TW202041475A - Breaking method and breaking method - Google Patents

Abstract

The present invention provides a breaking method capable of easily and well breaking along a scribe line formed on a bonded substrate, and a breaking method applied to the breaking method. The cutting method of the present invention is to separate the substrate 10 formed by bonding the first substrate 11 and the second substrate 12 with the sealing material SL, and includes: the surface 11a of the first substrate 11 is opposed to the sealing material SL The step of forming the first scribe line L1 toward the position; the step of forming the second scribe line L2 on the surface 12a of the second substrate 12 opposite to the sealing material SL; the area containing the first scribe line L1 Press to make the second vertical crack C2 penetrate along the second scribe line L2; and the area of the substrate 10 separated by the first scribe line L1 and the second scribe line L2 to each other in a direction parallel to the substrate 10 The step of separating the substrate 10 along the first scribe line L1 and the second scribe line L2.

Description

Breaking method and breaking method

The present invention relates to a method for breaking a bonded substrate by forming a scribe line, and a method for breaking the bonded substrate applied to the method.

In the past, the breaking of brittle material substrates such as glass substrates was performed by a scribing step in which a scribe line is formed on the surface of the substrate, and a breaking step in which a predetermined force is applied to the surface of the substrate along the formed scribe line. In the scribing step, while pressing the scribing wheel against the surface of the substrate, it moves along a predetermined line.

The following Patent Document 1 describes a rupture method in which the first scribe line formed on the surface of the first substrate and the second scribe line formed on the surface of the second substrate are separated from the first substrate and the second substrate. The substrate formed by the substrate bonding is broken. The second scribe line formed on the surface of the second substrate is formed at the same position as the first scribe line in a plan view. In this breaking method, if an impact is applied to the guide rod placed on the first scribe line toward the first substrate, the second substrate is fractured along the second scribe line. After that, part or all of the area on one side of the boundary with the first scribe line and the second scribe line is supported by the supporting member, and the other side of the boundary with the first scribe line and the second scribe line All the areas are arranged in such a way that they protrude from one end of the supporting member. Then, by pressing the other side area with the breaking rod, the first substrate is broken along the first scribe line. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2017-013239 A

[The problem to be solved by the invention]

In the bonded substrate, the first substrate and the second substrate may be bonded by the sealing material at the fracture position. In this type of substrate, it is difficult for vertical cracks to fully penetrate the substrate along the scribe line in the substrate formed after the scribe line in the first substrate and the second substrate. If the cracking step is performed on the substrate in a state where the penetration of the vertical cracks is insufficient, the edge of the cracked substrate may produce finer cracks or breakage, which may reduce the strength of the substrate. The cracking method of Patent Document 1 refers to the bonded substrate, but it does not disclose the cracking step of the bonded substrate that takes into account the penetration state of the vertical cracks into each substrate. In addition, as in Patent Document 1, if the bonded substrate is broken by pressing it from one direction, the end faces of the substrate may contact each other at the time of the fracture, which may cause a defect in the substrate and other product quality degradation. Especially when at least a part of the product shape includes a curved portion, since the end faces of the substrate in the curved portion are in contact with each other, defects of the substrate may occur, and therefore the cracking method of Patent Document 1 cannot be adopted.

In view of this problem, the object of the present invention is to provide a breaking method capable of easily and well breaking along the scribe line formed on the bonded substrate, and a breaking method applied to the breaking method. [Means to solve the problem]

The first aspect of the present invention relates to a method for separating a substrate formed by bonding a first substrate and a second substrate through a sealing material. The cutting method of this aspect includes: pressing a scribing wheel against a position on the surface of the first substrate facing the sealing material while moving the scribing wheel to form a first substrate on the surface of the first substrate. 1 Scribe line; while pressing the scribing wheel against the position of the surface of the second substrate facing the sealing material, move the scribing wheel to form a second scribing line on the surface of the second substrate ; Press the area including the first scribing line formed on the surface of the first substrate, so that vertical cracks penetrate into the second substrate along the second scribing line; will be formed by the first scribing line and the second scribing The regions of the substrate separated by the scribe lines are pulled apart from each other in a direction parallel to the surface of the substrate, thereby separating the substrate along the first scribe line and the second scribe line.

Regarding the bonded substrate in which the first substrate and the second substrate are bonded with a sealing material, vertical cracks penetrate well in the substrate where the scribe line is formed first, and the vertical crack is difficult to fully penetrate the substrate where the scribe line is formed later. In this regard, with the above-mentioned structure, once the scribe line is formed on the second substrate, a force is applied to the second substrate through the first substrate, whereby the second scribe line formed after the vertical crack penetrates to the second substrate. Substrate. Thereby, the second substrate is in a state where it can be easily separated along the second scribe line. Thereby, the substrate can be easily separated along the first scribe line and the second scribe line.

