TW201835229A - 抗蝕劑製程用膜形成材料、圖案形成方法及聚矽氧烷 - Google Patents
抗蝕劑製程用膜形成材料、圖案形成方法及聚矽氧烷 Download PDFInfo
- Publication number
- TW201835229A TW201835229A TW107105924A TW107105924A TW201835229A TW 201835229 A TW201835229 A TW 201835229A TW 107105924 A TW107105924 A TW 107105924A TW 107105924 A TW107105924 A TW 107105924A TW 201835229 A TW201835229 A TW 201835229A
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- group
- silicon
- formula
- forming material
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Silicon Polymers (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-034173 | 2017-02-24 | ||
| JP2017034173 | 2017-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201835229A true TW201835229A (zh) | 2018-10-01 |
Family
ID=63252731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107105924A TW201835229A (zh) | 2017-02-24 | 2018-02-22 | 抗蝕劑製程用膜形成材料、圖案形成方法及聚矽氧烷 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2018155377A1 (fr) |
| TW (1) | TW201835229A (fr) |
| WO (1) | WO2018155377A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI874433B (zh) * | 2019-08-09 | 2025-03-01 | 德商默克專利有限公司 | 製造低介電常數矽質膜的組成物及使用其製造固化膜及電子裝置的方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118541645A (zh) * | 2022-01-12 | 2024-08-23 | 日产化学株式会社 | 含硅抗蚀剂下层膜形成用组合物及含硅抗蚀剂下层膜 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6511927B2 (ja) * | 2014-06-05 | 2019-05-15 | Jsr株式会社 | シリコン含有膜形成用組成物、パターン形成方法及びポリシロキサン化合物 |
| JP6250513B2 (ja) * | 2014-10-03 | 2017-12-20 | 信越化学工業株式会社 | 塗布型ケイ素含有膜形成用組成物、基板、及びパターン形成方法 |
| WO2016111210A1 (fr) * | 2015-01-09 | 2016-07-14 | Jsr株式会社 | Composition pour former un film contenant du silicium et procédé de formation de motif utilisant ladite composition |
-
2018
- 2018-02-19 JP JP2019501309A patent/JPWO2018155377A1/ja active Pending
- 2018-02-19 WO PCT/JP2018/005727 patent/WO2018155377A1/fr not_active Ceased
- 2018-02-22 TW TW107105924A patent/TW201835229A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI874433B (zh) * | 2019-08-09 | 2025-03-01 | 德商默克專利有限公司 | 製造低介電常數矽質膜的組成物及使用其製造固化膜及電子裝置的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018155377A1 (ja) | 2020-01-16 |
| WO2018155377A1 (fr) | 2018-08-30 |
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