TW201642999A - Thin plate-shaped workpiece manufacturing method and dual-head surface grinding apparatus - Google Patents
Thin plate-shaped workpiece manufacturing method and dual-head surface grinding apparatus Download PDFInfo
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- TW201642999A TW201642999A TW105110045A TW105110045A TW201642999A TW 201642999 A TW201642999 A TW 201642999A TW 105110045 A TW105110045 A TW 105110045A TW 105110045 A TW105110045 A TW 105110045A TW 201642999 A TW201642999 A TW 201642999A
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- 238000000227 grinding Methods 0.000 title claims abstract description 155
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 230000003068 static effect Effects 0.000 claims abstract description 121
- 238000000034 method Methods 0.000 claims description 9
- 239000003082 abrasive agent Substances 0.000 claims description 7
- 230000002706 hydrostatic effect Effects 0.000 claims description 7
- 230000004660 morphological change Effects 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000012545 processing Methods 0.000 description 5
- 239000003643 water by type Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
本發明關於一種薄板狀工件的製造方法以及一種雙頭平面磨削裝置。The present invention relates to a method of manufacturing a thin plate-like workpiece and a double-head surface grinding apparatus.
舉例來說，橫型雙頭平面磨削裝置構成為：具備左右一對靜壓墊和左右一對磨削磨具，一邊利用靜壓墊從矽晶片等薄板狀工件的兩面側對該工件進行靜壓支承，一邊使該工件繞著中心軸旋轉，並且利用旋轉著的一對磨削磨具從該工件的兩面側夾住該工件來進行磨削(參照例如專利文獻1)。For example, the horizontal double-head plane grinding device is configured to include a pair of right and left static pressure pads and a pair of left and right grinding abrasives, and the workpiece is subjected to the workpiece from both sides of the thin plate-shaped workpiece such as a silicon wafer by a static pressure pad. The workpiece is rotated by the static pressure support while the workpiece is rotated about the central axis, and the workpiece is clamped from both sides of the workpiece by a pair of rotating grinding tools (see, for example, Patent Document 1).
在這種雙頭平面磨削裝置中，由於利用兩個支承單元即靜壓墊和磨削磨具在不同的兩個部位支承磨削中的工件，因此例如一旦由這兩個支承單元進行支承的支承位置在軸向上、也就是說工件的板厚方向上錯開了，則在工件上就會產生彎曲應力，從而無法進行高精度的磨削。In such a double-head plane grinding device, since the workpiece being ground is supported at two different locations by means of two supporting units, namely a static pressure pad and a grinding abrasive, for example, once supported by the two supporting units When the support position is shifted in the axial direction, that is, in the thickness direction of the workpiece, bending stress is generated on the workpiece, so that high-precision grinding cannot be performed.
相對於此，專利文獻1中記載的雙頭平面磨削裝置構成為具備使左右側的靜壓墊沿著軸向同步移動的移動機構，並且以工件的安裝基準位置為中心，在磨削工件時使兩靜壓墊同步地在相同速度下移動相同距離，由此能夠使靜壓墊相對於工件安裝基準位置正確地定位，從而能夠進行高精度的磨削。On the other hand, the double-head plane grinding device described in Patent Document 1 is configured to include a moving mechanism that synchronously moves the right and left static pressure pads in the axial direction, and grinds the workpiece centering on the mounting reference position of the workpiece. When the two static pressure pads are simultaneously moved at the same speed at the same speed, the static pressure pad can be correctly positioned with respect to the workpiece mounting reference position, so that high-precision grinding can be performed.
〔專利文獻〕 [專利文獻1]日本特開2003-236746號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-236746
在專利文獻1中記載的雙頭平面磨削裝置中，如上所述，以工件的安裝基準位置為中心，在磨削工件時使兩靜壓墊同步地在相同速度下移動相同距離，然而工件不一定是在兩靜壓墊之間的中央處被靜壓支承著，而且靜壓支承位置與兩磨削磨具之間的中央位置也不一定一致，因此無法保證在工件上不會產生彎曲應力。In the double-head surface grinding apparatus described in Patent Document 1, as described above, the two static pressure pads are simultaneously moved at the same speed at the same speed while grinding the workpiece, centering on the mounting reference position of the workpiece, but the workpiece It is not necessarily statically supported at the center between the two static pressure pads, and the central position between the static pressure support position and the two grinding tools is not necessarily the same, so there is no guarantee that bending will not occur on the workpiece. stress.
此外，作為不使磨削中的工件產生彎曲應力的其他方法，例如可以想到下述方法：直到得到規定精度為止，反覆地進行後述一連串的作業，即預先進行試磨削，並綜合地分析試磨削中的各種數據(磨具軸的電流值變化數據、工件動作數據等)、磨削後的工件的目測確認結果(表面粗糙度、彎曲等)、磨削後的工件的測量數據等來進行調整。Further, as another method of not causing bending stress in the workpiece during grinding, for example, a method in which a series of operations to be described later is performed, that is, a trial grinding in advance, and a comprehensive analysis test, is conceivable until a predetermined accuracy is obtained. Various data in the grinding (current value change data of the grinding tool shaft, workpiece movement data, etc.), visual inspection results of the workpiece after grinding (surface roughness, bending, etc.), measurement data of the workpiece after grinding, etc. Make adjustments.
然而，存在下述問題：雖然適當地進行如上述那樣藉由反覆地試磨削來調整的預先調整作業，就能夠可靠地得到高精度，但是要根據試磨削的結果來適當地進行調整，作業員就必須具備充分的經驗，該預先調整作業對經驗較少的作業員來說是難度較高的。However, there is a problem that although the pre-adjustment work adjusted by the repeated trial grinding as described above is appropriately performed, the high precision can be reliably obtained, but the adjustment is appropriately performed according to the result of the trial grinding. The operator must have sufficient experience, and the pre-adjustment operation is more difficult for less experienced operators.
本發明是根據上述問題而完成的，其的目的在於提供一種薄板狀工件的製造方法以及雙頭平面磨削裝置，根據該薄板狀工件的製造方法以及雙頭平面磨削裝置，不論作業員的熟練度高低，都能夠可靠地進行為了高精度地磨削薄板狀工件而所需的預先調整。The present invention has been made in view of the above problems, and an object thereof is to provide a method for manufacturing a thin plate-shaped workpiece and a double-head surface grinding device according to the method for manufacturing the thin plate-shaped workpiece and the double-head surface grinding device, regardless of the operator's With high proficiency, it is possible to reliably perform the pre-adjustment required for grinding a thin plate-shaped workpiece with high precision.
