TW202123532A - Antenna device and manufacturing method thereof - Google Patents

Abstract

An antenna device includes a substrate, a chip, and an antenna. The chip is disposed on the substrate, and the chip has at least two pads. The antenna is disposed on the substrate, and the chip is disposed between the substrate and the antenna. The antenna has a first bonding line segment and a second bonding line segment electrically connecting to at least two pads respectively. The first bonding line segment is located on the outermost of the antenna to across the short-side direction of the chip with completely overlapping one of the at least two pads. The second bonding line segment is located on the innermost of the antenna to across the short-side direction of the chip with completely overlapping the other one of the at least two pads.

Description

Antenna device and manufacturing method thereof

The present invention relates to a wireless communication device, and more particularly to an antenna device and a manufacturing method thereof.

Radio Frequency Identification (RFID) devices are convenient. With the progress of the times, radio frequency identification devices are widely used in various fields, such as logistics management, warehouse management, or identity recognition.

However, in some radio frequency identification devices, because the antenna substrate is used to carry the antenna, and there is a gap between the integrated circuit (IC) chip and the antenna substrate, the overall thickness of the radio frequency identification device is thicker and easier. Problems such as IC chip breakage and antenna and chip contact breakage occur. In addition, if an IC chip such as a flexible integrated circuit chip or a plastic integrated circuit chip is used in the radio frequency identification device, during the manufacturing process, the integrated circuit chip is When bonding to the antenna substrate, it requires greater pressure and longer bonding time than traditional integrated circuit chips. As a result, the pressure is too high and the chip is prone to cracks, the antenna is easily broken, and the thermal compression bonding process Long time and other issues. Therefore, there is an urgent need for a method that can solve the aforementioned problems.

The present invention provides an antenna device, which can prevent problems such as chip breakage and antenna disconnection.

The present invention also provides a method for manufacturing an antenna device, which can produce an antenna device that can prevent problems such as chip cracking, antenna disconnection, etc., thereby improving the yield of the antenna device.

At least one embodiment of the present invention provides an antenna device including a substrate, a chip, and an antenna. The chip is arranged on the substrate and has at least two pads. The antenna is arranged on the substrate, and the chip is located between the substrate and the antenna. The antenna has a first bonding wire segment and a second bonding wire segment electrically connected to at least two pads, respectively. The first bonding wire segment is located at the outermost circle of the antenna and traverses the short side direction of the chip in a manner of completely covering one of the at least two pads. The second bonding wire segment is located at the innermost circle of the antenna and traverses the short side direction of the chip in a manner of completely covering the other of the at least two pads.

At least one embodiment of the present invention provides a manufacturing method of an antenna device, which includes steps such as a substrate preparation step, a wafer placement step, and an antenna formation step. The substrate is formed in the substrate preparation step. In the wafer placing step, the substrate is moved in a roll-to-roll manner, and the wafer is placed on the substrate, and the wafer has at least two pads. In addition, there is an included angle between the short side direction of the wafer and the moving direction of the substrate, wherein the included angle is less than or equal to 45 degrees. In the antenna forming step, the antenna is formed on the substrate, and the chip is located between the substrate and the antenna. In addition, the antenna has a first bonding wire segment and a second bonding wire segment electrically connected to at least two pads, wherein the first bonding wire segment is located at the outermost circle of the antenna, and horizontally covers one of the at least two pads. Across the short-side direction of the chip; the second bonding wire segment is located at the innermost circle of the antenna, and crosses the short-side direction of the chip in a manner that completely covers the other of the at least two pads.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

Throughout the specification, the same reference numerals indicate the same or similar elements. In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on another element," it can be directly on the other element, or intervening elements may also be present. The "electrical connection" of two components to each other can mean that there are other components between the two components.

It should be understood that although the terms "first" and "second" etc. may be used herein to describe various elements, components, regions, layers and/or parts, these elements, components, regions, and/or parts should not be affected by Limitations of these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section.

The terminology used here is only for the purpose of describing specific embodiments and is not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms "one" and "one" are intended to include plural forms, including "at least one." "One of at least two" is intended to mean at least a part of the plural form, the number of which may be singular or plural, and "the other of at least two" means another part other than the aforementioned part, the number of which may be It may be singular or plural. "Or" means "and/or". It should also be understood that when used in this specification, the terms "including" and/or "including" designate the presence of the features, regions, wholes, steps, operations, elements, and/or components, but do not exclude one or more The existence or addition of other features, regions as a whole, steps, operations, elements, components, and/or combinations thereof.

In addition, relative terms such as "lower" or "bottom surface" and "upper" or "top surface" may be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "below" other elements will be oriented "above" the other elements. Thus, the exemplary terms "upper" or "lower" can include an orientation of above and below.

As used herein, "about" or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the measurement in question and the error associated with the measurement A specific number (ie, the limit of the measurement system). For example, "about" or "substantially" can mean within one or more standard deviations of the stated value, or within ±30%, 20%, 10%, 5%. Furthermore, the "about" or "substantially" used herein can select a more acceptable deviation range or standard deviation based on optical properties, etching properties, or other properties, and not one standard deviation can be used for all properties.

Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

Fig. 1A is a schematic top view of an antenna device according to the first embodiment of the present invention; Fig. 1B is a schematic partial cross-sectional view along the line X1-X2 in Fig. 1A; Fig. 1C is a schematic view along the line Y1-Y2 in Fig. 1A Schematic diagram of the cross-section. For the convenience of description, the positions of the first pad 212, the second pad 214, the third pad 216, and the fourth pad 218 are indicated by dotted lines in FIG. 1A. In order to make the drawing clearer, another dashed line is used to indicate the position of the protective layer 500.

1A to 1C, the antenna device 10 includes a substrate 100, a chip 200, and an antenna 300. The chip 200 is located between the substrate 100 and the antenna 300, and the chip 200 is bonded to the antenna 300 via the pad 210 provided on the active surface 200a thereof. Specifically, as shown in FIG. 1B, the chip 200 is disposed on the substrate 100 such that the active surface 200a faces upward (that is, the back surface of the chip 200 faces the substrate 100), the antenna 300 is disposed on the substrate 100 and the chip 200, and the antenna 300 is arranged to be bonded to wafer 200.

