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TW201829550A - Two-layer photosensitive layer roll - Google Patents

Two-layer photosensitive layer roll Download PDF

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Publication number
TW201829550A
TW201829550A TW106144311A TW106144311A TW201829550A TW 201829550 A TW201829550 A TW 201829550A TW 106144311 A TW106144311 A TW 106144311A TW 106144311 A TW106144311 A TW 106144311A TW 201829550 A TW201829550 A TW 201829550A
Authority
TW
Taiwan
Prior art keywords
group
photosensitive layer
formula
integer
photosensitive
Prior art date
Application number
TW106144311A
Other languages
Chinese (zh)
Other versions
TWI685515B (en
Inventor
藤田充
谷崎洋子
Original Assignee
日商旭化成股份有限公司
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Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW201829550A publication Critical patent/TW201829550A/en
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Publication of TWI685515B publication Critical patent/TWI685515B/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

This photosensitive layer roll has a support body film, and a photosensitive layer that is provided on the support body film and includes a photosensitive resin composition, wherein the photosensitive resin composition includes at least one resin selected from the group consisting of a phenolic resin, a polyimide precursor, a polybenzoxazole precursor, and a soluble polyimide, and the photosensitive layer is a layer that has a temperature at which the melt viscosity thereof becomes 500Pa?s or less.

Description

2層感光層捲筒2-layer photosensitive layer reel

本發明係關於一種感光層捲筒。The invention relates to a photosensitive layer reel.

先前，作為半導體裝置、液晶顯示元件、印刷配線板等之圖案化所利用之圖像形成方法，一般已知有光微影法。於光微影法中，通常使用以下兩種方法之任一種，即，將感光性樹脂組合物之溶液塗佈於銅箔積層板等基板上並使之乾燥之方法，或將依序積層有支持體、包含感光性樹脂組合物之層(以下亦稱為「感光層」)、及視需要使用之覆膜之感光性樹脂積層體(以下亦稱為「乾膜光阻」)積層於基板之方法。於印刷配線板之製造中，多使用後者。乾膜光阻有以捲筒之形態保管之情況(參照專利文獻1)。於專利文獻1中提出有一種感光性複合體，其為了自乾膜光阻之捲筒省去覆膜以降低製造成本，而依序包含感光層、及具有感光層厚度之5分之1以下之厚度之非黏著性外層。就乾膜光阻之操作之觀點而言，要求於室溫下乾膜光阻不具有黏著性，於將乾膜光阻熱壓接於基板等時(即層壓時)表現出流動性(參照專利文獻2)。於專利文獻2中提出有一種感光性覆層膜，其於基板溫度20℃下不具有黏著性，且即便置於基板上亦容易進行位置修正。又，於專利文獻3中，藉由在感光性樹脂組合物中將具有特定結構之酚系樹脂與非離子性界面活性劑組合使用，而同時實現了低溫硬化性及硬化膜之耐化學品性。[先前技術文獻][專利文獻][專利文獻1]日本專利特開2001-175000號公報[專利文獻2]日本專利特開2003-149803號公報[專利文獻3]日本專利特開2013-190697號公報Conventionally, as an image forming method used for patterning semiconductor devices, liquid crystal display elements, printed wiring boards, etc., photolithography is generally known. In the photolithography method, one of the following two methods is generally used, namely, a method of applying a solution of the photosensitive resin composition on a substrate such as a copper foil laminate and drying it, or sequentially stacking A support, a layer containing a photosensitive resin composition (hereinafter also referred to as a "photosensitive layer"), and a photosensitive resin laminate (hereinafter also referred to as a "dry film photoresist") of a coating film as needed are laminated on a substrate Method. In the manufacture of printed wiring boards, the latter is often used. The dry film photoresist may be stored in the form of a roll (see Patent Document 1). Patent Document 1 proposes a photosensitive composite, which includes a photosensitive layer in order to eliminate the coating from the dry film photoresist roll to reduce the manufacturing cost, and has less than 1/5 of the thickness of the photosensitive layer The thickness of the non-adhesive outer layer. From the viewpoint of the operation of the dry film photoresist, it is required that the dry film photoresist does not have adhesiveness at room temperature, and exhibits fluidity when the dry film photoresist is thermally pressure-bonded to a substrate, etc. Refer to Patent Document 2). Patent Document 2 proposes a photosensitive coating film that has no adhesiveness at a substrate temperature of 20 ° C. and can be easily corrected for position even when placed on the substrate. Moreover, in Patent Document 3, by combining a phenol resin having a specific structure with a nonionic surfactant in a photosensitive resin composition, low-temperature curability and chemical resistance of a cured film are simultaneously achieved . [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2001-175000 [Patent Literature 2] Japanese Patent Laid-Open No. 2003-149803 [Patent Literature 3] Japanese Patent Laid-Open No. 2013-190697 Bulletin

[發明所欲解決之問題]通常，感光性樹脂積層體係以捲筒之形態製造，並切割成必需寬度而使用。然而，於感光層為包含選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種樹脂之先前之感光性樹脂積層體之情形時，存在如下問題：切割時產生皺褶或裂痕，不易以截面變得平滑之方式進行切割。[解決問題之技術手段]本發明者等人發現，藉由調整感光層之熔融黏度或去除覆膜可解決上述問題，從而完成了本發明。即，本發明如下所述。[1]一種感光層捲筒，其具有：支持體膜；及感光層，其設置於上述支持體膜上，且包含感光性樹脂組合物；且上述感光性樹脂組合物包含選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種樹脂，且上述感光層為具有熔融黏度成為500 Pa・s以下之溫度點之層。[2]如[1]所記載之感光層捲筒，其中上述感光層為具有熔融黏度成為350 Pa・s以下之溫度點之層。[3]如[1]或[2]所記載之感光層捲筒，其中上述感光層於100℃下之熔融黏度為500 Pa・s以下。[4]如[3]所記載之感光層捲筒，其中上述感光層於100℃下之熔融黏度為350 Pa・s以下。[5]如[1]～[4]中任一項所記載之感光層捲筒，其於上述感光層之與設置有上述支持體膜一側相反之側具有覆膜，且上述覆膜之軟化溫度為90℃以上。[6]如[5]所記載之感光層捲筒，其中上述覆膜之軟化溫度為110℃以上。[7]如[1]～[6]中任一項所記載之感光層捲筒，其中上述感光層中所包含之有機溶劑之量相對於上述感光層之總量為0.1質量%以上且15質量%以下。[8]如[7]所記載之感光層捲筒，其中上述感光層中所包含之有機溶劑之量相對於上述感光層之總量為1質量%以上且15質量%以下。[9]如[7]或[8]所記載之感光層捲筒，其中上述有機溶劑包含選自由γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮、二甲基亞碸、丙二醇單甲醚、第三丁醇及四氫呋喃甲醇所組成之群中之至少一種。[10]如[9]所記載之感光層捲筒，其中上述有機溶劑包含選自由γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮及二甲基亞碸所組成之群中之至少一種。[11]如[1]～[10]中任一項所記載之感光層捲筒，其中上述感光性樹脂組合物包含上述聚醯亞胺前驅物。[12]如[1]～[10]中任一項所記載之感光層捲筒，其中上述感光性樹脂組合物包含上述聚苯并㗁唑前驅物。[13]如[1]～[10]中任一項所記載之感光層捲筒，其中上述感光性樹脂組合物包含上述可溶性聚醯亞胺。[14]如[1]～[10]中任一項所記載之感光層捲筒，其中上述感光性樹脂組合物包含上述酚系樹脂。[15]如[14]所記載之感光層捲筒，其中上述酚系樹脂具有下述通式(1)：[化1](式1){式(1)中，a為1～3之整數，b為0～3之整數，1≦(a＋b)≦4，R1 表示選自由碳數1～20之一價有機基、鹵素原子、硝基及氰基所組成之群中之一價取代基，b為2或3之情形時複數個R1 分別可相同亦可不同，且X表示選自由可具有不飽和鍵之碳數2～10之二價鏈狀脂肪族基、碳數3～20之二價脂環式基、下述通式(2)：[化2](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及具有芳香族環之二價有機基所組成之群中之二價有機基}所表示之結構作為重複單元。[16]如[15]所記載之感光層捲筒，其中上述通式(1)中之X為選自由下述通式(3)：[化3](式3){式(3)中，R2 、R3 、R4 及R5 分別獨立地為氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，n1為0～4之整數，n1為1～4之整數之情形時R6 為鹵素原子、羥基、或一價有機基，至少1個R6 為羥基，n1為2～4之整數之情形時複數個R6 分別可相同亦可不同}所表示之二價基、及下述通式(4)：[化4](式4){式(4)中，R7 、R8 、R9 及R10 分別獨立地表示氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，且W為選自由單鍵、可經氟原子取代之碳數1～10之鏈狀脂肪族基、可經氟原子取代之碳數3～20之脂環式基、下述通式(2)：[化5](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及下述式(5)：[化6](式5)所表示之二價基所組成之群中之二價有機基}所表示之二價基所組成之群中之二價有機基。[17]如[15]或[16]所記載之感光層捲筒，其中上述通式(1)中之X為下述式(6)：[化7](式6)所表示之二價有機基。[18]如[17]所記載之感光層捲筒，其中上述通式(1)中之X為下述式(7)：[化8](式7)所表示之二價有機基。[19]如[15]～[19]中任一項所記載之感光層捲筒，其中上述酚系樹脂於同一樹脂骨架內具有下述通式(8)：[化9](式8){式(8)中，R11 為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n2為1～3之整數，n3為0～2之整數，m1為1～500之整數，2≦(n2＋n3)≦4，n3為2之情形時R11 分別可相同亦可不同}所表示之重複單元、及下述通式(9)：[化10](式9){式(9)中，R12 及R13 分別獨立地為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n4為1～3之整數，n5為0～2之整數，n6為0～3之整數，m2為1～500之整數，2≦(n4＋n5)≦4，n5為2之情形時R12 分別可相同亦可不同，n6為2或3之情形時R13 分別可相同亦可不同}所表示之重複單元之兩者。[20]一種感光層捲筒，其具有：支持體膜；及感光層，其設置於上述支持體膜上，且包含感光性樹脂組合物；上述感光性樹脂組合物包含選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種樹脂，且上述支持體膜之兩面與上述感光層相接。[21]如[20]所記載之感光層捲筒，其中上述感光層中所包含之有機溶劑之量相對於上述感光層之總量為0.1質量%以上且15質量%以下。[22]如[21]所記載之感光層捲筒，其中上述感光層中所包含之有機溶劑之量相對於上述感光層之總量為1質量%以上且15質量%以下。[23]如[21]或[22]所記載之感光層捲筒，其中上述感光性樹脂組合物包含上述酚系樹脂。[24]如[21]～[23]中任一項所記載之感光層捲筒，其中上述有機溶劑包含選自由γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮、二甲基亞碸、丙二醇單甲醚、第三丁醇及四氫呋喃甲醇所組成之群中之至少一種。[25]如[24]所記載之感光層捲筒，其中上述有機溶劑包含選自由γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮及二甲基亞碸所組成之群中之至少一種。[26]如[20]～[25]中任一項所記載之感光層捲筒，其中上述感光性樹脂組合物包含上述聚醯亞胺前驅物。[27]如[20]～[25]中任一項所記載之感光層捲筒，其中上述感光性樹脂組合物包含上述聚苯并㗁唑前驅物。[28]如[20]～[25]中任一項所記載之感光層捲筒，其中上述感光性樹脂組合物包含上述可溶性聚醯亞胺。[29]如[20]～[25]中任一項所記載之感光層捲筒，其中上述感光性樹脂組合物包含酚系樹脂。[30]如[29]所記載之感光層捲筒，其中上述酚系樹脂具有下述通式(1)：[化11](式1){式(1)中，a為1～3之整數，b為0～3之整數，1≦(a＋b)≦4，R1 表示選自由碳數1～20之一價有機基、鹵素原子、硝基及氰基所組成之群中之一價取代基，b為2或3之情形時複數個R1 分別可相同亦可不同，且X表示選自由可具有不飽和鍵之碳數2～10之二價鏈狀脂肪族基、碳數3～20之二價脂環式基、下述通式(2)：[化12](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及具有芳香族環之二價有機基所組成之群中之二價有機基}所表示之結構作為重複單元。[31]如[30]所記載之感光層捲筒，其中上述通式(1)中之X為選自由下述通式(3)：[化13](式3){式(3)中，R2 、R3 、R4 及R5 分別獨立地為氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，n1為0～4之整數，n1為1～4之整數之情形時R6 為鹵素原子、羥基、或一價有機基，至少1個R6 為羥基，n1為2～4之整數之情形時複數個R6 分別可相同亦可不同}所表示之二價基、及下述通式(4)：[化14](式4){式(4)中，R7 、R8 、R9 及R10 分別獨立地表示氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，且W為選自由單鍵、可經氟原子取代之碳數1～10之鏈狀脂肪族基、可經氟原子取代之碳數3～20之脂環式基、下述通式(2)：[化15](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及下述式(5)：[化16](式5)所表示之二價基所組成之群中之二價有機基}所表示之二價基所組成之群中之二價有機基。[32]如[30]或[31]所記載之感光層捲筒，其中上述通式(1)中之X為下述式(6)：[化17](式6)所表示之二價有機基。[33]如[32]所記載之感光層捲筒，其中上述通式(1)中之X為下述式(7)：[化18](式7)所表示之二價有機基。[34]如[30]～[33]中任一項所記載之感光層捲筒，其中上述酚系樹脂於同一樹脂骨架內具有下述通式(8)：[化19](式8){式(8)中，R11 為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n2為1～3之整數，n3為0～2之整數，m1為1～500之整數，2≦(n2＋n3)≦4，n3為2之情形時R11 分別可相同亦可不同}所表示之重複單元、及下述通式(9)：[化20](式9){式(9)中，R12 及R13 分別獨立地為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n4為1～3之整數，n5為0～2之整數，n6為0～3之整數，m2為1～500之整數，2≦(n4＋n5)≦4，n5為2之情形時R12 分別可相同亦可不同，n6為2或3之情形時R13 分別可相同亦可不同}所表示之重複單元之兩者。[35]一種切條感光層捲筒之製造方法，其係利用切條機切割如[1]～[34]中任一項所記載之感光層捲筒而製造切條感光層捲筒。[36]如[35]所記載之切條感光層捲筒之製造方法，其中上述切條機之齒被加熱。[37]如[36]所記載之切條感光層捲筒之製造方法，其中上述切條機之齒被加熱至100℃以上。[38]一種切條感光層捲筒之製造方法，其包含以下步驟：於如[1]～[34]中任一項所記載之感光層捲筒於上述感光層之與設置有上述支持體膜一側相反之側具有覆膜之情形時，將上述覆膜剝離；利用切條機切割不具有上述覆膜之上述感光層捲筒；於經切割之上述感光層捲筒貼合上述剝離之覆膜或與上述剝離之覆膜不同之覆膜。[39]如[38]所記載之切條感光層捲筒之製造方法，其中上述切條機之齒被加熱。[40]如[39]所記載之切條感光層捲筒之製造方法，其中上述切條機之齒被加熱至100℃以上。[發明之效果]根據本發明，能夠提供一種切割時不易產生皺褶或裂痕且能夠以截面變得平滑之方式進行切割之感光層捲筒。[Problems to be Solved by the Invention] Generally, the photosensitive resin laminate system is manufactured in the form of a roll and cut to a necessary width for use. However, the photosensitive layer is a previous photosensitive resin laminate containing at least one resin selected from the group consisting of phenolic resin, polyimide precursor, polybenzoxazole precursor, and soluble polyimide In the case of the body, there is a problem that wrinkles or cracks are generated during cutting, and it is not easy to cut in a way that the cross section becomes smooth. [Technical Means for Solving the Problems] The inventors of the present invention have found that the above problems can be solved by adjusting the melt viscosity of the photosensitive layer or removing the coating, thereby completing the present invention. That is, the present invention is as follows. [1] A photosensitive layer reel comprising: a support film; and a photosensitive layer provided on the support film and containing a photosensitive resin composition; and the photosensitive resin composition containing a phenol resin , At least one resin in the group consisting of polyimide precursors, polybenzoxazole precursors, and soluble polyimide, and the photosensitive layer has a temperature point at which the melt viscosity becomes 500 Pa · s or less Floor. [2] The photosensitive layer roll according to [1], wherein the photosensitive layer is a layer having a temperature point at which the melt viscosity becomes 350 Pa · s or less. [3] The photosensitive layer roll as described in [1] or [2], wherein the melt viscosity of the photosensitive layer at 100 ° C is 500 Pa · s or less. [4] The photosensitive layer roll as described in [3], wherein the melt viscosity of the photosensitive layer at 100 ° C. is 350 Pa · s or less. [5] The photosensitive layer roll as described in any one of [1] to [4], which has a coating on the opposite side of the photosensitive layer from the side on which the support film is provided, and the The softening temperature is above 90 ° C. [6] The photosensitive layer roll as described in [5], wherein the softening temperature of the coating is 110 ° C. or higher. [7] The photosensitive layer roll according to any one of [1] to [6], wherein the amount of the organic solvent contained in the photosensitive layer is 0.1% by mass or more and 15% relative to the total amount of the photosensitive layer Mass% or less. [8] The photosensitive layer roll according to [7], wherein the amount of the organic solvent contained in the photosensitive layer is 1% by mass or more and 15% by mass or less relative to the total amount of the photosensitive layer. [9] The photosensitive layer reel as described in [7] or [8], wherein the organic solvent contains γ-butyrolactone, acetone, methyl ethyl ketone, N-methyl-2-pyrrolidone At least one of the group consisting of dimethyl sulfoxide, propylene glycol monomethyl ether, third butanol and tetrahydrofuran methanol. [10] The photosensitive layer roll as described in [9], wherein the organic solvent includes a member selected from the group consisting of γ-butyrolactone, acetone, methyl ethyl ketone, N-methyl-2-pyrrolidone and dimethyl At least one of the groups formed by Ah. [11] The photosensitive layer roll according to any one of [1] to [10], wherein the photosensitive resin composition includes the polyimide precursor. [12] The photosensitive layer roll according to any one of [1] to [10], wherein the photosensitive resin composition includes the polybenzoxazole precursor. [13] The photosensitive layer roll according to any one of [1] to [10], wherein the photosensitive resin composition contains the soluble polyimide. [14] The photosensitive layer roll according to any one of [1] to [10], wherein the photosensitive resin composition contains the phenol resin. [15] The photosensitive layer roll as described in [14], wherein the phenol resin has the following general formula (1): [Chem. 1] (Formula 1) {In formula (1), a is an integer of 1 to 3, b is an integer of 0 to 3, 1 ≦ (a + b) ≦ 4, R 1 represents a monovalent organic group selected from carbon numbers 1 to 20 , A halogen atom, a nitro group, and a monovalent substituent in the group consisting of cyano, when b is 2 or 3, a plurality of R 1 may be the same or different, and X represents selected from the group that may have an unsaturated bond A divalent chain aliphatic group having 2 to 10 carbon atoms, a divalent alicyclic group having 3 to 20 carbon atoms, and the following general formula (2): [Chem 2] (Formula 2) (In formula (2), p is an integer of 1 to 10) a divalent organic group in the group consisting of a divalent epoxyalkyl group and a divalent organic group having an aromatic ring} The structure shown is used as a repeating unit. [16] The photosensitive layer roll as described in [15], wherein X in the above general formula (1) is selected from the following general formula (3): [Chem. 3] (Formula 3) {In formula (3), R 2 , R 3 , R 4 and R 5 are each independently a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a part or all of a hydrogen atom is fluorinated Monovalent aliphatic group with 1 to 10 carbon atoms substituted by atoms, n1 is an integer of 0 to 4, when n1 is an integer of 1 to 4, R 6 is a halogen atom, a hydroxyl group, or a monovalent organic group, at least When one R 6 is a hydroxyl group and n1 is an integer of 2 to 4, the plural R 6 may be the same or different, respectively, the divalent group represented by}, and the following general formula (4): [化 4] (Formula 4) {In formula (4), R 7 , R 8 , R 9 and R 10 each independently represent a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a part or all of a hydrogen atom through fluorine A monovalent aliphatic group having 1 to 10 carbon atoms substituted by atoms, and W is selected from a single bond, a linear aliphatic group having 1 to 10 carbon atoms which may be substituted by fluorine atoms, and carbon which may be substituted by fluorine atoms The alicyclic group of 3-20, the following general formula (2): [Chemical 5] The divalent epoxyalkyl group represented by (Formula 2) (in formula (2), p is an integer of 1 to 10), and the following formula (5): The divalent organic group in the group consisting of the divalent group represented by (Formula 5)} The divalent organic group in the group consisting of the divalent group represented by}. [17] The photosensitive layer roll as described in [15] or [16], wherein X in the above general formula (1) is the following formula (6): [化 7] The divalent organic group represented by (Formula 6). [18] The photosensitive layer roll as described in [17], wherein X in the above general formula (1) is the following formula (7): [Chem 8] The divalent organic group represented by (Formula 7). [19] The photosensitive layer roll according to any one of [15] to [19], wherein the phenol resin has the following general formula (8) in the same resin skeleton: [Chem 9] (Formula 8) {In formula (8), R 11 is a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, n2 is an integer of 1 to 3, and n3 is 0 to 2 Integer, m1 is an integer from 1 to 500, 2 ≦ (n2 + n3) ≦ 4, when n3 is 2, R 11 may be the same or different} repeating unit represented by}, and the following general formula (9): [ Chemical 10] (Formula 9) {In formula (9), R 12 and R 13 are each independently a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, and n4 is an integer of 1 to 3 , N5 is an integer from 0 to 2, n6 is an integer from 0 to 3, m2 is an integer from 1 to 500, 2 ≦ (n4 + n5) ≦ 4, when n5 is 2, R 12 may be the same or different, n6 is In the case of 2 or 3, R 13 may be the same or different, and both of the repeating units represented by}. [20] A photosensitive layer reel comprising: a support film; and a photosensitive layer provided on the support film and containing a photosensitive resin composition; the photosensitive resin composition comprises a phenolic resin, At least one resin in the group consisting of a polyimide precursor, a polybenzoxazole precursor, and a soluble polyimide, and both sides of the support film are in contact with the photosensitive layer. [21] The photosensitive layer roll described in [20], wherein the amount of the organic solvent contained in the photosensitive layer is 0.1% by mass or more and 15% by mass or less relative to the total amount of the photosensitive layer. [22] The photosensitive layer roll described in [21], wherein the amount of the organic solvent contained in the photosensitive layer is 1% by mass or more and 15% by mass or less relative to the total amount of the photosensitive layer. [23] The photosensitive layer roll according to [21] or [22], wherein the photosensitive resin composition contains the phenol resin. [24] The photosensitive layer roll as described in any one of [21] to [23], wherein the organic solvent contains a member selected from the group consisting of γ-butyrolactone, acetone, methyl ethyl ketone, and N-methyl-2 -At least one of the group consisting of pyrrolidone, dimethyl sulfoxide, propylene glycol monomethyl ether, third butanol, and tetrahydrofuran methanol. [25] The photosensitive layer roll as described in [24], wherein the organic solvent includes a member selected from the group consisting of γ-butyrolactone, acetone, methyl ethyl ketone, N-methyl-2-pyrrolidone and dimethyl At least one of the groups formed by Ah. [26] The photosensitive layer roll according to any one of [20] to [25], wherein the photosensitive resin composition contains the polyimide precursor. [27] The photosensitive layer roll according to any one of [20] to [25], wherein the photosensitive resin composition contains the polybenzoxazole precursor. [28] The photosensitive layer roll described in any one of [20] to [25], wherein the photosensitive resin composition contains the soluble polyimide. [29] The photosensitive layer roll according to any one of [20] to [25], wherein the photosensitive resin composition contains a phenol resin. [30] The photosensitive layer roll as described in [29], wherein the phenol resin has the following general formula (1): [Chem 11] (Formula 1) {In formula (1), a is an integer of 1 to 3, b is an integer of 0 to 3, 1 ≦ (a + b) ≦ 4, R 1 represents a monovalent organic group selected from carbon numbers 1 to 20 , A halogen atom, a nitro group, and a monovalent substituent in the group consisting of cyano, when b is 2 or 3, a plurality of R 1 may be the same or different, and X represents selected from the group that may have an unsaturated bond A divalent chain aliphatic group having 2 to 10 carbon atoms, a divalent alicyclic group having 3 to 20 carbon atoms, and the following general formula (2): [Chem 12] (Formula 2) (In formula (2), p is an integer of 1 to 10) a divalent organic group in the group consisting of a divalent epoxyalkyl group and a divalent organic group having an aromatic ring} The structure shown is used as a repeating unit. [31] The photosensitive layer roll as described in [30], wherein X in the above general formula (1) is selected from the following general formula (3): [Chem. 13] (Formula 3) {In formula (3), R 2 , R 3 , R 4 and R 5 are each independently a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a part or all of a hydrogen atom is fluorinated Monovalent aliphatic group with 1 to 10 carbon atoms substituted by atoms, n1 is an integer of 0 to 4, when n1 is an integer of 1 to 4, R 6 is a halogen atom, a hydroxyl group, or a monovalent organic group, at least When one R 6 is a hydroxyl group and n1 is an integer of 2 to 4, the plural R 6 may be the same or different, respectively, a divalent group represented by}, and the following general formula (4): [Chem 14] (Formula 4) {In formula (4), R 7 , R 8 , R 9 and R 10 each independently represent a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a part or all of a hydrogen atom through fluorine A monovalent aliphatic group having 1 to 10 carbon atoms substituted by atoms, and W is selected from a single bond, a linear aliphatic group having 1 to 10 carbon atoms which may be substituted by fluorine atoms, and carbon which may be substituted by fluorine atoms The alicyclic group of 3-20, the following general formula (2): [Chem. 15] The divalent epoxyalkyl group represented by (Formula 2) (in formula (2), p is an integer of 1 to 10), and the following formula (5): [Chem 16] The divalent organic group in the group consisting of the divalent group represented by (Formula 5)} The divalent organic group in the group consisting of the divalent group represented by}. [32] The photosensitive layer roll as described in [30] or [31], wherein X in the general formula (1) is the following formula (6): [Chem. 17] The divalent organic group represented by (Formula 6). [33] The photosensitive layer roll as described in [32], wherein X in the above general formula (1) is the following formula (7): [Chem. 18] The divalent organic group represented by (Formula 7). [34] The photosensitive layer roll as described in any one of [30] to [33], wherein the phenol resin has the following general formula (8) within the same resin skeleton: [Chem 19] (Formula 8) {In formula (8), R 11 is a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, n2 is an integer of 1 to 3, and n3 is 0 to 2 Integer, m1 is an integer from 1 to 500, 2 ≦ (n2 + n3) ≦ 4, when n3 is 2, R 11 may be the same or different, respectively, the repeating unit represented by}, and the following general formula (9): [ Chemical 20] (Formula 9) {In formula (9), R 12 and R 13 are each independently a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, and n4 is an integer of 1 to 3 , N5 is an integer from 0 to 2, n6 is an integer from 0 to 3, m2 is an integer from 1 to 500, 2 ≦ (n4 + n5) ≦ 4, when n5 is 2, R 12 may be the same or different, n6 is In the case of 2 or 3, R 13 may be the same or different, and both of the repeating units represented by}. [35] A method for manufacturing a slit photosensitive layer roll, which uses a slitter to cut the photosensitive layer roll as described in any one of [1] to [34] to manufacture a slit strip photosensitive layer roll. [36] The method of manufacturing a slit photosensitive layer roll as described in [35], wherein the teeth of the slitter are heated. [37] The method for manufacturing a slit photosensitive layer roll as described in [36], wherein the teeth of the slitter are heated to 100 ° C or higher. [38] A method for manufacturing a slit-shaped photosensitive layer roll, comprising the following steps: the photosensitive layer roll as described in any one of [1] to [34] is provided on the photosensitive layer and the support is provided When there is a film on the opposite side of the film, peel the film; cut the photosensitive layer roll without the film using a slitter; fit the peeled film on the cut photosensitive layer roll The film or a film different from the above-mentioned peeled film. [39] The method for manufacturing a slit photosensitive layer roll as described in [38], wherein the teeth of the slitter are heated. [40] The method for manufacturing a slit photosensitive layer roll as described in [39], wherein the teeth of the slitter are heated to above 100 ° C. [Effects of the Invention] According to the present invention, it is possible to provide a photosensitive layer roll that is less likely to cause wrinkles or cracks during cutting and can be cut so that the cross section becomes smooth.

