TW201726765A - Polymer, polymer precursor and methods for making the polymer and the polymer precursor - Google Patents
Polymer, polymer precursor and methods for making the polymer and the polymer precursor Download PDFInfo
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- 239000002243 precursor Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229920000642 polymer Polymers 0.000 title abstract 11
- 239000000126 substance Substances 0.000 claims abstract description 72
- 239000011347 resin Substances 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 52
- 150000001875 compounds Chemical class 0.000 claims description 30
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 239000013067 intermediate product Substances 0.000 claims description 15
- -1 dinitrodiphenyl ether Chemical compound 0.000 claims description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 230000002194 synthesizing effect Effects 0.000 claims description 11
- 229910052794 bromium Inorganic materials 0.000 claims description 10
- 125000005843 halogen group Chemical group 0.000 claims description 8
- 239000000376 reactant Substances 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- ZHDTXTDHBRADLM-UHFFFAOYSA-N hydron;2,3,4,5-tetrahydropyridin-6-amine;chloride Chemical compound Cl.NC1=NCCCC1 ZHDTXTDHBRADLM-UHFFFAOYSA-N 0.000 claims description 6
- 230000031709 bromination Effects 0.000 claims description 5
- 238000005893 bromination reaction Methods 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 150000001335 aliphatic alkanes Chemical group 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- ZXVONLUNISGICL-UHFFFAOYSA-N 4,6-dinitro-o-cresol Chemical group CC1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1O ZXVONLUNISGICL-UHFFFAOYSA-N 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 125000006615 aromatic heterocyclic group Chemical group 0.000 abstract description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
- 238000001465 metallisation Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000007142 ring opening reaction Methods 0.000 description 7
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
本發明涉及一種用於金屬化的樹脂化合物及其製備方法，一種用於金屬化的樹脂前驅體及其製備方法。The present invention relates to a resin compound for metallization and a process for the preparation thereof, a resin precursor for metallization and a process for the preparation thereof.
習知之聚醯亞胺表面金屬化製程，通常包括開環、觸媒、活化、化學鍍四個主要步驟，其中開環係藉由氫氧化鉀溶液對聚醯亞胺進行表面改質，使其官能基極性化(即介電層改質為帶負電荷)，從而使聚醯亞胺對帶正電的離子觸煤(Pd2+ /Cu2+ /Ni2+ )有親和力。然，由於聚醯亞胺材料不耐鹼性，開環製程對聚醯亞胺材料有一定的破壞(聚醯亞胺因鹼液之蝕刻伴隨有外層剝離之現象)，使聚醯亞胺與金屬層連接強度下降。The conventional metalimidation process of polyimine, which generally includes four main steps of ring opening, catalyst, activation, and electroless plating, wherein the ring opening is surface-modified by a potassium hydroxide solution to cause the polyimide to be surface-modified. The functional group is polarized (ie, the dielectric layer is modified to be negatively charged) such that the polyimine has an affinity for the positively charged ion-contacting coal (Pd 2+ /Cu 2+ /Ni 2+ ). However, since the polyimine material is not alkali-resistant, the ring-opening process has a certain damage to the polyimide material (the phenomenon that the polyimide is etched by the lye is accompanied by the peeling of the outer layer), so that the polyimide and the polyimide The metal layer connection strength is lowered.
鑒於此，有必要提供一種樹脂化合物及其製備方法，利用該樹脂化合物進行表面金屬化處理不需要進行開環處理。In view of the above, it is necessary to provide a resin compound and a method for producing the same, and the surface metallization treatment using the resin compound does not require ring-opening treatment.
另外，還有必要提供一種樹脂前驅體及其製備方法，利用該樹脂前驅體進行表面金屬化處理不需要進行開環處理。In addition, it is also necessary to provide a resin precursor and a method for preparing the same, and the surface metallization treatment using the resin precursor does not require a ring opening treatment.
一種樹脂化合物，具有通式如下：A resin compound having the general formula as follows:
其中n為1之整數倍，Ar為含氮芳香雜環分子基團，Ar’為具有如下通式之基團：Wherein n is an integer multiple of 1, Ar is a nitrogen-containing aromatic heterocyclic molecular group, and Ar' is a group having the following formula:
其中Y1、Y2、Y3、Y4為上述的Ar基團或H，且四者不同時為H。Wherein Y1, Y2, Y3, and Y4 are the above Ar groups or H, and the four are not H at the same time.