In addition, deeper vertical cracks can be formed along the first scribe line and the second scribe line in advance, and the areas of the substrate separated by the first scribe line and the second scribe line are pulled to each other in a direction parallel to the surface of the substrate So as to separate the substrate. Therefore, when the substrates are separated, there is no situation where the end surfaces of the substrates are in contact with each other, and there is no need to worry about cracks or breakage of the substrates. Therefore, without reducing the strength of the substrate, it can be finished into high-quality products.

In the dividing method of this aspect, the first scribe line and the second scribe line may form a scribe line including a curve.

With this configuration, vertical cracks can be properly penetrated into both the first scribe line and the second scribe line. Therefore, even when the first scribe line and the second scribe line include a curve, It is also possible to prevent the contact between the end surfaces of the substrate by pulling the substrate away along the first scribe line and the second scribe line, thereby smoothly separating the substrate. Therefore, the breaking method of the above configuration can be applied to the breaking of various substrates.

The breaking method of this aspect can be configured as follows: in the step of infiltrating the vertical cracks into the second substrate, the elastic member is in close contact with the first scribe line, and the area including the first scribe line is Press.

With this configuration, the elastic member is in close contact with the area along the first scribe line, so that the pressing force can be uniformly applied to the entire range of the area. Thereby, it is possible to uniformly apply force to the second scribe line formed on the surface of the second substrate. Thus, in the step of infiltrating the vertical cracks into the second substrate, it is easy to make the vertical cracks penetrate into the second substrate along the second scribe line. Thereby, the substrate can be easily separated along the first scribe line and the second scribe line.

In this case, it may be configured as follows: the fixing member for fixing the elastic member is urged, and the area including the first scribe line is pressed.

With this, the force applied to the fixing member is fully applied to the elastic member, and therefore, the elastic member is uniformly in close contact with the entire area along the first scribe line. Thereby, the pressing force can be uniformly applied to the entire range of the area along the first scribe line, and the second scribe line formed on the surface of the second substrate can be reliably and uniformly applied. This makes it easier for vertical cracks to penetrate into the second substrate along the second scribe line. Thereby, the substrate can be easily separated along the first scribe line and the second scribe line.

The second aspect of the present invention relates to a rupture method, which is formed along a first scribe line formed on the first substrate at a position opposite to the sealing material and formed on the second scribe line after the first scribe line. The second scribe line at the position of the substrate facing the sealing material ruptures the substrate formed by bonding the first substrate and the second substrate with the sealing material. The cracking method of this aspect includes the step of pressing the area including the first scribe line to make the vertical crack penetrate into the second substrate along the second scribe line; and stepping from the first scribe line The area of the substrate separated by the line and the second scribe line is pulled apart in a direction parallel to the surface of the substrate, thereby separating the substrate along the first scribe line and the second scribe line.

According to this structure, the same effect as the first aspect is exerted. [Effects of Invention]

As described above, according to the present invention, it is possible to provide a breaking method capable of easily and well breaking along the scribe line formed on the bonded substrate, and a breaking method applied to the breaking method.

The effect or significance of the present invention will become clearer from the description of the embodiments shown below. However, the embodiment shown below is only an example when implementing the present invention, and the present invention is not limited to what is described in the following embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, X-axis, Y-axis, and Z-axis orthogonal to each other are marked for convenience. The Z axis represents the vertical direction above and below. Hereinafter, above and below mean the positive side of the Z axis and the negative side of the Z axis, respectively.

This embodiment relates to a method of dividing the bonded substrate 10 formed by bonding the first substrate 11 and the second substrate 12 together. Hereinafter, the "bonded substrate 10" is simply referred to as the "substrate 10" in this specification. In addition, in the present embodiment, when there is no special description, "to separate the substrate 10" or "to separate the substrate 10" means to simultaneously separate or separate the first substrate 11 and the second substrate 12.

First, the structure of the scribing device 100 for forming scribing lines on the substrate 10 will be described. In this embodiment, first, after the first scribe line L1 is formed on the surface 11a of the first substrate 11, the second scribe line L2 is formed on the surface 12a of the second substrate 12.

FIG. 1 is a diagram schematically showing the structure of the scribing device 100 of the first embodiment. The scribing device 100 includes a mobile station 101 and a scribing head 120. The moving table 101 is screwed with the ball screw 102. The moving table 101 is supported by a pair of guide rails 103 so as to be movable in the Y-axis direction. The ball screw 102 is rotated by the drive of the motor, whereby the moving table 101 moves along the pair of guide rails 103 in the Y-axis direction.

A motor 104 is provided on the upper surface of the mobile station 101. The motor 104 rotates the placing part 105 located on the upper part on the XY plane and positions it at a predetermined angle. The mounting part 105 which can be rotated horizontally by the motor 104 is equipped with the vacuum suction means which is not shown in figure. The substrate 10 placed on the placing portion 105 is held on the placing portion 105 by the vacuum suction means.