The substrate 100 may be a flexible substrate. In this embodiment, the material of the substrate 100 may include paper, polyethylene terephthalate (PET), polyvinyl chloride (PVC), plastic film, or other suitable materials, etc. Those of ordinary skill in the art can select the material of the substrate 100 according to design requirements, and the present invention is not limited thereto. For example, when the antenna device 10 is used on a packaging box (such as a milk box, a paper bag, a biscuit bag, etc.), the substrate 100 is, for example, a substrate (such as paper, kraft paper, plastic, etc.) used to form the packaging box.

The chip 200 may include more than two pads 210, wherein the pads 210 are disposed on the active surface 200 a of the chip 200. For example, the pad 210 includes a first pad 212, a second pad 214, a third pad 216, and a fourth pad 218, for example. 1B, in the short-side direction D1 of the chip 200, the first pad 212 and the second pad 214 are, for example, located on a short side of the active surface 200a, and are respectively disposed adjacent to the chip 200 along the short-side direction D1. The first pad 212 and the second pad 214 overlap with the outermost circle of the antenna 300 in the top view direction. In this embodiment, a third pad 216 and a fourth pad 218 may be provided on the other short side of the chip 200, wherein the third pad 216 and the fourth pad 218 are respectively provided along the short side direction D1, for example At both ends of the long side adjacent to the chip 200 (as shown in FIG. 1A ), the third pad 216 and the fourth pad 218 overlap the innermost circle of the antenna 300 in the top view direction. It should be noted that although the number of pads on each short side of the chip shown in FIG. 1B is two as an example, the present invention is not limited to this. In other embodiments, the number of pads on each short side of the chip can also be 1 or greater than or equal to 2, and the type of the pads can also be adjusted according to different electrical connection methods, which will be described in detail later. 1C, in the longitudinal direction D2 of the chip 200, the third pad 216 is located at one end of the active surface 200a along the longitudinal direction D2 relative to the first pad 212, for example. For example, the fourth pad 218 is located at one end of the active surface 200 a along the longitudinal direction D2 relative to the second pad 214 (as shown in FIG. 1A ). In this embodiment, the chip 200 may be an integrated circuit component based on plastic, that is, a chip type in which active components and circuits are formed on a flexible substrate such as plastic. The active surface 200a is the formation surface of an integrated circuit including thin film transistors, TFTs, etc. In this embodiment, the first pad 212, the second pad 214, the third pad 216, and the fourth pad 218 can be used as electrical It is connected to the contact point of the integrated circuit inside the chip 200. The materials of the first pad 212, the second pad 214, the third pad 216 and the fourth pad 218 include conductive materials, such as gold, silver, copper, aluminum, molybdenum, titanium or other metals or alloys containing the foregoing metals .

The antenna 300 is, for example, a helical coil or other shapes, and both ends of the antenna 300 are electrically connected to the pads 210 of the chip 200. In this embodiment, the two ends of the antenna 300 are specifically described as follows: one end of the antenna 300 is Located on the outermost circle of the antenna, and extending from the end of the outermost circle of the coil inward (in the direction of the innermost circle), covering the pad 210 of the chip and crossing a specific line segment on the short side of the chip. This specific line segment will be referred to as The first bonding wire segment 310 of the antenna 300; the other end is located on the innermost circle of the antenna and extends outward (in the direction of the outermost circle) from the end of the innermost circle, covering the other pad 210 of the chip and crossing the other chip A specific line segment on a short side is referred to as the second bonding line segment 320 of the antenna 300 hereinafter.

1A, in the top view of the antenna device, the antenna 300 is located on the outermost first bonding line segment 310 and the innermost second bonding line segment 320 in the substrate projection direction to continuously and completely cross the short side direction of the chip 200 In the D1 method, the long side of the wafer 200 spans from the long side of the wafer 200 to the long side of the other side of the wafer 200 and extends on the two short sides of the wafer 200 respectively. According to this, the bonding of the antenna and the chip can be made less affected by the topography of the bonding surface such as the pad, and the problem of disconnection of the antenna can be avoided. In this embodiment, the material of the antenna 300 includes conductive materials, such as silver, copper, aluminum, graphene, or other conductive materials. In addition, the width of the first bonding wire segment 310 and the second bonding wire segment 320 of the antenna 300 may also be greater than the width of other parts of the antenna 300. As shown in FIG. 1A, on the chip 200, compared with other parts of the antenna 300, the first bonding wire segment 310 and the second bonding wire segment 320 have a larger coverage area in the projection direction of the substrate, and thus can cover more completely The two short sides of the wafer 200.

In this embodiment, the first bonding wire segment 310 and the second bonding wire segment 320 of the antenna 300 completely cover the pad 210 of the chip 200. Furthermore, as shown in FIG. 1A, in the top view of the antenna device, the coverage area of the first bonding wire segment 310 is larger than the areas of the first pad 212 and the second pad 214, and the coverage area of the second bonding wire segment 320 is larger than The area of the third pad 216 and the fourth pad 218 can therefore increase the contact area between the antenna 300 and the pad 210 of the chip 200, thereby ensuring the electrical connection between the antenna 300 and the chip 200, and preventing the antenna and the chip from being in contact with each other. Defects such as wire breakage or antenna breakage occurred during bonding.

In this embodiment, a groove may be further provided in the substrate 100. For example, the substrate in the predetermined region of the wafer can be stamped on the substrate 100 by stamping to reduce the thickness of the substrate in the predetermined region of the wafer, and a groove capable of accommodating the wafer can be formed in the predetermined region of the wafer. In other embodiments, the grooves can also be provided by forming a printed layer with openings on the substrate 100, which will be described in detail later. In some embodiments, the punching density of the substrate 100 at the groove 110 is, for example, greater than the punching density of the substrate 100 at the periphery of the groove 110, but the present invention is not limited thereto. 1B and 1C, there is an angle θ1 between the sidewall 110a of the groove 110 and the bottom surface 100b of the substrate 100. For example, the included angle θ1 may be an acute angle, but the invention is not limited to this.

The wafer 200 is, for example, disposed in the groove 110. In FIG. 1C, the description is made with an example in which the depth of the groove 110 is substantially the same as the height of the wafer 200. Furthermore, the depth of the groove is not greater than the thickness of the entire substrate, that is, a certain thickness of the substrate 100 is reserved at the bottom 110 b of the groove 110. In addition, the setting depth of the groove 110 can be adjusted according to requirements. In this embodiment, the depth of the groove 110 can be set in such a way that the top surface 210a of the pad 210 is substantially aligned with the surface 100a of the substrate 100. Specifically, referring to FIG. 1C, the distance between the top surface 210a of the pad 210 of the wafer 200 and the bottom surface 100b of the substrate 100 is set to H1, and the thickness of the substrate 100 outside the groove 110 is set to H2. For example, the distance between the top surface 210a of the pad 210 and the surface 100a of the substrate 100 is set to |H1-H2│≦5 μm. In one embodiment, the distance |H1-H2| is set to be substantially 0 μm, for example, that is, the top surface 210a of the pad 210 and the surface 100a of the substrate 100 may be coplanar.

