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TW201806237A - Antenna module and method of manufacturing the same, and portable electronic device - Google Patents

Antenna module and method of manufacturing the same, and portable electronic device Download PDF

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Publication number
TW201806237A
TW201806237A TW105124607A TW105124607A TW201806237A TW 201806237 A TW201806237 A TW 201806237A TW 105124607 A TW105124607 A TW 105124607A TW 105124607 A TW105124607 A TW 105124607A TW 201806237 A TW201806237 A TW 201806237A
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Taiwan
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conductive
layer
radiation
electrically connected
radiation layer
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TW105124607A
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Chinese (zh)
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TWI686007B (en
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游舜荃
鄭志宏
蔡嘉峻
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佳邦科技股份有限公司
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Abstract

The prevent invention provides an antenna module and a method of manufacturing the same, and a portable electronic device. The antenna module includes an antenna structure and an electronic structure. The antenna structure includes a radiation body and a conductive coil. One part of the conductive coil is embedded inside the radiation body, and another part of the conductive coil is exposed from the radiation body. The electronic structure includes a circuit substrate disposed on the top side of the radiation body and electrically connected to the conductive coil and an electronic element disposed on the circuit substrate and electrically connected to the circuit substrate. Therefore, it is easy for the antenna structure to output radiation energy due to the partially-exposed conductive coil.

Description

天線模組及其製作方法、以及可攜式電子裝置 Antenna module and manufacturing method thereof, and portable electronic device

本發明涉及一種天線模組及其製作方法以及一種可攜式電子裝置,特別是涉及一種應用於無線射頻辨識系統或是近場通訊系統的天線模組及其製作方法以及一種內部安裝有天線模組的可攜式電子裝置。 The invention relates to an antenna module and a manufacturing method thereof, and a portable electronic device, in particular to an antenna module applied to a radio frequency identification system or a near field communication system, a manufacturing method thereof and an antenna module mounted therein Group of portable electronic devices.

手機或任何類型的行動通訊裝置,已成為現代人隨身攜帶的配備。以往行動通訊裝置的主要功能僅限於撥打電話、發送簡訊或無線上網等大眾已知的功能。然而,隨著科技的進步,且由於手機攜帶方便的特點,業界已開始設想將某些符合日常生活所需的功能整合到手機上,例如非接觸式的智慧卡。所謂非接觸式的智慧卡,即為透過近距離的感應方式來使得設置在卡片內的晶片發揮作用。目前日常生活中應用非接觸式智慧卡的場合非常多,諸如採行PayPass TM與VISA WAVE規格的非接觸式信用卡、大眾運輸系統的悠遊卡、7-11的icash卡、具ID辨識功能的門禁卡與會員卡等等。上述智慧卡可提供使用者在日常生活方面許多非常便利的服務,故業者無不積極研發要將該些具有各種用途的智慧卡功能整合到人人都會隨身攜帶的手機上,讓原本多用來收聽電話的手機亦可拿來刷卡、作為電子錢包、搭大眾運輸系統、或是識別身份。 Mobile phones or any type of mobile communication device have become a portable device for modern people. In the past, the main functions of mobile communication devices were limited to functions such as making calls, sending text messages, or wireless Internet access. However, with the advancement of technology and the convenience of mobile phones, the industry has begun to envision the integration of certain functions required for daily life into mobile phones, such as contactless smart cards. The so-called non-contact smart card is a wafer that is placed in the card by a close-range sensing method. At present, there are many applications for contactless smart cards in daily life, such as contactless credit cards with PayPass TM and VISA WAVE specifications, leisure cards for mass transit systems, iSSH cards with 7-11, and access control with ID identification. Cards and membership cards and more. The above-mentioned smart card can provide users with many very convenient services in daily life. Therefore, all the developers are actively researching and developing the smart card functions with various uses into the mobile phone that everyone will carry with them, so that the original is used for listening. Phone phones can also be used to swipe cards, as e-wallets, to take the mass transit system, or to identify themselves.

上述具備近場通訊技術功能的手機,其內部通常裝設近場通 訊天線,然而近場通訊天線需要使用打線的方式來完成IC晶片的電性連接,不僅費時,而且成本也較高。 The above-mentioned mobile phone with near field communication technology is usually equipped with a near field pass. The antenna, however, the near field communication antenna needs to use the wire to complete the electrical connection of the IC chip, which is time consuming and costly.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種天線模組及其製作方法以及一種內部安裝有天線模組的可攜式電子裝置。 The technical problem to be solved by the present invention is to provide an antenna module and a manufacturing method thereof, and a portable electronic device with an antenna module mounted therein.

為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種天線模組,其包括:一天線結構以及一電子結構。所述天線結構包括一輻射本體以及一導電線圈。所述電子結構包括一設置在所述輻射本體的頂端上且電性連接於所述導電線圈的電路基板以及一設置在所述電路基板上且電性連接於所述電路基板的電子元件。 In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an antenna module including: an antenna structure and an electronic structure. The antenna structure includes a radiating body and a conductive coil. The electronic structure includes a circuit substrate disposed on a top end of the radiation body and electrically connected to the conductive coil, and an electronic component disposed on the circuit substrate and electrically connected to the circuit substrate.

為了解決上述的技術問題,本發明所採用的另外一技術方案是,提供一種天線模組的製作方法,其包括:首先,製作出一天線結構,所述天線結構包括一輻射本體以及一導電線圈;接著,製作出一電子結構,所述電子結構包括一電路基板以及一設置在所述電路基板上且電性連接於所述電路基板的電子元件;然後,將所述電子結構放置在所述天線結構的頂端上,其中,所述電路基板設置在所述輻射本體的頂端上且電性連接於所述導電線圈。 In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a method for fabricating an antenna module, comprising: first, fabricating an antenna structure, the antenna structure including a radiation body and a conductive coil And then, an electronic structure is formed, the electronic structure including a circuit substrate and an electronic component disposed on the circuit substrate and electrically connected to the circuit substrate; and then placing the electronic structure in the On the top end of the antenna structure, the circuit substrate is disposed on a top end of the radiation body and electrically connected to the conductive coil.

