[go: up one dir, main page]

TW202041635A - Adhesive composition for heat-resistant adhesive sheet, and heat-resistant adhesive sheet - Google Patents

Adhesive composition for heat-resistant adhesive sheet, and heat-resistant adhesive sheet Download PDF

Info

Publication number
TW202041635A
TW202041635A TW109108868A TW109108868A TW202041635A TW 202041635 A TW202041635 A TW 202041635A TW 109108868 A TW109108868 A TW 109108868A TW 109108868 A TW109108868 A TW 109108868A TW 202041635 A TW202041635 A TW 202041635A
Authority
TW
Taiwan
Prior art keywords
meth
acrylic copolymer
heat
acrylate
adhesive composition
Prior art date
Application number
TW109108868A
Other languages
Chinese (zh)
Other versions
TWI829891B (en
Inventor
神崎天心
狩野肇
鴨井彬
Original Assignee
日商日本電石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本電石工業股份有限公司 filed Critical 日商日本電石工業股份有限公司
Publication of TW202041635A publication Critical patent/TW202041635A/en
Application granted granted Critical
Publication of TWI829891B publication Critical patent/TWI829891B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/005Presence of polyester in the release coating
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00Presence of polyamine or polyimide
    • C09J2479/08Presence of polyamine or polyimide polyimide
    • C09J2479/086Presence of polyamine or polyimide polyimide in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

Provided are an adhesive composition for a heat-resistant adhesive sheet, and a heat-resistant adhesive sheet using the same, the adhesive composition comprising a (meth)acrylic copolymer and a cross-linking agent, the (meth)acrylic copolymer comprising: a structural unit derived from N-methylolacrylamide; a structural unit derived from a hydroxy alkyl methacrylate; and a structural unit derived from an alkyl (meth)acrylate, and a mole ratio of a functional group included in the cross-linking agent with respect to a cross-linking functional group included in the (meth)acrylic copolymer being from 0.1 to 1.0.

Description

耐熱性黏著片用黏著劑組成物、以及耐熱性黏著片Adhesive composition for heat-resistant adhesive sheet, and heat-resistant adhesive sheet

本發明係關於耐熱性黏著片用黏著劑組成物、及耐熱性黏著片。The present invention relates to an adhesive composition for a heat-resistant adhesive sheet and a heat-resistant adhesive sheet.

在柔性印刷基板(FPC:Flexible Printed Circuit)為代表之電子構件之製造時之熱處理步驟中,就FPC之固定及保護零件之目的,而使用耐熱性黏著片。於具備耐熱性黏著片之黏著劑層,要求抑制在熱處理後進行剝離時之黏著力的過度上升,與抑制被黏著體之污染以及抑制劣化。 此外,就被黏著體而言,廣泛地使用銅箔、聚醯亞胺等。In the heat treatment step during the manufacture of electronic components represented by flexible printed circuit boards (FPC: Flexible Printed Circuit), heat-resistant adhesive sheets are used for the purpose of fixing FPC and protecting parts. For the adhesive layer with the heat-resistant adhesive sheet, it is required to suppress the excessive increase in the adhesive force when peeling off after the heat treatment, and to suppress the contamination of the adherend and to suppress the deterioration. In addition, copper foil, polyimide, etc. are widely used for adherends.

就以往之耐熱性黏著片而言,可舉例如日本特開2013-032504號公報中記載者。 於日本特開2013-032504號公報中,揭示一種黏著劑,包含使含氮單體共聚之特定Tg範圍之丙烯酸系樹脂作為主要組成物。根據日本特開2013-032504號公報,其在170℃以上之加熱步驟中仍保護被黏著體表面,且可從被黏著體表面剝離。 此外,日本特開2013-032504號公報之實施例之評價,係以使用了SUS板,並以180℃、5小時之條件而得。Examples of conventional heat-resistant adhesive sheets include those described in JP 2013-032504 A. In Japanese Patent Laid-Open No. 2013-032504, an adhesive is disclosed that includes an acrylic resin with a specific Tg range in which nitrogen-containing monomers are copolymerized as a main component. According to Japanese Patent Laid-Open No. 2013-032504, it still protects the surface of the adherend during the heating step above 170° C., and can be peeled off from the surface of the adherend. In addition, the evaluation of the examples in Japanese Patent Application Laid-Open No. 2013-032504 was obtained under conditions of 180°C for 5 hours using a SUS plate.

[發明所欲解決之課題][The problem to be solved by the invention]

近年,於耐熱性黏著片中,例如要求即使在如200℃般之比以往更高溫條件下之熱處理後,黏著力仍不會上升之性能。 此外,一般而言,耐熱性黏著片之被黏著體,係例如為聚醯亞胺之情況,將耐熱性黏著片剝離時,容易有黏著劑殘留於被黏著體,亦即,容易產生被黏著體之污染。此外,在被黏著體為銅箔時,容易產生被黏著體之氧化,亦即,容易產生被黏著體的劣化。In recent years, in heat-resistant adhesive sheets, for example, even after heat treatment at a higher temperature than before, such as 200°C, the performance that the adhesive force does not increase is required. In addition, in general, the adherend of the heat-resistant adhesive sheet is, for example, polyimide. When the heat-resistant adhesive sheet is peeled off, the adhesive is likely to remain on the adherend, that is, it is easy to be adhered Body pollution. In addition, when the adherend is copper foil, oxidation of the adherend is likely to occur, that is, degradation of the adherend is likely to occur.

日本特開2013-032504號公報中記載之黏著劑,因為凝聚力小,故於200℃之高溫條件下容易產生黏著劑層之浮起、剝落等,此外,在被黏著體為銅箔之情況,會產生被黏著體氧化的問題。The adhesive described in Japanese Patent Laid-Open No. 2013-032504 has a low cohesive force, so it is easy to cause the adhesive layer to float and peel off at a high temperature of 200°C. In addition, when the adherend is copper foil, There will be a problem of oxidation by the adherend.

本發明之一實施形態欲解決之課題係提供一種耐熱性黏著片用黏著劑組成物,例如即使在以200℃以上之高溫條件下經熱處理後,就抑制從被黏著體剝離黏著劑層時之被黏著體之污染、及抑制被黏著體之氧化為優良。 此外,本發明之其他實施形態欲解決之課題係提供使用了耐熱性黏著片用黏著劑組成物之耐熱性黏著片。 [解決課題之手段]The problem to be solved by one embodiment of the present invention is to provide an adhesive composition for a heat-resistant adhesive sheet. For example, even after heat treatment at a high temperature of 200° C. or more, it prevents the adhesive layer from being peeled off from the adherend. Contamination of adherends and suppression of oxidation of adherends are excellent. In addition, the problem to be solved by other embodiments of the present invention is to provide a heat-resistant adhesive sheet using an adhesive composition for a heat-resistant adhesive sheet. [Means to solve the problem]

就用以解決上述課題之手段而言,包含以下態樣。 >1>一種耐熱性黏著片用黏著劑組成物,含有: (甲基)丙烯酸系共聚物,該(甲基)丙烯酸系共聚物含有來自N-羥甲基丙烯醯胺之構成單元、來自甲基丙烯酸羥基烷基酯之構成單元、以及來自(甲基)丙烯酸烷基酯之構成單元,及 交聯劑; 該交聯劑之官能基之莫耳數相對於該(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數的比為0.1以上且1.0以下。 >2>如>1>之耐熱性黏著片用黏著劑組成物,其中,該(甲基)丙烯酸系共聚物之玻璃轉移溫度為未達-40℃。 >3>如>1>或>2>之耐熱性黏著片用黏著劑組成物,在該(甲基)丙烯酸系共聚物中,該來自N-羥甲基丙烯醯胺之構成單元的含量相對於該來自甲基丙烯酸羥基烷基酯之構成單元之含量的質量比為0.25以上且5.0以下。 >4>如>1>~>3>中任一項之耐熱性黏著片用黏著劑組成物,該交聯劑之官能基之莫耳數相對於該(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數的比為0.2以上且1.0以下。 >5>一種耐熱性黏著片,具備黏著劑層,該黏著劑層為如>1>~>4>中任一項之耐熱性黏著片用黏著劑組成物之交聯物。 [發明之效果]The means for solving the above-mentioned problems include the following aspects. >1>An adhesive composition for heat-resistant adhesive sheets, containing: (Meth)acrylic copolymer containing a structural unit derived from N-methylol acrylamide, a structural unit derived from hydroxyalkyl methacrylate, and a (meth)acrylic copolymer The constituent units of alkyl acrylate, and Crosslinking agent The ratio of the number of moles of the functional groups of the crosslinking agent to the total number of moles of the crosslinkable functional groups possessed by the (meth)acrylic copolymer is 0.1 or more and 1.0 or less. >2> The adhesive composition for heat-resistant adhesive sheets as in >1>, wherein the glass transition temperature of the (meth)acrylic copolymer is less than -40°C. >3> The adhesive composition for heat-resistant adhesive sheets such as >1> or >2>, in the (meth)acrylic copolymer, the content of the constituent units derived from N-methylolacrylamide is relatively The mass ratio to the content of the structural unit derived from the hydroxyalkyl methacrylate is 0.25 or more and 5.0 or less. >4>For the heat-resistant adhesive sheet adhesive composition of any one of >1>~>3>, the number of moles of the functional group of the crosslinking agent is relative to that of the (meth)acrylic copolymer The ratio of the total mole numbers of the crosslinkable functional groups is 0.2 or more and 1.0 or less. >5> A heat-resistant adhesive sheet, comprising an adhesive layer, and the adhesive layer is a cross-linked product of the adhesive composition for a heat-resistant adhesive sheet as described in any one of >1> to >4>. [Effects of Invention]

根據本發明之一實施形態,可提供一種耐熱性黏著片用黏著劑組成物,例如即使在200℃以上之高溫條件下經熱處理後,就抑制從被黏著體剝離黏著劑層時之被黏著體之污染、及抑制被黏著體之氧化為優良。 此外,根據本發明之其他實施形態,可提供一種耐熱性黏著片,使用了耐熱性黏著片用黏著劑組成物。According to an embodiment of the present invention, an adhesive composition for a heat-resistant adhesive sheet can be provided. For example, even after heat treatment at a high temperature of 200° C. or higher, the adherend when the adhesive layer is peeled from the adherend is suppressed The pollution and the inhibition of the oxidation of the adherend are excellent. In addition, according to another embodiment of the present invention, there can be provided a heat-resistant adhesive sheet using an adhesive composition for a heat-resistant adhesive sheet.

以下針對本發明之內容詳細地進行說明。以下記載之構成要件之說明,係基於本發明之具代表性之實施態様,但本發明並非限定為如此之實施態様。 本說明書中使用「~」表示之數值範圍,係表示包含「~」之前後所記載之數值各別作為最小值及最大值的範圍。 此外,在本說明書中之組成物中之各成分之量,在組成物中併用數種對應於各成分之物質時,若無特別指明,則表示對應於該成分之數種物質的合計量的含意。The content of the present invention will be described in detail below. The description of the constituent elements described below is based on a representative embodiment of the present invention, but the present invention is not limited to such an embodiment. The numerical range indicated by "~" in this manual refers to the range that includes the numerical values described before and after "~" as the minimum and maximum values. In addition, the amount of each component in the composition in this specification, when several substances corresponding to each component are used in the composition, unless otherwise specified, it means the total amount of several substances corresponding to the component meaning.

此外,本說明書中之「步驟」的用語,並非僅指獨立之步驟,即使為無法與其他步驟明確地區分的情況,只要是達成該步驟之預期的目的,則包含於本用語中。 此外,在本發明中,「質量%」與「重量%」係相同含意,「質量份」與「重量份」係相同含意。 另外,本發明中,2種以上之理想態樣之組合係更佳之態樣。In addition, the term "step" in this manual does not only refer to an independent step. Even if it cannot be clearly distinguished from other steps, as long as it achieves the intended purpose of the step, it is included in this term. In addition, in the present invention, "mass %" and "weight %" have the same meaning, and "mass part" and "weight part" have the same meaning. In addition, in the present invention, a combination of two or more ideal aspects is a more preferable aspect.

(甲基)丙烯酸係指丙烯酸及甲基丙烯酸中之至少一者的含意,(甲基)丙烯酸酯係指丙烯酸酯及甲基丙烯酸酯中之至少一者的含意。 本說明書中之(甲基)丙烯酸系共聚物係指,構成其之單體之中,為主成分之單體至少係由具有(甲基)丙烯醯基之單體進行聚合所形成之聚合物的含意。 (甲基)丙烯酸系共聚物中之主成分係指,形成聚合物之單體成分之中含有率(所謂的含有比率;以下亦同。)(質量%)最多之含意,例如為(甲基)丙烯酸系共聚物時,係指由具有(甲基)丙烯醯基之單體所形成之構成單元之含有率為全部構成單元之50質量%以上之單體的含意。 黏著劑層係(甲基)丙烯酸系共聚物與交聯劑經實質地交聯後的層,例如指固體狀或凝膠狀之層的含意。(Meth)acrylic acid means at least one of acrylic acid and methacrylic acid, and (meth)acrylate means at least one of acrylate and methacrylate. The (meth)acrylic copolymer in this specification refers to a polymer formed by polymerizing at least monomers having a (meth)acrylic acid group as the main component of the monomers constituting it The meaning of. The main component in the (meth)acrylic copolymer refers to the content rate (the so-called content rate; the same below.) (mass%) of the monomer components forming the polymer means the most, such as (methyl ) In the case of an acrylic copolymer, it means that the content of the structural unit formed from the monomer having a (meth)acrylic acid group is 50% by mass or more of all the structural units. The adhesive layer is a layer obtained by substantially crosslinking a (meth)acrylic copolymer and a crosslinking agent, for example, it means a solid or gel layer.

