TW201840728A - Resin material and laminate - Google Patents

Abstract

Provided is a resin material with which it is possible to effectively improve insulating properties and thermal conductance, effectively curb variation in breakdown strength, and effectively improve adhesion. The resin material according to the present invention contains first boron nitride cohesive particles, second boron nitride cohesive particles, and a binder resin. The first boron nitride cohesive particles, when compressed from 10% to 40% of the particle diameter, generate cracking at least once as a result of compressive displacement of 5% or more of the particle diameter. The aspect ratio of primary particles that constitute the first boron nitride cohesive particles exceeds 7. The second boron nitride cohesive particles, when compressed from 5% to 75% of the particle diameter, generate cracking at least three times as a result of compression displacement of 2% or more of particle diameter. The aspect ratio of the primary particles that constitute the second boron nitride cohesive particles does not exceed 7.

Description

Resin materials and laminates

The invention relates to a resin material containing boron nitride aggregated particles and a binder resin. In addition, the present invention relates to a laminate using the above resin material.

In recent years, the miniaturization and high performance of electronic and electrical equipment are being carried out, and the mounting density of electronic parts has become higher. Therefore, how to dissipate the heat generated by electronic parts in a narrow space becomes a problem. The heat generated by electronic parts is directly related to the reliability of electronic and electrical equipment, so the efficient dissipation of the heat generated becomes an urgent issue. As a method for solving the above-mentioned problems, a method of using a ceramic substrate having a high thermal conductivity using a heat-dissipating substrate such as a power semiconductor device can be cited. Examples of such ceramic substrates include alumina substrates and aluminum nitride substrates. However, in the above method using a ceramic substrate, there are the following problems: multilayering is difficult, processability is poor, and the cost is very high. Furthermore, since the difference between the linear expansion coefficients of the ceramic substrate and the copper circuit is large, there is also a problem that the copper circuit easily peels off during the cooling and heating cycle. Therefore, a resin composition using boron nitride having a low linear expansion coefficient, particularly hexagonal boron nitride, as a heat dissipation material has attracted attention. The crystal structure of hexagonal boron nitride is similar to the layer structure of hexagonal network of graphite. The particle shape of hexagonal boron nitride is scaly. Therefore, it is known that hexagonal boron nitride has the property that the thermal conductivity in the plane direction is higher than the thermal conductivity in the thickness direction and the thermal conductivity has anisotropy. As a method of reducing the anisotropy of the thermal conductivity of hexagonal boron nitride and increasing the thermal conductivity in the thickness direction, it has been proposed to use secondary agglomerated particles (agglomerated particles of boron nitride) obtained by agglomerating primary particles of hexagonal boron nitride. ). The following Patent Documents 1 to 3 disclose resin compositions using boron nitride aggregated particles. The following Patent Document 1 discloses a thermosetting resin composition containing an inorganic filler in a thermosetting resin. The above-mentioned inorganic filler contains a secondary aggregate (A) containing primary particles of boron nitride with an average length of 8 μm or less in a volume ratio of 40:60 to 98: 2, and contains an average length of more than 8 μm and is Secondary aggregates of primary particles of boron nitride below 20 μm (B). The content of the inorganic filler is 40% by volume or more and 80% by volume or less. The following Patent Document 2 discloses a curable heat-dissipating composition containing two kinds of fillers having different compressive breaking strengths (except when the two kinds of fillers are the same substance) and a curable resin (C). The compression failure strength ratio of the above two fillers (the compression failure strength of the filler (A) having a higher compression failure strength / the compression failure strength of the filler (B) having a lower compression failure strength) is 5 or more and 1500 or less. The filler (B) is hexagonal boron nitride aggregated particles. The following Patent Document 3 discloses a thermosetting resin composition containing a thermosetting resin and an inorganic filler. The above-mentioned inorganic filler contains secondary particles (A) formed of primary particles of boron nitride having an aspect ratio of 10 or more and 20 or less, and primary particles of boron nitride having an aspect ratio of 2 or more and 9 or less Secondary particles (B). [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2011-6586 [Patent Literature 2] WO2013 / 145961A1 [Patent Literature 3] WO2014 / 199650A1

[Problems to be solved by the invention] In the curable composition using the previous boron nitride aggregated particles as described in Patent Documents 1 to 3, in order to maintain the isotropy of the thermal conductivity of the boron nitride aggregated particles, When pressurizing materials such as metal forming, it is necessary to avoid disintegration of boron nitride aggregated particles due to pressurization. Therefore, there may be voids remaining between the boron nitride aggregated particles. As a result, although the thermal conductivity in the thickness direction can be improved, there is a case where the insulation is reduced. In addition, if pressurization of sheet forming or the like is performed to eliminate voids between boron nitride aggregated particles, the boron nitride aggregated particles may be deformed or disintegrated to lose the thermal conductivity of the boron nitride aggregated particles. . As a result, the thermal conductivity in the pressing direction (thickness direction) may decrease. In the previous boron nitride aggregated particles, there is a limit to achieving both higher insulation and higher thermal conductivity. In addition, in the curable composition using the previous boron nitride aggregated particles, it is difficult to completely eliminate the voids between the boron nitride aggregated particles, and the dielectric breakdown strength may be uneven. In addition, in the curable composition using the previous boron nitride aggregated particles, the area of the end surface of the boron nitride constituting the boron nitride aggregated particles is small, and there are also few functional groups present on the end surface. As a result, the adhesion between the boron nitride aggregated particles and the hardenable compound may decrease, or the adhesion between the hardenable composition and the adherend may decrease. An object of the present invention is to provide a resin material that can effectively improve insulation and thermal conductivity, can effectively suppress unevenness in dielectric breakdown strength, and can effectively improve adhesion, and a laminate using the resin material. [Technical Means for Solving the Problem] According to a broader aspect of the present invention, there is provided a resin material comprising first boron nitride aggregated particles, second boron nitride aggregated particles, and a binder resin, the first boron nitride The aggregated particles are fractures that occur at least once when the particle size of the first boron nitride aggregated particles is compressed from 10% to 40%, accompanied by a compression displacement of 5% or more of the particle size of the first boron nitride aggregated particles Particles, and the aspect ratio of the primary particles constituting the first boron nitride aggregated particles exceeds 7, the second boron nitride aggregated particles are compressed by reducing the particle size of the second boron nitride aggregated particles from 5% to 75 At%, 3 times or more fractured particles accompanied by a compression displacement of 2% or more of the particle diameter of the second boron nitride aggregated particles are generated, and the aspect ratio of the primary particles constituting the second boron nitride aggregated particles is 7 or less . In a specific aspect of the resin material of the present invention, the particle diameter of the first boron nitride aggregated particles exceeds 20 μm, and the average long diameter of the primary particles constituting the first boron nitride aggregated particles is 2 μm or more and is not Up to 20 μm, the average long diameter of the primary particles constituting the second boron nitride aggregated particles is 8 μm or less. In a specific aspect of the resin material of the present invention, the particle diameter of the second boron nitride aggregated particles is 30 μm or more and 60 μm or less. In a specific aspect of the resin material of the present invention, the compressive strength of the second boron nitride aggregated particles when compressed by 20% is 3 N / mm ² or less. In a specific aspect of the resin material of the present invention, the total content of the first boron nitride aggregated particles and the second boron nitride aggregated particles is 100% by volume or more and 80% by volume in 100% by volume of the resin material the following. In a specific aspect of the resin material of the present invention, the resin material is a resin sheet. According to a broader aspect of the present invention, there is provided a laminate including a heat conductor, an insulation layer laminated on one surface of the heat conductor, and a conductive layer laminated on a surface of the insulation layer opposite to the heat conductor And the material of the insulating layer is the resin material. [Effect of the Invention] The resin material of the present invention contains the first boron nitride aggregated particles, the second boron nitride aggregated particles, and the binder resin. In the resin material of the present invention, the first boron nitride aggregated particles are accompanied by the first boron nitride more than once when the particle size of the first boron nitride aggregated particles is compressed from 10% to 40% The aggregated particles have a compressive displacement of 5% or more of the fractured particles, and the aspect ratio of the primary particles constituting the first boron nitride aggregated particles exceeds 7. In the resin material of the present invention, the second boron nitride aggregated particles are accompanied by the second boron nitride aggregated three times or more when the particle size of the second boron nitride aggregated particles is compressed from 5% to 75% three times The fractured particles having a compression displacement of 2% or more of the particle diameter of the aggregated particles, and the aspect ratio of the primary particles constituting the second boron nitride aggregated particles are 7 or less. Since the resin material of the present invention has the above-mentioned structure, it is possible to effectively improve the insulation and thermal conductivity, to effectively suppress the unevenness of the dielectric breakdown strength, and to effectively improve the adhesion.

