TW201704011A - Mold release film - Google Patents
Mold release film Download PDFInfo
- Publication number
- TW201704011A TW201704011A TW105107039A TW105107039A TW201704011A TW 201704011 A TW201704011 A TW 201704011A TW 105107039 A TW105107039 A TW 105107039A TW 105107039 A TW105107039 A TW 105107039A TW 201704011 A TW201704011 A TW 201704011A
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- TW
- Taiwan
- Prior art keywords
- film
- release film
- release
- group
- layer
- Prior art date
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- 239000011248 coating agent Substances 0.000 claims abstract description 102
- 238000000576 coating method Methods 0.000 claims abstract description 88
- 239000010410 layer Substances 0.000 claims abstract description 86
- 239000012790 adhesive layer Substances 0.000 claims abstract description 73
- 239000000853 adhesive Substances 0.000 claims abstract description 68
- 230000001070 adhesive effect Effects 0.000 claims abstract description 67
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229920006267 polyester film Polymers 0.000 claims abstract description 55
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 30
- 239000003054 catalyst Substances 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 125000000524 functional group Chemical group 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims description 85
- 239000011347 resin Substances 0.000 claims description 85
- 239000011247 coating layer Substances 0.000 claims description 65
- 229920000728 polyester Polymers 0.000 claims description 53
- 150000001875 compounds Chemical class 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 35
- 229920000642 polymer Polymers 0.000 claims description 30
- 229920002675 Polyoxyl Polymers 0.000 claims description 28
- 125000000217 alkyl group Chemical group 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 21
- 229920002098 polyfluorene Polymers 0.000 claims description 20
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 17
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- 125000006038 hexenyl group Chemical group 0.000 claims description 12
- 150000002894 organic compounds Chemical class 0.000 claims description 11
- 239000011230 binding agent Substances 0.000 claims description 8
- 125000003342 alkenyl group Chemical group 0.000 claims description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 2
- 150000002926 oxygen Chemical class 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 41
- 239000000470 constituent Substances 0.000 abstract description 13
- 238000001556 precipitation Methods 0.000 abstract description 10
- 238000013508 migration Methods 0.000 abstract description 8
- 230000005012 migration Effects 0.000 abstract description 8
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 5
- 229920001296 polysiloxane Polymers 0.000 abstract description 2
- 229920002050 silicone resin Polymers 0.000 abstract 2
- -1 etc. Chemical compound 0.000 description 85
- 238000000034 method Methods 0.000 description 84
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 74
- 239000000178 monomer Substances 0.000 description 50
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 42
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 41
- 239000002245 particle Substances 0.000 description 39
- 239000003795 chemical substances by application Substances 0.000 description 35
- 239000000203 mixture Substances 0.000 description 31
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 29
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 27
- 239000003999 initiator Substances 0.000 description 24
- 230000004048 modification Effects 0.000 description 22
- 238000012986 modification Methods 0.000 description 22
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 239000002253 acid Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 20
- 238000007792 addition Methods 0.000 description 19
- 125000002947 alkylene group Chemical group 0.000 description 19
- 239000003431 cross linking reagent Substances 0.000 description 18
- 238000001035 drying Methods 0.000 description 17
- 229920001577 copolymer Polymers 0.000 description 16
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 15
- 238000011156 evaluation Methods 0.000 description 14
- 235000011187 glycerol Nutrition 0.000 description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 13
- 229920000223 polyglycerol Polymers 0.000 description 13
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 12
- 238000002156 mixing Methods 0.000 description 12
- 239000004721 Polyphenylene oxide Substances 0.000 description 11
- 229920000058 polyacrylate Polymers 0.000 description 11
- 229920000570 polyether Polymers 0.000 description 11
- 239000002994 raw material Substances 0.000 description 11
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 10
- 239000002390 adhesive tape Substances 0.000 description 10
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 10
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 10
- 150000003077 polyols Chemical class 0.000 description 10
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 10
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 10
- GPBBNPPLBQIADY-UHFFFAOYSA-N 4,4-dimethyloxane Chemical compound CC1(C)CCOCC1 GPBBNPPLBQIADY-UHFFFAOYSA-N 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 9
- 238000001816 cooling Methods 0.000 description 9
- 150000002009 diols Chemical class 0.000 description 9
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000007756 gravure coating Methods 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 230000007704 transition Effects 0.000 description 8
- 229920002554 vinyl polymer Polymers 0.000 description 8
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000012046 mixed solvent Substances 0.000 description 7
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 7
- 230000003405 preventing effect Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000012071 phase Substances 0.000 description 6
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 6
- 229920005906 polyester polyol Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000004970 Chain extender Substances 0.000 description 5
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 5
- 239000003522 acrylic cement Substances 0.000 description 5
- 239000001361 adipic acid Substances 0.000 description 5
- 235000011037 adipic acid Nutrition 0.000 description 5
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 229910000420 cerium oxide Inorganic materials 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- 239000011976 maleic acid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 239000011146 organic particle Substances 0.000 description 5
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 229920001225 polyester resin Polymers 0.000 description 5
- 239000004645 polyester resin Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 230000000379 polymerizing effect Effects 0.000 description 5
- 229920005749 polyurethane resin Polymers 0.000 description 5
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- DMZVAHRTAMMFJA-UHFFFAOYSA-N CC(CCCCCCCCC)C=CCCCC Chemical group CC(CCCCCCCCC)C=CCCCC DMZVAHRTAMMFJA-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- 229920005601 base polymer Polymers 0.000 description 4
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 4
- 239000001530 fumaric acid Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 238000006068 polycondensation reaction Methods 0.000 description 4
- 229920000123 polythiophene Polymers 0.000 description 4
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 150000003304 ruthenium compounds Chemical class 0.000 description 4
- 125000000542 sulfonic acid group Chemical group 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
- VOQDCMULDZDDLP-UHFFFAOYSA-N 2-methoxy-2,3-dimethyloxane Chemical group CC1C(OCCC1)(C)OC VOQDCMULDZDDLP-UHFFFAOYSA-N 0.000 description 3
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VPLKXGORNUYFBO-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C1(CC2C(CC1)O2)CCC(C(OC)(OC)OC)CCCCCCCC VPLKXGORNUYFBO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- UGAPHEBNTGUMBB-UHFFFAOYSA-N acetic acid;ethyl acetate Chemical compound CC(O)=O.CCOC(C)=O UGAPHEBNTGUMBB-UHFFFAOYSA-N 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 235000012211 aluminium silicate Nutrition 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 150000007942 carboxylates Chemical group 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 3
- 238000004811 liquid chromatography Methods 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229940059574 pentaerithrityl Drugs 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 3
- 229920000447 polyanionic polymer Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 230000002194 synthesizing effect Effects 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- 229930192474 thiophene Natural products 0.000 description 3
- 150000003577 thiophenes Chemical class 0.000 description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 238000005809 transesterification reaction Methods 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- OHBQPCCCRFSCAX-UHFFFAOYSA-N 1,4-Dimethoxybenzene Chemical group COC1=CC=C(OC)C=C1 OHBQPCCCRFSCAX-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 2
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- IAXFZZHBFXRZMT-UHFFFAOYSA-N 2-[3-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=CC(OCCO)=C1 IAXFZZHBFXRZMT-UHFFFAOYSA-N 0.000 description 2
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 2
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 2
- MQSZOZMNAJHVML-UHFFFAOYSA-N 3-phenylbut-1-yn-1-ol Chemical class OC#CC(C)C1=CC=CC=C1 MQSZOZMNAJHVML-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 2
- JZHKIUBMQMDQRG-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)OC)CCCCCCCC JZHKIUBMQMDQRG-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- 229920001634 Copolyester Polymers 0.000 description 2
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 2
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000001506 calcium phosphate Substances 0.000 description 2
- 229910000389 calcium phosphate Inorganic materials 0.000 description 2
- 235000011010 calcium phosphates Nutrition 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- BXJGUBZTZWCMEX-UHFFFAOYSA-N dimethylhydroquinone Natural products CC1=C(C)C(O)=CC=C1O BXJGUBZTZWCMEX-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000001227 electron beam curing Methods 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 150000002291 germanium compounds Chemical class 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- OLLMEZGFCPWTGD-UHFFFAOYSA-N hexane;methanol Chemical compound OC.OC.CCCCCC OLLMEZGFCPWTGD-UHFFFAOYSA-N 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 239000013500 performance material Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 150000007519 polyprotic acids Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- 239000002683 reaction inhibitor Substances 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical group O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000003017 thermal stabilizer Substances 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- FXCSCTVYEKPPDO-UHFFFAOYSA-N (2-ethenylphenyl)-phenylmethanone Chemical compound C=CC1=CC=CC=C1C(=O)C1=CC=CC=C1 FXCSCTVYEKPPDO-UHFFFAOYSA-N 0.000 description 1
- GHKBRNPRJNJGIM-SNAWJCMRSA-N (e)-4-butoxy-4-oxobut-2-eneperoxoic acid Chemical compound CCCCOC(=O)\C=C\C(=O)OO GHKBRNPRJNJGIM-SNAWJCMRSA-N 0.000 description 1
- WHIVNJATOVLWBW-PLNGDYQASA-N (nz)-n-butan-2-ylidenehydroxylamine Chemical compound CC\C(C)=N/O WHIVNJATOVLWBW-PLNGDYQASA-N 0.000 description 1
- DQGPWNBGAYGUPK-UHFFFAOYSA-N 1,1,1-trifluoro-4-(trimethoxymethyl)dodecane Chemical compound FC(CCC(C(OC)(OC)OC)CCCCCCCC)(F)F DQGPWNBGAYGUPK-UHFFFAOYSA-N 0.000 description 1
- BMJSLYDHFJCVBR-UHFFFAOYSA-N 1,1,2-trichloro-1,2-diisocyanatoethane Chemical compound O=C=NC(Cl)C(Cl)(Cl)N=C=O BMJSLYDHFJCVBR-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- GDDPLWAEEWIQKZ-UHFFFAOYSA-N 1,1-diethoxydecane Chemical compound CCCCCCCCCC(OCC)OCC GDDPLWAEEWIQKZ-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- QOKSGFNBBSSNAL-UHFFFAOYSA-N 1,2-diisocyanato-3,4-dimethylbenzene Chemical compound CC1=CC=C(N=C=O)C(N=C=O)=C1C QOKSGFNBBSSNAL-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- CTOHEPRICOKHIV-UHFFFAOYSA-N 1-dodecylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCCCCC CTOHEPRICOKHIV-UHFFFAOYSA-N 0.000 description 1
- OZFIGURLAJSLIR-UHFFFAOYSA-N 1-ethenyl-2h-pyridine Chemical compound C=CN1CC=CC=C1 OZFIGURLAJSLIR-UHFFFAOYSA-N 0.000 description 1
- LNKDTZRRFHHCCV-UHFFFAOYSA-N 1-ethenyl-2h-pyrimidine Chemical compound C=CN1CN=CC=C1 LNKDTZRRFHHCCV-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- CTXUTPWZJZHRJC-UHFFFAOYSA-N 1-ethenylpyrrole Chemical compound C=CN1C=CC=C1 CTXUTPWZJZHRJC-UHFFFAOYSA-N 0.000 description 1
- QIVRKSLMUAURGI-UHFFFAOYSA-N 1-isocyanato-1-[2-(1-isocyanatocyclohexyl)propan-2-yl]cyclohexane Chemical compound C1CCCCC1(N=C=O)C(C)(C)C1(N=C=O)CCCCC1 QIVRKSLMUAURGI-UHFFFAOYSA-N 0.000 description 1
- IVMHNKJWTRJTRU-UHFFFAOYSA-N 1-isocyanato-2-methoxyethane Chemical compound COCCN=C=O IVMHNKJWTRJTRU-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- HGRVTNYKVLTPAB-UHFFFAOYSA-N 2,2-dimethyl-1,4-dioxane Chemical compound CC1(C)COCCO1 HGRVTNYKVLTPAB-UHFFFAOYSA-N 0.000 description 1
- DDHUNHGZUHZNKB-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diamine Chemical compound NCC(C)(C)CN DDHUNHGZUHZNKB-UHFFFAOYSA-N 0.000 description 1
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- ZWNMRZQYWRLGMM-UHFFFAOYSA-N 2,5-dimethylhexane-2,5-diol Chemical compound CC(C)(O)CCC(C)(C)O ZWNMRZQYWRLGMM-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- GAMXOFKSAQTGLL-UHFFFAOYSA-N 2-[(1-amino-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidamide;sulfo hydrogen sulfate Chemical compound OS(=O)(=O)OS(O)(=O)=O.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N GAMXOFKSAQTGLL-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- TUQYFIFPADMJFJ-UHFFFAOYSA-N 2-butyl-2-hexylpropane-1,3-diol Chemical compound CCCCCCC(CO)(CO)CCCC TUQYFIFPADMJFJ-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- HVOAFLJLVONUSZ-UHFFFAOYSA-N 2-ethylperoxythiophene Chemical compound CCOOC1=CC=CS1 HVOAFLJLVONUSZ-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- JVZZUPJFERSVRN-UHFFFAOYSA-N 2-methyl-2-propylpropane-1,3-diol Chemical compound CCCC(C)(CO)CO JVZZUPJFERSVRN-UHFFFAOYSA-N 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- HDQMSISCGQUWEU-UHFFFAOYSA-N 2-methylpropane propane Chemical compound CCC.CCC.CC(C)C HDQMSISCGQUWEU-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- SDOFNQUTVKJYKH-UHFFFAOYSA-N 3-butoxycarbonylbut-3-eneperoxoic acid Chemical compound C(C(=C)CC(=O)OO)(=O)OCCCC SDOFNQUTVKJYKH-UHFFFAOYSA-N 0.000 description 1
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 1
- NIAXWFTYAJQENP-UHFFFAOYSA-N 3-ethenyl-2h-1,3-oxazole Chemical compound C=CN1COC=C1 NIAXWFTYAJQENP-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- SSMDYRHBKZVGNR-UHFFFAOYSA-N 3-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)C1=CC(=O)NC1=O SSMDYRHBKZVGNR-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- QLIQIXIBZLTPGQ-UHFFFAOYSA-N 4-(2-hydroxyethoxy)benzoic acid Chemical compound OCCOC1=CC=C(C(O)=O)C=C1 QLIQIXIBZLTPGQ-UHFFFAOYSA-N 0.000 description 1
- SXPGQGNWEWPWQZ-UHFFFAOYSA-N 4-(triethoxymethyl)dodecan-1-amine Chemical compound NCCCC(C(OCC)(OCC)OCC)CCCCCCCC SXPGQGNWEWPWQZ-UHFFFAOYSA-N 0.000 description 1
- DFYGYTNMHPUJBY-UHFFFAOYSA-N 4-(trimethoxymethyl)dodecane-1-thiol Chemical compound SCCCC(C(OC)(OC)OC)CCCCCCCC DFYGYTNMHPUJBY-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- ZFSPZXXKYPTSTJ-UHFFFAOYSA-N 5-methyl-2-propan-2-yl-4,5-dihydro-1h-imidazole Chemical compound CC(C)C1=NCC(C)N1 ZFSPZXXKYPTSTJ-UHFFFAOYSA-N 0.000 description 1
- GLBHAWAMATUOBB-UHFFFAOYSA-N 6,6-dimethylheptane-1,1-diamine Chemical compound CC(C)(C)CCCCC(N)N GLBHAWAMATUOBB-UHFFFAOYSA-N 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- NXPBROUAWSUHTF-UHFFFAOYSA-N C(=CCCCC)C(CCCC(OC)(OC)OC)CCCCC Chemical compound C(=CCCCC)C(CCCC(OC)(OC)OC)CCCCC NXPBROUAWSUHTF-UHFFFAOYSA-N 0.000 description 1
- CYLYONSVMHVVJA-UHFFFAOYSA-N C(=O)(C(=C)C)C1=C(C=2CC3=CC=CC=C3C2C=C1)C1=CC=CC=2C3=CC=CC=C3CC12 Chemical compound C(=O)(C(=C)C)C1=C(C=2CC3=CC=CC=C3C2C=C1)C1=CC=CC=2C3=CC=CC=C3CC12 CYLYONSVMHVVJA-UHFFFAOYSA-N 0.000 description 1
- ZIPRMPRBQSJVJY-UHFFFAOYSA-N C(C(=O)C)(=O)O.C(C)(=N)N Chemical compound C(C(=O)C)(=O)O.C(C)(=N)N ZIPRMPRBQSJVJY-UHFFFAOYSA-N 0.000 description 1
- SMIGUTJGJVSFQH-UHFFFAOYSA-N C(C1CO1)OC(CC(OC)(OC)OC)CCCCCCC Chemical compound C(C1CO1)OC(CC(OC)(OC)OC)CCCCCCC SMIGUTJGJVSFQH-UHFFFAOYSA-N 0.000 description 1
- INIIKCHXCLPMER-UHFFFAOYSA-N C(C1CO1)OC(CC(OCC)(OCC)OCC)CCCCCCC Chemical compound C(C1CO1)OC(CC(OCC)(OCC)OCC)CCCCCCC INIIKCHXCLPMER-UHFFFAOYSA-N 0.000 description 1
- ASBJAXCRVCEEAO-UHFFFAOYSA-N C1(=CC=CC=C1)N1C(C(C2=CC=CC=C12)C(=O)O)C(=O)O Chemical compound C1(=CC=CC=C1)N1C(C(C2=CC=CC=C12)C(=O)O)C(=O)O ASBJAXCRVCEEAO-UHFFFAOYSA-N 0.000 description 1
- YQNKTSGZUHGTQK-UHFFFAOYSA-N CC1(OC1)C=CCCCC Chemical compound CC1(OC1)C=CCCCC YQNKTSGZUHGTQK-UHFFFAOYSA-N 0.000 description 1
- YNZWBRRDIHXALL-UHFFFAOYSA-N CCCCCCCC(CC(OC(=C)C)OC(=C)C)COCC1CO1 Chemical compound CCCCCCCC(CC(OC(=C)C)OC(=C)C)COCC1CO1 YNZWBRRDIHXALL-UHFFFAOYSA-N 0.000 description 1
- GGXWDWNWNOINTP-UHFFFAOYSA-N CCCCOCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound CCCCOCCCC(C(OC)(OC)OC)CCCCCCCC GGXWDWNWNOINTP-UHFFFAOYSA-N 0.000 description 1
- YAQWKIOMMVWPSP-UHFFFAOYSA-N CCCC[Sn](CCCC)(OCCCCCCCCCC(OCC)(OCC)OCC)OCCCCCCCCCC(OCC)(OCC)OCC Chemical compound CCCC[Sn](CCCC)(OCCCCCCCCCC(OCC)(OCC)OCC)OCCCCCCCCCC(OCC)(OCC)OCC YAQWKIOMMVWPSP-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 150000000703 Cerium Chemical class 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 241000519079 Hara hara Species 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- BWPYBAJTDILQPY-UHFFFAOYSA-N Methoxyphenone Chemical compound C1=C(C)C(OC)=CC=C1C(=O)C1=CC=CC(C)=C1 BWPYBAJTDILQPY-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- NGPHCCBDMPHGMX-UHFFFAOYSA-N N1C(=CC2=CC=CC=C12)N.C=CC Chemical compound N1C(=CC2=CC=CC=C12)N.C=CC NGPHCCBDMPHGMX-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- HDONYZHVZVCMLR-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1 Chemical compound N=C=O.N=C=O.CC1CCCCC1 HDONYZHVZVCMLR-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- FNYLWPVRPXGIIP-UHFFFAOYSA-N Triamterene Chemical compound NC1=NC2=NC(N)=NC(N)=C2N=C1C1=CC=CC=C1 FNYLWPVRPXGIIP-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- CQQXCSFSYHAZOO-UHFFFAOYSA-L [acetyloxy(dioctyl)stannyl] acetate Chemical compound CCCCCCCC[Sn](OC(C)=O)(OC(C)=O)CCCCCCCC CQQXCSFSYHAZOO-UHFFFAOYSA-L 0.000 description 1
- VXPYSZQGFPMWQU-UHFFFAOYSA-L [acetyloxy(diphenyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.C=1C=CC=CC=1[Sn+2]C1=CC=CC=C1 VXPYSZQGFPMWQU-UHFFFAOYSA-L 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 description 1
- AWFFJJAOMMAGFE-BGSQTJHASA-L [dibutyl-[(z)-octadec-9-enoyl]oxystannyl] (z)-octadec-9-enoate Chemical compound CCCC[Sn+2]CCCC.CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O AWFFJJAOMMAGFE-BGSQTJHASA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000001449 anionic compounds Chemical class 0.000 description 1
- 150000001450 anions Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000007869 azo polymerization initiator Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- GCBSCAKBRSMFCP-UHFFFAOYSA-N benzene;methanol Chemical compound OC.OC.C1=CC=CC=C1 GCBSCAKBRSMFCP-UHFFFAOYSA-N 0.000 description 1
- VSMKVYMEPNUODT-UHFFFAOYSA-N benzenecarboximidamide;benzoic acid Chemical compound NC(=[NH2+])C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 VSMKVYMEPNUODT-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- CURBACXRQKTCKZ-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O CURBACXRQKTCKZ-UHFFFAOYSA-N 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- DHDZMONMPFKUJO-UHFFFAOYSA-N decane-1,9-diamine Chemical compound CC(N)CCCCCCCCN DHDZMONMPFKUJO-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- KEIQPMUPONZJJH-UHFFFAOYSA-N dicyclohexylmethanediamine Chemical compound C1CCCCC1C(N)(N)C1CCCCC1 KEIQPMUPONZJJH-UHFFFAOYSA-N 0.000 description 1
- QLCGFUKTPZHCND-UHFFFAOYSA-N diethoxy(dioctyl)stannane Chemical compound CCCCCCCC[Sn](OCC)(OCC)CCCCCCCC QLCGFUKTPZHCND-UHFFFAOYSA-N 0.000 description 1
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- JMGZBMRVDHKMKB-UHFFFAOYSA-L disodium;2-sulfobutanedioate Chemical compound [Na+].[Na+].OS(=O)(=O)C(C([O-])=O)CC([O-])=O JMGZBMRVDHKMKB-UHFFFAOYSA-L 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 125000005670 ethenylalkyl group Chemical group 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000717 hydrazino group Chemical group [H]N([*])N([H])[H] 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- DLMVDBDHOIWEJZ-UHFFFAOYSA-N isocyanatooxyimino(oxo)methane Chemical compound O=C=NON=C=O DLMVDBDHOIWEJZ-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- CNHDIAIOKMXOLK-UHFFFAOYSA-N monomethylhydroquinone Natural products CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- ROHAJWIUPFLJJM-UHFFFAOYSA-N n-butoxymethanamine Chemical compound CCCCONC ROHAJWIUPFLJJM-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000006384 oligomerization reaction Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001444 polymaleic acid Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 239000011527 polyurethane coating Substances 0.000 description 1
- 229920003009 polyurethane dispersion Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000007717 redox polymerization reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 150000004685 tetrahydrates Chemical class 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
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Abstract
Description
本發明乃是關於一種離型薄膜,特別是適用於各種黏著劑保護用並要求輕剝離之用途,且寡聚物析出量極少,例如,適合靜電容量方式之觸控面板製造用等,透過黏著劑層而貼合之各種用途、液晶顯示器(以下簡稱LCD)中所用的偏光板、相位差板等之LCD構成構件製造用、電漿顯示器面板(以下簡稱PDP)構成構件製造用、有機電致發光(以下簡稱有機EL)構成構件製造用等、各種顯示器構成構件製造用之外,各種黏著劑層保護用途之離型薄膜。 The present invention relates to a release film, and is particularly suitable for use in various adhesive protection applications and requires light peeling, and the amount of oligomer precipitation is extremely small, for example, for the manufacture of a touch panel suitable for an electrostatic capacity type, etc. Various applications of the coating layer, and the use of a liquid crystal panel (hereinafter referred to as LCD), such as a polarizing plate or a phase difference plate, for the manufacture of an LCD component, and a plasma display panel (hereinafter referred to as PDP) for the manufacture of components, organic electro Light-emitting (hereinafter referred to as "organic EL") is a release film which is used for the manufacture of members and various types of display constituent members, and is used for various adhesive layer protection purposes.
以往,以聚酯薄膜作為基材之離型薄膜係可使用於靜電容量方式之觸控面板製造用等、透過黏著劑層而貼合之各種用途、LCD用偏光板、相位差板製造用、PDP構成構件製造用、有機EL構成構件製造用等、各種顯示器構成構件製造用等、各種光學用途等。近年來,伴隨著各種顯示器構成構件,特別是LCD用偏光板之薄型化,離型薄膜與薄型偏光板之剝離力高,且無法順利剝離 的不良狀況會成為問題。若無法順利地自薄型偏光板將離型薄膜剝離的話,良率會降低而成為問題。又,黏著劑層塗佈後,以寡聚物析出所為之LCD用偏光板之檢査性降低、黏著劑層之視覺辨識性的降低會成為問題。又,因離型薄膜的帶電導致的異物捲入,使異物轉印向黏著劑層而成為問題。 In the past, a release film made of a polyester film as a base material can be used for various applications such as a touch panel manufacturing for electrostatic capacitance type, which is bonded through an adhesive layer, a polarizing plate for LCD, and a phase difference plate. The PDP is used for the production of a member, the production of an organic EL constituent member, the use of various display constituent members, various optical applications, and the like. In recent years, with the various display constituent members, particularly the polarizing plate for LCD, the peeling force of the release film and the thin polarizing plate is high, and the peeling force cannot be smoothly peeled off. Bad conditions can become a problem. If the release film is not peeled off smoothly from the thin polarizing plate, the yield is lowered and it becomes a problem. Further, after the application of the adhesive layer, the inspection property of the polarizing plate for LCD which is precipitated by the oligomer is lowered, and the deterioration of the visibility of the adhesive layer is a problem. Moreover, the foreign matter is caught by the charging of the release film, and the foreign matter is transferred to the adhesive layer, which is a problem.
近年來,伴隨著IT(Information Technology)領域的躍進,與LCD、PDP、有機EL等之顯示構件製造時所使用的離型薄膜之品質提昇的同時,在黏著劑層保護用途中,伴隨著自離型薄膜之聚酯的寡聚物析出或黏著劑與離型薄膜之剝離性的各種不良狀況,很明顯地存在著。 In recent years, with the advancement of the IT (Information Technology) field, the quality of the release film used in the manufacture of display members such as LCD, PDP, and organic EL has been improved, and the use of the adhesive layer has been accompanied by self-protection. Various problems such as oligomerization of the polyester of the release film or peeling property of the adhesive and the release film are apparent.
不只是偏光板用途,即使是將物體間以面接著之黏著薄片用途中,仍有許多報告指出因離型薄膜之剝離力所致的不良狀況。黏著薄片已有各種習知者,且已知有黏著薄片之1的無基材之兩面黏著薄片。無基材之兩面黏著薄片係由於黏著層之兩面積層剝離力相對低的輕剝離薄膜與剝離力相對高的重剝離薄膜而成的積層體構成所成的,且在將兩面的剝離薄膜去除後,即成為沒有支持基材而僅由黏著層所成之兩面黏著薄片。 It is not only the use of polarizing plates, but even in the application of adhering sheets between objects, there are still many reports indicating defects due to the peeling force of the release film. Adhesive sheets have been known to the art, and a two-sided adhesive sheet having no substrate is known. The non-substrate two-sided adhesive sheet is formed by a laminate of a lightly peeling film having a relatively low peeling force of the two layers of the adhesive layer and a heavy release film having a relatively high peeling force, and after removing the peeling film on both sides That is, it becomes an adhesive sheet which is formed by the adhesive layer without the support substrate and which is formed only by the adhesive layer.
無基材之兩面黏著薄片的使用方法,首先輕剝離薄膜被剝離,且露出的黏著層之一側的表面乃接著於貼合對象之物體面,在其接著後,重剝離薄膜再剝離,而露出的黏著層之另一側的面係接著於不同的物體面,藉此例示出物體間被面接著之加工步驟。 In the method of using the two-sided adhesive sheet without the substrate, first, the light release film is peeled off, and the surface on one side of the exposed adhesive layer is next to the surface of the object to be bonded, and after that, the film is peeled off and peeled off again. The surface on the other side of the exposed adhesive layer is followed by a different object surface, thereby exemplifying the processing steps in which the objects are surface-to-face.
近年來,無基材之兩面黏著薄片係因其作業性良好之點而備受矚目,不僅用途廣泛,亦可使用於各種光學用途之構件,例如行動電話等。特別是,靜電容量方式之觸控面板,乃藉由以二根手指進行畫面操作之多點觸碰操作,而作為情報端子之用途會進入急速地擴大之狀況。靜電容量方式之觸控面板,相較於電阻膜方式,在構成上因有印刷段差變厚的傾向,而有將黏著層增厚來解除印刷段差之提案。將黏著層增厚時,會有於剝離離型薄膜之際使黏著層的一部分附著於離型薄膜,或於轉印至離型薄膜的部分之黏著層中有氣泡混入等之不良狀況發生。因此,將無基材之兩面黏著薄片使用於光學用途時,不僅是無基材之兩面黏著薄片,即使是在組合之離型薄膜中,也必須要有較以往更加嚴謹、更高品質之離型薄膜的狀況。 In recent years, the two-sided adhesive sheet having no substrate has been attracting attention because of its excellent workability, and it can be used not only for a wide range of applications but also for various optical applications such as mobile phones. In particular, the capacitive touch panel is a multi-touch operation using two fingers for screen operation, and the use as an information terminal is rapidly expanding. In the touch panel of the electrostatic capacitance type, the difference in the printing step tends to be thicker than that of the resistive film method, and there is a proposal to increase the thickness of the adhesive layer to cancel the printing step. When the adhesive layer is thickened, a part of the adhesive layer may be adhered to the release film at the time of peeling off the release film, or a problem may occur in which air bubbles are mixed in the adhesive layer transferred to the portion of the release film. Therefore, when the non-substrate two-sided adhesive sheet is used for optical use, it is not only a non-substrate adhesive sheet on both sides, but even in the combined release film, it must be more rigorous and higher quality than before. The condition of the film.