＜第1實施形態：2層感光層捲筒＞本發明之第1實施形態之感光層捲筒係藉由依序積層如下2層而形成，即支持體膜、及包含含有選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種樹脂之感光性樹脂組合物的感光層。於本實施形態中，感光層捲筒不包含覆膜。於支持體膜之單面積層有感光層，且支持體膜之另一面(即，支持體背面或未積層感光層之面)露出，因此支持體膜之兩面與感光層相接。以下，將不包含覆膜且支持體膜之兩面與感光層相接之感光層捲筒作為2層感光層捲筒進行說明。先前之感光層捲筒存在如下問題：由於具備覆膜，故而切割時容易於覆膜產生皺褶，尤其是對切條機之齒進行加熱而切割之情形時，容易於覆膜產生較大之皺褶。為了解決上述問題，第1實施形態之2層感光層捲筒之特徵在於不包含覆膜。＜支持體膜＞作為本實施形態之支持體膜，只要表面平滑則並無特別限定，例如可使用聚對苯二甲酸乙二酯、聚丙烯、聚乙烯、聚酯等聚合物膜，其中，較佳為聚對苯二甲酸乙二酯膜(以下稱為「PET膜」)。就於進行光微影法時將感光層自2層感光層捲筒轉印至基材之觀點而言，支持體膜較佳為對至少一個面實施過脫模處理。本實施形態中之脫模處理係指利用聚矽氧系界面活性劑、聚矽氧樹脂等聚矽氧系化合物、氟系界面活性劑、氟樹脂等含氟化合物、醇酸樹脂等脫模劑對支持體膜之表面較薄地進行塗佈之化學處理、或對支持體膜進行電暈處理等物理處理。將脫模劑塗佈於支持體膜之情形時，較佳為於獲得脫模效果之限度內較薄地進行塗佈。塗佈後，亦可藉由熱或UV處理將脫模劑固定於支持體膜。更較佳為於塗佈脫模劑之前，對支持體膜設置底塗層。＜感光層＞感光層係藉由如下方式形成，即，於支持體膜、較佳為於支持體膜之經脫模處理之面塗佈包含選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種樹脂之感光性樹脂組合物。以下，對感光性樹脂組合物所包含之成分進行說明。[包含酚系樹脂之感光性樹脂組合物][(A)成分：酚系樹脂]一般，酚系樹脂為包含酚系化合物及醛化合物之熱硬化性樹脂。於本實施形態中，就感光層之熱熔融性之觀點而言，酚系樹脂(A)較佳為具有下述通式(1)：[化21](式1){式(1)中，a為1～3之整數，b為0～3之整數，1≦(a＋b)≦4，R1 表示選自由碳數1～20之一價有機基、鹵素原子、硝基及氰基所組成之群中之一價取代基，b為2或3之情形時複數個R1 分別可相同亦可不同，且X表示選自由可具有不飽和鍵之碳數2～10之二價鏈狀脂肪族基、碳數3～20之二價脂環式基、下述通式(2)：[化22](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及具有芳香族環之二價有機基所組成之群中之二價有機基}所表示之結構作為重複單元。具有式(1)所表示之結構之重複單元之酚系樹脂(A)與例如聚醯亞胺樹脂及聚苯并㗁唑樹脂相比，能夠於低溫下硬化，且能夠形成具有良好之伸長率之硬化膜，進而有助於感光層之熱熔融性。熱熔融性優異之感光層於切割時、尤其是對切條機之齒進行加熱而切割時，不易於切斷面產生裂痕，能以截面變得平滑之方式進行切割，因此較佳。於上述通式(1)中，R1 為選自由碳數1～20之一價有機基、鹵素原子、硝基及氰基所組成之群中之一價取代基，就鹼溶解性之觀點而言，較佳為選自由鹵素原子、硝基、氰基、可具有不飽和鍵之碳數1～10之脂肪族基、碳數6～20之芳香族基、及下述通式(10)：[化23]{式(10)中，R14 、R15 及R16 分別獨立地表示氫原子、可具有不飽和鍵之碳數1～10之鏈狀脂肪族基、碳數3～20之脂環式基、或碳數6～20之芳香族基，而且，R17 表示可具有不飽和鍵之碳數1～10之二價鏈狀脂肪族基、碳數3～20之二價脂環式基、或碳數6～20之二價芳香族基}所表示之4種基所組成之群中之一價取代基。於本實施形態中，上述通式(1)中，a為1～3之整數，就鹼溶解性及伸長率之觀點而言較佳為2。於a為2之情形時，羥基彼此之取代位置可為鄰位、間位及對位之任一者。於a為3之情形時，羥基彼此之取代位置為1,2,3-位、1,2,4-位及1,3,5-位等均可。於本實施形態中，上述通式(1)中，b為0～3之整數，就鹼溶解性及伸長率之觀點而言，較佳為0或1。於b為2或3之情形時，複數個R1 可相同亦可不同。進而，於本實施形態中，上述通式(1)中，a及b滿足1≦(a＋b)≦4之關係。於本實施形態中，上述通式(1)中，X為選自由可具有不飽和鍵之碳數2～10之二價鏈狀脂肪族基、碳數3～20之二價脂環式基、上述通式(2)所表示之環氧烷基、及具有芳香族環之二價有機基所組成之群中之二價有機基。該等二價有機基中，就硬化後之膜之強韌性之觀點及熱熔融性之觀點而言，X較佳為選自由下述通式(3)：[化24](式3){式(3)中，R2 、R3 、R4 及R5 分別獨立地為氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，n1為0～4之整數，n1 為1～4之整數之情形時R6 為鹵素原子、羥基、或一價有機基，至少1個R6 為羥基，n1 為2～4之整數之情形時複數個R6 分別可相同亦可不同}所表示之基、及下述通式(4)：[化25](式4){式(4)中，R7 、R8 、R9 及R10 分別獨立地表示氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，且W為選自由單鍵、可經氟原子取代之碳數1～10之鏈狀脂肪族基、可經氟原子取代之碳數3～20之脂環式基、下述通式(2)：[化26](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及下述式(5)：[化27](式5)所表示之二價基所組成之群中之二價有機基}所表示之二價基所組成之群中之有機基。作為式(4)中之W，就硬化膜之伸長率及熱熔融性之觀點而言，較佳為選自由單鍵、上述通式(2)所表示之環氧烷基、以及上述式(5)中之酯基、醯胺基及磺醯基所組成之群中之二價有機基。於本實施形態中，上述通式(1)中，X較佳為上述通式(3)或(4)所表示之二價有機基，而且關於上述通式(4)所表示之二價有機基，就樹脂組合物之圖案形成性良好之觀點、及硬化後之硬化膜之伸長率及熱熔融性之觀點而言，更佳為下述式(6)：[化28](式6)所表示之二價有機基，尤佳為下述式(7)：[化29](式7)所表示之二價有機基。關於通式(1)中之含有酚性羥基之部位與X所表示之部位之比率，尤其就伸長率之觀點而言，通式(1)所表示之結構中之X所表示之部位之比率較佳為20質量%以上，更佳為30質量%以上。就鹼可溶性之觀點而言，上述比率較佳為80質量%以下，更佳為70質量%以下。又，就感光層之熱熔融性及鹼可溶性之觀點而言，酚系樹脂(A)尤佳為於同一樹脂骨架內具有下述通式(8)：[化30](式8){式(8)中，R11 為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n2為1～3之整數，n3為0～2之整數，m1為1～500之整數，2≦(n2＋n3)≦4，n3為2之情形時R11 分別可相同亦可不同}所表示之重複單元、及下述通式(9)：[化31](式9){式(9)中，R12 及R13 分別獨立地為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n4為1～3之整數，n5為0～2之整數，n6為0～3之整數，m2為1～500之整數，2≦(n4＋n5)≦4，n5為2之情形時R12 分別可相同亦可不同，n6為2或3之情形時R13 分別可相同亦可不同}所表示之重複單元之兩者。通式(8)之m1及上述通式(9)之m2表示酚系樹脂(A)之主鏈中各重複單元之總數。即，於酚系樹脂(A)中，通式(8)所表示之結構中之括弧內之重複單元及通式(9)所表示之結構中之括弧內之重複單元可無規、嵌段或以該等之組合進行排列。就鹼溶解性及硬化物之伸長率之觀點而言，m1及m2分別獨立地為1～500之整數，下限值較佳為2，更佳為3，上限值較佳為450，更佳為400，進而較佳為350。就硬化後之膜之強韌性及熱熔融性之觀點而言，m1及m2分別獨立地較佳為2以上，就於鹼水溶液中之溶解性之觀點而言，較佳為450以下。關於在同一樹脂骨架內具有通式(8)所表示之結構及通式(9)所表示之結構之兩者之酚系樹脂(A)，通式(8)所表示之結構之莫耳比率越高，硬化後之膜物性越良好，耐熱性及熱熔融性亦越優異，通式(9)所表示之結構之莫耳比率越高，鹼溶解性越良好，硬化後之圖案形狀越優異。因此，作為通式(8)所表示之結構與通式(9)所表示之結構之比率之範圍，就硬化後之膜物性之觀點而言，較佳為m1 ：m2 ＝90：10～20：80，就硬化後之膜物性、鹼溶解性及熱熔融性之觀點而言，更佳為m1 ：m2 ＝80：20～40：60，就硬化後之膜物性、圖案形狀、鹼溶解性及熱熔融性之觀點而言，尤佳為m1 ：m2 ＝70：30～50：50。酚系樹脂(A)典型而言包含酚系化合物、及共聚合成分、具體而言為選自由具有醛基之化合物(亦包含如三㗁烷般分解而生成醛化合物之化合物)、具有酮基之化合物、分子內具有2個羥甲基之化合物、分子內具有2個烷氧基甲基之化合物、及分子內具有2個鹵烷基之化合物所組成之群中之1種以上之化合物，更典型而言可藉由使該等單體成分進行聚合反應而合成。例如，可使如下所示之酚及/或酚衍生物(以下亦統稱為「酚系化合物」)與醛化合物、酮化合物、羥甲基化合物、烷氧基甲基化合物、二烯化合物、或鹵烷基化合物等共聚合成分進行聚合而獲得酚系樹脂(A)。於該情形時，上述通式(1)中，OH基及任意R1 基鍵結於芳香環之結構所表示之部分來自上述酚系化合物，X所表示之部分來自上述共聚合成分。就反應控制、以及所獲得之酚系樹脂(A)及感光性樹脂組合物之穩定性之觀點而言，酚系化合物與上述共聚合成分之饋入莫耳比(酚系化合物：共聚合成分)較佳為5：1～1.01：1，更佳為2.5：1～1.1：1。於本實施形態中，酚系樹脂(A)之重量平均分子量較佳為700～100,000，更佳為1,500～80,000，進而較佳為2,000～50,000。就硬化膜之伸長率之觀點而言，重量平均分子量較佳為700以上，另一方面，就感光性樹脂組合物之鹼溶解性之觀點而言，重量平均分子量較佳為100,000以下。重量平均分子量可藉由凝膠滲透層析法(GPC)進行測定，並藉由使用標準聚苯乙烯製作之校準曲線算出。於本實施形態中，作為可用以獲得酚系樹脂(A)之酚系化合物，例如可列舉：甲酚、乙基苯酚、丙基苯酚、丁基苯酚、戊基苯酚、環己基苯酚、羥基聯苯、苄基苯酚、硝基苄基苯酚、氰基苄基苯酚、金剛烷苯酚、硝基苯酚、氟苯酚、氯苯酚、溴苯酚、三氟甲基苯酚、N-(羥基苯基)-5-降烯-2,3-二羧醯亞胺、N-(羥基苯基)-5-甲基-5-降烯-2,3-二羧醯亞胺、三氟甲基苯酚、羥基苯甲酸、羥基苯甲酸甲酯、羥基苯甲酸乙酯、羥基苯甲酸苄酯、羥基苯甲醯胺、羥基苯甲醛、羥基苯乙酮、羥基二苯甲酮、羥基苯甲腈、間苯二酚、二甲苯酚、鄰苯二酚、甲基鄰苯二酚、乙基鄰苯二酚、己基鄰苯二酚、苄基鄰苯二酚、硝基苄基鄰苯二酚、甲基間苯二酚、乙基間苯二酚、己基間苯二酚、苄基間苯二酚、硝基苄基間苯二酚、對苯二酚、咖啡酸、二羥基苯甲酸、二羥基苯甲酸甲酯、二羥基苯甲酸乙酯、二羥基苯甲酸丁酯、二羥基苯甲酸丙酯、二羥基苯甲酸苄酯、二羥基苯甲醯胺、二羥基苯甲醛、二羥基苯乙酮、二羥基二苯甲酮、二羥基苯甲腈、N-(二羥基苯基)-5-降烯-2,3-二羧醯亞胺、N-(二羥基苯基)-5-甲基-5-降烯-2,3-二羧醯亞胺、硝基鄰苯二酚、氟鄰苯二酚、氯鄰苯二酚、溴鄰苯二酚、三氟甲基鄰苯二酚、硝基間苯二酚、氟間苯二酚、氯間苯二酚、溴間苯二酚、三氟甲基間苯二酚、鄰苯三酚、間苯三酚、1,2,4-三羥基苯、三羥基苯甲酸、三羥基苯甲酸甲酯、三羥基苯甲酸乙酯、三羥基苯甲酸丁酯、三羥基苯甲酸丙酯、三羥基苯甲酸苄酯、三羥基苯甲醯胺、三羥基苯甲醛、三羥基苯乙酮、三羥基二苯甲酮、三羥基苯甲腈等。作為上述醛化合物，例如可列舉：乙醛、丙醛、新戊醛、丁醛、戊醛、己醛、三㗁烷、乙二醛、環己基醛、二苯基乙醛、乙基丁醛、苯甲醛、乙醛酸、5-降烯-2-羧基醛、丙二醛、丁二醛、戊二醛、水楊醛、萘甲醛、對苯二甲醛等。作為上述酮化合物，例如可列舉：丙酮、甲基乙基酮、二乙基酮、二丙基酮、二環己基酮、二苄基酮、環戊酮、環己酮、二環己酮、環己烷二酮、3-丁炔-2-酮、2-降酮、金剛酮、2,2-雙(4-氧雜環己基)丙烷等。作為上述羥甲基化合物，例如可列舉：2,6-雙(羥甲基)-對甲酚、2,6-雙(羥甲基)-4-乙基苯酚、2,6-雙(羥甲基)-4-丙基苯酚、2,6-雙(羥甲基)-4-正丁基苯酚、2,6-雙(羥甲基)-4-第三丁基苯酚、2,6-雙(羥甲基)-4-甲氧基苯酚、2,6-雙(羥甲基)-4-乙氧基苯酚、2,6-雙(羥甲基)-4-丙氧基苯酚、2,6-雙(羥甲基)-4-正丁氧基苯酚、2,6-雙(羥甲基)-4-第三丁氧基苯酚、1,3-雙(羥甲基)脲、核糖醇、阿拉伯糖醇、阿洛醇、2,2-雙(羥甲基)丁酸、2-苄氧基-1,3-丙二醇、2,2-二甲基-1,3-丙二醇、2,2-二乙基-1,3-丙二醇、單醋酸甘油酯、2-甲基-2-硝基-1,3-丙二醇、5-降烯-2,2-二甲醇、5-降烯-2,3-二甲醇、季戊四醇、2-苯基-1,3-丙二醇、三羥甲基乙烷、三羥甲基丙烷、3,6-雙(羥甲基)均四甲苯、2-硝基-對苯二甲醇、1,10-二羥基癸烷、1,12-二羥基十二烷、1,4-雙(羥甲基)環己烷、1,4-雙(羥甲基)環己烯、1,6-雙(羥甲基)金剛烷、1,4-苯二甲醇、1,3-苯二甲醇、2,6-雙(羥甲基)-1,4-二甲氧基苯、2,3-雙(羥甲基)萘、2,6-雙(羥甲基)萘、1,8-雙(羥甲基)蒽、2,2'-雙(羥甲基)二苯醚、4,4'-雙(羥甲基)二苯醚、4,4'-雙(羥甲基)二苯硫醚、4,4'-雙(羥甲基)二苯甲酮、4-羥甲基苯甲酸-4'-羥甲基苯基、4-羥甲基苯甲酸-4'-羥甲基醯苯胺、4,4'-雙(羥甲基)苯基脲、4,4'-雙(羥甲基)苯基胺甲酸乙酯、1,8-雙(羥甲基)蒽、4,4'-雙(羥甲基)聯苯、2,2'-二甲基-4,4'-雙(羥甲基)聯苯、2,2-雙(4-羥甲基苯基)丙烷、乙二醇、二乙二醇、三乙二醇、四乙二醇、丙二醇、二丙二醇、三丙二醇、四丙二醇等。作為上述烷氧基甲基化合物，例如可列舉：2,6-雙(甲氧基甲基)-對甲酚、2,6-雙(甲氧基甲基)-4-乙基苯酚、2,6-雙(甲氧基甲基)-4-丙基苯酚、2,6-雙(甲氧基甲基)-4-正丁基苯酚、2,6-雙(甲氧基甲基)-4-第三丁基苯酚、2,6-雙(甲氧基甲基)-4-甲氧基苯酚、2,6-雙(甲氧基甲基)-4-乙氧基苯酚、2,6-雙(甲氧基甲基)-4-丙氧基苯酚、2,6-雙(甲氧基甲基)-4-正丁氧基苯酚、2,6-雙(甲氧基甲基)-4-第三丁氧基苯酚、1,3-雙(甲氧基甲基)脲、2,2-雙(甲氧基甲基)丁酸、2,2-雙(甲氧基甲基)-5-降烯、2,3-雙(甲氧基甲基)-5-降烯、1,4-雙(甲氧基甲基)環己烷、1,4-雙(甲氧基甲基)環己烯、1,6-雙(甲氧基甲基)金剛烷、1,4-雙(甲氧基甲基)苯、1,3-雙(甲氧基甲基)苯、2,6-雙(甲氧基甲基)-1,4-二甲氧基苯、2,3-雙(甲氧基甲基)萘、2,6-雙(甲氧基甲基)萘、1,8-雙(甲氧基甲基)蒽、2,2'-雙(甲氧基甲基)二苯醚、4,4'-雙(甲氧基甲基)二苯醚、4,4'-雙(甲氧基甲基)二苯硫醚、4,4'-雙(甲氧基甲基)二苯甲酮、4-甲氧基甲基苯甲酸-4'-甲氧基甲基苯酯、4-甲氧基甲基苯甲酸-4'-甲氧基甲基醯苯胺、4,4'-雙(甲氧基甲基)苯基脲、4,4'-雙(甲氧基甲基)苯基胺甲酸乙酯、1,8-雙(甲氧基甲基)蒽、4,4'-雙(甲氧基甲基)聯苯、2,2'-二甲基-4,4'-雙(甲氧基甲基)聯苯、2,2-雙(4-甲氧基甲基苯基)丙烷、乙二醇二甲醚、二乙二醇二甲醚、三乙二醇二甲醚、四乙二醇二甲醚、丙二醇二甲醚、二丙二醇二甲醚、三丙二醇二甲醚、四丙二醇二甲醚等。作為上述二烯化合物，例如可列舉：丁二烯、戊二烯、己二烯、庚二烯、辛二烯、3-甲基-1,3-丁二烯、1,3-丁二醇-二甲基丙烯酸酯、2,4-己二烯-1-醇、甲基環己二烯、環戊二烯、環己二烯、環庚二烯、環辛二烯、二環戊二烯、1-羥基二環戊二烯、1-甲基環戊二烯、甲基二環戊二烯、二烯丙醚、二烯丙硫醚、己二酸二烯丙酯、2,5-降二烯、四氫茚、5-亞乙基-2-降烯、5-乙烯基-2-降烯、三聚氰酸三烯丙酯、異三聚氰酸二烯丙酯、異三聚氰酸三烯丙酯、異三聚氰酸二烯丙基丙酯等。作為上述鹵烷基化合物，例如可列舉：二氯二甲苯、二氯甲基二甲氧基苯、二氯甲基均四甲苯、二氯甲基聯苯、二氯甲基-聯苯羧酸、二氯甲基-聯苯二羧酸、二氯甲基-甲基聯苯、二氯甲基-二甲基聯苯、二氯甲基蒽、乙二醇雙(氯乙基)醚、二乙二醇雙(氯乙基)醚、三乙二醇雙(氯乙基)醚、四乙二醇雙(氯乙基)醚等。藉由利用脫水、脫鹵化氫、或脫醇使上述酚系化合物及共聚合成分縮合、或者一面使不飽和鍵斷鍵一面使其等聚合，可獲得酚系樹脂(A)。於酚系化合物與共聚合成分之聚合時，亦可使用觸媒。作為酸性觸媒，例如可列舉：鹽酸、硫酸、硝酸、磷酸、亞磷酸、甲磺酸、對甲苯磺酸、二甲基硫酸、二乙基硫酸、乙酸、草酸、1-羥基亞乙基-1,1'-二膦酸、乙酸鋅、三氟化硼、三氟化硼-苯酚錯合物、三氟化硼-醚錯合物等。作為鹼性觸媒，例如可列舉：氫氧化鋰、氫氧化鈉、氫氧化鉀、氫氧化鈣、氫氧化鋇、碳酸鈉、三乙胺、吡啶、4-N,N-二甲胺基吡啶、哌啶、哌、1,4-二氮雜雙環[2.2.2]辛烷、1,8-二氮雜雙環[5.4.0]-7-十一烯、1,5-二氮雜雙環[4.3.0]-5-壬烯、氨、六亞甲基四胺等。於本實施形態中，為了獲得酚系樹脂(A)而使用之觸媒之量較佳為相對於共聚合成分之合計莫耳數、較佳為醛化合物、酮化合物、羥甲基化合物、烷氧基甲基化合物、二烯化合物及鹵烷基化合物之合計莫耳數100莫耳%為0.01莫耳%～100莫耳%之範圍。於進行酚系樹脂(A)之合成反應時，可視需要使用有機溶劑。可使用之有機溶劑之具體例並無限定，可列舉：雙(2-甲氧基乙基)醚、甲基溶纖劑、乙基溶纖劑、丙二醇單甲醚、丙二醇單甲醚乙酸酯、二乙二醇二甲醚、二丙二醇二甲醚、環己酮、環戊酮、甲苯、二甲苯、γ-丁內酯、N-甲基-2-吡咯啶酮等。將饋入原料之總質量設為100質量份時，該等有機溶劑之使用量通常為10質量份～1000質量份，較佳為20質量份～500質量份。又，於酚系樹脂(A)之合成反應中，反應溫度較佳為40℃～250℃，更佳為100℃～200℃之範圍，而且，反應時間較佳為大致1小時～10小時。再者，酚系樹脂(A)亦可為於不損及本發明之效果之範圍內例如以成為酚系樹脂(A)之原料之酚系化合物總莫耳數之30%以下進而使用並非上述通式(1)之結構之原料之酚系化合物進行聚合而成者。於本實施形態中，上述通式(1)中，a為1之情形時，為了提高鹼溶解性，可見選自由酚醛清漆樹脂及多羥基苯乙烯樹脂所組成之群中之酚系樹脂(以下亦稱為酚系樹脂(A'))與酚系樹脂(A)混合。酚系樹脂(A)與酚系樹脂(A')之混合比以質量比計較佳為(A)/(A')＝10/90～90/10之範圍。就於鹼水溶液中之溶解性、及硬化膜之伸長率之觀點而言，該混合比較佳為(A)/(A')＝10/90～90/10，更佳為(A)/(A')＝20/80～80/20，進而較佳為(A)/(A')＝30/70～70/30。上述酚醛清漆樹脂可藉由使酚類與甲醛於酸性觸媒之存在下進行縮合而獲得。作為上述酚類，例如可列舉：苯酚、鄰甲酚、間甲酚、對甲酚、鄰乙基苯酚、間乙基苯酚、對乙基苯酚、鄰丁基苯酚、間丁基苯酚、對丁基苯酚、2,3-二甲苯酚、2,4-二甲苯酚、2,5-二甲苯酚、2,6-二甲苯酚、3,4-二甲苯酚、3,5-二甲苯酚、2,3,5-三甲基苯酚、3,4,5-三甲基苯酚、鄰苯二酚、間苯二酚、鄰苯三酚、α-萘酚、β-萘酚等。作為具體之酚醛清漆樹脂，例如可列舉：苯酚/甲醛縮合酚醛清漆樹脂、甲酚/甲醛縮合酚醛清漆樹脂、苯酚-萘酚/甲醛縮合酚醛清漆樹脂等。作為上述多羥基苯乙烯樹脂，較佳為聚對乙烯基苯酚。聚對乙烯基苯酚只要為含有對乙烯基苯酚作為聚合單元之聚合物，則並無特別限定。可構成聚對乙烯基苯酚之除對乙烯基苯酚以外之聚合單元只要不違反本發明之目的，則可為能夠與對乙烯基苯酚進行共聚合之任意化合物。能夠與對乙烯基苯酚進行共聚合之化合物例如可列舉：丙烯酸甲酯、甲基丙烯酸甲酯、丙烯酸羥基乙酯、甲基丙烯酸丁酯、丙烯酸辛酯、甲基丙烯酸2-乙氧基乙酯、丙烯酸第三丁酯、1,5-戊二醇二丙烯酸酯、丙烯酸N,N-二乙胺基乙酯、乙二醇二丙烯酸酯、1,3-丙二醇二丙烯酸酯、癸二醇二丙烯酸酯、癸二醇二甲基丙烯酸酯、1,4-環己烷二醇二丙烯酸酯、2,2-二羥甲基丙烷二丙烯酸酯、丙三醇二丙烯酸酯、三丙二醇二丙烯酸酯、丙三醇三丙烯酸酯、2,2-二(對羥基苯基)-丙烷二甲基丙烯酸酯、三乙二醇二丙烯酸酯、聚氧乙基-2-2-二(對羥基苯基)-丙烷二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、聚氧丙基三羥甲基丙烷三丙烯酸酯、乙二醇二甲基丙烯酸酯、丁二醇二甲基丙烯酸酯、1,3-丙二醇二甲基丙烯酸酯、丁二醇二甲基丙烯酸酯、1,3-丙二醇二甲基丙烯酸酯、1,2,4-丁三醇三甲基丙烯酸酯、2,2,4-三甲基-1,3-戊二醇二甲基丙烯酸酯、季戊四醇三甲基丙烯酸酯、1-苯乙烯-1,2-二甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、1,5-戊二醇二甲基丙烯酸酯及1,4-苯二醇二甲基丙烯酸酯等丙烯酸之酯；苯乙烯、以及例如2-甲基苯乙烯及乙烯基甲苯等取代苯乙烯；丙烯酸乙烯酯及甲基丙烯酸乙烯酯等乙烯酯；鄰乙烯基苯酚及間乙烯基苯酚等除對乙烯基苯酚以外之乙烯基苯酚等單體，但並不限定於該等。酚系樹脂(A')(即，選自由酚醛清漆樹脂及多羥基苯乙烯樹脂所組成之群中之酚系樹脂)之重量平均分子量較佳為700～100,000，更佳為1,500～80,000，進而較佳為2,000～50,000。就硬化膜之伸長率之觀點而言，重量平均分子量較佳為700以上，另一方面，就感光性樹脂組合物之鹼溶解性之觀點而言，較佳為100,000以下。再者，選自由酚醛清漆樹脂及多羥基苯乙烯樹脂所組成之群中之酚系樹脂可單獨使用1種，亦可將2種以上混合而使用。[光酸產生劑(B)]於本實施形態中，感光性樹脂組合物係可感應紫外線、電子束、X射線等所代表之活性光線(即放射線)而形成樹脂圖案之組合物。感光性樹脂組合物可為負型(即未照射部藉由顯影而溶出者)或正型(即照射部藉由顯影而溶出者)之任一者。於本實施形態中，將感光性樹脂組合物作為負型感光性樹脂組合物使用之情形時，光酸產生劑(B)受到放射線照射而產生酸，所產生之酸引起上述酚系樹脂(A)與交聯劑之交聯反應，藉此放射線照射部不溶於顯影液。作為可使用於負型之光酸產生劑(B)，例如可列舉以下化合物：(i)三氯甲基-s-三類三(2,4,6-三氯甲基)-s-三、2-苯基-雙(4,6-三氯甲基)-s-三、2-(3-氯苯基)-雙(4,6-三氯甲基)-s-三、2-(2-氯苯基)-雙(4,6-三氯甲基)-s-三、2-(4-甲氧基苯基)-雙(4,6-三氯甲基)-s-三、2-(3-甲氧基苯基)-雙(4,6-三氯甲基)-s-三、2-(2-甲氧基苯基)-雙(4,6-三氯甲基)-s-三、2-(4-甲硫基苯基)-雙(4,6-三氯甲基)-s-三、2-(3-甲硫基苯基)雙(4,6-三氯甲基-s-三、2-(2-甲硫基苯基)-雙(4,6-三氯甲基)-s-三、2-(4-甲氧基萘基)-雙(4,6-三氯甲基)-s-三、2-(3-甲氧基萘基)-雙(4,6-三氯甲基)-s-三、2-(2-甲氧基萘基)-雙(4,6-三氯甲基)-s-三、2-(3,4,5-三甲氧基-β-苯乙烯基)-雙(4,6-三氯甲基)-s-三、2-(4-甲硫基-β-苯乙烯基)-雙(4,6-三氯甲基)-s-三、2-(3-甲硫基-β-苯乙烯基)-雙(4,6-三氯甲基)-s-三、2-(2-甲硫基-β-苯乙烯基)-雙(4,6-三氯甲基)-s-三等；(ii)二芳基錪鹽類二苯基錪四氟硼酸鹽、二苯基錪四氟磷酸鹽、二苯基錪四氟砷酸鹽、二苯基錪三氟甲磺酸鹽、二苯基錪三氟乙酸鹽、二苯基錪-對甲苯磺酸鹽、4-甲氧基苯基苯基錪四氟硼酸鹽、4-甲氧基苯基苯基錪六氟膦酸鹽、4-甲氧基苯基苯基錪六氟砷酸鹽、4-甲氧基苯基苯基錪三氟甲磺酸鹽、4-甲氧基苯基苯基錪三氟乙酸鹽、4-甲氧基苯基苯基錪-對甲苯磺酸鹽、雙(4-第三丁基苯基)錪四氟硼酸鹽、雙(4-第三丁基苯基)錪六氟砷酸鹽、雙(4-第三丁基苯基)錪三氟甲磺酸鹽、雙(4-第三丁基苯基)錪三氟乙酸鹽、雙(4-第三丁基苯基)錪-對甲苯磺酸鹽等；(iii)三芳基鋶鹽類三苯基鋶四氟硼酸鹽、三苯基鋶六氟膦酸鹽、三苯基鋶六氟砷酸鹽、三苯基鋶甲磺酸鹽、三苯基鋶三氟乙酸鹽、三苯基鋶-對甲苯磺酸鹽、4-甲氧基苯基二苯基鋶四氟硼酸鹽、4-甲氧基苯基二苯基鋶六氟膦酸鹽、4-甲氧基苯基二苯基鋶六氟砷酸鹽、4-甲氧基苯基二苯基鋶甲磺酸鹽、4-甲氧基苯基二苯基鋶三氟乙酸鹽、4-甲氧基苯基二苯基鋶-對甲苯磺酸鹽、4-苯硫基苯基二苯基四氟硼酸鹽、4-苯硫基苯基二苯基六氟膦酸鹽、4-苯硫基苯基二苯基六氟砷酸鹽、4-苯硫基苯基二苯基三氟甲磺酸鹽、4-苯硫基苯基二苯基三氟乙酸鹽、4-苯硫基苯基二苯基-對甲苯磺酸鹽等。該等化合物中，作為三氯甲基-s-三類，較佳為2-(3-氯苯基)-雙(4,6-三氯甲基)-s-三、2-(4-氯苯基)-雙(4,6-三氯甲基)-s-三、2-(4-甲硫基苯基)-雙(4,6-三氯甲基)-s-三、2-(4-甲氧基-β-苯乙烯基)-雙(4,6-三氯甲基)-s-三、2-(4-甲氧基萘基)-雙(4,6-三氯甲基)-s-三等。作為二芳基錪鹽類，較佳為二苯基錪三氟乙酸鹽、二苯基錪三氟甲磺酸鹽、4-甲氧基苯基苯基錪三氟甲磺酸鹽、4-甲氧基苯基苯基錪三氟乙酸鹽等。作為三芳基鋶鹽類，較佳為三苯基鋶甲磺酸鹽、三苯基鋶三氟乙酸鹽、4-甲氧基苯基二苯基鋶甲磺酸鹽、4-甲氧基苯基二苯基鋶三氟乙酸鹽、4-苯硫基苯基二苯基三氟甲磺酸鹽、4-苯硫基苯基二苯基三氟乙酸鹽等。此外，亦可使用以下所示之化合物作為光酸產生劑(B)。(1)重氮酮化合物作為重氮酮化合物，例如可列舉：1,3-二酮-2-重氮化合物、重氮苯醌化合物、重氮萘醌化合物等。作為具體例，可列舉酚類之1,2-萘醌二疊氮-4-磺酸酯化合物。(2)碸化合物作為碸化合物，例如可列舉：β-酮基碸化合物、β-磺醯基碸化合物及該等化合物之α-重氮化合物。作為具體例，可列舉：4-三苯甲醯甲基碸、基苯甲醯甲基碸、雙(苯甲醯甲基磺醯基)甲烷等。(3)磺酸化合物作為磺酸化合物，例如可列舉：磺酸烷基酯類、磺酸鹵烷基酯類、磺酸芳基酯類、亞胺基磺酸酯類等。作為磺酸化合物之較佳之具體例，可列舉：安息香甲苯磺酸酯、鄰苯三酚三(三氟甲磺酸酯)、三氟甲磺酸鄰硝基苄酯、對甲苯磺酸鄰硝基苄酯等。(4)磺醯亞胺化合物作為磺醯亞胺化合物，例如可列舉：N-(三氟甲基磺醯氧基)丁二醯亞胺、N-(三氟甲基磺醯氧基)鄰苯二甲醯亞胺、N-(三氟甲基磺醯氧基)二苯基順丁烯二醯亞胺、N-(三氟甲基磺醯氧基)雙環[2.2.1]庚-5-烯-2,3-二羧醯亞胺、N-(三氟甲基磺醯氧基)萘醯亞胺等。(5)肟酯化合物作為肟酯化合物，具體而言，可列舉：2-[2-(4-甲基苯基磺醯氧基亞胺基)]-2,3-二氫噻吩-3-亞基]-2-(2-甲基苯基)乙腈(Ciba Specialty Chemicals公司商品名「Irgacure PAG121」)、[2-(丙基磺醯氧基亞胺基)-2,3-二氫噻吩-3-亞基]-2-(2-甲基苯基)乙腈(Ciba Specialty Chemicals公司商品名「Irgacure PAG103」)、[2-(正辛烷磺醯氧基亞胺基)-2,3-二氫噻吩-3-亞基]-2-(2-甲基苯基)乙腈(Ciba Specialty Chemicals公司商品名「Irgacure PAG108」)、α-(正辛烷磺醯氧基亞胺基)-4-甲氧基苯乙腈(Ciba Specialty Chemicals公司商品名「CGI725」)等。(6)重氮甲烷化合物作為重氮甲烷化合物，具體而言，可列舉：雙(三氟甲基磺醯基)重氮甲烷、雙(環己基磺醯基)重氮甲烷、雙(苯基磺醯基)重氮甲烷等。就感度之觀點而言，尤佳為上述(5)肟酯化合物。於本實施形態中，於感光性樹脂組合物為負型之情形時，光酸產生劑(B)相對於酚系樹脂(A)100質量份之調配量較佳為0.1～50質量份，更佳為1～40質量份。若該調配量為0.1質量份以上，則可良好地獲得感度之提昇效果，若該調配量為50質量份以下，則硬化膜之機械物性良好。於本實施形態中，感光性樹脂組合物亦可作為正型之感光性樹脂組合物使用。於該情形時，使用上述(i)～(iii)、以及(1)～(6)所示之光酸產生劑及/或醌二疊氮化合物。其中，就硬化後之物性之觀點而言，較佳為醌二疊氮化合物。其原因在於：醌二疊氮化合物於硬化時進行熱分解，殘留於硬化後之膜中之量極少。因此，正型之光酸產生劑(B)較佳為醌二疊氮化合物。作為醌二疊氮化合物，可列舉具有1,2-苯醌二疊氮結構或1,2-萘醌二疊氮結構(以下，亦將具有後者之結構之化合物稱為「NQD化合物」)之化合物。該等化合物例如記述於美國專利第2,772,972號說明書、美國專利第2,797,213號說明書、美國專利第3,669,658號說明書等。該NQD化合物為選自由以下詳細敍述之具有複數個酚性羥基之化合物(以下亦稱為「多羥基化合物」)之1,2-萘醌二疊氮-4-磺酸酯、及該多羥基化合物之1,2-萘醌二疊氮-5-磺酸酯所組成之群中之至少一種化合物。NQD化合物係藉由如下方式獲得：根據常規方法，利用氯磺酸或亞硫醯氯等將萘醌二疊氮磺酸轉化為磺醯氯，並使所獲得之萘醌二疊氮磺醯氯與多羥基化合物進行縮合反應。例如，可藉由如下方式獲得：使多羥基化合物與特定量之1,2-萘醌二疊氮-5-磺醯氯或1,2-萘醌二疊氮-4-磺醯氯於二㗁烷、丙酮、或四氫呋喃等溶劑中，在三乙胺等鹼性觸媒之存在下反應而進行酯化，將所獲得之產物進行水洗並使之乾燥。就感度及伸長率等硬化膜物性之觀點而言，作為較佳之NQD化合物之例，可列舉下述通式群：[化32]{式中，Q為氫原子、或下述式群：[化33]之任一者所表示之萘醌二疊氮磺酸酯基，但所有Q不會同時為氫原子}所表示者。又，作為NQD化合物，亦可使用同一分子中具有4-萘醌二疊氮磺醯基及5-萘醌二疊氮磺醯基之萘醌二疊氮磺醯酯化合物，或者亦可將4-萘醌二疊氮磺醯酯化合物及5-萘醌二疊氮磺醯酯化合物混合而使用。上述NQD化合物可單獨使用，亦可將2種以上混合而使用。於本實施形態中，感光性樹脂組合物為正型之情形時，光酸產生劑(B)之使用量相對於本組合物之酚系樹脂(A)100質量份較佳為0.1～70質量份，更佳為1～40質量份，進而較佳為5～30質量份。若該使用量為0.1質量份以上，則獲得良好之感度，若為70質量份以下，則硬化膜之機械物性良好。[溶劑(C)]作為溶劑(C)，可列舉：醯胺類、亞碸類、脲類、酮類、酯類、內酯類、醚類、鹵化烴類、烴類等，例如可使用：N-甲基-2-吡咯啶酮、N,N-甲基乙醯胺、N,N-二甲基甲醯胺、二甲基亞碸、四甲基脲、丙酮、甲基乙基酮、甲基異丁基酮、環戊酮、環己酮、乙酸甲酯、乙酸乙酯、乙酸丁酯、草酸二乙酯、乳酸乙酯、乳酸甲酯、乳酸丁酯、γ-丁內酯、丙二醇單甲醚乙酸酯、丙二醇單甲醚、苄醇、苯乙二醇、四氫呋喃甲醇、第三丁醇、乙二醇二甲醚、二乙二醇二甲醚、四氫呋喃、嗎啉、二氯甲烷、1,2-二氯乙烷、1,4-二氯丁烷、氯苯、鄰二氯苯、苯甲醚、己烷、庚烷、苯、甲苯、二甲苯、均三甲苯等。其中，就樹脂之溶解性、樹脂組合物之穩定性、對基板之接著性、熱熔融性、保存穩定性、及黏連性之觀點而言，較佳為γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮、二甲基亞碸、丙二醇單甲醚、第三丁醇及四氫呋喃甲醇，其中，尤佳為γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮、及二甲基亞碸。[聚矽氧型界面活性劑(D)]所謂聚矽氧型界面活性劑係指分子內具有矽氧烷鍵及矽-碳鍵之界面活性劑。例如可列舉：二甲基矽氧烷伸乙氧基接枝化合物、二甲基矽氧烷伸丙氧基接枝化合物、(羥基伸乙氧基丙基)甲基矽氧烷-二甲基矽氧烷化合物等。作為聚矽氧型界面活性劑之具體例，可列舉：有機矽氧烷聚合物KF-640、642、643、KP341、X-70-092、X-70-093(以上為商品名，信越化學工業公司製造)；SH-28PA、SH-190、SH-193、SZ-6032、SF-8428、DC-57、DC-190(以上為商品名，Dow Corning Toray公司製造)；SILWET L-77、L-7001、FZ-2105、FZ-2120、FZ-2154、FZ-2164、FZ-2166、L-7604(以上為商品名，Nippon Unicar公司製造)；DBE-814、DBE-224、DBE-621、CMS-626、CMS-222、KF-352A、KF-354L、KF-355A、KF-6020、DBE-821、DBE-712(Gelest)、BYK-307、BYK-310、BYK-378、BYK-333(以上為商品名，BYK-Chemie Japan製造)；Glanol(商品名，共榮社化學公司製造)等。該等之中，就組合物清漆之塗佈性之觀點而言，較佳為二甲基矽氧烷伸乙氧基接枝化合物、及二甲基矽氧烷伸丙氧基接枝化合物。該等聚矽氧型界面活性劑可單獨使用1種或者將2種以上組合而使用。就組合物清漆對支持體之塗佈性之觀點而言，聚矽氧型界面活性劑(D)之使用量相對於酚系樹脂(A)100質量份較佳為0.01～30質量份，更佳為0.02～10質量份。若聚矽氧型界面活性劑(D)之使用量為30質量份以下，則可抑制顯影時之殘渣及圖案隆起。[其他成分]於本實施形態之感光性樹脂組合物中，能夠視需要含有交聯劑(E)、熱酸產生劑、矽烷偶合劑、染料、溶解促進劑等。交聯劑(E)係如下化合物，其於對使用本實施形態之感光性樹脂組合物形成之凸紋圖案進行加熱硬化時，可與酚系樹脂(A)進行交聯，或者交聯劑自身形成交聯網狀結構。交聯劑(E)只要為能夠進行熱交聯之化合物，則並無限定。一般，交聯劑可進一步提高分子內具有2個交聯基且包含感光性樹脂組合物之硬化膜之熱特性、機械特性、及耐化學品性。作為交聯劑(E)，例如可列舉作為含有羥甲基及/或烷氧基甲基之化合物之Cymel(註冊商標)300、301、303、370、325、327、701、266、267、238、1141、272、202、1156、1158、1123、1170、1174、UFR65、300、Micoat 102、105(以上為Mitsui Cytec 公司製造)；NIKALAC(註冊商標)MX-270、-280、-290、NIKALAC MS-11、NIKALAC MW-30、-100、-300、-390、-750(以上為Sanwa Chemical公司製造)；DML-OCHP、DML-MBPC、DML-BPC、DML-PEP、DML-34X、DML-PSBP、DML-PTBP、DMLPCHP、DML-POP、DML-PFP、DML-MBOC、BisCMP-F、DML-BisOC-Z、DML-BisOCHP-Z、DML-BisOC-P、DMOM-PTBT、TMOM-BP、TMOM-BPA、TML-BPAF-MF(以上為本州化學工業公司製造)；苯二甲醇、雙(羥甲基)甲酚、雙(羥甲基)二甲氧基苯、雙(羥甲基)二苯醚、雙(羥甲基)二苯甲酮、羥甲基苯甲酸羥甲基苯酯、雙(羥甲基)聯苯、二甲基雙(羥甲基)聯苯、雙(甲氧基甲基)苯、雙(甲氧基甲基)甲酚、雙(甲氧基甲基)二甲氧基苯、雙(甲氧基甲基)二苯醚、雙(甲氧基甲基)二苯甲酮、甲氧基甲基苯甲酸甲氧基甲基苯酯、雙(甲氧基甲基)聯苯、二甲基雙(甲氧基甲基)聯苯等。又，作為交聯劑(E)，可列舉作為環氧乙烷化合物之苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、雙酚型環氧樹脂、三酚型環氧樹脂、四酚型環氧樹脂、酚-苯二甲基型環氧樹脂、萘酚-苯二甲基型環氧樹脂、酚-萘酚型環氧樹脂、酚-二環戊二烯型環氧樹脂、脂環式環氧樹脂、脂肪族環氧樹脂、二乙二醇二縮水甘油醚、山梨醇聚縮水甘油醚、丙二醇二縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、1,1,2,2-四(對羥基苯基)乙烷四縮水甘油醚、丙三醇三縮水甘油醚、鄰第二丁基苯基縮水甘油醚、1,6-雙(2,3-環氧丙氧基)萘、二丙三醇聚縮水甘油醚、聚乙二醇縮水甘油醚；YDB-340、YDB-412、YDF-2001、YDF-2004(以上為商品名，新日鐵化學股份有限公司製造)；NC-3000-H、EPPN-501H、EOCN-1020、NC-7000L、EPPN-201L、XD-1000、EOCN-4600(以上為商品名，日本化薬股份有限公司製造)；Epikote(註冊商標)1001、Epikote1007、Epikote1009、Epikote5050、Epikote5051、Epikote1031S、Epikote180S65、Epikote157H70、YX-315-75(以上為商品名，Japan Epoxy Resins股份有限公司製造)；EHPE3150、PLACCEL G402、PUE101、PUE105(以上為商品名，Daicel Chemical industries股份有限公司製造)；EPICLON(註冊商標)830、850、1050、N-680、N-690、N-695、N-770、HP-7200、HP-820、EXA-4850-1000(以上為商品名，DIC公司製造)；DENACOL(註冊商標)EX-201、EX-251、EX-203、EX-313、EX-314、EX-321、EX-411、EX-511、EX-512、EX-612、EX-614、EX-614B、EX-711、EX-731、EX-810、EX-911、EM-150(以上為商品名，Nagase chemteX公司製造)；Epolight(註冊商標)70P、Epolight100MF(以上為商品名，共榮社化學製造)等。又，作為交聯劑(E)，可列舉作為含異氰酸基化合物之4,4'-二苯基甲烷二異氰酸酯、甲苯二異氰酸酯、1,3-伸苯基二亞甲基二異氰酸酯、二環己基甲烷-4,4'-二異氰酸酯、異佛爾酮二異氰酸酯、六亞甲基二異氰酸酯；Takenate(註冊商標)500、600；Cosmonat(註冊商標)NBDI、ND(以上為商品名，三井化學公司製造)；Duranate(註冊商標)17B-60PX、TPA-B80E、MF-B60X、MF-K60X、E402-B80T(以上為商品名，旭化成化學公司製造)等。又，作為交聯劑(E)，可列舉作為雙順丁烯二醯亞胺化合物之4,4'-二苯基甲烷雙順丁烯二醯亞胺、苯基甲烷順丁烯二醯亞胺、間伸苯基雙順丁烯二醯亞胺、雙酚A二苯醚雙順丁烯二醯亞胺、3,3'-二甲基-5,5'-二乙基-4,4'-二苯基甲烷雙順丁烯二醯亞胺、4-甲基-1,3-伸苯基雙順丁烯二醯亞胺、1,6'-雙順丁烯二醯亞胺-(2,2,4-三甲基)己烷、4,4'-二苯醚雙順丁烯二醯亞胺、4,4'-二苯基碸雙順丁烯二醯亞胺、1,3-雙(3-順丁烯二醯亞胺苯氧基)苯、1,3-雙(4-順丁烯二醯亞胺苯氧基)苯；BMI-1000、BMI-1100、BMI-2000、BMI-2300、BMI-3000、BMI-4000、BMI-5100、BMI-7000、BMI-TMH、BMI-6000、BMI-8000(以上為商品名，大和化成工業股份有限公司製造)等。作為使用交聯劑(E)之情形時之調配量，相對於酚系樹脂(A)100質量份較佳為0.1～40質量份，更佳為1～30質量份。若該調配量為0.1質量份以上，則熱硬化膜之熱物性及機械強度良好，若為40質量份以下，則組合物之清漆狀態下之穩定性及熱硬化膜之伸長率良好。就即便於降低硬化溫度之情形時，亦表現良好之硬化物之熱物性及機械物性之觀點而言，熱酸產生劑較佳為調配至樹脂組合物。作為熱酸產生劑，只要為藉由熱產生酸之化合物，則並無限定，例如可列舉：氯乙酸烯丙酯、氯乙酸正丁酯、氯乙酸第三丁酯、氯乙酸乙酯、氯乙酸甲酯、氯乙酸苄酯、氯乙酸異丙酯、氯乙酸2-甲氧基乙酯、二氯乙酸甲酯、三氯乙酸甲酯、三氯乙酸乙酯、三氯乙酸2-乙氧基乙酯、氰基乙酸第三丁酯、甲基丙烯酸第三丁酯、三氟乙酸乙酯、三氟乙酸甲酯、三氟乙酸苯酯、三氟乙酸乙烯酯、三氟乙酸異丙酯、三氟乙酸烯丙酯、苯甲酸乙酯、苯甲酸甲酯、苯甲酸第三丁酯、2-氯苯甲酸甲酯、2-氯苯甲酸乙酯、4-氯苯甲酸乙酯、2,5-二氯苯甲酸乙酯、2,4-二氯苯甲酸甲酯、對氟苯甲酸乙酯、對氟苯甲酸甲酯、五氯苯基羧酸第三丁酯、五氟丙酸甲酯、五氟丙酸乙酯、丁烯酸第三丁酯等羧酸酯類；酚酞、瑞香草酚酞等環狀羧酸酯類；甲磺酸乙酯、甲磺酸甲酯、甲磺酸2-甲氧基乙酯、甲磺酸2-異丙氧基乙酯、對甲苯磺酸苯酯、對甲苯磺酸乙酯、對甲苯磺酸甲酯、對甲苯磺酸2-苯基乙酯、對甲苯磺酸正丙酯、對甲苯磺酸正丁酯、對甲苯磺酸第三丁酯、對甲苯磺酸正己酯、對甲苯磺酸正庚酯、對甲苯磺酸正辛酯、對甲苯磺酸2-甲氧基乙酯、對甲苯磺酸炔丙酯、對甲苯磺酸3-丁炔酯、三氟甲磺酸乙酯、三氟甲磺酸正丁酯、全氟丁烷磺酸乙酯、全氟丁烷磺酸甲酯、苄基(4-羥基苯基)甲基鋶六氟銻酸酯、苄基(4-羥基苯基)甲基鋶六氟磷酸酯、三甲基鋶甲基硫酸酯、三-對鋶三氟甲磺酸酯、三甲基鋶三氟甲磺酸酯、吡啶鎓-對甲苯磺酸酯、全氟辛烷磺酸乙酯等磺酸酯類；1,4-丁烷磺內酯、2,4-丁烷磺內酯、1,3-丙烷磺內酯、酚紅、溴酚綠、溴酚紫等環狀磺酸酯類；2-磺基苯甲酸酐、對甲苯磺酸酐、鄰苯二甲酸酐等芳香族羧酸酐等。作為使用熱酸產生劑之情形時之調配量，相對於(A)酚系樹脂100質量份較佳為0.1～30質量份，更佳為0.5～10質量份，進而較佳為1～5質量份。若調配量為0.1質量份以上，則保持熱硬化後之圖案形狀之效果良好，另一方面，若調配量為30質量份以下，則不會對微影法性能產生不良影響，且組合物之穩定性良好。作為矽烷偶合劑，例如可列舉：3-巰丙基三甲氧基矽烷(信越化學工業股份有限公司製造：商品名KBM803、Chisso股份有限公司製造：商品名Sila-Ace S810)、3-巰丙基三乙氧基矽烷(AZmax股份有限公司製造：商品名 SIM6475.0)、3-巰丙基甲基二甲氧基矽烷(信越化學工業股份有限公司製造：商品名LS1375，AZmax股份有限公司製造：商品名SIM6474.0)、巰基甲基三甲氧基矽烷(AZmax股份有限公司製造：商品名SIM6473.5C)、巰基甲基甲基二甲氧基矽烷(AZmax股份有限公司製造：商品名SIM6473.0)、3-巰丙基二乙氧基甲氧基矽烷、3-巰丙基二乙氧基二甲氧基矽烷、3-巰丙基三丙氧基矽烷、3-巰丙基二乙氧基丙氧基矽烷、3-巰丙基二乙氧基二丙氧基矽烷、3-巰丙基二甲氧基丙氧基矽烷、3-巰丙基甲氧基二丙氧基矽烷、2-巰基乙基三甲氧基矽烷、2-巰基乙基二乙氧基甲氧基矽烷、2-巰基乙基二乙氧基二甲氧基矽烷、2-巰基乙基三丙氧基矽烷、2-巰基乙基三丙氧基矽烷、2-巰基乙基二乙氧基二丙氧基矽烷、2-巰基乙基二甲氧基丙氧基矽烷、2-巰基乙基甲氧基二丙氧基矽烷、4-巰基丁基三甲氧基矽烷、4-巰基丁基三乙氧基矽烷、4-巰基丁基三丙氧基矽烷、N-(3-三乙氧基矽烷基丙基)脲(信越化學工業股份有限公司製造：商品名LS3610，AZmax股份有限公司製造：商品名SIU9055.0)、N-(3-三甲氧基矽烷基丙基)脲(AZmax股份有限公司製造：商品名SIU9058.0)、N-(3-二乙氧基甲氧基矽烷基丙基)脲、N-(3-二乙氧基二甲氧基矽烷基丙基)脲、N-(3-三丙氧基矽烷基丙基)脲、N-(3-二乙氧基丙氧基矽烷基丙基)脲、N-(3-二乙氧基二丙氧基矽烷基丙基)脲、N-(3-二甲氧基丙氧基矽烷基丙基)脲、N-(3-甲氧基二丙氧基矽烷基丙基)脲、N-(3-三甲氧基矽烷基乙基)脲、N-(3-二乙氧基二甲氧基矽烷基乙基)脲、N-(3-三丙氧基矽烷基乙基)脲、N-(3-三丙氧基矽烷基乙基)脲、N-(3-二乙氧基二丙氧基矽烷基乙基)脲、N-(3-二甲氧基丙氧基矽烷基乙基)脲、N-(3-甲氧基二丙氧基矽烷基乙基)脲、N-(3-三甲氧基矽烷基丁基)脲、N-(3-三乙氧基矽烷基丁基)脲、N-(3-三丙氧基矽烷基丁基)脲、3-(間胺基苯氧基)丙基三甲氧基矽烷(AZmax股份有限公司製造：商品名SLA0598.0)、間胺基苯基三甲氧基矽烷(AZmax股份有限公司製造：商品名SLA0599.0)、對胺基苯基三甲氧基矽烷(AZmax股份有限公司製造：商品名SLA0599.1)胺基苯基三甲氧基矽烷(AZmax股份有限公司製造：商品名SLA0599.2)、2-(三甲氧基矽烷基乙基)吡啶(AZmax股份有限公司製造：商品名SIT8396.0)、2-(三乙氧基矽烷基乙基)吡啶、2-(二甲氧基矽烷基甲基乙基)吡啶、2-(二乙氧基矽烷基甲基乙基)吡啶、(3-三乙氧基矽烷基丙基)-第三丁基胺基甲酸酯、(3-縮水甘油氧基丙基)三乙氧基矽烷、四甲氧基矽烷、四二乙氧基矽烷、四-正丙氧基矽烷、四-異丙氧基矽烷、四-正丁氧基矽烷、四-異丁氧基矽烷、四-第三丁氧基矽烷、四(甲氧基二乙氧基矽烷)、四(甲氧基-正丙氧基矽烷)、四(二乙氧基二乙氧基矽烷)、四(甲氧基二乙氧基二乙氧基矽烷)、雙(三甲氧基矽烷基)乙烷、雙(三甲氧基矽烷基)己烷、雙(三乙氧基矽烷基)甲烷、雙(三乙氧基矽烷基)乙烷、雙(三乙氧基矽烷基)乙烯、雙(三乙氧基矽烷基)辛烷、雙(三乙氧基矽烷基)辛二烯、雙[3-(三乙氧基矽烷基)丙基]二硫醚、雙[3-(三乙氧基矽烷基)丙基]四硫醚、二-第三丁氧基二乙醯氧基矽烷、二異丁氧基鋁氧基三乙氧基矽烷、雙(戊二酸)鈦-O,O'-雙(氧基乙基)-胺基丙基三乙氧基矽烷、苯基矽烷三醇、甲基苯基矽烷二醇、乙基苯基矽烷二醇、正丙基苯基矽烷二醇、異丙基苯基矽烷二醇、正丁基二苯基矽烷二醇、異丁基苯基矽烷二醇、第三丁基苯基矽烷二醇、二苯基矽烷二醇、二甲氧基二苯基矽烷、二乙氧基二苯基矽烷、二甲氧基二-對甲苯基矽烷、乙基甲基苯基矽烷醇、正丙基甲基苯基矽烷醇、異丙基甲基苯基矽烷醇、正丁基甲基苯基矽烷醇、異丁基甲基苯基矽烷醇、第三丁基甲基苯基矽烷醇、乙基正丙基苯基矽烷醇、乙基異丙基苯基矽烷醇、正丁基乙基苯基矽烷醇、異丁基乙基苯基矽烷醇、第三丁基乙基苯基矽烷醇、甲基二苯基矽烷醇、乙基二苯基矽烷醇、正丙基二苯基矽烷醇、異丙基二苯基矽烷醇、正丁基二苯基矽烷醇、異丁基二苯基矽烷醇、第三丁基二苯基矽烷醇、三苯基矽烷醇等。該等可單獨使用，亦可將複數種組合而使用。作為矽烷偶合劑，上述矽烷偶合劑中，就保存穩定性之觀點而言，較佳為苯基矽烷三醇、三甲氧基苯基矽烷、三甲氧基(對甲苯基)矽烷、二苯基矽烷二醇、二甲氧基二苯基矽烷、二乙氧基二苯基矽烷、二甲氧基二-對甲苯基矽烷、三苯基矽烷醇、及下述式：[化34]所表示之化合物。作為使用矽烷偶合劑之情形時之調配量，相對於酚系樹脂(A)100質量份較佳為0.01～20質量份。作為染料，例如可列舉：甲基紫、結晶紫、孔雀綠等。作為染料之調配量，相對於酚系樹脂(A)100質量份較佳為0.1～30質量份。作為溶解促進劑，較佳為具有羥基或羧基之化合物。作為具有羥基之化合物之例，可列舉：對上述萘醌二疊氮化合物所使用之壓載劑、以及對異丙苯基苯酚、雙酚類、間苯二酚類、及MtrisPC、MtetraPC等直鏈狀酚系化合物、TrisP-HAP、TrisP-PHBA、TrisP-PA等非直鏈狀酚系化合物(均為本州化學工業公司製造)、二苯基甲烷之2～5個之苯酚取代物、3,3-二苯基丙烷之1～5個之苯酚取代物、使2,2-雙-(3-胺基-4-羥基苯基)六氟丙烷與5-降烯-2,3-二羧酸酐以莫耳比1：2進行反應而獲得之化合物、使雙-(3-胺基-4-羥基苯基)碸與1,2-環己基二羧酸酐以莫耳比1：2進行反應而獲得之化合物、N-羥基丁二醯亞胺、N-羥基鄰苯二甲醯亞胺、N-羥基5-降烯-2,3-二羧醯亞胺等。作為具有羧基之化合物之例，可列舉：3-苯基乳酸、4-羥基苯基乳酸、4-羥基苦杏仁酸、3,4-二羥基苦杏仁酸、4-羥基-3-甲氧基苦杏仁酸、2-甲氧基-2-(1-萘基)丙酸、苦杏仁酸、2-苯基乳酸、α-甲氧基苯基乙酸、O-乙醯基苦杏仁酸、伊康酸等。作為使用溶解促進劑之情形時之調配量，相對於(A)酚系樹脂100質量份較佳為0.1～30質量份。[包含聚醯亞胺前驅物及/或鹼可溶性聚醯亞胺之感光性樹脂組合物] (A)聚醯亞胺前驅物 作為用於聚醯亞胺前驅物組合物之感光性樹脂，可列舉聚醯胺、聚醯胺酸酯等。例如，作為聚醯胺酸酯，可使用包含下述通式(11)： [化35]{式(11)中，R1 及R2 分別獨立地為氫原子、碳數1～30之飽和脂肪族基、芳香族基、具有碳-碳不飽和雙鍵之一價有機基、或具有碳-碳不飽和雙鍵之一價離子，X1 為四價有機基，Y1 為二價有機基，m為1以上之整數，而且m較佳為2以上，更佳為5以上} 所表示之重複單元之聚醯胺酸酯。 上述通式(11)之R1 及R2 以一價陽離子之形式存在時，O帶負電荷(即，以-O- 之形式存在)。又，X1 及Y1 亦可含有羥基。 通式(11)中之R1 及R2 は，更佳為於下述通式(12)： [化36]{通式(12)中，R3 、R4 及R5 分別獨立地為氫原子或碳數1～5之有機基，而且m1 為1～20之整數} 所表示之一價有機基、或下述通式(13)： [化37]{通式(13)中，R6 、R7 及R8 分別獨立地為氫原子或碳數1～5之有機基，而且m2 為1～20之整數} 所表示之一價有機基之末端具有銨離子之結構。 亦可將複數種通式(11)所表示之聚醯胺酸酯進行混合。又，亦可使用使通式(11)所表示之聚醯胺酸酯彼此進行共聚合而成之聚醯胺酸酯。 式(11)中之X1 就熱熔融性之觀點而言較佳為包含芳香族基之四價有機基。具體而言，X1 較佳為包含下述通式(2)～(4)： [化38][化39][化40]{式(4)中，R9 為氧原子、硫原子、二價有機基之任一者} 所表示之至少一種結構之四價有機基。 通式(4)中之R9 例如為碳數1～40之二價有機基或鹵素原子。R9 亦可包含羥基。 就熱熔融性之觀點而言，X1 尤佳為包含下述通式(5)： [化41]所表示之結構之四價有機基。 就層間絕緣膜與密封材之密接性之觀點而言，式(11)中之Y1 較佳為包含芳香族基之二價有機基。具體而言，Y1 較佳為包含下述通式(6)～(8)： [化42]{式(6)中，R10 、R11 、R12 及R13 為氫原子、碳數1～5之一價脂肪族基，可相同亦可不同} [化43]{式(7)中，R14 ～R21 為氫原子、鹵素原子、碳數1～5之一價有機基，可相互不同，亦可相同} [化44]{式(8)中，R22 為二價基，R23 ～R30 為氫原子、鹵素原子、碳數1～5之一價脂肪族基，可相同亦可不同) 所表示之至少一種結構之二價有機基。 通式(8)中之R22 例如為碳數1～40之二價有機基或鹵素原子。 就熱熔融性之觀點而言，作為Y1 ，尤佳為包含下述通式(9)： [化45]所表示之結構之二價有機基。 於上述聚醯胺酸酯中，其重複單元中之X1 來自作為原料使用之四羧酸二酐，Y1 來自作為原料使用之二胺。 作為原料使用之四羧酸二酐並無限定，例如可列舉：均苯四甲酸二酐、二苯醚-3,3',4,4'-四羧酸二酐、二苯甲酮-3,3',4,4'-四羧酸二酐、聯苯-3,3',4,4'-四羧酸二酐、二苯基碸-3,3',4,4'-四羧酸二酐、二苯基甲烷-3,3',4,4'-四羧酸二酐、2,2-雙(3,4-鄰苯二甲酸酐)丙烷、2,2-雙(3,4-鄰苯二甲酸酐)-1,1,1,3,3,3-六氟丙烷等。又，該等可單獨使用，亦可將2種以上混合而使用。 作為原料使用之二胺例如可列舉：對伸苯基二胺、間伸苯基二胺、4,4'-二胺基二苯醚、3,4'-二胺基二苯醚、3,3'-二胺基二苯醚、4,4'-二胺基二苯硫醚、3,4'-二胺基二苯硫醚、3,3'-二胺基二苯硫醚、4,4'-二胺基二苯基碸、3,4'-二胺基二苯基碸、3,3'-二胺基二苯基碸、4,4'-二胺基聯苯、3,4'-二胺基聯苯、3,3'-二胺基聯苯、4,4'-二胺基二苯甲酮、3,4'-二胺基二苯甲酮、3,3'-二胺基二苯甲酮、4,4'-二胺基二苯甲烷、3,4'-二胺基二苯甲烷、3,3'-二胺基二苯甲烷、1,4-雙(4-胺基苯氧基)苯、1,3-雙(4-胺基苯氧基)苯、1,3-雙(3-胺基苯氧基)苯、雙[4-(4-胺基苯氧基)苯基]碸、雙[4-(3-胺基苯氧基)苯基]碸、4,4-雙(4-胺基苯氧基)聯苯、4,4-雙(3-胺基苯氧基)聯苯、雙[4-(4-胺基苯氧基)苯基]醚、雙[4-(3-胺基苯氧基)苯基]醚、1,4-雙(4-胺基苯基)苯、1,3-雙(4-胺基苯基)苯、9，10-雙(4-胺基苯基)蒽、2,2-雙(4-胺基苯基)丙烷、2,2-雙(4-胺基苯基)六氟丙烷、2,2-雙[4-(4-胺基苯氧基)苯基)丙烷、2,2-雙[4-(4-胺基苯氧基)苯基)六氟丙烷、1,4-雙(3-胺基丙基二甲基矽烷基)苯、鄰聯甲苯胺碸、9,9-雙(4-胺基苯基)茀等。亦可為該等苯環上之氫原子之一部分被取代而成者。又，該等可單獨使用，亦可將2種以上混合而使用。 於聚醯胺酸酯(A)之合成中，通常可較佳地使用如下方法，即，將進行下述四羧酸二酐之酯化反應所獲得之四羧酸二酯直接用於與二胺之縮合反應。 上述四羧酸二酐之酯化反應所使用之醇類為具有烯烴性雙鍵之醇，具體而言，可列舉：甲基丙烯酸2-羥基乙酯、2-甲基丙烯醯氧基乙醇、甘油二丙烯酸酯、甘油二甲基丙烯酸酯等，但並不限定於該等。該等醇類可單獨使用或將2種以上混合而使用。 關於本實施形態所使用之聚醯胺酸酯(A)之具體之合成方法，可採用先前公知之方法。關於合成方法，例如可列舉國際公開第00/43439號說明書所示之方法。即，將四羧酸二酯一次性轉化成四羧酸二酯二醯氯化物，並將該四羧酸二酯二醯氯化物及二胺於鹼性化合物之存在下用於縮合反應，從而製造聚醯胺酸酯(A)。又，作為合成方法，可列舉藉由將四羧酸二酯及二胺於有機脫水劑之存在下用於縮合反應之方法而製造聚醯胺酸酯(A)之方法。 作為有機脫水劑之例，可列舉：二環己基碳二醯亞胺(DCC)、二乙基碳二醯亞胺、二異丙基碳二醯亞胺、乙基環己基碳二醯亞胺、二苯基碳二醯亞胺、1-乙基-3-(3-二甲胺基丙基)碳二醯亞胺、1-環己基-3-(3-二甲胺基丙基)碳二醯亞胺鹽酸鹽等。 