Hereinafter, the present invention will be described in detail. (Resin material) The resin material of the present invention contains the first boron nitride aggregated particles, the second boron nitride aggregated particles, and the binder resin. In the resin material of the present invention, the first boron nitride aggregated particles are accompanied by the first boron nitride more than once when the particle size of the first boron nitride aggregated particles is compressed from 10% to 40% Fractured particles with a compression displacement of more than 5% of the particle diameter of the aggregated particles. In the resin material of the present invention, the aspect ratio of the primary particles constituting the first boron nitride aggregated particles exceeds 7. In the resin material of the present invention, the second boron nitride aggregated particles are accompanied by the second boron nitride aggregated three times or more when the particle size of the second boron nitride aggregated particles is compressed from 5% to 75% three times Aggregated particles with a compressive displacement of 2% or more of the ruptured particles. In the resin material of the present invention, the aspect ratio of the primary particles constituting the second boron nitride aggregated particles is 7 or less. Since the resin material of the present invention has the above-mentioned structure, it is possible to effectively improve the insulation and thermal conductivity, to effectively suppress the unevenness of the dielectric breakdown strength, and to effectively improve the adhesion. In the resin material of the present invention, when a compressive force is applied by pressurization or the like, the first boron nitride aggregated particles are not excessively deformed or disintegrated, and the second boron nitride aggregated particles are moderately deformed Or disintegrate. Therefore, since the second boron nitride aggregated particles existing between the first boron nitride aggregated particles are disintegrated stepwise, the gaps existing between the first boron nitride aggregated particles can be filled, which can effectively Ground to improve insulation. Furthermore, the alignment of the primary particles constituting the first boron nitride aggregated particles can be effectively controlled by the second boron nitride aggregated particles that are moderately deformed or disintegrated, so that the thermal conductivity can be effectively improved. The first boron nitride aggregated particles are relatively less likely to deform or disintegrate than the second boron nitride aggregated particles. In the first boron nitride aggregated particles, since the aspect ratio of the primary particles constituting the first boron nitride aggregated particles is relatively large, there are cases where the primary particles are close to each other and entangled with each other. Therefore, even if a compressive force is applied by pressurization or the like, a large number of primary particles must move, so the first boron nitride aggregated particles are less likely to be deformed or disintegrated (see FIG. 5 (a)). The second boron nitride aggregated particles are relatively easier to deform or disintegrate than the first boron nitride aggregated particles. Therefore, when a compressive force is applied by pressurization or the like, the first boron nitride aggregated particles do not excessively deform or collapse, and the second boron nitride aggregated particles moderately deform or collapse. Furthermore, it is preferable that the pressurizing pressure for deforming or disintegrating the second boron nitride aggregated particles is lower than the pressurizing pressure for deforming or disintegrating the first boron nitride aggregated particles. For example, if a resin material containing only the first boron nitride aggregated particles is used and pressurized by sheet forming or the like, the first boron nitride aggregated particles are less likely to be deformed or disintegrated by pressurization, and the surface can be improved The thermal conductivity in the direction and the thickness direction, but voids remain between the first boron nitride aggregated particles, and the insulation deteriorates. On the other hand, in the case of pressurizing to the extent of eliminating voids, even the first boron nitride aggregated particles cannot maintain their form, and the thermal conductivity in the thickness direction decreases. In addition, if a resin material containing only the second boron nitride aggregated particles is used and pressurized by sheet forming or the like, the second boron nitride aggregated particles are easily deformed or disintegrated due to pressurization, and therefore exist When the thermal conductivity in the thickness direction decreases. The resin material of the present invention uses two kinds of boron nitride aggregated particles having different behaviors of deformation or disintegration during compression. In the resin material of the present invention, the first boron nitride aggregated particles are not easily deformed or disintegrated, and the second boron nitride aggregated particles are easily deformed or disintegrated, and will be deformed or disintegrated in stages, so if pressure is applied When a compressive force is applied, the second boron nitride aggregated particles are appropriately deformed or disintegrated around the first boron nitride aggregated particles. In addition, the compressed second boron nitride aggregated particles can fill the gaps existing between the first boron nitride aggregated particles, and the insulation can be effectively improved. Furthermore, the alignment of the primary particles having a relatively large aspect ratio, which constitute the first boron nitride aggregated particles, can be controlled by the second boron nitride aggregated particles that are appropriately deformed or disintegrated, not only in the plane direction, but also In the thickness direction, the thermal conductivity can also be effectively improved. In particular, by controlling the initial disintegration behavior when the second boron nitride aggregated particles are compressed by 20%, the alignment of the primary particles constituting the first boron nitride aggregated particles can be more effectively controlled. From the viewpoint of more effectively controlling the alignment of the primary particles constituting the first boron nitride aggregated particles, the compression strength of the second boron nitride aggregated particles when compressed by 20% is preferably 3 N / mm ² or less. In addition, in the resin material of the present invention, since the aspect ratio of the primary particles constituting the second boron nitride aggregated particles is relatively small, there are few contacts between the second boron nitride aggregated particles (see FIG. 5 ( b)). Therefore, the second boron nitride aggregated particles are easily deformed or disintegrated, and the gap between the first boron nitride aggregated particles can be filled without a gap. As a result, partial discharge (internal discharge) generated in the void portion can be suppressed, and unevenness in dielectric breakdown strength can be effectively suppressed. In addition, in the resin material of the present invention, since the gap existing between the first boron nitride aggregated particles can be filled without a gap, the long-term insulation reliability can be effectively improved. Furthermore, in the resin material of the present invention, since the aspect ratio of the primary particles constituting the second boron nitride aggregated particles is relatively small, the area of the end surface of the primary particles constituting the second boron nitride aggregated particles is large. Functional groups such as hydroxyl groups and amine groups exist on the above-mentioned end surface, and the amount of functional groups such as hydroxyl groups and amine groups can be increased by the second boron nitride aggregated particles. In addition, the second boron nitride aggregated particles and the primary particles constituting the second boron nitride aggregated particles can be bonded to the binder resin, the adherend, and the like through the above functional groups. As a result, the adhesion between the boron nitride aggregated particles and the binder resin and the adhesion between the boron nitride aggregated particles and the adherend can be effectively improved. In order to obtain this effect, it is useful to use the first boron nitride aggregated particles and the second boron nitride aggregated particles that satisfy the relationship between the specific deformation or disintegration behavior during compression and the specific aspect ratio. (First boron nitride aggregated particles and second boron nitride aggregated particles) In the resin material of the present invention, the first boron nitride aggregated particles are based on the particle size of the first boron nitride aggregated particles from 10% When it is compressed to 40%, the particles that are fractured with compressive displacement of 5% or more of the particle diameter of the first boron nitride aggregated particles are generated more than once. Here, cracking means that the first boron nitride aggregated particles are partially or entirely deformed or disintegrated. In the measurement results of the compressive strength of the first boron nitride aggregated particles, compressive displacement of 5% or more of the particle diameter of the first boron nitride aggregated particles was observed without an increase in compressive load of 1 mN or more. The phenomenon of increase is considered to be cracked (refer to FIG. 3. In FIG. 3, cracking is considered to occur at D1). The first boron nitride aggregated particles are less likely to crack when compressed. The first boron nitride aggregated particles are not easily deformed or disintegrated locally or entirely. Since the first boron nitride aggregated particles are less likely to crack when compressed, the thermal conductivity in the thickness direction can be effectively improved. From the viewpoint of more effectively improving the insulation property and the viewpoint of more effectively improving the thermal conductivity, it is preferable that the first boron nitride aggregated particles compress the particle diameter of the first boron nitride aggregated particles from 10% When it reaches 40%, more than one occurrence of fractured particles accompanied by a compression displacement of 9% or more of the particle diameter of the first boron nitride aggregated particles occurs. In the resin material of the present invention, the second boron nitride aggregated particles are accompanied by the second boron nitride aggregated three times or more when the particle size of the second boron nitride aggregated particles is compressed from 5% to 75% three times Aggregated particles with a compressive displacement of 2% or more of the ruptured particles. Here, cracking means that the second boron nitride aggregated particles are partially or entirely deformed or disintegrated. In the measurement results of the compressive strength of the second boron nitride aggregated particles, if the compression load of 0.5 mN or more is not increased, a compression displacement of 2% or more of the particle diameter of the second boron nitride aggregated particles is observed The phenomenon is considered to be cracking (refer to FIG. 4. In FIG. 4, cracking is considered to occur at D2). The second boron nitride aggregated particles are likely to crack when compressed. The second boron nitride aggregated particles are easily deformed or disintegrated locally or entirely. Since the second boron nitride aggregated particles are likely to crack when compressed, it is possible to fill the gaps existing between the first boron nitride aggregated particles. From the viewpoint of more effectively improving the insulation property and the viewpoint of more effectively improving the thermal conductivity, it is preferable that the second boron nitride aggregated particles compress the particle diameter of the second boron nitride aggregated particles from 5% At 75%, three or more times of rupture particles accompanied by a compression displacement of 3% or more of the particle diameter of the second boron nitride aggregated particles are generated. From the viewpoint of more effectively improving the insulating property and the viewpoint of more effectively improving the thermal conductivity, the compression strength of the first boron nitride aggregated particles at 20% compression is preferably 0.5 N / mm ² or more, more preferably It is 2 N / mm ² or more, and preferably 10 N / mm ² or less, and more preferably 5 N / mm ² or less. From the viewpoint of more effectively improving the insulation and the viewpoint of more effectively improving the thermal conductivity, the compression strength of the second boron nitride aggregated particles at 20% compression is preferably 0.5 N / mm ² or more, more preferably It is 1 N / mm ² or more, and preferably 3 N / mm ² or less, and more preferably 2 N / mm ² or less. The ratio of the compressive strength of the first boron nitride aggregated particles at 20% compression to the compressive strength of the second boron nitride aggregated particles at 20% compression (the first boron nitride aggregated particles at 20% compression) The compressive strength / compressive strength of the second boron nitride aggregated particles when compressed by 20%) is preferably 0.55 or more, and more preferably 0.9 or more. The ratio of the compressive strength of the first boron nitride aggregated particles at 20% compression to the compressive strength of the second boron nitride aggregated particles at 20% compression (the first boron nitride aggregated particles at 20% compression) Compressive strength / compressive strength of the second boron nitride aggregated particles when compressed by 20%) is preferably 10 or less, more preferably 6 or less. If the above ratio (compressive strength at 20% compression of the first boron nitride aggregated particles / compressive strength at 20% compression of the second boron nitride aggregated particles) is above the lower limit and below the upper limit, it can be more effective Improving insulation can effectively improve thermal conductivity. The compression strength when the first boron nitride aggregated particles and the second boron nitride aggregated particles are each compressed by 20% can be measured as follows. Using a micro-compression tester, using a diamond-made prism as a compression member, the smooth end surface of the compression member was dropped toward the boron nitride aggregated particles to compress the boron nitride aggregated particles. As a measurement result, the relationship between the compressive load value and the compressive displacement can be obtained. For the compressive load value, the compressive load value per unit area is calculated using the average cross-sectional area calculated from the particle diameter of the boron nitride aggregated particles, which is used as the compressive strength . In addition, the compression ratio is calculated from the compression displacement and the particle size of the boron nitride aggregated particles, and the relationship between the compression strength and the compression ratio is obtained. The measured boron nitride aggregated particles are observed with a microscope, and boron nitride aggregated particles