無基材之兩面黏著薄片的使用中,在將輕剝離離型薄膜自黏著層剝離之際,會有輕剝離離型薄膜之剝離力高,無法自黏著劑順利地剝離而導致良率降低之問題。 In the use of the non-substrate two-sided adhesive sheet, when the light release release film is peeled off from the adhesive layer, the peeling force of the light release release film is high, and the adhesive cannot be smoothly peeled off from the adhesive, resulting in a decrease in yield. problem.
解決該問題之方法,乃提案有例如如專利文獻1、專利文獻2中所載的,使離型層的剝離速度在一定程度以下。但是,近年來,特別是在矚目於黏著層之段差吸收性而使用黏著層本身更柔軟的形式時,即使是使用前述記載之離型薄膜,也有未必有可滿足之程度的情況。又,前述方法因添加含移行成分之聚矽氧樹脂,當移行性惡化且使其與黏著劑貼合時,移行成分會移行至黏著劑 側,且會有可能污染黏著劑或污染黏著加工步驟之課題。 In order to solve this problem, for example, as disclosed in Patent Document 1 and Patent Document 2, the peeling speed of the release layer is set to be a certain level or less. However, in recent years, in particular, when the adhesive layer itself is used in a form in which the adhesive layer is inferior in absorbability, even if the release film described above is used, it may not be satisfactory. Further, in the above method, since the polyfluorene resin containing the transition component is added, when the migration property is deteriorated and it is bonded to the adhesive, the transition component migrates to the adhesive. Side, and there may be problems that may contaminate the adhesive or contaminate the adhesive processing steps.
[專利文獻1]日本特開2012-25088號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-25088
[專利文獻2]日本特開2012-179888號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-179888
本發明乃是有鑑於上述實情所為者,其解決課題的方法在於提供一種自黏著劑之離型性良好且寡聚物析出量極少、移行性少,除了適用於例如靜電容量方式之觸控面板製造用等、液晶顯示器(LCD)中所用的偏光板、相位差板等之LCD構成構件製造用、電漿顯示器面板構成構件製造用、有機電致發光構成構件製造用等、各種顯示器構成構件製造用之外,也適用於各種黏著劑層保護用途之離型薄膜。 The present invention has been made in view of the above circumstances, and a method for solving the problem is to provide a touch panel which is excellent in release property from a self-adhesive agent, has a small amount of oligomer deposition, and has less mobility, and is applicable to, for example, a capacitive touch panel. Manufacture of LCD components such as a polarizing plate or a phase difference plate used in a liquid crystal display (LCD), a plasma display panel constituting member, and an organic electroluminescence constituting member, and various display components are manufactured. In addition, it is also suitable for release films for various adhesive layer protection purposes.
本發明者鑑於上述實情所專致於檢討之結果發現,根據具有特定的構成之聚酯薄膜係可輕易地解決上述課題,終至於完成本發明。 The inventors of the present invention have found that the above problems can be easily solved by the polyester film having a specific constitution in view of the above-mentioned findings, and the present invention has been completed.
即,本發明之要旨係一種離型薄膜,其特徵係於聚酯薄膜之單面上具有由含有具官能基之反應性聚矽 氧樹脂、未反應性聚矽氧樹脂與鉑系觸媒之塗佈液所形成的聚矽氧系離型層。 That is, the gist of the present invention is a release film characterized in that it has a reactive polyfluorene having a functional group on one side of the polyester film. A polyfluorene-based release layer formed of an oxygen resin, a non-reactive polyanthracene resin, and a platinum-based catalyst coating liquid.
根據本發明,係可提供一種與黏著劑之離型性良好,且寡聚物析出量極少、移行性低的離型聚酯薄膜,而其工業的價值高。 According to the present invention, it is possible to provide a release polyester film which is excellent in release property from an adhesive, has a small amount of oligomer precipitation, and has low migration property, and has high industrial value.
1‧‧‧無基材之兩面黏著薄片 1‧‧‧Two-sided adhesive sheet without substrate
2‧‧‧黏著劑層 2‧‧‧Adhesive layer
3‧‧‧第1離型薄膜基材 3‧‧‧1st release film substrate
4‧‧‧第1離型劑層 4‧‧‧1st release layer
5‧‧‧第2離型薄膜基材 5‧‧‧Separate release film substrate
6‧‧‧第2離型劑層 6‧‧‧Second release agent layer
7‧‧‧第1離型薄膜(輕剝離側) 7‧‧‧1st release film (light peeling side)
8‧‧‧第2離型薄膜(重剝離側) 8‧‧‧Second release film (heavy peeling side)
[圖1]表示本發明之無基材之兩面黏著薄片的一例之剖面模式圖。 Fig. 1 is a schematic cross-sectional view showing an example of a non-substrate double-sided adhesive sheet of the present invention.
本發明中所謂的聚酯薄膜,意指將依壓出法自壓出模所熔融壓出之薄片予以延伸所成的薄膜。 The term "polyester film" as used in the present invention means a film obtained by stretching a sheet which is melted and extruded from a die by a pressing method.
構成上述薄膜之聚酯,意指一聚合物,該聚合物係含藉由二羧酸與二醇或由羥基羧酸所聚縮合而得之酯基。二羧酸方面,可例示出對苯二甲酸、間苯二甲酸、己二酸、壬二酸、癸二酸、2,6-萘二羧酸、1,4-環己烷二羧酸等,二醇方面,可例示出乙二醇、1,4-丁烷二醇、二 乙二醇、三乙二醇、新戊二醇、1,4-環己烷二甲醇、聚乙二醇等,羥基羧酸方面,可例示出p-羥基安息香酸、6-羥基-2-萘甲酸等。該聚合物之代表,可例示出聚對苯二甲酸乙二醇酯或聚-2、6-萘二甲酸乙二醇酯等。 The polyester constituting the above film means a polymer containing an ester group obtained by condensation condensation of a dicarboxylic acid with a diol or a hydroxycarboxylic acid. Examples of the dicarboxylic acid include terephthalic acid, isophthalic acid, adipic acid, sebacic acid, sebacic acid, 2,6-naphthalene dicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, and the like. As the diol, ethylene glycol, 1,4-butanediol, and the like can be exemplified. Ethylene glycol, triethylene glycol, neopentyl glycol, 1,4-cyclohexane dimethanol, polyethylene glycol, etc., and hydroxycarboxylic acid, p-hydroxybenzoic acid, 6-hydroxy-2- Naphthoic acid and the like. Representative examples of the polymer include polyethylene terephthalate or polyethylene-2,6-naphthalenedicarboxylate.
本發明之薄膜中,在以賦予易滑性及防止各步驟中的損傷的發生為主要目的時,係以摻合粒子為佳。摻合之粒子的種類,若為可賦予易滑性之粒子即可,並無特別限定,具體例方面,可舉例如氧化矽、碳酸鈣、碳酸鎂、碳酸鋇、硫酸鈣、磷酸鈣、磷酸鎂、高嶺土、氧化鋁、氧化鈦等之粒子。又,亦可使用日本特公昭59-5216號公報、日本特開昭59-217755號公報等中所記載之耐熱性有機粒子。其他的耐熱性有機粒子之例,可舉出熱硬化性尿素樹脂、熱硬化性苯酚樹脂、熱硬化性環氧樹脂、苯并三聚氰二胺樹脂等。再者,聚酯製造步驟中,亦可使用使觸媒等之金屬化合物的一部分沈澱、微分散之析出粒子。 In the film of the present invention, it is preferred to blend the particles in order to impart slipperiness and prevent the occurrence of damage in each step. The type of the particles to be blended is not particularly limited as long as it imparts slipperiness, and specific examples thereof include cerium oxide, calcium carbonate, magnesium carbonate, barium carbonate, calcium sulfate, calcium phosphate, and phosphoric acid. Particles such as magnesium, kaolin, alumina, and titanium oxide. In addition, the heat-resistant organic particles described in Japanese Patent Publication No. 59-217755, and the like. Examples of the other heat-resistant organic particles include a thermosetting urea resin, a thermosetting phenol resin, a thermosetting epoxy resin, and a benzoguanamine resin. Further, in the polyester production step, precipitated particles in which a part of the metal compound such as a catalyst is precipitated or finely dispersed may be used.
此外,有關所使用之粒子的形狀,並無特別限定,可使用球狀、塊狀、棒狀、扁平狀等任一種。又,其硬度、比重、顏色等也無特別限制。此等一連串的粒子,可視需要而併用2種以上。 Further, the shape of the particles to be used is not particularly limited, and any of a spherical shape, a block shape, a rod shape, and a flat shape may be used. Further, the hardness, specific gravity, color, and the like are not particularly limited. These series of particles may be used in combination of two or more types as needed.
又,所用的粒子,其平均粒徑通常為0.01~3μm、較佳為0.1~2μm之範圍。平均粒徑未達0.01μm時,會有無法賦予易滑性的情況。此外,超過3μm時,於薄膜製膜之際,會因其粒子的凝聚物而有透明性降低的 問題,此外,也因容易發生破斷等而在生產性之面上成為問題。 Further, the particles to be used have an average particle diameter of usually from 0.01 to 3 μm, preferably from 0.1 to 2 μm. When the average particle diameter is less than 0.01 μm, the slipperiness may not be imparted. In addition, when it exceeds 3 μm, when the film is formed, the transparency of the particles is lowered due to the aggregation of the particles. The problem is also a problem on the productive side due to the possibility of breakage.
再者,聚酯中的粒子含量通常為0.001~5重量%、較佳為0.005~3重量%之範圍。粒子含量未達0.001重量%時,會有薄膜的易滑性不足的情況,此外,當添加超過5重量%時,會有薄膜的透明性不足的情況。 Further, the content of the particles in the polyester is usually in the range of 0.001 to 5% by weight, preferably 0.005 to 3% by weight. When the content of the particles is less than 0.001% by weight, the slipperiness of the film may be insufficient, and when the amount is more than 5% by weight, the transparency of the film may be insufficient.
在聚酯層中添加粒子之方法方面,並無特別限定,可採用以往公知的方法。例如,雖可在製造構成各層之聚酯的任意階段中進行添加,但以酯化或酯交換反應終了後添加為佳。 The method of adding particles to the polyester layer is not particularly limited, and a conventionally known method can be employed. For example, it may be added at any stage in which the polyester constituting each layer is produced, but it is preferably added after the esterification or transesterification reaction is completed.
又,亦可藉由下述方法來進行:使用附通氣孔之混練壓出機並摻混使其分散於乙二醇或水等之粒子的漿料與聚酯原料之方法,或使用混練壓出機並摻混已使其乾燥之粒子與聚酯原料之方法等。 Further, it can also be carried out by a method of mixing a slurry of a particle of ethylene glycol or water with a polyester raw material by using a kneading extruder equipped with a vent hole, or by using a kneading pressure. A method of discharging and blending the dried particles with a polyester raw material, and the like.
此外,本發明之聚酯薄膜中,除了上述粒子以外,亦可視需要而添加以往公知的抗氧化劑、抗靜電劑、熱安定劑、潤滑劑、染料、顏料等。 Further, in the polyester film of the present invention, in addition to the above particles, a conventionally known antioxidant, an antistatic agent, a thermal stabilizer, a lubricant, a dye, a pigment, or the like may be added as needed.
本發明中之聚酯薄膜的厚度,若在可製膜為薄膜的範圍時,並無特別限定,通常為10~350μm、較佳為15~100μm之範圍。 The thickness of the polyester film in the present invention is not particularly limited as long as it can be formed into a film, and is usually in the range of 10 to 350 μm, preferably 15 to 100 μm.
本發明之離型薄膜,於180℃加熱10分鐘之後,離型層表面的寡聚物量(OL)為2.0mg/m2以下。其中所謂的加熱後之寡聚物量,乃是將離型薄膜於180℃加熱10分鐘之後,使其表面以DMF(二甲基甲醯胺)4ml 進行洗淨,以液體層析求該DMF中的寡聚物量,並將此值除以使DMF接觸之薄膜面積,所測得的可作為薄膜表面寡聚物量(mg/m2)。 In the release film of the present invention, after heating at 180 ° C for 10 minutes, the amount of oligomer (OL) on the surface of the release layer is 2.0 mg/m 2 or less. The amount of the oligomer after heating is obtained by heating the release film at 180 ° C for 10 minutes, and then washing the surface with 4 ml of DMF (dimethylformamide) to obtain the DMF by liquid chromatography. The amount of oligomer, which was measured by dividing the film area of the DMF contact, was measured as the amount of film surface oligomer (mg/m 2 ).
加熱後減少OL方面,可舉出以聚酯之固相聚合減少聚酯中的寡聚物量之方法,或是設置防止寡聚物析出的塗佈層之方法等。特別是,本發明乃具有有效地防止寡聚物析出於塗佈層之機能。在防止寡聚物的析出方面,可採取各種方法。例如有使塗佈層中含有包含鋁之有機化合物的方法,但並不受限於此。 The method of reducing the OL after heating includes a method of reducing the amount of the oligomer in the polyester by solid phase polymerization of the polyester, or a method of providing a coating layer for preventing the precipitation of the oligomer. In particular, the present invention has a function of effectively preventing the oligomer from being deposited on the coating layer. Various methods can be employed in preventing the precipitation of oligomers. For example, there is a method of containing an organic compound containing aluminum in the coating layer, but it is not limited thereto.
接著,雖就本發明中之聚酯薄膜的製造例具體地說明,但並不受限於以下之製造例。即,以使用先前所述之聚酯原料,將由壓出嘴所壓出之熔融薄片以冷卻輥予以冷卻固化而得未延伸薄片之方法為佳。此時,為使薄片平面性提昇,係以提高薄片與旋轉冷卻桶之密著性為佳,較佳可採用外加靜電密著法及/或液體塗佈密著法。接著所得之未延伸薄片係可向二軸方向延伸。此時,首先,將前述未延伸薄片係於單一方向以輥或拉幅機方式之延伸機延伸。延伸溫度通常為90~140℃、較佳為95~120℃,延伸倍率通常為2.5~7倍,較佳為3.0~6倍。接著,向與第一階段之延伸方向垂直的方向延伸,而此時延伸溫度通常為90~170℃、延伸倍率通常為3.0~7倍,較佳為3.5~6倍。然後,繼續以180~270℃之溫度在緊繃下或30%以內的鬆弛下進行熱處理,得到二軸配向薄膜。上述延伸,可採用將單一方向之延伸以2階段以上進行之 方法。此時,以最終二方向之延伸倍率各為上述範圍之方式進行為佳。 Next, although the production example of the polyester film in the present invention is specifically described, it is not limited to the following production examples. That is, a method in which the molten sheet extruded from the extrusion nozzle is cooled and solidified by a cooling roll to obtain an unstretched sheet is preferably used. At this time, in order to improve the planarity of the sheet, it is preferable to improve the adhesion between the sheet and the rotary cooling drum, and it is preferable to use an electrostatic sealing method and/or a liquid coating adhesion method. The resulting unstretched sheet can then be extended in the biaxial direction. At this time, first, the unstretched sheet is stretched in a single direction in a roll or tenter type stretching machine. The stretching temperature is usually from 90 to 140 ° C, preferably from 95 to 120 ° C, and the stretching ratio is usually from 2.5 to 7 times, preferably from 3.0 to 6 times. Next, it extends in a direction perpendicular to the extending direction of the first stage, and at this time, the stretching temperature is usually 90 to 170 ° C, and the stretching ratio is usually 3.0 to 7 times, preferably 3.5 to 6 times. Then, heat treatment is continued at a temperature of 180 to 270 ° C under tension or within 30% to obtain a biaxial alignment film. The above extension can be carried out by extending the single direction in two or more stages. method. In this case, it is preferred that the stretching ratios in the final two directions are each in the above range.
又,有關本發明之聚酯薄膜製造,亦可採用同時二軸延伸法。同時二軸延伸法係將前述未延伸薄片以通常90~140℃、較佳為80~110℃所溫控之狀態同時向機械方向及寬幅方向同時延伸並使其配向之方法,且延伸倍率方面,以面積倍率計為4~50倍,較佳為7~35倍,更佳為10~25倍。然後,繼續以170~250℃之溫度在緊繃下或30%以內的鬆弛下進行熱處理,得到延伸配向薄膜。有關於採用上述延伸方式之同時二軸延伸裝置,係可採用螺槳方式、集電弓方式、線性驅動方式等以往公知的延伸方式。 Further, in the production of the polyester film of the present invention, a simultaneous biaxial stretching method can also be employed. At the same time, the biaxial stretching method is a method in which the unstretched sheet is simultaneously extended and aligned in the mechanical direction and the wide direction at a temperature of 90 to 140 ° C, preferably 80 to 110 ° C, and the stretching ratio is extended. In terms of area magnification, it is 4 to 50 times, preferably 7 to 35 times, more preferably 10 to 25 times. Then, heat treatment is continued at a temperature of 170 to 250 ° C under tension or within 30% to obtain an extended alignment film. Regarding the simultaneous biaxial stretching device using the above extension method, a conventionally known extension method such as a propeller method, a pantograph method, or a linear driving method can be employed.
於聚酯薄膜之表面形成塗佈層之方法,並無特別限制,但較佳係採用於製造聚酯薄膜之步驟中塗佈塗佈液之方法。具體而言,可舉出於未延伸薄片表面塗佈塗佈液而乾燥之方法、於一軸延伸薄膜表面塗佈塗佈液而乾燥之方法、於二軸延伸薄膜表面塗佈塗佈液而乾燥之方法等。此等之中,係以於未延伸薄膜或一軸延伸薄膜表面塗佈塗佈液之後,在對薄膜進行熱處理之過程同時將塗佈層乾燥硬化之方法較為經濟。又,形成塗佈層之方法方面,因應需要,亦可採用併用幾個前述塗佈方法之方法。具體而言,可舉出於未延伸薄片表面塗佈第一層而乾燥,之後在一軸方向延伸後,塗佈第二層而乾燥之方法等。於聚酯薄膜之表面塗佈塗佈液之方法方面,可使用原崎勇次著、 槙書店1979年發行之「塗佈方式」中所示之反向輥塗佈機、凹版塗佈機、刮棒塗佈機、氣動刮刀塗佈機等。 The method of forming the coating layer on the surface of the polyester film is not particularly limited, but is preferably a method of applying a coating liquid in the step of producing a polyester film. Specifically, a method in which the coating liquid is applied to the surface of the unstretched sheet and dried, a method in which the coating liquid is applied to the surface of the one-axis stretched film and dried, and a coating liquid is applied to the surface of the biaxially stretched film to be dried. Method and so on. Among these, it is economical to dry and harden the coating layer while heat-treating the film after applying the coating liquid to the surface of the unstretched film or the one-axis stretching film. Further, in terms of the method of forming the coating layer, a method of using several of the above coating methods may be employed as needed. Specifically, a method in which the first layer is applied to the surface of the unstretched sheet and dried, and then the second layer is applied and dried after being stretched in the axial direction is used. For the method of applying the coating liquid on the surface of the polyester film, you can use Harahara, A reverse roll coater, a gravure coater, a bar coater, a pneumatic blade coater, and the like shown in "Coating Method" issued by the bookstore in 1979.
接著,就本發明中之塗佈層的形成進行說明。構成本發明之離型薄膜的塗佈層,為了使寡聚物析出防止性變佳,同時使經時之離型層與聚酯薄膜之塗膜密著性變佳,係以含有有機矽化合物為佳,使用以下述一般式(1)所示之有機矽化合物更佳。 Next, the formation of the coating layer in the present invention will be described. The coating layer constituting the release film of the present invention contains an organic ruthenium compound in order to improve the deposition prevention property of the oligomer and to improve the adhesion of the release film and the polyester film over time. Preferably, the organic ruthenium compound represented by the following general formula (1) is more preferably used.
Si(X)d(Y)e(R1)f…(1) Si(X) d (Y) e (R 1 ) f ...(1)
上述式中,X係具有由環氧基、巰基、(甲基)丙烯醯基、烯基、鹵烷基及胺基選出的至少1種的有機基,R1為一價烴基且為碳數1~10者,Y為水解性基,d為1或2之整數,e為2或3之整數,f為0或1之整數,且d+e+f=4。 In the above formula, X has at least one organic group selected from the group consisting of an epoxy group, a fluorenyl group, a (meth) acryl fluorenyl group, an alkenyl group, a haloalkyl group, and an amine group, and R1 is a monovalent hydrocarbon group and has a carbon number of 1 In the case of ~10, Y is a hydrolyzable group, d is an integer of 1 or 2, e is an integer of 2 or 3, f is an integer of 0 or 1, and d+e+f=4.
前述一般式(1)所示之有機矽化合物,可使用具有2個(D單位源)或3個(T單位源)能藉由水解、縮合反應形成矽氧烷鍵結之水解性基Y者。 The organic ruthenium compound represented by the above general formula (1) may be a hydrolyzable group Y having two (D unit sources) or three (T unit sources) capable of forming a siloxane coupling by hydrolysis or condensation reaction. .
一般式(1)中,一價烴基R1係碳數為1~10者,特別以甲基、乙基、丙基為佳。 In the general formula (1), the monovalent hydrocarbon group R 1 has a carbon number of from 1 to 10, particularly preferably a methyl group, an ethyl group or a propyl group.
一般式(1)中,水解性基Y方面,可使用以往公知者,可例示出下述者。甲氧基、乙氧基、丁氧基、異丙烯氧基、乙醯氧基、丁酮肟基及胺基等。此等之水解性基,可單獨使用或使用複數種。若使用甲氧基或乙氧基,可賦予塗佈材良好的保存安定性,又因具有適當的水 解性而特別佳。 In the general formula (1), a conventionally known one can be used as the hydrolyzable group Y, and the following can be exemplified. Methoxy, ethoxy, butoxy, isopropenyloxy, ethoxylated, butanone oxime and amine groups. These hydrolyzable groups may be used singly or in plural. When a methoxy group or an ethoxy group is used, the coating material can be imparted with good preservation stability and with appropriate water. It is especially good for solution.
本發明中,塗佈層中所含之有機矽化合物方面,具體而言,可例示乙烯基三甲氧基矽烷、γ-環氧丙氧基三甲氧基矽烷、γ-環氧丙氧基甲基二乙氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷、γ-巰基丙基三甲氧基矽烷、γ-甲基丙烯氧基丙基三甲氧基矽烷、γ-丙烯氧基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、5-己烯基三甲氧基矽烷、p-苯乙烯基三甲氧基矽烷、三氟丙基三甲氧基矽烷、γ-環氧丙氧基三乙氧基矽烷、γ-環氧丙氧基甲基二異丙烯氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷等。 In the present invention, as the organic ruthenium compound contained in the coating layer, specifically, vinyl trimethoxy decane, γ-glycidoxytrimethoxy decane, γ-glycidoxymethyl group can be exemplified. Diethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ-mercaptopropyltrimethoxydecane, γ-methylpropoxypropyltrimethoxydecane, γ - propyleneoxypropyltrimethoxydecane, γ-aminopropyltriethoxydecane, 5-hexenyltrimethoxydecane, p-styryltrimethoxydecane, trifluoropropyltrimethoxy Decane, γ-glycidoxytriethoxydecane, γ-glycidoxymethyldiisopropenyloxydecane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, etc. .
本發明中,為了使離型薄膜之寡聚物析出防止性變佳,同時使經時的離型層與聚酯薄膜之塗膜密著性變佳,係以塗佈層中含有含鋁之有機化合物者佳。 In the present invention, in order to improve the precipitation preventing property of the release film and to improve the coating film adhesion of the release film and the polyester film over time, the coating layer contains aluminum. Organic compounds are good.
具有鋁元素之有機化合物,其具體例方面可例示鋁參(乙醯丙酮酸鹽)、鋁單乙醯丙酮酸鹽雙(乙醯乙酸乙酯)、鋁-二-n-丁氧基-單乙醯乙酸乙酯、鋁-二-異-丙氧基-單乙醯乙酸甲酯、鋁參(乙醯乙酸乙酯)等。 An organic compound having an aluminum element, and specific examples thereof may be exemplified by aluminum ginseng (acetamidine pyruvate), aluminum monoethyl acetonate bis(acetate ethyl acetate), aluminum-di-n-butoxy-single Ethyl acetate, aluminum-di-iso-propoxy-monoethylammonium acetate, aluminum ginate (acetic acid ethyl acetate) and the like.
塗佈層中所含之鋁化合物的量通常為0.001~70重量%、較佳為5~35重量%、更佳為5~15重量%之範圍。鋁化合物的量若為0.001重量%以下,塗佈層之硬化反應無法迅速地進行,塗佈層之上形成離型層後的離型面之塗膜密著性會惡化。又,鋁化合物的量若為70重量%以上,則無關乎塗佈層之硬化反應,塗佈層中殘存的鋁 化合物會妨礙離型層之硬化,且離型面之塗膜密著性會惡化。 The amount of the aluminum compound contained in the coating layer is usually in the range of 0.001 to 70% by weight, preferably 5 to 35% by weight, more preferably 5 to 15% by weight. When the amount of the aluminum compound is 0.001% by weight or less, the hardening reaction of the coating layer cannot be rapidly performed, and the coating film adhesion property of the release surface after forming the release layer on the coating layer is deteriorated. Further, if the amount of the aluminum compound is 70% by weight or more, the hardening reaction of the coating layer and the residual aluminum in the coating layer are irrelevant. The compound hinders the hardening of the release layer, and the adhesion of the coating film on the release surface is deteriorated.
塗佈層中,亦可含有具鋁元素以外之金屬元素的有機化合物。特別是以有機錫化合物為佳。有機錫化合物的具體例方面,可舉出二丁基錫二月桂酸鹽、二丁基錫二乙酸酯、二丁基錫二辛酸鹽、二丁基錫二油酸酯、二苯基錫二乙酸酯、二丁基錫氧化物、二丁基錫二甲氧化物、二丁基雙(三乙氧基矽氧基)錫、二丁基錫苄基馬來酸鹽、二辛基錫二乙酸酯、二辛基錫二月桂酸鹽等。 The coating layer may also contain an organic compound having a metal element other than aluminum. In particular, an organotin compound is preferred. Specific examples of the organotin compound include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin dioctanoate, dibutyltin dioleate, diphenyltin diacetate, and dibutyltin oxidation. , dibutyltin dimethoxide, dibutyl bis(triethoxydecyloxy)tin, dibutyltinbenzyl maleate, dioctyltin diacetate, dioctyltin dilaurate Wait.
再者,以改良塗佈層之固著性、潤滑性為目的,係可含有無機系粒子,具體例方面,可舉出氧化矽、氧化鋁、高嶺土、碳酸鈣、氧化鈦、鋇鹽等。 In addition, inorganic particles may be contained for the purpose of improving the fixing property and lubricity of the coating layer, and specific examples thereof include cerium oxide, aluminum oxide, kaolin, calcium carbonate, titanium oxide, and cerium salt.
又,因應需要,亦可含有消泡劑、塗佈性改良劑、增黏劑、有機系潤滑劑、有機系高分子粒子、抗氧化劑、紫外線吸收劑、發泡劑、染料等。 Further, if necessary, an antifoaming agent, a coatability improver, a tackifier, an organic lubricant, an organic polymer particle, an antioxidant, an ultraviolet absorber, a foaming agent, a dye, or the like may be contained.
在不超越本發明之要旨的範圍中,以分散性改良、造膜性改良等為目的下,所使用的有機溶劑可僅使用一種,亦可適當地使用2種以上。 In the range which does not exceed the gist of the present invention, the organic solvent to be used may be used singly or in combination of two or more kinds.
於構成本發明中之離型薄膜的聚酯薄膜上所設置的塗佈層之塗佈量(乾燥後),通常為0.005~1g/m2、較佳為0.005~0.5g/m2之範圍。塗佈量(乾燥後)未達0.005g/m2時,塗佈厚度的均一性會有不足的情況,熱處理後,自塗佈層表面析出之寡聚物量會有變多的情況。此外,當塗佈超過1g/m2時,會產生潤滑性降低等 之不良狀況。 The coating amount (after drying) of the coating layer provided on the polyester film constituting the release film of the present invention is usually in the range of 0.005 to 1 g/m 2 , preferably 0.005 to 0.5 g/m 2 . . When the coating amount (after drying) is less than 0.005 g/m 2 , the uniformity of the coating thickness may be insufficient, and the amount of the oligomer precipitated from the surface of the coating layer may increase after the heat treatment. Further, when the coating amount exceeds 1 g/m 2 , a problem such as a decrease in lubricity is caused.
本發明中,有關於聚酯薄膜上形成塗佈層時的硬化條件,並無特別限定,例如,藉由離線塗佈而設置塗佈層時,通常可以60~200℃、3~40秒鐘、較佳為80~180℃、3~40秒鐘做為基準來進行熱處理。又,因應需要,亦可併用熱處理與紫外線照射等之活性能量線照射。 In the present invention, the curing conditions in forming the coating layer on the polyester film are not particularly limited. For example, when the coating layer is provided by off-line coating, it is usually 60 to 200 ° C for 3 to 40 seconds. Preferably, the heat treatment is performed at 80 to 180 ° C for 3 to 40 seconds. Further, if necessary, it is also possible to use an active energy ray such as heat treatment or ultraviolet irradiation.