(耐熱性黏著片用黏著劑組成物) 本發明之耐熱性黏著片用黏著劑組成物(以下,有時簡稱為「黏著劑組成物」)係含有: (甲基)丙烯酸系共聚物(以下,有時稱為「特定(甲基)丙烯酸系共聚物」。),該(甲基)丙烯酸系共聚物含有來自N-羥甲基丙烯醯胺之構成單元、來自甲基丙烯酸羥基烷基酯之構成單元、以及來自(甲基)丙烯酸烷基酯之構成單元,及 交聯劑; 該交聯劑之官能基之莫耳數相對於該(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數的比為0.1以上且1.0以下。 本案發明者們深入研究之結果,發現:本發明之黏著劑組成物藉由具有上述構成,可提供一種黏著劑層,例如即使在200℃以上之高溫條件下經熱處理後,就抑制從被黏著體剝離黏著劑層時之被黏著體之污染、及抑制被黏著體之氧化為優良。獲得上述效果之詳細的機制雖尚未明瞭,據推測如以下所述。 此外,本說明書中,抑制被黏著體之污染為優良係指耐污染性優良。此外,本說明書中,抑制被黏著體之氧化為優良係指耐氧化性優良。(Adhesive composition for heat-resistant adhesive sheets) The adhesive composition for a heat-resistant adhesive sheet of the present invention (hereinafter sometimes referred to as "adhesive composition") contains: (Meth)acrylic copolymer (hereinafter, sometimes referred to as "specific (meth)acrylic copolymer".) This (meth)acrylic copolymer contains a structure derived from N-methylolacrylamide Unit, structural unit derived from hydroxyalkyl methacrylate, and structural unit derived from alkyl (meth)acrylate, and Crosslinking agent The ratio of the number of moles of the functional groups of the crosslinking agent to the total number of moles of the crosslinkable functional groups possessed by the (meth)acrylic copolymer is 0.1 or more and 1.0 or less. As a result of intensive research, the inventors of the present invention have found that the adhesive composition of the present invention can provide an adhesive layer by having the above-mentioned constitution. For example, even after heat treatment at a high temperature of 200°C or higher, the adhesive composition is prevented from being adhered. The contamination of the adherend when the adhesive layer is peeled off and the suppression of oxidation of the adherend are excellent. Although the detailed mechanism for obtaining the above effects is not yet clear, it is presumed to be as follows. In addition, in this specification, the suppression of contamination of the adherend is excellent means that the contamination resistance is excellent. In addition, in this specification, the suppression of the oxidation of the adherend is excellent means that the oxidation resistance is excellent.

本發明之黏著劑組成物含有:特定(甲基)丙烯酸系共聚物,該特定(甲基)丙烯酸系共聚物含有來自N-羥甲基丙烯醯胺之構成單元。 N-羥甲基丙烯醯胺因為在高溫條件下會進行自交聯,故含有來自N-羥甲基丙烯醯胺之構成單元之本發明之黏著劑組成物,例如即使在約200℃之高溫條件下,仍可維持適當高的凝聚力。因此,將本發明之黏著劑組成物使用於耐熱性黏著片之黏著劑層時,被黏著體例如即使為銅箔,被黏著體與黏著劑層之密接良好,可抑制因為黏著劑層之浮起、剝離所致之被黏著體的氧化。 此外,含有來自N-羥甲基丙烯醯胺之構成單元之本發明的黏著劑組成物,因為即使在高溫條件下仍可自交聯,可維持適當高的凝聚力。因此,將本發明之黏著劑組成物使用於耐熱性黏著片之黏著劑層時,被黏著體例如即使為聚醯亞胺,仍可抑制在將黏著劑層從被黏著體剝離時之被黏著體上之黏著劑層的殘留(被黏著體之污染)。 此外,本發明之黏著劑組成物含有:特定(甲基)丙烯酸系共聚物,該特定(甲基)丙烯酸系共聚物含有來自甲基丙烯酸羥基烷基酯之構成單元。上述來自甲基丙烯酸羥基烷基酯之構成單元有在高溫條件下一部分之構成單元會分解(解聚),使凝聚力適當地降低的傾向。因此推測例如可抑制於約200℃之高溫條件下之在熱處理後之黏著力上升。 在本發明之黏著劑組成物中,據推測特定(甲基)丙烯酸系共聚物所含有之來自N-羥甲基丙烯醯胺之構成單元與來自甲基丙烯酸羥基烷基酯之構成單元係發揮互補之功能,即使在高溫條件下之熱處理後,凝聚力也不會過度地上升或過度地下降,故在將本發明之黏著劑組成物使用於耐熱性黏著片之黏著劑層時,可抑制熱處理後之黏著劑層之黏著力上升,且就抑制被黏著體之污染及抑制劣化為優良。 詳細之機制雖未明瞭,更詳細而言,來自甲基丙烯酸羥基烷基酯之構成單元在熱處理時一部分之構成單元的分解,與例如在200℃以上之環境下之N-羥甲基丙烯醯胺之自交聯反應所導致之凝聚力的上升相互影響而使凝聚力成為適當的範圍。此外,本發明之黏著劑組成物因為含有特定(甲基)丙烯酸系共聚物,且該特定(甲基)丙烯酸系共聚物含有來自會進行自交聯之N-羥甲基丙烯醯胺之構成單元,故對於推測是因為來自甲基丙烯酸羥基烷基酯之構成單元之一部分分解(解聚)所發生之被黏著體之污染的抑制為優良。 此外,本發明之黏著劑組成物中,交聯劑之官能基的含量相對於特定(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數,其莫耳比為0.1以上且1.2以下,故在黏著劑組成物中會適當地進行交聯,可適當地獲得凝聚力,而可獲得適當之耐熱性黏著片用之黏著劑組成物。 以下,針對本發明之黏著劑組成物所含有之各構成要件之詳細內容進行說明。The adhesive composition of the present invention contains a specific (meth)acrylic copolymer, and the specific (meth)acrylic copolymer contains a structural unit derived from N-methylol acrylamide. Since N-methylol acrylamide is self-crosslinking under high temperature conditions, the adhesive composition of the present invention containing constituent units derived from N-methylol acrylamide, for example, even at a high temperature of about 200°C Under these conditions, a reasonably high cohesion can be maintained. Therefore, when the adhesive composition of the present invention is used in the adhesive layer of a heat-resistant adhesive sheet, even if the adherend is a copper foil, the adherend and the adhesive layer are in good adhesion, and the floating of the adhesive layer can be suppressed. Oxidation of the adherend caused by peeling and peeling. In addition, the adhesive composition of the present invention containing structural units derived from N-methylol acrylamide can self-crosslink even under high temperature conditions and can maintain a suitably high cohesive force. Therefore, when the adhesive composition of the present invention is used for the adhesive layer of a heat-resistant adhesive sheet, even if the adherend is polyimide, it can be prevented from being adhered when the adhesive layer is peeled from the adherend. The residue of the adhesive layer on the body (contamination by the adhesive body). In addition, the adhesive composition of the present invention contains a specific (meth)acrylic copolymer, and the specific (meth)acrylic copolymer contains a structural unit derived from a hydroxyalkyl methacrylate. The above-mentioned structural unit derived from hydroxyalkyl methacrylate has a tendency that a part of the structural unit decomposes (depolymerizes) under high temperature conditions, and the cohesive force is appropriately lowered. Therefore, it is presumed that, for example, it is possible to suppress the increase in adhesion after heat treatment under high temperature conditions of about 200°C. In the adhesive composition of the present invention, it is presumed that the structural unit derived from N-methylol acrylamide and the structural unit derived from hydroxyalkyl methacrylate contained in the specific (meth)acrylic copolymer function Complementary functions, even after heat treatment under high temperature conditions, the cohesive force will not increase or decrease excessively. Therefore, when the adhesive composition of the present invention is used in the adhesive layer of a heat-resistant adhesive sheet, the heat treatment can be suppressed The adhesive force of the subsequent adhesive layer increases, and it is excellent to suppress the contamination of the adherend and to suppress the deterioration. Although the detailed mechanism is not clear, in more detail, the decomposition of a part of the structural unit derived from the hydroxyalkyl methacrylate during heat treatment is different from that of N-methylolacrylic acid at an environment above 200°C. The increase in cohesive force caused by the self-crosslinking reaction of amine affects each other to make cohesive force into an appropriate range. In addition, the adhesive composition of the present invention contains a specific (meth)acrylic copolymer, and the specific (meth)acrylic copolymer contains a composition derived from self-crosslinking N-methylolacrylamide Unit, it is excellent for the suppression of the contamination of the adherend which is presumed to be due to the partial decomposition (depolymerization) of one of the structural units derived from the hydroxyalkyl methacrylate. In addition, in the adhesive composition of the present invention, the content of the functional group of the crosslinking agent relative to the total moles of the crosslinkable functional groups possessed by the specific (meth)acrylic copolymer has a molar ratio of 0.1 or more And 1.2 or less, the adhesive composition will be appropriately cross-linked, the cohesive force can be appropriately obtained, and an appropriate adhesive composition for a heat-resistant adhesive sheet can be obtained. Hereinafter, the detailed content of each component contained in the adhesive composition of the present invention will be described.

此外,本說明書中,高溫條件係指至少在大氣壓下200℃以上之溫度條件的含意。In addition, in this specification, high temperature conditions mean the meaning of temperature conditions of at least 200°C or more under atmospheric pressure.

>特定(甲基)丙烯酸系共聚物> 本發明之黏著劑組成物係含有:(甲基)丙烯酸系共聚物(特定(甲基)丙烯酸系共聚物),該(甲基)丙烯酸系共聚物含有來自N-羥甲基丙烯醯胺之構成單元、來自甲基丙烯酸羥基烷基酯之構成單元、及來自(甲基)丙烯酸烷基酯之構成單元。>Specific (meth)acrylic copolymers> The adhesive composition of the present invention contains: (meth)acrylic copolymer (specific (meth)acrylic copolymer), and the (meth)acrylic copolymer contains N-methylolacrylamide The structural unit, the structural unit derived from the hydroxyalkyl methacrylate, and the structural unit derived from the alkyl (meth)acrylate.

>>來自N-羥甲基丙烯醯胺之構成單元>> 特定(甲基)丙烯酸系共聚物含有來自N-羥甲基丙烯醯胺之構成單元。 N-羥甲基丙烯醯胺可使用市售品,亦可使用藉由合成而得者。>>The constituent unit from N-hydroxymethyl acrylamide >> The specific (meth)acrylic copolymer contains a structural unit derived from N-methylol acrylamide. Commercial products can be used for N-methylol acrylamide, or those obtained by synthesis can also be used.

就來自N-羥甲基丙烯醯胺之構成單元之含量而言,考慮耐污染性及耐氧化性之觀點,相對於構成特定(甲基)丙烯酸系共聚物之全部構成單元,宜為0.1質量%~20質量%,更宜為1.0質量%~15質量%,進一步宜為1.5質量%~11質量%,尤其宜為2.0質量%~9.0質量%。Regarding the content of the constituent units derived from N-methylol acrylamide, considering contamination resistance and oxidation resistance, it is preferably 0.1 mass relative to all constituent units constituting the specific (meth)acrylic copolymer % To 20% by mass, more preferably 1.0% to 15% by mass, further preferably 1.5% to 11% by mass, particularly preferably 2.0% to 9.0% by mass.

>>來自甲基丙烯酸羥基烷基酯之構成單元>> 特定(甲基)丙烯酸系共聚物係含有來自甲基丙烯酸羥基烷基酯之構成單元。 來自甲基丙烯酸羥基烷基酯之構成單元因為有在高溫條件下一部分之構成單元會分解(解聚),使於黏著劑層之凝聚力適度地降低的傾向,故推測可抑制在高溫條件下之熱處理後之黏著力的上升,可更抑制被黏著體之污染及劣化。 此外,來自甲基丙烯酸羥基烷基酯之構成單元之一部分的構成單元分解(解聚)所致之凝聚力降低的傾向,係比丙烯酸羥基烷基酯更大。 來自甲基丙烯酸羥基烷基酯之構成單元可含有單獨1種,亦可含有2種以上。>>Constituted unit from hydroxyalkyl methacrylate>> The specific (meth)acrylic copolymer contains structural units derived from hydroxyalkyl methacrylate. Since the structural unit derived from hydroxyalkyl methacrylate has a tendency to decompose (depolymerize) under high temperature conditions, the cohesive force of the adhesive layer is moderately lowered, so it is estimated that it can be suppressed under high temperature conditions. The increase in adhesive force after heat treatment can further inhibit the contamination and deterioration of the adherend. In addition, the tendency of the cohesive force to decrease due to decomposition (depolymerization) of a part of the structural unit derived from the hydroxyalkyl methacrylate is greater than that of the hydroxyalkyl acrylate. The structural unit derived from hydroxyalkyl methacrylate may be contained individually by 1 type, and may contain 2 or more types.

就形成來自甲基丙烯酸羥基烷基酯之構成單元的甲基丙烯酸羥基烷基酯單體而言,可舉例如1分子中至少含有1個羥基及甲基丙烯醯氧基之單體。Examples of the hydroxyalkyl methacrylate monomer forming the structural unit derived from the hydroxyalkyl methacrylate include monomers containing at least one hydroxyl group and methacryloxy group in one molecule.

就甲基丙烯酸羥基烷基酯單體而言,可舉例如甲基丙烯酸-2-羥基乙酯、甲基丙烯酸-2-羥基丙酯、甲基丙烯酸-3-羥基丙酯、甲基丙烯酸-4-羥基丁酯、甲基丙烯酸-6-羥基己酯、甲基丙烯酸10-羥基癸酯、甲基丙烯酸12-羥基月桂酯、甲基丙烯酸-3-甲基-3-羥基丁酯、甲基丙烯酸-1,1-二甲基-3-羥基丁酯、甲基丙烯酸-1,3-二甲基-3-羥基丁酯、甲基丙烯酸-2,2,4-三甲基-3-羥基戊酯、甲基丙烯酸-2-乙基-3-羥基己酯等。The hydroxyalkyl methacrylate monomers include, for example, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, and methacrylic acid- 4-hydroxybutyl ester, 6-hydroxyhexyl methacrylate, 10-hydroxydecyl methacrylate, 12-hydroxylauryl methacrylate, 3-methyl-3-hydroxybutyl methacrylate, methyl methacrylate 1,1-dimethyl-3-hydroxybutyl methacrylate, 1,3-dimethyl-3-hydroxybutyl methacrylate, 2,2,4-trimethyl-3 methacrylate -Hydroxypentyl ester, 2-ethyl-3-hydroxyhexyl methacrylate, etc.

考慮耐污染性及耐氧化性之觀點,就甲基丙烯酸羥基烷基酯而言,更宜為碳數1~10之甲基丙烯酸羥基烷基酯,進一步宜為具有碳數2~8之羥基烷基之甲基丙烯酸羥基烷基酯。Considering the viewpoints of stain resistance and oxidation resistance, for hydroxyalkyl methacrylate, it is more preferably a hydroxyalkyl methacrylate having 1 to 10 carbon atoms, and more preferably a hydroxyl group having 2 to 8 carbon atoms Alkyl is a hydroxyalkyl methacrylate.

就來自甲基丙烯酸羥基烷基酯之構成單元之含量而言,相對於特定(甲基)丙烯酸系共聚物之全部構成單元,宜為0.1質量%~10質量%,更宜為0.5質量%~8質量%,進一步宜為1.5質量%~6質量%,尤其宜為2.5質量%~5質量%。The content of the structural unit derived from the hydroxyalkyl methacrylate is preferably 0.1% by mass to 10% by mass, and more preferably 0.5% by mass to all the structural units of the specific (meth)acrylic copolymer. 8% by mass, more preferably 1.5% by mass to 6% by mass, and particularly preferably 2.5% by mass to 5% by mass.