一種樹脂前驅體，其具有通式如下：A resin precursor having the general formula as follows:
其中n為1之整數倍，Ar為含氮芳香雜環分子基團，Ar’為具有如下通式之基團：Wherein n is an integer multiple of 1, Ar is a nitrogen-containing aromatic heterocyclic molecular group, and Ar' is a group having the following formula:
其中Y1、Y2、Y3、Y4為上述的Ar基團或H，且四者不同時為H。Wherein Y1, Y2, Y3, and Y4 are the above Ar groups or H, and the four are not H at the same time.
上述樹脂化合物的製備方法，其包括如下步驟：A method for preparing the above resin compound, comprising the steps of:
(1)將4,4二氨基二苯醚氧化得到4,4二硝基二苯醚；(1) oxidizing 4,4 diaminodiphenyl ether to obtain 4,4 dinitrodiphenyl ether;
(2)將4,4二硝基二苯醚溴化得到物質A，其中物質A具有通式：(2) Bromination of 4,4 dinitrodiphenyl ether to obtain substance A, wherein substance A has the formula:
其中X1~X4為Br或H，且四者不同時為H；Where X1~X4 are Br or H, and the four are not H at the same time;
(3)使用含氮芳香雜環分子物質合成物質M，其中物質M具有通式： Ar-B(OR)2 ，其中Ar為含氮芳香雜環分子基團，B為硼原子，R為烷基或H；(3) synthesizing substance M using a nitrogen-containing aromatic heterocyclic molecular substance, wherein substance M has the formula: Ar-B(OR) 2 , wherein Ar is a nitrogen-containing aromatic heterocyclic molecular group, B is a boron atom, and R is an alkane Base or H;
(4)物質A和M反應，獲得物質E，其中物質E具有通式：(4) The substances A and M react to obtain the substance E, wherein the substance E has the formula:
其中Y1、Y2、Y3、Y4為含氮芳香雜環分子基團或H，且四者不同時為H；Wherein Y1, Y2, Y3, Y4 are nitrogen-containing aromatic heterocyclic molecular groups or H, and four are not H at the same time;
(5)物質E和反應物反應生成樹脂前驅體；(5) Substance E and reactants Reactive to form a resin precursor;
(6)該樹脂前驅體脫去水分子形成所述樹脂化合物。(6) The resin precursor removes water molecules to form the resin compound.
上述樹脂前驅體的製備方法，其包括如下步驟：The method for preparing the above resin precursor comprises the following steps:
(1)將4,4二氨基二苯醚氧化得到4,4二硝基二苯醚；(1) oxidizing 4,4 diaminodiphenyl ether to obtain 4,4 dinitrodiphenyl ether;
(2)將4,4二硝基二苯醚溴化得到物質A，其中物質A具有通式：(2) Bromination of 4,4 dinitrodiphenyl ether to obtain substance A, wherein substance A has the formula:
其中X1~X4為Br或H，且四者不同時為H；Where X1~X4 are Br or H, and the four are not H at the same time;
(3)使用含氮芳香雜環分子物質合成物質M，其中物質M具有通式： Ar-B(OR)2 ，其中Ar為含氮芳香雜環分子基團，B為硼原子，R為烷基或H；(3) synthesizing substance M using a nitrogen-containing aromatic heterocyclic molecular substance, wherein substance M has the formula: Ar-B(OR) 2 , wherein Ar is a nitrogen-containing aromatic heterocyclic molecular group, B is a boron atom, and R is an alkane Base or H;
(4)物質A和M反應，獲得物質E，其中物質E具有通式：(4) The substances A and M react to obtain the substance E, wherein the substance E has the formula:
其中Y1、Y2、Y3、Y4為含氮芳香雜環分子基團或H，且四者不同時為H；Wherein Y1, Y2, Y3, Y4 are nitrogen-containing aromatic heterocyclic molecular groups or H, and four are not H at the same time;
(5)物質E和反應物反應生成樹脂前驅體。(5) Substance E and reactants The reaction produces a resin precursor.
使用該樹脂化合物或樹脂前驅體可省去常規金屬化製程中的開環步驟，且該樹脂化合物與金屬層牢固接合。The use of the resin compound or the resin precursor can eliminate the ring opening step in the conventional metallization process, and the resin compound is firmly bonded to the metal layer.
圖1是本發明一較佳實施方式的金屬化製程的示意圖。1 is a schematic view of a metallization process in accordance with a preferred embodiment of the present invention.
