TW202409358A - Plating device and plating method including a plating tank, a substrate holder, a rotating mechanism, a raising-lowering mechanism and a control device - Google Patents

Abstract

A plating device according to the present invention includes a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate which is an object to be plated; a rotating mechanism which rotates the substrate holder; a raising-lowering mechanism which raises or lowers the substrate holder; and a control device. The substrate holder is equipped with a contact member configured to come into contact with the substrate and provide power supply; a sealing member configured to seal a gap between the substrate holder and the substrate; a liquid holding part having the contact member inside and configured to hold a liquid when the gap between the substrate holder and the substrate is sealed by the sealing member; and an ejection port which is open to the liquid holding part or to a space formed inside the substrate holder and communicating with the liquid holding part or can be disposed on a lateral side of the substrate holder, so as to eject the liquid.

Description

Plating device and plating method

The present invention relates to a coating device and a coating method.

As plating apparatuses, cup-type and immersion-type electroplating apparatuses are known. In cup-type electroplating apparatuses, a substrate (e.g., a semiconductor wafer) held in a substrate holder with the surface to be plated facing downward is immersed in a plating liquid, and a conductive film is deposited on the surface of the substrate by applying a voltage between the substrate and the anode (see Patent Documents 1 and 2). In immersion-type electroplating apparatuses, plating is performed with the surface to be plated facing sideways (see Patent Document 3).

The substrate holder of this plating device is provided with a contact member for contacting the substrate and supplying power. Furthermore, the substrate holder is provided with a sealing member that seals during the plating process so that the plating liquid does not come into contact with the contact member. In the electroplating apparatus of Patent Document 3, in order to prevent the plating liquid from entering the sealed space accommodating the contact member in the workpiece holding jig, the sealed space is filled with a liquid that does not contain a metal salt. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Invention Patent No. 7047200 [Patent Document 2] Japanese Invention Patent No. 7081063 [Patent Document 3] Japanese Invention Patent No. 6893142

[Problem to be solved by the invention]

If there are impurities such as components of the plating liquid inside the substrate holder, the metal components will accumulate and damage the contact members. In addition, it will become a cause of uneven power supply due to the dissolution of the seed layer of the substrate, which will lead to uneven plating thickness. It is desired to perform efficient plating processing and suppress the adverse effects on contact members caused by impurities inside the substrate holder.

The present invention was completed in view of the above-mentioned problems. One of its purposes is to propose a plating method and a plating device that can suppress adverse effects on contact members and the like caused by contaminants inside the substrate holder. [Means to solve the problem]

According to one aspect of the present invention, a plating device is provided. The plating device includes: a plating tank configured to accommodate a plating liquid; a substrate holder configured to hold a substrate that is an object to be plated; a rotation mechanism that rotates the substrate holder; and a lifting mechanism. a mechanism to raise and lower the substrate holder; and a control device; the substrate holder is provided with: a contact member configured to contact the substrate and provide power; and a sealing member configured to seal between the substrate holder and the substrate. The pressing member is disposed opposite to the sealing member to press the substrate against the sealing member; the liquid holding part has the contact member inside, and the liquid holding part is formed between the substrate holder and the substrate The liquid can be maintained when sealed by the sealing member; the discharge port is formed in the liquid holding part or a space opening in the substrate holder that communicates with the liquid holding part, or may be disposed in the liquid holding part. The side of the substrate holder spits out the aforementioned liquid.

According to another aspect of the present invention, a coating method is provided. The coating method is a coating method in which a coating process is performed by a coating device, wherein the coating device comprises: a coating tank configured to contain a coating liquid; a substrate holder configured to hold a substrate to be subjected to the coating process; a rotating mechanism configured to rotate the substrate holder; and a lifting mechanism configured to lift the substrate holder; the substrate holder comprises: a contact member configured to contact the substrate to supply electricity; a sealing member configured to seal the substrate holder and the substrate; a liquid holding portion having the contact member inside, the liquid holding portion being configured to be placed in the substrate holder; The coating method comprises the following steps: a step of mounting the substrate on the substrate holder; a step of discharging the liquid from the discharge port; a step of rotating the substrate holder so that the discharged liquid flows to the liquid holding portion or the liquid is evenly distributed in the liquid holding portion; and a step of performing the coating treatment on the mounted substrate.

The following is a description of the embodiments of the present invention with reference to the drawings. In the drawings described below, the same or equivalent components are given the same symbols and repeated descriptions are omitted.

First implementation type ＜Overall structure of plating equipment＞ FIG. 1 is a perspective view showing the overall structure of a plating device 1000 according to the first embodiment. FIG. 2 is a top view showing the overall structure of the plating apparatus 1000. As shown in FIGS. 1 and 2 , the plating device 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a prewet module 200 , a prepreg module 300 , a plating module 400 , and a cleaning module 500 . Rotary rinse dryer 600, transport device 700 and control module 800.

The loading port 100 is a module for moving substrates stored in a cassette such as a FOUP not shown in the figure into the coating apparatus 1000, or moving substrates from the coating apparatus 1000 to the cassette. In the present embodiment, four loading ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to receive and send substrates between the loading port 100, the aligner 120, and the transport device 700. When the transport robot 110 and the transport device 700 receive and send substrates between the transport robot 110 and the transport device 700, the substrates can be received and sent through a temporary table not shown in the figure.

The aligner 120 is a module used to align the position of the orientation plane or the cutout of the substrate in a predetermined direction. In this embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. In the prewet module 200, the coated surface of the substrate before the coating treatment is wetted with a treatment liquid (prewet liquid) such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The prewet module 200 is configured to implement a prewet treatment, which is to replace the treatment liquid inside the pattern with the coating liquid during coating, so as to facilitate the supply of the coating liquid to the inside of the pattern. In this embodiment, two pre-wetting modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-wetting modules 200 are arbitrary.

The prepreg module 300 is, for example, configured to perform a prepreg treatment using a treatment solution such as sulfuric acid or hydrochloric acid to etch a high-resistance surface such as a seed layer formed on the plated surface of the substrate before the plating treatment. Oxide film to remove it, to clean or activate the surface of the plated underlying layer. In this embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the prepreg modules 300 are arbitrary. The pre-impregnation process can also be omitted, and the plating device 1000 does not need to have a prepreg module. The plating module 400 performs a plating process on the substrate. In this embodiment, there are two groups of 24 plating modules 400 with 12 units each. In each group, 3 plating modules 400 are arranged side by side in the vertical direction and 4 units are arranged side by side in the horizontal direction. , but the number and configuration of the plating modules 400 are arbitrary.

The cleaning module 500 is configured to perform a cleaning process for removing residual coating liquid and the like on the substrate after the coating process. In this embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The rotary rinse dryer 600 is a module for rotating the substrate after the cleaning process at high speed to dry it. In this embodiment, two rotary rinse dryers are arranged side by side in the vertical direction, but the number and arrangement of the rotary rinse dryers are arbitrary. The transport device 700 is a device for transporting substrates between multiple modules in the coating device 1000. The control module 800 is configured to control multiple modules of the coating device 1000, and can be composed of, for example, a general computer or a dedicated computer having an input/output interface with an operator.

An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, the substrate stored in the cassette is loaded into the loading port 100 . Then, the transport robot 110 takes out the substrate from the cassette in the loading port 100 and transports the substrate to the aligner 120 . The aligner 120 aligns the position of the orientation plane, cutout, etc. of the substrate in a predetermined direction. The transfer robot 110 delivers the substrates aligned in the direction by the aligner 120 to the transfer device 700 .

The transport device 700 transports the substrate received from the transport robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting treatment on the substrate. The transport device 700 transports the substrate that has been pre-wetted to the pre-preg module 300. The pre-preg module 300 performs a pre-preg treatment on the substrate. The transport device 700 transports the substrate that has been pre-preg to the coating module 400. The coating module 400 performs a coating treatment on the substrate.

The transport device 700 transports the plated substrate to the cleaning module 500 . The cleaning module 500 performs cleaning processing on the substrate. The transport device 700 transports the cleaned substrate to the spin rinse dryer 600 . The spin rinse dryer 600 performs a drying process on the substrate. The transport device 700 transports the dried substrate to the transport robot 110 . The transfer robot 110 transfers the substrate received from the transfer device 700 to the cassette on the loading port 100 . Finally, the cassette containing the substrate is unloaded from the loading port 100 . ＜Composition of plating module＞

Next, the structure of the coating module 400 will be described. The 24 coating modules 400 in this embodiment have the same structure, so only one coating module 400 will be described. FIG. 3 is a longitudinal sectional view schematically showing the structure of the coating module 400 of this embodiment. As shown in FIG. 3 , the coating module 400 has a coating tank 410 for containing a coating liquid. The coating tank 410 is a container having a cylindrical side wall and a circular bottom wall, and a circular opening is formed at the top. In addition, the coating module 400 has an overflow tank 405 arranged on the outer side of the upper opening of the coating tank 410. The overflow tank 405 is a container for receiving the coating liquid overflowing from the upper opening of the coating tank 410.

The plating module 400 is provided with a diaphragm 420 that vertically separates the inside of the plating tank 410 . The interior of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by a separator 420 . The cathode region 422 and the anode region 424 are respectively filled with plating liquid. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode area 424. In the cathode region 422, a resistance body 450 is arranged to face the diaphragm 420. The resistor 450 is a member for uniformizing the plating process on the plated surface Wf-a of the substrate Wf, and is composed of a plate-shaped member in which a plurality of holes are formed. As long as the plating process can be performed with expected accuracy, the resistor 450 does not need to be disposed in the plating tank 410 .

The plating solution may be a solution containing ions of metal elements constituting the plating film, and specific examples thereof are not particularly limited. As an example of a plating process, a copper plating process can be used, and as an example of a plating liquid, a copper sulfate solution can be used. Furthermore, in this embodiment, the plating solution contains predetermined additives. However, it is not limited to this structure, and the plating liquid may also have a structure which does not contain additives.

The specific type of anode 430 is not particularly limited, and either a dissolving anode or a non-dissolving anode may be used. In this embodiment, an insoluble anode is used as the anode 430 . The specific type of this insoluble anode is not particularly limited, and platinum, iridium oxide, etc. can be used.

The coating module 400 also includes a substrate holder 440 that holds the substrate Wf in a state where the coating surface Wf-a faces downward. The coating module 400 includes a first lifting mechanism 442 that is used to lift the substrate holder 440. The first lifting mechanism 442 can be realized by a known mechanism such as a direct-acting actuator. The coating module 400 also includes a rotating mechanism 446 that rotates the substrate holder 440 so that the substrate Wf rotates around a virtual rotating shaft extending vertically in the center of the coating surface Wf-a. The rotating mechanism 446 can be realized by a known mechanism such as a motor.