having a particle diameter of ± 10% are selected for measurement. In addition, the said compressive strength is calculated as the average compressive strength obtained by averaging 20 measurement results. As the above-mentioned micro-compression tester, for example, "Micro-compression tester HM2000" manufactured by Fischer Instruments is used. In addition, the compression ratio can be calculated by (compression ratio = compression displacement ÷ average particle diameter × 100). The above-mentioned compressive strength can be measured using boron nitride aggregated particles before being prepared in the resin material, or the binder resin can be removed from the resin material, and the recovered boron nitride aggregated particles can be used for measurement. As a method of removing the binder resin from the resin material, a method of heating the resin material at a high temperature of 600 ° C. for 5 hours and the like can be mentioned. The method of removing the binder resin from the resin material may be the above-mentioned method or other methods. The number of occurrences of cracking of the first boron nitride aggregated particles when the particle size of the first boron nitride aggregated particles is compressed from 10% to 40%, and the compression displacement relative to the first nitrogenation when the fracture occurs The ratio of the particle diameter of the boron aggregated particles can be evaluated as follows. In the compression displacement-compression load value curve obtained by the measurement of the compression strength described above, the distance between the positions where the compression displacement does not change with the increase of the compression load of 1 mN or more is read (D1 in FIG. 3). By dividing this value by the particle size, the ratio of compression displacement due to cracking is calculated. The number of occurrences of cracking of the second boron nitride aggregated particles when the particle size of the second boron nitride aggregated particles is compressed from 5% to 75%, and the second displacement of the compression displacement relative to the occurrence of fracture The ratio of the particle diameter of the boron aggregated particles can be evaluated as follows. In the compression displacement-compression load value curve obtained by the measurement of the compression strength described above, the distance between positions where the compression displacement does not change with the increase of the compression load of 0.5 mN or more is read (D2 in FIG. 4). By dividing this value by the particle size, the ratio of compression displacement due to cracking is calculated. From the viewpoint of more effectively improving insulation and more effectively improving thermal conductivity, the particle diameter of the first boron nitride aggregated particles is preferably more than 20 μm, more preferably 50 μm or more, and is more preferable It is 120 μm or less, more preferably 100 μm or less. From the viewpoint of more effectively improving insulation and more effectively improving thermal conductivity, the particle diameter of the second boron nitride aggregated particles is preferably 30 μm or more, more preferably 35 μm or more, and preferably It is 60 μm or less, more preferably 55 μm or less. The particle diameters of the first boron nitride aggregated particles and the second boron nitride aggregated particles are preferably average particle diameters obtained by averaging the particle diameters on a volume basis. The particle diameters of the first boron nitride aggregated particles and the second boron nitride aggregated particles can be measured using a "laser diffraction type particle size distribution measuring device" manufactured by HORIBA. The particle size of the first boron nitride aggregated particles and the second boron nitride aggregated particles is preferably 3 g of each boron nitride aggregated particle, and the average particle size of each boron nitride aggregated particle contained therein is averaged And figure it out. Regarding the calculation method of the average particle diameter, among the particles of the first boron nitride aggregated particles and the second boron nitride aggregated particles, it is preferable to use the particle diameter (d50 ) As the average particle size. From the viewpoint of more effectively improving insulation and more effectively improving thermal conductivity, the aspect ratio of the first boron nitride aggregated particles is preferably 3 or less, and more preferably 2 or less. The lower limit of the aspect ratio of the first boron nitride aggregated particles is not particularly limited. The aspect ratio of the first boron nitride aggregated particles may be 1 or more. From the viewpoint of more effectively improving insulation and more effectively improving thermal conductivity, the aspect ratio of the second boron nitride aggregated particles is preferably 3 or less, and more preferably 2 or less. The lower limit of the aspect ratio of the second boron nitride aggregated particles is not particularly limited. The aspect ratio of the second boron nitride aggregated particles may be 1 or more. The aspect ratio of the first boron nitride aggregated particles and the second boron nitride aggregated particles represents the major axis / minor axis. The aspect ratio of the first boron nitride aggregated particles and the second boron nitride aggregated particles is preferably an average aspect ratio obtained by averaging the aspect ratios of the plurality of boron nitride aggregated particles. The average aspect ratio of the first boron nitride aggregated particles and the second boron nitride aggregated particles can be calculated by observing 50 randomly selected boron nitride aggregated particles using an electron microscope or an optical microscope to calculate the The average value of the long diameter / short diameter is obtained. From the viewpoint of improving the thermal conductivity more effectively, the thermal conductivity of the first boron nitride aggregated particles is preferably 5 W / m · K or more, and more preferably 10 W / m · K or more. The upper limit of the thermal conductivity of the first boron nitride aggregated particles is not particularly limited. The thermal conductivity of the first boron nitride aggregated particles may be 1000 W / m · K or less. From the viewpoint of more effectively improving thermal conductivity, the thermal conductivity of the second boron nitride aggregated particles is preferably 5 W / m · K or more, and more preferably 10 W / m · K or more. The upper limit of the thermal conductivity of the second boron nitride aggregated particles is not particularly limited. The thermal conductivity of the second boron nitride aggregated particles may be 1000 W / m · K or less. From the viewpoint of more effectively improving the insulation and the viewpoint of more effectively improving the thermal conductivity, the total content of the first boron nitride aggregated particles and the second boron nitride aggregated particles in 100% by volume of the resin material It is preferably 20% by volume or more, more preferably 45% by volume or more, and preferably 80% by volume or less, and more preferably 70% by volume or less. The method for producing the first boron nitride aggregated particles and the second boron nitride aggregated particles is not particularly limited, and examples thereof include a spray drying method and a fluidized bed granulation method. The method for producing the first boron nitride aggregated particles and the second boron nitride aggregated particles is preferably a spray-dry method. The spray drying method can be classified into a two-fluid nozzle method, a disk method (also called a rotation method), and an ultrasonic nozzle method according to the spray method, and any of these methods can be applied. From the viewpoint that the total pore volume can be more easily controlled, the ultrasonic nozzle method is preferred. The first boron nitride aggregated particles and the second boron nitride aggregated particles are preferably manufactured using primary particles of boron nitride as a material. The boron nitride used as the material of the first boron nitride aggregated particles and the second boron nitride aggregated particles is not particularly limited. Examples of boron nitride used as the material include hexagonal boron nitride, cubic boron nitride, boron compounds, and ammonia. Boron nitride produced by the reduction nitridation method, boron compounds, and melamine contain nitrogen. Compound made of boron nitride, and boron nitride made of sodium borohydride and ammonium chloride. From the viewpoint of more effectively improving the thermal conductivity of the first boron nitride aggregated particles and the second boron nitride aggregated particles, the boron nitride used as the material of the boron nitride aggregated particles is preferably hexagonal boron nitride . From the viewpoint of more effectively improving the insulating property and the viewpoint of more effectively improving the thermal conductivity, the first boron nitride aggregated particles are preferably primary particle aggregates of the first boron nitride, and the second nitrogen The boron oxide aggregated particles are preferably aggregates of second boron nitride as primary particles. The first boron nitride aggregated particles are preferably secondary particles obtained by aggregating the first boron nitride as primary particles, and the second boron nitride aggregated particles are preferably made of the second nitrogen as primary particles Secondary particles formed by boron agglomeration. In addition, as a method for producing boron nitride aggregated particles, a granulation step is not necessarily required. It may be a boron nitride aggregated particle formed by the primary aggregation of primary particles of boron nitride accompanying the crystal growth of boron nitride. In addition, in order to make the particle diameter of the boron nitride aggregated particles uniform, it may be pulverized boron nitride aggregated particles. From the viewpoint of more effectively improving the insulation property and the viewpoint of more effectively improving the thermal conductivity, the first boron nitride aggregated particles may include a compression characteristic within the above range, and the aspect ratio of the primary particles constituting the aggregated particles is as follows Two or more types of agglomerated particles with different particle sizes in the above-mentioned range. From the viewpoint of more effectively improving the insulating property and the viewpoint of more effectively improving the thermal conductivity, the second boron nitride aggregated particles may include a compression characteristic within the above range, and the aspect ratio of the primary particles constituting the aggregated particles is as follows Two or more types of agglomerated particles with different particle sizes in the above-mentioned range. From the viewpoint of more effectively improving the insulating property and the viewpoint of more effectively improving the thermal conductivity, the resin material may contain, in addition to the first boron nitride aggregated particles and the second boron nitride aggregated particles, The first boron nitride aggregated particles and the third inorganic particles of the second boron nitride aggregated particles. From the viewpoint of more effectively improving the insulation properties and the viewpoint of more effectively improving the thermal conductivity, the resin material preferably contains the third inorganic particles. The third inorganic particles are preferably aggregated particles. The third inorganic particles are preferably secondary particles obtained by aggregating primary particles of boron nitride. Primary particles constituting the first boron nitride aggregated particles and second boron nitride aggregated particles (first boron nitride and second boron nitride): Primary particles constituting the first boron nitride aggregated particles (first nitride The average long diameter of boron) is preferably 2 μm or more, more preferably 3 μm or more, and preferably less than 20 μm, more preferably 16 μm or less. If the average long diameter of the primary particles (first boron nitride) constituting the first boron nitride aggregated particles is above the lower limit and below the upper limit, the insulation and thermal conductivity can be more effectively improved and the suppression can be more effectively suppressed The uneven dielectric strength can improve the adhesion more effectively. The average long diameter of the primary particles (second boron nitride) constituting the second boron nitride aggregated particles is preferably 3 μm or more, more preferably 4 μm or more, and preferably 8 μm or less, more preferably 7.5 μm the following. If the average long diameter of the primary particles (second boron nitride) constituting the second boron nitride aggregated particles is above the lower limit and below the upper limit, the insulation and thermal conductivity can be more effectively improved, and the suppression can be more effectively The uneven dielectric strength can improve the adhesion more effectively. The average major axis of the primary particles (first boron nitride and second boron nitride) constituting the first boron nitride aggregated particles and the second boron nitride aggregated particles can be calculated as follows. Using an electron microscope, the primary particles (first boron nitride and second boron nitride) constituting the first boron nitride aggregated particles and the second boron nitride aggregated particles are mixed with a thermosetting resin, etc. Observe the cross section of the produced sheet or the laminate produced by pressurization. The long diameters of 50 primary particles (each boron nitride) constituting each boron nitride aggregated particle arbitrarily selected from the obtained electron microscope images were measured, and the average value was calculated. In the resin material of the present invention, the aspect ratio of the primary particles (first boron nitride) constituting the first boron nitride aggregated particles exceeds 7. From the viewpoint of more effectively improving the insulation and thermal conductivity, the viewpoint of more effectively suppressing the unevenness of the dielectric breakdown strength, and the viewpoint of more effectively improving the adhesiveness, the primary particles constituting the first boron nitride aggregated particles The aspect ratio of (first boron nitride) is preferably 7.5 or more, and more preferably 8 or more. The upper limit of the aspect ratio of the primary particles constituting the first boron nitride aggregated particles is not particularly limited. The aspect ratio of the primary particles constituting the first boron nitride aggregated particles may be 20 or less. In the resin material of the present invention, the aspect ratio of the primary particles (second boron nitride) constituting the second boron nitride aggregated particles is 7 or less. From the viewpoint of more effectively improving the insulation and thermal conductivity, the viewpoint of more effectively suppressing the unevenness of dielectric breakdown strength, and the viewpoint of more effectively improving the adhesiveness, the primary particles constituting the second boron nitride aggregated particles The (second boron nitride) aspect ratio is preferably 6.5 or less, more