本發明實施方式之樹脂化合物可藉由本領域習知的各種方式（如印刷、塗佈等）形成於欲金屬化之基材表面。The resin compound of the embodiment of the present invention can be formed on the surface of the substrate to be metallized by various means known in the art (e.g., printing, coating, etc.).
該樹脂化合物具有通式如下：The resin compound has the general formula as follows:
其中n為1之整數倍，Ar為含氮芳香雜環分子基團（如2,2-联吡啶、苯并咪唑、1,10-菲罗啉），Ar’為具有如下通式之基團：Wherein n is an integer multiple of 1, Ar is a nitrogen-containing aromatic heterocyclic molecular group (such as 2,2-bipyridine, benzimidazole, 1,10-phenanthroline), and Ar' is a group having the following formula :
其中Y1、Y2、Y3、Y4可為上述的Ar基團或H，且不可四者同時為H。Wherein Y1, Y2, Y3, and Y4 may be the above Ar group or H, and not all of them may be H at the same time.
本發明還提供一種樹脂前驅體，其具有通式如下：The invention also provides a resin precursor having the general formula as follows:
其中n、Ar、及Ar’均滿足上面所述的條件。Wherein n, Ar, and Ar' satisfy the conditions described above.
該樹脂前驅體脫去水分子，即為前述之樹脂化合物。The resin precursor is dehydrated, that is, the aforementioned resin compound.
將本發明之樹脂化合物形成於欲金屬化之基材表面形成樹脂化合物膜後，再經習知的觸媒、活化、化學鍍、電鍍等步驟即可在該樹脂化合物膜表面形成金屬層。其中觸媒步驟為將含鈀離子（Pd2+ ）的活性前驅體形成於樹脂化合物膜表面，活化步驟為將鈀離子（Pd2+ ）還原成金屬鈀，化學鍍步驟為化學鍍鎳，電鍍步驟為電鍍銅。After the resin compound of the present invention is formed on the surface of the substrate to be metallized to form a resin compound film, a metal layer can be formed on the surface of the resin compound film by a conventional catalyst, activation, electroless plating, electroplating or the like. The catalyst step is to form an active precursor containing palladium ions (Pd 2+ ) on the surface of the resin compound film, the activation step is to reduce palladium ions (Pd 2+ ) to metal palladium, and the electroless plating step is electroless nickel plating, electroplating. The step is electroplating copper.
利用本發明之樹脂化合物進行金屬化製程的示意圖請參圖1所示。A schematic diagram of the metallization process using the resin compound of the present invention is shown in FIG.
本發明之樹脂化合物含有芳香雜環官能基，對於銅、鎳、钯等離子的晶種層，及銅、鎳、鈀金屬層有良好的親和力，金屬晶核材料易成膜於基材上。該樹脂化合物可運用於微細圖案化之軟性銅薄基板及軟性印刷電路板的製造。The resin compound of the present invention contains an aromatic heterocyclic functional group, and has a good affinity for a seed layer of copper, nickel, palladium or the like, and a copper, nickel, and palladium metal layer, and the metal crystal core material is easily formed on the substrate. The resin compound can be applied to the production of a finely patterned soft copper thin substrate and a flexible printed circuit board.
本發明之樹脂化合物透過雜環上的含氮官能基之陰電性，可與晶種層產生配位鍵。故，使用該樹脂化合物可省去常規金屬化製程中的開環步驟，且該樹脂化合物與金屬層牢固接合。The resin compound of the present invention can form a coordinate bond with the seed layer through the negative electrical conductivity of the nitrogen-containing functional group on the hetero ring. Therefore, the use of the resin compound can eliminate the ring opening step in the conventional metallization process, and the resin compound is firmly bonded to the metal layer.
另外，本發明之樹脂化合物具有吸濕低，較低的介電常數，對有機溶劑的溶解度提高等特性。Further, the resin compound of the present invention has characteristics such as low moisture absorption, low dielectric constant, and improved solubility in an organic solvent.
下面介紹本發明所述的樹脂化合物的較佳實施例的製備方法，其包括如下步驟。其中下述步驟中涉及到的n、Ar、及Ar’均滿足上述的條件。Next, a preparation method of a preferred embodiment of the resin compound of the present invention will be described, which comprises the following steps. Among them, n, Ar, and Ar' involved in the following steps satisfy the above conditions.
