TW201807353A - LED illuminating device capable of preventing a decrease in the light receiving sensitivity of a remote control light receiving element, so as to reduce the risk of inoperability - Google Patents

Abstract

to the subject of the present invention is to provide an LED illuminating device capable of preventing a decrease in the light receiving sensitivity of a remote control light receiving element, so as to reduce the risk of inoperability. To solve the problem, an illuminating LED and a remote control light receiving element are mounted on the same light source substrate, and the height of the illuminating LED is substantially the same as that of the remote control light receiving element. The LED illuminating device has an LED ceiling lamp body and a light-transmitting outer cover mounted on the LED ceiling lamp body. The LED ceiling lamp body includes: a body base; a heat-dissipating plate mounted on the body base; a power supply substrate surrounded by the body base and the heat-dissipating plate; the light source substrate mounted on the heat-dissipating plate; and an LED outer cover for covering the illuminating LED, the remote control light receiving element and the light source substrate.

Description

LED lighting device

The present invention relates to an LED lighting device.

A conventional LED lighting device is used to receive a signal sent from a remote controller, that is, a remote-control light receiving element is mounted inside an LED lighting substrate or the like.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2011-108604

When the remote control light receiving element is installed on the back of the main body or the like on the inside of the LED lighting substrate, the light receiving sensitivity of the remote control light receiving element may be lowered. It is ideal to increase the light receiving sensitivity of the light receiving element of the remote control. However, in this case, the light of the LED will be blocked and the illuminance will decrease. Low or poor appearance, and the wavelength emitted from the LED interferes with the transmission signal of the remote control, which may cause inoperability. In view of this, an object of the present invention is to provide an LED lighting device which can prevent the light receiving sensitivity of a light receiving element of a remote controller from being reduced, thereby reducing the risk of inoperability.

In order to solve the above-mentioned problems, the present invention is characterized in that the lighting LED and the remote control light receiving element are mounted on the same light source substrate, and the parts of the lighting LED and the remote control light receiving element are substantially equal in height.

According to the present invention, it is possible to provide an LED lighting device that prevents a decrease in light receiving sensitivity of a light receiving element of a remote controller and reduces the risk of inoperability.

1‧‧‧LED ceiling light

2‧‧‧LED ceiling light body

3‧‧‧ Transparent cover

4‧‧‧ decorative frame

5‧‧‧Reflective cover

6‧‧‧LED cover

7‧‧‧ reflector

8‧‧‧ light source substrate

9‧‧‧lighting LED

10‧‧‧ Remote control light receiving element

11‧‧‧ heat sink

12‧‧‧Power supply board

13‧‧‧Insulation board

14‧‧‧Sensor

15‧‧‧ base of the body

A‧‧‧Magnification range

FIG. 1 is an overall perspective view of the LED ceiling lamp 1.

Fig. 2 is a partially exploded perspective view of the LED ceiling lamp 1 of Fig. 1.

Fig. 3 is an exploded perspective view of the LED ceiling lamp 1 of Fig. 1.

Fig. 4 is a sectional view taken along the line AA 'in Fig. 1.

FIG. 5 is a partially enlarged view of FIG. 4.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall perspective view of the LED ceiling lamp 1. Fig. 2 is a partially exploded perspective view of the LED ceiling lamp 1 of Fig. 1. Fig. 3 is an exploded perspective view of the LED ceiling lamp 1 of Fig. 1. Fig. 4 is a sectional view taken along the line AA 'in Fig. 1.

In this example, although the LED ceiling lamp is formed into a slightly circular shape, it is not limited to this shape.

The LED ceiling lamp is connected via a mounting adapter (not shown) that is fitted to a hanging light cable box or a ceiling wiring box (not shown) installed on the ceiling surface of the home. It is connected to an external power supply and is fixed at a predetermined position on the ceiling surface for use. In addition, in the following description, unless otherwise specified, the ceiling surface side will be referred to as the "upper side" and the opposite side (floor side) will be referred to as the "lower side" based on the state where the LED ceiling light is mounted on the ceiling surface. side".

As shown in FIG. 1, the LED ceiling lamp 1 includes: an LED ceiling lamp body 2; a light-transmitting outer cover 3 mounted on the LED ceiling-light body 2;

As shown in FIG. 2, in the LED ceiling lamp 1, the transparent outer cover 3 can be freely attached and detached from the LED ceiling lamp body 2.

