TW202448601A - Mixed silver powder, method for producing mixed silver powder, and conductive paste - Google Patents
Mixed silver powder, method for producing mixed silver powder, and conductive paste Download PDFInfo
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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Abstract
Description
本發明是有關於一種混合銀粉、混合銀粉的製造方法以及導電糊。The present invention relates to a mixed silver powder, a method for manufacturing the mixed silver powder and a conductive paste.
將包含導電金屬粉末的導電糊塗佈或印刷於膜、基板、電子零件等的基材並進行加熱使其乾燥硬化,藉此形成電極或電配線等的方法自先前起便被廣泛使用。但是,隨著近年來的電子設備的高性能化,對使用導電糊形成的電極或電配線等要求更低的電阻,且該要求逐年變嚴。The method of applying or printing a conductive paste containing conductive metal powder on a base material such as a film, substrate, or electronic component and drying and curing it by heating to form electrodes or electrical wiring has been widely used since ancient times. However, with the recent improvement in the performance of electronic devices, electrodes and electrical wiring formed using conductive pastes are required to have lower resistance, and this requirement is becoming more stringent year by year.
對於所述要求,例如,於專利文獻1中,提出了如下內容:以獲得具有高的導電性(低電阻)的導電糊組成物為目的,將包含碎片狀銀粉末及球狀銀粉末且於碎片狀銀粉末及球狀銀粉末中的至少任一者的銀粉末的表面附著有多元羧酸的銀粉末用作導電金屬粉末。 [現有技術文獻] [專利文獻] In response to the above requirements, for example, Patent Document 1 proposes the following: for the purpose of obtaining a conductive paste composition having high conductivity (low resistance), a silver powder containing a fragmented silver powder and a spherical silver powder and having a polycarboxylic acid attached to the surface of at least one of the fragmented silver powder and the spherical silver powder is used as a conductive metal powder. [Prior Art Document] [Patent Document]
[專利文獻1]日本專利特開2011-100573號公報[Patent Document 1] Japanese Patent Publication No. 2011-100573
[發明所欲解決之課題][The problem that the invention wants to solve]
此處,關於現有的導電糊中可使用的銀粉末(銀粉),於降低使用導電糊形成的導電膜的比電阻這一方面有進一步的改善的餘地。Here, regarding the silver powder (silver powder) that can be used in the conventional conductive paste, there is room for further improvement in terms of reducing the specific resistance of a conductive film formed using the conductive paste.
因此,本發明的目的在於提供一種能夠降低導電膜的比電阻的混合銀粉。 另外,本發明的目的在於提供一種能夠降低導電膜的比電阻的混合銀粉的製造方法。 另外,本發明的目的在於提供一種能夠降低導電膜的比電阻的導電糊。 [解決課題之手段] Therefore, the object of the present invention is to provide a mixed silver powder capable of reducing the specific resistance of a conductive film. In addition, the object of the present invention is to provide a method for producing a mixed silver powder capable of reducing the specific resistance of a conductive film. In addition, the object of the present invention is to provide a conductive paste capable of reducing the specific resistance of a conductive film. [Means for Solving the Problem]
為了解決所述課題,本發明者等人反覆進行了努力研究,結果,本發明者等人完成了以下所述的本發明。In order to solve the above problems, the inventors have repeatedly conducted diligent research, and as a result, the inventors have completed the present invention described below.
即,用於解決所述課題的本發明的主旨結構如下所述。That is, the main structure of the present invention for solving the above-mentioned problems is as follows.
[1]一種混合銀粉,為包含第一銀粒子、第二銀粒子以及第三銀粒子的混合銀粉, 於對將所述混合銀粉埋入樹脂而成的樹脂塊的研磨剖面中的100個以上的銀粒子進行觀察, 並將對所述銀粒子的周長、以及 與所述銀粒子的外形外接且面積最小的長方形的長邊長度及短邊長度進行測定時的、 所述長邊長度為3 μm以上的銀粒子設為所述第一銀粒子、 將所述長邊長度為0.5 μm以上且小於3 μm的銀粒子設為所述第二銀粒子、 將所述長邊長度小於0.5 μm的銀粒子設為所述第三銀粒子的情況下, 所述第一銀粒子的縱橫比的平均值為2以上, 所述第二銀粒子的縱橫比的平均值為1.5以上且小於2, 所述第三銀粒子的縱橫比的平均值小於1.5, 所述第一銀粒子於所述混合銀粉中所佔的個數比例為0.5%以上且5%以下,所述第二銀粒子於所述混合銀粉中所佔的個數比例為10%以上,所述第三銀粒子於所述混合銀粉中所佔的個數比例為15%以上, 藉由以下的式(1): 比α=第二銀粒子的周長/(第二銀粒子的長邊長度×2+第二銀粒子的短邊長度×2)…(1) 計算出的比α的平均值為0.84以上, 於選自由所述第一銀粒子、所述第二銀粒子、及所述第三銀粒子所組成的群組中的至少一種銀粒子的表面附著有多元羧酸。 [1] A mixed silver powder comprising a first silver particle, a second silver particle and a third silver particle, wherein when observing more than 100 silver particles in a polished cross section of a resin block formed by embedding the mixed silver powder in a resin, and measuring the perimeter of the silver particles, and the long side length and short side length of a rectangle that circumscribes the outer shape of the silver particles and has the smallest area, the silver particles having a long side length of 3 μm or more are set as the first silver particles, the silver particles having a long side length of 0.5 μm or more and less than 3 μm are set as the second silver particles, and the silver particles having a long side length of less than 0.5 μm are set as the third silver particles, The average value of the aspect ratio of the first silver particles is greater than 2, The average value of the aspect ratio of the second silver particles is greater than 1.5 and less than 2, The average value of the aspect ratio of the third silver particles is less than 1.5, The number ratio of the first silver particles in the mixed silver powder is greater than 0.5% and less than 5%, the number ratio of the second silver particles in the mixed silver powder is greater than 10%, and the number ratio of the third silver particles in the mixed silver powder is greater than 15%, By the following formula (1): Ratio α = circumference of the second silver particle / (long side length of the second silver particle × 2 + short side length of the second silver particle × 2) ... (1) The calculated average value of the ratio α is greater than 0.84, A polycarboxylic acid is attached to the surface of at least one silver particle selected from the group consisting of the first silver particle, the second silver particle, and the third silver particle.
[2]如[1]所述的混合銀粉,其中於所述第一銀粒子及所述第二銀粒子的表面附著有多元羧酸。[2] The mixed silver powder as described in [1], wherein a polycarboxylic acid is attached to the surfaces of the first silver particles and the second silver particles.
[3]如[1]或[2]所述的混合銀粉,其中所述多元羧酸相對於所述第一銀粒子、所述第二銀粒子、及所述第三銀粒子的合計的含有比例為0.01質量%以上且0.15質量%以下。[3] The mixed silver powder according to [1] or [2], wherein the content ratio of the polycarboxylic acid relative to the total of the first silver particles, the second silver particles, and the third silver particles is 0.01 mass % or more and 0.15 mass % or less.
[4]如[1]至[3]中任一項所述的混合銀粉,其中所述多元羧酸為選自由草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十一烷二酸、十二烷二酸、蘋果酸、二乙基戊二酸、3-甲基己二酸、丁基丙二酸、馬來酸、二甘醇酸及檸檬酸所組成的群組中的至少一種多元羧酸。[4] The mixed silver powder as described in any one of [1] to [3], wherein the polycarboxylic acid is at least one polycarboxylic acid selected from the group consisting of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, apple acid, diethylglutaric acid, 3-methyladipic acid, butylmalonic acid, maleic acid, diglycolic acid and citric acid.
[5]一種混合銀粉的製造方法,製造如[1]至[4]中任一項所述的混合銀粉,所述製造方法包括: 混合步驟,將含有銀粒子A1及銀粒子A2的銀粉A、與包含銀粒子B的銀粉B混合而獲得混合物;以及 前處理步驟,於所述混合步驟之前,利用多元羧酸對所述銀粉A及所述銀粉B中的至少一者的銀粉進行表面處理劑附著處理,或者後處理步驟,利用多元羧酸對所述混合步驟中獲得的所述混合物進行表面處理劑附著處理, 於對將所述銀粉A埋入樹脂而成的樹脂塊的研磨剖面中的100個以上的銀粒子、與將所述銀粉B埋入樹脂而成的樹脂塊的研磨剖面中的100個以上的銀粒子分別進行觀察, 並對所述銀粒子的周長、以及 與所述銀粒子的外形外接且面積最小的長方形的長邊長度及短邊長度 進行測定的情況下, 所述銀粒子A1的縱橫比的平均值為2以上, 所述銀粒子A2的縱橫比的平均值小於2,且 藉由以下的式(2): 比β=銀粒子A2的周長/(銀粒子A2的長邊長度×2+銀粒子A2的短邊長度×2)…(2) 計算出的比β的平均值為0.84以上, 所述銀粒子B的縱橫比的平均值小於1.5。 [5] A method for producing a mixed silver powder, producing the mixed silver powder as described in any one of [1] to [4], the method comprising: a mixing step, mixing silver powder A containing silver particles A1 and silver particles A2 with silver powder B containing silver particles B to obtain a mixture; and a pre-treatment step, before the mixing step, performing a surface treatment agent attachment treatment on at least one of the silver powders A and B using a polycarboxylic acid, or a post-treatment step, performing a surface treatment agent attachment treatment on the mixture obtained in the mixing step using a polycarboxylic acid, When observing more than 100 silver particles in a polished cross section of a resin block formed by embedding the silver powder A in resin and more than 100 silver particles in a polished cross section of a resin block formed by embedding the silver powder B in resin, respectively, and measuring the perimeter of the silver particles, and the length of the long side and the length of the short side of a rectangle circumscribing the outer shape of the silver particles and having the smallest area, the average value of the aspect ratio of the silver particles A1 is greater than 2, the average value of the aspect ratio of the silver particles A2 is less than 2, and by the following formula (2): ratio β = perimeter of silver particle A2/(length of the long side of silver particle A2 × 2 + length of the short side of silver particle A2 × 2)…(2) The calculated average value of the ratio β is greater than 0.84, and the average value of the aspect ratio of the silver particles B is less than 1.5.
[6]如[5]所述的混合銀粉的製造方法,包括所述前處理步驟, 於所述前處理步驟中,利用所述多元羧酸對所述銀粉A進行表面處理劑附著處理。 [6] The method for producing mixed silver powder as described in [5] comprises the pretreatment step, In the pretreatment step, the silver powder A is subjected to a surface treatment agent attachment treatment using the polycarboxylic acid.
[7]如[5]或[6]所述的混合銀粉的製造方法,其中所述多元羧酸相對於所述銀粉A及所述銀粉B的合計的使用率為0.01質量%以上且0.15質量%以下。[7] The method for producing a mixed silver powder according to [5] or [6], wherein the usage ratio of the polycarboxylic acid relative to the total of the silver powder A and the silver powder B is 0.01 mass % or more and 0.15 mass % or less.
[8]如[5]至[7]中任一項所述的混合銀粉的製造方法,其中所述表面處理劑附著處理中使用的所述多元羧酸為選自由草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十一烷二酸、十二烷二酸、蘋果酸、二乙基戊二酸、3-甲基己二酸、丁基丙二酸、馬來酸、二甘醇酸及檸檬酸所組成的群組中的至少一種多元羧酸。[8] A method for producing a mixed silver powder as described in any one of [5] to [7], wherein the polycarboxylic acid used in the surface treatment agent adhesion treatment is at least one polycarboxylic acid selected from the group consisting of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, apple acid, diethylglutaric acid, 3-methyladipic acid, butylmalonic acid, maleic acid, diglycolic acid and citric acid.
[9]一種導電糊,包含如[1]至[4]中任一項所述的混合銀粉、黏合劑以及溶劑。 [發明的效果] [9] A conductive paste comprising the mixed silver powder, a binder and a solvent as described in any one of [1] to [4]. [Effect of the invention]
藉由本發明,可提供一種能夠降低導電膜的比電阻的混合銀粉。 另外,藉由本發明,可提供一種能夠降低導電膜的比電阻的混合銀粉的製造方法。 另外,藉由本發明,可提供一種能夠降低導電膜的比電阻的導電糊。 The present invention can provide a mixed silver powder capable of reducing the specific resistance of a conductive film. In addition, the present invention can provide a method for producing a mixed silver powder capable of reducing the specific resistance of a conductive film. In addition, the present invention can provide a conductive paste capable of reducing the specific resistance of a conductive film.
本發明的混合銀粉適合於作為導電糊用的導電填料的用途。使用本發明的混合銀粉的導電糊可用於在基板上的導電圖案的形成、或電極的形成。使用本發明的混合銀粉的導電糊可藉由利用例如網版印刷、平板印刷、光微影法等印刷於基板上,而形成導電圖案或電極等導電膜(以下,有時簡稱為「導電膜」)。 再者,本發明的混合銀粉例如可藉由本發明的混合銀粉的製造方法而獲得。 The mixed silver powder of the present invention is suitable for use as a conductive filler for a conductive paste. The conductive paste using the mixed silver powder of the present invention can be used to form a conductive pattern on a substrate or to form an electrode. The conductive paste using the mixed silver powder of the present invention can be printed on a substrate using, for example, screen printing, lithography, photolithography, etc. to form a conductive film such as a conductive pattern or an electrode (hereinafter, sometimes referred to as a "conductive film"). Furthermore, the mixed silver powder of the present invention can be obtained, for example, by the method for manufacturing the mixed silver powder of the present invention.
(用語及測定方法) 首先,於說明實施形態之前,說明本說明書中的用語及測定方法等。 (Terms and measurement methods) First, before explaining the implementation form, the terms and measurement methods used in this manual are explained.
<銀粒子的觀察> 於本說明書中,銀粒子的觀察可藉由如下方式來進行:首先,將混合銀粉或銀粉放入至樹脂及硬化劑中並加以固化,利用橫剖面拋光機(cross-section polisher)進行研磨,藉此使銀粒子的剖面露出,利用掃描式電子顯微鏡(Scanning Electron Microscope,SEM)對各銀粒子以規定的倍率(例如,5,000倍或3,000倍)進行觀察。此處,根據絕緣性的樹脂與導電性的銀粒子的對比度,銀粒子的輪廓清晰且可明確地視認到銀粒子的外周的銀粒子視為剖面露出的銀粒子。然後,對於在將混合銀粉或銀粉埋入樹脂而成的樹脂塊的研磨剖面中,自可明確地視認到外周的銀粒子中任意地選擇的100個以上的銀粒子,使用圖像分析軟體描摹銀粒子外周,藉此可測定各銀粒子的長方形的長邊長度(以下,有時簡稱為「長邊長度」)、長方形的短邊長度(以下,有時簡稱為「短邊長度」)、周長、銀粒子的面積、銀粒子的最大長度。 再者,作為所述樹脂及硬化劑,例如可使用司特爾(Struers)公司製造的「艾泊費庫斯(EpoFix)樹脂」及「艾泊費庫斯(EpoFix)硬化劑」。 另外,作為所述橫剖面拋光機,例如可使用日本高新技術(High-technologies)公司製造的「亞布萊德(ArBlade)5000」。 另外,作為所述掃描式電子顯微鏡,例如可使用日本電子股份有限公司製造的「JEOL JSM-IT300LV」。 另外,作為所述圖像分析軟體,例如可使用貿泰科(MOUNTECH)股份有限公司製造的「圖像分析式粒度分佈測定軟體Mac-View」。 <Observation of Silver Particles> In this specification, observation of silver particles can be performed as follows: First, a mixed silver powder or silver powder is placed in a resin and a hardener and cured, and polished using a cross-section polisher to expose the cross section of the silver particles, and each silver particle is observed at a predetermined magnification (e.g., 5,000 times or 3,000 times) using a scanning electron microscope (SEM). Here, based on the contrast between the insulating resin and the conductive silver particles, the silver particles whose outlines are clear and whose peripheries can be clearly seen are considered to be silver particles whose cross sections are exposed. Then, in the polished cross section of the resin block formed by embedding the mixed silver powder or the silver powder in the resin, 100 or more silver particles are randomly selected from the silver particles whose periphery can be clearly seen, and the periphery of the silver particles is traced using image analysis software, thereby measuring the length of the long side of the rectangle of each silver particle (hereinafter, sometimes referred to as "long side length"), the length of the short side of the rectangle (hereinafter, sometimes referred to as "short side length"), the perimeter, the area of the silver particle, and the maximum length of the silver particle. Furthermore, as the resin and hardener, for example, "EpoFix resin" and "EpoFix hardener" manufactured by Struers can be used. In addition, as the cross-sectional polisher, for example, "ArBlade 5000" manufactured by Japan High-technologies Corporation can be used. In addition, as the scanning electron microscope, for example, "JEOL JSM-IT300LV" manufactured by JEOL Ltd. can be used. In addition, as the image analysis software, for example, "Image Analysis Particle Size Distribution Measurement Software Mac-View" manufactured by MOUNTECH Co., Ltd. can be used.
此處,參照圖1,對與銀粒子剖面的外形外接且面積最小的長方形的長邊長度及短邊長度的確定方法進行說明。 如圖1所示,首先,選擇(100個以上)作為測定對象的銀粒子。繼而,使所選擇的銀粒子旋轉360度,同時製成與銀粒子的外形外接的所有長方形。然後,自該些長方形中取出面積最小的長方形,確定該長方形的長邊長度及短邊長度。 Here, referring to FIG1, the method for determining the length of the long side and the short side of the rectangle with the smallest area that circumscribes the outer shape of the cross section of the silver particle is described. As shown in FIG1, first, select (more than 100) silver particles as the measurement object. Then, rotate the selected silver particles 360 degrees, and simultaneously make all rectangles circumscribing the outer shape of the silver particles. Then, take out the rectangle with the smallest area from these rectangles, and determine the length of the long side and the short side of the rectangle.
