TW201819686A - A water-based composition for post-treatment of metal surfaces - Google Patents
A water-based composition for post-treatment of metal surfaces Download PDFInfo
- Publication number
- TW201819686A TW201819686A TW106120995A TW106120995A TW201819686A TW 201819686 A TW201819686 A TW 201819686A TW 106120995 A TW106120995 A TW 106120995A TW 106120995 A TW106120995 A TW 106120995A TW 201819686 A TW201819686 A TW 201819686A
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- Taiwan
- Prior art keywords
- water
- based composition
- silver
- range
- metal
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 67
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 33
- 239000002184 metal Substances 0.000 title claims abstract description 33
- 239000004332 silver Substances 0.000 claims abstract description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052709 silver Inorganic materials 0.000 claims abstract description 37
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 20
- 150000001875 compounds Chemical class 0.000 claims abstract description 17
- 239000002280 amphoteric surfactant Substances 0.000 claims abstract description 6
- 239000003093 cationic surfactant Substances 0.000 claims abstract description 6
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 6
- 125000000129 anionic group Chemical group 0.000 claims abstract description 5
- 239000003945 anionic surfactant Substances 0.000 claims abstract description 5
- 125000002091 cationic group Chemical group 0.000 claims abstract description 5
- 239000002888 zwitterionic surfactant Substances 0.000 claims abstract description 5
- 239000004094 surface-active agent Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000007957 coemulsifier Substances 0.000 claims description 10
- 238000007654 immersion Methods 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- SUHUKEQAOUOUJO-UHFFFAOYSA-N ethane-1,2-diol;2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound OCCO.CC(C)CC(C)(O)C#CC(C)(O)CC(C)C SUHUKEQAOUOUJO-UHFFFAOYSA-N 0.000 claims description 3
- 229920001521 polyalkylene glycol ether Polymers 0.000 claims description 3
- CTTGTRXRTUKVEB-UHFFFAOYSA-N 2,3,6,7-tetramethyloct-4-yne-3,6-diol Chemical compound CC(C)C(C)(O)C#CC(C)(O)C(C)C CTTGTRXRTUKVEB-UHFFFAOYSA-N 0.000 claims description 2
- RHRRUYIZUBAQTQ-UHFFFAOYSA-N 2,5,8,11-tetramethyldodec-6-yne-5,8-diol Chemical compound CC(C)CCC(C)(O)C#CC(C)(O)CCC(C)C RHRRUYIZUBAQTQ-UHFFFAOYSA-N 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- 238000012805 post-processing Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 abstract 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 abstract 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000002209 hydrophobic effect Effects 0.000 description 5
- QJAOYSPHSNGHNC-UHFFFAOYSA-N octadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCS QJAOYSPHSNGHNC-UHFFFAOYSA-N 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 150000003573 thiols Chemical class 0.000 description 3
- -1 Alkane thiol Chemical class 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- 239000004435 Oxo alcohol Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical compound OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 2
- LTVPMANAZMCXHK-UHFFFAOYSA-N 2,5,8,11-tetramethyldodec-6-ene-5,8-diol Chemical compound CC(C)CCC(C)(O)C=CC(C)(O)CCC(C)C LTVPMANAZMCXHK-UHFFFAOYSA-N 0.000 description 1
- JIMHRFRMUJZRFD-UHFFFAOYSA-N 2-[7-(2-hydroxyethoxy)-2,4,7,9-tetramethyldec-5-yn-4-yl]oxyethanol Chemical compound OCCOC(C)(CC(C)C)C#CC(C)(CC(C)C)OCCO JIMHRFRMUJZRFD-UHFFFAOYSA-N 0.000 description 1
- CYEJIAUEAAVGGO-UHFFFAOYSA-N 3-ethoxy-2-methylnonane Chemical group CCCCCCC(C(C)C)OCC CYEJIAUEAAVGGO-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 101100361281 Caenorhabditis elegans rpm-1 gene Proteins 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 229910017821 Cu—Ge Inorganic materials 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- VTXVGVNLYGSIAR-UHFFFAOYSA-N decane-1-thiol Chemical compound CCCCCCCCCCS VTXVGVNLYGSIAR-UHFFFAOYSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ORTRWBYBJVGVQC-UHFFFAOYSA-N hexadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCS ORTRWBYBJVGVQC-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- YNESSCJHABBEIO-UHFFFAOYSA-N nonadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCCS YNESSCJHABBEIO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- CCIDWXHLGNEQSL-UHFFFAOYSA-N undecane-1-thiol Chemical compound CCCCCCCCCCCS CCIDWXHLGNEQSL-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
- C23F11/161—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
- C23F11/122—Alcohols; Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/141—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/145—Amides; N-substituted amides
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
Description
本發明係關於用於金屬表面後處理之水基組合物、其用途及金屬表面後處理之方法。The present invention relates to a water-based composition for post-treatment of metal surfaces, its use, and a method for post-treatment of metal surfaces.
