TW202203072A - Surface-complementary dielectric mask for printed circuits, methods of fabrication and uses thereof - Google Patents

Abstract

The disclosure relates to systems, methods and devices for mitigating warpage in printed circuit boards (PCBs) high-frequency connect PCBs (HFCPs), or additively manufactured electronics (AME) with surface mounted chip packages (SMT) during reflow processing for soldering the SMT to the PCB, HFCP, or AME. More specifically, the disclosure is directed to the fabrication of a surface-complementary dielectric mask, or reflow compression mask to substantially encapsulate the SMT, and mitigate warpage, and/or protect the PCB, HFCP, or AME during shipment and further manipulation or processing.

Description

Surface Complementary Dielectric Mask for Printed Circuits, Method of Manufacture and Use thereof

The present disclosure relates to systems, methods, and devices for: a) reducing warpage of printed circuit boards (PCBs) with surface mount chip packages (SMTs) and high frequency connection PCBs (HFCPs) during reflow processes , and b) optionally wrapping the entire PCB with an encapsulation layer that reflects the negative of the PCB filled with the outer layers. More particularly, the present disclosure is related to fabricating surface complementary dielectric masks for substantially encapsulating SMT, and reducing warpage and optionally encapsulating devices mounted on a PCB.

There is an increasing need for electronic devices with small form factors in, for example, all of the following fields: manufacturing, commercial, consumer products, military, aerospace, Internet of Things, and the like. Products with these smaller form factors rely on tight and complex PCBs with closely spaced digital and analog circuits or chip packages on their surfaces placed in close proximity to each other. Similarly, with the scaling down (miniaturization) of these active devices, there is an increasing need for such (miniature) devices to perform substantially more and more complex electronic functions, which are packaged in advanced packages such as ball grid Arrays (BGAs), Micro BGAs, Quad Flat Packages (QFPs), and Chip Scale Packages (CSPs), increase the complexity and issues associated with small form factor PCBs that OEMs even need to deal with during handling and use. form factor) design-related higher stability, higher quality, better fault tolerance, improved reliability, lower "parasitic" or "bleeder" interconnects, and better device yield.

At the same time, due to the increase in PCB complexity and SMT density (the number of terminals of SMT components increases), due to the reduction in size, each SMT component mounted on the PCB (such as BGA (Ball Grid Array) or CSP (Chip Scale Package) ) the terminal spacing is reduced. These components are usually made of multiple materials, so that when mounted on a PCB using the reflow soldering process, their internal temperature may become uneven and more likely to warp when heated (depending on the number of these components) The difference in thermal expansion coefficient between materials, the environment and the PCB itself).

In addition, due to the current trend of reducing PCB thickness (eg, reducing the length of vias, which is effective in guiding routing from narrow-pitch components and reducing routing area), not only SMT components, but also the PCB itself may experience heating related problems of warping. In other words, as the thickness of the PCB decreases, the board is more likely to warp, thus weakening the coupling with the SMT.

Thermal warpage is believed to be induced (in SMT components) due to mismatches in coefficient of thermal expansion (CTE) and Young's modulus between different materials, especially after curing of the solder that limits expansion and relaxation of the SMT relative to the surface itself and/or between the SMT component and the dielectric portion of the PCB). During the reflow process, the SMT components are mounted together and experience high temperatures and severe temperature gradients. This may exacerbate the total thermal warpage. Excessive warpage can induce out-of-plane alignment of the solder bumps, resulting in unsoldered or mechanically weakened joints. In addition, PCB warpage can also cause solder ball coplanarity issues (such as in BGAs) by affecting joint formation and shape, causing thermal fatigue of solder joints under operating conditions, which in turn can affect solder joint reliability and cause malfunction of electronic devices.

In addition, there is a need to protect the mounted device from harsh environments and/or to provide other functions by permanently incorporating complementary dielectric masks. The dielectric mask may further include metal traces and bumps for signal input/output (I/O) and thermal dissipation purposes.

Factors affecting warpage may include time/temperature profile during the reflow soldering process, PCB thickness, PCB topology, spatial imbalance in trace density, and other factors.

The present disclosure is directed to overcoming one or more of the above identified disadvantages by using build-up fabrication techniques and systems.

In various exemplary embodiments, methods for reducing printed circuit boards (PCBs), high frequency connection PCBs (HFCPs), or build-up electronic devices (AMEs) with surface mount chip packages (SMTs) during reflow processes are disclosed. The system and method of warping. More particularly, disclosed are methods, systems, and methods for substantially encapsulating SMT coupled to external layers of a PCB, HFCP, or build-up electronic device (AME) and reducing warpage of SMT components and the PCB HFCP or AME itself. Exemplary Embodiments of Surface Complementary Dielectric Masks.

In an exemplary embodiment, provided herein is a computerized method for reducing warpage of an assembled PCB, HFCP or AME during a reflow process, the method comprising: obtaining a plurality of numbers associated with the assembled PCB, HFCP or AME file, the assembled PCB, HFCP or AME has a top surface and a base surface; using the files, fabricate a surface complementary dielectric mask for at least one of Swap): the top surface and the substrate surface; and the RCM is coupled to at least one of: the top surface and the substrate surface before starting the reflow process, thereby reducing warpage during the reflow process.

In another exemplary embodiment, the step of making a surface complementary dielectric mask or RCM comprises providing an ink jet printing system comprising: a print head operable to dispense the (first) dielectric ink composition a transmitter operatively coupled to the print head and configured to transport the substrate to the print head; and a computer-aided manufacturing ("CAM") module comprising at least communicating with the transmitter and the (first) print head a central processing module (CPM), the CPM further comprising at least one processor in communication with a non-transitory processor-readable storage medium having stored thereon a processor having a set of executable instructions A readable medium, the executable instructions, when executed by at least one processor, cause the CPM to control an inkjet printing system by performing steps comprising: receiving at least one file associated with the assembled PCB, HFCP or AME; and A file library is generated, each file in the file representing a substantially 2D layer used to print an RCM (in other words, a surface complementary dielectric mask or a reflow compression mask), where the CAM module is configured to control the transmitter and Each of the print heads; provides a (first) dielectric ink composition; using a CAM module, obtains a file representing a first substantially 2D layer for printing; Represent a pattern of a substantially 2D layer; cure the pattern; obtain a subsequent file representing a substantially 2D layer of the RCM; use a (first) print head, form a pattern corresponding to the subsequent layer; make a pattern corresponding to the second dielectric ink The pattern is cured; and after printing and curing all layers configured to form the surface complementary dielectric mask, the substrate is removed.

In another exemplary embodiment, provided herein is a method of fabricating a surface complementary dielectric mask (or RCM) using an ink jet printer, comprising: providing an ink jet printing system comprising: a first print head , which is operable to dispense the first dielectric ink composition; a conveyor that is operably coupled to the first print head, configured to convey the substrate to the first print head; and a computer-aided manufacturing ("CAM") ) module comprising at least a central processing module (CPM) in communication with the transmitter and the first print head, the CPM further comprising at least one processor in communication with a non-transitory processor-readable storage medium, the non-transitory processing A processor-readable storage medium having stored thereon a processor-readable medium having a set of executable instructions that, when executed by at least one processor, cause the CPM to control the inkjet printing system by performing steps comprising: receiving At least one file related to the assembled PCB, HFCP or AME (referring to the PCB, HFCP or AME after the reflow process) that the RCM is trying to manufacture, use the at least one file related to the assembled PCB, HFCP or AME to generate a file library containing a plurality of files (each file representing a substantially 2D layer used to print the RCM) and an associated metafile representing at least the printing order of that layer; providing a first dielectric ink composition; using a CAM module , obtaining a first file representing the first layer for printing the RCM from the archive, wherein the first file contains printing instructions for the pattern corresponding to the first layer of the RCM; using the first print head, a corresponding pattern is formed on the substrate In the pattern of the first dielectric ink; the pattern corresponding to the first dielectric ink in the first layer is cured; using the CAM module, obtain the subsequent file representing the subsequent layer for printing the RCM treatment from the archive, The subsequent file includes printing instructions for the pattern corresponding to the first dielectric ink in the subsequent RCM layer; repeating the steps of using the first print head to form the pattern corresponding to the first dielectric ink to using the CAM module from the 2D file The library obtains a subsequent, substantially 2D layer, followed by curing the pattern in the final layer corresponding to the first dielectric ink composition, the surface complementary dielectric mask comprising a plurality of cavities, voids, protrusions, channels , recess, or a combination thereof, configured to complement the surface of the PCB, HFCP, or AME, encapsulating virtually any surface mount components thereon.

In another exemplary embodiment, the method further includes providing a housing operable to receive the RCM and the PCB, HFCP or AME coupled thereto prior to initiating the reflow.

Systems, methods and masks for direct and continuous fabrication of surface complementary dielectric masks or RCMs to substantially encapsulate SMT and reduce warpage when read in conjunction with the drawings and illustrative, non-limiting examples These and other features will become apparent from the following detailed description.

