TW201441397A - Sputtering apparatus and sputtering method - Google Patents

Abstract

The present invention provides a sputtering apparatus and method. The sputtering apparatus includes a chamber, a target rotating mechanism disposed in the middle of the chamber, a first target and a second target being able to be located at opposite sides of the target rotating mechanism, the target rotating mechanism including a rotating axis for allowing the target rotating mechanism to be rotated around the rotating axis, and sealing mechanisms disposed at two sides of the target rotating mechanism for being coupled with the target rotating mechanism and the chamber to separate the chamber into two sealed chambers, the two chambers allowing a first substrate and a second substrate to be respectively disposed therein, wherein the target rotating mechanism has a first target fixing element and a second target fixing element for fixing the first target and the second target.

Description

Sputtering equipment and sputtering method

The present invention relates to a coating apparatus, and more particularly to a sputtering apparatus.

Sputter is an excellent coating process. A high-voltage DC glow discharge is applied to both ends of a vacuum environment electrode to ionize the introduced process gas. The positive ions bombard the target at a high speed under the action of an electric field. Atoms and molecules are deposited on the surface of the substrate to be coated. The sputtering process has the advantages of good film quality and high speed, and is widely used in the thin film field effect transistor (TFT) industry. However, in actual use, it is sometimes necessary to continuously plate two different films, and the materials of the two films may be cross-contaminated and cannot be operated in the same process chamber.

For example, an ITO/Ag/ITO film layer structure widely used in an active-matrix organic light-emitting diode (AMOLED) anode is a film structure having an Ag film between two ITO films. An ITO film, an Ag film, and another ITO film are sequentially sputtered on the substrate. Since ITO is a reactive sputtering coating, it is necessary to pass O ₂ , H ₂ O, etc. when sputtering ITO. If Ag is plated in the same chamber, the Ag target will chemically react and be contaminated by oxidation. Therefore, sputtering of ITO and Ag cannot be performed in the same process chamber.

To solve this problem, the conventional process, as shown in FIG. 1, is to separately provide a chamber 1' for sputtering ITO and a chamber 2' for sputtering Ag, and a transfer chamber is provided between the two (not shown). ). The above chambers are arranged independently of each other. In order to improve production efficiency, a plurality of ITO-plated chambers 1' and Ag-sputtered chambers 2' are generally disposed on the same device. However, the multi-chamber device described above has a complicated structure, a large floor space, and a relatively low cost. high.

It is an object of the present invention to provide a sputtering apparatus and a sputtering method to solve the problems of the prior art.

In order to achieve the above object, the present invention discloses a sputtering apparatus comprising: a cavity; a rotating target mechanism disposed in a middle portion of the cavity, wherein the opposite sides of the rotating target mechanism can be provided with a first target and a second a target; the rotating target mechanism includes a rotating shaft and rotatable about the rotating shaft; and a sealing mechanism disposed on both sides of the rotating target mechanism for the rotating target mechanism and the The cavity is coupled to isolate the cavity into two sealed chambers for respectively providing a first substrate and a second substrate therein, wherein the rotating target mechanism comprises oppositely disposed a first target fixture and a second target fixture for fixing the first target and the second target.

The invention also provides a sputtering method, comprising: step 1, using a rotating target mechanism to the first base in the sputtering apparatus The plate and/or the second substrate are subjected to a first sputtering and/or a second sputtering; and in step 2, the rotating target mechanism is rotated by 180 degrees to perform a third operation on the first substrate and the second substrate Sputtering and fourth sputtering, wherein the third sputtering and the fourth sputtering are performed at least partially simultaneously.

Compared with the prior art, it is required to provide different coating chambers and conveying chambers to achieve sputtering. The sputtering apparatus and the sputtering method of the present invention have a rotating target mechanism, so that different coatings can be simultaneously sputtered in the same cavity. Moreover, it is not necessary to transport the substrate between different chambers, thereby enabling continuous sputtering, improving sputtering efficiency, and simplifying the process.