形成於本發明中所得之聚酯薄膜的單邊最外層之離型層硬化型聚矽氧樹脂的種類方面,包括加成型、縮合型、紫外線硬化型、電子線硬化型、無溶劑型等任一硬化反應形式均可使用。 The type of the release layer-type polysulfonated resin which is formed on the one-side outermost layer of the polyester film obtained in the present invention includes addition molding, condensation type, ultraviolet curing type, electron beam curing type, solventless type, and the like. A hardening reaction form can be used.
本發明中使用的具有以烯基及烷基作為官能基之聚矽氧樹脂的例子,可舉出如以下所述者。首先,含烯基之硬化型聚矽氧樹脂,在二有機聚矽氧烷方面,可舉出分子鏈兩末端三甲基矽氧基封鎖二甲基矽氧烷‧甲基己烯基矽氧烷共聚物(二甲基矽氧烷單位96莫耳%、甲基己烯基矽氧烷單位4莫耳%)、分子鏈兩末端二甲基乙烯基矽氧基封鎖二甲基矽氧烷‧甲基己烯基矽氧烷共聚物(二甲基矽氧烷單位97莫耳%、甲基己烯基矽氧烷單位3莫耳%)、分子鏈兩末端二甲基己烯基矽氧基封鎖二甲基矽氧烷‧甲基己烯基矽氧烷共聚物(二甲基矽氧烷單位95莫耳%、甲基己烯基矽氧烷單位5莫耳%)。接著,含烷基硬化型聚矽氧樹脂,在有機氫聚矽氧烷方面,可舉出分子鏈兩末端三甲基矽氧基封鎖甲基氫聚矽氧烷、分子鏈 兩末端三甲基矽氧基封鎖二甲基矽氧烷‧甲基氫矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封鎖甲基氫聚矽氧烷、分子鏈兩末端二甲基氫矽氧基封鎖二甲基矽氧烷‧甲基氫矽氧烷共聚物。 Examples of the polyfluorene oxide resin having an alkenyl group and an alkyl group as a functional group used in the present invention include the following. First, an alkenyl group-containing hardening polyoxynoxy resin, in terms of diorganopolyoxyalkylene, a molecular chain having a terminal trimethyl methoxy group to block dimethyloxane ‧ methylhexenyl oxime Alkane copolymer (96 mole % of dimethyloxane, 4 mole % of methylhexenyl oxirane), dimethylvinyl methoxy group at the two ends of the molecular chain, dimethyl oxoxane ‧Methylhexenyl decane copolymer (methyl methoxide unit 97 mol%, methylhexenyl decane unit 3 mol%), molecular chain both ends dimethylhexenyl hydrazine The oxy group blocked the dimethyloxane ‧ methylhexenyl decane copolymer (dimethyloxane unit 95 mol%, methylhexenyl decane unit 5 mol%). Next, the alkyl-containing hardening polyfluorene oxide, in terms of the organic hydrogen polyoxyalkylene, may be exemplified by a molecular chain at both ends of a trimethyl methoxy group to block methyl hydrogen polyoxyalkylene, a molecular chain. The two-terminal trimethyl methoxy group blocks the dimethyl oxane ‧ methyl hydrazine copolymer, the two ends of the molecular chain dimethyl hydro hydroxy groups block the methyl hydrogen polyoxy siloxane, and the two ends of the molecular chain The methylhydroquinoneoxy group blocks the dimethyloxane ‧ methylhydroquinoxane copolymer.
本發明中使用的具有己烯基與苯基之聚矽氧樹脂方面,係以下述一般式(I)所示之有機聚矽氧烷為佳。雖化學構造係以一般式(I)所示,但可為直鏈狀構造或分歧構造。各官能基的導入部分任意亦可。 The polyfluorene oxide resin having a hexenyl group and a phenyl group used in the present invention is preferably an organopolyoxane represented by the following general formula (I). Although the chemical structure is represented by the general formula (I), it may be a linear structure or a divergent structure. The introduction portion of each functional group may be any optional.
上述式中,a、b分別表示正之整數。 In the above formula, a and b each represent a positive integer.
本發明中使用的具有乙烯基與苯基之聚矽氧樹脂方面,係以下述一般式(II)所示之有機聚矽氧烷為佳。雖可將化學構造以一般式(II)所示,但可為直鏈狀構造或分歧構造。各官能基的導入部分任意亦可。 The polyfluorene oxide resin having a vinyl group and a phenyl group used in the present invention is preferably an organopolyoxane represented by the following general formula (II). Although the chemical structure may be represented by the general formula (II), it may be a linear structure or a divergent structure. The introduction portion of each functional group may be any optional.
上述式中,c、d分別表示正之整數。 In the above formula, c and d each represent a positive integer.
本發明中使用的具有氫化矽烷基之聚矽氧樹脂方面,係以下述一般式(III)所示之有機聚矽氧烷為佳。雖可將化學構造以一般式(III)所示,但可為直鏈狀構造或分歧構造。各官能基的導入部分任意亦可。 The polyfluorene oxide having a hydrogenated alkylene group used in the present invention is preferably an organopolyoxane represented by the following general formula (III). Although the chemical structure may be represented by the general formula (III), it may be a linear structure or a divergent structure. The introduction portion of each functional group may be any optional.
上述式中,e、f分別表示正之整數。 In the above formula, e and f each represent a positive integer.
雖將具有己烯基之聚矽氧樹脂與具有乙烯基聚合物基之聚矽氧樹脂分為(I)式與(II)式,但亦可含有於1個的有機聚矽氧烷中含有己烯基與乙烯基聚合物基。 Although the polyhexyloxy resin having a hexenyl group and the polyoxyl resin having a vinyl polymer group are classified into the formulas (I) and (II), they may be contained in one organic polyoxane. Hexenyl and vinyl polymer groups.
又,苯基未必為含有己烯基與乙烯基之聚矽氧樹脂中所必要含有的,亦可於1個的有機聚矽氧烷中含有苯基。 Further, the phenyl group is not necessarily required to be contained in the polyfluorene oxide resin containing a hexenyl group and a vinyl group, and a phenyl group may be contained in one organic polysiloxane.
本發明中使用的聚矽氧樹脂中所含之己烯基、乙烯基、苯基與氫化矽烷基的比,在使氫化矽烷基為100時,係以己烯基為35~65、乙烯基為5~35、苯基為1~20者佳。期望是以己烯基為45~55、乙烯基為15~25、苯基為2~10者更佳。己烯基若未達35,聚矽氧硬 化反應會不足,在30000mm/分之剝離力會變高,將離型薄膜以高速自黏著劑剝離時,會有無法完美地剝離之不良狀況發生。己烯基若超過65,則聚矽氧硬化中,交聯點會過多,在300mm/分之剝離力會變高,將離型薄膜從黏著劑剝離時,會有無法完美地剝離之不良狀況發生。乙烯基若未達15,則聚矽氧硬化反應會不足,在30000mm/分之剝離力會變高,將離型薄膜以高速自黏著劑剝離時,會有無法完美地剝離之不良狀況發生。乙烯基若超過35,則聚矽氧硬化中,交聯點會過多,在300mm/分之剝離力會變高,將離型薄膜從黏著劑剝離時,會有無法完美地剝離之不良狀況發生。苯基若未達1,則聚矽氧膜會變軟,在30000mm/分之剝離力會變高,將離型薄膜以高速自黏著劑剝離時,會有無法完美地剝離之不良狀況發生。苯基若超過20,則聚矽氧膜會變得過硬,在300mm/分之剝離力會變高,將離型薄膜從黏著劑剝離時,會有無法完美地剝離之不良狀況發生。 The ratio of the hexenyl group, the vinyl group, the phenyl group and the hydrazinyl group contained in the polyfluorene oxide resin used in the present invention is a hexenyl group of 35 to 65 and a vinyl group when the alkylene group is 100. It is preferably 5 to 35 and phenyl is 1 to 20. It is desirable to have a hexenyl group of 45 to 55, a vinyl group of 15 to 25, and a phenyl group of 2 to 10. If the hexenyl group does not reach 35, it is hard. The chemical reaction will be insufficient, and the peeling force at 30,000 mm/min will become high, and when the release film is peeled off at a high speed from the adhesive, there is a problem that the peeling film cannot be perfectly peeled off. When the amount of the hexenyl group exceeds 65, the degree of crosslinking is too large in the polyoxygen curing, and the peeling force at 300 mm/min is high, and when the release film is peeled off from the adhesive, there is a problem that the peeling film cannot be perfectly peeled off. occur. If the vinyl group is less than 15, the polyoxygen hardening reaction will be insufficient, and the peeling force at 30,000 mm/min will become high, and when the release film is peeled off at a high speed from the adhesive, there is a problem that the peeling film cannot be perfectly peeled off. When the vinyl group exceeds 35, in the case of polyoxygen curing, the crosslinking point is too large, and the peeling force at 300 mm/min is high, and when the release film is peeled off from the adhesive, the defective state may not be perfectly peeled off. . When the phenyl group is less than 1, the polyfluorene oxide film becomes soft, and the peeling force at 30,000 mm/min is increased. When the release film is peeled off at a high speed from the adhesive, a problem that the peeling film cannot be perfectly peeled off may occur. When the phenyl group exceeds 20, the polyfluorene oxide film becomes too hard, and the peeling force at 300 mm/min is high, and when the release film is peeled off from the adhesive, there is a problem that the peeling film cannot be perfectly peeled off.
本發明中使用的聚矽氧樹脂中所含之二甲基矽烷基(一般式(I)之a、一般式(II)之c、一般式(III)之f)數係以2000以上5000以下為佳。更佳為3000以上4000以下為佳。若未達2000,會有分子量小而未反應聚矽氧會移行至黏著層等之不良狀況發生。若超過5000,則分子量過大而硬化反應無法順利地進行,可能無法獲得所期望的剝離特性。 The dimethyl fluorenyl group (general formula (I) a, general formula (II) c, general formula (III) f) contained in the polyfluorene oxide resin used in the present invention is 2,000 or more and 5,000 or less. It is better. More preferably, it is preferably 3000 or more and 4000 or less. If it is less than 2000, there will be a problem that the molecular weight is small and the unreacted polyoxygen will migrate to the adhesive layer. If it exceeds 5,000, the molecular weight is too large and the hardening reaction does not proceed smoothly, and the desired peeling characteristics may not be obtained.
本發明中,為了賦予輕剝離性,必須要添加 質量平均分子量50000以上100000以下的未反應性聚矽氧樹脂。 In the present invention, in order to impart light peelability, it is necessary to add An unreactive polyxanthene resin having a mass average molecular weight of 50,000 or more and 100,000 or less.
前述的未反應性聚矽氧樹脂方面,係以下述一般式(IV)所示之有機聚矽氧烷為佳。 The above-mentioned unreacted polyoxyphthalocene resin is preferably an organopolyoxane represented by the following general formula (IV).
上述式中,g表示正之整數。 In the above formula, g represents a positive integer.
本發明使用的聚矽氧樹脂中,所含之未反應性聚矽氧樹脂為1~10重量%之範圍、較佳為1~5重量%。未反應性聚矽氧樹脂之含量若較1%低,則無法成為輕剝離,若超過5重量%,則有硬化性顯著地降低,密著性也惡化之不良狀況。 The polyoxyphthalocene resin used in the present invention contains 1 to 10% by weight, preferably 1 to 5% by weight, of the unreacted polyoxyl resin. When the content of the unreacted polyoxyl resin is less than 1%, the peeling is not possible, and when it is more than 5% by weight, the curability is remarkably lowered, and the adhesion is also deteriorated.
本發明中,為了減小剝離力,亦可添加聚矽氧油。聚矽氧油乃是被稱為直餾聚矽氧油、改性聚矽氧油之聚矽氧油,可舉出下述者。直餾聚矽氧油方面,可舉出二甲基聚矽氧油、甲基苯基聚矽氧油、甲基氫聚矽氧油等。又,改性聚矽氧油方面,可舉出側鏈型形式之聚醚改性、芳烷基改性、氟烷基改性、長鏈烷基改性、高級脂肪酸酯改性、高級脂肪酸醯胺改性、聚醚‧長鏈烷基改性‧芳烷基改性、苯基改性、兩末端型之聚醚改性、聚醚‧甲 氧基改性等。 In the present invention, in order to reduce the peeling force, polyoxygenated oil may be added. The polyoxygenated oil is a polyoxygenated oil called a straight-run polyoxyxene oil or a modified polyoxygenated oil, and the following may be mentioned. Examples of the straight-run polyoxyl oil include dimethylpolyphthalic acid oil, methylphenylpolyphosphoric acid oil, and methyl hydrogen polyoxygenated oil. Further, examples of the modified polyoxyxene oil include a polyether modification in a side chain type, an aralkyl modification, a fluoroalkyl modification, a long-chain alkyl modification, a higher fatty acid ester modification, and an advanced Fatty acid decylamine modification, polyether ‧ long-chain alkyl modification ‧ aralkyl modification, phenyl modification, two-terminal polyether modification, polyether ‧ Oxygen modification and the like.
本發明中使用的聚矽氧樹脂中所含之聚矽氧油成分係1~10重量%之範圍,較佳為1~5重量%。聚矽氧油成分之含量若低於1%,則速度依存性會變高,若超過5重量%,則移行性高,在黏著劑加工時會弄髒輥或移行至黏著劑面,發生黏著剝離力降低等。 The polyoxyxylene oil component contained in the polyoxyxylene resin used in the present invention is in the range of 1 to 10% by weight, preferably 1 to 5% by weight. When the content of the polyoxygenated oil component is less than 1%, the speed dependency becomes high, and if it exceeds 5% by weight, the transition property is high, and the roller is smeared or migrated to the adhesive surface during the processing of the adhesive to cause adhesion. The peeling force is lowered, and the like.
本發明中,以日東電工股份公司製No.31B膠帶所為之殘留接著率係以80%以上者為佳,更佳為85%以上。殘留接著率若低於80%,則移行性高,在黏著劑加工時會弄髒輥或移行至黏著劑面,發生黏著剝離力降低等。 In the present invention, the residual adhesion ratio of the No. 31B tape manufactured by Nitto Denko Corporation is preferably 80% or more, more preferably 85% or more. When the residual adhesion ratio is less than 80%, the migration property is high, and the roller is smeared or moved to the adhesive surface during the processing of the adhesive, and the adhesive peeling force is lowered.
本發明中,係以日東電工股份公司製No.31B膠帶所為以300mm/分的剝離力為10~20mN/cm者佳。以300mm/分之剝離力若超過20mN/cm,則將離型薄膜從黏著劑剝離時,會有無法完美地剝離之不良狀況發生。 In the present invention, the No. 31B tape manufactured by Nitto Denko Corporation is preferably used at a peeling force of 300 mm/min of 10 to 20 mN/cm. When the peeling force of 300 mm/min is more than 20 mN/cm, when the release film is peeled off from the adhesive, there is a problem that the release film cannot be perfectly peeled off.
本發明中,係以日東電工股份公司製No.31B膠帶所為以30000mm/分的剝離力未達80mN/cm者佳。以30000mm/分之剝離力若超過80mN/cm,將離型薄膜以高速自黏著劑剝離時,會有無法完美地剝離之不良狀況發生。 In the present invention, it is preferred that the No. 31B tape manufactured by Nitto Denko Co., Ltd. has a peeling force of less than 80 mN/cm at 30,000 mm/min. When the peeling force of 30,000 mm/min is more than 80 mN/cm, when the release film is peeled off at a high speed from the adhesive, a problem that the peeling film cannot be peeled off perfectly may occur.
硬化型聚矽氧樹脂的種類方面,可使用加成型、縮合型、紫外線硬化型、電子線硬化型、無溶劑型等,任一硬化反應形式均可。要舉具體例的話,可例示出信越化學工業(股)製KS-774、KS-775、KS-778、KS-779H、KS-847H、KS-856、X-62-2422、X-62-2461、X- 62-1387、X-62-5039、X-62-5040、KNS-3051、X-62-1496、KNS320A、KNS316、X-62-1574A/B、X-62-7052、X-62-7028A/B、X-62-7619、X-62-7213、X-62-2829、Momentive Performance Materials製YSR-3022、TPR-6700、TPR-6720、TPR-6721、TPR6500、TPR6501、UV9300、UV9425、XS56-A2775、XS56-A2982、XS56-C6010、XS56-C4880、UV9430、TPR6600、TPR6604、TPR6605、Dow Corning Toray(股)製SRX357、SRX211、SD7220、SD7292、LTC750A、LTC760A、LTC303E、LTC300B、LTC856、SP7259、BY24-468C、SP7248S、BY24-452、DKQ3-202、DKQ3-203、DKQ3-204、DKQ3-205、DKQ3-210等。再者,為了調整離型層之剝離性等,亦可併用剝離控制劑。 As the type of the curable polyoxynoxy resin, any of the hardening reaction forms, such as addition molding, condensation type, ultraviolet curing type, electron beam curing type, and solventless type, can be used. For specific examples, KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-856, X-62-2422, and X-62- can be exemplified by Shin-Etsu Chemical Co., Ltd. 2461, X- 62-1387, X-62-5039, X-62-5040, KNS-3051, X-62-1496, KNS320A, KNS316, X-62-1574A/B, X-62-7052, X-62-7028A/ B, X-62-7619, X-62-7213, X-62-2829, Momentive Performance Materials YSR-3022, TPR-6700, TPR-6720, TPR-6721, TPR6500, TPR6501, UV9300, UV9425, XS56- A2775, XS56-A2982, XS56-C6010, XS56-C4880, UV9430, TPR6600, TPR6604, TPR6605, Dow Corning Toray SRX357, SRX211, SD7220, SD7292, LTC750A, LTC760A, LTC303E, LTC300B, LTC856, SP7259, BY24 -468C, SP7248S, BY24-452, DKQ3-202, DKQ3-203, DKQ3-204, DKQ3-205, DKQ3-210, etc. Further, in order to adjust the peeling property of the release layer or the like, a release controlling agent may be used in combination.
本發明中,於聚酯薄膜設置離型層之方法方面,係可使用反向輥筒塗佈、凹版塗佈、棒塗佈、刮片塗佈等以往公知的塗佈方式。本發明中之離型層之塗佈量通常為0.01~1g/m2之範圍。 In the present invention, a conventionally known coating method such as reverse roll coating, gravure coating, bar coating, or blade coating can be used for the method of providing the release layer of the polyester film. The coating amount of the release layer in the present invention is usually in the range of 0.01 to 1 g/m 2 .
本發明中,在未設置離型層之面上,亦可設置接著層、抗靜電層、寡聚物析出防止層等之塗佈層,又可對聚酯薄膜施予電暈處理、電漿處理等之表面處理。 In the present invention, a coating layer such as an adhesive layer, an antistatic layer, an oligomer precipitation preventing layer or the like may be provided on the surface on which the release layer is not provided, and a corona treatment and a plasma may be applied to the polyester film. Surface treatment such as processing.
本發明中之聚酯薄膜,為使離型層美觀且堅固,可使用促進加成型之反應的鉑系觸媒。本成分方面,可例示出氯化鉑酸、氯化鉑酸之醇溶液、氯化鉑酸與烯烴之錯合物;氯化鉑酸與烯基矽氧烷之錯合物等之鉑系化合 物;鉑黑、擔持有鉑之氧化矽、擔持有鉑之活性碳。離型層中的鉑系觸媒含量通常為0.3~3.0重量%、較佳為0.5~2.0重量%之範圍。離型層中的鉑系觸媒含量較0.3重量%更低時,會有剝離力不良的情況或在塗佈層的硬化反應會不足,而有面狀惡化等之不良的情況發生,此外,離型層中的鉑系觸媒含量超過3.0重量%時,會花費成本,又反應性高,會有膠體異物產生等之步驟不良的情況發生。 In the polyester film of the present invention, in order to make the release layer beautiful and strong, a platinum-based catalyst which promotes the reaction of the addition molding can be used. Examples of the component include platinum chloride acid, an alcohol solution of chloroplatinic acid, a complex of chloroplatinic acid and an olefin, and a platinum compound of a complex of a platinum chloride acid and an alkenyl siloxane. Platinum black, ruthenium oxide bearing platinum, and activated carbon holding platinum. The content of the platinum-based catalyst in the release layer is usually in the range of 0.3 to 3.0% by weight, preferably 0.5 to 2.0% by weight. When the content of the platinum-based catalyst in the release layer is lower than 0.3% by weight, the peeling force may be poor, or the hardening reaction in the coating layer may be insufficient, and the surface may be deteriorated, and the like may occur. When the content of the platinum-based catalyst in the release layer exceeds 3.0% by weight, the cost is high and the reactivity is high, and a step such as generation of colloidal foreign matter may occur.
又,加成型之反應因反應性非常地高,所以視情況可添加乙炔醇作為反應抑制劑。其成分為具有碳-碳三鍵與羥基之有機化合物,較佳為由3-甲基-1-丁炔-3-醇、3,5-二甲基-1-己炔-3-醇及苯基丁炔醇所成之群選出的化合物。 Further, since the reaction of addition molding is extremely high in reactivity, acetylene alcohol may be added as a reaction inhibitor as the case may be. The composition is an organic compound having a carbon-carbon triple bond and a hydroxyl group, preferably 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol and A selected group of phenylbutynols.
本發明中所謂的剝離力,意指將兩面黏著膠帶(日東電工製「No.31B」)貼附於離型層面,放置在室溫1小時後,以與基材薄膜剝離角度180°、任意之拉伸速度將膠帶剝離時,用拉伸試驗機測定之值。本發明中,調整特定的剝離力之方法雖可藉由選擇離型層中的組成來達成,但也可採用其他手段,主要是將聚矽氧離型層之離型劑的種類依所期望的剝離力來變更者佳,再者,剝離力因大幅地依賴使用的離型劑之塗佈量,所以以調整該離型劑之塗佈量的方法又更佳。 The peeling force in the present invention means that the double-sided adhesive tape ("No. 31B" manufactured by Nitto Denko Corporation) is attached to the release layer, and after being left at room temperature for one hour, the peeling angle is 180° with the base film. When the tape was peeled off, the value was measured by a tensile tester. In the present invention, the method of adjusting the specific peeling force can be achieved by selecting the composition in the release layer, but other means can be used, mainly depending on the type of the release agent of the polyfluorinated release layer. The peeling force is preferably changed. Further, since the peeling force largely depends on the amount of the release agent to be used, it is more preferable to adjust the coating amount of the release agent.
本發明中之聚酯薄膜的剝離力之值,在300mm/分速度區域之低速剝離力通常為10~20mN/cm之範圍。該剝離力未達10mN/cm時,剝離力過輕,會有本來 不必剝離的情況也容易剝離之不良狀況發生。剝離力超過20mN/cm時,剝離力重者其離型薄膜之剝離力差變小,剝離步驟時會發生不良狀況,剝離力重者,其離型薄膜的決定幅度會變小。 The value of the peeling force of the polyester film of the present invention is usually in the range of 10 to 20 mN/cm at a low speed peeling force in a region of 300 mm/min. When the peeling force is less than 10 mN/cm, the peeling force is too light, and there will be originally In the case where it is not necessary to peel off, the defective condition which is easily peeled off occurs. When the peeling force exceeds 20 mN/cm, the difference in peeling force of the release film is small when the peeling force is heavy, and a problem occurs in the peeling step, and the peeling force is large, and the determined range of the release film is small.
再者,在考慮加工性之60000mm/分速度區域的高速剝離力通常為90mN/cm以下。該剝離力大於90mN/cm時,剝離力重者其離型薄膜之剝離力差會變小,剝離步驟時無法順利剝離,會連黏著劑整個都剝下。 Further, the high-speed peeling force in the region of the speed of 60,000 mm/min in consideration of workability is usually 90 mN/cm or less. When the peeling force is more than 90 mN/cm, the peeling force of the release film is small, and the peeling force difference is small, and the peeling step cannot be smoothly peeled off, and the entire adhesive is peeled off.
將本發明之離型薄膜予以熱處理(180℃、10分鐘)之後,藉由二甲基甲醯胺而自離型層表面所抽出之聚酯的寡聚物量(OL)通常為2.0mg/m2以下、較佳為1.0mg/m2以下。OL超過2.0mg/m2時,例如,在液晶構成構件製造時,用於黏著劑層保護用途的情況下,會有黏著劑之透明性降低、黏著劑層之黏著力降低或伴隨光學評價之檢査步驟中有阻礙等之不良狀況發生。 After the release film of the present invention is subjected to heat treatment (180 ° C, 10 minutes), the amount of the oligomer (OL) of the polyester extracted from the surface of the release layer by dimethylformamide is usually 2.0 mg/m. 2 or less, preferably 1.0 mg/m 2 or less. When the OL exceeds 2.0 mg/m 2 , for example, when the liquid crystal constituent member is used for the purpose of protecting the adhesive layer, the transparency of the adhesive may be lowered, the adhesive force of the adhesive layer may be lowered, or the optical evaluation may be accompanied. In the inspection step, there are obstacles such as obstacles.
本發明中之離型薄膜,為了使OL滿足上述範圍,塗佈層中所含的鋁元素量方面,係使用螢光X線測定裝置並以FP(Fundamental Parameter Method)法測定之值為0.2kcps以上、更佳為0.5kcps以上、特別佳為0.8kcps以上。鋁元素量未達0.2kcps時,會有無法獲得所期望的寡聚物封止性能之情況。 In the release film of the present invention, in order to make OL satisfy the above range, the amount of aluminum element contained in the coating layer is 0.2 kcps by a fluorescent X-ray measuring apparatus and measured by a FP (Fundamental Parameter Method) method. The above, more preferably 0.5 kcps or more, particularly preferably 0.8 kcps or more. When the amount of aluminum element is less than 0.2 kcps, the desired oligomer sealing performance may not be obtained.
本發明中所謂的「寡聚物」,乃定義為熱處理後,結晶化而析出於薄膜表面之聚酯的低分子量物之中的環狀三量體。 The "oligomer" in the present invention is defined as a cyclic triad in a low molecular weight product of a polyester which is crystallized and precipitated on the surface of the film after heat treatment.
本發明中構成2種離型薄膜(以下稱剝離力小者為第1離型薄膜、剝離力大者為第2離型薄膜)之聚酯薄膜可為單層構成或積層構成,例如,除了2層、3層構成以外,在不超過本發明之要旨下,也可為4層或其以上之多層,並未特別受限。 In the present invention, the polyester film constituting the two release films (hereinafter referred to as the first release film having a small peeling force and the second release film having a large peeling force) may be a single layer structure or a laminated structure, for example, In addition to the two-layer and three-layer configuration, a layer of four or more layers may be used without exceeding the gist of the present invention, and is not particularly limited.
本發明中,使用於聚酯薄膜之聚酯,可為同質聚酯或共聚聚酯。由同質聚酯所成時,係以使芳香族二羧酸與脂肪族二醇聚縮合所得者為佳。 In the present invention, the polyester used in the polyester film may be a homopolyester or a copolyester. When it is made of a homopolyester, it is preferable to obtain a polycondensation of an aromatic dicarboxylic acid and an aliphatic diol.
芳香族二羧酸方面,可舉出對苯二甲酸、2,6-萘二羧酸等,脂肪族二醇方面,可舉出乙二醇、二乙二醇、1,4-環己烷二甲醇等。 Examples of the aromatic dicarboxylic acid include terephthalic acid and 2,6-naphthalenedicarboxylic acid, and examples of the aliphatic diol include ethylene glycol, diethylene glycol, and 1,4-cyclohexane. Dimethanol and the like.
代表的聚酯方面,可例示出聚對苯二甲酸乙二醇酯(PET)等。 As the polyester represented, polyethylene terephthalate (PET) or the like can be exemplified.
此外,共聚聚酯之二羧酸成分方面,可舉出間苯二甲酸、鄰苯二甲酸、對苯二甲酸、2,6-萘二羧酸、己二酸、癸二酸、氧基羧酸(例如,P-氧基安息香酸等)等之1種或2種以上,二醇成分方面,可舉出乙二醇、二乙二醇、丙二醇、丁烷二醇、1,4-環己烷二甲醇、新戊二醇等之1種或2種以上。不管如何,本發明中所謂的聚酯通常指60莫耳%以上、較佳為80莫耳%以上為對苯二甲酸乙二醇酯單位之聚對苯二甲酸乙二醇酯等的聚酯。 Further, examples of the dicarboxylic acid component of the copolyester include isophthalic acid, phthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, adipic acid, sebacic acid, and oxycarboxylate. One or two or more kinds of the acid (for example, P-oxybenzoic acid), and examples of the diol component include ethylene glycol, diethylene glycol, propylene glycol, butanediol, and 1,4-ring. One or two or more kinds of hexane dimethanol or neopentyl glycol. In any case, the polyester in the present invention generally means a polyester such as polyethylene terephthalate having a content of 60 mol% or more, preferably 80 mol% or more. .