<縱橫比的平均值> 於本說明書中,所謂「縱橫比」,是長邊長度相對於短邊長度的比(長邊長度/短邊長度),所謂「縱橫比的平均值」,是指按照長邊長度的值劃分的範圍內的銀粒子的各縱橫比的平均值。 <Average value of aspect ratio> In this specification, the so-called "aspect ratio" is the ratio of the long side length to the short side length (long side length/short side length), and the so-called "average value of aspect ratio" refers to the average value of each aspect ratio of the silver particles within the range divided by the value of the long side length.
<短邊長度的平均值> 於本說明書中,所謂「短邊長度的平均值」,是指按照長邊長度的值劃分的範圍內的銀粒子的各短邊長度的平均值。 <Average value of short side length> In this specification, the "average value of short side length" refers to the average value of the length of each short side of the silver particles within the range divided according to the value of the long side length.
<形狀係數的平均值> 於本說明書中,所謂「形狀係數」,是指藉由「π×(銀粒子的最大長度/2) 2/銀粒子的面積」計算出的形狀係數,所謂「形狀係數的平均值」,是按照長邊長度的值劃分的範圍內的銀粒子的各形狀係數的平均值。再者,銀粒子的最大長度的單位為「μm」,銀粒子的面積的單位為「μm 2」。 <Average value of shape factor> In this specification, the "shape factor" refers to the shape factor calculated by "π×(maximum length of silver particle/2) 2 /area of silver particle", and the "average value of shape factor" refers to the average value of each shape factor of silver particles in the range divided according to the value of the long side length. The unit of the maximum length of silver particles is "μm", and the unit of the area of silver particles is "μm 2 ".
<粒度分佈的測定> 於本說明書中,混合銀粉的體積基準的累計10%粒子徑(D 10)、累計50%粒子徑(D 50)、累計90%粒子徑(D 90)、及累計95%粒子徑(D 95)、以及累計100%(即,最大粒子)的粒子徑(D MAX)是利用雷射繞射-散射式粒子徑分佈測定裝置(麥奇克拜爾(MicrotracBEL)股份有限公司製造,麥奇克(Microtrac)MT-3300 EXII)來測定。 <Measurement of Particle Size Distribution> In this specification, the volume-based cumulative 10% particle size ( D10 ), cumulative 50% particle size ( D50 ), cumulative 90% particle size ( D90 ), cumulative 95% particle size ( D95 ), and cumulative 100% (i.e., largest particle) particle size ( DMAX ) of the mixed silver powder are measured using a laser diffraction-scattering particle size distribution measuring device (Microtrac MT-3300 EXII, manufactured by MicrotracBEL Co., Ltd.).
<多元羧酸的含有比例的測定方法> 於本說明書中,「多元羧酸的含有比例」可藉由如下方式來測定:首先,自附著有多元羧酸的混合銀粉,使多元羧酸溶出至鹽酸中,繼而,於溶出有多元羧酸的鹽酸溶出液中對多元羧酸進行酯化,繼而,將酯化後的多元羧酸提取至有機溶媒中,繼而,根據多元羧酸酯的校準曲線來求出所提取的己二酸酯量,藉由換算計算來計算出多元羧酸量。例如,於多元羧酸為己二酸的情況下,己二酸的含有比例可依照日本專利特開2012-122880號公報中記載的己二酸的定量方法來測定。再者,於多元羧酸為己二酸的情況下,己二酸的含有比例亦可採用如下方法來測定:使用氯化氫-甲醇試劑將試樣銀粉表面的己二酸甲基化,將所生成的己二酸二甲酯提取至有機溶媒中,藉由氣相層析-質譜(Gas Chromatography-Mass Spectrometry,GC-MS)進行測定。 <Method for determining the content ratio of polycarboxylic acid> In this specification, the "content ratio of polycarboxylic acid" can be determined by the following method: first, polycarboxylic acid is dissolved in hydrochloric acid from a mixed silver powder to which polycarboxylic acid is attached, then the polycarboxylic acid is esterified in the hydrochloric acid solution in which the polycarboxylic acid is dissolved, then the esterified polycarboxylic acid is extracted into an organic solvent, then the amount of adipic acid ester extracted is obtained based on the calibration curve of polycarboxylic acid ester, and the amount of polycarboxylic acid is calculated by conversion calculation. For example, when the polycarboxylic acid is adipic acid, the content ratio of adipic acid can be determined according to the quantitative method of adipic acid described in Japanese Patent Laid-Open No. 2012-122880. Furthermore, when the polycarboxylic acid is adipic acid, the content ratio of adipic acid can also be determined by the following method: using hydrogen chloride-methanol reagent to methylate the adipic acid on the surface of the sample silver powder, extracting the generated dimethyl adipate into an organic solvent, and determining it by gas chromatography-mass spectrometry (GC-MS).
<布厄特(Brunauer-Emmett-Teller,BET)比表面積> 於本說明書中,「BET比表面積」可使用麥庫索布HM-型號1210(Macsorb HM-model 1210)(貿泰科(MOUNTECH)公司製造)並利用基於氮吸附的BET 1點法來測定。再者,於BET比表面積的測定中,測定前的脫氣條件為60℃、10分鐘。 <Brunauer-Emmett-Teller (BET) specific surface area> In this manual, "BET specific surface area" can be measured using Macsorb HM-model 1210 (manufactured by MOUNTECH) and the BET single-point method based on nitrogen adsorption. In the measurement of BET specific surface area, the degassing conditions before the measurement are 60°C and 10 minutes.
<混合銀粉的強熱減量(Ig-Loss)值> 於本說明書中,所謂「混合銀粉的強熱減量(Ig-Loss)值」,表示自室溫加熱至800℃時的質量的變化量,具體而言,表示混合銀粉所具有的銀以外的組成物的量,是表示混合銀粉中殘存的成分、例如於混合銀粉的製造過程中使用的處理劑或添加劑等殘存成分的量的多少的指標。而且,於本說明書中,「混合銀粉的強熱減量(Ig-Loss)值」可精密地秤量(秤量值:w1)混合銀粉試樣並放入至磁性坩堝中,加熱至800℃,然後以對於達到恆量而言充分的時間於800℃下保持30分鐘,其後進行冷卻並再次秤量(秤量值:w2),並根據「強熱減量(Ig-Loss)值(質量%)=(w1-w2)/w1×100」來計算出。 <Heat loss (Ig-Loss) value of mixed silver powder> In this manual, the so-called "heat loss (Ig-Loss) value of mixed silver powder" indicates the change in mass when heated from room temperature to 800°C. Specifically, it indicates the amount of components other than silver in the mixed silver powder, and is an indicator of the amount of residual components in the mixed silver powder, such as residual components such as treatment agents or additives used in the production process of the mixed silver powder. Moreover, in this manual, the "heat loss (Ig-Loss) value of the mixed silver powder" can be calculated by precisely weighing (weighing value: w1) the mixed silver powder sample and placing it in a magnetic crucible, heating it to 800°C, and then keeping it at 800°C for 30 minutes, which is sufficient time to achieve constant weight, and then cooling and weighing it again (weighing value: w2), and then according to "heat loss (Ig-Loss) value (mass %) = (w1-w2)/w1×100".
<混合銀粉的敲緊密度> 於本說明書中,「混合銀粉的敲緊密度」可使用例如敲緊密度測定裝置(柴山科學公司製造,容積比重測定裝置SS-DA-2),計量30 g銀粉試樣並放入至20 mL的試管中,以落差20 mm敲擊1,000次,並根據「敲緊密度=試樣質量(g)/敲擊後的試樣體積(mL)」來計算出。 <Tap density of mixed silver powder> In this manual, the "tap density of mixed silver powder" can be calculated by, for example, using a tap density measuring device (produced by Shibayama Scientific Co., Ltd., volumetric specific gravity measuring device SS-DA-2), weighing 30 g of silver powder sample and placing it in a 20 mL test tube, tapping it 1,000 times with a drop of 20 mm, and then calculating the tap density = sample mass (g) / sample volume after tapping (mL)".
<圓相當徑(海伍德(Heywood)徑)> 於本說明書中,「圓相當徑(Heywood徑)」可使用藉由觀察銀粒子的剖面而測定的銀粒子的面積來計算出。具體而言,可製成具有與該銀粒子的面積相同的面積的圓來求出圓相當徑(Heywood徑)。 <Circle equivalent diameter (Heywood diameter)> In this specification, the "circle equivalent diameter (Heywood diameter)" can be calculated using the area of the silver particle measured by observing the cross section of the silver particle. Specifically, the circle equivalent diameter (Heywood diameter) can be obtained by making a circle having the same area as the area of the silver particle.
<導電糊的黏度> 於本說明書中,「導電糊的黏度」可設為如下值:例如使用博勒飛(Brookfield)公司製造的5XHBDV-IIIUC作為旋轉式的黏度計,錐軸(cone spindle)使用CPE-52,將測定溫度設為25℃,將錐軸的轉數設為1 rpm,並使錐軸旋轉5分鐘時的值。 <Viscosity of conductive paste> In this manual, "viscosity of conductive paste" can be set to the following value: for example, using 5XHBDV-IIIUC manufactured by Brookfield as a rotational viscometer, using CPE-52 as a cone spindle, setting the measurement temperature to 25°C, setting the cone spindle speed to 1 rpm, and rotating the cone spindle for 5 minutes.
(混合銀粉) 本發明的混合銀粉為包含第一銀粒子、第二銀粒子以及第三銀粒子的混合銀粉,於對將混合銀粉埋入樹脂而成的樹脂塊的研磨剖面中的100個以上的銀粒子進行觀察,並將對銀粒子的周長、以及與銀粒子的外形外接且面積最小的長方形的長邊長度及短邊長度進行測定時的、長邊長度為3 μm以上的銀粒子設為第一銀粒子、將長邊長度為0.5 μm以上且小於3 μm的銀粒子設為第二銀粒子、將長邊長度小於0.5 μm的銀粒子設為第三銀粒子的情況下,第一銀粒子的縱橫比的平均值為2以上,第二銀粒子的縱橫比的平均值為1.5以上且小於2,第三銀粒子的縱橫比的平均值小於1.5,第一銀粒子於混合銀粉中所佔的個數比例為0.5%以上且5%以下,第二銀粒子於混合銀粉中所佔的個數比例為10%以上,第三銀粒子於混合銀粉中所佔的個數比例為15%以上,藉由以下的式(1): 比α=第二銀粒子的周長/(第二銀粒子的長邊長度×2+第二銀粒子的短邊長度×2)…(1) 計算出的比α(亦稱為矩形度)的平均值為0.84以上,於選自由第一銀粒子、第二銀粒子、及第三銀粒子所組成的群組中的至少一種銀粒子的表面附著有多元羧酸。 若為所述般的混合銀粉,則能夠降低導電膜的比電阻。推斷其理由在於:於導電膜中,比較小的第三銀粒子進入比較大且對於降低比電阻而言有利的第一銀粒子的間隙中,藉此導電膜的空間率減少,銀粉成為緻密的狀態,結果,導電膜中的沒有銀粒子的空間、即成為高電阻的部分減少,比電阻降低。另外,推斷其理由在於:於導電膜中,存在具有第一銀粒子與第三銀粒子之間的長邊長度的第二銀粒子,並且因第二銀粒子的形狀接近矩形而第一銀粒子與第二銀粒子之間或第二銀粒子彼此可能以面或線相接,藉此導電膜的空間率進一步減少,成為高電阻的部分進一步減少,比電阻降低。而且,推測藉由具有長徑越大縱橫比越大的傾向,而於銀粒子的填充性及燒結性的容易度的方面優異,結果所獲得的導電膜的導電性提高。 再者,各銀粒子的周長、長方形的長邊長度及短邊長度、縱橫比的平均值、個數比例、以及比α可藉由可用作原料的銀粉的特性、後述的表面處理劑附著處理的時序、以及表面處理劑附著處理中可使用的多元羧酸的種類及使用率來調整。 (Mixed silver powder) The mixed silver powder of the present invention is a mixed silver powder comprising a first silver particle, a second silver particle and a third silver particle. When observing more than 100 silver particles in a polished cross section of a resin block formed by embedding the mixed silver powder in a resin, and measuring the perimeter of the silver particles and the length of the long side and the length of the short side of a rectangle circumscribing the outer shape of the silver particles and having the smallest area, the silver particles having a long side length of 3 μm or more are set as the first silver particles, the silver particles having a long side length of 0.5 μm or more and less than 3 μm are set as the second silver particles, and the silver particles having a long side length of less than 0.5 μm are set as the third silver particles. When the silver particles with a diameter of 20 μm are used as the third silver particles, the average value of the aspect ratio of the first silver particles is greater than 2, the average value of the aspect ratio of the second silver particles is greater than 1.5 and less than 2, the average value of the aspect ratio of the third silver particles is less than 1.5, the number ratio of the first silver particles in the mixed silver powder is greater than 0.5% and less than 5%, the number ratio of the second silver particles in the mixed silver powder is greater than 10%, and the number ratio of the third silver particles in the mixed silver powder is greater than 15%, by the following formula (1): Ratio α = circumference of the second silver particle / (long side length of the second silver particle × 2 + short side length of the second silver particle × 2) ... (1) The calculated average value of the ratio α (also called rectangularity) is greater than 0.84, and polycarboxylic acid is attached to the surface of at least one silver particle selected from the group consisting of the first silver particle, the second silver particle, and the third silver particle. If it is a mixed silver powder as described above, the specific resistance of the conductive film can be reduced. The reason is inferred to be that in the conductive film, the relatively small third silver particles enter the gaps between the relatively large first silver particles that are beneficial for reducing the specific resistance, thereby reducing the space rate of the conductive film and making the silver powder dense. As a result, the space without silver particles in the conductive film, that is, the part that becomes high resistance, is reduced, and the specific resistance is reduced. In addition, the reason is inferred to be that: in the conductive film, there are second silver particles with the long side length between the first silver particles and the third silver particles, and because the shape of the second silver particles is close to a rectangle, the first silver particles and the second silver particles or the second silver particles may be connected in a plane or line, thereby further reducing the space ratio of the conductive film, further reducing the part that becomes high resistance, and reducing the specific resistance. In addition, it is inferred that the silver particles are excellent in filling and sintering ease due to the tendency of having a larger aspect ratio as the length diameter increases, and the conductivity of the conductive film obtained is improved as a result. Furthermore, the perimeter of each silver particle, the length of the long side and the short side of the rectangle, the average value of the aspect ratio, the number ratio, and the ratio α can be adjusted by the characteristics of the silver powder that can be used as a raw material, the timing of the surface treatment agent attachment treatment described later, and the type and usage rate of the polycarboxylic acid that can be used in the surface treatment agent attachment treatment.
<第一銀粒子> 於本發明的混合銀粉中,第一銀粒子是長邊長度為3 μm以上的銀粒子。 <First silver particles> In the mixed silver powder of the present invention, the first silver particles are silver particles having a long side length of 3 μm or more.
於本發明的混合銀粉中,第一銀粒子的縱橫比的平均值需要為2以上,較佳為2.3以上,更佳為2.5以上,進而佳為3以上。 若第一銀粒子的縱橫比的平均值為2以上,則可有效地降低導電膜的比電阻。 另一方面,第一銀粒子的縱橫比的平均值例如為5以下,可為4以下,亦可為3.5以下。 In the mixed silver powder of the present invention, the average value of the aspect ratio of the first silver particles needs to be greater than 2, preferably greater than 2.3, more preferably greater than 2.5, and further preferably greater than 3. If the average value of the aspect ratio of the first silver particles is greater than 2, the specific resistance of the conductive film can be effectively reduced. On the other hand, the average value of the aspect ratio of the first silver particles is, for example, less than 5, less than 4, or less than 3.5.
第一銀粒子的短邊長度的平均值例如為0.6 μm以上,可為1.0 μm以上,亦可為1.3 μm以上。例如為2.5 μm以下,可為2.0 μm以下,亦可為1.9 μm以下。The average value of the short side length of the first silver particles is, for example, 0.6 μm or more, 1.0 μm or more, or 1.3 μm or more, and for example, 2.5 μm or less, 2.0 μm or less, or 1.9 μm or less.
第一銀粒子的形狀係數的平均值例如為2以上,可為2.5以上,亦可為3以上,例如為6以下,可為5以下,亦可為4以下。The average value of the shape factor of the first silver particles is, for example, greater than 2, may be greater than 2.5, or may be greater than 3, and is, for example, less than 6, may be less than 5, or may be less than 4.
於本發明的混合銀粉中,第一銀粒子於混合銀粉中所佔的個數比例需要為0.5%以上,較佳為1%以上,更佳為1.5%以上,需要為5%以下,較佳為4%以下,更佳為3%以下。 若第一銀粒子於混合銀粉中所佔的個數比例為所述範圍內,則可有效地降低導電膜的比電阻。 In the mixed silver powder of the present invention, the number ratio of the first silver particles in the mixed silver powder needs to be 0.5% or more, preferably 1% or more, more preferably 1.5% or more, and needs to be 5% or less, preferably 4% or less, and more preferably 3% or less. If the number ratio of the first silver particles in the mixed silver powder is within the above range, the specific resistance of the conductive film can be effectively reduced.
<第二銀粒子> 於本發明的混合銀粉中,第二銀粒子是長邊長度為0.5 μm以上且小於3 μm的銀粒子。 <Second silver particles> In the mixed silver powder of the present invention, the second silver particles are silver particles having a long side length of 0.5 μm or more and less than 3 μm.