Exemplary implementations of systems, methods, and masks operable to reduce warpage of PCBs and/or HFCPs on which SMT components are coupled during a reflow soldering process are provided herein.

The methods, systems, and masks disclosed herein use a computerized inkjet printing system adapted and configured for 3D printing, such as inkjet printing for PCB, HFCP, or AME. The RCM itself is a build-up manufacturing (AM) model constructed based on the original PCB, HFCP or AME and SMT component manufacturing design files (eg Gerber, Excelon, Eagle and the like) and automatically generates a file library for printing the RCM .

Design files for printing surface Complementary Dielectric Masks (RCMs) can be (assuming (but not limited to) double-sided PCB, HFCP or AME): ● Shape/outline of printed circuit, eg Gerber files (eg ODB++, RS274D, RS274X, DXF and the like). Gerber files are collections of files that contain information about the layers of the PCB used for fabrication. These files may contain information about, for example, one of the following: top solder paste configuration, top trace pattern, bottom trace pattern, bottom solder paste configuration, NC drill (with the location and size of all drilled holes) , and hole or feature opposite side dimensions, X, Y, coordinates), board overview and details (possibly in another file) with all required dimensions and tolerances, and fabrication drawings (as appropriate). • Centroid file, which contains information about the position of each SMT component on the surface (top and/or base) of the PCB, HFCP or AME, such as x-y position, rotation, layers, reference designators and values/packages.

In an exemplary embodiment, the surface complementary dielectric mask can be made from, for example, the following: • Base portion - manufactured using a profile file, printed to the desired height. Because thermal warpage depends on the thickness of the layer undergoing reflow soldering, the height of the base portion (see eg, h , Figure 2) is dimensioned and configured to reduce any thermal warpage that may occur. ● Component parts - constructed from centroid files where cavities, voids or recesses are created (see eg _104i , Figure 2), and the required tolerances are added so SMT components can be placed more securely (make the cavities slightly larger than the component to make the components fit). ● Pad portion - constructed from profile files in which cavities are created and formed (see eg _105j , Figure 2, configured to form voids operable to receive solder paste), based on component files and (top/base) solder Mask position file, printed to the desired height (depth) to ensure that the Surface Complementary Dielectric Mask (RCM) does not touch the dispensed solder paste during assembly and does not apply paste prior to the reflow process. ● Alignment parts (eg location of fiducials) - created from drill files (eg Numerically Controlled (NC) drill files, Excellon and the like) to make small cylindrical protrusions (see eg _106p , Figure 2 , configured to form protrusions sized and configured to engage unplated drilled holes) that will serve as fiducials and enable surface complementary dielectric masks (RCMs) to interface with PCB, HFCP or Complementary surfaces (top and/or base) of the AME are aligned. In the absence of a drill in the PCB, HFCP or AME, the outline of the board can be used to create a frame (see eg 107, Figure 2) which will wrap the PCB, HFCP or AME to become the frame of the PCB, HFCP or AME and Manufactured to the desired depth for PCB, HFCP or AME. The printed surface Complementary Dielectric Mask (RCM) can then be automatically printed in complementary orientation relative to the PCB, HFCP or AME design file.

Currently, PCBs, HFCPs or AMEs, especially PCBs, HFCPs or AMEs fabricated using build-up fabrication with photopolymerizable polymers, are subject to deformation when exposed to high temperatures such as the time-temperature profile experienced during the reflow soldering process (See, eg, Figure 3), thereby limiting assembly solutions to manual procedures that require time and labor. The fabricated surface complementary dielectric masks (RCMs) disclosed herein are reusable, time saving, and can be produced using the same computerized systems used to initially fabricate PCBs, HFCPs, or AMEs. In addition, the precise placement of SMT components on PCB, HFCP or AME can be performed by camera and image processing, which will enable component placement and alignment at the assembly stage without the need for other expensive equipment such as pick-and-place machines. allow.

In addition, the surface complementary dielectric mask can be used as an encapsulation mold to protect the printed circuit during operation and/or shipping, acting to "encapsulate" the component. Additionally and in an exemplary embodiment, the surface complementary dielectric mask itself may be fabricated into a printed circuit (eg, PCB, HFCP, AME, or flexible printed circuit (FPC)), such as by fabricating with conductive traces ( such as copper, silver, and the like) and connecting SMT components, thus making it possible to use build-up fabrication to fabricate complex multi-circuit systems. In the context of this application, the term "encapsulated component" may specifically refer to a device having an encapsulated structure that is a package, such as a surface complementary dielectric mask, but is not part of the encapsulated structure. The structure of one or more electronic chips (such as SMT components coupled to a PCB, HFCP or AME). The thickness of such SMT components can be less than the thickness of the corresponding complementary cavities in the encapsulation structure, such as a surface complementary dielectric mask.

In addition, RCMs (whether in pure dielectric form or in (non-test) topology circuits) can be further protected by providing a housing that couples to the surface of the PCB, HFCP or AME prior to reflow processing, shipment or operation. The housing is operable to receive the PCB, HFCP or AME and (depending on the surface with the coupled RCM) the coupled RCM. In the context of the present disclosure, the term "housing" refers to an indication that a component (such as a housing) that is contained contains corresponding dimensions such that the component contained (such as a PCB, HFCP, or AME and any surface-coupled RCM) is correspondingly ) can fit into the interior of a storage component such as a housing. The housing can be made, for example, of metal, reinforced thermosetting resins (eg fiberglass), and the like. Additionally, in certain embodiments, the RCM is fabricated from a high T _g resin, such as poly(methyl methacrylate) (PMMA), poly(ether ash) ( PESU), poly(imide-imine) (PAI), poly(imide-imide) (PI), copolymers and terpolymers thereof (eg glass fiber reinforced with graphite).

Accordingly and in an exemplary embodiment, provided herein is a computerized method for reducing warpage of an assembled (meaning having at least one coupled SMT) PCB, HFCP or AME during a reflow process, the method comprising: obtaining A plurality of files associated with each of the assembled PCB, HFCP or AME (each having a top surface and a base surface and, as appropriate, a plurality of side surfaces); using the plurality of files, manufacture for at least one of the following Surface Complementary Dielectric Mask (RCM) of these: the top surface and the base surface; and before starting the reflow process, the complementary surface dielectric mask is coupled to at least one of the following: the top surface and the base surface, by This reduces warpage during the reflow process.

In the context of this disclosure, the term "warping" means the strain-induced non-planarity or bending of an integrated circuit (IC) package (eg, SMT), PCB, HFCP, or AME, its surface, or a combination thereof, which It may occur during assembly or after assembly, such as during a reflow process (in other words, vertical deflection from a horizontal base surface). IC packages, PCBs, HFCPs or AMEs, or combinations thereof, are bent into concave or convex (or partially convex and concave) profiles, where "convex" is generally defined as bending up or toward the connection mold and/or stiffener , and where "concave" is generally defined as bending down or away from the connecting die and/or stiffener. Furthermore, in the context of this disclosure, "reduce" is meant to encompass surface complementary dielectric masks (RCM) and/or any operation of PCB, HFCP or AME that results in at least one of: reducing the Detrimental effects on the performance of the PCB and/or any SMT components (ICs) coupled thereto, and reducing damage to the PCB and/or any SMT components coupled thereto after the reflow process. The term reduction also encompasses any use of a surface complementary dielectric mask (RCM) during at least one of: shipping (coupled PCB, HFCP, or AME), reflow processing, and use as disclosed herein Nested PCB, HFCP or AME coupling add-ons (in other words, original - first PCB, HFCP or AME and manufactured second PCB, HFCP with at least one surface complementary to that of the first, original PCB, HFCP or AME or operative coupling of AME). For example, in exemplary implementations of the disclosed systems and methods, the term "reduce" means ensuring that the PCB, HFCP or AME complies with the "IPC-9641 High Temperature Printed Board Flatness Guidelines" Guideline)".

For example, warpage measurements of out-of-plane deformation of plastic ball grid array (PBGA) components can be performed, for example, using a thermal shadow Moiré apparatus (TherMoiré PS200) in combination with a heating stage. Other methods may use full-field shadow Moiré, confocal microscopy, strain gage arrays, finite element analysis (temperature distribution during reflow, and/or strain gage data).

Furthermore, the term "file" shall include any piece of computer/processor readable data in any form that can be shared between users. A "file" can be a discrete file, such as stored by an operating system, or a "file" can be a record, image or part of an image in a database, a block or part of a database, or shared among users and Any other computer readable data used by the systems disclosed herein.

The plurality of files associated with the assembled PCB, HFCP or AME used in the computerized method implemented using the disclosed system for reducing warpage during the reflow process further comprises: configured to define the assembled PCB, A file of the outline of the HFCP or AME; and a file configured to define the size and spatial arrangement of at least one surface mount integrated circuit (SMT) assembled on at least one of the following: the top surface and the base surface. In addition, the plurality of files associated with the assembled PCB, HFCP or AME further includes at least one of: a file configured to define spatial parameters for solder paste distribution; and an alignment file, wherein the alignment file includes Spatial arrangement of at least one of the following: Non-Plated Drilled (Through) Holes (NPTH), Plated Through Holes (PTH), and Blind Vias (e.g. for coupling and soldering SMT components, and PTH or blind vias (both for connection) Various layers on the PCB) have different NPTH).

Accordingly, in the methods provided herein, the step of fabricating a surface complementary dielectric mask (RCM) for reducing warpage during the reflow process further comprises: providing an inkjet printing system comprising: (first) printing a head operable to dispense the (first) dielectric ink composition; a conveyor operably coupled to the print head, configured to convey the substrate to the print head; and computer-aided manufacturing ("CAM") a module comprising a central processing module (CPM) in communication with the print head, the CPM further comprising: at least one processor in communication with a non-transitory storage medium having a set of executable instructions stored thereon, the etc. executable instructions are configured to, when executed, cause the CPM to perform the following steps: receive the various files disclosed herein (eg ODB, ODB++, .asm, STL, IGES, STEP (ISO 10303-21), intermediate data files (IDF), Catia, SolidWorks, Autocad, ProE, 3D Studio, Gerber, Rhino, Altium, Orcad); and generating a library of files representing a substantially 2D layer used to print surface Complementary Dielectric Masks (RCMs) (eg raster files such as: JPEG, GIF, TIFF, BMP, PDF files, or a combination comprising one or more of the foregoing), wherein the CAM module is configured to control each conveyor and print head; providing A dielectric ink composition; obtaining a first substantially 2D layer using a CAM module; using a print head to form a pattern corresponding to the first substantially 2D layer; curing the pattern; obtaining a subsequent, substantially 2D layer of RCM; Using a print head, forming a pattern corresponding to subsequent layers; curing the pattern corresponding to the second dielectric ink; and after printing and curing all layers configured to form a surface complementary dielectric mask (RCM), Remove the substrate.

In the context of this disclosure, the term "operable" means that the system and/or device and/or process or some element, component or step is fully functionally sized, adapted and calibrated; including for use in activation, coupling or Elements (having internal dimensions suitable for storage) that perform the stated function when implemented; and meet applicable operability requirements for performing the stated function when activated, coupled or implemented, and whether powered, coupled, implemented , implement, actuate, implement or execute a program is irrelevant when executed by at least one processor associated with the system, method and/or device. With respect to the disclosed systems and methods, the term "operable" also means that the system and/or circuit is fully functional and calibrated, includes logic for performing the described function when executed by at least one processor, and satisfies the requirements specified by the Applicable operability requirements for at least one processor to perform the described function when executed.

Systems implementing the disclosed methods may further include a number of subsystems and modules. Such subsystems and modules can be, for example: mechanical subsystems used to control the movement of the print head, substrate (or chuck coupled to the substrate), its heating and conveyor action; ink composition injection systems; curing and / or sintering (in the case of dispensing conductive inks to form surface complementary dielectric masks (RCMs) such as separate PCB, HFCP or AME) subsystems; computerized with processors (eg GPU and/or CPU) Subsystems that are configured to control the process and generate appropriate printing instructions and necessary files, or otherwise retrieve such files from remote locations (eg, 2D archives); component placement systems such as robotic arms ( e.g. pick and place); machine vision systems (e.g. for measuring warpage using confocal optics); and command and control systems (e.g. CPM) for controlling 3D printing.

The use of the term "module" does not imply that a component is functionally described or claimed as part of a module, or all configured in a (single) co-package. Indeed, any or all of the various components of a module (whether control logic, GPU, SATA memory drives, or other components) may be combined in a single package or maintained separately and may be further distributed in multiple groups or packages or across multiple (remote) location and device. Furthermore, in certain exemplary embodiments, the term "module" refers to an integral or distributed hardware unit. Also, in the context of the disclosure provided herein, the term "dispenser" used in conjunction with a printhead is used to refer to a printhead that dispenses inkjet ink droplets. Dispensers can be, for example, devices used to dispense small amounts of liquid, including microvalves, piezoelectric dispensers, continuous jet printheads, boiling (bubble jet) dispensers, and other devices that affect the temperature and properties of the fluid flowing through the dispenser.

As indicated, the set of executable instructions is further configured to, when executed, cause the processor to generate a file of a plurality of subsequent layers, whereby each subsequent layer file represents a method for printing a surface complementary dielectric mask (RCM). Subsequent layers are substantially two-dimensional (2D), and wherein each subsequent layer file is indexed by printing order. In an exemplary embodiment, each layer file is configured to provide printing instructions for a pattern represented by the dielectric ink in the layer.

In an exemplary embodiment, the printed pattern in the layers is configured to form voids (referring to the volume in a given 3D coordinate position) when the last layer in the printing sequence is printed, the voids sized to accommodate SMT components, and based on the file specifying the coordinates and quantities of solder paste distribution, adapt the resulting pattern specified for each layer in the 2D file library to generate at least one file in the file library, define the configuration configured to receive the solder paste (in other words, providing space for solder paste); and using, for example, an alignment file (eg, EAGLE), adapting the generated pattern library to generate a pattern that is configured to form protrusions (eg, cylindrical or other shapes), which The isoprotrusions are sized and configured to engage at least one of: non-plated drilled holes (NPTH), blind holes, and plated through holes (PTH).

In another embodiment, provided herein is a computerized method of using an inkjet printer to fabricate a complementary dielectric surface mask for an assembled printed circuit board (PCB), High frequency connection PCB (HFCP) or build-up electronic device (AME) each having at least one and at least one of the following An operatively coupled surface mount module (SMT): a top surface layer and a base surface layer, the method comprising: providing an ink jet printing system comprising: a first print head operable to dispense a first combination of dielectric inks a conveyor operably coupled to the first print head and configured to convey the substrate to the first print head; and a computer-aided manufacturing ("CAM") module including at least the conveyor and the first print head a central processing module (CPM) for print head communication, the CPM further comprising at least one processor in communication with a non-transitory processor-readable storage medium having a set of executable instructions stored thereon, The executable instructions, when executed by at least one processor, cause the CPM to control the inkjet printing system by performing steps including: receiving at least one file associated with an assembled PCB, HFCP or AME in which an attempt is made to manufacture the An RCM of an assembled PCB, HFCP or AME; using at least one file associated with the assembled PCB, HFCP or AME, resulting in a plurality of files (each file representing a substantially two-dimensional (2D) layer used to print the RCM) and a file of metafiles representing at least a printing sequence; providing a first dielectric ink composition; using a CAM module, obtaining a first file from the file, representing a first layer for printing the RCM, wherein the first file contains print instructions corresponding to the pattern of the RCM; use the first print head to form a pattern corresponding to the first dielectric ink on the substrate; cure the pattern corresponding to the first dielectric ink in the first layer; use The CAM module obtains a follow-up file representing the subsequent layer used for printing the RCM from the file library, the follow-up file contains the printing instructions corresponding to the pattern of the first dielectric ink in the subsequent layer; the first print head is repeatedly used to form a corresponding From the step of patterning the first dielectric ink to the step of obtaining subsequent, substantially 2D layers from the 2D archive using a CAM module, then making the final layer in the printing sequence correspond to the first dielectric ink composition The pattern is cured, the RCM includes a plurality of cavities configured to complement the surface of the PCB, HFCP or AME, substantially encapsulating the surface mount components thereon; and the substrate is removed.

The term "wafer" refers to an unpackaged, singulated IC device. The term "die package" may specifically refer to a housing into which a wafer enters to be inserted into a circuit board, such as a printed circuit board (PCB) (socket mount) or soldered to a circuit board (surface mount), thereby forming a die installation. In electronic devices, the term chip package or chip carrier may refer to material added around a component or integrated circuit to enable the component or integrated circuit to be handled without damage and incorporated into the circuit.

Thus, a CAM module may contain: 2D file library that stores files converted from PCB fabrication files such as Gerber (ODB++) and centroid files, possibly including SMT component BOM (Bill of Materials) files. Furthermore, as an alternative to or in addition to the files disclosed above, the 2D library may store files converted from other file formats. Such files may be, for example, STEP files and/or IDF files. For example, an IDF file for a PCB attempting to mask produces two files that can be used by CAM to produce an essentially 2D layer file. These files are *.enm files related to the plate structure and *.emp files related to the coupling components.

As used herein, the term "library" refers to a collection of Surface Complementary Dielectric Masks (RCMs), 2D layer files, derived from various files associated with a PCB, HFCP or AME attempting to undergo reflow, shipment or further processing , which contains the information needed to print the dielectric pattern of each layer, which can be accessed and used by a data collection application and executed by a computer-readable medium. The CAM further includes a processor in communication with the archive; a memory device, or non-transitory storage device, which stores a set of operational instructions for execution by the processor; one or more micromachined inkjet print heads that act as dispensers, It communicates with the processor and library; and the print head interface circuit, which communicates with the archive, memory and micromachined inkjet print head, the (2D) archive is configured to provide a specific target function layer (in other words, form the final manufacturing printer operating parameters for the layer of a component of an object).