The scribing device 100 is provided with two cameras 106 that photograph the alignment marks formed on the substrate 10 above the substrate 10 placed on the mounting portion 105. In addition, a bridge 107 is bridged on the pillars 108a and 108b so as to straddle the moving table 101 and the placing portion 105 above it.

A rail 109 is installed on the bridge 107. The rail 109 is connected to the scribing head 120 via the moving part 110, and is arranged in such a way that the moving part 110 slides on the rail 109 so that the scribing head 120 moves along the X-axis direction.

When the scribing device 100 is used to form a scribing line on the substrate 10, the holder unit 130 with the scribing wheel 1 is installed on the support 121 of the scribing head 120 first.

Secondly, the scribing device 100 uses a pair of cameras 106 to position the substrate 10. Then, the scribing device 100 moves the scribing head 120 to a predetermined position, and applies a predetermined load to the scribing wheel 1 to make it contact the surface 11 a of the first substrate 11. After that, the scribing device 100 moves the scribing head 120 in the X-axis direction, thereby forming the first scribing line L1 on the surface 11 a of the first substrate 10. Furthermore, the scribing device 100 rotates the mounting portion 105 or moves it in the Y-axis direction as necessary to form the first scribing line L1 in the same manner as in the above case.

When the second scribe line L2 is formed on the surface 12a of the second substrate 12, the substrate 10 is inverted by a reversing mechanism (not shown) so that the surface 12a of the substrate 12 is positioned upward. In this state, the scribing wheel 1 is used to form the second scribing line L2 on the surface 12a of the second substrate 12 in the same manner as described above.

In the above embodiment, the scoring device 100 in which the scoring head 120 moves in the X-axis direction and the placement portion 105 moves and rotates in the Y-axis direction is shown, but the scoring device 100 is the scoring head 120 and the placement portion 105 can be relatively mobile. For example, it may also be the scribing device 100 in which the scribing head 120 is fixed and the mounting portion 105 moves and rotates in the X-axis and Y-axis directions. Moreover, in this case, the camera 106 can be fixed to the scoring head 120.

The substrate cutting method of this embodiment is composed of the following steps: after forming the first scribing line L1 and the second scribing line L2 by the scribing device 100, the second vertical crack C2 is along the second scribing line L2 The step of penetrating into the second substrate 12; and the step of separating the substrate 10 along the first scribe line L1 and the second scribe line L2. Here, the operation of "permeating the second vertical crack C2 into the second substrate 12 along the second scribe line L2" described above is hereinafter referred to as "pre-cracking". In addition, the first vertical crack C1 and the second vertical crack C2 are shown in FIGS. 3(b) and (c).

FIG. 2 is a flowchart showing a method of breaking the substrate 10.

The breaking of the substrate 10 is performed by the following steps: the step of forming the first scribe line L1 on the first substrate 11 (S11); the step of forming the second scribe line L2 on the second substrate 12 (S12); 2 The substrate 12 is pre-fractured (S13); and the step of separating the substrate 10 along the first scribe line L1 and the second scribe line L2 (S14). Wherein, the steps of forming scribe lines in steps S11 and S12 are performed by the above-mentioned scribing device 100.

Next, referring to FIGS. 3(a) to (f), the method of breaking the substrate shown in FIG. 2, especially the steps S13 and S14 of FIG. 2 will be described in detail.

3(a) to (f) are side views schematically showing the process of the method of dividing the substrate 10. Fig. 3(a) is a schematic diagram when the vicinity of the scribed position is viewed from the negative side of the Y-axis, and Fig. 3(b) to (f) are schematic diagrams when the vicinity of the scribed position of the substrate 10 is viewed from the negative side of the X-axis.

3(a) to (c) show the steps of forming a scribe line, which is performed by the scribing device 100 described with reference to FIG. 1. FIG. 3(d) shows the step of pre-fracture of the second substrate 12. 3(e) and (f) show the steps of separating the substrate 10.

In addition, the substrate 10 is configured by bonding the first substrate 11 and the second substrate 12 via a sealing material SL. As such a substrate 10, for example, a color filter (CF) is formed on the first substrate 11 and a thin film transistor (TFT) is formed on the second substrate 12. In this case, the sealing material SL, the first substrate 11, and the second substrate 12 form a liquid crystal injection region R, and liquid crystal is injected into the liquid crystal injection region R.

As the sealing material SL, for example, an adhesive made of a resin material such as epoxy resin can be used. When the sealing material SL is made of ultraviolet curable resin, the first substrate 11 is overlapped on the upper surface of the second substrate 12 with the sealing material SL coated on the surface of the second substrate 12, and then ultraviolet rays are irradiated. Thereby, the sealing material SL is cured, and the first substrate 11 and the second substrate 12 are bonded via the sealing material SL. In addition, the sealing material SL may be composed of thermosetting resin. In this case, the sealing material SL is hardened by heating, and the first substrate 11 and the second substrate 12 are bonded via the sealing material SL. If the sealing material SL is hardened, it has a higher hardness.

