TW201943095A - Method for manufacturing solar battery cell, method for manufacturing solar battery module, and solar battery module - Google Patents
Method for manufacturing solar battery cell, method for manufacturing solar battery module, and solar battery module Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/40—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising photovoltaic cells in a mechanically stacked configuration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
本發明提供一種於使用疊瓦方式之太陽電池模組化時,可抑制太陽電池單元之輸出降低之太陽電池單元之製造方法。太陽電池單元之製造方法係用於包含至少1個使用疊瓦方式將至少2個長方形狀之雙面電極型之太陽電池單元電性連接之太陽電池串之太陽電池模組者,且包括透明電極層形成步驟,該透明電極層形成步驟係於半導體積層體10之兩主面形成透明電極層者,且於在兩主面中之一主面側形成透明電極層20時,於成為太陽電池單元之長邊部之長邊區域RL及成為太陽電池單元之短邊部之短邊區域RS之一主面側配置遮罩,將與長邊區域RL交叉之方向設為搬送方向TD,一面搬送半導體積層體10,一面利用物理氣相生長法形成透明電極層20。The present invention provides a method for manufacturing a solar battery cell capable of suppressing a decrease in the output of the solar battery cell when the solar battery module using the shingle method is modularized. A method for manufacturing a solar battery cell is used for a solar battery module including at least one solar cell string in which at least two rectangular double-sided electrode-type solar battery cells are electrically connected by a shingle method, and includes a transparent electrode. A layer forming step for forming a transparent electrode layer on two main surfaces of the semiconductor laminate 10, and when forming the transparent electrode layer 20 on one of the two main surfaces, it becomes a solar cell One of the long side regions RL of the long side portion and the short side region RS of the short side portion of the solar cell is provided with a mask, and the direction intersecting the long side region RL is set to the transport direction TD, and the semiconductor is transported on one side The laminated body 10 is formed with a transparent electrode layer 20 by a physical vapor growth method.
Description
本發明係關於一種太陽電池單元之製造方法、太陽電池模組之製造方法、太陽電池單元、及太陽電池模組。The present invention relates to a method for manufacturing a solar battery cell, a method for manufacturing a solar battery module, a solar battery unit, and a solar battery module.
近來,於將雙面電極型之太陽電池單元模組化之情形時,存在如下方式,即,不使用導電性之連接線而藉由將太陽電池單元之一部分彼此重疊而直接地電性且物理性進行連接(例如,專利文獻1)。Recently, in the case of modularizing a double-electrode-type solar battery cell, there is a method that directly and electrically and physically overlaps a part of the solar battery cell without using a conductive connecting wire. Sex (for example, Patent Document 1).
此種連接方式稱為疊瓦方式。根據該方式,可認為能夠於太陽電池模組中之有限之太陽電池單元安裝面積上安裝更多之太陽電池單元,增加用於光電轉換之受光面積,因此,太陽電池模組之輸出提昇。
[先前技術文獻]
[專利文獻]This type of connection is called a shingle method. According to this method, it can be considered that more solar battery units can be installed on a limited solar battery unit installation area in the solar battery module, and the light receiving area for photoelectric conversion is increased. Therefore, the output of the solar battery module is improved.
[Prior technical literature]
[Patent Literature]
[專利文獻1]日本專利特開平11-186577號公報[Patent Document 1] Japanese Patent Laid-Open No. 11-186577
[發明所欲解決之問題][Problems to be solved by the invention]
於雙面電極型太陽電池單元之製造方法中,獲得於半導體基板之兩主面之各面上形成有p型半導體層、n型半導體層之半導體積層體,且於該半導體積層體之兩主面形成透明電極層、金屬電極層。
一般而言,作為透明電極層之形成方法,例如使用濺鍍法等物理氣相生長法(PVD法)。於此情形時,以半導體積層體之兩主面之透明電極層彼此不短路之方式,進行於任一主面之透明電極層之製膜時使用遮罩之圖案化。In the method for manufacturing a double-sided electrode type solar cell, a semiconductor laminate having a p-type semiconductor layer and an n-type semiconductor layer formed on each of the two main surfaces of a semiconductor substrate is obtained, and A transparent electrode layer and a metal electrode layer are formed on the surface.
Generally, as a method for forming the transparent electrode layer, a physical vapor growth method (PVD method) such as a sputtering method is used. In this case, the patterning using a mask is performed on the film formation of the transparent electrode layers on any of the main surfaces in such a manner that the transparent electrode layers on the two main surfaces of the semiconductor laminate are not short-circuited with each other.
然而,本案發明者們得出如下見解,即,於製膜時使用遮罩之圖案化中,因遮罩而阻礙製膜,導致遮罩附近之太陽電池單元之端部之透明電極層之膜厚變得薄於太陽電池單元之中央部之膜厚。藉此,推測太陽電池單元之端部之透明電極層之電阻增大,太陽電池單元之輸出降低。However, the inventors of the present case have found that during patterning using a mask during film formation, the film formation is hindered by the mask, resulting in a film of a transparent electrode layer at the end of a solar cell near the mask. The thickness becomes thinner than the film thickness of the central portion of the solar cell. Accordingly, it is presumed that the resistance of the transparent electrode layer at the end of the solar battery cell increases, and the output of the solar battery cell decreases.
本發明之目的在於提供一種於使用疊瓦方式之太陽電池模組化時可抑制輸出降低之太陽電池單元之製造方法、太陽電池模組之製造方法、太陽電池單元、及太陽電池模組。
[解決問題之技術手段]An object of the present invention is to provide a manufacturing method of a solar battery cell, a manufacturing method of a solar battery module, a solar battery unit, and a solar battery module when a solar cell module using a shingle method is modularized.
[Technical means to solve the problem]
本發明之太陽電池單元之製造方法係用於包含至少1個使用疊瓦方式將至少2個長方形狀之雙面電極型之太陽電池單元電性連接之太陽電池串之太陽電池模組者,且包含透明電極層形成步驟,該透明電極層形成步驟係於半導體積層體之兩主面形成透明電極層者,且於在兩主面中之一主面側形成透明電極層時,於成為太陽電池單元之長邊部之長邊區域及成為太陽電池單元之短邊部之短邊區域之一主面側配置遮罩,將與長邊區域交叉之方向設為搬送方向一面搬送半導體積層體,一面利用物理氣相生長法形成透明電極層。The method for manufacturing a solar cell according to the present invention is used for a solar cell module including at least one solar cell string electrically connected to at least two rectangular double-sided electrode-type solar cells using a shingle method, and It includes a step of forming a transparent electrode layer. The step of forming a transparent electrode layer is to form a transparent electrode layer on two main surfaces of a semiconductor laminate. When a transparent electrode layer is formed on one of the two main surfaces, it becomes a solar cell A mask is arranged on the main surface side of the long side region of the long side portion of the cell and the short side region that becomes the short side portion of the solar cell. The semiconductor layer is transported while the direction intersecting the long side region is set as the transport direction. A transparent electrode layer is formed by a physical vapor growth method.
本發明之太陽電池模組之製造方法係包含至少1個使用疊瓦方式將至少2個長方形狀之雙面電極型之太陽電池單元電性連接之太陽電池串者,太陽電池單元係利用上述太陽電池單元之製造方法製造,該太陽電池單元之製造方法包含透明電極層形成步驟,該透明電極層形成步驟係於在半導體積層體之兩主面中之一主面側形成透明電極層時,於成為太陽電池單元之長邊部之長邊區域及成為太陽電池單元之短邊部之短邊區域之一主面側配置遮罩,將與長邊區域交叉之方向設為搬送方向一面搬送半導體積層體,一面利用物理氣相生長法形成透明電極層,且該太陽電池模組之製造方法包括太陽電池串形成步驟,該太陽電池串形成步驟係將相鄰之太陽電池單元中之一太陽電池單元之搬送方向之前側之長邊部之一主面側之一部分重疊於相鄰之太陽電池單元中之另一太陽電池單元之搬送方向之後側之長邊部之與一主面側相反之另一主面側之一部分之下,將相鄰之太陽電池單元彼此連接。The method for manufacturing a solar cell module of the present invention includes at least one solar cell string electrically connected to at least two rectangular double-sided electrode-type solar cells using a shingle method. The manufacturing method of a battery cell includes a step of forming a transparent electrode layer. The step of forming a transparent electrode layer is formed when a transparent electrode layer is formed on a main surface side of one of two main surfaces of a semiconductor laminate. A mask is disposed on the main surface side of one of the long-side region serving as the long-side portion of the solar battery cell and the short-side region serving as the short-side portion of the solar battery cell. The semiconductor layer is transported while the direction intersecting the long-side region is set as the transport direction The transparent electrode layer is formed on one side by a physical vapor growth method, and the manufacturing method of the solar cell module includes a step of forming a solar cell string. The step of forming the solar cell string is one of adjacent solar cells. One of the long sides on the front side of the conveying direction partially overlaps the other of the adjacent solar cells Yang conveyed under a portion of the cell with a main surface side of the other main surface opposite to the long side of the side portion of the side of the adjacent solar cells are connected to each other after the feeding direction.
本發明之太陽電池單元係用於包含至少1個使用疊瓦方式將至少2個長方形狀之雙面電極型之太陽電池單元電性連接之太陽電池串之太陽電池模組者,且具備半導體積層體、及形成於半導體積層體之兩主面之透明電極層,且於兩主面中之一主面側,太陽電池單元之長邊部中之另一端側之長邊部中之透明電極層之端部之減退區域之寬度小於太陽電池單元之長邊部中之一端側之長邊部中之透明電極層之端部之減退區域之寬度,所謂減退區域係透明電極層之端部之膜厚較透明電極層之中央部之膜厚減退之區域。The solar battery cell of the present invention is a solar battery module including at least one solar cell string electrically connected to at least two rectangular double-sided electrode-type solar battery cells by a shingle method, and is provided with a semiconductor laminate. And a transparent electrode layer formed on the two main surfaces of the semiconductor multilayer body, and on one of the two main surfaces, the transparent electrode layer in the long side of the other side of the long side of the solar cell The width of the decreasing region at the end is smaller than the width of the decreasing region at the end of the transparent electrode layer in one of the long sides of the solar cell. The so-called decreasing region is the film at the end of the transparent electrode layer. A region where the film thickness of the central portion of the transparent electrode layer decreases.
本發明之太陽電池模組係包含至少1個使用疊瓦方式將至少2個長方形狀之雙面電極型之太陽電池單元電性連接之太陽電池串者,太陽電池單元係上述太陽電池單元,且具備半導體積層體、及形成於半導體積層體之兩主面之透明電極層,於兩主面中之一主面側,太陽電池單元之長邊部中之另一端側之長邊部中之透明電極層之端部之減退區域之寬度小於太陽電池單元之長邊部中之一端側之長邊部中之透明電極層之端部之減退區域之寬度,且相鄰之太陽電池單元中之一太陽電池單元之一端側之長邊部之一主面側之一部分重疊地連接於相鄰之太陽電池單元中之另一太陽電池單元之另一端側之長邊部之與一主面側相反之另一主面側之一部分之下。
[發明之效果]The solar battery module of the present invention includes at least one solar battery string electrically connected to at least two rectangular double-sided electrode-type solar battery cells by a shingle method. The solar battery unit is the above-mentioned solar battery unit, and The semiconductor laminated body is provided with a transparent electrode layer formed on two principal surfaces of the semiconductor laminated body, and one of the two principal surfaces is transparent on one of the principal surfaces, and the other of the long sides of the long side of the solar cell is transparent. The width of the decreasing region at the end of the electrode layer is smaller than the width of the decreasing region at the end of the transparent electrode layer in the long side of one of the long sides of the solar cell, and one of the adjacent solar cells One of the main surface sides of one of the long side portions of one end side of the solar battery cell is connected to the other side of the other solar battery unit in the adjacent one of the long side portions and is opposite to one of the main surface sides. Under one part of the other main surface side.
[Effect of the invention]
根據本發明,於使用疊瓦方式之太陽電池模組化時,可抑制太陽電池單元之輸出降低。According to the present invention, when the solar cell module using the shingle method is modularized, it is possible to suppress a decrease in the output of the solar cell unit.
對本發明之一實施形態進行說明,則如下所述,但本發明並不限定於此。再者,為方便起見,亦有將影線或構件符號等省略之情形,但於此情形時,參照其他圖式。又,圖式中之各種構件之尺寸為方便起見調整為容易觀察者。One embodiment of the present invention will be described below, but the present invention is not limited to this. Moreover, for convenience, hatching or component symbols may be omitted, but in this case, refer to other drawings. In addition, the dimensions of various components in the drawings are adjusted for the convenience of the observer for convenience.