本發明是一種薄板狀工件的製造方法，其具備磨削步驟和預先調整步驟，該磨削步驟是使用具有一對靜壓墊和一對磨削磨具的雙頭平面磨削裝置，一邊使在所述一對靜壓墊之間被靜壓支承著的薄板狀的工件旋轉，一邊利用所述一對磨削磨具來磨削所述工件的兩面的步驟，該預先調整步驟是在進行所述磨削步驟之前對所述雙頭平面磨削裝置進行調整的步驟，在所述預先調整步驟中，在第一狀態和第二狀態下取得與調整用工件的形態相關的規定值，並根據在該第一狀態和該第二狀態下的所述規定值之間的變化來調整所述雙頭平面磨削裝置，其中該第一狀態是一邊在所述一對靜壓墊之間對所述調整用工件進行靜壓支承，一邊利用所述一對磨削磨具夾持所述調整用工件的狀態，該第二狀態是不利用所述靜壓墊來對所述調整用工件進行靜壓支承，只利用所述一對磨削磨具來夾持所述調整用工件的狀態。The present invention relates to a method for producing a thin plate-like workpiece, which comprises a grinding step and a pre-adjusting step of using a double-headed surface grinding device having a pair of static pressure pads and a pair of grinding tools, while a step of grinding the both sides of the workpiece by the pair of grinding tools while the thin plate-shaped workpiece supported by the static pressure between the pair of static pressure pads is rotated, and the pre-adjusting step is performed a step of adjusting the double-head plane grinding device before the grinding step, in the pre-adjusting step, obtaining a predetermined value related to a form of the workpiece for adjustment in the first state and the second state, and Adjusting the double-head plane grinding device according to a change between the predetermined values in the first state and the second state, wherein the first state is one side between the pair of static pressure pads The adjustment workpiece is hydrostatically supported, and the state of the adjustment workpiece is sandwiched by the pair of grinding grindstones, and the second state is that the adjustment workpiece is not used by the static pressure pad Static pressure bearing, using only the said Grinding a workpiece with the grinding wheel to the clamped state of the adjustment.
此外，較佳的是，以對所述一對靜壓墊與所述調整用工件之間的距離進行檢測的距離檢測感測器的輸出值作為所述規定值。在該情況下，較佳的是，以在所述第一狀態下的所述距離檢測感測器的輸出值與在所述第二狀態下的所述距離檢測感測器的輸出值之間的變化量小於等於規定判定值為條件來結束所述預先調整步驟。Further, it is preferable that an output value of the distance detecting sensor that detects a distance between the pair of static pressure pads and the workpiece for adjustment is the predetermined value. In this case, preferably, between the output value of the distance detecting sensor in the first state and the output value of the distance detecting sensor in the second state The amount of change is less than or equal to a predetermined determination value to end the pre-adjustment step.
此外，較佳的是，所述預先調整步驟具備：在所述一對靜壓墊之間對所述調整用工件進行靜壓支承的靜壓支承步驟；利用所述一對磨削磨具來夾持在所述靜壓支承步驟中被靜壓支承著的所述調整用工件的磨具支承步驟；在所述磨具支承步驟後使利用所述一對靜壓墊進行的靜壓支承停止的靜壓支承停止步驟；以及對進行所述靜壓支承停止步驟之前的所述距離檢測感測器的輸出值與進行所述靜壓支承停止步驟之後的所述距離檢測感測器的輸出值之間的變化量是否小於等於所述規定判定值進行判定的形態變化判定步驟，直到在所述形態變化判定步驟中，所述變化量被判定為小於等於所述規定判定值為止，反覆調整所述雙頭平面磨削裝置來使所述變化量減小，並且反覆進行所述靜壓支承步驟和該靜壓支承步驟以後的步驟。Further, preferably, the pre-adjusting step includes: a static pressure supporting step of statically supporting the adjusting workpiece between the pair of static pressure pads; and the pair of grinding tools An abrasive support step of holding the adjustment workpiece that is statically supported in the hydrostatic support step; and stopping static pressure support by the pair of static pressure pads after the abrasive support step a static pressure bearing stopping step; and an output value of the distance detecting sensor before the step of performing the static pressure bearing stopping step and an output value of the distance detecting sensor after performing the static pressure bearing stopping step The morphological change determination step of determining whether the amount of change is less than or equal to the predetermined determination value until the change amount is determined to be equal to or less than the predetermined determination value in the morphological change determination step, and the adjustment is repeated The double-head plane grinding device reduces the amount of change, and repeats the steps of the hydrostatic support step and the static pressure support step.
此外，較佳的是，在所述磨具支承步驟中，利用所述一對磨削磨具在所述距離檢測感測器的輸出值與所述靜壓支承步驟時大致相等的位置夾持所述調整用工件。Further, preferably, in the grinding tool supporting step, the pair of grinding tools are used to clamp the output value of the distance detecting sensor substantially equal to that at the static pressure supporting step. The adjustment workpiece.
另外，本發明是一種雙頭平面磨削裝置，其一邊使在一對靜壓墊之間被靜壓支承著的薄板狀的工件旋轉，一邊利用一對磨削磨具來磨削所述工件的兩面，所述雙頭平面磨削裝置具備預先調整單元，該預先調整單元用於：在第一狀態和第二狀態下分別取得與調整用工件的形態相關的規定值，並根據在該第一狀態和該第二狀態下的所述規定值之間的變化，在磨削所述工件之前進行規定的調整，其中該第一狀態是一邊在所述一對靜壓墊之間對所述調整用工件進行靜壓支承，一邊利用所述一對磨削磨具夾持所述調整用工件的狀態，該第二狀態是不利用所述靜壓墊來對所述調整用工件進行靜壓支承，只利用所述一對磨削磨具來夾持所述調整用工件的狀態。Further, the present invention is a double-headed surface grinding apparatus which grinds a workpiece by rotating a thin plate-like workpiece that is statically supported between a pair of static pressure pads while rotating a pair of grinding tools. On both sides, the double-head plane grinding device includes a pre-adjustment unit for obtaining a predetermined value related to the form of the adjustment workpiece in the first state and the second state, and according to the a change between the state and the specified value in the second state, the predetermined adjustment being performed prior to grinding the workpiece, wherein the first state is one side between the pair of static pressure pads Adjusting the static pressure support by the workpiece, and clamping the state of the adjustment workpiece by the pair of grinding grindstones, wherein the second state is to statically press the adjustment workpiece without using the static pressure pad Supporting the state in which the workpiece for adjustment is held by only the pair of grinding stones.
根據本發明，不論作業員的熟練度高低，都能夠可靠地進行為了高精度地磨削薄板狀工件而所需的預先調整。According to the present invention, it is possible to reliably perform the pre-adjustment required for grinding the thin plate-shaped workpiece with high precision regardless of the skill level of the worker.
