TW201838899A - Electronic component operating device and operation classification device applying the same capable of shortening overall operation time and effectively increase production efficiency - Google Patents
Electronic component operating device and operation classification device applying the same capable of shortening overall operation time and effectively increase production efficiency Download PDFInfo
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- TW201838899A TW201838899A TW106113515A TW106113515A TW201838899A TW 201838899 A TW201838899 A TW 201838899A TW 106113515 A TW106113515 A TW 106113515A TW 106113515 A TW106113515 A TW 106113515A TW 201838899 A TW201838899 A TW 201838899A
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- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 238000004904 shortening Methods 0.000 title abstract description 5
- 230000007246 mechanism Effects 0.000 claims abstract description 65
- 238000012360 testing method Methods 0.000 claims description 53
- 208000028659 discharge Diseases 0.000 claims description 32
- 238000007599 discharging Methods 0.000 claims description 21
- 238000006073 displacement reaction Methods 0.000 claims description 17
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
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Abstract
Description
本發明係提供一種可於第一、二工作站執行預設作業之同時,並執行輸出全作業電子元件,進而縮短整體作業時間及有效提高生產效能之電子元件作業裝置。 The present invention provides an electronic component operating device that can perform a preset operation at the first and second workstations and simultaneously output an electronic component for full operation, thereby shortening the overall operation time and effectively improving the production efficiency.
在現今,電子元件於製作完成後,業者為確保電子元件品質,必須以檢測裝置對電子元件進行測試作業及外觀檢知作業,以淘汰出不良品;請參閱第1、2圖,該檢測裝置係於機台11上配置具測試座121之測試裝置12,以對電子元件執行測試作業,另於測試裝置12之第一、二側分別設置第一、二取像器131、132,第一、二取像器131、132分別於一箱體內設置CCD及複數個菱鏡,以取像已測電子元件之底面及四個側面,以檢知外觀是否損壞或缺少錫球等,又該第一取像器131之第一側係配置有二作第一方向(如X方向)位移之第一供料載台141及第一收料載台142,以分別承載待測電子元件及已測電子元件,該第二取像器132之第二側亦配置有二作X方向位移之第二供料載台143及第二收料載台144,以分別承載待測電子元件及已測電子元件,一可作第二、三方向(如Y、Z方向)位移之第一取放器151,係於測試座121、第一取像器131及第一供、收料載台141、142間移載待測電子元件及已測電子元件,另一可作Y-Z方向位移之第二取放器152,係於測試座121、第二取像器132及第二供、收料載台143、144間移載待測電子元件及已測電子元件;於使用時,該第一供料載台141係承載一待測電子元件161, 並與第一收料載台142同步作X方向位移,將待測電子元件161載送至測試座121之第一側,第一取放器151係作Y-Z方向位移於第一供料載台141上取出待測電子元件161,並移入測試座121而執行測試作業,該第二取放器152則已作Y-Z方向位移於測試座121取出已測電子元件162,並移載至第二取像器132,該第二取放器152再作Z方向向下位移將已測電子元件162移入第二取像器132內,第二取像器132即對已測電子元件162進行底部及四個側面之取像作業,以檢知已測電子元件162之外觀是否損壞或缺漏錫球等,於檢知作業完畢後,該第二取放器152再作Z方向向上位移將已測且已檢知之電子元件162移出第二取像器132,由於第二收料載台144已於第二取像器132的第二側等待,該第二取放器152再作Y-Z方向位移將已測且已檢知之電子元件162由第二取像器132處移載置入於第二收料載台144,第二收料載台144於承載已測電子元件162後,可作X方向位移輸出已測電子元件162;惟,由於檢測裝置之第二取像器132係配置於測試座121與第二收料載台144之間,導致第二取放器152於測試座121處取出已測電子元件162後,必須依序先作Y方向位移將已測電子元件162移載至第二取像器132處,再作Z方向位移將已測電子元件162移入第二取像器132進行五面檢知作業,待第二取像器132檢知完畢後,第二取放器152又必須作Z方向位移將已測且已檢知之電子元件162移出第二取像器132,方可再作Y方向位移將該已測且已檢知的電子元件162移載至第二收料載台144,以致第二取放器152費時將已測電子元件162移入及移出第二取像器132而增加作業時間,再者,第二收料載台144雖早已位於第二取像器132之第二側,但仍必須耗時空等電子元件162於第二取像器122進行檢知作業,並無法立即載料輸出,以致增加整體作業時間,造成生產效能無法提升之缺失。 Nowadays, after the electronic components are manufactured, in order to ensure the quality of the electronic components, the manufacturer must perform the test operation and the appearance inspection operation on the electronic components by the detecting device to eliminate the defective products; refer to Figures 1 and 2, the detecting device A test device 12 having a test socket 121 is disposed on the machine 11 to perform a test operation on the electronic component, and first and second imagers 131 and 132 are respectively disposed on the first and second sides of the test device 12, first And the two image taking devices 131 and 132 respectively respectively set a CCD and a plurality of prisms in a box to take the bottom surface and the four sides of the tested electronic component to detect whether the appearance is damaged or lack of solder balls, etc. The first side of the image finder 131 is provided with two first loading stages 141 and a first receiving stage 142 for shifting in the first direction (such as the X direction) to respectively carry the electronic components to be tested and the measured The electronic component, the second side of the second imager 132 is also provided with two second loading stages 143 and a second receiving stage 144 for X-direction displacement to respectively carry the electronic components to be tested and the tested electronic components. The component can be displaced in the second and third directions (such as Y and Z directions). The first pick-and-placer 151 is configured to transfer the electronic component to be tested and the electronic component to be tested between the test stand 121, the first image capture device 131, and the first supply and receiving stages 141 and 142, and the other can be used as the YZ direction. The second pick-and-place 152 of the displacement transfers the electronic component to be tested and the electronic component to be tested between the test stand 121, the second image finder 132 and the second supply and receiving stage 143, 144; The first feeding stage 141 carries an electronic component 161 to be tested, and is displaced in the X direction in synchronization with the first receiving stage 142, and carries the electronic component 161 to be tested to the first side of the test socket 121. A pick-and-place device 151 is taken out in the YZ direction to take out the electronic component 161 to be tested on the first feeding stage 141, and is moved into the test seat 121 to perform a test operation. The second pick-and-placer 152 has been displaced in the YZ direction. The test stand 121 takes out the tested electronic component 162 and transfers it to the second image finder 132. The second pick-and-place 152 then shifts the Z direction downward to move the measured electronic