>>來自(甲基)丙烯酸烷基酯之構成單元>> 特定(甲基)丙烯酸系共聚物係含有來自(甲基)丙烯酸烷基酯之構成單元。 特定(甲基)丙烯酸系共聚物藉由含有來自(甲基)丙烯酸烷基酯之構成單元,就由本發明之黏著劑組成物所形成之黏著劑層而言,可賦予其在初始及熱處理後皆為優良的黏著力。 特定(甲基)丙烯酸系共聚物,可含有單獨1種之來自烷基(甲基)丙烯酸酯之構成單元,亦可含有2種以上。>>Constituted units from alkyl (meth)acrylates>> The specific (meth)acrylic copolymer contains a structural unit derived from an alkyl (meth)acrylate. The specific (meth)acrylic copolymer contains the structural unit derived from the alkyl (meth)acrylate, as far as the adhesive layer formed by the adhesive composition of the present invention is concerned, it can be given the initial and after heat treatment Both are excellent adhesion. The specific (meth)acrylic copolymer may contain a single type of structural unit derived from an alkyl (meth)acrylate, or may contain two or more types.

形成來自(甲基)丙烯酸烷基酯之構成單元之(甲基)丙烯酸烷基酯單體係沒有特別之限制,例如可為經取代或未取代之(甲基)丙烯酸烷基酯,考慮容易與上述甲基丙烯酸羥基烷基酯單體及N-羥甲基丙烯醯胺進行加成聚合之觀點,宜為經取代或未取代之丙烯酸烷基酯。 就(甲基)丙烯酸烷基酯中之烷基而言,沒有特別之限制,可為直鏈狀、分支狀或環狀中之任一者。 此外,考慮黏著劑層之對於被黏著體之黏著力及與基材之密接性之觀點,上述烷基之碳數宜為1~18,更宜為1~12。The single alkyl (meth)acrylate system that forms the structural unit derived from the alkyl (meth)acrylate is not particularly limited. For example, it may be a substituted or unsubstituted alkyl (meth)acrylate, which is easy to consider From the viewpoint of addition polymerization with the above-mentioned hydroxyalkyl methacrylate monomer and N-methylol acrylamide, a substituted or unsubstituted alkyl acrylate is preferable. The alkyl group in the alkyl (meth)acrylate is not particularly limited, and it may be any of linear, branched, or cyclic. In addition, considering the adhesion of the adhesive layer to the adherend and the adhesion to the substrate, the carbon number of the above-mentioned alkyl group is preferably 1-18, more preferably 1-12.

就(甲基)丙烯酸烷基酯而言,沒有特別之制限,可舉例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸正十二烷酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異莰酯等。As far as the alkyl (meth)acrylate is concerned, there are no special restrictions, such as methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, (meth)acrylic acid Isobutyl ester, second butyl (meth)acrylate, third butyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, (meth)acrylic acid-2- Ethylhexyl, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, n-dodecyl (meth)acrylate, stearyl (meth)acrylate Esters, lauryl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, etc.

此等之中,考慮黏著力之觀點,就(甲基)丙烯酸烷基酯而言,宜為丙烯酸烷基酯,更宜為選自於由丙烯酸甲酯(MA)、丙烯酸第三丁酯(t-BA)、及丙烯酸正丁酯(n-BA)構成之群組中之至少1種之單體,進一步宜為丙烯酸正丁酯(n-BA)。Among these, considering the viewpoint of adhesion, as far as the alkyl (meth)acrylate is concerned, it is preferably an alkyl acrylate, and more preferably selected from methyl acrylate (MA) and tertiary butyl acrylate ( t-BA) and at least one monomer from the group consisting of n-butyl acrylate (n-BA), and more preferably n-butyl acrylate (n-BA).

就特定(甲基)丙烯酸系共聚物中之來自(甲基)丙烯酸烷基酯之構成單元的含量而言,考慮黏著力之觀點,相對於特定(甲基)丙烯酸系共聚物之全部構成單元,宜為50質量%以上且99.95質量%以下,更宜為60質量%以上且99.95質量%以下,進一步宜為70質量%以上且99.95質量%以下,尤其宜為80質量%以上且99.95質量%以下。Regarding the content of the structural unit derived from the alkyl (meth)acrylate in the specific (meth)acrylic copolymer, considering the adhesive force, relative to all the structural units of the specific (meth)acrylic copolymer , Preferably 50% by mass or more and 99.95% by mass, more preferably 60% by mass or more and 99.95% by mass, further preferably 70% by mass or more and 99.95% by mass, especially preferably 80% by mass or more and 99.95% by mass the following.

-來自N-羥甲基丙烯醯胺之構成單元相對於來自甲基丙烯酸羥基烷基酯之構成單元的質量比- 來自N-羥甲基丙烯醯胺之構成單元之含量相對於來自甲基丙烯酸羥基烷基酯之構成單元之含量的質量比,考慮耐污染性及耐氧化性之觀點,宜為0.1以上且5.0以下,更宜為0.25以上且5.0以下,進一步宜為0.3以上且4.0以下,尤其宜為0.5以上且3.5以下。-The mass ratio of the structural unit derived from N-methylol acrylamide to the structural unit derived from hydroxyalkyl methacrylate- The mass ratio of the content of the constituent units derived from N-methylol acrylamide to the content of the constituent units derived from hydroxyalkyl methacrylate, considering contamination resistance and oxidation resistance, is preferably 0.1 or more and 5.0 Hereinafter, it is more preferably 0.25 or more and 5.0 or less, further preferably 0.3 or more and 4.0 or less, and particularly preferably 0.5 or more and 3.5 or less.

>>其他構成單元>> 特定(甲基)丙烯酸系共聚物在發揮本發明之效果的範圍內,亦可含有來自上述N-羥甲基丙烯醯胺之構成單元、來自甲基丙烯酸羥基烷基酯之構成單元、及來自(甲基)丙烯酸烷基酯之構成單元以外的構成單元(以下也稱為「其他構成單元」。)。 構成其他構成單元之單體只要是可與上述N-羥甲基丙烯醯胺、甲基丙烯酸羥基烷基酯單體及(甲基)丙烯酸烷基酯進行共聚合者便沒有特別之限制,可因應目的適當地選擇。>>Other components>> The specific (meth)acrylic copolymer may contain structural units derived from the above-mentioned N-methylol acrylamide, structural units derived from hydroxyalkyl methacrylate, and structural units derived from Structural units other than the structural units of the alkyl (meth)acrylate (hereinafter also referred to as "other structural units"). The monomers constituting other structural units are not particularly limited as long as they can be copolymerized with the above-mentioned N-methylol acrylamide, hydroxyalkyl methacrylate monomer and alkyl (meth)acrylate. Choose appropriately according to the purpose.

就構成其他構成單元之單體而言,可列舉具有羧基、氧化伸烷基、環氧丙基、醯胺基、N-取代醯胺基、三級胺基、羥基(惟,不對應於N-羥甲基丙烯醯胺、及甲基丙烯酸羥基烷基酯具有之羥基。)等官能基之單體,或多官能(甲基)丙烯酸系單體、芳香族單乙烯系單體、氰化乙烯系單體、具有芳香族環之(甲基)丙烯酸系單體。With regard to monomers constituting other structural units, examples include carboxyl groups, alkylene oxide groups, glycidyl groups, amide groups, N-substituted amide groups, tertiary amine groups, and hydroxyl groups (but not corresponding to N -Hydroxymethyl acrylamide and hydroxyalkyl methacrylate and other functional group monomers, or multifunctional (meth)acrylic monomers, aromatic monovinyl monomers, cyanide Vinyl monomers, (meth)acrylic monomers having aromatic rings.

就具有羧基之單體而言,可舉例如丙烯酸(AA)、甲基丙烯酸、巴豆酸、馬來酸酐、富馬酸、伊康酸、戊烯二酸、檸康酸、ω-羧基-聚己內酯單(甲基)丙烯酸酯(例如ω-羧基-聚己內酯(n≒2)單丙烯酸酯)、琥珀酸酯(例如琥珀酸-2-丙烯醯基氧基乙酯)、甲酸乙烯酯、乙酸乙烯酯、丙酸乙烯酯、新癸酸乙烯酯等。For monomers having a carboxyl group, for example, acrylic acid (AA), methacrylic acid, crotonic acid, maleic anhydride, fumaric acid, itaconic acid, glutaconic acid, citraconic acid, ω-carboxy-poly Caprolactone mono(meth)acrylate (e.g. ω-carboxy-polycaprolactone (n≒2) monoacrylate), succinate (e.g. succinic acid-2-propenyloxyethyl), formic acid Vinyl ester, vinyl acetate, vinyl propionate, vinyl neodecanoate, etc.

就具有氧化伸烷基之單體而言,可舉例如(甲基)丙烯酸甲氧基乙酯、丙烯酸-2-(乙氧基乙氧基)乙酯、聚乙二醇(甲基)丙烯酸酯、聚乙二醇(甲基)丙烯酸甲氧酯、聚丙二醇(甲基)丙烯酸甲氧酯、聚丙二醇(甲基)丙烯酸酯及甲氧基聚乙二醇(甲基)丙烯酸酯。As for the monomer having an oxyalkylene group, for example, methoxyethyl (meth)acrylate, 2-(ethoxyethoxy)ethyl acrylate, polyethylene glycol (meth)acrylic acid Ester, polyethylene glycol (meth) methacrylate, polypropylene glycol (meth) methacrylate, polypropylene glycol (meth) acrylate, and methoxy polyethylene glycol (meth) acrylate.

就具有環氧丙基之單體而言,可列舉(甲基)丙烯酸環氧丙酯、(甲基)丙烯酸-3,4-環氧環己基甲酯、環氧丙基乙烯基醚、3,4-環氧環己基乙烯基醚、環氧丙基(甲基)烯丙基醚、3,4-環氧環己基(甲基)烯丙基醚等。For monomers with glycidyl groups, glycidyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, glycidyl vinyl ether, 3 ,4-Epoxycyclohexyl vinyl ether, epoxypropyl (methyl) allyl ether, 3,4-epoxycyclohexyl (methyl) allyl ether, etc.

就具有醯胺基或N-取代醯胺基之單體而言,可列舉丙烯醯胺、甲基丙烯醯胺、N-甲基(甲基)丙烯醯胺、N-乙基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-乙氧基甲基(甲基)丙烯醯胺、N-丙氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、N-第三丁基丙烯醯胺、N-辛基丙烯醯胺、二丙酮丙烯醯胺、羥基乙基丙烯醯胺等。For monomers having an amide group or N-substituted amide group, acrylamide, methacrylamide, N-methyl(meth)acrylamide, N-ethyl(methyl) Acrylamide, N-methoxymethyl (meth)acrylamide, N-ethoxymethyl (meth)acrylamide, N-propoxymethyl (meth)acrylamide, N -Butoxymethyl (meth)acrylamide, N-tert-butylacrylamide, N-octylacrylamide, diacetone acrylamide, hydroxyethyl acrylamide, etc.

就具有三級胺基之單體而言,可列舉(甲基)丙烯酸二甲基胺基乙酯、(甲基)丙烯酸二乙基胺基乙酯、二甲基胺基丙基(甲基)丙烯醯胺等。For monomers with tertiary amino groups, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, dimethylaminopropyl (methyl) ) Acrylamide, etc.

就N-羥甲基丙烯醯胺及甲基丙烯酸羥基烷基酯以外之具有羥基之單體而言,可舉例如丙烯酸-2-羥基乙酯、丙烯酸-2-羥基丙酯、丙烯酸-4-羥基丁酯、丙烯酸-6-羥基己酯等。For monomers having a hydroxyl group other than N-methylol acrylamide and hydroxyalkyl methacrylate, for example, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxypropyl acrylate Hydroxybutyl ester, 6-hydroxyhexyl acrylate, etc.

就多官能(甲基)丙烯酸系單體而言,可列舉1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、己內酯改性二環戊烯基二(甲基)丙烯酸酯、環氧乙烷改性二(甲基)丙烯酸酯、二(甲基)丙烯醯氧基乙基異氰脲酸酯、三環癸烷二甲醇(甲基)丙烯酸酯、二羥甲基二環戊烷二(甲基)丙烯酸酯、環氧乙烷改性六氫鄰苯二甲酸二(甲基)丙烯酸酯、三環戊烷二甲醇(甲基)丙烯酸酯、新戊二醇改性三甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二新戊四醇三(甲基)丙烯酸酯、二甘油四(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等。The polyfunctional (meth)acrylic monomers include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and neopentyl glycol Di(meth)acrylate, polyethylene glycol di(meth)acrylate, caprolactone modified dicyclopentenyl di(meth)acrylate, ethylene oxide modified di(meth)acrylic acid Ester, di(meth)acryloxyethyl isocyanurate, tricyclodecane dimethanol (meth)acrylate, dimethylol dicyclopentane di(meth)acrylate, epoxy Ethane modified hexahydrophthalic acid di(meth)acrylate, tricyclopentane dimethanol (meth)acrylate, neopentyl glycol modified trimethylpropane di(meth)acrylate, three Hydroxymethylpropane tri(meth)acrylate, dineopentyl erythritol tri(meth)acrylate, diglycerol tetra(meth)acrylate, neopentaerythritol tetra(meth)acrylate, dineopentyl Tetraol hexa(meth)acrylate etc.

就芳香族單乙烯系單體而言,可舉例如苯乙烯、α-甲基苯乙烯、第三丁基苯乙烯、對氯苯乙烯、氯甲基苯乙烯、乙烯基甲苯、乙烯基吡啶。 就氰化乙烯系單體而言,可舉例如丙烯腈、甲基丙烯腈。Examples of aromatic monovinyl monomers include styrene, α-methylstyrene, tertiary butylstyrene, p-chlorostyrene, chloromethylstyrene, vinyl toluene, and vinylpyridine. Examples of vinyl cyanide monomers include acrylonitrile and methacrylonitrile.

就具有芳香族環之(甲基)丙烯酸系單體而言,可舉例如(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸芐酯、苯氧基二乙二醇(甲基)丙烯酸酯、環氧乙烷(EO)改性甲酚(甲基)丙烯酸酯、環氧乙烷(EO)改性壬基苯酚(甲基)丙烯酸酯、羥基乙基化β-萘酚丙烯酸酯、(甲基)丙烯酸聯苯酯。For (meth)acrylic monomers having an aromatic ring, for example, phenoxyethyl (meth)acrylate, benzyl (meth)acrylate, phenoxydiethylene glycol (meth) Acrylate, ethylene oxide (EO) modified cresol (meth) acrylate, ethylene oxide (EO) modified nonylphenol (meth) acrylate, hydroxyethylated β-naphthol acrylate , Biphenyl (meth)acrylate.

特定(甲基)丙烯酸系共聚物亦可含有其他構成單元,考慮耐污染性及耐氧化性之觀點,宜不含其他構成單元。尤其,宜不含N-羥甲基丙烯醯胺及甲基丙烯酸羥基烷基酯以外之具有羥基之單體。 含有其他構成單元時,就其他構成單元之含量而言,宜為相對於特定(甲基)丙烯酸系共聚物之全部構成單元,為5質量%以下較理想,更宜為未達1質量%,進一步宜為未達0.1質量%。The specific (meth)acrylic copolymer may also contain other structural units, and it is preferable not to contain other structural units from the viewpoint of contamination resistance and oxidation resistance. In particular, it is preferable not to contain monomers having hydroxyl groups other than N-methylol acrylamide and hydroxyalkyl methacrylate. When other structural units are contained, the content of other structural units is preferably 5% by mass or less relative to all the structural units of the specific (meth)acrylic copolymer, and more preferably less than 1% by mass, More preferably, it is less than 0.1% by mass.

