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TW201613991A - Dry film, cured product and printed wiring board - Google Patents

Dry film, cured product and printed wiring board

Info

Publication number
TW201613991A
TW201613991A TW104125415A TW104125415A TW201613991A TW 201613991 A TW201613991 A TW 201613991A TW 104125415 A TW104125415 A TW 104125415A TW 104125415 A TW104125415 A TW 104125415A TW 201613991 A TW201613991 A TW 201613991A
Authority
TW
Taiwan
Prior art keywords
dry film
cured product
wiring board
printed wiring
resin layer
Prior art date
Application number
TW104125415A
Other languages
Chinese (zh)
Inventor
Takayuki Chujo
Arata Endo
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201613991A publication Critical patent/TW201613991A/en

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)

Abstract

The present invention provides a dry film having a resin layer, which is used to produce a cured product having heat resistance, low warpage and excellent fracture resistance, excellent in peeling off from a carrier film and capable of preventing fractures and dust falling, and a printed wiring board which comprises the cured product obtained by curing the dry film. The solution provided by the present invention is a dry film having a resin layer. The resin layer contains a thermosetting resin component, at least one of curing agent and curing accelerator, a maleimide compound, fillers and at least two solvents characterized in that the boiling points of the solvents are higher than 100 DEG C and the difference between the boiling points is more than 5 DEG C.
TW104125415A 2014-10-08 2015-08-05 Dry film, cured product and printed wiring board TW201613991A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014207328A JP2016074849A (en) 2014-10-08 2014-10-08 Dry film, cured product, and printed wiring board

Publications (1)

Publication Number Publication Date
TW201613991A true TW201613991A (en) 2016-04-16

Family

ID=55713002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125415A TW201613991A (en) 2014-10-08 2015-08-05 Dry film, cured product and printed wiring board

Country Status (4)

Country Link
JP (1) JP2016074849A (en)
KR (1) KR20160041788A (en)
CN (1) CN105504677A (en)
TW (1) TW201613991A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732055B (en) * 2016-10-17 2021-07-01 日商三鍵有限公司 Curable resin composition
TWI752057B (en) * 2016-07-20 2022-01-11 日商昭和電工材料股份有限公司 Composite film for electronic equipment, printed wiring board, and manufacturing method using high-frequency signal
TWI765028B (en) * 2017-06-30 2022-05-21 日商琳得科股份有限公司 Resin sheet, laminate, and method for producing resin sheet

Families Citing this family (18)

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Publication number Priority date Publication date Assignee Title
JP2018012777A (en) * 2016-07-20 2018-01-25 日立化成株式会社 Insulation resin material, resin film for interlayer insulation and production method of the same, composite film and production method of the same, and printed wiring board and production method of the same
JP6789030B2 (en) * 2016-08-09 2020-11-25 京セラ株式会社 Encapsulating resin composition and semiconductor device
JP2018125378A (en) * 2017-01-31 2018-08-09 太陽インキ製造株式会社 Dry film, cured product, printed wiring board, and method for producing cured product
CN108219371B (en) * 2017-12-29 2020-08-18 广东生益科技股份有限公司 Epoxy resin composition, prepreg, laminate, and printed wiring board
JP6999459B2 (en) * 2018-03-22 2022-01-18 太陽インキ製造株式会社 Dry films, cured products, and electronic components
JP7169076B2 (en) * 2018-03-22 2022-11-10 太陽インキ製造株式会社 Thermosetting resin composition, dry film, cured product, and electronic component
KR102524881B1 (en) * 2018-03-29 2023-04-25 디아이씨 가부시끼가이샤 Curable composition and cured product thereof
JP7057905B2 (en) * 2018-03-29 2022-04-21 Dic株式会社 Curable composition and its cured product
JP7232247B2 (en) * 2018-04-26 2023-03-02 リンテック株式会社 Resin composition, resin sheet and laminate
SG11202012017VA (en) * 2018-06-12 2021-01-28 Showa Denko Materials Co Ltd Curable resin composition and electronic component device
JP2020094089A (en) * 2018-12-10 2020-06-18 積水化学工業株式会社 Resin material and multilayer printed wiring board
WO2020121734A1 (en) * 2018-12-12 2020-06-18 パナソニックＩｐマネジメント株式会社 Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and printed wiring board
TWI853957B (en) * 2019-07-12 2024-09-01 日商味之素股份有限公司 Resin composition
TWI875814B (en) * 2019-09-30 2025-03-11 日商太陽控股股份有限公司 Laminated structure
JP7409262B2 (en) * 2020-08-24 2024-01-09 味の素株式会社 resin composition
JP7248000B2 (en) * 2020-11-05 2023-03-29 味の素株式会社 resin composition
CN116396678B (en) * 2021-12-27 2024-08-09 山东工业陶瓷研究设计院有限公司 Normal-temperature curing radiation coating slurry, radiation coating and preparation method thereof
CN119116521B (en) * 2024-09-29 2025-10-10 江西省航宇新材料股份有限公司 A lead-free medium-Tg CAF-resistant, low-loss copper-clad laminate material and its preparation process

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008133353A (en) * 2006-11-28 2008-06-12 Hitachi Chem Co Ltd Thermosetting resin composition, and prepreg and laminate using the resin composition
JP5396805B2 (en) * 2008-10-07 2014-01-22 味の素株式会社 Epoxy resin composition
JP5740941B2 (en) * 2010-11-30 2015-07-01 住友ベークライト株式会社 Prepreg, metal-clad laminate, printed wiring board, and semiconductor device
CN102977551B (en) * 2011-09-02 2014-12-10 广东生益科技股份有限公司 Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition
CN103937156A (en) * 2014-03-05 2014-07-23 浙江华正新材料股份有限公司 Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752057B (en) * 2016-07-20 2022-01-11 日商昭和電工材料股份有限公司 Composite film for electronic equipment, printed wiring board, and manufacturing method using high-frequency signal
US11331888B2 (en) 2016-07-20 2022-05-17 Showa Denko Materials Co., Ltd. Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor
TWI732055B (en) * 2016-10-17 2021-07-01 日商三鍵有限公司 Curable resin composition
US11091676B2 (en) 2016-10-17 2021-08-17 Threebond Co., Ltd. Curable resin composition
TWI765028B (en) * 2017-06-30 2022-05-21 日商琳得科股份有限公司 Resin sheet, laminate, and method for producing resin sheet

Also Published As

Publication number Publication date
CN105504677A (en) 2016-04-20
KR20160041788A (en) 2016-04-18
JP2016074849A (en) 2016-05-12

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