1‧‧‧First substrate

1'‧‧‧室

2‧‧‧second substrate

2’‧‧‧室

10‧‧‧ cavity

11‧‧‧ inner wall

11a‧‧‧ Protrusion

12a‧‧‧The Ministry of Launch

12b‧‧‧Receiving Department

13a‧‧‧The Ministry of Launch

13b‧‧‧Receiving Department

20‧‧‧Rotating target mechanism

21‧‧‧First target fixture

21a‧‧‧First target

22‧‧‧Second target fixture

22a‧‧‧second target

23‧‧‧Insulation

24‧‧‧Rotary axis

25‧‧‧First backplane

26‧‧‧Second backplane

261‧‧‧ Cable docking point

28‧‧‧Cooling water pipes

28a‧‧‧Cooling water inlet

29‧‧‧ cable

29a‧‧‧ cable entry point

29b‧‧‧ Cable connection point

30‧‧‧ Sealing mechanism

31‧‧‧ Sealing ring

32‧‧‧Metal structural parts

33‧‧‧Mobile track

S‧‧‧ bolt

Figure 1 shows a schematic of an existing multi-chamber sputtering apparatus.

Fig. 2A is a schematic view showing a sputtering apparatus according to an embodiment of the present invention.

2B is a schematic view showing a rotating target mechanism of a sputtering apparatus according to an embodiment of the present invention.

Fig. 2C is a schematic view showing the rotation target of the sputtering apparatus in Fig. 2A rotated by 180 degrees.

Figure 3A shows a front view of one of two sets of sealing mechanisms.

Figure 3B is a schematic illustration of the relative movement of a set of sealing mechanisms with a rotating target mechanism.

Figure 3C shows the contact between the rotating target mechanism and the two sets of sealing mechanisms. Later side view.

Figure 4 is a schematic view showing a sensor disposed on a cavity in accordance with an embodiment of the present invention.

5A to 5C are schematic views showing the structure of the cooling water and the cable of the target.

Fig. 2A is a schematic view showing a sputtering apparatus according to an embodiment of the present invention. Figure 2B is a schematic illustration of the rotating target mechanism 20 of the sputtering apparatus of Figure 2A.

As shown in FIG. 2A, the sputtering apparatus according to an embodiment of the present invention includes a cavity 10, a rotating target mechanism 20, and two sets of sealing mechanisms 30. In operation, the first substrate 1 and the second substrate 2 may be disposed in a sputtering apparatus.

The cavity 10 has a rectangular parallelepiped shape in this embodiment, and may be any other shape in other embodiments.

The rotating target mechanism 20 is disposed in the cavity 10 and, as shown in FIG. 2B, includes a first target fixture 21, a second target fixture 22, and a first target fixture 21 and a second target The insulating layer 23 and the rotating shaft 24 between the material fixing members 22.

In the present embodiment, the first target fixing member 21 is for surrounding and fixing the first target 21a, and the second target fixing member 22 is for surrounding and fixing the second target 22a. The first target 21a can be sputtered and deposited on the first substrate 1 or the second substrate 2 under the action of an electric field, and the second target 22a can be sputtered under the electric field and deposited on the second substrate 2 or the first substrate 1 on. First target solid The stator 21 and the second target fixture 22 are not limited to surrounding the first target 21a and the second target 22a, but any structure capable of fixing the first target 21a and the second target 22a is possible.

In the present embodiment, the rotating target mechanism 20 is approximately plate-shaped and preferably rectangular, but in other embodiments the rotating target mechanism 20 may be of any other shape. The first target fixture 21 and the second target fixture 22 are located on opposite sides of the rotating target mechanism 20.

After being fixed by the first target fixture 21 and the second target fixture 22, the first target 21a and the second target 22a face the first substrate 1 and the second substrate 2, respectively. The first substrate 1 and the second substrate 2 facing the surface of the rotating target mechanism 20 are required to be sputtered with the first target 21a and the second target 22a.

In an embodiment, as shown in FIG. 2B, the first target fixing member 21 and the insulating layer 23 further have a first backing plate 25, and the second target fixing member 22 and the insulating layer 23 are further disposed between The second backing plate 26, the first target 21a and the second target 22a are fixedly disposed on the first backboard 25 and the second backboard 26 by the first target fixing member 21 and the second target fixing member 22, respectively.

The rotating shaft 24 is provided in the insulating layer 23 in this embodiment. The rotating shaft 24 may be disposed through the insulating layer 23 or may be disposed on the upper and lower sides of the insulating layer 23. However, the present invention is not limited to providing the rotating shaft 24 in the insulating layer 23 or on the upper and lower sides thereof. For example, the rotating shaft 24 may be located at other positions of the rotating target mechanism 20 as long as the rotating target mechanism 20 can be rotated about the rotating shaft 24.

The rotating target mechanism 20 is rotatable about the rotating shaft 24 in the cavity 10. Figure 2C shows the rotating target machine of the sputtering apparatus in Figure 2A. Schematic diagram of structure 20 after 180 degrees of rotation. 2A and 2C, it can be seen that the first target fixture 21 and the first target 21a can face the first substrate 1 and the second target fixture 22 and the second target 22a are positive by rotation. For the second substrate 2 (as shown in FIG. 2A), the first target holder 21 and the first target 21a can face the second substrate 2 and the second target holder 22 and the second target 22a face each other. The first substrate 1 (as shown in Fig. 2C). In this way, in the case where the above two rotations are in place, the rotating target mechanism 20 can simultaneously sputter the first target 21a and the second target 22a on the first substrate 1 and the second substrate 2 under the action of the electric field. Or simultaneously sputtering the second target 22a and the first target 21a on the first substrate 1 and the second substrate 2.

FIG. 3A is a front view showing one of the two sets of sealing mechanisms 30, and FIG. 3B is a schematic view showing a relative movement of one of the sealing mechanisms 30 and the rotating target mechanism 20, and FIG. 3C is a rotation. A schematic side view of the target mechanism 20 after contact with the two sets of sealing mechanisms 30. In the present invention, a sealing mechanism 30 is disposed on both sides of the rotating target mechanism 20 for coupling with the rotating target mechanism 20 and the cavity 10 to isolate the cavity 10 into two sealed chambers, two chambers The first substrate 1 and the second substrate 2 are separately disposed therein.

As shown in FIGS. 3A and 3B, each set of sealing mechanism 30 includes a seal ring 31, a metal structural member 32, and at least one set of moving rails 33. The seal ring 31 is a rectangular closed ring having a shape corresponding to the rotating target mechanism 20 in this embodiment, and is two inner and outer rings. The metal structural member 32 has a shape corresponding to the seal ring 31 and the seal ring 31 is fixed thereto, and both inner and outer rings of the seal ring 31 protrude from the plane in which the metal structural member 32 is located.

As shown in FIG. 3B, the metal structural member 32 is disposed on the moving rail 33 and is movable along the moving rail 33. In the present embodiment, the moving rail 33 is, for example, a screw type moving rail, and the position of the metal structural member 32 corresponding to the moving rail 33 has a corresponding threaded hole. A screw-type moving track passes through the threaded hole and is capable of moving the metal structural member 32 closer to or away from the rotating target mechanism 20 as it rotates.

As shown in Fig. 3C, the inner wall 11 of the cavity 10 in the present embodiment has a rectangular annular projection 11a that engages with the four side edges of the rotating target mechanism 20. The rectangular annular projection 11a is constituted, for example, by four strip-shaped projections extending inwardly along the four inner walls 11 of the cavity 10. The four strip protrusions can be enclosed in a rectangle. The strip-shaped projections of the top and bottom surfaces of the cavity 10 can be provided with the rotating shaft 24, and at the same time, the moving rail 33 can be provided. When each set of sealing mechanism 30 has a set of moving rails 33, the moving rails 33 are provided with strip-like protrusions or lower strip-like protrusions at the upper portion of the cavity 10, when each set of sealing mechanism 30 has two sets of moving rails 33 The two sets of moving rails 33 are respectively provided with strip-like protrusions at the upper portion of the cavity 10 and strip-shaped protrusions of the lower portion.

As shown in Fig. 3C, two sets of sealing mechanisms 30 are respectively disposed on both sides of the rotating target mechanism 20 and the rectangular annular projection 11a. Thus, in the case where the rotating target mechanism 20 needs to rotate about the rotating shaft 24, the metal structural members 32 of the two sets of sealing mechanisms 30 need to drive the sealing ring 31 away from the rotating target mechanism 20 along the moving rail 33, respectively, to avoid interference. The rotation of the target mechanism 20 is rotated.