在本發明之黏著劑組成物中,特定(甲基)丙烯酸系共聚物之含量,可因應目的適當地調整,考慮黏著力之觀點,相對於黏著劑組成物之全部固體成分,宜為80質量%~99質量%,更宜為85質量%~99質量%,進一步宜為90質量%~98質量%。 此外,固體成分總質量係指從黏著劑組成物排除了溶劑等揮發性成分後之殘渣的總質量的含意。In the adhesive composition of the present invention, the content of the specific (meth)acrylic copolymer can be adjusted appropriately according to the purpose. Considering the viewpoint of adhesive force, it is preferably 80 mass relative to the total solid content of the adhesive composition % To 99% by mass, more preferably 85% to 99% by mass, and further preferably 90% to 98% by mass. In addition, the total mass of solid content means the total mass of the residue after excluding solvents and other volatile components from the adhesive composition.

>>特定(甲基)丙烯酸系共聚物之重量平均分子量(Mw)>> 特定(甲基)丙烯酸系共聚物之重量平均分子量(Mw)係沒有特別之限制,考慮改善黏著力之觀點,宜為5萬~100萬,更宜為10萬~80萬,進一步宜為20萬~60萬。重量平均分子量可藉由聚合反應溫度、時間、有機溶劑的量等進行調整。>>Weight average molecular weight (Mw) of specific (meth)acrylic copolymers>> The weight average molecular weight (Mw) of the specific (meth)acrylic copolymer is not particularly limited. Considering the viewpoint of improving the adhesion, it is preferably 50,000 to 1 million, more preferably 100,000 to 800,000, and further preferably 20 Ten thousand to six hundred thousand. The weight average molecular weight can be adjusted by the polymerization temperature, time, amount of organic solvent, and the like.

[重量平均分子量(Mw)之測定方法] 特定(甲基)丙烯酸系共聚物之重量平均分子量(Mw)係藉由下述測定方法求得。 更具體而言,可依循下述(1)~(3)進行測定,求得重量平均分子量(Mw)。 (1)將特定(甲基)丙烯酸系共聚物之溶液塗布於剝離紙,於100℃乾燥1分鐘,獲得薄膜狀之特定(甲基)丙烯酸系共聚物。 (2)使上述(1)獲得之薄膜狀之特定(甲基)丙烯酸系共聚物藉由四氫呋喃溶解而成為固體成分0.2質量%。 (3)以下述條件,使用凝膠滲透層析(GPC),以標準聚苯乙烯換算值之形式,測定特定(甲基)丙烯酸系共聚物之重量平均分子量(Mw)。[Method for measuring weight average molecular weight (Mw)] The weight average molecular weight (Mw) of the specific (meth)acrylic copolymer is obtained by the following measurement method. More specifically, the measurement can be performed according to the following (1) to (3) to obtain the weight average molecular weight (Mw). (1) Apply a solution of a specific (meth)acrylic copolymer to release paper and dry at 100°C for 1 minute to obtain a film of specific (meth)acrylic copolymer. (2) The film-like specific (meth)acrylic copolymer obtained in the above (1) is dissolved in tetrahydrofuran to have a solid content of 0.2% by mass. (3) Under the following conditions, using gel permeation chromatography (GPC), the weight average molecular weight (Mw) of the specific (meth)acrylic copolymer is measured as a standard polystyrene conversion value.

(條件) GPC:HLC-8220 GPC[東曹(股)製] 管柱:使用4支TSK-GEL GMHXL[東曹(股)製] 流動相溶劑:四氫呋喃 流速:0.8mL/分鐘 管柱溫度:40℃(condition) GPC: HLC-8220 GPC [Tosoh Corporation] String: Use 4 TSK-GEL GMHXL [Tosoh Corporation] Mobile phase solvent: tetrahydrofuran Flow rate: 0.8mL/min Column temperature: 40℃

-玻璃轉移溫度- 考慮提高獲得之黏著劑層之黏著力,且更抑制凝聚力之過度上升所致之熱處理後之黏著力上升之觀點,特定(甲基)丙烯酸系共聚物之玻璃轉移溫度(Tg)宜為-60℃~-5℃,更宜為-55℃~-30℃,進一步宜為-50℃以上未達-40℃。-Glass transition temperature- Considering the viewpoint of increasing the adhesive force of the obtained adhesive layer and suppressing the increase of the adhesive force after heat treatment caused by the excessive increase of cohesive force, the glass transition temperature (Tg) of the specific (meth)acrylic copolymer is preferably -60 ℃~-5℃, more preferably -55℃~-30℃, and further preferably above -50℃ and less than -40℃.

特定(甲基)丙烯酸系共聚物之玻璃轉移溫度(Tg)係藉由下式之計算所求得的莫耳平均玻璃轉移溫度。The glass transition temperature (Tg) of the specific (meth)acrylic copolymer is the molar average glass transition temperature calculated by the following formula.

[數1]

Figure 02_image001
式中,Tg1 、Tg2 、……及Tgn 係表示單體1、單體2、……及單體n各別之均聚物之以絕對溫度(單位:K;以下亦同。)表示的玻璃轉移溫度。m1 、m2 、……及mn 係各別之單體成分的莫耳分率。[Number 1]
Figure 02_image001
In the formula, Tg 1 , Tg 2 , ... and Tg n represent the absolute temperature of the homopolymers of monomer 1, monomer 2, ... and monomer n (unit: K; the same applies below). Indicates the glass transition temperature. m 1 , m 2 , ... and m n are the molar fractions of the individual monomer components.

此外,「均聚物之以絕對溫度(K)表示之玻璃轉移溫度」係指將該單體單獨地進行聚合所製得之均聚物以絕對溫度(K)表示的玻璃轉移溫度。均聚物之玻璃轉移溫度係將該均聚物,使用差示掃描量熱測定裝置(DSC)(Ta Instruments Japan Inc.製,製品名:DSC2500),以於氮氣氣流中、測定樣本10mg、升溫速度10℃/分鐘之條件進行測定,將獲得之DSC曲線之拐點,作為均聚物之玻璃轉移溫度。In addition, "the glass transition temperature of a homopolymer expressed in absolute temperature (K)" refers to the glass transition temperature expressed in absolute temperature (K) of a homopolymer obtained by separately polymerizing the monomer. The glass transition temperature of the homopolymer was measured using a differential scanning calorimetry device (DSC) (manufactured by Ta Instruments Japan Inc., product name: DSC2500) for the homopolymer to measure 10 mg of the sample in a nitrogen gas stream and raise the temperature The measurement is carried out at a speed of 10°C/min, and the inflection point of the obtained DSC curve is taken as the glass transition temperature of the homopolymer.

具代表性之單體之「均聚物之以攝氏溫度(單位:℃;以下亦同。)表示之玻璃轉移溫度」係:丙烯酸甲酯為5℃,丙烯酸乙酯為-27℃,丙烯酸正丁酯為-57℃,丙烯酸-2-乙基己酯為-76℃,N-羥甲基丙烯醯胺為100℃,羥基乙基丙烯醯胺為98℃,丙烯酸二甲基胺基乙酯為18℃,甲基丙烯酸-2-羥基乙酯為55℃,甲基丙烯酸-2-羥基丁酯為26℃,丙烯酸-2-羥基乙酯為-15℃,丙烯酸-4-羥基丁酯為-39℃,丙烯酸為163℃。例如,藉由使用此等具代表性之單體,可適當地調整上述玻璃轉移溫度。 此外,藉由從絕對溫度(K)減去273而可將絕對溫度(K)換算為攝氏溫度(℃),藉由將攝氏溫度(℃)加上273而可將攝氏溫度(℃)換算為絕對溫度(K)。"Glass transition temperature of homopolymer expressed in Celsius (unit: °C; the same below.) of representative monomers" series: 5 °C for methyl acrylate, -27 °C for ethyl acrylate, normal acrylic acid Butyl ester is -57°C, 2-ethylhexyl acrylate is -76°C, N-methylol acrylamide is 100°C, hydroxyethyl acrylamide is 98°C, dimethylaminoethyl acrylate Is 18°C, 2-hydroxyethyl methacrylate is 55°C, 2-hydroxybutyl methacrylate is 26°C, 2-hydroxyethyl acrylate is -15°C, and 4-hydroxybutyl acrylate is -39°C, acrylic acid is 163°C. For example, by using these representative monomers, the above-mentioned glass transition temperature can be adjusted appropriately. In addition, by subtracting 273 from the absolute temperature (K), the absolute temperature (K) can be converted to the Celsius temperature (℃), and by adding the Celsius temperature (℃) to 273, the Celsius temperature (℃) can be converted to Absolute temperature (K).

[特定(甲基)丙烯酸系共聚物之製造方法] 特定(甲基)丙烯酸系共聚物之製造方法係沒有特別之限制,可藉由溶液聚合、乳化聚合、懸浮聚合等方法將單體進行聚合來製造。 此外,在製造後製備本發明之黏著劑組成物時,考慮處理步驟較簡單且能以短時間進行,特定(甲基)丙烯酸系共聚物宜使用溶液聚合來製造。[Method for manufacturing specific (meth)acrylic copolymer] The method for producing the specific (meth)acrylic copolymer is not particularly limited, and it can be produced by polymerizing monomers by methods such as solution polymerization, emulsion polymerization, and suspension polymerization. In addition, when preparing the adhesive composition of the present invention after manufacturing, considering that the processing steps are relatively simple and can be performed in a short time, the specific (meth)acrylic copolymer is preferably manufactured by solution polymerization.

溶液聚合一般而言可使用於聚合槽內加入預定之有機溶劑、單體、聚合起始劑、及因應需求而使用之鏈轉移劑,於氮氣氣流中或於有機溶劑之回流溫度,邊攪拌邊使其加熱反應數小時等之方法。此外,藉由調整反應溫度、時間、溶劑量、觸媒之種類及量,可使特定(甲基)丙烯酸系共聚物之重量平均分子量成為期望的值。In general, solution polymerization can be used to add predetermined organic solvents, monomers, polymerization initiators, and chain transfer agents according to needs to the polymerization tank, in a nitrogen stream or at the reflux temperature of the organic solvent, while stirring It is heated and reacted for several hours. In addition, the weight average molecular weight of the specific (meth)acrylic copolymer can be adjusted to a desired value by adjusting the reaction temperature, time, amount of solvent, and type and amount of catalyst.

就特定(甲基)丙烯酸系共聚物之聚合反應時使用的有機溶劑而言,沒有特別之限制,可列舉芳香族烴化合物、脂肪族系或脂環族系烴化合物、酯化合物、酮化合物、乙二醇醚化合物、醇化合物等。 此等有機溶劑可各自單獨使用1種,亦可混合2種以上使用。The organic solvent used in the polymerization reaction of the specific (meth)acrylic copolymer is not particularly limited. Examples include aromatic hydrocarbon compounds, aliphatic or alicyclic hydrocarbon compounds, ester compounds, ketone compounds, Glycol ether compounds, alcohol compounds, etc. These organic solvents may each be used individually by 1 type, and may mix and use 2 or more types.

就聚合反應時使用之有機溶劑而言,可舉例如苯、甲苯、乙基苯、正丙基苯、第三丁基苯、鄰二甲苯、間二甲苯、對二甲苯、四氫萘、十氫萘、及芳香族石腦油為代表之芳香族烴系有機溶劑;正己烷、正庚烷、正辛烷、異辛烷、正癸烷、二戊烯、石油精、石油石腦油、及松節油為代表之脂肪族烴系或脂環族烴系之有機溶劑;乙酸乙酯、乙酸正丁酯、乙酸正戊酯、乙酸-2-羥基乙酯、乙酸-2-丁氧基乙酯、乙酸-3-甲氧基丁酯、及苯甲酸甲酯為代表之酯系有機溶劑;丙酮、甲乙酮、甲基-異丁基酮、異佛爾酮、環己酮、及、甲基環己酮為代表之酮系有機溶劑;乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單丁基醚、二乙二醇單甲基醚、二乙二醇單乙基醚、及二乙二醇單丁基醚為代表之乙二醇醚系有機溶劑;以及甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇、第二丁醇、及第三丁醇為代表之醇系有機溶劑等。Regarding the organic solvent used in the polymerization reaction, for example, benzene, toluene, ethylbenzene, n-propylbenzene, tertiary butylbenzene, o-xylene, meta-xylene, p-xylene, tetralin, ten Hydronaphthalene and aromatic naphtha are represented by aromatic hydrocarbon-based organic solvents; n-hexane, n-heptane, n-octane, isooctane, n-decane, dipentene, petroleum spirit, petroleum naphtha, And turpentine as the representative organic solvent of aliphatic hydrocarbon series or alicyclic hydrocarbon series; ethyl acetate, n-butyl acetate, n-pentyl acetate, 2-hydroxyethyl acetate, 2-butoxyethyl acetate , 3-methoxybutyl acetate, and methyl benzoate as representative organic solvents; acetone, methyl ethyl ketone, methyl-isobutyl ketone, isophorone, cyclohexanone, and methyl cyclic Ketone-based organic solvent represented by hexanone; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl Ether, and glycol ether-based organic solvents represented by diethylene glycol monobutyl ether; and methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, second butanol, and Alcohol-based organic solvents represented by tributanol.

此外,就聚合起始劑而言,可舉例如於通常之聚合方法可使用之有機過氧化物、偶氮化合物。In addition, examples of the polymerization initiator include organic peroxides and azo compounds that can be used in ordinary polymerization methods.

>交聯劑> 本發明之黏著劑組成物含有交聯劑。 就交聯劑而言,可舉例如異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉系交聯劑、碳二亞胺系交聯劑、金屬螯合化合物等,考慮於高溫條件下之熱處理後之耐污染性、及耐氧化性之觀點,宜為異氰酸酯系交聯劑或金屬螯合化合物,更宜為異氰酸酯系交聯劑。 交聯劑,可含有單獨1種,亦可含有2種以上。>Crosslinking agent> The adhesive composition of the present invention contains a crosslinking agent. As for the cross-linking agent, for example, isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, carbodiimide-based cross-linking agents, metal chelating compounds, etc., are considered. From the following viewpoints of stain resistance and oxidation resistance after heat treatment, isocyanate-based crosslinking agents or metal chelate compounds are preferred, and isocyanate-based crosslinking agents are more preferred. The crosslinking agent may be contained alone or in two or more kinds.