The coating module 400 is configured as follows: the first lifting mechanism 442 is used to immerse the substrate Wf in the coating liquid in the cathode area 422, and the substrate Wf is rotated using the rotating mechanism 446 while a voltage is applied between the anode 430 and the substrate Wf, thereby performing a coating treatment on the coating surface Wf-a of the substrate Wf.

FIG. 4 is a schematic longitudinal cross-sectional view of a substrate holder 440. The substrate holder 440 includes: a support portion 490 for supporting a substrate Wf; a back plate assembly 492 for clamping the substrate Wf together with the support portion 490; and a rotation axis 491 extending vertically upward from the back plate assembly 492. The support portion 490 includes: a first upper member 493; a second upper member 496; and a support mechanism 494 for supporting the outer periphery of the plated surface Wf-a of the substrate Wf. The first upper member 493 holds the second upper member 496. In the illustrated example, the first upper member 493 extends in a substantially horizontal direction, and the second upper member 496 extends in a substantially vertical direction, but the present invention is not limited thereto. The support mechanism 494 is an annular member having an opening in the center for exposing the coated surface Wf-a of the substrate Wf. The support mechanism 494 is suspended and held by the second upper member 496. The second upper member 496 may be a columnar member, and one or more of the second upper members 496 are provided on the annular upper surface of the support mechanism 494.

The back plate assembly 492 includes a disk-shaped floating plate 492-2 that holds the substrate Wf together with the support mechanism 494. The floating plate 492-2 is arranged on the back side of the plated surface Wf-a of the substrate Wf. In addition, the back plate assembly 492 includes a disc-shaped back plate 492-1 arranged above the floating plate 492-2. In addition, the back plate assembly 492 is provided with: a floating mechanism 492-4 that lifts the floating plate 492-2 in a direction away from the back surface of the substrate Wf; and a pressing mechanism 492-3 that resists the pulling force from the floating mechanism 492-4. The floating plate 492-2 is pressed against the back surface of the substrate Wf.

The floating mechanism 492-4 includes a compression spring, which is installed between the upper end of a shaft extending upward from the floating plate 492-2 through the backing plate 492-1 and the backing plate 492-1. The floating mechanism 492-4 is configured in such a manner that the floating plate 492-2 is lifted upward through the shaft by the compression reaction force of the compression spring, and is pulled in a direction away from the back surface of the substrate Wf. In the following figures, the illustration of the floating mechanism 492-4 is appropriately omitted.

The pressing mechanism 492-3 is configured to press the floating plate 492-2 downward by supplying fluid to the floating plate 492-2 through a flow path (not shown) formed inside the back plate 492-1. The pressing mechanism 492-3 presses the substrate Wf toward the supporting mechanism 494 with a force stronger than the pulling force from the floating mechanism 492-4 during fluid supply. The floating plate 492-2 is a pressing member arranged to face a sealing member 494-2 (FIG. 5) described below, and is configured to press the substrate Wf against the sealing member 494-2.

The first lifting mechanism 442 raises and lowers the entire substrate holder 440 (arrow A10). The plating module 400 further has a second lifting mechanism 443. The second lifting mechanism 443 is driven by a conventional mechanism such as a linear actuator, and raises and lowers the rotating shaft 491 and the back plate assembly 492 relative to the support portion 490 (arrow A20). The rotating shaft 491 is formed with a discharge port 60 for discharging liquid and a supply channel 50 connected to the discharge port 60 so that the liquid can flow therethrough. The discharge port 60 will be described in detail later.

FIG5 is a schematic enlarged longitudinal sectional view showing a partial structure of the substrate holder 440. The supporting mechanism 494 includes an annular supporting member 494-1, which is used to support the outer periphery of the coated surface Wf-a of the substrate Wf. The supporting member 494-1 has a flange 494-1a, which protrudes to the outer periphery of the lower surface of the back plate assembly 492 (floating plate 492-2). An annular sealing member 494-2 is arranged on the flange 494-1a, which is configured to seal the substrate Wf. The sealing member 494-2 is an elastic member. The supporting member 494-1 supports the outer periphery of the coated surface Wf-a of the substrate Wf through the sealing member 494-2. When the substrate Wf is subjected to the plating process, the substrate Wf is sandwiched between the sealing member 494-2 and the floating plate 492-2, thereby sealing the space between the supporting member 494-1 (substrate holder 440) and the substrate Wf.

The support mechanism 494 includes an annular base 494-3 attached to the inner peripheral surface of the support member 494-1, and an annular conductive member 494-5 attached to the upper surface of the base 494-3. The base 494-3 is made of a conductive member such as stainless steel. The conductive member 494-5 is an annular member with conductivity, and may contain copper or other metals, for example.

The supporting mechanism 494 has a contact member 494-4, which is configured to be in contact with the substrate Wf and to supply electricity. The contact member 494-4 is annularly mounted on the inner peripheral surface of the base 494-3 by means of screws or the like. The supporting member 494-1 holds the contact member 494-4 via the base 494-3. The contact member 494-4 is a conductive member, which is used to supply electricity to the substrate Wf held on the substrate holder 440 from a power source not shown in the figure. The contact member 494-4 has: a plurality of substrate contacts 494-4a, which are in contact with the outer peripheral portion of the coated surface Wf-a of the substrate Wf; and a main body 494-4b, which extends upwards compared to the substrate contacts 494-4a.

The substrate holder 440 has a liquid holding portion 494L, which is configured as follows: when the substrate Wf is sealed by the sealing member 494-2, the liquid inside the substrate holder 440 can be held. The liquid holding portion 494L has a contact member 494-4 disposed therein. The liquid holding portion 494L may include a plurality of side walls that are opposite to each other and sandwich the contact member 494-4, and a bottom wall below the contact member 494-4. In the example shown in the figure, the liquid holding portion 494L includes the outer side surface of the circular plate-shaped floating plate 492-2, the inner side surface and the bottom surface of the supporting member 494-1. Thus, when the sealing member 494-2 is used to seal the substrate holder 440 and the substrate Wf, the contact member 494-4 can be efficiently covered with a small amount of liquid. Here, the outer side surface of the floating plate 492-2 exists above the sealing member 494-2 and extends in a substantially vertical direction. The so-called bottom surface of the supporting member 494-1 refers to a surface formed above the flange 494-1a protruding inward in the radial direction of the substrate holder 440 and extending along the flange 494-1a.

When the substrate Wf is not mounted on the substrate holder 440, the liquid will flow down through the gap between the floating plate 492-2 and the sealing member 494-2. If the substrate Wf sandwiched between the floating plate 492-2 and the sealing member 494-2 is sealed, the liquid holding portion 494L can hold the liquid and prevent the liquid from flowing down. In addition, a recess is formed in the bottom wall constituting the liquid holding portion 494L. When the substrate Wf is not mounted on the substrate holder 440, a small amount of liquid can be held in the liquid holding portion 494L.

FIG6 is a conceptual diagram for explaining the space inside the substrate holder 440. A discharge port 60 for discharging liquid L1 is formed inside the substrate holder 440. The discharge port 60 opens in the liquid holding portion 494L or in a space inside the substrate holder 440 that is connected to the liquid holding portion 494L. In the illustrated example, the discharge port 60 is formed above the floating plate 492-2 and opens in the internal space S1 above the floating plate 492-2. In the illustrated example, the discharge port 60 is formed on the rotating shaft 491, but is not limited to this. The discharge port 60 may, for example, be formed at a position above the floating plate 492-2 in the back plate 492-1. The discharge of liquid L1 from the discharge port 60 may be performed by the control module 800 controlling a valve or pump, not shown, disposed on the supply flow path 50.

The substrate holder 440 is configured to supply the liquid L1 discharged from the discharge port 60 to the liquid holding portion 494L. The liquid L1 supplied to the liquid holding part 494L covers at least a part of the contact member 494-4. The composition of the liquid L1 is not particularly limited as long as it has the effect of protecting the contact member 494-4. The liquid L1 preferably has a conductivity below a predetermined threshold or less than a predetermined threshold, has a low conductivity based on a predetermined threshold, or has been degassed.

The conductivity of liquid L1 is preferably 50 μS/cm or less, more preferably 10 μS/cm or less. If a highly conductive liquid exists around the contact member 494-4 and the substrate Wf, metal components may accumulate and cause damage. In addition to the current passing through the contact portion between the contact member 494-4 and the substrate Wf, the shunt current does not pass through the contact portion but flows between the seed layer of the substrate Wf and the contact member 494-4 through the liquid. At this time, the seed layer may become thin due to ionization and elution of copper in the seed layer. If the seed layer becomes thinner and the resistance increases, uneven power supply will occur. If the conductivity of the liquid L1 is low, this adverse effect can be suppressed. In addition, regarding the details of the shunt current, please refer to the above-mentioned Patent Document 2.

If an oxygen-containing liquid exists around the contact member 494-4 and the substrate Wf, oxygen ionization will occur and a local battery effect will occur in which the seed layer dissolves in the liquid. For example, if the copper in the seed layer donates electrons to the dissolved oxygen, the copper will become copper ions and dissolve while hydroxide ions are generated from the dissolved oxygen. Due to the local battery effect, the seed layer will become thinner and the resistance will increase, resulting in uneven power supply. If the liquid L1 is degassed, this adverse effect can be suppressed. In addition, for details on the local battery effect, please refer to the above-mentioned patent document 2.

From these viewpoints, liquid L1 is preferably pure water, ion-exchanged water, or degassed water.

In this embodiment, when the substrate holder 440 and the substrate Wf are sealed, the liquid L can be held in the liquid holding portion 494L. The liquid holding portion 494L can hold more liquid L1 than the vicinity of the contact member in Patent Document 2, so that the mixed substances such as the coating liquid near the contact member 494-4 are diluted to a lower concentration. Thereby, the adverse effects such as those described above caused by the mixed substances can be suppressed.

FIG7 is a conceptual diagram illustrating the control module 800. The control module 800 functions as a control device for controlling the operation of the coating module 400. The control module 800 has a computer such as a microcomputer, and the computer has a CPU (Central Processing Unit) 801 as a processor and a memory 802 as a temporary or non-temporary storage medium. The control module 800 controls the controlled part of the coating module 400 by the operation of the CPU 801. The CPU 801 can perform various processes by executing a program stored in the memory 802 or reading a program stored in a storage medium not shown in the figure into the memory 802 and executing it. The program includes, for example, a program for executing a transport robot, transport control of a transport device, control of processes in each processing module, control of coating processes in the coating module 400, control of processes related to liquid L1, and a program for detecting abnormalities in various devices. As a storage medium, for example, a computer-readable memory such as ROM, RAM, flash memory, a hard disk, a CD-ROM, a DVD-ROM, or a floppy disk, or a solid state hard disk, etc., which are known, can be used. The control module 800 is configured to communicate with an upper controller (not shown in the figure) that uniformly controls the coating device 1000 and other related devices, and it can transmit data with a database possessed by the upper controller. Part or all of the functions of the control module 800 can be constituted by hardware such as ASIC. Part or all of the functions of the control module 800 may also be constituted by a PLC, a sequencer, etc. Part or all of the control module 800 may be disposed inside and/or outside the frame of the coating device 1000. Part or all of the control module 800 may be connected to various parts of the coating device 1000 in a wired and/or wireless manner to enable communication.