The seal ring 31 and the metal structural member 32 move together to a position that does not interfere with the rotating target mechanism 20 or move to the edge of the cavity 10 to stop moving, The rotating target mechanism 20 is made rotatable.

After the rotating target mechanism 20 is rotated into position (for example, the first target 21a and the second target 22a are facing the first substrate 1 (or the second substrate 2) and the second substrate 2 (or the first substrate 1)), The seal ring 31 and the metal structural member 32 in the two sets of sealing mechanisms 30 are moved together along the moving rail 33 back to both sides of the rotating target mechanism 20. At this time, the two seal rings 31 of each group of the sealing mechanism 30 respectively abut the rectangular annular protrusions 11a and the first target fixing member 21b or the second target fixing member 22b on the inner wall 11 of the cavity 10. In this way, the cavity 10 can be separated into two mutually independent and sealed chambers. The first substrate 1 and the second substrate 2 are respectively accommodated in the two chambers.

Whether or not the rotating target mechanism 20 is rotated into position can be controlled by a plurality of sensors. Figure 4 is a schematic illustration of a sensor disposed on a cavity 10 in accordance with one embodiment of the present invention. As shown in Fig. 4, two pairs of sensors 12a, 12b and 13a, 13b are respectively disposed at positions on the upper and lower portions of the cavity 10 at positions corresponding to the rotation of the rotating target mechanism 20 in position. The sensors 12a, 12b and 13a, 13b are preferably disposed on one side of the upper and lower strip-like protrusions as shown in FIG. 4, but the invention is not limited thereto, and the two pairs of sensors 12a, 12b And 13a, 13b can also be mounted on the other side opposite to the side shown in Fig. 4. When the rotating target mechanism 20 is not rotated into position, the transmitting portion 12a (or 13a) and the receiving portion 12b (or 13b) of the pair of sensors 12a, 12b (or 13a, 13b) are in an on state, or two pairs of senses The detectors 12a, 12b and 13a, 13b are all in an on state. After the rotating target mechanism 20 is rotated into position, the transmitting portion 12a and the receiving portion 12b of the pair of sensors and the transmitting portion 13a and the receiving portion 13b of the other pair of sensors are both shielded, and the two pairs of sensors 12a, 12b, and 13a, 13b are simultaneously in a non-conducting state, indicating that the rotating target mechanism 20 has been rotated into position.

5A to 5C are schematic views showing the structure of the cooling water pipe 28 and the cable 29 of the rotating target mechanism 20.

The cooling water pipes 28 are respectively disposed on the opposite surfaces of the insulating layer 23 or in the insulating layer 23. As shown in FIG. 5A, the insulating layer 23 enters the position corresponding to the rotating shaft 24 from above the insulating layer 23, and is separated from the position corresponding to the rotating shaft 24 from below the insulating layer 23.

The cooling water pipe 28 may have one set on each of both surfaces of the insulating layer 23. The cooling water pipe 28 on both surfaces may share the cooling water introduction port 28a and the outlet port 28b. The cooling water pipe 28 is distributed on the surface or inside of the insulating layer 23, in which cooling water is passed. The cooling water pipe 28 cools the rotating target mechanism 20 when it is in operation.

The cable 29 enters the insulating layer 23 from a position above the insulating layer 23 corresponding to the rotating shaft 24, and extends along the upper portion of the insulating layer 23. Cables 29 are respectively disposed on opposite surfaces of the insulating layer 23. The insulating layer 23 has a cable lead-in point 29a and a plurality of cable connection points 29b, respectively.

As shown in FIG. 5B, the first backboard 25 and the second backboard 26 are provided with corresponding cable docking points (only the cable docking point 261 on the second backboard 26 is shown), and the insulating layer 23 is provided. The cable connection point 29b is electrically connected. The first backing plate 25 and the second backing plate 26 are mounted on both sides of the insulating layer 23 and are fixed by bolts S.