就異氰酸酯系交聯劑而言,可列舉1分子中具有2個以上之異氰酸酯基之化合物(多異氰酸酯化合物)。 就異氰酸酯系交聯劑而言,可舉例如二異氰酸二甲苯酯(XDI)、二苯基甲烷二異氰酸酯、三苯基甲烷三異氰酸酯、及二異氰酸甲苯酯(TDI)等芳香族多異氰酸酯化合物;二異氰酸六亞甲酯(HMDI)、二異氰酸五亞甲酯(PDI)、異佛爾酮二異氰酸酯、芳香族多異氰酸酯化合物之氫化物等之脂肪族或脂環族多異氰酸酯化合物等。 此外,就多異氰酸酯化合物而言,也可列舉上述多異氰酸酯化合物之二聚體、三聚體、或五聚體、上述多異氰酸酯化合物與三羥甲基丙烷等多元醇化合物之加成物、上述異氰酸酯化合物之縮二脲體等。Examples of the isocyanate-based crosslinking agent include compounds (polyisocyanate compounds) having two or more isocyanate groups in one molecule. The isocyanate-based crosslinking agent includes, for example, aromatics such as xylene diisocyanate (XDI), diphenylmethane diisocyanate, triphenylmethane triisocyanate, and toluene diisocyanate (TDI). Polyisocyanate compound; aliphatic or alicyclic such as hexamethylene diisocyanate (HMDI), pentamethylene diisocyanate (PDI), isophorone diisocyanate, hydrogenated aromatic polyisocyanate compound, etc. Group polyisocyanate compounds and so on. In addition, polyisocyanate compounds include dimers, trimers, or pentamers of the above-mentioned polyisocyanate compounds, adducts of the above-mentioned polyisocyanate compounds and polyol compounds such as trimethylolpropane, and the above Biuret of isocyanate compound, etc.

就聚異氰酸酯化合物而言,可使用市售品。 就聚異氰酸酯化合物之市售品之例子而言,可列舉「Coronate(註冊商標)HX」、「Coronate(註冊商標)HL-S」、「Coronate(註冊商標)L」、「Coronate(註冊商標)L45E」、「Coronate(註冊商標)2031」、「Coronate(註冊商標)2037」、「Coronate(註冊商標)2234」、「Coronate(註冊商標)2785」、「aquanate(註冊商標)200」、及「aquanate(註冊商標)210」[以上為東曹(股)];「Sumidur(註冊商標)N3300」、「Desmodur(註冊商標)N3400」、及「Sumidur(註冊商標)N-75」[以上為Sumika Covestro Urethane Co.,Ltd.];「DURANATE(註冊商標)E-405-80T」、「DURANATE(註冊商標)AE700-100」、「DURANATE(註冊商標)24A-100」、及「DURANATE(註冊商標)TSE-100」[以上為旭化成(股)];以及「TAKENATE(註冊商標)D-110N」、「TAKENATE(註冊商標)D-120N」、「TAKENATE(註冊商標)M-631N」、「MT-OLESTER(註冊商標)NP1200」、及「STABiO(註冊商標)XD-340N」[以上為三井化學(股)]。As the polyisocyanate compound, commercially available products can be used. Examples of commercially available polyisocyanate compounds include "Coronate (registered trademark) HX", "Coronate (registered trademark) HL-S", "Coronate (registered trademark) L", and "Coronate (registered trademark) L45E", "Coronate (registered trademark) 2031", "Coronate (registered trademark) 2037", "Coronate (registered trademark) 2234", "Coronate (registered trademark) 2785", "aquanate (registered trademark) 200", and " Aquanate (registered trademark) 210" [the above is Tosoh (shares)]; "Sumidur (registered trademark) N3300", "Desmodur (registered trademark) N3400", and "Sumidur (registered trademark) N-75" [the above is Sumika Covestro Urethane Co., Ltd.]; "DURANATE (registered trademark) E-405-80T", "DURANATE (registered trademark) AE700-100", "DURANATE (registered trademark) 24A-100", and "DURANATE (registered trademark) ) TSE-100" [Above is Asahi Kasei (shares)]; and "TAKENATE (registered trademark) D-110N", "TAKENATE (registered trademark) D-120N", "TAKENATE (registered trademark) M-631N", "MT -OLESTER (registered trademark) NP1200" and "STABiO (registered trademark) XD-340N" [above is Mitsui Chemicals Co., Ltd.].

此等之中,考慮高溫條件下之熱處理後之耐污染性、及耐氧化性之觀點,就交聯劑而言,為二異氰酸甲苯酯之三羥甲基丙烷加成物之「Coronate L45E」較為理想。Among these, considering the pollution resistance and oxidation resistance after heat treatment under high temperature conditions, the crosslinking agent is the "Coronate" of the trimethylolpropane adduct of toluene diisocyanate. "L45E" is ideal.

就金屬螯合化合物而言,可列舉單乙醯丙酮酸雙(乙基乙醯乙酸)鋁、參(乙基乙醯乙酸)鋁、及參(乙醯丙酮酸)鋁為代表之鋁螯合化合物、鈦螯合化合物、鋯螯合化合物、鈷螯合化合物等。As for the metal chelate compound, aluminum chelate represented by bis(ethylacetate) aluminum, ginseng (ethylacetate) aluminum, and ginseng (acetylpyruvate) aluminum Compounds, titanium chelate compounds, zirconium chelate compounds, cobalt chelate compounds, etc.

就金屬螯合化合物而言,可使用市售品。 就金屬螯合化合物之市售品之例子而言,可列舉「Aluminum Chelate A」、「Aluminum Chelate D」、及「ALCH-TR」[以上為Kawaken Fine Chemicals Co.,Ltd.]。As for the metal chelate compound, commercially available products can be used. Examples of commercially available products of metal chelate compounds include "Aluminum Chelate A", "Aluminum Chelate D", and "ALCH-TR" [Kawaken Fine Chemicals Co., Ltd. above].

>>交聯劑之官能基之莫耳數相對於(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數的比>> 交聯劑之官能基之莫耳數相對於(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數的比(莫耳比)係0.1以上且1.0以下。 若上述莫耳比為上述範圍內,則在高溫條件下之熱處理所致之來自甲基丙烯酸羥基烷基酯之構成單元之一部分的構成單元之分解(解聚)與N-羥甲基丙烯醯胺之自交聯反應所致之互補效果變得更加明顯,凝聚力變得更適當,可更抑制高溫條件下之熱處理後之黏著力上升,可更抑制被黏著體之污染及劣化。 考慮上述觀點,就上述莫耳比而言,宜為0.2以上且1.0以下,更宜為0.25以上且0.9以下,進一步宜為0.25以上且0.7以下,尤其宜為0.25以上且0.6以下,最好宜為0.3以上且0.5以下。>>The ratio of the mole number of the functional group of the crosslinking agent to the total mole number of the crosslinkable functional group possessed by the (meth)acrylic copolymer>> The ratio (molar ratio) of the number of moles of the functional groups of the crosslinking agent to the total number of moles of the crosslinkable functional groups possessed by the (meth)acrylic copolymer is 0.1 or more and 1.0 or less. If the above-mentioned molar ratio is within the above-mentioned range, the decomposition (depolymerization) of a part of the structural unit derived from a part of the structural unit of hydroxyalkyl methacrylate caused by the heat treatment under high temperature conditions and the N-methylolacrylic acid The complementary effect caused by the self-crosslinking reaction of amine becomes more obvious, the cohesive force becomes more appropriate, the increase in adhesion after heat treatment under high temperature conditions can be suppressed, and the pollution and deterioration of the adherend can be suppressed. Considering the above point of view, the above molar ratio is preferably 0.2 or more and 1.0 or less, more preferably 0.25 or more and 0.9 or less, further preferably 0.25 or more and 0.7 or less, particularly preferably 0.25 or more and 0.6 or less, and most preferably It is 0.3 or more and 0.5 or less.

就(甲基)丙烯酸系共聚物具有之交聯性官能基而言,來自N-羥甲基丙烯醯胺之構成單元中的交聯性官能基系N-羥甲基,來自甲基丙烯酸羥基烷基酯之構成單元中之交聯性官能基係羥基。 (甲基)丙烯酸系共聚物含有作為其他構成單元之來自具有交聯性官能基之單體的構成單元(以下也稱為「來自具有交聯性官能基之單體之其他構成單元」。)時,除了上述N-羥甲基及羥基之外,其他構成單元所含有之交聯性官能基亦對應於(甲基)丙烯酸系共聚物具有之交聯性官能基。 就其他構成單元具有之交聯性官能基而言,只要是藉由與交聯劑之交聯反應可形成交聯結構之官能基,則可舉例如羧基、酮基、羥基、醯胺基、N-取代醯胺基、環氧基等官能基。Regarding the crosslinkable functional group possessed by the (meth)acrylic copolymer, the crosslinkable functional group in the constituent unit derived from N-methylol acrylamide is N-methylol, derived from methacrylic hydroxyl group The crosslinkable functional group in the structural unit of the alkyl ester is a hydroxyl group. The (meth)acrylic copolymer contains as other structural units a structural unit derived from a monomer having a crosslinkable functional group (hereinafter also referred to as "other structural unit derived from a monomer having a crosslinkable functional group"). In this case, in addition to the above-mentioned N-methylol and hydroxyl groups, the crosslinkable functional groups contained in other structural units also correspond to the crosslinkable functional groups possessed by the (meth)acrylic copolymer. As for the crosslinkable functional groups possessed by other structural units, as long as they are functional groups that can form a crosslinked structure by crosslinking reaction with a crosslinking agent, examples include carboxyl groups, ketone groups, hydroxyl groups, amide groups, Functional groups such as N-substituted amide and epoxy groups.

上述莫耳比可藉由以交聯劑具有之官能基之莫耳數(下式(1))及(甲基)丙烯酸系共聚物具有之交聯性官能基之合計莫耳數(下式(2))所表示之式(3)來求得。 此外,交聯劑具有之官能基係指可與上述(甲基)丙烯酸系共聚物具有之交聯性官能基進行交聯反應的基,例如交聯劑為異氰酸酯系交聯劑時,官能基係指異氰酸酯基。The above-mentioned molar ratio can be determined by the molar number of functional groups possessed by the crosslinking agent (the following formula (1)) and the total molar number of crosslinkable functional groups possessed by the (meth)acrylic copolymer (the following formula (2)) It can be obtained by formula (3). In addition, the functional group possessed by the crosslinking agent refers to a group capable of undergoing a crosslinking reaction with the crosslinkable functional group possessed by the (meth)acrylic copolymer. For example, when the crosslinking agent is an isocyanate crosslinking agent, the functional group Refers to isocyanate groups.

此外,交聯劑為金屬螯合化合物時,考慮上述(甲基)丙烯酸系共聚物所含有之羥基係與金屬螯合化合物中之中心金屬配位鍵結,藉由將中心金屬之價數替換為官能基之數目,可求得用於上述莫耳比之計算之金屬螯合化合物之當量(莫耳數)。 本發明中,例如鋁螯合化合物中之中心金屬之價數為3,則鋁螯合化合物能以每1莫耳具有3莫耳之官能基來替換進行計算。 金屬螯合化合物之當量係藉由下式計算而得之值。 當量=(A×B/C)/(D1 ×E1 /F1 +D2 ×E2 /F2 +……+Dn ×En ×Fn ) A=金屬螯合化合物之金屬之價數 B=金屬螯合化合物之質量份數目(作為固體成分的量) C=金屬螯合化合物之分子量 D1 、D2 、……Dn =特定(甲基)丙烯酸系共聚物中使用之全部單體中之具有交聯性官能基之各單體的含有率(質量%) E1 、E2 、……En =具有交聯性官能基之各單體之1分子中含有之交聯性官能基的數目 F1 、F2 、……Fn =於特定(甲基)丙烯酸系共聚物中使用之具有交聯性官能基之各單體的分子量 此外,n表示使用之單體之種類的數目,例如使用之(甲基)丙烯酸系單體為1種時,於計算中僅使用D1 ,而不使用D2 ……DnIn addition, when the crosslinking agent is a metal chelate compound, it is considered that the hydroxyl group contained in the above-mentioned (meth)acrylic copolymer is coordinated with the central metal in the metal chelate compound, and the valence of the central metal is replaced Is the number of functional groups, and the equivalent weight (number of moles) of the metal chelate compound used in the calculation of the molar ratio can be obtained. In the present invention, for example, the valence of the central metal in the aluminum chelate compound is 3, and the aluminum chelate compound can be calculated by replacing the functional group with 3 mol per 1 mol. The equivalent weight of the metal chelate compound is a value calculated by the following formula. Equivalent=(A×B/C)/(D 1 ×E 1 /F 1 +D 2 ×E 2 /F 2 +……+D n ×E n ×F n ) A=metal chelate compound Valence B = the number of parts by mass of the metal chelate compound (as a solid content) C = the molecular weight of the metal chelate compound D 1 , D 2 , ... D n = used in the specific (meth)acrylic copolymer The content of each monomer having a cross-linkable functional group in all monomers (mass%) E 1 , E 2 ,...E n = the amount contained in 1 molecule of each monomer having a cross-linkable functional group The number of linkable functional groups F 1 , F 2 , ... F n = the molecular weight of each monomer having a crosslinkable functional group used in the specific (meth)acrylic copolymer. In addition, n represents the monomer used For the number of types, for example, when the (meth)acrylic monomer used is one type, only D 1 is used in the calculation, and D 2 ...D n is not used.

莫耳比之計算中使用之交聯劑具有之官能基之莫耳數,可使用交聯劑中之官能基之含有率、交聯劑之固體成分量、及摻合量(添加之質量份),藉由下式(1)來求得。The number of moles of functional groups of the cross-linking agent used in the calculation of the molar ratio can be used as the content of the functional groups in the cross-linking agent, the solid content of the cross-linking agent, and the blending amount (added mass parts ), obtained by the following formula (1).