8 to 13 illustrate the coating method of this embodiment, which are longitudinal cross-sectional views showing the state of the substrate holder 440 in time sequence. The coating method is performed under the control of the control module 800.

8 and 9 schematically show the steps of mounting the substrate Wf on the substrate holder 440. FIG. 8 is a diagram showing a state where the substrate Wf is arranged on the supporting member 494. In the example shown in the figure, the back plate assembly 492 including the floating plate 492-2 is raised by the second lifting mechanism 443. Thus, the substrate Wf is arranged on the supporting member 494 in a state where the gap between the supporting member 494 and the floating plate 492-2 is widened.

Fig. 9 is a diagram showing a state where the substrate Wf is sealed. The back plate assembly 492 is lowered by the second lifting mechanism 443. The floating plate 492-2 presses the substrate Wf against the supporting member 494, thereby sealing the space between the substrate holder 440 and the substrate Wf.

FIG. 10 is a diagram schematically showing the steps of discharging the liquid L1. The liquid L1 discharged from the discharge port 60 above the floating plate 492-2 is arranged on the back surface BS of the floating plate 492-2. The back surface BS is the surface of the floating plate 492-2 opposite to the side where the substrate Wf is disposed. In this way, the control module 800 is configured to eject the liquid L1 through the ejection port 60 to the liquid holding part 494L or a space connected to the liquid holding part 494L when the substrate Wf is sealed by the sealing member 494-2. Thereby, the liquid L1 can be stored in the liquid holding portion 494L that can maintain the state of the liquid L1, thereby reducing the concentration of the contaminants and suppressing adverse effects of the contaminants on the contact member 494-4 and the like. In addition, since the liquid L1 is supplied to the contact member 494-4 after the substrate Wf is mounted, the mixing of the plating liquid during the mounting of the substrate Wf and the mixing of the plating liquid due to leakage of the sealing member 494-2 , can also effectively suppress the above adverse effects. In the illustrated example, since the discharge port 60 is formed above the floating plate 492-2, the supply flow path 50 to the discharge port 60 can be shortened and simplified. Furthermore, by configuring the liquid L1 to be discharged toward the back surface BS, the liquid L1 can be supplied to the contact member 494-4 using the rotation mechanism 446.

FIG. 11 and FIG. 12 are diagrams schematically showing the steps of rotating the substrate holder 440. The rotating mechanism 446 rotates the substrate holder 440 with the axis intersecting the coated surface Wf-a as the rotation axis (arrow A30). As shown in FIG. 11, the liquid L1 on the back surface BS of the floating plate 492-2 flows radially outward (arrow A40) by the centrifugal force of this rotation. The liquid L1 flows to the liquid retaining portion 494L formed on the outer side of the floating plate 492-2. FIG. 12 is a diagram showing that the liquid L1 reaches the liquid retaining portion 494L and is retained in the liquid retaining portion 494L due to the flow during the rotation. In addition, by this rotation, the liquid L1 can be distributed more evenly in the liquid retaining portion 494L.

FIG. 13 is a diagram schematically showing the step of immersing the substrate holder 440 in the coating liquid for coating treatment. The first lifting mechanism 442 lowers the substrate holder 440 to the coating tank 410 to immerse at least the substrate Wf in the coating liquid. While the substrate Wf is immersed in the coating liquid, a voltage is applied between the substrate Wf and the anode 430 to perform the coating treatment. During the immersion of the substrate holder 440 and the coating treatment, the liquid L is held in the liquid holding portion 494L. When the substrate holder 440 is immersed in the coating liquid for coating treatment, the rotation of the substrate holder 440 may be stopped. However, from the viewpoint of making the thickness of the coating formed uniform, it is preferably rotated at a predetermined rotation speed.

FIG. 14 is an enlarged cross-sectional view schematically showing a substrate holder 440 of a liquid holding portion 494L holding liquid L1. The liquid level HL1 of the liquid L1 in the liquid holding portion 494L is preferably between the height H1 of the coated surface Wf-a of the substrate Wf and the height H2 of the back surface BS of the floating plate 492-2. If the liquid level HL1 of the liquid L1 is lower than the height H1, the contact member 494-4 cannot be fully coated, and an adverse effect may be caused by mixed substances. In addition, since the distance between the liquid level of the liquid L1 and the coated surface Wf-a is close, the seed layer may be easily oxidized due to oxygen dissolved from the liquid surface. If the liquid level HL1 of the liquid L1 is higher than the height H2, in addition to the inefficiency of the rotation due to the mass of the liquid L1, a large amount of the liquid L1 will flow down when the substrate Wf is removed from the substrate holder 440, and there is a concern that the coating liquid may be diluted. The control module 800 is preferably configured to discharge a preset amount of liquid L1. This amount is preferably set in the following manner: In the liquid holding portion 494L, the liquid level of the liquid L1 becomes the height between the coated surface Wf-a on the lower surface of the substrate Wf and the back surface BS on the upper surface of the floating plate 492-2.

FIG. 15 is a flow chart showing the flow of the plating method of this embodiment. In step S101, the substrate Wf is mounted on the substrate holder 440. After step S101, step S102 is performed. In step S102, the liquid L1 is discharged to the back surface BS of the floating plate 492-2 as a pressing member. After step S102, step S103 is performed. In step S103, the substrate holder 440 rotates. After step S103, step S104 is performed. In step S104, the substrate holder 440 is immersed in the plating liquid. After step S104, step S105 is performed. In step S105, a plating process is performed on the substrate Wf. After step S105, the substrate Wf is removed from the substrate holder 440 and transported to the cleaning module 500.

The coating device 1000 of this embodiment includes a substrate holder 440 and a rotating mechanism 446. The substrate holder 440 includes: a liquid holding portion 494L having a contact member 494-4 therein, the liquid holding portion 494L being configured to hold the liquid L1 when the substrate holder 440 and the substrate Wf are sealed by the sealing member 494-2; and a discharge port 60 being configured to discharge the liquid L1 by opening in the liquid holding portion 494L or in a space communicating with the liquid holding portion 494L inside the substrate holder 440. Thus, the coating device 1000 can be provided which can suppress the adverse effects of the mixed matter inside the substrate holder 440 on the contact member 494-4 and the like. Furthermore, the coating process can be efficiently performed by adjusting the amount of liquid L1 inside the substrate holder 440. Furthermore, compared with the case where the liquid is sprayed toward the contact member from the outside of the substrate holder, the concern that the liquid L1 flows down and dilutes the coating liquid when the liquid L1 is supplied to the contact member 494-4 can be reduced.

The coating method of this embodiment is a coating method performed by the above-mentioned coating apparatus 1000, and includes the following steps: a step of mounting the substrate Wf on the substrate holder 440; a step of discharging the liquid L1 from the discharge port 60; a step of rotating the substrate holder 440 so that the discharged liquid L1 flows to the liquid holding portion 494L or the liquid L1 is more evenly distributed in the liquid holding portion 494L; and a step of coating the mounted substrate Wf. In this way, the adverse effects of the impurities in the substrate holder 440 on the contact member 494-4 and the like can be more reliably suppressed.

The following modifications are also within the scope of the present invention and can be combined with the above-described embodiments or other modifications. In the following modifications, the same reference numerals are used for parts showing the same structures and functions as those in the above-mentioned embodiment, and descriptions thereof are appropriately omitted. (Modification 1-1)

In the above embodiment, a recess may be formed on the back surface of the floating plate serving as the pressing member.

Fig. 16 schematically shows the back side BS of the floating plate 492-2A of this modification, which is a cross-sectional view of the back plate assembly 492. In the illustrated example, 10 cylindrical pressing mechanisms 492-3 are arranged in a rotationally symmetrical manner on the back side BS, but the shape, number and position of the pressing mechanisms 492-3 are not particularly limited.

A recess 40A is formed in the central portion of the back side BS of the floating plate 492-2A so as to surround the central axis Ax1 of the floating plate 492-2A. The central axis Ax1 is preferably configured to be substantially consistent with the rotation axis of the substrate holder 440. The liquid L1 dropped from the discharge port 60 is temporarily held in the recess 40A. The recess 40A holds the liquid L1 in the central portion before being rotated by the rotating mechanism 446 (the above-mentioned step S103), thereby suppressing the deviation of the amount of liquid L1 flowing in each direction during rotation. In this way, the liquid L1 is more evenly distributed in the liquid holding portion 494L. (Variation 1-2)

In Modification 1-1, radial recesses may be formed on the back surface of the floating plate.

FIG. 17 schematically shows the back side BS of the floating plate 492-2B of the present modification, which is a cross-sectional view of the back plate assembly 492. In addition to the recess 40A, radially extending recesses 40B are also formed on the back side BS of the floating plate 492-2B. The liquid L1 discharged from the discharge port 60 easily flows radially through the recess 40B. Thus, when the rotating mechanism 446 is rotated in the above-mentioned step S103, the deviation of the amount of the liquid L1 flowing in each direction can be more reliably suppressed.

In the plating apparatus according to this modification, recessed portions 40A and 40B for flowing or retaining the liquid L1 are formed on the back surface BS of the floating plate 492-2B. This can suppress variation in the amount of liquid L1 flowing in each direction, and allow liquid L1 to be more uniformly distributed in the liquid holding portion 494L. In addition, the liquid L1 can be smoothly flowed to the liquid holding portion 494L, thereby improving the processing efficiency. In addition, the recessed portion 40B may be formed on the back surface BS instead of the recessed portion 40A. (Modification 1-3)

In the above-mentioned embodiment, the liquid L1 may be further allowed to flow to the liquid retaining portion 494L by tilting the substrate holder.

FIG. 18 is a schematic longitudinal cross-sectional view of a coating module 400A for illustrating the coating method of this modification. The coating module 400A has substantially the same structure as the above-mentioned coating module 400, but is different in that it has a tilting mechanism 447. The tilting mechanism 447 is configured to tilt the substrate holder 440, which can be achieved by a known mechanism such as a tilting mechanism. Here, the tilt of the substrate holder 440 refers to the tilt of the substrate Wf that can be arranged on the substrate holder 440, which is represented by, for example, the angle of the lower surface of the floating plate 492-2 relative to the horizontal.