銀及銀合金用於電子裝置中但不可避免地,成品將需要進一步清潔並拋光以暫時地去除不期望的鏽污產品。眾所周知,由於暴露於每天大氣條件,銀及銀合金產生破壞光澤的暗色膜,稱為鏽污。防止金屬及金屬合金之鏽污在眾多工業中係具有挑戰性之問題。金屬及金屬合金之鏽污已尤其在電子材料工業中成問題,其中鏽污可在電子裝置中之組件之間引起錯誤的電接觸。 US20070277906A1揭示用於處理金屬(例如,銀或銀之合金)之水基組合物,其包含選自烷烴硫醇、氫硫乙酸烷基酯、二烷基硫醚或二烷基二硫醚之處理劑及有效使處理劑溶解之濃度之兩性、非離子或陽離子表面活性劑之至少一者。較佳地,組合物至少包含非離子相對疏水性表面活性劑,例如椰油醯胺DEA。組合物尤其適用於處理Ag-Cu-Ge合金。Silver and silver alloys are used in electronic devices but inevitably, the finished product will need to be further cleaned and polished to temporarily remove unwanted rusty products. It is well known that due to exposure to daily atmospheric conditions, silver and silver alloys produce a dark film that destroys the luster, called rust. Preventing rust on metals and metal alloys is a challenging problem in many industries. Rust of metals and metal alloys has become a problem especially in the electronic materials industry, where rust can cause erroneous electrical contact between components in electronic devices. US20070277906A1 discloses a water-based composition for treating a metal (for example, silver or a silver alloy) comprising a treatment selected from the group consisting of an alkanethiol, an alkyl hydrothioacetate, a dialkyl sulfide, or a dialkyl disulfide At least one of an amphoteric, nonionic, or cationic surfactant at a concentration effective to dissolve the treating agent. Preferably, the composition comprises at least a non-ionic relatively hydrophobic surfactant, such as cocoamide DEA. The composition is particularly suitable for processing Ag-Cu-Ge alloys.
