TW201918681A - Airtight penetration structure for heat dissipation device - Google Patents
Airtight penetration structure for heat dissipation device Download PDFInfo
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- TW201918681A TW201918681A TW106138372A TW106138372A TW201918681A TW 201918681 A TW201918681 A TW 201918681A TW 106138372 A TW106138372 A TW 106138372A TW 106138372 A TW106138372 A TW 106138372A TW 201918681 A TW201918681 A TW 201918681A
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- hollow cylinder
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- 230000017525 heat dissipation Effects 0.000 title abstract description 7
- 230000035515 penetration Effects 0.000 title abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 238000004070 electrodeposition Methods 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 238000010146 3D printing Methods 0.000 claims description 3
- 238000005323 electroforming Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
一種散熱裝置氣密貫穿結構，尤指一種透過具有凸緣結構之中空柱體貫穿具有氣密腔室的散熱裝置並由該中空柱體及其凸緣結構與該散熱裝置結合，進而提供一種散熱裝置氣密貫穿結構。A heat-tight device air-tight through structure, in particular, a heat-dissipating device having a gas-tight chamber through a hollow cylinder having a flange structure, and the hollow cylinder and its flange structure are combined with the heat-dissipating device to provide a heat dissipation The device is airtight throughout the structure.
現行電子設備隨著效能提高，其中作為處理訊號及運算的電子元件相對的也較以前的電子元件產生較高的熱量，最常被使用的一般散熱元件包含熱管、散熱器、均溫板等元件，並透過直接與會發熱之電子元件接觸後進一步增加散熱效能，防止電子元件溫度過高而燒毀等情事。 均溫板係為一種較大範圍面與面之熱傳導應用，其有別於熱管之點對點的熱傳導方式，並適用於空間較為窄小之處使用。 習知係將均溫板與一基板結合使用並透過均溫板傳導該基板上之發熱元件之熱量，習知技術主要係於均溫板避開該腔室之部位，即該均溫板閉合處外之四耦各形成有穿孔並穿設一具有內螺牙之銅柱，基板相對該均溫板設置銅柱之位置係開設至少一孔洞，再透過一螺鎖元件以螺鎖之方式同時穿設該等銅柱及孔洞將該均溫板固定於該基板上，但此一固定方式因銅柱設置於該均溫板之四耦處，與該發熱元件距離較遠，該均溫板固定後與發熱元件無法緊密貼合，進而產生熱阻現象；為改善前述無法緊密貼合之問題，則業者將銅柱直接對應設置於該均溫板與發熱元件貼設之部位之鄰近處，故該等銅柱係直接貫穿均溫板具有腔室之部位，雖可增加組裝時緊密度防止熱阻現象產生，但該均溫板之腔室受該等銅柱貫穿破壞後失去氣密性，其腔室內部不再具有真空狀態，並且因銅柱貫穿破壞該腔室，則其內部之工作流體之流動路徑可能因此受阻礙，造成熱傳效率降低，甚至嚴重亦可能產生洩漏，進而令該均溫板失去熱傳效用。 再者，美國專利號7066240及6302192及7100680三案係揭示一種均溫板結構5，一本體51具有相互分離之第一平板511與第二平板512，並於該本體周緣設有一外突出部513，俾使該外突出部513相連接而形成一封閉腔室514；一凹槽5111位於第一平板511上且遠離該外突出部513，並與該第二平板512相連接；一開口52穿透該第一平板511之凹槽5111及第二平板512，且該凹槽5111包含有一環狀外表面5112，並與第二平板512上之一相對應環狀邊緣表面5121相連接，使得該開口52獨立隔絕於該本體51外；一間隔部53延伸接觸於第一平板511、第二平板512之間；一毛細纖維結構54設於該封閉腔室514，雖此一結構藉由凹槽5111之設計而具有支撐結構及具有氣密之效果，但卻因凹槽之設置令該均溫板內部汽液循環之腔室空間大為縮減，相對的因凹槽之設置使得均溫板與熱源之接觸面積變小，故不僅熱傳效率降低接觸面積亦大為縮減，並且此種貫穿結構並無法確認貫穿之部位是否確實保持氣密。 故習知具有下列缺點： 1.易產生熱阻現象； 2.熱傳導面積縮減； 3.熱傳效率降低。With the improvement of the performance of current electronic devices, the electronic components that process signals and calculations are relatively hotter than the previous electronic components. The most commonly used heat dissipation components include heat pipes, heat sinks, temperature equalization plates, and the like. And by directly contacting the electronic components that will heat up, further increase the heat dissipation performance, and prevent the electronic components from being overheated and burned. The uniform temperature plate is a kind of heat transfer application with a wide range of surface and surface, which is different from the point-to-point heat conduction mode of the heat pipe, and is suitable for use in a narrow space. Conventionally, a temperature equalizing plate is used in combination with a substrate and the heat of the heating element on the substrate is transmitted through the temperature equalizing plate. The prior art is mainly applied to