為了解決上述的技術問題,本發明所採用的另外再一技術方案是,提供一種可攜式電子裝置,其內部安裝有一天線模組,其特徵在於,所述天線模組包括:一天線結構以及一電子結構。所述天線結構包括一輻射本體以及一導電線圈。所述電子結構包括一設置在所述輻射本體的頂端上且電性連接於所述導電線圈的電路基板以及一設置在所述電路基板上且電性連接於所述電路基板的電子元件。 In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a portable electronic device having an antenna module mounted therein, wherein the antenna module includes: an antenna structure and An electronic structure. The antenna structure includes a radiating body and a conductive coil. The electronic structure includes a circuit substrate disposed on a top end of the radiation body and electrically connected to the conductive coil, and an electronic component disposed on the circuit substrate and electrically connected to the circuit substrate.

本發明的有益效果在於,本發明所提供的技術方案可通過“所述電子結構包括一設置在所述輻射本體的頂端上且電性連接 於所述導電線圈的電路基板以及一設置在所述電路基板上且電性連接於所述電路基板的電子元件”的技術特徵,所製作出一種以所述天線結構來搭載所述電子元件的天線模組以及一種內部安裝有天線模組的可攜式電子裝置。 An advantageous effect of the present invention is that the technical solution provided by the present invention can be adopted by: "the electronic structure includes a first end disposed on the top of the radiation body and electrically connected a technical feature of the circuit substrate of the conductive coil and an electronic component disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the electronic component is mounted by the antenna structure The antenna module and a portable electronic device with an antenna module mounted therein.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,然而所提供的附圖僅用於提供參考與說明,並非用來對本發明加以限制。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

P‧‧‧可攜式電子裝置 P‧‧‧Portable electronic device

M‧‧‧天線模組 M‧‧‧Antenna Module

1‧‧‧天線結構 1‧‧‧Antenna structure

10‧‧‧輻射本體 10‧‧‧radiation ontology

100‧‧‧基底輻射層 100‧‧‧Based radiation layer

101‧‧‧第一輻射層 101‧‧‧First radiation layer

102‧‧‧第二輻射層 102‧‧‧second radiation layer

1021‧‧‧第一側端 1021‧‧‧ first side

1022‧‧‧第二側端 1022‧‧‧second side

103‧‧‧第三輻射層 103‧‧‧ Third radiation layer

1031‧‧‧第一側端 1031‧‧‧First side

1032‧‧‧第二側端 1032‧‧‧second side

104‧‧‧頂端輻射層 104‧‧‧Top radiation layer

1040‧‧‧上表面 1040‧‧‧ upper surface

11‧‧‧導電線圈 11‧‧‧Electrical coil

111‧‧‧第一導電層 111‧‧‧First conductive layer

1111‧‧‧第一左側表面 1111‧‧‧First left side surface

1112‧‧‧第一右側表面 1112‧‧‧ first right side surface

112‧‧‧第二導電層 112‧‧‧Second conductive layer

1121‧‧‧第二左側表面 1121‧‧‧Second left side surface

1122‧‧‧第二右側表面 1122‧‧‧Second right side surface

113A‧‧‧第一導電連接層 113A‧‧‧First conductive connection layer

1130A‧‧‧第一連接表面 1130A‧‧‧ first connecting surface

113B‧‧‧第二導電連接層 113B‧‧‧Second conductive connection layer

1130B‧‧‧第二連接表面 1130B‧‧‧Second connection surface

114A‧‧‧第三導電連接層 114A‧‧‧3rd conductive connection layer

1140A‧‧‧第三連接表面 1140A‧‧‧ third connecting surface

114B‧‧‧第四導電連接層 114B‧‧‧4th conductive connection layer

1140B‧‧‧第四連接表面 1140B‧‧‧Four connection surface

115A‧‧‧第一導電延伸層 115A‧‧‧First Conductive Extension

1150A‧‧‧第一延伸表面 1150A‧‧‧First extended surface

115B‧‧‧第二導電延伸層 115B‧‧‧Second conductive extension layer

1150B‧‧‧第二延伸表面 1150B‧‧‧Second extension surface

116A‧‧‧第五導電連接層 116A‧‧‧5th conductive connection layer

116B‧‧‧第六導電連接層 116B‧‧‧6th conductive connection layer

117A‧‧‧第一引出電極 117A‧‧‧first extraction electrode

1170A‧‧‧第一電極表面 1170A‧‧‧First electrode surface

117B‧‧‧第二引出電極 117B‧‧‧second extraction electrode

1170B‧‧‧第二電極表面 1170B‧‧‧Second electrode surface

2‧‧‧電子結構 2‧‧‧Electronic structure

20‧‧‧電路基板 20‧‧‧ circuit board

200‧‧‧導電接點 200‧‧‧Electrical contacts

21‧‧‧電子元件 21‧‧‧Electronic components

圖1為本發明所提供的一種以天線結構來搭載電子元件的天線模組的製作方法的流程圖。 1 is a flow chart of a method for fabricating an antenna module in which an electronic component is mounted by an antenna structure according to the present invention.

圖2為本發明天線模組的天線結構的立體示意圖。 2 is a perspective view showing the antenna structure of the antenna module of the present invention.

圖3為本發明天線模組的天線結構的剖面示意圖。 3 is a cross-sectional view showing the antenna structure of the antenna module of the present invention.

圖4為本發明天線模組的天線結構的導電線圈的立體示意圖。 4 is a perspective view of a conductive coil of an antenna structure of an antenna module of the present invention.

圖5為本發明天線模組的電子結構的立體示意圖。 FIG. 5 is a perspective view of the electronic structure of the antenna module of the present invention.

圖6為本發明所提供的一種以天線結構來搭載電子元件的天線模組的立體示意圖。 FIG. 6 is a perspective view of an antenna module in which an electronic component is mounted by an antenna structure according to the present invention.