本實施形態所使用之聚醯胺酸酯(A)之重量平均分子量較佳為6,000～150,000，更佳為7,000～50,000，更佳為7,000～20,000。 (B1)光起始劑 於負型感光性樹脂之情形時，對樹脂組合物添加光起始劑。作為光起始劑，例如可使用：二苯甲酮、鄰苯甲醯苯甲酸甲酯、4-苯甲醯基-4'-甲基二苯基酮、二苄基酮、及茀酮等二苯甲酮衍生物；2,2'-二乙氧基苯乙酮、及2-羥基-2-甲基苯丙酮等苯乙酮衍生物；1-羥基環己基苯基酮、9-氧硫、2-甲基9-氧硫、2-異丙基9-氧硫、及二乙基9-氧硫等9-氧硫衍生物；苯偶醯、苯偶醯二甲基縮酮、苯偶醯-β-甲氧基乙基縮醛等苯偶醯衍生物；安息香甲醚等安息香衍生物；2,6-二(4'-二疊氮苯亞甲基)-4-甲基環己酮、及2,6'-二(4'-二疊氮苯亞甲基)環己酮等疊氮類；1-苯基-1,2-丁二酮-2-(O-甲氧基羰基)肟、1-苯基丙烷二酮-2-(O-甲氧基羰基)肟、1-苯基丙烷二酮-2-(O-二乙氧基羰基)肟、1-苯基丙烷二酮-2-(O-苯甲醯基)肟、1,3-二苯基丙烷三酮-2-(O-二乙氧基羰基)肟、1-苯基-3-二乙氧基丙烷三酮-2-(O-苯甲醯基)肟等肟類；N-苯基甘胺酸等N-芳基甘胺酸類；過氧化苯甲醯等過氧化物類；芳香族聯咪唑類；以及二茂鈦類等。該等之中，就光感度之方面而言較佳為上述肟類。 光起始劑之添加量較佳為相對於聚醯胺酸酯(A)100質量份為1～40質量份，更佳為2～20質量份。藉由相對於聚醯胺酸酯(A)100質量份添加1質量份以上之光起始劑，光感度優異。又，藉由添加40質量份以下之光起始劑，厚膜硬化性優異。 (B2)光酸產生劑 於正型感光性樹脂之情形時，對樹脂組合物添加光酸產生劑。藉由樹脂組合物含有光酸產生劑，於紫外線曝光部產生酸，曝光部於鹼水溶液中之溶解性增大。藉此，可將樹脂作為正型感光性樹脂組合物使用。 作為光酸產生劑，例如可列舉：醌二疊氮化合物、鋶鹽、鏻鹽、重氮鎓鹽、錪鹽等。其中，就表現優異之溶解抑止效果且獲得高感度之正型感光性樹脂組合物之觀點而言，較佳為使用醌二疊氮化合物。又，亦可含有2種以上之光酸產生劑。 (C)溶劑(C)溶劑與上述項目[包含酚系樹脂之感光性樹脂組合物]中所說明之溶劑相同。較佳之溶劑之種類及量亦與上述項目[包含酚系樹脂之感光性樹脂組合物]中所說明之種類及量相同。 ＜聚醯亞胺＞ 由上述聚醯亞胺前驅物組合物所形成之硬化凸紋圖案之結構係由下述通式(1)： [化46]{式(1)中，X1 、Y1 、及m可與上述通式(11)中定義之X1 、Y1 、及m相同，例如，X1 為四價有機基，Y1 為二價有機基，m為1以上之整數} 所表示。 根據與對通式(11)所說明之理由相同之理由，通式(11)中之較佳之X1 、Y1 、及m於通式(1)所表示之聚醯亞胺中亦較佳。 於鹼可溶性聚醯亞胺之情形時，亦可將聚醯亞胺之末端取代為羥基。 [包含聚苯并㗁唑前驅物之感光性樹脂組合物] (A)聚苯并㗁唑前驅物 作為用於聚苯并㗁唑前驅物組合物之感光性樹脂，可使用包含下述通式(14)： [化47]{式(14)中，U及V分別獨立地為二價有機基} 所表示之重複單元之聚(鄰羥基醯胺)。 就熱熔融性之觀點而言，式(14)中之U較佳為碳數1～30之二價有機基，更佳為碳數1～15之鏈狀伸烷基(其中，鏈狀伸烷基之氫原子亦可被鹵素原子所取代)，尤佳為碳數1～8且氫原子之一部分或全部被氟原子所取代之鏈狀伸烷基。 又，就熱熔融性之觀點而言，式(14)中之V較佳為包含芳香族基之二價有機基，更佳為包含下述通式(6)～(8)： [化48]{式(6)中，R10 、R11 、R12 及R13 為氫原子、碳數1～5之一價脂肪族基，可相同亦可不同} [化49]{式(7)中，R14 ～R21 為氫原子、鹵素原子、碳數1～5之一價有機基，可相互不同，亦可相同} [化50]{式(8)中，R22 為二價基，R23 ～R30 為氫原子、鹵素原子、碳數1～5之一價脂肪族基，可相同亦可不同} 所表示之至少一種結構之二價有機基。 通式(8)中之R22 例如為碳數1～40之二價有機基或鹵素原子。 就熱熔融性之觀點而言，V尤佳為包含下述通式(9)： [化51]所表示之結構之二價有機基。 就熱熔融性之觀點而言，V較佳為碳數1～40之二價有機基，更佳為碳數1～40之二價鏈狀脂肪族基，尤佳為碳數1～20之二價鏈狀脂肪族基。 聚苯并㗁唑前驅物一般可由二羧酸衍生物與含羥基二胺類合成。具體而言，將二羧酸衍生物轉化成二鹵化物衍生物之後，進行與二胺類之反應，藉此可合成聚苯并㗁唑前驅物。作為二鹵化物衍生物，較佳為二氯化物衍生物。 二氯化物衍生物可藉由使鹵化劑作用於二羧酸衍生物而合成。作為鹵化劑，可使用通常之羧酸之醯氯化反應所使用之亞硫醯氯、磷醯氯、氧氯化磷、五氯化磷等。 作為合成二氯化物衍生物之方法，有使二羧酸衍生物及上述鹵化劑於溶劑中進行反應之方法、於過剩之鹵化劑中進行反應後將過剩成分蒸餾去除之方法等。 作為二羧酸衍生物所使用之二羧酸，例如可列舉：間苯二甲酸、對苯二甲酸、2,2-雙(4-羧基苯基)-1,1,1,3,3,3-六氟丙烷、4,4'-二羧基聯苯、4,4'-二羧基二苯醚、4,4'-二羧基四苯基矽烷、雙(4-羧基苯基)碸、2,2-雙(對羧基苯基)丙烷、5-第三丁基間苯二甲酸、5-溴間苯二甲酸、5-氟間苯二甲酸、5-氯間苯二甲酸、2,6-萘二羧酸、丙二酸、二甲基丙二酸、乙基丙二酸、異丙基丙二酸、二-正丁基丙二酸、琥珀酸、四氟琥珀酸、甲基琥珀酸、2,2-二甲基琥珀酸、2,3-二甲基琥珀酸、二甲基甲基琥珀酸、戊二酸、六氟戊二酸、2-甲基戊二酸、3-甲基戊二酸、2,2-二甲基戊二酸、3,3-二甲基戊二酸、3-乙基-3-甲基戊二酸、己二酸、八氟己二酸、3-甲基己二酸、八氟己二酸、辛二酸、2,2,6,6-四甲基辛二酸、辛二酸、十二氟辛二酸、壬二酸、癸二酸、十六氟癸二酸、1,9-壬二酸、十二烷二酸、十三烷二酸、十四烷二酸、十五烷二酸、十六烷二酸、十七烷二酸、十八烷二酸、十九烷二酸、二十烷二酸、二十一烷二酸、二十二烷二酸、二十三烷二酸、二十四烷二酸、二十五烷二酸、二十六烷二酸、二十七烷二酸、二十八烷二酸、二十九烷二酸、三十烷二酸、三十一烷二酸、三十二烷二酸、二甘醇酸等。亦可將該等混合而使用。 作為含羥基二胺，例如可列舉：3,3'-二胺基-4,4'-二羥基聯苯、4,4'-二胺基-3,3'-二羥基聯苯、雙(3-胺基-4-羥基苯基)丙烷、雙(4-胺基-3-羥基苯基)丙烷、雙(3-胺基-4-羥基苯基)碸、雙(4-胺基-3-羥基苯基)碸、2,2-雙(3-胺基-4-羥基苯基)-1,1,1,3,3,3-六氟丙烷、2,2-雙(4-胺基-3-羥基苯基)-1,1,1,3,3,3-六氟丙烷等。亦可將該等混合而使用。 (B2)光酸產生劑 光酸產生劑具有使光照射部之鹼水溶液可溶性增大之功能。作為光酸產生劑，例如可列舉：重氮萘醌化合物、芳基重氮鎓鹽、二芳基錪鹽、三芳基鋶鹽等。其中，重氮萘醌化合物之感度較高而較佳。 (C)溶劑(C)溶劑與上述項目[包含酚系樹脂之感光性樹脂組合物]中所說明之溶劑相同。較佳之溶劑之種類及量亦與上述項目[包含酚系樹脂之感光性樹脂組合物]中所說明之種類及量相同。 ＜聚苯并㗁唑＞ 由上述聚苯并㗁唑前驅物組合物形成之硬化凸紋圖案之結構係由下述通式(10)： [化52]{式(10)中，U及V與上述通式(14)中所定義之U及V相同} 所表示。根據與對通式(14)所說明之理由相同之理由，通式(14)中之較佳之U及V於通式(10)之聚苯并㗁唑中亦較佳。 第1實施形態之感光性樹脂組合物可包含選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種，就熱熔融性之觀點而已，較佳為包含酚系樹脂。＜第2實施形態：低熔融黏度感光層捲筒＞本發明之第2實施形態之感光層捲筒具有：支持體膜；及感光層，其包含設置於上述支持體膜上之感光性樹脂組合物；上述感光性樹脂組合物包含選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種樹脂，且上述感光層為具有熔融黏度成為500 Pa・s以下之溫度點之層。先前之感光層捲筒由於感光層之熔融黏度較高，故而存在即便於切割時加熱切條機之齒而進行切割之情形時，亦容易產生裂痕的問題。為了解決上述課題，第2實施形態之感光層捲筒之特徵在於：感光層為具有熔融黏度成為500 Pa・s以下之溫度點之層。本實施形態之感光層為具有熔融黏度成為500 Pa・s以下之溫度點之層。感光層較佳為具有熔融黏度成為450 Pa・s以下之溫度點之層，較佳為具有成為400 Pa・s以下之溫度點之層，較佳為具有成為350 Pa・s以下之溫度點之層，較佳為具有成為300 Pa・s以下之溫度點之層，較佳為具有成為250 Pa・s以下之溫度點之層，較佳為具有成為200 Pa・s以下之溫度點之層。藉由降低感光層之熔融黏度，於進行切割、尤其是加熱切條機之齒而進行切割之情形時，能夠抑制裂痕之產生。本實施形態之感光層於100℃下之熔融黏度較佳為500 Pa・s以下，較佳為450 Pa・s以下，較佳為400 Pa・s以下，較佳為350 Pa・s以下，較佳為300 Pa・s以下，較佳為250 Pa・s以下，較佳為200 Pa・s以下，較佳為150 Pa・s以下，較佳為100 Pa・s以下。第2實施形態之感光層捲筒亦可於感光層之與設置有上述支持體膜一側相反之側具有覆膜。若具備覆膜，則於進行切割時、尤其是加熱切條機之齒而進行切割之情形時，有產生皺褶之可能性，因此較佳為不提供覆膜，或者使用軟化溫度較高之覆膜。覆膜之軟化點溫度較佳為90℃以上，較佳為100℃以上，較佳為110℃以上，較佳為120℃以上，較佳為130℃以上。覆膜之材質只要滿足上述軟化點溫度，則並無特別限定。感光層之熔融黏度能夠利用感光層中所包含之有機溶劑之種類及/或量進行調整。其詳情記載於下文中。其他方面與上述項目＜第1實施形態：2層感光層捲筒＞中所說明之構成相同。＜感光層捲筒之製作及使用＞對本實施形態之感光性膜之製作方法進行說明。感光層可藉由將上述感光性樹脂組合物以液狀感光性樹脂組合物之形式塗佈於支持體膜上而形成。作為塗佈之方法，例如可列舉：輥式塗佈機、缺角輪塗佈機、凹版塗佈機、氣刀塗佈機、模嘴塗佈機、棒式塗佈機等方法。又，溶劑(C)之去除例如可藉由加熱進行。就感光層中之有機溶劑之殘量之觀點而言，去除有機溶劑時，加熱溫度較佳為約70～150℃，更佳為100～140℃，且/或加熱時間較佳為約1分鐘～30分鐘，更佳為約3分鐘～20分鐘，進而較佳為約4分鐘～10分鐘。又，感光層之厚度根據用途而不同，將溶劑去除後之厚度較佳為1～30 μm左右。感光性膜亦可於支持體膜與感光層之間進而具備緩衝層、接著層、光吸收層、阻氣層等中間層或覆膜。感光性膜例如可捲取至具有圓筒狀等形態之捲芯製成感光層捲筒而以捲筒狀之形態儲存。作為捲芯，只要為先前所使用者，則並無特別限定，作為其材料，例如可列舉：聚乙烯樹脂、聚丙烯樹脂、聚苯乙烯樹脂、聚氯乙烯樹脂、ABS樹脂(acrylonitrile-butadiene-styrene，丙烯腈-丁二烯-苯乙烯共聚物)等塑膠等。儲存時，較佳為以支持體膜成為最外側之方式進行捲取。又，於捲取成捲筒狀之感光性膜(感光性膜捲筒)之端面，就端面保護之觀點而言，較佳為設置端面分隔件，而且，就耐邊緣融合之觀點而言，較佳為設置防濕端面分隔件。又，於將感光性膜或感光層捲筒捆包時，較佳為包裹至透濕性較小之薄銅板(black sheet)而進行包裝。＜感光層捲筒之切割＞藉由利用切條機將所製作之感光層捲筒切割成所需寬度，可製造切條感光層捲筒。就於切條機之切斷面抑制皺褶或裂痕之觀點而言，較佳為對切條機之齒進行加熱。切條機之齒之加熱溫度可為80℃以上，可為90℃以上，可為100℃以上，可為110℃以上，可為120℃以上，可為130℃以上。於感光層捲筒具備覆膜之情形時，有切割時於覆膜產生皺褶之可能性，尤其於加熱切條機之齒而進行切割之情形時，有於覆膜產生較大皺褶之可能性。就抑制切割時產生之覆膜之皺褶之觀點而言，切條感光層捲筒之製造方法較佳為包含以下步驟：於上述感光層捲筒於上述感光層之與設置有上述支持體膜一側相反之側具有覆膜之情形時，將上述覆膜剝離；利用切條機切割不具有上述覆膜之上述感光層捲筒；及於上述經切割之上述感光層捲筒貼合上述剝離之覆膜或與上述剝離之覆膜不同之覆膜。＜感光層對基材之積層＞作為將切條感光層捲筒之感光層積層至基材上之方法，可列舉一面將感光層加熱至70～130℃左右一面於0.1～1 MPa左右(即，1～10 kgf/cm2 左右)之壓力下使用貼合機等壓接至基材之方法等。積層步驟亦可於減壓下進行。積層感光層之基材之表面並無特別限制。於第1實施形態之2層感光層捲筒之情形時，由於不具有覆膜，故而有感光層貼附至支持體膜之虞(黏連之虞)。另一方面，若降低感光層之黏著性，則有將感光層積層至基材上時不密接之虞。即，第1實施形態之2層感光層捲筒較理想為於保管狀態即室溫下黏著性較低，且於積層至基材上時之加熱時表現出較高之密接性。就同時實現室溫下之黏著性及容易因熱而熔融之感光性膜之形成之觀點而言，感光層中之殘留有機溶劑量相對於感光層之總量較佳為0.1質量%以上且15質量%以下，較佳為0.3質量%以上且15質量%以下，較佳為0.5質量%以上且15質量%以下，較佳為0.8質量%以上且15質量%以下，較佳為1質量%以上且15質量%以下，較佳為3質量%以上且14質量%以下，較佳為3質量%以上且13質量%以下，更佳為5質量%以上且13質量%以下。若感光層中之殘留有機溶劑量為上述範圍，則於室溫下黏著性較低，製作感光層捲筒時感光層貼附至支持體膜之情況較少，且對感光層進行加熱而積層至基材上時顯示較高之熔融性，表現出較高之密接性。殘留於感光層中之有機溶劑可為上文所說明之溶劑(C)，就樹脂之溶解性、樹脂組合物之穩定性、對基板之接著性、熱熔融性、保存穩定性、及黏連性之觀點而言，較佳為γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮、二甲基亞碸、丙二醇單甲醚、第三丁醇及四氫呋喃甲醇，其中，尤佳為γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮、二甲基亞碸。於第2實施形態之低熔融黏度感光層捲筒之情形同樣期望於室溫時具有較高之熔融黏度，感光層之黏著性較低，於進行切割、尤其是加熱切條機之齒而進行切割之情形時，因較低之熔融黏度而不易產生裂痕。較佳之感光層中之殘留有機溶劑量與上述範圍相同。感光層之熔融黏度能夠利用感光層中所包含之有機溶劑之量進行調整。感光層中所包含之有機溶劑之量越多，感光層之熔融黏度越低。感光層中之有機溶劑之量可藉由調整用以將有機溶劑去除之加熱溫度及/或加熱時間而加以控制。此外，亦可利用降低聚合物分子量之方法、增加不會熱硬化之塑化劑等低分子成分之方法等調整感光層之熔融黏度。對於以此方式積層於基材上之感光層，通過負型或正型遮罩圖案呈圖像狀地照射活性光線而形成曝光部。此時，於存在於感光層上之支持體相對於活性光線透明之情形時，可通過支持體照射活性光線，於支持體對活性光線顯示遮光性之情形時，將支持體去除後對感光層照射活性光線。作為活性光線之光源，可使用X射線、電子束、紫外線、可見光線等，較佳為200～500 nm之波長者。就圖案之解像度及操作性之方面而言，光源波長較佳為水銀燈之g線、h線或i線之區域，可單獨使用亦可將2種以上之光化射線混合。作為曝光裝置，較佳為對準機、平行曝光機、鏡面投影曝光機、及步進式曝光機。曝光後，亦可視需要再次以80～140℃對塗膜進行加熱。其次，可使用顯影液並自浸漬法、覆液法、噴霧法等方法中選擇而進行顯影。可藉由顯影，自經塗佈之感光性樹脂層中將曝光部(正型之情形)或未曝光部(負型之情形)溶出去除，而獲得凸紋圖案。作為顯影液，例如可使用氫氧化鈉、碳酸鈉、矽酸鈉、氨水等無機鹼類、乙胺、二乙胺、三乙胺、三乙醇胺等有機胺類、四甲基氫氧化銨、四丁基氫氧化銨等四級銨鹽類等之水溶液、及視需要適量添加甲醇、乙醇等水溶性有機溶劑、或界面活性劑而成之水溶液。該等之中，較佳為四甲基氫氧化銨水溶液。四甲基氫氧化銨之濃度較佳為0.5～10質量%，更佳為1～5質量%。顯影後，藉由沖洗液進行洗淨，並將顯影液去除，藉此可獲得形成有凸紋圖案之基板。作為沖洗液，例如可使用蒸餾水、甲醇、乙醇、異丙醇等，可單獨使用該等或將2種以上組合而使用。最後，藉由對以此方式獲得之凸紋圖案進行加熱，可獲得硬化凸紋圖案。加熱溫度較佳為150℃以上且300℃以下，更佳為250℃以下。使用第1或第2實施形態之感光層捲筒之硬化凸紋圖案之製造方法可較佳地利用於半導體裝置、顯示體裝置及發光裝置之表面保護膜、層間絕緣膜、再配線用絕緣膜、用於扇出型晶圓級封裝(FOWLP)之再配線層、覆晶裝置用保護膜、高密度基板、具有凸塊結構之裝置之保護膜、多層電路之層間絕緣膜、軟性銅箔板之罩部塗佈、阻焊膜、以及液晶配向膜等之製作。以上，對本發明之較佳之實施形態進行了說明，但本發明並不限定於上述實施形態。本發明能夠於不脫離其主旨之範圍內進行各種變化。[實施例]以下，藉由實施例更詳細地說明本發明，但本發明並不限定於該等實施例。[合成例1]＜酚系樹脂(A-1)之合成＞於容量0.5升之附迪安-斯塔克裝置之可分離式燒瓶中，將間苯三酚100.9 g(0.8 mol)、4,4'-雙(甲氧基甲基)聯苯(以下亦稱為「BMMB」)121.2 g(0.5 mol)、二乙基硫酸3.9 g(0.025 mol)、及二乙二醇二甲醚140 g於70℃下混合攪拌，使固形物溶解。藉由油浴將混合溶液加溫至140℃，並藉由反應液確認甲醇之產生，直接於140℃下將反應液攪拌2小時。其次，將反應容器於大氣中冷卻，向其另行添加100 g之四氫呋喃并進行攪拌。於高速攪拌下將反應稀釋液滴加至4 L之水中，使樹脂分散析出並將其回收，適當進行水洗、脫水後，實施真空乾燥，以產率70%獲得包含間苯三酚/BMMB之共聚物(酚系樹脂(A-1))。[合成例2]＜酚系樹脂(A-2)之合成＞使用3,5-二羥基苯甲酸甲酯128.3 g(0.76 mol)代替合成例1之間苯三酚，除此以外與合成例1同樣地進行合成，以產率65%獲得包含3,5-二羥基苯甲酸甲酯/BMMB之共聚物(酚系樹脂(A-2))。[合成例3]＜酚系樹脂(A-3)之合成＞對容量1.0 L之附迪安-斯塔克裝置之可分離式燒瓶進行氮氣置換，其後，於可分離式燒瓶中將間苯二酚81.3 g(0.738 mol)、BMMB 84.8 g(0.35 mol)、對甲苯磺酸3.81 g(0.02 mol)、及丙二醇單甲醚(以下亦稱為「PGME」)116 g於50℃下混合攪拌，使固形物溶解。藉由油浴將混合溶液加溫至120℃，並藉由反應液確認甲醇之產生，直接於120℃下將反應液攪拌3小時。其次，於另一容器中將2,6-雙(羥甲基)-對甲酚24.9 g(0.150 mol)、及PGME 249 g混合攪拌而獲得均勻溶解之溶液，使用滴液漏斗耗時1小時將該溶液滴加至上述可分離式燒瓶中，滴加後，進而攪拌2小時。反應結束後進行與合成例1相同之處理，以產率77%獲得包含間苯二酚/BMMB/2,6-雙(羥甲基)-對甲酚之共聚物(酚系樹脂(A-3))。[合成例4]＜聚醯亞胺前驅物(A-5)之合成＞於容量2 L之可分離式燒瓶中，將均苯四甲酸二酐87.2 g(0.4 mol)、異丁醇59.3 g(0.8 mol)、及γ-丁內酯(以下亦稱為「GBL」)320 g於室溫(25℃)下混合攪拌而使之溶解，並於冰浴冷卻下攪拌並且添加吡啶63.3 g(0.8 mol)，放熱結束後放置冷卻至室溫，並放置16小時。其次，對將二環己基碳二醯亞胺165 g(0.8 mol)溶解於GBL 120 g而成之溶液，於冰浴冷卻下進行攪拌並且以40分鐘添加至上述可分離式燒瓶。繼而，對使4,4'-二胺基二苯醚74.5 g(0.37 mol)懸浮於GBL 150 g而成之懸浮物，於冰浴冷卻下進行攪拌並且以60分鐘添加至上述可分離式燒瓶。於室溫下攪拌2小時後，將乙醇30 ml添加至上述可分離式燒瓶並攪拌1小時，進而添加甲基乙醯胺(以下稱為「DMAc」)250 ml及四氫呋喃(THF)400 ml，其後藉由抽氣過濾將沈澱去除而獲得反應液。向所獲得之反應液添加15 L之乙醇並將生成之沈澱過濾分離，其後進行真空乾燥而獲得聚醯亞胺前驅物(A-5)。[合成例5]＜聚苯并㗁唑前驅物(A-6)之合成＞於容量2 L之可分離式燒瓶中，將2,2-雙(3-胺基-4-羥基苯基)-六氟丙烷197.8 g(0.54 mol)、吡啶75.9 g(0.96 mol)、及DMAc 692 g於室溫(25℃)下混合攪拌而使之溶解。藉由滴液漏斗向所獲得之混合溶液另行滴加使5-降烯-2,3-二羧酸酐19.7 g(0.12 mol)溶解於二乙二醇二甲醚(以下亦稱為「DMDG」)88 g中而成之溶液。滴加所需之時間為40分鐘，反應液溫最大為28℃。滴加結束後，藉由熱水浴將反應液加溫至50℃並攪拌18小時，其後進行反應液之IR光譜之測定，確認出現1385 cm-1 及1772 cm-1 之醯亞胺基之特性吸收。其次，藉由水浴將反應液冷卻至8℃，並藉由滴液漏斗向該反應液另行滴加使二氯化4,4'-二苯醚二羧酸142.3 g(0.48 mol)溶解於DMDG 398 g中而成之溶液。滴加所需之時間為80分鐘，反應液溫最大為12℃。滴加結束3小時後，於高速攪拌下將上述反應液滴加至12 L之水中，使聚合物分散析出並將其回收，適當進行水洗、脫水之後，實施真空乾燥，獲得聚苯并㗁唑前驅物(A-6)。＜樹脂(A)及(A')＞ A-1：包含間苯三酚/BMMB之共聚物，聚苯乙烯換算重量平均分子量(Mw)＝15,000 A-2：包含3,5-二羥基苯甲酸甲酯/BMMB之共聚物，聚苯乙烯換算重量平均分子量(Mw)＝21,000 A-3：包含間苯二酚/BMMB/2,6-雙(羥甲基)-對甲酚之共聚物，聚苯乙烯換算重量平均分子量(Mw)＝9,900 A-4：酚醛清漆樹脂，聚苯乙烯換算重量平均分子量(Mw)＝10,600(旭有機材公司製造，製品名EP-4080G) A-5：聚醯亞胺前驅物 A-6：聚苯并㗁唑前驅物＜光酸產生劑(B)＞ B-1：下述式所表示之光酸產生劑：[化53]{式中，Q中83%為以下之：[化54]所表示之結構，其餘為氫原子}＜溶劑(C)＞ C-1：γ-丁內酯(GBL) C-2：甲基乙基酮 C-3：丙酮 C-4：N,N-二甲基甲醯胺＜界面活性劑(D)＞ D-1：聚矽氧型界面活性劑 DBE821(商品名，Gelest公司製造) D-2：聚矽氧型界面活性劑 DBE224(商品名，Gelest公司製造)＜交聯劑(E)＞ E-1：1,3,4,6-四(甲氧基甲基)甘脲(SANWA CHEMICAL製造，商品名；NIKALACMX-270)[感光性樹脂組合物之製備]根據下述表1所示之組成，使樹脂(A)、光酸產生劑(B)、界面活性劑(D)、及交聯劑(E)溶解於溶劑(C)，並利用0.1 μm之過濾器進行過濾而製備正型感光性樹脂組合物。[表1] [支持體膜]準備經聚矽氧系化合物進行過脫模處理之PET膜「PET25X」(LINTEC股份有限公司製造，寬度290 mm，厚度25 μm)作為支持體膜。[感光性膜之製作](實施例1)使用作為脫模處理PET膜之「PET25X」作為支持體膜，於脫模處理面上塗佈具有上述表1所示之組成之感光性樹脂組合物之溶液。繼而，使塗佈有感光性樹脂組合物之溶液之PET膜於120℃之熱風下乾燥5分鐘，形成感光層。此時，使加熱後之感光層之厚度為10 μm。對外徑3.5英吋之圓筒狀塑膠管，使用相對於捲軸寬度方向平行地配置之加壓捲筒對塑膠管呈線狀地施加壓力，以7 kg之張力將上述組成之寬度300 mm之感光性膜捲取1000 m而獲得感光性膜捲筒。(實施例2～14)使用上述表1所示之成分、組合物及乾燥條件，除此以外依據與實施例1相同之順序製作各感光性膜捲筒。(比較例1～3)使用上述表1所示之成分、組合物及乾燥條件，且於獲得感光性膜捲筒時於感光層上設置軟化溫度為90℃之覆膜，除此以外依據與實施例1相同之順序製作各感光性膜捲筒。＜殘留溶劑量＞自實施例及比較例中分別製作之感光性膜捲筒捲出感光性膜，將感光層自支持體膜剝離，並利用氣相層析儀(Agilent Technology股份有限公司製造，商品名「6890N」)對剝離之感光層進行分析而測定相對於酚系樹脂100質量份之殘留溶劑量(質量份)。＜熔融黏度＞自實施例及比較例中分別製作之感光性膜捲筒捲出感光性膜，將感光層自支持體膜剝離，並使用熔融黏度測定裝置(TA Instruments Japan股份有限公司製造，製品名「DHR-2」)，於以下之條件下對剝離之感光層進行測定。將溫度100℃下之熔融黏度示於表1。・樣品形狀 膜厚：0.5 mmt 直徑：25 mm圓板・測定條件 起始溫度：50℃ 升溫速度：5℃/min 結束溫度：220℃ 應變：0.1% 頻率：1 Hz 負荷：0.5 N(±0.1 N)＜保存穩定性＞將實施例及比較例中分別製作之感光性膜捲筒於室溫(25℃)下保管1個月以上，其後對捲筒之捲出進行目測觀察並根據下述基準進行評價。 S(明顯良好)：即便以捲筒形態於室溫下保存1個月以上，感光層亦不附著於支持體膜背面。 A(良好)：若以捲筒形態於室溫下保存1個月，則感光層之一部分附著於支持體膜背面。＜支持體膜之剝離性＞自實施例及比較例中分別製作之感光性膜捲筒捲出感光性膜，將感光層加熱至130℃並且積層於玻璃板上，製作轉印有感光層之特性評價用樣品。繼而，自特性評價用樣品中將支持體膜剝離去除，並藉由目測對感光層之轉印狀態進行評價。 S(明顯良好)：感光層未附著於支持體膜，能夠剝離去除。 A(良好)：於感光層之一部分在感光層附著於支持體膜之狀態下剝離。 B(不良)：於感光層之整面在感光層附著於支持體膜之狀態下剝離。＜切割時之裂痕＞利用將齒加熱至100℃之切條機對實施例及比較例中分別製作之感光性膜捲筒進行切割。藉由目測對切割時之裂痕之產生及切斷面之美觀進行評價。 S(明顯良好)：未產生裂痕，切斷面亦平滑。 A(良好)：未產生裂痕，但切斷面略有凹凸。 B(不良)：產生裂痕。＜覆膜之皺褶＞利用加熱至100℃之具有齒之切條機對比較例中製作之感光性膜捲筒進行切割，並藉由目測對產生於覆膜之皺褶進行評價。 A(良好)：未於覆膜產生皺褶。 B(不良)：於覆膜產生皺褶。＜評價結果＞對於各實施例及比較例，將各特性評價結果示於上述表1。[產業上之可利用性]本發明之感光層捲筒可較佳地作為半導體裝置、顯示體裝置及發光裝置之表面保護膜、層間絕緣膜、再配線用絕緣膜、用於晶圓級封裝之再配線層、覆晶裝置用保護膜、高密度基板、具有凸塊結構之裝置之保護膜、多層電路之層間絕緣膜、軟性銅箔板之罩部塗佈、阻焊膜、以及液晶配向膜等加以利用。<First embodiment: two-layer photosensitive layer reel> The photosensitive layer reel of the first embodiment of the present invention is formed by sequentially laminating the following two layers, that is, a support film, and containing A photosensitive layer of a photosensitive resin composition of at least one resin in the group consisting of a polyimide precursor, a polybenzoxazole precursor, and a soluble polyimide. In this embodiment, the photosensitive layer roll does not include a film. There is a photosensitive layer on the single-area layer of the support film, and the other side of the support film (ie, the back side of the support or the side where the photosensitive layer is not laminated) is exposed, so both sides of the support film are in contact with the photosensitive layer. Hereinafter, a photosensitive layer roll that does not include a coating film and has both sides of the support film in contact with the photosensitive layer will be described as a two-layer photosensitive layer roll. The previous photosensitive layer reel has the following problems: due to the coating, it is easy to wrinkle the coating when cutting, especially when the teeth of the cutting machine are heated and cut, it is easy to produce a large Wrinkled. In order to solve the above problem, the two-layer photosensitive layer reel of the first embodiment is characterized in that it does not include a film. <Support film> The support film of this embodiment is not particularly limited as long as the surface is smooth. For example, polymer films such as polyethylene terephthalate, polypropylene, polyethylene, and polyester can be used. A polyethylene terephthalate film (hereinafter referred to as "PET film") is preferred. From the viewpoint of transferring the photosensitive layer from the two-layer photosensitive layer roll to the base material when performing the photolithography method, it is preferable that the support film is subjected to release treatment on at least one surface. The mold release treatment in this embodiment refers to the use of polysiloxane-based surfactants, polysiloxane-based compounds such as polysiloxane-based resins, fluorine-based surfactants, fluorine-containing compounds such as fluororesins, alkyd resins, and other release agents. The surface of the support film is thinly coated with chemical treatment, or the support film is subjected to physical treatment such as corona treatment. When the release agent is applied to the support film, it is preferable to apply it thinly within the limit of obtaining the release effect. After coating, the release agent may be fixed to the support film by heat or UV treatment. More preferably, before applying the release agent, an undercoat layer is provided on the support film. <Photosensitive layer> The photosensitive layer is formed by coating the surface of the support film, preferably the release film of the support film, containing a precursor selected from the group consisting of phenolic resin, polyimide precursor, A photosensitive resin composition of at least one resin in the group consisting of a polybenzoxazole precursor and soluble polyimide. Hereinafter, the components contained in the photosensitive resin composition will be described. [Photosensitive resin composition containing phenol resin] [(A) component: phenol resin] Generally, the phenol resin is a thermosetting resin containing a phenol compound and an aldehyde compound. In the present embodiment, from the viewpoint of the hot meltability of the photosensitive layer, the phenol resin (A) preferably has the following general formula (1): (Formula 1) {In formula (1), a is an integer of 1 to 3, b is an integer of 0 to 3, 1 ≦ (a + b) ≦ 4, R 1 Represents a monovalent substituent selected from the group consisting of a monovalent organic group having 1 to 20 carbon atoms, a halogen atom, a nitro group, and a cyano group, when b is 2 or 3, plural R 1 Each may be the same or different, and X represents a divalent alicyclic group selected from the group consisting of a divalent chain aliphatic group having 2 to 10 carbon atoms, a divalent alicyclic group having 3 to 20 carbon atoms, and the following general formula ( 2): [Chem 22] (Formula 2) (In formula (2), p is an integer of 1 to 10) a divalent organic group in the group consisting of a divalent epoxyalkyl group and a divalent organic group having an aromatic ring} The structure shown is used as a repeating unit. The phenol resin (A) having a repeating unit represented by the formula (1) can be hardened at a low temperature and can form a good elongation compared with, for example, polyimide resin and polybenzoxazole resin The cured film further contributes to the hot meltability of the photosensitive layer. The photosensitive layer having excellent thermal fusion property is preferred because it is not likely to cause cracks in the cut surface during cutting, especially when the teeth of the cutting machine are heated and cut, and can be cut so that the cross section becomes smooth. In the above general formula (1), R 1 It is a monovalent substituent selected from the group consisting of a C 1-20 monovalent organic group, a halogen atom, a nitro group and a cyano group. From the viewpoint of alkali solubility, it is preferably selected from a halogen atom, Nitro group, cyano group, aliphatic group having 1 to 10 carbon atoms which may have unsaturated bonds, aromatic group having 6 to 20 carbon atoms, and the following general formula (10): [Chem 23] {In formula (10), R 14 , R 15 And R 16 Each independently represents a hydrogen atom, a C 1-10 linear aliphatic group which may have an unsaturated bond, an alicyclic group having 3 to 20 carbon atoms, or an aromatic group having 6 to 20 carbon atoms, and furthermore, R 17 Represents a divalent chain aliphatic group having 1 to 10 carbon atoms, a divalent alicyclic group having 3 to 20 carbon atoms, or a divalent aromatic group having 6 to 20 carbon atoms which may have an unsaturated bond} A monovalent substituent in a group consisting of 4 kinds of groups. In the present embodiment, in the general formula (1), a is an integer of 1 to 3, and it is preferably 2 from the viewpoint of alkali solubility and elongation. When a is 2, the substitution position of the hydroxyl groups may be any of ortho, meta, and para. When a is 3, the substitution positions of the hydroxy groups may be 1, 2, 3-position, 1, 2, 4- position, 1, 3, 5- position, etc. In the present embodiment, in the above general formula (1), b is an integer of 0 to 3, and from the viewpoint of alkali solubility and elongation, it is preferably 0 or 1. When b is 2 or 3, plural R 1 They can be the same or different. Furthermore, in the present embodiment, in the above general formula (1), a and b satisfy the relationship of 1 ≦ (a + b) ≦ 4. In the present embodiment, in the above general formula (1), X is selected from a divalent chain aliphatic group having 2 to 10 carbon atoms and a divalent alicyclic group having 3 to 20 carbon atoms which may have an unsaturated bond , A divalent organic group in the group consisting of an epoxyalkyl group represented by the general formula (2) and a divalent organic group having an aromatic ring. Among these divalent organic groups, X is preferably selected from the following general formula (3) from the viewpoint of the toughness of the cured film and the viewpoint of hot meltability: (Formula 3) {Formula (3), R 2 , R 3 , R 4 And R 5 Each is independently a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a monovalent aliphatic group having 1 to 10 carbon atoms in which a part or all of a hydrogen atom is substituted with a fluorine atom, and n1 is 0 to 4 Integer, n 1 When it is an integer from 1 to 4, R 6 Is a halogen atom, a hydroxyl group, or a monovalent organic group, at least one R 6 Is hydroxyl, n 1 In the case of an integer from 2 to 4, plural R 6 They may be the same or different}, and the following general formula (4): [Chem 25] (Formula 4) {Formula (4), R 7 , R 8 , R 9 And R 10 Each independently represents a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a monovalent aliphatic group having 1 to 10 carbon atoms in which a part or all of a hydrogen atom is substituted with a fluorine atom, and W is selected from Single bond, C 1-10 linear aliphatic group which may be substituted with fluorine atom, C 3-20 alicyclic group which may be substituted with fluorine atom, the following general formula (2): [Chem 26] The divalent epoxyalkyl group represented by (Formula 2) (in formula (2), p is an integer of 1 to 10), and the following formula (5): [Chem 27] The organic group in the group composed of the divalent groups represented by (division 5) in the group composed of the divalent groups represented by}. As W in formula (4), from the viewpoint of elongation and hot meltability of the cured film, it is preferably selected from a single bond, an epoxyalkyl group represented by the above general formula (2), and the above formula ( 5) The divalent organic group in the group consisting of ester group, amide group and sulfonamide group. In this embodiment, in the above general formula (1), X is preferably a divalent organic group represented by the above general formula (3) or (4), and regarding the divalent organic group represented by the above general formula (4) From the viewpoint of good pattern formability of the resin composition and the viewpoint of elongation and hot meltability of the cured film after curing, the following formula (6) is more preferable: The divalent organic group represented by (Formula 6) is particularly preferably the following formula (7): [Chem 29] The divalent organic group represented by (Formula 7). Regarding the ratio of the phenolic hydroxyl group-containing portion in the general formula (1) to the portion represented by X, especially from the viewpoint of elongation, the ratio of the portion represented by X in the structure represented by the general formula (1) It is preferably 20% by mass or more, and more preferably 30% by mass or more. From the viewpoint of alkali solubility, the above ratio is preferably 80% by mass or less, and more preferably 70% by mass or less. In addition, from the viewpoint of the hot meltability and alkali solubility of the photosensitive layer, the phenol resin (A) preferably has the following general formula (8) within the same resin skeleton: (Formula 8) {Formula (8), R 11 It is a monovalent group with a carbon number of 1 to 10 selected from the group consisting of hydrocarbon groups and alkoxy groups, n2 is an integer of 1 to 3, n3 is an integer of 0 to 2, m1 is an integer of 1 to 500, 2 ≦ (n2 + n3) ≦ 4, when n3 is 2, R 11 They may be the same or different, and the repeating unit represented by}, and the following general formula (9): [Chem 31] (Formula 9) {Formula (9), R 12 And R 13 Are independently a monovalent group of 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, n4 is an integer of 1 to 3, n5 is an integer of 0 to 2, n6 is an integer of 0 to 3 , M2 is an integer from 1 to 500, 2 ≦ (n4 + n5) ≦ 4, when n5 is 2, R 12 They can be the same or different. When n6 is 2 or 3, R 13 They can be the same or different from both of the repeating units represented by}. M1 of the general formula (8) and m2 of the above general formula (9) represent the total number of each repeating unit in the main chain of the phenol resin (A). That is, in the phenol resin (A), the repeating unit in the brackets in the structure represented by the general formula (8) and the repeating unit in the brackets in the structure represented by the general formula (9) may be random, block Or arrange in a combination of these. From the viewpoint of alkali solubility and elongation of the cured product, m1 and m2 are independently integers of 1 to 500, the lower