發明目標本發明之目標係提供用於金屬(尤其銀或銀合金)表面有效後處理以防止此等表面之鏽污之組合物。 本發明提供用於金屬表面(較佳銀或銀合金表面)後處理之水基組合物、其用途及方法。較佳實施例在從屬申請專利範圍內闡述。 金屬表面尤其係金屬基材或塑膠材料(例如,連接器或IC /引線架應用)之技術級及裝飾性表面以及汽車、航空太空、建築、通信、家具、衛生及消費品之表面之領域中之表面。 本發明特定而言提供用於金屬表面(較佳銀或銀合金表面)後處理之水基組合物,其包含: 烷烴硫醇 陰離子、陽離子、非離子、兩性或兩性離子表面活性劑,其中HLB值為12至18、較佳15, 其中水基組合物進一步含有 通式I之化合物:, 其中 R1 係-H、-CH3 、-C2 H5 、-(C2 H4 O)p -H、-(C2 H4 O)p -CH3 、-(C2 H4 O)p -CH(CH3 )2 、-(C2 H4 O)p -C(CH3 )3 ,其中p係1至20、較佳1至10、更佳2至6範圍內之整數, R2 係H或CH3 ,較佳CH3 , n係0至3、較佳1至3、甚至更佳1或2範圍內之整數, m係0、1或2範圍內之整數,較佳0。 HLB值係根據W.C. Griffin之方法測定。 對於本發明,通常或在以下其他實施例中之一者中,獲得一或多個以下益處: - 抗鏽污性質之增強(尤其由K2 S測試證明) - 透明保護性塗層提供高度疏水表面性質 - 排斥氧化劑 - 透明組合物,防止對經組合物處理之表面之外觀的負面效應 - 增強之自裝配硫醇單層在浸沒銀表面上之形成,從而提供非極性膜 - 銀表面處理後,改良之疏水烷烴硫醇剩餘物之沖洗能力,有效消除油性殘餘物 該組合物可係乳液。 烷烴硫醇在浸沒銀表面上形成自裝配硫醇單層,其防止或延緩鏽污。 式I之化合物亦稱為「雙子表面活性劑」,其具有更一般之以下結構:雙子表面活性劑包括兩個極性頭(親水基團),其側接有疏水尾連接至其之間隔基;間隔基可為剛性或撓性、極性或非極性。本發明亦揭示在用於金屬表面後處理之組合物中使用此等一般表面活性劑。已顯示,藉由添加具有上述結構之表面活性劑,尤其藉由添加式I之組分,可達成組合物改良之抗鏽污性質。 在式I化合物之較佳實施例中,m = 0,n在0至3之範圍內,較佳n在1至3之範圍內,更佳n係1或2,且R1 獨立地選自由以下組成之群:-H、-CH3 、-C2 H5 及-(C2 H4 O)p -H,其中p在2至6之範圍內。 更佳式I之化合物係選自由以下組成之群:2,3,6,7-四甲基-4-辛炔-3,6-二醇、2,5,8,11-四甲基-6-十二炔-5,8-二醇乙氧基化物、2,4,7,9-四甲基-5-癸炔-4,7-二醇乙氧基化物、2,4,7,9-四甲基-5-癸炔-4,7-二醇、2,2’-[(2,4,7,9-四甲基-5-癸炔-4,7-二基)雙(氧基)]二乙醇及2,4,7,9-四甲基-5-癸炔-4,7-二醇雙聚氧乙烯-醚。 陰離子、陽離子、非離子、兩性或兩性離子表面活性劑可具有可為直鏈或具支鏈之疏水尾。 陰離子、陽離子、非離子、兩性或兩性離子表面活性劑可係乙氧基化或丙氧基化烷基、乙氧基化或丙氧基化胺、乙氧基化或丙氧基化醯胺、乙氧基化或丙氧基化醇或其混合物。有益的表面活性劑係3-乙氧基-2-甲基壬烷。 表面活性劑可具有通式II: R3 O(CH2 CH2 O)x H 式II 其中 R3 係具有6至15個碳原子、較佳8至12個碳原子之直鏈或具支鏈烷基, x係3至15、較佳7至11範圍內之整數。 較佳地,表面活性劑係聚乙二醇、更佳PEG-11 C10-11羰基合成醇乙氧基化物(CAS Nr:78330-20-8)。 水基組合物可包含共乳化劑,其亦可稱為「第二表面活性劑」。 共乳化劑可具有通式III R4 O(CH2 CH2 O)y H 式III 其中 R4 係具有16至20個碳原子、較佳16至18個碳原子之直鏈或具支鏈烷基, y係2至10、較佳3至6範圍內之整數。 共乳化劑較佳係聚伸烷基二醇醚。較佳地,共乳化劑係乙氧基化丙氧基化C16-18醇(CAS Nr. 68002-96-0)。 烷烴硫醇較佳係具支鏈或無支鏈C10 -至C20 -烷烴硫醇,更佳無支鏈C10 -至C20 -烷烴硫醇,例如癸硫醇、十一硫醇、十二硫醇、十六硫醇、十七硫醇、十八硫醇、十九硫醇、二十硫醇,最佳十七硫醇、十八硫醇、十九硫醇、二十硫醇。在一個較佳實施例中,烷烴硫醇係十八硫醇。 在較佳實施例中,水基組合物不含鉻酸鹽及/或不含有機溶劑。 水基組合物可具有1至6、較佳2至4範圍內之pH。pH可藉由緩衝系統調整。適宜緩衝系統係檸檬酸/檸檬酸鹽、乙酸/乙酸鹽、酒石酸/酒石酸鹽、磷酸/磷酸鹽或任何適宜的酸及鹽組合。 水基組合物可包含以下量之所提及成分: 烷烴硫醇: 0.1 g/L- 5 g/L、較佳0.5 g/L- 4 g/L 表面活性劑: 2 g/L- 30 g/L、較佳5 g/L- 20 g/L 式I化合物: 1 g/L- 10 g/L、較佳1 g/L- 5 g/L;及 視情況共乳化劑: 0.1 g/L- 5 g/L、較佳0.5 g/L- 2 g/L 在另一態樣中,本發明係關於上文水基組合物用於金屬表面(尤其銀或銀合金表面)後處理之用途,其用於在金屬沈積後,尤其在銀或銀合金沈積後避免鏽污。 在又一態樣中,本發明係關於金屬表面(尤其銀或銀合金表面)後處理之方法,其以此順序包含以下步驟: a. 提供金屬表面、尤其銀或銀合金表面, b. 使金屬表面(尤其銀或銀合金表面)與上文所述之水基組合物接觸。可用上文所述之任一水基組合物。 接觸可藉由任何適宜方法完成。步驟b.中之接觸特定而言可藉由浸沒至水基組合物中及/或藉由用水基組合物噴射至表面上完成。 步驟b.中之接觸可另外在無電條件下,亦即不在金屬表面與電極之間供應電流之情形下完成。 在另一實施例中,步驟b.中之接觸係在當金屬表面浸沒於水基組合物中時在金屬表面(尤其銀或銀合金表面)與至少一個電極之間施加電流下發生。金屬表面可用作陰極且另一電極(其係相對電極)可用作陽極或反之亦然。較佳地,金屬表面係陰極的。 本發明較佳以室溫(22±2℃)或更高、更佳30℃或更高之範圍內、最佳35℃至65℃範圍內之組合物溫度工作。