於本發明的混合銀粉中,第二銀粒子的縱橫比的平均值需要為1.5以上,較佳為1.6以上,更佳為1.7以上,需要小於2,較佳為1.95以下,更佳為1.92以下。 若第二銀粒子的縱橫比的平均值為所述範圍內,則可有效地降低導電膜的比電阻。 In the mixed silver powder of the present invention, the average value of the aspect ratio of the second silver particles needs to be greater than 1.5, preferably greater than 1.6, and more preferably greater than 1.7, and needs to be less than 2, preferably less than 1.95, and more preferably less than 1.92. If the average value of the aspect ratio of the second silver particles is within the above range, the specific resistance of the conductive film can be effectively reduced.
於本發明的混合銀粉中,藉由以下的式(1): 比α=第二銀粒子的周長/(第二銀粒子的長邊長度×2+第二銀粒子的短邊長度×2)…(1) 計算出的比α的平均值需要為0.84以上,較佳為0.85以上。比α表示粒子剖面的矩形度,比α的值越接近1,粒子形狀越為接近矩形的形狀。 若比α的平均值為0.84以上,則可有效地降低導電膜的比電阻。 另一方面,比α的平均值為1以下,例如亦可為0.95以下。 In the mixed silver powder of the present invention, by the following formula (1): Ratio α = circumference of the second silver particle / (long side length of the second silver particle × 2 + short side length of the second silver particle × 2) ... (1) The calculated average value of the ratio α needs to be greater than 0.84, preferably greater than 0.85. The ratio α represents the rectangularity of the particle cross section. The closer the value of the ratio α is to 1, the closer the particle shape is to a rectangular shape. If the average value of the ratio α is greater than 0.84, the specific resistance of the conductive film can be effectively reduced. On the other hand, the average value of the ratio α is less than 1, for example, it can also be less than 0.95.
第二銀粒子的短邊長度的平均值例如為0.3 μm以上,可為0.4 μm以上,亦可為0.5 μm以上,例如為1 μm以下,可為0.8 μm以下,亦可為0.7 μm以下。The average value of the short side length of the second silver particles is, for example, 0.3 μm or more, 0.4 μm or more, or 0.5 μm or more, and is, for example, 1 μm or less, 0.8 μm or less, or 0.7 μm or less.
第二銀粒子的形狀係數的平均值例如為1.5以上,可為1.7以上,亦可為2以上,例如為3以下,可為2.5以下,亦可為2.3以下。The average value of the shape factor of the second silver particles is, for example, 1.5 or more, 1.7 or more, or 2 or more, and is, for example, 3 or less, 2.5 or less, or 2.3 or less.
於本發明的混合銀粉中,第二銀粒子於混合銀粉中所佔的個數比例需要為10%以上,較佳為30%以上。 若第二銀粒子於混合銀粉中所佔的個數比例為10%以上,則可有效地降低導電膜的比電阻。 In the mixed silver powder of the present invention, the number ratio of the second silver particles in the mixed silver powder needs to be more than 10%, preferably more than 30%. If the number ratio of the second silver particles in the mixed silver powder is more than 10%, the specific resistance of the conductive film can be effectively reduced.
<第三銀粒子> 於本發明的混合銀粉中,第三銀粒子是長邊長度小於0.5 μm的銀粒子。 <Third silver particles> In the mixed silver powder of the present invention, the third silver particles are silver particles having a long side length of less than 0.5 μm.
於本發明的混合銀粉中,第三銀粒子的縱橫比的平均值需要小於1.5,較佳為1.4以下,進而佳為1.35以下。 若第三銀粒子的縱橫比的平均值小於1.5,則可有效地降低導電膜的比電阻。 另一方面,第三銀粒子的縱橫比的平均值例如為1.1以上,可為1.2以上,亦可為1.25以上。 In the mixed silver powder of the present invention, the average value of the aspect ratio of the third silver particles needs to be less than 1.5, preferably less than 1.4, and further preferably less than 1.35. If the average value of the aspect ratio of the third silver particles is less than 1.5, the specific resistance of the conductive film can be effectively reduced. On the other hand, the average value of the aspect ratio of the third silver particles is, for example, greater than 1.1, greater than 1.2, or greater than 1.25.
第三銀粒子的短邊長度的平均值例如為0.1 μm以上,可為0.2 μm以上,亦可為0.25 μm以上。例如為0.5 μm以下,可為0.4 μm以下。The average value of the short side length of the third silver particles is, for example, 0.1 μm or more, 0.2 μm or more, or 0.25 μm or more, and is, for example, 0.5 μm or less, or 0.4 μm or less.
第三銀粒子的形狀係數的平均值例如為1.2以上,可為1.4以上,亦可為1.6以上,例如為2.5以下,可為2以下,亦可為1.75以下。The average value of the shape factor of the third silver particles is, for example, 1.2 or more, 1.4 or more, or 1.6 or more, and is, for example, 2.5 or less, 2 or less, or 1.75 or less.
於本發明的混合銀粉中,第三銀粒子於混合銀粉中所佔的個數比例需要為10%以上,較佳為13%以上,更佳為15%以上。 若第三銀粒子於混合銀粉中所佔的個數比例為所述範圍內,則可有效地降低導電膜的比電阻。 In the mixed silver powder of the present invention, the number ratio of the third silver particles in the mixed silver powder needs to be 10% or more, preferably 13% or more, and more preferably 15% or more. If the number ratio of the third silver particles in the mixed silver powder is within the above range, the specific resistance of the conductive film can be effectively reduced.
<多元羧酸> 本發明的混合銀粉於選自由第一銀粒子、第二銀粒子、及第三銀粒子所組成的群組中的至少一種銀粒子的表面附著有多元羧酸。而且,就可有效地降低導電膜的比電阻的方面而言,混合銀粉較佳為於第一銀粒子及第二銀粒子的表面附著有多元羧酸。 <Polycarboxylic acid> The mixed silver powder of the present invention has a polycarboxylic acid attached to the surface of at least one silver particle selected from the group consisting of the first silver particle, the second silver particle, and the third silver particle. In addition, in terms of effectively reducing the specific resistance of the conductive film, the mixed silver powder preferably has a polycarboxylic acid attached to the surface of the first silver particle and the second silver particle.
此處,作為多元羧酸,並無特別限定,可列舉現有公知者,就可有效地降低導電膜的比電阻的方面而言,多元羧酸較佳為脂肪族多元羧酸,更佳為飽和型脂肪族多元羧酸。 更具體而言,多元羧酸較佳為選自由草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十一烷二酸、十二烷二酸、蘋果酸、二乙基戊二酸、3-甲基己二酸、丁基丙二酸、馬來酸、二甘醇酸及檸檬酸所組成的群組中的至少一種多元羧酸,特佳為己二酸。 Here, the polycarboxylic acid is not particularly limited, and existing known ones can be cited. In terms of being able to effectively reduce the specific resistance of the conductive film, the polycarboxylic acid is preferably an aliphatic polycarboxylic acid, and more preferably a saturated aliphatic polycarboxylic acid. More specifically, the polycarboxylic acid is preferably at least one polycarboxylic acid selected from the group consisting of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, apple acid, diethylglutaric acid, 3-methyladipic acid, butylmalonic acid, maleic acid, diglycolic acid and citric acid, and adipic acid is particularly preferred.
多元羧酸相對於第一銀粒子、第二銀粒子、及第三銀粒子的合計的含有比例較佳為0.01質量%以上,更佳為0.02質量%以上,較佳為0.15質量%以下,更佳為0.1質量%以下,進而佳為0.05質量%以下。 若所述多元羧酸的含有比例為所述範圍內,則可有效地降低導電膜的比電阻。 The content ratio of the polycarboxylic acid relative to the total of the first silver particles, the second silver particles, and the third silver particles is preferably 0.01 mass % or more, more preferably 0.02 mass % or more, preferably 0.15 mass % or less, more preferably 0.1 mass % or less, and further preferably 0.05 mass % or less. If the content ratio of the polycarboxylic acid is within the above range, the specific resistance of the conductive film can be effectively reduced.
<混合銀粉的特性> 混合銀粉的藉由雷射繞射散射式粒度分佈測定而獲得的體積基準的累計50%粒子徑(D 50)例如為1 μm以上,例如為3 μm以下。 <Characteristics of Mixed Silver Powder> The cumulative 50% particle size (D 50 ) of the mixed silver powder on a volume basis obtained by laser diffraction scattering particle size distribution measurement is, for example, 1 μm or more and, for example, 3 μm or less.
混合銀粉的BET比表面積例如為0.2 m 2/g以上,可為0.4 m 2/g以上,亦可為0.5 m 2/g以上,例如為1 m 2/g以下,可為0.8 m 2/g以下,亦可為0.7 m 2/g以下。 The BET specific surface area of the mixed silver powder is, for example, 0.2 m 2 /g or more, 0.4 m 2 /g or more, or 0.5 m 2 /g or more, and is, for example, 1 m 2 /g or less, 0.8 m 2 /g or less, or 0.7 m 2 /g or less.
混合銀粉的強熱減量(Ig-Loss)值例如為0.05質量%以上,可為0.1質量%以上,亦可為0.3質量%以上,例如為3質量%以下,可為1質量%以下,亦可為0.5質量%以下。The intensive heat loss (Ig-Loss) value of the mixed silver powder is, for example, 0.05 mass % or more, 0.1 mass % or more, or 0.3 mass % or more, for example, 3 mass % or less, 1 mass % or less, or 0.5 mass % or less.
混合銀粉的敲緊密度例如為3 g/mL以上,可為4 g/mL以上,亦可為5 g/mL以上,例如為7 g/mL以下,可為6 g/mL以下。The tap density of the mixed silver powder is, for example, 3 g/mL or more, may be 4 g/mL or more, and may be 5 g/mL or more, and for example, 7 g/mL or less, and may be 6 g/mL or less.
(混合銀粉的製造方法) 本發明的混合銀粉的製造方法包括:混合步驟,將含有銀粒子A1及銀粒子A2的銀粉A、與包含銀粒子B的銀粉B混合而獲得混合物;以及前處理步驟,於混合步驟之前,利用多元羧酸對銀粉A及銀粉B中的至少一者的銀粉進行表面處理劑附著處理,或者後處理步驟,利用多元羧酸對混合步驟中獲得的混合物進行表面處理劑附著處理,於對將銀粉A埋入樹脂而成的樹脂塊的研磨剖面中的100個以上的銀粒子、與將銀粉B埋入樹脂而成的樹脂塊的研磨剖面中的100個以上的銀粒子分別進行觀察,並對銀粒子的周長、以及與銀粒子的外形外接且面積最小的長方形的長邊長度及短邊長度進行測定的情況下,銀粒子A1的縱橫比的平均值為2以上,銀粒子A2的縱橫比的平均值小於2,且藉由以下的式(2): 比β=銀粒子A2的周長/(銀粒子A2的長邊長度×2+銀粒子A2的短邊長度×2)…(2) 計算出的比β(亦稱為矩形度)的平均值為0.84以上,銀粒子B的縱橫比的平均值小於1.5。 若為所述般的混合銀粉的製造方法,則可獲得能夠降低導電膜的比電阻的混合銀粉。另外,藉由本發明的混合銀粉的製造方法,可獲得所述本發明的混合銀粉。 再者,本發明的混合銀粉的製造方法中的銀粒子的剖面的觀察可利用與所述本發明的混合銀粉的銀粒子的剖面的觀察相同的方法來進行。 (Method for producing mixed silver powder) The method for producing mixed silver powder of the present invention comprises: a mixing step, mixing silver powder A containing silver particles A1 and silver particles A2 with silver powder B containing silver particles B to obtain a mixture; and a pre-treatment step, before the mixing step, using a polycarboxylic acid to carry out a surface treatment agent attachment treatment on at least one of the silver powders A and B, or a post-treatment step, using a polycarboxylic acid to carry out a surface treatment agent attachment treatment on the mixture obtained in the mixing step, before burying the silver powder A in a tree. When observing more than 100 silver particles in the polished cross section of a resin block formed by embedding silver powder B in resin and measuring the perimeter of the silver particles and the length of the long side and the length of the short side of the rectangle circumscribing the outer shape of the silver particles and having the smallest area, the average value of the aspect ratio of the silver particles A1 is greater than 2, the average value of the aspect ratio of the silver particles A2 is less than 2, and the following formula (2): Ratio β = circumference of silver particle A2 / (long side length of silver particle A2 × 2 + short side length of silver particle A2 × 2) ... (2) The calculated average value of ratio β (also called rectangularity) is 0.84 or more, and the average value of aspect ratio of silver particle B is less than 1.5. If the above-mentioned mixed silver powder production method is used, a mixed silver powder capable of reducing the specific resistance of the conductive film can be obtained. In addition, the mixed silver powder of the present invention can be obtained by the mixed silver powder production method of the present invention. Furthermore, the observation of the cross section of the silver particles in the mixed silver powder production method of the present invention can be carried out by the same method as the observation of the cross section of the silver particles of the mixed silver powder of the present invention.
本發明的混合銀粉的製造方法除了包括所述前處理步驟、混合步驟、及後處理步驟以外,亦可任意地進而包括在前處理步驟或混合步驟之前將銀粒子A及/或銀粒子B碎解的碎解步驟等其他步驟。The method for producing the mixed silver powder of the present invention may further include, in addition to the pre-treatment step, the mixing step, and the post-treatment step, other steps such as a crushing step of crushing the silver particles A and/or the silver particles B before the pre-treatment step or the mixing step.
<銀粉A> 銀粉A含有縱橫比大的銀粒子A1、以及縱橫比小於銀粒子A1且粒子形狀的矩形度大的銀粒子A2。 <Silver powder A> Silver powder A contains silver particles A1 having a large aspect ratio, and silver particles A2 having a smaller aspect ratio than silver particles A1 and a large rectangular shape.
〔銀粒子A1〕 銀粒子A1是縱橫比為2以上的銀粒子。銀粉A中的銀粒子A1的個數比例例如為5%以上且50%以下。 [Silver particles A1] Silver particles A1 are silver particles having an aspect ratio of 2 or more. The number ratio of silver particles A1 in silver powder A is, for example, 5% or more and 50% or less.
銀粒子A1的縱橫比的平均值為2以上,較佳為2.3以上,更佳為2.5以上,進而佳為3以上。 若銀粒子A1的縱橫比的平均值為2以上,則可獲得能夠有效地降低導電膜的比電阻的混合銀粉。 另一方面,銀粒子A1的縱橫比的平均值例如為5以下,可為4以下,亦可為3.5以下。 The average value of the aspect ratio of the silver particles A1 is 2 or more, preferably 2.3 or more, more preferably 2.5 or more, and further preferably 3 or more. If the average value of the aspect ratio of the silver particles A1 is 2 or more, a mixed silver powder that can effectively reduce the specific resistance of the conductive film can be obtained. On the other hand, the average value of the aspect ratio of the silver particles A1 is, for example, 5 or less, 4 or less, or 3.5 or less.
〔銀粒子A2〕 銀粒子A2是縱橫比小於銀粒子A1且粒子形狀的矩形度(後述的比β)為0.84以上的銀粒子。銀粒子A2是縱橫比小於2的銀粒子。而且,對於縱橫比小於2的銀粒子,測定矩形度,該些的平均值為0.84以上。銀粉A中的銀粒子A2的個數比例例如較佳為50%~95%。 [Silver particles A2] Silver particles A2 are silver particles having an aspect ratio smaller than that of silver particles A1 and a rectangularity of the particle shape (ratio β described below) of 0.84 or more. Silver particles A2 are silver particles having an aspect ratio of less than 2. Moreover, for silver particles having an aspect ratio of less than 2, the rectangularity is measured, and the average value thereof is 0.84 or more. The number ratio of silver particles A2 in silver powder A is preferably, for example, 50% to 95%.
銀粒子A2的縱橫比的平均值較佳為1.4以上,並且小於2。 若銀粒子A2的縱橫比的平均值為所述範圍內,則可獲得能夠有效地降低導電膜的比電阻的混合銀粉。 The average value of the aspect ratio of the silver particles A2 is preferably greater than 1.4 and less than 2. If the average value of the aspect ratio of the silver particles A2 is within the above range, a mixed silver powder that can effectively reduce the specific resistance of the conductive film can be obtained.
於銀粉A中,藉由以下的式(2): 比β=銀粒子A2的周長/(銀粒子A2的長邊長度×2+銀粒子A2的短邊長度×2)…(2) 計算出的比β的平均值需要為0.84以上,較佳為0.85以上。比β表示粒子剖面的矩形度,比β的值越接近1,粒子形狀越為接近矩形的形狀。 若比β的平均值為0.84以上,則可有效地降低導電膜的比電阻。 另一方面,比β的平均值為1以下,例如可為0.95以下。 In silver powder A, by the following formula (2): Ratio β = circumference of silver particle A2 / (long side length of silver particle A2 × 2 + short side length of silver particle A2 × 2) ... (2) The calculated average value of the ratio β needs to be greater than 0.84, preferably greater than 0.85. The ratio β represents the rectangularity of the particle cross section. The closer the value of the ratio β is to 1, the closer the particle shape is to a rectangular shape. If the average value of the ratio β is greater than 0.84, the specific resistance of the conductive film can be effectively reduced. On the other hand, the average value of the ratio β is less than 1, for example, less than 0.95.
