來自第二參考鏡之經反射第二參考光產生對應於複數個結構之底部的底部干涉條紋,例如,如圖12中之相關圖1230中之底部條紋1234所繪示。For example, reflected sample light from a sample and reflected reference light from a reference mirror that interfere with each other by an optical path difference in a plurality of images generate top interference fringes corresponding to a top surface of the sample, for example, as shown in top fringes 1232 in correlation graph 1230 in FIG. 12 , and reflected sample light from a sample and reflected second reference light from a second reference mirror that interfere with each other by a second optical path difference in a second set of multiple images generate bottom interference fringes corresponding to bottoms of a plurality of structures, for example, as shown in bottom fringes 1234 in correlation graph 1230 in FIG. 12 .

舉實例而言,照明光可具有光譜頻寬,且分裂參考光會引導第一光譜範圍入射於參考鏡上並引導第二光譜範圍入射於第二參考鏡上,例如,如參考圖12及圖13A至圖13C所討論。額外地,使干涉樣本光及參考光成像可使用第一感測器,且使干涉樣本光及第二參考光成像可使用第二感測器,例如,如參考圖12及圖13A至圖13C所討論。For example, the illumination light may have a spectral bandwidth, and the split reference light may direct a first spectral range to be incident on a reference mirror and a second spectral range to be incident on a second reference mirror, for example, as discussed with reference to FIG12 and FIG13A to FIG13C. Additionally, imaging the interfering sample light and the reference light may use a first sensor, and imaging the interfering sample light and the second reference light may use a second sensor, for example, as discussed with reference to FIG12 and FIG13A to FIG13C.

在一些實施方案中,該方法可進一步包括減小產生照明光之光源之數值孔徑,及將照明光提供至具有將照明光引導至物鏡之分光器的干涉儀之光學路徑中;其中具有第一數值孔徑之照明光學元件包含光源之數值孔徑及物鏡,其中具有大於第一數值孔徑之第二數值孔徑的收集光學元件包含物鏡,例如,如參考圖10、圖11A、圖11B、及圖11C所討論。用於減小產生照明光之光源之數值孔徑之構件,可包括例如圖10所顯示之孔徑/物鏡1012/1022,或者孔徑可在透鏡處調整,或者可進一步在源之中間影像中或沿著光束之任何處調整。用於將照明光提供至具有將照明光引導至物鏡之分光器的干涉儀之光學路徑中之構件可包括例如圖10及圖11C中顯示之分光器1014、1154。In some embodiments, the method may further include reducing the numerical aperture of the light source that produces the illumination light, and providing the illumination light to an optical path of an interferometer having a beam splitter that directs the illumination light to an objective lens; wherein the illumination optical element having a first numerical aperture includes the numerical aperture of the light source and the objective lens, and wherein the collection optical element having a second numerical aperture greater than the first numerical aperture includes the objective lens, for example, as discussed with reference to Figures 10, 11A, 11B, and 11C. The means for reducing the numerical aperture of the light source that produces the illumination light may include, for example, aperture/objective lens 1012/1022 shown in Figure 10, or the aperture may be adjusted at the lens, or may be further adjusted in an intermediate image of the source or anywhere along the beam. Components for providing illumination light into the optical path of an interferometer having a beam splitter that directs the illumination light to the objective lens may include, for example, beam splitters 1014, 1154 shown in Figures 10 and 11C.

在一些實施方案中,照明光可具有光譜頻寬及角頻寬中之至少一者以在多個影像中產生低相干條紋,例如,如參考圖7A及圖7B中之光源712所討論。In some implementations, the illumination light may have at least one of a spectral bandwidth and an angular bandwidth to produce low coherence fringes in multiple images, for example, as discussed with reference to light source 712 in Figures 7A and 7B.

在一些實施方案中,產生照明光之照明源能夠經組態以改變照明光中之以下中之一或多者:光譜頻寬及角頻寬中之至少一者;柱面光學元件及空間線性光源中之至少一者;及偏振控制,例如,如參考圖7A及圖7B中之光源712所討論。In some implementations, an illumination source that generates illumination light can be configured to vary one or more of the following in the illumination light: at least one of spectral bandwidth and angular bandwidth; at least one of a cylindrical optical element and a spatially linear light source; and polarization control, for example, as discussed with reference to light source 712 in Figures 7A and 7B.

在一些實施方案中,可在至少與複數個結構之深度一般大之範圍上掃描一或多個相干包絡,例如,如參考圖12所討論。例如,在一些實施方案中,該範圍可係可調整的,例如,如參考圖12所討論。在一些實施方案中,該方法可進一步包括:在多個影像中偵測對應於樣本之頂部表面的頂部干涉條紋;在多個影像中偵測對應於複數個結構之底部的底部干涉條紋;及基於頂部干涉條紋與底部干涉條紋之間之距離判定複數個結構之深度,例如,如參考圖12及圖15所討論。用於在多個影像中偵測對應於樣本之頂部表面的頂部干涉條紋之構件;用於在多個影像中偵測對應於複數個結構之底部的底部干涉條紋之構件;及用於基於頂部干涉條紋與底部干涉條紋之間之距離判定複數個結構之深度之構件可包括例如圖7A、圖7B、圖8、及圖10中可利用如本文所討論之電腦可讀程式碼組態之至少一個處理器752、850、及1050。In some embodiments, the one or more coherence envelopes may be scanned over a range at least as large as the depth of the plurality of structures, e.g., as discussed with reference to FIG. 12. For example, in some embodiments, the range may be adjustable, e.g., as discussed with reference to FIG. 12. In some embodiments, the method may further include: detecting top interference fringes corresponding to a top surface of the sample in the plurality of images; detecting bottom interference fringes corresponding to bottoms of the plurality of structures in the plurality of images; and determining the depths of the plurality of structures based on a distance between the top interference fringes and the bottom interference fringes, e.g., as discussed with reference to FIG. 12 and FIG. 15. Components for detecting top interference fringes corresponding to the top surface of the sample in multiple images; components for detecting bottom interference fringes corresponding to the bottom of multiple structures in multiple images; and components for determining the depth of multiple structures based on the distance between the top interference fringes and the bottom interference fringes may include, for example, at least one processor 752, 850, and 1050 in Figures 7A, 7B, 8, and 10 that can be configured using computer-readable code as discussed herein.

在一些實施方案中,該方法可藉由例如使用如參考圖5A至圖5E所討論之調變干涉儀500或非平衡光纖干涉儀,調變照明光或藉由來自樣本之經反射樣本光與經反射參考光產生干涉所產生之干涉光之光譜的週期性,來通過樣本之深度掃描藉由來自樣本之經反射樣本光與來自參考鏡之經反射參考光產生干涉所產生之一或多個相干包絡。In some embodiments, the method can be performed by depth scanning of the sample to obtain one or more coherent envelopes generated by interference between reflected sample light from the sample and reflected reference light from a reference mirror by modulating the periodicity of the spectrum of illumination light or interference light generated by interference between reflected sample light from the sample and reflected reference light, for example using a modulation interferometer 500 or an unbalanced fiber optic interferometer as discussed with reference to FIGS. 5A to 5E .