圖7為本發明所提供的一種內部安裝有天線模組的可攜式電子裝置的功能方塊圖。 FIG. 7 is a functional block diagram of a portable electronic device with an antenna module installed therein according to the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“天線模組及其製作方法以及一種內部安裝有天線模組的可攜式電子裝置”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,予以聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的技術範圍。 The following is a specific embodiment to illustrate an embodiment of the present invention relating to an "antenna module and a method for fabricating the same, and a portable electronic device with an antenna module mounted therein", which can be used by those skilled in the art. The disclosure discloses the advantages and effects of the present invention. The present invention may be carried out or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not intended to be construed in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

請參閱圖1至圖6所示,本發明提供一種天線模組M的製作方法,其包括:首先,配合圖1以及圖2所示,製作出一天線結構1,天線結構1包括一輻射本體10以及一導電線圈11,其中,導電線圈11的其中一部分內埋在輻射本體10內,並且導電線圈11的另外一部分裸露在輻射本體10外(S100);接著,配合圖1以及圖5所示,製作出一電子結構2,電子結構2包括一電路基板20以及一設置在電路基板20上且電性連接於電路基板20的電子元件21(S102),其中電路基板20的底端具有多個導電接點200;然後,配合圖1以及圖6所示,將電子結構2放置在天線結構1的頂端上,以完成一種以天線結構來搭載電子元件21的天線模組M的製作,其中電路基板20設置在輻射本體10的頂端上且通過多個導電接點200以電性連接於導電線圈11(S104)。舉例來說,依據不同的設計需求,天線模組M所提供的電感值能通過輻射本體10的導磁率以及導電線圈11的圈數進行調整,且天線模組M所提供的阻值能通過導電線圈11的線寬進行調整。 Referring to FIG. 1 to FIG. 6 , the present invention provides a method for fabricating an antenna module M, which includes: first, an antenna structure 1 is formed as shown in FIG. 1 and FIG. 2 , and the antenna structure 1 includes a radiation body. 10 and a conductive coil 11, wherein a part of the conductive coil 11 is buried in the radiation body 10, and another part of the conductive coil 11 is exposed outside the radiation body 10 (S100); and then, as shown in FIG. 1 and FIG. An electronic structure 2 is formed. The electronic structure 2 includes a circuit substrate 20 and an electronic component 21 (S102) disposed on the circuit substrate 20 and electrically connected to the circuit substrate 20, wherein the bottom end of the circuit substrate 20 has a plurality of Conductive contact 200; then, as shown in FIG. 1 and FIG. 6, the electronic structure 2 is placed on the top end of the antenna structure 1 to complete the fabrication of an antenna module M in which the electronic component 21 is mounted by an antenna structure, wherein the circuit The substrate 20 is disposed on the top end of the radiation body 10 and electrically connected to the conductive coil 11 through a plurality of conductive contacts 200 (S104). For example, according to different design requirements, the inductance value provided by the antenna module M can be adjusted by the magnetic permeability of the radiation body 10 and the number of turns of the conductive coil 11, and the resistance value provided by the antenna module M can be electrically conductive. The line width of the coil 11 is adjusted.

值得注意的是,由於天線結構1與電子結構2可以分開製作,所以在使用原有的加工設備或者加工方法的條件下,即可分別完成天線結構1與電子結構2的製作,如此可有效降低製作成本,並且增加天線結構1與電子結構2在搭配上的靈活性。舉例來說,電子結構2可以直接被黏貼在天線結構1上,所以天線模組M的整體體積可以得到有效的降低。 It should be noted that since the antenna structure 1 and the electronic structure 2 can be separately manufactured, the fabrication of the antenna structure 1 and the electronic structure 2 can be completed separately under the condition of using the original processing equipment or processing method, which can effectively reduce The manufacturing cost and the flexibility of the antenna structure 1 and the electronic structure 2 are matched. For example, the electronic structure 2 can be directly attached to the antenna structure 1, so that the overall volume of the antenna module M can be effectively reduced.

藉此,配合圖2、圖5以及圖6所示,本發明提供一種天線模組M,其包括:一天線結構1以及一電子結構2。首先,天線結構1包括一輻射本體10以及一導電線圈11,其中導電線圈11的其中一部分內埋在輻射本體10內,並且導電線圈11的另外一部分裸露在輻射本體10外。另外,電子結構2包括一設置在輻射本體10的頂端上且電性連接於導電線圈11的電路基板20以及一設置在電路基板20上且通過多個導電接點200以電性連接於電路基板 20的電子元件21。舉例來說,電子元件21可以是任何種類的IC晶片,並且天線模組M可被應用於無線射頻辨識系統(Radio Frequency Identification,RFID)或是近場通訊系統(Near Field Communication,NFC)。 Accordingly, the present invention provides an antenna module M including an antenna structure 1 and an electronic structure 2 as shown in FIG. 2, FIG. 5 and FIG. First, the antenna structure 1 includes a radiating body 10 and a conductive coil 11 in which a portion of the conductive coil 11 is buried within the radiating body 10, and another portion of the conductive coil 11 is exposed outside the radiating body 10. In addition, the electronic structure 2 includes a circuit substrate 20 disposed on the top end of the radiation body 10 and electrically connected to the conductive coil 11 , and a circuit board 20 disposed on the circuit substrate 20 and electrically connected to the circuit substrate through the plurality of conductive contacts 200 . 20 electronic component 21. For example, the electronic component 21 can be any kind of IC chip, and the antenna module M can be applied to a Radio Frequency Identification (RFID) or a Near Field Communication (NFC) system.

值得注意的是,大部分的導電線圈11會被內埋在輻射本體10內,以使得大部分的導電線圈11能夠得到輻射本體10的保護,以提升導電線圈11的環境耐受度,並提升天線結構1的整體可靠度。另外,由於導電線圈11的另外一部分可以被裸露在輻射本體10外,所以可以使得天線結構1的輻射能量較容易發射出去。 It is worth noting that most of the conductive coils 11 are buried in the radiation body 10, so that most of the conductive coils 11 can be protected by the radiation body 10 to improve the environmental tolerance of the conductive coils 11 and improve The overall reliability of the antenna structure 1. In addition, since another portion of the conductive coil 11 can be exposed outside the radiation body 10, the radiant energy of the antenna structure 1 can be made to be easily emitted.