limit value is preferably 2, more preferably 3, and the upper limit value is preferably 450, more It is preferably 400, and more preferably 350. From the viewpoint of the toughness and hot meltability of the cured film, m1 and m2 are independently preferably 2 or more, and from the viewpoint of solubility in an alkaline aqueous solution, preferably 450 or less. Regarding the phenol resin (A) having both the structure represented by the general formula (8) and the structure represented by the general formula (9) in the same resin skeleton, the molar ratio of the structure represented by the general formula (8) The higher, the better the physical properties of the film after curing, the better the heat resistance and hot meltability, the higher the molar ratio of the structure represented by the general formula (9), the better the alkali solubility, the better the shape of the pattern after curing . Therefore, the range of the ratio of the structure represented by the general formula (8) to the structure represented by the general formula (9) is preferably m from the viewpoint of the film physical properties after curing 1 : M 2 = 90: 10 to 20:80, from the viewpoint of film physical properties after hardening, alkali solubility and hot meltability, it is more preferably m 1 : M 2 = 80: 20-40: 60, from the viewpoint of film physical properties, pattern shape, alkali solubility and hot meltability after curing, m is particularly preferred 1 : M 2 = 70: 30 ～ 50: 50. The phenol resin (A) typically contains a phenol compound and a copolymerization component, and is specifically selected from a compound having an aldehyde group (including a compound that decomposes like trioxane to form an aldehyde compound), and has a ketone group One or more compounds in the group consisting of a compound, a compound having 2 hydroxymethyl groups in the molecule, a compound having 2 alkoxymethyl groups in the molecule, and a compound having 2 haloalkyl groups in the molecule, More typically, it can be synthesized by subjecting these monomer components to polymerization reaction. For example, the following phenols and / or phenol derivatives (hereinafter collectively referred to as "phenolic compounds") and aldehyde compounds, ketone compounds, methylol compounds, alkoxymethyl compounds, diene compounds, or Copolymerization components such as haloalkyl compounds are polymerized to obtain phenol resin (A). In this case, in the above general formula (1), the OH group and any R 1 The part represented by the structure in which the group is bonded to the aromatic ring comes from the above-mentioned phenolic compound, and the part represented by X comes from the above-mentioned copolymerization component. From the viewpoints of reaction control and the stability of the obtained phenol resin (A) and photosensitive resin composition, the feed molar ratio of the phenol compound and the above-mentioned copolymer component (phenol compound: copolymer component ) Is preferably 5: 1 to 1.01: 1: more preferably 2.5: 1 to 1.1: 1. In this embodiment, the weight average molecular weight of the phenol resin (A) is preferably 700 to 100,000, more preferably 1,500 to 80,000, and still more preferably 2,000 to 50,000. From the viewpoint of the elongation of the cured film, the weight average molecular weight is preferably 700 or more. On the other hand, from the viewpoint of the alkali solubility of the photosensitive resin composition, the weight average molecular weight is preferably 100,000 or less. The weight average molecular weight can be measured by gel permeation chromatography (GPC) and calculated by a calibration curve made using standard polystyrene. In the present embodiment, examples of the phenol compound that can be used to obtain the phenol resin (A) include cresol, ethyl phenol, propyl phenol, butyl phenol, amyl phenol, cyclohexyl phenol, and hydroxyl group. Benzene, benzylphenol, nitrobenzylphenol, cyanobenzylphenol, adamantanephenol, nitrophenol, fluorophenol, chlorophenol, bromophenol, trifluoromethylphenol, N- (hydroxyphenyl) -5 -Norbornene-2,3-dicarboximide, N- (hydroxyphenyl) -5-methyl-5-norene-2,3-dicarboximide, trifluoromethylphenol, hydroxybenzene Formic acid, methyl hydroxybenzoate, ethyl hydroxybenzoate, benzyl hydroxybenzoate, hydroxybenzamide, hydroxybenzaldehyde, hydroxyacetophenone, hydroxybenzophenone, hydroxybenzonitrile, resorcinol , Xylenol, catechol, methylcatechol, ethylcatechol, hexylcatechol, benzylcatechol, nitrobenzylcatechol, methylresorcinol Diphenol, ethyl resorcinol, hexyl resorcinol, benzyl resorcinol, nitrobenzyl resorcinol, hydroquinone, caffeic acid, dihydroxybenzoic acid, dihydroxybenzoic acid methyl Ester, ethyl dihydroxybenzoate, butyl dihydroxybenzoate, propyl dihydroxybenzoate, benzyl dihydroxybenzoate, dihydroxybenzamide, dihydroxybenzaldehyde, dihydroxyacetophenone, dihydroxy Benzophenone, dihydroxybenzonitrile, N- (dihydroxyphenyl) -5-norene-2,3-dicarboxyimidimide, N- (dihydroxyphenyl) -5-methyl-5 -Norphene-2,3-dicarboximide, nitrocatechol, fluorocatechol, chlorocatechol, bromocatechol, trifluoromethylcatechol, nitro Resorcinol, fluororesorcinol, chlororesorcinol, bromoresorcinol, trifluoromethylresorcinol, pyrogallol, resorcinol, 1,2,4-trihydroxy Benzene, trihydroxybenzoic acid, methyl trihydroxybenzoate, ethyl trihydroxybenzoate, butyl trihydroxybenzoate, propyl trihydroxybenzoate, benzyl trihydroxybenzoate, trihydroxybenzamide, tris Hydroxybenzaldehyde, trihydroxyacetophenone, trihydroxybenzophenone, trihydroxybenzonitrile, etc. Examples of the aldehyde compounds include acetaldehyde, propionaldehyde, pivalaldehyde, butyraldehyde, valeraldehyde, hexanal, trioxane, glyoxal, cyclohexyl aldehyde, diphenyl acetaldehyde, ethyl butyraldehyde , Benzaldehyde, glyoxylic acid, 5-norene-2-carboxyaldehyde, malondialdehyde, succinaldehyde, glutaraldehyde, salicylaldehyde, naphthalene formaldehyde, terephthalaldehyde, etc. Examples of the ketone compound include acetone, methyl ethyl ketone, diethyl ketone, dipropyl ketone, dicyclohexyl ketone, dibenzyl ketone, cyclopentanone, cyclohexanone, and dicyclohexanone. Cyclohexanedione, 3-butyn-2-one, 2-norone, adamantone, 2,2-bis (4-oxetanyl) propane, etc. Examples of the hydroxymethyl compound include 2,6-bis (hydroxymethyl) -p-cresol, 2,6-bis (hydroxymethyl) -4-ethylphenol, and 2,6-bis (hydroxyl) Methyl) -4-propylphenol, 2,6-bis (hydroxymethyl) -4-n-butylphenol, 2,6-bis (hydroxymethyl) -4-third butylphenol, 2,6 -Bis (hydroxymethyl) -4-methoxyphenol, 2,6-bis (hydroxymethyl) -4-ethoxyphenol, 2,6-bis (hydroxymethyl) -4-propoxyphenol , 2,6-bis (hydroxymethyl) -4-n-butoxyphenol, 2,6-bis (hydroxymethyl) -4-third butoxyphenol, 1,3-bis (hydroxymethyl) Urea, ribitol, arabitol, allitol, 2,2-bis (hydroxymethyl) butanoic acid, 2-benzyloxy-1,3-propanediol, 2,2-dimethyl-1,3- Propylene glycol, 2,2-diethyl-1,3-propanediol, glycerol monoacetate, 2-methyl-2-nitro-1,3-propanediol, 5-norene-2,2-dimethanol, 5 -Norphene-2,3-dimethanol, pentaerythritol, 2-phenyl-1,3-propanediol, trimethylolethane, trimethylolpropane, 3,6-bis (hydroxymethyl) pyrylene , 2-nitro-p-phenylenediethanol, 1,10-dihydroxydecane, 1,12-dihydroxydodecane, 1,4-bis (hydroxymethyl) cyclohexane, 1,4-bis ( (Hydroxymethyl) cyclohexene, 1,6-bis (hydroxymethyl) adamantane, 1,4-benzenedimethanol, 1,3-benzenedimethanol, 2,6-bis (hydroxymethyl) -1, 4-dimethoxybenzene, 2,3-bis (hydroxymethyl) naphthalene, 2,6-bis (hydroxymethyl) naphthalene, 1,8-bis (hydroxymethyl) anthracene, 2,2'-bis (Hydroxymethyl) diphenyl ether, 4,4'-bis (hydroxymethyl) diphenyl ether, 4,4'-bis (hydroxymethyl) diphenyl sulfide, 4,4'-bis (hydroxymethyl) ) Benzophenone, 4-hydroxymethylbenzoic acid-4'-hydroxymethylphenyl, 4-hydroxymethylbenzoic acid-4'-hydroxymethyl aniline, 4,4'-bis (hydroxymethyl) ) Phenylurea, 4,4'-bis (hydroxymethyl) phenylcarbamate, 1,8-bis (hydroxymethyl) anthracene, 4,4'-bis (hydroxymethyl) biphenyl, 2 , 2'-Dimethyl-4,4'-bis (hydroxymethyl) biphenyl, 2,2-bis (4-hydroxymethylphenyl) propane, ethylene glycol, diethylene glycol, triethylenedioxide Alcohol, tetraethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, tetrapropylene glycol, etc. Examples of the alkoxymethyl compound include 2,6-bis (methoxymethyl) -p-cresol, 2,6-bis (methoxymethyl) -4-ethylphenol, and 2 , 6-bis (methoxymethyl) -4-propylphenol, 2,6-bis (methoxymethyl) -4-n-butylphenol, 2,6-bis (methoxymethyl) -4-tert-butylphenol, 2,6-bis (methoxymethyl) -4-methoxyphenol, 2,6-bis (methoxymethyl) -4-ethoxyphenol, 2 , 6-bis (methoxymethyl) -4-propoxyphenol, 2,6-bis (methoxymethyl) -4-n-butoxyphenol, 2,6-bis (methoxymethoxy Group) -4-third butoxyphenol, 1,3-bis (methoxymethyl) urea, 2,2-bis (methoxymethyl) butanoic acid, 2,2-bis (methoxy) Methyl) -5-norbornene, 2,3-bis (methoxymethyl) -5-norene, 1,4-bis (methoxymethyl) cyclohexane, 1,4-bis (methyl Oxymethyl) cyclohexene, 1,6-bis (methoxymethyl) adamantane, 1,4-bis (methoxymethyl) benzene, 1,3-bis (methoxymethyl) Benzene, 2,6-bis (methoxymethyl) -1,4-dimethoxybenzene, 2,3-bis (methoxymethyl) naphthalene, 2,6-bis (methoxymethyl) ) Naphthalene, 1,8-bis (methoxymethyl) anthracene, 2,2'-bis (methoxymethyl) diphenyl ether, 4,4'-bis (methoxymethyl) diphenyl ether , 4,4'-bis (methoxymethyl) diphenyl sulfide, 4,4'-bis (methoxymethyl) benzophenone, 4-methoxymethylbenzoic acid-4'- Methoxymethylphenyl ester, 4-methoxymethylbenzoic acid-4'-methoxymethyl aniline, 4,4'-bis (methoxymethyl) phenylurea, 4,4 ' -Ethyl bis (methoxymethyl) phenylcarbamate, 1,8-bis (methoxymethyl) anthracene, 4,4'-bis (methoxymethyl) biphenyl, 2,2 '-Dimethyl-4,4'-bis (methoxymethyl) biphenyl, 2,2-bis (4-methoxymethylphenyl) propane, ethylene glycol dimethyl ether, diethylene glycol Dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, propylene glycol dimethyl ether, dipropylene glycol dimethyl ether, tripropylene glycol dimethyl ether, tetrapropylene glycol dimethyl ether, etc. Examples of the diene compounds include butadiene, pentadiene, hexadiene, heptadiene, octadiene, 3-methyl-1,3-butadiene, and 1,3-butanediol. -Dimethacrylate, 2,4-hexadien-1-ol, methylcyclohexadiene, cyclopentadiene, cyclohexadiene, cycloheptadiene, cyclooctadiene, dicyclopentadiene Ene, 1-hydroxydicyclopentadiene, 1-methylcyclopentadiene, methyldicyclopentadiene, diallyl ether, diallyl sulfide, diallyl adipate, 2,5 -Nordiene, tetrahydroindene, 5-ethylene-2-norene, 5-vinyl-2-norene, triallyl cyanurate, diallyl isocyanurate, iso Triallyl cyanurate, diallyl isocyanurate, etc. Examples of the above-mentioned haloalkyl compounds include dichloroxylene, dichloromethyldimethoxybenzene, dichloromethylpyrylene, dichloromethylbiphenyl, and dichloromethyl-biphenylcarboxylic acid. , Dichloromethyl-biphenyldicarboxylic acid, dichloromethyl-methylbiphenyl, dichloromethyl-dimethylbiphenyl, dichloromethylanthracene, ethylene glycol bis (chloroethyl) ether, Diethylene glycol bis (chloroethyl) ether, triethylene glycol bis (chloroethyl) ether, tetraethylene glycol bis (chloroethyl) ether, etc. The phenolic resin (A) can be obtained by condensing the above-mentioned phenolic compound and copolymerized component by dehydration, dehydrohalogenation, or dealcoholization, or polymerizing the unsaturated bond while breaking the bond. In the polymerization of the phenolic compound and the copolymerization component, a catalyst can also be used. Examples of acidic catalysts include hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, phosphorous acid, methanesulfonic acid, p-toluenesulfonic acid, dimethyl sulfuric acid, diethyl sulfuric acid, acetic acid, oxalic acid, and 1-hydroxyethylene- 1,1'-Diphosphonic acid, zinc acetate, boron trifluoride, boron trifluoride-phenol complex, boron trifluoride-ether complex, etc. Examples of alkaline catalysts include lithium hydroxide, sodium hydroxide, potassium hydroxide, calcium hydroxide, barium hydroxide, sodium carbonate, triethylamine, pyridine, 4-N, N-dimethylaminopyridine , Piperidine, piper, 1,4-diazabicyclo [2.2.2] octane, 1,8-diazabicyclo [5.4.0] -7-undecene, 1,5-diazabicyclo [4.3.0] -5-nonene, ammonia, hexamethylenetetramine, etc. In the present embodiment, the amount of the catalyst used to obtain the phenol resin (A) is preferably the number of moles relative to the total of the copolymerization components, preferably the aldehyde compound, ketone compound, methylol compound, alkylene The total number of moles of the oxymethyl compound, the diene compound, and the haloalkyl compound is 100 mol%, which is in the range of 0.01 mol% to 100 mol%. When performing the synthesis reaction of the phenol resin (A), an organic solvent may be used if necessary. Specific examples of organic solvents that can be used are not limited, and examples include bis (2-methoxyethyl) ether, methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetic acid. Ester, diethylene glycol dimethyl ether, dipropylene glycol dimethyl ether, cyclohexanone, cyclopentanone, toluene, xylene, γ-butyrolactone, N-methyl-2-pyrrolidone, etc. When the total mass of the fed raw materials is set to 100 parts by mass, the amount of these organic solvents used is usually 10 parts by mass to 1000 parts by mass, preferably 20 parts by mass to 500 parts by mass. Furthermore, in the synthesis reaction of the phenol resin (A), the reaction temperature is preferably 40 ° C to 250 ° C, more preferably 100 ° C to 200 ° C, and the reaction time is preferably about 1 hour to 10 hours. Furthermore, the phenol-based resin (A) may be within a range not detrimental to the effect of the present invention, for example, it is not more than 30% of the total number of moles of the phenol-based compound used as the raw material of the phenol-based resin (A). The phenol compound of the raw material of the structure of the general formula (1) is polymerized. In this embodiment, in the above general formula (1), when a is 1, in order to improve alkali solubility, it can be seen that a phenol resin selected from the group consisting of novolak resin and polyhydroxystyrene resin (below Also known as phenol resin (A ')) and phenol resin (A) are mixed. The mixing ratio of the phenol resin (A) and the phenol resin (A ') is preferably in the range of (A) / (A') = 10/90 to 90/10 in terms of mass ratio. From the viewpoint of solubility in an aqueous alkali solution and the elongation of the cured film, the mixing is preferably (A) / (A ') = 10/90 to 90/10, and more preferably (A) / ( A ') = 20/80 to 80/20, more preferably (A) / (A') = 30/70 to 70/30. The novolak resin can be obtained by condensing phenols and formaldehyde in the presence of an acid catalyst. Examples of the phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p-butyl Phenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol , 2,3,5-trimethylphenol, 3,4,5-trimethylphenol, catechol, resorcinol, pyrogallol, α-naphthol, β-naphthol, etc. Specific novolak resins include, for example, phenol / formaldehyde condensation novolak resins, cresol / formaldehyde condensation novolak resins, phenol-naphthol / formaldehyde condensation novolak resins, and the like. As the polyhydroxystyrene resin, poly-p-vinylphenol is preferred. Poly-p-vinylphenol is not particularly limited as long as it is a polymer containing p-vinylphenol as a polymer unit. The polymer units other than p-vinylphenol that can constitute poly-p-vinylphenol may be any compounds that can be copolymerized with p-vinylphenol as long as the purpose of the present invention is not violated. Examples of compounds that can be copolymerized with vinyl phenol include methyl acrylate, methyl methacrylate, hydroxyethyl acrylate, butyl methacrylate, octyl acrylate, and 2-ethoxyethyl methacrylate , Third butyl acrylate, 1,5-pentanediol diacrylate, N, N-diethylaminoethyl acrylate, ethylene glycol diacrylate, 1,3-propanediol diacrylate, decanediol diacrylate Acrylate, decanediol dimethacrylate, 1,4-cyclohexanediol diacrylate, 2,2-dimethylolpropane diacrylate, glycerol diacrylate, tripropylene glycol diacrylate , Glycerin triacrylate, 2,2-bis (p-hydroxyphenyl) -propane dimethacrylate, triethylene glycol diacrylate, polyoxyethyl-2-2-di (p-hydroxyphenyl) ) -Propane dimethacrylate, triethylene glycol dimethacrylate, polyoxypropyltrimethylolpropane triacrylate, ethylene glycol dimethacrylate, butylene glycol dimethacrylate, 1,3-propanediol dimethacrylate, butanediol dimethacrylate, 1,3-propanediol dimethacrylate, 1,2,4-butanetriol trimethacrylate, 2,2, 4-trimethyl-1,3-pentanediol dimethacrylate, pentaerythritol trimethacrylate, 1-styrene-1,2-dimethacrylate, pentaerythritol tetramethacrylate, trihydroxy Ester of acrylic acid such as methyl propane trimethacrylate, 1,5-pentanediol dimethacrylate and 1,4-benzenediol dimethacrylate; styrene, and for example 2-methylstyrene Substituted styrene such as vinyl toluene; vinyl esters such as vinyl acrylate and vinyl methacrylate; monomers such as o-vinylphenol and m-vinylphenol other than p-vinylphenol, but not limited In such. The weight average molecular weight of the phenol resin (A ') (that is, a phenol resin selected from the group consisting of novolak resin and polyhydroxystyrene resin) is preferably 700 to 100,000, more preferably 1,500 to 80,000, and It is preferably 2,000 to 50,000. From the viewpoint of the elongation of the cured film, the weight average molecular weight is preferably 700 or more. On the other hand, from the viewpoint of the alkali solubility of the photosensitive resin composition, it is preferably 100,000 or less. In addition, the phenol resin selected from the group consisting of novolak resin and polyhydroxystyrene resin may be used alone, or may be used by mixing two or more kinds. [Photoacid generator (B)] In the present embodiment, the photosensitive resin composition is a composition capable of sensing active light (ie, radiation) represented by ultraviolet rays, electron beams, X-rays, etc. to form a resin pattern. The photosensitive resin composition may be either a negative type (that is, a non-irradiated portion is eluted by development) or a positive type (that is, an irradiated portion is eluted by development). In the present embodiment, when the photosensitive resin composition is used as a negative photosensitive resin composition, the photoacid generator (B) is irradiated with radiation to generate acid, and the generated acid causes the phenolic resin (A ) A cross-linking reaction with a cross-linking agent, whereby the radiation irradiated portion is insoluble in the developer. Examples of the photoacid generator (B) that can be used in the negative type include the following compounds: (i) Trichloromethyl-s-three tris (2,4,6-trichloromethyl) -s-tris , 2-phenyl-bis (4,6-trichloromethyl) -s-tri, 2- (3-chlorophenyl) -bis (4,6-trichloromethyl) -s-tri, 2- (2-chlorophenyl) -bis (4,6-trichloromethyl) -s-tris, 2- (4-methoxyphenyl) -bis (4,6-trichloromethyl) -s- Three, 2- (3-methoxyphenyl) -bis (4,6-trichloromethyl) -s-tri, 2- (2-methoxyphenyl) -bis (4,6-trichloro Methyl) -s-tris, 2- (4-methylthiophenyl) -bis (4,6-trichloromethyl) -s-tris, 2- (3-methylthiophenyl) bis (4 , 6-trichloromethyl-s-tris, 2- (2-methylthiophenyl) -bis (4,6-trichloromethyl) -s-tris, 2- (4-methoxynaphthyl ) -Bis (4,6-trichloromethyl) -s-tris, 2- (3-methoxynaphthyl) -bis (4,6-trichloromethyl) -s-tris, 2- (2 -Methoxynaphthyl) -bis (4,6-trichloromethyl) -s-tris, 2- (3,4,5-trimethoxy-β-styryl) -bis (4,6- Trichloromethyl) -s-tris, 2- (4-methylthio-β-styryl) -bis (4,6-trichloromethyl) -s-tris, 2- (3-methylthio -β-styryl) -bis (4,6-trichloromethyl) -s-tris, 2- (2-methylthio-β-styryl) -bis (4,6-trichloromethyl ) -s-Third grade; (ii) Diaryl iodonium salts, diphenyl iodonium tetrafluoroborate, diphenyl iodonium tetrafluorophosphate, diphenyl iodonium tetrafluoroarsenate, diphenyl iodonium trifluoro Methanesulfonate, diphenylphosphonium trifluoroacetate, diphenylphosphonium-p-toluenesulfonate, 4-methoxyphenylphenylphosphonium tetrafluoroborate, 4-methoxyphenylphenylphosphonium Hexafluorophosphonate, 4-methoxyphenyl phenyl phosphonium hexafluoroarsenate, 4-methoxy phenyl phenyl phosphonium trifluoromethanesulfonate, 4-methoxy phenyl phenyl oxonium trifluoride Fluoroacetic acid salt, 4-methoxyphenyl phenyl iodonium-p-toluenesulfonate, bis (4-tertiary butyl phenyl) chlorotetrafluoroborate, bis (4-tertiary butyl phenyl) iodonium Hexafluoroarsenate, bis (4-third butylphenyl) chlorotrifluoromethanesulfonate, bis (4-third butylphenyl) chlorotrifluoroacetate, bis (4-third butyl Phenyl) -Pollium-p-toluenesulfonate, etc .; (iii) Triaryl alkoxide salts triphenyl alkane tetrafluoroborate, triphenyl alkane hexafluorophosphonate, triphenyl alkane hexafluoroarsenate, tris Phenyl Methanesulfonate, Triphenylammonium trifluoroacetate, Triphenylammonium-p-toluenesulfonate, 4-methoxyphenyldiphenylammonium tetrafluoroborate, 4-methoxybenzene Benzyl diphenyl alkane hexafluorophosphonate, 4-methoxyphenyl diphenyl alkane hexafluoroarsenate, 4-methoxyphenyl diphenyl alkane methanesulfonate, 4-methoxybenzene Triphenylacetate trifluoroacetate, 4-methoxyphenyldiphenylammonium-p-toluenesulfonate, 4-phenylthiophenyldiphenyltetrafluoroborate, 4-phenylthiophenyl Diphenyl hexafluorophosphonate, 4-phenylthiophenyl Diphenyl hexafluoroarsenate, 4-phenylthiophenyl diphenyl trifluoromethanesulfonate, 4-phenylthiophenyl diphenyl trifluoroacetate, 4-phenylthiophenyl diphenyl -P-toluenesulfonate and so on. Among these compounds, as trichloromethyl-s-three, 2- (3-chlorophenyl) -bis (4,6-trichloromethyl) -s-tri, 2- (4- Chlorophenyl) -bis (4,6-trichloromethyl) -s-tris, 2- (4-methylthiophenyl) -bis (4,6-trichloromethyl) -s-tris, 2 -(4-methoxy-β-styryl) -bis (4,6-trichloromethyl) -s-tris, 2- (4-methoxynaphthyl) -bis (4,6-tris Chloromethyl) -s-three. As the diaryliodonium salts, preferred are diphenylphosphonium trifluoroacetate, diphenylphosphonium trifluoromethanesulfonate, 4-methoxyphenylphenylphosphonium trifluoromethanesulfonate, 4- Methoxy phenyl phenyl epitrifluoroacetate and so on. As triaryl alkane salts, triphenyl alkane methanesulfonate, triphenyl alkane trifluoroacetate, 4-methoxyphenyl diphenyl alkane methanesulfonate, 4-methoxybenzene Triphenylacetic acid trifluoroacetate, 4-phenylthiophenyldiphenyltrifluoromethanesulfonate, 4-phenylthiophenyldiphenyltrifluoroacetate, etc. In addition, the compounds shown below can also be used as the photoacid generator (B). (1) Diazo ketone compound Examples of the diazo ketone compound include 1,3-diketo-2-diazo compound, diazobenzoquinone compound, and diazonaphthoquinone compound. Specific examples include 1,2-naphthoquinonediazide-4-sulfonate compounds of phenols. (2) Ballast compounds Examples of the ballast compounds include β-keto ballast compounds, β-sulfonyl ballast compounds, and α-diazo compounds of these compounds. As a specific example, 4-tribenzoyl methyl sulfone, It is based on benzyl methacrylate, bis (benzyl sulfonamide) methane, etc. (3) Sulfonic acid compound Examples of the sulfonic acid compound include sulfonic acid alkyl esters, sulfonic acid haloalkyl esters, sulfonic acid aryl esters, and iminosulfonic acid esters. Preferred