TW202033974A - Inspecting device and its socket - Google Patents

Abstract

A socket includes a base body, a wiring board, a capacitive element and two adjacent probe pins. A chip-receiving recess is formed on a top surface of the base body. The wiring board is disposed inside the base body. The two probe pins insert inside the base body and pass through the wiring board, respectively. The capacitor element is soldered on the wiring boards and electrically connected to the probe pins through the wiring board. The probe pins are a power probe and a ground probe, respectively.

Description

Detection device and probe holder

The present invention relates to a detection device, in particular to a detection device capable of improving the distance between a capacitive element and an element to be measured.

Generally speaking, after the semiconductor wafer is manufactured, a final test (FT, Final Test) is performed on the semiconductor wafer to ensure the quality of the semiconductor wafer when it is shipped. During electrical testing, a plurality of probes of a testing device are used to individually touch the conductive contacts of each semiconductor chip, so as to screen out defective semiconductor chips.

In the above-mentioned final test, in order to maintain the integrity of the power supply and the signal, capacitive elements, such as decoupling capacitors or bypass capacitors, are usually installed on the test device's carrier to compensate for transient voltage drops. And maintain the voltage level.

Therefore, how to make the capacitive element show the maximum efficiency to ensure good power integrity quality is a topic that needs to be broken through in semiconductor testing technology.

An embodiment of the present invention provides a detection device. The detection device includes a carrier board, a chip accommodating part, a wiring board, a plurality of retractable probes and a plurality of capacitance elements. The chip accommodating part is used for holding a semiconductor chip. The wiring board is located between the carrier board and the chip accommodating part. These telescopic probes pass through the wiring board in parallel. Each telescopic probe is used to connect the semiconductor chip and the carrier. These capacitive elements are distributed on the wiring board. Each capacitive element is electrically connected to any two adjacent telescopic probes through the wiring board, and the two telescopic probes are respectively used to connect a power contact and a ground contact of the semiconductor chip.

According to one or more embodiments of the present invention, in the aforementioned detection device, the detection device further includes a probe holder. The probe base includes a top surface and a bottom surface. The top surface is arranged opposite to the bottom surface. The bottom surface is located on the carrier board, and the wafer accommodating portion is a wafer groove formed on the top surface. The wiring board is located in the probe base, which is closer to the top surface of the probe base than the bottom surface of the probe base, and the telescopic probe is located in the probe base in parallel.

According to one or more embodiments of the present invention, in the above-mentioned detection device, the wiring board includes a board body, a plurality of through holes and a plurality of conductive pads. The board has a first surface and a second surface opposite to each other. The first surface faces the wafer accommodating part. Each through hole penetrates the board body and connects the first surface and the second surface to accommodate one of the telescopic probes. These conductive pads are located on the first side of the board. Each conductive pad surrounds one of the through holes and is electrically connected to one of the telescopic probes.

According to one or more embodiments of the present invention, in the above-mentioned detection device, the wiring board further includes a plurality of conductive wear-resistant layers. The conductive wear-resistant layers are respectively located in the through holes, and each conductive wear-resistant layer surrounds and contacts one of the telescopic probes.

According to one or more embodiments of the present invention, in the above-mentioned detection device, each conductive wear-resistant layer extends beyond the corresponding through hole and covers the corresponding conductive pad.

According to one or more embodiments of the present invention, in the above-mentioned detection device, the wiring board further includes a plurality of conductive adhesives. Each conductive adhesive attaches one of the conductive wear-resistant layers to the board, and is electrically connected to one of the conductive pads and one of the conductive wear-resistant layers.

According to one or more embodiments of the present invention, in the aforementioned detection device, each telescopic probe includes a stationary needle body, a movable needle body and a spring. One end of the stationary needle body extends to the carrier board, and the other end has a groove. The movable needle body is telescopically located in the groove and one of the through holes, and contacts one of the conductive wear-resistant layers. The spring is located in the groove and connects the stationary needle body and the movable needle body. One of the capacitor elements is located between any two adjacent movable needle bodies.

According to one or more embodiments of the present invention, in the aforementioned detection device, each capacitive element is interposed between the aforementioned two retractable probes.

Another embodiment of the present invention provides a probe holder. The probe holder includes a bearing seat, a wiring board, a capacitive element, a power probe and a ground probe. The bearing includes a top surface and a bottom surface which are arranged oppositely. The top face has a chip accommodating part. The distribution board is located inside the socket. The power probe is located inside the socket and passes through the wiring board. The ground probe is located inside the socket, passes through the wiring board, and is the probe closest to the power probe. The capacitive element is welded on the wiring board, located on one side of the power probe and the ground probe, and is electrically connected to the power probe and the ground probe through the wiring board.