步驟（1）：將4,4二氨基二苯醚氧化得到4,4二硝基二苯醚，具體可藉由添加硝酸（HNO3 ）使4,4二氨基二苯醚氧化形成4,4二硝基二苯醚，反應式如下：Step (1): oxidizing 4,4 diaminodiphenyl ether to obtain 4,4 dinitrodiphenyl ether, specifically by adding nitric acid (HNO 3 ) to oxidize 4,4 diaminodiphenyl ether to form 4, 4 Dinitrodiphenyl ether, the reaction formula is as follows:
步驟（2）：4,4二硝基二苯醚之溴化(可藉由添加反應物HBr/Br2 )得到物質A，反應式如下：Step (2): bromination of 4,4 dinitrodiphenyl ether (by adding the reactant HBr/Br 2 ) to obtain the substance A, the reaction formula is as follows:
其中X1~X4可為溴(Br)或氫（H），且不可四者同時為氫（H）。Wherein X1~X4 may be bromine (Br) or hydrogen (H), and not all of them are hydrogen (H) at the same time.
其中步驟（2）中可藉由控制添加反應物HBr/Br2 的摩爾當量以控制X1~X4中含有1~4個Br。較佳的，物質A中的X1~X4四者均為Br，更佳的X1和X3均為Br，X2和X4均為H。In the step (2), the molar equivalent of the reactant HBr/Br 2 can be controlled to control the inclusion of 1 to 4 Br in X1 to X4. Preferably, all of X1 to X4 in substance A are Br, and more preferably X1 and X3 are Br, and both X2 and X4 are H.
步驟（3）：使用含氮芳香雜環分子物質合成物質M(簡寫成Ar-B(OR)2 ，Ar基團滿足上述的條件，B為硼原子，R為氫（H）或烷基)。Step (3): synthesizing substance M using a nitrogen-containing aromatic heterocyclic molecular substance (abbreviated as Ar-B(OR) 2 , the Ar group satisfies the above conditions, B is a boron atom, and R is hydrogen (H) or an alkyl group) .
本實施例中含氮芳香雜環分子物質使用2,2-联吡啶。可以理解的，該含氮芳香雜環分子物質不限於使用2,2-联吡啶，也可使用其他的物質。In the present embodiment, the nitrogen-containing aromatic heterocyclic molecular substance is 2,2-bipyridine. It is to be understood that the nitrogen-containing aromatic heterocyclic molecular substance is not limited to the use of 2,2-bipyridine, and other substances may be used.
以含氮芳香雜環分子物質為2,2-联吡啶為例，步驟（3）反應式如下：Taking the nitrogen-containing aromatic heterocyclic molecular substance as 2,2-bipyridine as an example, the reaction formula of the step (3) is as follows:
步驟（3）反應式如下：The reaction of step (3) is as follows:
如步驟（3）反應式所示，步驟（3）中包括兩個反應。步驟（3）之反應一為含氮芳香雜環分子物質（2,2-联吡啶）鹵化得到中間產物(簡寫為Ar-X，X可為I、Br、或Cl)，具體為2,2-联吡啶之苯環上的一個氫被鹵族原子（I、Br、或Cl）取代。步驟（3）之反應二為中間產物(Ar-X)中的X基團（即鹵族原子）被(OR)2 B-B(OR)2 中的-B(OR)2 基團取代生成物質M（簡寫為Ar-B(OR)2 ），其中Ar基團滿足上述的條件，B為硼原子，R為氫（H）或烷基。As shown in the reaction formula of the step (3), two reactions are included in the step (3). The reaction of the step (3) is halogenation of a nitrogen-containing aromatic heterocyclic molecular substance (2,2-bipyridine) to obtain an intermediate product (abbreviated as Ar-X, X may be I, Br, or Cl), specifically 2, 2 - One hydrogen on the benzene ring of the bipyridine is substituted with a halogen atom (I, Br, or Cl). The second reaction of the step (3) is that the X group (i.e., the halogen atom) in the intermediate product (Ar-X) is substituted with the -B(OR) 2 group in the (OR) 2 BB(OR) 2 to form the substance M. (abbreviated as Ar-B(OR) 2 ), wherein the Ar group satisfies the above conditions, B is a boron atom, and R is hydrogen (H) or an alkyl group.