本發明中,聚酯層中,以賦予易滑性為主要 目的方面,係以摻合粒子者佳。摻合之粒子的種類,若為可賦予易滑性之粒子即可,並未特別受限,具體例方面,可舉例如氧化矽、碳酸鈣、碳酸鎂、碳酸鋇、硫酸鈣、磷酸鈣、磷酸鎂、高嶺土、氧化鋁、氧化鈦等之粒子。又,亦可使用日本特公昭59-5216號公報、日本特開昭59-217755號公報等所載之耐熱性有機粒子。其他的耐熱性有機粒子之例,可舉出熱硬化性尿素樹脂、熱硬化性苯酚樹脂、熱硬化性環氧樹脂、苯并三聚氰二胺樹脂等。再者,聚酯製造步驟中,亦可使用使觸媒等之金屬化合物的一部分沈澱、微分散所成之析出粒子。 In the present invention, the polyester layer is mainly provided with imparting slipperiness. In terms of purpose, it is better to blend particles. The type of the particles to be blended is not particularly limited as long as it imparts slipperiness, and specific examples thereof include cerium oxide, calcium carbonate, magnesium carbonate, barium carbonate, calcium sulfate, and calcium phosphate. Particles such as magnesium phosphate, kaolin, alumina, and titanium oxide. Further, heat-resistant organic particles contained in JP-A-59-5216, JP-A-59-217755, and the like can be used. Examples of the other heat-resistant organic particles include a thermosetting urea resin, a thermosetting phenol resin, a thermosetting epoxy resin, and a benzoguanamine resin. Further, in the polyester production step, precipitated particles obtained by precipitating and finely dispersing a part of the metal compound such as a catalyst may be used.
此外,有關所使用之粒子的形狀並無特別限定,可使用球狀、塊狀、棒狀、扁平狀等之任一者。又,關於其硬度、比重、顏色等亦無特別限制。此等一系列的粒子,可因應需要而併用2種類以上。 Further, the shape of the particles to be used is not particularly limited, and any of a spherical shape, a block shape, a rod shape, and a flat shape may be used. Further, there is no particular limitation on the hardness, specific gravity, color, and the like. These series of particles can be used in combination of two or more types as needed.
又,所用的粒子的平均粒徑通常為0.01~3μm、較佳為0.01~1μm之範圍。平均粒徑未達0.01μm時,會有粒子容易凝聚且分散性不足的情況,此外,超過3μm時,薄膜之表面粗度會變得過粗,之後的步驟中,在塗佈設置有離型層時等,會有不良狀況發生的情況。 Further, the average particle diameter of the particles to be used is usually in the range of 0.01 to 3 μm, preferably 0.01 to 1 μm. When the average particle diameter is less than 0.01 μm, the particles tend to aggregate and the dispersibility is insufficient. Further, when the thickness exceeds 3 μm, the surface roughness of the film becomes too thick, and in the subsequent step, the coating is provided with a release type. When there is a layer, there is a case where a bad condition occurs.
再者,聚酯層中的粒子含量通常為0.001~5重量%、較佳為0.005~3重量%之範圍。粒子含量未達0.001重量%時,會有薄膜的易滑性不足的情況,此外,添加超過5重量%時,會有薄膜的透明性不足的情況。 Further, the content of the particles in the polyester layer is usually in the range of 0.001 to 5% by weight, preferably 0.005 to 3% by weight. When the content of the particles is less than 0.001% by weight, the slipperiness of the film may be insufficient, and when it is added in an amount of more than 5% by weight, the transparency of the film may be insufficient.
在聚酯層中添加粒子之方法方面,並未特別 受限,可採用以往公知的方法。例如,雖可於製造構成各層之聚酯的任意階段中添加,但較佳為於酯化的階段或酯交換反應終了後,進行聚縮合反應者。 There is no special way to add particles to the polyester layer. Restricted, a conventionally known method can be employed. For example, although it may be added at any stage of producing the polyester constituting each layer, it is preferred to carry out the polycondensation reaction after the stage of esterification or after the end of the transesterification reaction.
又,可藉由下述方法來進行:使用附換氣裝置之混練壓出機,以使其分散於乙二醇或水等之粒子的漿料與聚酯原料進行摻混之方法、或使用混練壓出機,將已乾燥之粒子與聚酯原料進行摻混之方法等。 Further, the method may be carried out by using a kneading extruder equipped with a gas exchange device to blend a slurry of particles such as ethylene glycol or water with a polyester raw material, or using A method in which a kneading extruder is used to blend dried particles with a polyester raw material.
此外,本發明之聚酯薄膜中,除了上述之粒子以外,尚可因應需要而添加以往公知的抗氧化劑、抗靜電劑、熱安定劑、潤滑劑、染料、顏料等。 Further, in the polyester film of the present invention, in addition to the above-mentioned particles, conventionally known antioxidants, antistatic agents, thermal stabilizers, lubricants, dyes, pigments and the like may be added as needed.
構成本發明之第1離型薄膜及第2離型薄膜之聚酯薄膜的厚度,若為可製膜為薄膜之範圍即可,並未特別受限。在第1離型薄膜中通常為25~75μm、較佳為38~75μm之範圍。此外,在第2離型薄膜中通常為25~250μm、較佳為38~188μm、更佳為50~125μm之範圍。 The thickness of the polyester film constituting the first release film and the second release film of the present invention is not particularly limited as long as it can be formed into a film. The first release film is usually in the range of 25 to 75 μm, preferably 38 to 75 μm. Further, the second release film is usually in the range of 25 to 250 μm, preferably 38 to 188 μm, more preferably 50 to 125 μm.
接著,以下將具體地說明本發明中之聚酯薄膜的製造例,但並不受限於下述之製造例中。 Next, a production example of the polyester film in the present invention will be specifically described below, but is not limited to the production examples described below.
首先,係以使用前述聚酯原料,將由噴嘴壓出之熔融薄片以冷卻輥冷卻固化而得未延伸薄片之方法為佳。此時,為使薄片的平面性提昇,有必要提高薄片與旋轉冷卻桶之密著性,較佳可採用外加靜電密著法及/或液體塗佈密著法。接著,所得之未延伸薄片係可向二軸方向延伸。此時,首先將前述的未延伸薄片在單一方向上藉由輥或拉幅機方式之延伸機進行延伸。延伸溫度通常為70 ~120℃、較佳為80~110℃,延伸倍率通常為2.5~7倍,較佳為3.0~6倍。接著,與第一階段的延伸方向垂直之延伸溫度通常為70~170℃,延伸倍率通常為3.0~7倍,較佳為3.5~6倍。然後,繼續以180~270℃之溫度在緊繃下或30%以內的鬆弛下進行熱處理,得到二軸配向薄膜。上述延伸中,可採用將單一方向之延伸以2階段以上進行之方法。此時,最終係以使二方向之延伸倍率個別為上述範圍之方式來進行者為佳。 First, it is preferred to use a method in which the above-mentioned polyester raw material is used, and a molten sheet extruded from a nozzle is cooled and solidified by a cooling roll to obtain an unstretched sheet. At this time, in order to improve the planarity of the sheet, it is necessary to improve the adhesion between the sheet and the rotary cooling barrel, and it is preferable to employ an external electrostatic adhesion method and/or a liquid coating adhesion method. Next, the resulting unstretched sheet can be extended in the biaxial direction. At this time, the aforementioned unstretched sheet is first stretched in a single direction by a roll or tenter type stretching machine. The extension temperature is usually 70 ~120 ° C, preferably 80 ~ 110 ° C, the stretching ratio is usually 2.5 to 7 times, preferably 3.0 to 6 times. Then, the extension temperature perpendicular to the extending direction of the first stage is usually 70 to 170 ° C, and the stretching ratio is usually 3.0 to 7 times, preferably 3.5 to 6 times. Then, heat treatment is continued at a temperature of 180 to 270 ° C under tension or within 30% to obtain a biaxial alignment film. In the above extension, a method of performing the extension in a single direction in two or more stages may be employed. In this case, it is preferable that the stretching ratio in the two directions is individually set to the above range.
又,有關本發明中之聚酯薄膜製造,亦可採用同時二軸延伸法。同時二軸延伸法乃是將前述的未延伸薄片以通常70~120℃、較佳為80~110℃之溫控狀態於機械方向及寬幅方向同時延伸並使其配向之方法,其延伸倍率方面,以面積倍率計為4~50倍,較佳為7~35倍,更佳為10~25倍。然後,繼續以170~250℃之溫度在緊繃下或30%以內的鬆弛下進行熱處理,得到延伸配向薄膜。有關採用上述延伸方式之同時二軸延伸裝置,可採用螺槳方式、集電弓方式、線性驅動方式等之以往公知的延伸方式。 Further, in the production of the polyester film of the present invention, a simultaneous biaxial stretching method can also be employed. At the same time, the biaxial stretching method is a method in which the unstretched sheet is simultaneously extended and aligned in the mechanical direction and the wide direction in a temperature control state of usually 70 to 120 ° C, preferably 80 to 110 ° C, and the stretching ratio thereof is extended. In terms of area magnification, it is 4 to 50 times, preferably 7 to 35 times, more preferably 10 to 25 times. Then, heat treatment is continued at a temperature of 170 to 250 ° C under tension or within 30% to obtain an extended alignment film. Regarding the simultaneous biaxial stretching device using the above extension method, a conventionally known extension method such as a propeller method, a pantograph method, or a linear driving method can be employed.
再來,可於上述聚酯薄膜的延伸步驟中,實施處理薄膜表面之塗佈延伸法(線內塗佈)。藉由塗佈延伸法而於聚酯薄膜上設置塗佈層時,係可於可延伸同時塗佈時一起將塗佈層之厚度因應延伸倍率而變薄,能製作適合作為聚酯薄膜之薄膜。 Further, in the step of extending the polyester film, a coating stretching method (in-line coating) for treating the surface of the film can be carried out. When the coating layer is provided on the polyester film by the coating stretching method, the thickness of the coating layer can be thinned together with the stretching ratio when it is stretchable and simultaneously coated, and a film suitable as a polyester film can be produced. .
接著,就構成本發明中之離型薄膜的塗佈層 進行說明。 Next, it constitutes a coating layer of the release film in the present invention. Be explained.
構成本發明中之離型薄膜的塗佈層,為了增進防帶電性、寡聚物析出防止性,係含有導電性化合物(A)。該導電性化合物(A)方面,係以使噻吩或噻吩衍生物單獨或共聚所得之聚合物為佳,特別是以在由噻吩或噻吩衍生物所成的化合物中摻雜有其他陰離子化合物者,或是於化合物中摻雜有本身具有陰離子基者,因顯示出優異的導電性而較佳。該化合物(A)方面,可例示如將下述式(1)或(2)之化合物於聚陰離子的存在下聚合所得者。 The coating layer constituting the release film of the present invention contains the conductive compound (A) in order to enhance the antistatic property and the prevention of the precipitation of the oligomer. In the aspect of the conductive compound (A), a polymer obtained by separately or copolymerizing a thiophene or a thiophene derivative is preferred, and in particular, a compound obtained from a thiophene or a thiophene derivative is doped with another anionic compound. It is preferable to dope the compound with an anion group itself, since it exhibits excellent conductivity. In the case of the compound (A), those obtained by polymerizing a compound of the following formula (1) or (2) in the presence of a polyanion can be exemplified.
上述式(1)中,R1、R2各自獨立地表示氫元素、碳數1~12之脂肪族烴基、脂環族烴基或芳香族烴基,例如甲基、乙基、丙基、異丙基、丁基、環伸己基、苯基等。 In the above formula (1), R 1 and R 2 each independently represent a hydrogen element, an aliphatic hydrocarbon group having 1 to 12 carbon atoms, an alicyclic hydrocarbon group or an aromatic hydrocarbon group such as a methyl group, an ethyl group, a propyl group or an isopropyl group. Base, butyl, cyclohexyl, phenyl, and the like.
上述式(2)中,n為1~4之整數。 In the above formula (2), n is an integer of 1 to 4.
本發明之離型薄膜中,係以使用由化2所示之構造式而成的聚噻吩或聚噻吩衍生物者佳,例如以化2中n=1(亞甲基)、n=2(伸乙基)、n=3(伸丙基)之化合物為佳。其中,特別佳為n=2之伸乙基的化合物,即,聚-3,4-伸乙基二氧基噻吩。聚噻吩或聚噻吩衍生物方面,可例示如在噻吩環之3位與4位的位置上有官能基鍵結之化合物。如上述,係以在3位與4位之碳原子上鍵結了氧原子之化合物為佳。有關具有於該碳原子上直接鍵結了碳原子或氫原子之構造的化合物,會有塗佈液不易水性化的情況。 In the release film of the present invention, it is preferred to use a polythiophene or a polythiophene derivative obtained by the structural formula shown by Chemical Formula 2, for example, in the case of 2, n=1 (methylene), n=2 ( Compounds having an ethyl group and n = 3 (extended propyl) are preferred. Among them, a compound of ethyl group having n = 2, that is, poly-3,4-extended ethyldioxythiophene is particularly preferable. As the polythiophene or polythiophene derivative, a compound having a functional group bonded at the 3-position and 4-position positions of the thiophene ring can be exemplified. As described above, a compound in which an oxygen atom is bonded to a carbon atom at the 3 position and the 4 position is preferred. The compound having a structure in which a carbon atom or a hydrogen atom is directly bonded to the carbon atom may be difficult to be aqueous.
聚合時使用的聚陰離子方面,可例示如聚(甲基)丙烯酸、聚馬來酸、聚苯乙烯磺酸等。又此等之酸可一部分或全部被中和。 Examples of the polyanion used in the polymerization include poly(meth)acrylic acid, polymaleic acid, polystyrenesulfonic acid, and the like. Again, these acids may be partially or completely neutralized.
此外,該聚合物的製造方法方面,例如可採用日本特開平7-90060號公報中所示之方法。 Further, as a method of producing the polymer, for example, a method shown in Japanese Laid-Open Patent Publication No. Hei 7-90060 can be employed.
本發明中,特別佳的樣態方面,可舉出於上述式(2)之化合物中n=2、使用聚苯乙烯磺酸作為聚陰離子者。 In the present invention, particularly preferred aspects are those in which the compound of the above formula (2) has n = 2 and polystyrene sulfonic acid is used as the polyanion.
構成本發明中之離型薄膜的塗佈層,係以含有上述導電性化合物與黏合劑聚合物為必須要件者。 The coating layer constituting the release film of the present invention is required to contain the above-mentioned conductive compound and binder polymer.
構成本發明中之塗佈層之黏合劑聚合物(B),乃定義為依據高分子化合物安全性評價流程圖(日本昭和60年11月化學物質審議會主催),以膠體滲透層析(GPC)測定之數平均分子量(Mn)為1000以上之高分子化合物,且具有造膜性者。 The binder polymer (B) constituting the coating layer in the present invention is defined as a flow chart for the safety evaluation of a polymer compound (mainly reminded by the Chemical Substance Review Meeting of the Showa 60, Japan), by colloidal permeation chromatography (GPC). A polymer compound having a number average molecular weight (Mn) of 1,000 or more and having a film-forming property.
構成本發明中之塗佈層之黏合劑聚合物(B)方面,若為可與噻吩或噻吩衍生物相溶或可混合分散即可,可為熱硬化性樹脂或熱可塑性樹脂。可具例如,聚對苯二甲酸乙二醇酯、聚對苯二甲酸丁二醇酯、聚萘二甲酸乙二醇酯等之聚酯;聚醯亞胺、聚醯胺醯亞胺等之聚醯亞胺;聚醯胺6、聚醯胺6,6、聚醯胺12、聚醯胺11等之聚醯胺;聚氟化亞乙烯、聚氟化乙烯基、聚四氟乙烯、乙烯四氟乙烯共聚物、聚氯三氟乙烯等之氟樹脂;聚乙烯基醇、聚乙烯基醚、聚乙烯基丁縮醛、聚乙酸乙烯基、聚氯化乙烯基等之乙烯基樹脂;環氧樹脂;環氧丙烷樹脂;二甲苯樹脂;芳香族聚醯胺樹脂;聚醯亞胺聚矽氧;聚胺基甲酸酯;聚脲;三聚氰胺樹脂;苯酚樹脂;聚醚;丙烯醯基樹脂及此等之共聚物等。 The binder polymer (B) constituting the coating layer in the present invention may be a thermosetting resin or a thermoplastic resin if it is compatible with the thiophene or the thiophene derivative or may be mixed and dispersed. For example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.; polyimine, polyamidimide, etc. Polyimine; polyamido 6, polyamine 6,6, polyamide 12, polyamide amine, etc.; polyfluorinated vinylidene, polyfluorinated vinyl, polytetrafluoroethylene, ethylene a fluororesin such as a tetrafluoroethylene copolymer or a polychlorotrifluoroethylene; a vinyl resin such as polyvinyl alcohol, polyvinyl ether, polyvinyl butyral, polyvinyl acetate or polyvinyl chloride; Oxygen resin; propylene oxide resin; xylene resin; aromatic polyamide resin; polyimine polyoxyl; polyurethane; polyurea; melamine resin; phenol resin; polyether; And such copolymers and the like.
塗佈層中之導電性化合物(A)之摻合比例為10~90重量%、較佳為20~80重量%。未達10重量%時,會有防帶電性及寡聚物析出防止性不足的情況。此外,若超過80重量%,則防帶電性既已於飽和狀態,即 使有該值以上的增量,也會有難以獲得顯著效果的情況。 The blending ratio of the conductive compound (A) in the coating layer is from 10 to 90% by weight, preferably from 20 to 80% by weight. When it is less than 10% by weight, there is a case where the antistatic property and the oligomer precipitation preventing property are insufficient. In addition, if it exceeds 80% by weight, the antistatic property is already in a saturated state, that is, In the case of increments above this value, there are cases where it is difficult to obtain a significant effect.
此等黏合劑聚合物(B)亦可溶解於有機溶劑,且賦予磺酸基或羧基等之官能基而得以水溶液化。又,黏合劑聚合物(B)中,可因應需要而併用交聯劑、聚合起始劑等之硬化劑、聚合促進劑、溶劑、黏度調整劑等。 These binder polymers (B) can also be dissolved in an organic solvent, and can impart an aqueous solution by imparting a functional group such as a sulfonic acid group or a carboxyl group. Further, in the binder polymer (B), a curing agent such as a crosslinking agent or a polymerization initiator, a polymerization accelerator, a solvent, a viscosity adjuster, or the like may be used in combination.
前述黏合劑聚合物(B)之中,為使塗佈液製作時容易混合,係以由聚酯樹脂、丙烯醯基樹脂、聚胺基甲酸酯樹脂之中選出任1種類以上為佳。特別是以聚胺基甲酸酯樹脂為佳。 In the above-mentioned binder polymer (B), it is preferred to select one or more of the polyester resin, the acryl resin, and the polyurethane resin in order to facilitate the mixing of the coating liquid. In particular, a polyurethane resin is preferred.
本發明中使用的聚酯樹脂,乃定義為使二羧酸成分與二醇成分作為構成成分之線狀聚酯。二羧酸成分方面,可例示出對苯二甲酸、間苯二甲酸、鄰苯二甲酸、2,6-萘二羧酸、4,4-二苯基二羧酸、1,4-環己烷二羧酸、己二酸、癸二酸、苯基二氫茚二羧酸、二聚酸等。此等之成分係可使用2種以上。再者,可與此等之成分一起少比例地使用如馬來酸、延胡索酸、伊康酸等之不飽和多元酸或如p-羥基安息香酸、p-(β-羥基乙氧基)安息香酸等之羥基羧酸。不飽和多元酸成分或羥基羧酸成分的比例,高為10莫耳%、較佳為5莫耳%以下。 The polyester resin used in the present invention is defined as a linear polyester having a dicarboxylic acid component and a diol component as constituent components. Examples of the dicarboxylic acid component include terephthalic acid, isophthalic acid, phthalic acid, 2,6-naphthalene dicarboxylic acid, 4,4-diphenyldicarboxylic acid, and 1,4-cyclohexane. Alkanedicarboxylic acid, adipic acid, sebacic acid, phenyldihydroindole dicarboxylic acid, dimer acid, and the like. These components can be used in two or more types. Further, an unsaturated polybasic acid such as maleic acid, fumaric acid, itaconic acid or the like or p-hydroxybenzoic acid, p-(β-hydroxyethoxy)benzoic acid may be used in a small proportion together with these components. The hydroxycarboxylic acid. The ratio of the unsaturated polybasic acid component or the hydroxycarboxylic acid component is 10 mol% or more, preferably 5 mol% or less.
又,二醇成分方面,可例示出乙二醇、1,4-丁烷二醇、新戊二醇、二乙二醇、二丙二醇、1,6-己烷二醇、1,4-環己烷二甲醇、二甲伸苯基二醇、二羥甲基丙酸、丙三醇、三羥甲基丙烷、聚(乙烯氧基)二醇、聚 (四亞甲基氧基)二醇、雙酚A之環氧烷加成物、氫化雙酚A之環氧烷加成物等。此等可使用2種以上。 Further, examples of the diol component include ethylene glycol, 1,4-butanediol, neopentyl glycol, diethylene glycol, dipropylene glycol, 1,6-hexanediol, and 1,4-ring. Hexane dimethanol, dimethyl phenyl diol, dimethylol propionic acid, glycerol, trimethylolpropane, poly(ethyleneoxy) diol, poly (tetramethyleneoxy) diol, an alkylene oxide adduct of bisphenol A, an alkylene oxide adduct of hydrogenated bisphenol A, and the like. These can be used in two or more types.
該多元醇成分之中,更以乙二醇、雙酚A之氧化乙烯加成物或氧化丙烯加成物、1,4-丁烷二醇為佳,其中再以乙二醇、雙酚A之氧化乙烯加成物或氧化丙烯加成物為佳。又,前述聚酯樹脂中,為了使水性液化容易,可使若干量的具磺酸鹽基之化合物或具羧酸鹽基之化合物共聚,且以其為佳。此具磺酸鹽基之化合物方面,較佳可舉例如5-鈉磺酸基間苯二甲酸、5-銨磺酸基間苯二甲酸、4-鈉磺酸基間苯二甲酸、4-甲基銨磺酸基間苯二甲酸、2-鈉磺酸基間苯二甲酸、5-鉀磺酸基間苯二甲酸、4-鉀磺酸基間苯二甲酸、2-鉀磺酸基間苯二甲酸、鈉磺酸基琥珀酸等之磺酸鹼金屬鹽系或磺酸胺鹽系化合物等。 Among the polyol components, ethylene glycol, ethylene oxide adduct of bisphenol A or propylene oxide adduct, 1,4-butanediol is preferred, and ethylene glycol and bisphenol A are further included. The ethylene oxide adduct or the propylene oxide adduct is preferred. Further, in the polyester resin, in order to facilitate aqueous liquefaction, a certain amount of a compound having a sulfonate group or a compound having a carboxylate group may be copolymerized, and it is preferred. The compound having a sulfonate group is preferably, for example, 5-sodium sulfoisophthalic acid, 5-ammonium sulfoisophthalic acid, 4-sodium sulfoisophthalic acid, or 4- Methylammonium sulfoisophthalate, 2-sodium sulfoisophthalate, 5-potassium sulfoisophthalate, 4-potassium sulfoisophthalate, 2-potassium sulfonate An alkali metal sulfonate or a sulfonic acid amine salt compound such as isophthalic acid or sodium sulfosuccinate.
此具羧酸鹽基之化合物方面,可舉例如無水偏苯三甲酸、偏苯三甲酸、無水均苯四甲酸、均苯四甲酸、對稱苯三甲酸、環丁烷四羧酸、二羥甲基丙酸等、或此等之單鹼金屬鹽等。此外,游離羧基係於共聚後使鹼金屬化合物或胺化合物作用而為羧酸鹽基。可使用由此等之化合物中各自適當地選出1種以上,藉由常法之聚縮合反應予以合成而得之聚酯。 Examples of the compound having a carboxylate group include anhydrous trimellitic acid, trimellitic acid, anhydrous pyromellitic acid, pyromellitic acid, symmetrical trimellitic acid, cyclobutanetetracarboxylic acid, and dihydroxyl. Propionic acid, etc., or such monoalkali metal salts, and the like. Further, the free carboxyl group is subjected to copolymerization to cause an alkali metal compound or an amine compound to act as a carboxylate group. A polyester obtained by synthesizing one or more of these compounds in a suitable manner and synthesizing them by a conventional polycondensation reaction can be used.
關於聚酯樹脂,其玻璃轉移溫度(以下簡稱為Tg)通常為40℃以上、較佳為60℃以上。Tg未達40℃時,以接著性提昇為目的下,在塗佈層之塗佈厚度為厚的情況時,會有容易封端等之不良狀況發生。 The glass transition temperature (hereinafter abbreviated as Tg) of the polyester resin is usually 40 ° C or higher, preferably 60 ° C or higher. When the Tg is less than 40 ° C, in the case where the coating thickness of the coating layer is thick for the purpose of improving the adhesion, there is a problem that it is easy to seal the end.
丙烯醯基樹脂方面,係如丙烯酸系、甲基丙烯酸系之單體所代表的,乃為由具有碳-碳雙鍵之聚合性單體所成的聚合物。此等可為單獨聚合物或共聚物。又,亦包含該等聚合物與其他聚合物(例如聚酯、聚胺基甲酸酯等)之共聚物。例如,嵌段共聚物、接枝共聚物。再者,也包含於聚酯溶液或聚酯分散液中將具有碳-碳雙鍵之聚合性單體予以聚合所得之聚合物(視情況可為聚合物的混合物)。同樣地,也包含於聚胺基甲酸酯溶液、聚胺基甲酸酯分散液中將具有碳-碳雙鍵之聚合性單體聚合所得之聚合物(視情況可為聚合物的混合物)。同樣地,亦包含於其他聚合物溶液或分散液中將具有碳-碳雙鍵之聚合性單體聚合所得之聚合物(視情況可為聚合物的混合物)。 The acryl-based resin is a polymer composed of a polymerizable monomer having a carbon-carbon double bond, as represented by an acrylic or methacrylic monomer. These may be individual polymers or copolymers. Also included are copolymers of such polymers with other polymers (e.g., polyesters, polyurethanes, etc.). For example, block copolymers, graft copolymers. Further, a polymer obtained by polymerizing a polymerizable monomer having a carbon-carbon double bond in a polyester solution or a polyester dispersion (which may optionally be a mixture of polymers) is also included. Similarly, a polymer obtained by polymerizing a polymerizable monomer having a carbon-carbon double bond in a polyurethane solution or a polyurethane dispersion (which may optionally be a mixture of polymers) is also included. . Similarly, a polymer obtained by polymerizing a polymerizable monomer having a carbon-carbon double bond (which may optionally be a mixture of polymers) is also included in other polymer solutions or dispersions.
上述具有碳-碳雙鍵之聚合性單體方面,雖無特別限定,但代表的化合物方面,如丙烯酸、甲基丙烯酸、巴豆酸、伊康酸、延胡索酸、馬來酸、檸康酸之各種含羧基之單體類及該等之鹽;如2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、4-羥基丁基(甲基)丙烯酸酯、單丁基羥基反丁烯二酸酯、單丁基羥基衣康酸酯之各種含羥基之單體類;如甲基(甲基)丙烯酸酯、乙基(甲基)丙烯酸酯、丙基(甲基)丙烯酸酯、丁基(甲基)丙烯酸酯、月桂基(甲基)丙烯酸酯之各種(甲基)丙烯酸酯類;如(甲基)丙烯醯胺、二丙酮丙烯醯胺、N-羥甲基丙烯醯胺或(甲基)丙烯腈等之各種含氮 之乙烯基系單體類。又,可併用此等而將如以下所示之聚合性單體共聚。即,可例示出如苯乙烯、α-甲基苯乙烯、二乙烯基苯、乙烯基甲苯之各種苯乙烯衍生物;如乙酸乙烯基酯、丙酸乙烯基酯之各種乙烯基酯類;如γ-甲基丙烯醯氧基丙基三甲氧基矽烷、乙烯基三甲氧基矽烷、甲基丙烯醯基矽巨分子單體等之各種含矽之聚合性單體類;含磷之乙烯基系單體類;如氯化乙烯基、氯化亞乙烯、氟化乙烯基、氟化亞乙烯、三氟氯乙烯、四氟乙烯、氯三氟乙烯、六氟丙烯之各種鹵素化乙烯基類;如丁二烯之各種共軛二烯類等。 The polymerizable monomer having a carbon-carbon double bond is not particularly limited, but various compounds such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, fumaric acid, maleic acid, and citraconic acid are various. a carboxyl group-containing monomer and salts thereof; such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, single Various hydroxyl group-containing monomers of butyl hydroxy fumarate, monobutyl hydroxy itaconate; such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (a) Various (meth) acrylates of acrylate, butyl (meth) acrylate, lauryl (meth) acrylate; such as (meth) acrylamide, diacetone acrylamide, N-hydroxyl Various nitrogenous substances such as methacrylamide or (meth)acrylonitrile Vinyl monomer. Further, the polymerizable monomer as shown below can be copolymerized by using these in combination. That is, various styrene derivatives such as styrene, α-methylstyrene, divinylbenzene, and vinyltoluene; various vinyl esters such as vinyl acetate and vinyl propionate; Various fluorene-containing polymerizable monomers such as γ-methyl propylene methoxy propyl trimethoxy decane, vinyl trimethoxy decane, methacryl fluorenyl fluorene macromonomer; Monomers; such as vinyl chloride, vinyl chloride, fluorinated vinyl, vinylidene fluoride, chlorotrifluoroethylene, tetrafluoroethylene, chlorotrifluoroethylene, hexafluoropropylene, various halogenated vinyls; Such as various conjugated dienes of butadiene.
丙烯醯基樹脂中,玻璃轉移溫度(以下簡稱為Tg)通常為40℃以上、較佳為60℃以上。Tg未達40℃時,以接著性提昇為目的下,在塗佈層之塗佈厚度為厚的情況時,會有容易封端等之不良狀況發生。 In the acrylonitrile-based resin, the glass transition temperature (hereinafter abbreviated as Tg) is usually 40 ° C or higher, preferably 60 ° C or higher. When the Tg is less than 40 ° C, in the case where the coating thickness of the coating layer is thick for the purpose of improving the adhesion, there is a problem that it is easy to seal the end.