As shown in Fig. 3(a), while pressing the scribing wheel 1 against the surface 11a of the first substrate 11, the scribing wheel 1 is moved in the positive direction of the X axis, thereby forming the first scribing line L1. At this time, the scribing wheel 1 is pressed against the position directly above the sealing material SL, and a first scribing line L1 is formed on the surface 11a of the first substrate 11 along the sealing material SL. Thereby, as shown in FIG. 3( b ), the first vertical crack C1 is formed on the first substrate 11 along the first scribe line L1. The first vertical crack C1 penetrates into the first substrate 11 toward the sealing material SL. Its permeability is 70-100%, which is high permeability. Furthermore, this step is equivalent to step S11 in FIG. 2.

Next, the substrate 10 is inverted by a reversing mechanism (not shown) so that the surface 12a of the second substrate 12 is positioned upward. In this state, as illustrated in Figure 3(a), while pressing the scribing wheel 1 against the surface 12a of the second substrate 12, the scribing wheel 1 is moved in the positive direction of the X axis to form a second scribing Underline L2. Thereby, as shown in FIG. 3( c ), the second vertical crack C2 is formed in the second substrate 12 along the second scribe line L2. The second vertical crack C2 penetrates into the second substrate 12 toward the sealing material SL. The penetration of the second vertical crack C2 in the second substrate 12 is much lower than that of the first substrate 11, and the penetration is 15-30%. Furthermore, this step is equivalent to step S12 in FIG. 2.

Next, the second substrate 12 is pre-fractured. Specifically, the substrate 10 is inverted again, and as shown in FIG. 3(d), the surface 11a of the first substrate 11 is positioned upward. Then, the elastic member 13 fixed to the fixing member 14 is placed on the surface 11a of the first substrate 11 so as to cover the area including the first scribe line L1. When the impact member 15 gives the fixing member 14 a force toward the first substrate 11, the second vertical crack C2 formed along the second scribe line L2 penetrates toward the sealing material SL. In FIG. 3(d), the enclosed part is the second vertical crack C2 newly penetrated into the inside of the second substrate 12 by the force imparted by the impact member 15. Furthermore, this step is equivalent to step S13 in FIG. 2.

The elastic member 13 is, for example, rubber or resin. The fixing member 14 is a plate-shaped member having a hardness higher than that of the elastic member 13. The impact member 15 uses a member heavier than the fixing member 14 to move to the fixing member 14 from a position away from the fixing member 14 and collide with the fixing member 14 to apply force to the substrate 10.

In addition, when the second substrate 12 is pre-fractured, the substrate 10 is placed on a mounting table. A buffer material is arranged between the mounting table and the substrate 10. The buffer material is made of paper or rubber, for example.

After the second substrate 12 is pre-fractured, the substrate 10 is separated. Specifically, as shown in FIG. 3( e ), the substrates 10 are pulled apart from each other in a direction parallel to the surface 11 a of the first substrate 11 along the first scribe line L1 and the second scribe line L2. The separation by pulling away can be done manually or mechanically. Thereby, as shown in FIG. 3(f), the separation of the substrate 10 is completed. Furthermore, this step corresponds to step S14. As a result, the bonded substrate 10 is broken.

<Verification> The inventors of the present application have verified the effect when the above-mentioned structured separation method is used. Hereinafter, the verification and verification results will be described with reference to FIGS. 4(a) to 5(d).

In this verification, the substrate 40 formed by bonding the first substrate 41 and the second substrate 42 was used, and the case where the scribe line formed by the first substrate 41 and the second substrate 42 along the sealing material F was curved was performed verification. At this time, circular scribe lines and so-called auxiliary lines H are formed on each of the first substrate 41 and the second substrate 42. For the convenience of description, this circular scribed line is called "product line S".

Here, the auxiliary line H is used to separate the first substrate 41 and the second substrate along the product line S along the product line S that defines the shape of the product obtained by the separation of the substrate 40. 2 substrate 42 and a scribe line formed on the outside of the product line S. When separating the closed-curved products, firstly, the laminated substrate 40 is pulled away along the auxiliary line H to be separated. As a result, an elongated vertical crack is induced from the separated auxiliary line H, and the first vertical crack G1 of the first substrate 41 and the second vertical crack G2 of the second substrate 42 are divided along the product line S. Thereby, it is easy to take out the products defined by the closed curve-shaped product line S.

In addition, the auxiliary lines formed on the first substrate 41 and the auxiliary lines formed on the second substrate 42 are both referred to herein as "auxiliary lines H". The same applies to "Product Line S".