〔銀粉A的製備方法〕 關於銀粉A的製備方法,若為銀粉A中所含的銀粒子A及銀粒子B滿足規定的條件者,則並無特別限定,可使用現有公知的方法。 以下,對銀粉A的製備方法的一例進行說明,但本發明的混合銀粉的製造方法中所使用的銀粉A並不限定於此。 [Preparation method of silver powder A] Regarding the preparation method of silver powder A, there is no particular limitation as long as the silver particles A and silver particles B contained in the silver powder A meet the prescribed conditions, and a conventionally known method can be used. Below, an example of the preparation method of silver powder A is described, but the silver powder A used in the method for producing the mixed silver powder of the present invention is not limited thereto.
銀粉A可藉由包括如下步驟的方法來製備:還原步驟,於銀氨錯合物水溶液中添加還原劑而獲得第一液;表面處理劑添加步驟,於第一液中添加表面處理劑而獲得第二液;分離步驟,自第二液分離並進行乾燥而獲得縱橫比小於1.5的球狀銀粉;以及部分性地進行扁平化的步驟,於容器內對球狀銀粉、潤滑劑以及介質進行攪拌,以可形成縱橫比大的銀粒子A1、與縱橫比小於銀粒子A1且矩形度大的銀粒子A2的程度部分性地進行扁平化。Silver powder A can be prepared by a method comprising the following steps: a reduction step, in which a reducing agent is added to an aqueous silver ammine complex solution to obtain a first liquid; a surface treatment agent addition step, in which a surface treatment agent is added to the first liquid to obtain a second liquid; a separation step, in which the spherical silver powder having an aspect ratio of less than 1.5 is separated from the second liquid and dried; and a partial flattening step, in which the spherical silver powder, a lubricant and a medium are stirred in a container to partially flatten the spherical silver powder to such an extent that silver particles A1 having a large aspect ratio and silver particles A2 having an aspect ratio smaller than that of the silver particles A1 and a large rectangularity are formed.
-還原步驟- 於還原步驟中,於銀氨錯合物水溶液中添加還原劑而獲得第一液。此處,於還原步驟中,藉由添加還原劑,銀離子被還原,銀的粒子(以下,稱為核粒子)可析出。 -Reduction step- In the reduction step, a reducing agent is added to the silver-ammonia complex aqueous solution to obtain a first solution. Here, in the reduction step, by adding the reducing agent, silver ions are reduced and silver particles (hereinafter referred to as core particles) can be precipitated.
作為還原劑,例如可列舉:肼、肼化合物及福馬林等。Examples of the reducing agent include hydrazine, hydrazine compounds, and formalin.
銀氨錯合物水溶液可使用於硝酸銀水溶液或氧化銀懸浮液等原料液中添加氨水或銨鹽而生成者。亦可於原料液或銀氨錯合物水溶液中添加pH值調整劑。作為pH值調整劑,可使用一般的酸或鹼,例如可列舉硝酸、氫氧化鈉等。The silver-ammonia complex aqueous solution can be produced by adding ammonia water or ammonium salt to a raw material solution such as a silver nitrate aqueous solution or a silver oxide suspension. A pH adjuster can also be added to the raw material solution or the silver-ammonia complex aqueous solution. As the pH adjuster, a general acid or base can be used, for example, nitric acid, sodium hydroxide, etc.
-表面處理劑添加步驟- 於表面處理劑添加步驟中,於在還原步驟中獲得的第一液中添加表面處理劑而獲得第二液。此處,於表面處理劑添加步驟中,表面處理劑可藉由吸附等而被覆於核粒子的表面。 再者,以下,將由表面處理劑被覆的核粒子稱為被覆粒子。第二液為分散有被覆粒子的懸浮液(所謂的漿料)或分散液。 -Surface treatment agent adding step- In the surface treatment agent adding step, the surface treatment agent is added to the first liquid obtained in the reduction step to obtain a second liquid. Here, in the surface treatment agent adding step, the surface treatment agent can be coated on the surface of the core particles by adsorption or the like. In addition, hereinafter, the core particles coated with the surface treatment agent are referred to as coated particles. The second liquid is a suspension (so-called slurry) or a dispersion in which the coated particles are dispersed.
作為表面處理劑,例如可列舉:硬脂酸、棕櫚酸、亞麻油酸、次亞麻油酸、油酸等脂肪酸。該些中,較佳為亞麻油酸、次亞麻油酸、油酸等不飽和脂肪酸。Examples of the surface treatment agent include fatty acids such as stearic acid, palmitic acid, linoleic acid, linolenic acid, and oleic acid. Among these, unsaturated fatty acids such as linoleic acid, linolenic acid, and oleic acid are preferred.
相對於銀氨錯合物水溶液中所含的銀的質量,表面處理劑添加步驟中的表面處理劑的添加量通常為0.05質量%以上且0.15質量%以下。The amount of the surface treatment agent added in the surface treatment agent adding step is usually 0.05 mass % or more and 0.15 mass % or less relative to the mass of silver contained in the silver ammine complex aqueous solution.
藉由表面處理劑添加步驟而附著於核粒子並殘留至乾燥步驟後的表面處理劑的附著量是使用對後述的乾燥步驟後的球狀銀粉於確定了表面處理劑的種類的狀態下進行測定而得的值。 再者,表面處理劑的種類可藉由對球狀銀粉進行加熱而揮發的表面處理劑的利用氣相層析法的定性分析來確定。 The amount of the surface treatment agent that is attached to the core particles by the surface treatment agent addition step and remains after the drying step is a value measured using the spherical silver powder after the drying step described later in a state where the type of the surface treatment agent is determined. In addition, the type of the surface treatment agent can be determined by qualitative analysis of the surface treatment agent volatilized by heating the spherical silver powder using gas chromatography.
球狀銀粉的表面處理劑的附著量可依照日本專利第5622543號公報中所記載的脂肪酸的定量分析方法來進行。 具體而言,首先,利用酸溶解銀粉,之後混合有機溶媒,於該有機溶媒相中總量提取表面處理劑後,分取規定量的有機溶媒相,對於進行蒸發乾燥而殘留的固體物,利用碳硫分析裝置測定碳量,藉此可利用計算來求出。 The amount of surface treatment agent attached to spherical silver powder can be determined by the quantitative analysis method of fatty acids described in Japanese Patent No. 5622543. Specifically, first, the silver powder is dissolved with acid, then mixed with an organic solvent, and the total amount of the surface treatment agent is extracted from the organic solvent phase. A predetermined amount of the organic solvent phase is then separated, and the carbon content of the solids remaining after evaporation and drying is measured using a carbon-sulfur analyzer, which can be calculated.
例如,於表面處理劑被確定為硬脂酸、且球狀銀粉中不含硬脂酸以外的碳源的情況下,硬脂酸的測定方法為以下方法。For example, when the surface treatment agent is determined to be stearic acid and the spherical silver powder does not contain a carbon source other than stearic acid, the method for determining stearic acid is as follows.
於硬脂酸的含量(mg)不同的標準液中,藉由利用碳硫分析裝置測定各碳量(強度)而求出校準曲線,此時將其斜率設為A(強度/mg)。而且,關於銀粉中的硬脂酸質量X(mg)、濃度Y(%),自藉由所述銀粉的處理而於總有機溶媒量a(mL)中提取處理劑而得者中分取規定量b(mL),將藉由其殘存固體物的測定而求出的碳量設為C(強度),將溶解於酸中的銀粉的量設為M(g),於該情況下,硬脂酸質量X及濃度Y分別可藉由下述式(A)及式(B)來計算出。 X(mg)=(C/A×a/b)…(A) Y(%)=X/(M×1000)×100…(B) In standard solutions with different stearic acid contents (mg), the calibration curve is obtained by measuring each carbon amount (strength) using a carbon-sulfur analyzer, and its slope is set as A (strength/mg). In addition, regarding the stearic acid mass X (mg) and concentration Y (%) in the silver powder, a predetermined amount b (mL) is taken from the treatment agent obtained by extracting the treatment agent from the total organic solvent amount a (mL) by treating the silver powder, and the carbon amount obtained by measuring the residual solid matter is set as C (strength), and the amount of silver powder dissolved in the acid is set as M (g). In this case, the stearic acid mass X and concentration Y can be calculated by the following formula (A) and formula (B), respectively. X(mg)=(C/A×a/b)…(A) Y(%)=X/(M×1000)×100…(B)
於油酸為處理劑的情況下,亦與所述同樣地測定碳量來求出。關於油酸,亦使用硬脂酸的校準曲線來計算。硬脂酸的分子量為284.48,其中的碳量為216.19,油酸的分子量為282.46,其中的碳量為216.19,因此油酸濃度Y'可藉由下述式(C)來計算出。 油酸濃度Y'(%)=Y×(216.19/284.48)×(282.46/216.19)…(C) When oleic acid is used as the treatment agent, the carbon content is measured in the same manner as described above. For oleic acid, the calibration curve of stearic acid is also used for calculation. The molecular weight of stearic acid is 284.48, and the carbon content is 216.19. The molecular weight of oleic acid is 282.46, and the carbon content is 216.19. Therefore, the oleic acid concentration Y' can be calculated by the following formula (C). Oleic acid concentration Y' (%) = Y × (216.19/284.48) × (282.46/216.19) ... (C)
相對於球狀銀粉的質量,表面處理劑的附著量較佳為0.01質量%以上且0.11質量%以下。The amount of the surface treatment agent attached is preferably 0.01 mass % or more and 0.11 mass % or less relative to the mass of the spherical silver powder.
-分離步驟- 於分離步驟中,自第二液分離被覆粒子。將於分離步驟中經分離及乾燥的被覆粒子的集合體稱為球狀銀粉。 再者,於分離步驟中,可任意地進行自第二液回收被覆粒子並進行清洗的清洗回收步驟、使被覆粒子乾燥的乾燥步驟。 -Separation step- In the separation step, the coated particles are separated from the second liquid. The aggregate of the coated particles separated and dried in the separation step is called spherical silver powder. In addition, in the separation step, a washing and recovery step of recovering the coated particles from the second liquid and washing them, and a drying step of drying the coated particles can be arbitrarily performed.
於清洗回收步驟中,例如將第二液脫水而將被覆粒子的集合體製成濾餅狀,另外,對被覆粒子的集合體的濾餅進行清洗。清洗回收步驟中的清洗例如可使用純水進行。清洗回收步驟中的脫水例如可藉由傾析或壓濾機來進行。可使用清洗水的電導率來判定清洗的終點。具體而言,可於清洗水的電導率成為規定值以下的情況下判定為清洗結束。清洗後的被覆粒子可以濾餅狀等凝聚狀態供於乾燥步驟。In the cleaning and recovery step, for example, the second liquid is dehydrated to make the aggregate of coated particles into a filter cake shape, and the filter cake of the aggregate of coated particles is cleaned. The cleaning in the cleaning and recovery step can be performed, for example, using pure water. The dehydration in the cleaning and recovery step can be performed, for example, by decanting or a filter press. The end point of the cleaning can be determined by the conductivity of the cleaning water. Specifically, the cleaning can be determined to be complete when the conductivity of the cleaning water becomes below a specified value. The cleaned coated particles can be provided to the drying step in a coagulated state such as a filter cake shape.
於乾燥步驟中,對包含水分且凝聚狀態的被覆粒子的集合體進行乾燥。乾燥步驟中可使用真空乾燥、或氣流式的乾燥機。於乾燥步驟中,亦可進行如下操作:對被覆粒子的集合體吹送高壓空氣流,或者將濾餅或乾燥過程中的銀粉投入具有攪拌轉子的攪拌機並進行攪拌,藉此對濾餅或乾燥過程中的銀粉賦予分散力,以促進分散或乾燥。In the drying step, the aggregate of the coated particles containing water and in a coagulated state is dried. In the drying step, a vacuum drying or an air flow type dryer can be used. In the drying step, the following operation can also be performed: a high-pressure air flow is blown to the aggregate of the coated particles, or the filter cake or the silver powder in the drying process is put into a stirrer with a stirring rotor and stirred, thereby giving a dispersing force to the filter cake or the silver powder in the drying process to promote dispersion or drying.
於乾燥步驟中,銀粉的溫度通常為100℃以下。若銀粉的溫度為100℃以下,則可有效地抑制銀粉中的銀粒子彼此燒結。In the drying step, the temperature of the silver powder is usually below 100° C. If the temperature of the silver powder is below 100° C., sintering of silver particles in the silver powder can be effectively suppressed.
乾燥後的球狀銀粉有時會成為塊狀,因此可於進行乾燥步驟的同時、或於乾燥步驟後,以提高球狀銀粉的處理性等為目的而進行碎解或分級操作。此處,所謂球狀銀粉的處理性的提高,是指為了例如於後述的步驟(部分性地進行扁平化的步驟)中確保不會對後述的潤滑劑的添加、或向裝置內的供給操作造成阻礙的程度的流動性、或者使裝置中的處理效率良好地進行而適度地使球狀銀粉鬆散。The dried spherical silver powder may be in a lump form, so it may be crushed or classified during or after the drying step for the purpose of improving the handling properties of the spherical silver powder. Here, the so-called improvement of the handling properties of the spherical silver powder refers to the proper loosening of the spherical silver powder in order to ensure the fluidity to a degree that does not hinder the addition of the lubricant described later or the supply operation into the device in the step described later (partial flattening step), or to ensure good handling efficiency in the device.
分離步驟中獲得的球狀銀粉的根據與後述的潤滑劑混合後藉由BET法求出的比表面積(BET比表面積)計算出的比表面積徑為1.3 μm以上且2.0 μm以下。 此處,比表面積徑可基於將球狀銀粉與潤滑劑混合後藉由BET法求出的比表面積A(m 2/g)與銀的密度ρ,並使用下述式(D)來計算出。 比表面積徑(μm)=6/(A×ρ)…(D) The spherical silver powder obtained in the separation step has a specific surface area calculated from the specific surface area obtained by the BET method after mixing with the lubricant described later (BET specific surface area) of 1.3 μm or more and 2.0 μm or less. Here, the specific surface area can be calculated using the following formula (D) based on the specific surface area A (m 2 /g) obtained by the BET method after mixing the spherical silver powder with the lubricant and the density ρ of silver. Specific surface area (μm) = 6/(A×ρ)… (D)
-部分性地進行扁平化的步驟- 於該步驟中,於容器內對球狀銀粉、潤滑劑以及介質進行攪拌,獲得以可形成縱橫比大的銀粒子A1、與縱橫比小且矩形度大的銀粒子A2的程度對球狀銀粉部分性地進行扁平化而成的銀粉A。 -Partial flattening step- In this step, spherical silver powder, lubricant and medium are stirred in a container to obtain silver powder A in which the spherical silver powder is partially flattened to such an extent that silver particles A1 with a large aspect ratio and silver particles A2 with a small aspect ratio and a large rectangular shape can be formed.
此處,部分性地進行扁平化的步驟以使潤滑劑均勻地分散於球狀銀粉的表面為目的而包括將球狀銀粉與潤滑劑混合的潤滑劑混合步驟。於潤滑劑混合步驟中,可對藉由碎解而適度地鬆散的狀態的球狀銀粉添加潤滑劑,並使用碎解機進行攪拌混合,例如可將銀粉投入至亨舍爾(Henschel)型混合器(三井礦山(股)製造,FM混合器,型號FM75型,使用SO型攪拌葉片)或噴射磨機型混合器中,添加潤滑劑並進行攪拌,使球狀銀粉與潤滑劑混合。於潤滑劑混合步驟後亦可適度地為凝聚狀態。於本步驟中,獲得與潤滑劑混合後的球狀銀粉中的被覆粒子藉由在容器內與介質以少的碰撞次數進行碰撞而部分性地經扁平化、且由潤滑劑被覆的銀粒子的集合體即銀粉A。銀粉中的被覆粒子中碰撞次數比較多的粒子為縱橫比大的銀粒子A1,碰撞次數比較少的粒子為縱橫比小且矩形度大的銀粒子A2。藉由調整攪拌容器內的介質與銀粉的填充率以及由攪拌容器的旋轉速度與時間估算的能量量來控制與介質的碰撞次數,以使銀粒子A1與銀粒子A2共存(不僅僅是銀粒子A1)。Here, the step of partially flattening the spherical silver powder includes a lubricant mixing step of mixing the spherical silver powder with the lubricant for the purpose of uniformly dispersing the lubricant on the surface of the spherical silver powder. In the lubricant mixing step, the lubricant may be added to the spherical silver powder that is appropriately loosened by crushing, and the mixture may be stirred and mixed using a crusher. For example, the silver powder may be put into a Henschel mixer (manufactured by Mitsui Mining Co., Ltd., FM mixer, model FM75, using SO type stirring blades) or a jet mill mixer, and the lubricant may be added and stirred to mix the spherical silver powder with the lubricant. After the lubricant mixing step, the spherical silver powder mixed with the lubricant may be in an agglomerated state to a certain extent. In this step, the coated particles in the spherical silver powder mixed with the lubricant are partially flattened by colliding with the medium in a small number of collisions in the container, and the silver particles are coated with the lubricant, that is, silver powder A. Among the coated particles in the silver powder, the particles with a relatively large number of collisions are silver particles A1 with a large aspect ratio, and the particles with a relatively small number of collisions are silver particles A2 with a small aspect ratio and a large rectangular degree. The number of collisions with the medium is controlled by adjusting the filling ratio of the medium and the silver powder in the stirring container and the amount of energy estimated by the rotation speed and time of the stirring container so that the silver particles A1 and the silver particles A2 coexist (not just the silver particles A1).