In addition, in the planar direction of the antenna device, the groove 110 does not penetrate the entire substrate 100. If the distance between the bottom 110b of the groove 110 and the bottom surface 100b of the substrate 100 is set as H3, the distance H3 is not 0 μm. In one embodiment, the thickness H2 of the substrate 100 is, for example, 50 to 70 μm, and the distance H3 is, for example, 20 to 30 μm. The residual thickness of the substrate at the groove (ie, the distance H3) can be adjusted according to the strength of the substrate. The invention is not limited to this.

In this embodiment, the antenna 300 completely covers the two short sides of the wafer 200, for example, it also completely covers the two short sides of the groove 110. Furthermore, it is possible to prevent the bonding of the antenna and the chip from being affected by the topography such as grooves, and prevent the antenna from disconnecting or breaking the antenna.

Based on the above, by providing the above grooves on the substrate, not only the overall thickness of the antenna device 10 can be reduced, but also it can be avoided that the wafer protrudes from the substrate and is easily damaged during the manufacturing process to affect the yield, or due to the wafer and the substrate. There is a gap between them and it is easy to cause the antenna to form a disconnection and other problems. For example, compared with the traditional antenna device (thickness greater than 100 μm), the thickness of the antenna device 10 of the present invention only includes the thickness of the substrate 100 and the antenna 300, so the overall thickness of the antenna device 10 can be less than 50 μm. degree. In addition, the gap between the wafer and the substrate during antenna printing is, for example, 0 μm.

In this embodiment, an adhesive layer may optionally be included between the substrate 100 and the wafer 200. For example, the chip 200 can be attached and fixed on the substrate 100 by the adhesive layer 400. The area of the adhesive layer 400 in the projection direction of the substrate is, for example, greater than or equal to or smaller than the area of the wafer 200 in the projection direction of the substrate. In some embodiments, when the area of the adhesive layer 400 in the projection direction of the substrate is greater than the area of the wafer 200 in the projection direction of the substrate, the wafer 200 is, for example, buried in a part of the adhesive layer 400 so as to be located between the substrate 100 and the wafer 200 The thickness of the adhesive layer 400 is smaller than that of the adhesive layer 400 located at the periphery of the chip 200. For example, the adhesive layer 400 may further have a groove 410, and the wafer 200 is buried in the groove 410, for example. In this way, the wafer 200 can be prevented from falling off the substrate 100. In this embodiment, the material of the adhesive layer 400 includes, for example, adhesive, such as hot melt adhesive or other suitable adhesive materials, but the present invention is not limited thereto.

In one embodiment, when the substrate 100 has the groove 110, the adhesive layer 400 may be located at the bottom 110b of the groove 110, and the chip 200 may be attached and fixed in the groove 110.

In this embodiment, the substrate 100 may also optionally include a protective layer. For example, on the substrate 100, the protective layer 500 at least covers the area with the chip 200 and the antenna 300. In other words, the protective layer 500 covers the chip 200, the antenna 300 and part of the substrate 100. In addition, in the case where the substrate 100 further has the groove 110, in the top view direction of the antenna device, the covering area of the protective layer 500 is, for example, larger than the area of the groove 110. Thereby, the chip and the antenna can be protected from being damaged during the manufacturing process, and the antenna can also be prevented from falling off. In this embodiment, the protective layer 500 includes, for example, a printed protective layer or a printed material. For example, when the antenna device 10 is used on a packaging box, the protective layer 500 may be a printing layer used for the outer layer of the packaging box, that is, a printed material used for printing trademarks, packaging designs, and the like. In this way, the manufacturing steps can be simplified to improve the process efficiency, and the antenna device can be hidden inside the printed layer by the protective layer, thereby protecting the chip and the antenna from damage.

Fig. 2A is a schematic top view of an antenna device according to the second embodiment of the present invention; Fig. 2B is a schematic partial cross-sectional view along the line X1-X2 in Fig. 2A; Fig. 2C is a schematic view along the line Y1-Y2 in Fig. 2A Schematic diagram of the cross section. It must be noted here that the embodiment of FIGS. 2A to 2C uses the element numbers and part of the content of the embodiment of FIGS. 1A to 1C, wherein the same or similar numbers are used to denote the same or similar elements, and the same is omitted. Description of technical content. For the description of the omitted parts, refer to the foregoing embodiment, which is not repeated here.

2A to 2C, the difference between the antenna device 20 of this embodiment and the antenna device 10 of the first embodiment is: in the antenna device 20 of this embodiment, the substrate 100 further has a groove 120 in the area around the chip. This reduces the impact of chip breakage due to external force during the manufacturing process of the antenna device 20. As shown in FIG. 2A, the trench 120 is adjacent to the short side of the wafer 200 and is separated from the wafer 200 by a distance. In this embodiment, the distance between the trench 120 and the wafer 200 is, for example, 2 mm, but the invention is not limited to this. It should be noted that although the number of grooves shown in FIG. 2A is two as an example, the present invention is not limited thereto. In other embodiments, the number of grooves can also be one or greater than or equal to two. In this embodiment, the longitudinal extension direction of the trench 120 is, for example, parallel to the short-side direction D1 of the wafer 200, and the length of the trench 120 is, for example, greater than or equal to the width of the wafer 200. The depth of the trench 120 is, for example, less than or equal to the thickness of the substrate 100. In this embodiment, the trench 120 penetrates the substrate 100, for example. Accordingly, in the manufacturing process, when the wafer position is deviated due to the difference in ductility between the substrate and the wafer, the groove can play a buffer function to prevent the wafer from being pulled and broken, thereby improving the yield of the antenna device. .

Fig. 3A is a schematic top view of an antenna device according to a third embodiment of the present invention; Fig. 3B is a schematic partial cross-sectional view along the line X1-X2 in Fig. 3A; Fig. 3C is a schematic view along the line Y1-Y2 in Fig. 3A Schematic diagram of the cross-section. It must be noted here that the embodiment of FIGS. 3A to 3C follows the element numbers and part of the content of the embodiment of FIGS. 1A to 1C, wherein the same or similar numbers are used to denote the same or similar elements, and the same is omitted. Description of technical content. For the description of the omitted parts, refer to the foregoing embodiment, which is not repeated here.