the portion of the temperature equalizing plate that avoids the chamber, that is, the temperature equalizing plate is closed. Each of the four couplings is formed with a perforation and a copper post having an internal thread, and the substrate is provided with at least one hole relative to the position of the copper plate provided by the temperature equalizing plate, and is simultaneously screwed through a screw locking component The copper plate and the hole are bored to fix the temperature equalizing plate on the substrate, but the fixing manner is because the copper column is disposed at the four couplings of the temperature equalizing plate, and the heating element is far away from the heating element. After the fixing, the heat-generating component cannot be closely adhered to each other, thereby generating a thermal resistance phenomenon; in order to improve the problem that the above-mentioned inseparable, the copper column is directly disposed adjacent to the portion where the temperature-regulating plate and the heat-generating component are attached, Therefore, the copper pillars directly penetrate the portion of the uniform temperature plate having the chamber, and although the tightness during assembly can be increased to prevent the occurrence of thermal resistance, the chamber of the uniform temperature plate loses airtightness after being broken by the copper columns. , the interior of the chamber no longer has a vacuum And damage due to the copper posts throughout the chamber, its internal flow path of the working fluid may therefore be impeded, resulting in reduced heat transfer efficiency, even seriously it may also leak, and thus enabling the loss of vapor chamber heat transfer effectiveness. In addition, U.S. Patent Nos. 7,066,240 and 6,302,192 and 7,100,680 disclose a temperature equalizing plate structure 5, a body 51 having a first plate 511 and a second plate 512 separated from each other, and an outer protrusion 513 disposed on the periphery of the body. The outer protrusions 513 are connected to form a closed chamber 514; a recess 5111 is located on the first flat plate 511 and away from the outer protrusion 513, and is connected to the second flat plate 512; an opening 52 is worn The groove 5111 and the second plate 512 of the first plate 511 are penetrated, and the groove 5111 includes an annular outer surface 5112 and is connected with the corresponding annular edge surface 5121 of the second plate 512, so that the The opening 52 is independently isolated from the body 51; a spacer 53 extends between the first plate 511 and the second plate 512; a capillary structure 54 is disposed in the closed chamber 514, although the structure is formed by the groove The design of 5111 has a supporting structure and has the effect of airtightness, but the space of the vapor-liquid circulation inside the temperature equalizing plate is greatly reduced due to the setting of the groove, and the relative temperature plate is made due to the setting of the groove. The contact area of the heat source becomes smaller, so not only heat transfer The efficiency reduction contact area is also greatly reduced, and such a penetrating structure does not confirm whether the penetrating portion does remain airtight. Therefore, the conventional disadvantages have the following disadvantages: 1. It is easy to generate thermal resistance; 2. The heat conduction area is reduced; 3. The heat transfer efficiency is lowered.