Additionally, chips or chip packages used in conjunction with the systems, methods and compositions described herein may be Quad Flat Pack (QFP) packages, Thin Small Outline Packages (TSOPs), small integrated circuits (Small Outline Integrated Circuit; SOIC) package, Small Outline J-Lead (SOJ) package, Plastic Leaded Chip Carrier (PLCC) package, Wafer Level Chip Scale Package ; WLCSP), Mold Array Process-Ball Grid Array (MAPBGA) package, Ball-Grid Array (BGA), Quad Flat No-Lead ; QFN) package, Land Grid Array (LGA) package, passive component, or a combination comprising two or more of the foregoing.

In certain exemplary implementations, the systems provided herein further include a robotic arm in communication with and under the control of the CAM module, configured to place each of the plurality of active components on the Its designated location, which can be manufactured by the system.

The solder paste or solder balls may be arranged, for example, in a grid array pattern, wherein the conductive elements or solder balls have preselected dimensions and are spaced apart from each other by one or more preselected distances or pitches. Thus, the term "Fine Ball Grid Array" (FBGA) refers only to a specific ball grid array pattern having conductive elements that are considered relatively small to be spaced apart from each other at extremely small distances (resulting in smaller sized spaces or pitches). or solder balls. As generally used herein, the term "ball grid array" (BGA) encompasses fine ball grid array (FBGA) as well as ball grid array. Thus, and in an exemplary embodiment, a pattern representing conductive ink printed using the methods described herein is configured to fabricate interconnect (in other words, solder) balls. For example, as illustrated in FIG. 2, the solder balls may be seated in dedicated recesses _105j .

As used herein, the term "complementary" means that two surface profiles, such as the surface profiles illustrated in FIGS. 1A and 1J , are sized and configured such that the surface topography profile represented by FIG. 1A can be substantially Nested with complementary surface topology profiles facing cells such as those illustrated in Figure 1J. The "complementary" surfaces need not be identical. Perfect configuration or positioning of features is not "substantially" or "usually" required, but may vary based on, for example, manufacturing tolerances or on processing methods such as the use of solder balls, solder paste, or solder powder.

For example, in SMT components such as quad flat (QFP) package, thin small outline package (TSOP), small outline integrated circuit (SOIC) package, small outline J lead (SOJ) package, plastic lead chip carrier (PLCC) package, die Wafer Level Chip Scale Package (WLCSP), Die Array Processing - Ball Grid Array (MAPBGA), Ball Grid Array (BGA), Quad Flat No-Lead (QFN), Land Grid Array (LGA) or a combination thereof) coupled to the top surface of a PCB, HFCP, or AME, the methods provided herein may further include fabricating a first dielectric surface mask complementary to the top surface; and a second dielectric surface complementary to the base surface Electrical surface mask. In an exemplary embodiment, during the reflow process, the PCB is sandwiched between the first surface complementary dielectric mask and the second surface complementary dielectric mask, thus providing an improved surface for the PCB during the reflow process base.

Alternatively or additionally, the build-up manufacturing systems used in the methods and compositions for making surface complementary dielectric masks may further comprise any other number of other functional print heads or source materials suitable for dispensing conductive inkjet inks , the method further comprises: providing a second conductive ink composition; using a second conductive ink print head to form a predetermined pattern corresponding to the second conductive inkjet ink, the pattern being a connection terminal, a combination with a lead, an interconnection ball or a 2D representation of a combination thereof. In these exemplary embodiments, a surface complementary dielectric mask (RCM) can be fabricated as a second PCB, HFCP or AME and electrically coupled to its complementary surface on the original PCB, HFCP or AME.

In an exemplary embodiment, the term "forming" (and its variations "formed", etc.) refers to pumping, injecting, pouring, releasing, using any suitable means known in the art, Displace, dispense, circulate, or otherwise place a fluid or material (eg, conductive ink) into contact with another material (eg, a substrate, resin, or another layer). Similarly, the term "embedded" refers to the die and/or die package being securely coupled within a surrounding structure, or conformally or securely sealed within a material or structure.

Curing a dielectric layer or pattern deposited by a suitable dispenser as described herein can be achieved by, for example, heating, photopolymerization, drying, deposition plasma, annealing, promoting redox reactions, by UV beam Irradiate or comprise a combination of one or more of the foregoing. Curing need not be performed by a single process and may involve several processes (eg, drying and heating, and deposition of cross-linking agent with additional print heads) simultaneously or sequentially.

In an exemplary embodiment, in the methods disclosed herein for reducing warpage during reflow processing of PCBs, a dielectric ink composition for forming a surface complementary dielectric mask (RCM) or mold Contains polyester (PES), polyethylene (PE), polyvinyl alcohol (PVOH), poly(vinyl acetate) (PVA), polymethylmethacrylate (PMMA), poly(vinylpyrrolidone), poly(vinylpyrrolidone) Functional acrylates or combinations comprising mixtures, monomers, oligomers, and copolymers of one or more of the foregoing, which may further undergo cross-linking. In this context, cross-linking refers to the use of cross-linking agents by covalent bonding (ie, forming a linking group) or by monomers such as, but not limited to, methacrylates, methacrylamides, Free-radical polymerization of acrylates or acrylamides) holds the parts together. In some exemplary embodiments, the linking group grows to the end of the polymer arm.

For example, the multifunctional acrylate is at least one of the following monomers, oligomers, polymers and copolymers: 1,2-ethylene glycol diacrylate, 1,3-propylene glycol diacrylate, 1 ,4-Butanediol Diacrylate, 1,6-Hexanediol Diacrylate, Dipropylene Glycol Diacrylate, Neopentyl Glycol Diacrylate, Ethoxylated Neopentyl Glycol Diacrylate, Propoxy Neopentyl Glycol Diacrylate, Tripropylene Glycol Diacrylate, Bisphenol-A-Diglycidyl Ether Diacrylate, Hydroxypivalate Neopentyl Glycol Diacrylate, Ethoxylated Bisphenol-A-Diacrylate Glycidyl Ether Diacrylate, Polyethylene Glycol Diacrylate, Trimethylolpropane Triacrylate, Ethoxylated Trimethylolpropane Triacrylate, Propoxylated Trimethylolpropane Triacrylate, Propoxylated glycerol triacrylate, gins(2-acryloyloxyethyl) isocyanurate, isopentaerythritol triacrylate, ethoxylated isopentaerythritol triacrylate, isopentaerythritol Alcohol tetraacrylate, ethoxylated isopentaerythritol tetraacrylate, bis(trimethylolpropane) tetraacrylate, dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, or one or more of the foregoing of multifunctional acrylate compositions.

In an exemplary embodiment, the term "copolymer" means a polymer (including trimers, tetramers, etc.) derived from two or more monomers, and the term "polymer" refers to polymers derived from a or any carbon-containing compound that is a repeating unit of multiple different monomers.

Other functional heads may be located before, between, or after the inkjet ink print heads used in the system for implementing the methods described herein. These functional heads may include an electromagnetic radiation (EMR) source configured to emit electromagnetic radiation of a predetermined wavelength (□) and used for photopolymerization, thus curing the multifunctional acrylate (whether alone or in the presence of a photoinitiator) case). For example, the EMR source is configured to emit radiation with wavelengths between 190 nm and about 400 nm (eg, 395 nm), which in exemplary embodiments can be used to accelerate and/or modulate and/or facilitate photopolymerizable media. Electrical ink composition. Other functional heads may be heating elements, other print heads with various inks (eg supports, pre-soldered connectivity inks, marking printing of various components (eg capacitors, transistors) and the like) and combinations of the foregoing.

Other similar functional steps (and thus the support systems used to implement these steps) may be performed before or after each surface complementary dielectric mask (RCM) fabrication step (eg, dispensing and curing). Such steps may include (but are not limited to): a heating step (by heating elements or hot air); photobleaching (of the photoresist mask support pattern), photocuring, or exposure to any other suitable source of actinic radiation (using (e.g. UV light source); drying (e.g. using vacuum zones and/or heating elements); (reactive) plasma deposition (e.g. using pressurized plasma guns and plasma beam controllers); cross-linking (not by polyfunctional acrylics) ester), such as by using a cationic initiator such as [4-[(2-hydroxytetradecyl)-oxy]-phenyl]-phenyl iodonium hexafluoroantimonate; prior to coating; annealing, Or promote redox reactions and combinations thereof, regardless of the order in which these processes are utilized. In certain exemplary embodiments, a laser (eg, selective laser sintering/melting, direct laser sintering/melting) or electron beam fusion may be used on the printed dielectric pattern. It should be noted that if the conductive portion is added to the surface complementary dielectric mask (RCM), the sintering of the conductive portion can even cause the conductive portion to be printed on the surface complementary dielectric mask (RCM) described herein. 100) on the substrate surface (102, see eg Figure 2).