[Verification 1] [condition] A scoring wheel was used to form a scoring line on the surface of the bonded substrate under the following conditions. ・Laminated substrate...The first substrate 0.2 mm The second substrate 0.2 mm ・The shape of the marking line (product line)...round ・Sealing material... WORLD ROCK 723K1 manufactured by Xie Li Chemical Industry Co., Ltd. Thickness 10 μm ・Traveling load…0.06 MPa ・Travel speed…30 mm/sec ・Scribing wheel…Diameter 2.0 mm, angle of tool tip 115 degrees Number of grooves 360, groove depth 3 μm ・Elastic member...Material Rubber ・Plate member...weight 45 g, size 50×50 mm ・Hammer…weight 441 g, diameter 48 mm

The above-mentioned bonded substrate 40 (hereinafter referred to as the substrate 40) is formed on the surface 41a of the first substrate 41 and the surface 42a of the second substrate 42 to form product lines S, respectively. Then, as shown in FIGS. 4( a) and (b ), the elastic member 44 attached to the plate member 43 is placed along the product line S. In this state, the second substrate 42 is pre-fractured by dropping the hammer 45 from above. After that, the substrate 40 is separated along the product line S by the operator's hand.

Furthermore, in this verification, the plate member 43, the elastic member 44, and the hammer 45 in the above conditions correspond to the fixing member 14, the elastic member 13, and the impact member 15 described with reference to FIG. 3(d), respectively.

In the verification 1, the first substrate 41 and the second substrate 42 formed with the product line S and the auxiliary line H as shown in FIG. 4(c) are used. Furthermore, as shown by the dotted line in Figure 4(d), regarding the semicircle on the positive side of the Y axis of the product line S, and the auxiliary line H on the positive side of the Y axis that is in contact with the tangent of the product line S, whether the substrate 40 can be The separation is evaluated. The dotted line in FIG. 4(d) is referred to as the evaluation target product line S1 and the evaluation target auxiliary line H1, respectively.

In the verification 1, the plate member 43 is an opaque one. Furthermore, in verification 1, as shown in FIG. 4(e), the elastic member 44 is only placed on the product line S, and is not placed on the auxiliary line H. Furthermore, in Fig. 4(e), the elastic member 44 is represented by a dotted chain line.

In this state, the hammer 45 is dropped from a predetermined height to the surface of the plate member 43, and the second substrate 42 is pre-cracked. Also, at this time, 8 sheets of dust-free paper with a thickness of about 0.07 mm are stacked under the second substrate 42 as a buffer material, and the hammer 45 is dropped from a height of 20 mm from the surface of the plate member 43.

Then, after pre-fracture of the second substrate 42, the substrate 40 is separated along the product line S.

[Result of Verification 1] After the pre-cracking of the second substrate 42, the substrate 40 is not separated along the evaluation target product line S1 of FIG. 4(d), but after separation along the auxiliary line H, the product line S can be separated. In this case, after the pre-cracking of the second substrate 42, the substrate 40 can be easily separated.

[Verification 2] [condition] In verification 2, the plate member 43 is made transparent. Also, as shown in Figure 5(a), the shape of the auxiliary line H is different from verification 1. In this case, the dashed part of FIG. 5(b) is used as the evaluation target product line S1 and the evaluation target auxiliary line H1.

Verification 2 is also the same as verification 1. The elastic member 44 is placed only on the product line S, and is not placed on the auxiliary line H (see FIG. 4(e)). Other conditions are the same as verification 1.

In this state, the second substrate 42 is pre-fractured by dropping the hammer 45 from a predetermined height to the surface 41 a of the first substrate 41. At this time, 8 sheets of dust-free paper with a thickness of about 0.07 mm are stacked under the second substrate 42 as a buffer material. The height from the surface 41a of the first substrate 41 is 50 mm, 40 mm, 30 mm, and 20 mm. fall.

Then, after pre-fracture of the second substrate 42, the substrate 40 is separated along the product line S.

[Result of Verification 2] The second substrate 42 is pre-fractured by dropping the hammer 45 from any height, and the substrate 40 is not separated along the evaluation target product line S1 in FIG. 5( b ). In this case, after the second substrate 42 is pre-cracked, the evaluation target auxiliary line H1 is separated, and then the substrate 40 is separated along the evaluation target product line S1, whereby the substrate 40 can be separated.

In addition, no cracks other than the vertical cracks formed along the evaluation target auxiliary line H1 and the evaluation target product line S1 were generated in any case.

[Verification 3] [condition] In Verification 1 and Verification 2, the elastic member 44 is placed only on the product line S. In verification 3, the elastic member 44 is also placed on the auxiliary line H. That is, the product line S and the auxiliary line H are pre-cut.

