TW201943660A - Lower heating hot field device of three-dimensional molded glass continuous molding device for reducing heat loss resulting from a cooling device and achieving the effect of lowering the production cost - Google Patents

Abstract

The invention relates to a heating hot field device and, more particularly, to a novel design of a lower heating hot field device of three-dimensional molded glass continuous molding device. The lower heating hot field device of three-dimensional molded glass continuous molding device includes an integrally formed graphite heating block prepared by a material with a good heat conductivity, and a base. The heating block is provided with an appropriate number of slotted holes to be tightly combined with a heating assembly so as to form a heating hot field. The base is made of a porous ceramic material. The heating block is fixedly arranged on the base by using a detachable assembly. The base is arranged in a fixing frame. The fixing frame is fixedly arranged on a preset position of the molding device by using the detachable assembly. The base of the invention is capable of effectively blocking heat of the hot field of the heating block, so as to greatly reduce heat loss resulting from a cooling device, and achieve the effect of greatly lowering the production cost.

Description

   Heating thermal field device under molded three-dimensional glass continuous molding device   

The invention belongs to the technical field of heating thermal field devices, in particular to the new design of the heating thermal field device structure under the three-dimensional molded glass continuous molding device. The base of the present invention can effectively block the heat of the heating field of the heating block, except for ensuring the three-dimensional molded glass products. In addition to the accuracy of the size, it can effectively block the heat of the heat field of the heating block, greatly reduce the heat loss taken by the cooling device, and have the effect of greatly reducing the production cost.

Press, because glass has high light transmission characteristics, so display devices (such as mobile phones, watches and other electronic products) choose it as the shell of the window part. The surface of handheld electronic products is usually provided with a glass shell to protect the display module inside the product. At present, most of the glass shells have the shape of a flat plate, so a seam is formed on the upper surface of the electronic product. Furthermore, since a certain width of the mechanism must be reserved around the electronic product to hold the flat glass, the top surface of the electronic product cannot be fully utilized. Therefore, three-dimensional or curved glass has been gradually applied to the glass shell of electronic products.

The flat glass case is easier to manufacture, and the three-dimensional glass case is more difficult to manufacture. At present, there are generally two methods for manufacturing a glass case with a three-dimensional shape. The first method is to manufacture a plurality of flat glass units, and then form a glass case with a three-dimensional shape by sticking edges. The second method is: manufacturing a rectangular parallelepiped glass with a certain thickness, and then grinding the rectangular parallelepiped glass several times to form a three-dimensional shape with multiple sides. However, the above two methods are time-consuming and labor-intensive, and the production speed is very slow. Generally speaking, since the glass material is a flat plate, if a glass with a shape is to be produced, it is better to set the flat glass material between an upper mold and a lower mold, and then heat the upper mold. Pieces, lower molds, and glass material to soften the glass material. When the above-mentioned glass material is softened, the upper mold and the lower mold can perform a clamping action, so that the upper mold and the lower mold jointly shape the shape of the glass material in a clamping direction, thereby producing corresponding molded glass. . China Patent Bulletin No. M452174 "Molding Equipment for Manufacturing Molded Glass" (refer to the patent publication information on May 01, 2013), which contains a female mold part, a first male mold part, and a second male mold part. Mold parts, a support rod and a pressure rod. The first male mold part is disposed on the female mold part in an openable and closable manner, and the second male mold part is disposed between the female mold part and the first male mold part. The support ejector is penetrated through the female mold part, and the support ejector is used to push against the second male mold part, thereby supporting the second male mold part and the first male mold part to be clamped together. A moulded glass. The pressing rod is arranged on one side of the first male mold part, and the pressing rod is used to press down the first male mold part so that the first male mold part is opposite to the second male mold part. The mother mold part is moved to a mold clamping position, thereby molding the molded glass.