爰此，為解決上述習知技術之缺點，本發明之主要目的，係提供一種解決習知貫穿具有氣密腔室造成真空氣密洩漏的散熱裝置貫穿氣密結構。 為達上述之目的，本發明係提供一種散熱裝置貫穿氣密結構，係包含：一第一板體、一第二板體； 所述第一板體具有一第一側及一第二側及一第一孔洞，該第一孔洞貫穿該第一板體之第一、二側；所述第二板體具有一第三側及一第四側及一第二孔洞，所述第三側與前述第一側相對應蓋合，並該第一、二板體共同界定一密閉腔室，該第二孔洞貫穿該第二板體之第三、四側；所述中空柱體兩端為自由端並分別具有一第一凸緣及一第二凸緣，並該中空柱體穿設該第一、二孔洞，並該第一、二凸緣分別與該第二、四側貼設並密封該第一、二孔洞之周緣。 為達上述之目的，本發明係提供一種散熱裝置貫穿氣密結構，係包含：一第一板體、一第二板體； 所述第一板體具有一第一側及一第二側及一第一孔洞，該第一 孔洞貫穿該第一板體之第一、二側；所述第二板體具有一第三側及一第四側及一中空柱體，所述第三側與前述第一側相對應蓋合，並該第一、二板體共同界定一密閉腔室，該中空柱體由該第三側向該第一板體一體延伸，並對應穿設前述第一孔洞，該中空柱體貫穿該第一孔洞之一端為自由端，並具有一第一凸緣，該第一凸緣貼設該第二側並密封該第一孔洞之周緣。 透過本發明之散熱裝置氣密貫穿結構係可確保當散熱裝置進行貫穿結構之設置時仍可確實保有散熱裝置內部密閉腔室的氣密性。Accordingly, in order to solve the above-mentioned shortcomings of the prior art, it is a primary object of the present invention to provide a heat sink that penetrates an airtight structure through a leaky vacuum leak caused by a hermetic chamber. In order to achieve the above object, the present invention provides a heat sink through a hermetic structure, comprising: a first plate body and a second plate body; wherein the first plate body has a first side and a second side; a first hole penetrating through the first and second sides of the first plate body; the second plate body having a third side and a fourth side and a second hole, the third side being The first side is correspondingly closed, and the first and second plates jointly define a closed chamber, and the second hole penetrates the third and fourth sides of the second plate; the two ends of the hollow cylinder are free And a first flange and a second flange respectively, and the first and second flanges are respectively disposed on the first and second holes, and the first and second flanges are respectively attached and sealed to the second and fourth sides The circumference of the first and second holes. In order to achieve the above object, the present invention provides a heat sink through a hermetic structure, comprising: a first plate body and a second plate body; wherein the first plate body has a first side and a second side; a first hole penetrating through the first and second sides of the first plate body; the second plate body having a third side and a fourth side and a hollow cylinder, the third side being The first side is correspondingly closed, and the first and second plates jointly define a closed chamber. The hollow cylinder extends integrally from the third side to the first plate body, and correspondingly penetrates the first hole. The hollow cylinder has a free end extending through one end of the first hole and has a first flange, the first flange is attached to the second side and seals the periphery of the first hole. The airtight through structure of the heat dissipating device of the present invention ensures that the airtightness of the internal sealed chamber of the heat dissipating device can be surely maintained when the heat dissipating device is disposed through the structure.
請參閱第3、4圖，係為本發明散熱裝置氣密貫穿結構之第一實施例立體分解組合剖視圖，如圖所示，本發明散熱裝置氣密貫穿結構1，係包含：一第一板體11、一第二板體12、一中空柱體13； 所述第一板體11具有一第一側111及一第二側112及一第一孔洞113，該第一孔洞113貫穿該第一板體11之第一、二側111、112，所述第一、二側111、112分設所述第一板體11之下、上兩側。 所述第二板體12具有一第三側121及一第四側122及一第二孔洞123，所述第三、四側121、122分設所述第二板體12之上、下兩側，所述第三側121與前述第一側111相對應蓋合，並該第一、二板體11、12共同界定一密閉腔室14，該第二孔洞123貫穿該第二板體12之第三、四側121、122。 所述中空柱體13兩端為自由端並分別具有一第一凸緣131及一第二凸緣132，所述第一、二凸緣131、132分設該中空柱體13之兩末端並與該中空柱體13呈相互垂直延伸設置，並該中空柱體13穿設該第一、二孔洞113、123，並該第一、二凸緣131、132分別與該第二、四側112、122貼設並切齊該第二、四側112、122表面及密封該第一、二孔洞113、123之周緣，令所述中空柱體13與該第一、二板體11、12之第一、二孔洞113、123之處保持氣密，保持氣密可透過熔接或擴散接合或黏合其中任一方式進行，所述中空柱體13具有一貫穿孔133，貫穿該中空柱體13兩端，並該貫穿孔133可設置內螺紋（圖中未示）供螺鎖元件進行螺鎖使用。 所述第一、二板體11、12之材質係為銅或鋁或不鏽鋼或鈦材質其中任一，第一、二板體11、12可選用相同材質或以混搭之方式配合使用皆可。 所述第一板體11之第一側111對應設置於該密閉腔室14之部位設有一親水性層141，並透過該親水性層141增加密閉腔室14內工作液體2之汽液循環效率。 請參閱第5圖，係為本發明散熱裝置氣密貫穿結構之第二實施例組合剖視圖，如圖所示，本實施例部分結構與前述第一實施例相同故在此將不再贅述，惟本實施例與前述第一實施例之不同處在於所述密閉腔室14中之第二板體12的第三側121具有一毛細結構3，所述毛細結構3係不接觸所述中空柱體13之外緣，所述毛細結構3係為網格體或纖維體或具有多孔性質之結構體其中任一，所述毛細結構3為多孔性質之結構體時係可透過電化學沉積或電鑄或3D列印或印刷方式以局部或疊層之方式形成。 當選擇透過電化學沉積方式形成多孔性質之結構體時其材質係為銅或鎳或鋁或導熱性質良好之金屬其中任一。 