specific examples of the sulfonic acid compound include benzoin tosylate, pyrogallol tris (trifluoromethanesulfonate), o-nitrobenzyl trifluoromethanesulfonate, and o-nitrobenzene p-toluenesulfonate. Benzyl ester and so on. (4) Sulfonimide compound As the sulfonimide compound, for example, N- (trifluoromethylsulfonyloxy) succinimide, N- (trifluoromethylsulfonyloxy) ortho Xylylenediimide, N- (trifluoromethylsulfonyloxy) diphenyl maleimide, N- (trifluoromethylsulfonyloxy) bicyclo [2.2.1] heptan 5-ene-2,3-dicarboximide, N- (trifluoromethylsulfonyloxy) naphthalene imide, etc. (5) Oxime ester compound As an oxime ester compound, specifically, 2- [2- (4-methylphenylsulfonylimido)]-2,3-dihydrothiophene-3- Subunit] -2- (2-methylphenyl) acetonitrile (Ciba Specialty Chemicals company trade name "Irgacure PAG121"), [2- (propylsulfonyloxyimino) -2,3-dihydrothiophene -3-ylidene] -2- (2-methylphenyl) acetonitrile (trade name "Irgacure PAG103" of Ciba Specialty Chemicals), [2- (n-octanesulfonyloxyimino) -2,3 -Dihydrothiophene-3-ylidene] -2- (2-methylphenyl) acetonitrile (Ciba Specialty Chemicals company trade name "Irgacure PAG108"), α- (n-octanesulfonyloxyimino)- 4-Methoxybenzeneacetonitrile (Ciba Specialty Chemicals' trade name "CGI725"), etc. (6) Diazomethane compound As the diazomethane compound, specific examples include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, and bis (phenyl (Sulfonyl) diazomethane, etc. From the viewpoint of sensitivity, the above-mentioned (5) oxime ester compound is particularly preferable. In the present embodiment, when the photosensitive resin composition is negative, the blending amount of the photoacid generator (B) with respect to 100 parts by mass of the phenol resin (A) is preferably 0.1 to 50 parts by mass, more Preferably it is 1-40 mass parts. If the blending amount is 0.1 parts by mass or more, the effect of improving sensitivity can be obtained well, and if the blending amount is 50 parts by mass or less, the mechanical properties of the cured film are good. In this embodiment, the photosensitive resin composition can also be used as a positive type photosensitive resin composition. In this case, the photoacid generators and / or quinonediazide compounds shown in (i) to (iii) and (1) to (6) above are used. Among them, a quinonediazide compound is preferred from the viewpoint of physical properties after curing. The reason is that the quinonediazide compound thermally decomposes during curing, and the amount remaining in the cured film is extremely small. Therefore, the positive photoacid generator (B) is preferably a quinonediazide compound. Examples of the quinonediazide compound include a 1,2-benzoquinonediazide structure or a 1,2-naphthoquinonediazide structure (hereinafter, the compound having the latter structure is also referred to as "NQD compound") Compound. Such compounds are described in, for example, US Patent No. 2,772,972, US Patent No. 2,797,213, and US Patent No. 3,669,658. The NQD compound is a 1,2-naphthoquinonediazide-4-sulfonate selected from a compound having a plurality of phenolic hydroxyl groups (hereinafter also referred to as "polyhydroxy compound") described in detail below, and the polyhydroxy group At least one compound of the group consisting of 1,2-naphthoquinonediazide-5-sulfonate of the compound. The NQD compound is obtained by converting naphthoquinone diazide sulfonic acid into sulfonyl chloride using chlorosulfonic acid, sulfenyl chloride or the like according to a conventional method, and the obtained naphthoquinone diazide sulfonyl chloride Condensation reaction with polyhydroxy compounds. For example, it can be obtained by combining a polyhydroxy compound with a specific amount of 1,2-naphthoquinonediazide-5-sulfonyl chloride or 1,2-naphthoquinonediazide-4-sulfonyl chloride in two In a solvent such as ethane, acetone, or tetrahydrofuran, it is reacted in the presence of an alkaline catalyst such as triethylamine to perform esterification, and the obtained product is washed with water and dried. From the viewpoint of the physical properties of the cured film such as sensitivity and elongation, as examples of preferred NQD compounds, the following general formula group may be mentioned: {In the formula, Q is a hydrogen atom, or the following formula group: [化 33] The naphthoquinone diazide sulfonate group represented by any one, but all Q will not be represented by hydrogen atoms at the same time. In addition, as the NQD compound, a naphthoquinone diazide sulfonamide compound having 4-naphthoquinone diazide sulfonyl group and 5-naphthoquinone diazide sulfonyl group in the same molecule may be used, or 4 -The naphthoquinone diazide sulfonate compound and the 5-naphthoquinone diazide sulfonate compound are used in combination. The above-mentioned NQD compounds may be used alone or in combination of two or more. In the present embodiment, when the photosensitive resin composition is a positive type, the amount of the photoacid generator (B) is preferably 0.1 to 70 parts by mass with respect to 100 parts by mass of the phenol resin (A) of the composition. Parts, more preferably 1 to 40 parts by mass, and still more preferably 5 to 30 parts by mass. If the amount of use is 0.1 parts by mass or more, good sensitivity is obtained, and if it is 70 parts by mass or less, the mechanical properties of the cured film are good. [Solvent (C)] Examples of the solvent (C) include amides, sulfonamides, ureas, ketones, esters, lactones, ethers, halogenated hydrocarbons, and hydrocarbons. For example, they can be used. : N-methyl-2-pyrrolidone, N, N-methylacetamide, N, N-dimethylformamide, dimethylsulfoxide, tetramethylurea, acetone, methylethyl Ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, methyl acetate, ethyl acetate, butyl acetate, diethyl oxalate, ethyl lactate, methyl lactate, butyl lactate, γ-butyrolene Ester, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, benzyl alcohol, benzene ethylene glycol, tetrahydrofuran methanol, third butanol, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, tetrahydrofuran, morpholine , Dichloromethane, 1,2-dichloroethane, 1,4-dichlorobutane, chlorobenzene, o-dichlorobenzene, anisole, hexane, heptane, benzene, toluene, xylene, all three Toluene, etc. Among them, from the viewpoints of the solubility of the resin, the stability of the resin composition, the adhesion to the substrate, the hot meltability, the storage stability, and the adhesion, γ-butyrolactone, acetone, and alpha Ethyl ethyl ketone, N-methyl-2-pyrrolidone, dimethyl sulfoxide, propylene glycol monomethyl ether, third butanol and tetrahydrofuran methanol, among which γ-butyrolactone, acetone, methyl Ethyl ketone, N-methyl-2-pyrrolidone, and dimethyl sulfoxide. [Polysiloxane-based surfactant (D)] The so-called polysiloxane-based surfactant refers to a surfactant having a siloxane bond and a silicon-carbon bond in the molecule. Examples include: dimethylsiloxane ethoxylated graft compound, dimethylsiloxane propoxylated graft compound, (hydroxyethoxypropyl) methylsiloxane-dimethyl Siloxane compounds, etc. Specific examples of polysiloxane-based surfactants include organic silicone polymers KF-640, 642, 643, KP341, X-70-092, and X-70-093 (the above are trade names, Shin-Etsu Chemical Manufactured by an industrial company); SH-28PA, SH-190, SH-193, SZ-6032, SF-8428, DC-57, DC-190 (the above are trade names, manufactured by Dow Corning Toray); SILWET L-77, L-7001, FZ-2105, FZ-2120, FZ-2154, FZ-2164, FZ-2166, L-7604 (the above are trade names, manufactured by Nippon Unicar); DBE-814, DBE-224, DBE-621 , CMS-626, CMS-222, KF-352A, KF-354L, KF-355A, KF-6020, DBE-821, DBE-712 (Gelest), BYK-307, BYK-310, BYK-378, BYK- 333 (the above is a trade name, manufactured by BYK-Chemie Japan); Glanol (a trade name, manufactured by Kyoeisha Chemical Company), etc. Among these, from the viewpoint of the coatability of the varnish of the composition, a dimethylsiloxyethoxy graft compound and a dimethylsiloxypropoxy graft compound are preferable. These polysiloxane-based surfactants can be used alone or in combination of two or more. From the viewpoint of the coatability of the composition varnish to the support, the use amount of the polysiloxane-based surfactant (D) is preferably 0.01 to 30 parts by mass relative to 100 parts by mass of the phenol resin (A), and more It is preferably 0.02 to 10 parts by mass. If the use amount of the polysiloxane-based surfactant (D) is 30 parts by mass or less, it is possible to suppress residue and pattern swell during development. [Other components] The photosensitive resin composition of this embodiment may contain a crosslinking agent (E), a thermal acid generator, a silane coupling agent, a dye, a dissolution accelerator, etc. as needed. The cross-linking agent (E) is a compound that can be cross-linked with the phenol resin (A) or the cross-linking agent itself when the relief pattern formed using the photosensitive resin composition of this embodiment is heat-cured Form a network-like structure. The crosslinking agent (E) is not limited as long as it can be thermally crosslinked. In general, the crosslinking agent can further improve the thermal characteristics, mechanical characteristics, and chemical resistance of the cured film having two crosslinking groups in the molecule and containing the photosensitive resin composition. As the crosslinking agent (E), for example, Cymel (registered trademark) 300, 301, 303, 370, 325, 327, 701, 266, 267, which is a compound containing a hydroxymethyl group and / or an alkoxymethyl group, 238, 1141, 272, 202, 1156, 1158, 1123, 1170, 1174, UFR65, 300, Micoat 102, 105 (above manufactured by Mitsui Cytec); NIKALAC (registered trademark) MX-270, -280, -290, NIKALAC MS-11, NIKALAC MW-30, -100, -300, -390, -750 (above manufactured by Sanwa Chemical); DML-OCHP, DML-MBPC, DML-BPC, DML-PEP, DML-34X, DML-PSBP, DML-PTBP, DMLCPHP, DML-POP, DML-PFP, DML-MBOC, BisCMP-F, DML-BisOC-Z, DML-BisOCHP-Z, DML-BisOC-P, DMOM-PTBT, TMOM- BP, TMOM-BPA, TML-BPAF-MF (manufactured by the above state chemical industry company); benzenedimethanol, bis (hydroxymethyl) cresol, bis (hydroxymethyl) dimethoxybenzene, bis (hydroxymethyl) Group) diphenyl ether, bis (hydroxymethyl) benzophenone, hydroxymethyl benzoic acid hydroxymethyl phenyl ester, bis (hydroxymethyl) biphenyl, dimethyl bis (hydroxymethyl) biphenyl, bis (Methoxymethyl) benzene, bis (methoxymethyl) cresol, bis (methoxymethyl) dimethoxy , Bis (methoxymethyl) diphenyl ether, bis (methoxymethyl) benzophenone, methoxymethyl benzoate methoxymethyl benzoate, bis (methoxymethyl) Benzene, dimethyl bis (methoxymethyl) biphenyl and so on. Moreover, as a crosslinking agent (E), a phenol novolak epoxy resin, a cresol novolak epoxy resin, a bisphenol epoxy resin, a triphenol epoxy resin, etc. are mentioned as an ethylene oxide compound. Tetraphenol epoxy resin, phenol-xylylene epoxy resin, naphthol-xylylene epoxy resin, phenol-naphthol epoxy resin, phenol-dicyclopentadiene epoxy resin , Alicyclic epoxy resin, aliphatic epoxy resin, diethylene glycol diglycidyl ether, sorbitol polyglycidyl ether, propylene glycol diglycidyl ether, trimethylolpropane polyglycidyl ether, 1,1, 2,2-tetra (p-hydroxyphenyl) ethane tetraglycidyl ether, glycerol triglycidyl ether, o-second butylphenyl glycidyl ether, 1,6-bis (2,3-epoxypropylene Oxy) naphthalene, diglycerin polyglycidyl ether, polyethylene glycol glycidyl ether; YDB-340, YDB-412, YDF-2001, YDF-2004 (the above are trade names, Nippon Steel Chemical Co., Ltd. Manufacturing); NC-3000-H, EPPN-501H, EOCN-1020, NC-7000L, EPPN-201L, XD-1000, EOCN-4600 (the above are trade names, manufactured by Nippon Chemicals Co., Ltd.); Epikote ( Trademarks) 1001, Epikote1007, Epikote1009, Epikote5050, Epikote5051, Epikote1031S, Epikote180S65, Epikote157H70, YX-315-75 (the above are trade names, manufactured by Japan Epoxy Resins Co., Ltd.); EHPE3150, PLACCEL G402, PUE101, PUE and above Trade name, manufactured by Daicel Chemical Industries Co., Ltd.); EPICLON (registered trademark) 830, 850, 1050, N-680, N-690, N-695, N-770, HP-7200, HP-820, EXA-4850 -1000 (the above is a trade name, made by DIC); DENACOL (registered trademark) EX-201, EX-251, EX-203, EX-313, EX-314, EX-321, EX-411, EX-511, EX-512, EX-612, EX-614, EX-614B, EX-711, EX-731, EX-810, EX-911, EM-150 (the above are trade names, manufactured by Nagase chemteX); Epolight (registered Trademark) 70P, Epolight100MF (the above are trade names, manufactured by Kyoeisha Chemical), etc. In addition, as the cross-linking agent (E), 4,4′-diphenylmethane diisocyanate, toluene diisocyanate, 1,3-phenylene dimethylene diisocyanate, which are isocyanate group-containing compounds, Dicyclohexylmethane-4,4'-diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate; Takenate (registered trademark) 500, 600; Cosmonat (registered trademark) NBDI, ND (the above are trade names, (Mitsui Chemical Co., Ltd.); Duranate (registered trademark) 17B-60PX, TPA-B80E, MF-B60X, MF-K60X, E402-B80T (the above are trade names, manufactured by Asahi Kasei Chemical Co., Ltd.), etc. In addition, as the cross-linking agent (E), 4,4'-diphenylmethane bis-cis-butadiene diimide, phenylmethane-cis-butadiene diimide can be cited as the bis-cis-butadiene diimide compound. Amine, m-phenylene bis-cis-butadiene diimide, bisphenol A diphenyl ether bis-cis-butadiene diimide, 3,3'-dimethyl-5,5'-diethyl-4, 4'-diphenylmethane bis-cis-butadiene diimide, 4-methyl-1,3-phenylene bis-cis-butadiene diimide, 1,6'-bis-cis-butadiene diimide -(2,2,4-trimethyl) hexane, 4,4'-diphenyl ether bis-cis-butadiene diimide, 4,4'-diphenyl bis-cis-butadiene di-imide, 1,3-bis (3-cis-butenediimidephenoxy) benzene, 1,3-bis (4-cis-butadieneimidephenoxy) benzene; BMI-1000, BMI-1100, BMI-2000, BMI-2300, BMI-3000, BMI-4000, BMI-5100, BMI-7000, BMI-TMH, BMI-6000, BMI-8000 (the above are trade names, manufactured by Daiwa Chemical Industry Co., Ltd.), etc. . The blending amount when the crosslinking agent (E) is used is preferably 0.1 to 40 parts by mass, and more preferably 1 to 30 parts by mass with respect to 100 parts by mass of the phenol resin (A). If the blending amount is 0.1 parts by mass or more, the thermal physical properties and mechanical strength of the thermosetting film are good, and if it is 40 parts by mass or less, the stability of the composition in the varnish state and the elongation of the thermosetting film are good. From the viewpoint of showing good thermal properties and mechanical properties of the cured product even when the curing temperature is lowered, the thermal acid generator is preferably blended into the resin composition. The thermal acid generator is not limited as long as it is a compound that generates acid by heat, and examples thereof include allyl chloroacetate, n-butyl chloroacetate, third butyl chloroacetate, ethyl chloroacetate, and chlorine Methyl acetate, benzyl chloroacetate, isopropyl chloroacetate, 2-methoxyethyl chloroacetate, methyl dichloroacetate, methyl trichloroacetate, ethyl trichloroacetate, triethoxyacetic acid 2-ethoxy Ethyl ethyl ester, third butyl cyanoacetate, third butyl methacrylate, ethyl trifluoroacetate, methyl trifluoroacetate, phenyl trifluoroacetate, vinyl trifluoroacetate, isopropyl trifluoroacetate , Allyl trifluoroacetate, ethyl benzoate, methyl benzoate, tert-butyl benzoate, methyl 2-chlorobenzoate, ethyl 2-chlorobenzoate, ethyl 4-chlorobenzoate, 2 , Ethyl 5-dichlorobenzoate, methyl 2,4-dichlorobenzoate, ethyl p-fluorobenzoate, methyl p-fluorobenzoate, third butyl pentachlorophenylcarboxylate, pentafluoropropionic acid Carboxylic acid esters such as methyl ester, ethyl pentafluoropropionate, and tertiary butyl crotonate; cyclic carboxylic acid esters such as phenolphthalein and vanilloyl phthalide; ethyl methanesulfonate, methyl methanesulfonate, methanesulfon Acid 2 -Methoxyethyl, 2-isopropoxyethyl methanesulfonate, phenyl p-toluenesulfonate, ethyl p-toluenesulfonate, methyl p-toluenesulfonate, 2-phenylethyl p-toluenesulfonate , N-propyl p-toluenesulfonate, n-butyl p-toluenesulfonate, third butyl p-toluenesulfonate, n-hexyl p-toluenesulfonate, n-heptyl p-toluenesulfonate, n-octyl p-toluenesulfonate, p 2-methoxyethyl tosylate, propargyl p-toluenesulfonate, 3-butynyl p-toluenesulfonate, ethyl trifluoromethanesulfonate, n-butyl trifluoromethanesulfonate, perfluorobutane Ethyl sulfonate, methyl perfluorobutanesulfonate, benzyl (4-hydroxyphenyl) methyl hexafluoroantimonate, benzyl (4-hydroxyphenyl) methyl hexafluorophosphate, tris Sulfonates such as methyl sulfonate methylsulfate, tri-p-fujitrifluoromethanesulfonate, trimethylfamium trifluoromethanesulfonate, pyridinium-p-toluenesulfonate, and ethyl perfluorooctanesulfonate Esters; 1,4-butane sultone, 2,4-butane sultone, 1,3-propane sultone, phenol red, bromophenol green, bromophenol violet and other cyclic sulfonates; Aromatic carboxylic anhydrides such as 2-sulfobenzoic anhydride, p-toluenesulfonic anhydride, and phthalic anhydride. When the thermal acid generator is used, it is preferably 0.1 to 30 parts by mass, more preferably 0.5 to 10 parts by mass, and still more preferably 1 to 5 parts by mass relative to (A) 100 parts by mass of the phenol resin. Copies. If the blending amount is 0.1 parts by mass or more, the effect of maintaining the shape of the pattern after heat curing is good. On the other hand, if the blending amount is 30 parts by mass or less, it will not adversely affect the performance of the lithography method, and the composition Good stability. Examples of the silane coupling agent include 3-mercaptopropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name KBM803, manufactured by Chisso Co., Ltd .: trade name Sila-Ace S810), 3-mercaptopropyl Triethoxysilane (manufactured by AZmax Co., Ltd .: trade name SIM6475.0), 3-mercaptopropylmethyldimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name LS1375, manufactured by AZmax Co., Ltd .: Trade name SIM6474.0), mercaptomethyltrimethoxysilane (made by AZmax Co., Ltd .: trade name SIM6473.5C), mercaptomethyl methyldimethoxysilane (made by AZmax Co., Ltd .: trade name SIM6473.0 ), 3-mercaptopropyl diethoxymethoxysilane, 3-mercaptopropyl diethoxydimethoxysilane, 3-mercaptopropyltripropoxysilane, 3-mercaptopropyl diethoxy Propyloxysilane, 3-mercaptopropyl diethoxydipropoxysilane, 3-mercaptopropyldimethoxypropoxysilane, 3-mercaptopropylmethoxydipropoxysilane, 2 -Mercaptoethyl trimethoxysilane, 2-mercaptoethyl diethoxymethoxysilane, 2-mercaptoethyl diethoxydi Methoxysilane, 2-mercaptoethyltripropoxysilane, 2-mercaptoethyltripropoxysilane, 2-mercaptoethyl diethoxydipropoxysilane, 2-mercaptoethyldimethoxy Propyloxysilane, 2-mercaptoethylmethoxydipropoxysilane, 4-mercaptobutyltrimethoxysilane, 4-mercaptobutyltriethoxysilane, 4-mercaptobutyltripropoxysilane Silane, N- (3-triethoxysilylpropyl) urea (manufactured by Shin-Etsu Chemical Co., Ltd .: trade name LS3610, manufactured by AZmax Co., Ltd .: trade name SIU9055.0), N- (3-trimethoxy) Silylpropyl) urea (manufactured by AZmax Co., Ltd .: trade name SIU9058.0), N- (3-diethoxymethoxysilylpropyl) urea, N- (3-diethoxydi Methoxysilylpropyl) urea, N- (3-tripropoxysilylpropyl) urea, N- (3-diethoxypropoxysilylpropyl) urea, N- (3- Diethoxydipropoxysilylpropyl) urea, N- (3-dimethoxypropoxysilylpropyl) urea, N- (3-methoxydipropoxysilylpropyl) ) Urea, N- (3-trimethoxysilylethyl) urea, N- (3-diethoxydimethoxysilylethyl) urea, N- (3 -Tripropoxysilylethyl) urea, N- (3-tripropoxysilylethyl) urea, N- (3-diethoxydipropoxysilylethyl) urea, N- (3-Dimethoxypropoxysilylethyl) urea, N- (3-methoxydipropoxysilylethyl) urea, N- (3-trimethoxysilylbutyl) urea , N- (3-triethoxysilylbutyl) urea, N- (3-tripropoxysilylbutyl) urea, 3- (m-aminophenoxy) propyltrimethoxysilane ( Made by AZmax Co., Ltd .: trade name SLA0598.0), m-aminophenyltrimethoxysilane (made by AZmax Co., Ltd .: trade name SLA0599.0), p-aminophenyltrimethoxysilane (AZmax Co., Ltd. Production: trade name SLA0599.1) aminophenyltrimethoxysilane (product made by AZmax Co., Ltd .: trade name SLA0599.2), 2- (trimethoxysilylethyl) pyridine (product made by AZmax Co., Ltd .: trade product Name SIT8396.0), 2- (triethoxysilylethyl) pyridine, 2- (dimethoxysilylmethylethyl) pyridine, 2- (diethoxysilylmethylethyl) Pyridine, (3-triethoxysilylpropyl) -third butyl carbamate, (3-glycidyl Propyl) triethoxysilane, tetramethoxysilane, tetradiethoxysilane, tetra-n-propoxysilane, tetra-isopropoxysilane, tetra-n-butoxysilane, tetra-iso Butoxysilane, tetra-third butoxysilane, tetra (methoxydiethoxysilane), tetra (methoxy-n-propoxysilane), tetra (diethoxydiethoxysilane) ), Tetra (methoxydiethoxydiethoxysilane), bis (trimethoxysilyl) ethane, bis (trimethoxysilyl) hexane, bis (triethoxysilyl) methane , Bis (triethoxysilyl) ethane, bis (triethoxysilyl) ethylene, bis (triethoxysilyl) octane, bis (triethoxysilyl) octadiene, di [3- (Triethoxysilyl) propyl] disulfide, bis [3- (triethoxysilyl) propyl] tetrasulfide, di-third butoxydiethoxysilane 、 Diisobutoxyaluminumoxytriethoxysilane, bis (glutaric acid) titanium-O, O'-bis (oxyethyl) -aminopropyltriethoxysilane, phenylsilane Alcohol, methylphenylsilanediol, ethylphenylsilanediol, n-propylphenylsilanediol, isopropylphenylsilanediol N-butyldiphenylsilanediol, isobutylphenylsilanediol, third butylphenylsilanediol, diphenylsilanediol, dimethoxydiphenylsilane, diethoxydi Phenylsilane, dimethoxydi-p-tolylsilane, ethylmethylphenylsilanol, n-propylmethylphenylsilanol, isopropylmethylphenylsilanol, n-butylmethylphenylsilan Alcohol, isobutyl methyl phenyl silanol, tertiary butyl methyl phenyl silanol, ethyl n-propyl phenyl silanol, ethyl isopropyl phenyl silanol, n-butyl ethyl phenyl silanol, iso Butyl ethyl phenyl silanol, third butyl ethyl phenyl silanol, methyl diphenyl silanol, ethyl diphenyl silanol, n-propyl diphenyl silanol, isopropyl diphenyl Silanol, n-butyl diphenyl silanol, isobutyl diphenyl silanol, tertiary butyl diphenyl silanol, triphenyl silanol, etc. These can be used alone or in combination. As the silane coupling agent, from the viewpoint of storage stability, the silane coupling agent is preferably phenylsilanetriol, trimethoxyphenylsilane, trimethoxy (p-tolyl) silane, diphenylsilane Diol, dimethoxydiphenylsilane, diethoxydiphenylsilane, dimethoxydi-p-tolylsilane, triphenylsilanol, and the following formula: [Chem 34] The compound represented. The blending amount when using a silane coupling agent is preferably 0.01 to 20 parts by mass relative to 100 parts by mass of the phenol resin (A). Examples of the dye include methyl violet, crystal violet, and malachite green. The blending amount of the dye is preferably 0.1 to 30 parts by mass relative to 100 parts by mass of the phenol resin (A). As the dissolution accelerator, a compound having a hydroxyl group or a carboxyl group is preferred. Examples of the compound having a hydroxyl group include a ballast used for the naphthoquinone diazide compound, p-cumylphenol, bisphenols, resorcinol, MtrisPC, MtetraPC, etc. Non-linear phenolic compounds such as chain phenolic