According to one or more embodiments of the present invention, in the above-mentioned probe holder, the wiring board includes a board, a first through hole, a second through hole, and a first guide The electric pad and a second conductive pad. The board has a first surface and a second surface opposite to each other. The first side faces the accommodating part. The first through hole penetrates the board body and connects the first surface and the second surface to accommodate the power probe. The first conductive pad is located on the first surface, surrounds the first through hole, and is electrically connected to the power probe. The second through hole penetrates the board body and connects the first surface and the second surface to accommodate the ground probe. The second conductive pad is located on the first surface, surrounds the second through hole, and is electrically connected to the ground probe.

According to one or more embodiments of the present invention, in the above-mentioned probe holder, the wiring board further includes a first conductive wear-resistant layer and a second conductive wear-resistant layer. The first conductive wear-resistant layer is located in the first through hole, surrounds and contacts the power probe. The second conductive wear-resistant layer is located in the second through hole, surrounds and contacts the ground probe.

According to one or more embodiments of the present invention, in the above-mentioned probe holder, the first conductive wear-resistant layer is located on the inner wall of the first conductive pad and the first through hole, and the second conductive wear-resistant layer is located on the second conductive pad And on the inner wall of the second through hole.

According to one or more embodiments of the present invention, in the above-mentioned probe holder, the wiring board further includes a first conductive adhesive and a second conductive adhesive. The first conductive adhesive attaches the first conductive wear-resistant layer to the board and electrically connects the first conductive pad and the first conductive wear-resistant layer. The second conductive adhesive attaches the second conductive wear-resistant layer to the board and electrically connects the second conductive pad and the second conductive wear-resistant layer.

According to one or more embodiments of the present invention, in the above-mentioned probe holder, the power probe includes a first stationary needle body, a first movable needle body and a first spring. One end of the first stationary needle body has a first groove. The first movable needle body is telescopically located in the first groove and the first through hole, and contacts the first conductive wear-resistant layer. The first spring is located in the first groove and connects the first stationary needle body and the first movable needle body.

According to one or more embodiments of the present invention, the ground probe includes a second stationary needle body, a second movable needle body and a second spring. One end of the second stationary needle body has a second groove. The second movable needle body is telescopically located in the second groove and the second through hole, and contacts the second conductive wear-resistant layer. The second spring is located in the second groove and connects the second stationary needle body and the second movable needle body. The capacitance element is located between the first movable needle body and the second movable needle body.

According to one or more embodiments of the present invention, the capacitive element is closer to the top surface of the socket than the bottom surface of the socket.

In this way, through the above-mentioned structure of integrating the capacitor element into the probe layer, the distance between the capacitor element and the semiconductor chip is shortened, which not only provides reliable signal integrity, but also reduces the maintenance difficulty of the capacitor element.

The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

10‧‧‧Detection device

100‧‧‧Carrier Board

110‧‧‧Contact

200‧‧‧Probe holder

210‧‧‧Seat

211‧‧‧Top surface

212‧‧‧Bottom

220‧‧‧Internal space

230‧‧‧Cylindrical slot

240‧‧‧Chip accommodating part

241‧‧‧chip slot

300‧‧‧Wiring board

310‧‧‧Board

311‧‧‧The first side

312‧‧‧Second side

321‧‧‧First through hole

322‧‧‧First conductive pad

323‧‧‧First conductive wear-resistant layer

324‧‧‧The first conductive adhesive

325‧‧‧First trace

331‧‧‧Second through hole

332‧‧‧Second conductive pad

333‧‧‧Second conductive wear-resistant layer

334‧‧‧Second conductive adhesive

335‧‧‧Second trace

400‧‧‧Retractable Probe

400A‧‧‧Power Probe

410‧‧‧The first stationary needle

411‧‧‧First groove

412‧‧‧First lower needle end

420‧‧‧The first movable needle

421‧‧‧First upper needle end

430‧‧‧First spring

400B‧‧‧Ground probe

440‧‧‧Second stationary needle

441‧‧‧Second groove

442‧‧‧Second lower needle end

450‧‧‧Second movable needle

451‧‧‧Second upper needle end

460‧‧‧Second spring

500‧‧‧Capacitor element

600‧‧‧Semiconductor chip

610‧‧‧Contact

610A‧‧‧Power contact

610B‧‧‧Ground contact

AA‧‧‧line segment

Z‧‧‧Interval

In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and understandable, the description of the accompanying drawings is as follows: Figure 1 is a schematic diagram of a detection device according to an embodiment of the present invention; Figure 2 is A top view of a wiring board according to an embodiment of the invention; Fig. 3 is a cross-sectional view taken along line AA in Fig. 2; and Fig. 4 is a use operation diagram of Fig. 3.