Consideration can be given by the deposition tool (for example, in terms of viscosity and surface tension of the composition) and the deposition surface characteristics (such as hydrophilicity or hydrophobicity, and the interfacial energy of the substrate or support material (such as glass), if used) or above Deposition of successive layers of substrate layers imposes requirements to formulate conductive ink compositions. For example, the viscosity (measured at printing temperature (°C)) of the conductive inkjet ink and/or DI may be, for example, not less than about 5 cP, such as not less than about 8 cP, or not less than about 10 cP, and not higher than about 30 cP, such as not higher than about 20 cP, or not higher than about 15 cP. The conductive inks can each be configured (eg, formulated) to have a dynamic surface tension between about 25 mN/m and about 35 mN/m, such as between about 29 mN/m and about 31 mN/m (referring to the surface tension at the orifice when droplets of inkjet ink are formed), as measured by the maximum bubble pressure tension meter at a surface age of 50 ms and at 25°C. The dynamic surface tension can be adjusted such that the contact angle with the peelable substrate, support material, resin layer, or combination thereof is between about 100° and about 165°.

In an exemplary embodiment, the term "chuck" is intended to mean a mechanism for supporting, holding, or retaining a substrate or workpiece. The chuck may include one or more parts. In an exemplary embodiment, the chuck may comprise a stage and insert (platform) combination, jacketed or otherwise configured for heating and/or cooling and having another similar component, or any combination thereof.

In an exemplary embodiment, inkjet ink compositions, systems, and methods that enable direct, continuous, or semi-continuous inkjet printing of surface complementary dielectric masks (RCMs) can be accomplished by ejecting a single shot from an orifice herein. Droplets of the provided liquid inkjet ink are patterned as, for example, in two dimensions (XY dimension) (understood that the print head can also be moved in the Z axis), over a removable substrate or any subsequent layers Operate the print head (or substrate) at a predetermined distance. The height of the print head can vary with the number of layers, maintaining eg a fixed distance. Each droplet can be configured to follow a predetermined trajectory from an orifice operably coupled to the orifice, via a deformable piezoelectric crystal (in an exemplary embodiment), to the substrate by, for example, a pressure pulse. The printing of the first ink jet metallic ink can be increased and a larger number of layers can be accommodated. The inkjet printheads provided for use in the methods described herein can provide minimum layer film thicknesses of equal to or less than about 0.3 μm to 10,000 μm.

The conveyors used in the described methods and that can be implemented in the described systems to move between the various print heads can be configured to move at speeds between about 5 mm/sec and about 1000 mm/sec. For example, the speed of the chuck can depend on, for example: the desired throughput, the number of print heads used in the process, the number and thickness of the layers of surface complementary dielectric masks (RCM) described herein that are printed, ( dielectric) the curing time of the ink, the evaporation rate of the ink solvent and the like, or a combination of factors including one or more of the foregoing.

In an exemplary embodiment, the volume of each droplet of the metallic (or metallic) ink and/or the second, resinous ink may range from 0.5 to 300 picoliters (pL), eg, 1-4 pL, depending on the driving pulse. It depends on the strength and the characteristics of the ink. The waveform used to eject a single drop can be a 10 V to about 70 V pulse, or about 16 V to about 20 V, and can be ejected at a frequency between about 2 kHz and about 500 kHz.

In certain exemplary embodiments, the CAM module further includes a computer program product for fabricating one or more surface-complementary dielectric masks. In some cases, the printed surface-complementary dielectric mask may contain discrete metal (conductive) components and resin (insulating and/or dielectric) components, thus effectively forming a topological circuit board automatically.

A computer that controls the printing process described herein may include a computer-readable storage medium having computer-readable code embodied therewith that, when executed by a processor in a digital computing device, causes a three-dimensional The inkjet printing unit performs the following steps: preprocessing computer-aided design/computer-aided manufacturing (CAD/CAM) generated information (eg Gerber and centroid files) related to the PCB intended to undergo the reflow process, thereby generating complex numbers A library of 2D files (in other words, each file representing at least one substantially 2D layer for printing a surface Complementary Dielectric Mask (RCM)); directing the DI resin material from the first inkjet print head on the substrate surface Droplet flow; moving the substrate relative to the inkjet head in the XY plane of the substrate, where for each of the plurality of layers (and/or the pattern of DI inkjet inks within each layer), a complementary dielectric at the surface The step of moving the substrate relative to the inkjet head in the XY plane of the substrate is performed in the layer-by-layer fabrication of the mask (RCM).

Furthermore, a computer program may include code means for carrying out the steps of the methods described herein, as well as a computer program product including the code means stored on a computer-readable medium. Memory devices as used in the methods described herein may be any of various types of non-volatile memory devices or storage devices (in other words, memory that does not lose information on it in the absence of power) device). The term "memory device" is intended to cover installation media such as CD-ROM, floppy disk or tape devices or non-volatile memory such as magnetic media such as hard drives, optical storage, or ROM, EPROM, FLASH and the like. Memory devices may also include other types of memory or combinations thereof. Additionally, the memory medium may be located in the first computer executing the program, and/or may be located in a second, different computer connected to the first computer via a network, such as the Internet. In the latter case, the second computer may further provide program instructions to the first computer for execution. The term "memory device" may also include two or more memory devices that may reside in different locations, such as in different computers connected via a network. Thus, for example, the bit library may reside on a memory device remote from the CAM module coupled to the provided 3D inkjet printer, and be accessible by the provided 3D inkjet printer (eg, via a wide area network road).

Unless specifically stated otherwise, as is apparent from the following discussion, it should be understood that throughout Discussion of the terms "", "measurement", "analyze" or similar terms refer to the actions and/or processes of a computer or computing system, or similar electronic computing device, which will Data represented in a manner, such as transistor architecture, is manipulated and/or converted into other data similarly represented in the form of layers of physical structure (in other words, resinous or metallic/metallic).

Furthermore, as used herein, the term "2D archive" refers to a given set of files that together define a single surface complementary dielectric mask or a plurality of surface complementary dielectric masks. In addition, the term "2D archive" may also be used to refer to a collection of 2D files or any other grid graphics file format (an image is represented as a collection of pixels, usually in the form of a rectangular grid, such as BMP, PNG, TIFF, GIF), which Structural layers that can be indexed, searched, and reassembled to provide a given surface-complementary dielectric mask (whether the search is for a surface-complementary dielectric mask (RCM) as a whole, or a surface-complementary dielectric mask (RCM) within a given specific layer).

The computer-aided design/computer-aided manufacturing (CAD/CAM) generated information used in the methods, programs and libraries related to the surface Complementary Dielectric Mask (RCM) described herein to be fabricated can be based on the information used to create the surface Complementary Dielectric Masking (RCM) CAD/CAM data packages such as IGES, DXF, DWG, DMIS, NC files, GERBER® files, EXCELLON®, STL, EPRT files, ODB, ODB++, .asm , STL, IGES, STEP, Catia, SolidWorks, Autocad, ProE, 3D Studio, Gerber, Rhino, Altium, Orcad, Eagle files, or a software package containing one or more of the foregoing. In addition, attributes associated with graphical objects (see, eg, FIGS. 1A-1J ) transfer the meta-information required for fabrication and can precisely define surface complementary dielectric masks (RCMs). Thus, and in an exemplary embodiment, using a preprocessing algorithm, such as GERBER®, EXCELLON®, ODB++, Centroid, DWG, DXF, STL, EPRT ASM, and the like, described herein, is converted into a surface for fabrication 2D archive of Complementary Dielectric Masking (RCM).

A more complete understanding of the components, methods, assemblies and devices disclosed herein can be obtained by reference to the accompanying drawings. These drawings (also referred to herein as "drawings") are merely schematic representations (eg, illustrations) for convenience and simplicity in illustrating the present disclosure, and are therefore not intended to indicate relative dimensions of devices or components thereof and Dimensions and/or define or limit the scope of exemplary embodiments. Although specific terms are used in the following description for the sake of clarity, these terms are only intended to refer to the specific structures of the exemplary implementations selected for illustration in the drawings, and are not intended to define or limit the scope of the present disclosure. In the drawings and the following description, it should be understood that like numerals refer to components of the same function.

Turning to FIGS. 1A-3B , illustrated in FIG. 1A , the illustration shows an archival image of a PCB that includes SMT components attempting to couple to the PCB during the reflow process. FIG. 1B is an image of the outline/shape file of PCB 200 (see eg 201, FIG. 3A). For example, a board profile file (which can stand alone or be part of a Gerber/ODB/ODB++ file) can be used to verify board dimensions, and can also include any that can be added to the surface Complementary Dielectric Mask (RCM) 100 cutout or external wiring. Figure 1C shows a graphic image or centroid file image of a PCB board with SMT components (see eg _204i , Figure 3A). This file describes the location and orientation of all surface mount (SMT) components, including reference designators, X and Y positions, board rotation and sides (top 203 or bottom 202, see eg Figure 3A). Only surface mount parts are listed in Centroid. Figure 1D shows the solder paste location (see eg _205j , Figure 3A). This can be derived from a solder paste stencil file (eg Eagle file, *.brd) that provides solder paste locations, which can be incorporated into the design (and/or cavity 104i) of the surface complementary dielectric mask (RCM) (see For example _105j , Fig. 2, 3B). Figure 1E illustrates the drill file. This can be, for example, an NC file (eg Excellon), which can be used in conjunction with a ^GERBER® file to define through holes (PTH, blind, buried, etc.) and drills for fasteners, NPTH, and other purposes (see eg _206p , Fig. 3A), and used to define the protrusions in the surface complementary dielectric mask (RCM) configured to engage the defined drilled holes in the complementary surfaces of the PCB (see e.g. _106p , Fig. 2, 3B).