After the control module 800 discharges the liquid L1 from the discharge port 60 toward the floating plate 492-2, it controls the rotation mechanism 446 and the tilting mechanism 447 to rotate the substrate holder 440 while tilting the back surface BS of the floating plate 492-2 relatively horizontally. This way the substrate holder 440 is tilted. Due to gravity, the liquid L1 easily flows to the liquid holding portion 494L located on the inclined lower side. Thereby, even in a case where the liquid L1 is difficult to flow by rotation, the liquid L1 can be supplied to the contact member 494-4 more reliably. From the viewpoint of distributing the liquid L1 more uniformly in the liquid holding portion 494L, the tilting mechanism 447 preferably tilts the substrate holder 440 in multiple different directions.

In addition, as shown in the example, when the substrate holder 440 with the substrate Wf mounted thereon is immersed in the coating liquid, if the substrate holder 440 is tilted by the tilting mechanism 447, the tilting causes bubbles to rise toward the liquid surface, so that bubbles are less likely to remain on the coating surface Wf-a. This can prevent the electric field from being disrupted by bubbles, and can reduce the uniformity of the thickness of the coating formed. In other words, the control module 800 can make the liquid L1 flow to the liquid holding portion 494L when the substrate holder 440 is tilted to prevent bubbles from entering the coating surface Wf-a.

FIG. 19 is a flow chart showing the flow of the plating method according to this modification. This plating method is performed by the control module 800. Steps S201, S202, and S205 are the same as steps S101, S102, and S105 of the above-mentioned flowchart of FIG. 15, so the description is omitted. After step S202, step S203 is performed. In step S203, the substrate holder 440 is immersed in the plating liquid while the substrate holder 440 is tilted and rotated by the tilting mechanism 447 and the rotation mechanism 446 respectively. After step S203, step S204 is performed. In step S204, the tilt mechanism 447 brings the substrate holder 440 into a horizontal position. Here, the so-called horizontal position means that the direction of the substrate holder 440 is substantially horizontal, so that the plated surface Wf-a can be plated as uniformly as expected. After step S204, step S205 is performed. (Modification 1-4)

In the above-mentioned embodiment, the liquid may be discharged from the outside of the substrate holder and disposed on the back side of the floating plate.

FIG. 20 is a longitudinal sectional view schematically showing the plating module 400B of this modification. The plating module 400B has substantially the same structure as the plating module 400 of the above-mentioned embodiment, but it is equipped with a substrate holder 440A instead of the substrate holder 440, and is further equipped with a liquid supply device 600. This point is different from the above-mentioned plating module 400B. The overlay mold set 400 is different. The substrate holder 440A has substantially the same structure as the substrate holder 440, but is equipped with a floating plate 492-2C instead of the floating plate 492-2, and does not have the supply flow path 50 and the discharge port 60, which is different from the substrate holder 440. different.

The liquid supply device 600 is configured to supply the liquid L1 to the floating plate 492-2C. The liquid supply device 600 has a nozzle 610 in which a discharge port 61 for discharging the liquid L1 is formed. The nozzle 610 is configured as follows: when the back plate 492-1 rises, the liquid L1 can be discharged from the outside of the substrate holder 440A toward the recessed portion 40C described later. The illustrated example is configured as follows: the liquid L1 discharged from the nozzle 610 passes between the first upper member 493 and the plurality of columnar second upper members 496 arranged on the outer periphery of the support member 494 and is injected into the interior of the substrate holder 440A. The discharge port 61 can be preferably arranged on the side of the substrate holder 440A. In other words, the outlet 61 is preferably disposed on the side of the substrate holder 440A or can flow to the side of the substrate holder 440A. In addition, from the perspective of making it easy for the liquid L1 to reach the recess 40C, the outlet 61 is preferably disposed on the side of the substrate holder 440A and can be disposed above the bottom surface S100 of the substrate holder 440A, and can be disposed above the highest reaching position of the back surface BS of the floating plate 492-2C. In this way, the outlet 61 for discharging the liquid L1 toward the recess 40C is formed in the liquid supply device 600.

FIG. 21 is a top view schematically showing the back side BS of the floating plate 492-2C of this modification. The floating plate 492-2C has substantially the same structure as the floating plate 492-2A of the above modification, but is different in that a recess 40C is formed therein instead of the recess 40A. The recess 40C is formed on the outer periphery of the floating plate 40C. Thus, it is easy to introduce the liquid L1 from the outside of the substrate holder 440A into the recess 40C.

22 to 24 are vertical cross-sectional views showing the state of the substrate holder 440A in time series for explaining the plating method of this modification. This plating method is controlled by the control module 800 .

FIG. 22 is a diagram schematically showing the step of disposing the liquid L1 inside the substrate holder 440A. When the second lifting mechanism 443 moves the back plate assembly 492 to separate it from the sealing member 494-2, the liquid L1 is ejected from the ejection port 61 of the nozzle 610 toward the recess 40C. At this time, it is preferred to rotate the substrate holder 440A by the rotating mechanism 446 so that the liquid L1 is distributed as much as possible around the entire periphery. Alternatively, the liquid supply device 600 may also be moved in a manner to eject the liquid L1 toward different positions of the recess 40C.

FIG. 23 is a diagram schematically showing the steps of mounting the substrate Wf on the substrate holder 440A on which the liquid L1 is arranged. The substrate Wf is placed on the support member 494, and the second lifting mechanism 443 lowers the back plate assembly 492, whereby the substrate holder 440A and the substrate Wf are sealed. The liquid L1 is still disposed in the recess 40C of the floating plate 492-2C.

Fig. 24 schematically shows the step of causing the liquid L1 in the recess 40C to flow to the liquid retaining portion 494L. When the substrate holder 440A is rotated by the rotating mechanism 446, the liquid L1 flows radially outward from the recess 40C disposed on the outer periphery of the floating plate 492-2C by centrifugal force and is retained in the liquid retaining portion 494L.

In the coating device and coating method of this variant, the outlet 61 for discharging the liquid L1 is arranged outside the substrate holder 440A, and the control module 800 is configured to discharge the liquid L1 from the outlet 61 outside the substrate holder 440A toward the floating plate 492-2C. Thereby, there is no need to set a supply flow path for discharging the liquid L1 to the substrate holder 440A, and the liquid L1 can be supplied to the inside of the substrate holder 440A more simply. (Variant 1-5)

In the above embodiment, the inside of the substrate holder can also be cleaned by discharging the liquid L1 into the inside of the substrate holder.

25 is a conceptual diagram showing a coating module 400C of this modification. The coating module 400C has the same structure as the coating module 400A of the above modification, but is different from the coating module 400A in that it includes a cleaning device 470. The cleaning device 470 includes an arm 474 and a cleaning nozzle 482.

The cleaning nozzle 482 discharges liquid L2 as a cleaning liquid. Liquid L2 may be pure water, degassed water, etc., and may have the same composition as liquid L1 or a different composition. The cleaning nozzle 482 is connected to a pipe (not shown), and discharges the liquid L2 introduced through the pipe from a liquid source (not shown) and supplied. In the illustrated example, the cleaning nozzle 482 is a nozzle that spits out the liquid L1 in a manner that spreads along a plane. The cleaning nozzle 482 may also be a linear nozzle that spits out the liquid L1 in substantially the same direction.

The cleaning device 470 has a driving mechanism 476 configured to rotate an arm 474. The driving mechanism 476 can be realized by a known mechanism such as a motor. The arm 474 is a plate-shaped member extending in the horizontal direction from the driving mechanism 476. The cleaning nozzle 482 is held on the arm 474. The driving mechanism 476 is configured to move the cleaning nozzle 482 between a cleaning position between the coating tank 410 and the substrate holder 440 and a retreat position retreated from the coating tank 410 and the substrate holder 440 by rotating the arm 474.

The cleaning device 470 includes a tray member 478 arranged below the cleaning nozzle 482 . The tray member 478 is configured to receive the liquid L2 discharged from the cleaning nozzle 482 and then flowed down after contacting the substrate holder 440 . In this modification, the cleaning nozzle 482 and the arm 474 are accommodated in the tray member 478 . The drive mechanism 476 is configured to rotate the cleaning nozzle 482, the arm 474, and the tray member 478 together between the cleaning position and the retracted position. However, the driving mechanism 476 can also drive the cleaning nozzle 482 and the arm 474 and the tray member 478 respectively.

In the cleaning method of the substrate holder 440 of this modification, after the liquid L1 is discharged from the discharge port 60 into the substrate holder 440 on which the substrate Wf is not mounted, the substrate holder 440 is rotated by the "rotating mechanism 446" and At least one of "the tilt mechanism 447 tilts the substrate holder 440" causes the liquid L1 to flow inside the substrate holder 440. By such a flow, the back surface BS of the floating plate 492-2, the contact member 494-4, the liquid holding part 494L, the sealing member 494-2, and the like can be cleaned. After cleaning the inside of the substrate holder 440, the liquid L1 flows down to the tray member 478 from between the floating plate 492-2 and the sealing member 494-2, so that it can be suppressed from diluting the plating liquid. On the other hand, the surface of the floating plate 492 - 2 on the side where the substrate Wf is disposed and the supporting member 494 are cleaned by the liquid L2 ejected from the cleaning nozzle 482 . The liquid L1 and the liquid L2 flowing down to the tray member 478 are discharged through a pipe (not shown). In addition, the liquid L2 discharged from the cleaning nozzle 482 may not be used, but the liquid L1 discharged from the discharge port 60 may be used for cleaning.

In this modification, the control module 800 is configured as follows: when the substrate Wf is not mounted on the substrate holder 440, the liquid L1 is discharged from the discharge port 60 to clean at least one of the back surface BS, the contact member 494-4, the liquid holding portion 494L, and the sealing member 494-2. Thus, after the substrate Wf is removed, damage to the contact member 494-4 and the like due to mixed substances such as the coating liquid can be suppressed.

FIG. 26 is a flow chart showing the process of the coating method of this variation. In step S301, the substrate Wf is subjected to coating treatment. After step S301, step S302 is performed. In step S302, the substrate Wf is removed from the substrate holder 440. After step S302, step S303 is performed. In step S303, liquid L1 is ejected to the back surface BS of the floating plate 492-2 as a pressing member. After step S303, step S304 is performed. In step S304, the tilting mechanism 447 or the rotating mechanism 446 tilts or rotates the substrate holder 440, respectively. After step S304, the process ends. (Variation 1-6)

In the above embodiment, the supporting member of the substrate holder may also be formed with an inclined surface for allowing liquid to be discharged to the outside of the substrate holder.

FIG. 27 is a longitudinal sectional view schematically showing the substrate holder 440B of this modification. The substrate holder 440B has substantially the same structure as the substrate holder 440 of the above embodiment, but is different from the substrate holder 440 in that it includes a support member 494A instead of the support member 494 . The support member 494A has substantially the same structure as the support member 494 described above, but is different from the support member 494 in that an inclined surface 494S is formed on the inner surface of the side wall constituting the liquid holding portion 494L. The inclined surface 494S has a height that becomes higher toward the radially outer side, making it easier to discharge the liquid L1 toward the radially outer side than a vertically extending side surface.