As shown in FIG. 3, the LED ceiling lamp 1 is composed of a member near the ceiling surface side and includes the following components: an LED ceiling lamp body 2; a decorative frame 4; and a light-transmitting outer cover installed on the LED ceiling lamp body 2. 3, wherein the LED ceiling lamp body 2 is composed of the following elements: a slightly circular body base 15, a sensor 14, an insulating plate 13, and a body base 15 The power supply substrate 12 surrounded by the heat dissipation plate 11, the heat dissipation plate 11 mounted on the body base 15, the light source substrate 8 mounted on the heat dissipation plate 11, the reflection plate 7, the LED outer cover 6 and the reflection outer cover 5 covering the light source substrate 8.

In the LED ceiling light body 2, the body base 15 is a part that is formed into a substantially circular shape by, for example, processing a metal plate. A substantially circular hole is provided in the center of the main body base 15 as an appliance mounting portion. In the appliance mounting portion, a mounting adapter (not shown) is engaged and fixed via a hanging portion. This mounting adapter is fixed to the indoor wiring device on the ceiling surface side. In this way, the LED ceiling lamp 1 including the main body base 15 is fixed to a predetermined position on the ceiling surface via the mounting adapter, the appliance mounting portion, and the indoor wiring appliance, respectively.

By placing the lighting LED 9 and the remote control light receiving element 10 on the light source substrate 8, the height of these two parts can be set to be substantially equal without interfering with the lighting method of the LED 9 for lighting, thereby preventing the remote control light receiving element 10 from receiving light. The sensitivity is reduced. In addition, the effect of deleting parts required for each setting can be achieved.

A power supply connection section (not shown) is provided near the appliance mounting section. The power supply connection portion is electrically connected between the mounting adapter and the power supply board 12 through a wire (not shown). In this way, the LED ceiling lamp 1 receives power through the indoor wiring device, the installation adapter, and the power supply connection part, respectively.

The insulating plate 13 is provided to be sandwiched between the body base 15 and the heat dissipation plate 11. Both the main body base 15 and the heat dissipation plate 11 are made of metal, such as a pre-coated metal layer (PCM) steel plate. In contrast, the insulating plate 13 is made of a resin material such as polypropylene (PP), which has electrical insulation and flame resistance. And shaped.

The power source substrate 12 is held on the insulating plate 13 via a substrate locking portion protrudingly provided on the outer edge of the insulating plate 13. The insulating plate 13 is fixed to the main body base 15 with screws. In this way, the power source substrate 12 is locked and fixed in a heat radiation space surrounded by the main body base 15 and the heat radiation plate 11 while maintaining the electrical insulation.

The heat radiating plate 11 functions to cool the power source substrate 12 and the light source substrate 8 to which a plurality of LEDs are mounted. These substrates generate heat during operation. Generally speaking, the LED system of a semiconductor element has a heat-resistant property. In addition, since a large current with a low voltage flows during use and high-intensity light emission is performed, heat generated by the light emission causes deterioration of the LED itself or surrounding components. In order to suppress this deterioration and achieve long life and high reliability, it is necessary to perform appropriate heat radiation.

When the power supply substrate 12 and the light source substrate 8 generate heat, the gas-phase atmosphere temperature of the heat radiation space surrounded by the body base 15 and the heat radiation plate 11 increases. At this time, if the volume of the heat radiation space is small, the amount of air stored therein will decrease. As a result, the heat radiation effect due to contact with the air will be reduced, so the volume of the heat radiation space is as large as possible. In addition, from the viewpoint of maintaining good thermal conductivity, it is preferable that the heat sink 11 has a slightly conical shape and is formed integrally without a seam. Such a heat radiating plate 11 can be manufactured by press-forming a thin metal plate.

In the light source for lighting, the light source substrate 8 can be made into four substrates each having a common fan shape. The four substrates are formed into a donut shape as a whole in a state where they are mounted on a predetermined position of the heat sink 11. shape.

On the light source substrate 8, a plurality of main LEDs and security lamp LEDs as main light sources are mounted by welding. These LEDs emit light and generate heat during operation, causing their own temperature to rise. As the temperature rises, the luminous efficiency of the LED will decrease. In addition, the life will be shortened accordingly. Therefore, it is necessary to provide an appropriate heat sink to offset the temperature rise.