如上所述,一般而言,作為雙面電極型之太陽電池單元中之透明電極層之形成方法使用PVD法。於此情形時,以半導體積層體之兩主面之透明電極層彼此不短路之方式,進行於任一主面之透明電極層之製膜時使用遮罩之圖案化。As described above, in general, a PVD method is used as a method for forming a transparent electrode layer in a solar cell of a double-sided electrode type. In this case, the patterning using a mask is performed on the film formation of the transparent electrode layers on any of the main surfaces in such a manner that the transparent electrode layers on the two main surfaces of the semiconductor laminate are not short-circuited with each other.
然而,於用於疊瓦方式之太陽電池模組之太陽電池單元之製造方法中,有時如圖1所示,於自1個半導體基板製作之半導體積層體10X形成透明電極層20X之後,例如,沿著透明電極層20X之形成區域上之切斷線CL進行雷射切斷,獲得長方形狀之複數個太陽電池單元。
於此情形時,若沿著透明電極層20X之形成區域上之切斷線CL進行雷射切斷,則透明電極層20X附著於半導體積層體10X之切斷面、尤其半導體基板(光電轉換基板)之切斷面,導致太陽電池單元之性能降低。
關於此點,考慮於切斷線CL附近不形成透明電極(例如參照下述圖9)。作為此種透明電極層之形成方法,考慮製膜時使用遮罩之圖案化、或製膜後使用蝕刻之圖案化等。於製膜後使用蝕刻之圖案化中,因製造步驟之增多等而導致製造時間、製造成本增大。
如此,亦根據抑制雷射切斷引起之太陽電池單元之性能降低之觀點,較佳為進行於任一主面之透明電極層之製膜時使用遮罩之圖案化(例如,參照下述圖8)。However, in a method for manufacturing a solar cell for a shingled solar cell module, as shown in FIG. 1, after a transparent electrode layer 20X is formed on a semiconductor laminate 10X fabricated from a semiconductor substrate, for example, Laser cutting is performed along the cutting line CL on the formation area of the transparent electrode layer 20X to obtain a plurality of rectangular solar cells.
In this case, if laser cutting is performed along the cutting line CL on the formation area of the transparent electrode layer 20X, the transparent electrode layer 20X is attached to the cut surface of the semiconductor laminate 10X, especially the semiconductor substrate (photoelectric conversion substrate). ), The performance of the solar cell is reduced.
In this regard, it is considered that a transparent electrode is not formed near the cutting line CL (for example, refer to FIG. 9 described below). As a method for forming such a transparent electrode layer, patterning using a mask during film formation, or patterning using etching after film formation, etc. are considered. In patterning using etching after film formation, manufacturing time and manufacturing costs increase due to an increase in manufacturing steps and the like.
In this way, from the viewpoint of suppressing the degradation of the performance of the solar cell caused by laser cutting, it is preferable to use a mask patterning when forming a transparent electrode layer on any main surface (for example, refer to the following figure) 8).
然而,如上所述,本案發明者們獲得如下見解,即,於製膜時使用遮罩之圖案化中,因遮罩而阻礙製膜,導致遮罩附近之太陽電池單元之端部之透明電極層之膜厚變得薄於太陽電池單元之中央部之膜厚。因此,推測太陽電池單元之端部之透明電極層之電阻增大,太陽電池單元之輸出降低。However, as described above, the inventors of the present case gained the insight that, in the patterning using a mask during film formation, the film formation is hindered by the mask, resulting in a transparent electrode at the end of the solar cell near the mask The film thickness of the layer becomes thinner than the film thickness of the central portion of the solar cell. Therefore, it is presumed that the resistance of the transparent electrode layer at the end of the solar battery cell increases, and the output of the solar battery cell decreases.
本案發明者們如圖2及圖3所示地發現了PVD法中之半導體積層體10X之搬送方向TD與遮罩MASK附近之透明電極層20X之端部之膜厚較透明電極層20X之中央部之膜厚減退(減少)之減退區域R1、R2之關係。
如圖2所示,若將搭載於托盤TRAY且於端部之一主面側配置有遮罩MASK之半導體積層體10X向搬送方向TD搬送,則於在遮罩MASK之開口部露出之半導體積層體10X上形成透明電極層20X。
於此情形時,如圖3所示,搬送方向TD之後側之透明電極層20X之端部之減退區域R2之寬度W2小於搬送方向TD之前側之透明電極層20X之端部之減退區域R1之寬度W1(及搬送方向TD之右側及左側之減退區域之寬度:詳情後述)。再者,減退區域之寬度W1、W2係與透明電極層20X之端部(邊部)及半導體積層體10X之端部(邊部)交叉之方向上之減退區域之長度。
換言之,搬送方向TD之後側之透明電極層20X之端部之減退區域R2之減退角度θ2大於搬送方向TD之前側之透明電極層20X之端部之減退區域R1之減退角度θ1。減退角度θ1、θ2係透明電極層20X之減退區域之表面相對於半導體積層體10X之主面之傾斜角度,換言之,減退角度θ1、θ2係透明電極層20X之減退相對於與半導體積層體10X之主面平行之面(自透明電極層20X之平坦部分之表面延伸之線)之傾斜角度。As shown in FIG. 2 and FIG. 3, the inventors of the present case found that the film thickness of the end of the transparent electrode layer 20X near the mask electrode 20X in the transport direction TD of the semiconductor multilayer body 10X in the PVD method is larger than the center of the transparent electrode layer 20X. The relationship between the reduced regions R1 and R2 where the film thickness is reduced (decreased).
As shown in FIG. 2, if the semiconductor laminated body 10X mounted on the tray TRAY and with a mask MASK disposed on one of the main surface sides of the end is transported in the transport direction TD, the semiconductor laminate exposed at the opening of the mask MASK is transported. A transparent electrode layer 20X is formed on the body 10X.
In this case, as shown in FIG. 3, the width W2 of the decreasing region R2 at the end of the transparent electrode layer 20X on the rear side in the transport direction TD is smaller than the decreasing region R1 of the end of the transparent electrode layer 20X on the front side in the transport direction TD. Width W1 (and the width of the decreasing area on the right and left sides of the conveying direction TD: details will be described later). Further, the widths W1 and W2 of the receding region are the lengths of the receding regions in a direction intersecting the end (edge) of the transparent electrode layer 20X and the end (edge) of the semiconductor multilayer body 10X.
In other words, the receding angle θ2 of the receding region R2 of the end portion of the transparent electrode layer 20X on the rear side in the transport direction TD is larger than the receding angle θ1 of the receding region R1 of the end of the transparent electrode layer 20X on the front side in the transport direction TD. The receding angles θ1 and θ2 are the inclination angles of the surface of the receding area of the transparent electrode layer 20X with respect to the main surface of the semiconductor laminate 10X. In other words, the receding angles θ1 and θ2 are the receding angles of the transparent electrode layer 20X with respect to the semiconductor lamination 10X. The inclination angle of a plane parallel to the main surface (a line extending from the surface of a flat portion of the transparent electrode layer 20X).
因此,本案發明者們發現,於太陽電池單元之製造方法中,使太陽電池單元之長邊部成為透明電極層之端部之減退區域R2之寬度W2較小之搬送方向TD之後側。
藉此,太陽電池單元中之透明電極層之端部(4邊部)之減退區域之總面積減少,從而抑制了太陽電池單元之端部之透明電極層之電阻增大。其結果,抑制了太陽電池單元之輸出降低。Therefore, the inventors of the present invention found that in the method for manufacturing a solar battery cell, the width W2 of the reduced region R2 in which the long side portion of the solar battery cell becomes the end of the transparent electrode layer is smaller in the rearward direction of the transport direction TD.
Thereby, the total area of the fading region of the end portion (four sides) of the transparent electrode layer in the solar battery cell is reduced, thereby suppressing the increase in the resistance of the transparent electrode layer at the end portion of the solar battery cell. As a result, a decrease in the output of the solar cell is suppressed.
又,本案發明者們發現,於太陽電池模組之製造方法中,於形成使用疊瓦方式將太陽電池單元電性連接之太陽電池串時,以相鄰之太陽電池單元之一太陽電池單元中之透明電極層之減退區域R1之寬度W1較大之搬送方向TD之前側之端部成為另一太陽電池單元中之透明電極層之減退區域R2之寬度W2較小之搬送方向TD之後側之端部之下之方式,將相鄰之太陽電池單元重疊。
如此,藉由將一太陽電池單元中之透明電極層之減退區域R1之寬度W1較大之搬送方向TD之前側之端部配置於另一太陽電池單元中之透明電極層之減退區域R2之寬度W2較小之搬送方向TD之後側之端部之遮光區域,而抑制太陽電池單元之輸出降低。
以下,對本實施形態之太陽電池模組、太陽電池單元、太陽電池模組之製造方法、及太陽電池單元之製造方法詳細地進行說明。In addition, the inventors of the present case have found that in the method for manufacturing a solar battery module, when forming a solar battery string that uses a shingle method to electrically connect solar battery cells, one of the adjacent solar battery cells is used in the solar battery string. The width W1 of the decreasing region R1 of the transparent electrode layer is larger, and the end in the front direction of the transport direction TD is smaller than the width W2 of the decreasing region R2 of the transparent electrode layer in the other solar cell. Sub-systems, overlapping adjacent solar cells.
In this way, by arranging the width W1 of the decreasing region R1 of the transparent electrode layer in one solar cell unit to be larger, the end portion on the front side of the transport direction TD is arranged in the width of the decreasing region R2 of the transparent electrode layer in another solar cell unit. W2 has a small light-shielding region at the end portion on the rear side in the transport direction TD, and suppresses a decrease in the output of the solar cell.
Hereinafter, a solar cell module, a solar cell unit, a method of manufacturing a solar cell module, and a method of manufacturing a solar cell unit according to this embodiment will be described in detail.
(太陽電池模組)
圖4係表示本實施形態之太陽電池模組之側視圖。如圖1所示,太陽電池模組100包含至少1個使用疊瓦方式將至少2個長方形狀之雙面電極型之太陽電池單元1電性連接之太陽電池串2。(Solar battery module)
Fig. 4 is a side view showing a solar cell module according to this embodiment. As shown in FIG. 1, the solar battery module 100 includes at least one solar battery string 2 that is electrically connected to at least two rectangular double-sided electrode-type solar battery cells 1 using a shingle method.
太陽電池單元1係串聯地連接。具體而言,相鄰之太陽電池單元1、1中之一太陽電池單元1之X方向(+X方向)之一端側之長邊部之一面側(例如受光面側)之一部分重疊於另一太陽電池單元1之與X方向相反方向(-X方向)之另一端側之長邊部之另一面側(例如背面側)之一部分之下。於太陽電池單元1之一端側之受光面側之一部分、及另一端側之背面側之一部分形成Y方向上延伸之母線電極(後述)。一太陽電池單元1之一端側之受光面側之母線電極例如經由導電性接著劑8(詳情參照圖6)而與另一太陽電池單元1之另一端側之背面側之母線電極電性連接。
如此,如將瓦鋪於房頂般,成為複數個太陽電池單元1均勻地於某一方向整齊傾斜之堆積構造,因此,將以此方式將太陽電池單元1電性連接之方式稱為疊瓦方式。又,將以繩狀連接而成之複數個太陽電池單元1稱為太陽電池串。
以下,將相鄰之太陽電池單元1、1重疊之區域稱為重疊區域Ro。The solar battery cells 1 are connected in series. Specifically, one of the adjacent long side portions of one of the X-direction (+ X-direction) end sides of one of the adjacent solar battery cells 1 and 1 partially overlaps the other one (for example, the light-receiving surface side). The solar cell unit 1 is below a part of the other surface side (for example, the back surface side) of the long side portion of the other end side opposite to the X direction (-X direction). A bus electrode (to be described later) extending in the Y direction is formed on a part of the light receiving surface side of one end side and a part of the back surface side of the other end side of the solar battery cell 1. The bus bar electrode on the light-receiving surface side of one solar battery cell 1 is electrically connected to the bus bar electrode on the back surface side of the other solar battery unit 1 via a conductive adhesive 8 (see FIG. 6 for details).
In this way, if the tiles are laid on the roof, it becomes a stacked structure in which a plurality of solar battery cells 1 are uniformly inclined in a certain direction. Therefore, the method of electrically connecting the solar battery cells 1 in this way is called a shingle. the way. The plurality of solar battery cells 1 connected in a rope shape are referred to as a solar battery string.