In this case, the shape of the auxiliary line H is shown in Figure 5(a), which is the same auxiliary line H as verification 2. As shown in Figure 5(c), the elastic member 44 is placed on the product line S and the auxiliary line H Line H. Other conditions are the same as verification 1. That is, the plate member 43 is an opaque one. Moreover, FIG. 5(c) is the same as FIG. 4(e), and the elastic member 44 is shown by a dotted chain line.

In this state, the second substrate 42 is pre-cracked by dropping the hammer 45 from a predetermined height onto the surface of the plate member 43. At this time, 8 sheets of dust-free paper with a thickness of about 0.07 mm are stacked under the second substrate 42 as a buffer material, and the hammer 45 is dropped from the height of 20 mm, 15 mm, 10 mm, and 5 mm from the surface of the plate member 43.

Then, after pre-fracture of the second substrate 42, the substrate 40 is separated along the product line S.

[Result of Verification 3] If the hammer 45 is dropped from any height to perform pre-cracking, cracks deviating from a part of the evaluation target auxiliary line H of the substrate 40 are generated. Such cracks do not contribute to the breaking of the substrate 40, and may cause cracks or damage to the product part when the substrate 40 is broken, so it is not a preferable crack.

[Verification 4] [condition] In verification 4, only the elastic member 44 was placed on the auxiliary line H. That is, only the auxiliary wire H is pre-cut.

In this case, the shape of the auxiliary line H is as shown in FIG. 5(a), which is the same as the auxiliary line H of verification 2. As shown in FIG. 5(d), only the elastic member 44 is placed on the auxiliary line H. Other conditions are the same as verification 1. However, a transparent plate member 43 is used.

In this state, 8 sheets of dust-free paper with a thickness of about 0.07 mm are stacked under the second substrate 42 as a buffer material, and the hammer 45 is dropped from a height of 5 mm from the surface of the plate member 43.

After the second substrate 42 is pre-fractured, the substrate 40 is separated along the product line S.

[Result of Verification 4] From the evaluation target auxiliary line H1, cracks are generated inside the product, and the substrate 40 cannot be separated.

[Verification 5] In order to improve the accuracy of pre-fracture, that is, the penetration of the second vertical crack G2 in the second substrate 42, the following verification was performed.

Instead of the substrate 40, pressure sensitive paper is placed on the mounting table, and the elastic member and the plate member are placed on the pressure sensitive paper. At this time, the same transparent plate member 43 and elastic member 44 as the verification 2 were used. Then, the hammer 45 is dropped from a height of 30 mm, 20 mm, and 10 mm from the surface of the plate member 43. At this time, a cylindrical and hollow member (not shown) having a diameter slightly larger than the diameter of the hammer 45 is placed on the plate member 43, and the cylindrical member is used as a guide for the hammer 45. That is, the guide is arranged so that the center of the elastic member is aligned with the center of the guide, the hammer 45 is dropped inside the cylindrical member of the fixed guide, and the hammer 45 collides with the plate member 43. Thus, the shape of the elastic member 44 is transferred to the pressure sensitive paper.

[Result of Verification 5] When the hammer 45 is dropped from a height of 10 mm, the traces of the elastic member 44 transferred to the pressure-sensitive paper are uneven. From this, it is considered that when the hammer 45 is dropped from the height of 10 mm, even if a guide is used, the impact applied from the elastic member 44 to the substrate 40 is not uniform.

When the hammer 45 is dropped from the height of 20 mm and 30 mm, the traces transferred to the elastic member 44 of the pressure sensitive paper are uniformly formed. The reason for this is considered to be that the hammer 45 can be reliably brought into contact with the center of the elastic member 44 by the guide, and the impact can be uniformly applied to the substrate from the elastic member.

[Verification 6] Under the same conditions as in the verification 1, the product line S is formed on the surface 41a of the first substrate 41 and the surface of the second substrate 42. After that, the second substrate 42 is not pre-fractured as in the verifications 1 to 4, and the substrate 40 is separated.

[Result of Verification 6] At the boundary line between the evaluation target auxiliary line H1 and the first substrate 41, a residue called a corner occurs or a crack occurs inside the product line to cause defects such as damage to the substrate, and it is difficult to separate the substrate 40.

[Summary of Verification] According to the results of verification 1 and verification 2 of the separation of the substrate 40 after pre-fracture of the second substrate 42 and verification 6 of the separation of the substrate 40 without pre-fracture of the second substrate 42, it is possible to confirm the bonding substrate In 40, if the second substrate 42 is pre-fractured, the substrate 40 can be separated along the auxiliary line H and the product line S.

Comparing the verification 1 and verification 2 of pre-fracture only on the product line S with verification 3 that also pre-fractured the auxiliary line H, in verification 3, when the substrate 40 was separated, the substrate 40 cracked . From this, it can be confirmed that it is appropriate not to pre-break the auxiliary wire H, but to pre-break only the product line S.