3A to 3C, the difference between the antenna device 30 of this embodiment and the antenna device 10 of the first embodiment is that the area of the groove 130 of the antenna device 30 of this embodiment is larger than that of the antenna device 10 of the first embodiment The area of the groove 110. In this embodiment, in addition to the chip 200, the antenna 300 is also completely contained in the groove 130. 3C, there is an included angle θ2 between the sidewall 130a of the groove 130 and the bottom surface 100b of the substrate 100, and the included angle θ2 may be an acute angle, but the present invention is not limited thereto.

Referring to FIG. 3A, in the top view direction of the antenna device, the covering area of the protective layer 500 is, for example, larger than the area of the groove 130. Thereby, the chip and the antenna can be protected from being damaged during the manufacturing process, and the antenna can also be prevented from falling off.

3C, the antenna 300 roughly includes two types of traces on different planes, such as the antenna 302 located on the chip 200 and the antenna 304 located at the bottom 130b of the groove 130. In this embodiment, the surface 302a of the antenna 302 It is higher than the surface 304a of the antenna 304. In addition, the depth of the groove 130 can be set in such a way that the surface 302 a of the antenna 302 is substantially aligned with the surface 100 a of the substrate 100. Specifically, if the distance between the surface 302a of the antenna 302 and the bottom surface 100b of the substrate 100 is set to H4, and the thickness of the substrate 100 outside the groove 130 is set to H2, the distance H4 can be less than the thickness H2, or For example, the distance between the surface 302a of the antenna 302 and the surface 100a of the substrate 100 is set to |H4-H2│≦5 μm. In one embodiment, the distance |H4-H2| is set to be substantially 0 μm, for example, that is, the surface 302a of the antenna 302 and the surface 100a of the substrate 100 may be coplanar. In this way, not only the overall thickness of the antenna device 30 can be reduced, but also problems such as the chip or the antenna protruding from the substrate and easily damaged during the manufacturing process, affecting the yield, or easily causing the antenna to be disconnected, can also be avoided.

Fig. 4A is a schematic top view of an antenna device according to a fourth embodiment of the present invention; Fig. 4B is a schematic partial cross-sectional view along the line X1-X2 in Fig. 4A; Fig. 4C is a schematic view along the line Y1-Y2 in Fig. 4A Schematic diagram of the cross-section. It must be noted here that the embodiment of FIGS. 4A to 4C uses the element numbers and part of the content of the embodiment of FIGS. 1A to 1C, wherein the same or similar numbers are used to denote the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted parts, refer to the foregoing embodiment, which is not repeated here.

4A to 4C, the difference between the antenna device 40 of this embodiment and the antenna device 10 of the first embodiment is that the substrate 100 does not include the groove 110, and the area of the protective layer 502 is small. In the top view direction, the protective layer 502 only covers a part of the antenna 300 near the junction with the wafer 200. In other words, the coverage area of the protective layer 502 is at least larger than the area where the wafer 200 is provided. In this way, the chip can be protected from damage during the manufacturing process.

In this embodiment, compared with the conventional antenna device, the antenna device 40 of the present invention has a smaller overall thickness, and the gap between the chip and the substrate when the antenna is printed is small. For example, compared to the conventional antenna device (thickness greater than 100 μm), the thickness of the antenna device 40 only includes the thickness of the substrate 100, the adhesive layer 400, the chip 200 and the antenna 300, so the overall thickness of the antenna device 40 can be thinner Change to 70 μm～80 μm. In addition, when the adhesive layer 400 does not have the groove 410, the gap between the chip and the substrate when the antenna 300 is printed is, for example, 23 μm, which is thinner than the conventional antenna device, and can also prevent chip cracking, antenna disconnection, etc. Technical effect. On the other hand, when the adhesive layer 400 has the groove 410, the gap between the wafer and the substrate during the printing of the antenna 300 can be further reduced to 15 μm, so that the aforementioned technical effect is better.

Hereinafter, a manufacturing process of an antenna device according to the fifth embodiment of the present invention will be explained.

5A to 5D are flowcharts of a manufacturing method of an antenna device according to a fifth embodiment of the present invention. It must be noted here that the embodiments of FIGS. 5A to 5D follow the element numbers and part of the content of the embodiments of FIGS. 1A to 1C, wherein the same or similar numbers are used to denote the same or similar elements, and the same elements are omitted. Description of technical content. For the description of the omitted parts, refer to the foregoing embodiment, which is not repeated here. In this embodiment, the description is made by taking an example that the area of the adhesive layer 400 in the projection direction of the substrate is larger than the area of the wafer 200 in the projection direction of the substrate.

Referring to FIG. 5A, a substrate 100 is provided. Next, corresponding to the predetermined formation area of the wafer in the subsequent steps, an adhesive layer 400 is formed on the substrate.

Referring to FIG. 5B, a printing layer 600 is formed on the substrate 100. In this embodiment, the printing layer 600 further has an opening 602 to expose part of the adhesive layer 400. In other words, the printing layer 600 covers a part of the adhesive layer 400, and there is a distance L1 between the sidewall of the opening 602 and the side surface of the adhesive layer 400. In this embodiment, the adhesive layer 400 and the opening 602 of the printing layer 600 jointly form a groove shape, that is, the surface 400a of the adhesive layer 400 exposed by the opening 602 is, for example, the bottom of the groove, and the sidewall of the opening 602 is, for example, a recess. The sidewall of the groove. In this embodiment, the material of the printing layer 600 is, for example, printing ink used for printing trademarks, packaging designs, and the like. The thickness of the printed layer 600 is, for example, 15 μm.

Referring to FIG. 5C, the chip 200 is placed on the adhesive layer 400, that is, the chip 200 is placed in the opening 602 of the printed layer 600. In this embodiment, the depth of the groove formed by the printing layer 600 and the adhesive layer 400 is, for example, 1/2 of the thickness of the wafer 200. Specifically, referring to FIG. 5C, there is a distance H5 between the surface 600a of the printing layer 600 and the surface 400a of the adhesive layer 400, and the distance H5 is, for example, less than or equal to 1/2 the thickness of the wafer 200.