圖17係繪示利用干涉儀特徵化包括複數個結構之樣本之區域之方法的流程圖,該方法可例如使用關於圖9及圖11A至圖11C所討論之干涉物鏡,分別由圖7A、圖8、及圖10中所繪示之干涉儀700、800、及1000中之任一者執行。在一些實施方案中,複數個結構可係溝槽、孔洞、及高縱橫比(HAR)結構中之至少一者。例如,HAR結構可具有5 µm或更小之寬度及30 µm或更大之深度。FIG17 is a flow chart illustrating a method for characterizing a region of a sample including a plurality of structures using interferometry, which method may be performed, for example, by any of the interferometers 700, 800, and 1000 illustrated in FIG7A, FIG8, and FIG10, respectively, using the interferometric objectives discussed with respect to FIG9 and FIG11A-11C. In some embodiments, the plurality of structures may be at least one of trenches, holes, and high aspect ratio (HAR) structures. For example, the HAR structures may have a width of 5 μm or less and a depth of 30 μm or more.

如方塊1702所繪示,該方法包括將照明光分裂成待入射於樣本上並由該樣本反射的樣本光及待入射於參考鏡上並由該參考鏡反射的參考光,例如,如圖7A中之分光器714所繪示。舉實例而言,用於將照明光分裂成待入射於樣本上並由該樣本反射的樣本光及待入射至參考鏡上並由該參考鏡反射的參考光之構件可包括定位於物鏡下方之分光器(亦即,分光器係定位於物鏡與樣本之間),諸如圖8、圖9、圖10、圖11A、及圖11B中之分光器812、904、1024、1104、及1124,或者定位於物鏡上方之分光器(亦即,物鏡係定位於分光器與樣本之間),諸如圖11C中之分光器1154。As shown in block 1702, the method includes splitting the illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by the reference mirror, for example, as shown by the beam splitter 714 in FIG. 7A. For example, the components for splitting the illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by the reference mirror may include a beam splitter positioned below the objective lens (i.e., the beam splitter is positioned between the objective lens and the sample), such as the beam splitters 812, 904, 1024, 1104, and 1124 in Figures 8, 9, 10, 11A, and 11B, or a beam splitter positioned above the objective lens (i.e., the objective lens is positioned between the beam splitter and the sample), such as the beam splitter 1154 in Figure 11C.

如方塊1704所繪示,該方法包括利用具有第一數值孔徑之照明光學元件用樣本光照射樣本之區域,例如,如圖7A中之樣本光724所繪示。用於利用具有第一數值孔徑之照明光學元件用樣本光照射樣本之區域之構件可包括例如經定位以在收集透鏡下方提供照明光之光學元件,諸如分別在圖8及圖9中顯示之(多個)透鏡/分光器/樣本光811/812/825及908/904/907所繪示,或可包括例如經定位以在收集透鏡之前提供照明光之光學元件,諸如圖10中顯示之孔徑/物鏡/樣本光1012/1022/1023及在圖11A、圖11B、及圖11C中顯示之物鏡/樣本光1102/1107、1152/1157所繪示。As depicted at block 1704, the method includes illuminating a region of the sample with sample light using an illumination optical element having a first numerical aperture, for example, as depicted as sample light 724 in FIG. 7A. Components for illuminating an area of a sample with sample light using an illumination optical element having an aperture of a first numerical value may include, for example, an optical element positioned to provide illumination light below a collection lens, such as (multiple) lens/beamsplitter/sample light 811/812/825 and 908/904/907 shown in Figures 8 and 9, respectively, or may include, for example, an optical element positioned to provide illumination light before a collection lens, such as aperture/objective lens/sample light 1012/1022/1023 shown in Figure 10 and objective lens/sample light 1102/1107, 1152/1157 shown in Figures 11A, 11B, and 11C.

在方塊1706處,該方法包括將收集光學元件聚焦於相對於樣本之焦點位置處,該收集光學元件具有大於第一數值孔徑之第二數值孔徑,例如,如圖7A中之經收集光726所繪示。在一些實施方案中,收集光學元件可係邁克生物鏡、米勞物鏡、或林尼克物鏡中之一者。用於將收集光學元件聚焦於相對於樣本之焦點位置處,該收集光學元件具有大於第一數值孔徑之第二數值孔徑之構件可包括例如分別在圖8、圖9、圖10、圖11A、圖11B、及圖11C中顯示之物鏡/經收集光822/829、902/909、1022/1029、1102/1109、1122/1129、及1152/1159。At block 1706, the method includes focusing a collection optical element at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture, for example, as depicted by collected light 726 in FIG 7A. In some embodiments, the collection optical element can be one of a Michaelisoscope, a Milbescope, or a Linnik objective. Components for focusing the collecting optical element at a focal position relative to the sample, the collecting optical element having a second numerical aperture greater than the first numerical aperture may include, for example, objective lenses/collected light 822/829, 902/909, 1022/1029, 1102/1109, 1122/1129, and 1152/1159 shown in Figures 8, 9, 10, 11A, 11B, and 11C, respectively.

在方塊1708處,該方法包括改變樣本光與參考光之間之光學路徑差,同時不改變收集光學元件相對於樣本之焦點位置,例如,如圖7A中之箭頭721所繪示。用於改變樣本光與參考光之間之光學路徑差,同時不改變收集光學元件相對於樣本之焦點位置之構件可包括例如圖8、圖9、圖10、圖11A、圖11B、及圖11C中顯示之移動參考鏡716、826、906、1026、1106、1126、及1156,及/或圖10及圖11A中顯示之移動分光器1024及1104,及/或圖8及圖10中改變照明光之光譜之光源810或1010。At block 1708, the method includes changing the optical path difference between the sample light and the reference light while not changing the focal position of the collection optical element relative to the sample, for example, as shown by arrow 721 in Figure 7A. Means for changing the optical path difference between the sample light and the reference light while not changing the focal position of the collection optical element relative to the sample may include, for example, the moving reference mirrors 716, 826, 906, 1026, 1106, 1126, and 1156 shown in Figures 8, 9, 10, 11A, 11B, and 11C, and/or the moving beam splitters 1024 and 1104 shown in Figures 10 and 11A, and/or the light source 810 or 1010 in Figures 8 and 10 that changes the spectrum of the illumination light.