作為潤滑劑,例如可列舉:硬脂酸、棕櫚酸、亞麻油酸、次亞麻油酸、油酸等脂肪酸。該些中,較佳為亞麻油酸、次亞麻油酸、油酸等不飽和脂肪酸。相對於球狀銀粉的質量,潤滑劑的添加量例如為0.05質量%以上且0.3質量%以下。Examples of lubricants include fatty acids such as stearic acid, palmitic acid, linolenic acid, linolenic acid, and oleic acid. Among these, unsaturated fatty acids such as linolenic acid, linolenic acid, and oleic acid are preferred. The amount of lubricant added is, for example, 0.05 mass % or more and 0.3 mass % or less relative to the mass of the spherical silver powder.
關於部分性地進行扁平化的步驟,作為一例,可調用球磨機或珠磨機等所謂的媒介磨機來使用。介質可使用不鏽鋼(steel use stainless,SUS)或氧化鋯等公知的材料。媒介磨機中的攪拌可藉由容器或攪拌槳片的旋轉來進行,亦可藉由使容器振動來進行。For the partial flattening step, a so-called media mill such as a ball mill or a bead mill can be used, for example. The medium can be made of known materials such as stainless steel (SUS) or zirconia. Stirring in the media mill can be performed by rotating the container or the stirring paddle, or by vibrating the container.
另外,部分性地進行扁平化的步驟亦較佳為包括於進行與介質的碰撞後,進一步使用亨舍爾型混合器或噴射磨機型混合器等進行碎解處理的步驟。亦較佳為藉由該碎解處理,碎解因與介質的碰撞而變得過大的銀粒子,使累計90%粒子徑(D 90)、累計95%粒子徑(D 95)、以及累計100%(即,最大粒子)的粒子徑(D MAX)的值降低。再者,於進行碎解處理的步驟中,就能夠有效地減小各種粒子徑的方面而言,較佳為使用噴射磨機型混合器。 In addition, the step of partially flattening preferably includes a step of further performing a disintegration treatment using a Henschel mixer or a jet mill mixer after the collision with the medium. It is also preferred that the disintegration treatment disintegrates the silver particles that have become too large due to the collision with the medium, so that the values of the cumulative 90% particle size (D 90 ), the cumulative 95% particle size (D 95 ), and the cumulative 100% (i.e., the largest particle) particle size (D MAX ) are reduced. Furthermore, in the step of performing the disintegration treatment, it is preferred to use a jet mill mixer in terms of being able to effectively reduce the various particle sizes.
此處,於進行所述碎解處理的步驟中使用噴射磨機型混合器的情況下,於部分性地進行扁平化的步驟中,亦可利用旋風器(cyclone)等處理碎解後的銀粉,去除小的微粒子(切屑等,例如粒徑小於0.1 μm)。再者,旋風器亦可使用加入追加氣流而提高捕集效率的裝置。Here, when a jet mill mixer is used in the crushing step, the crushed silver powder can be treated with a cyclone or the like in the partial flattening step to remove small particles (chips, etc., for example, particles with a diameter less than 0.1 μm). Furthermore, the cyclone can also be used as a device that adds additional airflow to improve the collection efficiency.
<銀粉B> 銀粉B包含銀粒子B。 <Silver powder B> Silver powder B contains silver particles B.
銀粒子B的縱橫比的平均值需要小於1.5,較佳為1.4以下,進而佳為1.35以下。 若銀粒子B的縱橫比的平均值小於1.5,則可獲得能夠有效地降低導電膜的比電阻的混合銀粉。 另一方面,粒子B的縱橫比的平均值例如為1.1以上,可為1.2以上,亦可為1.25以上。 The average value of the aspect ratio of the silver particles B needs to be less than 1.5, preferably less than 1.4, and further preferably less than 1.35. If the average value of the aspect ratio of the silver particles B is less than 1.5, a mixed silver powder that can effectively reduce the specific resistance of the conductive film can be obtained. On the other hand, the average value of the aspect ratio of the particles B is, for example, greater than 1.1, greater than 1.2, or greater than 1.25.
銀粒子B的形狀係數的平均值例如為1以上,可為1.3以上,亦可為1.5以上,例如為1.7以下,可為1.6以下。The average value of the shape factor of the silver particles B is, for example, not less than 1, may be not less than 1.3, or may be not less than 1.5, and is, for example, not more than 1.7, or may be not more than 1.6.
銀粒子B的圓相當徑(Heywood徑)的平均值例如為0.1 μm以上,可為0.3 μm以上,例如為1 μm以下,可為0.5 μm以下。The average value of the circle equivalent diameter (Heywood diameter) of the silver particles B is, for example, 0.1 μm or more, and may be 0.3 μm or more, and, for example, 1 μm or less, and may be 0.5 μm or less.
銀粉B的藉由雷射繞射散射式粒度分佈測定而獲得的體積基準的累計50%粒子徑(D 50)例如為0.3 μm以上,可為0.5 μm以上,例如為1.3 μm以下,可為1 μm以下。 The volume-based cumulative 50% particle size (D 50 ) of the silver powder B obtained by laser diffraction scattering particle size distribution measurement is, for example, 0.3 μm or more, or 0.5 μm or more, and, for example, 1.3 μm or less, or 1 μm or less.
以下,對本發明的混合銀粉的製造方法中的前處理步驟、混合步驟、及後處理步驟進行說明。Hereinafter, the pre-treatment step, the mixing step, and the post-treatment step in the method for producing the mixed silver powder of the present invention will be described.
<前處理步驟> 於前處理步驟中,於混合步驟之前,利用多元羧酸對銀粉A及銀粉B中的至少一者的銀粉進行表面處理劑附著處理。 此處,於前處理步驟中,就可獲得能夠有效地降低導電膜的比電阻的混合銀粉的方面而言,較佳為利用多元羧酸對銀粉A進行表面處理劑附著處理。 <Pretreatment step> In the pretreatment step, before the mixing step, at least one of the silver powders A and B is subjected to a surface treatment agent adhesion treatment using a polycarboxylic acid. Here, in the pretreatment step, in order to obtain a mixed silver powder that can effectively reduce the specific resistance of the conductive film, it is preferred to use a polycarboxylic acid to carry out a surface treatment agent adhesion treatment on the silver powder A.
於前處理步驟中,利用多元羧酸進行的銀粉的表面處理劑附著處理並無特別限定,例如可使用樣品磨機、亨舍爾型混合器等碎解機進行。 再者,利用多元羧酸進行的銀粉的表面處理劑附著處理的時間通常為1分鐘以上且30分鐘以下。 In the pre-treatment step, the surface treatment agent adhesion treatment of the silver powder using polycarboxylic acid is not particularly limited, and can be performed using, for example, a sample mill, a Henschel mixer, or other disintegrator. Furthermore, the surface treatment agent adhesion treatment of the silver powder using polycarboxylic acid is usually performed for a period of more than 1 minute and less than 30 minutes.
作為前處理步驟的表面處理劑附著處理中使用的多元羧酸,並無特別限定,可列舉現有公知者,就可獲得能夠有效地降低導電膜的比電阻的混合銀粉的方面而言,多元羧酸較佳為脂肪族多元羧酸,更佳為飽和型脂肪族多元羧酸。 更具體而言,多元羧酸較佳為選自由草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十一烷二酸、十二烷二酸、蘋果酸、二乙基戊二酸、3-甲基己二酸、丁基丙二酸、馬來酸、二甘醇酸及檸檬酸所組成的群組中的至少一種多元羧酸,特佳為己二酸。 The polycarboxylic acid used in the surface treatment agent attachment treatment as the pretreatment step is not particularly limited, and existing known ones can be cited. In terms of obtaining a mixed silver powder that can effectively reduce the specific resistance of the conductive film, the polycarboxylic acid is preferably an aliphatic polycarboxylic acid, and more preferably a saturated aliphatic polycarboxylic acid. More specifically, the polycarboxylic acid is preferably at least one polycarboxylic acid selected from the group consisting of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, apple acid, diethyl glutaric acid, 3-methyl adipic acid, butylmalonic acid, maleic acid, diglycolic acid and citric acid, and adipic acid is particularly preferred.
此處,多元羧酸亦可以溶解於溶媒中的溶液的形式來使用。作為可用於溶解多元羧酸的溶媒,例如可列舉甲醇、乙醇、丙醇等醇等。該些中,較佳為乙醇。Here, the polycarboxylic acid may be used in the form of a solution dissolved in a solvent. Examples of the solvent that can be used to dissolve the polycarboxylic acid include alcohols such as methanol, ethanol, and propanol. Among these, ethanol is preferred.
於前處理步驟中,多元羧酸相對於銀粉A及銀粉B的合計的使用率較佳為0.01質量%以上,更佳為0.02質量%以上,較佳為0.15質量%以下,更佳為0.1質量%以下,進而佳為0.05質量%以下。 若所述多元羧酸的含有比例為所述範圍內,則可獲得能夠有效地降低導電膜的比電阻的混合銀粉。 In the pretreatment step, the usage rate of the polycarboxylic acid relative to the total of the silver powder A and the silver powder B is preferably 0.01 mass % or more, more preferably 0.02 mass % or more, preferably 0.15 mass % or less, more preferably 0.1 mass % or less, and further preferably 0.05 mass % or less. If the content ratio of the polycarboxylic acid is within the above range, a mixed silver powder that can effectively reduce the specific resistance of the conductive film can be obtained.
<混合步驟> 於混合步驟中,將含有銀粒子A1及銀粒子A2的銀粉A、與包含銀粒子B的銀粉B混合而獲得混合物。再者,於在混合步驟之前進行了前處理步驟的情況下,混合步驟中獲得的混合物可相當於目標物的混合銀粉。 <Mixing step> In the mixing step, silver powder A containing silver particles A1 and silver particles A2 is mixed with silver powder B containing silver particles B to obtain a mixture. Furthermore, when a pretreatment step is performed before the mixing step, the mixture obtained in the mixing step can be equivalent to the target mixed silver powder.
銀粉B相對於銀粉A的混合比例(銀粉B/銀粉A)以質量基準計例如為10/90以上,可為20/80以上,亦可為30/70以上,例如亦為90/10以下,可為60/40以下,亦可為40/60以下。 若銀粉B相對於銀粉A的混合比例為所述範圍內,則可獲得能夠有效地降低導電膜的比電阻的混合銀粉。 The mixing ratio of silver powder B to silver powder A (silver powder B/silver powder A) is, for example, 10/90 or more, 20/80 or more, or 30/70 or more, and for example, 90/10 or less, 60/40 or less, or 40/60 or less, on a mass basis. If the mixing ratio of silver powder B to silver powder A is within the above range, a mixed silver powder that can effectively reduce the specific resistance of the conductive film can be obtained.
<後處理步驟> 於後處理步驟中,利用多元羧酸對混合步驟中獲得的混合物進行表面處理劑附著處理。再者,於後處理步驟中經表面處理劑附著處理後的混合物可相當於目標物的混合銀粉。 <Post-treatment step> In the post-treatment step, the mixture obtained in the mixing step is subjected to a surface treatment agent attachment treatment using a polycarboxylic acid. Furthermore, the mixture subjected to the surface treatment agent attachment treatment in the post-treatment step can be equivalent to the target mixed silver powder.
於後處理步驟中,利用多元羧酸進行的混合物的表面處理劑附著處理並無特別限定,例如可使用樣品磨機、亨舍爾型混合器等碎解機進行。 再者,利用多元羧酸進行的混合物的表面處理劑附著處理的時間通常為1分鐘以上且30分鐘以下。 In the post-treatment step, the surface treatment agent adhesion treatment of the mixture using the polycarboxylic acid is not particularly limited, and can be performed using, for example, a sample mill, a Henschel mixer, or other disintegrator. Furthermore, the surface treatment agent adhesion treatment of the mixture using the polycarboxylic acid is usually performed for more than 1 minute and less than 30 minutes.
作為後處理步驟的表面處理劑附著處理中使用的多元羧酸,並無特別限定,可列舉現有公知者,就可獲得能夠有效地降低導電膜的比電阻的混合銀粉的方面而言,多元羧酸較佳為脂肪族多元羧酸,更佳為飽和型脂肪族多元羧酸。 更具體而言,多元羧酸較佳為選自由草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十一烷二酸、十二烷二酸、蘋果酸、二乙基戊二酸、3-甲基己二酸、丁基丙二酸、馬來酸、二甘醇酸及檸檬酸所組成的群組中的至少一種多元羧酸,特佳為己二酸。 The polycarboxylic acid used in the surface treatment agent attachment treatment as the post-treatment step is not particularly limited, and existing known ones can be cited. In terms of obtaining a mixed silver powder that can effectively reduce the specific resistance of the conductive film, the polycarboxylic acid is preferably an aliphatic polycarboxylic acid, and more preferably a saturated aliphatic polycarboxylic acid. More specifically, the polycarboxylic acid is preferably at least one polycarboxylic acid selected from the group consisting of oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, apple acid, diethylglutaric acid, 3-methyl adipic acid, butylmalonic acid, maleic acid, diglycolic acid and citric acid, and adipic acid is particularly preferred.
此處,多元羧酸亦可以溶解於溶媒中的溶液的形式來使用。作為可用於溶解多元羧酸的溶媒,例如可列舉甲醇、乙醇、丙醇等醇等。Here, the polycarboxylic acid may be used in the form of a solution dissolved in a solvent. Examples of the solvent that can be used to dissolve the polycarboxylic acid include alcohols such as methanol, ethanol, and propanol.
於後處理步驟中,多元羧酸相對於銀粉A及銀粉B的合計的使用率較佳為0.01質量%以上,更佳為0.02質量%以上,較佳為0.15質量%以下,更佳為0.1質量%以下,進而佳為0.05質量%以下。 若所述多元羧酸的含有比例為所述範圍內,則可獲得能夠有效地降低導電膜的比電阻的混合銀粉。 In the post-treatment step, the usage rate of the polycarboxylic acid relative to the total of the silver powder A and the silver powder B is preferably 0.01 mass % or more, more preferably 0.02 mass % or more, preferably 0.15 mass % or less, more preferably 0.1 mass % or less, and further preferably 0.05 mass % or less. If the content ratio of the polycarboxylic acid is within the above range, a mixed silver powder that can effectively reduce the specific resistance of the conductive film can be obtained.
(導電糊) 本發明的導電糊包含所述本發明的混合銀粉、黏合劑以及溶劑,且可任意地包含混合銀粉、黏合劑、及溶劑以外的成分(以下,有時稱為「其他成分」)。本發明的導電糊由於包含本發明的混合銀粉,因此可降低導電膜的比電阻。 (Conductive paste) The conductive paste of the present invention includes the mixed silver powder, binder and solvent of the present invention, and may optionally include components other than the mixed silver powder, binder and solvent (hereinafter, sometimes referred to as "other components"). Since the conductive paste of the present invention includes the mixed silver powder of the present invention, the specific resistance of the conductive film can be reduced.
導電糊中的混合銀粉的含有比例較佳為50質量%以上,更佳為80質量%以上,較佳為98質量%以下,更佳為95質量%以下。 若導電糊中的混合銀粉的含有比例為所述範圍內,則可有效地降低導電膜的比電阻。 The content of the mixed silver powder in the conductive paste is preferably 50% by mass or more, more preferably 80% by mass or more, preferably 98% by mass or less, and more preferably 95% by mass or less. If the content of the mixed silver powder in the conductive paste is within the above range, the specific resistance of the conductive film can be effectively reduced.
作為導電糊的黏合劑,例如可列舉:環氧樹脂、丙烯酸樹脂、聚酯樹脂、聚醯亞胺樹脂、聚胺基甲酸酯樹脂、苯氧基樹脂、矽酮樹脂、乙基纖維素等。該些可單獨使用一種,亦可併用兩種以上。Examples of the binder for the conductive paste include epoxy resin, acrylic resin, polyester resin, polyimide resin, polyurethane resin, phenoxy resin, silicone resin, ethyl cellulose, etc. These may be used alone or in combination of two or more.
作為導電糊的溶劑(即,分散介質),例如可列舉:萜品醇、丁基卡必醇、丁基卡必醇乙酸酯、2,2,4-三甲基-1,3-戊二醇單異丁酸酯(texanol)等。該些可單獨使用一種,亦可併用兩種以上。Examples of the solvent (i.e., dispersion medium) of the conductive paste include terpineol, butyl carbitol, butyl carbitol acetate, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate (texanol), etc. These may be used alone or in combination of two or more.
作為導電糊可包含的其他成分,例如可列舉:玻璃膠(glass frit)、分散劑、界面活性劑、黏度調整劑等。該些可單獨使用一種,亦可併用兩種以上。Other components that may be included in the conductive paste include, for example, glass frit, dispersant, surfactant, viscosity adjuster, etc. These may be used alone or in combination of two or more.
於導電糊的製造、即分散或混煉中,可使用超音波分散、分散器、三根輥磨機、球磨機、珠磨機、雙軸捏合機、自轉公轉式攪拌機等。In the production, i.e., dispersion or mixing of the conductive paste, ultrasonic dispersion, disperser, three-roll mill, ball mill, bead mill, twin-shaft kneader, rotation-revolution mixer, etc. can be used.
導電糊的黏度並無特別限制,可根據目的適宜選擇,於糊溫度25℃、轉數1 rpm的條件下,較佳為150 Pa・s以上,更佳為200 Pa・s以上,較佳為800 Pa・s以下,更佳為750 Pa・s以下。 若導電糊的黏度為150 Pa・s以上,則可有效地抑制印刷時的「洇滲」的產生。 另一方面,若導電糊的黏度為800 Pa・s以下,則可有效地抑制印刷不均的產生。 The viscosity of the conductive paste is not particularly limited and can be appropriately selected according to the purpose. Under the conditions of a paste temperature of 25°C and a rotation speed of 1 rpm, it is preferably 150 Pa・s or more, more preferably 200 Pa・s or more, preferably 800 Pa・s or less, and more preferably 750 Pa・s or less. If the viscosity of the conductive paste is 150 Pa・s or more, the occurrence of "bleeding" during printing can be effectively suppressed. On the other hand, if the viscosity of the conductive paste is 800 Pa・s or less, the occurrence of uneven printing can be effectively suppressed.