若選用網格體作為毛細結構時所述網格體之材質係為銅或鋁或不鏽鋼或鈦材質其中任一，當然亦可透過疊層材料混搭之方式設置。 請參閱第6圖，係為本發明散熱裝置氣密貫穿結構之第三實施例組合剖視圖，如圖所示，本實施例部分結構與前述第二實施例相同故在此將不再贅述，惟本實施例與前述第二實施例之不同處在於具有複數第一凸體114及一毛細結構3，該等第一凸體114由所述第一板體11之第一側111向該第二板體12之第三側121延伸所構型，所述毛細結構3生成於該第三側121，該等第一凸體114呈自由端之一端抵接該毛細結構3一側，所述第一凸體114相對於第二側112之處係成凹陷狀。 請參閱第7圖，係為本發明散熱裝置氣密貫穿結構之第四實施例組合剖視圖，如圖所示，本實施例部分結構與前述第一實施例相同故在此將不再贅述，惟本實施例與前述第一實施例之不同處在於所述中空柱體13係由所述第二板體12之第三側121向所述第一板體11之第一側111一體延伸構形，並該中空柱體13之自由端處設有一第一凸緣131，所述第一凸緣13形成於該中空柱體13呈自由端之一端，並與該中空柱體13呈垂直延伸構型，並該第一板體11所開設之第一孔洞113與前述中空柱體13對應，並該中空柱體13穿設該第一孔洞113至該第一板體11之第二側112，該中空柱體13之第一凸緣131貼設該第二側112與該第二側112表面切齊並密封該第一孔洞113之周緣，令該密閉腔室14保持氣密性，所述第一凸緣131與該中空柱體13垂直延伸設置。 請參閱第8圖，係為本發明散熱裝置氣密貫穿結構之第五實施例組合剖視圖，如圖所示，本實施例部分結構與前述第四實施例相同故在此將不再贅述，惟本實施例與前述第四實施例之不同處在於所述第一板體11之第一側111向該第二板體12之第三側121延伸複數第一凸體114，所述毛細結構3生成於該第三側121，該等第一凸體114抵接該毛細結構3一側，所述第一凸體114對應第二側112處係呈凹陷狀。 本發明主要目的在於提供一種具有真空氣密腔室的散熱裝置當需要進行貫穿設置螺鎖元件時，具有貫穿且保持真空氣密性之貫穿結構，藉以維持散熱裝置內部工作液體之汽液循環皆為正常運作以及透過親水性層與毛細結構之搭配使用提升內部汽液循環效率者。3 and 4 are a perspective exploded cross-sectional view of a first embodiment of the airtight through structure of the heat dissipating device of the present invention. As shown in the figure, the heat dissipating device of the present invention has a gas tight through structure 1 comprising: a first plate The first plate body 11 has a first side 111 and a second side 112 and a first hole 113. The first hole 113 penetrates the first portion. The first and second sides 111 and 112 of the first and second sides 111 and 112 are respectively disposed on the lower and upper sides of the first plate body 11. The second plate body 12 has a third side 121 and a fourth side 122 and a second hole 123. The third and fourth sides 121 and 122 are divided into two upper and lower plates 12. On the side, the third side 121 is correspondingly covered with the first side 111, and the first and second plates 11 and 12 jointly define a closed chamber 14 , and the second hole 123 extends through the second plate 12 . The third and fourth sides 121 and 122. The two ends of the hollow cylinder 13 are free ends and have a first flange 131 and a second flange 132. The first and second flanges 131 and 132 are respectively disposed at two ends of the hollow cylinder 13 and And the hollow cylinder 13 extends perpendicularly to each other, and the first and second holes 113, 123 are penetrated by the hollow cylinder 13 , and the first and second flanges 131 and 132 are respectively associated with the second and fourth sides 112 . And affixing and aligning the surfaces of the second and fourth sides 112 and 122 and sealing the periphery of the first and second holes 113 and 123 to make the hollow cylinder 13 and the first and second plates 11 and 12 The first and second holes 113, 123 are kept airtight, and the airtightness is maintained by either welding or diffusion bonding or bonding. The hollow cylinder 13 has a uniform perforation 133 extending through the ends of the hollow cylinder 13. And the through hole 133 can be provided with an internal thread (not shown) for the screw lock element to be screwed. The materials of the first and second plates 11 and 12 are made of copper or aluminum or stainless steel or titanium. The first and second plates 11 and 12 can be used in the same material or in a mixed manner. The first side 111 of the first plate body 11 is provided with a hydrophilic layer 141 corresponding to the portion disposed in the sealed chamber 14 , and the vapor-liquid circulation efficiency of the working liquid 2 in the sealed chamber 14 is increased through the hydrophilic layer 141 . . Referring to FIG. 5, it is a sectional view of a second embodiment of the airtight through structure of the heat dissipating device of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment, and therefore will not be further described herein. The difference between this embodiment and the foregoing first embodiment is that the third side 121 of the second plate body 12 in the closed chamber 14 has a capillary structure 3, and the capillary