如方塊1710所繪示,該方法包括:利用收集光學元件對與來自參考鏡之經反射參考光以複數個光學路徑差產生干涉之來自樣本之經反射樣本光進行成像,以產生多個影像,例如,如圖7A及在圖15中顯示之干涉光722及偵測器720所繪示。用於利用收集光學元件對與來自參考鏡之經反射參考光以複數個光學路徑差產生干涉之來自樣本之經反射樣本光進行成像以產生多個影像之構件可包括例如如圖8中之物鏡822、透鏡842、及偵測器840,或圖10中之物鏡1022、透鏡1042、及偵測器1040。As shown in block 1710, the method includes imaging the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror by a plurality of optical path differences using a collection optical element to generate a plurality of images, for example, as shown in FIG. 7A and the interference light 722 and the detector 720 shown in FIG. 15. The components for imaging the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror by a plurality of optical path differences using a collection optical element to generate a plurality of images may include, for example, the objective lens 822, the lens 842, and the detector 840 in FIG. 8, or the objective lens 1022, the lens 1042, and the detector 1040 in FIG.

如方塊1712所繪示,該方法包括分析包括複數個結構之樣本之區域的多個影像以特徵化樣本之區域,例如,如參考圖7A所顯示之處理系統750所討論。用於分析包括複數個結構之樣本之區域的多個影像以特徵化樣本之區域之構件,可包括例如圖7A、圖8、及圖10中可用如本文所討論之電腦可讀程式碼組態的至少一個處理器752、850、及1050。As indicated at block 1712, the method includes analyzing a plurality of images of a region of a sample including a plurality of structures to characterize the region of the sample, for example, as discussed with reference to the processing system 750 shown in FIG7A. Means for analyzing a plurality of images of a region of a sample including a plurality of structures to characterize the region of the sample may include, for example, at least one processor 752, 850, and 1050 of FIG7A, FIG8, and FIG10 that may be configured with computer readable code as discussed herein.

圖18係繪示利用干涉儀特徵化包括複數個結構之樣本之區域之方法的流程圖,該方法可例如使用關於圖5A至圖5E所討論之週期光譜之調變,由圖7B所顯示之干涉儀700'執行。在一些實施方案中,複數個結構可係溝槽、孔洞、及高縱橫比(HAR)結構中之至少一者。例如,HAR結構可具有5 µm或更小之寬度及30 µm或更大之深度。FIG. 18 is a flow chart illustrating a method for characterizing a region of a sample including a plurality of structures using interferometry, which method may be performed, for example, by the interferometer 700' shown in FIG. 7B using modulation of the periodic spectrum discussed with respect to FIG. 5A-5E. In some embodiments, the plurality of structures may be at least one of trenches, holes, and high aspect ratio (HAR) structures. For example, the HAR structures may have a width of 5 μm or less and a depth of 30 μm or more.

如方塊1802所繪示,該方法包括將照明光分裂成待入射於樣本上並由該樣本反射的樣本光及待入射於參考鏡上並由該參考鏡反射的參考光,例如,如圖7B中之分光器714所繪示。舉實例而言,用於將照明光分裂成待入射於樣本上並由該樣本反射的樣本光及待入射至參考鏡上並由該參考鏡反射的參考光之構件可包括定位於物鏡下方之分光器(亦即,分光器係定位於物鏡與樣本之間),諸如圖8、圖9、圖10、圖11A、及圖11B中之分光器812、904、1024、1104、及1124,或者定位於物鏡上方之分光器(亦即,物鏡係定位於分光器與樣本之間),諸如圖11C中之分光器1154。As shown in block 1802, the method includes splitting the illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by the reference mirror, for example, as shown by the beam splitter 714 in FIG. 7B. For example, the components for splitting the illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by the reference mirror may include a beam splitter positioned below the objective lens (i.e., the beam splitter is positioned between the objective lens and the sample), such as the beam splitters 812, 904, 1024, 1104, and 1124 in Figures 8, 9, 10, 11A, and 11B, or a beam splitter positioned above the objective lens (i.e., the objective lens is positioned between the beam splitter and the sample), such as the beam splitter 1154 in Figure 11C.

如方塊1804所繪示,該方法包括利用具有第一數值孔徑之照明光學元件用樣本光照射樣本之區域,例如,如圖7B中之樣本光724所繪示。用於利用具有第一數值孔徑之照明光學元件用樣本光照射樣本之區域之構件可包括例如經定位以在收集透鏡下方提供照明光之光學元件,諸如分別在圖8及圖9中顯示之(多個)透鏡/分光器/樣本光811/812/825及908/904/907所繪示,或可包括例如經定位以在收集透鏡之前提供照明光之光學元件,諸如圖10中顯示之孔徑/物鏡/樣本光1012/1022/1023及在圖11A、圖11B、及圖11C中顯示之物鏡/樣本光1102/1107、1152/1157所繪示。As depicted at block 1804, the method includes illuminating a region of the sample with sample light using an illumination optical element having a first numerical aperture, for example, as depicted as sample light 724 in FIG. 7B. Components for illuminating an area of a sample with sample light using an illumination optical element having an aperture of a first numerical value may include, for example, an optical element positioned to provide illumination light below a collection lens, such as (multiple) lens/beamsplitter/sample light 811/812/825 and 908/904/907 shown in Figures 8 and 9, respectively, or may include, for example, an optical element positioned to provide illumination light before a collection lens, such as aperture/objective lens/sample light 1012/1022/1023 shown in Figure 10 and objective lens/sample light 1102/1107, 1152/1157 shown in Figures 11A, 11B, and 11C.

在方塊1806處,該方法包括將收集光學元件聚焦於相對於樣本之焦點位置處,該收集光學元件具有大於第一數值孔徑之第二數值孔徑,例如,如圖7B中之經收集光726所繪示。在一些實施方案中,收集光學元件可係邁克生物鏡、米勞物鏡、或林尼克物鏡中之一者。用於將收集光學元件聚焦於相對於樣本之焦點位置處,該收集光學元件具有大於第一數值孔徑之第二數值孔徑之構件可包括例如分別在圖8、圖9、圖10、圖11A、圖11B、及圖11C中顯示之物鏡/經收集光822/829、902/909、1022/1029、1102/1109、1122/1129、及1152/1159。At block 1806, the method includes focusing a collection optical element at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture, for example, as depicted by collected light 726 in Figure 7B. In some embodiments, the collection optical element can be one of a Michaelisoscope, a Milbescope, or a Linnik objective. Components for focusing the collecting optical element at a focal position relative to the sample, the collecting optical element having a second numerical aperture greater than the first numerical aperture may include, for example, objective lenses/collected light 822/829, 902/909, 1022/1029, 1102/1109, 1122/1129, and 1152/1159 shown in Figures 8, 9, 10, 11A, 11B, and 11C, respectively.