Hereinafter, a region where adjacent solar battery cells 1 and 1 overlap is referred to as an overlapping region Ro.
太陽電池單元1由受光側保護構件3及背側保護構件4夾入。於受光側保護構件3與背側保護構件4之間填充有液體狀或固體狀之密封材5,藉此,將太陽電池單元1密封。The solar battery cell 1 is sandwiched between the light-receiving-side protective member 3 and the back-side protective member 4. A liquid or solid sealing material 5 is filled between the light-receiving-side protective member 3 and the back-side protective member 4, thereby sealing the solar battery cell 1.
再者,作為導電性接著劑8,例如可列舉導電性接著膏。此種導電性接著劑膏係例如環氧樹脂、丙烯酸樹脂、或聚胺酯樹脂等熱固型接著性樹脂材料中分散有導電性粒子之膏狀之接著劑。但,並不限於此,例如,亦可使用使導電性粒子分散於熱固型之接著性樹脂材料形成為膜狀之導電性接著膜或各向異性導電膜。Examples of the conductive adhesive 8 include a conductive adhesive paste. Such a conductive adhesive paste is a paste-like adhesive in which conductive particles are dispersed in a thermosetting adhesive resin material such as an epoxy resin, an acrylic resin, or a polyurethane resin. However, the invention is not limited to this. For example, a conductive adhesive film or an anisotropic conductive film in which conductive particles are dispersed in a thermosetting adhesive resin material and formed into a film shape may be used.
密封材5係密封保護太陽電池單元1者,介置於太陽電池單元1之受光側之面與受光側保護構件3之間、及太陽電池單元1之背側之面與背側保護構件4之間。
作為密封材5之形狀並無特別限定,例如,可列舉片狀。其原因在於,若為片狀,則容易被覆面狀之太陽電池之表面及背面。
作為密封材5之材料,並無特別限定,但較佳為具有使光透過之特性(透光性)。又,密封材5之材料較佳為具有使太陽電池單元1、受光側保護構件3及背側保護構件4接著之接著性。
作為此種材料,例如可列舉乙烯/乙酸乙烯酯共聚物(EVA)、乙烯/α-烯烴共聚物、乙烯/乙酸乙烯酯/異氰尿酸三烯丙酯(EVAT)、聚乙烯丁醛(PVB)、丙烯酸樹脂、聚胺酯樹脂、或矽酮樹脂等透光性樹脂。The sealing material 5 seals and protects the solar cell unit 1 and is interposed between the light-receiving-side surface of the solar cell unit 1 and the light-receiving-side protective member 3, and the back surface of the solar cell 1 and the back-side protective member 4. between.
The shape of the sealing material 5 is not particularly limited, and examples thereof include a sheet shape. The reason is that, if it is sheet-like, it is easy to coat the front and back surfaces of the solar cell in a surface shape.
The material of the sealing material 5 is not particularly limited, but it is preferable to have a characteristic (light-transmitting property) for transmitting light. Moreover, it is preferable that the material of the sealing material 5 has adhesiveness to which the solar cell 1, the light receiving side protection member 3, and the back side protection member 4 are adhered.
Examples of such materials include ethylene / vinyl acetate copolymer (EVA), ethylene / α-olefin copolymer, ethylene / vinyl acetate / triallyl isocyanurate (EVAT), and polyvinyl butyraldehyde (PVB ), Acrylic resin, polyurethane resin, or silicone resin.
受光側保護構件3係介隔密封材5覆蓋太陽電池單元1之表面(受光面),從而保護該太陽電池單元1。
作為受光側保護構件3之形狀,並無特別限定,但根據間接地覆蓋面狀之受光面之方面,較佳為板狀或片狀。
作為受光側保護構件3之材料,並無特別限定,但較佳為與密封材5同樣地一面具有透光性一面對於紫外光具有耐受性之材料,例如,可列舉玻璃、或丙烯酸樹脂或聚碳酸酯樹脂等透明樹脂。又,受光側保護構件3之表面可加工為凹凸狀,亦可由抗反射塗層被覆。其原因在於,若如此地構成,則可使受光側保護構件3不易反射所接收之光,從而可將更多之光導入至太陽電池單元1。The light-receiving-side protection member 3 covers the surface (light-receiving surface) of the solar battery cell 1 with a sealing material 5 interposed therebetween, thereby protecting the solar battery cell 1.
The shape of the light-receiving-side protective member 3 is not particularly limited, but it is preferably a plate-like or sheet-like shape in terms of indirectly covering the planar light-receiving surface.
The material of the light-receiving-side protective member 3 is not particularly limited, but it is preferably a material that is light-transmissive and resistant to ultraviolet light, like the sealing material 5, and examples thereof include glass, acrylic resin, or Transparent resin such as polycarbonate resin. In addition, the surface of the light-receiving-side protective member 3 may be processed into a concave-convex shape, or may be covered with an anti-reflection coating. The reason is that if configured in this manner, the light-receiving-side protective member 3 can make it difficult to reflect the received light, and more light can be introduced into the solar battery cell 1.
背側保護構件4係介隔密封材5覆蓋太陽電池單元1之背面,保護該太陽電池單元1。
作為背側保護構件4之形狀並無特別限定,但與受光側保護構件3同樣地,根據間接地覆蓋面狀之背面之方面,較佳為板狀或片狀。
作為背側保護構件4之材料,並無特別限定,但較佳為防止水等滲入之(遮水性較高之)材料。例如,可列舉聚對苯二甲酸乙二酯(PET)、聚乙烯(PE)、烯烴系樹脂、含氟樹脂、或含矽酮樹脂等樹脂膜與鋁箔等金屬箔之積層體。
以下,對太陽電池單元1詳細地進行說明。The back-side protection member 4 covers the back surface of the solar battery cell 1 with a sealing material 5 interposed therebetween to protect the solar battery cell 1.
The shape of the back-side protective member 4 is not particularly limited, but, like the light-receiving-side protective member 3, it is preferably plate-shaped or sheet-shaped in terms of covering the planar back surface indirectly.
The material of the back-side protective member 4 is not particularly limited, but a material (higher water-shielding property) that prevents penetration of water or the like is preferred. For example, a laminate of a resin film such as polyethylene terephthalate (PET), polyethylene (PE), an olefin-based resin, a fluorine-containing resin, or a silicone-containing resin, and a metal foil such as an aluminum foil can be cited.
Hereinafter, the solar battery cell 1 will be described in detail.
(太陽電池單元)
圖5係自受光面側觀察本實施形態之太陽電池單元所得之圖,圖6係圖5所示之VI-VI線剖視圖。圖5及圖6所示之太陽電池單元1係長方形狀之雙面電極型之太陽電池單元。太陽電池單元1具有:半導體積層體10,其具有2個主面;透明電極層20,其形成於半導體積層體10之主面中之一面側(例如受光面側)之大致整面;金屬電極層21,其形成於透明電極層20上;透明電極層30,其形成於半導體積層體10之主面中之另一面側(例如背面側)之大致整面;及金屬電極層31,其形成於透明電極層30上。(Solar battery unit)
FIG. 5 is a diagram obtained by observing the solar battery cell according to this embodiment from the light receiving surface side, and FIG. 6 is a cross-sectional view taken along the line VI-VI shown in FIG. 5. The solar battery cell 1 shown in FIGS. 5 and 6 is a rectangular double-sided electrode type solar battery cell. The solar cell 1 includes a semiconductor multilayer body 10 having two main surfaces, a transparent electrode layer 20 formed on a substantially entire surface side (for example, a light-receiving surface side) of the main surfaces of the semiconductor multilayer body 10, and a metal electrode. A layer 21 is formed on the transparent electrode layer 20; a transparent electrode layer 30 is formed on the substantially entire surface of the other surface side (for example, the back surface side) of the main surface of the semiconductor laminate 10; and a metal electrode layer 31 is formed On the transparent electrode layer 30.
圖7係圖6所示之半導體積層體10之區域A之放大圖。如圖7所示,半導體積層體10具有:半導體基板(光電轉換基板)110,其具有2個主面;鈍化層120及第1導電型半導體層121,其等依序積層於半導體基板110之主面中之一面側(例如受光面側);及鈍化層130及第2導電型半導體層131,其等依序積層於半導體基板110之主面中之另一面側(例如背面側)。FIG. 7 is an enlarged view of a region A of the semiconductor multilayer body 10 shown in FIG. 6. As shown in FIG. 7, the semiconductor multilayer body 10 includes a semiconductor substrate (photoelectric conversion substrate) 110 having two main surfaces, a passivation layer 120 and a first conductive semiconductor layer 121, which are sequentially laminated on the semiconductor substrate 110. One of the main surfaces (for example, the light-receiving surface side); and the passivation layer 130 and the second conductive semiconductor layer 131 are sequentially laminated on the other surface (for example, the back surface) of the main surface of the semiconductor substrate 110.
<半導體基板>
作為半導體基板110,使用導電型單晶矽基板、例如n型單晶矽基板或p型單晶矽基板。藉此,實現較高之光電轉換效率。
半導體基板110較佳為n型單晶矽基板。藉此,結晶矽基板內之載子壽命變長。其原因在於:於p型單晶矽基板中,存在因光照射而產生受作為p型摻雜劑之B(硼)影響成為再鍵結中心之LID(Light Induced Degradation,光衰退)之情形,但於n型單晶矽基板中,更抑制LID。< Semiconductor substrate >
As the semiconductor substrate 110, a conductive single crystal silicon substrate such as an n-type single crystal silicon substrate or a p-type single crystal silicon substrate is used. Thereby, a higher photoelectric conversion efficiency is achieved.
The semiconductor substrate 110 is preferably an n-type single crystal silicon substrate. As a result, the carrier life in the crystalline silicon substrate becomes longer. The reason is that in a p-type single crystal silicon substrate, there is a case where a light-induced LID (Light Induced Degradation) which is affected by B (boron) as a p-type dopant is caused by light irradiation. However, in an n-type single crystal silicon substrate, LID is more suppressed.
半導體基板110於背面側具有稱為紋理構造之稜錐型之微細之凹凸構造。藉此,未被半導體基板110吸收而通過之光之回收效率提昇。
又,半導體基板110亦可於受光面側具有被稱為紋理構造之稜錐型之微細之凹凸構造。藉此,於受光面,入射光之反射減少,半導體基板11中之光封閉效應提昇。The semiconductor substrate 110 has a pyramid-shaped fine uneven structure called a texture structure on the back surface side. Thereby, the recovery efficiency of the light which is not absorbed by the semiconductor substrate 110 and passed through is improved.
In addition, the semiconductor substrate 110 may have a fine uneven structure called a pyramid structure called a texture structure on the light receiving surface side. Thereby, the reflection of the incident light on the light receiving surface is reduced, and the light confinement effect in the semiconductor substrate 11 is improved.
半導體基板110之厚度較佳為50 μm以上250 μm以下,更佳為60 μm以上230 μm以下,進而較佳為70 μm以上210 μm以下。藉此,材料成本降低。
再者,作為半導體基板110,亦可使用導電型多晶矽基板、例如n型多晶矽基板或p型多晶矽基板。於此情形時,更經濟地製造太陽電池。The thickness of the semiconductor substrate 110 is preferably 50 μm to 250 μm, more preferably 60 μm to 230 μm, and even more preferably 70 μm to 210 μm. This reduces the material cost.
Moreover, as the semiconductor substrate 110, a conductive polycrystalline silicon substrate, such as an n-type polycrystalline silicon substrate or a p-type polycrystalline silicon substrate, can also be used. In this case, it is more economical to manufacture solar cells.
<第1導電型半導體層及第2導電型半導體層>
第1導電型半導體層121係介隔鈍化層120形成於半導體基板110之受光面側之大致整面,第2導電型半導體層131係介隔鈍化層130形成於半導體基板110之背面側之大致整面。<First conductivity type semiconductor layer and second conductivity type semiconductor layer>
The first conductive type semiconductor layer 121 is formed on the substantially entire surface of the light receiving surface side of the semiconductor substrate 110, and the second conductive type semiconductor layer 131 is formed on the substantially back surface side of the semiconductor substrate 110. Whole surface.