更進一步來說,配合圖2至圖4所示,輻射本體10包括一基底輻射層100、一設置在基底輻射層100上的第一輻射層101、一設置在第一輻射層101上的第二輻射層102、一設置在第二輻射層102上的第三輻射層103以及一設置在第三輻射層103上的頂端輻射層104。也就是說,基底輻射層100、第一輻射層101、第二輻射層102、第三輻射層103以及頂端輻射層104可以彼此相連成單一輻射本體10。另外,輻射本體10可由導磁材料或者介電材料所製成,例如導磁材料主要可由過渡元素鐵、鈷、鎳及其合金等組成且能夠直接或間接產生磁性的物質。舉例來說,基底輻射層100具有一基底導磁率μ4,第一輻射層101具有一第一導磁率μ1,第二輻射層102具有一第二導磁率μ2,第三輻射層103具有一第三導磁率μ3,頂端輻射層104具有一頂端導磁率μ5,並且第一導磁率μ1、第二導磁率μ2以及第三導磁率μ3三者都大於基底導磁率μ4以及頂端導磁率μ5,其中所採用的導磁率的範圍可以是1≦μ1,μ2,μ3,μ4,μ5≦100。 Further, as shown in FIG. 2 to FIG. 4, the radiation body 10 includes a base radiation layer 100, a first radiation layer 101 disposed on the base radiation layer 100, and a first radiation layer 101. The second radiation layer 102, a third radiation layer 103 disposed on the second radiation layer 102, and a top radiation layer 104 disposed on the third radiation layer 103. That is, the base radiation layer 100, the first radiation layer 101, the second radiation layer 102, the third radiation layer 103, and the top radiation layer 104 may be connected to each other as a single radiation body 10. In addition, the radiation body 10 may be made of a magnetic conductive material or a dielectric material, for example, a magnetic conductive material may be mainly composed of a transition element of iron, cobalt, nickel, an alloy thereof, or the like, and capable of directly or indirectly generating a magnetic substance. For example, the base radiation layer 100 has a substrate magnetic permeability μ4, the first radiation layer 101 has a first magnetic permeability μ1, the second radiation layer 102 has a second magnetic permeability μ2, and the third radiation layer 103 has a third. The magnetic permeability μ3, the top radiation layer 104 has a top magnetic permeability μ5, and the first magnetic permeability μ1, the second magnetic permeability μ2, and the third magnetic permeability μ3 are both larger than the substrate magnetic permeability μ4 and the top magnetic permeability μ5, wherein The magnetic permeability may range from 1 ≦μ1, μ2, μ3, μ4, and μ5≦100.

值得注意的是,當基底導磁率μ4與頂端導磁率μ5所採用的導磁率非常低時,例如μ4=1以及μ5=1時,導電線圈11的全部就可以都被內埋在輻射本體10內,此種設計一樣可以達到讓天線結構1的輻射能量(或是說,輻射本體10的能量)較容易發射出去 的優點。 It should be noted that when the magnetic permeability used for the substrate permeability μ4 and the tip permeability μ5 is very low, for example, μ4=1 and μ5=1, all of the conductive coils 11 may be buried in the radiation body 10. In this way, the radiant energy of the antenna structure 1 (or the energy of the radiating body 10) can be easily emitted. The advantages.

更進一步來說,配合圖2至圖4所示,導電線圈11包括多個連接於第一輻射層101與第二輻射層102之間的第一導電層111、多個連接於第二輻射層102與第三輻射層103之間的第二導電層112、多個連接於第二輻射層102的一第一側端1021的第一導電連接層113A、多個連接於第二輻射層102的一第二側端1022的第二導電連接層113B、至少一連接於第三輻射層103的一第一側端1031的第三導電連接層114A、至少一連接於第三輻射層103的一第二側端1032的第四導電連接層114B、至少一設置在第三輻射層103上且電性連接於至少一第三導電連接層114A的第一導電延伸層115A、至少一設置在第三輻射層103上且電性連接於至少一第四導電連接層114B的第二導電延伸層115B、至少一電性連接於至少一第一導電延伸層115A的第五導電連接層116A、至少一電性連接於至少一第二導電延伸層115B的第六導電連接層116B、至少一電性連接於至少一第五導電連接層116A且從頂端輻射層104部分裸露而出的第一引出電極117A以及至少一電性連接於至少一第六導電連接層116B且從頂端輻射層104部分裸露而出的第二引出電極117B。另外,每一個第一導電連接層113A電性連接於相對應的第一導電層111與相對應的第二導電層112之間,每一個第二導電連接層113B電性連接於相對應的第一導電層111與相對應的第二導電層112之間,至少一第三導電連接層114A電性連接於相對應的第一導電連接層113A與至少一第一導電延伸層115A之間,並且至少一第四導電連接層114B電性連接於相對應的第二導電連接層113B與至少一第二導電延伸層115B之間。此外,配合圖3至圖6所示,電路基板20的兩個導電接點200可分別電性連接於至少一第一引出電極117A以及至少一第二引出電極117B。 Further, as shown in FIG. 2 to FIG. 4, the conductive coil 11 includes a plurality of first conductive layers 111 connected between the first radiation layer 101 and the second radiation layer 102, and a plurality of connected to the second radiation layer. a second conductive layer 112 between the 102 and the third radiation layer 103, a plurality of first conductive connection layers 113A connected to a first side end 1021 of the second radiation layer 102, and a plurality of connected to the second radiation layer 102. a second conductive connection layer 113B of the second side end 1022, at least one third conductive connection layer 114A connected to a first side end 1031 of the third radiation layer 103, and at least one first connection to the third radiation layer 103 a fourth conductive connecting layer 114B of the two side ends 1032, at least one first conductive extending layer 115A disposed on the third radiating layer 103 and electrically connected to the at least one third conductive connecting layer 114A, at least one disposed on the third radiation The second conductive extension layer 115B on the layer 103 and electrically connected to the at least one fourth conductive connection layer 114B, the at least one fifth conductive connection layer 116A electrically connected to the at least one first conductive extension layer 115A, at least one electrical a sixth conductive connection layer connected to the at least one second conductive extension layer 115B 116B, at least one first extraction electrode 117A electrically connected to at least one fifth conductive connection layer 116A and partially exposed from the top radiation layer 104, and at least one electrically connected to the at least one sixth conductive connection layer 116B and from the top end The second extraction electrode 117B is partially exposed by the radiation layer 104. In addition, each of the first conductive connection layers 113A is electrically connected between the corresponding first conductive layer 111 and the corresponding second conductive layer 112, and each of the second conductive connection layers 113B is electrically connected to the corresponding first Between a conductive layer 111 and a corresponding second conductive layer 112, at least one third conductive connection layer 114A is electrically connected between the corresponding first conductive connection layer 113A and at least one first conductive extension layer 115A, and The at least one fourth conductive connection layer 114B is electrically connected between the corresponding second conductive connection layer 113B and the at least one second conductive extension layer 115B. In addition, as shown in FIG. 3 to FIG. 6 , the two conductive contacts 200 of the circuit substrate 20 can be electrically connected to the at least one first extraction electrode 117A and the at least one second extraction electrode 117B, respectively.