A 3D three-dimensional molded glass molding machine using hot press molding technology, there are those who use a heating device to directly heat the mold. For example, the applicant previously proposed and approved M524845 "Heating device for continuous molding of molded three-dimensional glass" [July 105, 1 [Announcement], which is a new design of the heating device structure especially for the three-dimensional molded glass continuous molding device. The heating device is composed of a heating block integrated with a good thermal conductivity material. The heating block has an appropriate number of slots for heating elements. Because the heating block is integrally formed, there is no conductive heat loss, and the heat conduction is good, which is suitable for continuous molding of higher temperature three-dimensional molded glass. However, because the heating element in the previous case is set in the slot of the heating block, if the heating element is damaged after using it for a period of time, generally only the damaged heating element is replaced. This will cause the newly replaced heating element to be used for a period of time. In the case of using the heating element together, because the heating temperature of the old and new heating elements will be different, so the heating temperature of the heating block is not uniform, so that the yield of the molded three-dimensional glass product has been reduced, which is missing. In addition, since the heating element is easily disposed in the slot of the heating block, there must be a gap between the outer edge of the heating element and the inner edge of the slot, and this gap has a loss of heat conduction loss. Based on this, the application re-filed No. I606017 "Heating Device for Molded Three-Dimensional Glass Continuous Forming Device" [Announcement November 21, 106], which is mainly composed of a heating block and a base that are integrally formed of a material with good thermal conductivity. The number of slots is used to tightly combine the heating element, and there is no gap between the heating element and the slot of the heating block. The heating block is fixed to the base with a detachable element, and the base is fixed to a continuous solid glass molding device with a detachable element. At the predetermined position, when the heating element is replaced, the heating block containing the heating element is replaced without replacing the base, so that all the heating elements combined with the heating block can be replaced together, which can indeed eliminate the lack of previous removal.

However, the previous patent disclosed that the heating block is integrally formed of a metal material with good heat conduction, and the heating block is fixed to the base with a detachable element. Since the heat conduction of the general metal is not fast enough, the heat formed by the heating block and the heating element There is still room for improvement in the field's heat transfer and temperature equalization performance.

Moreover, please refer to FIG. 1. As the lower heating device (A), the heating block (B) and the base (C) are integrally formed of a metal material with good heat conduction. The heating block (B) has an appropriate number of The slot (F) is closely combined with the heating element (G) to form a heating thermal field. The heat system of the heating block (B) heating the thermal field is directly transmitted to the metal base (C), except that it will cause the base (C) to be caused by high temperature. There is a risk of deformation and insufficient pressure resistance, which cannot ensure the accuracy of the dimensions of the three-dimensional molded glass product. As mentioned above, the conventional metal base (C) is fixed to the predetermined position of the molded three-dimensional glass continuous molding device with detachable components, that is, the metal cavity (D) shown in FIG. 1, and the metal cavity (D) is provided inside There is a cooling water channel (E), and the metal base (C) conducts the heat of the heating field to the metal cavity (D). In order to prevent the metal cavity (D) from being deformed, the cooling water in the cooling water channel (E) will continuously flow The tropical walk conducted to the metal cavity (D) will cause great energy loss and increase production costs. In view of this deficiency, the present invention proposes a better design, so that the patent of the heating field device under the continuous molding device for molded three-dimensional glass is more perfect.

In view of the lack of conventional technology, the inventor of the present invention has accumulated many years of practical expertise in the design and manufacturing of precision ceramic technology industrial products. After continuous research and improvement, the research and development of the present invention has finally been successful and made public.

The reason is that the main object of the present invention is to provide a "heating thermal field device under the continuous molding device for molded three-dimensional glass", which is specially designed for the new structure of the heating thermal field device under the continuous molding device for three-dimensional molded glass. The heating thermal field device under the glass continuous forming device includes a heating block and a base that are integrally formed of a material with good thermal conductivity. The heating block has a proper number of slots to tightly combine heating elements to form a heating thermal field. The base is composed of multiple holes. The heating block is fixed to the base with a detachable element, the base is placed in a fixed frame, and the fixed frame is fixed to a predetermined position of the molding device with the detachable element. The base of the present invention is made of a porous ceramic material. Structure, the base is made of non-metal porous ceramic material that is resistant to high temperature, high pressure and difficult to deform. It can cut off heat and pressure, so that the base is not deformed under high temperature and high pressure. In addition, it has the accuracy to ensure the size of three-dimensional molded glass products. In addition, it can effectively block the heat of the thermal field of the heating block, and greatly reduce the heat loss taken away by the cooling device. It has significantly reduced the cost of production of the effect.