第1導電型半導體層121係由第1導電型矽系層例如p型矽系層形成。第2導電型半導體層131係由與第1導電型不同之第2導電型之矽系層例如n型矽系層形成。再者,第1導電型半導體層121亦可為n型矽系層,第2導電型半導體層131亦可為p型矽系層。
p型矽系層及n型矽系層係由非晶質矽層或包含非晶質矽及晶質矽之微晶矽層形成。作為p型矽系層之摻雜劑雜質,較佳地使用B(硼),作為n型矽系層之摻雜劑雜質,較佳地使用P(磷)。The first conductive type semiconductor layer 121 is formed of a first conductive type silicon-based layer such as a p-type silicon-based layer. The second conductivity type semiconductor layer 131 is formed of a silicon-based layer of a second conductivity type different from the first conductivity type, such as an n-type silicon-based layer. The first conductive semiconductor layer 121 may be an n-type silicon-based layer, and the second conductive semiconductor layer 131 may be a p-type silicon-based layer.
The p-type silicon-based layer and the n-type silicon-based layer are formed of an amorphous silicon layer or a microcrystalline silicon layer including amorphous silicon and crystalline silicon. As the dopant impurity of the p-type silicon-based layer, B (boron) is preferably used, and as the dopant impurity of the n-type silicon-based layer, P (phosphorus) is preferably used.
<鈍化層>
鈍化層120、130係由本徵矽系層形成。鈍化層120、130作為鈍化層發揮功能,抑制載子之再鍵結。< Passivation layer >
The passivation layers 120 and 130 are formed of an intrinsic silicon-based layer. The passivation layers 120 and 130 function as a passivation layer and suppress re-bonding of carriers.
<透明電極層>
再次參照圖5及圖6進行說明。透明電極層20形成於半導體積層體10之受光面側之大致整面,透明電極層30形成於半導體積層體10之背面側之大致整面。
透明電極層20、30由透明導電性材料形成。作為透明導電性材料使用透明導電性金屬氧化物、例如氧化銦、氧化錫、氧化鋅、氧化鈦及其等之複合氧化物等。其等之中,較佳為以氧化銦為主成分之銦系複合氧化物。根據較高之導電率及透明性之觀點,尤佳為銦氧化物。進而,為了確保可靠性或更高之導電率,較佳為於銦氧化物中添加摻雜劑。作為摻雜劑,例如可列舉Sn、W、Zn、Ti、Ce、Zr、Mo、Al、Ga、Ge、As、Si或S等。< Transparent electrode layer >
The description will be made with reference to FIGS. 5 and 6 again. The transparent electrode layer 20 is formed on the substantially entire surface of the light-receiving surface side of the semiconductor multilayer body 10, and the transparent electrode layer 30 is formed on the substantially entire surface of the rear surface side of the semiconductor multilayer body 10.
The transparent electrode layers 20 and 30 are formed of a transparent conductive material. As the transparent conductive material, transparent conductive metal oxides such as indium oxide, tin oxide, zinc oxide, titanium oxide, and composite oxides thereof are used. Among these, an indium-based composite oxide containing indium oxide as a main component is preferred. From the viewpoint of higher electrical conductivity and transparency, indium oxide is particularly preferred. Furthermore, in order to ensure reliability or higher conductivity, it is preferable to add a dopant to the indium oxide. Examples of the dopant include Sn, W, Zn, Ti, Ce, Zr, Mo, Al, Ga, Ge, As, Si, and S.
透明電極層30係利用不使用遮罩之線內PVD法形成,透明電極層20係利用使用遮罩之線內PVD法形成。透明電極層20於半導體積層體10之受光面側,於成為太陽電池單元1之長邊部之長邊區域RL及成為太陽電池單元之短邊部之短邊區域RS配置遮罩,且將與長邊區域RL交叉之X方向作為搬送方向,一面搬送半導體積層體10一面利用PVD法形成(詳情後述)。
藉此,形成遮罩附近之透明電極層20之端部(4邊部)之膜厚較透明電極層20之中央部之膜厚更減退之減退區域。X方向(搬送方向)之後側之透明電極層20之端部之減退區域R2之寬度W2小於X方向(搬送方向)之前側之透明電極層20之端部之減退區域R1之寬度W1{及X方向之右側及左側(相對於搬送方向之交叉方向上之兩端側)之透明電極層20之端部之減退區域之寬度:詳情後述}。換言之,太陽電池單元之長邊部中之另一端側之長邊部中之透明電極層20之端部之減退區域R2之寬度W2小於一端側之長邊部中之透明電極層20之端部之減退區域R1之寬度W1(及短邊部之透明電極層20之端部之減退區域之寬度)。
再者,所謂減退區域係透明電極層20之端部之膜厚相較透明電極層20之中央部之膜厚減退之區域,所謂減退區域之寬度W1、W2係與透明電極層20之端部(邊部)及半導體積層體10之端部(邊部)交叉之方向上之減退區域之長度。The transparent electrode layer 30 is formed using the in-line PVD method without using a mask, and the transparent electrode layer 20 is formed using the in-line PVD method using a mask. The transparent electrode layer 20 is arranged on the light-receiving surface side of the semiconductor multilayer body 10, and a mask is disposed on the long-side region RL that becomes the long-side portion of the solar battery cell 1 and the short-side region RS that becomes the short-side portion of the solar battery cell. The X direction at which the long-side region RL intersects is taken as a conveyance direction, and is formed by a PVD method while conveying the semiconductor multilayer body 10 (described later in detail).
As a result, a reduced region where the film thickness of the end portion (four sides) of the transparent electrode layer 20 near the mask is smaller than the film thickness of the central portion of the transparent electrode layer 20 is formed. The width W2 of the receding region R2 at the end of the transparent electrode layer 20 on the rear side in the X direction (conveying direction) is smaller than the width W1 of the receding region R1 on the end of the transparent electrode layer 20 on the front side in the X direction (conveying direction). The width of the decreasing region of the end of the transparent electrode layer 20 on the right side and the left side (both ends in the crossing direction with respect to the conveying direction) of the direction: details will be described later}. In other words, the width W2 of the fade region R2 of the end portion of the transparent electrode layer 20 in the long side portion of the other end side of the solar cell is smaller than the end portion of the transparent electrode layer 20 in the long side portion of the one end side. The width W1 of the reduced region R1 (and the width of the reduced region of the end of the transparent electrode layer 20 at the short side portion).
In addition, the so-called reduced region refers to a region where the film thickness of the end portion of the transparent electrode layer 20 decreases compared to the film thickness of the central portion of the transparent electrode layer 20, and the width W1, W2 of the so-called reduced region is to the end portion of the transparent electrode layer 20 ( The length of the receding region in the direction in which the edge portion) and the end portion (side portion) of the semiconductor multilayer body 10 intersect.
又,X方向(搬送方向)之後側之透明電極層20之端部之減退區域R2之減退角度θ2大於X方向(搬送方向)之前側之透明電極層20之端部之減退區域R1之減退角度θ1{及X方向之右側及左側(相對於搬送方向之交叉方向上之兩端側)之透明電極層20之端部之減退區域之減退角度}。換言之,太陽電池單元之另一端側之長邊部中之透明電極層20之端部之減退區域R2之減退角度θ2大於太陽電池單元之一端側之長邊部中之透明電極層20之端部之減退區域R1之減退角度θ1(及短邊部之透明電極層20之端部之減退區域之減退角度)。
再者,所謂減退角度θ1、θ2係透明電極層20之減退區域之表面相對於半導體積層體10之主面之傾斜角度,換言之為透明電極層20之減退相對於半導體積層體10之與主面平行之面(自透明電極之平坦部分之表面延伸之線)之傾斜角度。The receding angle θ2 of the receding region R2 at the end of the transparent electrode layer 20 on the rear side in the X direction (conveying direction) is larger than the receding angle of the receding region R1 on the end of the transparent electrode layer 20 on the front side in the X direction (conveying direction). θ1 {the receding angle of the receding region of the end of the transparent electrode layer 20 on the right and left sides of the X-direction (both ends in the direction of the cross with respect to the conveying direction)}. In other words, the receding angle θ2 of the receding region R2 of the end portion of the transparent electrode layer 20 in the long side portion of the other end side of the solar cell is larger than the end portion of the transparent electrode layer 20 in the long side portion of the one end side of the solar cell The receding angle θ1 of the receding area R1 (and the receding angle of the receding area of the end of the transparent electrode layer 20 in the short side portion).
In addition, the so-called receding angles θ1 and θ2 are the angles of inclination of the surface of the decreasing region of the transparent electrode layer 20 with respect to the main surface of the semiconductor laminate 10, in other words, the decreasing of the transparent electrode layer 20 with respect to the main surface of the semiconductor multilayer 10 Angles of inclination of parallel faces (lines extending from the surface of a flat portion of a transparent electrode).
再者,較佳為因遮罩而未形成透明電極層20之長邊區域RL、及透明電極層20之膜厚減退之減退區域R1、R2包含於上述重疊區域Ro。Furthermore, it is preferable that the long-side region RL of the transparent electrode layer 20 and the decrease regions R1 and R2 of the film thickness of the transparent electrode layer 20 not be formed by the mask are included in the overlapping region Ro.
金屬電極層21係形成於透明電極層20上,金屬電極層31係形成於透明電極層30上。
金屬電極層21、31係由金屬材料形成。作為金屬材料,例如使用Cu、Ag、Al及其等之合金。The metal electrode layer 21 is formed on the transparent electrode layer 20, and the metal electrode layer 31 is formed on the transparent electrode layer 30.
The metal electrode layers 21 and 31 are formed of a metal material. As the metal material, for example, an alloy of Cu, Ag, Al, or the like is used.
金屬電極層21形成所謂梳形之形狀,且具有相當於梳齒之複數個指狀電極部21f、及相當於梳齒之支持部之母線電極部21b。母線電極部21b沿著X方向之一端側(搬送方向之前側)之受光面側(一主面側)之一部分重疊區域Ro、尤其沿搬送方向之前側之長邊區域RL之減退區域R1於Y方向延伸。指狀電極部21f自母線電極部21b於與Y方向交叉之X方向延伸。The metal electrode layer 21 has a so-called comb shape, and includes a plurality of finger electrode portions 21f corresponding to comb teeth, and a bus bar electrode portion 21b corresponding to a support portion of the comb teeth. The bus bar electrode portion 21b partially overlaps with one of the light receiving surface side (one main surface side) along one end side in the X direction (front side in the conveying direction), particularly the decreasing region R1 of the long side region RL along the front side in the conveying direction. Direction. The finger electrode portion 21f extends from the bus bar electrode portion 21b in the X direction crossing the Y direction.
金屬電極層31例如形成於背面側。而且,該金屬電極層31與金屬電極層21同樣為梳形之形狀。即,金屬電極層31具有相當於梳齒之複數個指狀電極部31f、及相當於梳齒之支持部之母線電極部31b。母線電極部31b沿著X方向之另一端側(搬送方向之後側)之背面側(另一主面側)之一部分重疊區域Ro於Y方向延伸。指狀電極部31f自母線電極部31b於與Y方向交叉之X方向延伸。再者,金屬電極層31並不限定於梳形,例如,亦可矩形狀地形成於太陽電池單元1之背面側之大致整體上。
又,於金屬電極層31之重疊區域Ro(例如金屬電極層31之母線電極部31b)上設置用以製作上述太陽電池串之導電性接著劑8。再者,導電性接著劑8亦可設置於受光面側之金屬電極層21之重疊區域Ro(例如金屬電極層21之母線電極部21b)上而代替設置於背面側之金屬電極層31之重疊區域Ro。The metal electrode layer 31 is formed on the back surface side, for example. The metal electrode layer 31 has a comb-like shape similar to the metal electrode layer 21. That is, the metal electrode layer 31 includes a plurality of finger electrode portions 31 f corresponding to comb teeth, and a bus bar electrode portion 31 b corresponding to a support portion of the comb teeth. The bus bar electrode portion 31 b extends along a part of the overlapping area Ro along the rear side (the other main surface side) of the other end side (the rear side in the conveying direction) of the X direction in the Y direction. The finger electrode portion 31f extends from the bus bar electrode portion 31b in the X direction crossing the Y direction. The metal electrode layer 31 is not limited to a comb shape, and may be formed in a rectangular shape over the entire back surface side of the solar battery cell 1, for example.
A conductive adhesive 8 for forming the solar cell string is provided on the overlapping region Ro (for example, the bus electrode portion 31b of the metal electrode layer 31) of the metal electrode layer 31. In addition, the conductive adhesive 8 may be provided on the overlapping area Ro of the metal electrode layer 21 on the light-receiving surface side (for example, the bus electrode portion 21b of the metal electrode layer 21) instead of the overlap of the metal electrode layer 31 provided on the back surface side. Area Ro.
