TW201613168A - Varistor having multilayer coating and fabrication method - Google Patents
Varistor having multilayer coating and fabrication methodInfo
- Publication number
- TW201613168A TW201613168A TW104125633A TW104125633A TW201613168A TW 201613168 A TW201613168 A TW 201613168A TW 104125633 A TW104125633 A TW 104125633A TW 104125633 A TW104125633 A TW 104125633A TW 201613168 A TW201613168 A TW 201613168A
- Authority
- TW
- Taiwan
- Prior art keywords
- multilayer coating
- varistor
- fabrication method
- ceramic body
- outer layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
- H01C7/108—Metal oxide
- H01C7/112—ZnO type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
- H01C17/06546—Oxides of zinc or cadmium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/102—Varistor boundary, e.g. surface layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
- H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/285—Precursor compositions therefor, e.g. pastes, inks, glass frits applied to zinc or cadmium oxide resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Details Of Resistors (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCPCT/CN2014/083974 | 2014-08-08 | ||
| PCT/CN2014/083974 WO2016019569A1 (en) | 2014-08-08 | 2014-08-08 | Varistor having multilayer coating and fabrication method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201613168A true TW201613168A (en) | 2016-04-01 |
| TWI630745B TWI630745B (zh) | 2018-07-21 |
Family
ID=55263045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104125633A TWI630745B (zh) | 2014-08-08 | 2015-08-06 | 具多塗層變阻器及其製備方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20170221612A1 (zh) |
| EP (2) | EP3178098A4 (zh) |
| JP (2) | JP2017524270A (zh) |
| CN (2) | CN106663510B (zh) |
| TW (1) | TWI630745B (zh) |
| WO (2) | WO2016019569A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110301079B (zh) * | 2018-01-23 | 2021-08-24 | 东莞令特电子有限公司 | 组合式管状金属氧化物变阻器和气体放电管 |
| JP7431798B2 (ja) | 2018-07-18 | 2024-02-15 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | バリスタパッシベーション層及びその製造方法 |
| US11862922B2 (en) | 2020-12-21 | 2024-01-02 | Energetiq Technology, Inc. | Light emitting sealed body and light source device |
| DE102023104467A1 (de) * | 2023-02-23 | 2024-08-29 | Tdk Electronics Ag | Keramisches Bauelement und Verfahren zur Herstellung eines keramischen Bauelements |
Family Cites Families (37)
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| US4039904A (en) * | 1976-01-02 | 1977-08-02 | P. R. Mallory & Co., Inc. | Intermediate precoat layer of resin material for stabilizing encapsulated electric devices |
| BR8103687A (pt) * | 1980-06-23 | 1982-03-02 | Gen Electric | Revestimento isolante para varistores de oxido de zinco aplicaveis e para raios e protetores de picos de voltagem |
| EP0147607B1 (de) | 1983-12-22 | 1988-05-04 | BBC Brown Boveri AG | Zinkoxid-Varistor |
| JPS6347901A (ja) * | 1986-08-16 | 1988-02-29 | ティーディーケイ株式会社 | 電子部品 |
| DE3823698A1 (de) * | 1988-07-13 | 1990-01-18 | Philips Patentverwaltung | Nichtlinearer spannungsabhaengiger widerstand |
| JPH05109506A (ja) * | 1991-10-16 | 1993-04-30 | Fuji Electric Co Ltd | 電圧非直線抵抗体 |
| JPH11204304A (ja) * | 1998-01-08 | 1999-07-30 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
| JP3415094B2 (ja) * | 2000-03-31 | 2003-06-09 | 岡谷電機産業株式会社 | 外装被覆型電子部品の製造方法 |
| DE10062293A1 (de) * | 2000-12-14 | 2002-07-04 | Epcos Ag | Elektrisches Bauelement und Verfahren zu dessen Herstellung |
| CN1226756C (zh) | 2002-01-22 | 2005-11-09 | 兴勤电子工业股份有限公司 | 具有磷酸盐绝缘层的变阻器及其制法 |
| US6841191B2 (en) * | 2002-02-08 | 2005-01-11 | Thinking Electronic Industrial Co., Ltd. | Varistor and fabricating method of zinc phosphate insulation for the same |
| JP2004095609A (ja) * | 2002-08-29 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 外装被覆形バリスタ |
| JP4434699B2 (ja) * | 2003-11-18 | 2010-03-17 | コーア株式会社 | 抵抗器およびその製造方法 |
| JP2005243746A (ja) * | 2004-02-24 | 2005-09-08 | Nippon Chemicon Corp | バリスタ |