preferably 6 or less. The lower limit of the aspect ratio of the primary particles constituting the second boron nitride aggregated particles is not particularly limited. The aspect ratio of the primary particles constituting the second boron nitride aggregated particles may be 2 or more. The aspect ratio of the primary particles (first boron nitride and second boron nitride) constituting the first boron nitride aggregated particles and the second boron nitride aggregated particles represents the major axis / minor axis. The aspect ratio of the primary particles (first boron nitride and second boron nitride) constituting the first boron nitride aggregated particles and the second boron nitride aggregated particles can be calculated as follows. Using an electron microscope, the primary particles (first boron nitride and second boron nitride) constituting the first boron nitride aggregated particles and the second boron nitride aggregated particles are mixed with a thermosetting resin, etc. Observe the cross section of the produced sheet or the laminate produced by pressurization. The major axis / minor axis of 50 primary particles (each boron nitride) constituting each boron nitride aggregated particle arbitrarily selected from the obtained electron microscope images were measured, and the average value was calculated. In the primary particles constituting the first boron nitride aggregated particles and the second boron nitride aggregated particles, it is not necessary that all the primary particles are in the form of scales, and particles containing a plurality of primary particles combined or aggregated may also be contained. The particles formed by combining or aggregating the plurality of primary particles may have a curved shape (curved particles), and the primary particles constituting the first boron nitride aggregated particles and the second boron nitride aggregated particles may contain the curved particles. In particular, in the second boron nitride aggregated particles, if the primary particles constituting the second boron nitride aggregated particles contain the curved particles, the presence of the second boron nitride aggregated particles can be filled in the above without gaps. The first boron nitride aggregates voids between particles. The curved shape particles are divided into two particles at the curved portion, and the major axis / minor axis of each particle is measured, and the major axis / minor axis of the long axis particle is taken as the major axis / minor axis of the curved particle. The aspect ratio is calculated based on the obtained values of the major axis / minor axis. In the electron microscope image of the cross section of the sheet or laminate, the first boron nitride aggregated particles can maintain the morphology of the aggregated particles even after being pressurized, so it can be based on the electron microscope of the cross section of the sheet or laminate Image to confirm. On the other hand, the second boron nitride aggregated particles are deformed or disintegrated while maintaining isotropy after pressurization, and therefore strongly suggest their existence. It is assumed that scales obtained by crushing the second boron nitride aggregated particles in advance (primary particles constituting the second boron nitride aggregated particles: the second boron nitride), and the first boron nitride aggregated particles In the case of mixing a thermosetting resin and the like to produce a sheet or laminate, the scales are relatively easy to align in the plane direction compared to aggregated particles. Therefore, compared with the case of using aggregated particles, it is difficult for the above-mentioned scales to maintain isotropy even after pressurization. As a result, it can be determined from the electron microscope image of the cross section of the sheet or laminate even after pressurization that the first boron nitride aggregated particles having a relatively large aspect ratio and relatively easy to maintain shape are used, and The second boron nitride aggregated particles that are easily disintegrated. (Binder resin) The resin material of the present invention contains a binder resin. The binder resin is not particularly limited. As the above-mentioned binder resin, a known insulating resin can be used. The binder resin preferably contains a thermoplastic component (thermoplastic compound) or a curable component, and more preferably contains a curable component. Examples of the above-mentioned curable components include thermosetting components and photo-curing components. The thermosetting component preferably contains a thermosetting compound and a thermosetting agent. The photocurable component preferably contains a photocurable compound and a photopolymerization initiator. The binder resin preferably contains a thermosetting component. Only one kind of the above binder resin may be used, or two or more kinds may be used in combination. "(Meth) acryloyl" means acryloyl and methacryloyl. "(Meth) acrylic group" means an acrylic group and a methacrylic group. "(Meth) acrylate" means acrylate and methacrylate. (Thermosetting component: thermosetting compound) Examples of the thermosetting compound include styrene compounds, phenoxy compounds, oxetane compounds, epoxy compounds, episulfide compounds, (meth) acrylic acid Compound, phenol compound, amino compound, unsaturated polyester compound, polyurethane compound, polysiloxane compound, polyimide compound, etc. Only one type of the above thermosetting compound may be used, or two or more types may be used in combination. As the thermosetting compound, (A1) a thermosetting compound having a molecular weight of less than 10,000 (sometimes only described as (A1) thermosetting compound), or (A2) a thermosetting compound having a molecular weight of 10,000 or more Compound (sometimes only described as (A2) thermosetting compound). Both (A1) thermosetting compounds and (A2) thermosetting compounds can also be used. In 100% by volume of the resin material, the content of the thermosetting compound is preferably 10% by volume or more, more preferably 20% by volume or more, and preferably 90% by volume or less, more preferably 80% by volume or less. If the content of the thermosetting compound is at least the above lower limit, the adhesiveness and heat resistance of the cured product become higher. If the content of the thermosetting compound is equal to or less than the above upper limit, the coatability of the resin material becomes higher. (A1) Thermosetting compound having a molecular weight of not more than 10,000: Examples of the (A1) thermosetting compound include thermosetting compounds having a cyclic ether group. Examples of the cyclic ether group include epoxy groups and oxetanyl groups. The thermosetting compound having a cyclic ether group is preferably a thermosetting compound having an epoxy group or an oxetanyl group. (A1) Only one type of thermosetting compound may be used, or two or more types may be used in combination. (A1) The thermosetting compound may contain (A1a) a thermosetting compound having an epoxy group (sometimes only referred to as (A1a) thermosetting compound), or may contain (A1b) a heat having an oxetanyl group Curable compound (sometimes only described as (A1b) thermosetting compound). From the viewpoint of more effectively improving the heat resistance and moisture resistance of the cured product, the (A1) thermosetting compound preferably has an aromatic skeleton. The aromatic skeleton is not particularly limited, and examples include naphthalene skeleton, stilbene skeleton, biphenyl skeleton, anthracene skeleton, pyrene skeleton, Skeleton, adamantane skeleton and bisphenol A skeleton etc. From the viewpoint of more effectively improving the cold-heat cycle resistance and heat resistance of the cured product, the aromatic skeleton is preferably a biphenyl skeleton or a stilbene skeleton. Examples of the (A1a) thermosetting compound include epoxy monomers having a bisphenol skeleton, epoxy monomers having a dicyclopentadiene skeleton, epoxy monomers having a naphthalene skeleton, and rings having an adamantane skeleton. Oxygen monomers, epoxy monomers with stilbene skeleton, epoxy monomers with biphenyl skeleton, epoxy monomers with bis (glycidoxyphenyl) methane skeleton, with Epoxy monomer with skeleton, epoxy monomer with anthracene skeleton, epoxy monomer with pyrene skeleton, etc. These hydrides or modified products can also be used. (A1a) Only one type of thermosetting compound may be used, or two or more types may be used in combination. Examples of the epoxy monomer having a bisphenol skeleton include epoxy monomers having a bisphenol skeleton of bisphenol A type, bisphenol F type or bisphenol S type. Examples of the epoxy monomer having a dicyclopentadiene skeleton include dicyclopentadiene dioxide, phenol novolak epoxy monomer having a dicyclopentadiene skeleton, and the like. Examples of the epoxy monomer having a naphthalene skeleton include 1-glycidyl naphthalene, 2-glycidyl naphthalene, 1,2-diglycidyl naphthalene, 1,5-diglycidyl naphthalene, and 1, 6-diglycidyl naphthalene, 1,7-diglycidyl naphthalene, 2,7-diglycidyl naphthalene, triglycidyl naphthalene, and 1,2,5,6-tetraglycidyl naphthalene, etc. Examples of the epoxy monomer having an adamantane skeleton include 1,3-bis (4-glycidoxyphenyl) adamantane and 2,2-bis (4-glycidoxyphenyl) adamantine Alkane etc. Examples of the epoxy monomer having a stilbene skeleton include: 9,9-bis (4-glycidoxyphenyl) stilbene, 9,9-bis (4-glycidoxy-3-methylphenyl) ) Fusi, 9,9-bis (4-glycidoxy-3-chlorophenyl) fuzi, 9,9-bis (4-glycidoxy-3-bromophenyl) fusi, 9,9-bis (4-glycidoxy-3-fluorophenyl) stilbene, 9,9-bis (4-glycidoxy-3-methoxyphenyl) stilbene, 9,9-bis (4-glycidyloxy Yl-3,5-dimethylphenyl) stilbene, 9,9-bis (4-glycidoxy-3,5-dichlorophenyl) stilbene, and 9,9-bis (4-glycidyloxy) Yl-3,5-dibromophenyl) fusi etc. Examples of the epoxy monomer having a biphenyl skeleton include 4,4'-diglycidyl biphenyl and 4,4'-diglycidyl-3,3 ', 5,5'-tetramethyl Base biphenyl, etc. Examples of the epoxy monomer having a bis (glycidoxyphenyl) methane skeleton include 1,1′-bis (2,7-glycidoxynaphthyl) methane and 1,8′-bis ( 2,7-glycidoxynaphthyl) methane, 1,1'-bis (3,7-glycidoxynaphthyl) methane, 1,8'-bis (3,7-glycidoxynaphthyl) ) Methane, 1,1'-bis (3,5-glycidoxynaphthyl) methane, 1,8'-bis (3,5-glycidoxynaphthyl) methane, 1, 2'-bis ( 2,7-glycidoxynaphthyl) methane, 1,2-bis (3,7-glycidoxynaphthyl) methane, and 1,2-bis (3,5-glycidoxynaphthalene) Radical) methane, etc. As the above has Examples of the epoxy monomers of the skeleton include: 1,3,4,5,6,8-hexamethyl-2,7-bis (oxiranylmethoxy) -9-phenyl-9H- Wait. Specific examples of the (A1b) thermosetting compound include, for example, 4,4′-bis [(3-ethyl-3-oxetanyl) methoxymethyl] biphenyl, 1,4- Bis [(3-ethyl-3-oxetanyl) methyl] phthalate, 1,4-bis [(3-ethyl-3-oxetanyl) methoxymethyl ] Benzene and oxetane modified phenol novolac, etc. (A1b) Only one type of thermosetting compound may be used, or two or more types may be used in combination. From the viewpoint of improving the heat resistance of the cured product, the (A1) thermosetting compound preferably contains a thermosetting compound having two or more cyclic ether groups. From the viewpoint of improving the heat resistance of the cured product, the content of the thermosetting compound having 2 or more cyclic ether groups in the (A1) thermosetting compound 100% by weight is preferably 70% by weight or more, More preferably, it is 80% by weight or more, and preferably 100% by weight or less. In (A1) 100% by weight of the thermosetting compound, the content of the thermosetting compound having two or more cyclic ether groups may be 10% by weight or more and 100% by weight or less. In addition, (A1) the entire thermosetting compound may be a thermosetting compound having two or more cyclic ether groups. (A1) The molecular weight of the thermosetting compound is less than 10,000. (A1) The molecular weight of the thermosetting compound is preferably 200 or more, and preferably 1200 or less, more preferably 600 or less, and still more preferably 550 or less. If the molecular weight of the (A1) thermosetting compound is at least the above lower limit, the adhesiveness of the surface of the cured product becomes lower, and the handleability of the resin material becomes higher. If the molecular weight of the (A1) thermosetting compound is equal to or lower than the above upper limit, the adhesiveness of the cured product becomes higher. Furthermore, the hardened material hardly becomes hard and becomes brittle, and the adhesiveness of the hardened material becomes higher. In addition, in this specification, the molecular weight of (A1) thermosetting compound is when (A1) the thermosetting compound is not a polymer and when the structural formula of (A1) thermosetting compound can be specified , Means the molecular weight that can be calculated from the structural formula, and in the case where (A1) the thermosetting compound is a polymer, it means the weight average molecular weight. The weight average molecular weight is the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC). In the measurement of gel permeation chromatography (GPC), tetrahydrofuran is preferably used as the eluent. In 100% by volume of the resin material, the content of the (A1) thermosetting compound is preferably 10% by volume or more, more preferably 20% by volume or more, and preferably 90% by volume or less, more preferably 80% by volume or less. If the content of the (A1) thermosetting compound is at least the above lower limit, the adhesiveness and heat resistance of the cured product become higher. If the content of the (A1) thermosetting compound is equal to or lower than the above upper limit, the coatability of the resin material becomes higher. (A2) Thermosetting compound having a molecular weight of 10,000 or more: (A2) Thermosetting compound is a thermosetting compound having a molecular weight of 10,000 or more. Since the molecular weight of the (A2) thermosetting compound is 10,000 or more, the (A2) thermosetting compound is usually a polymer, and the above molecular weight usually means the weight average molecular weight. From the viewpoint of more effectively improving the heat resistance and moisture resistance of the cured product, the (A2) thermosetting compound preferably has an aromatic skeleton. In the case where (A2) the thermosetting compound is a polymer and (A2) the thermosetting compound has an aromatic skeleton, (A2) the thermosetting compound may have an aromatic skeleton at any part of the entire polymer. It is contained in the backbone of the main chain, and may also be contained in the side chain. From the viewpoint of improving the heat resistance of the cured product and the moisture resistance of the cured product, the (A2) thermosetting compound preferably has an aromatic skeleton in the main chain skeleton. (A2) Only one type of thermosetting compound may be used, or two or more types may be used in combination. The aromatic skeleton is not particularly limited, and examples include naphthalene skeleton, stilbene skeleton, biphenyl skeleton, anthracene skeleton, pyrene skeleton, Skeleton, adamantane skeleton and bisphenol A skeleton etc. From the viewpoint of more effectively improving the cold-heat cycle resistance and heat resistance of the cured product, the aromatic skeleton is preferably a biphenyl skeleton or a stilbene skeleton. The (A2) thermosetting compound is not particularly limited, and