以下，根據圖式詳細地說明本發明的實施方式。圖1到圖9中舉例示出了在橫型雙頭平面磨削裝置和使用該橫型雙頭平面磨削裝置來進行的薄板狀工件的製造方法中採用了本發明而構成的第一實施方式。如圖1、圖2所示，本實施方式的橫型雙頭平面磨削裝置具備左右一對靜壓墊1、2、驅動單元(省略圖示)以及左右一對磨削磨具4、5。上述一對靜壓墊1、2對矽晶片等薄板狀工件W進行靜壓支承。該驅動單元經由載具3驅動由上述靜壓墊1、2靜壓支承著的工件W繞該工件W的大致中心旋轉。上述一對磨削磨具4、5以能夠繞左右方向上的軸心自由旋轉的方式佈置著，並且從工件W的兩面側夾住工件W來進行磨削。Hereinafter, embodiments of the present invention will be described in detail based on the drawings. 1 to 9 exemplify a first embodiment in which the present invention is employed in a horizontal double-head plane grinding apparatus and a method of manufacturing a thin-plate-shaped workpiece using the horizontal double-head surface grinding apparatus. the way. As shown in FIG. 1 and FIG. 2, the horizontal double-head plane grinding apparatus of the present embodiment includes a pair of right and left static pressure pads 1, 2, a driving unit (not shown), and a pair of left and right grinding tools 4 and 5 . The pair of static pressure pads 1 and 2 are statically supported on a thin plate-like workpiece W such as a tantalum wafer. The drive unit drives the workpiece W statically supported by the static pressure pads 1 and 2 to rotate around the center of the workpiece W via the carrier 3. The pair of grinding stones 4 and 5 are arranged to be rotatable about the axis in the left-right direction, and the workpiece W is sandwiched from both sides of the workpiece W to perform grinding.
靜壓墊1、2呈從軸向看去為近似圓形的形狀，靜壓墊1、2在例如下部側具備從外周側向中心側凹入的凹部1a、2a，磨削磨具4、5佈置為與上述凹部la、2a對應。靜壓墊1、2能夠沿著左右方向在前進位置與後退位置之間移動，其中該前進位置是工件W附近的位置，該後退位置是比該前進位置還遠離工件W的位置，在前進位置處，靜壓墊1、2經由供向與工件W相向的工件支承面1b、2b的靜壓流體(在此為靜壓水)對工件W進行靜壓支承。The static pressure pads 1 and 2 have a substantially circular shape as viewed in the axial direction, and the static pressure pads 1 and 2 have concave portions 1a and 2a recessed from the outer circumferential side toward the center side, for example, on the lower side, and the grinding abrasives 4, 5 is arranged to correspond to the above-described recesses 1a, 2a. The static pressure pads 1, 2 are movable between a forward position and a retracted position in the left-right direction, wherein the advanced position is a position near the workpiece W, and the retracted position is a position farther from the workpiece W than the advanced position, in the advanced position The static pressure pads 1 and 2 are statically supported by the static pressure fluid (here, static pressure water) supplied to the workpiece support surfaces 1b and 2b facing the workpiece W.
在靜壓墊1、2的工件支承面1b、2b側上，除了多個袋(pocket，省略圖示)和排出槽(省略圖示)外，還佈置有多個(例如沿著凹部1a、2a的周向佈置有三個)空氣感測器6a～6c、7a～7c，靜壓水經由規定的噴嘴供向上述多個袋，上述排出槽將靜壓水從各個袋向外側排出，上述多個空氣感測器6a～6c、7a～7c留有規定間隔地佈置在凹部1a、2a的附近。On the workpiece support surfaces 1b and 2b side of the static pressure pads 1 and 2, in addition to a plurality of pockets (not shown) and discharge grooves (not shown), a plurality of (for example, along the recess 1a, There are three air sensors 6a to 6c and 7a to 7c arranged in the circumferential direction of the 2a, and the static pressure water is supplied to the plurality of pockets via a predetermined nozzle, and the discharge tank discharges the static pressure water from the respective pockets to the outside. The air sensors 6a to 6c and 7a to 7c are arranged in the vicinity of the recesses 1a and 2a with a predetermined interval.
空氣感測器(距離檢測感測器)6a～6c、7a～7c構成為從空氣噴嘴向工件W側噴出空氣，並根據噴出空氣時的背壓的變化來進行與工件W和靜壓墊1、2的工件支承面1b、2b之間的間隙的大小(距離)相應的輸出，空氣感測器6a、7a以在左右方向上相對應的方式佈置在凹部1a、2a的前側(圖1中的下側)，空氣感測器6c、7c以在左右方向上相對應的方式佈置在凹部1a、2a的後側(圖1中的上側)，空氣感測器6b、7b以在左右方向上相對應的方式佈置在凹部1a、2a的上側。需要說明的是，空氣感測器6a～6c、7a～7c只是距離檢測感測器的一個例子，還可以使用其他感測器，例如雷射式感測器、接觸式感測器等，只要能夠檢測出與工件W之間的距離即可。The air sensors (distance detecting sensors) 6a to 6c and 7a to 7c are configured to eject air from the air nozzle to the workpiece W side, and perform the work with the workpiece W and the static pressure pad 1 according to the change in the back pressure when the air is ejected. Corresponding output of the size (distance) of the gap between the workpiece supporting faces 1b, 2b of 2, the air sensors 6a, 7a are arranged on the front side of the recesses 1a, 2a in a corresponding manner in the left-right direction (Fig. 1 The lower side of the air sensor 6c, 7c is disposed on the rear side (upper side in FIG. 1) of the recesses 1a, 2a in the left-right direction, and the air sensors 6b, 7b are in the left-right direction. Correspondingly arranged on the upper side of the recesses 1a, 2a. It should be noted that the air sensors 6a-6c, 7a-7c are only one example of the distance detecting sensor, and other sensors such as a laser sensor, a contact sensor, etc. may be used as long as It is possible to detect the distance from the workpiece W.
磨削磨具4、5呈杯形等形狀，並且設置在由軸承殼8、9支承著能夠自由旋轉的、沿左右方向佈置的磨具軸10、11的頂端側上，磨削磨具4、5經由磨具軸10、11受磨具驅動電動機12、13驅動，從而繞該磨具軸10、11旋轉。此外，磨削磨具4、5例如經由軸承殼8、9等受切入驅動電動機(省略圖示)驅動，從而能夠在左右方向(軸向)上移動。另外，例如能夠經由軸承殼8、9等來調整磨削磨具4、5相對于軸向的傾斜度。The grinding grindstones 4, 5 are in the shape of a cup or the like, and are disposed on the tip end side of the grindstone shafts 10, 11 which are rotatably supported by the bearing shells 8, 9 and arranged in the left-right direction, grinding the grindstone 4 5 is driven by the abrasive drive motors 12, 13 via the abrasive shafts 10, 11 to rotate about the abrasive shafts 10, 11. Further, the grinding stones 4 and 5 are driven by a drive motor (not shown) via the bearing housings 8 and 9, for example, and are movable in the left-right direction (axial direction). Further, for example, the inclination of the grinding stones 4, 5 with respect to the axial direction can be adjusted via the bearing shells 8, 9, and the like.