OBJECTS OF THE INVENTION The object of the present invention is to provide a composition for effective post-treatment of the surfaces of metals, especially silver or silver alloys, to prevent rusting of these surfaces. The present invention provides a water-based composition for post-treatment of a metal surface (preferably a surface of silver or a silver alloy), its use and method. Preferred embodiments are described within the scope of the dependent patent applications. Metallic surfaces are in particular technical and decorative surfaces of metal substrates or plastic materials (e.g. connectors or IC / lead frame applications) and in the fields of automotive, aerospace, construction, communications, furniture, sanitary and consumer products surface. The present invention specifically provides a water-based composition for post-treatment of a metal surface (preferably a silver or silver alloy surface), which comprises: an alkanethiol anionic, cationic, nonionic, amphoteric or zwitterionic surfactant, wherein HLB The value is 12 to 18, preferably 15, wherein the water-based composition further contains a compound of general formula I: , Where R 1 is -H, -CH 3 , -C 2 H 5 ,-(C 2 H 4 O) p -H,-(C 2 H 4 O) p -CH 3 ,-(C 2 H 4 O ) p -CH (CH 3 ) 2 ,-(C 2 H 4 O) p -C (CH 3 ) 3 , where p is an integer in the range of 1 to 20, preferably 1 to 10, more preferably 2 to 6, R 2 is H or CH 3 , preferably CH 3 , n is an integer in the range of 0 to 3, preferably 1 to 3, or even more preferably 1 or 2, and m is an integer in the range of 0, 1 or 2, preferably 0. The HLB value was measured according to the method of WC Griffin. For the present invention, one or more of the following benefits are generally obtained or in one of the following other examples:-enhanced rust resistance (especially as evidenced by the K 2 S test)-transparent protective coating provides a high degree of hydrophobicity Surface properties-Repellent oxidant-Transparent composition to prevent negative effects on the appearance of the treated surface of the composition-Enhanced formation of self-assembled thiol monolayer on immersed silver surface to provide non-polar film-After silver surface treatment The improved flushing ability of the hydrophobic alkanethiol residue can effectively eliminate the oily residue. The composition can be an emulsion. The alkanethiol forms a self-assembled thiol monolayer on the surface of the immersed silver, which prevents or delays rusting. Compounds of formula I are also known as "gemini surfactants" and have a more general structure: Gemini surfactants include two polar heads (hydrophilic groups) that are flanked by spacers to which hydrophobic tails are attached; spacers can be rigid or flexible, polar or non-polar. The invention also discloses the use of these general surfactants in compositions for post-treatment of metal surfaces. It has been shown that by adding a surfactant having the above-mentioned