(太陽電池單元之製造方法)
其次,參照圖5~7及圖8~圖11,對本實施形態之太陽電池之製造方法進行說明。圖8係表示本實施形態之太陽電池單元之製造方法中之透明電極層形成步驟之圖,圖9~11係表示本實施形態之太陽電池單元之製造方法中之太陽電池單元切斷形成步驟之圖。(Manufacturing method of solar cell)
Next, a method for manufacturing a solar cell according to this embodiment will be described with reference to FIGS. 5 to 7 and FIGS. 8 to 11. FIG. 8 is a diagram showing the steps of forming a transparent electrode layer in the method for manufacturing a solar battery cell according to this embodiment, and FIGS. 9 to 11 are diagrams showing the steps of forming a solar cell in the method for manufacturing a solar battery cell according to this embodiment. Illustration.
首先,於半導體基板(例如n型單晶矽基板)110之受光面側之大致整面積層鈍化層(例如本徵矽系層)120(參照圖7)。又,於半導體基板110之背面側之大致整面積層鈍化層(例如本徵矽系層)130(參照圖7)。
其後,於鈍化層120上、即半導體基板110之受光面側之大致整面積層第1導電型半導體層(例如p型矽系層)121(參照圖7)。又,於鈍化層130上、即半導體基板110之背面側之大致整面積層第2導電型半導體層(例如n型矽系層)131(參照圖7)。First, a passivation layer (for example, an intrinsic silicon-based layer) 120 is formed on a substantially entire area of a light receiving surface side of a semiconductor substrate (for example, an n-type single crystal silicon substrate) 110 (see FIG. 7). Further, a passivation layer (for example, an intrinsic silicon-based layer) 130 is formed on the substantially entire area of the back surface side of the semiconductor substrate 110 (see FIG. 7).
Thereafter, a first conductive semiconductor layer (for example, a p-type silicon-based layer) 121 (see FIG. 7) is formed on the passivation layer 120, that is, a substantially entire area of the light receiving surface side of the semiconductor substrate 110. A second conductive type semiconductor layer (for example, an n-type silicon-based layer) 131 is formed on the passivation layer 130, that is, a substantially entire area of the back surface side of the semiconductor substrate 110 (see FIG. 7).
鈍化層120、130、第1導電型半導體層121及第2導電型半導體層131之形成方法並無特別限定,但較佳為使用電漿CVD(chemical vapor deposition,化學氣相沈積)法。作為電漿CVD法之製膜條件,例如,較佳地使用基板溫度100~300℃、壓力20~2600 Pa、高頻功率密度0.004~0.8 W/cm2
。作為材料氣體,例如較佳地使用SiH4
、Si2
H6
等含矽氣體、或矽系氣體與氫氣H2
之混合氣體。
作為第1導電型半導體層121之摻雜劑添加氣體,例如較佳地使用經氫稀釋之B2
H6
。作為第2導電型半導體層131之摻雜劑添加氣體,例如較佳地使用經氫稀釋之PH3
。
又,為提昇光之透過性,例如,亦可微量添加氧或碳等雜質。於此情形時,例如,於CVD製膜時導入CO2
或CH4
等氣體。
根據使用電漿CVD法之製膜,可根據製膜條件而相對容易地控制膜質,因此,折射率之調整變得容易。
藉由以上步驟而獲得半導體積層體10。The formation method of the passivation layers 120 and 130, the first conductive type semiconductor layer 121, and the second conductive type semiconductor layer 131 is not particularly limited, but a plasma CVD (chemical vapor deposition) method is preferably used. As the film forming conditions of the plasma CVD method, for example, a substrate temperature of 100 to 300 ° C., a pressure of 20 to 2600 Pa, and a high-frequency power density of 0.004 to 0.8 W / cm 2 are preferably used. As the material gas, for example, a silicon-containing gas such as SiH 4 or Si 2 H 6 or a mixed gas of a silicon-based gas and hydrogen H 2 is preferably used.
As the dopant additive gas of the first conductive type semiconductor layer 121, for example, B 2 H 6 diluted with hydrogen is preferably used. As the dopant addition gas of the second conductive type semiconductor layer 131, for example, PH 3 diluted with hydrogen is preferably used.
Moreover, in order to improve the light transmittance, for example, impurities such as oxygen and carbon may be added in a small amount. In this case, for example, a gas such as CO 2 or CH 4 is introduced during CVD film formation.
According to the film formation using the plasma CVD method, the film quality can be relatively easily controlled according to the film formation conditions, and therefore, the adjustment of the refractive index becomes easy.
The semiconductor laminated body 10 is obtained by the above steps.
繼而,如圖8所示,於第1導電型半導體層121上、即半導體積層體10之受光面側之大致整面積層透明電極層20。
作為透明電極層20之形成方法,使用濺鍍法等物理氣相生長法(PVD)。此時,以覆蓋成為太陽電池單元1之長邊部之預定之長邊區域RL及成為太陽電池單元1之短邊部之預定之短邊區域RS之受光面側之方式,配置遮罩MASK,將與長邊區域RL交叉之X方向作為搬送方向TD,一面搬送半導體積層體10,一面於半導體積層體10之受光面側形成透明電極層20(透明電極層形成步驟)。Then, as shown in FIG. 8, a transparent electrode layer 20 is formed on the first conductive type semiconductor layer 121, that is, on the light receiving surface side of the semiconductor multilayer body 10, over the entire area.
As a method of forming the transparent electrode layer 20, a physical vapor growth method (PVD) such as a sputtering method is used. At this time, the mask MASK is arranged so as to cover the light-receiving surface side of the predetermined long-side region RL that becomes the long-side portion of the solar battery unit 1 and the predetermined short-side region RS that becomes the short-side portion of the solar battery unit 1, Using the X direction intersecting the long-side region RL as the transport direction TD, the semiconductor laminated body 10 is transported, and the transparent electrode layer 20 is formed on the light receiving surface side of the semiconductor laminated body 10 (transparent electrode layer forming step).
繼而,於第2導電型半導體層131上、即半導體積層體10之背面側之大致整面積層透明電極層30。
作為透明電極層30之形成方法,使用濺鍍法等物理氣相生長法(PVD)。此時,一面搬送半導體積層體10,一面於半導體積層體10之背面側形成透明電極層30(透明電極層形成步驟)。Then, a transparent electrode layer 30 is layered on the second conductive type semiconductor layer 131, that is, the entire entire area of the back surface side of the semiconductor laminate 10.
As a method of forming the transparent electrode layer 30, a physical vapor growth method (PVD) such as a sputtering method is used. At this time, a transparent electrode layer 30 is formed on the rear surface side of the semiconductor multilayer body 10 while the semiconductor multilayer body 10 is conveyed (transparent electrode layer forming step).
PVD法製膜時之壓力較佳為0.3 Pa以上0.6 Pa以下。若壓力小於0.3 Pa,則放電不穩定。若壓力大於0.6 Pa,則減退區域減少,但透明電極層之電阻增大,導致速率降低。
搬送速度較佳為500 mm/分鐘以上1500 mm/分鐘以下。若使搬送速度大於1500 mm/分鐘,則必須為獲得必需之膜厚而提昇PVD法中之功率,但若提昇功率,則太陽電池單元之性能降低。若使搬送速度小於500 mm/分鐘,則必須為獲得必需之膜厚而使生產線長距離化,但若使生產線長距離化,則導致生PVD裝置之大型化、高價格化。
配置於下述切斷步驟中被切斷之長邊區域RL之遮罩之搬送方向TD之寬度較佳為1.0 mm以上1.4 mm以下。1.0 mm係加工極限值。若遮罩之寬度變得大於1.4 mm,則於使用疊瓦方式之太陽電池模組化時,減退區域未收斂於重疊區域內,因減退區域導致之太陽電池單元之輸出降低之抑制效果減輕。The pressure during PVD film formation is preferably 0.3 Pa or more and 0.6 Pa or less. If the pressure is less than 0.3 Pa, the discharge is unstable. If the pressure is greater than 0.6 Pa, the decay region decreases, but the resistance of the transparent electrode layer increases, resulting in a decrease in the rate.
The conveying speed is preferably from 500 mm / minute to 1500 mm / minute. If the conveying speed is greater than 1500 mm / min, the power in the PVD method must be increased in order to obtain the necessary film thickness, but if the power is increased, the performance of the solar cell unit is reduced. If the conveying speed is less than 500 mm / min, the production line must be long-distance in order to obtain the necessary film thickness. However, if the production line is long-distance, the size and cost of the PVD device will be increased.
The width of the conveyance direction TD of the mask arranged in the long-side region RL cut in the following cutting step is preferably 1.0 mm or more and 1.4 mm or less. 1.0 mm is the processing limit. If the width of the mask becomes larger than 1.4 mm, when the solar cell module using the shingle method is modularized, the decrease region does not converge within the overlap region, and the suppression effect of the decrease in the output of the solar cell caused by the decrease region is reduced.
繼而,於透明電極層20上、即半導體積層體10之受光面側形成金屬電極層21。此時,沿著X方向之一端側之一部分重疊區域Ro、尤其透明電極層20之製膜時沿搬送方向之前側之長邊區域RL之減退區域R1,形成Y方向上延伸之母線電極部21b。
又,於透明電極層30上、即半導體積層體10之背面側形成金屬電極層31。此時,形成沿著X方向之另一端側(搬送方向之後側)之背面側(另一主面側)之一部分重疊區域Ro於Y方向延伸之母線電極部31b。Then, a metal electrode layer 21 is formed on the transparent electrode layer 20, that is, on the light-receiving surface side of the semiconductor multilayer body 10. At this time, a partially overlapping region Ro along one end side in the X direction, in particular, the reduced region R1 along the long side region RL on the front side in the transport direction during film formation of the transparent electrode layer 20 forms a bus bar electrode portion 21b extending in the Y direction. .
A metal electrode layer 31 is formed on the transparent electrode layer 30, that is, on the back surface side of the semiconductor laminate 10. At this time, a bus bar electrode portion 31 b extending in the Y direction is formed in a partially overlapping region Ro on the back surface side (the other main surface side) along the other end side in the X direction (the rear side in the conveying direction).
其後,如圖9(為方便起見,省略金屬電極層21)所示,於長邊區域RL沿著切斷線CL、即於藉由遮罩MASK而未形成透明電極層20之透明電極層20非形成區域,使用雷射將半導體積層體10切斷。如此,如圖10及圖11所示,將半導體積層體10細分(為方便起見,省略金屬電極層21)。
繼之,藉由以上步驟,完成圖5及圖6所示之太陽電池單元1。Thereafter, as shown in FIG. 9 (the metal electrode layer 21 is omitted for convenience), the transparent electrode of the transparent electrode layer 20 is not formed by masking MASK along the cutting line CL in the long-side region RL. The layer 20 is a non-formation region, and the semiconductor multilayer body 10 is cut using a laser. In this way, as shown in FIGS. 10 and 11, the semiconductor multilayer body 10 is subdivided (for convenience, the metal electrode layer 21 is omitted).
Then, through the above steps, the solar cell unit 1 shown in FIG. 5 and FIG. 6 is completed.
(太陽電池模組之製造方法)
其次,對本實施形態之太陽電池模組之製造方法進行說明。
首先,如圖4所示,使用疊瓦方式將至少2個長方形狀之太陽電池單元1電性連接,獲得太陽電池串2(太陽電池串形成步驟)。具體而言,將相鄰之太陽電池單元1、1中之一太陽電池單元1之搬送方向TD之前側之長邊部之受光面側之一部分重疊於另一太陽電池單元1之搬送方向TD之後側之長邊部之背面側之一部分之下,經由導電性接著劑8將相鄰之太陽電池單元1、1彼此連接。藉由對所需數量之太陽電池單元1進行此種連接,而完成包含複數個太陽電池單元1之太陽電池串2。(Manufacturing method of solar cell module)
Next, a method for manufacturing a solar cell module according to this embodiment will be described.
First, as shown in FIG. 4, at least two rectangular solar battery cells 1 are electrically connected using a shingle method to obtain a solar battery string 2 (solar battery string forming step). Specifically, one of the light receiving surface sides of the long side portion of the front side of the transport direction TD of one of the adjacent solar cells 1 and 1 overlaps the transport direction TD of the other solar cell 1 Under one part of the back side of the long side portion on the side, adjacent solar battery cells 1 and 1 are connected to each other via a conductive adhesive 8. By making such connection to the required number of solar battery cells 1, a solar battery string 2 including a plurality of solar battery cells 1 is completed.