在方塊1808處,該方法包括:調變照明光或藉由來自樣本之經反射樣本光與來自參考鏡之經反射參考光產生干涉所產生之干涉光之光譜的週期性,同時不改變該收集光學元件相對於樣本之該焦點位置,例如,如圖7B中之箭頭721所繪示。用於調變照明光或藉由來自樣本之經反射樣本光與來自參考鏡之經反射參考光產生干涉所產生之干涉光之光譜的週期性,同時不改變收集光學元件相對於樣本之焦點位置之構件,可包括例如如參考圖5A至圖5E所討論之調變干涉儀500或非平衡光纖干涉儀。At block 1808, the method includes modulating the periodicity of the spectrum of illumination light or interference light generated by interference of reflected sample light from the sample with reflected reference light from the reference mirror without changing the focal position of the collection optical element relative to the sample, for example, as shown by arrow 721 in FIG. 7B. Means for modulating the periodicity of the spectrum of illumination light or interference light generated by interference of reflected sample light from the sample with reflected reference light from the reference mirror without changing the focal position of the collection optical element relative to the sample may include, for example, the modulation interferometer 500 or the unbalanced fiber interferometer discussed with reference to FIGS. 5A to 5E.

如方塊1810所繪示,該方法包括:利用收集光學元件對與來自參考鏡之經反射參考光以光之光譜的週期性之調變的複數個變化產生干涉之來自樣本之經反射樣本光進行成像,以產生多個影像,例如,如圖7B及圖15中所顯示之干涉光722及偵測器720所繪示。用於利用收集光學元件對與來自參考鏡之經反射參考光以光之光譜的週期性之調變的複數個變化產生干涉之來自樣本之經反射樣本光進行成像以產生多個影像之構件,可包括例如如圖8之物鏡822、透鏡842、及偵測器840,或圖10中之物鏡1022、透鏡1042、及偵測器1040。As shown in block 1810, the method includes: using a collecting optical element to image the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror with multiple changes in the periodic modulation of the light spectrum to produce multiple images, for example, as shown by the interference light 722 and the detector 720 shown in Figures 7B and 15. Components for imaging the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror by multiple changes in the periodic modulation of the light spectrum using collecting optical elements to produce multiple images may include, for example, the objective lens 822, lens 842, and detector 840 in Figure 8, or the objective lens 1022, lens 1042, and detector 1040 in Figure 10.

如方塊1812所繪示,該方法包括分析包括複數個結構之樣本之區域的多個影像以特徵化樣本之區域,例如,如參考圖7B所顯示之處理系統750所討論。用於分析包括複數個結構之樣本之區域的多個影像以特徵化樣本之區域之構件,可包括例如圖7B中可用如本文所討論之電腦可讀程式碼組態的至少一個處理器752。As indicated at block 1812, the method includes analyzing a plurality of images of a region of a sample including a plurality of structures to characterize the region of the sample, for example, as discussed with reference to the processing system 750 shown in FIG7B. The means for analyzing a plurality of images of a region of a sample including a plurality of structures to characterize the region of the sample may include, for example, at least one processor 752 of FIG7B that may be configured with computer readable code as discussed herein.

所屬技術領域中具有通常知識者將理解,本揭露之前述實施方案提供許多替代方案及修改,其亦視為在本揭露之範疇內。例如,本揭露全文係在無光偏振之情況下進行描述,但是若需要,可使用干涉光束中之正交偏振光並使用偏振像素化攝影機來分析影像。上文描述係意欲為說明性且非限制性。例如,上述實例(或其一或多個態樣)可彼此組合使用。可諸如藉由所屬技術領域中具有通常知識者檢視上文敘述來使用其他實施方案。此外,各種特徵可分組在一起,且可使用少於具體所揭示實施方案之所有特徵。因此,下列態樣特此作為實例或實施方式併入至上文描述中,其中各態樣獨立地作為一單獨實施方案,且預期此類實施方案可在各種組合或排列中與彼此組合。因此,隨附申請專利範圍之精神及範疇不應限於前述說明。Those of ordinary skill in the art will appreciate that the foregoing embodiments of the present disclosure provide many alternatives and modifications, which are also considered to be within the scope of the present disclosure. For example, the entire disclosure is described in the absence of light polarization, but if desired, orthogonal polarized light in an interfering beam can be used and a polarization pixelated camera can be used to analyze the image. The above description is intended to be illustrative and non-limiting. For example, the above examples (or one or more aspects thereof) can be used in combination with each other. Other embodiments can be used as reviewed by those of ordinary skill in the art. In addition, various features can be grouped together, and less than all features of the specific disclosed embodiments can be used. Therefore, the following aspects are hereby incorporated into the above description as examples or implementations, wherein each aspect is independently a separate implementation, and it is expected that such implementations can be combined with each other in various combinations or arrangements. Therefore, the spirit and scope of the appended claims should not be limited to the foregoing description.