The base made of the aforementioned porous ceramic material of the present invention is preferably made of silicon carbide or aluminum oxide.

According to the present invention, the heating block integrally formed of the material with good heat conduction is made of graphite integrally. Since the heating block composed of graphite has better heat conduction and temperature uniformity than the heating block of metal material, and the heating block composed of graphite has more It is not easy to deform, which has the effect of making the internal stress of three-dimensional molded glass products small and the forming yield high.

(A) ‧‧‧lower heating device

(B) ‧‧‧Heating block

(C) ‧‧‧base

(D) ‧‧‧metal cavity

(E) ‧‧‧Cooling channel

(F) ‧‧‧Slot

(G) ‧‧‧Heating element

(1) ‧‧‧furnace

(10) ‧‧‧Heating and high temperature forming zone

(11) ‧‧‧ Slowly descending zone

(12) ‧‧‧Cooling zone

(2) ‧‧‧Inner Conveyor

(3) ‧‧‧ Outer Conveyor

(4) ‧‧‧Exchange System

(40) ‧‧‧Airtight Door

(41) ‧‧‧Airtight Door

(42) ‧‧‧Exchange Room

(5) ‧‧‧Pressure system

(6) ‧‧‧Upper heating device

(60) ‧‧‧Lower heating device

(61) ‧‧‧Heating block

(62) ‧‧‧Base

(63) ‧‧‧Slot

(64) ‧‧‧Pressure plate

(65) ‧‧‧Heating block

(66) ‧‧‧Base

(67) ‧‧‧Slot

(68) ‧‧‧Fixed frame

(69) ‧‧‧Metal cavity

(690) ‧‧‧Cooling Channel

(7) ‧‧‧Mould

(8) ‧‧‧Heating element

(9) ‧‧‧Displacement mechanism

Figure 1 is a schematic diagram of a conventional heating thermal field device; Figure 2 is a front cross-sectional view of a molded three-dimensional glass continuous molding device according to the present invention; Figure 3 is a top cross-sectional view of a molded three-dimensional glass continuous molding device according to the present invention; Fig. 5 is a side view of a continuous three-dimensional glass molding device according to the present invention; Fig. 5 is a plan view of a heating field device in the embodiment of the present invention; Fig. 6 is a plan view of a heating field device in the embodiment of the present invention; Schematic diagram of thermal field device.

In order to achieve the above-mentioned technical means of the present invention, an embodiment will be enumerated, and the drawings will be explained later. Your review committee can obtain a better understanding of the structure, features, and effects of the present invention.