繼而,將背側保護構件4、密封材5、至少1個太陽電池串2、密封材5、及受光側保護構件3依序重疊,並使用進行真空排氣之貼合機等於特定之溫度、壓力下進行加熱、加壓,藉此,進行密封。
藉由以上步驟,完成圖4所示之太陽電池模組100。
再者,太陽電池模組100之製造方法並無特別限定。Then, the back side protection member 4, the sealing material 5, at least one solar cell string 2, the sealing material 5, and the light receiving side protection member 3 are sequentially stacked, and a vacuum bonding machine is used to equalize a specific temperature, Heating and pressing are performed under pressure to seal.
Through the above steps, the solar cell module 100 shown in FIG. 4 is completed.
In addition, the manufacturing method of the solar cell module 100 is not particularly limited.
如以上所說明,根據本實施形態之太陽電池單元之製造方法,於透明電極層形成步驟中,於在半導體積層體10之受光面側形成透明電極層20時,於成為太陽電池單元1之長邊部之長邊區域RL及成為太陽電池單元1之短邊部之短邊區域RS之受光面側配置遮罩,將與長邊區域RL交叉之X方向設為搬送方向TD,一面搬送半導體積層體10一面利用PVD法形成透明電極層20。
根據藉由該製造方法製造所得之太陽電池單元1,於半導體積層體10之受光面側,太陽電池單元1之長邊部中之另一端側之長邊部中之透明電極層20之端部之減退區域R2之寬度W2小於太陽電池單元1之長邊部中之一端側之長邊部中之透明電極層20之端部之減退區域R1之寬度W1。
藉此,太陽電池單元1中之透明電極層20之端部(4邊部)之減退區域之總面積減少,太陽電池單元1之端部之透明電極層20之電阻增大得以抑制。其結果,太陽電池單元1之輸出降低得以抑制。
進而,根據本實施形態之太陽電池單元之製造方法,可抑制雷射切斷時於半導體積層體10之切斷面、尤其半導體基板(光電轉換基板)之切斷面附著透明電極層20,從而可抑制太陽電池單元1之性能降低。As described above, according to the method for manufacturing a solar cell according to this embodiment, in the step of forming the transparent electrode layer, when the transparent electrode layer 20 is formed on the light-receiving surface side of the semiconductor multilayer body 10, it becomes the length of the solar cell 1 A mask is arranged on the light-receiving surface side of the long-side region RL of the side portion and the short-side region RS of the short-side portion of the solar cell 1. The X direction intersecting the long-side region RL is set as the transport direction TD, and the semiconductor laminate is transported on one side On the body 10 side, a transparent electrode layer 20 is formed by a PVD method.
According to the solar battery cell 1 obtained by the manufacturing method, the transparent electrode layer 20 is at the light receiving surface side of the semiconductor laminated body 10 and at the end portion of the transparent electrode layer 20 in the long edge portion of the other end side of the long edge portion of the solar cell unit 1. The width W2 of the receding region R2 is smaller than the width W1 of the receding region R1 of the end of the transparent electrode layer 20 in the long side portion of one end side of the long side portion of the solar battery cell 1.
Thereby, the total area of the fading region of the end portion (four sides) of the transparent electrode layer 20 in the solar cell unit 1 is reduced, and the increase in the resistance of the transparent electrode layer 20 at the end portion of the solar cell unit 1 is suppressed. As a result, the decrease in the output of the solar battery cell 1 is suppressed.
Furthermore, according to the method for manufacturing a solar cell according to this embodiment, it is possible to prevent the transparent electrode layer 20 from adhering to the cut surface of the semiconductor multilayer body 10, especially the cut surface of the semiconductor substrate (photoelectric conversion substrate) during laser cutting, so that It is possible to suppress degradation of the performance of the solar battery cell 1.
又,根據本實施形態之太陽電池模組之製造方法,將相鄰之太陽電池單元1、1中之一太陽電池單元1之搬送方向TD之前側之長邊部之受光面側之一部分重疊於另一太陽電池單元1之搬送方向TD之後側之長邊部之背面側之一部分之下,將相鄰之太陽電池單元1、1彼此連接。
根據藉由該製造方法製造所得之太陽電池模組100,相鄰之太陽電池單元1、1中之一太陽電池單元1之一端側之長邊部之受光面側之一部分(透明電極層20之端部之減退區域R1之寬度W1較大者)重疊地連接於另一太陽電池單元1之另一端側之長邊部之背面側之一部分(透明電極層20之端部之減退區域R2之寬度W2較小者)之下。
如此,藉由將一太陽電池單元1中之透明電極層20之減退區域R1之寬度W1較大之搬送方向TD之前側之端部配置於另一太陽電池單元1中之透明電極層20之減退區域R2之寬度W2較小之搬送方向TD之後側之端部之遮光區域,而抑制太陽電池單元1之輸出降低。In addition, according to the manufacturing method of the solar cell module of this embodiment, one of the light receiving surface sides of the long side portion of the front side of the transport direction TD of one of the adjacent solar cells 1 and 1 is overlapped with The adjacent solar cells 1 and 1 are connected to each other under a portion of the rear side of the long side portion on the rear side of the transport direction TD of the other solar cell 1.
According to the solar cell module 100 manufactured by this manufacturing method, a part of the light-receiving surface side of the long side portion of one end side of one of the adjacent solar battery cells 1 and 1 (the transparent electrode layer 20) The width W1 of the reduced region R1 at the end is larger) and is connected to a part of the back side of the long side portion of the other end side of the other solar cell 1 (the width of the reduced region R2 at the end of the transparent electrode layer 20). W2 is smaller).
In this way, by reducing the width W1 of the decreasing region R1 of the transparent electrode layer 20 in one solar battery cell 1 in the transport direction TD, the end portion on the front side of the transparent electrode layer 20 in the other solar battery cell 1 is reduced. The width W2 of the region R2 is small, and the light-shielding region at the end portion on the rear side in the conveying direction TD is suppressed to suppress the decrease in the output of the solar cell 1.
此處,參照圖13A~圖13E,對透明電極層形成步驟中之搬送方向TD與透明電極層20之端部之減退區域之寬度W之關係進行驗證。
圖13A係將透明電極層形成步驟中之搬送方向TD設為上方向(+Y方向)時之圖8中之區域B之放大圖,圖13B係將透明電極層形成步驟中之搬送方向TD設為右方向(-X方向)時之圖8中之區域B之放大圖,圖13C(相當於上述實施形態)係將透明電極層形成步驟中之搬送方向TD設為左方向(+X方向)時之圖8中之區域B之放大圖。
圖13D圖示了表示遮罩MASK之右側之(沿著成為太陽電池單元之左側之長邊部之長邊區域RL)透明電極層20之端部之膜厚50%減退區域R1(50%)之寬度W1(50%)及面積、遮罩MASK之左側之(沿著成為太陽電池單元之右側之長邊部之長邊區域RL)透明電極層20之端部之膜厚50%減退區域R2(50%)之寬度W2(50%)及面積、遮罩MASK之上側之(沿著成為太陽電池單元之上側之短邊部之短邊區域RS)透明電極層20之端部之膜厚50%減退區域R3(50%)之寬度W3(50%)及面積、及遮罩MASK之下側之(沿著成為太陽電池單元之下側之短邊部之短邊區域RS)透明電極層20之端部之膜厚50%減退區域R4(50%)之寬度W4(50%)及面積之表。
此處,於上述實施形態中,示出了透明電極層20之端部之膜厚較透明電極層20之中央部之膜厚減退(減少)之減退區域R1、R2,但於本驗證中,如圖13E(剖視圖)所示,作為減退區域,考量透明電極層20之端部之膜厚減退(減少)至透明電極層20之中央部之膜厚(100%)之50%以下之膜厚50%減退區域。藉此,所謂膜厚50%減退區域R1(50%)之寬度W1(50%)及膜厚50%減退區域R2(50%)之寬度W2(50%)係透明電極層20之端部之膜厚減退至透明電極層20之中央部之膜厚(100%)之50%以下之區域之X方向之寬度,所謂膜厚50%減退區域R3(50%)之寬度W3(50%)及膜厚50%減退區域R4(50%)之寬度W4(50%)係透明電極層20之端部之膜厚減退至透明電極層20之中央部之膜厚(100%)之50%以下之區域之Y方向之寬度。再者,作為減退區域及其寬度,並不限定於此,例如亦可為透明電極層20之端部之膜厚減退(減少)至透明電極層20之中央部之膜厚(100%)之未達100%或特定之比率以下之區域及其寬度。
又,於圖13D之表中,示出了膜厚50%減退區域R1(50%)、R2(50%)、R3(50%)、R4(50%)中之面積(再者,於因疊瓦方式而成為陰影損失之情形時將面積設為「0」)。又,所謂因減退導致之面積損失係因減退導致之透明電極層20之面積之減少比率。因減退導致之面積損失以透明電極層20之面積中之膜厚50%減退區域R1(50%)、R2(50%)、R3(50%)、R4(50%)之面積比率、即下式表示。
面積損失
=膜厚50%減退區域R1(50%)、R2(50%)、R3(50%)、R4(50%)之總面積/透明電極層20之面積
此處,對用於本驗證之透明電極層20之面積進行記載。本驗證係使用一邊之長度為156.75 mm之方形之半導體基板110,於在上述半導體基板110形成有半導體層120、121、130、131之半導體積層體10形成透明電極層20、30、及金屬電極層21、31後,利用雷射以5等分進行。於透明電極層20之形成中,成為太陽電池之長邊部之長邊區域RL且相當於半導體基板110之端部之長邊區域RL、及成為太陽電池之短邊部之短邊區域RS且相當於半導體基板110之端部之短邊區域RS之遮罩寬度設為1.0 mm,因此,長方形狀之太陽電池單元中之透明電極層20之短邊側之長度成為((156.75-2)/5)-1.4=29.55(mm)(再者,1.4 mm係遮罩寬度),透明電極層20之面積成為(156.75-2)×29.55=4752.86 mm2
。再者,搬送速度係如圖13D之表所示。Here, referring to FIGS. 13A to 13E, the relationship between the transport direction TD in the transparent electrode layer forming step and the width W of the recessed region at the end of the transparent electrode layer 20 is verified.
FIG. 13A is an enlarged view of the area B in FIG. 8 when the transport direction TD in the transparent electrode layer formation step is set to the upward direction (+ Y direction), and FIG. 13B is the transport direction TD in the transparent electrode layer formation step. FIG. 13C (equivalent to the above embodiment) is an enlarged view of the area B in FIG. 8 when the right direction (-X direction) is used, and the transport direction TD in the transparent electrode layer forming step is set to the left direction (+ X direction). An enlarged view of a region B in FIG. 8 at this time.
FIG. 13D illustrates a 50% decrease in thickness R1 (50%) of the film thickness at the ends of the transparent electrode layer 20 on the right side of the mask MASK (along the long side region RL that becomes the long side portion on the left side of the solar cell). The width W1 (50%) and the area, the left side of the mask MASK (along the long side area RL that becomes the long side part of the right side of the solar cell), the film thickness at the ends of the transparent electrode layer 20 is 50% of the reduced area R2 (50%) width W2 (50%) and area, the thickness on the upper side of the mask MASK (the short side region RS along the short side portion that becomes the upper side of the solar cell), the film thickness of the end portion of the transparent electrode layer 50 Width W3 (50%) and area of the% decrease region R3 (50%), and the lower side of the mask MASK (the short side region RS along the short side portion that becomes the lower side of the solar cell) transparent electrode layer 20 Table showing the width W4 (50%) and area of the film thickness at the end of the 50% decrease region R4 (50%).
Here, in the above embodiment, the decrease regions R1 and R2 where the film thickness at the end portion of the transparent electrode layer 20 is smaller (decreased) than the film thickness at the center portion of the transparent electrode layer 20 are shown. However, in this verification, As shown in FIG. 13E (cross-sectional view), as the decrease region, the film thickness at the end portion of the transparent electrode layer 20 is reduced (decreased) to a film thickness of 50% or less at the center portion of the transparent electrode layer 20 (100%). 50% decrease area. Accordingly, the width W1 (50%) of the region 50% of the film thickness decrease R1 (50%) and the width W2 (50%) of the region 50% of the film thickness decrease R2 (50%) are the ends of the transparent electrode layer 20. The width in the X direction of a region where the film thickness decreases to 50% or less of the film thickness (100%) of the central portion of the transparent electrode layer 20, and the width W3 (50%) of the so-called film thickness reduction region R3 (50%) and The width W4 (50%) of the film thickness 50% decrease region R4 (50%) is a decrease in the film thickness at the ends of the transparent electrode layer 20 to less than 50% of the film thickness (100%) in the center of the transparent electrode layer 20 The width of the area in the Y direction. In addition, the reduced region and its width are not limited to this. For example, the thickness of the transparent electrode layer 20 may be reduced (decreased) to the thickness of the central portion of the transparent electrode layer 20 (100%). Areas below 100% or below a specified ratio and their widths.