structure, and in particular by adding a component of formula I, improved rust resistance properties of the composition can be achieved. In a preferred embodiment of the compound of formula I, m = 0, n is in the range of 0 to 3, preferably n is in the range of 1 to 3, more preferably n is 1 or 2, and R 1 is independently selected from the group consisting of: -H, -CH 3, -C 2 H 5 and - (C 2 H 4 O) p -H, wherein p is in the range of 2-6. More preferably the compound of formula I is selected from the group consisting of: 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 2,5,8,11-tetramethyl- 6-dodecyne-5,8-diol ethoxylate, 2,4,7,9-tetramethyl-5-decyne-4,7-diol ethoxylate, 2,4,7 , 9-tetramethyl-5-decyne-4,7-diol, 2,2 '-[(2,4,7,9-tetramethyl-5-decyne-4,7-diyl) Bis (oxy)] diethanol and 2,4,7,9-tetramethyl-5-decyne-4,7-diol bispolyoxyethylene-ether. Anionic, cationic, non-ionic, amphoteric or zwitterionic surfactants may have hydrophobic tails which may be straight or branched. Anionic, cationic, non-ionic, amphoteric or zwitterionic surfactants can be ethoxylated or propoxylated alkyl, ethoxylated or propoxylated amines, ethoxylated or propoxylated amidines , Ethoxylated or propoxylated alcohols, or mixtures thereof. A beneficial surfactant is 3-ethoxy-2-methylnonane. The surfactant may have the general formula II: R 3 O (CH 2 CH 2 O) x H Formula II wherein R 3 is a straight or branched chain having 6 to 15 carbon atoms, preferably 8 to 12 carbon atoms Alkyl, x is an integer in the range of 3 to 15, preferably 7 to 11. Preferably, the surfactant is polyethylene glycol, more preferably PEG-11 C10-11 carbonyl synthesis alcohol ethoxylate (CAS Nr: 78330-20-8). The water-based composition may include a co-emulsifier, which may also be referred to as a "second surfactant." Co-emulsifiers may have the general formula III R 4 O (CH 2 CH 2 O) y H Formula III wherein R 4 is a straight or branched chain alkane having 16 to 20 carbon atoms, preferably 16 to 18 carbon atoms. The base, y is an integer in the range of 2 to 10, preferably 3 to 6. The co-emulsifier is preferably a polyalkylene glycol ether. Preferably, the co-emulsifier is an ethoxylated propoxylated C16-18 alcohol (CAS Nr. 68002-96-0). The alkanethiol is preferably a branched or unbranched C 10 -to C 20 -alkanethiol, more preferably an unbranched C 10 -to C 20 -alkanethiol, such as decanethiol, undecanethiol, Dodecylmercaptan, hexadecanethiol, heptathiol, octadecylthiol, nonadecanethiol, eicosylthiol, the best heptathiol, octadecylthiol, nonadecanylthiol, eicosylthiol alcohol. In a preferred embodiment, the alkanethiol is octadecanethiol. In a preferred embodiment, the water-based composition is free of chromate and / or free of organic solvents. The water-based