本發明的導電糊適合於導電膜的形成、即、於基板上的導電圖案的形成、或電極的形成。例如,可適宜地用於在太陽電池用的矽晶圓、觸控面板用膜、電致發光(electroluminescence,EL)元件用玻璃等各種基體上直接、或者在視需要在基體上進一步設置透明導電膜後的該膜上進行塗佈或印刷而形成導電膜。使用本發明的導電糊獲得的導電膜可適宜地用於例如太陽電池單元的集電電極、晶片型電子零件的外部電極、射頻識別(Radio-Frequency Identification,RFID)、電磁波屏蔽、振子接著、膜片開關、電致發光等的電極或電配線用途等中。The conductive paste of the present invention is suitable for forming a conductive film, that is, forming a conductive pattern on a substrate, or forming an electrode. For example, it can be suitably used to form a conductive film by coating or printing directly on various substrates such as silicon wafers for solar cells, films for touch panels, and glass for electroluminescence (EL) elements, or on a transparent conductive film that is further provided on the substrate as needed. The conductive film obtained using the conductive paste of the present invention can be suitably used, for example, as a collector electrode of a solar cell unit, an external electrode of a chip-type electronic component, radio-frequency identification (RFID), electromagnetic wave shielding, vibrator bonding, diaphragm switches, electrodes for electroluminescence, or electrical wiring, etc.
導電糊例如可藉由網版印刷、平板印刷、光微影法等印刷於基板上,而形成所期望的形狀的導電膜。 [實施例] The conductive paste can be printed on the substrate by screen printing, lithography, photolithography, etc. to form a conductive film of a desired shape. [Example]
以下,使用實施例更詳細地說明本發明,但本發明不受以下實施例的任何限定。Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to the following examples.
(實施例1) <銀粉A的製備> 〔還原步驟〕 首先,於作為銀離子水溶液的包含68.8 kg的銀的硝酸銀水溶液2922 kg中,加入26質量%的氨水溶液167.1 kg,生成銀氨錯合物水溶液。進而,對於該銀氨錯合物水溶液,加入作為還原劑的6質量%肼水溶液266 kg,獲得第一液。還原劑的添加速度是設為80 L/min。 (Example 1) <Preparation of silver powder A> [Reduction step] First, 167.1 kg of 26 mass % ammonia aqueous solution was added to 2922 kg of silver nitrate aqueous solution containing 68.8 kg of silver as a silver ion aqueous solution to generate a silver-ammonia complex aqueous solution. Furthermore, 266 kg of 6 mass % hydrazine aqueous solution was added to the silver-ammonia complex aqueous solution as a reducing agent to obtain a first liquid. The rate of addition of the reducing agent was set to 80 L/min.
〔表面處理劑添加步驟〕 於自還原劑添加結束時起經過5分鐘後,加入68.8 g(相對於銀氨錯合物水溶液中所含的銀的質量而為0.1質量%(藉由油酸68.8 g/銀68800 g×100來計算))的作為表面處理劑的油酸。於添加表面處理劑後,攪拌5分鐘,獲得第二液。第二液為包含被覆粒子的漿料狀。 [Surface treatment agent addition step] After 5 minutes from the end of the reducing agent addition, 68.8 g (0.1 mass % relative to the mass of silver contained in the silver-ammonia complex aqueous solution (calculated by oleic acid 68.8 g/silver 68800 g×100)) of oleic acid as a surface treatment agent was added. After adding the surface treatment agent, the mixture was stirred for 5 minutes to obtain a second liquid. The second liquid was in the form of a slurry containing coated particles.
〔分離步驟〕 對第二液進行過濾,並進行水洗,之後使其乾燥,獲得球狀銀粉。 [Separation step] The second liquid is filtered, washed with water, and then dried to obtain spherical silver powder.
〔潤滑劑混合步驟〕 將所述球狀銀粉16.25 kg投入至亨舍爾型混合器(三井礦山(股)製造,FM混合器,型號FM75型,使用SO型攪拌葉片)中,以900 rpm攪拌1分鐘後,投入37.4 g(相對於球狀銀粉的質量而為0.23質量%(藉由油酸37.4 g/球狀銀粉16250 g×100來計算))的作為潤滑劑的油酸,以攪拌葉片的轉數2200 rpm混合攪拌20分鐘。以多批次進行本步驟,獲得使潤滑劑分散於銀粒子表面的潤滑劑混合銀粉。 [Lubricant mixing step] 16.25 kg of the spherical silver powder was added to a Henschel mixer (Mitsui Mining Co., Ltd., FM mixer, model FM75, using SO type stirring blades), stirred at 900 rpm for 1 minute, and then 37.4 g (0.23 mass % relative to the mass of the spherical silver powder (calculated by oleic acid 37.4 g/spherical silver powder 16250 g × 100)) of oleic acid as a lubricant was added, and the mixture was mixed and stirred at 2200 rpm for 20 minutes. This step was performed in multiple batches to obtain a lubricant-mixed silver powder in which the lubricant was dispersed on the surface of the silver particles.
〔部分性地進行扁平化的步驟〕 將32 kg的所述潤滑劑混合銀粉與SUS球(直徑1.6 mm)256 kg投入至振動磨機(中央化工機股份有限公司製造,FVR-20型)中,以振動數780 vpm處理135分鐘,使潤滑劑混合銀粉部分性地進行扁平化。 [Partial flattening step] 32 kg of the lubricant-mixed silver powder and 256 kg of SUS balls (diameter 1.6 mm) were placed in a vibration mill (FVR-20 model, manufactured by Central Chemical Industry Co., Ltd.) and processed at a vibration speed of 780 vpm for 135 minutes to partially flatten the lubricant-mixed silver powder.
將部分性地進行扁平化後的銀粉(以下,亦稱為第二銀粉)與SUS球分離後,利用所述亨舍爾型混合器,以2600 rpm攪拌25分鐘並進行碎解。進而,為了自碎解後的第二銀粉中去除粗粒,而利用乾式篩裝置(富仁德・達博(Freund-Turbo)股份有限公司製造,TS125×200型/網眼27 μm篩子)進行篩分,獲得銀粉A。The partially flattened silver powder (hereinafter also referred to as the second silver powder) was separated from the SUS ball and then crushed by stirring at 2600 rpm for 25 minutes using the Henschel mixer. Furthermore, in order to remove coarse particles from the crushed second silver powder, it was screened using a dry screen device (manufactured by Freund-Turbo Co., Ltd., TS125×200 type/mesh 27 μm screen) to obtain silver powder A.
〔銀粉A的剖面觀察〕 對銀粉A中的銀粒子進行觀察,藉由以下的方法對銀粒子A1計算出縱橫比的平均值,對銀粒子A2計算出縱橫比的平均值及藉由以下的式(2): 比β=銀粒子A2的周長/(銀粒子A2的長邊長度×2+銀粒子A2的短邊長度×2)…(2) 計算出的比β的平均值。 具體而言,首先,將銀粉A放入至樹脂(司特爾(Struers)公司製造,艾泊費庫斯(EpoFix)樹脂)及硬化劑(司特爾(Struers)公司製造,艾泊費庫斯(EpoFix)硬化劑)中並加以固化,利用橫剖面拋光機(日本高新技術(High-technologies)公司製造,亞布萊德(ArBlade)5000)進行研磨,藉此使銀粒子的剖面露出,利用掃描式電子顯微鏡(日本電子股份有限公司製造,JEOL JSM-IT300LV)對各銀粒子以5,000倍進行觀察。此處,根據絕緣性的樹脂與導電性的銀粒子的對比度,銀粒子的輪廓清晰且可明確地視認到銀粒子的外周的銀粒子視為剖面露出的銀粒子。然後,對於在將銀粉A埋入樹脂而成的樹脂塊的研磨剖面中,自可明確地視認到外周的銀粒子中任意地選擇的100個以上的銀粒子,使用圖像分析軟體(貿泰科(MOUNTECH)股份有限公司製造,圖像分析式粒度分佈測定軟體Mac-View)描摹銀粒子外周,藉此測定各銀粒子的長邊長度、短邊長度、周長。再者,長邊長度及短邊長度是自動計算出與各銀粒子的外形外接的長方形的面積最小時的值。 繼而,將縱橫比為2以上的銀粒子設為銀粒子A1,將縱橫比小於2的銀粒子設為銀粒子A2,對銀粒子A1計算出縱橫比的平均值,對銀粒子A2計算出縱橫比的平均值以及比β的平均值。將結果示於表1中。 [Cross-sectional observation of silver powder A] The silver particles in silver powder A were observed, and the average value of the aspect ratio of silver particle A1 was calculated by the following method, and the average value of the aspect ratio of silver particle A2 was calculated by the following formula (2): Ratio β = circumference of silver particle A2 / (long side length of silver particle A2 × 2 + short side length of silver particle A2 × 2) ... (2) The average value of the calculated ratio β. Specifically, first, silver powder A was placed in a resin (EpoFix resin manufactured by Struers) and a hardener (EpoFix hardener manufactured by Struers) and cured, and then polished using a cross-section polisher (ArBlade 5000 manufactured by High-technologies Corporation of Japan) to expose the cross section of the silver particles. Each silver particle was observed at 5,000 times magnification using a scanning electron microscope (JEOL JSM-IT300LV manufactured by JEOL Ltd.). Here, based on the contrast between the insulating resin and the conductive silver particles, the silver particles whose outlines are clear and whose peripheries can be clearly seen are regarded as silver particles exposed in the cross section. Then, in the polished cross section of the resin block in which the silver powder A is embedded in the resin, 100 or more silver particles are randomly selected from the silver particles whose peripheries can be clearly seen, and the peripheries of the silver particles are traced using image analysis software (Mac-View, an image analysis type particle size distribution measurement software manufactured by MOUNTECH Co., Ltd.), thereby measuring the length of the long side, the length of the short side, and the perimeter of each silver particle. Furthermore, the length of the long side and the length of the short side are automatically calculated to be the values when the area of the rectangle circumscribing the outer shape of each silver particle is the smallest. Then, the silver particles with an aspect ratio of 2 or more are set as silver particles A1, and the silver particles with an aspect ratio of less than 2 are set as silver particles A2. The average value of the aspect ratio is calculated for silver particles A1, and the average value of the aspect ratio and the average value of the ratio β are calculated for silver particles A2. The results are shown in Table 1.
<銀粉B的準備> 作為銀粉B,準備同和高科技(DOWA high-tech)股份有限公司製造的「AG-2-1C」。再者,該銀粉B的利用雷射繞射散射式粒度分佈測定裝置而測定的體積基準的累計50%粒子徑(D 50)為0.80 μm,使用貿泰科(MOUNTECH)股份有限公司製造的圖像分析式粒度分佈測定軟體Mac-View進行合計100個以上的粒子外形的測量而得的形狀係數的平均值為1.53,縱橫比的平均值為1.3,平均Heywood徑為0.34 μm。 <Preparation of Silver Powder B>"AG-2-1C" manufactured by DOWA High-Tech Co., Ltd. was prepared as silver powder B. The volume-based cumulative 50% particle size (D 50 ) of the silver powder B measured by a laser diffraction scattering particle size distribution measuring device was 0.80 μm, and the average shape factor obtained by measuring the external shapes of more than 100 particles using image analysis particle size distribution measuring software Mac-View manufactured by MOUNTECH Co., Ltd. was 1.53, the average aspect ratio was 1.3, and the average Heywood diameter was 0.34 μm.
<混合銀粉的製造> 〔前處理步驟〕 首先,準備將己二酸(純正化學股份有限公司製造)0.056 g溶解於乙醇溶媒0.504 g中而成的溶液。繼而,將該溶液添加至所述獲得的銀粉A 120 g中,利用樣品磨機(協立理工(股)製造,SK-M10)混合4.5分鐘,利用己二酸對銀粉A表面進行處理。銀粉A於製造過程中使用了油酸作為表面處理劑或潤滑劑,但藉由該處理,使作為進一步的表面處理劑的己二酸附著於銀粉A表面。 <Production of mixed silver powder> [Pretreatment step] First, prepare a solution in which 0.056 g of adipic acid (manufactured by Junsei Chemical Co., Ltd.) is dissolved in 0.504 g of an ethanol solvent. Then, add the solution to 120 g of the obtained silver powder A, mix for 4.5 minutes using a sample mill (manufactured by Kyoritsu Riko Co., Ltd., SK-M10), and treat the surface of the silver powder A with adipic acid. Oleic acid is used as a surface treatment agent or lubricant in the production process of silver powder A, but this treatment allows adipic acid, which is a further surface treatment agent, to adhere to the surface of the silver powder A.
〔混合步驟〕 將所述前處理步驟中獲得的表面處理劑附著處理完畢的銀粉A與銀粉B以按照質量比計成為60:40(銀粉B/銀粉A=40/60)的方式混合而製造混合物(即,混合銀粉)。使用所獲得的混合銀粉進行以下所示的各種測定。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖2中。 [Mixing step] The silver powder A and silver powder B obtained in the pre-treatment step, which have been treated with the surface treatment agent, are mixed in a mass ratio of 60:40 (silver powder B/silver powder A=40/60) to produce a mixture (i.e., mixed silver powder). The obtained mixed silver powder is used to perform the various measurements shown below. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in FIG2.
〔BET比表面積的測定〕 所述獲得的混合銀粉的BET比表面積是使用BET比表面積測定裝置(麥庫索布HM-型號1210(Macsorb HM-model 1210),貿泰科(MOUNTECH)公司製造)並利用基於氮吸附的BET 1點法來測定。再者,於BET比表面積的測定中,測定前的脫氣條件是設為60℃、10分鐘。將結果示於表2中。 [Measurement of BET specific surface area] The BET specific surface area of the obtained mixed silver powder was measured using a BET specific surface area measuring device (Macsorb HM-model 1210, manufactured by MOUNTECH) and a BET single-point method based on nitrogen adsorption. In the measurement of the BET specific surface area, the degassing conditions before the measurement were set to 60°C and 10 minutes. The results are shown in Table 2.
〔粒度分佈的測定〕 藉由以下的方法來測定所述獲得的混合銀粉的體積基準的累計10%粒子徑(D 10)、累計50%粒子徑(D 50)、累計90%粒子徑(D 90)、及累計95%粒子徑(D 95)、以及累計100%(即,最大粒子)的粒子徑(D MAX)。另外,計算出累計90%粒子徑(D 90)與累計10%粒子徑(D 10)的差相對於累計50%粒子徑(D 50)的比[(D 90-D 10)/D 50]。將結果示於表2中。 將混合銀粉0.1 g加入至異丙醇(Isopropyl Alcohol,IPA)40 mL中,利用超音波均質機(裝置名:US-150T,日本精機製作所股份有限公司製造;19.5 kHz,晶片前端直徑18 mm)分散2分鐘後,利用雷射繞射-散射式粒子徑分佈測定裝置(麥奇克拜爾(MicrotracBEL)股份有限公司製造,麥奇克(Microtrac)MT-3300 EXII)進行測定。 [Measurement of particle size distribution] The volume-based cumulative 10% particle size ( D10 ), cumulative 50% particle size (D50), cumulative 90% particle size ( D90 ), cumulative 95% particle size ( D95 ), and cumulative 100% (i.e., largest particle) particle size ( DMAX ) of the obtained mixed silver powder were measured by the following method. In addition, the ratio of the difference between the cumulative 90% particle size (D90 ) and the cumulative 10% particle size ( D10 ) to the cumulative 50% particle size ( D50 ) was calculated [( D90 - D10 )/ D50 ]. The results are shown in Table 2. 0.1 g of the mixed silver powder was added to 40 mL of isopropyl alcohol (IPA), dispersed for 2 minutes using an ultrasonic homogenizer (device name: US-150T, manufactured by Nippon Seiki Co., Ltd.; 19.5 kHz, chip tip diameter 18 mm), and then measured using a laser diffraction-scattering particle size distribution measuring device (Microtrac BEL Co., Ltd., Microtrac MT-3300 EXII).
〔強熱減量(Ig-Loss)值的測定〕 所述獲得的混合銀粉的強熱減量(Ig-Loss)值是精密地秤量(秤量值:w1)混合銀粉試樣3 g並放入至磁性坩堝中,加熱至800℃,然後以對於達到恆量而言充分的時間於800℃下保持30分鐘,其後進行冷卻並再次秤量(秤量值:w2),並根據「強熱減量(Ig-Loss)值(質量%)=(w1-w2)/w1×100」來計算出。將結果示於表2中。 [Determination of Ig-Loss value] The Ig-Loss value of the obtained mixed silver powder is obtained by accurately weighing (weighing value: w1) 3 g of the mixed silver powder sample and placing it in a magnetic crucible, heating it to 800°C, and then keeping it at 800°C for 30 minutes, which is sufficient time for achieving constant weight, and then cooling and weighing it again (weighing value: w2), and calculating it according to "Ig-Loss value (mass %) = (w1-w2)/w1×100". The results are shown in Table 2.
〔敲緊密度的測定〕 所述獲得的混合銀粉的敲緊密度是使用敲緊密度測定裝置(柴山科學公司製造,容積比重測定裝置SS-DA-2),計量銀粉30 g並放入至20 mL的試管中,以落差20 mm敲擊1,000次,並根據「敲緊密度=試樣質量(g)/敲擊後的試樣體積(mL)」來計算出。將結果示於表2中。 [Measurement of tap density] The tap density of the obtained mixed silver powder was measured using a tap density measuring device (produced by Shibayama Scientific Co., Ltd., volume specific gravity measuring device SS-DA-2). 30 g of silver powder was weighed and placed in a 20 mL test tube, and tapped 1,000 times with a drop of 20 mm. The tap density was calculated according to "tap density = sample mass (g) / sample volume after tapping (mL)". The results are shown in Table 2.