The present invention is a new design for the structure of the heating device under the three-dimensional molded glass continuous forming device. First, please refer to FIG. 2 and FIG. 3. The heating field device of the present invention is provided in the three-dimensional molded glass continuous forming device. It consists of a furnace body (1), an inner conveying path (2), an outer conveying path (3), an exchange system (4) and a pressurizing system (5). The inner conveying path (2) is provided in the furnace body (1). ) Inside, and connected to the exchange system (4) on the two sides of the furnace body (1), and the outer conveyor (3) is provided on the outside of the furnace body (1), and to the exchange system (4) on the two sides of the furnace body (1) ), The furnace body (1) is hermetically sealed and introduces a protective gas [the device for providing a protective gas is a conventional technology, not to go into details], and according to the process, there are a temperature rising and high temperature forming zone (10) and a slowing down zone (11) And cooling zone (12), heating and high temperature forming zone (10) and slow-down zone (11) have heat-resistant material [heat-resistant material is a known technology, not shown in the figure, not to go into details], the cooling zone (12) has a cooling device [Cooling device is a conventional technology, not much to say], the heating system is equipped with a pressurizing system (5) above the high temperature and high temperature forming zone (10), slow down zone (11) and cooling zone (12). An upper heating thermal field device (6) is combined below each pressurizing system (5) of the forming area (10) and the slow-down area (11) [see Figure 4], and each of the upper heating field devices (6) In contrast, a lower heating thermal field device (60) is provided below the furnace body, and an upper heating thermal field device (6) and a lower heating thermal field device (60) are provided with heating elements (8). [The devices such as temperature control are conventional technologies, not [More details], and depending on the process of heating the upper heating field device (6) and the lower heating field device (60) to the required temperature, please refer to Figure 4, the heating field device of the present invention includes The upper heating thermal field device (6) below the pressing system (5) and the lower heating thermal field device (60) opposite to the lower heating system (5), please refer to FIG. 5. The upper heating thermal field device (6) of the present invention is It consists of a heat block (61) with a good thermal conductivity and a base (62). The heat block (61) has a suitable number of slots (63) to tightly combine the heating element (8) to form a heating field. Between the block (61) and the base (62), there is a pressure bearing plate (64) composed of a porous ceramic material. The heating block (61) is fixed on the base (62) with a detachable element, and the base (62) is Removable The component is fixed at the predetermined position of the molding device [ie, the heating system (6) is combined under the pressing system (5) of the heating and high-temperature molding zone (10) and the slow-down zone (11)], please refer to FIG. 6 As shown, the heating field device (60) under the present invention includes a heating block (65) and a base (66) that are integrally formed of a material with good thermal conductivity. The heating block (65) has an appropriate number of slots (67) to The heating element (8) is tightly combined to form a heating thermal field. The base (66) is composed of a porous ceramic material. The heating block (65) is fixed to the base (66) with a detachable element, and the base (66) is arranged. In the fixed frame (68), the fixed frame (68) is fixed to a predetermined position of the molding device with a detachable element [that is, a lower heating thermal field device is provided below the furnace body opposite to each upper heating thermal field device (6) ( 60)], the base (66) of the present invention is composed of a porous ceramic material, and the base (66) is made of a non-metallic porous ceramic material that is resistant to high temperature, high pressure and difficult to deform. High pressure without deformation at high temperature, in addition to ensuring the accuracy of three-dimensional molded glass product size, and can heat the block (6 5) The heat of the thermal field is effectively blocked, which greatly reduces the heat loss taken by the cooling device, and has the effect of greatly reducing the production cost. The flat glass to be molded is placed in the molding surface of the mold (7). When the mold (7) is pushed into the inner conveying channel, the heating field device (60) is heated. [The mold (7) is pushed into the inner conveying channel. The predetermined position of the heating thermal field device (60) is the displacement mechanism (9) shown in FIG. 4, and the heating system (6) is pressed down by the pressurizing system (5) when the heating and high temperature molding zone (10) is pressed down. The lower heating heat field device (60) heats the mold to the set temperature, the post pressure system (5) rises, the mold (7) is pushed into the next lower heating heat field device (60), and the pressure system (5) again Press down to make the upper heating field device (6) and the lower heating field device (60) heat the mold to the set temperature, so that the glass to be molded in the mold (7) is divided into stages and preheated [to avoid damage caused by rapid temperature changes] At high temperature, the glass is softened and formed by the pressure of the pressure system (5), and then cooled by the slow-down zone (11) [to avoid damage caused by rapid temperature changes] and cooled in the cooling zone (12). Out of the furnace body, and then demoulded, it has the effect of continuous, high efficiency and high quality molding and molding of three-dimensional glass.

Referring to FIG. 3, the exchange system (4) provided on the two sides of the furnace body (1) of the present invention each has two airtight doors (40) (41), and forms an exchange chamber (42). (7) Before being sent into the furnace body (1), the two airtight doors (40) (41) at the head end of the furnace body (1) are closed, and a vacuum is to be introduced into the exchange chamber (42) to introduce protective gas to After the same environment in the furnace body (1), the airtight door (41) inside the furnace is opened to push the mold (7) into the furnace body (1). Before the mold (7) is sent out of the furnace body (1), the furnace body The two air-tight doors (40) (41) at the rear end are closed, and the exchange chamber (42) has been evacuated and introduced protective gas to the same environment as the furnace body (1). The air-tight door (41) inside the furnace The square is opened and the mold (7) is pushed into the exchange chamber (42), so that it has the effect of preventing the furnace body (1) from mixing with the air outside the furnace to improve the molding quality of the component.