Then, for example, after the chip 200 is fixed by a heating and pressing process, the surface 600a of the printing layer 600 and the active surface 200a of the chip 200 are made coplanar.

Referring to FIG. 5D, an antenna 300 is formed on the substrate 100. In this embodiment, the antenna 300 is formed on the printed layer 600 and the chip 200, for example. So far, the fabrication of the antenna device 50 of this embodiment has been roughly completed. In this embodiment, in the top view direction of the antenna device, the area of the printed layer 600 is, for example, between the area of the chip 200 and the area of the antenna 300, and overlaps a part of the adhesive layer 400, but does not overlap with the position of the chip 200 overlapping.

Based on the above, by providing the above printed layer on the substrate, not only the overall thickness of the antenna device 50 can be reduced, but also the chip can be protected from damage during the manufacturing process to affect the yield, or the bonding between the antenna and the chip can be improved. It is not affected by the topography of the joint surface and avoids disconnection of the antenna.

Hereinafter, embodiments that can be applied to the pads in the above-mentioned embodiments and circuit structures that can be applied to chips will be exemplified, but the present invention is not limited to the following embodiments.

6A is a schematic top view of a wafer according to a sixth embodiment of the present invention; FIG. 6B is a schematic top view of a wafer according to a seventh embodiment of the present invention; FIG. 7 is a schematic view of a wafer according to the eighth embodiment of the present invention Schematic diagram of the circuit structure. It must be noted here that the embodiment of FIG. 6A, FIG. 6B, and FIG. 7 use the element numbers and part of the content of the embodiment of FIG. 1A to FIG. 1C, wherein the same or similar reference numbers are used to represent the same or similar elements, and The description of the same technical content is omitted. For the description of the omitted parts, refer to the foregoing embodiment, which is not repeated here.

6A, the pads of the chip 200 include, for example, a plurality of pads LA1 and a plurality of pads LB1, wherein in the long side direction D2 of the chip 200, the plurality of pads LA1 are located on a short side of the chip 200, and The multiple pads LB1 are located on the other short side of the chip 200. It should be noted that although the number of pads LA1 and LB1 shown in FIG. 6A is two as an example, the present invention is not limited thereto. In other embodiments, the number of pads LA1 and LB1 can also be greater than or equal to two. For example, in the chip 200 in any of the above embodiments, the third pad 216 and the fourth pad 218 can be regarded as a plurality of pads LA1, and the first pad 212 and the second pad 214 can be regarded as a plurality of pads. Pad LB1; or the first pad 212 and the second pad 214 can be regarded as a plurality of pads LA1, and the third pad 216 and the fourth pad 218 can be regarded as a plurality of pads LB1. Therefore, the structure of the pad LA1 and the pad LB1 is similar to the pad 210 in any of the foregoing embodiments, and will not be repeated here. In addition, both ends of the antenna (for example, the first bonding wire segment 310 and the second bonding wire segment 320 of the antenna 300) respectively cover a plurality of pads LA1 and a plurality of pads LB1, and are electrically connected to the pads LA1 and LB1 through the pads LA1 and LB1. According to the driving circuit in the chip 200, one of the pad LA1 and the pad LB1 can function as an input terminal, and the other can function as an output terminal.

6B, the pads of the chip 200 include, for example, a pad LA2 and a pad LB2. In the long side direction D2 of the chip 200, the pad LA2 is located on a short side of the chip 200, and the pad LB2 is located on the chip 200. On the other short side. The pad LA2 and the pad LB2 are, for example, elongated pads extending along the short side direction D1 of the chip 200. For example, the pad LA2 and the pad LB2 can be elongated pads with a length slightly less than the width of the chip 200. In this way, the contact area between the pads of the chip and the antenna can be increased. In addition, both ends of the antenna (such as the first bonding wire segment 310 and the second bonding wire segment 320 of the antenna 300) respectively cover the pad LA2 and the pad LB2, and are electrically connected to the chip 200 through the pad LA2 and the pad LB2. According to the driving circuit, one of the pad LA2 and the pad LB2 can be used as an input terminal, and the other can function as an output terminal.

Referring to FIG. 7, the pads LA on the chip 200 are, for example, the above-mentioned multiple pads LA1 or LA2, and the pads LB are, for example, the above-mentioned multiple pads LB1 or LB2, but the present invention is not limited thereto. One of the pad LA and the pad LB may be used as an input terminal, and the other may be used as an output terminal, for example. In this embodiment, the circuit structure 700 is coupled to the chip 200 via the pad LA and the pad LB, for example, and is connected in parallel with the capacitor C. The capacitor C is, for example, a tuning capacitor (Tuning Capacitor). In an embodiment, the circuit structure 700 may include a radio frequency block 710 and a digital block 720. The radio frequency block 710 includes, for example, a rectifier (Rectifier) 712 and a modulator (Modulator) 714, and the digital block 720 includes, for example, a clock generator (Clock Generator) 722, a memory array (Memory Array) 724, and a digital controller ( Digital Controller) 727, etc., but the present invention is not limited to this. In this embodiment, for example, the pad LA is used as the input terminal to receive the input signal from the circuit structure 700 and the pad LB is used as the output terminal to output the signal to the circuit structure 700. After receiving the signal through the antenna, the signal can be output to the circuit structure 700 through the pad LB, and the circuit structure 700 uses the radio frequency block 710 and the digital block 720 to rectify, modulate, write or read the signal, etc. deal with. After the signal is processed, the circuit structure 700 can output the processed signal to the pad LA.

Hereinafter, a manufacturing process of an antenna device according to an embodiment of the present invention will be described. The following content is described in a roll-to-roll process, but the present invention is not limited to this.

8A is a flowchart of a manufacturing method of an antenna device according to a ninth embodiment of the present invention; FIG. 8B is a partial perspective view of the manufacturing method of FIG. 8A.

8A and 8B, the substrate preparation steps include step S100, step S102, step S104, step S108 and so on.

In step S100, the substrate (raw material base material) is input into the printing device through a feed roller. In this embodiment, the substrate moves in a roll-to-roll manner, but the invention is not limited to this. The substrate is, for example, paper, polyethylene terephthalate, polyvinyl chloride, plastic film, or other suitable materials, and the present invention is not limited thereto. For example, when the antenna device is to be used on a packaging box (such as milk cartons, paper bags, biscuit bags, etc.), the substrate can be the same as the substrate used to form the packaging box (such as paper, kraft paper, plastic, etc.) material.