| JP2007035766A (ja) | 2005-07-25 | 2007-02-08 | Hitachi Ltd | 温度感知素子 |
| JP5264484B2 (ja) * | 2005-07-29 | 2013-08-14 | タイコ・エレクトロニクス・コーポレイション | 熱的に結合したmov過電圧要素とpptc過電流要素を有する回路保護デバイス |
| CN101401172B (zh) * | 2006-03-10 | 2011-01-26 | 卓英社有限公司 | 陶瓷组件元件、陶瓷组件及其制造方法 |
| RU2009147814A (ru) * | 2007-05-24 | 2011-06-27 | Басф Се (De) | Способ изготовления металлической фольги с полимерным покрытием и ее применение |
| US8849921B2 (en) | 2007-06-28 | 2014-09-30 | Symantec Corporation | Method and apparatus for creating predictive filters for messages |
| JP5157349B2 (ja) * | 2007-09-28 | 2013-03-06 | 日本ケミコン株式会社 | 電子部品 |
| JP5364285B2 (ja) | 2008-03-31 | 2013-12-11 | コーア株式会社 | 電子部品および電子部品の外装膜形成方法 |
| CN101620901A (zh) | 2008-07-04 | 2010-01-06 | 爱普科斯电子元器件(珠海保税区)有限公司 | 阻燃防爆压敏电阻 |
| US8562859B2 (en) * | 2008-11-17 | 2013-10-22 | Mitsubishi Electric Corporation | Voltage nonlinear resistor, lightning arrester equipped with voltage nonlinear resistor, and process for producing voltage nonlinear resistor |
| JP5297163B2 (ja) * | 2008-11-25 | 2013-09-25 | パナソニック株式会社 | Uv硬化性樹脂組成物およびこれを用いた接着方法 |
| US20100157492A1 (en) * | 2008-12-23 | 2010-06-24 | General Electric Company | Electronic device and associated method |
| JP2010192539A (ja) | 2009-02-16 | 2010-09-02 | Nippon Chemicon Corp | 電子部品の製造方法 |
| CN101556850A (zh) | 2009-05-20 | 2009-10-14 | 上海科特高分子材料有限公司 | 一种新型正温度系数热敏电阻器及其制造方法 |
| KR101008310B1 (ko) | 2010-07-30 | 2011-01-13 | 김선기 | 세라믹 칩 어셈블리 |
| CN102024541A (zh) * | 2010-12-09 | 2011-04-20 | 深圳顺络电子股份有限公司 | 一种多层片式压敏电阻及其制造方法 |
| US8584348B2 (en) * | 2011-03-05 | 2013-11-19 | Weis Innovations | Method of making a surface coated electronic ceramic component |
| KR101532118B1 (ko) * | 2011-12-27 | 2015-06-29 | 삼성전기주식회사 | 유전체 조성물 및 이를 포함하는 세라믹 전자 부품 |
| CN102665082A (zh) | 2012-04-26 | 2012-09-12 | 中山大学 | 一种适用于视频监控系统的错误隐藏的方法 |
| CN102664082A (zh) | 2012-05-17 | 2012-09-12 | 成都铁达电子有限责任公司 | 一种压敏电阻器及制造方法 |
| DE102012109704A1 (de) | 2012-10-11 | 2014-04-17 | Epcos Ag | Keramisches Bauelement mit Schutzschicht und Verfahren zu dessen Herstellung |
| KR101444536B1 (ko) * | 2012-10-18 | 2014-09-24 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조방법 |
| KR101422929B1 (ko) * | 2012-11-07 | 2014-07-23 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 실장 기판 |
| WO2014120880A1 (en) * | 2013-01-31 | 2014-08-07 | E. I. Du Pont De Nemours And Company | Gas permeation barrier material and electronic devices constructed therewith |
-
2014
- 2014-08-08 US US15/501,091 patent/US20170221612A1/en not_active Abandoned
- 2014-08-08 EP EP14899196.1A patent/EP3178098A4/en not_active Withdrawn
- 2014-08-08 WO PCT/CN2014/083974 patent/WO2016019569A1/en not_active Ceased
- 2014-08-08 JP JP2017526731A patent/JP2017524270A/ja active Pending
- 2014-08-08 CN CN201480080712.7A patent/CN106663510B/zh active Active
-
2015
- 2015-03-06 WO PCT/CN2015/073739 patent/WO2016019723A1/en not_active Ceased
- 2015-03-06 US US15/501,118 patent/US10446299B2/en active Active
- 2015-03-06 CN CN201580040746.8A patent/CN106688054B/zh active Active
- 2015-03-06 EP EP15830254.7A patent/EP3178097B1/en active Active
- 2015-03-06 JP JP2017526736A patent/JP2017524271A/ja active Pending
- 2015-08-06 TW TW104125633A patent/TWI630745B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN106663510B (zh) | 2019-05-03 |
| US20170221612A1 (en) | 2017-08-03 |
| EP3178097B1 (en) | 2021-08-18 |
| CN106688054A (zh) | 2017-05-17 |
| WO2016019569A1 (en) | 2016-02-11 |
| TWI630745B (zh) | 2018-07-21 |
| EP3178098A1 (en) | 2017-06-14 |
| JP2017524271A (ja) | 2017-08-24 |
| CN106663510A (zh) | 2017-05-10 |
| JP2017524270A (ja) | 2017-08-24 |
| US10446299B2 (en) | 2019-10-15 |
| EP3178098A4 (en) | 2018-06-06 |
| EP3178097A1 (en) | 2017-06-14 |
| US20170221613A1 (en) | 2017-08-03 |
| WO2016019723A1 (en) | 2016-02-11 |
| CN106688054B (zh) | 2020-04-17 |
| EP3178097A4 (en) | 2018-06-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |