TW202336558A - Server - Google Patents

Abstract

A server including a chassis, a motherboard assembly, a power assembly, a network card assembly and a first storing assembly is disclosed. The chassis has a front side and a rear side that are opposite. The motherboard assembly is disposed in the chassis and located between the front side and the rear side. The power assembly is disposed on the rear side of the chassis and is electrically connected to the motherboard assembly. The network card assembly is disposed on the front side of the chassis and is electrically connected to the motherboard assembly. The motherboard assembly is located between the power assembly and the network card assembly. The first storing assembly is disposed on the front side of the chassis and is electrically connected to the motherboard assembly.

Description

server

The present invention relates to an electronic device, and in particular to a server.

With the rapid development of cloud technology, manufacturers continue to launch various servers. A typical server includes a chassis, a motherboard, a hard disk module, a power supply module, a network card module and a fan module installed in the chassis. Generally speaking, in order to facilitate the disassembly and assembly of the hard disk module, the hard disk module will be installed on the front side of the chassis. Therefore, the space on the front side of the casing is not enough to install the network card, and the network card must be installed on the rear side of the casing.

However, since the network card is placed on the back side of the case, the airflow guided by the fan will first pass through the higher-temperature heat source on the motherboard before passing through the network card. As a result, after absorbing the heat generated by the heat source on the motherboard, the temperature difference between the air flow guided by the fan and the network card will be reduced, making it difficult for the network card to be cooled by the air flow. As a result, heat will easily accumulate in the server and reduce the heat dissipation efficiency of the entire server. In summary, traditional servers have the problem of maintaining the convenience of disassembling hard disks while taking into account the heat dissipation efficiency of the entire server.

The present invention provides a server that maintains the convenience of disassembling and assembling storage modules while taking into account the heat dissipation efficiency of the entire server.

A server disclosed in an embodiment of the present invention includes a chassis, a motherboard component, a power module, a network card module and a first storage module. The casing has a front side and a rear side opposite to each other. The motherboard assembly is disposed on the chassis between the front side and the rear side. The power module is disposed on the rear side of the chassis and is electrically connected to the motherboard component. The network card module is disposed on the front side of the chassis and is electrically connected to the motherboard component. The motherboard component is between the power module and the network card module. The first storage module is disposed on the front side of the chassis and is electrically connected to the motherboard assembly.

According to the server disclosed in the above embodiment, the first storage module and the network card module are both disposed on the front side of the chassis. Therefore, maintenance personnel can easily disassemble and install the first storage module from the front side of the casing. Moreover, the air flow guided by the fan will first pass through the network card and then pass through the motherboard assembly, which increases the temperature difference between the air flow and the network card module, so that the air flow can effectively cool the network card module. In this way, it is possible to maintain the convenience of disassembling and installing storage modules while taking into account the heat dissipation efficiency of the entire server.

Detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation mode. The content is sufficient to enable anyone with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement them accordingly, and based on the disclosure of this specification With the content, patent scope and drawings, anyone with ordinary knowledge in the art can easily understand the relevant objects and advantages of the present invention. The following examples further illustrate the aspects of the present invention in detail, but do not limit the scope of the present invention in any way.

Please refer to FIGS. 1 to 3 . FIG. 1 is a perspective exploded view of a server according to an embodiment of the present invention, FIG. 2 is a front view of the server in FIG. 1 , and FIG. 3 is a rear view of the server in FIG. 1 .

In this embodiment, the server 10 includes a chassis 100 , a motherboard component 150 , two power modules 200 , a network card module 250 and a first storage module 300 .

The casing 100 has a front side 101 and a rear side 102 opposite to each other. In this embodiment, the casing 100 includes a bottom plate 110 , a first side plate 120 and a second side plate 130 . The first side plate 120 and the second side plate 130 stand on opposite sides of the base plate 110 respectively. The front side 101 and the rear side 102 are located on the base plate 110 . The first side panel 120 and the second side panel 130 extend from the front side 101 to the rear side 102 . It should be noted that, for convenience of description, the top plate (not shown) provided on the side of the first side plate 120 and the second side plate 130 away from the bottom plate 110 is omitted in FIGS. 1 to 3 . In this embodiment, the chassis 100 complies with the 2U standard, for example.

The motherboard assembly 150 is disposed on the bottom plate 110 of the chassis 100 between the front side 101 and the rear side 102 . The motherboard component 150 may include a central processing unit and a memory, for example.

The two power modules 200 are disposed on the rear side 102 of the bottom plate 110 of the chassis 100 and are electrically connected to the motherboard assembly 150 . In other embodiments, the server may also include only one power module.

The network card module 250 is disposed on the front side 101 of the bottom plate 110 of the chassis 100 and is electrically connected to the motherboard assembly 150 . The motherboard assembly 150 is between the power module 200 and the network card module 250 . The network card module 250 may include, for example, a network card that complies with the Open Compute Project (OCP) standard.

The first storage module 300 is disposed on the front side 101 of the bottom plate 110 of the chassis 100 and is electrically connected to the motherboard assembly 150 . The first side plate 120 is closer to the first storage module 300 than the second side plate 130 . In this embodiment, the first storage module 300 is between the first side plate 120 and the network card module 250, but it is not limited to this. In other embodiments, the network card module may also be between the first storage module and the first side panel.

In this embodiment, the server 10 further includes an expansion card module 350 . The expansion card module 350 is electrically connected to the motherboard assembly 150 and is disposed on the front side 101 of the bottom plate 110 of the chassis 100 . In other embodiments, the server does not need to include the expansion card module 350 . The expansion card module 350 may include, for example, a graphics card or a network card that complies with the PCIe specification.

In this embodiment, the server 10 further includes two second storage modules 400 . The second storage module 400 is disposed on the front side 101 of the bottom plate 110 of the casing 100 . The network card module 250 is between the two second storage modules 400 and the backplane 110, but is not limited to this. In other embodiments, the network card module can also be interposed between the two second storage modules and the backplane. It should be noted that in other embodiments, the server does not need to include the two second storage modules 400 .

In addition, in this embodiment, the first storage module 300 is between the two second storage modules 400 and the first side plate 120, but it is not limited to this. In other embodiments, the second storage module can also be between the first storage module and the first side plate.

In this embodiment, the server 10 further includes a third storage module 450 and a fourth storage module 500 . The third storage module 450 and the fourth storage module 500 are disposed on the rear side 102 of the bottom plate 110 of the chassis 100 and are electrically connected to the motherboard assembly 150 . The second power module 200 is between the third storage module 450 and the fourth storage module 500 . In other embodiments, the third storage module and the fourth storage module may also be located between the two power modules. In other embodiments, the server does not need to include the third storage module 450 and the fourth storage module 500 .

In this embodiment, the server 10 further includes a fifth storage module 550. The fifth storage module 550 is disposed on the rear side 102 of the bottom plate 110 of the chassis 100 and is electrically connected to the motherboard assembly 150 . The two power modules 200 are between the fifth storage module 550 and the base plate 110 . In other embodiments, the fifth storage module can also be located between the two power modules and the backplane. In other embodiments, the server does not need to include the fifth storage module 550.

In this embodiment, the server 10 further includes a management module 600. The management module 600 is disposed on the front side 101 of the bottom plate 110 of the chassis 100 and is electrically connected to the motherboard assembly 150 . In this embodiment, the network card module 250 is between the management module 600 and the first storage module 300, but it is not limited to this. In other embodiments, the management module may also be interposed between the network card module and the first storage module.

In addition, in this embodiment, the management module 600 is between the expansion card module 350 and the backplane 110, but the invention is not limited to this. In other embodiments, the expansion card module can also be interposed between the management module and the backplane.

In this embodiment, the management module 600 includes a circuit board 610, a first connection port 620, a second connection port 630, a third connection port 640 and an indicator light 650. The first connection port 620 , the second connection port 630 , the third connection port 640 and the indicator light 650 are provided and electrically connected to the circuit board 610 . The second connection port 630 is between the first connection port 620 and the third connection port 640 . The third connection port 640 is between the second connection port 630 and the indicator light 650 . The first connection port 620 is, for example, a management (MGMT) port. The second connection port 630 is, for example, an integrated bus circuit (Inter-Integrated Circuit, I2C) port. The third connection port 640 is, for example, a Video Graphics Array (VGA) port. The indicator light 650 is, for example, a light emitting diode. In other embodiments, the server does not need to include the management module 600.

In this embodiment, the server 10 further includes a fan module 700 and an air guide 750 . The fan module 700 is disposed on the bottom plate 110 of the chassis 100 and is electrically connected to the motherboard assembly 150 . The motherboard assembly 150 is between the network card module 250 and the fan module 700 . The air guide 750 is disposed on a side of the motherboard assembly 150 away from the base plate 110 .

