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TW201612120A - Method for cutting non-alkali plate glass, method for cutting display panel, method for producing non-alkali plate glass, and method for producing display panel - Google Patents

Method for cutting non-alkali plate glass, method for cutting display panel, method for producing non-alkali plate glass, and method for producing display panel

Info

Publication number
TW201612120A
TW201612120A TW104125327A TW104125327A TW201612120A TW 201612120 A TW201612120 A TW 201612120A TW 104125327 A TW104125327 A TW 104125327A TW 104125327 A TW104125327 A TW 104125327A TW 201612120 A TW201612120 A TW 201612120A
Authority
TW
Taiwan
Prior art keywords
cutting
plate glass
display panel
producing
alkali plate
Prior art date
Application number
TW104125327A
Other languages
Chinese (zh)
Other versions
TWI654149B (en
Inventor
Hiroki Tanaka
Hirofumi Tokunaga
Kazutaka Ono
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201612120A publication Critical patent/TW201612120A/en
Application granted granted Critical
Publication of TWI654149B publication Critical patent/TWI654149B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Glass Compositions (AREA)

Abstract

Provided is a method for cutting non-alkali plate glass, wherein the non-alkali plate glass has a B2O3 content (C) of 0-8.5 mass% and a plate thickness (T) of 0.05-0.30mm, and using a specific cutter wheel on the surface of the non-alkali plate glass, a cutting line is made by scribing, and tensile stress or bending stress is applied to this cutting line, thereby cutting the non-alkali plate glass. Good cutting results can be achieved using the method for cutting non-alkali plate glass of the present invention.
TW104125327A 2014-08-04 2015-08-04 Method for cutting alkali-free glass plate, method for cutting display panel, method for producing alkali-free glass plate, and method for manufacturing display panel TWI654149B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-158881 2014-08-04
JP2014158881 2014-08-04

Publications (2)

Publication Number Publication Date
TW201612120A true TW201612120A (en) 2016-04-01
TWI654149B TWI654149B (en) 2019-03-21

Family

ID=55263829

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125327A TWI654149B (en) 2014-08-04 2015-08-04 Method for cutting alkali-free glass plate, method for cutting display panel, method for producing alkali-free glass plate, and method for manufacturing display panel

Country Status (5)

Country Link
JP (1) JPWO2016021564A1 (en)
KR (1) KR20170039143A (en)
CN (1) CN106660853B (en)
TW (1) TWI654149B (en)
WO (1) WO2016021564A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831958B (en) * 2019-04-15 2024-02-11 日商Ａｇｃ股份有限公司 Manufacturing methods and manufacturing systems for glass articles

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7333159B2 (en) * 2016-12-26 2023-08-24 日本電気硝子株式会社 Method for producing alkali-free glass substrate
TWI837150B (en) * 2018-09-28 2024-04-01 日商三星鑽石工業股份有限公司 How to break GaN substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074143B2 (en) * 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 Glass cutter wheel
EP2851172A1 (en) * 2004-02-02 2015-03-25 Mitsuboshi Diamond Industrial Co., Ltd. Cutter wheel and method for manufacturing the cutter wheel
JP2010126382A (en) * 2008-11-26 2010-06-10 Joyo Kogaku Kk Cutter wheel for cutting glass
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
JPWO2011129265A1 (en) 2010-04-12 2013-07-18 旭硝子株式会社 Sheet glass processing apparatus and processing method
KR101832020B1 (en) 2011-02-09 2018-02-23 아사히 가라스 가부시키가이샤 Glass plate cutting method and glass plate cutting device
JP2013112534A (en) * 2011-11-25 2013-06-10 Mitsuboshi Diamond Industrial Co Ltd Method for splitting brittle material substrate
JP5753504B2 (en) * 2012-02-27 2015-07-22 三星ダイヤモンド工業株式会社 A scribing wheel, a scribing device, and a scribing wheel manufacturing method.
JP6268805B2 (en) * 2013-08-13 2018-01-31 日本電気硝子株式会社 Manufacturing method of glass plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831958B (en) * 2019-04-15 2024-02-11 日商Ａｇｃ股份有限公司 Manufacturing methods and manufacturing systems for glass articles

Also Published As

Publication number Publication date
CN106660853B (en) 2019-05-14
WO2016021564A1 (en) 2016-02-11
JPWO2016021564A1 (en) 2017-05-18
TWI654149B (en) 2019-03-21
KR20170039143A (en) 2017-04-10
CN106660853A (en) 2017-05-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees