TW201613009A - Semiconductor manufacturing device and method for manufacturing semiconductor device - Google Patents
Semiconductor manufacturing device and method for manufacturing semiconductor deviceInfo
- Publication number
- TW201613009A TW201613009A TW104106094A TW104106094A TW201613009A TW 201613009 A TW201613009 A TW 201613009A TW 104106094 A TW104106094 A TW 104106094A TW 104106094 A TW104106094 A TW 104106094A TW 201613009 A TW201613009 A TW 201613009A
- Authority
- TW
- Taiwan
- Prior art keywords
- ring
- expanded sheet
- semiconductor
- manufacturing
- adhesive layer
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 239000012790 adhesive layer Substances 0.000 abstract 3
Landscapes
- Dicing (AREA)
Abstract
One embodiment of the present invention is to suppress generation of undivided regions, while dividing an adhesive layer by extending an expanded sheet wherein a plurality of semiconductor parts are attached to the expanded sheet with the adhesive layer in between. The semiconductor manufacturing device of the embodiment includes: a second ring for pressing and connecting a processed object to an expanded sheet, in which the processed object includes a first ring, the expanded sheet fixed by the first ring, and a plurality of semiconductor parts that are attached to the expanded sheet with an adhesive layer in between and divided from each other; a third ring for pressing the first ring; and a driving mechanism for lifting at least one of the processed object and the second ring, so as to make a height difference between the first ring and the second ring to extend the expanded sheet. An outer periphery of the second ring or an inner periphery of the third ring is formed as follows: in contrast to a width of a first direction, a width of a second direction orthogonal to the first direction is smaller.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014188530A JP6270671B2 (en) | 2014-09-17 | 2014-09-17 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201613009A true TW201613009A (en) | 2016-04-01 |
| TWI579948B TWI579948B (en) | 2017-04-21 |
Family
ID=55796148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104106094A TWI579948B (en) | 2014-09-17 | 2015-02-25 | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6270671B2 (en) |
| CN (1) | CN105990187B (en) |
| TW (1) | TWI579948B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6820494B2 (en) * | 2016-10-28 | 2021-01-27 | 株式会社東京精密 | Work dividing device and work dividing method |
| JP6945152B2 (en) * | 2016-10-28 | 2021-10-06 | 株式会社東京精密 | Work splitting device |
| JP6759524B2 (en) * | 2016-10-28 | 2020-09-23 | 株式会社東京精密 | Work dividing device and work dividing method |
| KR102434738B1 (en) * | 2016-10-28 | 2022-08-22 | 가부시키가이샤 도교 세이미쓰 | Workpiece dividing device and workpiece dividing method |
| JP6896990B2 (en) * | 2017-03-27 | 2021-06-30 | 株式会社東京精密 | Work division method |
| JP7110540B2 (en) * | 2018-01-11 | 2022-08-02 | 株式会社東京精密 | Work dividing device and work dividing method |
| JP7284439B2 (en) * | 2018-01-11 | 2023-05-31 | 株式会社東京精密 | Work dividing device and work dividing method |
| JP2020072139A (en) * | 2018-10-30 | 2020-05-07 | 株式会社ディスコ | Wafer expansion method and wafer expansion device |
| JP7221649B2 (en) * | 2018-10-30 | 2023-02-14 | 株式会社ディスコ | Wafer expansion method and wafer expansion device |
| JP7245987B2 (en) * | 2020-09-01 | 2023-03-27 | 株式会社東京精密 | Work dividing device and work dividing method |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3017827B2 (en) * | 1991-03-26 | 2000-03-13 | 沖電気工業株式会社 | Wafer ring holding mechanism in die bonding equipment |
| JPH09190988A (en) * | 1996-01-11 | 1997-07-22 | Toshiba Mechatronics Kk | Sheet expanding device |
| JPH11233458A (en) * | 1998-02-18 | 1999-08-27 | Hitachi Ltd | Semiconductor device manufacturing method and semiconductor wafer used for the manufacturing |
| US7005317B2 (en) * | 2003-10-27 | 2006-02-28 | Intel Corporation | Controlled fracture substrate singulation |
| JP2006310691A (en) * | 2005-05-02 | 2006-11-09 | Hugle Electronics Inc | Foldaway film sheet extension method and expander therefor |
| JP4714950B2 (en) * | 2005-11-18 | 2011-07-06 | 株式会社東京精密 | Expanding ring and substrate dividing method using the expanding ring |
| JP2007250598A (en) * | 2006-03-14 | 2007-09-27 | Renesas Technology Corp | Manufacturing method of semiconductor device |
| JP2010219267A (en) * | 2009-03-17 | 2010-09-30 | Toshiba Corp | Manufacturing method for semiconductor device |
| JP2010275509A (en) * | 2009-06-01 | 2010-12-09 | Furukawa Electric Co Ltd:The | Adhesive film and tape for semiconductor wafer processing |
| JP4976522B2 (en) * | 2010-04-16 | 2012-07-18 | 日東電工株式会社 | Thermosetting die bond film, dicing die bond film, and semiconductor device manufacturing method |
| JP2012243970A (en) * | 2011-05-20 | 2012-12-10 | Ngk Spark Plug Co Ltd | Method for transferring unit piece of ceramic wiring substrate and transfer device therefor |
| JP6055369B2 (en) * | 2012-09-28 | 2016-12-27 | 株式会社東芝 | Semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
| US10008405B2 (en) * | 2012-12-26 | 2018-06-26 | Hitachi Chemical Company, Ltd | Expansion method, method for manufacturing semiconductor device, and semiconductor device |
-
2014
- 2014-09-17 JP JP2014188530A patent/JP6270671B2/en active Active
-
2015
- 2015-02-25 TW TW104106094A patent/TWI579948B/en active
- 2015-03-04 CN CN201510097273.7A patent/CN105990187B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105990187B (en) | 2019-02-15 |
| JP6270671B2 (en) | 2018-01-31 |
| TWI579948B (en) | 2017-04-21 |
| CN105990187A (en) | 2016-10-05 |
| JP2016063016A (en) | 2016-04-25 |
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