TW201916182A - Electronic package - Google Patents

Abstract

An electronic package defines a plurality of grounding regions provided with ground contacts on a surface of the supporting structure, so that the electronic component can be selectively electrically connected to the grounding contact of at least one grounding region according to the functional specifications thereof. The larger or smaller ground potential required for the electronic component.

Description

 Electronic package  

The invention relates to a packaging technology, in particular to an electronic package capable of improving electrical functions.

With the evolution of semiconductor technology, semiconductor products have developed different package product types, and in order to improve electrical quality, a variety of semiconductor products have a shielding function to prevent electromagnetic interference (Electromagnetic Interference, referred to as EMI).

As shown in FIGS. 1A and 1B, the conventional semiconductor package 1 is provided with a semiconductor wafer 11 on a package substrate 10, and then the semiconductor wafer 11 is covered with an encapsulant 12, after which the encapsulant 12 and the package are encapsulated. A metal shielding layer 13 is formed on the side surface 10c of the substrate 10 to electrically connect the grounding portion 102 exposed on the side surface 10c of the package substrate 10 to the grounding portion 102 of the package substrate 10, and then grounded to the external system, thereby protecting the semiconductor wafer 11. Protected from external EMI and damaged.

The conventional package substrate 10 generally has a plurality of circuit layers 100. The circuit layers 100 are separated from each other by an insulating layer, and a plurality of conductive via holes are formed in the insulating layer to be electrically connected between the circuit layers 100. The lower circuit layer 100 also has a plurality of ball pads 101 for external connection of the semiconductor package 1 to the printed circuit board (not shown), and the upper circuit layer 100 includes a connection region G and a signal region S for the connection. The grounding contact 103 of the region G is electrically connected to the grounding portion 102 of the circuit layer 100, and is electrically connected to the grounding pad 110 of the semiconductor wafer 11 by a plurality of bonding wires 14, and the signal contact 104 of the signal region S is made by The plurality of bonding wires 14 are electrically connected to the signal pads 111 of the semiconductor wafer 11.

However, in the conventional semiconductor package 1, the semiconductor wafer 11 requires more and more functions, so that the semiconductor wafer 11 needs to transmit/receive more signals, so the current through the semiconductor wafer 11 via the signal pad 111 increases. As a result, the ground potential required for the semiconductor wafer 11 is increased, resulting in the single-connected region G of the package substrate 10 failing to meet the ground potential of the semiconductor wafer 11.

Therefore, how to overcome the problems of the above-mentioned prior art has become a problem that is currently being solved.

In view of the above-mentioned deficiencies of the prior art, the present invention provides an electronic package comprising: a load-bearing structure defining a first grounding area and a second grounding area, wherein the first grounding area is provided with at least one first grounding connection And the second grounding area is provided with at least one second grounding contact; and the electronic component is disposed on the supporting structure and electrically connected to the first and/or second grounding contact, and the electronic component is Located in the first grounding region, a portion of the first grounding region is located between the second grounding region and the electronic component.

In the above electronic package, the distribution area of the first grounding region is greater than or equal to the distribution area of the second grounding region.

In the above electronic package, the carrying structure is provided with a plurality of the first ground contacts and a plurality of the second ground contacts.

In the above electronic package, the electronic component has a solder pad to electrically connect the pad to the first ground contact by the first conductive component. For example, the first conductive element is a wire bond. Further, the first ground contact is electrically connected to the second ground contact by the second conductive element, for example, the second conductive element is a bonding wire.

In the above electronic package, the second grounding region is provided with at least one signal contact, and the third conductive component is electrically connected to the signal contact and the electronic component. For example, the third conductive element is a wire bond. Further, the electronic component has an electrode pad for electrically connecting the third conductive component, and the electrode pad is aligned with the signal contact on the same line.

In the above electronic package, the electronic component has a pad for electrically connecting the first and/or second ground contacts, and the pad and the first ground contact and the second ground contact are Arrange on the same line.

In the foregoing electronic package, an encapsulation layer formed on the carrier structure and covering the electronic component is further included.

In the above electronic package, a signal line is formed between the first ground region and the second ground region.

In the above electronic package, the electronic component has a solder pad, and the solder pad is electrically connected to the second ground contact by a fourth conductive component.

As can be seen from the above, the electronic package of the present invention mainly defines a plurality of grounding regions (ie, a first grounding region and a second grounding region) by the supporting structure, so that the electronic component can be selectively electrically connected to the first and/or Or a second ground contact, so that the electronic component can be electrically connected to the first and second ground contacts to meet the electron when the current through the multi-function electronic component is increased compared with the prior art. The requirement of the ground potential of the component.