Hereinafter, a plurality of embodiments of the present invention will be disclosed in drawings. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in the embodiment of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings.

Figure 1 is a schematic diagram of a detection device 10 according to an embodiment of the present invention. As shown in FIG. 1, the detection device 10 is used to detect an object to be tested, and the object to be tested is, for example, a semiconductor chip 600. The detection device 10 includes a carrier board 100, a wafer accommodating part 240, a wiring board 300, a plurality of retractable probes 400 and a plurality of capacitive elements 500. The wafer accommodating portion 240 is used to hold a semiconductor wafer 600. The wiring board 300 is located between the carrier board 100 and the chip accommodating part 240. These telescopic probes 400 pass through the wiring board 300 in parallel. One end of each telescopic probe 400 is connected to a contact 110 of the carrier board 100, and the other end is connected to the chip accommodating portion 240 for abutting against a contact 610 (such as a solder ball or a bonding pad) of the semiconductor chip 600. The capacitive elements 500 are distributed on the wiring board 300, and each capacitive element 500 is electrically connected to any two adjacent telescopic probes 400 through the wiring of the wiring board 300. For example, the capacitive element 500 is located between any two adjacent telescopic probes 400.

It should be understood that the two adjacent telescopic probes 400 are respectively used to abut one of the power contacts 610A and one of the ground contacts 610B of the semiconductor chip 600 to respectively transmit the power signal and the ground signal. Therefore, the adjacent telescopic probes 400 are referred to as power probe 400A and ground probe 400B in the following.

So, because this embodiment will be used as a decoupling capacitor (Decoupling Capacitor) The capacitive element 500 is integrated into the probe layer (that is, the probe position), thereby shortening the distance between the capacitive element 500 and the semiconductor chip 600, thereby reducing the phenomenon of power interference, not only providing more reliable signal integrity It can reduce the maintenance difficulty of the capacitor element 500.

More specifically, in this embodiment, the detection device 10 further includes a probe holder 200. The probe holder 200 includes a holder 210. The socket 210 has a top surface 211 and a bottom surface 212 opposite to each other. The bottom surface 212 is located on the carrier board 100, and the wafer accommodating portion 240 is, for example, a wafer groove 241 recessed on the top surface 211 for placing the aforementioned semiconductor wafer 600. The wiring board 300 is located in the probe holder 200 and inside the socket 210. Compared with the bottom surface 212 of the probe holder 200, the position of the wiring board 300 (ie, the capacitive element 500) is closer to the top surface 211 of the probe holder 200. These telescopic probes 400 are located side by side inside the socket 210 and pass through the wiring board 300 parallel to each other. However, the present invention is not limited to the position of the wiring board 300 and the retractable probe 400. For example, the probe base 200 has an internal space 220 and a plurality of cylindrical grooves 230 therein. The columnar grooves 230 are parallel to each other and connect to the internal space 220. The wiring board 300 is fixed in the internal space 220, and the telescopic probes 400 are fixed in the cylindrical groove 230 respectively.

However, the present invention is not limited to this. In other embodiments, the detection device 10 may omit the probe holder 200, so that any frame is used as the wafer accommodating portion 240 for carrying the semiconductor wafer 600; alternatively, the wiring board 300 may also be injection molded It is buried in the probe holder 200 during the procedure.

FIG. 2 is a top view of a wiring board 300 according to an embodiment of the invention. Figure 3 is a cross-sectional view of Figure 2 taken along line AA. As shown in Figure 2, the capacitive element 500 is not located between the power probe 400A and the ground probe 400B, and It is located on the same side of the power probe 400A and the ground probe 400B. Specifically, when the four retractable probes 400 in FIG. 2 can surround and define a compartment Z, the capacitive element 500 is at least located in the compartment Z adjacent to the power probe 400A and the ground probe 400B.

