TW202008801A - Expandable signal collection or transmission module capable of assembling (expanding) an array of a microphone and/or a speaker, or adjusting an area of the array of the microphone and/or the speaker - Google Patents
Expandable signal collection or transmission module capable of assembling (expanding) an array of a microphone and/or a speaker, or adjusting an area of the array of the microphone and/or the speaker Download PDFInfo
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Abstract
Description
本發明係一種訊號收集或發送模組,尤指一種可擴充式訊號收集或發送模組。 The invention is a signal collection or transmission module, especially an expandable signal collection or transmission module.
常見聲源偵測(偵測方位、位置、移動)的應用範圍相當廣泛,例如聲納探測(雷達)、無線通訊、視訊會議系統等等。且麥克風陣列中,舉例說明,是設法去估計聲音到達兩麥克風之間的時間延遲,再利用聲源與麥克風陣列的幾何關係,以估計出聲源的(到達)角度。 Common sound source detection (detection of position, position, movement) has a wide range of applications, such as sonar detection (radar), wireless communication, video conferencing systems, etc. And in the microphone array, for example, it is trying to estimate the time delay between the sound reaching the two microphones, and then using the geometric relationship between the sound source and the microphone array to estimate the (arrival) angle of the sound source.
因此,中華民國專利第I616811號揭露了一種「用於聲學監測的系統、單晶片系統、行動計算裝置、電腦程式產品以及方法」,其I616811號該案中圖1及圖2所示,其中圖1中結構主要揭示了聲學監測系統,以及聲學監測系統內所包含的麥克風陣列,該麥克風陣列的結構如圖2所示。 Therefore, Republic of China Patent No. I616811 discloses a "system for acoustic monitoring, single-chip system, mobile computing device, computer program product and method", which is shown in Figures 1 and 2 of the case of I616811. The structure in 1 mainly reveals the acoustic monitoring system and the microphone array included in the acoustic monitoring system. The structure of the microphone array is shown in FIG. 2.
此一技術方案中,該麥克風陣列為在一固定且不可修改的機構模組或板上固設有複數個麥克風裝置,因此,該麥克風裝置的數量以原有設計的數量為主,例如圖2中所示的8x8麥克風陣列,係無法隨時調整麥克風陣列的大小(將影響尺寸及效能),例如無法由8x8麥克風陣列(立即)調整為例如4x4麥克風陣列,即麥克風陣列無調整彈性,必需重新設計麥克風陣列。 In this technical solution, the microphone array is provided with a plurality of microphone devices fixed on a fixed and unmodifiable mechanism module or board. Therefore, the number of the microphone devices is mainly based on the original design, for example, FIG. 2 The 8x8 microphone array shown in the figure cannot adjust the size of the microphone array at any time (which will affect the size and performance). For example, it cannot be adjusted from the 8x8 microphone array (immediately) to a 4x4 microphone array. That is, the microphone array has no adjustment flexibility and must be redesigned. Microphone array.
有鑑於習用所述,因此本發明在於解決及改善習用所存在之 問題與缺失為目的。 In view of the practice, the present invention aims to solve and improve the problems and defects in the practice.
為了達成以上之目的,本發明提供一種可擴充式訊號收集或發送模組,其包含:一殼體,該殼體上設有一收音元件或一聲音發送元件、一電路板模組、至少一硬體介面、一結合部和一被結合部,該電路板模組上設有一控制器,該控制器設有一類比轉數位轉換器,且該收音元件或聲音發送元件經由該電路板模組電性連接該控制器,該控制器經由該電路板模組電性連接該硬體介面,該結合部和被結合部設置於該殼體的外表面上。 In order to achieve the above object, the present invention provides an expandable signal collection or transmission module, which includes: a housing provided with a sound receiving element or a sound transmitting element, a circuit board module, and at least one hard A body interface, a coupling portion and a coupled portion, a controller is provided on the circuit board module, the controller is provided with an analog-to-digital converter, and the sound receiving element or sound transmitting element is electrically connected through the circuit board module Connected to the controller, the controller is electrically connected to the hardware interface via the circuit board module, and the coupling portion and the coupled portion are disposed on the outer surface of the housing.