FIG. 28 is a longitudinal cross-sectional view schematically showing the cleaning method of the substrate holder 440B according to this modification. With the floating plate 492-2 lowered and in contact with the sealing member 494-2, the liquid L1 is discharged from the discharge port 60 and then rotated by the rotation mechanism 446. The liquid L1 located on the back surface BS of the floating plate 492-2 flows outward in the radial direction due to the centrifugal force of rotation, crosses the inclined surface 494S of the liquid holding part 494L, and flows toward the substrate holder from between the columnar second upper members 496. The outer discharge of 440B (arrow A50). Thereby, the liquid L1 flows outward smoothly in the radial direction, and the contact member 494-4 can be cleaned efficiently.

FIG. 29 is a flow chart showing the process of the coating method including the cleaning method of the substrate holder 440B of the present variation. The coating method is performed by the control module 800. In step S401, the substrate Wf is subjected to coating treatment. After step S401, step S402 is performed. In step S402, the substrate Wf is removed from the substrate holder 440B. After step S402, step S403 is performed. In step S403, the floating plate 492-2 as a clamping member is in contact with the sealing member 494-2. After step S403, step S404 is performed. In step S404, liquid L1 is ejected onto the back surface BS of the floating plate 492-2. After step S404, step S405 is performed. In step S405, the rotating mechanism 446 rotates the substrate holder 440B. After step S405, the process is completed. Second implementation type

The plating device of the second embodiment has the same configuration as the plating device 1000 of the first embodiment, but has a plating module 4000 instead of the plating module 400. This point is different from that of the plating device 1000. different. In the following, the same reference numerals will be used for parts showing the same structures and functions as those in the above-mentioned embodiment, and descriptions thereof will be appropriately omitted.

30 is a schematic longitudinal cross-sectional view of a coating module 4000 of this embodiment. The coating module 4000 has the same structure as the above-mentioned coating module 400, but it has a substrate holder 4400 instead of the substrate holder 440, and further has a conductivity meter 406 and a tray 406T, which is different from the above-mentioned coating module 400.

The substrate holder 4400 has the same structure as the substrate holder 440 described above, but is different from the substrate holder 440 in that the discharge port 90 opening to the liquid holding portion 494L and the discharge flow path 80 are formed. In the illustrated example, the substrate holder 4400 is provided with a support member 4940. In the support member 4940, the discharge port 90 is formed on the inner surface of the support member 4940 constituting the side wall of the liquid holding portion 494L. By forming the discharge port 90 inside the substrate holder 4400, the contaminants contained in the liquid L1 of the liquid holding portion 494L can be discharged in a state where the substrate Wf is removed, and the contamination of the contaminants to the contact member 494-4 and the like can be suppressed. of adverse effects. In addition, by discharging the liquid L1 in advance before removing the substrate Wf, it is possible to reduce the risk that the liquid L1 flows down to the plating solution and dilutes the plating solution when the substrate Wf is removed. Since the liquid L1 can be spouted and discharged, the amount of liquid L1 that can be held on the substrate holder 4400 is not limited, and a larger amount of liquid L1 can be supplied to the liquid holding portion 494L, thereby suppressing the impact of contaminants on the contact member. 494-4, etc. cause adverse effects.

The discharge flow path 80 passes through the inside of the substrate holder 4400 and communicates the discharge port 90 with the outside of the substrate holder 4400 . This can be appropriately adjusted to prevent the discharged liquid L1 from falling into the plating solution and diluting the plating solution. The discharge of the liquid L1 from the discharge port 90 can be controlled by a valve or a pump (not shown) provided in the discharge flow path 80 . In the illustrated example, the discharge flow path 80 sequentially passes through the support member 4940 , the second upper member 496 , the first upper member 493 and the rotation shaft 491 from the discharge port 90 . However, as long as the liquid L1 can be discharged from the substrate holder 4400 Internal discharge is not particularly limited. In the illustrated example, the liquid L1 discharged from the discharge channel 80 to the outside of the substrate holder 4400 is sent to the conductivity meter 406 through the tray 406T to measure the conductivity. In addition, the plating module 4000 does not need to be equipped with a conductivity meter.

FIG. 31 is a flow chart showing an example of the process of the coating method of the present embodiment. The coating method is performed by the control module 800. In step S501, the substrate Wf is mounted on the substrate holder 4400. After step S501, step S502 is performed. In step S502, liquid L1 is discharged from the discharge port 60. The discharged liquid L1 is retained in the liquid retaining portion 494L. Here, in order to make the liquid L1 flow to the liquid retaining portion 494L, or to make the liquid L1 more evenly distributed in the liquid retaining portion 494L, the substrate holder 4400 can also be rotated or tilted by the rotating mechanism 446 or the tilting mechanism 447. After step S502, step S503 is performed.

In step S503, the substrate holder 4400 is lowered by the first lifting mechanism 442, and the substrate holder 4400 is immersed in the coating liquid. After step S503, step S504 is performed. In step S504, the substrate Wf is subjected to coating treatment. In steps S503 and S504, the liquid L1 is held in the liquid holding portion 494L, so the concentration of the mixed matter is reduced, and the mixed matter can be suppressed from causing adverse effects on the contact member 494-4 and the like. After step S504, step S505 is performed.

In step S505, liquid L1 is discharged from the discharge port 90. For example, the liquid L1 may be discharged from the inside of the substrate holder 4400 so that the liquid L1 remains to an extent covering the substrate contacts 494-4b of the contact member 494-4. The liquid L1 inside the substrate holder 4400 may also be completely discharged. After step S505, step S506 is performed. In step S506, the substrate Wf is removed from the substrate holder 4400. In step S505, the amount of liquid L1 inside the substrate holder 440 is reduced. Therefore, when the substrate Wf is removed, the liquid L1 can be suppressed from flowing down to the plating solution and diluting the plating solution. The removed substrate Wf is transported to the cleaning module 500 .

The following variations are also within the scope of the present invention and can be combined with the above-mentioned embodiments or other variations. In the following variations, the same symbols are used to represent the same structures and functions as the above-mentioned embodiments, and the description is omitted as appropriate. (Variant 2-1)

In the above embodiment, the discharging operation and the discharging operation may be performed while the substrate holder 4400 is immersed in the plating liquid. Hereinafter, the operation of discharging the liquid L1 from the discharge port 60 is called a discharge operation, and the operation of discharging the liquid L1 from the discharge port 90 is called a discharge operation.

FIG. 32 is a flowchart showing the flow of the plating method according to this modification. This plating method is controlled by the control module 800 . In step S601, the substrate Wf is mounted on the substrate holder 4400. After step S601, step S602 is performed. In step S602, the substrate holder 4400 is lowered by the first lifting mechanism 442, and the substrate holder 4400 is immersed in the plating liquid. After step S602, step S603 is performed.

In step S603 , while the substrate holder 4400 is immersed in the plating liquid, the liquid L1 is discharged from the discharge port 60 and the liquid L1 is discharged from the discharge port 90 . The discharging operation and the discharging operation can be performed any number of times more than once. In the sealing member 494-2 and the substrate Wf, if foreign matter adheres to or is damaged at the parts in contact with each other, leakage will occur after sealing. When the substrate holder 4400 is immersed in the plating liquid, The plating liquid and the like enter the liquid holding portion 494L. In this modification, the discharge operation and the discharge operation are performed while the substrate holder 4400 is immersed in the plating liquid. This allows the contaminants such as the plating liquid that have entered the substrate holder 4400 to be discharged after the immersion, thereby reducing the impact of the contaminants on the substrate holder 4400. Contact member 494-4 and the like may cause adverse effects.

In the control module 800, when the conductivity of the discharged liquid L1 measured by the conductivity meter 406 is less than a predetermined threshold or below, the discharging and discharging operations can be stopped. Thereby, the plating process can be performed more reliably in a state where the concentration of contaminants present in the liquid holding portion 494L is low depending on the electrical conductivity. After step S603, step S604 is performed. In step S604, a plating process is performed on the substrate Wf. (Modification 2-2)

In the above-mentioned embodiment, the discharging and discharging operations can also be performed while the coating process is being performed. In this way, the concentration of the impurities can be more reliably reduced during the coating process, and the impurities can be prevented from causing adverse effects on the contact member 494-4 and the like.

The amount of liquid L1 discharged into the substrate holder 4400 is called a discharge amount, and the amount of liquid L1 discharged from the inside of the substrate holder 4400 is called a discharge amount. The control module 800 may control at least one of the discharge amount and the discharge amount according to the conductivity of the discharged liquid L1 measured by the conductivity meter 406 . For example, if the measured conductivity value of the liquid L1 is higher than a predetermined threshold, the concentration of contaminants may be high and may cause adverse effects such as accumulation of metal components. Therefore, the discharge volume and discharge volume can be increased at the same time. Alternatively, in this case, the discharge amount may only be increased to raise the liquid level of the liquid holding part 494L and reduce the concentration of the mixed matter. In addition, as the discharge amount or discharge amount, the discharge amount or discharge amount per unit time can also be controlled.

The manner in which the control module 800 controls the discharging operation and the discharging operation is not particularly limited. The spitting and discharging actions can be performed at the same time or at different times.

The control module 800 may also be configured to perform at least one of a discharging operation and a discharging operation intermittently. Thereby, on the one hand, the liquid L1 can be used efficiently, and on the other hand, the adverse effects of contaminants on the contact member 494-4 and the like can be reduced. The control module 800 may also be configured to continuously perform at least one of the discharging operation and the discharging operation during the plating process. This can further reduce the adverse effects of contaminants on the plating process during the plating process.

FIG. 33 is a flowchart showing the flow of the plating method according to this modification. This plating method is controlled by the control module 800 . Steps S701 and S702 are the same as steps S601 and S602 of the above-mentioned flowchart of FIG. 32 , so the description is omitted. After step S702, step S703 is performed. In step S703 , while the substrate Wf is subjected to a plating process, the liquid L1 is discharged from the discharge port 60 and the liquid L1 is discharged from the discharge port 90 . After the plating process is completed and the liquid L1 is discharged from the discharge port 90, the substrate Wf is preferably removed from the substrate holder 4400. (Modification 2-3)

In the above embodiment, when the substrate holder 4400 is immersed in the plating liquid, the liquid level of the liquid L1 in the substrate holder 4400 may be lower than the liquid level of the plating liquid in the plating tank 410 .

FIG. 34 is a longitudinal cross-sectional view of the substrate holder 4400 schematically showing the plating method of this modification. The control module 800 controls the first lifting mechanism 442 or the discharge or discharge of the liquid L1 so that the liquid level HL1 of the liquid L1 in the substrate holder 4400 is lower than the liquid level HS of the plating liquid. For example, the liquid level height HL1 of the liquid L1 is set to be higher than the liquid level height HS of the plating liquid. In this case, the substrate holder 4400 may be lowered by the first lifting mechanism 442, or the liquid L1 may be discharged from the discharge port 60 to raise the liquid level HL1 of the liquid L1.