In the table of FIG. 13D, the areas in the 50% film thickness reduction regions R1 (50%), R2 (50%), R3 (50%), and R4 (50%) are shown (in addition, in In the case where the shingle method causes shadow loss, the area is set to "0"). The area loss due to the decrease is a reduction ratio of the area of the transparent electrode layer 20 due to the decrease. The area loss due to the reduction is based on the area ratio of the film thickness 50% of the area of the transparent electrode layer 20 to the areas R1 (50%), R2 (50%), R3 (50%), and R4 (50%). Expression.
Area loss
= Total area of R1 (50%), R2 (50%), R3 (50%), R4 (50%) of 50% decrease in film thickness / area of transparent electrode layer 20 Here, it is transparent to this verification The area of the electrode layer 20 is described. This verification uses a square semiconductor substrate 110 having a length of 156.75 mm on one side, and transparent electrode layers 20, 30, and metal electrodes are formed on the semiconductor laminate 10 in which the semiconductor layers 120, 121, 130, and 131 are formed on the semiconductor substrate 110. After layers 21 and 31, the laser is used to divide in 5 equal parts. In the formation of the transparent electrode layer 20, the long-side region RL that is the long-side portion of the solar cell and corresponds to the long-side region RL that is the end portion of the semiconductor substrate 110, and the short-side region RS that is the short-side portion of the solar cell, and The mask width of the short-side region RS corresponding to the end portion of the semiconductor substrate 110 is set to 1.0 mm. Therefore, the length of the short-side side of the transparent electrode layer 20 in the rectangular solar cell becomes ((156.75-2) / 5) -1.4 = 29.55 (mm) (in addition, 1.4 mm is the mask width), and the area of the transparent electrode layer 20 becomes (156.75-2) × 29.55 = 4752.86 mm 2 . The conveying speed is shown in the table of FIG. 13D.
如圖13A及圖13D之表所示,若將透明電極層形成步驟中之搬送方向TD設為上方向(+Y方向),則遮罩MASK之左側之(沿著成為太陽電池單元之右側之長邊部之長邊區域RL)透明電極層20之端部之膜厚50%減退區域R2(50%)之寬度W2(50%)、遮罩MASK之右側之(沿著成為太陽電池單元之左側之長邊部之長邊區域RL)透明電極層20之端部之膜厚50%減退區域R1(50%)之寬度W1(50%)、及遮罩MASK之上側之(沿著成為太陽電池單元之上側之短邊部之短邊區域RS)透明電極層20之端部之膜厚50%減退區域R3(50%)之寬度W3(50%)較大,遮罩MASK之下側之(沿著成為太陽電池單元之下側之短邊部之短邊區域RS)透明電極層20之端部之膜厚50%減退區域R4(50%)之寬度W4(50%)較小。
此時,若將切斷線CL之右側、即成為太陽電池單元之左側之長邊部之長邊區域RL及減退區域R1(50%)之重疊區域Ro重疊於切斷線CL之左側、即成為太陽電池單元之右側之長邊部之長邊區域RL及減退區域R2(50%)之下,則沿著成為太陽電池單元之左側之長邊部之長邊區域RL之減退區域R1(50%)被覆蓋。另一方面,沿著成為太陽電池單元之右側之長邊部之長邊區域RL之減退區域R2(50%)之面積較大為77.4 mm2
。其結果,相對於1個太陽電池單元中之透明電極層20之總面積而言,減退區域R1(50%)、R2(50%)、R3(50%)、R4(50%)之總面積之面積損失較大為2.0%。
其原因在於:如圖12B所示,將太陽電池單元之減退區域R1(50%)之寬度W1(50%)(面積)較大之左側(長邊部)之重疊區域Ro覆蓋之太陽電池單元之右側(長邊部)之減退區域R2(50%)之寬度W2(50%)(面積)亦較大。As shown in the tables of FIGS. 13A and 13D, if the transport direction TD in the transparent electrode layer forming step is set to the upward direction (+ Y direction), the left side of the mask (alongside the right side of the solar cell) Long side region RL) Film thickness at the end of transparent electrode layer 20 50% Decreased region R2 (50%) Width W2 (50%), Right side of mask MASK (formed as a solar cell unit The long side area RL on the left side) The film thickness at the ends of the transparent electrode layer 20 is 50%. The width W1 (50%) of the region R1 (50%) is reduced, and the upper side of the mask MASK (belongs to become the sun) The short-side area RS of the short-side portion on the upper side of the battery cell) The film thickness at the end of the transparent electrode layer 20 is 50%. The width W3 (50%) of the reduced area R3 (50%) is larger, which covers the lower side of MASK. (Along the short-side region RS that becomes the short-side portion on the lower side of the solar cell), the width W4 (50%) of the 50% decrease region R4 (50%) of the film thickness of the end portion of the transparent electrode layer 20 is small.
At this time, if the right side of the cutting line CL, that is, the overlapping region Ro of the long side region RL and the decreasing region R1 (50%) of the long side portion that becomes the left side of the solar cell is superimposed on the left side of the cutting line CL, that is, Below the long-side region RL and the decreasing region R2 (50%) of the long-side portion that becomes the right side of the solar cell, along the decreasing region R1 (50) of the long-side region RL that becomes the long-side portion of the left side of the solar cell %) Is covered. On the other hand, the area of the decreasing region R2 (50%) along the long-side region RL that becomes the long-side portion on the right side of the solar cell is larger than 77.4 mm 2 . As a result, compared with the total area of the transparent electrode layer 20 in one solar battery cell, the total area of the declining regions R1 (50%), R2 (50%), R3 (50%), and R4 (50%) The area loss is larger at 2.0%.
The reason is that, as shown in FIG. 12B, the solar cell is covered by the overlapping region Ro of the left side (long side) of the width W1 (50%) (area) of the decreasing region R1 (50%) of the solar cell. The width W2 (50%) (area) of the decreasing region R2 (50%) on the right side (long side portion) is also large.
其次,如圖13B及圖13D之表所示,若將透明電極層形成步驟中之搬送方向TD設為右方向(-X方向),則遮罩MASK之左側(沿著成為太陽電池單元之右側之長邊部之長邊區域RL)透明電極層20之端部之膜厚50%減退區域R2(50%)之寬度W2(50%)、遮罩MASK之下側之(沿著成為太陽電池單元之下側之短邊部之短邊區域RS)透明電極層20之端部之膜厚50%減退區域R4(50%)之寬度W4(50%)、及遮罩MASK之上側之(沿著成為太陽電池單元之上側之短邊部之短邊區域RS)透明電極層20之端部之膜厚50%減退區域R3(50%)之寬度W3(50%)較大,遮罩MASK之右側之(沿著成為太陽電池單元之左側之長邊部之長邊區域RL)透明電極層20之端部之膜厚50%減退區域R1(50%)之寬度W1(50%)較小。
此時,若將切斷線CL之右側、即成為太陽電池單元之左側之長邊部之長邊區域RL及減退區域R1(50%)之重疊區域Ro重疊於切斷線CL之左側、即成為太陽電池單元之右側之長邊部之長邊區域RL及減退區域R2(50%)之下,則沿著成為太陽電池單元之左側之長邊部之長邊區域RL之減退區域R1(50%)被覆蓋。另一方面,沿著成為太陽電池單元之右側之長邊部之長邊區域RL之減退區域R2(50%)之面積較大為61.9 mm2
。其結果,相對於1個太陽電池單元中之透明電極層20之總面積而言,減退區域R1(50%)、R2(50%)、R3(50%)、R4(50%)之總面積之面積損失較大為2.0%。Next, as shown in the tables of FIG. 13B and FIG. 13D, if the transport direction TD in the transparent electrode layer forming step is set to the right direction (-X direction), the left side of MASK is masked (the right side becomes the right side of the solar cell). The long side region RL) The film thickness at the ends of the transparent electrode layer 20 is 50%. The width W2 (50%) of the region R2 (50%) is reduced. The lower side of the mask MASK (formed as a solar cell) Short side region of the short side of the lower side of the unit RS) Film thickness at the end of the transparent electrode layer 20 50% Decreased area R4 (50%) Width W4 (50%), and the upper side of the mask MASK (along The short-side region RS that becomes the short-side portion on the upper side of the solar cell unit) The film thickness at the end of the transparent electrode layer 20 is 50%, and the width W3 (50%) of the reduced region R3 (50%) is larger. The width W1 (50%) of the 50% decrease region R1 (50%) of the film thickness at the end of the transparent electrode layer 20 on the right side (long side region RL along the long side portion that becomes the left side of the solar cell unit) is small.
At this time, if the right side of the cutting line CL, that is, the overlapping region Ro of the long side region RL and the decreasing region R1 (50%) of the long side portion that becomes the left side of the solar cell is superimposed on the left side of the cutting line CL, that is, Below the long-side region RL and the decreasing region R2 (50%) of the long-side portion that becomes the right side of the solar cell, along the decreasing region R1 (50) of the long-side region RL that becomes the long-side portion of the left side of the solar cell %) Is covered. On the other hand, the area of the decreasing region R2 (50%) along the long-side region RL that becomes the long-side portion on the right side of the solar cell is larger than 61.9 mm 2 . As a result, compared with the total area of the transparent electrode layer 20 in one solar battery cell, the total area of the declining regions R1 (50%), R2 (50%), R3 (50%), and R4 (50%) The area loss is larger at 2.0%.
繼而,如圖13C及圖13D之表所示,若將透明電極層形成步驟中之搬送方向TD設為左方向(+X方向)(相當於上述實施形態),則遮罩MASK之左側之(沿著成為太陽電池單元之右側之長邊部之長邊區域RL)透明電極層20之端部之膜厚50%減退區域R2(50%)之寬度W2(50%)較小,遮罩MASK之右側之(沿著成為太陽電池單元之左側之長邊部之長邊區域RL)透明電極層20之端部之膜厚50%減退區域R1(50%)之寬度W1(50%)、遮罩MASK之下側之(沿著成為太陽電池單元之下側之短邊部之短邊區域RS)透明電極層20之端部之膜厚50%減退區域R4(50%)之寬度W4(50%)、及遮罩MASK之上側之(沿著成為太陽電池單元之上側之短邊部之短邊區域RS)透明電極層20之端部之膜厚50%減退區域R3(50%)之寬度W3(50%)較大。
此時,若將切斷線CL之右側、即成為太陽電池單元之左側之長邊部之長邊區域RL及減退區域R1(50%)之重疊區域Ro重疊於切斷線CL之左側、即成為太陽電池單元之右側之長邊部之長邊區域RL及減退區域R2(50%)之下,則沿著成為太陽電池單元之左側之長邊部之長邊區域RL之減退區域R1(50%)被覆蓋。又,沿著成為太陽電池單元之右側之長邊部之長邊區域RL之減退區域R2(50%)之面積亦相對較小為15.5 mm2
。其結果,相對於1個太陽電池單元中之透明電極層20之總面積而言,減退區域R1(50%)、R2(50%)、R3(50%)、R4(50%)之總面積之面積損失較小為1.0%。於此情形時,推測與圖13A及圖13B之情形相比,太陽電池單元及太陽電池模組之性能提昇1.1%。
其原因在於:如圖12A所示,將太陽電池單元之減退區域R1(50%)之寬度W1(50%)(面積)較大之左側(長邊部)之重疊區域Ro覆蓋之太陽電池單元之右側(長邊部)之減退區域R2(50%)之寬度W2(50%)(面積)較小。13C and 13D, if the transport direction TD in the transparent electrode layer forming step is set to the left direction (+ X direction) (equivalent to the above embodiment), the left side of the mask ( Along the long-side region RL that becomes the long-side portion on the right side of the solar cell), the film thickness at the end of the transparent electrode layer 20 is reduced by 50%, and the width W2 (50%) of the region R2 (50%) is small, which masks MASK. On the right side (long side region RL along the long side portion that becomes the left side of the solar cell), the film thickness at the ends of the transparent electrode layer 20 is 50%, and the width W1 (50%) of the region R1 (50%) is reduced. The thickness of the end of the transparent electrode layer 20 at the lower side of the mask MASK (along the short-side region RS that becomes the short-side portion at the lower side of the solar cell) W4 (50%) width W4 (50%) %), And the width above the mask (the short-side region RS along the short-side portion that becomes the upper side of the solar cell) the thickness of the transparent electrode layer 20 at the end of the 50% decrease region R3 (50%) width W3 (50%) is larger.