其中較佳的,該結合部為嵌合槽凸部,且該被結合部為嵌合槽。 Preferably, the coupling portion is a convex portion of the fitting groove, and the coupled portion is a fitting groove.
較佳的,該結合部為柱體,且該被結合部為凹槽。 Preferably, the coupling portion is a cylinder, and the coupled portion is a groove.
較佳的,該收音元件為麥克風裝置,該聲音發送元件為喇叭裝置。 Preferably, the sound receiving element is a microphone device, and the sound sending element is a speaker device.
因此,藉由單一單元設計之可擴充式訊號收集或發送模組其構成可組裝的單一接收器或發射器,俾可使本創作可機動性進行(擴充)組裝麥克風及/或喇叭陣列或藉以調整麥克風及/或喇叭陣列的面積大小(改變尺寸及效能),達到麥克風及/或喇叭陣列具有調整的彈性之功效。 Therefore, an expandable signal collection or transmission module designed by a single unit constitutes a assembleable single receiver or transmitter, so as to allow the creation flexibility to (expand) the assembly of microphones and/or speaker arrays or by Adjust the size of the microphone and/or speaker array (change the size and performance) to achieve the flexibility of the microphone and/or speaker array being adjusted.
10‧‧‧可擴充式訊號收集或發送模組 10‧‧‧Expandable signal collection or sending module
1‧‧‧殼體 1‧‧‧Housing
2‧‧‧收音元件 2‧‧‧Radio component
3‧‧‧電路板模組 3‧‧‧ circuit board module
4‧‧‧硬體介面 4‧‧‧Hardware interface
5‧‧‧結合部 5‧‧‧Joint
6‧‧‧被結合部 6‧‧‧bonded part
7‧‧‧控制器 7‧‧‧Controller
8‧‧‧類比轉數位轉換器 8‧‧‧Analog to Digital Converter
100‧‧‧機構 100‧‧‧Institution
200‧‧‧嵌合凹槽 200‧‧‧fitting groove
9‧‧‧聲音發送元件 9‧‧‧Sound sending component
第一圖係本發明較佳實施例之可擴充式訊號收集或發送模組的立體結構示意圖。 The first figure is a schematic diagram of a three-dimensional structure of an expandable signal collection or transmission module according to a preferred embodiment of the present invention.
第二圖係本發明較佳實施例之可擴充式訊號收集或發送模組進行擴充組裝的立體結構及動作前示意圖。 The second figure is a schematic diagram of the three-dimensional structure and pre-action schematic diagram of the expandable signal collection or transmission module of the preferred embodiment of the present invention for expansion assembly.
第三圖係本發明較佳實施例之可擴充式訊號收集或發送模組進行擴充組裝的立體結構及動作後示意圖。 The third figure is a schematic diagram of the three-dimensional structure and post-operation of the expandable signal collection or transmission module of the preferred embodiment of the present invention for expansion assembly.
第四圖係本發明較佳實施例之可擴充式訊號收集模組的方塊結構示意圖。 The fourth figure is a block diagram of the expandable signal collection module of the preferred embodiment of the present invention.
第四之A圖係本發明較佳實施例之可擴充式訊號收集模組的方塊結構及控制動作示意圖。 The fourth diagram A is a schematic diagram of the block structure and control actions of the expandable signal collection module of the preferred embodiment of the present invention.
第五圖係本發明較佳實施例之可擴充式訊號發送模組的方塊結構示意圖。 The fifth figure is a schematic block diagram of an expandable signal transmission module according to a preferred embodiment of the present invention.
第五之A圖係本發明較佳實施例之可擴充式訊號發送模組的方塊結構及控制動作示意圖。 The fifth diagram A is a schematic diagram of the block structure and control actions of the expandable signal transmission module according to the preferred embodiment of the present invention.
第六圖係本發明較佳實施例之可擴充式訊號收集或發送模組其結合部設為柱體,以及被結合部設為凹槽之進行擴充組裝的結構及動作前示意圖。 The sixth figure is a schematic diagram of the structure and the pre-action schematic diagram of the expandable signal collection or transmission module according to the preferred embodiment of the present invention, where the joint part is set as a cylinder and the joint part is set as a groove for expansion assembly.