structure 3 does not contact the hollow cylinder. At the outer edge of the 13th, the capillary structure 3 is a mesh body or a fibrous body or a structure having a porous property, and the capillary structure 3 is a porous structure and is permeable to electrochemical deposition or electroforming. Or 3D printing or printing is formed in a partial or laminated manner. When a structure in which a porous property is formed by electrochemical deposition is selected, the material is copper or nickel or aluminum or a metal having good thermal conductivity. If the mesh body is used as the capillary structure, the material of the mesh body is made of copper or aluminum or stainless steel or titanium, and of course, it can also be set by laminating the laminated materials. Referring to FIG. 6 , it is a sectional view of a third embodiment of the airtight through structure of the heat dissipating device of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the foregoing second embodiment, and therefore will not be further described herein. The difference between this embodiment and the foregoing second embodiment is that there are a plurality of first protrusions 114 and a capillary structure 3, and the first protrusions 114 are from the first side 111 to the second side of the first board 11 The third side 121 of the plate body 12 is configured to extend, and the capillary structure 3 is formed on the third side 121. The first protrusions 114 abut one end of the free end to abut the side of the capillary structure 3, A protrusion 114 is recessed relative to the second side 112. FIG. 7 is a cross-sectional view showing a fourth embodiment of the airtight through structure of the heat dissipating device of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment, and therefore will not be further described herein. The difference between this embodiment and the foregoing first embodiment is that the hollow cylinder 13 is integrally extended from the third side 121 of the second plate body 12 to the first side 111 of the first plate body 11 . And a first flange 131 is formed at the free end of the hollow cylinder 13 . The first flange 13 is formed at one end of the hollow cylinder 13 at a free end and extends perpendicularly to the hollow cylinder 13 . The first hole 113 of the first plate body 11 is corresponding to the hollow cylinder 13 , and the first hole 113 is inserted through the first hole 113 to the second side 112 of the first plate body 11 . The first flange 131 of the hollow cylinder 13 is attached to the second side 112 to be flush with the surface of the second side 112 and seal the periphery of the first hole 113 to keep the sealed chamber 14 airtight. The first flange 131 extends perpendicularly to the hollow cylinder 13 . Referring to FIG. 8 , it is a sectional view of a fifth embodiment of the airtight through structure of the heat dissipating device of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the foregoing fourth embodiment, and therefore will not be further described herein. The difference between the present embodiment and the foregoing fourth embodiment is that the first side 111 of the first plate body 11 extends to the third side 121 of the second plate body 12 to extend a plurality of first protrusions 114, and the capillary structure 3 The first protrusion 114 is abutted on the side of the capillary structure 3, and the first protrusion 114 is recessed corresponding to the second side 112. The main object of the present invention is to provide a heat dissipating device having a vacuum airtight chamber, which has a penetrating structure for penetrating and maintaining vacuum airtightness when the screwing member is required to be disposed, thereby maintaining a vapor-liquid circulation of the working liquid inside the heat dissipating device. For normal operation and through the use of hydrophilic layers and capillary structures to enhance the internal vapor-liquid circulation efficiency.