本發明中所謂的聚胺基甲酸酯樹脂,意指分子內具有胺基甲酸酯鍵結之高分子化合物。其中,考慮對線內塗佈的合適性時,係以水分散性或水溶性之胺基甲酸酯樹脂為佳。為了賦予水分散性或水溶性,可將羥基、羧基、磺酸基、磺醯基、磷酸基、醚基等之親水性基導入胺基甲酸酯樹脂中。前述親水性基之中,從塗膜物性及密著性提昇之觀點來看,係以使用羧酸基或磺酸基為佳。 The term "polyurethane resin" as used in the present invention means a polymer compound having a urethane bond in a molecule. Among them, in view of suitability for in-line coating, a water-dispersible or water-soluble urethane resin is preferred. In order to impart water dispersibility or water solubility, a hydrophilic group such as a hydroxyl group, a carboxyl group, a sulfonic acid group, a sulfonyl group, a phosphoric acid group or an ether group may be introduced into the urethane resin. Among the above hydrophilic groups, a carboxylic acid group or a sulfonic acid group is preferably used from the viewpoint of improving the physical properties and adhesion of the coating film.
胺基甲酸酯樹脂的具體製造例方面,可舉例如利用羥基與異氰酸酯之反應的方法。在用作為原料之羥基方面,係以使用多元醇為佳,可舉例如聚醚多元醇類、 聚酯多元醇類、聚碳酸酯系多元醇類、聚烯烴多元醇類、丙烯醯基多元醇類。此等之化合物可單獨使用,亦可使用複數種。 Specific examples of the production of the urethane resin include a method of using a reaction between a hydroxyl group and an isocyanate. In terms of the hydroxyl group used as the raw material, a polyol is preferably used, and for example, a polyether polyol, Polyester polyols, polycarbonate polyols, polyolefin polyols, and acryl-based polyols. These compounds may be used singly or in plural.
聚醚多元醇類方面,可舉出聚乙二醇、聚丙二醇、聚乙烯丙二醇、聚四亞甲基醚二醇、聚六亞甲基醚二醇等。 Examples of the polyether polyols include polyethylene glycol, polypropylene glycol, polyethylene propylene glycol, polytetramethylene ether glycol, and polyhexamethylene ether glycol.
聚酯多元醇類方面,可舉出由多元羧酸(丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、癸二酸、延胡索酸、馬來酸、對苯二甲酸、間苯二甲酸等)或該等之酸酐與多元醇(乙二醇、二乙二醇、三乙二醇、丙二醇、二丙二醇、三丙二醇、丁烷二醇、1,3-丁烷二醇、1,4-丁烷二醇、2,3-丁烷二醇、2-甲基-1,3-丙烷二醇、1,5-戊烷二醇、新戊二醇、1,6-己烷二醇、3-甲基-1,5-戊烷二醇、2-甲基-2,4-戊烷二醇、2-甲基-2-丙基-1,3-丙烷二醇、1,8-辛烷二醇、2,2,4-三甲基-1,3-戊烷二醇、2-乙基-1,3-己烷二醇、2,5-二甲基-2,5-己烷二醇、1,9-壬烷二醇、2-甲基-1,8-辛烷二醇、2-丁基-2-乙基-1,3-丙烷二醇、2-丁基-2-己基-1,3-丙烷二醇、環己烷二醇、雙羥基甲基環己烷、二甲醇苯、雙羥基乙氧基苯、烷基二烷醇胺、內酯二醇等)之反應所得者。 Examples of the polyester polyols include polycarboxylic acids (malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, sebacic acid, fumaric acid, maleic acid, and para-benzoic acid). Dicarboxylic acid, isophthalic acid, etc.) or the anhydrides and polyols (ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, butanediol, 1,3-butyl) Alkanediol, 1,4-butanediol, 2,3-butanediol, 2-methyl-1,3-propanediol, 1,5-pentanediol, neopentyl glycol, 1 ,6-hexanediol, 3-methyl-1,5-pentanediol, 2-methyl-2,4-pentanediol, 2-methyl-2-propyl-1,3- Propanediol, 1,8-octanediol, 2,2,4-trimethyl-1,3-pentanediol, 2-ethyl-1,3-hexanediol, 2,5- Dimethyl-2,5-hexanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 2-butyl-2-ethyl-1,3- Propane diol, 2-butyl-2-hexyl-1,3-propane diol, cyclohexane diol, bishydroxymethylcyclohexane, dimethanol benzene, bishydroxyethoxybenzene, alkyl dioxane The reaction of the reaction of an alcohol amine, a lactone diol, etc.).
聚碳酸酯系多元醇類方面,可舉出多元醇類與二甲基碳酸酯、二乙基碳酸酯、二苯基碳酸酯、乙烯碳酸酯等藉由脫醇反應所得之聚碳酸酯二醇,可舉例如聚(1,6-己烯)碳酸酯、聚(3-甲基-1,5-戊烯)碳酸酯等。 Examples of the polycarbonate-based polyols include polycarbonate diols obtained by dealcoholization reaction of polyols with dimethyl carbonate, diethyl carbonate, diphenyl carbonate, and ethylene carbonate. For example, poly(1,6-hexene) carbonate, poly(3-methyl-1,5-pentene) carbonate, etc. are mentioned.
獲得胺基甲酸酯樹脂所使用之聚異氰酸酯化合物方面,可例示出三氯乙烯二異氰酸酯、二甲伸苯基二異氰酸酯、亞甲基二苯基二異氰酸酯、伸苯基二異氰酸酯、萘二異氰酸酯、聯甲苯胺二異氰酸酯等之芳香族二異氰酸酯、α,α,α’,α’-四甲基二甲伸苯基二異氰酸酯等之具芳香環之脂肪族二異氰酸酯;亞甲基二異氰酸酯、丙烯二異氰酸酯、離胺酸二異氰酸酯、三甲基六亞甲基二異氰酸酯、六亞甲基二異氰酸酯等之脂肪族二異氰酸酯、環己烷二異氰酸酯、甲基環己烷二異氰酸酯、異佛爾酮二異氰酸酯、二環己基甲烷二異氰酸酯、亞異丙基二環己基二異氰酸酯等之脂環族二異氰酸酯等。此等可單獨使用,亦可併用複數種。 Examples of the polyisocyanate compound used for obtaining the urethane resin include trichloroethylene diisocyanate, dimethylphenylene diisocyanate, methylene diphenyl diisocyanate, phenyl diisocyanate, and naphthalene diisocyanate. An aromatic diisocyanate such as tolidine diisocyanate or an aromatic diisocyanate having an aromatic ring such as α,α,α′,α′-tetramethyldimethylphenylene diisocyanate; methylene diisocyanate; Aliphatic diisocyanate such as propylene diisocyanate, leucine diisocyanate, trimethylhexamethylene diisocyanate or hexamethylene diisocyanate, cyclohexane diisocyanate, methylcyclohexane diisocyanate, isophor An alicyclic diisocyanate such as keto diisocyanate, dicyclohexylmethane diisocyanate or isopropylidene dicyclohexyl diisocyanate. These may be used alone or in combination.
合成胺基甲酸酯樹脂時,較佳可使用以往公知的鏈延長劑,鏈延長劑方面,若為具有2個以上可與異氰酸酯基反應之活性基者,並無特別限定,泛用上可使用具有2個羥基或胺基之鏈延長劑。 In the case of synthesizing a urethane resin, it is preferable to use a conventionally known chain extender, and a chain extender is not particularly limited as long as it has two or more active groups reactive with an isocyanate group, and can be used in general. A chain extender having two hydroxyl groups or an amine group is used.
具有2個羥基之鏈延長劑方面,可例示出列舉如乙二醇、丙二醇、丁烷二醇等之脂肪族二醇、二甲伸苯基二醇、雙羥基乙氧基苯等之芳香族二醇、新戊二醇羥基三甲基乙酸酯等稱為酯二醇之二醇類。又,具有2個胺基之鏈延長劑方面,可舉例如三氯乙烯二胺、二甲伸苯基二胺、二苯基甲烷二胺等之芳香族二胺、乙烯二胺、丙烯二胺、己烷二胺、2,2-二甲基-1,3-丙烷二胺、2-甲基-1,5-戊烷二胺、三甲基己烷二胺、2-丁基-2-乙基-1,5-戊烷二 胺、1,8-辛烷二胺、1,9-壬烷二胺、1,10-癸烷二胺等之脂肪族二胺、1-胺基-3-胺基甲基-3,5,5-三甲基環己烷、二環己基甲烷二胺、亞異丙基環己基-4,4’-二胺、1,4-二胺基環己烷、1,3-雙胺基甲基環己烷等之脂環族二胺等。 The chain extender having two hydroxyl groups may, for example, be an aromatic diol such as ethylene glycol, propylene glycol or butanediol, or an aromatic group such as dimethyl phenyl diol or bishydroxy ethoxy benzene. Glycols such as diols, neopentyl glycol hydroxytrimethyl acetate, and the like are called ester diols. Further, examples of the chain extender having two amine groups include aromatic diamines such as trichloroethylene diamine, dimethyl phenyl diamine, and diphenylmethane diamine, ethylene diamine, and propylene diamine. Hexanediamine, 2,2-dimethyl-1,3-propanediamine, 2-methyl-1,5-pentanediamine, trimethylhexanediamine, 2-butyl-2 -ethyl-1,5-pentane II Aliphatic diamine, 1-amino-3-aminomethyl-3,5, such as amine, 1,8-octanediamine, 1,9-decanediamine, 1,10-decanediamine , 5-trimethylcyclohexane, dicyclohexylmethanediamine, isopropylcyclohexyl-4,4'-diamine, 1,4-diaminocyclohexane, 1,3-diamino An alicyclic diamine such as methylcyclohexane.
關於塗佈層中之黏合劑聚合物(B)之摻合比率,乃為10~90%之範圍、更佳為20~80%之範圍。該範圍未達10%時,會有對離型層之密著性降低的情況。此外,若超過80%時,接著性能會呈飽和狀態,即使有該值以上的增量,也會有無法獲得顯著效果的情況。 The blending ratio of the binder polymer (B) in the coating layer is in the range of 10 to 90%, more preferably 20 to 80%. When the range is less than 10%, the adhesion to the release layer may be lowered. Further, when it exceeds 80%, the performance is saturated, and even if there is an increase of the value or more, there is a case where a remarkable effect cannot be obtained.
本發明中,構成離型薄膜之塗佈層中,在提昇對離型層之接著性為目的下,係以含有聚胺基甲酸酯樹脂為佳。 In the present invention, in the coating layer constituting the release film, it is preferred to contain a polyurethane resin for the purpose of improving the adhesion to the release layer.
設置本發明中之塗佈層用的塗佈液,成分(C)方面,係以含有由丙三醇(C1)、聚丙三醇(C2)、對丙三醇或聚丙三醇之環氧烷加成物(C3)之群選出的1種以上之化合物或其衍生物為佳。分子內之丙三醇單位的平均個數係以2~20之範圍者為佳。順帶一提的是,使用丙三醇時,會有塗佈層之透明性略差的情況。 The coating liquid for coating layer of the present invention is provided, and the component (C) contains an alkylene oxide derived from glycerol (C1), polyglycerol (C2), p-glycerol or polyglycerol. It is preferred that one or more compounds selected from the group of the adducts (C3) or derivatives thereof are preferred. The average number of glycerol units in the molecule is preferably in the range of 2 to 20. Incidentally, when glycerin is used, the transparency of the coating layer may be slightly inferior.
又,所謂對丙三醇或聚丙三醇之環氧烷加成物,乃是具有於丙三醇或聚丙三醇之羥基上加成聚合環氧烷或其衍生物所成之構造。 Further, the alkylene oxide adduct of glycerol or polyglycerol has a structure in which a polymerized alkylene oxide or a derivative thereof is added to a hydroxyl group of glycerol or polyglycerol.
在此,丙三醇或聚丙三醇骨架的每個羥基上,所加成的環氧烷或其衍生物的構造即使不同也沒關係。又,至少分子中的一個羥基被加成即可,並不需要全 部的羥基上都加成有環氧烷或其衍生物。 Here, the structure of the alkylene oxide or its derivative to be added on each of the hydroxyl groups of the glycerol or polyglycerol skeleton may be different. Moreover, at least one of the hydroxyl groups in the molecule is added, and does not need to be all An alkylene oxide or a derivative thereof is added to the hydroxyl group of the moiety.
環氧烷或其衍生物方面,較佳的是含有氧化乙烯或氧化丙烯骨架之構造。環氧烷構造中的烷基鏈若變得過長,疏水性會變強,在塗佈液中的均一分散性會惡化,且有塗膜的防帶電性或透明性惡化之傾向。特別佳為氧化乙烯。 In the case of an alkylene oxide or a derivative thereof, a structure containing an ethylene oxide or propylene oxide skeleton is preferred. When the alkyl chain in the alkylene oxide structure is too long, the hydrophobicity is enhanced, the uniform dispersibility in the coating liquid is deteriorated, and the antistatic property or transparency of the coating film tends to be deteriorated. Particularly preferred is ethylene oxide.
對該丙三醇或聚丙三醇之環氧烷加成物中,環氧烷或其衍生物對丙三醇或聚丙三醇骨架之共聚比率雖未特別受限,以分子量比計,令丙三醇或聚丙三醇部分為1時,環氧烷部分係以20以下者佳,更佳為10以下者佳。環氧烷或其衍生物對丙三醇或聚丙三醇骨架的比率較此範圍大時,通常接近使用聚環氧烷時的特性,且有無法獲得充分的本發明之效果的情況。 In the alkylene oxide adduct of the glycerol or polyglycerol, the copolymerization ratio of the alkylene oxide or its derivative to the glycerol or polyglycerol skeleton is not particularly limited, and the molecular weight ratio is When the triol or polyglycerol moiety is 1, the alkylene oxide moiety is preferably 20 or less, more preferably 10 or less. When the ratio of the alkylene oxide or the derivative thereof to the glycerin or polyglycerol skeleton is larger than this range, the properties at the time of using the polyalkylene oxide are usually close to each other, and the effect of the present invention may not be sufficiently obtained.
關於本發明中之化合物(C),其特別佳的樣態方面,可例示出聚丙三醇(C2)及對丙三醇或聚丙三醇之環氧烷加成物(C3)。聚丙三醇(C2)方面,係以上述式(3)之化合物中n為2~20者特別佳。又,對丙三醇或聚丙三醇之環氧烷加成物(C3)方面,上述式(3)之化合物中,以於n=2上加成氧化乙烯、聚氧化乙烯之構造者特別佳,又,其加成數係以作為最終化合物(C3)之重量平均分子量計時成為300~2000之範圍者特別佳。 Regarding the compound (C) in the present invention, particularly preferred aspects of the aspect include polyglycerol (C2) and an alkylene oxide adduct (C3) of glycerol or polyglycerol. In the case of polyglycerol (C2), it is particularly preferable that n in the compound of the above formula (3) is 2 to 20. Further, in the case of the alkylene oxide adduct (C3) of glycerol or polyglycerol, the compound of the above formula (3) is particularly preferably a structure in which ethylene oxide and polyethylene oxide are added at n=2. Further, the number of additions is particularly preferably in the range of 300 to 2,000 as the weight average molecular weight of the final compound (C3).
關於塗佈層中之成分(C)之摻合比率,係10~90%之範圍、更佳為20~80%之範圍。該範圍未達10%時,會有塗佈性降低的情況。此外,在超過90%時, 會有塗佈層之耐久性不足的情況。 The blending ratio of the component (C) in the coating layer is in the range of 10 to 90%, more preferably 20 to 80%. When the range is less than 10%, the coating property may be lowered. In addition, when it exceeds 90%, There is a case where the durability of the coating layer is insufficient.
本發明中,關於構成離型薄膜之塗佈層,塗佈層中所佔的塗佈劑成分(A)之重量通常為0.5mg/m2以上、較佳為1mg/m2以上。塗佈劑成分(A)之量未達0.5mg/m2時,往往會有防帶電性不足的傾向。 In the coating layer constituting the release film, the weight of the coating agent component (A) in the coating layer is usually 0.5 mg/m 2 or more, preferably 1 mg/m 2 or more. When the amount of the coating agent component (A) is less than 0.5 mg/m 2 , the antistatic property tends to be insufficient.
又,本發明中,構成離型薄膜之塗佈層中所佔的塗佈劑成分(A)之比率雖未限定,關於上限,較佳為重量比率90%、更佳為80%、最佳為60%。塗佈劑成分(A)之比率,當超過重量比率90%時,會有塗膜的透明性不足或防帶電性能不足的情況。此外,關於下限,較佳為1%、更佳為2%。塗佈劑成分(A)之重量比率未達1%時,會有防帶電性能不足的情況。 Further, in the present invention, the ratio of the coating agent component (A) to be contained in the coating layer constituting the release film is not limited, and the upper limit is preferably 90% by weight, more preferably 80% by weight, and most preferably It is 60%. When the ratio of the coating agent component (A) exceeds 90% by weight, the transparency of the coating film may be insufficient or the antistatic property may be insufficient. Further, the lower limit is preferably 1%, more preferably 2%. When the weight ratio of the coating agent component (A) is less than 1%, the antistatic property may be insufficient.
本發明中之構成離型薄膜之塗佈層中,塗佈劑成分(A)與塗佈劑成分(B)之比率,係以重量比計為90/10~1/99之範圍者佳,更佳為70/30~1/99、最佳為50/50~2/98之範圍。若不在該範圍,則有防帶電性能或塗膜的外觀容易惡化之傾向。本發明使用的塗佈液中,為了改良對聚酯薄膜之塗佈性,可含界面活性劑。此界面活性劑方面,特別是以使用於其構造中含(聚)環氧烷或(聚)丙三醇、此等之衍生物者,因不阻礙所得之塗佈層之防帶電性而較佳。 In the coating layer constituting the release film of the present invention, the ratio of the coating agent component (A) to the coating agent component (B) is preferably in the range of 90/10 to 1/99 by weight. More preferably, it is 70/30~1/99, and the best is 50/50~2/98. If it is not in this range, the antistatic property or the appearance of the coating film tends to be deteriorated. The coating liquid used in the present invention may contain a surfactant in order to improve the coatability to the polyester film. In terms of the surfactant, especially in the case where (poly)alkylene oxide or (poly)glycerol or a derivative thereof is used in the structure, the anti-charge property of the obtained coating layer is not hindered. good.
本發明使用之塗佈液,亦可含有消泡劑、塗佈性改良劑、增黏劑、有機系潤滑劑、離型劑、有機粒子、無機粒子、抗氧化劑、紫外線吸收劑、發泡劑、染 料、顏料等之添加劑。此等之添加劑雖可單獨使用,但因應需要,亦可併用2種以上。又,此等添加劑方面,若使用於該構造中含(聚)環氧烷或(聚)丙三醇、此等之衍生物者,因不阻礙所得之塗佈層之防帶電性而較佳。 The coating liquid used in the present invention may further contain an antifoaming agent, a coating improver, a tackifier, an organic lubricant, a release agent, organic particles, inorganic particles, an antioxidant, an ultraviolet absorber, and a foaming agent. ,dye Additives such as materials and pigments. These additives may be used singly or in combination of two or more kinds as needed. Further, in the case of such an additive, if (poly)alkylene oxide or (poly)glycerol or a derivative thereof is used in the structure, it is preferred that the anti-charge property of the obtained coating layer is not inhibited. .
本發明中之塗佈液,從操作上、作業環境上及塗佈液組成物的安定性之面來看,係以作為水溶液或水分散液者較佳,但在作為以水為主的媒介,若再不超越本發明之要旨之範圍,亦可含有有機溶劑。 The coating liquid in the present invention is preferably used as an aqueous solution or an aqueous dispersion from the viewpoints of handling, work environment, and stability of the coating liquid composition, but is used as a water-based medium. An organic solvent may also be contained if it does not go beyond the gist of the present invention.
本發明中之塗佈層,較佳係藉由將含有特定化合物之塗佈液塗佈於薄膜所設置者,特別是在本發明中,藉由於薄膜製膜中進行塗佈之線內塗佈所設置者佳。 The coating layer in the present invention is preferably provided by coating a coating liquid containing a specific compound on a film, particularly in the present invention, by in-line coating by coating in a film forming film. The setting is good.
接著,就本發明中之離型層之形成進行說明。 Next, the formation of the release layer in the present invention will be described.
構成本發明中之第1離型薄膜及第2離型薄膜之離型層,意指具有離型性之層者,具體而言,係以使黏著層與離型層之剝離力在一定範圍而得以完成本發明者。 The release layer constituting the first release film and the second release film in the present invention means a layer having a release property, specifically, a peeling force of the adhesive layer and the release layer is within a certain range The inventors were able to complete.
第1離型薄膜31,有必要使其在0.3m/分之低速剝離力為10~20mN/cm。第1離型薄膜的剝離力未達10mN/cm的話,在本來沒必要剝離的場面中,離型薄膜會變得容易剝離。此外,第1離型薄膜的剝離力超過20mN/cm時,在剝去第1離型薄膜之步驟時,難以順利地剝離。 The first release film 31 needs to have a low-speed peeling force of 10 to 20 mN/cm at 0.3 m/min. When the peeling force of the first release film is less than 10 mN/cm, the release film is likely to be peeled off in the case where it is not necessary to peel off. Further, when the peeling force of the first release film exceeds 20 mN/cm, it is difficult to smoothly peel off when the first release film is peeled off.
再者,本發明中,有必要將60m/分之高速剝 離力抑制在90mN/cm以下,較佳為85mN/cm以下。該高速剝離力超過90mN/cm時,難以順利地剝離。 Furthermore, in the present invention, it is necessary to peel off 60 m/min. The force is suppressed to 90 mN/cm or less, preferably 85 mN/cm or less. When the high-speed peeling force exceeds 90 mN/cm, it is difficult to peel off smoothly.
本發明者,例如,一般而言,在貼合於電子零件之前的狀態中,即刻自無基材之兩面黏著薄片使第1離型薄膜剝離時,可預先裁切成接近電子零件大小的小片薄片狀,之後讓作業員以手進行剝離。該剝離作業步驟中,使用被裁切成的小片,給予一點剝離第1離型薄膜的契機之後,向小片的對角線方向使其180度剝離。 The present inventors, for example, generally, in a state before being attached to an electronic component, immediately when the first release film is peeled off from the adhesive sheet on both sides of the substrate, the small size of the electronic component can be cut in advance. It is in the form of flakes, and then the worker peels off by hand. In the peeling operation step, the cut piece was used, and the first release film was peeled off at a time, and then peeled off 180 degrees in the diagonal direction of the small piece.
此時,與一般的自黏著膠帶使離型薄膜180度剝離時不同,剝離方向中,為了於對角線方向使離型薄膜剝離,伴隨著剝離的進行,會有剝離面積緩慢地增加之傾向。本發明者乃著眼於此剝離方式,並將一定的剝離速度中剝離面積增加的現象,解讀為在同時間內使更大面積剝離之現象,也就是所謂的剝離傳遞速度更快之剝離方式。如本發明般,特別是使用考量了段差吸收性之柔軟的黏著層時,發現可有效地將60m/分之高速剝離力抑制在一定的剝離力程度,遂完成了本發明。 In this case, unlike the case where the release film is peeled off at 180 degrees from a general self-adhesive tape, in order to peel off the release film in the diagonal direction, the peeling area tends to increase slowly as the peeling progresses. . The present inventors have focused on the peeling method and the phenomenon in which the peeling area is increased at a certain peeling speed, and the phenomenon of peeling off a larger area at the same time, that is, a peeling method in which the so-called peeling speed is faster. As in the present invention, in particular, when a soft adhesive layer in which the step difference absorbability is considered is used, it has been found that the high-speed peeling force of 60 m/min can be effectively suppressed to a certain peeling force, and the present invention has been completed.
此外,第2離型薄膜在0.3m/分之剝離力,係以20~100mN/cm為佳,更佳為40~80mN/cm。第2離型薄膜的剝離力未達20mN/cm的話,自無基材之兩面黏著薄片剝離第1離型薄膜時,會有第2離型薄膜的一部分剝離等之不良狀況發生的情況。又,第2離型薄膜的剝離力超過100mN/cm時,於第2離型薄膜會有來自黏著劑層之成分殘留等之不良狀況發生的情況。 Further, the peeling force of the second release film at 0.3 m/min is preferably 20 to 100 mN/cm, more preferably 40 to 80 mN/cm. When the peeling force of the second release film is less than 20 mN/cm, when the first release film is peeled off from the adhesive sheet on both sides without the substrate, a problem such as partial peeling of the second release film may occur. In addition, when the peeling force of the second release film exceeds 100 mN/cm, the second release film may have a problem such as a residue from the adhesive layer.
本發明之無基材之兩面黏著薄片,除了上述剝離力之調整之外,還設置了第1離型薄膜與第2離型薄膜的剝離力差。 In the substrate-free double-sided adhesive sheet of the present invention, in addition to the adjustment of the peeling force, a peeling force difference between the first release film and the second release film is provided.
第2離型薄膜的剝離力,通常是第1離型薄膜的剝離力之2.0倍以上、較佳為3.0倍以上。若第2離型薄膜的剝離力未達第1離型薄膜的剝離力之2.0倍的話,將輕剝離側的第1離型薄膜剝下時,會有第2離型薄膜自黏著劑層浮起的現象發生,或是對第2離型薄膜上有黏著劑層成分殘留或滑移黏滯(zipping)等之不良狀況發生的情況。 The peeling force of the second release film is usually 2.0 times or more, preferably 3.0 times or more, of the peeling force of the first release film. When the peeling force of the second release film is less than 2.0 times the peeling force of the first release film, when the first release film on the light release side is peeled off, the second release film floats from the adhesive layer. The phenomenon occurs, or a problem occurs in the second release film in which an adhesive layer component remains or zipping occurs.
構成本發明中之離型薄膜的離型層,為使離型性良好,係以含有硬化型聚矽氧樹脂為佳。以硬化型聚矽氧樹脂為主成分之形式亦可,在無損及本發明主旨的範圍中,亦可使用藉由與胺基甲酸酯樹脂、環氧樹脂、醇酸樹脂等之有機樹脂進行接枝聚合等所成之改性聚矽氧形式等。 The release layer constituting the release film of the present invention preferably contains a hardening type polyfluorene resin in order to improve the release property. It may be in the form of a hardened polyoxymethylene resin as a main component, and may be used by an organic resin such as a urethane resin, an epoxy resin or an alkyd resin, in the scope of the present invention without departing from the gist of the present invention. A modified polyfluorene form or the like formed by graft polymerization or the like.
本發明中,剝離力小的離型薄膜有必要具有一離型層,該離型層係於聚酯薄膜上含有具有以烯基及烷基作為官能基之反應性聚矽氧樹脂、質量平均分子量400000以上之未反應性聚矽氧樹脂與鉑系觸媒之離型層。 In the present invention, it is necessary for the release film having a small peeling force to have a release layer which is based on a polyester film and which contains a reactive polyoxyl resin having an alkenyl group and an alkyl group as a functional group, and an average mass. A release layer of an unreacted polyanthracene resin having a molecular weight of 400,000 or more and a platinum-based catalyst.
本發明中使用的具有以烯基及烷基作為官能基之聚矽氧樹脂的例子,可舉出如下述者。首先,含烯基之硬化型聚矽氧樹脂,在二有機聚矽氧烷方面,可舉出分 子鏈兩末端三甲基矽氧基封鎖二甲基矽氧烷‧甲基己烯基矽氧烷共聚物(二甲基矽氧烷單位96莫耳%、甲基己烯基矽氧烷單位4莫耳%)、分子鏈兩末端二甲基乙烯基矽氧基封鎖二甲基矽氧烷‧甲基己烯基矽氧烷共聚物(二甲基矽氧烷單位97莫耳%、甲基己烯基矽氧烷單位3莫耳%)、分子鏈兩末端二甲基己烯基矽氧基封鎖二甲基矽氧烷‧甲基己烯基矽氧烷共聚物(二甲基矽氧烷單位95莫耳%、甲基己烯基矽氧烷單位5莫耳%)。接著,含烷基硬化型聚矽氧樹脂,在有機氫聚矽氧烷方面,可舉出分子鏈兩末端三甲基矽氧基封鎖甲基氫聚矽氧烷、分子鏈兩末端三甲基矽氧基封鎖二甲基矽氧烷‧甲基氫矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封鎖甲基氫聚矽氧烷、分子鏈兩末端二甲基氫矽氧基封鎖二甲基矽氧烷‧甲基氫矽氧烷共聚物。 Examples of the polyfluorene oxide resin having an alkenyl group and an alkyl group as a functional group used in the present invention include the following. First, an alkenyl group-containing hardening polyoxyl resin, in terms of diorganopolyoxyalkylene, may be cited Trimethyl methoxy group at both ends of the sub-chain blocks dimethyl oxane ‧ methyl hexenyl decane copolymer (dimethyl methoxy oxane unit 96 mol %, methyl hexenyl decane unit) 4 mol%), both ends of the molecular chain dimethylvinyl methoxy group blocked dimethyl oxa oxide ‧ methyl hexenyl decane copolymer (dimethyl methoxy oxane unit 97 mol%, A Hexenylalkenoxane unit 3 mole %), dimethyl hexenyl oxime oxy group at the two ends of the molecular chain, dimethyl oxane ‧ methyl hexenyl decane copolymer (dimethyl hydrazine) Oxysilane unit 95 mol%, methylhexenyl decane unit 5 mol%). Next, the alkyl-containing hardening polyfluorene oxide, in terms of the organohydrogen polyoxyalkylene, may be exemplified by a trimethyl methoxy group at both ends of the molecular chain, a methyl hydrogen polyoxyalkylene group, and a trimethyl group at both ends of the molecular chain. Oxyloxy blockade dimethyl methoxy oxane ‧ methylhydroquinone copolymer, molecular chain two-terminal dimethyl hydroquinone block methyl hydrogen polyoxyalkylene, molecular chain both ends dimethyl hydroquinone The base is blocked with a dimethyloxane ‧ methylhydroquinoxane copolymer.