The control module 800 of this modification is configured as follows: the substrate holder 4400 is immersed in the coating liquid so that the liquid level HL1 of the liquid L1 in the substrate holder 4400 is lower than the liquid level HS of the coating liquid. The inside of the coating tank 410 and the substrate holder 4400 is atmospheric pressure, so by this configuration, the water pressure of the coating liquid is higher than the water pressure of the liquid L1, so it is possible to suppress the liquid L1 from leaking into the coating liquid and diluting the coating liquid. Furthermore, by spouting and discharging the liquid L1 in the substrate holder 4400, the coating liquid and other components that have entered the substrate holder 4400 can also be discharged. In this way, on the one hand, the concentration of the mixed substances near the contact member 494-4 and the substrate Wf can be reduced, and on the other hand, the coating liquid can be suppressed from being diluted. In addition, when the outlet 90 is formed in the substrate holder 4400, the liquid level of the liquid L1 can also be higher than the back surface BS of the floating plate 492-2. (Variant 2-4)

In the above embodiment, the liquid discharge port may also be formed in the back plate assembly.

FIG. 35 is a longitudinal sectional view schematically showing the substrate holder 4400A of this modification. The substrate holder 4400A has substantially the same structure as the substrate holder 4400 described above, but is different from the substrate holder 4400 in that a discharge port 91 and a discharge flow path 81 are formed in place of the discharge port 90 and the discharge flow path 80 . The discharge port 91 is formed on one surface of the back plate 492-1 on the substrate Wf side. The discharge flow path 81 is configured to discharge the liquid L1 from the discharge port 91 through the back plate 492-1 and the rotation shaft 491 to the outside of the substrate holder 4400A. In this manner, by forming the discharge port 91 in a member disposed above the liquid holding portion 494L and shortening the discharge flow path 91 , the substrate holder 4400A can be constructed with a simpler structure. In this way, from the perspective of flexible design according to needs, the discharge port 91 can also be provided on at least one of the rotating shaft 491, the back plate assembly 492, and the side wall constituting the liquid holding portion 494L. (Modification 2-5)

In the above embodiment, the liquid discharge port may be formed at a position protruding from the space inside the substrate holder.

FIG. 36 is a longitudinal sectional view schematically showing the substrate holder 4400B of this modification. The substrate holder 4400B has substantially the same structure as the substrate holder 4400 described above, but is different from the substrate holder 4400 in that a discharge port 92 and a discharge flow path 82 are formed in place of the discharge port 90 and the discharge flow path 80 . The discharge port 92 is formed at an end portion of the tubular member at a position protruding from the surface of the back plate 492-1 on the substrate Wf side. The discharge flow path 82 is configured to discharge the liquid L1 from the discharge port 92 to the outside of the substrate holder 4400B through the back plate 492-1 and the rotation shaft 491. In this way, by forming the discharge port 92 at a protruding position in the internal space of the substrate holder 4400B, the substrate holder 4400B can be designed more flexibly. In addition, the discharge port 92 may be formed at a position protruding from any part of the substrate holder 4400B in addition to the back plate 492-1. (Modification 2-6)

In the above embodiment, the liquid discharged from the discharge port may be discharged from the discharge port.

37 is a schematic longitudinal cross-sectional view of a coating module 4000A of this modification. The coating module 4000A has substantially the same structure as the above-mentioned coating module 4000, but is different from the coating module 4000 in that it has a substrate holder 4400C instead of the substrate holder 4400 and an ion exchange column 407. The substrate holder 4400C has substantially the same structure as the plate holder 4400, but is different from the substrate holder 4400 in that it has an outlet 62 and a supply flow path 51 instead of the outlet 60 and the supply flow path 50.

The discharge port 62 is formed on the inner surface of the support member 4940 constituting the liquid holding portion 494L. Therefore, in this modification, both the discharge port 62 and the discharge port 90 are configured to open to the liquid holding portion 492L. The supply flow path 51 is connected to the discharge port 62 from the ion exchange column 407 through the rotation shaft 491, the first upper member 493, the second upper member 496, and the support member 4940, so that the liquid L1 can flow therein. The supply flow path 51 may be connected to a liquid source (not shown), and the liquid L1 may flow therein.

FIG. 38 is a conceptual diagram showing the arrangement of the discharge port 62 and the discharge port 90 in this modification. In this modification, the contact member 494-4 has an arc shape, and eight contact members 494-4 are arranged side by side in a ring shape in the liquid holding portion 494L. The discharge port 62 or the discharge port 90 is arranged between the two adjacent contact members 494-4. In the illustrated example, the discharge ports 62 and the discharge ports 90 are alternately arranged along the circumferential direction, but the configuration is not particularly limited to this as long as the liquid L1 can be discharged and discharged. From the same viewpoint, the number of each of the discharge port 62 and the discharge port 90 is not particularly limited as long as it is one or more. The shape of the contact member 494-4 can be appropriately designed to facilitate power supply to the substrate Wf, and is not limited to the illustrated example.

Returning to FIG. 37 , the liquid L1 discharged from the discharge port 90 is introduced into the ion exchange column 407 through the discharge flow path 80 . The ion exchange column 407 is provided with an ion exchange resin capable of deionizing liquid L1. In the ion exchange column 407, the liquid L1 is sent to perform ion exchange and the conductivity is reduced. The liquid L1 discharged from the ion exchange column 407 is discharged from the discharge port 62 through the supply flow path 51 . The discharge flow path 80 and the supply flow path 51 constitute a flow path that communicates the discharge port 90 with the discharge port 62 without passing through the liquid holding portion 494L and the space inside the substrate holder 4400C communicating with the liquid holding portion 494L. In this manner, the substrate holder 4000A is configured such that the liquid L1 circulates between the inside and the outside of the substrate holder 4400C.

In the example shown in the figure, the conductivity of the circulating liquid L1 is prevented from increasing by the ion exchange column 407. However, in addition to or instead of the ion exchange column 407, the coating module 4000A may also be provided with a conductivity meter 406 (FIG. 30). In this case, the following configuration may be adopted: when the conductivity of the discharged liquid L1 measured by the conductivity meter 406 is less than or below a predetermined threshold value, new liquid L1 that has not yet been discharged into the substrate holder 4400C is discharged from the discharge port 62.

In the coating method of this variation, the substrate holder 4400C is further provided with a flow path that connects the discharge port 90 with the discharge port 62 without passing through the liquid holding portion 494L and the space inside the substrate holder 4400C that is connected to the liquid holding portion 494L, and the control module 800 is configured to discharge the liquid L1 discharged from the discharge port 90 from the discharge port 62. In this way, on the one hand, the liquid L1 can be used efficiently, and on the other hand, the adverse effects of mixed substances on the contact member 494-4 can be reduced. In addition, when the liquid L1 is circulated, the positions of the discharge port 62 and the discharge port 90 are not particularly limited. It is also possible to circulate the liquid L1 through the discharge port 60 of the above-mentioned embodiment instead of the discharge port 62. From the perspective of flexible design in response to needs such as shortening the supply flow path, the discharge port 62 can be arranged on at least one of the rotating shaft 491, the back plate assembly 492, and the side wall constituting the liquid retaining portion 494L. (Variant 2-7)

In the above-mentioned embodiment, the coating module 4000 may not have the rotating mechanism 446. The coating module 4000 may also be configured as an immersion type coating device. In this case, as described in Patent Document 3, the substrate Wf, the resistance body 450 and the anode 430 may be arranged along the lead vertical direction respectively. Even if the substrate holder 4400 is not rotated, the contact member 494-4 and the like may be cleaned by the ejection action and the discharge action at least at one time point before the immersion of the substrate holder 4400, during the immersion, during the coating process and after the immersion is completed.

The present invention can also be described in the following forms. [Type 1] According to Type 1, a plating device is proposed, which includes: a plating tank configured to accommodate a plating liquid; and a substrate holder configured to hold a substrate to be plated Object; a rotation mechanism that rotates the substrate holder; a lift mechanism that lifts the substrate holder; and a control device; the substrate holder is provided with: a contact member configured to contact the substrate and enable power supply; and a sealing member configured to The method of sealing the substrate holder and the substrate; the pressing member is disposed opposite to the sealing member to press the substrate against the sealing member; and the liquid holding portion has the contact member inside, The liquid holding part is configured to hold liquid when the substrate is sealed by the sealing member; and the discharge port is formed as a space opening in the liquid holding part or inside the substrate holder that communicates with the liquid holding part, or It can be arranged on the side of the substrate holder to discharge the liquid. According to the aspect 1, it is possible to provide a plating device that can suppress adverse effects of contaminants inside the substrate holder on contact members and the like.

[Mode 2] According to the mode 2, in the mode 1, the discharge port is formed in at least one of a side wall constituting the liquid holding portion, a rotation shaft of the substrate holder, and a back plate assembly. According to type 2, the liquid supply flow path, etc. can be shortened, allowing for flexible design according to needs.

[Pattern 3] According to Pattern 3, in Pattern 1 or 2, the liquid holding portion is configured to include an outer surface of the pressing member, an inner surface and a bottom surface of a support member that supports the contact member. According to Mode 3, when the substrate is sealed by the sealing member, the contact member can be efficiently covered with a small amount of liquid.

[Type 4] According to Type 4, in any one of Types 1 to 3, the control device is configured such that when the substrate is sealed by the sealing member, through the discharge port, the control device is connected to the The liquid is discharged from the liquid holding part or the space communicated with the liquid holding part. According to the aspect 4, the liquid can be accumulated in the liquid holding part capable of maintaining the liquid state, and adverse effects of contaminants on contact members and the like can be suppressed.

[Type 5] According to Type 5, in any one of Types 1 to 4, the substrate holder is configured to hold the substrate with the plated surface of the substrate facing downward, and the rotation mechanism, The substrate holder is rotated using an axis intersecting the plated surface when the substrate is arranged on the substrate holder as a rotation axis. According to the fifth aspect, the rotation mechanism can be used to cause the liquid discharged into the substrate holder to flow to the liquid holding portion, or to be more uniformly distributed in the liquid holding portion. Furthermore, by performing the plating process while rotating the substrate holder, the thickness of the formed plating can be made more uniform.

[Pattern 6] According to Pattern 6, in Pattern 5, the discharge port is formed above the pressing member, and the discharge port is configured to discharge the liquid to the back of the surface of the pressing member on which the substrate is disposed. Attitude. According to type 6, the discharge port is formed above the pressing member, thereby shortening and simplifying the supply flow path to the discharge port. Furthermore, by configuring the liquid to be discharged to the back surface of the pressing member, the rotating mechanism can efficiently supply the liquid to the contact member.