步驟（4）:物質A和M反應，獲得物質E（簡寫為 ）。步驟（4）反應式如下：Step (4): Substance A and M react to obtain substance E (abbreviated as ). The reaction of step (4) is as follows:
如步驟（4）反應式所示，步驟（4）中包括兩個反應。步驟（4）之反應一為物質A和物質M反應得到中間產物(簡寫為)，具體為物質A的X1~X4基團中的溴（Br）基團被物質M中的含氮芳香雜環分子基團（Ar基團）取代。步驟（4）之反應二為中間產物還原成物質E（ ），具體為中間產物中的二硝基（NO2 )還原成二氨基（NH2 )。As shown in the reaction formula of the step (4), two reactions are included in the step (4). The reaction of the step (4) is the reaction of the substance A and the substance M to obtain an intermediate product (abbreviated as Specifically, the bromine (Br) group in the X1 to X4 group of the substance A is substituted with the nitrogen-containing aromatic heterocyclic molecular group (Ar group) in the substance M. The second reaction of the step (4) is the reduction of the intermediate product to the substance E ( Specifically, the dinitro (NO 2 ) in the intermediate product is reduced to a diamino group (NH 2 ).
其中步驟（4）之反應一中物質A和M的摩爾比優選為1:2。The molar ratio of the substances A and M in the reaction one of the step (4) is preferably 1:2.
步驟（5）：物質E和反應物聚合反應生成樹脂前驅體。反應式如下：Step (5): Substance E and reactants The polymerization produces a resin precursor. The reaction formula is as follows:
其中所述步驟（5）中反應物的可為如下所示的物質，但不限於此。Wherein the reactants in the step (5) It may be a substance as shown below, but is not limited thereto.
步驟（6）：樹脂前驅體脫去水分子形成所述樹脂化合物。該步驟可採用熱處理或化學領域習知各種方式使樹脂前驅體脫去水分子。反應式如下：Step (6): The resin precursor removes water molecules to form the resin compound. This step can be used to remove the water molecules from the resin precursor in a variety of ways known in the art of heat treatment or chemistry. The reaction formula is as follows:
無no
無no
Claims (10)
其中n為1之整數倍，Ar為含氮芳香雜環分子基團，Ar’為具有如下通式之基團：
其中Y1、Y2、Y3、Y4為上述的Ar基團或H，且四者不同時為H。A resin compound having the general formula as follows:
Wherein n is an integer multiple of 1, Ar is a nitrogen-containing aromatic heterocyclic molecular group, and Ar' is a group having the following formula:
Wherein Y1, Y2, Y3, and Y4 are the above Ar groups or H, and the four are not H at the same time.
其中n為1之整數倍，Ar為含氮芳香雜環分子基團，Ar’為具有如下通式之基團：
其中Y1、Y2、Y3、Y4為上述的Ar基團或H，且四者不同時為H。A resin precursor having the general formula as follows:
Wherein n is an integer multiple of 1, Ar is a nitrogen-containing aromatic heterocyclic molecular group, and Ar' is a group having the following formula:
Wherein Y1, Y2, Y3, and Y4 are the above Ar groups or H, and the four are not H at the same time.
(1)將4,4二氨基二苯醚氧化得到4,4二硝基二苯醚；
(2)將4,4二硝基二苯醚溴化得到物質A，其中物質A具有通式：
其中X1~X4為Br或H，且四者不同時為H；
(3)使用含氮芳香雜環分子物質合成物質M，其中物質M具有通式： Ar-B(OR)2 ，其中Ar為含氮芳香雜環分子基團，B為硼原子，R為烷基或H；
(4)物質A和M反應，獲得物質E，其中物質E具有通式：
其中Y1、Y2、Y3、Y4為含氮芳香雜環分子基團或H，且四者不同時為H；
(5)物質E和反應物（其中Ar為含氮芳香雜環分子基團）反應生成樹脂前驅體。A method for preparing a resin precursor according to claim 2, which comprises the steps of:
(1) oxidizing 4,4 diaminodiphenyl ether to obtain 4,4 dinitrodiphenyl ether;
(2) Bromination of 4,4 dinitrodiphenyl ether to obtain substance A, wherein substance A has the formula:
Where X1~X4 are Br or H, and the four are not H at the same time;
(3) synthesizing substance M using a nitrogen-containing aromatic heterocyclic molecular substance, wherein substance M has the formula: Ar-B(OR) 2 , wherein Ar is a nitrogen-containing aromatic heterocyclic molecular group, B is a boron atom, and R is an alkane Base or H;
(4) The substances A and M react to obtain the substance E, wherein the substance E has the formula:
Wherein Y1, Y2, Y3, Y4 are nitrogen-containing aromatic heterocyclic molecular groups or H, and four are not H at the same time;
(5) Substance E and reactants (wherein Ar is a nitrogen-containing aromatic heterocyclic molecular group) reacts to form a resin precursor.