composition may have a pH in the range of 1 to 6, preferably 2 to 4. The pH can be adjusted by a buffer system. Suitable buffer systems are citric acid / citrate, acetic acid / acetate, tartaric acid / tartrate, phosphoric acid / phosphate or any suitable acid and salt combination. The water-based composition may contain the mentioned ingredients in the following amounts: Alkane thiol: 0.1 g / L to 5 g / L, preferably 0.5 g / L to 4 g / L Surfactant: 2 g / L to 30 g / L, preferably 5 g / L-20 g / L Compound of formula I: 1 g / L-10 g / L, preferably 1 g / L-5 g / L; and optionally co-emulsifier: 0.1 g / L- 5 g / L, preferably 0.5 g / L- 2 g / L In another aspect, the present invention relates to the above-mentioned water-based composition for post-treatment of metal surfaces, especially silver or silver alloy surfaces. Uses to prevent rusting after metal deposition, especially after silver or silver alloy deposition. In yet another aspect, the present invention relates to a method for post-processing a metal surface (especially a silver or silver alloy surface), which in this order includes the following steps: a. Providing a metal surface, especially a silver or silver alloy surface, b. Using Metal surfaces, especially silver or silver alloy surfaces, are in contact with the water-based composition described above. Any of the water-based compositions described above can be used. Contacting can be accomplished by any suitable method. The contacting in step b. Can be done in particular by immersion into the water-based composition and / or by spraying the water-based composition onto the surface. The contacting in step b. May be additionally performed under no-current conditions, that is, without supplying a current between the metal surface and the electrode. In another embodiment, the contacting in step b. Occurs when an electrical current is applied between the metal surface (especially a silver or silver alloy surface) and the at least one electrode when the metal surface is immersed in the water-based composition. A metal surface can be used as the cathode and another electrode (which is the opposite electrode) can be used as the anode or vice versa. Preferably, the metal surface is cathodic. The present invention preferably operates at a composition temperature in the range of room temperature (22 ± 2 ° C) or higher, more preferably 30 ° C or higher, and most preferably in the range of 35 ° C to 65 ° C.
在下文中,本發明藉由工作實例闡釋。發明實例 1 :
提供水基組合物,其中分別通式I之c.)化合物(化合物c1))之濃度變化,而其他組分之濃度固定。 水基組合物係藉由將以下組分溶解於水中製得: a.烷烴硫醇
:十八硫醇。(CAS Nr. 2885-00-9) 量:2.5 g/L b.表面活性劑
:PEG-11 C10 - 11 羰基合成醇乙氧基化物
(CAS Nr: 78330-20-8) 量:17.5 g/l c.通式 I 之化合物
:c1)2,5,8,11- 四甲基 -6- 十二炔 -5,8- 二醇乙氧基化物
,(CAS Nr. 169117-72-0),量:2 g/l、3 g/l或4 g/l d. 共乳化劑:C16-18醇聚伸烷基二醇醚,(CAS Nr. 68002-96-0) 量:2.5 g/L。發明實例 2 :