As shown in FIGS. 2 and 3, the wiring board 300 includes a board 310, a plurality of through holes (such as the first through holes 321 and the second through holes 331, FIG. 3) and a plurality of conductive pads (such as the A conductive pad 322 and a second conductive pad 332, Figs. 2 and 3). The board 310 has a first surface 311 and a second surface 312 opposite to each other. The first surface 311 faces the wafer receiving portion 240 (FIG. 1). For example, the plate body 310 is a thin plate with a thickness in the range of 0.15 to 0.25 mm, for example. The first through hole 321 penetrates the board 310 and connects the first surface 311 and the second surface 312 to accommodate the power probe 400A. The first conductive pad 322 is located on the first surface 311, surrounds the first through hole 321, and is electrically connected to the power probe 400A. The second through hole 331 penetrates the board 310 and connects the first surface 311 and the second surface 312 to receive the ground probe 400B. The second conductive pad 332 is located on the first surface 311, surrounds the second through hole 331, and is electrically connected to the ground probe 400B. For example, the first conductive pad 322 and the second conductive pad 332 are ring-shaped, and include silver, copper or alloys thereof, or common highly conductive materials such as copper, nickel, or gold.

As shown in FIG. 3, the power probe 400A is located in the first through hole 321 and is electrically connected to the first conductive pad 322. The power probe 400A is, for example, a retractable coaxial elastic needle. The ground probe 400B is located in the second through hole 331 and is electrically connected to the second conductive pad 332. The ground probe 400B is, for example, a retractable coaxial elastic needle. Therefore, one of the capacitive elements 500 is electrically connected to the power probe through the corresponding first conductive pad 322, second conductive pad 332, first trace 325, and second trace 335, respectively 400A and ground probe 400B.

More specifically, the power probe 400A includes a first stationary needle body 410, a first movable needle body 420 and a first spring 430. One end of the first stationary needle body 410 has a first groove 411, and the other end has a first lower needle end 412. One end of the first movable needle body 420 is telescopically located in the first groove 411 and the first through hole 321 and is electrically connected to the first conductive pad 322, and the other end has a first upper needle end 421. The first upper pin end 421 is used to abut the power contact 610A of the semiconductor chip 600. The first spring 430 is located in the first groove 411 and connects the first stationary needle body 410 and the first movable needle body 420. The ground probe 400B includes a second stationary needle 440, a second movable needle 450 and a second spring 460. One end of the second stationary needle body 440 has a second groove 441, and the other end has a second lower needle end 442. One end of the second movable needle 450 is telescopically located in the second groove 441 and the second through hole 331 and is electrically connected to the second conductive pad 332, and the other end has a second upper needle end 451. The second upper pin end 451 is used to abut the ground contact 610B of the semiconductor chip 600. The second spring 460 is located in the second groove 441 and connects the second stationary needle 440 and the second movable needle 450.

Figure 4 is the operation diagram of Figure 3. Thus, as shown in FIG. 4, when the semiconductor chip 600 is placed in the chip accommodating portion 240 and the power probe 400A and the ground probe 400B are pressed downward, the power contact 610A of the semiconductor chip 600 is connected to the ground The contact 610B respectively presses down the first movable needle body 420 and the second movable needle body 450, so that the first movable needle body 420 can be retracted downwardly into the first groove 411 in the first through hole 321, The second movable needle 450 can be retracted downwardly into the second groove 441 in the second through hole 331 to perform a corresponding test action. On the contrary, when the semiconductor wafer 600 leaves the wafer accommodating part 240 At this time, the first spring 430 pushes the first movable needle body 420 upward in the first through hole 321 back to the original position, and the second spring 460 pushes the second movable needle body 450 into the second through hole 331 Push it back up to its original position.

In addition, the aforementioned wiring board 300 further includes a plurality of conductive wear resistant layers (for example, the first conductive wear resistant layer 323 and the second conductive wear resistant layer 333, FIG. 3). The first conductive wear-resistant layer 323 is located on the inner wall of the first through hole 321, and the first conductive wear-resistant layer 323 surrounds and contacts the power probe 400A. More specifically, the first conductive wear-resistant layer 323 contacts the first movable needle body 420 of the power probe 400A. The first conductive wear-resistant layer 323 is located on the inner walls of the first conductive pad 322 and the first through hole 321, which means that the first conductive wear-resistant layer 323 is not only located on the first conductive pad 322, but also the first conductive wear-resistant layer 323 It extends from the first through hole 321 to the first conductive pad 322 and covers the first conductive pad 322. For example, the first conductive adhesive 324 attaches the first conductive wear-resistant layer 323 to the board 310, and electrically connects the first conductive pad 322 and the first conductive wear-resistant layer 323, so that the first conductive wear-resistant layer 323 penetrates The first conductive glue 324 is formed on the inner wall of the first through hole 321 and the first conductive pad 322. The first conductive glue 324 is, for example, conductive silver glue.