The cable 29 is capable of transmitting power to the first target 21a and the second target 22a, respectively, through the first back plate 25 and the second back plate 26, specifically, the target The backing plate is combined with the conductive adhesive to enable electric power to be conducted from the first backing plate 25 and the second backing plate 26 to the first target 21a and the second target 22a to independently control the first A target 21a and a second target 22a are sputter deposited. However, the invention is not limited thereto. In an embodiment, the backplane may be omitted and power is transmitted to the first target 21a and the second target 22a by other forms.

The sputtering device also includes an external control device (not shown). The control device controls the movement of the metal structural member 32 provided with the seal ring 31 along the moving rail 33. When the moving rail 33 is a screw-type moving rail, the control device controls the external motor to rotate to drive the screw-type moving rail to rotate, so that the sealing ring 31 and the metal structural member 32 are away from or close to the rotating target mechanism 20.

In addition, the control device is also used to control the rotation of the rotating target mechanism 20. Specifically, the control device controls the external precision drive motor, and the rotary drive shaft 24 is rotated by the precision drive motor to drive the rotary target mechanism 20 to rotate relative to the cavity 10. When the pair of sensors 12a, 12b are blocked, they send a sensing signal to the control device, and the control device controls the external precision driving motor to stop and fix the rotating target mechanism 20.

During operation, when the rotating target mechanism 20 has been rotated into position and the sealing mechanism 30 divides the cavity 10 into two mutually isolated and sealed chambers, it is controlled by the control device to provide power to the rotating target via the cable 29. The first target 21a and the second target 22a of the mechanism 20 perform first sputtering and second sputtering, so that the first target 21a is deposited on the first substrate 1 under the action of an electric field, and the second target can be made at the same time. 22a is deposited on the second substrate 2 under the action of an electric field.

After the first substrate 1 and the second substrate 2 are sputter-deposited, the control seal 31 and the metal structural member 32 are moved away from the rotating target mechanism 20 along the moving rail 33. After the seal ring 31 and the metal structural member 32 are moved away from the position where they do not interfere with the rotation of the rotating target mechanism 20, the rotary target mechanism 20 is controlled to rotate by 180 degrees. After the rotating target mechanism 20 is rotated into position, the control seal 31 and the metal structural member 32 are brought close to the rotating target mechanism 20 along the moving rail 33, and the sealing ring 31 abuts on the projection 11a on the inner wall 11 of the cavity 10. And the first target fixture 21 and the second target fixture 22, thereby separating the cavity 10 into two mutually isolated and sealed chambers.

Then, the first target 21a and the second target 22a of the rotating target mechanism 20 are further supplied with electric power through the cable 29 to perform third sputtering and fourth sputtering, so that the first target 21a is in the second under the action of the electric field. The substrate 2 is deposited while the second target 22a is deposited on the first substrate 1 under the action of an electric field. In this way, different targets can be sputter deposited on two different substrates simultaneously.

In the present embodiment, the rotating target mechanism 20 is disposed at the center of the cavity 10, and the first substrate 1 and the second substrate 2 are disposed on both inner sides of the cavity 10. The first target 21a and the second target 22a are respectively an ITO target and an Ag target, and both the first substrate 1 and the second substrate 2 need to be sputtered with an ITO/Ag/ITO three-layer film as an example.

During operation, power is supplied to the first target 21a of the rotating target mechanism 20 through the cable 29, and the first target 21a is sputtered on the first substrate 1 with an ITO layer. After the end, the rotating target mechanism 20 is controlled to rotate, and after the rotation is in place, power is supplied to the first target 21a and the second target 22a, and the Ag substrate is sputtered on the first substrate 1 while the second substrate 2 is sputtered. ITO Floor. Then, the rotating target mechanism 20 is controlled to rotate, and after the rotation is in place, power is supplied to the first target 21a and the second target 22a, and the first substrate 1 is sputtered with the second ITO layer while the second substrate 2 is placed thereon. Sputtered Ag layer. The rotating target mechanism 20 is then controlled to rotate, providing power to the second target 22a after the rotation is in place, and sputtering a second ITO layer.

The ITO target and the Ag target in the above embodiments are merely illustrative. The first target and the second target of the present invention may be any target, but the present invention is preferably applied to a material in which two materials which are sputtered are easily reacted with each other and cannot be sputtered in the same chamber. For example, one of them is a reactive coating material, and the other is a material that is easily oxidized (for example, Al ₂ O ₃ , SiO ₂ , a metal material, etc.).