component 162 into the second image finder 132. The second image taking device 132 performs the image capturing operation on the bottom and the four sides of the tested electronic component 162 to detect the detected electronic component 162. Whether the solder ball or the like is damaged or missing, after the detecting operation is completed, the second pick-and-placer 152 is further displaced in the Z direction to move the detected electronic component 162 that has been detected out of the second image capture unit 132, due to the second The receiving stage 144 has been waiting on the second side of the second image picker 132, and the second pick-and-placer 152 is further displaced in the YZ direction to move the detected electronic component 162 from the second imager 132. The second receiving stage 144 is placed on the second receiving stage 144, and after the electronic component 162 is carried, the electronic component 162 can be outputted in the X direction; however, due to the second image of the detecting device The device 132 is disposed between the test socket 121 and the second receiving platform 144. After the second pick-and-placer 152 takes out the tested electronic component 162 at the test socket 121, the first direction must be shifted in the Y direction. The electronic component 162 is transferred to the second image finder 132, and then moved in the Z direction to move the measured electronic component 162 into the second image finder 132 for five-sided detection operation. After the second image finder 132 detects the image, the second image finder 132 is detected. The second pick-and-placer 152 must again perform a Z-direction displacement to move the detected and detected electronic component 162 out of the second imager. 132, the Y-direction displacement can be further transferred to the second receiving stage 144, so that the second pick-and-placer 152 moves the measured electronic component 162 into and out of the first time. The second image capture unit 132 increases the working time. Further, the second receiving stage 144 is already located on the second side of the second image capture unit 132. However, the electronic component 162 must be used in the second image capture unit 122. The inspection operation is carried out, and the output cannot be immediately loaded, so that the overall operation time is increased, resulting in a lack of improvement in production efficiency.
本發明之目的一,係提供一種電子元件作業裝置,其係配置可執行第一、二預設作業之第一、二工作站,載送機構係以入料載台承載待作業電子元件,並以轉站載台及出料載台分別位於第一、二工作站之側方,第一、二移載機構之第一、二移載具係分別將第一、二工作站之待轉站電子元件及全作業電子元件移入該轉站載台及出料載台,該入料載台、轉站載台及出料載台即同步位移,而供第一、二移載具於入料載台、轉站載台及第一、二工作站間移載該待作業電子元件及待轉站電子元件而接續執行第一、二預設作業,並使出料載台載出全作業電子元件,進而可於第一、二工作站執行預設作業之同時,並執行輸出全作業電子元件,達到縮短整體作業時間及有效提高生產效能之實用效益。 An object of the present invention is to provide an electronic component working device which is configured to execute first and second workstations of first and second preset operations, and the carrying mechanism carries the electronic components to be operated by the loading carrier, and The transfer station loading platform and the discharge loading platform are respectively located at the side of the first and second workstations, and the first and second transfer carriers of the first and second transfer mechanisms respectively respectively carry the electronic components of the first and second workstations to be transferred and The electronic components of the whole operation are moved into the transfer station and the discharge stage, and the loading stage, the transfer stage and the discharge stage are synchronously displaced, and the first and second transfer carriers are placed on the loading stage. Transferring the electronic components of the to-be-operated electronic components and the electronic components to be transferred between the transfer station and the first and second workstations, and performing the first and second preset operations, and allowing the discharge loading platform to carry out the entire operation electronic components, and then At the same time as the first and second workstations perform preset operations, and execute the output of all-operation electronic components, the practical benefits of shortening the overall operation time and effectively improving the production efficiency are achieved.
本發明之目的二,係提供一種應用電子元件作業裝置之作業分類設備,其包含機台、供料裝置、收料裝置、作業裝置、輸送裝置及中央控制裝置,該供料裝置係配置於機台上,並設有至少一容納待作業電子元件之供料承置器,該收料裝置係配置於機台上,並設有至少一容納全作業電子元件之收料承置器,該作業裝置係配置於機台上,並設有第一、二工作站及載送機構、第一移載機構、第二移載機構,而可於第一、二工作站對電子元件執行預設作業之同時,並執行輸出全作業電子元件,該輸送裝置係配置於機台上,並設有至少一移載電子元件之取放器,該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 A second object of the present invention is to provide an operation classification device for applying an electronic component working device, which comprises a machine table, a feeding device, a receiving device, a working device, a conveying device and a central control device, wherein the feeding device is disposed in the machine And a feeding device for accommodating the electronic components to be operated, the receiving device is disposed on the machine table, and is provided with at least one receiving device for accommodating the full working electronic components, the operation The device is disposed on the machine platform, and is provided with first and second workstations and a carrying mechanism, a first transfer mechanism and a second transfer mechanism, and can perform preset operations on the electronic components at the first and second workstations. And executing the output full-operation electronic component, the conveying device is disposed on the machine table, and is provided with at least one pick-and-place device for transferring electronic components, wherein the central control device is used for controlling and integrating each device to perform automation Work, to achieve practical benefits of improving operational efficiency.