examples thereof include styrene resin, phenoxy resin, oxetane resin, epoxy resin, episulfide compound, (meth) acrylic resin, and phenol Resins, amino resins, unsaturated polyester resins, polyurethane resins, polysiloxane resins, polyimide resins, etc. From the viewpoint of suppressing the oxidative deterioration of the cured product, further improving the cold-heat cycle resistance and heat resistance of the cured product, and further reducing the water absorption rate of the cured product, (A2) the thermosetting compound is preferably styrene resin or phenoxy The base resin or epoxy resin is more preferably a phenoxy resin or an epoxy resin, and further preferably a phenoxy resin. Especially by using phenoxy resin or epoxy resin, the heat resistance of the cured product becomes higher. Furthermore, by using phenoxy resin, the elastic modulus of the cured product becomes lower, and the cold-heat cycle resistance of the cured product becomes higher. Furthermore, the (A2) thermosetting compound may not have a cyclic ether group such as an epoxy group. As the styrene resin, specifically, a homopolymer of a styrene-based monomer, a copolymer of a styrene-based monomer and an acrylic monomer, and the like can be used. A styrene polymer having a structure of styrene-glycidyl methacrylate is preferred. Examples of the styrene-based monomers include styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, p-methoxystyrene, p-phenylstyrene, and p-chlorostyrene. , P-ethylstyrene, p-n-butylstyrene, p-tert-butylstyrene, p-n-hexylstyrene, p-n-octylstyrene, p-n-nonylstyrene, p-n-decylstyrene, p N-dodecyl styrene, 2,4-dimethylstyrene, 3,4-dichlorostyrene, etc. Specifically, the phenoxy resin is, for example, a resin obtained by reacting epihalohydrin with a dihydric phenol compound, or a resin obtained by reacting a divalent epoxy compound with a dihydric phenol compound. The phenoxy resin preferably has a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol A / F mixed skeleton, a naphthalene skeleton, a stilbene skeleton, a biphenyl skeleton, an anthracene skeleton, a pyrene skeleton, Skeleton, adamantane skeleton or dicyclopentadiene skeleton. The phenoxy resin preferably has a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol A / F mixed skeleton, a naphthalene skeleton, a stilbene skeleton or a biphenyl skeleton, and more preferably has a stilbene skeleton and a biphenyl skeleton At least one of the skeletons. By using the phenoxy resin having these preferable skeletons, the heat resistance of the cured product is further increased. The epoxy resin is an epoxy resin other than the phenoxy resin. Examples of the epoxy resin include epoxy resins containing a styrene skeleton, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, Biphenol type epoxy resin, naphthalene type epoxy resin, stilbene type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, anthracene type Epoxy resin, epoxy resin with adamantane skeleton, epoxy resin with tricyclodecane skeleton, and epoxy resin with trinuclear skeleton. (A2) The molecular weight of the thermosetting compound is 10,000 or more. (A2) The molecular weight of the thermosetting compound is preferably 30,000 or more, more preferably 40,000 or more, and preferably 1,000,000 or less, more preferably 250,000 or less. If the molecular weight of the (A2) thermosetting compound is at least the above lower limit, the cured product is less likely to be thermally deteriorated. If the molecular weight of the (A2) thermosetting compound is equal to or lower than the above upper limit, the compatibility of the (A2) thermosetting compound with other components becomes high. As a result, the heat resistance of the cured product becomes higher. In 100% by volume of the resin material, the content of the (A2) thermosetting compound is preferably 20% by volume or more, more preferably 30% by volume or more, and preferably 60% by volume or less, more preferably 50% by volume or less. If the content of the (A2) thermosetting compound is at least the above lower limit, the handleability of the resin material becomes better. If the content of the (A2) thermosetting compound is equal to or lower than the above upper limit, the coatability of the resin material becomes higher. (Thermosetting component: thermosetting agent) The thermosetting agent is not particularly limited. As the thermosetting agent, a thermosetting agent capable of hardening the thermosetting compound can be suitably used. In this specification, the thermosetting agent contains a curing catalyst. Only one type of thermosetting agent may be used, or two or more types may be used in combination. From the viewpoint of more effectively improving the heat resistance of the cured product, the thermal curing agent preferably has an aromatic skeleton or an alicyclic skeleton. The thermal hardener preferably contains an amine hardener (amine compound), an imidazole hardener, a phenolic hardener (phenolic compound) or an acid anhydride hardener (acid anhydride), and more preferably contains an amine hardener. The acid anhydride hardener is preferably an acid anhydride having an aromatic skeleton, a hydride of the acid anhydride or a modified product of the acid anhydride, or an acid anhydride having an alicyclic skeleton, a hydride of the acid anhydride or a modified product of the acid anhydride . Examples of the amine hardener include dicyandiamide, imidazole compounds, diaminodiphenylmethane, and diaminodiphenylsulfone. From the viewpoint of more effectively improving the adhesion of the hardened product, the amine hardener is more preferably a dicyandiamide or imidazole compound. From the viewpoint of more effectively improving the storage stability of the resin material, the thermal hardener preferably contains a hardener having a melting point of 180 ° C or higher, and more preferably contains an amine hardener having a melting point of 180 ° C or higher. Examples of the imidazole hardener include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2- Phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methyl Imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1 -Cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [ 2'-Methylimidazolyl- (1 ')]-ethyl-s-tris, 2,4-diamino-6- [2'-undecylimidazolyl- (1')]-ethyl- S-tris, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1 ')]-ethyl-s-tris, 2,4-diamino-6- [2'-Methylimidazolyl- (1 ')]-Ethyl-triisocyanuric acid adduct, 2-phenylimidazolium isocyanurate adduct, 2-methylimidazolium isocyanate Polycyanic acid adducts, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-dihydroxymethylimidazole, etc. Examples of the phenolic hardeners include phenol novolak, o-cresol novolak, p-cresol novolak, tertiary butylphenol novolak, dicyclopentadiene cresol, poly-p-vinylphenol, and bisphenol. A-type novolak, xylylene modified novolak, decalin modified novolak, poly (di-o-hydroxyphenyl) methane, poly (di-m-hydroxyphenyl) methane, and poly (di-p-hydroxyphenyl) ) Methane, etc. From the viewpoint of more effectively improving the flexibility of the cured product and the flame retardancy of the cured product, the phenolic curing agent is preferably a phenol resin having a melamine skeleton, a phenol resin having a tri skeleton, or having allyl Based phenolic resin. Examples of commercially available products of the above phenolic hardeners include MEH-8005, MEH-8010, and MEH-8015 (all of which are manufactured by Minghe Chemical Co., Ltd.), YLH903 (manufactured by Mitsubishi Chemical Corporation), LA-7052, LA-7054 , LA-7775, LA-1356 and LA-3018-50P (above are all manufactured by DIC), PS6313 and PS6492 (above are all manufactured by Qunrong Chemical Co., Ltd.), etc. Examples of the acid anhydride having an aromatic skeleton, the hydride of the acid anhydride, or the modified product of the acid anhydride include styrene / maleic anhydride copolymer, benzophenone tetracarboxylic dianhydride, and pyromellitic acid. Formic dianhydride, trimellitic anhydride, 4,4'-oxydiphthalic anhydride, phenylethynyl phthalic anhydride, glycerol bis (anhydride trimellitate) monoacetate, ethylene glycol Bis (dehydrated trimellitate), methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, etc. Examples of the commercially available products of the acid anhydride having an aromatic skeleton, the hydride of the acid anhydride, or the modified product of the acid anhydride include: SMA RESIN EF30, SMA RESIN EF40, SMA RESIN EF60 and SMA RESIN EF80 (the above are all Sartomer Japan Manufactured by the company), ODPA-M and PEPA (manufactured by MANAC), RIKACID MTA-10, RIKACID MTA-15, RIKACID TMTA, RIKACID TMEG-100, RIKACID TMEG-200, RIKACID TMEG-300, RIKACID TMEG-500 , RIKACID TMEG-S, RIKACID TH, RIKACID HT-1A, RIKACID HH, RIKACID MH-700, RIKACID MT-500, RIKACID DSDA and RIKACID TDA-100 (the above are all manufactured by New Japan Physical and Chemical Corporation), and EPICLON B4400, EPICLON B650, and EPICLON B570 (above are made by DIC), etc. The acid anhydride having an alicyclic skeleton, the hydride of the acid anhydride or the modified product of the acid anhydride is preferably an acid anhydride having a polyalicyclic skeleton, the hydride of the acid anhydride or a modified product of the acid anhydride, or has An acid anhydride of an alicyclic skeleton obtained by an addition reaction of a terpene compound and maleic anhydride, a hydride of the acid anhydride, or a modified product of the acid anhydride. By using these hardeners, the flexibility of the hardened product, and the moisture resistance and adhesiveness of the hardened product become higher. Examples of the acid anhydride having the alicyclic skeleton, the hydride of the acid anhydride, or the modified product of the acid anhydride may also include methyl dianhydride, the acid anhydride having a dicyclopentadiene skeleton, or a modified product of the acid anhydride. Examples of the commercially available products of the acid anhydride having an alicyclic skeleton, the hydride of the acid anhydride, or a modified product of the acid anhydride include RIKACID HNA and RIKACID HNA-100 (the above are all manufactured by Nippon Ricoh Chemical Co., Ltd.) and EPI -CURE YH306, EPI-CURE YH307, EPI-CURE YH308H, and EPI-CURE YH309 (all of which are manufactured by Mitsubishi Chemical Corporation), etc. The above-mentioned thermosetting agent is also preferably methyl dianhydride or trialkyltetrahydrophthalic anhydride. By using methyl dianhydride or trialkyltetrahydrophthalic anhydride, the water resistance of the hardened product becomes higher. In 100% by volume of the resin material, the content of the above-mentioned thermosetting agent is preferably 0.1% by volume or more, more preferably 1% by volume or more, and preferably 40% by volume or less, more preferably 25% by volume or less. If the content of the thermosetting agent is equal to or greater than the above lower limit, it is easier to sufficiently harden the thermosetting compound. If the content of the above-mentioned thermosetting agent is equal to or less than the above-mentioned upper limit, it is unlikely that an excessive amount of thermosetting agent that does not participate in hardening will be generated. Therefore, the heat resistance and adhesiveness of the cured product become higher. (Photocurable component: Photocurable compound) The photocurable compound is not particularly limited as long as it has photocurability. Only one kind of the photocurable compound may be used, or two or more kinds may be used in combination. The photocurable compound preferably has two or more ethylenically unsaturated bonds. Examples of the ethylenically unsaturated bond-containing group include vinyl, allyl, and (meth) acryl acetyl groups. From the viewpoint of efficiently proceeding the reaction and further suppressing foaming, peeling, and discoloration of the cured product, a (meth) acryloyl group is preferred. The photocurable compound preferably has a (meth) acryloyl group. From the viewpoint of more effectively improving the adhesiveness of the cured product, the photocurable compound preferably contains epoxy (meth) acrylate. From the viewpoint of more effectively improving the heat resistance of the cured product, the epoxy (meth) acrylate preferably includes a difunctional epoxy (meth) acrylate and a trifunctional epoxy (meth) or more Acrylate. The bifunctional epoxy (meth) acrylate preferably has two (meth) acryloyl groups. The epoxy (meth) acrylate having more than 3 functions preferably has three or more (meth) acryloyl groups. The epoxy (meth) acrylate is obtained by reacting (meth) acrylic acid with an epoxy compound. Epoxy (meth) acrylates can be obtained by converting epoxy groups to (meth) acryloyl groups. Since the photocurable compound is cured by irradiation with light, the epoxy (meth) acrylate preferably does not have an epoxy group. Examples of the epoxy (meth) acrylates include bisphenol epoxy (meth) acrylates (for example, bisphenol A epoxy (meth) acrylates and bisphenol F epoxy (meth) acrylates. ) Acrylate, bisphenol S-type epoxy (meth) acrylate), cresol novolac epoxy (meth) acrylate, amine-modified bisphenol epoxy (meth) acrylate, caprolactone Modified bisphenol epoxy (meth) acrylate, carboxylic anhydride modified epoxy (meth) acrylate, phenol novolak epoxy (meth) acrylate, etc. In 100% by volume of the resin material, the content of the photocurable compound is preferably 5% by volume or more, more preferably 10% by volume or more, and preferably 40% by volume or less, more preferably 30% by volume or less. If the content of these photocurable compounds is above the above lower limit and below the above upper limit, the adhesiveness of the cured product becomes higher. (Photocurable component: photopolymerization initiator) The above photopolymerization initiator is not particularly limited. As the photopolymerization initiator, a photopolymerization initiator capable of curing the photocurable compound by irradiation of light can be suitably used. Only one type of the photopolymerization initiator may be used, or two or more types may be used in combination. Examples of the photopolymerization initiator include: acetylphosphine oxide, halomethylated tri, halomethylated oxadiazole, imidazole, benzoin, benzoin alkyl ether, anthraquinone, benzanthrone, dibenzoyl Ketone, acetophenone, 9-oxo , Benzoate, acridine, brown, titanocene, α-aminoalkyl ketone, oxime, and derivatives of these. Examples of the benzophenone-based photopolymerization initiator include methyl phthaloyl benzoate and michelinone. Examples of commercially available products of benzophenone-based photopolymerization initiators include EAB (manufactured by Hodogaya Chemical Industry Co., Ltd.) and the like. Examples of commercially available products of the acetophenone-based photopolymerization initiator include Darocure 1173, Darocure 2959, Irgacure 184, Irgacure 907, and Irgacure 369 (all of which are manufactured by BASF). As a commercially available product of a benzoin-based photopolymerization initiator, Irgacure 651 (manufactured by BASF) and the like can be mentioned. Examples of the commercially available products of the acylphosphine oxide-based photopolymerization initiator include Lucirin TPO, Irgacure 819 (all of which are manufactured by BASF), and the like. As 9-oxygen sulfur Commercially available products of photopolymerization initiators, including isopropyl-9-oxysulfur , And diethyl-9-oxysulfur Wait. Examples of commercially available products of the oxime-based photopolymerization initiator include Irgacure OXE-01 and Irgacure OXE-02 (both of which are manufactured by BASF). The content of the photopolymerization initiator is preferably 1 part by weight or more, more preferably 3 parts by weight or more, and preferably 20 parts by weight or less, more preferably 15 parts by weight with respect to 100 parts by weight of the photocurable compound. the following. If the content of the photopolymerization initiator is not less than the above lower limit and not more than the upper limit, the photocurable compound can be photocured satisfactorily. (Insulating filler) The resin material of the present invention may contain an insulating filler. The insulating filler is not the first boron nitride aggregated particles, and is not the second boron nitride aggregated particles. The insulating filler has insulating properties. The insulating filler may be an organic filler or an inorganic filler. Only one type of the above-mentioned insulating filler may be used, or two or more types may be used in combination. From the viewpoint of more effectively improving thermal conductivity, the insulating filler is preferably an inorganic filler. From the viewpoint of improving the thermal conductivity more effectively, the insulating filler preferably has a thermal conductivity of 10 W / m · K or more. From the viewpoint of more effectively improving the thermal conductivity of the cured product, the thermal conductivity of the insulating filler is preferably 10 W / m · K or more, and more preferably 20 W / m · K or more. The upper limit of the thermal conductivity of the insulating filler is not particularly limited. Inorganic fillers with a thermal conductivity of about 300 W / m · K are widely known, and inorganic fillers with a thermal conductivity of about 200 W / m · K can be easily obtained. The material of the insulating filler is not particularly limited. Examples of the material of the insulating filler include nitrogen compounds (boron nitride, aluminum nitride, silicon nitride, carbon nitride, and titanium nitride, etc.), carbon compounds (silicon carbide, fluorine carbide, boron carbide, titanium carbide , Tungsten carbide, and diamond, etc.), and metal oxides (silica, alumina, zinc oxide, magnesium oxide, and beryllium oxide, etc.). The material of the insulating filler is preferably the nitrogen compound, the carbon compound or the metal oxide, more preferably aluminum oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, zinc oxide or magnesium oxide. By using these better insulating fillers, the thermal conductivity of the hardened material becomes higher. The insulating filler is preferably spherical particles, or non-aggregated particles having an aspect ratio of more than 2 and aggregated particles. By using these insulating fillers, the thermal conductivity of the hardened material becomes higher. The aspect ratio of the spherical particles is 2 or less. The new Mohs hardness of the material of the insulating filler is preferably 12 or less, more preferably 9 or less. If the new Mohs hardness of the material of the insulating filler is 9 or less, the workability of the hardened material becomes higher. From the viewpoint of more effectively improving the workability of the hardened material, the material of the insulating filler is preferably boron nitride, synthetic magnesium carbonate, crystalline silicon dioxide, zinc oxide, or magnesium oxide. The new Mohs hardness of the materials of these inorganic fillers is 9 or less. From the viewpoint of more effectively improving thermal conductivity, the particle diameter of the insulating filler is preferably 0.1 μm or more, and preferably 20 μm or less. If the particle size is equal to or greater than the lower limit, the insulating filler can be easily filled with high density. If the particle size is equal to or less than the upper limit, the thermal conductivity of the cured product becomes higher. The above-mentioned particle size means the average particle size determined from the measurement result of the particle size distribution by volume average measured by a laser diffraction type particle size distribution measuring device. The particle size of the insulating filler is preferably 3 g of insulating filler, and the particle size of the insulating filler contained therein is averaged and calculated. Regarding the calculation method of the average particle diameter of the insulating filler, it is preferable to use the particle diameter (d50) of the insulating filler when the cumulative volume is 50% as the average particle diameter. From the viewpoint of more effectively improving thermal conductivity, the content of the above-mentioned insulating filler is preferably 1% by volume or more, more preferably 3% by volume or more, and preferably 20% by volume or less in 100% by volume of the resin material. , More preferably 10% by volume or less. (Other components) In addition to the above-mentioned components, the above-mentioned resin material may contain other components commonly used in resin materials, resin sheets, and curable sheets, such as dispersants, chelating agents, and antioxidants. (Other details of resin material and cured product) The above resin material may be a paste or a curable paste. The resin material may be a resin sheet or a curable sheet. When the resin material contains a curable component, a cured product can be obtained by curing the resin material. The hardened material is a hardened material of the resin material, and is formed of the resin material. From the viewpoint of more effectively improving insulation and thermal conductivity, the resin material may be produced by laminating two or more resin sheets. In addition, in the resin sheet of 2 layers or more, 1 layer or more can be the resin sheet of this invention. (Laminate) The laminate of the present invention includes a heat conductor, an insulating layer, and a conductive layer. The insulating layer is laminated on one surface of the heat conductor. The conductive layer is deposited on the surface of the insulating layer opposite to the heat conductor. The insulating layer may be layered on another surface area of the heat conductor. In the laminate of the present invention, the material of the insulating layer is the resin material. Thermal conductor: The thermal conductivity of the above thermal conductor is preferably 10 W / m · K or more. As the above heat conductor, a suitable heat conductor can be used. It is preferable to use a metal material for the heat conductor. Examples of the metal materials include metal foils and metal plates. The heat conductor is preferably the metal foil or the metal plate, and more preferably the metal plate. Examples of the material of the metal material include aluminum, copper, gold, silver, and graphite sheets. From the viewpoint of more effectively improving thermal conductivity, the material of the metal material is preferably aluminum, copper, or gold, and more preferably aluminum or copper. Conductive layer: The metal used to form the conductive layer is not particularly limited. Examples of the aforementioned metals include gold, silver, palladium, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, thallium, germanium, cadmium, silicon, Tungsten, molybdenum and their alloys. In addition, examples of the metal include tin-doped indium oxide (ITO), solder, and the like. From the viewpoint of more effectively improving thermal conductivity, aluminum, copper or gold is preferred, and aluminum or copper is more preferred. The method of forming the conductive layer is not particularly limited. Examples of the method for forming the above-mentioned conductive layer include a method using electroless plating, a method using electroplating, and a method for subjecting the above-mentioned insulating layer and metal foil to heat and pressure bonding. Since the formation of the conductive layer is simple, it is preferable to heat-press the insulating layer and the metal foil. FIG. 1 is a cross-sectional view schematically showing a resin sheet according to an embodiment of the present invention. In addition, in FIG. 1, for convenience of illustration, it is different from the actual size and thickness. The resin sheet 1 (resin material) shown in FIG. 1 includes a binder resin 11, first boron nitride aggregated particles 12, and second boron nitride aggregated particles 13. The first boron nitride aggregated particles 12 and the second boron nitride aggregated particles 13 are preferably the first boron nitride aggregated particles and the second boron nitride aggregated particles. The first boron nitride aggregated particles 12 and the second boron nitride aggregated particles 13 have different deformation or disintegration behavior during compression. In addition, the aspect ratio of the primary particles constituting the first boron nitride aggregated particles 12 is different from the aspect ratio of the primary particles constituting the second boron nitride aggregated particles 13. In the resin sheet 1 of this embodiment, the binder resin 11 contains a curable component. The binder resin 11 may contain a thermosetting component containing a thermosetting compound and a thermosetting agent, or may contain a photosetting component containing a photosetting compound and a photopolymerization initiator. The above-mentioned binder resin is preferably not completely cured. The above-mentioned binder resin can be B-staged by heating or the like. The above-mentioned binder resin may be a B-staged compound that has been B-staged. In the above resin sheet, there are cases where voids exist inside the sheet. In the resin sheet, there may be a gap between the first boron nitride aggregated particles and the second boron nitride aggregated particles. 2 is a cross-sectional view schematically showing a laminate obtained by using a resin material according to an embodiment of the present invention. In addition, in FIG. 2, for convenience of illustration, it is different from the actual size and thickness. The laminate 21 shown in FIG. 2 includes a heat conductor 22, an insulating layer 23, and a conductive layer 24. The thermal conductor 22, the insulating layer 23, and the conductive layer 24 are the aforementioned thermal conductor, insulating layer, and conductive layer. In FIG. 2, the resin sheet 1 shown in FIG. 1 is used as the insulating layer 23. The heat conductor 22 has a surface 22a (first surface) and another surface 22b (second surface). The insulating layer 23 has a surface 23a (first surface) and another surface 23b (second surface). The conductive layer 24 has a surface 24a (first surface) and another surface 24b (second surface). A conductive layer 24 is deposited on one surface 23a (first surface) side of the insulating layer 23. A heat conductor 22 is laminated on the other surface 23b (second surface) side of the insulating layer 23. An insulating layer 23 is deposited on the other surface 24b (second surface) side of the conductive layer 24. An insulating layer 23 is laminated on one surface 22a (first surface) side of the heat conductor 22. An insulating layer 23 is arranged between the heat conductor 22 and the conductive layer 24. The manufacturing method of the above laminate is not particularly limited. Examples of the method for manufacturing the laminate include a method of laminating the heat conductor, the insulating layer, and the conductive layer, and performing heat and pressure bonding by vacuum pressure or the like. In the laminated body 21 of the present embodiment, the insulating layer 23 includes the hardened portion 14, the first boron nitride aggregated particles 12, and the second boron nitride aggregated particles 13. The insulating layer 23 is formed of the resin sheet 1 shown in FIG. 1. The insulating layer is preferably formed by subjecting the resin sheet to heat and pressure bonding using vacuum pressure or the like. In the laminate 21 of the present embodiment, the first boron nitride aggregated particles 12 are preferably not deformed or disintegrated by compressive force such as pressure, and preferably maintain their shape. The first boron nitride aggregated particles 12 preferably exist in the form of aggregated particles (secondary particles) in the hardened material. In the laminate 21 of the present embodiment, the second boron nitride aggregated particles 13 can be deformed or disintegrated due to compression force such as pressurization. The second boron nitride aggregated particles 13 may be deformed aggregated particles (secondary particles), or may become primary particles due to the collapse of the aggregated particles (secondary particles). The second boron nitride aggregated particles 13 may exist in the form of deformed aggregated particles (secondary particles) in the hardened material, or may exist in the form of primary particles due to the collapse of the aggregated particles (secondary particles). In the hardened part 14, the second boron nitride aggregated particles 13 deform or disintegrate around the first boron nitride aggregated particles 12. The deformed or disintegrated second boron nitride aggregated particles 13 exist between the first boron nitride aggregated particles 12. The deformed or disintegrated second boron nitride aggregated particles 13 can fill the gaps existing between the first boron nitride aggregated particles 12, and the insulation can be effectively improved. In addition, since the laminated body 21 can fill the gaps between the first boron nitride aggregated particles 12 with the second boron nitride aggregated particles 13 without gaps, it is possible to effectively suppress the unevenness of the dielectric breakdown strength. In the present embodiment, the cured product portion 14 is a portion where the adhesive resin 11 is cured. The hardened part 14 can be obtained by hardening the binder resin 11. The hardened material portion 14 may be a portion hardened by a thermosetting component containing a thermosetting compound and a thermosetting agent, or may be a hardened component containing a photohardening compound and a photopolymerization initiator . The hardened part 11 can be obtained by hardening a thermosetting component or a photosetting component. The above-mentioned resin material and the above-mentioned hardened product can be used for various applications requiring high thermal conductivity and mechanical strength. In an electronic device, the laminate is arranged between, for example, a heat-generating component and a heat-dissipating component. For example, the above laminate can be used as a heat sink for a power card used in a heat sink disposed between a CPU and a heat sink, an inverter of an electric vehicle, or the like. In addition, by forming a circuit on the conductive layer of the laminated body by a method such as etching, the laminated body can be used as an insulating circuit board. Hereinafter, the present invention will be clarified by listing specific examples and comparative examples of the present invention. The present invention is not limited to the following embodiments. Thermosetting compound: (1) "Epikote 828US" manufactured by Mitsubishi Chemical Corporation, epoxy compound (2) "DL-92" manufactured by Meiwa Chemical, phenol novolak compound thermosetting agent: (1) manufactured by Tokyo Chemical Industry Co., Ltd. "Dicyandiamide" (2) "2MZA-PW" manufactured by Shikoku Chemical Industry Co., Ltd., isocyanurate modified solid dispersion imidazole first boron nitride aggregated particles (including their substitutes): (1) "PTX60S" manufactured by Momentive (2) "PCTL7MHF" manufactured