1‧‧‧Semiconductor package

10‧‧‧Package substrate

10c‧‧‧ side

100‧‧‧Line layer

101‧‧‧Ball mat

102‧‧‧ Grounding Department

103‧‧‧ Grounding contacts

104,200b‧‧‧Signal contacts

11‧‧‧Semiconductor wafer

110‧‧‧Grounding mat

111‧‧‧Signal pad

12‧‧‧Package colloid

13‧‧‧Metal shield

14‧‧‧welding line

2,3‧‧‧Electronic package

20‧‧‧bearing structure

20a‧‧‧ surface

200‧‧‧ lines

200a‧‧‧conductive traces

200c‧‧‧Electrical endpoint

201‧‧‧First ground contact

202‧‧‧Second grounding contact

21,51‧‧‧First conductive element

22‧‧‧Second conductive element

23‧‧‧ Third conductive element

24‧‧‧Electronic components

240‧‧‧ solder pads

241‧‧‧electrode pads

25‧‧‧Encapsulation layer

300‧‧‧ signal line

54‧‧‧fourth conductive element

A‧‧‧First grounding area

B‧‧‧Second grounding area

C, D‧‧‧ dotted line

L, r, t‧‧‧ length

G‧‧‧Contact area

S‧‧‧ Signal Zone

1A is a schematic cross-sectional view of a conventional semiconductor package; FIG. 1B is a partial top view of FIG. 1A; FIG. 2A is a schematic cross-sectional view of the electronic package of the present invention; FIGS. 2B and 2C are 2A is a partial cross-sectional view of the electronic package of the present invention; FIG. 3 is a partial top view of another embodiment of the electronic package of the present invention; The figure is a schematic cross-sectional view of still another embodiment of the electronic package of the present invention; and FIG. 4B is a partial top view of FIG. 4A.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "first", "second" and "one" are used in the description, and are not intended to limit the scope of the invention. Changes or adjustments in the relative relationship are considered to be within the scope of the present invention.

2A to 2D are schematic views of the first embodiment of the electronic package 2 of the present invention.

As shown in FIGS. 2A to 2D, the electronic package 2 includes a carrier structure 20, at least one electronic component 24, at least one first conductive component 21, at least one second conductive component 22, and an encapsulation layer 25. .

The carrying structure 20 is defined on a surface 20a defining a first grounding area A and a second grounding area B separated from each other, and the electronic component 24 is located in the first grounding area A, so that the first grounding portion The area A is located between the second ground area B and the electronic component 24, that is, the first ground area A is adjacent to the electronic component 24, and the first ground area A is provided with a plurality of (three as shown) the first ground contact 201, and the second ground area B is provided with a plurality of lines (three as shown) separated from each other by a line 200 and a plurality (as shown in the figure) a second ground contact 202.

In this embodiment, the load-bearing structure 20 is a line structure having a core layer or a coreless core line structure, and has a plurality of circuit layers (not shown, referring to the circuit layer 100 of FIG. 1), for example The core substrate, the coreless substrate, or a fan-out type redistribution layer (RDL), and the circuit layer includes the first ground contacts 201 on the surface 20a of the load-bearing structure 20 Line 200 and second ground contact 202.

Furthermore, the material of the load-bearing structure 20 for the interlayer isolation circuit layer is, for example, polybenzoxazole (PBO), polyimide (PI), prepreg (prepreg, PP for short). ) such as dielectric materials. It should be understood that the carrying structure 20 may also be other carrier supporting the wafer, such as an organic board, a wafer, or other carrier board having a metal routing, and is not limited to the above.

Moreover, the distribution area of the first grounding area A (the U-shaped area surrounded by the imaginary line of FIG. 2B) is larger than the distribution area of the second grounding area B (the rectangular area surrounded by the imaginary line of FIG. 2B). It should be understood that the distribution area of the first grounding area A may also be equal to the distribution area of the second grounding area B.

In addition, the circuit 200 includes a conductive trace 200a and a signal contact 200b and an electrical terminal 200c respectively located at opposite ends of the conductive trace 200a.

The electronic component 24 is disposed on the carrying structure 20 and has a plurality of (three as shown) for electrically connecting the solder pads 240 of the first and/or second ground contacts 201, 202 and a plurality (such as The three shown in the figure are used to electrically connect the electrode pads 241 of the line 200.

In this embodiment, the electronic component 24 is an active component, a passive component or a combination thereof, etc., wherein the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

Furthermore, the pad 240 is a ground pad of the electronic component 24, and the electrode pad 241 is a signal pad of the electronic component 24.

Moreover, the electrode pads 241 of the electronic component 24 are electrically connected to the signal contacts 200b by a plurality of third conductive elements 23, wherein the third conductive elements 23 are solder wires.

In addition, as shown in FIG. 2C, the pad 240, the first ground contact 201, and the second ground contact 202 are arranged on the same straight line (as shown by the broken line C in FIG. 2C), and the signal is The contact 200b and the electrode pad 241 are in the same straight line (as shown by the broken line D shown in FIG. 2C).