載具3呈近似圓環狀且具備能夠供工件W插入的工件安裝孔14，載具3的厚度比工件W薄，載具3被沿著該載具3的外周佈置的多個支承輥15支承著能夠繞該載具3的大致中心自由旋轉，並且載具3能夠被驅動單元(省略圖示)驅動而旋轉。在載具3上設有向工件安裝孔14內突出而與工件W上的凹口部16扣合的扣合部17，該扣合部17與載具3形成為一體。The carrier 3 has a substantially annular shape and is provided with a workpiece mounting hole 14 into which the workpiece W can be inserted. The thickness of the carrier 3 is thinner than the workpiece W, and the carrier 3 is disposed along a plurality of support rollers 15 disposed along the outer circumference of the carrier 3. The support is rotatable about the approximate center of the carrier 3, and the carrier 3 can be driven to rotate by a drive unit (not shown). The carrier 3 is provided with a fastening portion 17 that protrudes into the workpiece mounting hole 14 and is engaged with the notch portion 16 of the workpiece W, and the fastening portion 17 is formed integrally with the carrier 3.
圖3示出本實施方式的橫型雙頭平面磨削裝置的控制系統的簡要結構。該控制系統具備靜壓墊控制單元21、磨具控制單元22以及操作單元23等。該靜壓墊控制單元21對靜壓墊1、2的移動(前進、後退)、靜壓水的供給、停止等進行控制。該磨具控制單元22對磨削磨具4、5的移動(前進、後退)、旋轉、停止等進行控制。該操作單元23用於對上述靜壓墊控制單元21、磨具控制單元22等進行各種設定、其他操作。Fig. 3 shows a schematic configuration of a control system of the horizontal double-head plane grinding apparatus of the present embodiment. The control system includes a static pressure pad control unit 21, a grinder control unit 22, an operation unit 23, and the like. The static pressure pad control unit 21 controls the movement (advance and retreat) of the static pressure pads 1 and 2, the supply and stop of the static pressure water, and the like. The grindstone control unit 22 controls the movement (advance, retreat), rotation, stop, and the like of the grinding grindstones 4, 5. The operation unit 23 is used to perform various settings and other operations on the static pressure pad control unit 21, the abrasive control unit 22, and the like.
操作單元23例如除了流量設定單元24、位置設定單元25、傾斜度設定單元26等，還具備感測器輸出值顯示單元27等。流量設定單元24用來對靜壓墊控制單元21設定靜壓水的流量。位置設定單元25用來對磨具控制單元22設定磨削磨具4、5的軸向位置。傾斜度設定單元26用來對磨具控制單元22設定磨削磨具4、5的傾斜度。感測器輸出值顯示單元27用來顯示來自空氣感測器6a～6c、7a～7c的輸出值。需要說明的是，例如就磨削磨具4、5的傾斜度來說，也可以不經由磨具控制單元22來進行調整，而是利用另外設置的傾斜度調整單元來進行調整。The operation unit 23 includes a sensor output value display unit 27 and the like in addition to the flow rate setting unit 24, the position setting unit 25, the inclination setting unit 26, and the like. The flow rate setting unit 24 is for setting the flow rate of the static pressure water to the static pressure pad control unit 21. The position setting unit 25 is used to set the axial position of the grinding stones 4, 5 to the grinding tool control unit 22. The inclination setting unit 26 is used to set the inclination of the grinding stones 4, 5 to the grinding tool control unit 22. The sensor output value display unit 27 is for displaying output values from the air sensors 6a to 6c, 7a to 7c. In addition, for example, the inclination of the grinding grindstones 4 and 5 may be adjusted without using the grindstone control unit 22, and may be adjusted by the inclination adjustment unit provided separately.
接著，邊參照圖4中所示的流程圖，邊說明使用本實施方式的橫型雙頭平面磨削裝置來進行的薄板狀工件的製造方法(調整方法和磨削方法)。如圖4所示，使用橫型雙頭平面磨削裝置來製造薄板狀工件時，首先進行對橫型雙頭平面磨削裝置作調整的預先調整步驟(SI～S10)，然後進行使用該預先調整後的橫型雙頭平面磨削裝置來磨削工件W的兩面的磨削步驟(S11)。Next, a method (adjustment method and grinding method) for manufacturing a thin plate-shaped workpiece using the horizontal double-head plane grinding apparatus of the present embodiment will be described with reference to a flowchart shown in FIG. As shown in FIG. 4, when a thin-plate-shaped workpiece is manufactured by using a horizontal double-head plane grinding device, a pre-adjustment step (SI to S10) for adjusting the horizontal double-head plane grinding device is first performed, and then the pre-adjustment step is performed. The adjusted horizontal double-head plane grinding device grinds the grinding steps on both sides of the workpiece W (S11).
在預先調整步驟中，首先，作為預先準備，作業員進行下述作業(S1)：使磨具軸10、11平行、同軸的調整；靜壓墊1、2相對於磨具軸10、11的角度(直角)的調整；空氣感測器6a～6c、7a～7c的校準；磨削磨具4、5的修整等。就空氣感測器6a～6c、7a～7c的校準來說，較佳的是以下述方式進行調整，即工件W與靜壓墊1、2上的工件支承面1b、2b之間的距離的變化量和與該變化量相應的感測器輸出值的變化量的比例為1：1，但是至少兩個變化量之間存在關聯即可。此外，本實施方式的空氣感測器6a～6c、7a～7c的輸出值被設定為：以0為基準值，與工件W之間的距離減少的方向為＋，與工件W之間的距離增加的方向為－。In the pre-adjustment step, first, as a preparation in advance, the worker performs the following operation (S1): adjusting the abrasive shafts 10, 11 in parallel and coaxially; and the static pressure pads 1, 2 with respect to the abrasive shafts 10, 11 Adjustment of angle (right angle); calibration of air sensors 6a to 6c, 7a to 7c; dressing of grinding tools 4, 5, and the like. The calibration of the air sensors 6a to 6c, 7a to 7c is preferably adjusted in such a manner that the distance between the workpiece W and the workpiece supporting faces 1b, 2b on the static pressure pads 1, 2 is The ratio of the amount of change to the amount of change in the sensor output value corresponding to the amount of change is 1:1, but there is a correlation between at least two amounts of change. Further, the output values of the air sensors 6a to 6c and 7a to 7c of the present embodiment are set such that with 0 as a reference value, the direction in which the distance between the workpieces W and the workpiece W decreases is +, and the distance from the workpiece W The direction of increase is -.
在預先準備(S1)之後，例如將載具3安裝在一對靜壓墊1、2之間，並將調整用工件Wa安裝在該載具3上(S2)。可以由作業員以手工作業的方式來安裝該調整用工件Wa，也可以由工件搬入搬出裝置自動地安裝該調整用工件Wa。此外，較佳的是使用完成磨削的工件W作為調整用工件Wa，但是也可以使用磨削前的工件W作為調整用工件Wa。此外，由於在該預先調整步驟中不對工件進行磨削，因此也可以使用與實際的磨削對象不同的金屬板、樹脂板等作為調整用工件Wa。After preparation (S1) in advance, for example, the carrier 3 is mounted between the pair of static pressure pads 1, 2, and the adjustment workpiece Wa is attached to the carrier 3 (S2). The adjustment workpiece Wa may be attached by a worker manually, or the adjustment workpiece Wa may be automatically attached by the workpiece loading/unloading device. Further, it is preferable to use the workpiece W that has been ground for grinding as the workpiece Wa for adjustment, but the workpiece W before grinding may be used as the workpiece Wa for adjustment. Further, since the workpiece is not ground in the pre-adjustment step, a metal plate, a resin plate or the like different from the actual grinding target may be used as the adjustment workpiece Wa.