Comparing Verification 1 and Verification 2 for pre-splitting only the product line S with Verification 4 for pre-splitting only the auxiliary line H, in Verification 4, the inside of the product line S also has cracks and cannot be separated . From this, it can be confirmed that it is appropriate not to pre-break the auxiliary wire H, but to pre-break only the product line S.

In verification 1 and verification 2, verification is performed by making the shape of the auxiliary line H different, but after both of them pre-fracture the second substrate 42, the substrate 40 can be separated. Therefore, it is believed that the difference in the shape of the auxiliary line H will not affect the pre-fracture.

If the results of verification 1 and verification 2 are compared, verification 2 using the transparent plate member 43 can easily separate the substrate 40. It is considered that this is because when the elastic member 44 is placed on the product line S, since the plate member 43 is transparent, the elastic member 44 can be placed while confirming the position of the product line S. From this, it is inferred that during pre-fracture, if the elastic member 44 is reliably placed in the area including the product line S, the pre-fracture can be performed well and the substrate 40 can be easily separated.

According to the result of verification 5, it can be confirmed that when the hammer 45 is dropped, if a guide member (a cylindrical member) is used, the hammer 45 can reliably collide with the center of the area including the product line S. Based on this, it is believed that the guide can improve the reproducibility of the collision position of the hammer 45 and can evenly apply force to the substrate 40, so the second vertical crack G2 easily penetrates into the second substrate 42 along the product line S.

<Effects of the implementation form> In the substrate 10 in which the first substrate 11 and the second substrate 12 are bonded via the sealing material SL, the penetration of the second vertical crack C2 of the substrate after the scribe line is formed may be low. In this state, when a predetermined force is applied to the substrate 10 to perform the cracking step, the cross section of the substrate 10 may be cracked or damaged.

In this regard, as shown in FIGS. 2 and 3(a) to (e), in the above configuration, the first scribe line L1 is formed on the surface 11a of the first substrate 11, and the first scribe line L1 is formed on the surface 12a of the second substrate 12. After the second scribe line L2 is formed, the second substrate 12 is pre-fractured. Thereby, the second vertical crack C2 generated in the second substrate 12 can penetrate toward the sealing material SL. Thereby, the second substrate 12 becomes a state that can be easily separated along the second scribe line L2. Thereby, the substrate 10 can be easily separated along the first scribe line L1 and the second scribe line L2.

In addition, when the second substrate 12 is pre-cracked in the above-mentioned manner, the second vertical crack C2 initially generated in the second substrate 12 expands in the thickness direction to become a deeper vertical crack, whereby the substrate 10 Separation. Therefore, when the substrate 10 is separated, there is no need to worry about cracks or damage to the substrate 10. Therefore, the strength of the substrate 10 is not reduced, and can be finished into high-quality products.

Furthermore, as shown in FIG. 3(f), when the substrate 10 is separated, the area of the substrate 10 separated by the first scribe line L1 and the second scribe line L2 is along a direction parallel to the surface 11a of the first substrate 11 Pull away from each other. As a result, there is no situation where the separated cross-sections are in contact with each other, and the ends of the surface of the substrate 10 after being divided are not easily damaged or cracked. Therefore, the strength of the substrate 10 is not reduced, and it can be finished into high-quality products.

Moreover, even when the first scribe line L1 and the second scribe line L2 include curved lines, the substrate 10 can be smoothly separated along the first scribe line L1 and the second scribe line L2.

As shown in FIG. 3(d), when the second substrate 12 is pre-fractured, the elastic member 13 is brought into close contact with the area along the first scribe line L1. Thereby, the impact member 15 can be used to uniformly apply pressing force to the entire range of the area. In addition, the second scribe line L2 formed on the surface 12a of the second substrate 12 can be uniformly applied. Thereby, the second vertical crack C2 generated along the second scribe line L2 at first easily penetrates into the second substrate 12. Thereby, the substrate 10 can be easily separated along the first scribe line L1 and the second scribe line L2.

In addition, the elastic member 13 is fixed to the fixing member 14. Therefore, the elastic member 13 can be fully urged from the fixing member 14 so that the elastic member 13 is uniformly in close contact with the entire area along the first scribe line L1. Thereby, the pressing force can be uniformly applied to the entire range of the area along the first scribe line L1, and the second scribe line L2 formed on the surface of the second substrate 12 can be reliably and uniformly applied. Thereby, the second vertical crack C2 generated along the second scribe line L2 penetrates into the second substrate 12 more easily. Thereby, the substrate 10 can be easily separated along the first scribe line L1 and the second scribe line L2.