第七圖係本發明較佳實施例之可擴充式訊號收集或發送模組其結合部設為柱體,以及被結合部設為凹槽之進行擴充組裝的結構及動作後示意圖。 The seventh figure is a schematic diagram of the structure and operation after expansion assembly of the expandable signal collection or transmission module of the preferred embodiment of the present invention, where the joint part is set as a cylinder and the joint part is set as a groove.
第八圖係本發明較佳實施例之可擴充式訊號收集或發送模組其安裝於經過排列設計且現成的可機動嵌合麥克風裝置及/或喇叭裝置而形成陣列的機構上,其立體分解結構示意圖。 The eighth figure is an expandable signal collection or transmission module according to a preferred embodiment of the present invention, which is installed on an array-designed and ready-to-move mobile microphone device and/or speaker device to form an array, and its three-dimensional decomposition Schematic.
為了使 貴審查委員能清楚了解本發明之內容,係以下列實施例搭配圖式及符號加以說明,敬請參閱之。 In order for your reviewing committee to clearly understand the content of the present invention, the following embodiments are illustrated with drawings and symbols, so please refer to it.
請參閱第一圖所示,本發明提供一種可擴充式訊號收集或發送模組10,其包含:一殼體1。 Referring to the first figure, the present invention provides an expandable signal collection or sending
其中,該殼體1上設有一收音元件2或一聲音發送元件9、一電路板模組3、兩個硬體介面4、一結合部5和一被結合部6,該電路板模組3 上設有一控制器7,該控制器7設有一類比轉數位轉換器8,且該收音元件2或聲音發送元件9經由該電路板模組3電性連接該控制器7,該控制器7經由該電路板模組3電性連接該兩硬體介面4,該結合部5和被結合部6設置於該殼體1的外表面上。 Wherein, the
本實施例中,該殼體1可為封閉或未封閉的結構,且該收音元件2較佳為麥克風裝置,該麥克風裝置可以是一種微型麥克風,該聲音發送元件9為喇叭裝置(speaker)。且該兩硬體介面4可包含為連接器接頭的結構、電接點等等,例如是串列周邊介面(SPI,Serial Peripheral Interface)的電接點或I2C匯流排電接點等等。又該控制器7例如是微控制器(MCU)、中央處理器(CPU)或數位訊號處理器(DSP)等等,因此,該類比轉數位轉換器8(ADC,Analog-to-digital converter)可與控制器7整合成一晶片,且亦可獨立的設置。此外,該結合部5可為嵌合槽凸部,且該被結合部6可為對應的嵌合槽。 In this embodiment, the
因此,請繼續參閱第二圖至第五圖所示,其中本發明可進行擴充組裝,可藉以多個可擴充式訊號收集或發送模組10排列組設構成麥克風及/或喇叭陣列,請先參閱第二圖和第三圖所示,其中使每兩個可擴充式訊號收集或發送模組10之間,其一可擴充式訊號收集或發送模組10的結合部5與另一可擴充式訊號收集或發送模組10的被結合部6相互結合(嵌合槽凸部嵌入嵌合槽),可使各該可擴充式訊號收集或發送模組10形成排列且相互固定。同時,請配合參閱第四圖、第四之A圖、第五圖、第五之A圖所示,嵌合槽凸部嵌入嵌合槽時,可讓其中一可擴充式訊號收集或發送模組10的硬體介面4與另一可擴充式訊號收集或發送模組10的硬體介面4相互(電性)連 接,以串接每一個可擴充式訊號收集或發送模組10並且形成麥克風及/或喇叭陣列,如圖所示為1x4的麥克風陣列為例,當然亦可設置為2x8或3x16的麥克風陣列,僅為舉例說明而不以此為限。本實施例中,每兩個可擴充式訊號收集或發送模組10之間其個別硬體介面4的相互(電性)連接,除了藉以設置連接線(Cable)以外,更可透過配接器、導線(纜線)、(匯流)排線或類似可直接耦接的裝置予以連接,此連接(耦接)可促使產生例如一電壓供應、數位訊號及/或類比訊號的通訊。 Therefore, please continue to refer to the second to fifth figures, in which the present invention can be expanded and assembled, and a plurality of expandable signal collection or
因此,藉由單一單元設計之可擴充式訊號收集或發送模組10其構成可組裝的單一接收器或發射器,俾可使本創作可機動性進行(擴充)組裝麥克風及/或喇叭陣列或藉以調整麥克風及/或喇叭陣列的面積大小(改變尺寸及效能),達到麥克風及/或喇叭陣列具有調整的彈性之功效。 Therefore, the expandable signal collection or
請再參閱第六圖和第七圖所示,其中該結合部5可為柱體,且該被結合部6可為對應的凹槽,並且使柱體與凹槽相互嵌設。藉以使本發明之各個可擴充式訊號收集或發送模組10的擴充組裝可更加便利快速。 Please refer to the sixth and seventh figures again, wherein the