〔混合銀粉的剖面觀察〕 對混合銀粉中的銀粒子進行觀察,並藉由以下方法進行如下計算: (A)對混合銀粉(銀粒子整體)計算出形狀係數的整體平均、長邊長度的整體平均、短邊長度的整體平均及縱橫比的整體平均 (B)對第一銀粒子計算出個數比例、形狀係數的平均值、短邊長度的平均值及縱橫比的平均值 (C)對第二銀粒子計算出個數比例、形狀係數的平均值、短邊長度的平均值及縱橫比的平均值、以及藉由以下的式(1): 比α=第二銀粒子的周長/(第二銀粒子的長邊長度×2+第二銀粒子的短邊長度×2)…(1) 計算出的比α的平均值 (D)對第三銀粒子計算出個數比例、形狀係數的平均值、短邊長度的平均值及縱橫比的平均值。 具體而言,首先,將混合銀粉放入至樹脂(司特爾(Struers)公司製造,艾泊費庫斯(EpoFix)樹脂)及硬化劑(司特爾(Struers)公司製造,艾泊費庫斯(EpoFix)硬化劑)中並加以固化,利用橫剖面拋光機(日本高新技術(High-technologies)公司製造,亞布萊德(ArBlade)5000)進行研磨,藉此使銀粒子的剖面露出,利用掃描式電子顯微鏡(日本電子股份有限公司製造,JEOL JSM-IT300LV)對各銀粒子以5,000倍(於後述的比較例3的情況下為3,000倍)進行觀察。此處,根據絕緣性的樹脂與導電性的銀粒子的對比度,銀粒子的輪廓清晰且可明確地視認到銀粒子的外周的銀粒子視為剖面露出的銀粒子。然後,對於在將混合銀粉埋入樹脂而成的樹脂塊的研磨剖面中,自可明確地視認到外周的銀粒子中任意地選擇的100個以上的銀粒子,使用圖像分析軟體(貿泰科(MOUNTECH)股份有限公司製造,圖像分析式粒度分佈測定軟體Mac-View)描摹銀粒子外周,藉此測定各銀粒子的長邊長度、短邊長度、周長、銀粒子的面積、銀粒子的最大長度。再者,長邊長度及短邊長度是自動計算出與各銀粒子的外形外接的長方形的面積最小時的值。使用該些測定值,(A)對混合銀粉(銀粒子整體)計算出形狀係數的整體平均、長邊長度的整體平均、短邊長度的整體平均、縱橫比的整體平均。將結果示於表2中。 繼而,將長邊長度為3 μm以上的銀粒子設為第一銀粒子、將長邊長度為0.5 μm以上且小於3 μm的銀粒子設為第二銀粒子、將長邊長度小於0.5 μm的銀粒子設為第三銀粒子,並進行如下計算: (B)對第一銀粒子計算出個數比例、形狀係數的平均值、短邊長度的平均值及縱橫比的平均值 (C)對第二銀粒子計算出個數比例、形狀係數的平均值、短邊長度的平均值及縱橫比的平均值、以及比α的平均值 (D)對第三銀粒子計算出個數比例、形狀係數的平均值、短邊長度的平均值及縱橫比的平均值。 將結果示於表2中。 [Cross-sectional observation of mixed silver powder] The silver particles in the mixed silver powder were observed and the following calculations were performed by the following method: (A) The overall average of the shape factor, the overall average of the long side length, the overall average of the short side length, and the overall average of the aspect ratio of the mixed silver powder (silver particles as a whole) were calculated (B) The number ratio, the average value of the shape factor, the average value of the short side length, and the average value of the aspect ratio of the first silver particles were calculated (C) The number ratio, the average value of the shape factor, the average value of the short side length, and the average value of the aspect ratio of the second silver particles were calculated, and the following formula (1) was used: Ratio α = circumference of the second silver particle / (long side length of the second silver particle × 2 + short side length of the second silver particle × 2) ... (1) Calculated average value of ratio α (D) The number ratio, average value of shape factor, average value of short side length and average value of aspect ratio were calculated for the third silver particles. Specifically, first, the mixed silver powder was placed in a resin (EpoFix resin manufactured by Struers) and a hardener (EpoFix hardener manufactured by Struers) and cured, and then polished using a cross-section polisher (ArBlade 5000 manufactured by High-technologies Corporation of Japan) to expose the cross section of the silver particles. Each silver particle was observed using a scanning electron microscope (JEOL JSM-IT300LV manufactured by JEOL Ltd.) at 5,000 times (3,000 times in the case of Comparative Example 3 described later). Here, based on the contrast between the insulating resin and the conductive silver particles, the silver particles whose outlines are clear and whose peripheries can be clearly seen are considered as the silver particles exposed in the cross section. Then, in the polished cross section of the resin block in which the mixed silver powder is embedded in the resin, 100 or more silver particles are randomly selected from the silver particles whose peripheries can be clearly seen, and the peripheries of the silver particles are traced using image analysis software (Mac-View, an image analysis type particle size distribution measurement software manufactured by MOUNTECH Co., Ltd.), thereby measuring the length of the long side, the length of the short side, the perimeter, the area of the silver particles, and the maximum length of the silver particles. Furthermore, the long side length and short side length are automatically calculated to be the values when the area of the rectangle circumscribing the outer shape of each silver particle is the smallest. Using these measured values, (A) the overall average of the shape factor, the overall average of the long side length, the overall average of the short side length, and the overall average of the aspect ratio are calculated for the mixed silver powder (silver particles as a whole). The results are shown in Table 2. Next, silver particles with a long side length of 3 μm or more are set as the first silver particles, silver particles with a long side length of 0.5 μm or more and less than 3 μm are set as the second silver particles, and silver particles with a long side length of less than 0.5 μm are set as the third silver particles, and the following calculations are performed: (B) The number ratio, the average value of the shape factor, the average value of the short side length, and the average value of the aspect ratio are calculated for the first silver particles (C) The number ratio, the average value of the shape factor, the average value of the short side length, the average value of the aspect ratio, and the average value of the ratio α are calculated for the second silver particles (D) The number ratio, the average value of the shape factor, the average value of the short side length, and the average value of the aspect ratio are calculated for the third silver particles. The results are shown in Table 2.
<導電糊的製備> 以導電糊中所述獲得的混合銀粉的Ag量成為91質量%、環氧樹脂A(艾迪科(ADEKA)製造,EP4901E)成為3.8質量%、環氧樹脂B(三菱化學製造,jER1009)成為1.0質量%、硬化劑(和光純藥製造 三氟化硼單乙基胺錯合物)成為0.2質量%、溶劑(BCA(Butyl Carbitol Acetate):丁基卡必醇乙酸酯)成為4.0質量%的方式,對該些使用無螺旋槳自轉公轉式攪拌脫泡裝置(EME股份有限公司製造的VMX-N360)以1200 rpm攪拌混合30秒,其後使用三根輥(艾卡特(EXAKT)公司製造的80S)以100 μm~20 μm在輥間隙中通過並進行混煉,獲得導電糊。 對於所獲得的導電糊,測定黏度,使用BCA將黏度調整為300 Pa・s。再者,導電糊的黏度是使用黏度計(博勒飛(Brookfield)公司製造的DV-III,CP-52錐)以25℃、1 rpm於保持5分鐘後測定的值。 <Preparation of conductive paste> The conductive paste was prepared by mixing the silver powder obtained above with an Ag content of 91%, epoxy resin A (EP4901E manufactured by ADEKA) with an epoxy resin content of 3.8%, epoxy resin B (jER1009 manufactured by Mitsubishi Chemical) with an epoxy resin content of 1.0%, a hardener (boron trifluoride monoethylamine complex manufactured by Wako Junyaku Co., Ltd.) with an epoxy resin content of 0.2%, and a solvent (BCA (Butyl Carbitol Acetate) with an epoxy resin content of 4.0%) at 1200 °C. rpm for 30 seconds, and then three rollers (80S manufactured by EXAKT) were used to pass through the roller gap at 100 μm to 20 μm and knead to obtain a conductive paste. The viscosity of the conductive paste obtained was measured and adjusted to 300 Pa・s using BCA. The viscosity of the conductive paste was measured using a viscometer (DV-III, CP-52 cone manufactured by Brookfield) at 25°C and 1 rpm for 5 minutes.
<導電膜的形成> 對於所述獲得的導電糊,使用網版印刷機(微技術(Micro-tec)公司製造的MT-320T),於刮板壓力0.18 MPa的條件下,印刷寬度500 μm、長度37.5 mm的線圖案而形成導電糊的膜。繼而,使用大氣循環式乾燥機,於200℃下將所獲得的膜加熱硬化30分鐘,形成導電膜。 <Formation of conductive film> The conductive paste obtained above was printed with a line pattern of 500 μm in width and 37.5 mm in length using a screen printer (MT-320T manufactured by Micro-tec) at a squeegee pressure of 0.18 MPa to form a conductive paste film. Then, the obtained film was heated and hardened at 200°C for 30 minutes using an atmospheric circulation dryer to form a conductive film.
〔比電阻值〕 對於所獲得的導電膜,使用表面粗糙度計(東京精密股份有限公司製造的薩福考姆(Surfcom)480B-12),對氧化鋁基板上未印刷膜的部分與導電膜的部分的階差進行測定,藉此測定導電膜的平均厚度。繼而,使用數位萬用表(digital multimeter)(愛德萬測試(ADVANTEST)公司製造的R6551),對導電膜的電阻值進行測定。然後,根據導電膜的尺寸(平均厚度、寬度、長度),求出導電膜的體積,根據該體積與測定的電阻值求出比電阻值。將結果示於表2中。 [Specific resistance value] For the obtained conductive film, the step difference between the unprinted film portion and the conductive film portion on the alumina substrate was measured using a surface roughness meter (Surfcom 480B-12 manufactured by Tokyo Seimitsu Co., Ltd.), thereby measuring the average thickness of the conductive film. Then, the resistance value of the conductive film was measured using a digital multimeter (R6551 manufactured by ADVANTEST). Then, the volume of the conductive film was calculated based on the size of the conductive film (average thickness, width, length), and the specific resistance value was calculated based on the volume and the measured resistance value. The results are shown in Table 2.
(實施例2) 除了藉由以下的方法進行混合銀粉的製造以外,與實施例1同樣地實施各種操作及測定。將結果示於表1及表2中。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖3中。 (Example 2) Except that the mixed silver powder was produced by the following method, various operations and measurements were performed in the same manner as in Example 1. The results are shown in Tables 1 and 2. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in Figure 3.
<混合銀粉的製造> 〔前處理步驟〕 準備「AG-2-1C」作為銀粉B,然後,使用己二酸進行表面處理劑附著處理。再者,該銀粉B的利用雷射繞射散射式粒度分佈測定裝置而測定的體積基準的累計50%粒子徑(D 50)為0.80 μm,使用貿泰科(MOUNTECH)股份有限公司製造的圖像分析式粒度分佈測定軟體Mac-View進行合計100個以上的粒子外形的測量而得的形狀係數的平均值為1.53,縱橫比的平均值為1.3,平均Heywood徑為0.34 μm。 關於使用己二酸的表面處理劑附著處理,首先,準備將己二酸(純正化學股份有限公司製造)0.084 g溶解於乙醇溶媒0.756 g中而成的溶液。繼而,將該溶液添加至「AG-2-1C」120 g中,利用樣品磨機(協立理工(股)製造,SK-M10)混合4.5分鐘,利用己二酸對銀粉B表面進行處理。 <Production of mixed silver powder> [Pretreatment step] "AG-2-1C" was prepared as silver powder B, and then adipic acid was used to perform a surface treatment agent adhesion treatment. The volume-based cumulative 50% particle size ( D50 ) of the silver powder B measured using a laser diffraction scattering particle size distribution measuring device was 0.80 μm, and the average shape factor obtained by measuring the shape of more than 100 particles using image analysis particle size distribution measuring software Mac-View manufactured by MOUNTECH Co., Ltd. was 1.53, the average aspect ratio was 1.3, and the average Heywood diameter was 0.34 μm. For the surface treatment agent adhesion treatment using adipic acid, first, a solution was prepared by dissolving 0.084 g of adipic acid (manufactured by Junsei Chemical Co., Ltd.) in 0.756 g of an ethanol solvent. Then, the solution was added to 120 g of "AG-2-1C" and mixed for 4.5 minutes using a sample mill (manufactured by Kyoritsu Riko Co., Ltd., SK-M10), and the surface of the silver powder B was treated with adipic acid.
〔碎解步驟〕 首先,利用樣品磨機(協立理工(股)製造,SK-M10)以4.5分鐘對藉由與所述實施例1的銀粉A的製備方法相同的方法而獲得的銀粉A 120 g進行碎解。 [Pulverization step] First, 120 g of silver powder A obtained by the same method as the preparation method of silver powder A in Example 1 was pulverized using a sample mill (SK-M10, manufactured by Kyoritsu Riko Co., Ltd.) for 4.5 minutes.
〔混合步驟〕 將所述碎解步驟中獲得的銀粉A、與表面處理劑附著處理完畢的銀粉B以按照質量比計成為60:40(銀粉B/銀粉A=40/60)的方式混合而製造混合物(即,混合銀粉)。 [Mixing step] The silver powder A obtained in the crushing step and the silver powder B treated with a surface treatment agent are mixed in a mass ratio of 60:40 (silver powder B/silver powder A=40/60) to produce a mixture (i.e., mixed silver powder).
(實施例3) 除了藉由以下的方法進行混合銀粉的製造以外,與實施例1同樣地實施各種操作及測定。將結果示於表1及表2中。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖4中。 (Example 3) Except that the mixed silver powder was produced by the following method, various operations and measurements were performed in the same manner as in Example 1. The results are shown in Tables 1 and 2. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in Figure 4.
<混合銀粉的製造> 〔混合步驟〕 首先,將藉由與所述實施例1的銀粉A的製備方法相同的方法而獲得的銀粉A 72 g與銀粉B 48 g混合,獲得混合物。 <Production of mixed silver powder> [Mixing step] First, 72 g of silver powder A obtained by the same method as the preparation method of silver powder A in Example 1 and 48 g of silver powder B are mixed to obtain a mixture.
〔後處理步驟〕 準備將己二酸(純正化學股份有限公司製造)0.0336 g溶解於乙醇溶媒0.3024 g中而成的溶液。繼而,將該溶液添加至所述混合步驟中獲得的混合物120 g中,利用樣品磨機(協立理工(股)製造,SK-M10)混合7.5分鐘,利用己二酸對混合物的表面進行處理,製造混合銀粉。 [Post-treatment step] Prepare a solution in which 0.0336 g of adipic acid (manufactured by Junsei Chemical Co., Ltd.) is dissolved in 0.3024 g of an ethanol solvent. Then, add the solution to 120 g of the mixture obtained in the mixing step, mix for 7.5 minutes using a sample mill (manufactured by Kyoritsu Riko Co., Ltd., SK-M10), and treat the surface of the mixture with adipic acid to produce a mixed silver powder.
(比較例1) 不混合銀粉B,分取120 g的銀粉A,添加將己二酸(純正化學股份有限公司製造的己二酸,0.0336 g)溶解於乙醇溶媒0.3024 g中而成的溶液,利用樣品磨機混合4.5分鐘,使作為進一步的表面處理劑的己二酸附著於銀粉表面,除此以外,與實施例1同樣地實施各種操作及測定。將結果示於表1及表2中。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖5中。 (Comparative Example 1) Without mixing silver powder B, 120 g of silver powder A was taken, and a solution prepared by dissolving adipic acid (0.0336 g of adipic acid manufactured by Junsei Chemical Co., Ltd.) in 0.3024 g of ethanol solvent was added, and mixed for 4.5 minutes using a sample mill to allow adipic acid as a further surface treatment agent to adhere to the surface of the silver powder. Other operations and measurements were performed in the same manner as in Example 1. The results are shown in Tables 1 and 2. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in Figure 5.
(比較例2) 除了藉由以下的方法進行混合銀粉的製造以外,與實施例1同樣地實施各種操作及測定。將結果示於表1及表2中。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖6中。 (Comparative Example 2) Except that the mixed silver powder was produced by the following method, various operations and measurements were performed in the same manner as in Example 1. The results are shown in Tables 1 and 2. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in Figure 6.
<混合銀粉的製造> 〔碎解步驟〕 首先,利用樣品磨機(協立理工(股)製造,SK-M10)以4.5分鐘對藉由與所述實施例1的銀粉A的製備方法相同的方法而獲得的銀粉A 120 g進行碎解。 <Production of mixed silver powder> [Pulverization step] First, 120 g of silver powder A obtained by the same method as the preparation method of silver powder A in Example 1 was pulverized using a sample mill (SK-M10, manufactured by Kyoritsu Riko Co., Ltd.) for 4.5 minutes.
〔混合步驟〕 將所述碎解步驟中獲得的銀粉A、與銀粉B以按照質量比計成為60:40(銀粉B/銀粉A=40/60)的方式混合而製造混合物(即,混合銀粉)。 [Mixing step] The silver powder A obtained in the crushing step is mixed with the silver powder B in a mass ratio of 60:40 (silver powder B/silver powder A=40/60) to produce a mixture (i.e., mixed silver powder).