本發明中,為了在不使移行性惡化下賦予輕剝離性,必須添加質量平均分子量400000以上之未反應性聚矽氧樹脂。 In the present invention, in order to impart light peeling property without deteriorating the transition property, it is necessary to add an unreactive polyxanthene resin having a mass average molecular weight of 400,000 or more.
前述的未反應性聚矽氧樹脂方面,係以下述一般式(I)所示之有機聚矽氧烷為佳。 The above-mentioned unreacted polyoxyphthalocene resin is preferably an organopolyoxane represented by the following general formula (I).
R3SiO(R2SiO)mSiR3……(I)(上述式中,R為不具有脂肪族不飽和鍵結之同種或異種的一價烴基、m表示正之整數)。 R 3 SiO(R 2 SiO) m SiR 3 (I) (In the above formula, R is a monovalent hydrocarbon group of the same or different kind which does not have an aliphatic unsaturated bond, and m represents a positive integer).
本發明中使用的聚矽氧樹脂中所含之未反應 性聚矽氧樹脂係1~10重量%之範圍,較佳為1~5重量%。未反應性聚矽氧樹脂之含量若低於1%,則速度依存性會變高,若超過5重量%,則有硬化性顯著地降低,密著性也惡化的情況。 Unreacted in the polyoxynoxy resin used in the present invention The polyoxyalkylene resin is in the range of 1 to 10% by weight, preferably 1 to 5% by weight. When the content of the unreacted polyoxyl resin is less than 1%, the speed dependency is high, and when it exceeds 5% by weight, the hardenability is remarkably lowered, and the adhesion is also deteriorated.
本發明中,為了使高速區域的剝離力變小,可添加聚矽氧油。聚矽氧油乃是被稱為直餾聚矽氧油、改性聚矽氧油之聚矽氧油,可舉出下述者。直餾聚矽氧方面,可舉出二甲基聚矽氧油、甲基苯基聚矽氧油、甲基氫聚矽氧油等。又,改性聚矽氧油方面,可舉出側鏈型形式之聚醚改性、芳烷基改性、氟烷基改性、長鏈烷基改性、高級脂肪酸酯改性、高級脂肪酸醯胺改性、聚醚‧長鏈烷基改性‧芳烷基改性、苯基改性、兩末端型之聚醚改性、聚醚‧甲氧基改性等。 In the present invention, in order to reduce the peeling force in the high speed region, polyfluorene oxide oil may be added. The polyoxygenated oil is a polyoxygenated oil called a straight-run polyoxyxene oil or a modified polyoxygenated oil, and the following may be mentioned. Examples of the straight-run polyfluorinated oxygen include dimethylpolyphthalide oil, methylphenylpolyphosphonium oil, and methylhydrogenpolyoxygenated oil. Further, examples of the modified polyoxyxene oil include a polyether modification in a side chain type, an aralkyl modification, a fluoroalkyl modification, a long-chain alkyl modification, a higher fatty acid ester modification, and an advanced Fatty acid decylamine modification, polyether ‧ long-chain alkyl modification ‧ aralkyl modification, phenyl modification, two-terminal polyether modification, polyether ‧ methoxy modification, etc.
本發明中使用的聚矽氧樹脂中所含之聚矽氧油成分通常為1~10重量%之範圍,較佳為1~5重量%。聚矽氧油成分之含量若低於1%,則速度依存性會變高,若超過5重量%,則移行性高,在黏著劑加工時會弄髒輥或移行至黏著劑面,發生黏著剝離力降低等。 The polyoxyxylene oil component contained in the polyoxyxylene resin used in the present invention is usually in the range of 1 to 10% by weight, preferably 1 to 5% by weight. When the content of the polyoxygenated oil component is less than 1%, the speed dependency becomes high, and if it exceeds 5% by weight, the transition property is high, and the roller is smeared or migrated to the adhesive surface during the processing of the adhesive to cause adhesion. The peeling force is lowered, and the like.
本發明中,以日東電工股份公司製No.31B膠帶所為之殘留接著率係以85%以上者佳,更佳為90%以上。殘留接著率若較80%更低,則移行性高,在黏著劑加工時會弄髒輥或移行至黏著劑面,發生黏著剝離力降低等。 In the present invention, the residual adhesion ratio of No. 31B tape manufactured by Nitto Denko Corporation is preferably 85% or more, more preferably 90% or more. If the residual adhesion ratio is lower than 80%, the migration property is high, and the roller is smeared or moved to the adhesive surface during the processing of the adhesive, and the adhesive peeling force is lowered.
硬化型聚矽氧樹脂的種類方面,可使用加成 型‧縮合型‧紫外線硬化型‧電子線硬化型‧無溶劑型等任一硬化反應形式。若列舉具體例,可例示出信越化學工業(股)製KS-774、KS-775、KS-778、KS-779H、KS-847H、KS-856、X-62-2422、X-62-2461、X-62-1387、X-62-5039、X-62-5040、KNS-3051、X-62-1496、KNS320A、KNS316、X-62-1574A/B、X-62-7052、X-62-7028A/B、X-62-7619、X-62-7213、Momentive Performance Materials製YSR-3022、TPR-6700、TPR-6720、TPR-6721、TPR6500、TPR6501、UV9300、UV9425、XS56-A2775、XS56-A2982、XS56-C6010、XS56-C4880、UV9430、TPR6600、TPR6604、TPR6605、Dow Corning Toray(股)製SRX357、SRX211、SD7220、SD7292、LTC750A、LTC760A、LTC303E、LTC300B、LTC856、SP7259、BY24-468C、SP7248S、BY24-452、DKQ3-202、DKQ3-203、DKQ3-204、DKQ3-205、DKQ3-210等。再者,為了調整離型層之剝離性等,亦可併用剝離控制劑。 For the type of hardened polyoxyl resin, the addition can be used. Type ‧ Condensation type ‧ UV curing type ‧ Electron line hardening type ‧ Solvent-free type, etc. For the specific examples, KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-856, X-62-2422, and X-62-2461 can be exemplified by Shin-Etsu Chemical Co., Ltd. , X-62-1387, X-62-5039, X-62-5040, KNS-3051, X-62-1496, KNS320A, KNS316, X-62-1574A/B, X-62-7052, X-62 -7028A/B, X-62-7619, X-62-7213, YSR-3022, TPR-6700, TPR-6720, TPR-6721, TPR6500, TPR6501, UV9300, UV9425, XS56-A2775, XS56, manufactured by Momentive Performance Materials -A2982, XS56-C6010, XS56-C4880, UV9430, TPR6600, TPR6604, TPR6605, Dow Corning Toray SRX357, SRX211, SD7220, SD7292, LTC750A, LTC760A, LTC303E, LTC300B, LTC856, SP7259, BY24-468C, SP7248S, BY24-452, DKQ3-202, DKQ3-203, DKQ3-204, DKQ3-205, DKQ3-210, etc. Further, in order to adjust the peeling property of the release layer or the like, a release controlling agent may be used in combination.
本發明中,有關於聚酯薄膜上形成離型層之際的硬化條件,並無特別限定,藉由離線塗佈而設置離型層時,通常以120~200℃、3~40秒鐘、較佳為100~180℃、3~40秒鐘為基準來進行熱處理者佳。又,因應需要,亦可併用熱處理與紫外線照射等之活性能量線照射。此外,用於以活性能量線照射所為之硬化的能量源方面,可使用以往公知的裝置、能量源。 In the present invention, the curing conditions for forming the release layer on the polyester film are not particularly limited, and when the release layer is provided by off-line coating, it is usually 120 to 200 ° C for 3 to 40 seconds. It is preferably 100 to 180 ° C and 3 to 40 seconds as a basis for heat treatment. Further, if necessary, it is also possible to use an active energy ray such as heat treatment or ultraviolet irradiation. Further, a conventionally known device or energy source can be used for the energy source which is hardened by irradiation with an active energy ray.
離型層之塗佈量(乾燥後),從塗佈性的面 來看,通常為0.005~1g/m2、較佳為0.005~0.5g/m2、更佳為0.01~0.2g/m2範圍。塗佈量(乾燥後)未達0.005g/m2時,從塗佈性的面看來欠缺安定性,會有難以獲得均一塗膜的情況。此外,超過1g/m2厚塗時,會有離型層本身的塗膜密著性、硬化性等降低的情況。 The coating amount of the release layer (after drying) is usually 0.005 to 1 g/m 2 , preferably 0.005 to 0.5 g/m 2 , more preferably 0.01 to 0.2 g/m from the viewpoint of coatability. 2 range. When the coating amount (after drying) is less than 0.005 g/m 2 , the coating property is insufficient in stability, and it may be difficult to obtain a uniform coating film. Further, when the coating is over 1 g/m 2 thick, the coating film adhesion property and the curability of the release layer itself may be lowered.
本發明中之無基材之兩面黏著薄片的構成方面,有必要於黏著層之兩側貼合離型薄膜。有關各個離型薄膜的厚度比,考慮操作性,係以第2離型薄膜的厚度為第1離型薄膜的厚度之2倍以上、較佳為3倍以上為佳。例如,藉由使第1離型薄膜的薄膜厚度變薄,在剝下第1離型薄膜時,會有可防止在第2離型薄膜與黏著界面發生浮起之優點。又,將黏著層塗佈於第2離型薄膜的離型面上時,為了消除步驟上異物或凹凸之影響,在考慮製造成本時,係以使容易受凹凸或異物的影響之第2離型薄膜的薄膜厚度變厚者為佳。第2離型薄膜的厚度未達第1離型薄膜的厚度之2倍時,薄膜基材的彈性差會消失,且自無基材之兩面黏著薄片剝離第1離型薄膜之際,會有第2離型薄膜的一部分剝離等之不良狀況發生的情況。 In the composition of the two-sided adhesive sheet having no substrate in the present invention, it is necessary to apply a release film to both sides of the adhesive layer. Regarding the thickness ratio of each of the release films, the thickness of the second release film is preferably twice or more, more preferably three times or more, the thickness of the first release film in consideration of workability. For example, by thinning the film thickness of the first release film, when the first release film is peeled off, there is an advantage that floating of the second release film and the adhesive interface can be prevented. Further, when the adhesive layer is applied to the release surface of the second release film, in order to eliminate the influence of foreign matter or unevenness on the step, the second separation is easily affected by the unevenness or foreign matter in consideration of the production cost. It is preferred that the film thickness of the film is increased. When the thickness of the second release film is less than twice the thickness of the first release film, the difference in elasticity of the film substrate disappears, and when the first release film is peeled off from the adhesive sheet on both sides without the substrate, A case where a part of the second release film is peeled off or the like occurs.
關於本發明中之第1離型薄膜及第2離型薄膜,在無損及本發明主旨的範圍中,係可於未設有離型層之薄膜面上設置接著層、抗靜電層、寡聚物析出防止層等之塗佈層。 In the first release film and the second release film of the present invention, an adhesive layer, an antistatic layer, and an oligomer can be provided on the film surface on which the release layer is not provided, without departing from the gist of the present invention. A coating layer such as a precipitation preventing layer is deposited.
本發明中之聚酯薄膜,為使輕剝離力之離型薄膜的離型層美觀且堅固,係使用促進加成型之反應的鉑 系觸媒。本成分方面,可例示出氯化鉑酸、氯化鉑酸之醇溶液、氯化鉑酸與烯烴之錯合物、氯化鉑酸與烯基矽氧烷之錯合物等之鉑系化合物、鉑黑、擔持有鉑之氧化矽、擔持有鉑之活性碳。離型層中的鉑系觸媒含量通常為0.3~3.0重量%、較佳為0.5~2.0重量%之範圍。離型層中的鉑系觸媒含量較0.3重量%更低時,因為剝離力不佳,塗佈層之硬化反應不足,會有面狀惡化等之不良狀況發生的情況,此外,離型層中的鉑系觸媒含量超過3.0重量%時,會花費成本,又會有反應性變高、膠體異物發生等之步驟不良狀況發生。 In the polyester film of the present invention, in order to make the release layer of the release film of light peeling force beautiful and strong, platinum which promotes the reaction of addition molding is used. Catalyst. The present invention may, for example, be a platinum-based compound such as a platinum chloride acid, an alcohol solution of a platinum chloride acid, a complex of a platinum chloride acid and an olefin, a complex of a platinum chloride acid and an alkenyl alkane. , platinum black, ruthenium oxide holding platinum, active carbon holding platinum. The content of the platinum-based catalyst in the release layer is usually in the range of 0.3 to 3.0% by weight, preferably 0.5 to 2.0% by weight. When the content of the platinum-based catalyst in the release layer is lower than 0.3% by weight, the peeling force is not good, and the hardening reaction of the coating layer is insufficient, and a problem such as deterioration of the surface may occur, and the release layer may be formed. When the content of the platinum-based catalyst in the middle is more than 3.0% by weight, the cost is high, and the disadvantage of the step such as high reactivity and occurrence of colloidal foreign matter occurs.
又,因加成型之反應反應性非常地高,而可視情況添加乙炔醇作為反應抑制劑。該成分為具有碳-碳三鍵與羥基之有機化合物,較佳為由3-甲基-1-丁炔-3-醇、3,5-二甲基-1-己炔-3-醇及苯基丁炔醇所成之群選出的化合物。 Further, since the reaction reactivity due to addition molding is extremely high, acetylene alcohol may be added as a reaction inhibitor as the case may be. The component is an organic compound having a carbon-carbon triple bond and a hydroxyl group, preferably 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and A selected group of phenylbutynols.
又,對構成第1離型薄膜及第2離型薄膜之聚酯薄膜,可預先施予電暈處理、電漿處理等之表面處理。 Further, the polyester film constituting the first release film and the second release film may be subjected to surface treatment such as corona treatment or plasma treatment in advance.
本發明中,製造離型薄膜時,於聚酯薄膜上塗佈了塗佈層之後,一端可將薄膜捲起後再於塗佈層上設置離型層,亦可於聚酯薄膜上塗佈、乾燥塗佈層後,連續地於塗佈層上設置離型層,本發明中可使用任一種手法。 In the present invention, when the release film is produced, after the coating layer is coated on the polyester film, the film may be rolled up at one end, and then the release layer may be provided on the coating layer, or may be coated on the polyester film. After the coating layer is dried, a release layer is continuously provided on the coating layer, and any method can be used in the present invention.
接著,就構成本發明中之無基材之兩面黏著薄片的黏著層說明於下。本發明中之黏著層,意指由具有 黏著性之材料所構成之層,且在不損及本發明之主旨的範圍中,可使用以往公知的材料。具體例之一,乃就使用丙烯酸系黏著劑的情況說明於下。 Next, the adhesive layer constituting the double-sided adhesive sheet having no substrate in the present invention will be described below. The adhesive layer in the present invention means A layer composed of an adhesive material can be used in a conventionally known material without departing from the gist of the present invention. One of the specific examples will be described below using an acrylic adhesive.
本發明中,所謂的丙烯酸系黏著劑,意指含有以丙烯酸系單體作為必需的單體(單體)成分所形成之丙烯酸系聚合物作為基礎聚合物之黏著劑層。該丙烯酸系聚合物,係以使具有直鏈或分枝鏈狀的烷基之(甲基)丙烯酸烷基酯及/或(甲基)丙烯酸烷氧基烷基酯作為必需的單體成分(更佳乃作為主要單體成分)所形成之丙烯酸系聚合物者佳。再者,丙烯酸系聚合物,係以使具有直鏈或分枝鏈狀的烷基之(甲基)丙烯酸烷基酯及丙烯酸烷氧基烷基酯作為必需的單體成分所形成之丙烯酸系聚合物者佳。 In the present invention, the acrylic adhesive means an adhesive layer containing an acrylic polymer formed of an acrylic monomer as an essential monomer (monomer) component as a base polymer. The acrylic polymer is obtained by using an alkyl (meth)acrylate having an alkyl group having a linear or branched chain and/or an alkoxyalkyl (meth)acrylate as an essential monomer component ( More preferably, it is an acrylic polymer formed as a main monomer component. Further, the acrylic polymer is an acrylic system formed by using an alkyl (meth) acrylate having an alkyl group having a linear or branched chain and an alkoxyalkyl acrylate as an essential monomer component. Polymer is good.
本發明之黏著層,係以使具有直鏈或分枝鏈狀的烷基之(甲基)丙烯酸烷基酯及丙烯酸烷氧基烷基酯作為必需的單體成分所形成之丙烯酸系黏著層者佳。 The adhesive layer of the present invention is an acrylic adhesive layer formed by using an alkyl (meth) acrylate having an alkyl group or a linear alkyl or alkyl acrylate as an essential monomer component. Good.
又,形成本發明之黏著層中作為基礎聚合物之丙烯酸系聚合物的單體成分中,亦可再進一步含有含極性基之單體、多官能性單體或其他的共聚性單體作為共聚單體成分。此外,上述之「(甲基)丙烯醯基」表示「丙烯醯基」及/或「甲基丙烯醯基」,其他亦同。又,作為基礎聚合物之丙烯酸系聚合物在本發明之黏著層中的含量雖未特別受限,但相對於黏著層之總重量(100重量%),係以60重量%以上為佳,更佳為80重量%以上。 Further, in the monomer component forming the acrylic polymer as the base polymer in the adhesive layer of the present invention, a polar group-containing monomer, a polyfunctional monomer or another copolymerizable monomer may be further included as a copolymerization. Monomer component. In addition, the above-mentioned "(meth)acryloyl group" means "acryloyl group" and/or "methacryloyl group", and the others are the same. Further, the content of the acrylic polymer as the base polymer in the adhesive layer of the present invention is not particularly limited, but is preferably 60% by weight or more based on the total weight (100% by weight) of the adhesive layer. Preferably, it is 80% by weight or more.
形成上述丙烯酸系聚合物之單體成分方面,較佳可使用具有直鏈或分枝鏈狀的烷基之(甲基)丙烯酸烷基酯(以下僅記為「(甲基)丙烯酸烷基酯」)。上述(甲基)丙烯酸烷基酯之具體例,可例示出(甲基)丙烯酸甲基酯、(甲基)丙烯酸乙基酯、(甲基)丙烯酸丙基酯、(甲基)丙烯酸異丙基酯、(甲基)丙烯酸丁基酯、(甲基)丙烯酸異丁基酯、(甲基)丙烯酸s-丁基酯、(甲基)丙烯酸t-丁基酯、(甲基)丙烯酸戊基酯、(甲基)丙烯酸異戊基酯、(甲基)丙烯酸己基酯、(甲基)丙烯酸庚基酯、(甲基)丙烯酸辛基酯、(甲基)丙烯酸2-乙基己基酯、(甲基)丙烯酸異辛基酯、(甲基)丙烯酸壬基酯、(甲基)丙烯酸異壬基酯、(甲基)丙烯酸癸基酯、(甲基)丙烯酸異癸基酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸廿烷基酯等之烷基碳數為1~20之(甲基)丙烯酸烷基酯等。又,(甲基)丙烯酸烷基酯可單獨使用或併用2種以上。其中,更以烷基之碳數為2~14之(甲基)丙烯酸烷基酯為佳,更佳為烷基之碳數為2~10之(甲基)丙烯酸烷基酯。 In order to form a monomer component of the above acrylic polymer, it is preferred to use an alkyl (meth)acrylate having a linear or branched chain alkyl group (hereinafter simply referred to as "alkyl (meth)acrylate) "). Specific examples of the alkyl (meth)acrylate may, for example, be methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate or isopropyl (meth)acrylate. Base ester, butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate Base ester, isoamyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate , isooctyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, ( Undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, fifteen (meth) acrylate Alkyl ester, cetyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, pentadecyl (meth) acrylate, (a) Alkyl carbon such as decyl acrylate 1 to 20 of the (meth) acrylate and the like. Further, the alkyl (meth)acrylate may be used singly or in combination of two or more. Among them, an alkyl (meth)acrylate having an alkyl group having 2 to 14 carbon atoms is preferred, and an alkyl (meth)acrylate having an alkyl group having 2 to 10 carbon atoms is more preferred.
上述含極性基之單體方面,可舉例如(甲基)丙烯酸、伊康酸、馬來酸、延胡索酸、巴豆酸、異巴 豆酸等之含羧基之單體或其無水物(無水馬來酸等);(甲基)丙烯酸2-羥基乙基酯、(甲基)丙烯酸3-羥基丙基酯、(甲基)丙烯酸4-羥基丁基酯、(甲基)丙烯酸6-羥基己基酯等之(甲基)丙烯酸羥基烷基酯、乙烯基醇、烯丙基醇等之含羥基之單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、N-羥基乙基丙烯醯胺等之含醯胺基之單體;(甲基)丙烯酸胺基乙基酯、(甲基)丙烯酸二甲基胺基乙基酯、(甲基)丙烯酸t-丁基胺基乙基酯等之含胺基之單體;(甲基)丙烯酸環氧丙基酯、(甲基)丙烯酸甲基環氧丙基酯等之含環氧丙基之單體;丙烯腈或甲基丙烯醯腈等之含氰基之單體;除了N-乙烯基-2-吡咯烷酮、(甲基)丙烯醯基嗎啉之外,尚可舉出N-乙烯基吡啶、N-乙烯基哌啶酮、N-乙烯基嘧啶、N-乙烯基哌嗪、N-乙烯基吡咯、N-乙烯基咪唑、N-乙烯基噁唑等之含雜環之乙烯基系單體;乙烯基磺酸鈉等之含磺酸基之單體;2-羥基乙基丙烯醯基磷酸酯等之含磷酸基之單體;環己基馬來醯亞胺、異丙基馬來醯亞胺等之醯亞含胺基之單體;2-甲基丙烯醯基氧基乙基異氰酸酯等之含異氰酸酯基之單體等。上述含極性基之單體可單獨使用或組合2種以上使用。 Examples of the above polar group-containing monomer include (meth)acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, and isobar. a carboxyl group-containing monomer such as stearic acid or an anhydride thereof (anhydrous maleic acid or the like); 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, or (meth)acrylic acid a hydroxyl group-containing monomer such as 4-hydroxybutyl ester or 6-hydroxyhexyl (meth)acrylate such as hydroxyalkyl (meth)acrylate, vinyl alcohol or allyl alcohol; (meth) propylene Indoleamine, N,N-dimethyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxy Monomethylamine-containing monomer such as methyl (meth) acrylamide, N-hydroxyethyl acrylamide, etc.; aminoethyl (meth) acrylate, dimethylamino (meth) acrylate An amine group-containing monomer such as ethyl ester or t-butylaminoethyl (meth)acrylate; glycidyl (meth)acrylate; methyl glycidyl (meth)acrylate a monomer containing a glycidyl group; a cyano group-containing monomer such as acrylonitrile or methacrylonitrile; in addition to N-vinyl-2-pyrrolidone or (meth)propenylmorpholine, N-vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine, N-ethylene a heterocyclic-containing vinyl monomer such as piperazine, N-vinylpyrrole, N-vinylimidazole or N-vinyloxazole; a sulfonic acid group-containing monomer such as sodium vinylsulfonate; a phosphate group-containing monomer such as hydroxyethyl acryloyl phosphinate; a quinone-containing amino group-containing monomer such as cyclohexylmaleimide or isopropylmaleimide; 2-methylpropene oxime An isocyanate group-containing monomer or the like such as a methoxyethyl isocyanate. The above polar group-containing monomers may be used singly or in combination of two or more.
上述多官能性單體方面,可舉例如己烷二醇二(甲基)丙烯酸酯、丁烷二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲 基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、烯丙基(甲基)丙烯酸酯、乙烯基(甲基)丙烯酸酯、二乙烯基苯、環氧丙烯酸酯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯等。上述多官能性單體可單獨使用或組合2種以上使用。 Examples of the polyfunctional monomer include hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, Polypropylene glycol di(a) Acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane Tris (meth) acrylate, tetramethylol methane tri (meth) acrylate, allyl (meth) acrylate, vinyl (meth) acrylate, divinyl benzene, epoxy acrylate, Polyester acrylate, urethane acrylate, and the like. These polyfunctional monomers may be used singly or in combination of two or more.
上述多官能性單體之含量,相對於形成丙烯酸系聚合物之單體成分100重量%,係以0.5重量%以下為佳。該含量若超過0.5重量%,會有例如黏著劑層之凝聚力變得過高,且應力緩和性降低的情況。 The content of the polyfunctional monomer is preferably 0.5% by weight or less based on 100% by weight of the monomer component forming the acrylic polymer. When the content is more than 0.5% by weight, for example, the cohesive force of the adhesive layer may become too high, and the stress relaxation property may be lowered.
又,上述含極性基之單體或多官能性單體以外之共聚性單體(其他的共聚性單體)方面,可舉例如環戊基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯、異莰基(甲基)丙烯酸酯等具有脂環式烴基之(甲基)丙烯酸酯或苯基(甲基)丙烯酸酯等具有芳香族烴基之(甲基)丙烯酸酯等的前述(甲基)丙烯酸烷基酯、(甲基)丙烯酸烷氧基烷基酯或含極性基之單體或多官能性單體以外之(甲基)丙烯酸酯;乙酸乙烯基酯、丙酸乙烯基酯等之乙烯基酯類;苯乙烯、乙烯基甲苯等之芳香族乙烯基化合物;乙烯、丁二烯、異戊二烯、異丁烯等之烯烴或二烯類;乙烯基烷基醚等之乙烯基醚類;氯化乙烯基等。 Further, examples of the copolymerizable monomer (other copolymerizable monomer) other than the polar group-containing monomer or the polyfunctional monomer include cyclopentyl (meth) acrylate and cyclohexyl (methyl). The above (meth) acrylate having an aromatic hydrocarbon group such as an alicyclic hydrocarbon group-containing (meth) acrylate or a phenyl (meth) acrylate such as an isodecyl (meth) acrylate or the like ( (meth)acrylic acid alkyl ester, (meth)acrylic acid alkoxyalkyl ester or polar group-containing monomer or polyfunctional monomer other than (meth) acrylate; vinyl acetate, propionic acid vinyl Vinyl esters such as esters; aromatic vinyl compounds such as styrene and vinyl toluene; olefins or dienes such as ethylene, butadiene, isoprene and isobutylene; and ethylene such as vinyl alkyl ether Ether ethers; vinyl chloride and the like.
上述丙烯酸系聚合物係可將上述之單體成分藉由以往公知或慣用的聚合方法來聚合而予以調製。丙烯 酸系聚合物的聚合方法方面,可舉例如溶液聚合方法、乳化聚合方法、塊狀聚合方法或以活性能量線照射所為之聚合方法(活性能量線聚合方法)等。上述之中,在透明性、耐水性、製造成本等之點上,係以溶液聚合方法、活性能量線聚合方法為佳。 The above acrylic polymer can be prepared by polymerizing the above monomer components by a conventionally known or conventional polymerization method. Propylene The polymerization method of the acid polymer may, for example, be a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a polymerization method (active energy ray polymerization method) by irradiation with an active energy ray. Among the above, a solution polymerization method or an active energy ray polymerization method is preferred in terms of transparency, water resistance, production cost, and the like.
上述之活性能量線聚合(光聚合)時所照射的活性能量線方面,可舉例如α線、β線、γ線、中性子線、電子線等之電離性放射線或是紫外線等,其中,紫外線在本發明之用途上較佳。又,活性能量線的照射能量、照射時間、照射方法等,若是不損及本發明之主旨的範圍,並無須特別限定。 The active energy ray to be irradiated during the active energy ray polymerization (photopolymerization) may, for example, be an ionizing radiation such as an α line, a β line, a γ line, a neutral line or an electron beam, or an ultraviolet ray. The use of the invention is preferred. Further, the irradiation energy of the active energy ray, the irradiation time, the irradiation method, and the like are not particularly limited as long as they do not impair the scope of the present invention.
又,在前述溶液聚合時,可使用各種一般的溶劑。具體例方面,可例示出乙酸乙基酯、乙酸n-丁基酯等之酯類;甲苯、苯等之芳香族烴類;n-己烷、n-庚烷等之脂肪族烴類;環己烷、甲基環己烷等之脂環式烴類;甲基乙基酮、甲基異丁基酮等之酮類等的有機溶劑。溶劑可單獨使用或組合2種以上使用。 Further, in the case of the above solution polymerization, various general solvents can be used. Specific examples thereof include esters of ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; and rings; An organic solvent such as an alicyclic hydrocarbon such as hexane or methylcyclohexane; or a ketone such as methyl ethyl ketone or methyl isobutyl ketone. The solvent may be used singly or in combination of two or more.
上述之丙烯酸系聚合物的調製時,可因應聚合反應的種類來使用熱聚合起始劑或光聚合起始劑(光起始劑)等之聚合起始劑。聚合起始劑可單獨使用或組合2種以上使用。 In the preparation of the above acrylic polymer, a polymerization initiator such as a thermal polymerization initiator or a photopolymerization initiator (photoinitiator) may be used depending on the type of the polymerization reaction. The polymerization initiators may be used singly or in combination of two or more.