Conversely, when fabricating surface complementary dielectric masks (RCMs), the profiles illustrated in Figure IF can be fabricated using profile files (see eg 101, Figures 2, 3B) and printed on the substrate surface (see eg 102, Figures 2, 3B) 3B) to the desired height. In addition, as illustrated in Figure 1G, the top surface (see eg 103, Figures 2, 3B) forms the SMT assembly portion, which is constructed from a centroid profile in which cavities, voids or recesses are created (see eg _104i , Figure 2 , 3B) and add the required tolerance. Figure 1H illustrates a component with pad and solder mask files (templates) and can be based on component files and (top/base) solder mask location files, from profile files and eg Eagle files (eg where cavities are created (see eg _105j , Figures 2, 3B)) construction, printed to the desired height (depth) (see e.g. _105i , Figures 2, 3B) to ensure that the surface complementary dielectric mask (RCM) does not touch during assembly Solder paste dispensed and no paste applied prior to reflow process. Finally, Figure 1I illustrates the fabrication of protrusions (see eg _106p , Figures 2, 3B) produced from drill files (eg Numerically Controlled (NC) drill files (*.brd), Excellon). Figure 1J illustrates the result of the final transformation of the data in the various files disclosed to generate a substantially 2D file (see eg, 100, Figures 2, 3B) for printing a surface complementary dielectric mask (RCM).

Turning now to Figure 4, a typical reflow process is described. As illustrated and in an exemplary embodiment, the basic reflow soldering process consists of: applying solder paste 301 to desired pads on a printed circuit board (PCB), HFCP or AME; placing SMT components 302 in the paste; Heat is applied 303 to the assembly, which causes the solder in the paste to melt (reflow), wet the PCB (or HFCP, AME) and terminate the parts (cool 304), causing the desired fillet connection. In an exemplary embodiment, after placing the SMT components and before applying heat, surface complementary dielectric masks (RCMs) are coupled 305 to the corresponding complementary surfaces and removed 306 after a cooling stage. It should be noted that coupling surface complementary dielectric masks (RCMs) to corresponding complementary surfaces can effectively encapsulate SMT devices and reduce warpage, as well as prevent defects such as tombstone of some SMT devices. In an exemplary embodiment, following the step of coupling 305 the RCM to at least one surface of the PCB, HFCP or AME, a housing 315 is provided that is operable to receive the at least one RCM and the PCB, HFCP or AME to which it is coupled , applying heat 303 to the housed assembly, which causes the solder in the paste to melt (reflow), wet the surface of the PCB, HFCP or AME and terminate the part (cool 304), cause the required fillet connection and solidification, Next, the housing 316 is removed and the RCM 306 is similarly separated and removed.

Tombstone effect (also known as Manhattan effect, Drawbridge effect or Stonehenge effect), in which one end of the chip assembly is detached from the PCB, while remaining bonded to the circuit board at the opposite end, by This end is raised and the chip components exhibit a more or less vertical orientation, considered a common soldering defect in surface mount electronics assemblies of small leadless components such as resistors and capacitors. Accordingly, the systems and methods disclosed herein are used as a method for reducing tombstoning of components in PCBs, HFCPs or AMEs.

As used herein, the term "comprising" and its derivatives are intended to specify the presence of stated features, elements, components, groups, integers and/or steps but not to exclude other unrecited features, elements, components, groups Open term for the presence of groups, integers and/or steps. The foregoing also applies to words of similar meaning, such as the terms "comprising", "having" and derivatives thereof.

All ranges disclosed herein are inclusive of the endpoints, and each endpoint is independently combinable with each other. "Combination" includes blends, mixtures, alloys, reaction products, and the like. Unless otherwise indicated herein or clearly contradicted by context, the terms "a" and "the" herein do not denote quantitative limitations and should be construed to encompass both the singular and the plural. As used herein, the suffix "(s)" is intended to include both the singular and the plural of the term it modifies, thereby including one or more of that term (eg, a printhead includes one or more printheads). References throughout this specification to "one exemplary embodiment," "another exemplary embodiment," "an exemplary embodiment," "an exemplary embodiment," and the like, when present, mean the particular elements described in connection with the exemplary embodiment (eg, characteristics, structures, and/or characteristics) are included in at least one exemplary embodiment described herein, and may or may not be present in other exemplary embodiments. Furthermore, it should be understood that the described elements may be combined in any suitable manner in the various exemplary embodiments. Furthermore, herein, the terms "first," "second," and similar terms do not denote any order, quantity, or importance, but rather are used to denote one element over another.

Similarly, the term "about" means that amounts, dimensions, formulations, parameters, and other quantities and characteristics are not and need not be exact, but can be approximated and/or larger or smaller as desired, reflecting tolerances, conversion factors , rounding, measurement error, and the like, and other factors known to those skilled in the art. Often, amounts, dimensions, formulations, parameters or other quantities or characteristics are "about" or "approximately" whether or not expressly stated.

Accordingly, in an exemplary embodiment, provided herein is a method for reducing warpage of an assembled printed circuit board (PCB), high frequency connection PCB (HFCP), or build-up electronic device (AME) during a reflow process Computerized method, the method comprising: obtaining a plurality of files related to an assembled PCB, HFCP or AME, the assembled PCB, HFCP or AME each having at least one of: a top surface and a base surface; using a plurality of file to fabricate a Surface Complementary Dielectric Mask (SCDM) or Reflow Compression Mask (RCM) for at least one of the following: the top surface and the substrate surface; and the SCDM or RCM and the PCB before starting the reflow process , HFCP or AME on their complementary surfaces coupled to thereby reduce warpage during the reflow process, wherein (i) the plurality of files associated with the assembled PCB, HFCP or AME comprising: configured to define the assembled PCB , HFCP, or AME profile; and a file configured to define the dimensions and spatial arrangement of at least one surface mount integrated circuit (SMT) to be assembled on at least one of the following: a PCB attempting to undergo a reflow process , the top surface and the base surface of HFCP or AME, (ii) wherein the plurality of files associated with the assembled PCB, HFCP or AME further comprises at least one of the following: a spatial parameter configured to define solder paste dispensing a file; and an alignment file, (iii) the alignment file comprising a spatial arrangement of electroless drilled holes, wherein (iv) the SCDM or RCM, when coupled with at least one of the following, is operable to substantially encapsulate at least one SMT: Top surface and base surface of an assembled PCB, HFCP or AME, wherein (v) the step of fabricating the SCDM or RCM comprises: providing an ink jet printing system comprising: a first print head operable to dispense a first dielectric ink composition; a conveyor operably coupled to the first print head, operable to convey the substrate to the first print head; and a computer-aided manufacturing ("CAM") module comprising at least the conveyor and the A central processing module (CPM) in communication with the first printhead, the CPM further comprising at least one processor in communication with a non-transitory processor-readable storage medium having executable instructions stored thereon A collection of executable instructions that, when executed by at least one processor, cause the CPM to control an inkjet printing system by performing steps comprising: receiving at least one file associated with an assembled PCB, HFCP or AME, wherein an attempt to manufacture SCDM or RCM of the PCB, HFCP or AME; using the at least one file associated with the assembled PCB, HFCP or AME to generate a file library comprising a plurality of files, each file representing a substantial 2D for printing the SCDM or RCM layer; and a metafile representing at least the printing order; providing a first dielectric ink composition; using a CAM module, obtain a first file from the library, which represents For printing the first layer of SCDM or RCM, wherein the first file contains printing instructions corresponding to the pattern of SCDM or RCM; using the first print head to form a pattern corresponding to the first dielectric ink; making the first layer The pattern corresponding to the first dielectric ink representation is cured; using the CAM module, a follow-up file is obtained from the library, which represents the subsequent layer for printing SCDM or RCM, and the follow-up file contains the subsequent layers corresponding to the first layer. A print instruction for a pattern of dielectric ink; repeating the steps of using the first print head to form a pattern corresponding to the first dielectric ink in subsequent layers to obtaining subsequent, substantially 2D layers from a 2D archive using a CAM module step, followed by curing the pattern corresponding to the first dielectric ink composition in the final layer in the printing sequence, the SCDM or RCM comprising a plurality of cavities configured to be complementary to at least one of the following: The top and base surfaces of the PCB, HFCP or AME, encapsulating virtually any surface mount components thereon: and removing the substrate, wherein (vi) the set of executable instructions is further configured to cause a CAM mode when executed Group: Using spatial parameters of solder paste dispensing to adapt the files generated in the library to generate patterns configured to cure the pattern corresponding to the first dielectric ink composition in the final layer in the printing sequence while forming voids that are operable to receive solder paste; and using the alignment file, the resulting library of patterns is adapted to generate patterns that are configured to correspond to the first in the final layer in the printing sequence A pattern of dielectric ink composition cures to form protrusions sized and configured to engage electroless drilled holes, wherein (vii) in making the final layer in the printing sequence corresponding to the first A pattern of the dielectric ink composition upon curing forms a frame sized to accommodate the contours of at least one of the top surface and substrate surface of a PCB, HFCP or AME intended to undergo a reflow process, wherein (viii) The first dielectric ink composition comprises polyester (PES), polyethylene (PE), polyvinyl alcohol (PVOH), poly(vinyl acetate) (PVA), polymethyl methacrylate (PMMA), poly( Vinylpyrrolidone), multifunctional acrylates, or a combination of mixtures, monomers, oligomers and copolymers comprising one or more of the foregoing, (ix) multifunctional acrylates are the following monomers, oligomers At least one of compounds, polymers and copolymers: 1,2-ethylene glycol diacrylate, 1,3-propanediol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediacrylate Alcohol Diacrylate, Dipropylene Glycol Diacrylate, Neopentyl Glycol Diacrylate, Ethoxylated Neopentyl Glycol Diacrylate, Propoxylated Neopentyl Glycol Diacrylate, Tripropylene Glycol Diacrylate, Diacrylate Phenol-A-Diglycidyl Ether Diacrylate, Hydroxypivalate Neopentyl Glycol Diacrylate, Ethoxylated Bisphenol-A-Diglycidyl Ether Diacrylate, Polyethylene Glycol Diacrylate, Tris Methylolpropane Triacrylate, Ethoxylated Trimethylolpropane Alkyl triacrylate, propoxylated trimethylolpropane triacrylate, propoxylated glycerol triacrylate, gins(2-acryloyloxyethyl) isocyanurate, isopentaerythritol triacrylate Acrylates, Ethoxylated Isopentaerythritol Triacrylate, Isopentaerythritol Tetraacrylate, Ethoxylated Isopentaerythritol Tetraacrylate, Di(trimethylolpropane) Tetraacrylate, Dipentaerythritol Pentaacrylate Acrylates and dipentaerythritol hexaacrylate, or a multifunctional acrylate composition comprising one or more of the foregoing, wherein (x) the at least one SMT is mounted using a solder reflow method, (xi) the at least one SMT is a wafer A package that is at least one of the following: Quad Flat Panel (QFP) package, Thin Small Outline Package (TSOP), Small Outline Integrated Circuit (SOIC) package, Small Outline J Lead (SOJ) Package, Plastic Leaded Chip Carrier (PLCC) Package , Wafer Level Chip Scale Package (WLCSP), Die Array Processing - Ball Grid Array (MAPBGA) package, Quad Flat No-Lead (QFN) package, Land Grid Array (LGA) package, of which (xii) PCB, The HFCP or AME each comprises a plurality of SMTs coupled to the top and base surfaces of the PCB, HFCP or AME, the method further comprising fabricating two dielectric surface masks: a first surface dielectric mask complementary to the top surface; and a second surface dielectric mask complementary to the substrate surface, (xiii) further comprising sandwiching the assembled PCB, HFCP or AME between the first complementary dielectric surface mask and the second complementary dielectric surface mask wherein (xiv) the complementary surface mask further comprises conductive traces and SMT and is operable as another PCB, HFCP or AME, further comprising (xv) electrically coupling the complementary surface mask to its complementary surface, and wherein the method Further comprising (xvi): after the step of coupling the SCDM or RCM to its complementary surface on the PCB, HFCP or AME, providing a housing operable to receive the SCDM or RCM coupled to the PCB, HFCP or AME; and start the reflow process.