在完成調整用工件Wa的安裝(S2)後，作業員接著操作操作單元23，從而藉由靜壓墊控制單元21的控制來向左右側的靜壓墊1、2供給靜壓水1c、2c，由此如圖5所示那樣在靜壓墊1、2之間對調整用工件Wa進行靜壓支承(S3：靜壓支承步驟)。需要說明的是，此時不使調整用工件Wa旋轉。接著，作業員操作操作單元23，從而藉由磨具控制單元22的控制來使左右側的磨削磨具4、5在停止旋轉狀態下前進，由此如圖6所示那樣利用上述磨削磨具4、5從調整用工件Wa的兩面側夾持住該調整用工件Wa(S4：磨具支承步驟)。然後，在該狀態下，作業員例如從感測器輸出值顯示單元27取得空氣感測器6a～6c、7a～7c輸出的感測器輸出值(S5)。After the attachment of the adjustment workpiece Wa is completed (S2), the operator then operates the operation unit 23 to supply the static pressure waters 1c, 2c to the left and right static pressure pads 1, 2 by the control of the static pressure pad control unit 21, Thereby, as shown in FIG. 5, the adjustment workpiece Wa is statically supported between the static pressure pads 1 and 2 (S3: static pressure support step). It should be noted that the adjustment workpiece Wa is not rotated at this time. Then, the operator operates the operation unit 23, whereby the left and right grinding tools 4, 5 are advanced in the stopped rotation state by the control of the grindstone control unit 22, thereby utilizing the above-described grinding as shown in FIG. The grinding tools 4 and 5 hold the adjustment workpiece Wa from both sides of the adjustment workpiece Wa (S4: Abrasive support step). Then, in this state, the operator obtains the sensor output values output from the air sensors 6a to 6c, 7a to 7c, for example, from the sensor output value display unit 27 (S5).
在此，在磨具支承步驟S4中，較佳的是以下述方式對磨削磨具4、5的軸向位置進行調整，即：磨削磨具4、5夾持前後(利用磨削磨具4、5進行夾持前和利用磨削磨具4、5進行夾持後)的、空氣感測器6a～6c、7a～7c輸出的感測器輸出值大致為相等的值。例如，以下述方式對磨削磨具4、5的軸向位置進行調整，即：利用磨削磨具4、5進行夾持前的感測器輸出值與利用磨削磨具4、5進行夾持後的感測器輸出值之間的差(絕對值)成為規定容許值以下的值。可以根據希望的磨削精度來設定規定容許值。需要說明的是，進行了該步驟S4後的狀態為第一狀態的一個例子，該第一狀態是一邊在一對靜壓墊1、2之間對調整用工件Wa進行靜壓支承，一邊利用一對磨削磨具4、5夾持調整用工件Wa的狀態。該第一狀態是與磨削工件W(S11)時同樣地利用靜壓墊1、2和磨削磨具4、5雙方來支承調整用工件Wa的狀態，只靠在步驟S5取得的第一狀態下的感測器輸出值，無法判定調整用工件Wa上是否產生了彎曲應力。Here, in the grindstone supporting step S4, it is preferable to adjust the axial positions of the grinding grindstones 4, 5 in such a manner that the grinding grindstones 4, 5 are held before and after (using a grinding mill) The sensor output values output by the air sensors 6a to 6c, 7a to 7c before and after the clamping of the 4 and 5 are clamped by the grinding tools 4 and 5 are substantially equal. For example, the axial position of the grinding tools 4, 5 is adjusted in such a manner that the sensor output values before clamping are performed by the grinding tools 4, 5 and by using the grinding tools 4, 5 The difference (absolute value) between the clamped output values of the clamps is equal to or less than a predetermined allowable value. The specified allowable value can be set according to the desired grinding accuracy. In addition, an example in which the state after the step S4 is the first state in which the adjustment workpiece Wa is statically supported between the pair of static pressure pads 1 and 2 is utilized. The state in which the pair of grinding grindstones 4 and 5 sandwich the workpiece Wa for adjustment. In the first state, the state in which the adjustment workpiece Wa is supported by both the static pressure pads 1 and 2 and the grinding stones 4 and 5 in the same manner as in the case of grinding the workpiece W (S11) is performed only in the first step S5. In the state of the sensor output value, it is impossible to determine whether or not the bending stress is generated on the adjustment workpiece Wa.
接著，在利用磨削磨具4、5夾持住調整用工件Wa的狀態下，作業員操作操作單元23，從而藉由靜壓墊控制單元21的控制來如圖7所示那樣停止向靜壓墊1、2供給靜壓水1c、2c，由此使利用靜壓墊1、2進行的靜壓支承停止(S6：靜壓支承停止步驟)。然後，在該狀態下，作業員例如從感測器輸出值顯示單元27取得空氣感測器6a～6c、7a～7c輸出的感測器輸出值。需要說明的是，進行了該步驟S6後的狀態為第二狀態的一個例子，該第二狀態是不利用靜壓墊1、2來對調整用工件Wa進行靜壓支承，只利用一對磨削磨具4、5來夾持調整用工件Wa的狀態。該第二狀態是從第一狀態中解除了利用靜壓墊1、2進行的靜壓支承，從而只利用磨削磨具4、5來進行支承的狀態，因此明顯可知調整用工件Wa上沒有產生彎曲應力。Next, in a state where the adjustment workpiece Wa is held by the grinding grindstones 4, 5, the operator operates the operation unit 23, and the static pressure pad control unit 21 controls the stop to be stopped as shown in FIG. The pressure pads 1 and 2 are supplied with the static pressure waters 1c and 2c, thereby stopping the static pressure support by the static pressure pads 1 and 2 (S6: static pressure support stopping step). Then, in this state, the operator obtains the sensor output values output from the air sensors 6a to 6c, 7a to 7c, for example, from the sensor output value display unit 27. It should be noted that the state after the step S6 is the second state in which the static pressure pad 1 and 2 are used to statically support the adjustment workpiece Wa, and only one pair of grinding is used. The state in which the workpieces Wa are adjusted by the sharpening tools 4 and 5 is clamped. In the second state, the static pressure support by the static pressure pads 1 and 2 is released from the first state, and the grinding abrasives 4 and 5 are used for the support. Therefore, it is apparent that the adjustment workpiece Wa is not present. Produces bending stress.