以及較佳的,如第八圖所示,本發明之可擴充式訊號收集或發送模組10可實施於麥克風及/或喇叭陣列的機構100上,該機構100可能包含控制主板、顯示器、選擇按鍵、攝影機、網路、天線、各種軟硬體組件等等應用於麥克風及/或喇叭陣列的多功能集合裝置或模組或手持行動電子裝置,使得複數個以上的可擴充式訊號收集或發送模組10可機動性且快速的組裝於該機構100上,因此,該機構100可能設計成面板或圓盤狀且其上設有複數個嵌合凹槽200,各該可擴充式訊號收集或發送模組10可快速嵌合於各該嵌合凹槽200(每一可擴充式訊號收集或發送模組10藉由結合部5為嵌合 槽凸部以及該被結合部6為嵌合槽分別對應嵌合於各該嵌合凹槽200),藉以讓各該可擴充式訊號收集或發送模組10通訊連接於機構100上的控制主板(圖未示),俾可使本發明達到可快速組裝構成麥克風及/或喇叭陣列之功效,使其容易擴充與拆卸。 And preferably, as shown in the eighth figure, the expandable signal collection or
以及較佳的,當藉由可擴充式訊號收集或發送模組10同時擴充組裝構成具有麥克風及喇叭陣列時,可利用波束成型、三角定位等演算法處理麥克風陣列接收到的聲音訊號,計算各個角度上的能量分佈(聲音到達角度),藉以判斷聲源方位,再以該聲源方位使喇叭陣列在該方位上發送聲音或聲響,達到判斷聲源方位及在該方位上發送聲音或聲響。 And preferably, when the expandable signal collection or
以上所論述者,僅為本發明較佳實施例而已,並非用以限定本發明實施之範圍;故在不脫離本發明之精神與範疇內所作之等效的修飾、組合、置換或轉用等,皆應涵蓋於本發明之申請專利範圍內。 The above discussion is only a preferred embodiment of the present invention and is not intended to limit the scope of implementation of the present invention; therefore, equivalent modifications, combinations, substitutions, or conversions made without departing from the spirit and scope of the present invention , Should be covered within the scope of the patent application of the present invention.
10‧‧‧可擴充式訊號收集或發送模組 10‧‧‧Expandable signal collection or sending module
1‧‧‧殼體 1‧‧‧Housing
2‧‧‧收音元件 2‧‧‧Radio component
3‧‧‧電路板模組 3‧‧‧ circuit board module
4‧‧‧硬體介面 4‧‧‧Hardware interface
5‧‧‧結合部 5‧‧‧Joint
6‧‧‧被結合部 6‧‧‧bonded part
7‧‧‧控制器 7‧‧‧Controller
8‧‧‧類比轉數位轉換器 8‧‧‧Analog to Digital Converter
9‧‧‧聲音發送元件 9‧‧‧Sound sending component
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107127057A TW202008801A (en) | 2018-08-03 | 2018-08-03 | Expandable signal collection or transmission module capable of assembling (expanding) an array of a microphone and/or a speaker, or adjusting an area of the array of the microphone and/or the speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107127057A TW202008801A (en) | 2018-08-03 | 2018-08-03 | Expandable signal collection or transmission module capable of assembling (expanding) an array of a microphone and/or a speaker, or adjusting an area of the array of the microphone and/or the speaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202008801A true TW202008801A (en) | 2020-02-16 |
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|---|---|---|---|
| TW107127057A TW202008801A (en) | 2018-08-03 | 2018-08-03 | Expandable signal collection or transmission module capable of assembling (expanding) an array of a microphone and/or a speaker, or adjusting an area of the array of the microphone and/or the speaker |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW202008801A (en) |
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2018
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