As mentioned above, please refer to FIG. 6, the heating field device (60) of the present invention includes a heating block (65) and a base (66) which are integrally formed of a material with good thermal conductivity. The heating block (65) It has a proper number of slots (67) to tightly combine the heating element (8) to form a heating thermal field. The base (66) is composed of a porous ceramic material, and the heating block (65) is fixed to the base with a detachable element ( 66) [Removable components such as bolts, fixing pins, etc.], the base (66) is placed in a fixed frame (68), and the fixed frame (68) is fixed to a predetermined position of the molding device with removable components [ie Each upper heating thermal field device (6) is provided below the furnace body with a lower heating thermal field device (60), that is, the metal cavity (69) shown in FIG. 7]. The base (66) of the present invention is composed of multiple holes. Made of ceramic material, the base (66) is made of non-metal porous ceramic material that is resistant to high temperature, high pressure and difficult to deform. It can cut off heat and pressure, so that the base is not deformed under high temperature and high pressure. In addition to the accuracy of the product dimensions, please refer to Figure 7, because the heating block (65) of the lower heating field device (60) The base (66) is made of a porous ceramic material. The heat of the heating block (65) is blocked by the base (66) of the porous ceramic material. The base (66) ) The heat transmitted to the metal cavity (69) is greatly reduced. [The base (66) is placed in a fixed frame (68), and the fixed frame (68) is fixed to a predetermined position of the molding device with a detachable element, that is, FIG. 7 The metal cavity (69) shown, the cooling water in the cooling channel (690) has limited heat removal, that is, the base (66) made of a porous ceramic material can effectively block the heat of the thermal field of the heating block (65), Significantly reduce the heat loss taken by the cooling water channel (690), and have the effect of greatly reducing the production cost.

The base (66) made of the aforementioned porous ceramic material of the present invention is preferably made of silicon carbide or aluminum oxide.

According to the present invention, the heating block (65) integrally formed of the material with good heat conduction is made of graphite integrally. Since the heating block (65) composed of graphite has better heat conduction and temperature uniformity than the heating block of metal material, and graphite The formed heating block (65) is more resistant to deformation, and has the effects of making the internal stress of the three-dimensional molded glass product small and the forming yield high.

In summary, a "heating field device under the continuous molding device for molded three-dimensional glass" disclosed in the present invention is unprecedented and has not been seen in domestic and foreign publications. It is believed that it has novel patent requirements. The present invention can indeed eliminate the lack of conventional technology and achieve the design purpose. It has also fully met the patent requirements and applied in accordance with the law. I would like to invite your reviewing committee to review and grant the patent in this case.

However, the above is only one of the preferred feasible embodiments of the present invention, and is not intended to limit the scope of the present invention. For those skilled in the art, the equivalent structural changes made by using the description of the present invention and the scope of patent application Should be included in the patent scope of the present invention.

Claims (4)

    The utility model relates to a heating thermal field device under a molded three-dimensional glass continuous molding device, which mainly includes a heating block integrally formed of a material with good thermal conductivity and a base. The heating block has a proper number of slots to closely combine heating elements to form a heating thermal field. The base is composed of a multi-porous ceramic material, the heating block is fixed on the base with a detachable element, the base is placed in a fixed frame, and the fixed frame is fixed on the predetermined position of the molding device with the detachable element.         The thermal field device under the molded three-dimensional glass continuous molding device described in the first patent application scope, wherein the base is made of silicon carbide.         The heating field device under the molded three-dimensional glass continuous molding device described in the first item of the patent application scope, wherein the base is made of alumina.         The thermal field device is heated under the molded three-dimensional glass continuous molding device described in item 1 of the scope of the patent application, wherein the heating block integrally formed of a material with good heat conduction is made of graphite integrally formed.