[Form 7] According to Form 7, in Form 6, a recessed portion for holding or flowing the liquid is formed on the back surface of the pressing member. According to Form 7, the liquid can be efficiently flowed to the liquid holding portion, or the liquid can be more evenly distributed in the liquid holding portion.

[Mode 8] According to the mode 8, in the mode 7, the recessed portions are formed in a radial shape, surround the central axis of the pressing member, or are formed in the outer peripheral portion of the pressing member. According to the aspect 8, the liquid can flow to the liquid holding portion more reliably and efficiently, or the liquid can be distributed more uniformly in the liquid holding portion.

[Mode 9] According to Mode 9, in any one of Modes 6 to 8, the control device is configured such that when the substrate is not mounted on the substrate holder, the liquid is ejected from the ejection port to clean at least one of the back surface, the contact member, the liquid retaining portion, and the sealing member. According to Mode 9, damage to the contact member and the like due to mixed matter after the substrate is removed can be suppressed.

[Mode 10] According to the mode 10, in the mode 9, the liquid holding portion is provided with an inclined surface having a height that becomes higher in the radial direction outward, and the control device is configured as follows: when the substrate is not mounted on the substrate In the case of a holder, in a state where the pressing member and the sealing member are brought into contact, the rotation mechanism is controlled to rotate the substrate holder, thereby causing the liquid to be discharged from the liquid holding portion across the inclined surface to the inclined surface. outside. According to the mode 10, since the liquid flows smoothly outward in the radial direction, the contact member can be cleaned efficiently.

[Mode 11] According to the mode 11, in any one of the modes 5 to 10, the control device is configured to control the rotation mechanism after the liquid is ejected into the space through the ejection port. The substrate holder rotates, thereby causing the liquid to flow to the liquid holding part or distributing the liquid more uniformly in the liquid holding part. According to the aspect 11, during the plating process, a rotating mechanism that makes the thickness of the plating formed more uniform can be appropriately used to supply the liquid to the contact member.

[Mode 12] According to Mode 12, in any one of Modes 1 to 11, a tilting mechanism for tilting the substrate holder is further provided, and the control device is configured as follows: after the liquid is ejected into the space through the ejection port, the tilting mechanism is controlled to tilt the substrate holder, thereby causing the liquid to flow to the liquid holding portion or causing the liquid to be more evenly distributed in the liquid holding portion. According to Mode 12, gravity can be used to more reliably supply the liquid to the contact member.

[Aspect 13] According to aspect 13, in aspect 12, the control device is configured to control the elevating mechanism so that the substrate holder mounted with the substrate is immersed in the plating tank. The tilting mechanism tilts the substrate holder, thereby causing the liquid to flow to the liquid holding portion. According to the mode 13, the substrate holder can be impregnated while preventing air bubbles from entering the surface to be plated, and the liquid can be caused to flow to the liquid holding portion.

[Mode 14] According to Mode 14, in any of Modes 1 to 13, the control device is configured as follows: in the liquid holding portion, a preset amount of the liquid is discharged so that the liquid level is located between the lower surface of the substrate and the upper surface of the pressing member. According to Mode 14, the contact member can be fully coated with the liquid, and the adverse effect of dissolved oxygen on the seed layer can be reduced. In addition, the substrate can be efficiently rotated, reducing the concern that the liquid will flow down to the coating liquid and dilute the coating liquid.

[Mode 15] According to the mode 15, in any one of the modes 1 to 14, a discharge port is further provided, which opens in the liquid holding part or the space communicating with the liquid holding part, and is present in the liquid holding part. The liquid in the liquid holding part or the space is discharged. According to the aspect 15, when the substrate is not mounted on the substrate holder, contaminants contained in the liquid are discharged, thereby suppressing adverse effects of the contaminants on contact members and the like.

[Mode 16] According to Mode 16, in Mode 15, the discharge port is formed on a side wall constituting the liquid holding portion, and at least one of the rotation axis and the back plate assembly of the substrate holder. According to Mode 16, the discharge flow path can be shortened, and a flexible design can be performed according to needs.

[Mode 17] According to Mode 17, in Mode 15 or 16, the substrate holder is further provided with a flow path connecting the discharge port with the outside of the substrate holder. According to Mode 17, appropriate adjustment can be made to prevent the discharged liquid from flowing down to the coating liquid and diluting the coating liquid.

[Mode 18] According to the mode 18, in the mode 15 or 16, the substrate holder further has a flow path that communicates the discharge port and the discharge port without passing through the liquid holding part and the space, The control device is configured to discharge the liquid from the discharge port before it is discharged from the discharge port. According to type 18, liquid can be used efficiently and adverse effects of contaminants on contact members and the like can be reduced.

[Aspect 19] According to aspect 19, in aspect 18, it further includes at least one of an ion exchange resin and a conductivity meter arranged in the flow path. According to the type 19, the discharged liquid can be discharged from the discharge port while the conductivity is low.

[Mode 20] According to Mode 20, in any one of Modes 15 to 19, the control device is configured such that, when the substrate is mounted on the substrate holder, the liquid is ejected from the ejection port and at the same time or at different times, at least a portion of the liquid held in the liquid holding portion is ejected from the discharge port. According to Mode 20, the amount of liquid that can be held in the substrate holder is not limited, a larger amount of liquid can be supplied to the liquid holding portion, and the adverse effects of mixed matter on the contact member and the like can be further suppressed.

[Mode 21] According to Mode 21, in Mode 20, the control device is configured such that the ejection action and the discharge action are performed while the substrate holder on which the substrate is mounted is immersed in the coating liquid. According to Mode 21, impurities such as the coating liquid that have entered the substrate due to immersion can be discharged, and the adverse effects of the impurities on contact components can be reduced.

[Mode 22] According to the mode 22, in the mode 21, the control device is configured such that the liquid level of the liquid in the substrate holder is lower than the liquid level of the plating liquid, The substrate holder is immersed in the plating liquid. According to Mode 22, since the water pressure of the plating liquid is higher than the water pressure of the liquid inside the substrate holder, leakage of the liquid can be suppressed and the plating liquid can be diluted.

[Mode 23] According to the mode 23, in the mode 21 or 22, the control device is configured to perform the ejection operation and the discharge operation while the plating process is in progress. According to the aspect 23, it is possible to more reliably suppress the adverse effects of contaminants on contact members and the like during the plating process.

[Mode 24] According to Mode 24, in any one of Modes 20 to 23, the control device is configured such that the discharge operation is performed after the coating process is performed and before the substrate is removed. According to Mode 24, it is possible to suppress the liquid from flowing down into the coating liquid and diluting the coating liquid when the substrate is removed.

[Form 25] According to Form 25, in any one of Forms 20 to 24, the control device is configured to intermittently perform at least one of the spitting action and the discharge action. According to Form 25, the liquid can be used efficiently, and the adverse effects of mixed substances on contact components can be reduced.

[Form 26] According to Form 26, in any one of Forms 20 to 24, the control device is configured such that at least one of the ejection action and the discharge action is continuously performed during the coating process. According to Form 26, the adverse effects of the mixed matter on the contact components can be more reliably reduced.

[Type 27] According to Type 27, in any one of Types 1 to 26, the liquid has a conductivity lower than a predetermined threshold or is degassed. According to the type 27, it is possible to suppress adverse effects of ions, dissolved oxygen, etc. contained in the liquid on contact members and the like.

[Form 28] According to Form 28, a coating method is proposed, which is a coating method in which a coating process is performed by a coating device, wherein the coating device comprises: a coating tank configured to contain a coating liquid; a substrate holder configured to hold a substrate to be subjected to the coating process; a rotating mechanism configured to rotate the substrate holder; and a lifting mechanism configured to lift the substrate holder; the substrate holder comprises: a contact member configured to contact the substrate to supply electricity; a sealing member configured to seal the substrate holder and the substrate; a liquid retaining portion having the contact member therein, the liquid retaining portion The substrate holder and the substrate are configured to be sealed by the sealing member so as to retain the liquid; and the outlet is opened in the liquid retaining portion or in the space in the substrate holder that is connected to the liquid retaining portion, or can be arranged on the side of the substrate holder; the coating method includes: the step of mounting the substrate on the substrate holder; the step of discharging the liquid from the outlet; the step of rotating the substrate holder so that the discharged liquid flows to the liquid retaining portion or the liquid is evenly distributed in the liquid retaining portion; and the step of performing the coating treatment on the mounted substrate. According to the form 28, it is possible to suppress the adverse effects of the impurities in the substrate holder on the contact member and the like.

The embodiments of the present invention have been described above. However, the embodiments of the invention described above are used to make the present invention easier to understand and do not limit the present invention. The present invention can be modified and improved without departing from the gist of the invention, and the present invention naturally includes equivalents thereof. In addition, the embodiments and modifications may be arbitrarily combined within the scope in which at least part of the above-mentioned problems can be solved or at least part of the effects may be exerted, and the constituent elements described in the patent application and the specification may be arbitrarily combined or omitted. .

40A, 40B, 40C: recess 50, 51: supply flow path 60, 61, 62: outlet 80, 81, 82: discharge flow path 90, 91, 92: outlet 100: loading port 110: transport robot 120: aligner 200: pre-wetting module 300: pre-preg module 400, 400A, 400B, 400C, 4000, 4000A: coating module 4400B: substrate holder 405: overflow tank 406: conductivity meter 406T: tray 407: ion exchange column 410: coating tank 420: diaphragm 422: cathode area 424: Anode area 430: Anode 440,440A,440B,4400,4400A, 4400B,4400C: Substrate holder 442: First lifting mechanism 443: Second lifting mechanism 446: Rotation mechanism 447: Tilt mechanism 450: Resistance body 470: Cleaning device 474: Arm 476: Driving mechanism 478: Tray member 482: Cleaning nozzle 490: Support part 491: Rotation axis 492: Back plate assembly 492-1: Back plate 492-2,492-2A,492-2B,492-2C: Floating plate 492-3: Pressing mechanism 492-4: Floating mechanism 493: First upper member 494,494A,4940: Support mechanism 494L: Liquid holding part 494S: Inclined surface 494-1: Support member 494-1a: Flange 494-2: Sealing member 494-3: Base 494-4: Contact member 494-4a: Substrate contact 494-4b: Body 494-5: Conductive member 496: Second upper member 500: Cleaning module 600: Liquid supply device 610: Nozzle 700: Transport device 800: Control module 801:CPU 802:Memory 1000:Coating device A10:arrow A20:arrow A30:arrow A40:arrow A50:arrow Ax1:Center axis of floating plate BS:Back side of floating plate H1:Height of coated surface H2:Height of back side of floating plate HL1:Height of liquid level of discharged liquid HS:Height of coating liquid level L1,L2:Liquid S1:Internal space Wf:Substrate Wf-a:Coated surface S100:Bottom surface S101~S105,S201~S205,S301~ S304,S401~405,S501~S506, S601~S604,S701~S703: Steps