〔習知〕 [study]
11‧‧‧機台 11‧‧‧ machine
12‧‧‧測試裝置 12‧‧‧Testing device
121‧‧‧測試座 121‧‧‧ test seat
131‧‧‧第一取像器 131‧‧‧First imager
132‧‧‧第二取像器 132‧‧‧Second imager
141‧‧‧第一供料載台 141‧‧‧First feeding platform
142‧‧‧第一收料載台 142‧‧‧First receiving platform
143‧‧‧第二供料載台 143‧‧‧Second feed stage
144‧‧‧第二收料載台 144‧‧‧Second receiving platform
151‧‧‧第一取放器 151‧‧‧First pick and place
152‧‧‧第二取放器 152‧‧‧Second pick and place
161、162‧‧‧電子元件 161, 162‧‧‧ electronic components
〔本發明〕 〔this invention〕
20‧‧‧作業裝置 20‧‧‧Working device
21‧‧‧第一工作站 21‧‧‧First workstation
211‧‧‧電路板 211‧‧‧ circuit board
212‧‧‧測試座 212‧‧‧ test seat
22‧‧‧第二工作站 22‧‧‧Second workstation
221‧‧‧檢知器 221‧‧‧Detector
23‧‧‧載送機構 23‧‧‧ Carriers
231‧‧‧第一入料載台 231‧‧‧First feeding platform
232‧‧‧第一轉站載台 232‧‧‧First transfer station
233‧‧‧第一出料載台 233‧‧‧First discharge stage
234‧‧‧第一驅動源 234‧‧‧First drive source
235‧‧‧第二入料載台 235‧‧‧Second feed stage
236‧‧‧第二轉站載台 236‧‧‧Second transfer station
237‧‧‧第二出料載台 237‧‧‧Second discharge stage
238‧‧‧第二驅動源 238‧‧‧Second drive source
24‧‧‧第一移載機構 24‧‧‧First transfer mechanism
241‧‧‧第一移載具 241‧‧‧First Transfer Vehicle
242‧‧‧第三移載具 242‧‧‧ Third Transfer Vehicle
243‧‧‧第三驅動源 243‧‧‧ Third drive source
244‧‧‧第四驅動源 244‧‧‧fourth drive source
25‧‧‧第二移載機構 25‧‧‧Second transfer mechanism
251‧‧‧第二移載具 251‧‧‧Second transfer vehicle
252‧‧‧第四移載具 252‧‧‧4th transfer vehicle
253‧‧‧第五驅動源 253‧‧‧ fifth drive source
30‧‧‧機台 30‧‧‧ machine
41、42、43、44、45‧‧‧電子元件 41, 42, 43, 44, 45‧‧‧ Electronic components
50‧‧‧供料裝置 50‧‧‧Feeding device
51‧‧‧供料承置器 51‧‧‧Feeder
60‧‧‧收料裝置 60‧‧‧ receiving device
61‧‧‧收料承置器 61‧‧‧Receipt receiver
70‧‧‧輸送裝置 70‧‧‧Conveyor
71‧‧‧第一取放器 71‧‧‧First pick and place
72‧‧‧第二取放器 72‧‧‧Second pick and place
第1圖:習知電子元件檢測裝置之使用示意圖(一)。 Figure 1: Schematic diagram of the use of a conventional electronic component detecting device (1).
第2圖:習知電子元件檢測裝置之使用示意圖(二)。 Figure 2: Schematic diagram of the use of the conventional electronic component detecting device (2).
第3圖:本發明電子元件作業裝置之配置圖。 Fig. 3 is a layout view of an electronic component working device of the present invention.
第4圖:本發明電子元件作業裝置之使用示意圖(一)。 Fig. 4 is a schematic view showing the use of the electronic component working device of the present invention (1).
第5圖:本發明電子元件作業裝置之使用示意圖(二)。 Fig. 5 is a schematic view showing the use of the electronic component working device of the present invention (2).
第6圖:本發明電子元件作業裝置之使用示意圖(三)。 Fig. 6 is a schematic view showing the use of the electronic component working device of the present invention (3).
第7圖:本發明電子元件作業裝置之使用示意圖(四)。 Figure 7 is a schematic view showing the use of the electronic component working device of the present invention (4).
第8圖:本發明電子元件作業裝置之使用示意圖(五)。 Figure 8 is a schematic view showing the use of the electronic component working device of the present invention (5).
第9圖:本發明電子元件作業裝置之使用示意圖(六)。 Figure 9 is a schematic view showing the use of the electronic component working device of the present invention (6).
第10圖:本發明電子元件作業裝置之使用示意圖(七)。 Fig. 10 is a schematic view showing the use of the electronic component working device of the present invention (7).
第11圖:本發明電子元件作業裝置之使用示意圖(八)。 Figure 11 is a schematic view showing the use of the electronic component working device of the present invention (8).