by Saint-Gobain (3) "CTS7M" manufactured by Saint-Gobain (4) Aggregated particles of boron nitride 1 (5) "AC6091" manufactured by Momentive The second boron nitride aggregated particles (including their substitutes): (1) boron nitride aggregated particles 1 (2) boron nitride aggregated particles 2 (3) boron nitride aggregated particles 3 (4) boron nitride aggregated particles 4 (5) Boron nitride aggregated particles 5 (6) "AC6091" manufactured by Momentive Corporation (7) "PTX25" manufactured by Momentive Corporation "Boron nitride aggregated particle 1" production method: The average length is obtained by using the spray drying method The primary particles of boron nitride with a diameter of 7.2 μm and an aspect ratio of 5.3 are produced by agglomeration so that the porosity becomes 44% and the average particle size becomes 40 μm. The porosity is measured with a mercury porosimeter, and the porosity is calculated when only voids of 5 μm or less are used as voids in the particles. The porosity is measured as follows. Method for measuring porosity: Using the mercury porosimeter "Poremaster 60" manufactured by QUANTACHROME, the cumulative penetration of mercury relative to the pressure applied by the mercury infiltration method is measured. Weigh 0.2 to 0.3 g of boron nitride agglomerated particles and perform measurement in low-pressure mode and high-pressure mode. According to the obtained data, the distribution curve of the pore volume per unit interval representing the pore diameter is obtained. Based on the distribution curve, the value obtained by subtracting the voids between the particles (V) from the total voids is calculated. According to the distribution curve, the pores with a pore diameter of 5 μm or more are defined as inter-particle voids. If the density of primary particles of boron nitride particles (ρ = 2.34) is used, the porosity (ε) can be expressed by the following formula. ε = V (V + (1 / ρ)) × 100 The obtained V value is substituted into the above formula to calculate the porosity. Production method of "Boron Nitride Aggregated Particle 2": By using the spray drying method, the primary particles of boron nitride having an average long diameter of 6.5 μm and an aspect ratio of 6.1 have a void ratio of 39% and an average particle size of 30 μm Made by agglomeration. Production method of "Boron Nitride Aggregated Particles 3": By using a spray drying method, primary particles of boron nitride with an average length of 9 μm and an aspect ratio of 5.5 have a porosity of 45% and an average particle size of 55 μm Made by agglomeration. Production method of "Boron Nitride Aggregated Particles 4": By using a spray drying method, primary particles of boron nitride having an average length of 9.2 μm and an aspect ratio of 5.5 have a void ratio of 43% and an average particle size of 70 μm Made by agglomeration. Production method of "Boron Nitride Aggregated Particle 5": By using the spray drying method, the primary particles of boron nitride with an average length of 10 μm and an aspect ratio of 6.2 have a porosity of 35% and an average particle size of 80 μm Made by agglomeration. (The compressive strength of each of the first boron nitride aggregated particles and the second boron nitride aggregated particles when compressed by 20%) The 20% compression of the first boron nitride aggregated particles and the second boron nitride aggregated particles is measured as follows Compressive strength from time to time. Measurement method of compressive strength when the first boron nitride aggregated particles and the second boron nitride aggregated particles are compressed by 20% each: Using a micro compression tester, under the condition of a compression speed of 0.67 mN / sec, a diamond corner column As the compression member, the smooth end surface of the compression member is dropped toward the boron nitride aggregated particles to compress the boron nitride aggregated particles. The first boron nitride aggregated particle system has a maximum test load of 120 mN, and the second boron nitride aggregated particle system has a maximum test load of 60 mN. As a measurement result, the relationship between the compressive load value and the compressive displacement can be obtained. For the compressive load value, the compressive load value per unit area is calculated using the average cross-sectional area calculated from the particle diameter of the boron nitride aggregated particles, which is used as the compressive strength . In addition, the compression ratio is calculated from the compression displacement and the particle size of the boron nitride aggregated particles, and the relationship between the compression strength and the compression ratio is obtained. The measured boron nitride aggregated particles are observed with a microscope, and boron nitride aggregated particles having a particle diameter of ± 10% are selected for measurement. In addition, the compressive strength at each compression rate was calculated as the average compressive strength obtained by averaging 20 measurement results. In addition, the compression ratio is calculated by (compression ratio = compression displacement ÷ average particle diameter × 100). (Deformation or disintegration behavior of the first boron nitride aggregated particles during compression) About the occurrence of cracking of the first boron nitride aggregated particles when the particle size of the first boron nitride aggregated particles is compressed from 10% to 40% The number of times and the ratio of compression displacement to the particle diameter of the first boron nitride aggregated particles at the time of cracking were evaluated as follows. The number of times the first boron nitride aggregated particles cracked when the particle size of the first boron nitride aggregated particles was compressed from 10% to 40%, and the compression displacement relative to the first boron nitride aggregated particles at the time of cracking Evaluation method of particle size ratio: Based on the relationship between the compression load value and compression displacement of the first boron nitride aggregated particles obtained by the above method, it is considered that there is no change in the compression load value and only the portion where the compression displacement changes occurs. The value of the magnitude of the compression displacement due to cracking is read, and this value is divided by the particle size of the first boron nitride aggregated particles, thereby calculating the ratio of the compression displacement when cracking occurs. The case where the ratio of the compression displacement is not less than 5% of the particle size without the increase of the compression load of 1 mN or more is regarded as primary fracture. In addition, when the above-mentioned disintegration behavior was observed in 8 or more boron nitride aggregated particles in 20 measurements, it was considered that the first boron nitride aggregated particles were satisfied. (The deformation or disintegration behavior of the second boron nitride aggregated particles during compression) The second boron nitride aggregated particles are broken when the particle size of the second boron nitride aggregated particles is compressed from 5% to 75% The number of times and the ratio of compression displacement to the particle size of the second boron nitride aggregated particles at the time of cracking were evaluated as follows. The number of times the second boron nitride aggregated particles rupture when the particle size of the second boron nitride aggregated particles is compressed from 5% to 75%, and the compression displacement relative to the second boron nitride aggregated particles when the fracture occurs Evaluation method of particle size ratio: Based on the relationship between the compression load value and compression displacement of the second boron nitride aggregated particles obtained by the above method, it is considered that there is no change in the compression load value, and only the portion where the compression displacement changes occurs. The value of the magnitude of the compression displacement due to cracking is read, and this value is divided by the particle diameter of the second boron nitride aggregated particles, thereby calculating the ratio of the compression displacement when cracking occurs. The case where the compression displacement ratio is not more than 2% of the particle size without the increase of the compression load of 0.5 mN or more is regarded as a primary fracture. In addition, when the above-mentioned disintegration behavior was observed in the boron nitride aggregated particles of 8 cuts or more in 20 measurements, it was considered that the second boron nitride aggregated particles were satisfied. (The particle size of the first boron nitride aggregated particles and the second boron nitride aggregated particles) The first boron nitride aggregated particles and the second nitride were measured using a "laser diffraction type particle size distribution measuring device" manufactured by Horiba, Ltd. The particle size of boron aggregated particles. 3 g of each boron nitride aggregated particle was collected, and the particle size of each boron nitride aggregated particle contained therein was averaged to calculate the particle size of the first boron nitride aggregated particle and the second boron nitride aggregated particle. Regarding the calculation method of the average particle diameter, in each particle of the first boron nitride aggregated particles and the second boron nitride aggregated particles, the average particle diameter (d50) of the boron nitride aggregated particles when the cumulative volume is 50% is used as the average Particle size. (Aspect ratio of primary particles (first boron nitride and second boron nitride) constituting the first boron nitride aggregated particles and second boron nitride aggregated particles) The composition of the first boron nitride aggregated particles and The aspect ratio of the primary particles (first boron nitride and second boron nitride) of the second boron nitride aggregated particles. Method for measuring the aspect ratio of primary particles (first boron nitride and second boron nitride) constituting the first boron nitride aggregated particles and second boron nitride aggregated particles: And the primary particles of the second boron nitride aggregated particles (first boron nitride and second boron nitride) mixed with thermosetting resin, etc. are randomly selected from the electron microscope image of the cross-section of the laminate produced The major axis / minor axis of each primary particle (each boron nitride) constituting each boron nitride aggregated particle was measured, and the average value was calculated to determine the above aspect ratio. Method for measuring the average long diameter of the primary particles (first boron nitride and second boron nitride) constituting the first boron nitride aggregated particles and the second boron nitride aggregated particles: The primary particles of the particles and the second boron nitride aggregated particles (first boron nitride and second boron nitride) are mixed with thermosetting resin, etc., in the electron microscope image of the cross-section of the laminate produced The long diameters of 50 primary particles (each boron nitride) constituting each boron nitride aggregated particle were measured, and the average value was calculated to determine the average long diameter. (Examples 1 to 10 and Comparative Examples 1 to 6) (1) Preparation of resin materials The ingredients shown in Tables 1 and 2 below were blended using the blending amounts shown in Tables 1 and 2 below, using a planetary mixer to Stir at 500 rpm for 25 minutes, thereby obtaining a resin material. (2) Fabrication of the laminated body The obtained resin material is coated on a release PET (polyethylene terephthalate) sheet (thickness 50 μm) at a thickness of 350 μm at 90 It was dried in an oven at 10 minutes for 10 minutes to form a curable sheet (insulating layer) to obtain a laminated sheet. Thereafter, the release PET sheet was peeled, and both sides of the curable sheet (insulating layer) were sandwiched between a copper foil and an aluminum plate, and vacuum pressure was applied under the conditions of a temperature of 200 ° C and a pressure of 12 MPa, thereby producing a laminate. (Evaluation) (1) Thermal conductivity After the obtained laminate was cut into 1 cm square, carbon black was sprayed on both sides to prepare a measurement sample. Using the obtained measurement sample, the thermal conductivity was calculated by the laser flash method. The thermal conductivity in Tables 1 and 2 is a relative value obtained by setting the value of Comparative Example 1 to 1.00. The thermal conductivity is measured using "LFA447" manufactured by NETZSCH. (2) Dielectric breakdown strength The copper foil in the obtained laminated body was etched, and the copper foil was patterned into a circle with a diameter of 2 cm to obtain a sample. Using a withstand voltage tester ("MODEL7473" manufactured by ETECH Electronics Co., Ltd.), an alternating voltage was applied between the samples at 25 ° C so that the voltage increased at a rate of 0.33 kV / sec. The voltage at which a current of 10 mA flows through the sample is set as the insulation breakdown voltage. Standardize by dividing the dielectric breakdown voltage by the thickness of the sample to calculate the dielectric breakdown strength. Determine the dielectric breakdown strength according to the following criteria. [Judgment criteria for dielectric breakdown strength] ○: 60 kV / mm or more △: 30 kV / mm or more and less than 60 kV / mm ×: less than 30 kV / mm (3) Unevenness of dielectric breakdown strength is obtained from 5 cm squares were cut from different parts of the laminate to obtain 20 measurement samples. Twenty samples were prepared in the same manner as in (2) above, and the dielectric breakdown strength was calculated for each sample. Judge the unevenness of dielectric breakdown strength according to the following criteria. [Judgment criteria for unevenness of dielectric breakdown strength] ○: The difference between the maximum and minimum values of dielectric breakdown strength is less than 20 kV / mm △: The difference between the maximum and minimum values of dielectric breakdown strength is 20 kV / mm or more and Less than 40 kV / mm ×: The difference between the maximum value and the minimum value of the dielectric breakdown strength is 40 kV / mm or more (4) Adhesion (peel strength) The obtained hardenable sheet (insulation) with a pressure of 10 MPa The layer 350 μm) was pressed between the electrolytic copper foil (thickness 35 μm) and the aluminum plate (thickness 1 mm), and heated at 200 ° C. for 1 hour to obtain a measurement sample. After that, the measurement sample was cut into 5 cm × 12 cm, leaving only the center of the short side 1 cm × 12 cm, and the remaining part of the copper foil was peeled off. The peel strength between the electrolytic copper foil at the center of 1 cm and the cured insulating layer was measured by a 90 ° peel test. The adhesion (peel strength) was determined according to the following criteria. [Judgment criteria for adhesion (peel strength)] ○: Peel strength is 5 N / cm or more △: Peel strength is 2 N / cm or more and less than 5 N / cm ×: Peel strength is less than 2 N / cm It is shown in Tables 1 and 2 below. [Table 1] [Table 2] In Comparative Example 4, the thermal conductivity is slightly poor.