100:干涉儀 102:樣本 110:寬頻光源 112:分光器 120:干涉物鏡 122:物鏡 123:經反射參考光束 124:分光器 125:樣本光束 125r:經反射樣本光束 126:參考鏡 128:致動器 129:箭頭 140:偵測器 142:透鏡 150:處理系統 202:樣本 210:干涉物鏡 212:樣本光束 213:焦點位置 218:箭頭 220A,220B,220C:干涉信號 302:樣本 304:結構 310:米勞干涉物鏡;干涉物鏡 312:箭頭 402:樣本 404:矽通孔 406:頂部表面 408:底部表面 410:掃描電子顯微鏡橫截面輪廓 420:低相干干涉儀橫截面輪廓 430:低相干干涉儀條紋相關圖 450:低相干干涉儀條紋 452:顶部條紋 454:底部條紋 460:低相干干涉儀條紋 462:顶部條紋 464:底部條紋 466:重影條紋 500:調變干涉儀 504:分光器 506:返回鏡 507:致動器 508:返回鏡 520:光譜調變器 522:色散光學元件 524:空間光調變器 526:重新組合光學元件 550:低相干條紋 552:低相干條紋;中條紋 554:低相干條紋;外側條紋 556:低相干條紋;外側條紋 562:輸入光 564:輸出光 602:光源 612,632:光學元件 610,620,630:系統 614:光源孔徑 624:光源孔徑 700,700':干涉儀 702:樣本 704:結構 710,710':光學頭 712:光源 713:干涉物鏡 714:分光器 715:參考光 716:參考鏡 717:樣本光 718:物鏡 719:孔徑 720:偵測器 721:箭頭 722:干涉光 724:陰影樣本光;樣本光 726:經收集光 730:台座 732: 夾盤 750:處理系統 752:處理器 754:記憶體 756:顯示器 757:通訊埠 758:輸入裝置 759:非暫時性電腦可用儲存媒體 772,782:調變光學元件 784,786,788:鏡 800:干涉儀 802:樣本 810:光源 811:透鏡 812:分光器 820:干涉物鏡 822:物鏡 823:參考光 825:樣本光 826:參考鏡 827:箭頭 828:致動器 829:經收集光 830:總成 831:致動器 832:箭頭 840:偵測器 842:透鏡 850:處理器 900:干涉物鏡 901:樣本 902:物鏡 904:分光器 905:參考光 906:參考鏡 907:樣本光 908:透鏡 909:經收集光 1000:干涉儀 1002:樣本 1010:光源 1011:透鏡 1012:孔徑 1014:分光器 1020:干涉物鏡 1022:物鏡 1023:參考光 1024:分光器 1025:樣本光 1026:參考鏡 1028:致動器 1029:經收集光 1040:偵測器 1042:透鏡 1050:處理器 1100:干涉物鏡 1101:樣本 1102:物鏡 1104:分光器 1105:參考光 1106:參考鏡 1107:樣本光 1109:經收集光 1120:干涉物鏡 1121:樣本 1122:物鏡 1124:分光器 1125:參考光 1126:參考鏡 1127:樣本光 1129:經收集光 1150:干涉物鏡 1151:樣本 1152,1153:匹配物鏡 1154:分光器 1155:參考光 1156:參考鏡 1157:樣本光 1159:經收集光 1200:結構 1202:頂部表面 1204:底部表面 1210:相關圖 1212:頂部條紋 1214:底部條紋 1220:參考鏡 1222:距離 1230:相關圖 1232:頂部條紋 1234:底部條紋 1240:第一參考鏡 1242:距離 1244:第二參考鏡 1246:距離 1300:干涉物鏡 1301:樣本 1303:照明光 1304:分光器 1305:參考光 1306:第二分光器 1307:樣本光 1308:參考鏡;第一參考鏡 1310:參考鏡;第二參考鏡 1320:干涉物鏡 1321:樣本 1323:照明光 1324:第一分光器 1325:參考光 1326:第一參考鏡 1327:樣本光 1330:第二參考鏡 1350:干涉物鏡 1351:樣本 1353:照明光 1354:第一分光器 1355:參考光 1356:玻璃板 1357:樣本光 1358:第一參考鏡 1360:第二參考鏡 1402:相關圖 1402b:底部條紋 1404:相關圖 1404b:底部條紋 1402t,1404t:可見條紋 1412:相關圖 1414:相關圖 1412t,1414t:可見條紋 1414b:底部條紋 1424:相關圖 1424t:可見條紋 1424b:底部條紋 1500:影像集合 1500A,1500B,1500C:影像 1502:結構 1602:流程方塊 1604:流程方塊 1606:流程方塊 1608:流程方塊 1610:流程方塊 1612:流程方塊 1702:流程方塊 1704:流程方塊 1706:流程方塊 1708:流程方塊 1710:流程方塊 1712:流程方塊 1802:流程方塊 1804:流程方塊 1806:流程方塊 1808:流程方塊 1810:流程方塊 1812:流程方塊 fl1:焦距 fl2:焦距 α:角度 β1:角度 β2:角度 100: interferometer 102: sample 110: broadband light source 112: beam splitter 120: interferometer lens 122: objective lens 123: reflected reference beam 124: beam splitter 125: sample beam 125r: reflected sample beam 126: reference lens 128: actuator 129: arrow 140: detector 142: lens 150: processing system 202: sample 210: interferometer lens 212: sample beam 213: focal position 218: arrow 220A, 220B, 220C: interference signal 302: sample 304: structure 310: Milhaud interferometer; interferometer 312: arrow 402: sample 404: through-silicon via 406: top surface 408: bottom surface 410: scanning electron microscope cross-sectional profile 420: low coherence interferometer cross-sectional profile 430: low coherence interferometer stripe correlation diagram 450: low coherence interferometer stripe 452: top stripe 454: bottom stripe 460: low coherence interferometer stripe 462: top stripe 464: bottom stripe 466: ghost stripe 500: modulation interferometer 504: beam splitter 506: return mirror 507: actuator 508: return mirror 520: spectrum modulator 522: dispersion optical element 524: spatial light modulator 526: recombinant optical element 550: low coherence stripe 552: low coherence stripe; middle stripe 554: low coherence stripe; outer stripe 556: low coherence stripe; outer stripe 562: input light 564: output light 602: light source 612,632: optical element 610,620,630: system 614: light source aperture 624: light source aperture 700,700': interferometer 702: sample 704: structure 710,710': optical head 712: light source 713: interference objective 714: spectrometer 715: reference light 716: reference lens 717: sample light 718: objective lens 719: aperture 720: detector 721: arrow 722: interference light 724: shadow sample light; sample light 726: collected light 730: stand 732: chuck 750: processing system 752: processor 754: memory 756: display 757: communication port 758: input device 759: non-temporary computer-usable storage medium 772,782: modulated optical element 784,786,788: mirror 800: interferometer 802: sample 810: light source 811: lens 812: beam splitter 820: interferometer lens 822: objective lens 823: reference light 825: sample light 826: reference lens 827: arrow 828: actuator 829: collected light 830: assembly 831: actuator 832: arrow 840: detector 842: lens 850: processor 900: interferometer lens 901: sample 902: objective lens 904: spectrometer 905: reference light 906: reference lens 907: sample light 908: lens 909: collected light 1000: interferometer 1002: sample 1010: light source 1011: lens 1012: aperture 1014: spectrometer 1020: interferometer 1022: objective lens 1023: reference light 1024: spectrometer 1025: sample light 1026: reference lens 1028: actuator 1029: collected light 1040: detector 1042: lens 1050: Processor 1100: Interference objective 1101: Sample 1102: Objective 1104: Spectrometer 1105: Reference light 1106: Reference lens 1107: Sample light 1109: Collected light 1120: Interference objective 1121: Sample 1122: Objective 1124: Spectrometer 1125: Reference light 1126: Reference lens 1127: Sample light 1129: Collected light 1150: Interference objective 1151: Sample 1152,1153: Matching objective 1154: Spectrometer 1155: Reference light 1156: reference mirror 1157: sample light 1159: collected light 1200: structure 1202: top surface 1204: bottom surface 1210: correlation map 1212: top stripe 1214: bottom stripe 1220: reference mirror 1222: distance 1230: correlation map 1232: top stripe 1234: bottom stripe 1240: first reference mirror 1242: distance 1244: second reference mirror 1246: distance 1300: interferometer 1301: sample 1303: illumination light 1304: beam splitter 1305: reference light 1306: second beam splitter 1307: sample light 1308: reference mirror; first reference mirror 1310: reference mirror; second reference mirror 1320: interference objective 1321: sample 1323: illumination light 1324: first beam splitter 1325: reference light 1326: first reference mirror 1327: sample light 1330: second reference mirror 1350: interference objective 1351: sample 1353: illumination light 1354: first beam splitter 1355: reference light 1356: glass plate 1357: sample light 1358: First reference mirror 1360: Second reference mirror 1402: Correlation graph 1402b: Bottom stripe 1404: Correlation graph 1404b: Bottom stripe 1402t, 1404t: Visible stripe 1412: Correlation graph 1414: Correlation graph 1412t, 1414t: Visible stripe 1414b: Bottom stripe 1424: Correlation graph 1424t: Visible stripe 1424b: Bottom stripe 1500: Image collection 1500A, 1500B, 1500C: Image 1502: Structure 1602: Process block 1604: Process block 1606: Process block 1608: Process block 1610: Process block 1612: Process block 1702: Process block 1704: Process block 1706: Process block 1708: Process block 1710: Process block 1712: Process block 1802: Process block 1804: Process block 1806: Process block 1808: Process block 1810: Process block 1812: Process block fl1: focal length fl2: focal length α: angle β1: angle β2: angle