第12圖:本發明作業裝置應用於作業分類設備之示意圖。 Fig. 12 is a schematic view showing the application of the working device of the present invention to a job sorting device.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第3圖,本發明電子元件作業裝置20包含第一工作站21、第二工作站22、載送機構23、第一移載機構24及第二移載機構25,更進一步,該作業裝置20係於機台30上採第一方向(如X方向)配置入料區、第一作業區、第二作業區及出料區,該第一工作站21係設有至少一第一作業器,以對電子元件執行第一預設作業,更進一步,該第一作業器可為一測試器,以對電子元件執行可為測試作業之第一預設作業,該測試器係具有電性連接之電路板及測試座,亦或具有電性連接之電路板及測試座,該電路板並電性連接一測試機,於本實施例中,該第一工作站21係配置於第一作業區,該第一作業器具有電性連接之電路板211及測試座212,以對電子元件執行測試作業;該第二工作站22係設有至少一第二作業器,以對電子元件執行第二預設作業,更進一步,該第二作業器可為一檢知器,以對電子元件執行可為外觀檢知作業之第二預設作業,該檢知器可具有至少一CCD,亦或於一箱體內配置CCD及複數個菱鏡,以對電子元件進行至少一面外觀檢知作業或五面外觀檢知作業,於本實施例中,該第二工作站22係配置於第二作業區, 該第二作業器係為一於箱體內配置CCD及複數個菱鏡之檢知器221,以對電子元件執行五面取像作業;該載送機構23係於第一、二工作站21、22之至少一側設置有作至少一方向位移之至少一入料載台、至少一轉站載台及至少一出料載台,以分別載送待作業電子元件、待轉站電子元件及全作業電子元件,於本實施例中,載送機構23係於第一、二工作站21、22之第一側配置有第一入料載台231、第一轉站載台232及第一出料載台233,該第一入料載台231、第一轉站載台232及第一出料載台233係呈等距排列,並由第一驅動源234驅動作X方向同步位移,以於入料區、第一作業區、第二作業區及出料區間載送電子元件,亦即該第一入料載台231係於入料區及第一作業區間載送待作業電子元件,第一轉站載台232係於第一作業區及第二作業區間載送已作第一預設作業之待轉站電子元件,第一出料載台233係於第二作業區及出料區間承載已作第一、二預設作業之全作業電子元件,又該載送機構23係於第一、二工作站21、22之第二側亦設有第二入料載台235、第二轉站載台236及第二出料載台237,該第二入料載台235、第二轉站載台236及第二出料載台237係呈等距排列,並由第二驅動源238驅動作X方向同步位移,以於入料區、第一作業區、第二作業區及出料區間載送電子元件,亦即第二入料載台235係於入料區及第一作業區間載送待作業電子元件,第二轉站載台236係於第一作業區及第二作業區間載送已作第一預設作業之待轉站電子元件,第二出料載台237係於第二作業區及出料區間載送已作第一、二預設作業之全作業電子元件;該第一移載機構24係配置有作至少一方向位移之至少一第一移載具241,以於第一工作站21、入料載台及轉站載台間移載待作業電子元件及待轉站電子元件,於本實施例中,該第一移載機構24係於第一作業區配置有作第二、三方向(如Y、Z方向)位移之第一移載具241及第三移載具242,該第一移載具2 41係由第三驅動源243驅動作Y-Z方向位移,以於第一工作站21之測試座212、第一入料載台231及第一轉站載台232間移載待作業電子元件及待轉站電子元件,該第三移載具242係由第四驅動源244驅動作Y-Z方向位移,以於第一工作站21之測試座212、第二入料載台235及第二轉站載台236間移載待作業電子元件及待轉站電子元件;該第二移載機構25係配置有作至少一方向位移之至少一第二移載具251,以於第二工作站22、轉站載台及出料載台間移載該待轉站電子元件及全作業電子元件,於本實施例中,該第二移載機構25係於第二作業區配置有作第二、三方向(如Y、Z方向)位移之第二移載具251及第四移載具252,該第二移載具251及第四移載具252係由第五驅動源253驅動作Y-Z方向位移,令第二移載具251於第二工作站22、第一轉站載台232及第一出料載台233間移載待轉站電子元件及全作業電子元件,以及令第四移載具252於第二工作站22、第二轉站載台236及第二出料載台236間移載待轉站電子元件及全作業電子元件。 In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail. As follows: Referring to FIG. 3, the electronic component working device 20 of the present invention includes a first workstation 21, The second workstation 22, the carrier mechanism 23, the first transfer mechanism 24, and the second transfer mechanism 25, and further, the working device 20 is disposed on the machine 30 in a first direction (such as the X direction) The first working area, the second working area and the discharging area, the first workstation 21 is provided with at least one first working device to perform a first preset operation on the electronic component, and further, the first working device can be a tester for performing a first predetermined operation on the electronic component, the tester having an electrically connected circuit board and a test stand, or an electrically connected circuit board and a test stand, the circuit The first workstation 21 is disposed in the first working area, and the first working device has an electrically connected circuit board 211 and a test socket 212 for the electronic components. Perform a test job; the second workstation 22 There is at least one second operator for performing a second preset operation on the electronic component, and further, the second operator can be a detector for performing a second preset that can be an appearance detection operation for the electronic component In the present embodiment, the detector may have at least one CCD, or a CCD and a plurality of prisms disposed in a box to perform at least one surface inspection operation or five-sided appearance detection operation on the electronic component. The second workstation 22 is disposed in the second working area, and the second working device is a detector 221 in which a CCD and a plurality of prisms are disposed in the casing to perform a five-sided image capturing operation on the electronic component; The carrier mechanism 23 is provided with at least one loading stage, at least one transfer station stage and at least one discharge stage for at least one direction displacement on at least one of the first and second workstations 21, 22 for respectively carrying In the present embodiment, the carrier mechanism 23 is provided with a first loading stage 231 on the first side of the first and second workstations 21, 22, and the electronic component to be transferred, and the electronic component to be transferred. a first transfer station 232 and a first discharge stage 233, The first loading stage 231, the first transfer station 232 and the first discharging stage 233 are arranged equidistantly, and are driven by the first driving source 234 to be synchronously displaced in the X direction, so as to be in the feeding area, An operation area, a second operation area and a discharge section carry electronic components, that is, the first loading stage 231 carries the electronic components to be operated in the feeding area and the first working section, and the first transfer station The 232 system carries the electronic components of the to-be-transferred station that have been the first preset operation in the first working area and the second working area, and the first discharging stage 233 is placed in the second working area and the discharging section has been first And the second working station electronic component, the second loading station 235 and the second transfer station 236 are also disposed on the second side of the first and second workstations 21 and 22; The second discharge stage 237, the second loading stage 235, the second transfer stage 236 and the second discharge stage 237 are arranged equidistantly and driven by the second driving source 238 for X-direction synchronization. Displacement, for carrying the electronic component in the feeding zone, the first working zone, the second working zone and the discharging zone, that is, the second feeding platform 235 is in the feeding zone and the The working area carries the electronic components to be operated, and the second transfer station 236 carries the electronic components to be transferred which have been the first preset operation in the first working area and the second working area, and the second discharging stage 237 Attaching to the second working area and the discharging section, carrying all the working electronic components that have been used for the first and second preset operations; the first transferring mechanism 24 is configured with at least one first moving carrier that is displaced in at least one direction 241, in order to transfer the electronic components to be operated and the electronic components to be transferred between the first workstation 21, the loading carrier and the transfer station, in the