提供水基組合物,其中通式I之c.)化合物之以下化合物c2) 2,4,7,9-四甲基-5-癸炔-4,7-二醇乙氧基化物(CAS Nr. 9014-85-1)及c3) 2,4,7,9-四甲基-5-癸炔-4,7-二醇(CAS Nr. 126-86-3)係以相同濃度單獨使用: 水基組合物係藉由將以下組分溶解於水中製得: a.烷烴硫醇
:十八硫醇。(CAS Nr. 2885-00-9) 量:2.5 g/L b.表面活性劑
:PEG-11 C10 - 11 羰基合成醇乙氧基化物
(CAS Nr: 78330-20-8) 量:17.5 g/l c.通式 I 之化合物 (c2 或 c3)
:量:2 g/l d. 共乳化劑:C16-18醇聚伸烷基二醇醚,(CAS Nr. 68002-96-0) 量:2.5 g/L。比較實例 :
提供比較水基組合物,其包含a.、b.及d.,其中通式I之化合物(c1-c3)之濃度係零且其他濃度係如上文所說明。 1.方法
在鍍銀銅板上實施後處理。具有銅表面之該等板可自以下步驟提供: 提供銅板 1. 脫脂 UnicleanTM
260 (電泳鹼性清潔器)陰極7V / 45℃ / 30 sec 2. 活化: UnicleanTM
675 (溫和酸性活化劑)浸沒/ RT / 30 sec 3. 鍍銀前 鍍銀前(低銀濃縮溶液)陰極3V / RT / 15 sec 4. 鍍銀 Silverlume Plus (亮銀沈積溶液)陰極1 ASD / RT / 5 min 或AgO-56 (技術級銀沈積溶液)陰極1 ASD / RT / 5 min 或ArgaluxTM
NCmod. (無氰化物之亮銀沈積溶液)陰極0.8 ASD / RT / 5 min 其中RT係介於22±2℃之間之室溫;DI水係去離子水;ASD係安培(Ampere) /平方公寸(A/dm²)且V係伏特(volt/voltage)。 在本發明之意義上,在使用技術級或裝飾性(有氰化物或無氰化物)銀沈積溶液用於鍍銀以避免在此鍍銀後鏽污之領域中,後處理組合物亦可對以其他方式獲得之鍍銀表面起作用。 根據本發明用於後處理之本發明水基組合物及比較水基組合物在多種條件下使用(參見以下測試)。 在水基組合物中後處理後,用以下各項沖洗所有試樣: -熱DI水沖洗 -冷DI水沖洗及 -用壓縮空氣乾燥。 ▪ 用本發明組合物及比較組合物後處理後之光學評估及隨後硫化物測試,其係由於: - 緊接後處理及沖洗後之殘餘物 - 硫化物測試後之著色及鏽污 熟習此項技術者在無任何儀器之情形下實施觀測。 ▪ 硫化物測試 ▪ 材料:玻璃燒杯 ▪ 化學品:硫化鉀44% K2
S,2% w/w於水中 ▪ 溫度:22 ± 2℃ ▪ 浸漬時間:5 - 10 min ▪ 由熟習此項技術者評估 ▪ 根據色彩強度 2.結果
2.1 沖洗能力測試 本發明水基組合物與比較水基組合物相比顯示改良之沖洗能力並完全消除油性殘餘物問題。用比較水基組合物處理Silverlume Plus、AgO-56及ArgaluxTM
NC mod.鍍銀表面,表面顯示差的沖洗能力,而本發明水基組合物顯示極佳沖洗能力。 2.2 抗鏽污測試 與無通式I之化合物(c1-c3)之比較水基組合物相比,本發明水基組合物顯示改良之抗鏽污保護。自諸如Silverlume Plus、AgO-56及ArgaluxTM
NC mod.之鍍銀溶液獲得之未經處理之銀表面展現極差的抗鏽污保護。經比較水基組合物處理之該等鍍銀表面在硫化物測試後顯示較少變色,而經本發明水基組合物處理之表面顯示極少變色至無變色。 測試材料:亮銀鍍覆之表面(Silverlume Plus) 水基組合物條件:pH 2.5 -溫度55℃-攪動200 RPM -浸沒過程持續1 min,沖洗並乾燥。
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| CN110424030B (en) * | 2019-08-30 | 2020-06-30 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper electroplating solution, preparation thereof and application thereof in flexible printed circuit board |
| JP2021042326A (en) * | 2019-09-12 | 2021-03-18 | 日華化学株式会社 | Electrolytic detergent and method for cleaning metal |
| JP7608195B2 (en) * | 2020-02-14 | 2025-01-06 | エボニック オペレーションズ ゲーエムベーハー | 2,4,7,9-tetramethyl-5-decyne-4,7-diol-based solvent-free composition |
| CN119061398A (en) * | 2023-05-30 | 2024-12-03 | 纳米铸币科技有限公司 | Compositions and related methods for depositing alkanethiol monolayers on metal surfaces |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215490A (en) * | 1983-05-23 | 1984-12-05 | Alps Electric Co Ltd | Discoloration inhibitor for metal |
| JPS60251285A (en) * | 1984-05-25 | 1985-12-11 | Showa Denko Kk | Surface treatment agent for plating electrical contacts |
| JPS61270382A (en) * | 1985-05-23 | 1986-11-29 | Nippon Shokubai Kagaku Kogyo Co Ltd | Aqueous surface treating composition for metal capable of treating oil stuck surface |