[圖1]繪示具有習知干涉物鏡之干涉儀的示意圖。 [圖2A]繪示習知干涉物鏡掃描焦點位置的操作。 [圖2B]繪示具有藉由掃描焦點位置產生之疊加干涉信號的樣本。 [圖3A]及[圖3B]繪示相對於樣本處於不同焦點位置的米勞(Mirau)干涉物鏡。 [圖4A]繪示樣本之掃描電子顯微鏡(scanning electron microscope, SEM)橫截面輪廓、對應低相干干涉儀(low coherence interferometer, LCI)橫截面輪廓、及繪示LCI條紋之對應相關圖。 [圖4B]及[圖4C]繪示由具有高縱橫比通孔之樣本產生的LCI條紋,所述通孔寬度分別為5 µm及1 µm。 [圖5A]繪示調變提供給計量干涉儀之光之光譜之調變干涉儀的示意圖。 [圖5B]繪示調變從計量干涉儀接收之光之光譜之調變干涉儀的示意圖。 [圖5C]繪示藉由調變光之光譜所產生的條紋。 [圖5D]繪示在藉由調變干涉儀調變光之光譜前的輸入光。 [圖5E]繪示輸出光,其顯示在藉由調變干涉儀調變光之光譜後的週期性光譜。 [圖6]繪示具有不同源大小及透鏡焦距之系統中之光束準直發散的實例。 [圖7A]繪示具有低NA照明光學元件及高NA收集光學元件之干涉儀的示意圖,該干涉儀藉由改變參考光與樣本光之間之光學路徑差同時維持收集光學元件之焦點位置來特徵化樣本上之結構。 [圖7B]繪示具有低NA照明光學元件及高NA收集光學元件之干涉儀的示意圖,該干涉儀藉由調變光之光譜的週期性同時維持收集光學元件之焦點位置來特徵化樣本上之結構。 [圖8]繪示向物鏡下方之干涉物鏡提供照明光之干涉儀的示意圖。 [圖9]繪示可搭配圖8所顯示之干涉儀使用之干涉物鏡的實施方案。 [圖10]繪示通過物鏡向干涉物鏡提供照明光之干涉儀的示意圖。 [圖11A]至[圖11C]繪示可搭配圖10所顯示之干涉儀使用之干涉物鏡的各種實施方案。 [圖12]繪示掃描單一參考光學路徑及掃描多個參考光學路徑之比較。 [圖13A]、[圖13B]、及[圖13C]繪示產生可搭配圖7A、圖7B、圖8、及圖10所顯示之干涉儀使用之多個參考光學路徑的不同實施方案。 [圖14A]、[圖14B]、及[圖14C]繪示如本文所討論之干涉儀之單一像素掃描所見之不同大小通孔之相關圖的實例。 [圖15]繪示如本文所討論之干涉儀所產生之多個影像中之樣本的全視場。 [圖16]至[圖18]係繪示如本文所討論利用干涉儀特徵化包括複數個結構之樣本之區域之方法的流程圖。 [Figure 1] shows a schematic diagram of an interferometer with a learned interferometer. [Figure 2A] shows the operation of scanning the focal position of the learned interferometer. [Figure 2B] shows a sample with superimposed interference signals generated by scanning the focal position. [Figure 3A] and [Figure 3B] show the Mirau interferometer at different focal positions relative to the sample. [Figure 4A] shows the scanning electron microscope (SEM) cross-sectional profile of the sample, the corresponding low coherence interferometer (LCI) cross-sectional profile, and the corresponding correlation diagram showing the LCI stripes. [FIG. 4B] and [FIG. 4C] show LCI fringes generated from a sample having high aspect ratio vias with a via width of 5 µm and 1 µm, respectively. [FIG. 5A] shows a schematic diagram of a modulation interferometer that modulates the spectrum of light provided to a metrology interferometer. [FIG. 5B] shows a schematic diagram of a modulation interferometer that modulates the spectrum of light received from a metrology interferometer. [FIG. 5C] shows fringes generated by modulating the spectrum of light. [FIG. 5D] shows input light before the spectrum of light is modulated by the modulation interferometer. [FIG. 5E] shows output light showing a periodic spectrum after the spectrum of light is modulated by the modulation interferometer. [Figure 6] shows an example of beam collimation divergence in a system with different source sizes and lens focal lengths. [Figure 7A] shows a schematic diagram of an interferometer with low NA illumination optics and high NA collection optics that characterizes structures on a sample by varying the optical path difference between reference and sample light while maintaining the focal position of the collection optics. [Figure 7B] shows a schematic diagram of an interferometer with low NA illumination optics and high NA collection optics that characterizes structures on a sample by modulating the periodicity of the spectrum of light while maintaining the focal position of the collection optics. [Figure 8] shows a schematic diagram of an interferometer providing illumination light to an interference objective below the objective. [FIG. 9] illustrates an embodiment of an interferometer objective that can be used with the interferometer shown in FIG. 8. [FIG. 10] illustrates a schematic diagram of an interferometer that provides illumination light to the interferometer objective through an objective lens. [FIG. 11A] to [FIG. 11C] illustrate various embodiments of an interferometer objective that can be used with the interferometer shown in FIG. 10. [FIG. 12] illustrates a comparison of scanning a single reference optical path and scanning multiple reference optical paths. [FIG. 13A], [FIG. 13B], and [FIG. 13C] illustrate different embodiments of generating multiple reference optical paths that can be used with the interferometers shown in FIG. 7A, FIG. 7B, FIG. 8, and FIG. 10. [FIG. 14A], [FIG. 14B], and [FIG. 14C] illustrate examples of correlation plots of vias of different sizes as seen in a single pixel scan of an interferometer as discussed herein. [FIG. 15] illustrates a full field of view of a sample in multiple images produced by an interferometer as discussed herein. [FIG. 16] to [FIG. 18] illustrate flow charts of a method for characterizing a region of a sample comprising multiple structures using an interferometer as discussed herein.