然後，求出在步驟S5中取得的第一狀態(靜壓支承停止前)下的感測器輸出值與在步驟S7中取得的第二狀態(靜壓支承停止後)下的感測器輸出值之間的變化量，並對該變化量是否小於等於規定判定值(例如5μm)進行判定(S8：形態變化判定步驟)。Then, the sensor output value in the first state (before the static pressure support is stopped) acquired in step S5 and the sensor output in the second state (after the static pressure support is stopped) obtained in step S7 are obtained. The amount of change between the values is determined by determining whether or not the amount of change is less than or equal to a predetermined determination value (for example, 5 μm) (S8: morphological change determination step).
如果上述感測器輸出值的變化量夠小(如果小於等於規定判定值)，就表示調整用工件Wa的形態在S5時間點(第一狀態)和S7時間點(第二狀態)之間幾乎沒有變化，因此能夠判定為在條件與磨削工件W時相同的第一狀態下，在調整用工件Wa上產生的彎曲應力在容許範圍內。另一方面，如果感測器輸出值的變化量大於規定判定值，就表示調整用工件Wa的形態在S5時間點(第一狀態)與S7時間點(第二狀態)之間發生了較大的變化，因此能夠判定為在條件與磨削工件W時相同的第一狀態下，在調整用工件Wa上產生了無法忽視的彎曲應力。If the amount of change in the sensor output value is sufficiently small (if less than or equal to the predetermined determination value), it means that the form of the adjustment workpiece Wa is almost between the S5 time point (first state) and the S7 time point (second state). Since there is no change, it can be determined that the bending stress generated in the adjustment workpiece Wa is within the allowable range in the first state in which the condition is the same as when the workpiece W is ground. On the other hand, if the amount of change in the sensor output value is larger than the predetermined determination value, it means that the form of the adjustment workpiece Wa has occurred between S5 time point (first state) and S7 time point (second state). Since the change is made, it can be determined that the bending stress which cannot be ignored is generated in the adjustment workpiece Wa in the first state which is the same as the case where the workpiece W is ground.
於是，如果感測器輸出值的變化量未小於等於規定判定值(S8：否)，作業員就根據上述感測器輸出值的變化方向和變化量來進行規定的調整，以使變化量減小(S9)。較佳的是以例如磨削磨具4、5的軸向位置、傾斜度為對象來進行該調整，但除此之外還能夠以例如靜壓水1c、2c的流量、噴嘴直徑等作為調整的對象，也可以對這些對象中的多個同時進行調整。Therefore, if the amount of change in the output value of the sensor is not less than or equal to the predetermined determination value (S8: NO), the operator performs a predetermined adjustment according to the direction of change and the amount of change of the output value of the sensor to reduce the amount of change. Small (S9). Preferably, the adjustment is performed for, for example, the axial position and the inclination of the grinding stones 4 and 5, but the flow rate of the hydrostatic waters 1c and 2c, the diameter of the nozzle, and the like can be adjusted as well. Objects can also be adjusted simultaneously for multiple of these objects.
如圖8所示，例如當左側的空氣感測器6a～6c的輸出值的變化量都是－10，並且右側的空氣感測器7a～7c的輸出值的變化量都是＋10時，可以認為：由磨削磨具4、5所支承的支承位置比由靜壓墊1、2所支承的支承位置位於右側。因此，作業員只要操作操作單元23的位置設定單元25來進行調整，例如使磨削磨具4、5在軸向上的位置往左側偏移即可。在該情況下，也可以不使磨削磨具4、5在軸向上的位置往左側偏移，取而代之的是例如可以進行調整來使右側的靜壓墊2側的靜壓水2c的流量比左側的靜壓墊1側的靜壓水1c的流量小，例如還可以進行調整來使右側的靜壓墊2側的用來供給靜壓水2c的噴嘴的直徑小於左側的靜壓墊1側的用來供給靜壓水1c的噴嘴的直徑。As shown in FIG. 8, for example, when the amount of change in the output values of the air sensors 6a to 6c on the left side is -10, and the amount of change in the output values of the air sensors 7a to 7c on the right side is +10, It is considered that the support position supported by the grinding stones 4, 5 is located on the right side than the support position supported by the static pressure pads 1, 2. Therefore, the operator only needs to operate the position setting unit 25 of the operation unit 23 to perform adjustment, for example, the position of the grinding grindstones 4 and 5 in the axial direction is shifted to the left side. In this case, the position of the grinding grindstones 4 and 5 in the axial direction may not be shifted to the left side, and instead, the flow rate ratio of the static pressure water 2c on the right side of the static pressure pad 2 may be adjusted, for example. The flow rate of the static pressure water 1c on the static pressure pad 1 side on the left side is small, and for example, the diameter of the nozzle for supplying the static pressure water 2c on the right static pressure pad 2 side is smaller than the static pressure pad 1 side on the left side. The diameter of the nozzle for supplying the hydrostatic water 1c.
一旦步驟S9的調整結束，就再次執行步驟S3以後的處理。也就是說，直到在步驟S8中，感測器輸出值的變化量被判定為小於等於規定判定值為止，反覆進行步驟S3～S9的處理。然後，如圖9中所示的例子那樣，當在步驟S8中，感測器輸出值的變化量被判定為小於等於規定判定值時(S8：是)，因為能夠判定為磨削中的工件上產生的彎曲應力已被調整為落在容許範圍內，所以在此結束預先調整步驟(S10)，並使用調整後的橫型雙頭平面磨削裝置來磨削工件W(S11：磨削步驟)。Once the adjustment of step S9 is completed, the processing from step S3 onward is executed again. In other words, until the amount of change in the sensor output value is determined to be equal to or smaller than the predetermined determination value in step S8, the processing of steps S3 to S9 is repeatedly performed. Then, as in the example shown in FIG. 9, when the amount of change in the sensor output value is determined to be equal to or smaller than the prescribed determination value in step S8 (S8: YES), since it is possible to determine the workpiece in the grinding The bending stress generated on the upper side has been adjusted to fall within the allowable range, so the pre-adjustment step (S10) is ended here, and the workpiece W is ground using the adjusted horizontal double-head plane grinding device (S11: grinding step) ).