It should be noted that the first storage module 300, the second storage module 400, the third storage module 450, the fourth storage module 500 and the fifth storage module 550 may include U.2 solid state drives, E3. S solid state drive, NVMe solid state drive or traditional hard drive (HDD).

It should be noted that in this embodiment, the motherboard component 150, the power module 200, the network card module 250, the first storage module 300, the expansion card module 350, the second storage module 400, the third The storage module 450, the fourth storage module 500 and the fifth storage module 550, the management module 600 and the fan module 700 are assembled on the chassis 100, for example, by hand screws or without tools, so as to improve the maintenance efficiency of maintenance personnel. Convenience.

According to the server disclosed in the above embodiment, the first storage module and the network card module are both disposed on the front side of the chassis. Therefore, maintenance personnel can easily disassemble and install the first storage module from the front side of the casing. Moreover, the air flow guided by the fan will first pass through the network card and then pass through the motherboard assembly, which increases the temperature difference between the air flow and the network card module, so that the air flow can effectively cool the network card module. In this way, it is possible to maintain the convenience of disassembling and installing storage modules while taking into account the heat dissipation efficiency of the entire server.

Although the present invention has been disclosed in the foregoing embodiments, they are not intended to limit the present invention. Anyone skilled in the similar art can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for an invention shall be determined by the scope of the patent application attached to this specification.

10:Server 100:Chassis 101:Front side 102:Rear side 110: Bottom plate 120:First side panel 130:Second side panel 150: Motherboard components 200:Power module 250:Network card module 300: First storage module 350: Expansion card module 400: Second storage module 450:Third storage module 500: The fourth storage module 550:The fifth storage module 600: Management module 610:Circuit board 620: First port 630: Second port 640: Third port 650:Indicator light 700:Fan module 750:Wind guide

FIG. 1 is an exploded perspective view of a server according to an embodiment of the present invention. Figure 2 is a front view of the server in Figure 1. Figure 3 is a rear view of the server in Figure 1.

10:Server

101:Front side

110: Bottom plate

120:First side panel

130:Second side panel

250:Network card module

300: First storage module

350: Expansion card module

400: Second storage module

600: Management module

610:Circuit board

620: First port

630: Second port

640: Third port

650:Indicator light

Claims (10)

A server includes: a casing having a front side and a back side opposite each other; a motherboard component disposed on the casing and between the front side and the back side; a power module disposed on The rear side of the casing is electrically connected to the motherboard component; a network card module is disposed on the front side of the casing and is electrically connected to the motherboard component, and the motherboard component is between the power supply between the module and the network card module; and a first storage module is disposed on the front side of the chassis and electrically connected to the motherboard assembly. The server of claim 1 further includes an expansion card module electrically connected to the motherboard assembly and disposed on the front side of the chassis. The server of claim 1, wherein the chassis includes a base plate, a first side plate and a second side plate, the first side plate and the second side plate respectively stand on opposite sides of the base plate, the front side and The rear side is located on the bottom panel, the first side panel and the second side panel extend from the front side to the rear side, and the first storage module is between the first side panel and the network card module. The server of claim 3 further includes two second storage modules, the two second storage modules are disposed on the front side of the chassis, and the network card module is between the two second storage modules and between the base plates. The server of claim 4, wherein the first storage module is between the two second storage modules and the first side plate. The server of claim 4 further includes a third storage module and a fourth storage module, the third storage module and the fourth storage module are disposed on the rear side and electrically connected to the As for the motherboard component, the power module is between the third storage module and the fourth storage module. The server of claim 5 further includes a fifth storage module, the fifth storage module is disposed on the rear side and electrically connected to the motherboard component, and the power module is between the fifth storage module between the module and the base plate. The server of claim 1 further includes a management module, which is disposed on the front side of the chassis and electrically connected to the motherboard assembly. The server of claim 8, wherein the chassis includes a base plate, a first side plate and a second side plate, the first side plate and the second side plate respectively stand on opposite sides of the base plate, the front side and The rear side is located on the bottom plate, the first side panel and the second side panel extend from the front side to the rear side, and the network card module is between the management module and the first storage module. The server of claim 8 further includes an expansion card module electrically connected to the motherboard assembly and disposed on the front side of the chassis, the chassis including a base plate, a first One side plate and a second side plate, the first side plate and the second side plate respectively stand on opposite sides of the base plate, the front side and the rear side are located on the base plate, the first side plate and the second side plate extend from the front side To the rear side, the management module is between the expansion card module and the backplane.