有關上述光聚合起始劑,並無特別限定,可使用安息香醚系光聚合起始劑、苯乙酮系光聚合起始劑、α-酮醇系光聚合起始劑、芳香族磺醯基氯化物系光聚合起 始劑、光活性肟系光聚合起始劑、安息香系光聚合起始劑、苄基系光聚合起始劑、二苯甲酮系光聚合起始劑、縮酮系光聚合起始劑、噻吨酮系光聚合起始劑等。關於光聚合起始劑的使用量,若是不損及本發明之主旨的範圍,並無須特別限定,例如,相對於形成丙烯酸系聚合物之單體成分全量100重量份,係以0.01~0.2重量份之範圍為佳。 The photopolymerization initiator is not particularly limited, and a benzoin ether photopolymerization initiator, an acetophenone photopolymerization initiator, an α-keto alcohol photopolymerization initiator, and an aromatic sulfonyl group can be used. Chloride photopolymerization Starting agent, photoactive oxime photopolymerization initiator, benzoin photopolymerization initiator, benzyl photopolymerization initiator, benzophenone photopolymerization initiator, ketal photopolymerization initiator, A thioxanthone photopolymerization initiator or the like. The amount of use of the photopolymerization initiator is not particularly limited as long as it does not impair the scope of the present invention. For example, it is 0.01 to 0.2 by weight based on 100 parts by weight of the total monomer component of the acrylic polymer. The range is best.
安息香醚系光聚合起始劑之具體例方面,可舉例如安息香甲基醚、安息香乙基醚、安息香丙基醚、安息香異丙基醚、安息香異丁基醚、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、甲基苯基醚甲基醚等。苯乙酮系光聚合起始劑方面,可舉例如2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、4-苯氧基二氯苯乙酮、4-(t-丁基)二氯苯乙酮等。α-酮醇系光聚合起始劑方面,可舉例如2-甲基-2-羥基苯丙酮、1-〔4-(2-羥基乙基)苯基〕-2-甲基丙烷-1-酮等。芳香族磺醯基氯化物系光聚合起始劑之具體例方面,可舉出2-萘磺醯基氯化物等。光活性肟系光聚合起始劑方面,可舉例如1-苯基-1,1-丙烷二酮-2-(o-乙氧基羰基)-肟等。安息香系光聚合起始劑中,例如,可含安息香等。苄基系光聚合起始劑中,例如,可含苄基等。 Specific examples of the benzoin ether photopolymerization initiator include, for example, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy Base-1,2-diphenylethane-1-one, methylphenyl ether methyl ether, and the like. Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, and 1-hydroxycyclohexylphenyl. Ketone, 4-phenoxydichloroacetophenone, 4-(t-butyl)dichloroacetophenone, and the like. The α-keto alcohol-based photopolymerization initiator may, for example, be 2-methyl-2-hydroxypropiophenone or 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropane-1- Ketones, etc. Specific examples of the aromatic sulfonyl chloride-based photopolymerization initiator include 2-naphthalenesulfonyl chloride and the like. The photoactive oxime photopolymerization initiator may, for example, be 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-ruthenium or the like. The benzoin-based photopolymerization initiator may, for example, contain benzoin or the like. The benzyl photopolymerization initiator may, for example, contain a benzyl group or the like.
二苯甲酮系光聚合起始劑之具體例方面,可例示出二苯甲酮、苯甲醯基安息香酸、3,3’-二甲基-4-甲氧基二苯甲酮、聚乙烯基二苯甲酮、α-羥基環己基苯基酮 等。縮酮系光聚合起始劑之具體例方面,包含苄基二甲基縮酮等。噻吨酮系光聚合起始劑之具體例方面,包含噻吨酮、2-氯噻吨酮、2-甲基噻吨酮、2,4-二甲基噻吨酮、異丙基噻吨酮、2,4-二異丙基噻吨酮、十二烷基噻吨酮等。 Specific examples of the benzophenone-based photopolymerization initiator include benzophenone, benzamidine benzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, and poly Vinyl benzophenone, α-hydroxycyclohexyl phenyl ketone Wait. Specific examples of the ketal-based photopolymerization initiator include benzyldimethylketal and the like. Specific examples of the thioxanthone photopolymerization initiator include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, and isopropylthioxan Ketone, 2,4-diisopropylthioxanthone, dodecylthioxanthone, and the like.
上述熱聚合起始劑之具體例方面,偶氮系聚合起始劑〔例如,2,2’-偶氮雙異丁腈、2,2’-偶氮雙-2-甲基丁腈、2,2’-偶氮雙(2-甲基丙酸)二甲基、4,4’-偶氮雙-4-氰基纈草酸、偶氮雙異戊腈、2,2’-偶氮雙(2-甲脒基丙烷)二氫氯化物、2,2’-偶氮雙〔2-(5-甲基-2-咪唑啉-2-基)丙烷〕二氫氯化物、2,2’-偶氮雙(2-甲基丙脒)二硫酸鹽、2,2’-偶氮雙(N,N’-二亞甲基異丁基脒)二氫氯化物等〕、過氧化物系聚合起始劑(例如,二苯甲醯基過氧化物、tert-丁基過馬來酸等)、氧化還原系聚合起始劑等。熱聚合起始劑的使用量方面,若是不損及本發明之主旨的範圍,並無須特別限定。 Specific examples of the above thermal polymerization initiator are azo polymerization initiators (for example, 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, 2 , 2'-azobis(2-methylpropionic acid) dimethyl, 4,4'-azobis-4-cyanoshikimic acid, azobisisopramonitrile, 2,2'-azo double (2-Methylpropanepropane) dihydrochloride, 2,2'-azobis[2-(5-methyl-2-imidazolin-2-yl)propane]dihydrochloride, 2,2' - azobis(2-methylpropionamidine) disulfate, 2,2'-azobis(N,N'-dimethylene isobutylphosphonium) dihydrochloride, etc., peroxide system A polymerization initiator (for example, benzoyl peroxide, tert-butyl permaleic acid, etc.), a redox polymerization initiator, or the like. The amount of the thermal polymerization initiator to be used is not particularly limited as long as it does not impair the scope of the present invention.
本發明中作為黏著層之一個形態所使用的丙烯酸系黏著層,可因應需要而在不損及本發明之特性的範圍下使用交聯劑、交聯促進劑、黏著賦予劑(例如松脂衍生物樹脂、聚萜烯樹脂、石油樹脂、油溶性苯酚樹脂等)、抗老化劑、填充劑、著色劑(顏料或染料等)、紫外線吸收劑、抗氧化劑、鏈轉移劑、可塑劑、軟化劑、界面活性劑、抗靜電劑等之公知的添加劑。又,形成黏著層之際,可使用各種一般的溶劑。溶劑的種類方面,並未特別限定,可使用例示於作為前述溶液聚合中所用的溶劑 等。 In the acrylic adhesive layer used as one form of the adhesive layer in the present invention, a crosslinking agent, a crosslinking accelerator, and an adhesion-imparting agent (for example, a rosin derivative) can be used as needed without impairing the characteristics of the present invention. Resin, polyterpene resin, petroleum resin, oil-soluble phenol resin, etc.), anti-aging agent, filler, colorant (pigment or dye, etc.), ultraviolet absorber, antioxidant, chain transfer agent, plasticizer, softener, A well-known additive such as a surfactant or an antistatic agent. Further, when an adhesive layer is formed, various general solvents can be used. The type of the solvent is not particularly limited, and examples thereof may be used as the solvent used in the solution polymerization described above. Wait.
上述交聯劑,係可藉由將黏著層之基礎聚合物予以交聯來控制黏著層之膠體分率。交聯劑方面,除了異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑之外、可舉出尿素系交聯劑、金屬烷氧化物系交聯劑、金屬螯合系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、噁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等,較佳可使用異氰酸酯系交聯劑或環氧系交聯劑。交聯劑可單獨使用或組合2種以上使用。 The above crosslinking agent can control the colloid fraction of the adhesive layer by crosslinking the base polymer of the adhesive layer. In addition to the isocyanate crosslinking agent, the epoxy crosslinking agent, the melamine crosslinking agent, and the peroxide crosslinking agent, a urea crosslinking agent and a metal alkoxide crosslinking are mentioned. A crosslinking agent, a metal chelate crosslinking agent, a metal salt crosslinking agent, a carbodiimide crosslinking agent, an oxazoline crosslinking agent, an aziridine crosslinking agent, an amine crosslinking agent, etc. Preferably, an isocyanate crosslinking agent or an epoxy crosslinking agent can be used. The crosslinking agent may be used singly or in combination of two or more.
本發明中之無基材之兩面黏著薄片中,於黏著層形成時使用作為該構成單位之丙烯酸系黏著劑組成物時,係以例如將存在於光學構件(例如,表面保護層、觸控面板及影像顯示單元之顯示面等)間之空隙,以與空氣比較後折射率接近光學構件之透明黏著薄片來取代,而使光透過性提昇,在考慮影像顯示裝置之亮度或抑制對比降低的情況下,係以設計黏著層本身柔軟者為佳。 In the double-sided adhesive sheet having no substrate in the present invention, when an acrylic adhesive composition as the constituent unit is used in forming the adhesive layer, for example, it will be present in an optical member (for example, a surface protective layer or a touch panel). And the gap between the display surface of the image display unit and the like, which is replaced by a transparent adhesive sheet having a refractive index close to that of the optical member after being compared with the air, thereby improving the light transmittance, considering the brightness of the image display device or suppressing the contrast reduction. Next, it is better to design the adhesive layer itself to be soft.
構成本發明中之無基材之兩面黏著薄片的黏著層厚度(乾燥後),通常為25μm~200μm、較佳為50μm~100μm之範圍。黏著層厚度未達25μm時,例如,光學構件間所產生的空隙會變得過大,會有難以用黏著層來填充至每個角落的情況。此外,黏著層厚度超過200μm時,相較於光學構件間產生的空隙,反而是黏著層厚度會變得過厚,會有過多的黏著層成分會自光學構件間吐出等不良狀況發生的情況。 The thickness of the adhesive layer (after drying) constituting the double-sided adhesive sheet having no substrate in the present invention is usually in the range of 25 μm to 200 μm, preferably 50 μm to 100 μm. When the thickness of the adhesive layer is less than 25 μm, for example, voids generated between the optical members may become excessively large, and it may be difficult to fill each corner with an adhesive layer. Further, when the thickness of the adhesive layer exceeds 200 μm, the thickness of the adhesive layer becomes too thick as compared with the void generated between the optical members, and there are cases where excessive adhesion of the adhesive layer component occurs between the optical members.
以下,藉由實施例來進一步詳細地說明本發明,本發明只要不超越該要旨,並不受限於以下之實施例。又,本發明中所用的測定法及評價方法係如下所述。 Hereinafter, the present invention will be described in more detail by way of examples, which are not intended to be limited thereto. Further, the measurement method and evaluation method used in the present invention are as follows.
將使用離心沈降式粒度分布測定裝置(股份公司島津製作所製SA-CP3型)所測定之等價球形分布中的積算(重量基準)50%之值,作為平均粒徑。 A value of 50% of the total value (weight basis) in the equivalent spherical distribution measured by a centrifugal sedimentation type particle size distribution measuring apparatus (Model SA-CP3 manufactured by Shimadzu Corporation) was used as the average particle diameter.
於試料薄膜的離型層表面貼附兩面黏著膠帶(日東電工製「No.31B」)之單面後,裁切成50mm×300mm大小,之後,測定放置於室溫1小時後的剝離力。剝離力係使用拉伸試驗機((股)INTESCO製「INTESCO型號2001型」),於拉伸速度300mm/分與30000mm/分條件下進行180°剝離。 A single-sided adhesive tape ("No. 31B" manufactured by Nitto Denko Corporation) was attached to the surface of the release layer of the sample film, and then cut into a size of 50 mm × 300 mm, and then the peeling force after standing at room temperature for 1 hour was measured. The peeling force was 180° peeling at a tensile speed of 300 mm/min and 30,000 mm/min using a tensile tester ("INTESCO Model 2001" manufactured by INTESCO).
將試料薄膜切成A4大,於薄膜的測定面將黏著膠帶(日東電工(株)「No.31B」基材厚度25μm)使用橡膠滾輪予以貼合之後,經過1小時之後,剝下黏著膠帶,將該 黏著膠帶,使用橡膠滾輪而貼合於已洗淨表面之不鏽鋼板。在上部確認上固定黏著膠帶,在下部確認上固定不鏽鋼板,以300mm/min之速度在180°方向上剝下,並測定接著力(1)。 The sample film was cut into A4, and the adhesive tape (Nitto Denko Co., Ltd. "No. 31B" substrate thickness: 25 μm) was bonded to the measurement surface of the film using a rubber roller. After one hour, the adhesive tape was peeled off. Will Adhesive tape is attached to a stainless steel plate with a cleaned surface using a rubber roller. The adhesive tape was fixed on the upper side, and the stainless steel plate was fixed on the lower portion, peeled off at a speed of 300 mm/min in the 180° direction, and the adhesion force (1) was measured.
使用不與試料貼合之黏著膠帶(日東電工(株)「No.31B」),以與上述相同的程序測定接著力(2)。殘留接著率係依下述式來求得。 The adhesion force (2) was measured by the same procedure as above using an adhesive tape (Nitto Denko Co., Ltd. "No. 31B") which was not bonded to the sample. The residual adhesion ratio was determined by the following formula.
殘留接著率(%)=接著力(1)÷接著力(2)×100 Residual adhesion rate (%) = subsequent force (1) ÷ adhesion force (2) × 100
於離型薄膜上塗佈了下述組成之丙烯酸系黏著劑組成物後,以100℃加熱處理5分鐘,得到厚度(乾燥後)為20μm之黏著層。然後,將貼合有離型薄膜與黏著層者以150℃加熱處理90分鐘後,剝下離型薄膜,並從自黏著層剝下離型薄膜時的狀況來評價離型特性。 The acrylic pressure-sensitive adhesive composition having the following composition was applied onto the release film, and then heat-treated at 100 ° C for 5 minutes to obtain an adhesive layer having a thickness (after drying) of 20 μm. Then, the release film and the adhesive layer were heat-treated at 150 ° C for 90 minutes, and then the release film was peeled off, and the release property was evaluated from the state when the release film was peeled off from the adhesive layer.
A:離型薄膜可完美地剝下,未見黏著劑附著於離型層的現象。 A: The release film was perfectly peeled off, and no adhesion of the adhesive to the release layer was observed.
B:離型薄膜雖可剝下,但以較快速度剝離時,黏著劑會附著於離型層。 B: Although the release film can be peeled off, the adhesive adheres to the release layer when peeled off at a relatively high speed.
C:黏著劑會附著於離型薄膜上,無法完美地剝下。 C: The adhesive adheres to the release film and cannot be peeled off perfectly.
預先將未熱處理的離型薄膜在空氣中以180℃加熱10 分鐘。然後,盡可能使已熱處理之該薄膜密著於上部打開之長寬10cm、高3cm的箱子內面而成為箱形之形狀。設置有塗佈層時,係使塗佈層面為內側。接著,於以上述之方法作成的箱子之中,加入DMF(二甲基甲醯胺)4ml放置3分鐘之後,回收DMF。將回收的DMF供給至液體層析(島津製作所製:LC-7A),求得DMF中的寡聚物量,將此值除以使DMF接觸之薄膜面積,作為薄膜表面寡聚物量(mg/m2)。 The unheated release film was previously heated in air at 180 ° C for 10 minutes. Then, as far as possible, the heat-treated film was adhered to the inner surface of the box having a length of 10 cm and a height of 3 cm which was opened at the upper portion to have a box shape. When the coating layer is provided, the coating layer is made to be inside. Next, 4 ml of DMF (dimethylformamide) was added to the box prepared by the above method for 3 minutes, and then DMF was recovered. The recovered DMF was supplied to liquid chromatography (manufactured by Shimadzu Corporation: LC-7A), and the amount of oligomer in DMF was determined. This value was divided by the area of the film in which DMF was contacted, and the amount of the surface oligomer was (mg/m). 2 ).
DMF中的寡聚物量,由標準試料波峰面積與測定試料波峰面積之波峰面積比來求得(絕對檢量線法)。標準試料之製作,係正確地秤量預先分取的寡聚物(環狀三量體),並溶解於正確秤量之DMF中而作成。標準試料的濃度,係以0.001~0.01mg/ml之範圍為佳。 The amount of oligomer in DMF is determined by the ratio of the peak area of the standard sample to the peak area of the peak area of the sample (absolute gauge method). The preparation of the standard sample is carried out by accurately weighing the pre-separated oligomer (cyclic triad) and dissolving it in a properly weighed DMF. The concentration of the standard sample is preferably in the range of 0.001 to 0.01 mg/ml.
此外,液體層析之條件係如下所述。 Further, the conditions of liquid chromatography are as follows.
移動相A:乙腈 Mobile phase A: acetonitrile
移動相B:2%乙酸水溶液 Mobile phase B: 2% aqueous acetic acid solution
管柱:三菱化學(股)製『MCI GEL ODS 1HU』 Pipe column: MCI GEL ODS 1HU by Mitsubishi Chemical Corporation
管柱溫度:40℃ Column temperature: 40 ° C
流速:1ml/分 Flow rate: 1ml/min
檢出波長:254nm Detection wavelength: 254nm
然後,藉由下述判定基準,對剝離狀況進行判定。 Then, the peeling condition is determined by the following criterion.
A:表面寡聚物量(OL)為2.0mg/m2以下(實用上沒問題之程度) A: The amount of surface oligomer (OL) is 2.0 mg/m 2 or less (the degree of practical use is not problematic)
B:表面寡聚物量(OL)超過2.0mg/m2(實用上有問題之程度) B: The amount of surface oligomer (OL) exceeds 2.0 mg/m 2 (the degree of practical problem)
預先地從設置有試料樣品之離型層的面,使用螢光X線測定裝置((股)島津製作所(製)型式「XRF-1500」)而藉由FP(Fundamental Parameter Method)法,在下述表1中所示之測定條件下,測定元素量。 In the FD (Fundamental Parameter Method) method, the surface of the release layer provided with the sample sample is used in advance by the fluorescent X-ray measuring device (the product "Shimadzu Manufacturing Co., Ltd." "XRF-1500"). The amount of the elements was measured under the measurement conditions shown in Table 1.
於塗佈後即刻藉由觸手擦拭試料薄膜的離型面5次,依下述判定基準判定離型層之脫落程度。 Immediately after coating, the release surface of the sample film was wiped by a tentacle for 5 times, and the degree of detachment of the release layer was determined according to the following criteria.
A:未見塗膜的脫落(可實用之程度) A: No peeling of the coating film (a practical degree)
B:塗膜變白但並未脫落(可實用之程度〉 B: The coating film turns white but does not fall off (the degree of practicality)
C:可確認塗膜的脫落(難以實用之程度) C: The peeling of the coating film can be confirmed (the degree of difficulty in practical use)
將試料薄膜放置於恆溫恆濕槽中,於80℃、90%RH氛圍下放1週之後,取出試料薄膜。然後,將試料薄膜的離型面以染入MEK(甲基乙基酮)之脫脂綿擦拭100次後,藉由觸手擦拭5次,依下述判定基準判定離型層之脫落程度。 The sample film was placed in a constant temperature and humidity chamber, and placed in an atmosphere of 80 ° C and 90% RH for one week, and then the sample film was taken out. Then, the release surface of the sample film was wiped 100 times with a degreased cotton dyed with MEK (methyl ethyl ketone), and then wiped 5 times with a tentacle to determine the degree of detachment of the release layer according to the following criteria.
A:塗膜完全未脫落,擦拭過之部分與未擦拭之部分的剝離力沒有差異(可實用之程度) A: The coating film does not fall off at all, and there is no difference in the peeling force between the wiped portion and the unwiped portion (a practical degree)
B:塗膜皆未脫落,擦拭過之部分相較於未擦拭之部分,剝離力稍微變重(可實用之程度) B: The coating film is not peeled off, and the peeling force is slightly heavier than the unwiped portion (a practical degree)
C:塗膜雖然變白但未脫落,擦拭過之部分相較於未擦拭之部分,剝離力稍微變重(可實用之程度〉 C: Although the coating film turns white but does not fall off, the peeling force is slightly heavier than the unwiped portion (a practical degree)
D:可確認塗膜的脫落(難以實用之程度) D: The peeling of the coating film can be confirmed (the degree of difficulty in practical use)
觀察於兩面設置了離型薄膜之光學用無基材之兩面黏 著薄片,評價異物的檢査性。 Observing the two sides of the optical substrate without the substrate provided with the release film on both sides A sheet is used to evaluate the checkability of foreign matter.
A:沒有表面寡聚物,檢査性良好。 A: There is no surface oligomer, and the inspection property is good.
B:表面寡聚物雖被檢出,但為不阻礙檢査性的程度。 B: Although the surface oligomer was detected, it did not inhibit the degree of inspectability.
C:表面寡聚物有多數被檢出,無法順利地檢査。 C: A large number of surface oligomers were detected and could not be checked smoothly.
精秤於聚酯中去除了非相溶的其他聚合物成分及顏料之聚酯1g,加入苯酚/四氯乙烷=50/50(重量比)之混合溶劑100ml而使其溶解,於30℃下測定。 The fine scale removes 1 g of the non-compatible other polymer component and the polyester of the pigment in the polyester, and dissolves it by adding 100 ml of a mixed solvent of phenol/tetrachloroethane = 50/50 (weight ratio) at 30 ° C. Determined below.
使用PerkinElmer公司製DSC-II型測定裝置,將樣品重量10mg於氮氣流下以昇溫速度10℃/分昇溫,使基線的偏起開始溫度為Tg。 Using a DSC-II type measuring apparatus manufactured by PerkinElmer Co., Ltd., a sample weight of 10 mg was heated at a temperature increase rate of 10 ° C /min under a nitrogen gas flow so that the base deflection starting temperature was Tg.
於試料薄膜的離型層表面貼附黏著膠帶(日東電工製「No.31B」)之後,切成50mm×300mm之大小,測定室溫下放置1小時後之剝離力。剝離力係使用高速剝離試驗機(TESTER SANGYO(製)高速剝離試驗機「TE-702型」),以使試料薄膜的離型面為上面之方式來固定,以將貼合著的對手方No.31B黏著膠帶予以剝離之要領,於剝離速度0.3m/分、60m/分之各測定條件下進行180°剝 離。 Adhesive tape ("No. 31B" manufactured by Nitto Denko Corporation) was attached to the surface of the release layer of the sample film, and then cut into a size of 50 mm × 300 mm, and the peeling force after standing at room temperature for 1 hour was measured. For the peeling force, a high-speed peeling tester (TESTER SANGYO high-speed peeling tester "TE-702 type") was used to fix the release film of the sample film so as to adhere to the opponent No. .31B Adhesive tape is peeled off, and stripped at 180° peeling speed of 0.3m/min and 60m/min. from.
將試料薄膜放置於恆溫恆濕槽中,在60℃、80%RH氛圍下放置4週,之後取出試料薄膜。然後,藉由觸手擦拭試料薄膜的離型面5次,依下述判定基準判定離型層之脫落程度。 The sample film was placed in a constant temperature and humidity chamber, and allowed to stand in an atmosphere of 60 ° C and 80% RH for 4 weeks, and then the sample film was taken out. Then, the release surface of the sample film was wiped five times by a tentacle, and the degree of detachment of the release layer was determined according to the following criteria.
A:未見塗膜的脫落(可實用之程度) A: No peeling of the coating film (a practical degree)
B:塗膜雖變白但未脫落(可實用之程度〉 B: Although the coating film turns white but does not fall off (the degree of practicality)
C:可確認塗膜的脫落(難以實用之程度) C: The peeling of the coating film can be confirmed (the degree of difficulty in practical use)
第1離型薄膜剝離時,有關第2離型層與黏著劑層界面的狀況,係依下述判定基準進行官能評價。 When the first release film was peeled off, the state of the interface between the second release layer and the adhesive layer was evaluated by the following criteria.
A:在第2離型層與黏著劑層界面未見異常(實用上沒問題之程度)。 A: No abnormality was observed at the interface between the second release layer and the adhesive layer (the extent of practical use).
B:在第2離型層與黏著劑層界面,稍微看見浮起(實用上會成為問題之程度)。 B: At the interface between the second release layer and the adhesive layer, the floating is slightly seen (the extent of the problem in practical use).
C:在第2離型層與黏著劑層界面,可見明確的浮起 (實用上有問題之程度)。 C: at the interface between the second release layer and the adhesive layer, a clear floating can be seen (The extent of practical problems).
無基材之兩面黏著薄片的製造中,確認是否弄髒輥,且藉由下述判定基準來進行官能評價。 In the production of the double-sided adhesive sheet without the substrate, it was confirmed whether or not the roller was soiled, and the sensory evaluation was performed by the following criteria.
A:輥並未弄髒(實用上沒問題之程度)。 A: The roller is not dirty (the extent of practical use).
B:輥僅因移行成分而稍有髒污(實用上會成為問題之程度)。 B: The roller is slightly dirty only due to the migration component (a practical degree of problem).
C:輥被移行成分弄髒,產生轉印髒污(實用上有問題之程度)。 C: The roller is soiled by the moving component, causing transfer dirt (a practical problem).
基於下述(6-1)之方法,測定試料薄膜的離型層表面中之表面固有電阻。(6-1)之方法,因無法測得較1×108Ω更高的表面固有電阻,以(6-1)無法測定之樣品係使用(6-2)之方法。 The surface specific resistance in the surface of the release layer of the sample film was measured based on the method (6-1) below. In the method of (6-1), since the surface specific resistance higher than 1 × 10 8 Ω cannot be measured, the method of (6-1) which cannot be measured is used (6-2).
(6-1)三菱化學公司製低電阻率計:使用Loresta-GP MCP-T600,以23℃、50%RH之測定氛圍,將樣品調濕30分鐘後,測定表面固有電阻值。 (6-1) Low resistivity meter manufactured by Mitsubishi Chemical Corporation: The surface specific resistance value was measured by measuring the atmosphere at 23 ° C and 50% RH using a Loresta-GP MCP-T600 for 30 minutes.
(6-2)日本Hewlett-Packard公司製高電阻測定器:使用 HP4339B及測定電極:HP16008B,於23℃、50%RH之測定氛圍,將樣品調濕30分鐘後,測定表面固有電阻值。 (6-2) High-resistance measuring device made by Hewlett-Packard Company, Japan: use HP4339B and measuring electrode: HP16008B, the sample was conditioned for 30 minutes at 23 ° C, 50% RH, and the surface specific resistance value was measured.
A:R(Ω)為1×108以下(可實用之程度、特別是,良好) A: R (Ω) is 1 × 10 8 or less (a practical degree, in particular, good)
B:R(Ω)為1×109以下(可實用之程度) B: R (Ω) is 1 × 10 9 or less (a practical degree)
C:R(Ω)為1×1010以下(實用上會有問題之程度) C: R (Ω) is 1 × 10 10 or less (the degree of practical problems)
D:R(Ω)超過1×1010(難以實用之程度) D: R (Ω) exceeds 1 × 10 10 (the degree of difficulty is practical)
實施例及比較例中使用的聚酯,乃是以下述方式準備的。 The polyesters used in the examples and comparative examples were prepared in the following manner.
使對苯二甲酸二甲基酯100重量份與乙二醇60重量份作為出發原料,再將作為觸媒之乙酸鎂‧四水鹽0.09重量份置入反應器中,使反應開始溫度為150℃,在餾去甲醇的同時緩慢地使反應溫度上昇,3小時後為230℃。4小時後實質地使酯交換反應結束。於此反應混合物中添加酸式乙基磷酸酯0.04份之後,添加使其分散於平均粒子徑1.6μm之乙二醇的氧化矽粒子0.06份、三氧化銻0.04份,進行4小時聚縮合反應。即,將溫度自230℃緩慢地昇溫為280℃。此外,壓力係由常壓緩慢地減少,最終為0.3mmHg。反應開始後,在經過4小時的時間點停止反 應,於氮加壓下使聚合物吐出。所得之聚酯(1)之極限黏度為0.53。 100 parts by weight of dimethyl terephthalate and 60 parts by weight of ethylene glycol were used as starting materials, and 0.09 parts by weight of magnesium acetate ‧ tetrahydrate as a catalyst was placed in a reactor to set a reaction initiation temperature of 150. At ° C, the reaction temperature was slowly raised while distilling off methanol, and it was 230 ° C after 3 hours. The transesterification reaction was substantially completed after 4 hours. After 0.04 parts of the acid ethyl phosphate was added to the reaction mixture, 0.06 parts of cerium oxide particles and 0.04 parts of cerium oxide dispersed in ethylene glycol having an average particle diameter of 1.6 μm were added, and a polycondensation reaction was carried out for 4 hours. That is, the temperature was slowly raised from 230 ° C to 280 ° C. In addition, the pressure system is slowly reduced from normal pressure, and finally is 0.3 mmHg. After the reaction started, stop at the time of 4 hours. The polymer should be spit out under nitrogen pressure. The resulting polyester (1) had an ultimate viscosity of 0.53.
將前述聚酯(1)作為原料,供給至附通氣孔之壓出機,在290℃予以熔融壓出後,使用外加靜電密著法於已設定表面溫度至40℃之冷卻輥上進行冷卻固化,獲得厚度約550μm之無定形薄膜。將此薄膜在85℃下於長邊方向延伸3.7倍,在100℃下於寬邊方向延伸3.9倍,在210℃進行熱處理,獲得厚度38μm之二軸延伸聚酯薄膜。 The polyester (1) is supplied as a raw material to an extruder equipped with a vent hole, and is melt-extruded at 290 ° C, and then cooled and solidified on a cooling roll having a surface temperature of 40 ° C by an external electrostatic chucking method. An amorphous film having a thickness of about 550 μm was obtained. This film was stretched 3.7 times in the longitudinal direction at 85 ° C, and extended 3.9 times in the width direction at 100 ° C, and heat-treated at 210 ° C to obtain a biaxially stretched polyester film having a thickness of 38 μm.