更進一步來說,配合圖2至圖4所示,每一個第一導電層111 具有一第一左側表面1111,每一個第二導電層112具有一第二左側表面1121,每一個第一導電連接層113A具有一第一連接表面1130A,至少一第三導電連接層114A具有一第三連接表面1140A,至少一第一導電延伸層115A具有一第一延伸表面1150A,並且第一左側表面1111、第一連接表面1130A、第二左側表面1121、第三連接表面1140A以及第一延伸表面1150A會彼此切齊。另外,每一個第一導電層111具有一與第一左側表面1111相反設置的第一右側表面1112,每一個第二導電層112具有一與第二左側表面1121相反設置的第二右側表面1122,每一個第二導電連接層113B具有一第二連接表面1130B,至少一第四導電連接層114B具有一第四連接表面1140B,至少一第二導電延伸層115B具有一第二延伸表面1150B,並且第一右側表面1112、第二連接表面1130B、第二右側表面1122、第四連接表面1140B以及第二延伸表面1150B彼此切齊。此外,至少一第一引出電極117A具有一第一電極表面1170A,至少一第二引出電極117B具有一第二電極表面1170B,並且第一電極表面1170A、第二電極表面1170B以及頂端輻射層104的上表面1040彼此切齊。 Further, in conjunction with FIG. 2 to FIG. 4, each of the first conductive layers 111 Each of the second conductive layers 112 has a second left surface 1121. Each of the first conductive connection layers 113A has a first connection surface 1130A, and at least one third conductive connection layer 114A has a first surface. The third connection surface 1140A, the at least one first conductive extension layer 115A has a first extension surface 1150A, and the first left side surface 1111, the first connection surface 1130A, the second left side surface 1121, the third connection surface 1140A, and the first extension surface The 1150A will be in line with each other. In addition, each of the first conductive layers 111 has a first right side surface 1112 disposed opposite to the first left side surface 1111, and each of the second conductive layers 112 has a second right side surface 1122 opposite to the second left side surface 1121. Each of the second conductive connection layers 113B has a second connection surface 1130B, at least one fourth conductive connection layer 114B has a fourth connection surface 1140B, and at least one second conductive extension layer 115B has a second extension surface 1150B, and A right side surface 1112, a second connecting surface 1130B, a second right side surface 1122, a fourth connecting surface 1140B, and a second extending surface 1150B are aligned with each other. In addition, at least one first extraction electrode 117A has a first electrode surface 1170A, at least one second extraction electrode 117B has a second electrode surface 1170B, and the first electrode surface 1170A, the second electrode surface 1170B, and the top radiation layer 104 The upper surfaces 1040 are aligned with each other.

值得注意的是,配合圖6以及圖7所示,本發明還進一步提供一種可攜式電子裝置P,並且可攜式電子裝置P的內部安裝有一天線模組M。首先,天線模組M包括一天線結構1以及一電子結構2。天線結構1包括一輻射本體10以及一導電線圈11。導電線圈11的其中一部分內埋在輻射本體10內,並且導電線圈11的另外一部分裸露在輻射本體10外。另外,電子結構2包括一設置在輻射本體10的頂端上且電性連接於導電線圈11的電路基板20以及一設置在電路基板20上且電性連接於電路基板20的電子元件21。 It is to be noted that, in conjunction with FIG. 6 and FIG. 7 , the present invention further provides a portable electronic device P, and an antenna module M is mounted inside the portable electronic device P. First, the antenna module M includes an antenna structure 1 and an electronic structure 2. The antenna structure 1 includes a radiating body 10 and a conductive coil 11. A portion of the conductive coil 11 is buried within the radiation body 10, and another portion of the conductive coil 11 is exposed outside the radiation body 10. In addition, the electronic structure 2 includes a circuit substrate 20 disposed on the top end of the radiation body 10 and electrically connected to the conductive coil 11 and an electronic component 21 disposed on the circuit substrate 20 and electrically connected to the circuit substrate 20.

[實施例的有益效果] [Advantageous Effects of Embodiments]

綜上所述,本發明的有益效果在於,本發明所提供的技術方 案可通過“電子結構2包括一設置在輻射本體10的頂端上且電性連接於導電線圈11的電路基板20以及一設置在電路基板20上且電性連接於電路基板20的電子元件21”的技術特徵,所製作出一種以天線結構1來搭載電子元件21的天線模組M以及一種內部安裝有天線模組M的可攜式電子裝置P。 In summary, the beneficial effects of the present invention are that the technical party provided by the present invention The electronic structure 2 includes a circuit substrate 20 disposed on the top end of the radiation body 10 and electrically connected to the conductive coil 11 and an electronic component 21 disposed on the circuit substrate 20 and electrically connected to the circuit substrate 20 According to the technical feature, an antenna module M in which the electronic component 21 is mounted by the antenna structure 1 and a portable electronic device P in which the antenna module M is mounted are manufactured.

更進一步來說,由於天線結構1與電子結構2可以分開製作,所以在使用原有的加工設備或者加工方法的條件下,即可分別完成天線結構1與電子結構2的製作,如此可有效降低製作成本,並且增加天線結構1與電子結構2在搭配上的靈活性。舉例來說,電子結構2可以直接被黏貼在天線結構1上,所以天線模組M的整體體積可以得到有效的降低。 Furthermore, since the antenna structure 1 and the electronic structure 2 can be separately manufactured, the fabrication of the antenna structure 1 and the electronic structure 2 can be completed separately under the condition of using the original processing equipment or processing method, which can effectively reduce The manufacturing cost and the flexibility of the antenna structure 1 and the electronic structure 2 are matched. For example, the electronic structure 2 can be directly attached to the antenna structure 1, so that the overall volume of the antenna module M can be effectively reduced.