1702:流程方塊 1702: Process block

1704:流程方塊 1704: Process block

1706:流程方塊 1706: Process block

1708:流程方塊 1708: Process block

1710:流程方塊 1710: Process Block

1712:流程方塊 1712: Process Block

Claims (17)

一種利用干涉儀特徵化包含複數個結構之樣本之區域之方法,該方法包含: 將照明光分裂成待入射於該樣本上並由該樣本反射的樣本光及待入射於參考鏡上並由該參考鏡反射的參考光; 利用具有第一數值孔徑之照明光學元件用該樣本光照射該樣本之該區域; 將收集光學元件聚焦於相對於該樣本之焦點位置處,該收集光學元件具有大於該第一數值孔徑之第二數值孔徑; 改變該樣本光與該參考光之間之光學路徑差,同時不改變該收集光學元件相對於該樣本之該焦點位置; 利用該收集光學元件對與來自該參考鏡之經反射的該參考光以複數個光學路徑差產生干涉之來自該樣本之經反射的該樣本光進行成像,以產生多個影像;及 分析包含該複數個結構之該樣本之該區域的該多個影像以特徵化該樣本之該區域。 A method for characterizing a region of a sample containing a plurality of structures using an interferometer, the method comprising: splitting illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by a reference mirror; illuminating the region of the sample with the sample light using an illumination optical element having a first numerical aperture; focusing a collection optical element at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture; changing the optical path difference between the sample light and the reference light while not changing the focal position of the collection optical element relative to the sample; Using the collecting optical element to image the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror by a plurality of optical path differences to generate a plurality of images; and Analyzing the plurality of images of the region of the sample containing the plurality of structures to characterize the region of the sample. 如請求項1之方法,其進一步包含將該照明光提供至該干涉儀在該收集光學元件與該樣本之間的光學路徑中。The method of claim 1, further comprising providing the illumination light to the interferometer in an optical path between the collection optical element and the sample. 如請求項1之方法,其中改變該樣本光與該參考光之間的該光學路徑差,同時不改變該收集光學元件相對於該樣本之該焦點位置包含移動該參考鏡及移動分光器中之至少一者,該分光器將該照明光分裂成該樣本光及該參考光。A method as in claim 1, wherein changing the optical path difference between the sample light and the reference light while not changing the focal position of the collecting optical element relative to the sample includes moving the reference mirror and moving at least one of a beam splitter that splits the illumination light into the sample light and the reference light. 如請求項1之方法,其進一步包含: 將該參考光分裂以產生待入射於第二參考鏡上並由該第二參考鏡反射的第二參考光; 改變該樣本光與該第二參考光之間之第二光學路徑差,同時不改變該收集光學元件相對於該樣本之該焦點位置; 利用該收集光學元件對以複數個第二光學路徑差產生干涉之來自該樣本之經反射的該樣本光與來自該第二參考鏡之經反射的該第二參考光進行成像,以產生第二組多個影像;及 分析包含該複數個結構之該樣本之該區域的該第二組多個影像以特徵化該樣本之該區域。 The method of claim 1 further comprises: splitting the reference light to generate a second reference light to be incident on and reflected by a second reference mirror; changing the second optical path difference between the sample light and the second reference light while not changing the focal position of the collecting optical element relative to the sample; using the collecting optical element to image the reflected sample light from the sample and the reflected second reference light from the second reference mirror that interfere with a plurality of second optical path differences to generate a second set of multiple images; and analyzing the second set of multiple images of the region of the sample containing the plurality of structures to characterize the region of the sample. 如請求項4之方法,其中該第二光學路徑差不同於該光學路徑差,且其中在該多個影像中以光學路徑差產生干涉的來自該樣本之經反射的該樣本光與來自該參考鏡之經反射的該參考光產生對應於該樣本之一頂部表面的頂部干涉條紋,且在該第二組多個影像中以第二光學路徑差產生干涉的來自該樣本之經反射的該樣本光與來自該第二參考鏡之經反射的該第二參考光產生對應於該複數個結構之底部的底部干涉條紋。A method as claimed in claim 4, wherein the second optical path difference is different from the optical path difference, and wherein the reflected sample light from the sample and the reflected reference light from the reference mirror that interfere with each other due to the optical path difference in the multiple images generate top interference fringes corresponding to a top surface of the sample, and wherein the reflected sample light from the sample and the reflected second reference light from the second reference mirror that interfere with each other due to the second optical path difference in the second set of multiple images generate bottom interference fringes corresponding to the bottoms of the multiple structures. 如請求項1之方法,其進一步包含: 減小產生該照明光之光源的數值孔徑; 將該照明光提供至具有將該照明光引導至物鏡之分光器的該干涉儀之光學路徑中;及 其中具有該第一數值孔徑之該照明光學元件包含該光源之該數值孔徑及該物鏡; 其中具有大於該第一數值孔徑之該第二數值孔徑的該收集光學元件包含該物鏡。 The method of claim 1, further comprising: reducing the numerical aperture of the light source generating the illumination light; providing the illumination light to the optical path of the interferometer having a beam splitter that directs the illumination light to the objective lens; and wherein the illumination optical element having the first numerical aperture includes the numerical aperture of the light source and the objective lens; wherein the collection optical element having the second numerical aperture greater than the first numerical aperture includes the objective lens. 如請求項1之方法,其中該複數個結構包含溝槽、孔洞、及高縱橫比(HAR)結構中之至少一者,其中所述HAR結構具有5 µm或更小之寬度及30 µm或更大之深度。The method of claim 1, wherein the plurality of structures comprises at least one of a trench, a hole, and a high aspect ratio (HAR) structure, wherein the HAR structure has a width of 5 μm or less and a depth of 30 μm or greater. 如請求項1之方法,其進一步包含: 在該多個影像中偵測對應於該樣本之頂部表面的頂部干涉條紋; 在該多個影像中偵測對應於該複數個結構之底部的底部干涉條紋;及 基於所述頂部干涉條紋與所述底部干涉條紋之間的距離判定該複數個結構的深度。 The method of claim 1 further comprises: Detecting top interference fringes corresponding to the top surface of the sample in the plurality of images; Detecting bottom interference fringes corresponding to the bottom of the plurality of structures in the plurality of images; and Determining the depth of the plurality of structures based on the distance between the top interference fringes and the bottom interference fringes. 一種干涉儀,其經組態用於特徵化包含複數個結構之樣本的區域,該干涉儀包含: 用於將照明光分裂成待入射於該樣本上並由該樣本反射的樣本光及待入射於參考鏡上並由該參考鏡反射的參考光之構件; 用於利用具有第一數值孔徑之照明光學元件用該樣本光照射該樣本之該區域之構件; 用於將收集光學元件聚焦於相對於該樣本之焦點位置處之構件,該收集光學元件具有大於該第一數值孔徑之第二數值孔徑; 用於改變該樣本光與該參考光之間的光學路徑差且同時不改變該收集光學元件相對於該樣本之該焦點位置之構件; 用於利用該收集光學元件對與來自該參考鏡之經反射的該參考光以複數個光學路徑差產生干涉之來自該樣本之經反射的該樣本光進行成像以產生多個影像之構件;及 用於分析包含該複數個結構之該樣本之該區域的該多個影像以特徵化該樣本之該區域之構件。 An interferometer configured for characterizing a region of a sample comprising a plurality of structures, the interferometer comprising: a means for splitting illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by a reference mirror; a means for illuminating the region of the sample with the sample light using an illumination optical element having a first numerical aperture; a means for focusing a collection optical element at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture; a means for changing the optical path difference between the sample light and the reference light while not changing the focal position of the collection optical element relative to the sample; A component for imaging the sample light reflected from the sample that interferes with the reference light reflected from the reference mirror by a plurality of optical path differences using the collecting optical element to generate a plurality of images; and A component for analyzing the plurality of images of the region of the sample containing the plurality of structures to characterize the region of the sample. 