交聯劑中之官能基之莫耳數(單位:mmol/特定(甲基)丙烯酸系共聚物之固體成分量100g) =[(交聯劑中之官能基之含有率(單位:質量%)×交聯劑之摻合量(單位:g))/交聯劑之固體成分(單位:質量%)]/官能基之分子量(單位:g/mol)×1000……式(1)The number of moles of functional groups in the crosslinking agent (unit: mmol/solid content of the specific (meth)acrylic copolymer 100g) =[(The content rate of the functional group in the crosslinking agent (unit: mass%) × the blending amount of the crosslinking agent (unit: g))/the solid content of the crosslinking agent (unit: mass%)]/functional group The molecular weight (unit: g/mol)×1000……Formula (1)

特定(甲基)丙烯酸系共聚物具有之交聯性官能基之合計莫耳數(單位:mmol/特定(甲基)丙烯酸系共聚物之固體成分量100g) =[特定(甲基)丙烯酸系共聚物中之來自N-羥甲基丙烯醯胺之構成單元之含有率(單位:質量%)/N-羥甲基丙烯醯胺之分子量(單位:g/mol)×來自N-羥甲基丙烯醯胺之構成單元中之N-羥甲基之個數(價數)×1000]+[特定(甲基)丙烯酸系共聚物中之來自甲基丙烯酸羥基烷基酯之構成單元之含有率(單位:質量%)/甲基丙烯酸羥基烷基酯之分子量(單位:g/mol)×來自甲基丙烯酸羥基烷基酯之構成單元中之羥基之個數(價數)×1000]+[特定(甲基)丙烯酸系共聚物中之來自具有交聯性官能基之單體之其他構成單元的含有率(單位:質量%)/具有交聯性官能基之單體之分子量(單位:g/mol)×其他構成單元中之交聯性官能基之個數(價數)×1000]]……式(2)The total number of moles of crosslinkable functional groups of the specific (meth)acrylic copolymer (unit: mmol/solid content of the specific (meth)acrylic copolymer 100g) =[The content of the constituent units derived from N-methylol acrylamide in the specific (meth)acrylic copolymer (unit: mass %)/the molecular weight of the N-methylol acrylamide (unit: g/ mol)×The number of N-methylol groups in the structural unit derived from N-methylol acrylamide (valence)×1000]+[The methacrylic hydroxyl group in the specific (meth)acrylic copolymer The content of the structural unit of the alkyl ester (unit: mass %) / the molecular weight of the hydroxyalkyl methacrylate (unit: g/mol) × the number of hydroxyl groups in the structural unit derived from the hydroxyalkyl methacrylate (Valency)×1000]+[The content of other constituent units derived from the monomer having a crosslinkable functional group in the specific (meth)acrylic copolymer (unit: mass %) / having a crosslinkable functional group The molecular weight of the monomer (unit: g/mol) × the number of cross-linkable functional groups in the other constituent units (valence) × 1000]]……Formula (2)

交聯劑中之官能基之莫耳數相對於特定(甲基)丙烯酸系共聚物具有之交聯性官能基之合計莫耳數之比=上式(1)/上式(2)……式(3)The ratio of the number of moles of functional groups in the crosslinking agent to the total number of moles of crosslinkable functional groups possessed by the specific (meth)acrylic copolymer = the above formula (1)/the above formula (2)... Formula (3)

就交聯劑之含量而言,沒有特別之限制,考慮耐污染性及耐氧化性之觀點,相對於特定(甲基)丙烯酸系共聚物之構成單元之合計100質量份,以有效成分換算值計,宜為0.1質量份以上且20質量份以下,更宜為1質量份以上且10質量份以下。There is no particular restriction on the content of the crosslinking agent. Considering stain resistance and oxidation resistance, the value is calculated as the effective ingredient relative to the total of 100 parts by mass of the structural units of the specific (meth)acrylic copolymer In total, it is preferably 0.1 part by mass or more and 20 parts by mass or less, and more preferably 1 part by mass or more and 10 parts by mass or less.

-交聯觸媒- 本發明之黏著劑組成物亦可含有交聯觸媒。 本發明之黏著劑組成物含有交聯觸媒時,即使在含有具有大體積之分子結構的單體時,交聯反應仍會輕易進行,可形成交聯密度高之黏著劑層,黏著劑層之在高溫條件下之耐久性及再加工性更容易為優良。 本發明之黏著劑組成物含有交聯觸媒時,交聯觸媒可含有單獨1種,亦可含有2種以上。-Crosslinking catalyst- The adhesive composition of the present invention may also contain a crosslinking catalyst. When the adhesive composition of the present invention contains a cross-linking catalyst, even when it contains a monomer with a large-volume molecular structure, the cross-linking reaction can still proceed easily, and an adhesive layer with high cross-linking density can be formed. Its durability and reworkability under high temperature conditions are easier to be excellent. When the adhesive composition of the present invention contains a cross-linking catalyst, the cross-linking catalyst may contain one type alone or two or more types.

就交聯觸媒而言,可適當地使用可用於黏著劑組成物之公知之交聯觸媒。 就交聯觸媒而言,沒有特別之限制,可舉例如1,2-二甲基咪唑、1-芐基-2-甲基咪唑、1-芐基-2-苯基咪唑、及2,3-二氫-1H-吡咯并[1,2-a]苯并咪唑為代表之咪唑化合物;二月桂酸二辛基錫、及1,3-二乙醯氧基四丁基錫氧烷為代表之有機金屬化合物;以及三伸乙二胺、及N-甲基𠰌啉為代表之3級胺化合物。As the crosslinking catalyst, a known crosslinking catalyst that can be used for the adhesive composition can be suitably used. As for the crosslinking catalyst, there is no particular limitation, and examples include 1,2-dimethylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 2, 3-Dihydro-1H-pyrrolo[1,2-a]benzimidazole is a representative imidazole compound; dioctyltin dilaurate, and 1,3-diethoxytetrabutylstannoxane are representative Organometallic compounds; and tertiary amine compounds represented by triethylenediamine and N-methyl 𠰌line.

交聯觸媒可使用市售品,就交聯觸媒之市售品而言,可舉例如四國化成工業(股)之「Curezol(註冊商標)1B2MZ」、「Curezol(註冊商標)1B2PZ」、「Curezol(註冊商標)TBZ」、及「Curezol(註冊商標)1,2DMZ」(皆為商品名)。Commercial products can be used as cross-linking catalysts. For commercial products of cross-linking catalysts, for example, "Curezol (registered trademark) 1B2MZ" and "Curezol (registered trademark) 1B2PZ" of Shikoku Chemical Industry Co., Ltd. , "Curezol (registered trademark) TBZ", and "Curezol (registered trademark) 1,2DMZ" (both are product names).

本發明之黏著劑組成物含有交聯觸媒時,考慮可更縮短養護時間之觀點,就交聯觸媒之含有率而言,相對於特定(甲基)丙烯酸系共聚物100質量份,宜為0.01質量份~1.5質量份,更宜為0.05質量份~1.0質量份,進一步宜為0.05質量份~0.5質量份。When the adhesive composition of the present invention contains a cross-linking catalyst, considering that the curing time can be shortened, the content of the cross-linking catalyst is preferably relative to 100 parts by mass of the specific (meth)acrylic copolymer It is 0.01 parts by mass to 1.5 parts by mass, more preferably 0.05 parts by mass to 1.0 parts by mass, and further preferably 0.05 parts by mass to 0.5 parts by mass.

[其他成分] 本發明之黏著劑組成物在上述特定(甲基)丙烯酸系共聚物、交聯劑、及交聯觸媒之外,因應需求,亦可適當地含有矽烷偶聯劑、有機溶劑、耐候性安定劑、塑化劑、軟化劑、剝離助劑、染料、顏料、無機填充劑、界面活性劑、抗氧化劑、金屬抗腐蝕劑、及黏著賦予樹脂、抗靜電劑、以及紫外線吸收劑、受阻胺系化合物等為代表之光安定劑等。[Other ingredients] In addition to the above-mentioned specific (meth)acrylic copolymer, cross-linking agent, and cross-linking catalyst, the adhesive composition of the present invention may also contain a silane coupling agent, organic solvent, and weather resistance as required. Agents, plasticizers, softeners, peeling aids, dyes, pigments, inorganic fillers, surfactants, antioxidants, metal corrosion inhibitors, and adhesion imparting resins, antistatic agents, UV absorbers, and hindered amine compounds Etc. as the representative light stabilizer etc.

[黏著劑組成物之用途] 就本發明之黏著劑組成物之用途而言,沒有特別之限制,可列舉適合用於藉由黏著劑層黏貼於被黏著體之用途中,後述之本發明之實施形態之耐熱性黏著片,例如適合用在靜電電容式之觸控面板製造步驟中之將透明導電性薄膜與玻璃基板等進行貼合之用途。此外,適合用於FPC製造步驟中之熱壓、回流焊接時、或背磨(Back Grinding)步驟中之零件的暫時固定或表面保護用途。[Use of adhesive composition] The use of the adhesive composition of the present invention is not particularly limited, and examples include heat-resistant adhesive sheets suitable for use in pasting to an adherend through an adhesive layer. The heat-resistant adhesive sheet of the embodiment of the present invention described later, For example, it is suitable for the application of bonding a transparent conductive film to a glass substrate in the manufacturing process of a capacitive touch panel. In addition, it is suitable for temporary fixation or surface protection of parts during hot pressing, reflow soldering, or Back Grinding in the FPC manufacturing process.

[耐熱性黏著片] 本發明之耐熱性黏著片具備黏著劑層,該黏著劑層為耐熱性黏著片用黏著劑組成物之交聯物。 本發明之耐熱性黏著片因為具備為本發明之黏著劑組成物之交聯物的黏著劑層,在高溫條件下之熱處理後之耐污染性及耐氧化性優良。 此外,耐熱性黏著片之最外側的面亦能受剝離薄膜保護。[Heat resistant adhesive sheet] The heat-resistant adhesive sheet of the present invention includes an adhesive layer, which is a cross-linked product of the adhesive composition for a heat-resistant adhesive sheet. Since the heat-resistant adhesive sheet of the present invention has an adhesive layer that is a cross-linked product of the adhesive composition of the present invention, it has excellent stain resistance and oxidation resistance after heat treatment under high temperature conditions. In addition, the outermost surface of the heat-resistant adhesive sheet can also be protected by the release film.

就保護黏著劑層側之面的剝離薄膜而言,為了容易將剝離薄膜從黏著劑層剝離,可舉例如經以氟系樹脂、棕櫚蠟(palm wax)、聚矽氧等脫模劑於表面實施了脫模處理之聚酯等合成樹脂薄膜較為理想。 將黏著劑層側之面與相反側之面以剝離薄膜保護時,就剝離薄膜而言,可列舉經硬塗膜化之聚對苯二甲酸乙二酯(PET)薄膜等表面保護薄膜。Regarding the release film for protecting the side of the adhesive layer, in order to easily peel the release film from the adhesive layer, for example, using a release agent such as fluorine-based resin, palm wax, and silicone on the surface Synthetic resin films such as polyester that have been demolded are ideal. When the surface on the side of the adhesive layer and the surface on the opposite side are protected with a release film, the release film includes surface protection films such as a polyethylene terephthalate (PET) film that has been hard-coated.

本發明之耐熱性黏著片中之黏著劑層之厚度可因應基材及被黏著體之種類、基材及被黏著體之表面粗糙度等適當地設定。一般而言,黏著劑層之厚度係1μm~100μm,宜為5μm~50μm,更宜為10μm~30μm。The thickness of the adhesive layer in the heat-resistant adhesive sheet of the present invention can be appropriately set according to the types of the substrate and the adherend, the surface roughness of the substrate and the adherend, and the like. Generally speaking, the thickness of the adhesive layer is 1 μm to 100 μm, preferably 5 μm to 50 μm, and more preferably 10 μm to 30 μm.

本發明之耐熱性黏著片係藉由公知方法製作。 就耐熱性黏著片之製作方法而言,沒有特別之限制,可舉例如將本發明之黏著劑組成物塗布於剝離薄膜上,使其乾燥,於剝離薄膜上形成了黏著劑組成物之塗布層後,藉由使其養護來製作耐熱性黏著片之方法。 此外,就耐熱性黏著片之製作方法之其他例而言,可列舉將本發明之黏著劑組成物塗布於剝離薄膜上,使其乾燥,於剝離薄膜上形成了黏著劑組成物之塗布層後,於塗布層之暴露面設置剝離薄膜使其密接,製作沒有支持體之兩面黏著帶。然後,使塗布層養護來製作成黏著劑層之方法。 此外,就乾燥條件而言,可舉例如使用熱風乾燥機,以70℃~120℃乾燥1分鐘~3分鐘之條件。The heat-resistant adhesive sheet of the present invention is produced by a known method. There are no particular restrictions on the method of making the heat-resistant adhesive sheet. For example, the adhesive composition of the present invention is applied to a release film and dried to form a coating layer of the adhesive composition on the release film. Then, it is a method of making a heat-resistant adhesive sheet by curing it. In addition, other examples of the method for producing a heat-resistant adhesive sheet include coating the adhesive composition of the present invention on a release film, and then drying, and forming a coating layer of the adhesive composition on the release film , Set a release film on the exposed surface of the coating layer to make it close to each other to make an adhesive tape on both sides without a support. Then, curing the coating layer to make the adhesive layer. In addition, the drying conditions include, for example, using a hot air dryer and drying at 70°C to 120°C for 1 minute to 3 minutes.

本發明之耐熱性黏著片,考慮高溫條件下之熱處理後之耐污染性及耐氧化性之觀點,熱處理前之黏著力與於高溫條件下之熱處理後之黏著力的差小較為理想。考慮同樣的觀點,熱處理前之黏著力與高溫條件下之熱處理後之黏著力的差宜為2.0N/mm,更宜為未達0.5N/mm。 此外,上述初始黏著力及在高溫條件下之熱處理後之黏著力表示以0.3m/分鐘之條件將耐熱性黏著片沿180°方向從被黏著體剝離時的黏著力。 [實施例]In the heat-resistant adhesive sheet of the present invention, considering the pollution resistance and oxidation resistance after heat treatment under high temperature conditions, the difference between the adhesive force before heat treatment and the adhesive force after heat treatment under high temperature conditions is preferably small. Considering the same point of view, the difference between the adhesive force before heat treatment and the adhesive force after heat treatment under high temperature conditions should be 2.0N/mm, more preferably less than 0.5N/mm. In addition, the above-mentioned initial adhesive force and adhesive force after heat treatment under high temperature conditions represent the adhesive force when the heat-resistant adhesive sheet is peeled from the adherend in the 180° direction under the condition of 0.3 m/min. [Example]

以下,藉由實施例來更具體地說明本發明,但本發明不限定於此等實施例。 實施例之玻璃轉移溫度(Tg)、重量平均分子量(Mw)、及莫耳比係藉由上述方法測定及計算而得者。Hereinafter, the present invention will be explained in more detail through examples, but the present invention is not limited to these examples. The glass transition temperature (Tg), weight average molecular weight (Mw), and molar ratio of the examples are measured and calculated by the above methods.