| US4885064A (en) * | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
| JP2905658B2 (en) * | 1993-01-11 | 1999-06-14 | 信越化学工業株式会社 | Underwater non-separable concrete composition and defoamer for concrete composition |
| US5525206A (en) * | 1995-02-01 | 1996-06-11 | Enthone-Omi, Inc. | Brightening additive for tungsten alloy electroplate |
| JP2001276705A (en) * | 2000-01-24 | 2001-10-09 | Daikin Ind Ltd | Method for coating base material, coated article and coating apparatus |
| JP2002356602A (en) * | 2000-07-28 | 2002-12-13 | Sekisui Chem Co Ltd | Colored resin emulsion, ink for inkjet printing, electrodeposition liquid and color filter |
| JP4386156B2 (en) * | 2001-05-30 | 2009-12-16 | 日信化学工業株式会社 | Water-soluble surfactant composition |
| GB0307290D0 (en) * | 2003-03-31 | 2003-05-07 | Cole Paul G | Enhancing silver tarnish-resistance |
| GB2412666B (en) * | 2004-03-30 | 2008-10-08 | Paul Gilbert Cole | Water-based metal treatment composition |
| US7771588B2 (en) * | 2005-11-17 | 2010-08-10 | General Electric Company | Separatory and emulsion breaking processes |
| JP2007246978A (en) * | 2006-03-15 | 2007-09-27 | Jsr Corp | Electroless plating solution |
| CN101353800B (en) * | 2007-07-26 | 2011-09-21 | 深圳市华傲创表面技术有限公司 | Water-soluble silver protecting agent and preparation thereof |
| CN102145267A (en) * | 2010-02-09 | 2011-08-10 | 天津赛菲化学科技发展有限公司 | Multifunctional surfactant composition for water-based system and preparation method thereof |
| IT1398698B1 (en) * | 2010-02-24 | 2013-03-08 | Mesa S A S Di Malimpensa Simona E Davide E C | METHOD FOR THE PROTECTION OF SILVER SURFACES AND ITS UNDERSTANDING ALLOYS. |
| CN101967631A (en) * | 2010-11-04 | 2011-02-09 | 西北工业大学 | Water-soluble silver anti-blushing agent and preparation method and using method thereof |
| JP5666940B2 (en) * | 2011-02-21 | 2015-02-12 | 株式会社大和化成研究所 | SEALING AGENT SOLUTION AND SEALING TREATMENT METHOD USING THE SAME |
| JP5599762B2 (en) * | 2011-06-17 | 2014-10-01 | 富士フイルム株式会社 | Ink composition, ink set, and image forming method |
| US9293571B2 (en) * | 2012-08-09 | 2016-03-22 | City University Of Hong Kong | Metal nanoparticle monolayer |
| JP6004469B2 (en) * | 2012-08-31 | 2016-10-05 | Jx金属株式会社 | Metal surface treatment agent and surface treatment method |
| TW201509245A (en) * | 2013-03-15 | 2015-03-01 | Omg Electronic Chemicals Llc | Process for forming self-assembled monolayer on metal surface and printed circuit board comprising self-assembled monolayer |
| CN103726056B (en) * | 2013-12-26 | 2015-10-21 | 张文博 | The protectant preparation method of a kind of water soluble molecules self-assembled film shaped metal |
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| TWI746583B (en) | 2021-11-21 |
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