更進一步來說,大部分的導電線圈11會被內埋在輻射本體10內,以使得大部分的導電線圈11能夠得到輻射本體10的保護,以提升導電線圈11的環境耐受度,並提升天線結構1的整體可靠度。另外,由於導電線圈11的另外一部分可以被裸露在輻射本體10外,所以可以使得天線結構1的輻射能量較容易發射出去。 Furthermore, most of the conductive coils 11 are buried in the radiation body 10, so that most of the conductive coils 11 can be protected by the radiation body 10 to improve the environmental tolerance of the conductive coils 11 and improve The overall reliability of the antenna structure 1. In addition, since another portion of the conductive coil 11 can be exposed outside the radiation body 10, the radiant energy of the antenna structure 1 can be made to be easily emitted.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,故凡運用本發明說明書及附圖內容所做的等效技術變化,均包含於本發明的申請專利範圍內。 The above disclosure is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the application of the present invention. Within the scope of the patent.

M‧‧‧天線模組 M‧‧‧Antenna Module

1‧‧‧天線結構 1‧‧‧Antenna structure

10‧‧‧輻射本體 10‧‧‧radiation ontology

11‧‧‧導電線圈 11‧‧‧Electrical coil

2‧‧‧電子結構 2‧‧‧Electronic structure

20‧‧‧電路基板 20‧‧‧ circuit board

200‧‧‧導電接點 200‧‧‧Electrical contacts

21‧‧‧電子元件 21‧‧‧Electronic components

Claims (10)