In another exemplary embodiment, provided herein is a complement for manufacturing an assembled printed circuit board (PCB), a high frequency connection PCB (HFCP), or a build-up electronic device (AME) using an inkjet printer Computerized method of dielectric surface masking, the assembled printed circuit board, high frequency connection PCB, or buildup electronic device each having at least one surface mount component operably coupled to at least one of the following (SMT): a top surface layer and a base surface layer, the method comprising: providing an ink jet printing system comprising: a first print head operable to dispense a first dielectric ink composition; a conveyor associated with a first A print head is operably coupled, configured to transfer the substrate to the first print head; and a computer-aided manufacturing ("CAM") module including a central processing module in communication with at least the conveyor and the first print head (CPM), the CPM further comprising at least one processor in communication with a non-transitory processor-readable storage medium having a set of executable instructions stored thereon, the executable instructions being executed by at least one A processor when executed causes the CPM to control the inkjet printing system by performing steps including: receiving at least one file associated with an assembled PCB, HFCP or AME in which attempts to manufacture the assembled PCB, HFCP or AME; SCDM or RCM; using the at least one file associated with the assembled PCB, HFCP or AME, a file library is generated that contains a plurality of files (each file represents a substantially two-dimensional (2D) layer for printing the SCDM or RCM) and at least a metafile representing the printing sequence; providing a first dielectric ink composition; using a CAM module, obtaining a first file from the library representing the first layer for printing SCDM or RCM, wherein the first file contains Printing instructions corresponding to the pattern of SCDM or RCM; using the first print head to form a pattern corresponding to the first dielectric ink on the substrate; curing the pattern corresponding to the first dielectric ink in the first layer ; Using the CAM module, obtain a follow-up file from the library, which represents a follow-up layer for printing SCDM or RCM, the follow-up file containing the printing instructions in the follow-up layer corresponding to the pattern of the first dielectric ink; Reuse the first layer The step of a print head forming a pattern corresponding to the first dielectric ink to the step of obtaining subsequent, substantially 2D layers from the 2D archive using a CAM module, followed by the final layer in the print sequence corresponding to the first dielectric Pattern curing of the electrical ink composition, SCDM or RCM comprising a plurality of cavities configured to complement the surface of the PCB, HFCP or AME, substantially encapsulating the surface mount components thereon; and removing the substrate, wherein (xvi) the surface complementary dielectric mask (RCM) further comprises conductive traces and at least one SMT and is operable as a second PCB, HFCP or AME, and wherein the method further comprises (xvi) making the second PCB, HFCP or AME is operably coupled to its complementary surface step.

While the foregoing disclosures for 3D printing of surface complementary dielectric masks based on various profiles using inkjet printing have been described with respect to some exemplary embodiments, those of ordinary skill in the art will benefit from the disclosures herein. Other exemplary embodiments are apparent. Furthermore, the described exemplary implementations are presented by way of example only, are intended to illustrate technical features, and are not intended to limit the scope of the present disclosure. Indeed, the novel methods, programs, libraries and systems described herein may be implemented in various other forms without departing from the spirit thereof. Accordingly, other combinations, omissions, substitutions and modifications will be apparent to those skilled in the art from the disclosure herein.

100: Surface Complementary Dielectric Mask 101: Profile File 102: Substrate Surface 103: Top Surface 104i: Cavity/Void/Recess 105 _j : Cavity/Recess 106 _p : Protrusion 107: Frame 200: Printed Circuit Board 201 : outline/shape file 202 : bottom 203 : top 205 _j : solder paste position 206 _p : drill h : height of base part

For a better understanding of the fabrication of surface complementary dielectric masks for substantially encapsulating SMT and reducing warpage, methods of fabricating such surface complementary dielectric masks and compositions, with respect to exemplary embodiments thereof, reference is made to Accompanying examples and drawings, of which:

Figure 1(A-J) is a description of the file information used and the method used to manufacture the RCM;

FIG. 2 is a simplified schematic illustration of FIG. 1J;

3A illustrates an exemplary implementation of a PCB containing various sized SMT components, and FIG. 3B shows the RCM of the PCB; and

Figure 4 is a flow diagram of an exemplary embodiment of a typical reflow process.