如請求項9之干涉儀,其中用於將該照明光分裂成樣本光及參考光之該構件係定位於該收集光學元件與該樣本之間。An interferometer as claimed in claim 9, wherein the component for splitting the illumination light into sample light and reference light is positioned between the collecting optical element and the sample. 如請求項9之干涉儀,其中用於改變該樣本光與該參考光之間之該光學路徑差,同時不改變該收集光學元件相對於該樣本之該焦點位置之該構件執行移動該參考鏡及移動分光器中之至少一者,該分光器將該照明光分裂成該樣本光及該參考光。An interferometer as claimed in claim 9, wherein the component for changing the optical path difference between the sample light and the reference light while not changing the focal position of the collecting optical element relative to the sample performs at least one of moving the reference mirror and moving a beam splitter that splits the illumination light into the sample light and the reference light. 如請求項9之干涉儀,其進一步包含: 用於將該參考光分裂以產生待入射於一第二參考鏡上且由該第二參考鏡反射的第二參考光之構件; 用於改變該樣本光與該第二參考光之間的第二光學路徑差且同時不改變該收集光學元件相對於該樣本之該焦點位置之構件; 用於利用該收集光學元件對以複數個第二光學路徑差產生干涉的來自該樣本之經反射的該樣本光與來自該第二參考鏡之經反射的該第二參考光進行成像來產生第二組多個影像之構件;及 用於分析包含該複數個結構之該樣本之該區域的該第二組多個影像以特徵化該樣本之該區域之構件。 The interferometer of claim 9 further comprises: a component for splitting the reference light to generate a second reference light to be incident on a second reference mirror and reflected by the second reference mirror; a component for changing the second optical path difference between the sample light and the second reference light without changing the focal position of the collecting optical element relative to the sample; a component for generating a second set of multiple images by imaging the reflected sample light from the sample and the reflected second reference light from the second reference mirror that interfere with a plurality of second optical path differences using the collecting optical element; and a component for analyzing the second set of multiple images of the region of the sample containing the plurality of structures to characterize the region of the sample. 如請求項12之干涉儀,其中該第二光學路徑差不同於該光學路徑差,且其中在該多個影像中以光學路徑差產生干涉的來自該樣本之經反射樣本光與來自該參考鏡之經反射參考光產生對應於該樣本之一頂部表面的頂部干涉條紋,且在該第二組多個影像中以第二光學路徑差產生干涉的來自該樣本之經反射樣本光與來自該第二參考鏡之經反射第二參考光產生對應於該複數個結構之底部的底部干涉條紋。An interferometer as claimed in claim 12, wherein the second optical path difference is different from the optical path difference, and wherein the reflected sample light from the sample and the reflected reference light from the reference mirror that interfere with the optical path difference in the multiple images produce top interference fringes corresponding to a top surface of the sample, and wherein the reflected sample light from the sample and the reflected second reference light from the second reference mirror that interfere with the second optical path difference in the second set of multiple images produce bottom interference fringes corresponding to the bottoms of the multiple structures. 如請求項9之干涉儀,其進一步包含: 用於減小產生該照明光之光源的數值孔徑之構件; 用於將該照明光提供至將該照明光引導至物鏡的該干涉儀之光學路徑中之構件;及 其中具有該第一數值孔徑之該照明光學元件包含該光源之該數值孔徑及該物鏡; 其中具有大於該第一數值孔徑之該第二數值孔徑的該收集光學元件包含該物鏡。 The interferometer of claim 9 further comprises: a component for reducing the numerical aperture of the light source generating the illumination light; a component for providing the illumination light to the optical path of the interferometer that guides the illumination light to the objective lens; and wherein the illumination optical element having the first numerical aperture comprises the numerical aperture of the light source and the objective lens; wherein the collection optical element having the second numerical aperture greater than the first numerical aperture comprises the objective lens. 如請求項9之干涉儀,其中該複數個結構包含溝槽、孔洞、及高縱橫比(HAR)結構中之至少一者,其中所述HAR結構具有5 µm或更小的寬度及30 µm或更大的深度。The interferometer of claim 9, wherein the plurality of structures comprises at least one of a trench, a hole, and a high aspect ratio (HAR) structure, wherein the HAR structure has a width of 5 μm or less and a depth of 30 μm or greater. 如請求項9之干涉儀,其進一步包含: 用於在該多個影像中偵測對應於該樣本之頂部表面的頂部干涉條紋之構件; 用於在該多個影像中偵測對應於該複數個結構之底部的底部干涉條紋之構件;及 用於基於所述頂部干涉條紋與所述底部干涉條紋之間的距離判定該複數個結構的深度之構件。 The interferometer of claim 9 further comprises: a component for detecting top interference fringes corresponding to the top surface of the sample in the plurality of images; a component for detecting bottom interference fringes corresponding to the bottom of the plurality of structures in the plurality of images; and a component for determining the depth of the plurality of structures based on the distance between the top interference fringes and the bottom interference fringes. 一種干涉儀,其經組態用於特徵化包含複數個結構之樣本之區域,該干涉儀包含: 分光器,其經組態以將照明光分裂成待入射於該樣本上並由該樣本反射的樣本光及待入射於一參考鏡上並由該參考鏡反射的參考光; 具有第一數值孔徑之照明光學元件,其經組態以用該樣本光照射該樣本之該區域; 收集光學元件,其經組態以聚焦於相對於該樣本之焦點位置處,該收集光學元件具有大於該第一數值孔徑之第二數值孔徑; 致動器,其經組態以改變該樣本光與該參考光之間之光學路徑差,同時不改變該收集光學元件相對於該樣本之該焦點位置; 偵測器,其經組態以利用該收集光學元件對與來自該參考鏡之經反射參考光以複數個光學路徑差產生干涉之來自該樣本之經反射樣本光進行成像,以產生多個影像;及 至少一個處理器,其經組態以分析包含該複數個結構之該樣本之該區域的該多個影像以特徵化該樣本之該區域。 An interferometer configured to characterize a region of a sample comprising a plurality of structures, the interferometer comprising: a beam splitter configured to split illumination light into sample light to be incident on and reflected by the sample and reference light to be incident on and reflected by a reference mirror; an illumination optical element having a first numerical aperture configured to illuminate the region of the sample with the sample light; a collection optical element configured to focus at a focal position relative to the sample, the collection optical element having a second numerical aperture greater than the first numerical aperture; an actuator configured to change the optical path difference between the sample light and the reference light while not changing the focal position of the collection optical element relative to the sample; a detector configured to utilize the collecting optical element to image the reflected sample light from the sample that interferes with the reflected reference light from the reference mirror by a plurality of optical path differences to generate a plurality of images; and at least one processor configured to analyze the plurality of images of the region of the sample containing the plurality of structures to characterize the region of the sample.
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