一種天線模組,其包括:一天線結構,所述天線結構包括一輻射本體以及一導電線圈;以及一電子結構,所述電子結構包括一設置在所述輻射本體的頂端上且電性連接於所述導電線圈的電路基板以及一設置在所述電路基板上且電性連接於所述電路基板的電子元件。 An antenna module includes: an antenna structure including a radiation body and a conductive coil; and an electronic structure, the electronic structure including a top portion of the radiation body and electrically connected to a circuit substrate of the conductive coil and an electronic component disposed on the circuit substrate and electrically connected to the circuit substrate. 如請求項1所述的天線模組,其中,所述導電線圈的其中一部分內埋在所述輻射本體內,且所述導電線圈的另外一部分裸露在所述輻射本體外,其中,所述輻射本體包括一基底輻射層、一設置在所述基底輻射層上的第一輻射層、一設置在所述第一輻射層上的第二輻射層、一設置在所述第二輻射層上的第三輻射層以及一設置在所述第三輻射層上的頂端輻射層,且所述輻射本體由導磁材料或者介電材料所製成,其中,所述基底輻射層具有一基底導磁率,所述第一輻射層具有一第一導磁率,所述第二輻射層具有一第二導磁率,所述第三輻射層具有一第三導磁率,所述頂端輻射層具有一頂端導磁率,且所述第一導磁率、所述第二導磁率以及所述第三導磁率三者都大於所述基底導磁率以及所述頂端導磁率。 The antenna module of claim 1, wherein a part of the conductive coil is buried in the radiation body, and another part of the conductive coil is exposed outside the radiation body, wherein the radiation The body includes a base radiation layer, a first radiation layer disposed on the base radiation layer, a second radiation layer disposed on the first radiation layer, and a first radiation layer disposed on the second radiation layer a third radiation layer and a top radiation layer disposed on the third radiation layer, and the radiation body is made of a magnetic conductive material or a dielectric material, wherein the base radiation layer has a substrate magnetic permeability, The first radiation layer has a first magnetic permeability, the second radiation layer has a second magnetic permeability, the third radiation layer has a third magnetic permeability, and the top radiation layer has a top magnetic permeability, and The first magnetic permeability, the second magnetic permeability, and the third magnetic permeability are both greater than the substrate permeability and the tip permeability. 如請求項2所述的天線模組,其中,所述導電線圈包括多個連接於所述第一輻射層與所述第二輻射層之間的第一導電層、多個連接於所述第二輻射層與所述第三輻射層之間的第二導電層、多個連接於所述第二輻射層的一第一側端的第一導電連接層、多個連接於所述第二輻射層的一第二側端的第二導電連接層、至少一連接於所述第三輻射層的一第一側端的第三導電連接層、至少一連接於所述第三輻射層的一第二側端的第四導電連接層、至少一設置在所述第三輻射層上且電性連接於至少一 所述第三導電連接層的第一導電延伸層、至少一設置在所述第三輻射層上且電性連接於至少一所述第四導電連接層的第二導電延伸層、至少一電性連接於至少一所述第一導電延伸層的第五導電連接層、至少一電性連接於至少一所述第二導電延伸層的第六導電連接層、至少一電性連接於至少一所述第五導電連接層且從所述頂端輻射層部分裸露而出的第一引出電極以及至少一電性連接於至少一所述第六導電連接層且從所述頂端輻射層部分裸露而出的第二引出電極,其中,每一個所述第一導電連接層電性連接於相對應的所述第一導電層與相對應的所述第二導電層之間,每一個所述第二導電連接層電性連接於相對應的所述第一導電層與相對應的所述第二導電層之間,至少一第三導電連接層電性連接於相對應的所述第一導電連接層與至少一所述第一導電延伸層之間,至少一第四導電連接層電性連接於相對應的所述第二導電連接層與至少一所述第二導電延伸層之間,且所述電路基板電性連接於至少一第一引出電極以及至少一第二引出電極。 The antenna module of claim 2, wherein the conductive coil comprises a plurality of first conductive layers connected between the first radiation layer and the second radiation layer, and a plurality of connected to the first a second conductive layer between the second radiation layer and the third radiation layer, a plurality of first conductive connection layers connected to a first side end of the second radiation layer, and a plurality of connected to the second radiation layer a second conductive connection layer at a second side end, at least one third conductive connection layer connected to a first side end of the third radiation layer, and at least one second side end connected to the third radiation layer The fourth conductive connection layer is disposed on the third radiation layer and electrically connected to at least one a first conductive extension layer of the third conductive connection layer, at least one second conductive extension layer disposed on the third radiation layer and electrically connected to the at least one fourth conductive connection layer, and at least one electrical property a fifth conductive connection layer connected to the at least one first conductive extension layer, at least one sixth conductive connection layer electrically connected to the at least one second conductive extension layer, at least one electrically connected to the at least one a first conductive connection layer and a first extraction electrode exposed from the top radiation layer portion and at least one electrically connected to the at least one of the sixth conductive connection layer and exposed from the top radiation layer portion a second extraction electrode, wherein each of the first conductive connection layers is electrically connected between the corresponding first conductive layer and the corresponding second conductive layer, and each of the second conductive connection layers Electrically connecting between the corresponding first conductive layer and the corresponding second conductive layer, the at least one third conductive connection layer being electrically connected to the corresponding first conductive connection layer and at least one The first conductive extension The at least one fourth conductive connection layer is electrically connected between the corresponding second conductive connection layer and the at least one second conductive extension layer, and the circuit substrate is electrically connected to the at least one first The extraction electrode and the at least one second extraction electrode. 如請求項3所述的天線模組,其中,每一個所述第一導電層具有一第一左側表面,每一個所述第二導電層具有一第二左側表面,每一個所述第一導電連接層具有一第一連接表面,至少一所述第三導電連接層具有一第三連接表面,至少一所述第一導電延伸層具有一第一延伸表面,且所述第一左側表面、所述第一連接表面、所述第二左側表面、所述第三連接表面以及所述第一延伸表面彼此切齊,其中,每一個所述第一導電層具有一與所述第一左側表面相反設置的第一右側表面,每一個所述第二導電層具有一與所述第二左側表面相反設置的第二右側表面,每一個所述第二導電連接層具有一第二連接表面,至少一所述第四導電連接層具有一第四連接表面,至少一所述第二導電延伸層具有一第二延伸表面,且所述第一右側表面、所述第 二連接表面、所述第二右側表面、所述第四連接表面以及所述第二延伸表面彼此切齊,其中,至少一所述第一引出電極具有一第一電極表面,至少一第二引出電極具有一第二電極表面,且所述第一電極表面、所述第二電極表面以及所述頂端輻射層的上表面彼此切齊。 The antenna module of claim 3, wherein each of the first conductive layers has a first left side surface, and each of the second conductive layers has a second left side surface, each of the first conductive layers The connection layer has a first connection surface, at least one of the third conductive connection layers has a third connection surface, at least one of the first conductive extension layers has a first extension surface, and the first left side surface The first connecting surface, the second left surface, the third connecting surface, and the first extending surface are aligned with each other, wherein each of the first conductive layers has a reverse opposite to the first left surface a first right side surface, each of the second conductive layers having a second right side surface opposite to the second left side surface, each of the second conductive connection layers having a second connection surface, at least one The fourth conductive connection layer has a fourth connection surface, at least one of the second conductive extension layers has a second extension surface, and the first right side surface, the first The second connecting surface, the second right surface, the fourth connecting surface and the second extending surface are aligned with each other, wherein at least one of the first extraction electrodes has a first electrode surface and at least one second lead The electrode has a second electrode surface, and the first electrode surface, the second electrode surface, and the top surface of the tip radiation layer are aligned with each other. 一種天線模組的製作方法,其包括:製作出一天線結構,所述天線結構包括一輻射本體以及一導電線圈;製作出一電子結構,所述電子結構包括一電路基板以及一設置在所述電路基板上且電性連接於所述電路基板的電子元件;以及將所述電子結構放置在所述天線結構的頂端上,其中,所述電路基板設置在所述輻射本體的頂端上且電性連接於所述導電線圈。 A method for fabricating an antenna module, comprising: fabricating an antenna structure, the antenna structure including a radiation body and a conductive coil; and fabricating an electronic structure, the electronic structure including a circuit substrate and a An electronic component on the circuit substrate and electrically connected to the circuit substrate; and placing the electronic structure on a top end of the antenna structure, wherein the circuit substrate is disposed on a top end of the radiation body and electrically Connected to the conductive coil. 