Furthermore, in the above-mentioned embodiment, as shown in FIG. 3(c), after the first scribe line L1 is formed on the surface 11a of the first substrate 11, the substrate 10 is reversed, and the surface 12a of the second substrate 12 The second scribe line L2 is formed, but it is not limited to this. For example, it can also be configured as follows: prepare two scribing wheels 1, while using one of the scribing wheels 1 to form the first scribing line L1 on the surface 11a of the first substrate 11, while using the other scribing wheel 1 on the first substrate 11 2 The surface 12a of the substrate 12 forms a second scribe line L2. That is, it may be such a configuration that the first scribe line L1 and the second scribe line L2 are simultaneously formed in parallel.

In this case, if the scribing wheel 1 on the second substrate 12 side is transferred a predetermined distance behind the scribing wheel 1 on the first substrate 11 side, the first scribe line L1 is also formed on the surface 11a of the first substrate 11 Then, a second scribe line L2 is formed on the surface 12a of the second substrate 12. Therefore, the penetration of the second vertical crack C2 generated in the second substrate 12 may become shallow. Therefore, in this case, as in the above-mentioned embodiment, by pre-fracture of the second substrate 12, the substrate 10 can be easily and well separated along the first scribe line L1 and the second scribe line L2 .

In addition, the first scribing line L1 and the second scribing line L2 may be composed of only straight lines, or may include curved lines in a part thereof. In addition, a part of the product shape formed by the first scribe line L1 and the second scribe line L2 may include a recessed portion on the product side.

In addition, the embodiments of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the scope of the patent application.

1: Scribe wheel 10: substrate 11: The first substrate 11a: Surface of the first substrate 12: The second substrate 12a: The surface of the second substrate L1: The first score line L2: 2nd score line 13: Elastic member 14: Fixed component (plate component) 15: Impact member 41: The first substrate 41a: surface 42: The second substrate 42a: surface 43: plate member 44: Elastic member 45: Hammer 100: Scribing device 101: mobile station 102: Ball screw 103: Rail 104: Motor 105: Placement Department 106: Camera 107: Bridge 108a, 108b: pillars 109: Rail 110: Mobile Department 120: Scribe head 121: Support 130: holder unit C1: The first vertical crack C2: The second vertical crack F: Sealing material G1: The first vertical crack G2: 2nd vertical crack H: auxiliary line H1: Evaluation target auxiliary line R: Liquid crystal injection area S: product line S1: Evaluation target product line SL: Sealing material

[Fig. 1] A diagram schematically showing the structure of the scribing device of the embodiment. [Figure 2] is a flow chart showing the breaking method of the embodiment. [Figure 3] (a) to (f) are side views schematically showing the process of the breaking method of the embodiment. [Figure 4] (a) ~ (e) are schematic diagrams for explaining the verification of the breaking method of the embodiment. [Figure 5] (a) ~ (d) are schematic diagrams for explaining the verification of the breaking method of the embodiment.

1: Scribe wheel

10: substrate

11: The first substrate

11a: Surface of the first substrate

12: The second substrate

12a: The surface of the second substrate

13: Elastic member

14: Fixed member (plate member)

15: Impact member

C1: The first vertical crack

C2: The second vertical crack

L1: The first score line

L2: 2nd score line

R: Liquid crystal injection area

SL: Sealing material

Claims (5)

A method for breaking apart a substrate formed by bonding a first substrate and a second substrate through a sealing material, and is characterized in that it comprises: The step of moving the scoring wheel while pressing the scoring wheel against the position of the surface of the first substrate opposite to the sealing material to form a first scoring line on the surface of the first substrate; The step of moving the scoring wheel while pressing the scoring wheel against the position of the surface of the second substrate opposite to the sealing material to form a second scoring line on the surface of the second substrate; A step of pressing a region including the first scribe line formed on the surface of the first substrate to make a vertical crack penetrate into the second substrate along the second scribe line; and The areas of the substrate separated by the first scribe line and the second scribe line are pulled apart from each other in a direction parallel to the surface of the substrate, thereby separating the areas along the first scribe line and the second scribe line The above-mentioned substrate separation step. Such as the breaking method of claim 1, in which, The first scribe line and the second scribe line are scribe lines including curved lines. Such as the breaking method of claim 1 or 2, where, In the step of allowing vertical cracks to penetrate into the second substrate, the elastic member is brought into close contact with the first scribe line, and the area including the first scribe line is pressed. Such as the breaking method of claim 3, where: A force is applied to the fixing member for fixing the elastic member, and the area including the first scribe line is pressed. A rupture method, which is formed along a first scribe line formed on a first substrate at a position opposite to the sealing material and a second substrate formed after the first scribe line at a position opposite to the sealing material The second scribe line breaks the substrate formed by bonding the first substrate and the second substrate through the sealing material, and is characterized in that it includes: The step of pressing the area containing the first scribe line to make the vertical crack penetrate into the second substrate along the second scribe line; and The areas of the substrate separated by the first scribe line and the second scribe line are pulled apart from each other in a direction parallel to the surface of the substrate, thereby separating the areas along the first scribe line and the second scribe line The above-mentioned substrate separation step.

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