The LED cover 6 has a function of guiding the light beams emitted by the plurality of LEDs to the lower side (floor side); a function of physically preventing the plurality of LEDs from contacting the power supply line; and pressing the light source substrate 8 for heat dissipation The function of the plate 11 in close contact.

FIG. 2 is a partial view showing an example of a state where the LED cover 6 is attached to the light source substrate 8. As shown in the figure, the plurality of LEDs are configured to emit light through the corresponding plurality of dome-shaped portions. In this example, a pair of LED groups are housed in one dome-shaped portion, but the number of LEDs housed in the dome-shaped portion is not limited to this. In a pair of LED groups, for example, one of them is a white system LED that emits a light beam of a white system, and the other is a warm color system LED that emits a light beam of a warm color system. As these LEDs, for example, a combination of a blue LED that emits a blue light beam and a yellow phosphor that combines blue light and yellow light to emit white light or warm-color light (for example, orange light) can be suitably used. LED.

The LED outer cover 6 is integrally formed using, for example, polycarbonate (PC), acrylic (PMMA), or polystyrene (PS) resins having translucent and electrically insulating properties. The integral molding using this resin and a plurality of dome-shaped portions that pass light from each LED are matched with each other The combination can not only ensure the rigidity of the LED outer cover 6, but also improve the close contact between the light source substrate 8 and the heat sink 11.

A structure in which the light source substrate 8 is sandwiched between the heat dissipation plate 11 and the LED outer cover 6 is fixed to the heat dissipation plate 11 with screws. In this way, the close contact between the light source substrate 8 and the heat sink 11 becomes high, and the heat dissipation can be improved. Therefore, the density of the light emitting surface can be made uniform, and the LED ceiling lamp 1 having excellent light emitting efficiency of the LED can be realized.

Moreover, not only the arrangement of the LEDs can be adjusted to an appropriate position with respect to the LED outer cover 6, but also the effect of reducing the warpage or deformation of the light source substrate 8 can be achieved.

The light-transmitting outer cover 3 is held in a suspended state by a mounting fixture fixed to the base of the heat-radiating plate 11. Specifically, for example, by rotating the translucent outer cover 3 counterclockwise in the circumferential direction, an engagement portion (not shown) protruding from the translucent outer cover 3 can be released and engaged. The translucent outer cover 3 is integrally formed using, for example, a translucent resin such as acrylate (PMMA).

FIG. 4 is a cross-sectional view of the LED ceiling light body 2 and is a partial view showing a light source substrate 8 in a state where the LED outer cover 6 is mounted on the LED 9 for illumination and the light receiving element 10 for a remote controller.

Fig. 5 is a partial enlargement of Fig. 4. As shown in the figure, the plurality of lighting LEDs 9 are configured to emit light through the corresponding plurality of dome-shaped portions 6 a, and the remote control light receiving element 10 is arranged in the non-dome-shaped portion 6 b. Further, between the LED 9 for illumination and the remote control light receiving element 10, an inclined portion 6 c of the LED cover 6 is provided. The portion of the LED cover 6 corresponding to the lighting LED 9 and the remote control light receiving element 10 can be used. By providing an inclined inclined portion 6c between the portions, a structure in which the wavelength emitted from the lighting LED 9 does not easily reach the light receiving element 10 of the remote controller can be achieved.

6‧‧‧LED cover

6a‧‧‧ dome shaped part

6b‧‧‧ non-dome shaped part

6c‧‧‧inclined

9‧‧‧lighting LED

10‧‧‧ Remote control light receiving element

11‧‧‧ heat sink

15‧‧‧ base of the body

Claims (2)

An LED lighting device in which the lighting LED and the remote control light receiving element are mounted on the same light source substrate, and the heights of the parts of the aforementioned lighting LED and the remote control light receiving element are substantially equal. The LED lighting device described in item 1 of the patent application scope has an LED ceiling light body and a light-transmitting outer cover installed on the LED ceiling light body. The LED ceiling light body has: a body base; a heat sink, which is installed; At the base of the body; a power supply board surrounded by the body base and the heat sink; the light source board mounted on the heat sink; and an LED cover that covers the lighting LED, the remote control light receiving element and In the light source substrate, an inclined portion is provided between a portion of the LED outer cover facing the LED for illumination and a portion facing the light receiving element of the remote controller.