如以上說明那樣，本實施方式之薄板狀工件的製造方法是這樣的方法：在磨削步驟之前的預先調整步驟中，在第一狀態和第二狀態下取得對調整用工件Wa與靜壓墊1、2之間的距離進行檢測的空氣感測器(距離檢測感測器)6a～6c、7a～7c的輸出值，並且根據在該第一狀態和該第二狀態下的感測器輸出值之間的變化來進行調整，以使該變化減小，其中該第一狀態是一邊在一對靜壓墊1、2之間對調整用工件Wa進行靜壓支承，一邊利用一對磨削磨具4、5夾持調整用工件Wa的狀態，該第二狀態是不利用靜壓墊1、2來對調整用工件Wa進行靜壓支承，只利用一對磨削磨具4、5來夾持調整用工件Wa的狀態。由此，不論作業員的熟練度高低，都能夠可靠地進行為了高精度地磨削薄板狀工件而所需的預先調整。As described above, the method of manufacturing the thin plate-shaped workpiece of the present embodiment is a method of obtaining the workpiece for adjustment and the pressure pad in the first state and the second state in the pre-adjustment step before the grinding step. The distance between the air detectors (distance detection sensors) 6a to 6c, 7a to 7c for detecting the distance between 1, 2, and according to the sensor output in the first state and the second state The change between the values is adjusted to reduce the change, wherein the first state is to perform static pressure support on the adjustment workpiece Wa between the pair of static pressure pads 1, 2, while using a pair of grinding The grinding tools 4 and 5 hold the state of the adjustment workpiece Wa. In the second state, the adjustment workpiece Wa is not statically supported by the static pressure pads 1 and 2, and only a pair of grinding tools 4 and 5 are used. The state of the workpiece Wa for adjustment is clamped. Thereby, regardless of the skill level of the worker, it is possible to reliably perform the pre-adjustment required for grinding the thin plate-shaped workpiece with high precision.
此外，由於能夠直接使用以往裝載在雙頭平面磨削裝置上的、用來監測工件的端面位置的空氣感測器6a～6c、7a～7c，因此能夠以較低的成本來實現本實施方式之薄板狀工件的製造方法。Further, since the air sensors 6a to 6c, 7a to 7c for monitoring the end position of the workpiece which are conventionally mounted on the double-head surface grinding device can be directly used, the present embodiment can be realized at a low cost. A method of manufacturing a thin plate-shaped workpiece.
圖10中舉例示出了本發明的第二實施方式，在圖10示出的例子中，改變了第一實施方式的一部分結構，在橫型雙頭平面磨削裝置中設置了自動地進行預先調整步驟中的至少一部分步驟的預先調整單元31。A second embodiment of the present invention is exemplified in Fig. 10. In the example shown in Fig. 10, a part of the structure of the first embodiment is changed, and an automatic pre-setting is provided in the horizontal double-head plane grinding device. The pre-adjustment unit 31 of at least a part of the steps of the adjustment step.
如圖10所示，本實施方式的橫型雙頭平面磨削裝置的控制系統除了靜壓墊控制單元21、磨具控制單元22等，還具備預先調整單元31。該預先調整單元31用來自動地進行圖4中所示的預先調整步驟中的至少一部分步驟，例如自動地進行步驟S3～S9的反覆處理，該預先調整單元31具備第一狀態控制單元32、第一輸出值取得單元33、第二狀態控制單元34、第二輸出值取得單元35、判定單元36、調整執行單元37等。As shown in FIG. 10, the control system of the horizontal double-head surface grinding apparatus according to the present embodiment further includes a pre-adjustment unit 31 in addition to the static pressure pad control unit 21, the grindstone control unit 22, and the like. The pre-adjustment unit 31 is configured to automatically perform at least a part of the pre-adjustment steps shown in FIG. 4, for example, automatically performing the repetitive processing of steps S3 to S9, and the pre-adjustment unit 31 is provided with a first state control unit 32, The first output value acquisition unit 33, the second state control unit 34, the second output value acquisition unit 35, the determination unit 36, the adjustment execution unit 37, and the like.
第一狀態控制單元32構成為：為了實現一邊在一對靜壓墊1、2之間對調整用工件Wa進行靜壓支承，一邊利用一對磨削磨具4、5夾持調整用工件Wa這樣的第一狀態，第一狀態控制單元32經由靜壓墊控制單元21和磨具控制單元22使圖4中的步驟S3、S4的處理自動地執行。此外，第一輸出值取得單元33取得在該第一狀態下的空氣感測器6a～6c、7a～7c的輸出值(圖4中的步驟S5)。The first state control unit 32 is configured to hold the adjustment workpiece Wa by the pair of grinding tools 4 and 5 while statically supporting the adjustment workpiece Wa between the pair of static pressure pads 1 and 2 In such a first state, the first state control unit 32 automatically performs the processing of steps S3, S4 in Fig. 4 via the static pressure pad control unit 21 and the abrasive control unit 22. Further, the first output value acquisition unit 33 acquires the output values of the air sensors 6a to 6c, 7a to 7c in the first state (step S5 in Fig. 4).
第二狀態控制單元34構成為：為了實現不利用靜壓墊1、2來對調整用工件Wa進行靜壓支承，只利用一對磨削磨具4、5來夾持調整用工件Wa這樣的第二狀態，第二狀態控制單元34經由靜壓墊控制單元21使圖4中的步驟S6的處理自動地執行。此外，第二輸出值取得單元35取得在該第二狀態下的空氣感測器6a～6c、7a～7c的輸出值(圖4中的步驟S7)。The second state control unit 34 is configured to hold the adjustment workpiece Wa by the pair of grinding tools 4 and 5 so that the adjustment workpiece Wa is not statically supported without using the static pressure pads 1 and 2. In the second state, the second state control unit 34 automatically performs the processing of step S6 in Fig. 4 via the static pressure pad control unit 21. Further, the second output value acquisition unit 35 acquires the output values of the air sensors 6a to 6c, 7a to 7c in the second state (step S7 in Fig. 4).
然後，判定單元36求出由第一輸出值取得單元33取得的、在第一狀態(靜壓支承停止前)下的感測器輸出值與由第二輸出值取得單元35取得的、在第二狀態(靜壓支承停止後)下的感測器輸出值之間的變化量，並對該變化量是否小於等於規定判定值(例如5μm)進行判定(圖4中的步驟S8)。Then, the determination unit 36 obtains the sensor output value obtained by the first output value acquisition unit 33 in the first state (before the static pressure support is stopped) and the second output value acquisition unit 35. The amount of change between the sensor output values in the two states (after the static pressure support is stopped) is determined as to whether or not the amount of change is less than or equal to a predetermined determination value (for example, 5 μm) (step S8 in Fig. 4).
此外，調整執行單元37具備用來調整靜壓水1c、2c的流量的流量調整單元37a、用來調整磨削磨具4、5的軸向位置的位置調整單元37b、用來調整磨削磨具4、5的傾斜度的傾斜度調整單元37c等，當判定單元36判定為感測器輸出值的變化量未小於等於規定判定值時(圖4中的步驟S8：否)，就根據上述感測器輸出值的變化方向和變化量，藉由流量調整單元37a、位置調整單元37b、傾斜度調整單元37c等自動地進行調整，以使變化量減小(圖4中的步驟S9)。Further, the adjustment executing unit 37 is provided with a flow rate adjusting unit 37a for adjusting the flow rates of the static pressure waters 1c, 2c, a position adjusting unit 37b for adjusting the axial position of the grinding stones 4, 5, and for adjusting the grinding mill. When the determination unit 36 determines that the amount of change in the sensor output value is not less than or equal to the predetermined determination value (step S8: NO in FIG. 4), according to the above-described inclination adjustment unit 37c having an inclination of 4 or 5 The direction of change and the amount of change of the sensor output value are automatically adjusted by the flow rate adjusting unit 37a, the position adjusting unit 37b, the inclination adjusting unit 37c, and the like so that the amount of change is reduced (step S9 in Fig. 4).