In step S102, the alignment mark 802 is printed on the substrate and the adhesive layer 810 is formed corresponding to the predetermined formation area of the wafer in the subsequent step. In this embodiment, the adhesive layer 810 is, for example, hot melt adhesive or other suitable adhesive materials. In some embodiments, the adhesive layer 810 may further have a groove (for example, the groove 410 of FIG. 1B).

In one embodiment, a groove may be formed in the substrate, for example, the groove 110 of FIG. 1A or the groove 130 of FIG. 3A may be formed. Moreover, an adhesive layer 810 can be formed in the groove. The method of forming the groove, for example, thinning the substrate thickness of the predetermined formation area of the chip or the antenna by means of stamping, stamping, etc., and forming a groove capable of accommodating at least one of the chip and the antenna at the predetermined formation area, but the present invention Not limited to this.

Next, in step S104, the adhesive layer 810 is dried to cure the adhesive layer 810. In this embodiment, the method of drying the adhesive layer 810 is not particularly limited, as long as it does not fall off due to subsequent manufacturing processes.

Then, in step S108, the substrate 800 (semi-finished substrate) with the alignment mark 802 and the adhesive layer 810 is taken up by a take-up roller 900, and the subsequent steps are performed in the bonding equipment.

In some embodiments, step S106 can be optionally performed between step S104 and step S108. In step S106, for example, a trench (not shown) is formed by cutting the substrate. In this embodiment, corresponding to the predetermined formation area of the wafer in the subsequent step, the length of the trench is, for example, greater than or equal to the width of the predetermined formation area of the wafer, and the depth of the trench is, for example, less than or equal to the thickness of the substrate. On the short side adjacent to the predetermined formation area of the wafer, the groove is separated from the predetermined formation area of the wafer by a distance. For example, the distance between the groove and the predetermined formation area of the wafer is about 2 mm. The longitudinal extension direction of the groove is, for example, parallel to the rolling direction of the take-up drum 900, that is, the longitudinal extension direction of the groove is, for example, parallel to the moving direction D3 of the substrate. Accordingly, in the subsequent manufacturing process, when the wafer position deviation caused by the difference in ductility between the substrate and the wafer occurs, the groove can play a buffer function to prevent the wafer from being pulled and broken, thereby improving the yield of the antenna device. .

In some embodiments, between step S104 and step S108, through the manufacturing process shown in FIGS. 5A to 5D, a printed layer with an opening is formed on the substrate, and the opening exposes, for example, part of the adhesive层810.

Fig. 9A and Fig. 9B are schematic diagrams of the next step of Fig. 8A and Fig. 8B.

9A and 9B, the wafer placement step includes step S110, step S112, step S114, step S116, step S118, and so on.

In step S110, the substrate 800 to be wound up in step S108 is input into the bonding equipment. In one embodiment, the bonding device is, for example, a flip chip bonding machine (Flip Chip Bonding Machine).

In step S112, pick up the chip 820 on a wafer or sheet, and make the pads (not shown) of the chip 820 face upward (ie, the back surface of the chip 820 faces the substrate 800). In some embodiments, when the pads of the chip 820 on the wafer or sheet are facing the surface of the wafer, after the chip 820 is picked up, the chip 820 is turned over by 180 degrees to turn the chip 820 over. The pad is facing up. The chip 820 may include more than two pads, wherein the pads are disposed on the active surface of the chip 820. For example, the pads may be the pads LA1 and LB1 as shown in FIG. 6A, or the pads LA2 and LB2 as shown in FIG. 6B, etc. The layout of the pads can be adjusted according to design requirements. The present invention is not limited to this. In this embodiment, the chip 820 may be an integrated circuit component based on plastic, that is, a chip type in which active components and circuits are formed on a flexible substrate such as plastic. The active surface of the chip 820 is the formation surface of integrated circuits including thin film transistors, TFTs, etc., and the pads can be used as contacts that are electrically connected to the internal integrated circuits of the chip 820. The material of the pad includes conductive materials, such as gold, silver, copper, aluminum, molybdenum, titanium, or other metals or alloys containing the foregoing metals.

In step S114, the wafer 820 is placed on the substrate 800. In this embodiment, the chip 820 is placed on the adhesive layer 810 in such a way that there is an angle between the short side direction of the chip 820 and the moving direction D3 of the substrate. The angle between the short side direction of the wafer 820 and the moving direction D3 of the substrate is, for example, less than or equal to 45 degrees, preferably 0 degrees. In other words, the short side direction of the wafer 820 and the moving direction D3 of the substrate are preferably parallel to each other. Because the larger the contact area between the receiving roller and the wafer, the easier it is to cause the subsequent bending angle of the wafer during the subsequent winding of the wafer, causing the friction between the receiving roller and the wafer surface to be too large, or increasing the impact of the wafer by the receiving roller And other issues, which in turn caused damage to the chip. However, by placing the chip 820 with an angle between the short side direction of the chip 820 and the movement direction D3 of the substrate, the force path of the chip in the movement direction D3 of the substrate is shorter and the bending angle of the chip is smaller. It can greatly reduce the chance of chip damage, thereby improving the yield. In contrast, if the short side direction of the wafer 820 and the moving direction D3 of the substrate are perpendicular to each other, the measured yield rate is extremely low, for example, less than 10%.

In some embodiments, when the substrate 800 further has a groove, the wafer 820 is placed in the groove, for example. According to this, not only can the thickness of the antenna device to be formed later be reduced, but also problems such as the wafer protruding from the substrate can be easily damaged in the subsequent manufacturing process, which affects the yield.

Next, in step S116, the wafer 820 is pressed and fixed. In this embodiment, the method of pressing and fixing is, for example, hot pressing, to heat and melt the adhesive layer 810, whereby the wafer 820 is fixed on the substrate 800 via the adhesive layer 810.

Then, in step S118, the substrate 800 on which the wafer 820 is placed is taken up by the take-up roller 900, and the subsequent steps are performed in the printing equipment.

10A and 10B are schematic diagrams of the next step of FIGS. 9A and 9B.

10A and 10B, the antenna formation steps include step S120, step S122, step S124, step S126 and so on.

In step S120, the substrate 800 to be wound up in step S118, that is, the substrate 800 on which the wafer 820 is placed, is input into the printing device.