>(甲基)丙烯酸系共聚物之製造> (製造例1) 於具備溫度計、攪拌機、回流冷凝器、及逐次滴加裝置之反應器內,加入丙酮:117質量份、甲苯:51質量份、偶氮二異丁腈(AIBN):0.048質量份。然後,準備含有丙烯酸正丁酯(BA)186.6質量份(相對於(甲基)丙烯酸系共聚物中之構成單元之全部質量為86質量%)、具有氮原子及羥基之為(甲基)丙烯酸系單體的N-羥甲基丙烯醯胺(N-MAM)26.0質量份(相對於(甲基)丙烯酸系共聚物中之構成單元之全部質量為12.0質量%)、及為來自甲基丙烯酸羥基烷基酯之構成單元的甲基丙烯酸-2-羥基乙基酯(2-HEMA)4.3質量份(相對於(甲基)丙烯酸系共聚物中之構成單元之全部質量為2.0質量%)的單體混合溶液385質量份,將其中的97質量份(25質量%)加入至反應裝置中,進行加熱,以回流溫度進行20分鐘回流。 然後,於回流溫度條件下,歷時90分鐘逐次滴加上述單體混合溶液之剩餘的288質量份(75質量%)、丙酮:124質量份、甲苯:96質量份、及AIBN:0.48質量份,再進行75分鐘之聚合反應。 之後,歷時50分鐘逐次滴加甲苯:96質量份與AIBN:1.92質量份之混合液,再進行120分鐘聚合反應。 反應結束後,藉由甲苯稀釋使固體成分濃度成為41質量%,獲得製造例1之(甲基)丙烯酸系共聚物之溶液。 此外,「固體成分」係指從(甲基)丙烯酸系共聚物之溶液除去了溶劑等揮發性成分後之殘渣量的含意。>Manufacturing of (meth)acrylic copolymers> (Manufacturing Example 1) In a reactor equipped with a thermometer, a stirrer, a reflux condenser, and a dropwise addition device, acetone: 117 parts by mass, toluene: 51 parts by mass, and azobisisobutyronitrile (AIBN): 0.048 parts by mass were added. Then, prepare 186.6 parts by mass of n-butyl acrylate (BA) (86% by mass relative to the total mass of the constituent units in the (meth)acrylic copolymer), and (meth)acrylic acid having a nitrogen atom and a hydroxyl group 26.0 parts by mass of N-methylol acrylamide (N-MAM) as a monomer (12.0% by mass relative to the total mass of the constituent units in the (meth)acrylic copolymer), and is derived from methacrylic acid 4.3 parts by mass of 2-hydroxyethyl methacrylate (2-HEMA) as the constituent unit of hydroxyalkyl ester (2.0% by mass relative to the total mass of the constituent units in the (meth)acrylic copolymer) The monomer mixed solution was 385 parts by mass, 97 parts by mass (25% by mass) of the monomer mixture solution was added to the reaction device, heated, and refluxed at the reflux temperature for 20 minutes. Then, under reflux temperature conditions, the remaining 288 parts by mass (75% by mass) of the monomer mixture solution, acetone: 124 parts by mass, toluene: 96 parts by mass, and AIBN: 0.48 parts by mass were gradually added dropwise over 90 minutes, The polymerization reaction was carried out for another 75 minutes. After that, a mixture of toluene: 96 parts by mass and AIBN: 1.92 parts by mass was added dropwise gradually over 50 minutes, and the polymerization reaction was performed for another 120 minutes. After the reaction was completed, the solid content concentration was 41% by mass by diluting with toluene to obtain a solution of the (meth)acrylic copolymer of Production Example 1. In addition, "solid content" means the amount of residue after removing volatile components such as a solvent from a solution of a (meth)acrylic copolymer.

(製造例2~20) 設定成表1所示之單體組成,變更有機溶劑及聚合起始劑之量來調整重量平均分子量,除此以外,以與(甲基)丙烯酸系共聚物1同樣的方式,合成(甲基)丙烯酸系共聚物2~20。 (甲基)丙烯酸系共聚物2~20之單體組成、及重量平均分子量(Mw)表示於表1。(Manufacturing examples 2-20) The monomer composition shown in Table 1 was set, and the amount of organic solvent and polymerization initiator was changed to adjust the weight average molecular weight. Other than that, the (meth)acrylic copolymer 1 was synthesized in the same manner as the (meth)acrylic copolymer 1. ) Acrylic copolymer 2-20. The monomer composition and weight average molecular weight (Mw) of (meth)acrylic copolymers 2-20 are shown in Table 1.

[表1]

Figure 02_image003
[Table 1]
Figure 02_image003

表1中之「-」表示不含有該成分。表1中,羥基組成比率係表示(甲基)丙烯酸系共聚物中之N-羥甲基丙烯醯胺單體之含量(質量%)相對於甲基丙烯酸羥基烷基酯單體之含量(質量%)的比率。 表1中之簡稱係如同下述。 ・2EHA:丙烯酸-2-乙基己酯 ・BA:丙烯酸正丁酯 ・EA:丙烯酸乙酯 ・MA:丙烯酸甲酯 ・DMAEA:丙烯酸二甲基胺基乙酯 ・N-MAM:N-羥甲基丙烯醯胺 ・HEAA:羥基乙基丙烯醯胺 ・2HEMA:甲基丙烯酸-2-羥基乙酯 ・2HBMA:甲基丙烯酸-2-羥基丁酯 ・2HEA:丙烯酸-2-羥基乙酯 ・AA:丙烯酸"-" in Table 1 means that the ingredient is not contained. In Table 1, the hydroxyl composition ratio represents the content (mass %) of the N-methylol acrylamide monomer in the (meth)acrylic copolymer relative to the content (mass) of the hydroxyalkyl methacrylate monomer %)The ratio. The abbreviations in Table 1 are as follows. ・2EHA: 2-ethylhexyl acrylate ・BA: n-butyl acrylate ・EA: Ethyl Acrylate ・MA: Methyl acrylate ・DMAEA: Dimethylaminoethyl acrylate ・N-MAM: N-methylol acrylamide ・HEAA: Hydroxyethyl acrylamide ・2HEMA: 2-hydroxyethyl methacrylate ・2HBMA: 2-hydroxybutyl methacrylate ・2HEA: 2-hydroxyethyl acrylate ・AA: Acrylic

(實施例1) >>黏著劑組成物之製備>> 將製造例1中製備之(甲基)丙烯酸系共聚物1之溶液(固體成分濃度:41質量%)243.9質量份(固體成分換算為100質量份)、作為交聯劑之「Coronate(註冊商標) L-45E(東曹(股)製,二異氰酸甲苯酯(TDI)與三羥甲基丙烷(TMP)之加成物,固體成分濃度:45質量%)6.67質量份(固體成分換算為3.0質量份)混合,充分地進行攪拌獲得黏著劑組成物。使用獲得之黏著劑組成物,依循以下之試驗用耐熱性黏著片之製作方法,製作試驗用黏著片,進行各種試驗。 交聯劑之官能基(異氰酸酯基)之莫耳數相對於(甲基)丙烯酸系共聚物具有之羥基、及N-羥甲基(交聯性官能基)之全部莫耳數之比為0.4。(Example 1) >>Preparation of adhesive composition>> The solution (solid content concentration: 41% by mass) of the (meth)acrylic copolymer 1 prepared in Production Example 1 was 243.9 parts by mass (100 parts by mass in terms of solid content), and "Coronate (registered trademark) as a crosslinking agent ) L-45E (manufactured by Tosoh Co., Ltd., adduct of toluene diisocyanate (TDI) and trimethylolpropane (TMP), solid content: 45% by mass) 6.67 parts by mass (calculated as solid content) (3.0 parts by mass)), mix and stir thoroughly to obtain an adhesive composition. Using the obtained adhesive composition, follow the following method of making heat-resistant adhesive sheets for testing to make test adhesive sheets and perform various tests. The ratio of the molar number of the functional group (isocyanate group) of the crosslinking agent to the total molar number of the hydroxyl group and the N-methylol group (crosslinkable functional group) possessed by the (meth)acrylic copolymer is 0.4 .

>>試驗用耐熱性黏著片之製作>> 使用上述獲得之黏著劑組成物,如以下之方式,製作試驗用黏著片。於聚醯亞胺(PI)片(製品名:kapton(註冊商標),DU PONT-TORAY CO.,LTD.製)上,以乾燥後之塗布量成為10g/m2 之方式塗布黏著劑組成物,藉由熱風循環式乾燥機以100℃乾燥60秒形成黏著劑層。之後,於藉由聚矽氧系脫模劑予以表面保護之脫模薄膜上,以接觸黏著劑層之方式載置PET(聚對苯二甲酸乙二酯)薄膜,藉由加壓軋輥進行壓接使其貼合。之後,於23℃、50%RH之環境下養護1週,獲得試驗用黏著片。>>Production of heat-resistant adhesive sheet for test>> Using the adhesive composition obtained above, the adhesive sheet for test is made as follows. Coat the adhesive composition on a polyimide (PI) sheet (product name: kapton (registered trademark), manufactured by DU PONT-TORAY CO., LTD.) so that the coating amount after drying becomes 10 g/m 2 , The adhesive layer is formed by drying at 100°C for 60 seconds with a hot-air circulating dryer. After that, a PET (polyethylene terephthalate) film is placed on the release film whose surface is protected by a silicone-based release agent in contact with the adhesive layer, and pressed by a pressure roller. Connect to make it fit. After that, it was cured for 1 week in an environment of 23° C. and 50% RH to obtain a test adhesive sheet.

>評價> >>黏著力>> 將試驗用黏著片剪切為25mm×150mm之大小,準備4個試驗用黏著片。 各別將製作之試驗用黏著片之其中一側的脫模薄膜剝離,貼合於電解銅箔(厚度:10μm,製品名:NC-WC,古河電氣工業(股)製)、及聚醯亞胺(PI)片[製品名:kapton(註冊商標),DU PONT-TORAY CO.,LTD.製]。>Evaluation> >>Adhesion>> Cut the test adhesive sheet into a size of 25mm×150mm, and prepare 4 test adhesive sheets. Separate the release film on one side of the produced test adhesive sheet, and paste it on the electrolytic copper foil (thickness: 10μm, product name: NC-WC, manufactured by Furukawa Electric Co., Ltd.), and Polya Amine (PI) tablets [product name: kapton (registered trademark), manufactured by DU PONT-TORAY CO., LTD.].

[初始黏著力(被黏著體:銅箔)] 第1之試驗用黏著片係貼合於銅箔後於23℃、50%RH之環境下放置24小時後,以0.3m/分鐘之條件將試驗用黏著片從銅箔剝離,測定初始之黏著力。[Initial adhesion (adherent body: copper foil)] The first test adhesive sheet is attached to the copper foil and placed in an environment of 23°C and 50%RH for 24 hours, then the test adhesive sheet is peeled from the copper foil at a condition of 0.3m/min to measure the initial adhesion force.

[耐熱試驗後之黏著力(被黏著體:銅箔)] 第2之試驗用黏著片係貼合於銅箔後於23℃、50%RH之環境下放置24小時後,於200℃之環境下放置60分鐘後,再次於23℃、50%RH之環境下放置3小時,以0.3m/分鐘之條件從銅箔剝離試驗用黏著片,測定耐熱試驗後之黏著力。[Adhesion after heat resistance test (Adherent body: copper foil)] The second test adhesive sheet is attached to copper foil and placed in an environment of 23°C and 50%RH for 24 hours, then placed in an environment of 200°C for 60 minutes, and then placed in an environment of 23°C and 50%RH again Leave it for 3 hours, peel off the adhesive sheet for the test from the copper foil at 0.3 m/min, and measure the adhesive force after the heat resistance test.

[初始黏著力(被黏著體:聚醯亞胺)] 第3之試驗用黏著片係貼合於聚醯亞胺後於23℃、50%RH之環境下放置24小時後,以0.3m/分鐘之條件將試驗用黏著片從聚醯亞胺剝離,測定初始之黏著力。[Initial adhesion (adhesive body: polyimide)] The third test adhesive sheet is attached to polyimide and left in an environment of 23°C and 50%RH for 24 hours, and then the test adhesive sheet is peeled from the polyimide at a condition of 0.3m/min. Determine the initial adhesion.

[耐熱試驗後之黏著力(被黏著體:聚醯亞胺)] 第4之試驗用黏著片係貼合於聚醯亞胺後於23℃、50%RH之環境下放置24小時後,於200℃之環境下放置60分鐘後,再次於23℃、50%RH之環境下放置3小時,以0.3m/分鐘之條件將試驗用黏著片從聚醯亞胺剝離,測定耐熱試驗後之黏著力。[Adhesion after heat resistance test (Adhesive body: Polyimide)] The fourth test adhesive sheet is attached to polyimide and placed in an environment of 23°C and 50%RH for 24 hours, then placed in an environment of 200°C for 60 minutes, and then again at 23°C and 50%RH Leave it for 3 hours in the same environment, peel off the test adhesive sheet from the polyimide at 0.3m/min, and measure the adhesive force after the heat resistance test.

初始黏著力、及耐熱試驗後之黏著力係依循以下基準評價。 初始黏著力之評價為A~C時,係抑制從被黏著體之非意圖之浮起及剝離,且從被黏著體之剝離作業性可適當地進行,故為容許範圍內。此外,耐熱試驗後之黏著力之評價為A~C時,係抑制從被黏著體之非意圖之浮起、剝離,且抑制熱處理後之過度的上升,為容許範圍內。 -初始黏著力、及耐熱試驗後之黏著力- A:1.5N/mm以上且未達2.0N/mm。 B:0.9N/mm以上且未達1.5N/mm、或2.0N/mm以上且未達2.5N/mm。 C:0.5N/mm以上且未達0.9N/mm、或2.5N/mm以上且未達3.0N/mm。 D:未達0.5N/mm、或3.0N/mm以上。The initial adhesion and the adhesion after the heat resistance test are evaluated according to the following benchmarks. When the initial adhesive strength is evaluated as A to C, unintentional floating and peeling from the adherend are suppressed, and the peeling workability from the adherend can be performed appropriately, so it is within the allowable range. In addition, when the evaluation of the adhesive force after the heat resistance test is A to C, it is within the allowable range to suppress unintentional floating and peeling from the adherend, and to suppress excessive rise after heat treatment. -Initial adhesion and adhesion after heat resistance test- A: 1.5N/mm or more and less than 2.0N/mm. B: 0.9 N/mm or more and less than 1.5 N/mm, or 2.0 N/mm or more and less than 2.5 N/mm. C: 0.5 N/mm or more and less than 0.9 N/mm, or 2.5 N/mm or more and less than 3.0 N/mm. D: Less than 0.5 N/mm, or 3.0 N/mm or more.

>>耐污染性>> 針對測定耐熱試驗後之黏著力後之聚醯亞胺或銅箔,以目視觀察聚醯亞胺或銅箔表面,依循下述之評價基準,進行耐污染性之評價。 若為A~C則為容許範圍。 A:於聚醯亞胺或銅箔之表面上確認完全沒有殘膠 B:於聚醯亞胺或銅箔之表面之邊緣部可確認到些許之殘膠。 C:於聚醯亞胺或銅箔之表面之邊緣部觀察到有殘膠,但從沒有殘膠之邊緣部向內側5mm~145mm之使用範圍內未觀察到殘膠。 D:於聚醯亞胺或銅箔之表面之從周邊部向內側0mm~150mm之使用範圍內有殘膠。>>Fouling resistance>> For the polyimide or copper foil after the heat resistance test is measured, the surface of the polyimide or copper foil is visually observed, and the contamination resistance is evaluated according to the following evaluation criteria. If it is A to C, it is the allowable range. A: Confirm that there is no residual glue on the surface of polyimide or copper foil B: A little residual glue can be confirmed on the edge of the surface of polyimide or copper foil. C: Glue residue is observed at the edge of the surface of polyimide or copper foil, but no glue residue is observed within the use range of 5mm to 145mm from the edge without glue residue to the inner side. D: There is residual glue on the surface of polyimide or copper foil in the range of 0mm~150mm from the periphery to the inside.