compounds, TrisP-HAP, TrisP-PHBA, TrisP-PA (all manufactured by Honshu Chemical Industry Co., Ltd.), 2 to 5 phenol substitutions of diphenylmethane, 3 1 to 5 phenol substitutes of 1,3-diphenylpropane, 2,2-bis- (3-amino-4-hydroxyphenyl) hexafluoropropane and 5-norene-2,3-di A compound obtained by reacting a carboxylic acid anhydride at a molar ratio of 1: 2, and a bis- (3-amino-4-hydroxyphenyl) sulfone and 1,2-cyclohexyl dicarboxylic anhydride at a molar ratio of 1: 2 The compound obtained by the reaction, N-hydroxysuccinimide, N-hydroxyphthalimide, N-hydroxy 5-norene-2,3-dicarboxyimidimide, etc. Examples of compounds having a carboxyl group include 3-phenyllactic acid, 4-hydroxyphenyllactic acid, 4-hydroxymandelic acid, 3,4-dihydroxymandelic acid, 4-hydroxy-3-methoxy Amygdalic acid, 2-methoxy-2- (1-naphthyl) propionic acid, amygdalic acid, 2-phenyl lactic acid, α-methoxyphenyl acetic acid, O-acetyl acetyl mandelic acid, Iraq Kang acid and so on. When the dissolution accelerator is used, the blending amount is preferably 0.1 to 30 parts by mass relative to 100 parts by mass of (A) phenol resin. [Photosensitive resin composition containing polyimide precursor and / or alkali-soluble polyimide] (A) The polyimide precursor can be used as a photosensitive resin for the polyimide precursor composition. Examples are polyamides, polyamides, and the like. For example, as the polyamic acid ester, the following general formula (11) can be used: {In formula (11), R 1 And R 2 Are independently a hydrogen atom, a saturated aliphatic group having 1 to 30 carbon atoms, an aromatic group, a monovalent organic group having a carbon-carbon unsaturated double bond, or a monovalent ion having a carbon-carbon unsaturated double bond, X 1 Is a tetravalent organic radical, Y 1 It is a divalent organic group, m is an integer of 1 or more, and m is preferably 2 or more, more preferably 5 or more} a repeating unit represented by a polyamide. R of the above general formula (11) 1 And R 2 When present in the form of a monovalent cation, O is negatively charged (ie, -O - Form exists). Again, X 1 And Y 1 It may also contain hydroxyl groups. R in general formula (11) 1 And R 2 は, preferably the following general formula (12): [Chem 36] {In formula (12), R 3 , R 4 And R 5 Are independently hydrogen atoms or organic groups having 1 to 5 carbon atoms, and m 1 Is an integer from 1 to 20} represents a monovalent organic group, or the following general formula (13): [Chem 37] {In formula (13), R 6 , R 7 And R 8 Are independently hydrogen atoms or organic groups having 1 to 5 carbon atoms, and m 2 It is an integer of 1-20} The structure of the monovalent organic group with ammonium ion at the end. It is also possible to mix a plurality of polyamides represented by the general formula (11). In addition, a polyamic acid ester obtained by copolymerizing the polyamic acid esters represented by the general formula (11) with each other can also be used. X in formula (11) 1 From the viewpoint of hot meltability, a tetravalent organic group containing an aromatic group is preferred. Specifically, X 1 Preferably, it contains the following general formulas (2) to (4): [化 39] [化 40] {In formula (4), R 9 It is any one of an oxygen atom, a sulfur atom, and a divalent organic group} and represents a tetravalent organic group of at least one structure. R in general formula (4) 9 For example, it is a divalent organic group having 1 to 40 carbon atoms or a halogen atom. R 9 It may also contain hydroxyl groups. From the viewpoint of hot meltability, X 1 It is especially preferred to include the following general formula (5): [Chem. 41] The tetravalent organic group of the structure shown. From the viewpoint of the adhesion between the interlayer insulating film and the sealing material, Y in formula (11) 1 It is preferably a divalent organic group containing an aromatic group. Specifically, Y 1 It is preferable to include the following general formulas (6) to (8): {In formula (6), R 10 , R 11 , R 12 And R 13 It is a hydrogen atom and a monovalent aliphatic group with 1 to 5 carbon atoms, which may be the same or different} [Chem 43] {In formula (7), R 14 ~ R twenty one It is a hydrogen atom, a halogen atom, a monovalent organic group having 1 to 5 carbon atoms, which may be different from each other or the same} [Chem 44] {In formula (8), R twenty two Is a divalent base, R twenty three ~ R 30 It is a hydrogen atom, a halogen atom, a monovalent aliphatic group having 1 to 5 carbon atoms, which may be the same or different) a divalent organic group represented by at least one structure. R in general formula (8) twenty two For example, it is a divalent organic group having 1 to 40 carbon atoms or a halogen atom. From the viewpoint of hot meltability, as Y 1 , Particularly preferably contains the following general formula (9): [Chem 45] The divalent organic group of the structure shown. In the above-mentioned polyamide, X in the repeating unit 1 From tetracarboxylic dianhydride used as raw material, Y 1 From the diamine used as a raw material. The tetracarboxylic dianhydride used as a raw material is not limited, and examples include pyromellitic dianhydride, diphenyl ether-3,3 ', 4,4'-tetracarboxylic dianhydride, and benzophenone-3. , 3 ', 4,4'-tetracarboxylic dianhydride, biphenyl-3,3', 4,4'-tetracarboxylic dianhydride, diphenyl sulfone-3,3 ', 4,4'-tetra Carboxylic dianhydride, diphenylmethane-3,3 ', 4,4'-tetracarboxylic dianhydride, 2,2-bis (3,4-phthalic anhydride) propane, 2,2-bis ( 3,4-phthalic anhydride) -1,1,1,3,3,3-hexafluoropropane, etc. In addition, these may be used alone, or two or more types may be mixed and used. Examples of the diamine used as the raw material include p-phenylene diamine, m-phenylene diamine, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 3, 3'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfide, 4 , 4'-Diamino diphenyl satin, 3,4'-diamino diphenyl satin, 3,3'-diamino diphenyl satin, 4,4'-diamino biphenyl , 4'-diaminobiphenyl, 3,3'-diaminobiphenyl, 4,4'-diaminobenzophenone, 3,4'-diaminobenzophenone, 3,3 '-Diaminobenzophenone, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 1,4- Bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, bis [4- (4 -Aminophenoxy) phenyl] lanthanum, bis [4- (3-aminophenoxy) phenyl] lanthanum, 4,4-bis (4-aminophenoxy) biphenyl, 4,4 -Bis (3-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (3-aminophenoxy) phenyl] ether, 1,4-bis (4-aminophenyl) benzene, 1,3-bis (4-aminophenyl) benzene, 9,10-bis (4-aminophenyl) anthracene, 2,2-bis (4- Aminophenyl) propane, 2,2-bis (4-aminophenyl) hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl) propane, 2,2- Bis (4- (4-aminophenoxy) phenyl) hexafluoropropane, 1,4-bis (3-aminopropyldimethylsilyl) benzene, o-tolidine, 9,9- Bis (4-aminophenyl) stilbene etc. It may also be one in which a part of hydrogen atoms on the benzene rings are substituted. In addition, these may be used alone, or two or more types may be mixed and used. In the synthesis of polyamide (A), the following method is generally preferably used, that is, the tetracarboxylic acid diester obtained by performing the esterification reaction of the following tetracarboxylic dianhydride is directly used in Amine condensation reaction. The alcohol used in the esterification reaction of the tetracarboxylic dianhydride is an alcohol having an olefinic double bond, and specific examples include 2-hydroxyethyl methacrylate, 2-methacryloyl alcohol, Glycerin diacrylate, glycerol dimethacrylate, etc., but not limited to these. These alcohols can be used individually or in mixture of 2 or more types. Regarding the specific synthesis method of the polyamide (A) used in the present embodiment, a conventionally known method can be used. Regarding the synthesis method, for example, the method shown in International Publication No. 00/43439 can be cited. That is, the tetracarboxylic acid diester is converted into tetracarboxylic acid diester diacid chloride in one go, and the tetracarboxylic acid diester diacid chloride and diamine are used in a condensation reaction in the presence of a basic compound, thereby Manufacture of polyamide (A). In addition, as a synthesis method, a method of producing a polyamic acid ester (A) by a method of using a tetracarboxylic acid diester and a diamine in a condensation reaction in the presence of an organic dehydrating agent can be cited. Examples of organic dehydrating agents include: dicyclohexylcarbodiimide (DCC), diethylcarbodiimide, diisopropylcarbodiimide, ethylcyclohexylcarbodiimide , Diphenylcarbodiimide, 1-ethyl-3- (3-dimethylaminopropyl) carbodiimide, 1-cyclohexyl-3- (3-dimethylaminopropyl) Carbodiimide hydrochloride, etc. The weight average molecular weight of the polyamide (A) used in this embodiment is preferably 6,000 to 150,000, more preferably 7,000 to 50,000, and even more preferably 7,000 to 20,000. (B1) When the photoinitiator is in the negative photosensitive resin, the photoinitiator is added to the resin composition. As the photoinitiator, for example, benzophenone, methyl o-benzoyl benzoate, 4-benzoyl-4'-methyldiphenyl ketone, dibenzyl ketone, stilbene, etc. Benzophenone derivatives; 2,2'-diethoxyacetophenone, 2-hydroxy-2-methylacetonone and other acetophenone derivatives; 1-hydroxycyclohexyl phenyl ketone, 9-oxygen sulfur , 2-Methyl 9-oxysulfur , 2-isopropyl 9-oxysulfur , And diethyl 9-oxysulfur 9-oxygen sulfur Derivatives; Benzoyl derivatives such as benzoyl, benzoyl dimethyl ketal, benzoyl-β-methoxyethyl acetal; benzoin derivatives such as benzoin methyl ether; 2,6-di 4'-diazidebenzylidene) -4-methylcyclohexanone and 2,6'-bis (4'-diazidebenzylidene) cyclohexanone and other azides; 1-benzene -1,2-Butanedione-2- (O-methoxycarbonyl) oxime, 1-phenylpropanedione-2- (O-methoxycarbonyl) oxime, 1-phenylpropanedione- 2- (O-diethoxycarbonyl) oxime, 1-phenylpropanedione-2- (O-benzoyl) oxime, 1,3-diphenylpropanetrione-2- (O-di Ethoxycarbonyl) oxime, 1-phenyl-3-diethoxypropane trione-2- (O-benzyl) oxime and other oximes; N-phenylglycine and other N-arylglycines Amino acids; peroxides such as benzoyl peroxide; aromatic biimidazoles; and titanocenes. Among these, the oximes described above are preferred in terms of light sensitivity. The amount of the photoinitiator added is preferably 1 to 40 parts by mass relative to 100 parts by mass of the polyamide (A), more preferably 2 to 20 parts by mass. By adding 1 part by mass or more of the photoinitiator to 100 parts by mass of the polyamide (A), the light sensitivity is excellent. In addition, by adding 40 parts by mass or less of a photoinitiator, the thick film curability is excellent. (B2) When the photoacid generator is in a positive photosensitive resin, a photoacid generator is added to the resin composition. When the resin composition contains a photo-acid generator, an acid is generated in the ultraviolet exposure part, and the solubility of the exposure part in the aqueous alkali solution increases. By this, the resin can be used as a positive photosensitive resin composition. Examples of the photoacid generator include quinonediazide compounds, osmium salts, phosphonium salts, diazonium salts, and iodonium salts. Among them, the quinonediazide compound is preferably used from the viewpoint of exhibiting an excellent dissolution inhibition effect and obtaining a high-sensitivity positive photosensitive resin composition. In addition, two or more kinds of photoacid generators may be contained. (C) Solvent (C) The solvent is the same as the solvent described in the above item [Photosensitive Resin Composition Containing Phenolic Resin]. The type and amount of the preferable solvent are also the same as those described in the above item [Photosensitive Resin Composition Containing Phenolic Resin]. <Polyimide> The structure of the hardened relief pattern formed from the above polyimide precursor composition is represented by the following general formula (1): [Chem 46] {In formula (1), X 1 , Y 1 , And m can be defined as X in the general formula (11) 1 , Y 1 , And m are the same, for example, X 1 Is a tetravalent organic radical, Y 1 It is a divalent organic group, and m is an integer of 1 or more}. For the same reason as explained for the general formula (11), the preferred X in the general formula (11) 1 , Y 1 , And m are also preferable in the polyimide represented by the general formula (1). In the case of alkali-soluble polyimide, the terminal of the polyimide can also be substituted with a hydroxyl group. [Photosensitive resin composition containing polybenzoxazole precursor] (A) Polybenzoxazole precursor As the photosensitive resin used for the polybenzoxazole precursor composition, the following general formula can be used: (14): [Chem 47] {In formula (14), U and V are each independently a divalent organic group} Poly (o-hydroxyamide) of the repeating unit represented by From the viewpoint of hot meltability, U in formula (14) is preferably a divalent organic group having 1 to 30 carbon atoms, and more preferably a chain extended alkyl group having 1 to 15 carbon atoms (wherein, the chain extended The hydrogen atom of the alkyl group may also be replaced by a halogen atom), particularly preferably a linear alkylene group having 1 to 8 carbon atoms and a part or all of the hydrogen atoms being replaced by fluorine atoms. Further, from the viewpoint of hot meltability, V in formula (14) is preferably a divalent organic group containing an aromatic group, and more preferably including the following general formulas (6) to (8): ] {In formula (6), R 10 , R 11 , R 12 And R 13 It is a hydrogen atom and a monovalent aliphatic group with 1 to 5 carbon atoms, which may be the same or different} [Chem 49] {In formula (7), R 14 ~ R twenty one It is a hydrogen atom, a halogen atom, a monovalent organic group having 1 to 5 carbon atoms, which may be different from each other or the same} [Chem 50] {In formula (8), R twenty two Is a divalent base, R twenty three ~ R 30 It is a hydrogen atom, a halogen atom, a monovalent aliphatic group having 1 to 5 carbon atoms, which may be the same or different} and a divalent organic group represented by at least one structure. R in general formula (8) twenty two For example, it is a divalent organic group having 1 to 40 carbon atoms or a halogen atom. From the viewpoint of hot meltability, V particularly preferably includes the following general formula (9): The divalent organic group of the structure shown. From the viewpoint of hot meltability, V is preferably a divalent organic group having 1 to 40 carbon atoms, more preferably a divalent chain aliphatic group having 1 to 40 carbon atoms, and particularly preferably 1 to 20 carbon atoms. Divalent chain aliphatic group. Polybenzoxazole precursors can generally be synthesized from dicarboxylic acid derivatives and hydroxyl-containing diamines. Specifically, after converting a dicarboxylic acid derivative into a dihalide derivative, a reaction with a diamine is carried out, whereby a polybenzoxazole precursor can be synthesized. The dihalide derivative is preferably a dichloride derivative. The dichloride derivative can be synthesized by acting a halogenating agent on the dicarboxylic acid derivative. As the halogenating agent, sulfenyl chloride, phospha chloride, phosphorus oxychloride, phosphorus pentachloride and the like used in ordinary chlorination reaction of carboxylic acid can be used. As a method of synthesizing the dichloride derivative, there are a method of reacting the dicarboxylic acid derivative and the above halogenating agent in a solvent, and a method of distilling off excess components after reacting in an excess halogenating agent. Examples of dicarboxylic acids used as dicarboxylic acid derivatives include isophthalic acid, terephthalic acid, 2,2-bis (4-carboxyphenyl) -1,1,1,3,3, 3-Hexafluoropropane, 4,4'-dicarboxybiphenyl, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxytetraphenylsilane, bis (4-carboxyphenyl) benzene, 2 , 2-bis (p-carboxyphenyl) propane, 5-tert-butylisophthalic acid, 5-bromoisophthalic acid, 5-fluoroisophthalic acid, 5-chloroisophthalic acid, 2,6 -Naphthalene dicarboxylic acid, malonic acid, dimethylmalonic acid, ethylmalonic acid, isopropylmalonic acid, di-n-butylmalonic acid, succinic acid, tetrafluorosuccinic acid, methyl succinic acid Acid, 2,2-dimethylsuccinic acid, 2,3-dimethylsuccinic acid, dimethylmethylsuccinic acid, glutaric acid, hexafluoroglutaric acid, 2-methylglutaric acid, 3- Methylglutaric acid, 2,2-dimethylglutaric acid, 3,3-dimethylglutaric acid, 3-ethyl-3-methylglutaric acid, adipic acid, octafluoroadipic acid , 3-methyladipic acid, octafluoroadipic acid, suberic acid, 2,2,6,6-tetramethyl suberic acid, suberic acid, dodecylfluoro suberic acid, azelaic acid, decane Diacid, hexadecanoic acid, 1,9-azelaic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, seventeen Alkanedioic acid, octadecanedioic acid, nonadecanodioic acid, eicosanedioic acid, eicosanedioic acid, behendioic acid, tricosanedioic acid, tetracosanedioic acid, Pentacosanedioic acid, hexacosanedioic acid, hexacosanedioic acid, octacosanedioic acid, cosanoic acid, tricosanedioic acid, tricosanedioic acid, thirty Dioxanedioic acid, diglycolic acid, etc. These can also be mixed and used. Examples of hydroxyl-containing diamines include 3,3'-diamino-4,4'-dihydroxybiphenyl, 4,4'-diamino-3,3'-dihydroxybiphenyl, and bis ( 3-amino-4-hydroxyphenyl) propane, bis (4-amino-3-hydroxyphenyl) propane, bis (3-amino-4-hydroxyphenyl) lanthanum, bis (4-amino- 3-hydroxyphenyl) sulfone, 2,2-bis (3-amino-4-hydroxyphenyl) -1,1,1,3,3,3-hexafluoropropane, 2,2-bis (4- (Amino-3-hydroxyphenyl) -1,1,1,3,3,3-hexafluoropropane, etc. These can also be mixed and used. (B2) Photoacid generator The photoacid generator has the function of increasing the solubility of the aqueous alkali solution in the light irradiation section. Examples of the photo-acid generator include diazonaphthoquinone compounds, aryldiazonium salts, diarylphosphonium salts, triarylammonium salts, and the like. Among them, the sensitivity of the diazonaphthoquinone compound is higher and better. (C) Solvent (C) The solvent is the same as the solvent described in the above item [Photosensitive Resin Composition Containing Phenolic Resin]. The type and amount of the preferable solvent are also the same as those described in the above item [Photosensitive Resin Composition Containing Phenolic Resin]. <Polybenzoxazole> The structure of the hardened relief pattern formed from the above polybenzoxazole precursor composition is represented by the following general formula (10): [Chemical 52] {In formula (10), U and V are the same as U and V defined in the above general formula (14)}. For the same reasons as explained for the general formula (14), the preferred U and V in the general formula (14) are also preferred in the polybenzoxazole of the general formula (10). The photosensitive resin composition of the first embodiment may include at least one selected from the group consisting of a phenol resin, a polyimide precursor, a polybenzoxazole precursor, and a soluble polyimide. From the viewpoint of meltability, it is preferable to include a phenol resin. <Second embodiment: low-melt viscosity photosensitive layer roll> The photosensitive layer roll of the second embodiment of the present invention includes: a support film; and a photosensitive layer including a photosensitive resin combination provided on the support film The photosensitive resin composition includes at least one resin selected from the group consisting of phenol resin, polyimide precursor, polybenzoxazole precursor, and soluble polyimide, and the photosensitive layer It is a layer having a temperature point at which the melt viscosity becomes 500 Pa · s or less. In the previous photosensitive layer drum, due to the high melt viscosity of the photosensitive layer, there is a problem that cracks are likely to occur even when the teeth of the slitter are heated and cut during cutting. In order to solve the above problem, the photosensitive layer roll of the second embodiment is characterized in that the photosensitive layer is a layer having a temperature point at which the melt viscosity becomes 500 Pa · s or less. The photosensitive layer of this embodiment is a layer having a temperature point at which the melt viscosity becomes 500 Pa · s or less. The photosensitive layer preferably has a temperature point at which the melt viscosity becomes 450 Pa · s or less, preferably has a temperature point at 400 Pa · s or less, and preferably has a temperature point at 350 Pa · s or less The layer is preferably a layer having a temperature point below 300 Pa · s, preferably a layer having a temperature point below 250 Pa · s, and preferably a layer having a temperature point below 200 Pa · s. By reducing the melt viscosity of the photosensitive layer, it is possible to suppress the occurrence of cracks when cutting, especially when heating the teeth of the slitter to cut. The melt viscosity of the photosensitive layer in this embodiment at 100 ° C is preferably 500 Pa · s or less, preferably 450 Pa · s or less, preferably 400 Pa · s or less, preferably 350 Pa · s or less, It is preferably 300 Pa · s or less, preferably 250 Pa · s or less, preferably 200 Pa · s or less, preferably 150 Pa · s or less, preferably 100 Pa · s or less. The photosensitive layer roll of the second embodiment may have a coating on the side of the photosensitive layer opposite to the side on which the support film is provided. If there is a coating, there is a possibility of wrinkles when cutting, especially when the teeth of the cutting machine are heated and cutting, so it is better not to provide a coating, or use a higher softening temperature Laminating. The softening point temperature of the film is preferably 90 ° C or higher, preferably 100 ° C or higher, preferably 110 ° C or higher, preferably 120 ° C or higher, preferably 130 ° C or higher. The material of the coating is not particularly limited as long as it satisfies the above-mentioned softening point temperature. The melt viscosity of the photosensitive layer can be adjusted by the type and / or amount of the organic solvent contained in the photosensitive layer. The details are described below. The other points are the same as those described in the above item <First Embodiment: Two-Layer Photographic Layer Reel>. <Preparation and use of photosensitive layer roll> The method for producing the photosensitive film of this embodiment will be described. The photosensitive layer can be formed by applying the above-mentioned photosensitive resin composition in the form of a liquid photosensitive resin composition on a support film. Examples of the coating method include roll coater, corner coater, gravure coater, air knife coater, die coater, and bar coater. In addition, the removal of the solvent (C) can be performed by heating, for example. From the viewpoint of the residual amount of organic solvent in the photosensitive layer, when removing the organic