embodiment, the first transfer mechanism 24 is in the first operation. The first transfer carrier 241 and the third transfer carrier 242 are disposed in the second and third directions (such as Y and Z directions), and the first transfer carrier 241 is driven by the third driving source 243 as YZ. The directional displacement is used to transfer the electronic component to be operated and the electronic component to be transferred between the test socket 212 of the first workstation 21, the first loading carrier 231 and the first transfer station 232, and the third transfer carrier 242 The fourth driving source 244 is driven to be displaced in the YZ direction, so as to be the test socket 212 of the first workstation 21 and the second loading station 235. The second transfer station 236 transfers the electronic component to be operated and the electronic component to be transferred; the second transfer mechanism 25 is configured with at least one second transfer carrier 251 for at least one direction displacement, for the second The electronic component and the electronic component of the standby station are transferred between the workstation 22, the transfer station, and the discharge carrier. In this embodiment, the second transfer mechanism 25 is disposed in the second working area. The second transfer carrier 251 and the fourth transfer carrier 252 are displaced in the second and third directions (such as the Y and Z directions), and the second transfer carrier 251 and the fourth transfer carrier 252 are driven by the fifth driving source 253. The displacement in the YZ direction causes the second transfer carrier 251 to transfer the electronic components to be transferred and the electronic components to be transferred between the second workstation 22, the first transfer station 232 and the first discharge stage 233, and the fourth The transfer carrier 252 transfers the electronic components to be transferred and the full-working electronic components between the second workstation 22, the second transfer station 236 and the second discharge stage 236.
請參閱第4圖,由於載送機構23之第一入料載台231及第二入料載台235係位於機台30之入料區,當第一入料載台231承載待作業之電子元件41後,該第一驅動源234即驅動第一入料載台231、第一轉站載台232及第一出料載台233作X方向同步位移,令承載待作業電子元件41之第一入料載台231由入料區位移至第一作業區,且位於第一工作站21之第一側,而第一轉站載台232由第一作業區位移至第二作業區,且位於第二工作站22之第一側,該第一出料載台233由第二作業區位移至出料區,該第一移載機構24之第三驅動源243係驅動第一移載具241作Y-Z方向位移,以於第一入料載台231取出待作業電子元件41,並移載至第一工作站21之測試座212而執行測試作業,第四驅動源244則 驅動第三移載具242作Y方向位移至第二轉站載台236之上方,該載送機構23之第二入料載台235則於入料區承載下一待作業之電子元件42。 Referring to FIG. 4, since the first loading stage 231 and the second loading stage 235 of the carrying mechanism 23 are located in the feeding area of the machine table 30, when the first loading stage 231 carries the electrons to be operated After the component 41, the first driving source 234 drives the first loading stage 231, the first transfer station 232 and the first discharging stage 233 to be synchronously displaced in the X direction, so as to carry the electronic component 41 to be operated. A loading stage 231 is displaced from the feeding zone to the first working area and is located on the first side of the first workstation 21, and the first transfer station 232 is displaced from the first working area to the second working area and is located On the first side of the second workstation 22, the first discharge carrier 233 is displaced from the second working area to the discharge area, and the third driving source 243 of the first transfer mechanism 24 drives the first transfer carrier 241 The YZ direction is displaced, so that the first loading stage 231 takes out the electronic component 41 to be operated, and transfers to the test socket 212 of the first workstation 21 to perform a test operation, and the fourth driving source 244 drives the third transfer carrier 242. Displacement in the Y direction above the second transfer station 236, the second loading stage 235 of the carrying mechanism 23 is carried in the loading area Electronic components 42 of the job.
請參閱第5、6圖,於第一工作站21之測試座212執行電子元件41之測試作業時,該載送機構23之第一驅動源234係驅動第一入料載台231、第一轉站載台232及第一出料載台233作X方向同步位移,令空的第一入料載台231、第一轉站載台232及第一出料載台233分別位於入料區、第一作業區及第二作業區,而第二驅動源238則驅動第二入料載台235、第二轉站載台236及第二出料載台237作X方向同步位移,令承載下一待作業電子元件42之第二入料載台235、第二轉站載台236及第二出料載台237分別位於第一作業區、第二作業區及出料區,該第一移載機構24之第四驅動源244係驅動第三移載具242作Z方向位移,以於第二入料載台235取出下一待作業之電子元件42;接著該載送機構23之第一入料載台231係於入料區承載另一待作業之電子元件43,由於第一轉站載台232已位於第一工作站21之第一側,於第一工作站21之測試座212完成電子元件41之測試作業後,該第一移載機構24之第三驅動源243係驅動第一移載具241作Y-Z方向位移,將測試座212之已測且待轉站之電子元件41移入第一轉站載台232,而第一移載機構24之第四驅動源244則驅動第三移載具242作Y-Z方向位移,將下一待作業之電子元件42移載至測試座212而接續執行測試作業。 Referring to FIGS. 5 and 6, when the test piece 212 of the first workstation 21 performs the test operation of the electronic component 41, the first driving source 234 of the carrier mechanism 23 drives the first loading carrier 231 and the first turn. The station stage 232 and the first discharge stage 233 are synchronously displaced in the X direction, so that the empty first loading stage 231, the first transfer stage 232 and the first discharging stage 233 are respectively located in the feeding area. The first working area and the second working area, and the second driving source 238 drives the second loading stage 235, the second transfer stage 236 and the second discharging stage 237 for synchronous displacement in the X direction, so as to be carried under The second loading stage 235, the second transfer station 236 and the second discharging stage 237 of the standby electronic component 42 are respectively located in the first working area, the second working area and the discharging area, and the first shift The fourth driving source 244 of the carrier mechanism 24 drives the third transfer carrier 242 to be displaced in the Z direction to take out the next electronic component 42 to be operated on the second loading stage 235; then the first of the carrier mechanism 23 The loading stage 231 is connected to the loading area to carry another electronic component 43 to be operated, since the first transfer station 232 is already located on the first side of the first workstation 21 After the test socket 212 of the first workstation 21 completes the testing operation of the electronic component 41, the third driving source 243 of the first transfer mechanism 24 drives the first transfer carrier 241 to be displaced in the YZ direction, and the test socket 212 is The electronic component 41 to be transferred and moved to the first transfer station 232, and the fourth drive source 244 of the first transfer mechanism 24 drives the third transfer carrier 242 to shift in the YZ direction, and the next work to be performed The electronic component 42 is transferred to the test socket 212 to continue the test operation.