1‧‧‧Resin sheet (resin material)

11‧‧‧Binder resin

12‧‧‧The first boron nitride agglomerated particles

13‧‧‧The second boron nitride agglomerated particles

14‧‧‧hardened part (the part hardened by adhesive resin)

21‧‧‧Layered body

22‧‧‧Heat Conductor

22a‧‧‧one surface (1st surface)

22b‧‧‧Another surface (second surface)

23‧‧‧Insulation

23a‧‧‧one surface (1st surface)

23b‧‧‧Another surface (second surface)

24‧‧‧conductive layer

24a‧‧‧one surface (1st surface)

24b‧‧‧other surface (second surface)

FIG. 1 is a cross-sectional view schematically showing a resin sheet according to an embodiment of the present invention. 2 is a cross-sectional view schematically showing a laminate obtained by using a resin material according to an embodiment of the present invention. 3 is a diagram showing an example of the relationship between the compression load value and compression displacement of the first boron nitride aggregated particles in the present invention. 4 is a diagram showing an example of the relationship between the compression load value and compression displacement of the second boron nitride aggregated particles in the present invention. FIG. 5 (FIG. 5 (a) and (b)) is a diagram showing an example of the difference between the first boron nitride aggregated particles and the second boron nitride aggregated particles in the present invention.

Claims (7)

A resin material containing first boron nitride aggregated particles, second boron nitride aggregated particles, and a binder resin, and the first boron nitride aggregated particles are based on the particle size of the first boron nitride aggregated particles When compressing from 10% to 40%, more than one occurrence of fractured particles accompanied by compressive displacement of 5% or more of the particle diameter of the first boron nitride aggregated particles, and the primary particles constituting the first boron nitride aggregated particles When the aspect ratio exceeds 7, the second boron nitride aggregated particles are accompanied by the second boron nitride aggregated particles when the particle size of the second boron nitride aggregated particles is compressed from 5% to 75% three times or more The particle diameter of 2% or more of the compressive displacement cracked particles, and the aspect ratio of the primary particles constituting the second boron nitride aggregated particles is 7 or less. The resin material according to claim 1, wherein the particle diameter of the first boron nitride aggregated particles exceeds 20 μm, and the average long diameter of the primary particles constituting the first boron nitride aggregated particles is 2 μm or more and less than 20 μm, The average long diameter of the primary particles constituting the second boron nitride aggregated particles is 8 μm or less. The resin material according to claim 1 or 2, wherein the particle diameter of the second boron nitride aggregated particles is 30 μm or more and 60 μm or less. The resin material according to claim 1 or 2, wherein the compressive strength of the second boron nitride aggregated particles when compressed by 20% is 3 N / mm ² or less. The resin material according to claim 1 or 2, wherein the total content of the first boron nitride aggregated particles and the second boron nitride aggregated particles in 100% by volume of the resin material is 20% by volume or more and 80% by volume or less. If the resin material of claim 1 or 2, it is a resin sheet. A laminate including a heat conductor, an insulation layer laminated on one surface of the heat conductor, and a conductive layer laminated on a surface of the insulation layer opposite to the heat conductor, and the material of the insulation layer is as requested The resin material according to any one of items 1 to 6.