As can be seen from the above, the present invention also discloses a sputtering method comprising the following steps: Step 1, performing first sputtering on the first substrate 1 and/or the second substrate 2 by using the rotating target mechanism 20 in a sputtering apparatus. Or a second sputtering; and step 2, rotating the rotating target mechanism 20 by 180 degrees to perform third sputtering and fourth sputtering on the first substrate 1 and the second substrate 2, wherein the third sputtering And the fourth sputtering is performed at least partially simultaneously.

Compared with the prior art, it is required to provide different coating chambers and conveying chambers to achieve sputtering. The sputtering apparatus and the sputtering method of the present invention have a rotating target mechanism, so that different coatings can be simultaneously sputtered in the same cavity. Moreover, it is not necessary to transport the substrate between different chambers, thereby enabling continuous sputtering, improving sputtering efficiency, and simplifying the process.

While the invention has been described with respect to the exemplary embodiments illustrated embodiments The present invention may be embodied in a variety of forms without departing from the spirit or scope of the invention. It is to be understood that the above-described embodiments are not limited to the details of the foregoing. Therefore, all changes and modifications that fall within the scope of the claims or their equivalents should be covered by the appended claims.

1‧‧‧First substrate

2‧‧‧second substrate

10‧‧‧ cavity

20‧‧‧Rotating target mechanism

21a‧‧‧First target

22a‧‧‧second target

24‧‧‧Rotary axis

30‧‧‧ Sealing mechanism

Claims (25)