請參閱第7、8圖,於第一工作站21之測試座212執行電子元件42之測試作業時,該載送機構23之第一驅動源234係驅動第一入料載台231、第一轉站載台232及第一出料載台233作X方向同步位移,令具待作業電子元件43之第一入料載台231、具待轉站電子元件41之第一轉站載 台232及空的第一出料載台233分別位於第一作業區、第二作業區及出料區,該第一移載機構24之第三驅動源243係驅動第一移載具241作Z方向位移,以於第一入料載台231取出待作業電子元件43,該第二移載機構25之第五驅動源253則驅動第二移載具251作Y-Z方向位移,以於第一轉站載台232取出已測之電子元件41,該載送機構23之第二驅動源238驅動第二入料載台235、第二轉站載台236及第二出料載台237作X方向同步位移,而分別位於入料區、第一作業區及第二作業區,令第二入料載台235於入料區承載一待作業之電子元件44;接著於第一工作站21之測試座212完成電子元件42之測試作業後,由於空的第二轉站載台236已位於第一工作站21之第二側,該第一移載機構24之第四驅動源244係驅動第三移載具242作Y-Z方向位移,將測試座212之已測且待轉站之電子元件42移載至第二轉站載台236,而第一移載機構24之第三驅動源243即驅動第一移載具241作Y-Z方向位移,將下一待作業之電子元件43移載至測試座212而接續執行測試作業,此時,第二移載機構25之第五驅動源253即驅動第二移載具251作Y-Z方向位移,將已測之電子元件41移至第二工作站22的檢知器221內而執行五面外觀檢知作業,因此,於第一工作站21及第二工作站22分別對不同電子元件41、43執行測試或檢知作業之同時,該第二入料載台235已承載待作業之電子元件44,以及第二轉站載台236已承載該已測之電子元件42,進而可避免耗時空等,以有效縮減整體作業時間。 Referring to FIGS. 7 and 8, when the test block 212 of the first workstation 21 performs the test operation of the electronic component 42, the first drive source 234 of the carrier mechanism 23 drives the first feed carrier 231 and the first turn. The station 232 and the first discharge stage 233 are synchronously displaced in the X direction, so that the first loading stage 231 of the electronic component 43 to be operated, the first transfer station 232 of the electronic component 41 to be transferred, and The empty first discharge platforms 233 are respectively located in the first working area, the second working area and the discharging area, and the third driving source 243 of the first transfer mechanism 24 drives the first moving carrier 241 to shift in the Z direction. The first loading stage 231 takes out the electronic component 43 to be operated, and the fifth driving source 253 of the second transfer mechanism 25 drives the second transfer carrier 251 to shift in the YZ direction to be carried in the first transfer station. The stage 232 takes out the measured electronic component 41, and the second driving source 238 of the carrier mechanism 23 drives the second loading stage 235, the second transfer station stage 236 and the second discharge stage 237 for synchronous displacement in the X direction. And respectively located in the feeding area, the first working area and the second working area, so that the second feeding stage 235 carries a power to be operated in the feeding area After the test operation of the electronic component 42 is completed by the test socket 212 of the first workstation 21, since the empty second transfer station 236 is located on the second side of the first workstation 21, the first transfer mechanism 24 The fourth driving source 244 drives the third transfer carrier 242 to shift in the YZ direction, and transfers the measured electronic component 42 of the test socket 212 to be transferred to the second transfer station 236, and the first transfer The third driving source 243 of the mechanism 24 drives the first transfer carrier 241 to shift in the YZ direction, and transfers the next electronic component 43 to be operated to the test socket 212 to continue the test operation. At this time, the second transfer mechanism The fifth driving source 253 of 25 drives the second transfer carrier 251 to shift in the YZ direction, and moves the measured electronic component 41 to the detector 221 of the second workstation 22 to perform a five-sided appearance detecting operation. While the first workstation 21 and the second workstation 22 perform testing or detecting operations on the different electronic components 41, 43 respectively, the second loading carrier 235 has carried the electronic component 44 to be operated, and the second relay station carries The stage 236 has carried the measured electronic component 42, thereby avoiding time-consuming In order to effectively reduce the overall operating time.