1‧‧‧散熱裝置氣密貫穿結構 1‧‧‧Heat-dissipating device airtight through structure
11‧‧‧第一板體 11‧‧‧ first board
111‧‧‧第一側 111‧‧‧ first side
112‧‧‧第二側 112‧‧‧ second side
113‧‧‧第一孔洞 113‧‧‧First hole
114‧‧‧第一凸體 114‧‧‧First convex
12‧‧‧第二板體 12‧‧‧Second plate
121‧‧‧第三側 121‧‧‧ third side
122‧‧‧第四側 122‧‧‧ fourth side
123‧‧‧第二孔洞 123‧‧‧Second hole
13‧‧‧中空柱體 13‧‧‧ hollow cylinder
131‧‧‧第一凸緣 131‧‧‧First flange
132‧‧‧第二凸緣 132‧‧‧second flange
133‧‧‧貫穿孔 133‧‧‧through holes
14‧‧‧密閉腔室 14‧‧‧Closed chamber
141‧‧‧親水性層 141‧‧‧Hydrophilic layer
2‧‧‧工作液體 2‧‧‧Working liquid
3‧‧‧毛細結構 3‧‧‧Capillary structure
第1圖係為習知技術散熱裝置俯視圖； 第2圖係為習知技術散熱裝置組合剖視圖； 第3圖係為本發明散熱裝置氣密貫穿結構之第一實施例立體分解圖； 第4圖係為本發明散熱裝置氣密貫穿結構之第一實施例組合剖視圖； 第5圖係為本發明散熱裝置氣密貫穿結構之第二實施例組合剖視圖； 第6圖係為本發明散熱裝置氣密貫穿結構之第三實施例組合剖視圖； 第7圖係為本發明散熱裝置氣密貫穿結構之第四實施例組合剖視圖； 第8圖係為本發明散熱裝置氣密貫穿結構之第五實施例組合剖視圖；1 is a top view of a conventional heat dissipating device; FIG. 2 is a cross-sectional view of a conventional heat dissipating device; FIG. 3 is an exploded perspective view of a first embodiment of the airtight through structure of the heat dissipating device of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a cross-sectional view showing a first embodiment of a heat-tight device air-tight through structure according to the present invention; FIG. 5 is a cross-sectional view showing a second embodiment of the heat-dissipating device air-permeable through structure of the present invention; 3 is a sectional view of a fourth embodiment of the heat dissipation device of the present invention; FIG. 8 is a combination of a fifth embodiment of the airtight penetration structure of the heat dissipation device of the present invention; Cutaway view
Claims (21)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106138372A TWI640742B (en) | 2017-11-07 | 2017-11-07 | Airtight penetration structure for heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106138372A TWI640742B (en) | 2017-11-07 | 2017-11-07 | Airtight penetration structure for heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
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| TWI640742B TWI640742B (en) | 2018-11-11 |
| TW201918681A true TW201918681A (en) | 2019-05-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113465431A (en) * | 2021-07-02 | 2021-10-01 | 青岛海信移动通信技术股份有限公司 | Temperature equalizing plate and terminal equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP4166884A1 (en) * | 2021-10-15 | 2023-04-19 | Single Use Support GmbH | Cooling plate and method for manufacturing a cooling plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH11325765A (en) * | 1998-05-15 | 1999-11-26 | Nissho Iwai Corp | Heat pipe and manufacturing method thereof |
| TW551612U (en) * | 2002-07-26 | 2003-09-01 | Tai Sol Electronics Co Ltd | Piercing type IC heat dissipating device |
| TW575155U (en) * | 2003-04-25 | 2004-02-01 | Pai-Chiou Wang | Flat type heat pipe with opening |
| CN105698581B (en) * | 2015-12-14 | 2018-05-29 | 上海利正卫星应用技术有限公司 | The flat-plate heat pipe of frivolous high pressure installation adaptability |
| CN105865241B (en) * | 2016-04-11 | 2018-07-24 | 广州华钻电子科技有限公司 | A kind of ultra-thin soaking plate and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113465431A (en) * | 2021-07-02 | 2021-10-01 | 青岛海信移动通信技术股份有限公司 | Temperature equalizing plate and terminal equipment |
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