The second conductive wear-resistant layer 333 is located on the inner wall of the second through hole 331, and the second conductive wear-resistant layer 333 surrounds and contacts the ground probe 400B. More specifically, the second conductive wear-resistant layer 333 contacts the second movable needle body 450 of the ground probe 400B. The second conductive wear-resistant layer 333 is located on the inner walls of the second conductive pad 332 and the second through hole 331, which means that the second conductive wear-resistant layer 333 is not only located on the second conductive pad 332, but also the second conductive wear-resistant layer 333 It extends from the second through hole 331 to the second conductive pad 332 and covers the second conductive pad 332. For example, the second conductive adhesive 334 attaches the second conductive wear-resistant layer 333 to the board 310 and is electrically connected to the second conductive The electrical pad 332 and the second conductive wear-resistant layer 333 make the second conductive wear-resistant layer 333 formed on the inner wall of the second through hole 331 and the second conductive pad 332 through the second conductive adhesive 334. The second conductive glue 334 is, for example, a conductive silver glue.

For example, the first conductive wear-resistant layer 323 and the second conductive wear-resistant layer 333 are ring-shaped respectively, and the first conductive wear-resistant layer 323 and the second conductive wear-resistant layer 333 respectively include, for example, silver graphite alloy. Silver graphite alloy is a silver-based binary alloy containing graphite components. It has good electrical conductivity, excellent wear resistance and self-lubricity, low contact resistance and high stability. The silver-graphite alloy is, for example, formed by uniformly mixing silver powder and graphite powder, then pressing and sintering.

Thus, as shown in Figure 4, since the first through hole 321 and the second through hole 331 are respectively provided with a first conductive wear-resistant layer 323 and a second conductive wear-resistant layer 333, even if the first movable needle is pressed and released multiple times The body 420 and the second movable needle body 450 still do not damage the wiring board 300, and thus avoid shortening the service life of the wiring board 300.

In addition, in the foregoing embodiments, the capacitor elements 500 are multilayer ceramic capacitors (Multilayer Ceramic Capacitor, MLCC), and their volume is 0.25 x 0.125 x 0.125 mm, or 0.4 x 0.2 x 0.2 mm, and their rated The voltage is in the range of 6.3 to 25 volts (V). The capacitance value is in the range of 0.2 to 10,000 picofarads. However, the present invention is not limited to this. In other embodiments, the capacitive element 500 may also be a parasitic capacitor, a capacitor with interdigitated electrodes, or any other capacitor formed with at least one patterned conductive electrode.

Finally, the various embodiments disclosed above are not intended to limit the present invention. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the present invention, and can be protected in this invention. Inventing. therefore The scope of protection of the present invention shall be subject to those defined by the attached patent scope.

10‧‧‧Detection device

100‧‧‧Carrier Board

110‧‧‧Contact

200‧‧‧Probe holder

210‧‧‧Seat

211‧‧‧Top surface

212‧‧‧Bottom

220‧‧‧Internal space

230‧‧‧Cylindrical slot

240‧‧‧Chip accommodating part

241‧‧‧chip slot

300‧‧‧Wiring board

400‧‧‧Retractable Probe

500‧‧‧Capacitor element

600‧‧‧Semiconductor chip

610‧‧‧Contact

610A‧‧‧Power contact

610B‧‧‧Ground contact

Claims (16)