請參閱第9圖,於第一工作站21及第二工作站22分別對不同電子元件41、43執行測試或檢知作業時,該載送機構23係以第一驅動源234驅動第一入料載台231、第一轉站載台232及第一出料載台233作X方向同步位移,再分別位於入料區、第一作業區及第二作業區,並令第一入料載台 231於入料區承載一待作業之電子元件45,而載送機構23之第二驅動源238則驅動第二入料載台235、第二轉站載台236及第二出料載台237亦作X方向同步位移,以分別位於第一作業區、第二作業區及出料區,第一移載機構24之第四驅動源244即驅動第三移載具242作Z方向位移,以於第二入料載台235取出待作業之電子元件44,第二移載機構25之第五驅動源253即驅動第四移載具252作Y-Z方向位移,以於第二轉站載台236取出已測之電子元件42。 Referring to FIG. 9 , when the first workstation 21 and the second workstation 22 perform testing or detecting operations on different electronic components 41 and 43 respectively, the carrier mechanism 23 drives the first loading carrier with the first driving source 234. The stage 231, the first transfer station stage 232 and the first discharge stage 233 are synchronously displaced in the X direction, and are respectively located in the feeding area, the first working area and the second working area, and the first loading stage 231 is arranged. The electronic component 45 to be operated is carried in the feeding area, and the second driving source 238 of the carrying mechanism 23 drives the second loading stage 235, the second transfer station 236 and the second discharging stage 237. The X-direction synchronous displacement is respectively located in the first working area, the second working area and the discharging area, and the fourth driving source 244 of the first transfer mechanism 24 drives the third transfer carrier 242 to be displaced in the Z direction. The second loading stage 235 takes out the electronic component 44 to be operated, and the fifth driving source 253 of the second transfer mechanism 25 drives the fourth transfer carrier 252 to be displaced in the YZ direction to be taken out by the second transfer station 236. Electronic component 42 that has been measured.
請參閱第10、11圖,由於載送機構23之第一轉站載台232係位於第一工作站21之第一側,以及該第一出料載台233位於第二工作站22之第一側,當電子元件43完成測試作業,以及電子元件41完成測試、檢知作業後,第一移載機構24之第三驅動源243即驅動第一移載具241作Y-Z方向位移,將已測電子元件43移入第一轉站載台232,而第二移載機構25之第五驅動源253即驅動第二移載具251作Y-Z方向位移,將已測且已檢知的全作業電子元件41移入第一出料載台233,另該第一移載機構24之第四驅動源244則驅動第三移載具242作Y-Z方向位移,將待作業電子元件44移入第一工作站21之測試座212而接續執行測試作業,第二移載機構25之第五驅動源253即驅動第四移載具252作Y-Z方向位移,將已測的電子元件42移至第二工作站22的檢知器221而接續執行五面外觀檢知作業;接著於第一工作站21之測試座212及第二工作站22的檢知器221分別執行電子元件44之測試作業及電子元件42之檢知作業時,該載送機構23係以第一驅動源234驅動第一入料載台231、第一轉站載台232及第一出料載台233作X方向同步位移,而分別位於第一作業區、第二作業區及出料區,進而使第一出料載台233載出已測且已檢知的全作業電子元件41;因此,本發明作業裝置20之載送機構23的各載台可於供料區、 第一作業區、第二作業區及出料區間往復位移,而載送待作業電子元件、待轉站電子元件或全作業電子元件,並於第一工作站21及第二工作站22分別執行預設作業(如測試作業或檢知作業)之同時,可執行輸出全作業電子元件,以避免載送機構23之載台耗時空等而無法迅速出料,達到縮短整體作業時間而有效提高生產效能之實用效益。 Referring to FIGS. 10 and 11, the first transfer station 232 of the carrier mechanism 23 is located on the first side of the first workstation 21, and the first discharge stage 233 is located on the first side of the second workstation 22. After the electronic component 43 completes the test operation, and the electronic component 41 completes the test and the detection operation, the third driving source 243 of the first transfer mechanism 24 drives the first transfer carrier 241 to shift in the YZ direction, and the detected electronic device The component 43 is moved into the first transfer station 232, and the fifth drive source 253 of the second transfer mechanism 25 drives the second transfer carrier 251 to be displaced in the YZ direction, and the measured and detected full-working electronic components 41 are detected. Moving into the first discharge stage 233, the fourth driving source 244 of the first transfer mechanism 24 drives the third transfer carrier 242 to shift in the YZ direction, and moves the electronic component 44 to be operated into the test socket of the first workstation 21. 212, and then performing the test operation, the fifth driving source 253 of the second transfer mechanism 25 drives the fourth transfer carrier 252 to shift in the YZ direction, and moves the measured electronic component 42 to the detector 221 of the second workstation 22. And then carry out the five-sided appearance detection operation; then the test on the first workstation 21 When the detector 221 of the second workstation 22 performs the test operation of the electronic component 44 and the detection operation of the electronic component 42, the carrier mechanism 23 drives the first loading stage 231 with the first driving source 234, The first transfer station 232 and the first discharge stage 233 are synchronously displaced in the X direction, and are respectively located in the first working area, the second working area and the discharging area, so that the first discharging stage 233 is carried out. Detecting and detecting the entire operation electronic component 41; therefore, each stage of the carrier mechanism 23 of the working device 20 of the present invention can be reciprocally displaced in the feeding zone, the first working zone, the second working zone, and the discharging section. And carrying the electronic component to be operated, the electronic component to be transferred, or the electronic component of the whole operation, and performing the preset operation (such as a test operation or a detection operation) at the first workstation 21 and the second workstation 22, respectively, and outputting the output The electronic components are all operated to avoid the time-consuming space of the carrier of the carrier mechanism 23, and the material cannot be quickly discharged, thereby achieving the practical benefit of shortening the overall operation time and effectively improving the production efficiency.