The first conductive element 21 is a bonding wire that is in contact with and electrically connected to the pad 240 and the first ground contact 201.

The second conductive element 22 is a bonding wire that is in contact with and electrically connected to the first ground contact 201 and the second ground contact 202.

In this embodiment, the length r of the first conductive element 21 and the length t of the second conductive element 22 are smaller than the length L of the third conductive element 23.

In addition, in another embodiment, as shown in FIG. 3, the solder pad 240 of the electronic component 24 can be directly electrically connected to the second ground contact 202 by a fourth conductive component 54 such as a bonding wire. The soldering pad 240 of the electronic component 24 can be electrically connected to the first conductive component 51 only by the first conductive component 51, such as the bonding wire, as shown in FIG. The ground contact 201 is not jumped to the second ground contact 202.

The encapsulation layer 25 is formed on the surface 20a of the carrier structure 20 to cover the electronic component 24, the first conductive component 21, the second conductive component 22 and the third conductive component 23.

In this embodiment, the encapsulation layer 25 is an insulating material, such as polyimide (PI), dry film, epoxy or molding compound, which is available. A lamination or molding is formed on the surface 20a of the load-bearing structure 20. However, the material and manufacturing method of the encapsulating layer 25 are not limited to the above.

Therefore, the electronic package 2 of the present invention defines a first grounding area A and a second grounding area B by the supporting structure 20, so that the electronic component 24 can be selectively electrically connected to the first and/or second grounding. The contacts 201, 202 are electrically connected to the first and second ground contacts when the current of the electronic component 24 is increased to increase the current through the electronic component 24, as compared with the prior art. 201, 202 to meet the ground potential of the electronic component 24.

Moreover, when the electronic component 24 has a small function, the electronic component 24 can be electrically connected only to the first ground contact 201 (or the second ground contact 202) to conform to the electronic component 24. The need for a small ground potential.

4A and 4B are schematic views of still another embodiment of the electronic package 3 of the present invention. The difference between this embodiment and the foregoing embodiment is only the wiring of the load-bearing structure 20, and the other components are substantially the same, so only the differences will be described below, and the same points will not be described again.

As shown in FIGS. 4A and 4B, the load-bearing structure 20 is formed with a signal line 300 between the first ground area A and the second ground area B.

In the present embodiment, the signal line 300 is electrically connected to the line 200 by the circuit layer in the carrying structure 20, so that the electronic component 24 is electrically connected to the signal contact 200b to electrically connect to the signal. Line 300 improves the flexibility of the line layout.

In summary, the electronic package of the present invention defines a first grounding area and a second grounding area by the supporting structure, so that the electronic component can be selectively electrically connected to the first and/or according to its functional specifications. The second ground contact can meet the larger or smaller ground potential required for the electronic component, thereby improving the utility of the electronic package.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

Claims (14)

 An electronic package includes: a load-bearing structure defining a first grounding area and a second grounding area, wherein the first grounding area is provided with at least one first grounding contact, and the second grounding area is provided with at least a second grounding contact; and an electronic component disposed on the carrying structure and electrically connected to the first grounding contact and/or the second grounding contact, and the electronic component is located in the first grounding area The portion of the first ground region is located between the second ground region and the electronic component.    The electronic package of claim 1, wherein the first grounding area has a distribution area greater than or equal to a distribution area of the second grounding area.    The electronic package of claim 1, wherein a signal line is formed between the first ground region and the second ground region.    The electronic package of claim 1, wherein the electronic component has a solder pad to electrically connect the pad to the first ground contact by the first conductive component.    The electronic package of claim 4, wherein the first conductive element is a bonding wire.    The electronic package of claim 4, wherein the first ground contact is electrically connected to the second ground contact by the second conductive element.    The electronic package of claim 6, wherein the second conductive element is a bonding wire.    The electronic package of claim 1, wherein the second grounding region is provided with at least one signal contact, and the signal contact and the electronic component are electrically connected by the third conductive component.    The electronic package of claim 8, wherein the third conductive element is a bonding wire.    The electronic package of claim 8, wherein the electronic component has an electrode pad electrically connected to the third conductive component, and the electrode pad is aligned with the signal contact on the same line.    The electronic package of claim 1, wherein the electronic component has a pad for electrically connecting the first ground contact and/or the second ground contact, and the pad is The first ground contact and the second ground contact are arranged on the same straight line.    The electronic package of claim 1, further comprising an encapsulation layer formed on the carrier structure and covering the electronic component.    The electronic package of claim 1, wherein the electronic component has a solder pad, and the fourth conductive component is electrically connected to the solder pad and the second ground contact.    The electronic package of claim 13, wherein the fourth conductive element is a bonding wire.