solvent, the heating temperature is preferably about 70 to 150 ° C, more preferably 100 to 140 ° C, and / or the heating time is preferably about 1 minute -30 minutes, more preferably about 3-20 minutes, and still more preferably about 4-10 minutes. In addition, the thickness of the photosensitive layer varies depending on the application, and the thickness after removing the solvent is preferably about 1 to 30 μm. The photosensitive film may further be provided with an intermediate layer or coating film such as a buffer layer, an adhesive layer, a light absorption layer, and a gas barrier layer between the support film and the photosensitive layer. For example, the photosensitive film can be wound up to a core having a cylindrical shape or the like to form a photosensitive layer roll and stored in a roll shape. The winding core is not particularly limited as long as it is a previous user. Examples of the material include polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, and ABS resin (acrylonitrile-butadiene- styrene, acrylonitrile-butadiene-styrene copolymer) and other plastics. During storage, it is preferable to wind up so that the support film becomes the outermost side. In addition, from the viewpoint of end face protection, it is preferable to provide an end face separator at the end face of the photosensitive film (photosensitive film roll) wound into a roll shape, and from the viewpoint of resistance to edge fusion, It is preferable to provide a moisture-proof end partition. In addition, when the photosensitive film or the photosensitive layer roll is bundled, it is preferably wrapped in a thin black sheet with a low moisture permeability and packaged. <Cutting of photosensitive layer roll> By cutting the produced photosensitive layer roll to a desired width with a slitter, a slit photosensitive layer roll can be manufactured. From the viewpoint of suppressing wrinkles or cracks on the cut surface of the slitter, it is preferable to heat the teeth of the slitter. The heating temperature of the teeth of the slitter can be above 80 ° C, above 90 ° C, above 100 ° C, above 110 ° C, above 120 ° C, and above 130 ° C. When the photosensitive layer roll is covered with a film, there is a possibility that the film will be wrinkled during cutting, especially when the teeth of the cutting machine are heated to cut, there is a large wrinkle in the film possibility. From the viewpoint of suppressing the wrinkle of the coating film generated during cutting, the method for manufacturing the slit photosensitive layer roll preferably includes the steps of: providing the support film on the photosensitive layer roll and the photosensitive layer When there is a film on the opposite side, peel the film; cut the photosensitive layer roll without the film with a slitter; and apply the peeling to the cut photosensitive layer roll The coating film or a coating film different from the peeled coating film. <Lamination of photosensitive layer to substrate> As a method of laminating the photosensitive layer of the slit photosensitive layer roll onto the substrate, the photosensitive layer may be heated to about 70 to 130 ° C. and at about 0.1 to 1 MPa (i.e. , 1 ～ 10 kgf / cm 2 The method of pressure bonding to the base material using a laminating machine etc. under the pressure of left and right). The lamination step can also be performed under reduced pressure. The surface of the base material of the laminated photosensitive layer is not particularly limited. In the case of the two-layer photosensitive layer roll of the first embodiment, since there is no coating, there is a possibility that the photosensitive layer is attached to the support film (risk of adhesion). On the other hand, if the adhesiveness of the photosensitive layer is reduced, there is a possibility that the photosensitive layer is not adhered when laminated on the substrate. That is, the two-layer photosensitive layer roll of the first embodiment preferably has a low adhesiveness in a storage state, that is, at room temperature, and exhibits a high adhesiveness when heated when it is laminated onto a substrate. From the viewpoint of achieving both the adhesion at room temperature and the formation of a photosensitive film that easily melts due to heat, the amount of residual organic solvent in the photosensitive layer is preferably 0.1% by mass or more and 15% relative to the total amount of the photosensitive layer Mass% or less, preferably 0.3 mass% or more and 15 mass% or less, preferably 0.5 mass% or more and 15 mass% or less, preferably 0.8 mass% or more and 15 mass% or less, preferably 1 mass% or more And 15 mass% or less, preferably 3 mass% or more and 14 mass% or less, preferably 3 mass% or more and 13 mass% or less, more preferably 5 mass% or more and 13 mass% or less. If the amount of residual organic solvent in the photosensitive layer is within the above range, the adhesiveness is low at room temperature, and the photosensitive layer is rarely attached to the support film when the photosensitive layer roll is produced, and the photosensitive layer is heated and laminated It shows higher meltability on the substrate and shows higher adhesion. The organic solvent remaining in the photosensitive layer may be the solvent (C) described above, with regard to the solubility of the resin, the stability of the resin composition, the adhesion to the substrate, the hot meltability, the storage stability, and the adhesion From the viewpoint of sex, γ-butyrolactone, acetone, methyl ethyl ketone, N-methyl-2-pyrrolidone, dimethyl sulfoxide, propylene glycol monomethyl ether, third butanol and Tetrahydrofuran methanol, among which γ-butyrolactone, acetone, methyl ethyl ketone, N-methyl-2-pyrrolidone, and dimethyl sulfoxide are particularly preferred. In the case of the low-melt viscosity photosensitive layer roll of the second embodiment, it is also desirable to have a high melt viscosity at room temperature, and the adhesion of the photosensitive layer is low. In the case of cutting, cracks are not likely to occur due to the lower melt viscosity. The preferred amount of residual organic solvent in the photosensitive layer is the same as the above range. The melt viscosity of the photosensitive layer can be adjusted by the amount of organic solvent contained in the photosensitive layer. The greater the amount of organic solvent contained in the photosensitive layer, the lower the melt viscosity of the photosensitive layer. The amount of organic solvent in the photosensitive layer can be controlled by adjusting the heating temperature and / or heating time for removing the organic solvent. In addition, the melt viscosity of the photosensitive layer can also be adjusted by a method of reducing the molecular weight of the polymer and a method of adding a low-molecular component such as a plasticizer that does not thermally harden. The photosensitive layer laminated on the substrate in this way is irradiated with active light in the form of an image through a negative or positive mask pattern to form an exposed portion. At this time, when the support present on the photosensitive layer is transparent to the active light, the active light can be irradiated through the support. Active light. As the light source of the active light, X-rays, electron beams, ultraviolet rays, visible light, etc. can be used, preferably a wavelength of 200 to 500 nm. In terms of the resolution and operability of the pattern, the wavelength of the light source is preferably the area of the g-line, h-line or i-line of the mercury lamp. As the exposure device, an alignment machine, a parallel exposure machine, a mirror projection exposure machine, and a stepping exposure machine are preferred. After exposure, the coating film may be heated again at 80 to 140 ° C if necessary. Secondly, the developer can be used and developed from methods such as the dipping method, the coating method, and the spray method. By developing, the exposed portion (in the case of positive type) or the unexposed portion (in the case of negative type) can be eluted and removed from the coated photosensitive resin layer to obtain a relief pattern. As the developing solution, for example, inorganic bases such as sodium hydroxide, sodium carbonate, sodium silicate, and ammonia, organic amines such as ethylamine, diethylamine, triethylamine, and triethanolamine, tetramethylammonium hydroxide, and Aqueous solutions of quaternary ammonium salts such as butylammonium hydroxide, etc., and aqueous solutions in which water-soluble organic solvents such as methanol and ethanol or surfactants are added in appropriate amounts. Among these, an aqueous solution of tetramethylammonium hydroxide is preferred. The concentration of tetramethylammonium hydroxide is preferably 0.5 to 10% by mass, more preferably 1 to 5% by mass. After the development, the rinse solution is used for washing, and the developer solution is removed, thereby obtaining a substrate on which the relief pattern is formed. As the rinsing liquid, for example, distilled water, methanol, ethanol, isopropanol, etc. can be used, and these can be used alone or in combination of two or more kinds. Finally, by heating the relief pattern obtained in this way, a hardened relief pattern can be obtained. The heating temperature is preferably 150 ° C or higher and 300 ° C or lower, and more preferably 250 ° C or lower. The method for manufacturing the hardened relief pattern using the photosensitive layer roll of the first or second embodiment can be preferably used for surface protective films, interlayer insulating films, and rewiring insulating films for semiconductor devices, display devices, and light emitting devices , Redistribution layer for fan-out wafer-level packaging (FOWLP), protective film for flip-chip devices, high-density substrate, protective film for devices with bump structure, interlayer insulating film for multilayer circuits, flexible copper foil The coating of the cover part, the production of solder mask, liquid crystal alignment film, etc. The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. The present invention can be variously changed without departing from the gist thereof. [Examples] Hereinafter, the present invention will be described in more detail with examples, but the present invention is not limited to these examples. [Synthesis Example 1] <Synthesis of Phenol Resin (A-1)> In a separable flask with a capacity of 0.5 liter with a Dean-Stark device, 100.9 g (0.8 mol) of phloroglucinol, 4 , 4'-bis (methoxymethyl) biphenyl (hereinafter also referred to as "BMMB") 121.2 g (0.5 mol), diethyl sulfate 3.9 g (0.025 mol), and diethylene glycol dimethyl ether 140 g Mix and stir at 70 ° C to dissolve the solids. The mixed solution was heated to 140 ° C by an oil bath, and the generation of methanol was confirmed by the reaction solution, and the reaction solution was directly stirred at 140 ° C for 2 hours. Next, the reaction vessel was cooled in the atmosphere, and 100 g of tetrahydrofuran was additionally added and stirred. Under high-speed stirring, the reaction diluted solution was added dropwise to 4 L of water to disperse and precipitate the resin and recover it. After appropriate washing and dehydration, vacuum drying was performed to obtain a product containing resorcinol / BMMB at a yield of 70%. Copolymer (phenolic resin (A-1)). [Synthesis Example 2] <Synthesis of Phenol Resin (A-2)> 128.3 g (0.76 mol) of methyl 3,5-dihydroxybenzoate was used instead of Pyrogallol between Synthesis Example 1, and otherwise 1 Synthesis was carried out in the same manner, and a copolymer containing 3,5-dihydroxybenzoic acid methyl ester / BMMB (phenol resin (A-2)) was obtained at a yield of 65%. [Synthesis Example 3] <Synthesis of Phenolic Resin (A-3)> The separable flask with a Dean-Stark apparatus with a capacity of 1.0 L was replaced with nitrogen, and thereafter, the 81.3 g (0.738 mol) of hydroquinone, 84.8 g (0.35 mol) of BMMB, 3.81 g (0.02 mol) of p-toluenesulfonic acid, and 116 g of propylene glycol monomethyl ether (hereinafter also referred to as "PGME") were mixed at 50 ° C Stir to dissolve the solid matter. The mixed solution was heated to 120 ° C by an oil bath, and the generation of methanol was confirmed by the reaction solution, and the reaction solution was directly stirred at 120 ° C for 3 hours. Secondly, in a separate container, 24.9 g (0.150 mol) of 2,6-bis (hydroxymethyl) -p-cresol and 249 g of PGME were mixed and stirred to obtain a uniformly dissolved solution. It took 1 hour to use a dropping funnel This solution was added dropwise to the above separable flask, and after dropping, it was further stirred for 2 hours. After the reaction, the same treatment as in Synthesis Example 1 was carried out to obtain a copolymer (phenol-based resin (A- 3)). [Synthesis Example 4] <Synthesis of Polyimide Precursor (A-5)> In a separable flask with a capacity of 2 L, pyromellitic dianhydride 87.2 g (0.4 mol) and isobutanol 59.3 g (0.8 mol), and γ-butyrolactone (hereinafter also referred to as "GBL") 320 g was mixed and stirred at room temperature (25 ℃) to dissolve, and stirred under ice bath cooling and added 63.3 g of pyridine ( 0.8 mol), let cool to room temperature after exotherm, and let stand for 16 hours. Next, a solution prepared by dissolving 165 g (0.8 mol) of dicyclohexylcarbodiimide in 120 g of GBL was stirred under ice bath cooling and added to the above separable flask in 40 minutes. Then, a suspension of 4,4'-diaminodiphenyl ether 74.5 g (0.37 mol) suspended in GBL 150 g was stirred under ice bath cooling and added to the above separable flask in 60 minutes . After stirring at room temperature for 2 hours, 30 ml of ethanol was added to the above separable flask and stirred for 1 hour, and then 250 ml of methylacetamide (hereinafter referred to as "DMAc") and 400 ml of tetrahydrofuran (THF) were added, Thereafter, the precipitate was removed by suction filtration to obtain a reaction liquid. 15 L of ethanol was added to the obtained reaction liquid, and the resulting precipitate was filtered and separated, followed by vacuum drying to obtain a polyimide precursor (A-5). [Synthesis Example 5] <Synthesis of polybenzoxazole precursor (A-6)> In a separable flask with a capacity of 2 L, place 2,2-bis (3-amino-4-hydroxyphenyl) -197.8 g (0.54 mol) of hexafluoropropane, 75.9 g (0.96 mol) of pyridine, and 692 g of DMAc were mixed and stirred at room temperature (25 ° C) to dissolve it. To the obtained mixed solution was added dropwise via a dropping funnel to dissolve 19.7 g (0.12 mol) of 5-norene-2,3-dicarboxylic anhydride in diethylene glycol dimethyl ether (hereinafter also referred to as "DMDG") ) Solution made in 88 g. The time required for the dropwise addition was 40 minutes, and the maximum temperature of the reaction solution was 28 ° C. After the dropwise addition was completed, the reaction liquid was heated to 50 ° C with a hot water bath and stirred for 18 hours, and then the IR spectrum of the reaction liquid was measured to confirm that 1385 cm appeared -1 And 1772 cm -1 The characteristic absorption of the imide group. Next, the reaction liquid was cooled to 8 ° C by a water bath, and the reaction liquid was added dropwise via a dropping funnel to dissolve 142.3 g (0.48 mol) of 4,4'-diphenyl ether dicarboxylic acid dichloride in DMDG Solution made in 398 g. The time required for the dropwise addition was 80 minutes, and the maximum temperature of the reaction solution was 12 ° C. Three hours after the end of the dropwise addition, the reaction solution was added dropwise to 12 L of water under high-speed stirring to disperse and precipitate the polymer and recover it. After appropriately washing with water and dehydrating, vacuum drying was performed to obtain polybenzoxazole. Precursor (A-6). <Resin (A) and (A ')> A-1: a copolymer containing resorcinol / BMMB, polystyrene-equivalent weight average molecular weight (Mw) = 15,000 A-2: containing 3,5-dihydroxybenzene Methyl formate / BMMB copolymer, polystyrene equivalent weight average molecular weight (Mw) = 21,000 A-3: Resorcinol / BMMB / 2,6-bis (hydroxymethyl) -p-cresol copolymer , Polystyrene equivalent weight average molecular weight (Mw) = 9,900 A-4: Novolac resin, polystyrene equivalent weight average molecular weight (Mw) = 10,600 (manufactured by Asahi Organic Materials Co., Ltd., product name EP-4080G) A-5: Polyimide precursor A-6: polybenzoxazole precursor <photoacid generator (B)> B-1: photoacid generator represented by the following formula: [Chemical 53] {In the formula, 83% of Q is the following: [化 54] The structure shown, the rest are hydrogen atoms} <solvent (C)> C-1: γ-butyrolactone (GBL) C-2: methyl ethyl ketone C-3: acetone C-4: N, N- Dimethylformamide <Surfactant (D)> D-1: Silicone type surfactant DBE821 (trade name, manufactured by Gelest) D-2: Silicone type surfactant DBE224 (trade name, (Made by Gelest) <Crosslinking agent (E)> E-1: 1,3,4,6-tetra (methoxymethyl) glycoluril (manufactured by SANWA Chemical, trade name; NIKALACMX-270) [photosensitive resin Preparation of composition] According to the composition shown in Table 1 below, the resin (A), the photoacid generator (B), the surfactant (D), and the crosslinking agent (E) are dissolved in the solvent (C), Then, a 0.1 μm filter was used for filtration to prepare a positive photosensitive resin composition. [Table 1] [Support film] A PET film "PET25X" (manufactured by LINTEC Co., Ltd., width 290 mm, thickness 25 μm) which has undergone release treatment with polysilicon compounds is prepared as a support film. [Preparation of photosensitive film] (Example 1) Using "PET25X" as a release film as a support film, a photosensitive resin composition having the composition shown in Table 1 above was coated on the release surface Of solution. Next, the PET film coated with the solution of the photosensitive resin composition was dried under hot air at 120 ° C for 5 minutes to form a photosensitive layer. At this time, the thickness of the photosensitive layer after heating was 10 μm. For a cylindrical plastic tube with an outer diameter of 3.5 inches, use a pressure reel arranged parallel to the width direction of the reel to apply linear pressure to the plastic tube, and use the tension of 7 kg to photosensitive the 300 mm width of the above composition The film is wound up to 1000 m to obtain a photosensitive film roll. (Examples 2 to 14) Each photosensitive film roll was produced in the same order as in Example 1 except for using the ingredients, composition, and drying conditions shown in Table 1 above. (Comparative Examples 1 to 3) Using the components, compositions, and drying conditions shown in Table 1 above, and providing a photosensitive film roll with a coating having a softening temperature of 90 ° C on the photosensitive layer, the basis is otherwise In Example 1, each photosensitive film roll was produced in the same order. <Amount of Residual Solvent> The photosensitive film was rolled out from the photosensitive film rolls prepared in the examples and the comparative examples, the photosensitive layer was peeled from the support film, and a gas chromatograph (manufactured by Agilent Technology Co., Ltd., Trade name "6890N") The peeled photosensitive layer was analyzed to determine the amount of residual solvent (parts by mass) relative to 100 parts by mass of the phenol resin. <Melting Viscosity> The photosensitive film was rolled out from the photosensitive film rolls produced in Examples and Comparative Examples, the photosensitive layer was peeled from the support film, and a melt viscosity measuring device (manufactured by TA Instruments Japan Co., Ltd., product was used) Name "DHR-2"), the peeled photosensitive layer was measured under the following conditions. Table 1 shows the melt viscosity at a temperature of 100 ° C.・ Sample shape film thickness: 0.5 mmt Diameter: 25 mm disc ・ Measurement conditions Initial temperature: 50 ℃ Heating rate: 5 ℃ / min End temperature: 220 ℃ Strain: 0.1% Frequency: 1 Hz Load: 0.5 N (± 0.1 N) <Storage stability> The photosensitive film rolls produced in the examples and comparative examples were stored at room temperature (25 ° C) for more than 1 month, and then the roll out of the rolls was visually observed and according Evaluate based on the above criteria. S (significantly good): Even if stored in a roll form at room temperature for more than 1 month, the photosensitive layer does not adhere to the back of the support film. A (good): If stored in a roll form at room temperature for 1 month, part of the photosensitive layer is attached to the back of the support film. <Releasability of support film> The photosensitive film was rolled out from the photosensitive film rolls produced in the examples and the comparative examples, the photosensitive layer was heated to 130 ° C. and laminated on a glass plate to produce a photosensitive layer transferred Sample for characteristic evaluation. Then, the support film was peeled off from the sample for characteristic evaluation, and the transfer state of the photosensitive layer was evaluated by visual observation. S (significantly good): The photosensitive layer is not attached to the support film and can be peeled off and removed. A (Good): A part of the photosensitive layer is peeled off with the photosensitive layer attached to the support film. B (Bad): The entire surface of the photosensitive layer is peeled off with the photosensitive layer attached to the support film. <Cracks during cutting> The photosensitive film rolls produced in the examples and the comparative examples were cut with a slitter that heated the teeth to 100 ° C. The occurrence of cracks during cutting and the appearance of the cut surface were evaluated by visual inspection. S (significantly good): No cracks were generated, and the cut surface was smooth. A (good): No cracks were generated, but the cut surface was slightly uneven. B (bad): A crack is generated. <Wrinkle of the film> The photosensitive film roll produced in the comparative example was cut with a tooth-cutting machine heated to 100 ° C, and the wrinkle generated in the film was evaluated by visual observation. A (good): No wrinkles were generated in the film. B (Bad): Wrinkles are generated in the film. <Evaluation Results> For each Example and Comparative Example, the evaluation results of each characteristic are shown in Table 1 above. [Industrial Applicability] The photosensitive layer reel of the present invention can be preferably used as a surface protection film, an interlayer insulating film, an insulating film for redistribution of semiconductor devices, display devices, and light emitting devices, for wafer-level packaging Rewiring layer, protective film for flip-chip devices, high-density substrates, protective films for devices with bump structures, interlayer insulating films for multilayer circuits, coating of soft copper foil cover parts, solder resist films, and liquid crystal alignment Use of membranes, etc.