A detection device comprising: a carrier board; a wafer accommodating part for holding a semiconductor chip; a wiring board located between the carrier board and the wafer accommodating part; a plurality of telescopic probes passing through in parallel The wiring board, each of the telescopic probes is used to connect the semiconductor chip and the carrier board; and a plurality of capacitive elements are distributed on the wiring board, wherein each of the capacitive elements is electrically connected to any two through the wiring board The two adjacent telescopic probes are respectively used for connecting a power contact and a ground contact of the semiconductor chip. The inspection device according to claim 1, further comprising: a probe holder including a top surface and a bottom surface, the top surface and the bottom surface are disposed oppositely, the bottom surface is located on the carrier board, and the chip accommodating portion is the A chip groove is formed on the top surface, wherein the wiring board is located in the probe base, and is closer to the top surface of the probe base than the bottom surface of the probe base, and the telescopic probes are located in parallel on the probe base. Inside the needle seat. The inspection device according to claim 1, wherein the wiring board comprises: a board body having a first surface and a second surface opposed to each other, the first surface facing the chip accommodating part; a plurality of through holes, each One of the through holes penetrates the plate body and connects the first Surface and the second surface to accommodate one of the telescopic probes; and a plurality of conductive pads located on the first surface of the board, each of the conductive pads surrounds one of the through holes, And electrically connected to one of the telescopic probes. The detection device according to claim 3, wherein the wiring board further comprises: a plurality of conductive wear-resistant layers respectively located in the through holes and surrounding and contacting the telescopic probes. The detection device according to claim 4, wherein each of the conductive wear-resistant layers further extends out of the corresponding through hole, and covers the corresponding conductive pad. The detection device according to claim 4, wherein the wiring board further comprises: a plurality of conductive adhesives, each of the conductive adhesives attaches one of the conductive wear resistant layers to the board, and electrically connects the conductive adhesives One of the conductive pads and one of the conductive wear-resistant layers. The detection device according to claim 4, wherein each of the telescopic probes includes: a stationary needle body, one end of the stationary needle body extends to the carrier plate, and the other end of the stationary needle body has a groove; and a movable needle body, Telescopically located in the groove and one of the through holes, and contacting one of the conductive wear-resistant layers; and A spring is located in the groove and connects the stationary needle body and the movable needle body, wherein one of the capacitive elements is located between any two adjacent movable needle bodies. The detection device according to claim 1, wherein each of the capacitive elements is between the two adjacent telescopic probes. A probe holder includes: a holder, including a top surface and a bottom surface that are arranged oppositely, the top surface has a chip accommodating part; a wiring board located inside the holder; a power probe located inside the holder Inside the socket and pass through the wiring board; a grounding probe located inside the socket, passing through the wiring board, and being the probe closest to the power probe; and a capacitive element soldered to the wiring board The upper part is located on one side of the power probe and the ground probe, and is electrically connected to the power probe and the ground probe through the wiring board. The probe holder according to claim 9, wherein the wiring board comprises: a board body having a first surface and a second surface opposed to each other, the first surface facing the chip accommodating portion; and a first through hole , Penetrate the board body and connect the first surface and the second surface to accommodate the power probe; a second through hole penetrates the board body and connects the first surface and the second surface, To accommodate the ground probe; a first conductive pad located on the first surface, surrounding the first through hole, and electrically connected to the power probe; and a second conductive pad located on the first surface, surrounding the The second through hole is electrically connected to the ground probe. The probe holder according to claim 10, wherein the wiring board further comprises: a first conductive wear-resistant layer located in the first through hole, surrounding and in contact with the power probe; and a second conductive wear-resistant layer , Located in the second through hole, surrounding and contacting the ground probe. The probe holder according to claim 11, wherein the first conductive wear-resistant layer is located on the inner wall of the first conductive pad and the first through hole, and the second conductive wear-resistant layer is located on the second conductive pad and On the inner wall of the second through hole. The probe holder according to claim 11, wherein the wiring board further comprises: a first conductive adhesive, attaching the first conductive wear-resistant layer to the board, and electrically connecting the first conductive pad and the first conductive pad A conductive wear-resistant layer; and a second conductive adhesive. The second conductive wear-resistant layer is attached to the board and electrically connected to the second conductive pad and the second conductive wear-resistant layer. The probe holder according to claim 11, wherein the power probe The needle includes: a first stationary needle body with a first groove at one end of the first stationary needle body; a first movable needle body telescopically located in the first groove and the first through hole, and Contacting the first conductive wear-resistant layer; and a first spring, located in the first groove, connecting the first stationary needle body and the first movable needle body. The probe holder according to claim 14, wherein the ground probe comprises: a second stationary needle body, one end of the second stationary needle body has a second groove; a second movable needle body, telescopically Located in the second groove and the second through hole, and in contact with the second conductive wear-resistant layer; and a second spring, located in the second groove, connecting the second stationary needle body and the second movable The needle body, wherein the capacitance element is located between the first movable needle body and the second movable needle body. The probe holder according to claim 9, wherein the capacitive element is closer to the top surface of the holder than the bottom surface of the holder.

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