In step S122, the antenna 830 is printed. In this embodiment, an antenna 830 is formed on the substrate 800 and the chip 820, and the antenna 830 is, for example, a spiral coil or other shapes. Two ends of the antenna 830 are electrically connected to the pads of the chip 820 respectively. In an embodiment, the antenna 830 may include a first bonding wire segment 310 and a second bonding wire segment 320 like the antenna 300 of FIG. 1A. For related descriptions, please refer to the above-mentioned embodiment, which will not be repeated here. In this embodiment, the material of the antenna 830 is, for example, conductive silver nano ink, graphene ink, or other conductive materials. Methods of printing the antenna 830 include, for example, Letterpress Printing, Gravure Printing, Screen Printing, Lithography, or Thermal Transfer. However, the present invention does not Limited to this.

Next, in step S124, the antenna 830 is dried, and the antenna 830 is cured. In this embodiment, the method of drying the antenna 830 includes, for example, thermal curing, light curing, or air-drying curing, etc., but the present invention is not limited thereto. In one embodiment, after curing the antenna 830, a protective layer may be formed thereon, for example, the protective layer 500 of FIG. 1A or the protective layer 502 of FIG. 4A. So far, the fabrication of the antenna device 60 of this embodiment has been roughly completed. Finally, in step S126, the antenna device 60 is wound up.

In this embodiment, the thickness of the substrate 800, the wafer 820, and the antenna 830 in the antenna device 60 are, for example, 35 μm, 13 μm, and 10 μm, respectively. In some embodiments, when the wafer 820 is placed in the groove, the overall thickness of the antenna device 60 may be less than 50 μm. Accordingly, compared with the traditional antenna device (thickness greater than 100 μm), not only the overall thickness of the antenna device is greatly reduced, but also problems such as the wafer protruding from the substrate and easily damaged in the subsequent manufacturing process and affecting the yield rate can be avoided. In addition, compared with the traditional antenna device manufacturing method, the steps of manufacturing the antenna device 60 are fewer, and the process efficiency can be improved.

FIG. 11 is a flowchart of a manufacturing method of an antenna device according to a tenth embodiment of the present invention.

Please refer to FIG. 11, the difference between the manufacturing method of the tenth embodiment and the manufacturing method of the ninth embodiment is that the manufacturing method of the tenth embodiment is the manufacturing process of the antenna device in the same roll-to-roll machine station. In other words, for example, steps S108, S118, and S120 of the ninth embodiment can be omitted. In this way, the process efficiency can be improved. For the part of the technical description omitted from step S200 to step S220, please refer to the related content of FIG. 8A, FIG. 9A, and FIG. 10A, which will not be repeated here.

12 is a perspective schematic view of a method of manufacturing an antenna device according to an eleventh embodiment of the present invention, in which the same component symbols as in FIGS. 8B, 9B, and 10B are used to represent the same or similar components, and omitted Part of the technical description, such as the size, material, function, etc. of each layer or area, can refer to the related content of FIG. 8B, FIG. 9B, and FIG. 10B, and therefore will not be described in detail below.

Referring to FIG. 12, for example, the manufacturing method of the ninth embodiment or the manufacturing method of the tenth embodiment may be repeated to form a plurality of antenna devices 60 on the substrate. For example, step S102 or step S202 can be repeated during the substrate preparation step to form multiple adhesive layers on the substrate, and then step S112 and step S114 or step S210 and step S212 can be repeated during the wafer placement step to combine A plurality of chips are placed on the adhesive layer, and then step S122 or step S216 is repeated during the antenna forming step, so that the plurality of antennas are respectively formed on the corresponding chips.

In summary, the antenna device of the present invention uses the outermost ring and innermost ring of the antenna to respectively span the chip, so that the bonding between the antenna and the chip is less affected by the topography of the bonding surface such as the pad, and the antenna is prevented from being generated. Disconnection and other situations. Moreover, in the manufacturing method of the antenna device of the present invention, placing the wafer on the substrate in such a way that there is an angle between the short side direction of the wafer and the rolling direction of the take-up roller, in addition to making the force path of the wafer shorter , In addition to the smaller bending angle, it can further improve the yield of the antenna device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be subject to those defined by the attached patent application scope.

10, 20, 30, 40, 50, 60: antenna device 100, 800: substrate 100a, 302a, 304a, 400a, 600a: surface 100b: bottom surface 110, 130, 410: groove 110a, 130a: side wall 110b, 130b: bottom 120: groove 200, 820: chip 200a: active side 210: pad 210a: Top surface 212: first pad 214: second pad 216: third pad 218: fourth pad 300, 302, 304, 830: antenna 310: The first joint line segment 320: second joint line segment 400, 810: Adhesive layer 500, 502: protective layer 600: printing layer 602: open 700: circuit structure 710: RF block 712: Rectifier 714: Modulator 720: digital block 722: Clock Generator 724: Memory Array 727: Digital Controller 802: Counterpoint 900: Receiving drum C: Capacitance D1: Short side direction D2: Long side direction D3: scroll direction H1, H3, H4, H5, L1: distance H2: thickness LA, LA1, LA2, LB, LB1, LB2: pad S100～S126, S200～S220: steps θ1, θ2: included angle

FIG. 1A is a schematic top view of an antenna device according to the first embodiment of the present invention. Fig. 1B is a schematic partial cross-sectional view of the line X1-X2 in Fig. 1A. Fig. 1C is a schematic cross-sectional view of the line Y1-Y2 in Fig. 1A. Fig. 2A is a schematic top view of an antenna device according to a second embodiment of the present invention. Fig. 2B is a schematic partial cross-sectional view of the line X1-X2 in Fig. 2A. Fig. 2C is a schematic cross-sectional view of the line Y1-Y2 in Fig. 2A. Fig. 3A is a schematic top view of an antenna device according to a third embodiment of the present invention. Fig. 3B is a schematic partial cross-sectional view of the line X1-X2 in Fig. 3A. Fig. 3C is a schematic cross-sectional view of the line Y1-Y2 in Fig. 3A. 4A is a schematic top view of an antenna device according to a fourth embodiment of the present invention. Fig. 4B is a schematic partial cross-sectional view of the line X1-X2 in Fig. 4A. Fig. 4C is a schematic cross-sectional view of the line Y1-Y2 in Fig. 4A. 5A to 5D are flowcharts of a manufacturing method of an antenna device according to a fifth embodiment of the present invention. Fig. 6A is a schematic top view of a wafer according to a sixth embodiment of the present invention. Fig. 6B is a schematic top view of a wafer according to a seventh embodiment of the present invention. FIG. 7 is a schematic diagram of a circuit structure of a chip according to an eighth embodiment of the present invention. 8A, 9A, and 10A are flowcharts of a manufacturing method of an antenna device according to a ninth embodiment of the present invention. 8B, 9B, and 10B are partial three-dimensional schematic diagrams of a manufacturing method of an antenna device according to a ninth embodiment of the present invention. FIG. 11 is a flowchart of a manufacturing method of an antenna device according to a tenth embodiment of the present invention. FIG. 12 is a perspective schematic diagram of a manufacturing method of an antenna device according to an eleventh embodiment of the present invention.