將含氮芳香雜環分子物質之苯環上的一個氫被鹵族原子取代得到中間產物，該鹵族原子為I、Br、或Cl；
將該中間產物與(OR)2 B-B(OR)2 反應使中間產物的鹵族原子基團被(OR)2 B-B(OR)2 中的B(OR)2 基團取代。The method for preparing a resin precursor according to claim 3, wherein the step of synthesizing the substance M comprises:
Passing a hydrogen on a benzene ring of a nitrogen-containing aromatic heterocyclic molecular substance by a halogen atom to obtain an intermediate product, the halogen atom being I, Br, or Cl;
This intermediate product is reacted with (OR) 2 BB(OR) 2 to replace the halogen atom group of the intermediate product with the B(OR) 2 group in (OR) 2 BB(OR) 2 .
物質A和物質M反應得到中間產物；
將該中間產物中的二硝基還原成二氨基。The method for preparing a resin precursor according to claim 3, wherein the step of synthesizing the substance E comprises:
Reaction of substance A and substance M to obtain an intermediate product ;
The dinitro group in the intermediate product is reduced to a diamino group.
(1)將4,4二氨基二苯醚氧化得到4,4二硝基二苯醚；
(2)將4,4二硝基二苯醚溴化得到物質A，其中物質A具有通式：
其中X1~X4為Br或H，且四者不同時為H；
(3)使用含氮芳香雜環分子物質合成物質M，其中物質M具有通式： Ar-B(OR)2 ，其中Ar為含氮芳香雜環分子基團，B為硼原子，R為烷基或H；
(4)物質A和M反應，獲得物質E，其中物質E具有通式：
其中Y1、Y2、Y3、Y4為含氮芳香雜環分子基團或H，且四者不同時為H；
(5)物質E和反應物（其中Ar為含氮芳香雜環分子基團）反應生成樹脂前驅體；
(6)該樹脂前驅體脫去水分子形成所述樹脂化合物。A method for preparing a resin compound according to claim 1, which comprises the steps of:
(1) oxidizing 4,4 diaminodiphenyl ether to obtain 4,4 dinitrodiphenyl ether;
(2) Bromination of 4,4 dinitrodiphenyl ether to obtain substance A, wherein substance A has the formula:
Where X1~X4 are Br or H, and the four are not H at the same time;
(3) synthesizing substance M using a nitrogen-containing aromatic heterocyclic molecular substance, wherein substance M has the formula: Ar-B(OR) 2 , wherein Ar is a nitrogen-containing aromatic heterocyclic molecular group, B is a boron atom, and R is an alkane Base or H;
(4) The substances A and M react to obtain the substance E, wherein the substance E has the formula:
Wherein Y1, Y2, Y3, Y4 are nitrogen-containing aromatic heterocyclic molecular groups or H, and four are not H at the same time;
(5) Substance E and reactants (wherein Ar is a nitrogen-containing aromatic heterocyclic molecular group) reacts to form a resin precursor;
(6) The resin precursor removes water molecules to form the resin compound.
將含氮芳香雜環分子物質之苯環上的一個氫被鹵族原子取代得到中間產物，該鹵族原子為I、Br、或Cl；
將該中間產物與(OR)2 B-B(OR)2 反應使中間產物的鹵族原子基團被(OR)2 B-B(OR)2 中的B(OR)2 基團取代。The method for preparing a resin compound according to claim 7, wherein the step of synthesizing the substance M comprises:
Passing a hydrogen on a benzene ring of a nitrogen-containing aromatic heterocyclic molecular substance by a halogen atom to obtain an intermediate product, the halogen atom being I, Br, or Cl;
This intermediate product is reacted with (OR) 2 BB(OR) 2 to replace the halogen atom group of the intermediate product with the B(OR) 2 group in (OR) 2 BB(OR) 2 .
物質A和物質M反應得到中間產物；
將該中間產物中的二硝基還原成二氨基。The method for preparing a resin compound according to claim 7, wherein the step of synthesizing the substance E comprises:
Reaction of substance A and substance M to obtain an intermediate product;
The dinitro group in the intermediate product is reduced to a diamino group.
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