Claims (40)

一種感光層捲筒，其包含：支持體膜；及感光層，其設置於上述支持體膜上，且包含感光性樹脂組合物；且上述感光性樹脂組合物包含選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種樹脂，且上述感光層為具有熔融黏度成為500 Pa・s以下之溫度點之層。A photosensitive layer roll comprising: a support film; and a photosensitive layer provided on the support film and comprising a photosensitive resin composition; and the photosensitive resin composition comprises a resin selected from the group consisting of phenolic resins and polyamides At least one resin in the group consisting of an imine precursor, a polybenzoxazole precursor, and a soluble polyimide, and the photosensitive layer is a layer having a temperature point at which the melt viscosity becomes 500 Pa · s or less. 如請求項1之感光層捲筒，其中上述感光層為具有熔融黏度成為350 Pa・s以下之溫度點之層。The photosensitive layer roll according to claim 1, wherein the photosensitive layer is a layer having a temperature point at which the melt viscosity becomes 350 Pa · s or less. 如請求項1或2之感光層捲筒，其中上述感光層於100℃下之熔融黏度為500 Pa・s以下。The photosensitive layer reel as claimed in claim 1 or 2, wherein the melt viscosity of the photosensitive layer at 100 ° C is 500 Pa · s or less. 如請求項3之感光層捲筒，其中上述感光層於100℃下之熔融黏度為350 Pa・s以下。The photosensitive layer roll of claim 3, wherein the melt viscosity of the photosensitive layer at 100 ° C is 350 Pa · s or less. 如請求項1至4中任一項之感光層捲筒，其於上述感光層之與設置有上述支持體膜一側相反之側具有覆膜，且上述覆膜之軟化溫度為90℃以上。The photosensitive layer roll according to any one of claims 1 to 4, which has a coating on the side of the photosensitive layer opposite to the side on which the support film is provided, and the softening temperature of the coating is 90 ° C. or higher. 如請求項5之感光層捲筒，其中上述覆膜之軟化溫度為110℃以上。The photosensitive layer roll according to claim 5, wherein the softening temperature of the above-mentioned film is 110 ° C or higher. 如請求項1至6中任一項之感光層捲筒，其中上述感光層中所包含之有機溶劑之量相對於上述感光層之總量為0.1質量%以上且15質量%以下。The photosensitive layer roll according to any one of claims 1 to 6, wherein the amount of the organic solvent contained in the photosensitive layer is 0.1% by mass or more and 15% by mass or less relative to the total amount of the photosensitive layer. 如請求項7之感光層捲筒，其中上述感光層中所包含之有機溶劑之量相對於上述感光層之總量為1質量%以上且15質量%以下。The photosensitive layer roll according to claim 7, wherein the amount of the organic solvent contained in the photosensitive layer is 1% by mass or more and 15% by mass or less relative to the total amount of the photosensitive layer. 如請求項7或8之感光層捲筒，其中上述有機溶劑包含選自由γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮、二甲基亞碸、丙二醇單甲醚、第三丁醇及四氫呋喃甲醇所組成之群中之至少一種。The photosensitive layer roll as claimed in claim 7 or 8, wherein the above organic solvent comprises a group selected from At least one of the group consisting of propylene glycol monomethyl ether, third butanol and tetrahydrofuran methanol. 如請求項9之感光層捲筒，其中上述有機溶劑包含選自由γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮及二甲基亞碸所組成之群中之至少一種。The photosensitive layer reel as claimed in claim 9, wherein the above organic solvent comprises γ-butyrolactone, acetone, methyl ethyl ketone, N-methyl-2-pyrrolidone and dimethyl sulfoxide At least one of the group. 如請求項1至10中任一項之感光層捲筒，其中上述感光性樹脂組合物包含上述聚醯亞胺前驅物。The photosensitive layer roll according to any one of claims 1 to 10, wherein the photosensitive resin composition contains the polyimide precursor. 如請求項1至10中任一項之感光層捲筒，其中上述感光性樹脂組合物包含上述聚苯并㗁唑前驅物。The photosensitive layer roll according to any one of claims 1 to 10, wherein the photosensitive resin composition contains the polybenzoxazole precursor. 如請求項1至10中任一項之感光層捲筒，其中上述感光性樹脂組合物包含上述可溶性聚醯亞胺。The photosensitive layer roll according to any one of claims 1 to 10, wherein the photosensitive resin composition contains the soluble polyimide. 如請求項1至10中任一項之感光層捲筒，其中上述感光性樹脂組合物包含上述酚系樹脂。The photosensitive layer roll according to any one of claims 1 to 10, wherein the photosensitive resin composition contains the phenol resin. 如請求項14之感光層捲筒，其中上述酚系樹脂具有下述通式(1)：[化1](式1){式(1)中，a為1～3之整數，b為0～3之整數，1≦(a＋b)≦4，R1 表示選自由碳數1～20之一價有機基、鹵素原子、硝基及氰基所組成之群中之一價取代基，b為2或3之情形時複數個R1 分別可相同亦可不同，且X表示選自由可具有不飽和鍵之碳數2～10之二價鏈狀脂肪族基、碳數3～20之二價脂環式基、下述通式(2)：[化2](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及具有芳香族環之二價有機基所組成之群中之二價有機基} 所表示之結構作為重複單元。The photosensitive layer roll according to claim 14, wherein the phenol resin has the following general formula (1): [Chemical Formula 1] (Formula 1) {In formula (1), a is an integer of 1 to 3, b is an integer of 0 to 3, 1 ≦ (a + b) ≦ 4, R 1 represents a monovalent organic group selected from carbon numbers 1 to 20 , A halogen atom, a nitro group, and a monovalent substituent in the group consisting of cyano, when b is 2 or 3, a plurality of R 1 may be the same or different, and X represents selected from the group that may have an unsaturated bond A divalent chain aliphatic group having 2 to 10 carbon atoms, a divalent alicyclic group having 3 to 20 carbon atoms, and the following general formula (2): [Chem 2] (Formula 2) (In formula (2), p is an integer of 1 to 10) a divalent organic group represented by a divalent epoxyalkyl group and a divalent organic group having an aromatic ring} The structure shown serves as a repeating unit. 如請求項15之感光層捲筒，其中上述通式(1)中之X為選自由下述通式(3)：[化3](式3){式(3)中，R2 、R3 、R4 及R5 分別獨立地為氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，n1為0～4之整數，n1為1～4之整數之情形時R6 為鹵素原子、羥基、或一價有機基，至少1個R6 為羥基，n1為2～4之整數之情形時複數個R6 分別可相同亦可不同}所表示之二價基、及下述通式(4)：[化4】(式4){式(4)中，R7 、R8 、R9 及R10 分別獨立地表示氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，且W為選自由單鍵、可經氟原子取代之碳數1～10之鏈狀脂肪族基、可經氟原子取代之碳數3～20之脂環式基、下述通式(2)：[化5](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及下述式(5)：[化6](式5)所表示之二價基所組成之群中之二價有機基} 所表示之二價基所組成之群中之二價有機基。The photosensitive layer reel as in claim 15, wherein X in the above general formula (1) is selected from the following general formula (3): [化 3] (Formula 3) {In formula (3), R 2 , R 3 , R 4 and R 5 are each independently a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a part or all of a hydrogen atom is fluorinated Monovalent aliphatic group with 1 to 10 carbon atoms substituted by atoms, n1 is an integer of 0 to 4, when n1 is an integer of 1 to 4, R 6 is a halogen atom, a hydroxyl group, or a monovalent organic group, at least When one R 6 is a hydroxyl group and n1 is an integer of 2 to 4, the plural R 6 may be the same or different, respectively, the divalent group represented by}, and the following general formula (4): [Chem 4] (Formula 4) {In formula (4), R 7 , R 8 , R 9 and R 10 each independently represent a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a part or all of a hydrogen atom through fluorine A monovalent aliphatic group having 1 to 10 carbon atoms substituted by atoms, and W is selected from a single bond, a linear aliphatic group having 1 to 10 carbon atoms which may be substituted by fluorine atoms, and carbon which may be substituted by fluorine atoms The alicyclic group of 3-20, the following general formula (2): [Chemical 5] The divalent epoxyalkyl group represented by (Formula 2) (in formula (2), p is an integer of 1 to 10), and the following formula (5): The divalent organic group in the group composed of the divalent groups represented by (Formula 5)} The divalent organic group in the group composed of the divalent groups represented by (Formula 5) 如請求項15或16之感光層捲筒，其中上述通式(1)中之X為下述式(6)：[化7](式6) 所表示之二價有機基。The photosensitive layer reel as in claim 15 or 16, wherein X in the above general formula (1) is the following formula (6): [化 7] The divalent organic group represented by (Formula 6). 如請求項17之感光層捲筒，其中上述通式(1)中之X為下述式(7)：[化8](式7) 所表示之二價有機基。The photosensitive layer reel as in claim 17, wherein X in the above general formula (1) is the following formula (7): [化 8] The divalent organic group represented by (Formula 7). 如請求項15至19中任一項之感光層捲筒，其中上述酚系樹脂於同一樹脂骨架內具有下述通式(8)：[化9](式8){式(8)中，R11 為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n2為1～3之整數，n3為0～2之整數，m1為1～500之整數，2≦(n2＋n3)≦4，n3為2之情形時R11 分別可相同亦可不同}所表示之重複單元、及下述通式(9)：[化10](式9){式(9)中，R12 及R13 分別獨立地為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n4為1～3之整數，n5為0～2之整數，n6為0～3之整數，m2為1～500之整數，2≦(n4＋n5)≦4，n5為2之情形時R12 分別可相同亦可不同，n6為2或3之情形時R13 分別可相同亦可不同} 所表示之重複單元之兩者。The photosensitive layer roll according to any one of claims 15 to 19, wherein the above phenol resin has the following general formula (8) within the same resin skeleton: [化 9] (Formula 8) {In formula (8), R 11 is a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, n2 is an integer of 1 to 3, and n3 is 0 to 2 Integer, m1 is an integer from 1 to 500, 2 ≦ (n2 + n3) ≦ 4, when n3 is 2, R 11 may be the same or different} repeating unit represented by}, and the following general formula (9): [ Chemical 10] (Formula 9) {In formula (9), R 12 and R 13 are each independently a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, and n4 is an integer of 1 to 3 , N5 is an integer from 0 to 2, n6 is an integer from 0 to 3, m2 is an integer from 1 to 500, 2 ≦ (n4 + n5) ≦ 4, when n5 is 2, R 12 may be the same or different, n6 is In the case of 2 or 3, R 13 may be the same or different, and both of the repeating units represented by}. 一種感光層捲筒，其包含：支持體膜；及感光層，其設置於上述支持體膜上，且包含感光性樹脂組合物；且 上述感光性樹脂組合物包含選自由酚系樹脂、聚醯亞胺前驅物、聚苯并㗁唑前驅物、及可溶性聚醯亞胺所組成之群中之至少一種樹脂，且上述支持體膜之兩面與上述感光層相接。A photosensitive layer roll comprising: a support film; and a photosensitive layer provided on the support film and comprising a photosensitive resin composition; and the photosensitive resin composition comprises a resin selected from the group consisting of phenolic resins and polyamides At least one resin in the group consisting of an imine precursor, a polybenzoxazole precursor, and a soluble polyimide, and both sides of the support film are in contact with the photosensitive layer. 如請求項20之感光層捲筒，其中上述感光層中所包含之有機溶劑之量相對於上述感光層之總量為0.1質量%以上且15質量%以下。The photosensitive layer roll according to claim 20, wherein the amount of the organic solvent contained in the photosensitive layer is 0.1% by mass or more and 15% by mass or less relative to the total amount of the photosensitive layer. 如請求項21之感光層捲筒，其中上述感光層中所包含之有機溶劑之量相對於上述感光層之總量為1質量%以上且15質量%以下。The photosensitive layer roll of claim 21, wherein the amount of the organic solvent contained in the photosensitive layer is 1% by mass or more and 15% by mass or less relative to the total amount of the photosensitive layer. 如請求項21或22之感光層捲筒，其中上述感光性樹脂組合物包含上述酚系樹脂。The photosensitive layer roll according to claim 21 or 22, wherein the photosensitive resin composition contains the phenol resin. 如請求項21至23中任一項之感光層捲筒，其中上述有機溶劑包含選自由γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮、二甲基亞碸、丙二醇單甲醚、第三丁醇及四氫呋喃甲醇所組成之群中之至少一種。The photosensitive layer roll according to any one of claims 21 to 23, wherein the organic solvent contains a member selected from the group consisting of γ-butyrolactone, acetone, methyl ethyl ketone, N-methyl-2-pyrrolidone, and dimethyl At least one of the group consisting of carbendane, propylene glycol monomethyl ether, third butanol, and tetrahydrofuran methanol. 如請求項24之感光層捲筒，其中上述有機溶劑包含選自由γ-丁內酯、丙酮、甲基乙基酮、N-甲基-2-吡咯啶酮及二甲基亞碸所組成之群中之至少一種。The photosensitive layer reel as claimed in claim 24, wherein the organic solvent comprises a composition selected from the group consisting of γ-butyrolactone, acetone, methyl ethyl ketone, N-methyl-2-pyrrolidone and dimethyl sulfoxide At least one of the group. 如請求項20至25中任一項之感光層捲筒，其中上述感光性樹脂組合物包含上述聚醯亞胺前驅物。The photosensitive layer roll according to any one of claims 20 to 25, wherein the photosensitive resin composition contains the polyimide precursor. 如請求項20至25中任一項之感光層捲筒，其中上述感光性樹脂組合物包含上述聚苯并㗁唑前驅物。The photosensitive layer roll according to any one of claims 20 to 25, wherein the photosensitive resin composition contains the polybenzoxazole precursor. 如請求項20至25中任一項之感光層捲筒，其中上述感光性樹脂組合物包含上述可溶性聚醯亞胺。The photosensitive layer roll according to any one of claims 20 to 25, wherein the photosensitive resin composition contains the soluble polyimide. 如請求項20至25中任一項之感光層捲筒，其中上述感光性樹脂組合物包含酚系樹脂。The photosensitive layer roll according to any one of claims 20 to 25, wherein the photosensitive resin composition contains a phenol resin. 如請求項29之感光層捲筒，其中上述酚系樹脂具有下述通式(1)：[化11](式1){式(1)中，a為1～3之整數，b為0～3之整數，1≦(a＋b)≦4，R1 表示選自由碳數1～20之一價有機基、鹵素原子、硝基及氰基所組成之群中之一價取代基，b為2或3之情形時複數個R1 分別可相同亦可不同，且X表示選自由可具有不飽和鍵之碳數2～10之二價鏈狀脂肪族基、碳數3～20之二價脂環式基、下述通式(2)：[化12](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及具有芳香族環之二價有機基所組成之群中之二價有機基} 所表示之結構作為重複單元。The photosensitive layer roll according to claim 29, wherein the phenol resin has the following general formula (1): [Chem 11] (Formula 1) {In formula (1), a is an integer of 1 to 3, b is an integer of 0 to 3, 1 ≦ (a + b) ≦ 4, R 1 represents a monovalent organic group selected from carbon numbers 1 to 20 , A halogen atom, a nitro group, and a monovalent substituent in the group consisting of cyano, when b is 2 or 3, a plurality of R 1 may be the same or different, and X represents selected from the group that may have an unsaturated bond A divalent chain aliphatic group having 2 to 10 carbon atoms, a divalent alicyclic group having 3 to 20 carbon atoms, and the following general formula (2): [Chem 12] (Formula 2) (In formula (2), p is an integer of 1 to 10) a divalent organic group represented by a divalent epoxyalkyl group and a divalent organic group having an aromatic ring} The structure shown serves as a repeating unit. 如請求項30之感光層捲筒，其中上述通式(1)中之X為選自由下述通式(3)：[化13](式3){式(3)中，R2 、R3 、R4 及R5 分別獨立地為氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，n1為0～4之整數，n1為1～4之整數之情形時R6 為鹵素原子、羥基、或一價有機基，至少1個R6 為羥基，n1為2～4之整數之情形時複數個R6 分別可相同亦可不同}所表示之二價基、及下述通式(4)：[化14](式4){式(4)中，R7 、R8 、R9 及R10 分別獨立地表示氫原子、碳數1～10之一價脂肪族基、或氫原子之一部分或全部經氟原子取代而成之碳數1～10之一價脂肪族基，且W為選自由單鍵、可經氟原子取代之碳數1～10之鏈狀脂肪族基、可經氟原子取代之碳數3～20之脂環式基、下述通式(2)：[化15](式2)(式(2)中，p為1～10之整數)所表示之二價環氧烷基、及下述式(5)：[化16](式5)所表示之二價基所組成之群中之二價有機基} 所表示之二價基所組成之群中之二價有機基。The photosensitive layer reel as in claim 30, wherein X in the above general formula (1) is selected from the following general formula (3): [化 13] (Formula 3) {In formula (3), R 2 , R 3 , R 4 and R 5 are each independently a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a part or all of a hydrogen atom is fluorinated Monovalent aliphatic group with 1 to 10 carbon atoms substituted by atoms, n1 is an integer of 0 to 4, when n1 is an integer of 1 to 4, R 6 is a halogen atom, a hydroxyl group, or a monovalent organic group, at least When one R 6 is a hydroxyl group and n1 is an integer of 2 to 4, the plural R 6 may be the same or different, respectively, a divalent group represented by}, and the following general formula (4): [Chem 14] (Formula 4) {In formula (4), R 7 , R 8 , R 9 and R 10 each independently represent a hydrogen atom, a monovalent aliphatic group having 1 to 10 carbon atoms, or a part or all of a hydrogen atom through fluorine A monovalent aliphatic group having 1 to 10 carbon atoms substituted by atoms, and W is selected from a single bond, a linear aliphatic group having 1 to 10 carbon atoms which may be substituted by fluorine atoms, and carbon which may be substituted by fluorine atoms The alicyclic group of 3-20, the following general formula (2): [Chem. 15] The divalent epoxyalkyl group represented by (Formula 2) (in formula (2), p is an integer of 1 to 10), and the following formula (5): [Chem 16] The divalent organic group in the group composed of the divalent groups represented by (Formula 5)} The divalent organic group in the group composed of the divalent groups represented by (Formula 5) 如請求項30或31之感光層捲筒，其中上述通式(1)中之X為下述式(6)： [化17](式6) 所表示之二價有機基。The photosensitive layer reel as in claim 30 or 31, wherein X in the above general formula (1) is the following formula (6): [化 17] The divalent organic group represented by (Formula 6). 如請求項32之感光層捲筒，其中上述通式(1)中之X為下述式(7)：[化18](式7) 所表示之二價有機基。The photosensitive layer reel as in claim 32, wherein X in the above general formula (1) is the following formula (7): [化 18] The divalent organic group represented by (Formula 7). 如請求項30至33中任一項之感光層捲筒，其中上述酚系樹脂於同一樹脂骨架內具有下述通式(8)： [化19](式8){式(8)中，R11 為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n2為1～3之整數，n3為0～2之整數，m1為1～500之整數，2≦(n2＋n3)≦4，n3為2之情形時R11 分別可相同亦可不同}所表示之重複單元、及下述通式(9)：[化20](式9) {式(9)中，R12 及R13 分別獨立地為選自由烴基及烷氧基所組成之群中之碳數1～10之一價基，n4為1～3之整數，n5為0～2之整數，n6為0～3之整數，m2為1～500之整數，2≦(n4＋n5)≦4，n5為2之情形時R12 分別可相同亦可不同，n6為2或3之情形時R13 分別可相同亦可不同}所表示之重複單元之兩者。The photosensitive layer roll according to any one of claims 30 to 33, wherein the above phenol resin has the following general formula (8) within the same resin skeleton: (Formula 8) {In formula (8), R 11 is a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, n2 is an integer of 1 to 3, and n3 is 0 to 2 Integer, m1 is an integer from 1 to 500, 2 ≦ (n2 + n3) ≦ 4, when n3 is 2, R 11 may be the same or different, respectively, the repeating unit represented by}, and the following general formula (9): [ Chemical 20] (Formula 9) {In formula (9), R 12 and R 13 are each independently a monovalent group having 1 to 10 carbon atoms selected from the group consisting of a hydrocarbon group and an alkoxy group, and n4 is an integer of 1 to 3 , N5 is an integer from 0 to 2, n6 is an integer from 0 to 3, m2 is an integer from 1 to 500, 2 ≦ (n4 + n5) ≦ 4, when n5 is 2, R 12 may be the same or different, n6 In the case of 2 or 3, R 13 may be the same or different, and both of the repeating units represented by}. 一種切條感光層捲筒之製造方法，其係利用切條機切割如請求項1至34中任一項之感光層捲筒而製造切條感光層捲筒。A method for manufacturing a stripped photosensitive layer roll, which uses a strip cutter to cut the photosensitive layer roll as described in any one of claims 1 to 34 to manufacture a stripped photosensitive layer roll. 如請求項35之切條感光層捲筒之製造方法，其中上述切條機之齒被加熱。A method of manufacturing a photosensitive layer roll for slitting a strip according to claim 35, wherein the teeth of the slitting machine are heated. 如請求項36之切條感光層捲筒之製造方法，其中上述切條機之齒被加熱至100℃以上。The method for manufacturing a stripped photosensitive layer roll of claim 36, wherein the teeth of the stripper are heated to above 100 ° C. 一種切條感光層捲筒之製造方法，其包含以下步驟：於如請求項1至34中任一項之感光層捲筒於上述感光層之與設置有上述支持體膜一側相反之側具有覆膜之情形時，將上述覆膜剝離；利用切條機切割不具有上述覆膜之上述感光層捲筒；及於經切割之上述感光層捲筒貼合上述剝離之覆膜或與上述剝離之覆膜不同之覆膜。A method for manufacturing a stripped photosensitive layer roll, comprising the following steps: The photosensitive layer roll according to any one of claims 1 to 34 is provided on the opposite side of the photosensitive layer from the side on which the support film is provided In the case of a film, peel off the film; cut the photosensitive layer reel without the film using a slitter; and apply the peeled film to the peeled film or cut off with the peeled film The coating is different. 如請求項38之切條感光層捲筒之製造方法，其中上述切條機之齒被加熱。The method of manufacturing a photosensitive layer roll for slitting a strip according to claim 38, wherein the teeth of the slitting machine are heated. 如請求項39之切條感光層捲筒之製造方法，其中上述切條機之齒被加熱至100℃以上。A method for manufacturing a stripped photosensitive layer roll as claimed in claim 39, wherein the teeth of the stripper are heated to above 100 ° C.
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