FIG. 1 is a perspective view showing the overall structure of the coating device of the first embodiment. FIG. 2 is a top view showing the overall structure of the coating device of the first embodiment. FIG. 3 is a longitudinal sectional view schematically showing the structure of the coating module of the first embodiment. FIG. 4 is a longitudinal sectional view schematically showing the substrate holder of the first embodiment. FIG. 5 is a longitudinal sectional view schematically showing the substrate holder of the contact member of the first embodiment. FIG. 6 is a longitudinal sectional view schematically showing the liquid holding portion of the substrate holder. FIG. 7 is a conceptual diagram showing the structure of the control module of the first embodiment. FIG. 8 is a longitudinal sectional view of the substrate holder for explaining the coating method of the first embodiment. FIG. 9 is a longitudinal sectional view of a substrate holder for illustrating the coating method of the first embodiment. FIG. 10 is a longitudinal sectional view of a substrate holder for illustrating the coating method of the first embodiment. FIG. 11 is a longitudinal sectional view of a substrate holder for illustrating the coating method of the first embodiment. FIG. 12 is a longitudinal sectional view of a substrate holder for illustrating the coating method of the first embodiment. FIG. 13 is a longitudinal sectional view of a substrate holder for illustrating the coating method of the first embodiment. FIG. 14 is an enlarged sectional view schematically showing a liquid holding portion. FIG. 15 is a flow chart showing the process of the coating method of the first embodiment. FIG. 16 is a top view schematically showing the floating plate of Modification 1-1. FIG. 17 schematically shows a top view of a floating plate of variant 1-2. FIG. 18 is a longitudinal cross-sectional view illustrating a coating method of variant 1-3. FIG. 19 is a flow chart showing a process of a coating method of variant 1-3. FIG. 20 is a longitudinal cross-sectional view schematically showing a coating module of variant 1-4. FIG. 21 is a schematic top view of a floating plate of variant 1-4. FIG. 22 is a longitudinal cross-sectional view of a substrate holder illustrating a coating method of variant 1-4. FIG. 23 is a longitudinal cross-sectional view of a substrate holder illustrating a coating method of variant 1-4. FIG. 24 is a longitudinal cross-sectional view of a substrate holder illustrating a coating method of variant 1-4. FIG. 25 is a schematic longitudinal section view of a coating module of variant 1-5. FIG. 26 is a flow chart showing the process of the coating method of variant 1-5. FIG. 27 is a schematic longitudinal section view of a substrate holder of variant 1-6. FIG. 28 is a longitudinal section view of a substrate holder for explaining the coating method of variant 1-6. FIG. 29 is a flow chart showing the process of the coating method of variant 1-6. FIG. 30 is a schematic longitudinal section view of a coating device of the second embodiment. FIG. 31 is a flow chart showing the process of the coating method of the second embodiment. FIG. 32 is a flow chart showing the process of the coating method of variant 2-1. FIG. 33 is a flow chart showing the process of the coating method of variant 2-2. FIG. 34 is a longitudinal cross-sectional view of a coating module for explaining the coating method of variant 2-3. FIG. 35 is a longitudinal cross-sectional view schematically showing a substrate holder of variant 2-4. FIG. 36 is a longitudinal cross-sectional view schematically showing a substrate holder of variant 2-5. FIG. 37 is a longitudinal cross-sectional view schematically showing a coating module of variant 2-6. FIG. 38 is a conceptual diagram showing a contact member of variant 2-6.

50: Supply flow path

60: Spit out

440: Substrate holder

442: The first lifting mechanism

443: The second lifting mechanism

446: Rotating mechanism

490: Support part

491: Rotation axis

492: Back panel assembly

492-1:Back plate

492-2: Floating board

492-3: Pressing mechanism

492-4: Floating mechanism

493: 1st upper member

494:Support mechanism

496: The second upper component

A10: Arrow

A20: Arrow

Wf: substrate

Wf-a: plated surface

Claims (28)

A plating device equipped with: The plating tank is configured to accommodate the plating liquid; The substrate holder is configured to hold the substrate, which is the object of the plating process; a rotating mechanism to rotate the aforementioned substrate holder; A lifting mechanism to lift the aforementioned substrate holder; and control device; The aforementioned substrate holder has: The contact member is configured to contact the aforementioned substrate and provide power; a sealing member configured to seal between the substrate holder and the substrate; The pressing member is arranged opposite to the sealing member and forms a state of pressing the substrate relative to the sealing member; a liquid holding portion having the contact member inside, and the liquid holding portion is configured to hold the liquid when the space between the substrate holder and the substrate is sealed by the sealing member; and The discharge port is formed in the liquid holding part or a space opening in the inside of the substrate holder that communicates with the liquid holding part, or may be arranged on the side of the substrate holder to discharge the liquid. A coating device as claimed in claim 1, wherein the outlet is formed on a side wall constituting the liquid retaining portion, and at least one of a rotating shaft of the substrate holder and a back plate assembly. The plating device according to claim 1 or 2, wherein the liquid holding portion is composed of an outer surface of the pressing member, an inner surface and a bottom surface of a supporting member that supports the contact member. The plating device of claim 1 or 2, wherein the control device is configured in the following manner: when the substrate is sealed by the sealing member, the liquid is discharged through the discharge port to the liquid holding part or communicates with the liquid holding part the aforementioned space. The plating device of claim 1 or 2, wherein the substrate holder is configured to hold the substrate with the plated surface of the substrate facing downwards, The rotation mechanism rotates the substrate holder using an axis intersecting the plated surface when the substrate is arranged on the substrate holder as a rotation axis. A coating device as claimed in claim 5, wherein the outlet is formed above the pressing member, and the outlet is configured to discharge the liquid toward the back side of the surface of the pressing member on which the substrate is disposed. A coating device as claimed in claim 6, wherein a recess for retaining the liquid or causing it to flow is formed on the back side of the pressing member. The plating device according to claim 7, wherein the recessed portions are formed in a radial shape, or are formed to surround the central axis of the pressing member, or are formed in an outer peripheral portion of the pressing member. A coating device as claimed in claim 6, wherein the control device is configured as follows: when the substrate is not mounted on the substrate holder, the liquid is ejected from the ejection port to clean at least one of the back side, the contact member, the liquid retaining portion and the sealing member. The plating device of claim 9, wherein the liquid holding portion has an inclined surface whose height increases outward in the radial direction; The control device is configured to control the rotating mechanism to rotate the substrate holder while the pressing member is in contact with the sealing member when the substrate is not mounted on the substrate holder, thereby causing the substrate holder to rotate. The liquid is discharged from the liquid holding portion across the inclined surface to the outside of the inclined surface. A coating device as claimed in claim 5, wherein the control device is configured as follows: after discharging the liquid into the space through the discharge port, the rotation mechanism is controlled to rotate the substrate holder, thereby causing the liquid to flow to the liquid retaining portion or causing the liquid to be more evenly distributed in the liquid retaining portion. The plating device of claim 1 or 2 further has a tilting mechanism for tilting the substrate holder; The control device is configured as follows: after the liquid is discharged into the space through the discharge port, the tilting mechanism is controlled to tilt the substrate holder, thereby causing the liquid to flow to the liquid holding part or making the liquid more uniform. distributed in the liquid holding part. A coating device as claimed in claim 12, wherein the control device is configured as follows: when the lifting mechanism is controlled to immerse the substrate holder on which the substrate is mounted in the coating tank, the tilting mechanism is controlled to tilt the substrate holder, thereby allowing the liquid to flow to the liquid holding portion. A coating device as claimed in claim 1 or 2, wherein the control device is configured as follows: a preset amount of the liquid is ejected from the liquid holding portion so that the liquid level is located between the lower surface of the substrate and the upper surface of the pressing member. The plating device according to claim 1 or 2, further equipped with a discharge port, which is opened in the liquid holding part or the space communicating with the liquid holding part, and the liquid existing in the liquid holding part or in the space is discharged. discharge. A coating device as claimed in claim 15, wherein the discharge port is formed on a side wall constituting the liquid retaining portion, and at least one of a rotating shaft of the substrate holder and a back plate assembly. In the coating device of claim 15, the substrate holder is further provided with a flow path connecting the exhaust port with the outside of the substrate holder. The plating device of claim 15, wherein the substrate holder further has a flow path that communicates the discharge port with the discharge port without passing through the liquid holding part and the space; The control device is configured to discharge the liquid from the discharge port before it is discharged from the discharge port. The plating device of claim 18, wherein the substrate holder further includes at least one of an ion exchange resin and a conductivity meter arranged in the flow path. A coating device as claimed in claim 15, wherein the control device is configured as follows: when the substrate is mounted on the substrate holder, a discharging action of discharging the liquid from the discharge port and a discharging action of discharging at least a portion of the liquid retained in the liquid retaining portion from the discharge port are performed simultaneously or at different times. As for the coating device of claim 20, the control device is configured as follows: when the substrate holder on which the substrate is mounted is immersed in the coating liquid, the ejection action and the discharge action are performed. The plating device of claim 21, wherein the control device is configured in the following manner: in such a manner that the liquid level of the liquid in the substrate holder is lower than the liquid level of the plating liquid, the substrate holder is Immerse in the aforementioned plating solution. A coating device as claimed in claim 21, wherein the control device is configured as follows: while the coating process is in progress, the spitting action and the discharge action are performed. The plating device of claim 20, wherein the control device is configured to perform the discharging operation after the plating process is performed and before the substrate is removed. A coating device as claimed in claim 20, wherein the control device is configured to intermittently perform at least one of the spitting action and the discharge action. A coating device as claimed in claim 20, wherein the control device is configured in the following manner: during the coating process, at least one of the spitting action and the discharge action is continuously performed. A coating device as claimed in claim 1 or 2, wherein the liquid has a conductivity lower than a predetermined threshold, or has been degassed. A coating method is a coating method in which a coating process is performed by a coating device, wherein the coating device comprises: A coating tank configured to contain a coating liquid; A substrate holder configured to hold a substrate to be subjected to the coating process; A rotating mechanism configured to rotate the substrate holder; and A lifting mechanism configured to lift the substrate holder; The substrate holder comprises: A contact member configured to contact the substrate to supply electricity; A sealing member configured to seal the substrate holder and the substrate; A liquid holding portion having the contact member therein, the liquid holding portion configured to hold liquid when the substrate holder and the substrate are sealed by the sealing member; The outlet is in the liquid holding part or in the space opening in communication with the liquid holding part in the substrate holder, or can be arranged on the side of the substrate holder; The coating method comprises: The step of mounting the substrate on the substrate holder; The step of discharging the liquid from the outlet; The step of rotating the substrate holder so that the discharged liquid flows to the liquid holding part or the liquid is evenly distributed in the liquid holding part; and The step of performing the coating treatment on the mounted substrate.

Images