於所得之聚酯薄膜,係以使塗佈量(乾燥後)成為0.12g/m2之方式藉由反向凹版塗佈方式塗佈由下述所示之離型劑組成-A所成的離型劑,並以吹乾機溫度150℃、線速度30m/分之條件,獲得輥狀的離型聚酯薄膜。 The obtained polyester film was coated by a reverse gravure coating method to form a release agent composition -A shown below by a coating amount (after drying) of 0.12 g/m 2 . A release agent was obtained, and a roll-shaped release polyester film was obtained under the conditions of a dryer temperature of 150 ° C and a linear velocity of 30 m / min.
‧a1:甲基與己烯基與苯基之比為100:1:0.1之前述一般式(I)之硬化型聚矽氧樹脂(分子量200000) ‧ a1: a hardened polyoxyxylene resin of the above general formula (I) having a ratio of methyl group to hexenyl group to phenyl group of 100:1:0.1 (molecular weight: 200,000)
‧a2:甲基與乙烯基之比為100:0.2之前述一般式(II)之硬化型聚矽氧樹脂(分子量200000) ‧ a2: a hardened polyxanthene resin of the above general formula (II) having a methyl to vinyl ratio of 100:0.2 (molecular weight: 200,000)
‧a3:甲基與氫化矽烷基之比為100:1.5之前述一般式 (III)之硬化型聚矽氧樹脂(分子量200000) ‧a3: the general formula of the ratio of methyl group to hydrogenated decyl group of 100:1.5 (III) hardened polyoxynoxy resin (molecular weight 200000)
‧a4:甲基與氫化矽烷基之比為100:0.4之前述一般式(III)之硬化型聚矽氧樹脂(分子量200000) ‧ a4: a hardened polyxanthene resin of the above general formula (III) having a ratio of methyl group to hydrogenated decyl group of 100:0.4 (molecular weight: 200000)
‧b1:前述一般式(IV)之未反應性聚矽氧樹脂(分子量80000) ‧b1: Unreacted polyoxyxylene resin of the above general formula (IV) (molecular weight: 80000)
‧c1:加成型鉑觸媒(PL-50T:信越化學工業製) ‧c1: Addition of platinum catalyst (PL-50T: Shin-Etsu Chemical Co., Ltd.)
硬化型聚矽氧樹脂a1 20份 Hardened polyoxyl resin a1 20 parts
未反應性聚矽氧樹脂b1 0.2份 Unreacted polyoxyl resin b1 0.2 parts
加成型鉑觸媒c1 0.2份 Addition of platinum catalyst c1 0.2 parts
MEK/甲苯混合溶劑(混合比率為1:1) MEK/toluene mixed solvent (mixing ratio is 1:1)
實施例1-1中,除了將離型劑組成變更為下述表2所示之塗佈劑組成以外,其餘係與實施例1同樣地實施製造,獲得離型薄膜。整理所得之結果,顯示於下述表3中。 In the same manner as in Example 1, except that the composition of the release agent was changed to the composition of the coating agent shown in Table 2 below, a release film was obtained. The results obtained by the finishing are shown in Table 3 below.
與實施例1-1同樣實施,得到厚度38μm之二軸延伸聚酯薄膜。 The same procedure as in Example 1-1 was carried out to obtain a biaxially stretched polyester film having a thickness of 38 μm.
接著,以使塗佈量(乾燥後)成為0.05g/m2之方式藉由反向凹版塗佈方式塗佈下述塗佈劑後,以120℃熱處理 30秒鐘。構成塗佈層之化合物例如下。 Next, the following coating agent was applied by reverse gravure coating so that the coating amount (after drying) was 0.05 g/m 2 , and then heat treatment was performed at 120 ° C for 30 seconds. The compound constituting the coating layer is, for example, the following.
‧具有鋁元素之有機化合物:(A1) ‧ Organic compounds with aluminum: (A1)
鋁參(乙醯乙酸乙酯) Aluminum ginseng (acetic acid ethyl acetate)
‧具有錫元素之有機化合物:(A2) ‧ Organic compounds with tin: (A2)
二辛基二乙醯氧基錫 Dioctyldiethoxytin oxide
‧有機矽化合物:(B1) ‧Organic compound: (B1)
2-(3,4-環氧環己基)乙基三甲氧基矽烷 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane
具有鋁元素之有機化合物(A1):33重量% Organic compound with aluminum element (A1): 33% by weight
有機矽化合物(B1):67重量% Organic germanium compound (B1): 67% by weight
將上述塗佈劑以甲苯/MEK混合溶劑(混合比率為1:4)稀釋,成為4重量%。 The coating agent was diluted with a toluene/MEK mixed solvent (mixing ratio of 1:4) to be 4% by weight.
然後,於塗佈層上藉由反向凹版塗佈方式以使塗佈量(乾燥後)成為0.12g/m2之方式塗佈由下述示所成之離型劑組成所成之離型劑,在吹乾機溫度150℃、線速度30m/分之條件下獲得輥狀的離型聚酯薄膜。 Then, the coating layer was applied by a reverse gravure coating method so that the coating amount (after drying) was 0.12 g/m 2 to form a release agent composed of the release agent composition shown below. A roll-shaped release polyester film was obtained under the conditions of a dryer temperature of 150 ° C and a linear velocity of 30 m / min.
a1:甲基與己烯基與苯基之比為100:1:0.1之前述一般式(I)之硬化型聚矽氧樹脂(分子量200000) A1: a hardened polyxanthene resin of the above general formula (I) having a ratio of methyl group to hexenyl group to phenyl group of 100:1:0.1 (molecular weight: 200,000)
a2:甲基與乙烯基之比為100:0.2之前述一般式(II)之 硬化型聚矽氧樹脂(分子量200000) A2: the general formula (II) of the above ratio of methyl group to vinyl group of 100:0.2 Hardened polyoxynoxy resin (molecular weight 200000)
a3:甲基與氫化矽烷基之比為100:1.5之前述一般式(III)之硬化型聚矽氧樹脂(分子量200000) A3: a hardened polyxanthene resin of the above general formula (III) having a ratio of a methyl group to a hydrogenated decyl group of 100: 1.5 (molecular weight: 200,000)
a4:甲基與氫化矽烷基之比為100:0.4之前述一般式(III)之硬化型聚矽氧樹脂(分子量200000) A4: a hardened polyxanthene resin of the above general formula (III) having a ratio of a methyl group to a hydrazine alkyl group of 100:0.4 (molecular weight: 200,000)
b1:前述一般式(IV)之未反應性聚矽氧樹脂(分子量80000) B1: the unreacted polyanthracene resin of the above general formula (IV) (molecular weight: 80000)
c1:加成型鉑觸媒(PL-50T:信越化學工業製) C1: Addition of platinum catalyst (PL-50T: Shin-Etsu Chemical Co., Ltd.)
實施例2-1中,除了使塗佈劑組成變更為下述表4所示之塗佈劑組成、將離型劑組成變更為下述表5所示之離型劑組成以外,其餘係與實施例2-1同樣地實施製造,得到離型薄膜。將上述實施例及比較例所得之各離型薄膜的特性列示於下述表6。 In the example 2-1, except that the coating agent composition was changed to the coating agent composition shown in the following Table 4, and the release agent composition was changed to the release agent composition shown in the following Table 5, In the same manner as in Example 2-1, a release film was obtained. The properties of the release films obtained in the above examples and comparative examples are shown in Table 6 below.
將前述聚酯(1)作為原料,供給至附通氣孔之壓出 機,在290℃予以熔融壓出後,使用外加靜電密著法於已設定表面溫度至40℃之冷卻輥上進行冷卻固化,而得厚度約600μm之無定形薄膜。將此薄膜在85℃下於長邊方向延伸3.3倍,在100℃下於寬邊方向延伸3.6倍,在210℃進行熱處理,得到厚度50μm之二軸延伸聚酯薄膜。 The polyester (1) is used as a raw material and is supplied to the vent hole. After melt-extrusion at 290 ° C, the film was cooled and solidified on a cooling roll having a surface temperature of 40 ° C by an external electrostatic adhesion method to obtain an amorphous film having a thickness of about 600 μm. This film was stretched 3.3 times in the longitudinal direction at 85 ° C, and stretched 3.6 times in the width direction at 100 ° C, and heat-treated at 210 ° C to obtain a biaxially stretched polyester film having a thickness of 50 μm.
將前述聚酯(1)作為原料,供給至附通氣孔之壓出機,在290℃予以熔融壓出後,使用外加靜電密著法於已設定表面溫度至40℃之冷卻輥上進行冷卻固化,而得厚度約1200μm之無定形薄膜。將此薄膜在85℃下於長邊方向延伸3.3倍,在100℃下於寬邊方向延伸3.6倍,在210℃進行熱處理,得到厚度100μm之二軸延伸聚酯薄膜。 The polyester (1) is supplied as a raw material to an extruder equipped with a vent hole, and is melt-extruded at 290 ° C, and then cooled and solidified on a cooling roll having a surface temperature of 40 ° C by an external electrostatic chucking method. Thus, an amorphous film having a thickness of about 1200 μm is obtained. This film was stretched 3.3 times in the longitudinal direction at 85 ° C, and stretched 3.6 times in the width direction at 100 ° C, and heat-treated at 210 ° C to obtain a biaxially stretched polyester film having a thickness of 100 μm.
藉由反向凹版塗佈方式於聚酯薄膜-1以使塗佈量(乾燥後)成為0.1g/m2之方式塗佈設置由下述離型劑組成A所成之離型劑,在150℃進行30秒鐘熱處理之後,得到第1離型薄膜。 The release film composed of the following release agent composition A was applied to the polyester film-1 by a reverse gravure coating method so that the coating amount (after drying) became 0.1 g/m 2 . After heat treatment at 150 ° C for 30 seconds, a first release film was obtained.
a1:硬化型聚矽氧樹脂(LTC310:Dow Corning Toray製) A1: Hardened polyoxyl resin (LTC310: Dow Corning Toray system)
a2:硬化型聚矽氧樹脂(LTC303E:Dow Corning Toray製 移行成分含有率15%) A2: Hardened polyoxynoxy resin (LTC303E: Transition component content of Dow Corning Toray is 15%)
a3:硬化型聚矽氧樹脂(KS-847H:信越化學工業製) A3: Hardened polyoxyl resin (KS-847H: Shin-Etsu Chemical Co., Ltd.)
a4:硬化型聚矽氧樹脂(SD-7292:Dow Corning Toray製) A4: Hardened polyoxyl resin (SD-7292: manufactured by Dow Corning Toray)
b1:質量平均分子量400000以上之未反應性聚矽氧樹脂 B1: unreactive polyxanthene resin having a mass average molecular weight of 400,000 or more
c1:加成型鉑觸媒(SRX212:Dow Corning Toray製) C1: Addition of platinum catalyst (SRX212: manufactured by Dow Corning Toray)
c2:加成型鉑觸媒(PL-50T:信越化學工業製) C2: Addition of platinum catalyst (PL-50T: Shin-Etsu Chemical Co., Ltd.)
硬化型聚矽氧樹脂a1 20份 Hardened polyoxyl resin a1 20 parts
未反應性聚矽氧樹脂b1 0.2份 Unreacted polyoxyl resin b1 0.2 parts
加成型鉑觸媒c1 0.2份 Addition of platinum catalyst c1 0.2 parts
MEK/甲苯混合溶劑(混合比率為1:1) MEK/toluene mixed solvent (mixing ratio is 1:1)
藉由反向凹版塗佈方式於聚酯薄膜-2以使塗佈量(乾燥後)成為0.1g/m2之方式塗佈設置由下述離型劑組成B所成之離型劑,在150℃進行30秒鐘熱處理之後,得到第2離型薄膜。 The release film composed of the following release agent composition B was applied to the polyester film-2 by a reverse gravure coating method so that the coating amount (after drying) was 0.1 g/m 2 . After heat treatment at 150 ° C for 30 seconds, a second release film was obtained.
硬化型聚矽氧樹脂a3 19份 Hardened polyoxyl resin a3 19 parts
硬化型聚矽氧樹脂a4 1份 Hardened polyoxyl resin a4 1 part
加成型鉑觸媒c1 0.2份 Addition of platinum catalyst c1 0.2 parts
MEK/甲苯混合溶劑(混合比率為1:1) MEK/toluene mixed solvent (mixing ratio is 1:1)
於所得之第2離型薄膜的離型層上,塗佈由下述丙烯酸系黏著劑組成物所構成之塗佈液後,在100℃進行5分鐘熱處理,得到塗佈量(乾燥後)為50μm之黏著劑層。 The coating liquid composed of the following acrylic pressure-sensitive adhesive composition was applied onto the release layer of the obtained second release film, and then heat-treated at 100 ° C for 5 minutes to obtain a coating amount (after drying). 50 μm adhesive layer.
相對於將2-乙基己基丙烯酸酯75質量份、乙酸乙烯基酯20質量份、丙烯酸5質量份之3成分予以無規共聚而成之丙烯酸酯共聚物(Mw=540000 Mn=67000 Mw/Mn=8理論Tg-50℃)1kg,係混合作為光聚合性起始劑之4-苯基二苯甲酮20g而形成黏著層。 An acrylate copolymer obtained by randomly copolymerizing 75 parts by mass of 2-ethylhexyl acrylate, 20 parts by mass of vinyl acetate, and 5 parts by mass of acrylic acid (Mw=540000 Mn=67000 Mw/Mn = 8 theoretical Tg - 50 ° C) 1 kg, and 20 g of 4-phenylbenzophenone as a photopolymerization initiator was mixed to form an adhesive layer.
接著,於露出之黏著層表面貼合第1離型薄膜,得到無基材之兩面黏著薄片。 Next, the first release film was bonded to the exposed surface of the adhesive layer to obtain a two-sided adhesive sheet having no substrate.
實施例3-1中,除了將離型劑組成、聚酯薄膜基材厚度變更如下述表7、表8中所示以外,其餘的係與實施例 3-1同樣地實施製造,得到第1離型薄膜、第2離型薄膜。然後,用兩者而透過黏著劑層予以貼合,得到無基材之兩面黏著薄片。將上述實施例及比較例所得之各離型薄膜的特性顯示於表8。 In Example 3-1, except that the release agent composition and the thickness of the polyester film substrate were changed as shown in Tables 7 and 8 below, the other systems and examples were 3-1 was similarly manufactured, and the first release film and the second release film were obtained. Then, the two are adhered through the adhesive layer to obtain a two-sided adhesive sheet having no substrate. The characteristics of the release films obtained in the above examples and comparative examples are shown in Table 8.
將前述聚酯(1)作為原料,供給至附通氣孔之壓出 機,在290℃予以熔融壓出後,使用外加靜電密著法於已設定表面溫度至40℃之冷卻輥上進行冷卻固化,而得厚度約600μm之無定形薄膜。將此薄膜在85℃下於長邊方向延伸3.3倍,以使塗佈厚度(乾燥後)成為0.03g/m2之方式塗佈由下述塗佈劑組成所構成之塗佈層後,在100℃下於寬邊方向延伸3.6倍,在210℃進行熱處理,得到厚度50μm之二軸延伸聚酯薄膜。 The polyester (1) is supplied as a raw material to an extruder equipped with a vent hole, and is melt-extruded at 290 ° C, and then cooled and solidified on a cooling roll having a surface temperature of 40 ° C by an external electrostatic chucking method. Thus, an amorphous film having a thickness of about 600 μm is obtained. This film was stretched 3.3 times in the longitudinal direction at 85 ° C to apply a coating layer composed of the following coating agent so that the coating thickness (after drying) was 0.03 g/m 2 . The film was stretched 3.6 times in the width direction at 100 ° C, and heat-treated at 210 ° C to obtain a biaxially stretched polyester film having a thickness of 50 μm.
將前述聚酯(1)作為原料,供給至附通氣孔之壓出機,在290℃予以熔融壓出後,使用外加靜電密著法於已設定表面溫度至40℃之冷卻輥上進行冷卻固化,而得厚度約1200μm之無定形薄膜。將此薄膜在85℃下於長邊方向延伸3.3倍,以使塗佈厚度(乾燥後)成為0.03g/m2之方式塗佈由下述塗佈劑組成所構成之塗佈層後,在100℃下於寬邊方向延伸3.6倍,在210℃進行熱處理,得到厚度100μm之二軸延伸聚酯薄膜。 The polyester (1) is supplied as a raw material to an extruder equipped with a vent hole, and is melt-extruded at 290 ° C, and then cooled and solidified on a cooling roll having a surface temperature of 40 ° C by an external electrostatic chucking method. Thus, an amorphous film having a thickness of about 1200 μm is obtained. This film was stretched 3.3 times in the longitudinal direction at 85 ° C to apply a coating layer composed of the following coating agent so that the coating thickness (after drying) was 0.03 g/m 2 . The film was stretched 3.6 times in the width direction at 100 ° C, and heat-treated at 210 ° C to obtain a biaxially stretched polyester film having a thickness of 100 μm.
(A):由聚伸乙基二氧基噻吩與聚苯乙烯磺酸所成之Starck股份公司製BaytronPAG (A): Baytron PAG manufactured by Starck AG, which is made of polyethylene oxythiophene and polystyrene sulfonic acid
(B):聚胺基甲酸酯樹脂 (B): Polyurethane resin
獲得由對苯二甲酸664份、間苯二甲酸631份、1,4-丁烷二醇472份、新戊二醇447份所成之聚酯多元醇。接 著,於所得之聚酯多元醇中加入己二酸321份、二羥甲基丙酸268份,得到含短鏈羧基之聚酯多元醇。再者,於前述聚酯多元醇1880份中加入六亞甲基二異氰酸酯160份,得到聚胺基甲酸酯樹脂水性塗料。 A polyester polyol obtained from 664 parts of terephthalic acid, 631 parts of isophthalic acid, 472 parts of 1,4-butanediol, and 447 parts of neopentyl glycol was obtained. Connect 321 parts of adipic acid and 268 parts of dimethylolpropionic acid were added to the obtained polyester polyol to obtain a polyester polyol having a short-chain carboxyl group. Further, 160 parts of hexamethylene diisocyanate was added to 1880 parts of the above polyester polyol to obtain a polyurethane coating resin aqueous coating material.
(C):前述式(3)中n=1之丙三醇 (C): glycerol with n=1 in the above formula (3)
A/B/C=40/40/20(重量%) A/B/C=40/40/20 (% by weight)
<第1離型薄膜的製造> <Manufacture of the first release film>
藉由反向凹版塗佈方式而於聚酯薄膜-1上以使塗佈量(乾燥後)成為0.1g/m2之方式塗佈設置由下述離型劑組成A所成之離型劑,在150℃進行30秒鐘熱處理之後,得到第1離型薄膜。 A release agent composed of the following release agent composition A was applied to the polyester film-1 by a reverse gravure coating method so that the coating amount (after drying) became 0.1 g/m 2 . After heat treatment at 150 ° C for 30 seconds, a first release film was obtained.
a1:硬化型聚矽氧樹脂(LTC310:Dow Corning Toray製) A1: Hardened polyoxyl resin (LTC310: manufactured by Dow Corning Toray)
a2:硬化型聚矽氧樹脂(LTC303E:Dow Corning Toray製、移行成分含有率15%) A2: Hardened polyoxynoxy resin (LTC303E: manufactured by Dow Corning Toray, transition component content: 15%)
a3:硬化型聚矽氧樹脂(KS-847H:信越化學工業製) A3: Hardened polyoxyl resin (KS-847H: Shin-Etsu Chemical Co., Ltd.)
a4:硬化型聚矽氧樹脂(SD-7292:Dow Corning Toray製) A4: Hardened polyoxyl resin (SD-7292: manufactured by Dow Corning Toray)
b1:質量平均分子量400000以上之未反應性聚矽氧樹脂 B1: unreactive polyxanthene resin having a mass average molecular weight of 400,000 or more
c1:加成型鉑觸媒(SRX212:Dow Corning Toray製) C1: Addition of platinum catalyst (SRX212: manufactured by Dow Corning Toray)
c2:加成型鉑觸媒(PL-50T:信越化學工業製) C2: Addition of platinum catalyst (PL-50T: Shin-Etsu Chemical Co., Ltd.)
硬化型聚矽氧樹脂a1 20份 Hardened polyoxyl resin a1 20 parts
未反應性聚矽氧樹脂b1 0.2份 Unreacted polyoxyl resin b1 0.2 parts
加成型鉑觸媒c1 0.2份 Addition of platinum catalyst c1 0.2 parts
MEK/甲苯混合溶劑(混合比率為1:1) MEK/toluene mixed solvent (mixing ratio is 1:1)
藉由反向凹版塗佈方式,於聚酯薄膜-2上以使塗佈量(乾燥後)成為0.1g/m2之方式塗佈設置由下述離型劑組成B所成之離型劑,在150℃進行30秒鐘熱處理之後,得到第2離型薄膜。 By using a reverse gravure coating method, a release agent composed of the following release agent composition B was applied to the polyester film-2 so that the coating amount (after drying) became 0.1 g/m 2 . After heat treatment at 150 ° C for 30 seconds, a second release film was obtained.
硬化型聚矽氧樹脂a3 19份 Hardened polyoxyl resin a3 19 parts
硬化型聚矽氧樹脂a4 1份 Hardened polyoxyl resin a4 1 part
加成型鉑觸媒c1 0.2份 Addition of platinum catalyst c1 0.2 parts
MEK/甲苯混合溶劑(混合比率為1:1) MEK/toluene mixed solvent (mixing ratio is 1:1)
於所得之第2離型薄膜的離型層上,塗佈由下述丙烯酸系黏著劑組成物所構成之塗佈液後,在100℃熱處理5分鐘,得到塗佈量(乾燥後)為50μm之黏著劑層。 The coating liquid composed of the following acrylic pressure-sensitive adhesive composition was applied onto the release layer of the obtained second release film, and then heat-treated at 100 ° C for 5 minutes to obtain a coating amount (after drying) of 50 μm. Adhesive layer.
相對於將2-乙基己基丙烯酸酯75質量份、乙酸乙烯基酯20質量份、丙烯酸5質量份之3成分予以無規共聚而成之丙烯酸酯共聚物(Mw=540000 Mn=67000 Mw/Mn=8理論Tg-50℃)1kg,混合作為光聚合性起始劑之4-苯基二苯甲酮20g而形成黏著層。 An acrylate copolymer obtained by randomly copolymerizing 75 parts by mass of 2-ethylhexyl acrylate, 20 parts by mass of vinyl acetate, and 5 parts by mass of acrylic acid (Mw=540000 Mn=67000 Mw/Mn = 8 theoretical Tg - 50 ° C) 1 kg, and 20 g of 4-phenylbenzophenone as a photopolymerization initiator was mixed to form an adhesive layer.
接著,於露出之黏著層表面使第1離型薄膜貼合,得到無基材之兩面黏著薄片。 Next, the first release film was bonded to the exposed surface of the adhesive layer to obtain a two-sided adhesive sheet having no substrate.
實施例4-1中,除了將塗佈劑組成、離型劑組成、聚酯薄膜基材厚度變更如下述表9、表10所示之外,其餘係與實施例4-1同樣地實施製造,得到第1離型薄膜、第2離型薄膜。然後,使用兩者再透過黏著劑層予以貼合,得到無基材之兩面黏著薄片。將上述實施例及比較例所得之各離型薄膜的特性顯示於下述表11、表12。 In the same manner as in Example 4-1, except that the coating agent composition, the release agent composition, and the thickness of the polyester film substrate were changed as shown in Tables 9 and 10 below. A first release film and a second release film were obtained. Then, the two layers are bonded together through the adhesive layer to obtain a two-sided adhesive sheet having no substrate. The properties of the release films obtained in the above examples and comparative examples are shown in Tables 11 and 12 below.
本發明之離型薄膜,乃是從黏著劑之離型性良好,且移行性少,而適合利用於例如靜電容量方式之觸控面板製造用等、液晶顯示器(LCD)中所用的偏光板、相位差板等之LCD構成構件製造用、電漿顯示器面板構成構件製造用、有機電致發光構成構件製造用等,除了各種顯示器構成構件製造用之外,也適用於各種黏著劑層保護用途。 The release film of the present invention is excellent in release property from an adhesive and has little transition property, and is suitable for use in, for example, a touch panel manufacturing of a capacitance type, a polarizing plate used in a liquid crystal display (LCD), The manufacture of the LCD component such as the phase difference plate, the manufacture of the plasma display panel constituent member, the manufacture of the organic electroluminescence component, and the like are also applicable to various adhesive layer protection applications in addition to the manufacture of various display constituent members.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-059601 | 2015-03-23 | ||
| JP2015059601A JP6488805B2 (en) | 2015-03-23 | 2015-03-23 | Substrate-less double-sided adhesive sheet |
| JP2015067803A JP6488819B2 (en) | 2015-03-30 | 2015-03-30 | Substrate-less double-sided adhesive sheet |
| JP2015067804A JP2016187871A (en) | 2015-03-30 | 2015-03-30 | Release film |
| JP2015-067802 | 2015-03-30 | ||
| JP2015-067803 | 2015-03-30 | ||
| JP2015-067804 | 2015-03-30 | ||
| JP2015067802A JP2016188265A (en) | 2015-03-30 | 2015-03-30 | Release film |
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| CN107868623A (en) * | 2017-10-18 | 2018-04-03 | 嘉善宇达电子有限公司 | One kind can resistant to elevated temperatures double faced adhesive tape |
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| JP6691702B2 (en) * | 2016-03-01 | 2020-05-13 | 東レフィルム加工株式会社 | Release film |
| KR102240076B1 (en) * | 2017-11-10 | 2021-04-14 | 주식회사 엘지화학 | Release composition and release film comprising release layer comprising cured product of the same |
| JP7304143B2 (en) * | 2018-02-13 | 2023-07-06 | 日東電工株式会社 | Adhesive sheet and adhesive sheet laminate |
| KR101973155B1 (en) * | 2018-12-10 | 2019-04-26 | (주)딥스원에듀 | Dot film, multi-layers optic sheet and smart electric board |
| JP7285641B2 (en) * | 2018-12-21 | 2023-06-02 | 日東電工株式会社 | Adhesive sheet with release film and method for producing the same |
| JP7664677B2 (en) | 2018-12-25 | 2025-04-18 | 信越化学工業株式会社 | Silicone release agent composition, release paper and release film |
| KR102306997B1 (en) | 2019-11-11 | 2021-09-29 | 도레이첨단소재 주식회사 | Release film for ultra-light release |
| KR102227259B1 (en) * | 2019-12-12 | 2021-03-11 | 도레이첨단소재 주식회사 | Adhesive composition for carrier film and carrier film comprising the same |
| WO2021124865A1 (en) * | 2019-12-17 | 2021-06-24 | 東洋紡株式会社 | Laminate body |
| JP2022038978A (en) * | 2020-08-27 | 2022-03-10 | 日東電工株式会社 | Optical laminate and method of manufacturing polarizing plate using the same |
| CN114654626A (en) * | 2022-03-18 | 2022-06-24 | 惠州市金亮丽塑胶制品有限公司 | Composite plastic processing release agent and preparation method thereof |
| KR102706835B1 (en) * | 2022-08-05 | 2024-09-20 | 미쯔비시 케미컬 주식회사 | Heteromorphic film |
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| JP2001179892A (en) * | 1999-12-22 | 2001-07-03 | Teijin Ltd | Release film |
| JP4941909B2 (en) * | 2006-06-30 | 2012-05-30 | 東レフィルム加工株式会社 | Release film |
| KR100836177B1 (en) * | 2007-03-16 | 2008-06-09 | 도레이새한 주식회사 | Antistatic Silicone Release Film |
| JP4837613B2 (en) * | 2007-03-30 | 2011-12-14 | リンテック株式会社 | Release film and method for producing release film |
| JP2011132524A (en) * | 2009-11-30 | 2011-07-07 | Adoweru:Kk | Release agent composition and release liner using the same |
| JP2012025088A (en) | 2010-07-27 | 2012-02-09 | Mitsubishi Plastics Inc | Polyester film for substrate-less double-sided adhesive sheet |
| JP2012179888A (en) | 2011-02-09 | 2012-09-20 | Mitsubishi Plastics Inc | Polyester film for substrate-less double-sided adhesive sheet |
| JP2012159548A (en) * | 2011-01-31 | 2012-08-23 | Mitsubishi Plastics Inc | Mold-release polyester film for polarizing plate |
| CN103229080B (en) * | 2010-12-27 | 2015-11-25 | 三菱树脂株式会社 | Mold release film |
| JP2012223904A (en) * | 2011-04-15 | 2012-11-15 | Nitto Denko Corp | Transparent resin film with pressure-sensitive adhesive layer, laminated film, and touch panel |
| JP2012224011A (en) * | 2011-04-21 | 2012-11-15 | Lintec Corp | Release film for ceramic green sheet manufacturing process |
| JP6081123B2 (en) * | 2011-10-08 | 2017-02-15 | 三菱樹脂株式会社 | Substrate-less double-sided adhesive sheet |
| CN104781359B (en) * | 2012-11-22 | 2017-04-05 | 三菱树脂株式会社 | Without base material double-sided adhesive sheet |
| JP6390150B2 (en) * | 2014-04-25 | 2018-09-19 | 三菱ケミカル株式会社 | Polyester film |
-
2016
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| CN107868623A (en) * | 2017-10-18 | 2018-04-03 | 嘉善宇达电子有限公司 | One kind can resistant to elevated temperatures double faced adhesive tape |
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| KR20170099980A (en) | 2017-09-01 |
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