A sputtering apparatus comprising: a cavity (10); a rotating target mechanism (20) disposed in a middle portion of the cavity (10), and a first target can be disposed on opposite sides of the rotating target mechanism (20) a material (21a) and a second target (22a); the rotating target mechanism (20) includes a rotating shaft (24) and is rotatable about the rotating shaft (24); and a sealing mechanism (30), On both sides of the rotating target mechanism (20) for coupling with the rotating target mechanism (20) and the cavity (10) to isolate the cavity (10) into two sealed a chamber for respectively providing a first substrate (1) and a second substrate (2) therein, wherein the rotating target mechanism (20) includes oppositely disposed first target holders ( 21) and a second target fixture (22) for fixing the first target (21a) and the second target (22a). The sputtering apparatus of claim 1, wherein the rotating target mechanism (20) further comprises an insulating layer (23), the insulating layer (23) being located at the first target fixing member (21) and Between the second target fixtures (22). The sputtering apparatus of claim 2, wherein the rotating target mechanism (20) further comprises a first backing plate (25) and a second backing plate (26), the first backing plate (25) being disposed Between the first target fixture (21) and the insulating layer (23), the second backing plate (26) is disposed in the second Between the target fixture (22) and the insulating layer (23), the first backing plate (25) and the second backing plate (26) are fixedly connected to the insulating layer (23). The sputtering apparatus according to claim 3, wherein the first target fixing member (21) surrounds the first target (21a) and fixes the first target (21a) at the first On a backing plate (25), the second target fixing member (22) surrounds the second target (22a) and fixes the second target (22a) to the second backing plate (26) )on. The sputtering apparatus of claim 3, wherein the sputtering apparatus further comprises a cable (29) disposed in the insulating layer (23) and passing through the first back respectively The plate (25) and the second back plate (26) are electrically connected to the first target (21a) and the second target (22a) to respectively be the first target (21a) and The second target (22a) provides electrical power. The sputtering apparatus according to claim 5, wherein the number of the cables (29) is two, and the insulating layer (23) is provided with a cable lead-in point corresponding to each of the cables (29). (29a) and a cable connection point (29b), the first backplane (25) and the second backplane (26) are provided with corresponding cable docking points (261) to interface with the insulating layer (23) The cable connection point (29b) on the upper is electrically connected. A sputtering apparatus according to claim 1, wherein the sealing mechanism (30) is two groups, the two sets of sealing mechanisms (30) are respectively disposed on two sides of the rotating target mechanism (20), and each set of the sealing mechanism (30) includes a sealing ring (31), a metal a structural member (32) and at least one set of moving rails (33), the sealing ring (31) being disposed on the metal structural member (32), the metal structural member (32) being capable of being on the moving rail (33) Moving upward to drive the sealing ring (31) away from or near the rotating target mechanism (20). The sputtering apparatus according to claim 7, wherein each of the set of moving rails (33) is a screw type moving rail, and the metal structural member (32) has a threaded hole at a position corresponding to the screw type moving rail. The screw-type moving rail passes through the threaded hole and is rotatable to drive the metal structural member (32) away from or near the rotating target mechanism (20). The sputtering apparatus according to claim 7, wherein the inner wall (11) of the cavity (10) has an annular protrusion (11a), and the at least one set of moving rails (33) is disposed at the ring The protrusions (11a), the sealing ring (31) of each group of the sealing mechanism (30) are two layers of sealing rings respectively protruding from the surface of the metal structural member (32) and respectively resisted when sealed The annular protrusion (11a) and the first target holder (21) or the second target holder (22) are attached. The sputtering apparatus according to claim 9, wherein the rotating shaft (24) is provided to the annular projection (11a). The sputtering apparatus according to claim 2, wherein the rotating target mechanism (20) further comprises a cooling water pipe (28) disposed inside or of the insulating layer (23) The opposite surfaces of the insulating layer (23). The sputtering apparatus of claim 1, wherein the cavity (10) further comprises a plurality of sensors for rotating the rotating target mechanism (20) to a specific position A sensing signal is emitted to stop the rotating target mechanism (20) from rotating. The sputtering apparatus of claim 7, wherein the sputtering apparatus further comprises control means for controlling movement of the metal structural member (32) along the moving rail (33), the cavity The body (10) further includes a plurality of sensors, and the control device controls the rotating target mechanism (20) to rotate or stop rotating according to a sensing signal emitted by the sensor. The sputtering apparatus according to claim 2, wherein the rotating shaft (24) is disposed in the insulating layer (23). The sputtering apparatus according to claim 1, wherein the rotating shaft (24) is disposed at at least one of an upper portion and a lower portion of the rotating target mechanism. A sputtering apparatus according to claim 1, wherein the first target The material (21a) and the second target (22a) can be separately sputter coated by an electric field. A sputtering apparatus according to claim 1, wherein the rotation of the rotating shaft (24) is controlled by a driving motor. The sputtering apparatus according to claim 1, wherein, in operation, after the first sputtering and the second sputtering of the first substrate (1) and the second substrate (2) are completed, the rotating target The mechanism (20) is rotatable by 180 degrees to perform third sputtering and fourth sputtering on the first substrate (1) and the second substrate (2). The sputtering apparatus according to claim 1, wherein, in operation, after the first sputtering or the second sputtering of the first substrate (1) or the second substrate (2) is completed, the rotating target The mechanism (20) is rotatable by 180 degrees to perform third sputtering and fourth sputtering on the first substrate (1) and the second substrate (2). A sputtering method, comprising: step 1, performing first sputtering and second sputtering on a first substrate (1) and a second substrate (2) by using a rotating target mechanism (20) in a sputtering apparatus; and a step 2. Rotating the rotating target mechanism (20) by 180 degrees to perform third sputtering and fourth sputtering on the first substrate (1) and the second substrate (2), Wherein the third sputtering and the fourth sputtering are performed at least partially simultaneously. A sputtering method, comprising: step 1, performing first sputtering or second sputtering on a first substrate (1) or a second substrate (2) by using a rotating target mechanism (20) in a sputtering apparatus; and a step 2. Rotating the rotating target mechanism (20) by 180 degrees to perform third sputtering and fourth sputtering on the first substrate (1) and the second substrate (2), wherein the third Sputtering and fourth sputtering are performed at least partially simultaneously. The sputtering method according to claim 20 or 21, wherein the sputtering method is performed using an Ag target and an ITO target. The sputtering method of claim 20, wherein the sputtering method is performed using the sputtering apparatus according to any one of claims 1-19. The sputtering method of claim 21, wherein the sputtering method is performed using the sputtering apparatus according to any one of claims 1-19. The sputtering method according to claim 20 or 21, wherein the steps 1 and 2 are repeatedly performed.