如請求項5所述的天線模組的製作方法,其中,所述導電線圈的其中一部分內埋在所述輻射本體內,且所述導電線圈的另外一部分裸露在所述輻射本體外,其中,所述天線模組的電感值能通過所述輻射本體的導磁率以及所述導電線圈的圈數進行調整,且所述天線模組的阻值能通過所述導電線圈的線寬進行調整。 The method of manufacturing the antenna module of claim 5, wherein a part of the conductive coil is buried in the radiation body, and another part of the conductive coil is exposed outside the radiation body, wherein The inductance value of the antenna module can be adjusted by the magnetic permeability of the radiation body and the number of turns of the conductive coil, and the resistance of the antenna module can be adjusted by the line width of the conductive coil. 一種可攜式電子裝置,其內部安裝有一天線模組,其特徵在於,所述天線模組包括:一天線結構,所述天線結構包括一輻射本體以及一導電線圈;以及一電子結構,所述電子結構包括一設置在所述輻射本體的頂端上且電性連接於所述導電線圈的電路基板以及一設置在所述電路基板上且電性連接於所述電路基板的電子元件。 A portable electronic device is internally mounted with an antenna module, wherein the antenna module includes: an antenna structure, the antenna structure includes a radiation body and a conductive coil; and an electronic structure, The electronic structure includes a circuit substrate disposed on a top end of the radiation body and electrically connected to the conductive coil, and an electronic component disposed on the circuit substrate and electrically connected to the circuit substrate. 如請求項7所述的可攜式電子裝置,其中,所述導電線圈的其 中一部分內埋在所述輻射本體內,且所述導電線圈的另外一部分裸露在所述輻射本體外,其中,所述輻射本體包括一基底輻射層、一設置在所述基底輻射層上的第一輻射層、一設置在所述第一輻射層上的第二輻射層、一設置在所述第二輻射層上的第三輻射層以及一設置在所述第三輻射層上的頂端輻射層,且所述輻射本體由導磁材料或者介電材料所製成,其中,所述基底輻射層具有一基底導磁率,所述第一輻射層具有一第一導磁率,所述第二輻射層具有一第二導磁率,所述第三輻射層具有一第三導磁率,所述頂端輻射層具有一頂端導磁率,且所述第一導磁率、所述第二導磁率以及所述第三導磁率三者都大於所述基底導磁率以及所述頂端導磁率。 The portable electronic device of claim 7, wherein the conductive coil a portion of the conductive body is buried in the radiation body, and another portion of the conductive coil is exposed outside the radiation body, wherein the radiation body includes a base radiation layer, and a first portion disposed on the base radiation layer a radiation layer, a second radiation layer disposed on the first radiation layer, a third radiation layer disposed on the second radiation layer, and a top radiation layer disposed on the third radiation layer And the radiation body is made of a magnetic conductive material or a dielectric material, wherein the base radiation layer has a substrate magnetic permeability, the first radiation layer has a first magnetic permeability, and the second radiation layer Having a second magnetic permeability, the third radiation layer has a third magnetic permeability, the top radiation layer has a top magnetic permeability, and the first magnetic permeability, the second magnetic permeability, and the third All of the magnetic permeability are greater than the substrate permeability and the tip permeability. 如請求項8所述的可攜式電子裝置,其中,所述導電線圈包括多個連接於所述第一輻射層與所述第二輻射層之間的第一導電層、多個連接於所述第二輻射層與所述第三輻射層之間的第二導電層、多個連接於所述第二輻射層的一第一側端的第一導電連接層、多個連接於所述第二輻射層的一第二側端的第二導電連接層、至少一連接於所述第三輻射層的一第一側端的第三導電連接層、至少一連接於所述第三輻射層的一第二側端的第四導電連接層、至少一設置在所述第三輻射層上且電性連接於至少一所述第三導電連接層的第一導電延伸層、至少一設置在所述第三輻射層上且電性連接於至少一所述第四導電連接層的第二導電延伸層、至少一電性連接於至少一所述第一導電延伸層的第五導電連接層、至少一電性連接於至少一所述第二導電延伸層的第六導電連接層、至少一電性連接於至少一所述第五導電連接層且從所述頂端輻射層部分裸露而出的第一引出電極以及至少一電性連接於至少一所述第六導電連接層且從所述頂端輻射層部分裸露而出的第二引出電極,其中,每一個所述第一導電連接層電性連接於相對應的所述第一導電層與 相對應的所述第二導電層之間,每一個所述第二導電連接層電性連接於相對應的所述第一導電層與相對應的所述第二導電層之間,至少一第三導電連接層電性連接於相對應的所述第一導電連接層與至少一所述第一導電延伸層之間,至少一第四導電連接層電性連接於相對應的所述第二導電連接層與至少一所述第二導電延伸層之間,且所述電路基板電性連接於至少一第一引出電極以及至少一第二引出電極。 The portable electronic device of claim 8, wherein the conductive coil comprises a plurality of first conductive layers connected between the first radiation layer and the second radiation layer, and a plurality of connected a second conductive layer between the second radiation layer and the third radiation layer, a plurality of first conductive connection layers connected to a first side end of the second radiation layer, and a plurality of connected to the second a second conductive connection layer of a second side end of the radiation layer, at least one third conductive connection layer connected to a first side end of the third radiation layer, and at least one second connected to the third radiation layer a fourth conductive connection layer at the side end, at least one first conductive extension layer disposed on the third radiation layer and electrically connected to the at least one third conductive connection layer, at least one disposed on the third radiation layer a second conductive extension layer electrically connected to the at least one fourth conductive connection layer, and at least one fifth conductive connection layer electrically connected to the at least one first conductive extension layer, at least one electrically connected to a sixth conductive connection layer of at least one of the second conductive extension layers And at least one first extraction electrode electrically connected to the at least one fifth conductive connection layer and exposed from the top radiation layer portion and at least one electrically connected to the at least one sixth conductive connection layer a second extraction electrode in which the top radiation layer portion is exposed, wherein each of the first conductive connection layers is electrically connected to the corresponding first conductive layer and Between the corresponding second conductive layers, each of the second conductive connection layers is electrically connected between the corresponding first conductive layer and the corresponding second conductive layer, at least one The third conductive connection layer is electrically connected between the corresponding first conductive connection layer and the at least one first conductive extension layer, and the at least one fourth conductive connection layer is electrically connected to the corresponding second conductive layer The circuit board is electrically connected to the at least one first extraction electrode and the at least one second extraction electrode. 如請求項9所述的可攜式電子裝置,其中,每一個所述第一導電層具有一第一左側表面,每一個所述第二導電層具有一第二左側表面,每一個所述第一導電連接層具有一第一連接表面,至少一所述第三導電連接層具有一第三連接表面,至少一所述第一導電延伸層具有一第一延伸表面,且所述第一左側表面、所述第一連接表面、所述第二左側表面、所述第三連接表面以及所述第一延伸表面彼此切齊,其中,每一個所述第一導電層具有一與所述第一左側表面相反設置的第一右側表面,每一個所述第二導電層具有一與所述第二左側表面相反設置的第二右側表面,每一個所述第二導電連接層具有一第二連接表面,至少一所述第四導電連接層具有一第四連接表面,至少一所述第二導電延伸層具有一第二延伸表面,且所述第一右側表面、所述第二連接表面、所述第二右側表面、所述第四連接表面以及所述第二延伸表面彼此切齊,其中,至少一所述第一引出電極具有一第一電極表面,至少一第二引出電極具有一第二電極表面,且所述第一電極表面、所述第二電極表面以及所述頂端輻射層的上表面彼此切齊。 The portable electronic device of claim 9, wherein each of the first conductive layers has a first left side surface, and each of the second conductive layers has a second left side surface, each of the An electrically conductive connection layer has a first connection surface, at least one of the third electrically conductive connection layers has a third connection surface, at least one of the first electrically conductive extension layers has a first extension surface, and the first left side surface The first connecting surface, the second left surface, the third connecting surface, and the first extending surface are aligned with each other, wherein each of the first conductive layers has a first left side a first right side surface disposed opposite to each other, each of the second conductive layers having a second right side surface disposed opposite to the second left side surface, each of the second conductive connection layers having a second connection surface At least one of the fourth conductive connection layers has a fourth connection surface, at least one of the second conductive extension layers has a second extension surface, and the first right side surface, the second connection surface, the The second right side surface, the fourth connecting surface and the second extending surface are aligned with each other, wherein at least one of the first extraction electrodes has a first electrode surface, and at least one of the second extraction electrodes has a second electrode a surface, and the first electrode surface, the second electrode surface, and the top surface of the tip radiation layer are aligned with each other.
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