At this time, if the right side of the cutting line CL, that is, the overlapping region Ro of the long side region RL and the decreasing region R1 (50%) of the long side portion that becomes the left side of the solar cell is superimposed on the left side of the cutting line CL, that is, Below the long-side region RL and the decreasing region R2 (50%) of the long-side portion that becomes the right side of the solar cell, along the decreasing region R1 (50) of the long-side region RL that becomes the long-side portion of the left side of the solar cell %) Is covered. In addition, the area of the decreasing region R2 (50%) along the long-side region RL that becomes the long-side portion on the right side of the solar cell is relatively small as 15.5 mm 2 . As a result, compared with the total area of the transparent electrode layer 20 in one solar battery cell, the total area of the declining regions R1 (50%), R2 (50%), R3 (50%), and R4 (50%) The area loss is small at 1.0%. In this case, it is presumed that the performance of the solar cell unit and the solar cell module is improved by 1.1% compared with the case of FIG. 13A and FIG. 13B.
The reason is that, as shown in FIG. 12A, the solar cell is covered by the overlapping region Ro on the left side (long side) of the width W1 (50%) (area) of the decreasing region R1 (50%) of the solar cell. The width W2 (50%) (area) of the decreasing region R2 (50%) on the right side (long side portion) is small.
再者,於與圖13C同樣之搬送方向TD,將搬送速度設為60 mm/min之10倍之600 mm/min,結果,如圖13D之表所示,獲得同樣之結果。
藉此,於本驗證中,將搬送速度設為60 mm/min之低速而進行,但推測即便提昇速度亦獲得同樣之傾向。Furthermore, in the same conveying direction TD as in FIG. 13C, the conveying speed was set to 600 mm / min, which is 10 times 60 mm / min. As a result, as shown in the table of FIG. 13D, the same result was obtained.
Therefore, in this verification, the conveying speed was set to a low speed of 60 mm / min, but it is estimated that the same tendency was obtained even if the speed was increased.
繼而,對透明電極層形成步驟中之遮罩之尺寸進行考量。
若考慮太陽電池單元彼此之接觸電阻及因密接性、重疊導致之面積損失,則重疊區域Ro之寬度較佳為設為1.5 mm。藉此,如圖13C及圖13D之表所示,為了將寬度W1=0.4 mm之減退區域R1全部重疊,較切斷線CL更靠右側之遮罩之寬度較佳為設為1.1 mm以下。
另一方面,因雷射切斷之物理性損傷,於與切斷線CL相距未達±0.15~0.3 mm之範圍內,鈍化膜不再發揮功能,因此,較切斷線CL更靠左側之遮罩之寬度例如較佳為設為0.3 mm。其原因在於:若於上述範圍內積層透明電極層,則通過發揮功能之鈍化膜與不發揮功能之鈍化膜之附近而移動至透明電極層之載子(電洞/電子)未移動至金屬電極層而移動至未發揮功能之鈍化膜,進而於半導體基板110再鍵結。
經斟酌以上情況,若將遮罩之寬度設為1.4 mm以下,則可將減退區域R1全部重疊,減退區域R1導致之太陽電池單元之輸出降低之抑制效果較大。
再者,遮罩之加工極限為1.0 mm。藉此,遮罩之寬度較佳為1.0 mm以上1.4 mm以下。Then, the size of the mask in the transparent electrode layer forming step is considered.
Considering the contact resistance of the solar battery cells and the area loss due to adhesion and overlap, the width of the overlapping region Ro is preferably set to 1.5 mm. Therefore, as shown in the tables of FIGS. 13C and 13D, in order to fully overlap the decreasing regions R1 having the width W1 = 0.4 mm, the width of the mask on the right side of the cutting line CL is preferably set to 1.1 mm or less.
On the other hand, due to the physical damage of the laser cutting, the passivation film no longer functions within the range of ± 0.15 to 0.3 mm from the cutting line CL, so it is closer to the left than the cutting line CL. The width of the mask is preferably 0.3 mm, for example. The reason is that if the transparent electrode layer is laminated within the above range, the carriers (holes / electrons) moved to the transparent electrode layer by the vicinity of the passivation film that functions and the passivation film that does not function do not move to the metal electrode. Layer to move to a non-functional passivation film, and then bond to the semiconductor substrate 110 again.
After considering the above circumstances, if the width of the mask is set to be less than 1.4 mm, all the decrease regions R1 can be overlapped, and the suppression effect of the decrease in the output of the solar cell caused by the decrease region R1 is large.
Furthermore, the processing limit of the mask is 1.0 mm. Therefore, the width of the mask is preferably 1.0 mm to 1.4 mm.
以上,對本發明之實施形態進行了說明,但本發明並不限定於上述實施形態,可進行各種變更及變化。例如,於本實施形態中,如圖7所示地例示了異質接合型之太陽電池及其製造方法,但本發明之特徵之電極形成方法並不限於異質接合型之太陽電池,亦適用於同質接合型太陽電池等各種太陽電池及其製造方法。As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, Various changes and changes are possible. For example, in this embodiment, as shown in FIG. 7, a heterojunction type solar cell and a method for manufacturing the same are illustrated, but the electrode forming method of the feature of the present invention is not limited to a heterojunction type solar cell, and is also applicable to a homogeneous type. Various solar cells such as a junction type solar cell and a method for manufacturing the same.
1‧‧‧太陽電池單元 1‧‧‧ solar cell
2‧‧‧太陽電池串 2‧‧‧ solar string
3‧‧‧受光側保護構件 3‧‧‧ light-side protection member
4‧‧‧背側保護構件 4‧‧‧Backside protection member
5‧‧‧密封材 5‧‧‧sealing material
8‧‧‧導電性接著劑 8‧‧‧ conductive adhesive
10‧‧‧半導體積層體 10‧‧‧Semiconductor laminate
10X‧‧‧半導體積層體 10X‧‧‧Semiconductor multilayer
20‧‧‧透明電極層 20‧‧‧ transparent electrode layer
20X‧‧‧透明電極層 20X‧‧‧Transparent electrode layer
21‧‧‧金屬電極層 21‧‧‧metal electrode layer
21b‧‧‧母線電極部 21b‧‧‧Bus electrode section
21f‧‧‧指狀電極部 21f‧‧‧finger electrode
30‧‧‧透明電極層 30‧‧‧ transparent electrode layer
31‧‧‧金屬電極層 31‧‧‧metal electrode layer
31b‧‧‧母線電極部 31b‧‧‧Bus electrode section
31f‧‧‧指狀電極部 31f‧‧‧finger electrode
100‧‧‧太陽電池模組 100‧‧‧ solar cell module
110‧‧‧半導體基板 110‧‧‧ semiconductor substrate
120‧‧‧鈍化層 120‧‧‧ passivation layer
121‧‧‧第1導電型半導體層 121‧‧‧ the first conductive semiconductor layer
130‧‧‧鈍化層 130‧‧‧ passivation layer
131‧‧‧第2導電型半導體層 131‧‧‧Second conductive semiconductor layer
A‧‧‧ 區域 A‧‧‧ area
B‧‧‧ 區域 B‧‧‧ Area
CL‧‧‧切斷線 CL‧‧‧cut line
MASK‧‧‧遮罩 MASK‧‧‧Mask
R1‧‧‧減退區域 R1‧‧‧ Decay area
R2‧‧‧減退區域 R2‧‧‧ Decay area
R3‧‧‧減退區域 R3‧‧‧ Decay area
R4‧‧‧減退區域 R4‧‧‧ Decay area
Ro‧‧‧重疊區域 Ro‧‧‧ overlapping area
RL‧‧‧長邊區域 RL‧‧‧long side area
RS‧‧‧短邊區域 RS‧‧‧ Short Side Area
TD‧‧‧搬送方向 TD‧‧‧ Transport direction
TRAY‧‧‧托盤 TRAY‧‧‧Tray
W‧‧‧寬度 W‧‧‧Width
W1‧‧‧寬度 W1‧‧‧Width
W2‧‧‧寬度 W2‧‧‧Width
W3‧‧‧寬度 W3‧‧‧Width
W4‧‧‧寬度 W4‧‧‧Width
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
θ1‧‧‧減退角度 θ1‧‧‧ receding angle
θ2‧‧‧減退角度 θ2‧‧‧ receding angle
圖1係表示先前之太陽電池單元之製造方法中之透明電極層形成步驟及切斷步驟之圖。FIG. 1 is a view showing a transparent electrode layer forming step and a cutting step in a conventional method for manufacturing a solar cell.
圖2係表示先前之太陽電池單元之製造方法中之使用PVD法之透明電極層形成步驟之圖。 FIG. 2 is a view showing a step of forming a transparent electrode layer using a PVD method in a conventional method for manufacturing a solar cell.
圖3係表示先前之太陽電池單元之製造方法中之使用PVD法之透明電極層形成步驟之圖。 FIG. 3 is a view showing a step of forming a transparent electrode layer using a PVD method in a conventional method for manufacturing a solar cell.
圖4係表示本實施形態之太陽電池模組之側視圖。 Fig. 4 is a side view showing a solar cell module according to this embodiment.
圖5係自受光面側觀察本實施形態之太陽電池單元所得之圖。 FIG. 5 is a diagram obtained by observing the solar battery cell of this embodiment from the light receiving surface side.
圖6係圖5所示之VI-VI線剖視圖。 FIG. 6 is a sectional view taken along the line VI-VI shown in FIG. 5.
圖7係圖6所示之半導體積層體10之區域A之放大圖。 FIG. 7 is an enlarged view of a region A of the semiconductor multilayer body 10 shown in FIG. 6.
圖8係表示本實施形態之太陽電池單元之製造方法中之透明電極層形成步驟之圖。 FIG. 8 is a diagram showing the steps of forming a transparent electrode layer in the method for manufacturing a solar battery cell according to this embodiment.
圖9係表示本實施形態之太陽電池單元之製造方法中之太陽電池單元切斷形成步驟之圖。 FIG. 9 is a diagram showing a step of forming a solar cell in the method for manufacturing a solar cell according to this embodiment.
圖10係表示本實施形態之太陽電池單元之製造方法中之太陽電池單元切斷形成步驟之圖。 FIG. 10 is a diagram showing a step of forming a solar cell in the method for manufacturing a solar cell according to this embodiment.
圖11係表示本實施形態之太陽電池單元之製造方法中之太陽電池單元切斷形成步驟之圖。 FIG. 11 is a diagram showing a step of forming a solar cell in the method for manufacturing a solar cell according to this embodiment.
圖12A係表示太陽電池單元之重疊之一例之圖。 FIG. 12A is a diagram showing an example of overlapping of solar cells.
圖12B係表示太陽電池單元之重疊之另一例之圖。 FIG. 12B is a diagram showing another example of the overlap of solar battery cells.
圖13A係將透明電極層形成步驟中之搬送方向設為上方向(+Y方向)時之圖8中之區域B之放大圖。 FIG. 13A is an enlarged view of a region B in FIG. 8 when the transport direction in the transparent electrode layer forming step is set to the upward direction (+ Y direction).
圖13B係將透明電極層形成步驟中之搬送方向設為右方向(-X方向)時之圖8中之區域B之放大圖。 FIG. 13B is an enlarged view of a region B in FIG. 8 when the transport direction in the transparent electrode layer forming step is set to the right direction (-X direction).
圖13C係將透明電極層形成步驟中之搬送方向設為左方向(+X方向)時之圖8中之區域B之放大圖。 FIG. 13C is an enlarged view of a region B in FIG. 8 when the transport direction in the transparent electrode layer forming step is set to the left direction (+ X direction).
圖13D圖示表示圖13A~圖13B中之透明電極層之端部之膜厚50%減退區域之寬度及面積之表。 FIG. 13D is a table showing the width and area of the area where the film thickness at the ends of the transparent electrode layer in FIG. 13A to FIG. 13B is reduced by 50%.
圖13E係用以說明膜厚50%減退區域之圖。 FIG. 13E is a diagram illustrating a 50% decrease in film thickness.
Claims (11)
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| WO2022210886A1 (en) * | 2021-03-31 | 2022-10-06 | 株式会社カネカ | Solar battery string connection method |
| KR102705231B1 (en) * | 2021-08-23 | 2024-09-11 | 주식회사 메카로에너지 | Solar power module and manufacturing method thereof |
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