10: Antenna device

100: substrate

110: Groove

200: chip

210: pad

212: first pad

214: second pad

216: third pad

218: fourth pad

300: Antenna

310: The first joint line segment

320: second joint line segment

400: Adhesive layer

500: protective layer

D1: Short side direction

D2: Long side direction

Claims (20)

An antenna device, including: Substrate A chip arranged on the substrate, the chip having at least two pads; and The antenna is disposed on the substrate, the chip is located between the substrate and the antenna, and the antenna has a first bonding wire segment and a second bonding wire segment electrically connected to the at least two pads, respectively, The first bonding wire segment is located at the outermost circle of the antenna and traverses the short side direction of the chip in a manner of completely covering one of the at least two pads, and the second bonding wire segment is located at the outermost ring of the antenna. The inner ring traverses the short side direction of the chip in a manner of completely covering the other of the at least two pads. The antenna device according to claim 1, wherein the substrate further has a groove, There is an included angle between the side wall of the groove and the bottom surface of the substrate, and the included angle is an acute angle. The antenna device according to claim 2, wherein the punching density of the substrate at the groove is greater than the punching density of the substrate at the periphery of the groove. The antenna device according to claim 2, wherein the chip is located in the groove, and the antenna straddles the groove, The distance between the top surface of the at least two pads and the bottom surface of the substrate is set to H1, the thickness of the substrate outside the groove is set to H2, and the at least two pads The distance between the top surface of the pad and the surface of the substrate│H1-H2│≦5 μm. The antenna device according to claim 2, wherein the chip and the antenna are located in the groove, Set the distance between the surface of the antenna above the chip and the bottom surface of the substrate as H4, and set the thickness of the substrate outside the groove as H2, then the antenna The distance between the surface of the substrate and the surface of the substrate│H4-H2│≦5 μm. The antenna device according to claim 2, which further includes: The protection layer is disposed on the chip, the protection layer covers at least a part of the chip, the antenna and the substrate, and the area of the protection layer is larger than the area of the groove. The antenna device according to claim 1, which further includes: The adhesive layer is located between the substrate and the chip. The antenna device according to claim 7, which further includes: The area of the adhesive layer is greater than the area of the chip, The chip is buried in a part of the adhesion layer, so that the thickness of the adhesion layer between the substrate and the chip is smaller than the thickness of the adhesion layer on the periphery of the chip. The antenna device according to claim 1, which further includes: The printing layer is located on the substrate, The printing layer has an opening, the chip is located in the opening, and the surface of the printing layer and the active surface of the chip are substantially coplanar. The antenna device according to any one of claim 1 to claim 9, wherein the substrate further includes a groove, The groove is adjacent to the short side of the wafer and is separated from the wafer by a distance, The length of the groove is greater than or equal to the width of the wafer. The antenna device according to claim 1, wherein the at least two pads include a first pad and a second pad, The first pad is located on the short side of the chip, and the second pad is located on the other short side of the chip, The first bonding wire segment completely covers the first pad, and the second bonding wire segment completely covers the second pad. A manufacturing method of an antenna device includes: The substrate preparation step, forming the substrate; In the wafer placing step, the substrate is moved in a roll-to-roll manner, and the wafer is placed on the substrate, the wafer has at least two pads, and the short side direction of the wafer is different from the moving direction of the substrate There is an included angle between, the included angle is less than or equal to 45 degrees; and In the antenna forming step, an antenna is formed on the substrate, the chip is located between the substrate and the antenna, and the antenna has a first bonding wire segment and a second bonding wire that are electrically connected to the at least two pads, respectively. Joining line segments, The first bonding wire segment is located at the outermost circle of the antenna and traverses the short side direction of the chip in a manner of completely covering one of the at least two pads, and the second bonding wire segment is located at the outermost ring of the antenna. The inner ring traverses the short side direction of the chip in a manner of completely covering the other of the at least two pads. The method for manufacturing an antenna device according to claim 12, wherein the substrate preparation step further includes: A groove forming step, forming a groove in the substrate corresponding to a predetermined formation area of the wafer or the antenna, There is an included angle between the side wall of the groove and the bottom surface of the substrate, and the included angle is an acute angle. The method for manufacturing an antenna device according to claim 13, wherein after the antenna forming step, the method further includes: A protective layer is formed on the chip, the protective layer covers at least a part of the chip, the antenna and the substrate, and the area of the protective layer is larger than the area of the groove. The method for manufacturing an antenna device according to claim 12, wherein the substrate preparation step further includes: Corresponding to the predetermined formation area of the wafer, an adhesive layer is formed on the substrate. The method of manufacturing an antenna device according to claim 15, wherein the area of the adhesive layer is larger than the area of the chip, In the wafer placement step, the wafer is buried in a part of the adhesive layer, so that the thickness of the adhesive layer between the substrate and the wafer is smaller than that of the adhesive layer at the periphery of the wafer thickness of. The method for manufacturing an antenna device according to claim 12, wherein after the substrate preparation step, the method further includes: The printing layer forming step is to form a printing layer with openings on the substrate, In the wafer placement step, the wafer is placed in the opening, and the surface of the printed layer and the active surface of the wafer are substantially coplanar. The method for manufacturing an antenna device according to claim 12, wherein the substrate preparation step further includes: In the groove forming step, a groove is formed in the substrate adjacent to the short side of the predetermined formation area of the wafer, and the groove is separated from the predetermined formation area by a distance. The method for manufacturing an antenna device according to claim 18, wherein the length of the groove is greater than or equal to the width of the wafer. The method of manufacturing an antenna device according to claim 12, wherein the at least two pads include a first pad and a second pad, The first pad is located on one short side of the chip, and the second pad is located on the other short side of the chip, The first bonding wire segment and the second bonding wire segment of the antenna completely cover the first pad and the second pad, respectively.

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