然後，直到判定單元36判定為感測器輸出值的變化量小於等於規定判定值為止，預先調整單元31反覆執行圖4中的步驟S3～S9。Then, until the determination unit 36 determines that the amount of change in the sensor output value is less than or equal to the predetermined determination value, the pre-adjustment unit 31 repeatedly executes steps S3 to S9 in Fig. 4 .
如以上說明那樣，由於在本發明中，能夠將第一狀態和第二狀態下的感測器輸出值之間的變化方向和變化量數字化，因此能夠如本實施方式那樣使預先調整步驟中的至少一部分步驟自動地執行。As described above, in the present invention, since the direction of change and the amount of change between the sensor output values in the first state and the second state can be digitized, the pre-adjustment step can be performed as in the present embodiment. At least some of the steps are performed automatically.
以上，詳細說明了本發明的實施方式，然而本發明不限於上述實施方式，能夠在不脫離本發明的要旨的範圍內進行各種變更。例如，上述實施方式中的預先調整步驟構成為：在第一狀態下取得感測器輸出值後，轉移到第二狀態來取得感測器輸出值。然而，預先調整步驟也可以構成為：先在第二狀態下取得感測器輸出值後，再轉移到第一狀態來取得感測器輸出值。The embodiments of the present invention have been described in detail above. The present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit and scope of the invention. For example, the pre-adjustment step in the above embodiment is configured to acquire the sensor output value in the first state, and then shift to the second state to obtain the sensor output value. However, the pre-adjustment step may be configured to first obtain the sensor output value in the second state, and then shift to the first state to obtain the sensor output value.
此外，上述實施方式中的預先調整步驟構成為：在執行靜壓支承步驟(圖4中的步驟S3)後執行磨具支承步驟(圖4中的步驟S4)，由此轉移到第一狀態。然而，預先調整步驟也可以構成為：先利用磨削磨具4、5來夾持調整用工件Wa，然後再利用靜壓墊1、2進行靜壓支承，由此轉移到第一狀態。Further, the pre-adjustment step in the above embodiment is configured to execute the grindstone support step (step S4 in FIG. 4) after performing the hydrostatic support step (step S3 in FIG. 4), thereby shifting to the first state. However, the pre-adjustment step may be configured such that the adjustment workpieces Wa are first held by the grinding stones 4 and 5, and then the static pressure pads 1 and 2 are used for static pressure support, thereby shifting to the first state.
上述實施方式構成為：在磨具支承步驟(圖4中的步驟S4)中，利用磨削磨具4、5在空氣感測器6a～6c、7a～7c的輸出值與靜壓支承步驟(圖4中的步驟S3)時大致相等的位置夾持調整用工件Wa。然而，上述實施方式也可以構成為：與空氣感測器6a～6c、7a～7c的輸出值無關地利用磨削磨具4、5在預先設定好的位置夾持調整用工件Wa。但是，在該情況下，有可能後續的調整比較費時。The above embodiment is configured such that in the grinding tool supporting step (step S4 in Fig. 4), the output values of the air sensors 6a to 6c, 7a to 7c and the static pressure supporting step are utilized by the grinding stones 4, 5. The adjustment workpiece Wa is sandwiched at a position substantially equal to the step S3) in Fig. 4 . However, in the above-described embodiment, the adjustment workpiece Wa may be held by the grinding grindstones 4 and 5 at a predetermined position regardless of the output values of the air sensors 6a to 6c and 7a to 7c. However, in this case, it is possible that subsequent adjustments are time consuming.
此外，本發明的雙頭平面磨削裝置也同樣能夠應用在將一對靜壓墊1、2和一對磨削磨具4、5沿上下方向佈置的縱型雙頭平面磨削裝置上。Further, the double-headed surface grinding apparatus of the present invention can also be applied to a vertical double-head plane grinding apparatus in which a pair of static pressure pads 1, 2 and a pair of grinding abrasives 4, 5 are arranged in the up and down direction.
1、2 靜壓墊 4、5 磨削磨具 6a～6c、7a～7c 空氣感測器(距離檢測感測器) W 工件 Wa 調整用工件1, 2 Static pressure pad 4, 5 Grinding abrasive tools 6a ~ 6c, 7a ~ 7c Air sensor (distance detection sensor) W Workpiece Wa Adjustment workpiece
圖1為示出本發明的第一實施方式的橫型雙頭平面磨削裝置的俯視剖視圖。 圖2是橫型雙頭平面磨削裝置的側視圖。 圖3是橫型雙頭平面磨削裝置的控制系統的方框圖。 圖4是使用橫型雙頭平面磨削裝置來進行的薄板狀工件的製造方法的流程圖。 圖5是薄板狀工件的製造方法中的靜壓支承步驟的說明圖。 圖6是薄板狀工件的製造方法中的磨具支承步驟的說明圖。 圖7是薄板狀工件的製造方法中的靜壓支承停止步驟的說明圖。 圖8是說明圖，其示出在薄板狀工件的製造方法中的、在第一狀態和第二狀態下的感測器輸出值之間的變化情況的一個例子。 圖9是說明圖，其示出在薄板狀工件的製造方法中的、在第一狀態和第二狀態下的感測器輸出值之間的變化情況的一個例子。 圖10是示出本發明的第二實施方式的橫型雙頭平面磨削裝置的控制系統的方框圖。1 is a plan cross-sectional view showing a horizontal double-head surface grinding apparatus according to a first embodiment of the present invention. 2 is a side view of a horizontal double-head plane grinding device. Figure 3 is a block diagram of a control system of a horizontal double-head plane grinding apparatus. 4 is a flow chart showing a method of manufacturing a thin plate-like workpiece using a horizontal double-head plane grinding device. Fig. 5 is an explanatory view of a static pressure supporting step in a method of manufacturing a thin plate-shaped workpiece. Fig. 6 is an explanatory view of a grinding tool supporting step in a method of manufacturing a thin plate-shaped workpiece. Fig. 7 is an explanatory diagram of a static pressure support stopping step in a method of manufacturing a thin plate-shaped workpiece. Fig. 8 is an explanatory view showing an example of a change between sensor output values in a first state and a second state in a method of manufacturing a thin plate-shaped workpiece. Fig. 9 is an explanatory view showing an example of a change between sensor output values in a first state and a second state in a method of manufacturing a thin plate-shaped workpiece. Fig. 10 is a block diagram showing a control system of a horizontal double-head plane grinding apparatus according to a second embodiment of the present invention.
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| CN116117682B (en) * | 2023-03-31 | 2024-04-12 | 西安奕斯伟材料科技股份有限公司 | Static pressure pad, grinding equipment and silicon wafer |
| CN117226707A (en) * | 2023-11-10 | 2023-12-15 | 西安奕斯伟材料科技股份有限公司 | Driving ring, bearing device and double-sided grinding device |
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