>>抗氧化性>> 針對測定耐熱試驗後之黏著力後的銅箔,以目視觀察銅箔的表面,依循下述評價基準,評價耐氧化性。 若為A~C則為容許範圍。 A:於銅箔確認完全沒有變色(氧化)。 B:於銅箔之邊緣部有確認到些許變色(氧化)。 C:於銅箔之邊緣部有變色(氧化),但於從未變色(氧化)之周邊部向內側5mm~145mm之使用範圍內未確認到變色(氧化)。 D:從銅箔之周邊部向內側0mm~150mm之使用範圍內有變色(氧化)。 -:有明顯的殘膠而難以確認變色。>>Antioxidant>> With respect to the copper foil after measuring the adhesive force after the heat resistance test, the surface of the copper foil was visually observed, and the oxidation resistance was evaluated according to the following evaluation criteria. If it is A to C, it is the allowable range. A: It is confirmed that there is no discoloration (oxidation) at all on the copper foil. B: A slight discoloration (oxidation) was confirmed at the edge of the copper foil. C: There is discoloration (oxidation) at the edge of the copper foil, but no discoloration (oxidation) is confirmed in the use range of 5mm to 145mm inward from the undiscolored (oxidized) peripheral part. D: There is discoloration (oxidation) in the range of 0mm~150mm from the periphery of the copper foil to the inside. -: There is obvious residual glue and it is difficult to confirm the discoloration.

(實施例2~20及比較例1~10) 變更為表2及表3表示之製造例之(甲基)丙烯酸系共聚物及/或交聯劑,除此以外,以與實施例1同樣的方式製備黏著劑組成物,使用該黏著劑組成物各別製作耐熱性黏著片。使用製得之耐熱性黏著片,以與實施例1同樣的方式製作試驗用黏著片,針對試驗用黏著片,以與實施例1同樣的方式進行各評價。結果表示於表2及表3。(Examples 2-20 and Comparative Examples 1-10) Except for changing to the (meth)acrylic copolymer and/or crosslinking agent of the production examples shown in Table 2 and Table 3, an adhesive composition was prepared in the same manner as in Example 1, and the adhesive composition was used Make heat-resistant adhesive sheets individually. Using the obtained heat-resistant adhesive sheet, an adhesive sheet for a test was produced in the same manner as in Example 1, and the adhesive sheet for a test was evaluated in the same manner as in Example 1. The results are shown in Table 2 and Table 3.

[表2]

Figure 02_image005
[Table 2]
Figure 02_image005

[表3]

Figure 02_image007
[table 3]
Figure 02_image007

表2及表3中之簡稱如同下述。此外,表2及表3中之質量份數係固體成分濃度或有效成分之換算值。此外,表2及表3中之「莫耳比」係表示交聯劑之官能基相對於(甲基)丙烯酸系共聚物中之N-羥甲基及羥基之合計莫耳數之莫耳比,莫耳數之比係藉由上述式(3)求得。表2及表3中之「Dry份數」係表示有效成分之換算值。The abbreviations in Table 2 and Table 3 are as follows. In addition, the mass parts in Table 2 and Table 3 are the conversion values of the solid content concentration or the effective ingredient. In addition, the "mole ratio" in Tables 2 and 3 means the mol ratio of the functional group of the crosslinking agent to the total number of moles of the N-methylol and hydroxyl groups in the (meth)acrylic copolymer , The ratio of the number of moles is obtained by the above formula (3). The "Dry parts" in Table 2 and Table 3 represent the converted value of the active ingredient.

・Coronate L45E:商品名(「Coronate」係註冊商標)、二異氰酸甲苯酯(TDI)與三羥甲基丙烷之加成物,固體成分:45質量%,異氰酸酯基之含有率:7.9質量%,異氰酸酯系交聯劑,東曹(股) ・Aluminum Chelate A:商品名,參乙醯丙酮鋁,金屬螯合化合物,Kawaken Fine Chemicals Co., Ltd.)・TAKENATE D-110N:三羥甲基丙烷與二異氰酸二甲苯酯加成物,異氰酸酯系交聯劑,三井化學(股)製 ・Coronate HX:六亞甲基二異氰酸酯之三聚物,異氰酸酯系交聯劑,東曹(股)製・Coronate L45E: Trade name ("Coronate" is a registered trademark), adduct of toluene diisocyanate (TDI) and trimethylolpropane, solid content: 45% by mass, isocyanate group content: 7.9 mass %, isocyanate-based crosslinking agent, Tosoh (shares) ・Aluminum Chelate A: Trade name, aluminum acetone, metal chelate compound, Kawaken Fine Chemicals Co., Ltd.) ・TAKENATE D-110N: Trimethylolpropane and xylene diisocyanate adduct , Isocyanate-based crosslinking agent, manufactured by Mitsui Chemicals Co., Ltd. ・Coronate HX: Trimer of hexamethylene diisocyanate, isocyanate-based crosslinking agent, manufactured by Tosoh Corporation

如同表2及表3之結果所示,可知由實施例1~實施例20之黏著劑組成物所形成之耐熱性黏著片比起藉由比較例1~10之黏著劑組成物所形成之耐熱性黏著片,即使在高溫條件下之熱處理後,從被黏著體剝離時,就被黏著體之污染的抑制而言更為優良。此外,可知由實施例1~實施例20之黏著劑組成物所形成之耐熱性黏著片比起藉由比較例1~10之黏著劑組成物所形成之耐熱性黏著片,對於被黏著體之氧化的抑制也更優良。As shown in the results of Table 2 and Table 3, it can be seen that the heat-resistant adhesive sheet formed from the adhesive composition of Examples 1 to 20 is compared with the heat-resistant adhesive sheet formed from the adhesive composition of Comparative Examples 1 to 10 The adhesive sheet, even after heat treatment under high temperature conditions, peels off from the adherend, it is more excellent in terms of suppression of contamination of the adherend. In addition, it can be seen that the heat-resistant adhesive sheet formed from the adhesive composition of Examples 1 to 20 is more effective than the heat-resistant adhesive sheet formed from the adhesive composition of Comparative Examples 1-10. The suppression of oxidation is also more excellent.

Claims (6)

一種耐熱性黏著片用黏著劑組成物,含有: (甲基)丙烯酸系共聚物,該(甲基)丙烯酸系共聚物含有來自N-羥甲基丙烯醯胺之構成單元、來自甲基丙烯酸羥基烷基酯之構成單元、以及來自(甲基)丙烯酸烷基酯之構成單元,及 交聯劑; 該交聯劑之官能基之莫耳數相對於該(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數的比為0.1以上且1.0以下。An adhesive composition for heat-resistant adhesive sheets, containing: (Meth)acrylic copolymer containing a structural unit derived from N-methylol acrylamide, a structural unit derived from hydroxyalkyl methacrylate, and a (meth)acrylic copolymer The constituent units of alkyl acrylate, and Crosslinking agent The ratio of the number of moles of the functional groups of the crosslinking agent to the total number of moles of the crosslinkable functional groups possessed by the (meth)acrylic copolymer is 0.1 or more and 1.0 or less. 如請求項1之耐熱性黏著片用黏著劑組成物,其中,該(甲基)丙烯酸系共聚物之玻璃轉移溫度為未達-40℃。The adhesive composition for a heat-resistant adhesive sheet of claim 1, wherein the glass transition temperature of the (meth)acrylic copolymer is less than -40°C. 如請求項1或2之耐熱性黏著片用黏著劑組成物,在該(甲基)丙烯酸系共聚物中,該來自N-羥甲基丙烯醯胺之構成單元的含量相對於該來自甲基丙烯酸羥基烷基酯之構成單元之含量的質量比為0.25以上且5.0以下。According to the adhesive composition for a heat-resistant adhesive sheet of claim 1 or 2, in the (meth)acrylic copolymer, the content of the N-methylol acrylamide-derived structural unit is relative to the methyl-derived adhesive composition The mass ratio of the content of the structural unit of the hydroxyalkyl acrylate is 0.25 or more and 5.0 or less. 如請求項1或2之耐熱性黏著片用黏著劑組成物,該交聯劑之官能基之莫耳數相對於該(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數的比為0.2以上且1.0以下。According to the adhesive composition for heat-resistant adhesive sheets of claim 1 or 2, the number of moles of the functional groups of the crosslinking agent is relative to the total number of moles of the crosslinkable functional groups of the (meth)acrylic copolymer The ratio of the numbers is 0.2 or more and 1.0 or less. 如請求項1或2之耐熱性黏著片用黏著劑組成物,在該(甲基)丙烯酸系共聚物中,該來自N-羥甲基丙烯醯胺之構成單元之含量相對於該來自甲基丙烯酸羥基烷基酯之構成單元的質量比為0.25以上且5.0以下, 該交聯劑之官能基之莫耳數相對於該(甲基)丙烯酸系共聚物具有之交聯性官能基之全部莫耳數之比為0.2以上且1.0以下。According to the adhesive composition for a heat-resistant adhesive sheet of claim 1 or 2, in the (meth)acrylic copolymer, the content of the N-methylol acrylamide-derived structural unit is relative to the methyl-derived adhesive composition The mass ratio of the structural units of the hydroxyalkyl acrylate is 0.25 or more and 5.0 or less, The ratio of the number of moles of the functional groups of the crosslinking agent to the total number of moles of the crosslinkable functional groups of the (meth)acrylic copolymer is 0.2 or more and 1.0 or less. 一種耐熱性黏著片,具備黏著劑層,該黏著劑層為如請求項1至5中任一項之耐熱性黏著片用黏著劑組成物之交聯物。A heat-resistant adhesive sheet is provided with an adhesive layer which is a cross-linked product of the adhesive composition for a heat-resistant adhesive sheet according to any one of claims 1 to 5.
TW109108868A 2019-03-20 2020-03-18 Adhesive composition for heat-resistant adhesive sheet, and heat-resistant adhesive sheet TWI829891B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-053374 2019-03-20
JP2019053374A JP7343107B2 (en) 2019-03-20 2019-03-20 Adhesive composition for heat-resistant adhesive sheet and heat-resistant adhesive sheet

Publications (2)

Publication Number Publication Date
TW202041635A true TW202041635A (en) 2020-11-16
TWI829891B TWI829891B (en) 2024-01-21

Family

ID=72557871

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109108868A TWI829891B (en) 2019-03-20 2020-03-18 Adhesive composition for heat-resistant adhesive sheet, and heat-resistant adhesive sheet

Country Status (3)

Country Link
JP (1) JP7343107B2 (en)
CN (1) CN111718674A (en)
TW (1) TWI829891B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116083007A (en) * 2022-11-03 2023-05-09 广东东立新材料科技股份有限公司 Protective pressure-sensitive adhesive for mobile phone glass manufacturing process and preparation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3334899B2 (en) * 1991-09-26 2002-10-15 キヤノン株式会社 Recording head
JP4037592B2 (en) 2000-03-23 2008-01-23 株式会社きもと Thermosetting adhesive sheet for manufacturing reinforced flexible printed circuit board and method for manufacturing reinforced flexible printed circuit board
JP2005029629A (en) 2003-07-09 2005-02-03 Panac Co Ltd Heat-resistant releasable acrylic copolymer composition and adhesive film using the same
JP2005075884A (en) * 2003-08-29 2005-03-24 Panac Co Ltd Removable adhesive film and removable adhesive
JP2005126500A (en) * 2003-10-22 2005-05-19 Panac Co Ltd Heat-resistant peelable adhesive film
JP2006152013A (en) * 2004-11-25 2006-06-15 Teijin Dupont Films Japan Ltd Easy-adhesive polyester film for solar cell back surface protective film and solar cell back surface protective film using the same
CN101580682B (en) * 2008-05-16 2011-04-06 北京高盟燕山科技有限公司 Waterborne compound adhesive and preparation method and application thereof
JP6712838B2 (en) 2013-03-27 2020-06-24 ソマール株式会社 Release sheet for hot press and method for manufacturing flexible printed wiring board using the same
CN107602760B (en) * 2017-08-07 2021-01-05 无锡海特新材料研究院有限公司 Polyacrylate emulsion pressure-sensitive adhesive for electronic protective film, and preparation method and application thereof

Also Published As

Publication number Publication date
JP7343107B2 (en) 2023-09-12
JP2020152840A (en) 2020-09-24
CN111718674A (en) 2020-09-29
TWI829891B (en) 2024-01-21

Similar Documents

Publication Publication Date Title
TWI825392B (en) Adhesive materials, adhesive sheets, flexible laminated components and mobile terminals
TWI585179B (en) Pressure-sensitive adhesive composition for a film used for processing wafer
JP6419626B2 (en) Adhesive composition and adhesive film
TWI848188B (en) Adhesive material, adhesive sheet, flexible laminated component and flexible device
JP6291492B2 (en) Adhesive composition, adhesive film, and article processing method
JP6552433B2 (en) Adhesive composition for protective film and protective film
TWI841611B (en) Protective sheet and laminate
JP2018090799A (en) Adhesive composition, adhesive obtained by crosslinking the same, adhesive for masking film, masking film, adhesive film for transparent electrode layer formation step, tape for semiconductor manufacture step, and method for using masking film
JP2017115078A (en) Adhesive composition, adhesive agent by crosslinking the same, adhesive agent for masking film, adhesive agent for heat resistant adhesive film and heat resistant adhesive film for masking
TWI829891B (en) Adhesive composition for heat-resistant adhesive sheet, and heat-resistant adhesive sheet
JP6885886B2 (en) Adhesive composition and adhesive sheet
JP6943732B2 (en) Adhesive composition for protective film and protective film
JP7638640B2 (en) Reinforcing films, optical and electronic components
JP7294568B2 (en) Adhesive composition for heat-resistant adhesive sheet, heat-resistant adhesive sheet, and laminate
TWI839390B (en) Adhesive composition for polarizing plate and polarizing plate with adhesive layer
JP2019143078A (en) Pressure sensitive adhesive composition, pressure sensitive adhesive obtained by crosslinking the same, pressure sensitive adhesive for masking film, masking film, self-adhesive film for step of forming transparent electrode layer, tape for step of producing semiconductor, method for using masking film
JP7334604B2 (en) Adhesive composition for polarizing plate, polarizing plate with adhesive layer, and in-vehicle display device
CN111548761B (en) Adhesive composition for polarizing plate, polarizing plate with adhesive layer, and vehicle-mounted display device
TWI899301B (en) Reinforcement films, optical components and electronic components
JP6246020B2 (en) Adhesive composition and optical member surface protective film
JP7645057B2 (en) Reinforcing films, optical and electronic components
JP2020158654A (en) Adhesive composition and adhesive sheet
CN121227236A (en) Adhesive compositions for protective films and protective films
TW202336197A (en) Adhesive material and adhesive sheet
TW202444557A (en) Reinforcement film, optical component and electronic component