(比較例3) 於實施例1中的表面處理劑添加步驟中不添加表面處理劑,對第二液進行過濾、水洗、乾燥後,於150℃下熱處理10小時來促進粒子彼此的凝聚,於潤滑劑混合步驟中將添加的潤滑劑設為48.8 g(相對於供於潤滑劑混合步驟的銀粉的質量而為0.30質量%),如以下般進行部分性地進行扁平化的步驟,並且藉由以下的方法進行混合銀粉的製造,除此以外,與實施例1同樣地實施各種操作及測定。將結果示於表1及表2中。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖7中。再者,比較例3中的混合銀粉的剖面觀察是利用掃描式電子顯微鏡以3,000倍對各銀粒子進行觀察。 (Comparative Example 3) In the surface treatment agent addition step in Example 1, no surface treatment agent was added, the second liquid was filtered, washed with water, and dried, and then heat-treated at 150°C for 10 hours to promote the aggregation of particles. In the lubricant mixing step, the lubricant added was set to 48.8 g (0.30 mass % relative to the mass of the silver powder provided for the lubricant mixing step), and a partial flattening step was performed as follows. The mixed silver powder was produced by the following method. Except for this, various operations and measurements were performed in the same manner as in Example 1. The results are shown in Tables 1 and 2. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in Figure 7. Furthermore, the cross-sectional observation of the mixed silver powder in Comparative Example 3 was performed using a scanning electron microscope at 3,000 times magnification to observe each silver particle.
〔部分性地進行扁平化的步驟〕 將32 kg的潤滑劑混合銀粉與SUS球(直徑1.6 mm)256 kg投入至振動磨機(中央化工機股份有限公司製造,FVR-20型)中,以振動數1200 vpm處理120分鐘來作為部分性地進行扁平化的處理,使潤滑劑混合銀粉部分性地進行扁平化而獲得第二銀粉。由於振動數比實施例1大,因此與實施例1相比扁平化進一步進展,縱橫比大的銀粒子增加。 [Partial flattening step] 32 kg of lubricant-mixed silver powder and 256 kg of SUS balls (diameter 1.6 mm) were placed in a vibration mill (manufactured by Central Chemical Industry Co., Ltd., FVR-20 model) and subjected to partial flattening treatment at a vibration number of 1200 vpm for 120 minutes to partially flatten the lubricant-mixed silver powder and obtain a second silver powder. Since the vibration number is greater than that of Example 1, the flattening is further advanced compared to Example 1, and the number of silver particles with a large aspect ratio increases.
將第二銀粉與SUS球分離後,利用所述亨舍爾型混合器,以2600 rpm攪拌25分鐘並進行碎解。進而,為了自碎解後的第二銀粉中去除粗粒,而利用乾式篩裝置(富仁德・達博(Freund-Turbo)股份有限公司製造,TS125×200型/網眼27 μm篩子)進行篩分,獲得銀粉A。After the second silver powder was separated from the SUS ball, it was stirred and crushed at 2600 rpm for 25 minutes using the Henschel mixer. In addition, in order to remove coarse particles from the crushed second silver powder, it was screened using a dry screen device (manufactured by Freund-Turbo Co., Ltd., TS125×200 type/mesh 27 μm screen) to obtain silver powder A.
<混合銀粉的製造> 〔前處理步驟〕 準備「AG-2-1C」作為銀粉B,然後,使用己二酸進行表面處理劑附著處理。 關於使用己二酸的表面處理劑附著處理,首先,準備將己二酸(純正化學股份有限公司製造)0.084 g溶解於乙醇溶媒0.756 g中而成的溶液。繼而,將該溶液添加至「AG-2-1C」120 g中,利用樣品磨機(協立理工(股)製造,SK-M10)混合4.5分鐘,利用己二酸對銀粉B表面進行處理。 <Production of mixed silver powder> [Pretreatment step] "AG-2-1C" was prepared as silver powder B, and then a surface treatment agent adhesion treatment was performed using adipic acid. For the surface treatment agent adhesion treatment using adipic acid, first, a solution was prepared by dissolving 0.084 g of adipic acid (manufactured by Junsei Chemical Co., Ltd.) in 0.756 g of ethanol solvent. Then, the solution was added to 120 g of "AG-2-1C", mixed for 4.5 minutes using a sample mill (manufactured by Kyoritsu Riko Co., Ltd., SK-M10), and the surface of silver powder B was treated with adipic acid.
〔混合步驟〕 將所述獲得的銀粉A、與表面處理劑附著處理完畢的銀粉B以按照質量比計成為60:40(銀粉B/銀粉A=40/60)的方式混合而製造混合物(即,混合銀粉)。 [Mixing step] The obtained silver powder A and the silver powder B which has been subjected to the surface treatment agent adhesion treatment are mixed in a mass ratio of 60:40 (silver powder B/silver powder A=40/60) to produce a mixture (i.e., mixed silver powder).
[表1]
[表2]
如根據表2亦明確般,得知實施例1~實施例3的混合銀粉與比較例1~比較例3的混合銀粉相比較,能夠降低導電膜的比電阻。As is also clear from Table 2, it is known that the mixed silver powder of Examples 1 to 3 can reduce the specific resistance of the conductive film compared with the mixed silver powder of Comparative Examples 1 to 3.
另外,藉由以下的方法進行混合銀粉中的己二酸的含有比例的測定。 秤量0.1 g~0.2 g的試樣銀粉,使用刻度吸移管添加1 mL的作為甲基化試劑的氯化氫-甲醇試劑(Hydrogen Chloride-Methanol Reagent)(5%-10%)[用於酯化(for Esterification)](東京化成工業製造),照射1分鐘超音波,利用50℃的熱水浴加溫30分鐘。繼而,照射1分鐘超音波,進行藉由該些操作而溶出的己二酸的甲基化處理,生成己二酸二甲酯。 繼而,向甲基化結束的試料液中添加己烷5 mL與蒸餾水4 mL,進行4次1分鐘的振盪提取,藉此將己二酸二甲酯提取至有機溶媒(己烷)中。 然後,使用花生酸甲酯作為內標準物質,對提取有己二酸二甲酯的有機溶媒加入己烷,以25 mL定容,對如此而得者使用作為氣相層析定量分析裝置的GC-MS(GC:安捷倫科技(Agilent Technologies)7980B、MS:安捷倫科技(Agilent Technologies)5977B)進行基於MS離子化電子游離(Electron Ionization,EI)法的測定,根據所求出的己二酸二甲酯量並藉由換算計算來計算出己二酸量。藉由對該計算出的己二酸量與試樣銀粉量進行比較,而將試樣銀粉中所含的己二酸量(質量%)定量化。 In addition, the content ratio of adipic acid in the mixed silver powder was measured by the following method. 0.1 g to 0.2 g of the sample silver powder was weighed, and 1 mL of Hydrogen Chloride-Methanol Reagent (5%-10%) [for esterification] (manufactured by Tokyo Chemical Industry Co., Ltd.) as a methylation reagent was added using a graduated pipette, and ultrasonicated for 1 minute and heated in a 50°C hot water bath for 30 minutes. Then, ultrasonicated for 1 minute, the adipic acid dissolved by these operations was methylated to generate dimethyl adipate. Next, 5 mL of hexane and 4 mL of distilled water were added to the methylated sample solution, and the solution was shaken for 1 minute four times to extract dimethyl adipate into the organic solvent (hexane). Then, using arachidic acid methyl ester as an internal standard substance, hexane was added to the organic solvent in which dimethyl adipate was extracted to a constant volume of 25 mL. The obtained solution was measured using a GC-MS (GC: Agilent Technologies 7980B, MS: Agilent Technologies 5977B) as a gas chromatography quantitative analysis device based on the MS ionization (EI) method, and the amount of adipic acid was calculated by conversion calculation based on the amount of dimethyl adipate obtained. By comparing the calculated amount of adipic acid with the amount of sample silver powder, the amount of adipic acid (mass %) contained in the sample silver powder is quantified.
藉由該己二酸的含有比例的測定方法來調查混合銀粉中所含的己二酸量,結果實施例1為0.021質量%,實施例2為0.023質量%,實施例3為0.024質量%,比較例1為0.025質量%,比較例3為0.022質量%。未添加己二酸的比較例2為0.001質量%以下。The amount of adipic acid contained in the mixed silver powder was investigated by the method for measuring the content ratio of adipic acid. The results showed that the amount of adipic acid contained in Example 1 was 0.021 mass%, in Example 2 was 0.023 mass%, in Example 3 was 0.024 mass%, in Comparative Example 1 was 0.025 mass%, and in Comparative Example 3 was 0.022 mass%. The amount of adipic acid contained in Comparative Example 2, to which no adipic acid was added, was less than 0.001 mass%.
(實施例4) 除了藉由以下的方法來進行銀粉A的製備中的部分性地進行扁平化的步驟、及混合銀粉的製造以外,與實施例1同樣地實施各種操作及測定。將結果示於表3及表4中。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖8中。 (Example 4) Except that the step of partially flattening the silver powder A and the production of the mixed silver powder were performed by the following method, various operations and measurements were performed in the same manner as in Example 1. The results are shown in Tables 3 and 4. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in Figure 8.
<銀粉A的製備> 〔部分性地進行扁平化的步驟〕 將32 kg的所述潤滑劑混合銀粉與SUS球(直徑1.6 mm)256 kg投入至振動磨機(中央化工機股份有限公司製造,FVR-20型)中,以振動數780 vpm處理135分鐘,使潤滑劑混合銀粉部分性地進行扁平化。 <Preparation of Silver Powder A> [Partial Flattening Step] 32 kg of the above-mentioned silver powder mixed with lubricant and 256 kg of SUS balls (diameter 1.6 mm) were put into a vibration mill (FVR-20 model, manufactured by Central Chemical Industry Co., Ltd.) and processed at a vibration speed of 780 vpm for 135 minutes to partially flatten the silver powder mixed with lubricant.
將部分性地進行扁平化後的銀粉與SUS球分離後,利用噴射磨機型混合器(日清工程(Nisshin Engineering)製造的噴射磨機(jet mill)CJ-25),於將針對每1 kg銀粉供給的壓縮空氣(0.7 MPa)的供給量設為11.6 m 3的條件下進行碎解。然後,利用旋風器於每1 kg銀粉的空氣輸送中所使用的空氣量為46 m 3的條件下對碎解後的銀粉進行處理,將小的微粒子(切屑,例如粒徑小於0.1 μm)自碎解後的銀粉去除。旋風器亦可使用加入追加氣流而提高捕集效率的裝置。 After the partially flattened silver powder is separated from the SUS ball, it is crushed using a jet mill mixer (jet mill CJ-25 manufactured by Nisshin Engineering) under the condition that the supply amount of compressed air (0.7 MPa) is set to 11.6 m3 per 1 kg of silver powder. Then, the crushed silver powder is processed using a cyclone under the condition that the air volume used in the air transport per 1 kg of silver powder is 46 m3 , and small fine particles (chips, such as particles less than 0.1 μm) are removed from the crushed silver powder. The cyclone can also be used with a device that adds additional air flow to improve the collection efficiency.
<混合銀粉的製造> 〔混合步驟〕 將所述獲得的銀粉A 84 g與銀粉B 36 g混合而獲得混合物。 <Production of mixed silver powder> [Mixing step] 84 g of the obtained silver powder A and 36 g of silver powder B are mixed to obtain a mixture.
〔後處理步驟〕 準備將己二酸(純正化學股份有限公司製造)0.0336 g溶解於乙醇溶媒0.3024 g中而成的溶液。繼而,將該溶液添加至所述混合步驟中獲得的混合物120 g中,利用樣品磨機(協立理工(股)製造,SK-M10)混合4.5分鐘,利用己二酸對混合物的表面進行處理,製造混合銀粉。 [Post-treatment step] Prepare a solution in which 0.0336 g of adipic acid (manufactured by Junsei Chemical Co., Ltd.) is dissolved in 0.3024 g of an ethanol solvent. Then, add the solution to 120 g of the mixture obtained in the mixing step, mix for 4.5 minutes using a sample mill (manufactured by Kyoritsu Riko Co., Ltd., SK-M10), and treat the surface of the mixture with adipic acid to produce a mixed silver powder.
(比較例4) 不混合銀粉B,分取120 g的銀粉A,添加將己二酸(純正化學股份有限公司製造的己二酸,0.0336 g)溶解於乙醇溶媒0.3024 g中而成的溶液,利用樣品磨機混合4.5分鐘,使作為進一步的表面處理劑的己二酸附著於銀粉表面,除此以外,與實施例4同樣地實施各種操作及測定。將結果示於表3及表4中。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖9中。 (Comparative Example 4) Without mixing silver powder B, 120 g of silver powder A was taken, and a solution prepared by dissolving adipic acid (0.0336 g of adipic acid manufactured by Junsei Chemical Co., Ltd.) in 0.3024 g of ethanol solvent was added, and mixed for 4.5 minutes using a sample mill to allow adipic acid as a further surface treatment agent to adhere to the surface of the silver powder. Other operations and measurements were performed in the same manner as in Example 4. The results are shown in Tables 3 and 4. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in Figure 9.
(比較例5) 除了藉由以下的方法進行混合銀粉的製造以外,與實施例4同樣地實施各種操作及測定。將結果示於表3及表4中。另外,將所獲得的混合銀粉的掃描式電子顯微鏡照片示於圖10中。 (Comparative Example 5) Except that the mixed silver powder was produced by the following method, various operations and measurements were performed in the same manner as in Example 4. The results are shown in Tables 3 and 4. In addition, a scanning electron microscope photograph of the obtained mixed silver powder is shown in FIG10.
<混合銀粉的製造> 〔碎解步驟〕 首先,利用樣品磨機(協立理工(股)製造,SK-M10)以4.5分鐘對藉由與所述實施例4的銀粉A的製備方法相同的方法而獲得的銀粉A 120 g進行碎解。 <Production of mixed silver powder> [Pulverization step] First, 120 g of silver powder A obtained by the same method as the preparation method of silver powder A in Example 4 was pulverized using a sample mill (SK-M10 manufactured by Kyoritsu Riko Co., Ltd.) for 4.5 minutes.
〔混合步驟〕 將所述碎解步驟中獲得的銀粉A、與銀粉B以按照質量比計成為70:30(銀粉B/銀粉A=30/70)的方式混合而製造混合物(即,混合銀粉)。 [Mixing step] The silver powder A obtained in the crushing step is mixed with the silver powder B in a mass ratio of 70:30 (silver powder B/silver powder A=30/70) to produce a mixture (i.e., mixed silver powder).
[表3]
[表4]
如根據表4亦明確般,得知實施例4的混合銀粉與比較例4及比較例5的混合銀粉相比較,能夠降低導電膜的比電阻。As is also clear from Table 4, it is known that the mixed silver powder of Example 4 can reduce the specific resistance of the conductive film compared with the mixed silver powder of Comparative Examples 4 and 5.
另外,藉由所述己二酸的含有比例的測定方法來調查混合銀粉中所含的己二酸量,結果實施例4為0.026質量%,比較例4為0.026質量%。未添加己二酸的比較例5為0.001質量%以下。 [產業上的可利用性] In addition, the amount of adipic acid contained in the mixed silver powder was investigated by the above-mentioned method for measuring the content ratio of adipic acid. The result was 0.026% by mass in Example 4 and 0.026% by mass in Comparative Example 4. The amount of adipic acid not added in Comparative Example 5 was less than 0.001% by mass. [Industrial Applicability]
藉由本發明,可提供一種能夠降低導電膜的比電阻的混合銀粉。 另外,藉由本發明,可提供一種能夠降低導電膜的比電阻的混合銀粉的製造方法。 另外,藉由本發明,可提供一種能夠降低導電膜的比電阻的導電糊。 The present invention can provide a mixed silver powder capable of reducing the specific resistance of a conductive film. In addition, the present invention can provide a method for producing a mixed silver powder capable of reducing the specific resistance of a conductive film. In addition, the present invention can provide a conductive paste capable of reducing the specific resistance of a conductive film.
無without
圖1是用於說明與銀粒子剖面的外形外接且面積最小的長方形的長邊長度及短邊長度的確定方法的概略圖。 圖2是實施例1的混合銀粉的掃描式電子顯微鏡照片。 圖3是實施例2的混合銀粉的掃描式電子顯微鏡照片。 圖4是實施例3的混合銀粉的掃描式電子顯微鏡照片。 圖5是比較例1的混合銀粉的掃描式電子顯微鏡照片。 圖6是比較例2的混合銀粉的掃描式電子顯微鏡照片。 圖7是比較例3的混合銀粉的掃描式電子顯微鏡照片。 圖8是實施例4的混合銀粉的掃描式電子顯微鏡照片。 圖9是比較例4的混合銀粉的掃描式電子顯微鏡照片。 圖10是比較例5的混合銀粉的掃描式電子顯微鏡照片。 FIG1 is a schematic diagram for explaining a method for determining the length of the long side and the short side of a rectangle that circumscribes the outer shape of a silver particle cross section and has the smallest area. FIG2 is a scanning electron microscope photograph of the mixed silver powder of Example 1. FIG3 is a scanning electron microscope photograph of the mixed silver powder of Example 2. FIG4 is a scanning electron microscope photograph of the mixed silver powder of Example 3. FIG5 is a scanning electron microscope photograph of the mixed silver powder of Comparative Example 1. FIG6 is a scanning electron microscope photograph of the mixed silver powder of Comparative Example 2. FIG7 is a scanning electron microscope photograph of the mixed silver powder of Comparative Example 3. FIG8 is a scanning electron microscope photograph of the mixed silver powder of Example 4. FIG9 is a scanning electron microscope photograph of the mixed silver powder of Comparative Example 4. FIG10 is a scanning electron microscope photograph of the mixed silver powder of Comparative Example 5.
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