請參閱第3、12圖,係本發明作業裝置20應用於作業分類設備之示意圖,該作業分類設備包含機台30、供料裝置50、收料裝置60、作業裝置20、輸送裝置70及中央控制裝置(圖未示出),該供料裝置50係裝配於機台30,並設有至少一供料承置器51,用以容納至少一待作業電子元件;該收料裝置60係裝配於機台30,並設有至少一收料承置器61,用以容納至少一全作業電子元件,該作業裝置20係裝配於機台30,並設有第一工作站21、第二工作站22、載送機構23、第一移載機構24及第二移載機構25,該第一工作站21係設有至少一第一作業器,以對電子元件執行第一預設作業,該第二工作站22係設有至少一第二作業器,以對電子元件執行第二預設作業,於本實施例中,該第一工作站21係對電子元件執行測試作業,該第二工作站22係對電子元件執行外觀檢知作業,該載送機構23係於第一、二工作站21、22之至少一側設置有作至少一方向位移之至少一入料載台、至少一轉站載台及至少一出料載台,以分別載送待作業電子元件、待轉站電子元件及全作業電子元件,於本實施例中,該載送機構23之第一、二入料載台231、235係載送待作業電子元件,第一、二轉站載台232、236係載送待轉站電子元件,第一、二出料載台233、237則載送全作業電子元件,該第一移載機構24係配置有作至少一方向位移之至少一第一移載具241,以於第一工作站21、入料載台及轉站載台間移載待作業電子元件及待轉站電子元件,於本實施例中,第一移載機構24之第一移載具2 41係於第一工作站21、第一入料載台231與第一轉站載台232間移載待作業電子元件及待轉站電子元件,第三移載具242則於第一工作站21、第二入料載台235與第二轉站載台236間移載待作業電子元件及待轉站電子元件,該第二移載機構25係配置有作至少一方向位移之至少一第二移載具251,以於第二工作站22、轉站載台及出料載台間移載該待轉站電子元件及全作業電子元件,於本實施例中,第二移載機構25之第二移載具251係於第二工作站22、第一轉站載台232及第一出料載台233間移載待轉站電子元件及全作業電子元件,第四移載具252係於第二工作站22、第二轉站載台236及第二出料載台237間移載待轉站電子元件及全作業電子元件;該輸送裝置70係配置於該機台30上,並設有至少一移載電子元件之取放器,於本實施例中,輸送裝置70係設有第一取放器71及第二取放器72,該第一取放器71係於供料裝置50與作業裝置20間移載待作業電子元件,該第二取放器72係於作業裝置20與收料裝置60間移載全作業電子元件,並依據測試結果,將全作業電子元件分類收置,該中央控制裝置係用以控制及整合各裝置及單元作動,以執行自動化作業,達到提升作業效能之實用效益。 Please refer to FIGS. 3 and 12, which are schematic diagrams of the working device 20 of the present invention applied to a work sorting device including a machine table 30, a feeding device 50, a receiving device 60, a working device 20, a conveying device 70, and a center. a control device (not shown), the feeding device 50 is mounted on the machine table 30, and is provided with at least one feeding device 51 for accommodating at least one electronic component to be operated; the receiving device 60 is assembled The machine 30 is provided with at least one receiving device 61 for accommodating at least one full working electronic component. The working device 20 is mounted on the machine 30 and is provided with a first workstation 21 and a second workstation 22 . a carrier mechanism 23, a first transfer mechanism 24, and a second transfer mechanism 25, the first workstation 21 is provided with at least one first operator for performing a first preset job on the electronic component, the second workstation The 22 series is provided with at least one second operator for performing a second preset operation on the electronic component. In the embodiment, the first workstation 21 performs a test operation on the electronic component, and the second workstation 22 is a pair of electronic components. Performing an appearance inspection operation, the carrier mechanism 23 At least one side of the first and second workstations 21, 22 is provided with at least one loading stage, at least one transfer station, and at least one discharge stage for at least one direction to respectively carry the electronic components to be operated, In the present embodiment, the first and second loading stations 231 and 235 of the carrying mechanism 23 carry the electronic components to be operated, and the first and second transfer stations are loaded. The 232 and 236 series carry the electronic components to be transferred, and the first and second discharge stages 233 and 237 carry the full-operation electronic components, and the first transfer mechanism 24 is configured to have at least one displacement in at least one direction. Transfer the carrier 241 to transfer the electronic components to be operated and the electronic components to be transferred between the first workstation 21, the loading carrier and the transfer station. In this embodiment, the first transfer mechanism 24 The transfer carrier 2 41 is connected to the first workstation 21, the first loading carrier 231 and the first transfer station 232 to transfer the electronic components to be operated and the electronic components to be transferred, and the third transfer carrier 242 is The first workstation 21, the second loading station 235 and the second transfer station 236 transfer the electronic components to be operated and are to be transferred An electronic component, the second transfer mechanism 25 is configured with at least one second transfer carrier 251 that is displaced in at least one direction to transfer the to-be-transferred between the second workstation 22, the transfer station, and the discharge carrier. In the present embodiment, the second transfer carrier 251 of the second transfer mechanism 25 is attached to the second workstation 22, the first transfer station 232, and the first discharge stage 233. Transferring the electronic components to be transferred and the electronic components of the whole operation, the fourth transfer carrier 252 is used to transfer the electronic components to be transferred between the second workstation 22, the second transfer station 236 and the second discharge carrier 237. And the whole operation electronic component; the conveying device 70 is disposed on the machine table 30, and is provided with at least one pick-and-place device for transferring electronic components. In the embodiment, the conveying device 70 is provided with a first pick-and-place device. 71 and a second pick-and-placer 72 for transferring the electronic components to be operated between the feeding device 50 and the working device 20, the second pick-and-placer 72 being attached to the working device 20 and the receiving device 60 transfer of all-operation electronic components, and according to the test results, the whole operation of electronic components is classified and placed, the central control device The system is used to control and integrate the various devices and units to perform automated operations to achieve practical benefits of improving operational efficiency.
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| TW201431761A (en) * | 2013-02-07 | 2014-08-16 | Hon Tech Inc | Electronic component operating apparatus, operating method, and operating equipment applied the same |
| TW201605702A (en) * | 2014-08-07 | 2016-02-16 | Hon Tech Inc | Electronic component delivery unit and its applicable electronic component inspection equipment |
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