Claims (20)

A computerized method for reducing warpage of an assembled printed circuit board (PCB), high frequency connection PCB (HFCP) or build-up electronic device (AME) during a reflow process, the method comprising: a. Obtain a plurality of files related to the assembled PCB, HFCP or AME each having at least one of the following: a top surface and a base surface; b. Using the plurality of files, fabricate a Surface Complementary Dielectric Mask (SCDM) or Reflow Compression Mask (RCM) for at least one of: the top surface and the base surface; and c. Coupling the SCDM or RCM to its complementary surface on the PCB, HFCP or AME prior to starting the reflow process, thereby reducing warpage during the reflow process. The method of claim 1, wherein the plurality of files associated with the assembled PCB, HFCP or AME comprise: a. A file configured to define the profile of the assembled PCB, HFCP or AME; and b. A file configured to define the dimensions and spatial arrangement of at least one surface mount integrated circuit (SMT) assembled on at least one of: the top surface of the PCB, HFCP or AME that is intended to undergo a reflow process and substrate surface. The method of claim 2, wherein the plurality of files related to the assembled PCB, HFCP or AME further comprise at least one of the following: a. A file configured to define space parameters for solder paste distribution; and b. Align the file. The method of claim 3, wherein the alignment file includes a spatial arrangement of electroless drilled holes. The method of claim 4, wherein the SCDM or RCM is operable to substantially encapsulate the at least one SMT when coupled with at least one of: a top surface and a base surface of the assembled PCB, HFCP or AME. The method of claim 5, wherein the steps for making the SCDM or RCM comprise: a. Provide inkjet printing systems that include: i. a first printhead operable to dispense the first dielectric ink composition; ii. a conveyor operably coupled to the first print head operable to convey a substrate to the first print head; and iii. A computer-aided manufacturing (“CAM”) module comprising a central processing module (CPM) in communication with at least the transmitter and the first print head, the CPM further comprising at least one processor readable with a non-transitory A processor in communication with a storage medium having stored on the non-transitory processor-readable storage medium a set of executable instructions that, when executed by the at least one processor, cause the CPM to control by performing steps comprising: The inkjet printing system: 1. Receive at least one file related to the assembled PCB, HFCP or AME in which an attempt is made to manufacture the SCDM or RCM of the assembled PCB, HFCP or AME; 2. Use the at least one file associated with the assembled PCB, HFCP or AME to generate a file library comprising a plurality of files, each file representing a substantially 2D layer used to print the SCDM or RCM; and 3. At least a metafile representing the printing order; b. providing the first dielectric ink composition; c. Using the CAM module, obtain a first file from the library, which represents the first layer for printing the SCDM or RCM, wherein the first file contains printing instructions corresponding to the pattern of the SCDM or RCM; d. using the first print head to form a pattern corresponding to the first dielectric ink; e. curing the pattern in the first layer corresponding to the first dielectric ink representation; f. Using the CAM module, obtain a follow-up file from the library, which represents a follow-up layer for printing the SCDM or RCM, the follow-up file includes the printing of the pattern corresponding to the first dielectric ink in the follow-up layer instruction; g. repeating the step of using the first print head to form a pattern corresponding to the first dielectric ink in the subsequent layer to the step of obtaining the subsequent, substantially 2D layer from the 2D archive using the CAM module, The pattern corresponding to the first dielectric ink composition in the final layer in the printing sequence is then cured, the SCDM or RCM comprising a plurality of cavities configured to match the following Complementary at least one of: the top surface and the base surface of the PCB, HFCP or AME, substantially encapsulating any surface mount components thereon; and h. Remove the base plate. The method of claim 6, wherein the set of executable instructions is further configured to cause the CAM module when executed: a. Using the spatial parameters of solder paste distribution, adapt the generated file in the library to generate a pattern configured to correspond to the first dielectric in the final layer in the printing sequence forming voids upon curing of the pattern of the ink composition, the voids being operable to receive the solder paste; and b. Using the alignment file, adapt the generated library of patterns to generate patterns configured to cure with patterns corresponding to the first dielectric ink composition in the final layer in the printing sequence When forming protrusions, the protrusions are sized and configured to engage the electroless drilled holes. The method of claim 7, wherein a frame is formed upon curing of the pattern corresponding to the first dielectric ink composition in the final layer in the printing sequence, the frame sized to accommodate at least one of Outline of: The top and base surfaces of the PCB, HFCP or AME that are attempting to undergo reflow processing. The method of claim 6, wherein the first dielectric ink composition comprises polyester (PES), polyethylene (PE), polyvinyl alcohol (PVOH), poly(vinyl acetate) (PVA), polymethyl Methyl acrylate (PMMA), poly(vinylpyrrolidone), multifunctional acrylates, or combinations comprising mixtures, monomers, oligomers, and copolymers of one or more of the foregoing. The method of claim 9, wherein the multifunctional acrylate is at least one of the following monomers, oligomers, polymers and copolymers: 1,2-ethylene glycol diacrylate, 1,3-propanediol Diacrylate, 1,4-Butanediol Diacrylate, 1,6-Hexanediol Diacrylate, Dipropylene Glycol Diacrylate, Neopentyl Glycol Diacrylate, Ethoxylated Neopentyl Glycol Diacrylate Esters, Propoxylated Neopentyl Glycol Diacrylate, Tripropylene Glycol Diacrylate, Bisphenol-A-Diglycidyl Ether Diacrylate, Hydroxypivalate Neopentyl Glycol Diacrylate, Ethoxylated Bis Phenol-A-Diglycidyl Ether Diacrylate, Polyethylene Glycol Diacrylate, Trimethylolpropane Triacrylate, Ethoxylated Trimethylolpropane Triacrylate, Propoxylated Trimethylol Propane Triacrylate, Propoxylated Glycerol Triacrylate, Tris(2-acryloyloxyethyl)isocyanurate, Isopentaerythritol Triacrylate, Ethoxylated Isopentaerythritol Triacrylate esters, isopentaerythritol tetraacrylate, ethoxylated isotaerythritol tetraacrylate, bis(trimethylolpropane) tetraacrylate, dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, or any of the foregoing One or more of the multifunctional acrylate compositions. The method of claim 7, wherein the at least one SMT is mounted using a reflow soldering method. The method of claim 12, wherein the at least one SMT is a chip package that is at least one of the following: Quad Flat Panel (QFP) package, Thin Small Outline Package (TSOP), Small Outline Integrated Circuit (SOIC) package, Small J Leaded (SOJ) packaging, Plastic Leaded Chip Carrier (PLCC) packaging, Wafer Level Chip Scale Packaging (WLCSP), Die Array Processing - Ball Grid Array (MAPBGA) packaging, Quad Flat No-Lead (QFN) packaging and pads Grid Array (LGA) package. The method of claim 12, wherein the PCB, HFCP or AME each comprises a plurality of SMTs coupled to the top and base surfaces of the PCB, HFCP or AME, the method further comprising fabricating two dielectric surface masks: a. a first surface dielectric mask complementary to the top surface; and b. A second surface dielectric mask complementary to the substrate surface. The method of claim 13, further comprising sandwiching the assembled PCB, HFCP or AME between the first complementary dielectric surface mask and the second complementary dielectric surface mask. The method of claim 7 or 13, wherein the complementary surface mask further comprises conductive traces and SMT and is operable as another PCB, HFCP or AME. The method of claim 15, further comprising electrically coupling the complementary surface mask to its complementary surface. The method of claim 1, further comprising: a. after the step of coupling the SCDM or RCM to its complementary surface on the PCB, HFCP or AME, providing a housing operable to receive the SCDM or RCM coupled to the PCB, HFCP or AME; and b. Start the reflow process. A Surface Complementary Dielectric Mask (SCDM) or Reflow for the use of ink jet printers to manufacture assembled printed circuit boards (PCBs), high frequency connection PCBs (HFCP), or build-up electronic devices (AME) Computerized method of compression masking (RCM), the assembled printed circuit board, high frequency connection PCB, or build-up electronic device each having at least one surface mount component operably coupled to at least one of the following (SMT): top surface layer and base surface layer, the method includes: a. Provide inkjet printing systems that include: i. a first printhead operable to dispense the first dielectric ink composition; ii. a conveyor operably coupled to the first print head, configured to convey a substrate to the first print head; and iii. A computer-aided manufacturing (“CAM”) module comprising a central processing module (CPM) in communication with at least the transmitter and the first print head, the CPM further comprising at least one processor readable with a non-transitory A processor in communication with a storage medium having stored on the non-transitory processor-readable storage medium a set of executable instructions that, when executed by the at least one processor, cause the CPM to control by performing steps comprising: The inkjet printing system: 1. Receive at least one file related to the assembled PCB, HFCP or AME in which an attempt is made to manufacture the SCDM or RCM of the assembled PCB, HFCP or AME; 2. Use the at least one file associated with the assembled PCB, HFCP or AME to generate a file library comprising a plurality of files, each file representing a substantially two-dimensional (2D) layer used to print the SCDM or RCM, and at least A metafile representing the printing order; b. providing the first dielectric ink composition; c. Using the CAM module, obtain a first file from the library, which represents the first layer for printing the SCDM or RCM, wherein the first file contains printing instructions corresponding to the pattern of the SCDM or RCM; d. using the first print head to form a pattern corresponding to the first dielectric ink on the substrate; e. curing the pattern in the first layer corresponding to the first dielectric ink representation; f. Using the CAM module, obtain a follow-up file from the library, which represents a follow-up layer for printing the SCDM or RCM, the follow-up file includes the printing of the pattern corresponding to the first dielectric ink in the follow-up layer instruction; g. Repeating the step of using the first print head to form the pattern corresponding to the first dielectric ink to the step of obtaining the subsequent, substantially 2D layer from the 2D archive using the CAM module, followed by printing the The pattern of the final layer in sequence corresponding to the first dielectric ink composition is cured, the surface complementary dielectric mask (RCM) includes a plurality of cavities configured to Complementary to the surface of the PCB, HFCP or AME, substantially encapsulating the surface mount components thereon; and h. Remove the base plate. The method of claim 18, wherein the SCDM or RCM further comprises conductive traces and at least one SMT coupled to the outer surface and is operable as a second PCB, HFCP or AME. The method of claim 19, further comprising the step of operatively coupling the second PCB, HFCP or AME to its complementary surface.

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